TWI752696B - Temperature management system - Google Patents

Temperature management system Download PDF

Info

Publication number
TWI752696B
TWI752696B TW109137472A TW109137472A TWI752696B TW I752696 B TWI752696 B TW I752696B TW 109137472 A TW109137472 A TW 109137472A TW 109137472 A TW109137472 A TW 109137472A TW I752696 B TWI752696 B TW I752696B
Authority
TW
Taiwan
Prior art keywords
temperature
processing unit
signal
unit
processing
Prior art date
Application number
TW109137472A
Other languages
Chinese (zh)
Other versions
TW202217570A (en
Inventor
王彥庚
Original Assignee
英業達股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英業達股份有限公司 filed Critical 英業達股份有限公司
Priority to TW109137472A priority Critical patent/TWI752696B/en
Application granted granted Critical
Publication of TWI752696B publication Critical patent/TWI752696B/en
Publication of TW202217570A publication Critical patent/TW202217570A/en

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A temperature management system is provided in the present invention. In the temperature management system, a processing module of a data processing device is provided to transmit a sensing signal includes a working temperature. A logic processing module connected to the processing module of the data processing device is set a warning temperature and a warning time and transmits a monitoring signal as the working temperature is greater or equal to the warning temperature. A management control module of a working device is provided to transmit a speed-up signal to at least one fan of the working device to make the fan speed up when receives the monitoring signal. After the fan speed up, the logic processing module is further provided to make the processing module stop working when the logic processing module still receives the monitoring signal from the logic processing module over the warning time.

Description

溫度管理系統temperature management system

本發明係有關於一種溫度管理系統,尤其是指一種用於管理資料處理裝置於運作時之工作溫度之溫度管理系統。The present invention relates to a temperature management system, in particular to a temperature management system for managing the working temperature of a data processing device during operation.

隨著網路科技的進步,伺服器在人們的生活中扮演著不可或缺的角色,一般而言,伺服器的系統在運作的過程中,皆有賴於如網路卡之資料處理裝置之運作,其中,由於科技的進步,智慧型網路卡(Smart Network interface controller, Smart NIC)已經漸漸充斥於伺服器之領域中,其可進一步提升營運商的資料管理量,可提升運作效率以及安全性,並可實現軟體定義網路(Software-Defined Networking, SDN)之功能。With the advancement of network technology, servers play an indispensable role in people's lives. Generally speaking, the operation of server systems depends on the operation of data processing devices such as network cards. , Among them, due to the advancement of technology, Smart Network Interface Controller (Smart NIC) has gradually flooded the field of servers, which can further increase the amount of data management of operators, and can improve operational efficiency and security. , and can realize the function of software-defined network (Software-Defined Networking, SDN).

此外,智慧型網路卡還可提供分散式硬體資源,可用於解除安裝或加速特定應用程式,並且營運商可使用智慧型網卡廠商或其他合作營運商提供的軟體,也可開發本身之軟體或提供其他接入服務,以供使用者使用定制化之軟體,因而智慧型網路卡的使用已為業界之趨勢。In addition, smart network cards can also provide distributed hardware resources that can be used to uninstall or accelerate specific applications, and operators can use software provided by smart network card manufacturers or other partner operators, or develop their own software Or provide other access services for users to use customized software, so the use of smart network cards has become a trend in the industry.

然而,由於如智慧型網路卡之資料處理裝置的功能愈來愈多,計算能力也愈來愈強,因而使得穩定性成為資料處理裝置較為重要的設計指標,一般來說,由於資料處理裝置的強度運算處理能力,因此其所造成的功耗較高而使資料處理裝置的工作溫度一般都會較高,而現有技術在沒有工作溫度的警示下,資料處理裝置在長時間的高溫度運作下容易損壞,從而導致伺服器整理運作出現問題而降低工作效率,因此,現有技術仍具備改善之空間。However, as data processing devices such as smart network cards have more and more functions and stronger computing power, stability has become a more important design index for data processing devices. Therefore, the power consumption caused by it is higher and the working temperature of the data processing device is generally higher. However, in the prior art, without the warning of the working temperature, the data processing device operates at a high temperature for a long time. It is easy to be damaged, which leads to problems in the sorting operation of the server and reduces the work efficiency. Therefore, there is still room for improvement in the prior art.

有鑒於在先前技術中,現有之資料處理裝置在工作溫度沒有適當的設計保護,因而有容易損壞而導致工作效率降低之問題,本發明透過提供一種用於管理資料處理裝置於運作時之工作溫度之溫度管理系統,以解決先前技術中所述之問題。In view of the fact that in the prior art, the existing data processing device is not properly designed to protect the working temperature, so it is easy to be damaged and the work efficiency is reduced, the present invention provides a method for managing the working temperature of the data processing device during operation. A temperature management system to solve the problems described in the prior art.

本發明為解決先前技術之問題,所採用之必要技術手段為提供一種溫度管理系統,係包含一資料處理裝置以及一工作裝置。資料處理裝置包含一第一處理模組以及一邏輯處理模組。第一處理模組係包含一第一處理單元以及一第一溫度感測單元,第一處理單元處於一第一運作狀態,第一溫度感測單元係電性連接於第一處理單元,用以感測第一處理單元之一第一工作溫度,並傳送出一包含第一工作溫度之第一感測信號。In order to solve the problems of the prior art, the present invention adopts the necessary technical means to provide a temperature management system, which includes a data processing device and a working device. The data processing device includes a first processing module and a logic processing module. The first processing module includes a first processing unit and a first temperature sensing unit, the first processing unit is in a first operating state, and the first temperature sensing unit is electrically connected to the first processing unit for A first working temperature of the first processing unit is sensed, and a first sensing signal including the first working temperature is transmitted.

邏輯處理模組係包含一溫度監測單元以及一第二處理單元。溫度監測單元係通信連接於第一溫度感測單元,設有一第一警示溫度,用以接收第一感測信號,並用以在第一工作溫度大於或等於第一警示溫度時,發送出一第一監測信號。第二處理單元係電性連接於溫度監測單元與第一處理單元,並設有一警示時間。The logic processing module includes a temperature monitoring unit and a second processing unit. The temperature monitoring unit is communicatively connected to the first temperature sensing unit, and is provided with a first warning temperature for receiving the first sensing signal, and for sending a first warning temperature when the first working temperature is greater than or equal to the first warning temperature a monitoring signal. The second processing unit is electrically connected to the temperature monitoring unit and the first processing unit, and is provided with a warning time.

工作裝置係包含一管理控制模組以及至少一風扇,管理控制模組係通信連接於溫度監測單元,用以在接收到第一監測信號時,發送出一風扇加速運轉信號。該至少一風扇係電性連接於管理控制模組,並鄰近於第一處理模組而設置,用以在接收到風扇加速運轉信號時加速運轉。其中,在該至少一風扇加速運轉後,第二處理單元在超過警示時間仍接收到溫度監測單元所發送出之第一監測信號時,係將一停止運作信號傳送至第一處理單元,藉以使第一處理單元自第一運作狀態轉換為一停止運作狀態。The working device includes a management control module and at least one fan. The management control module is communicatively connected to the temperature monitoring unit for sending a fan acceleration operation signal when receiving the first monitoring signal. The at least one fan is electrically connected to the management control module and disposed adjacent to the first processing module for accelerating the operation when receiving the fan acceleration operation signal. Wherein, after the at least one fan is accelerated to run, when the second processing unit still receives the first monitoring signal sent by the temperature monitoring unit after the warning time, it transmits a stop operation signal to the first processing unit, so that the The first processing unit transitions from the first operation state to a stop operation state.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為資料處理裝置為一網路卡,該工作裝置為一伺服器之主機板,網路卡為一智慧型網路卡(Smart Network interface controller, Smart NIC)。此外,溫度監測單元更用以在接收到第一感測信號時,將一包含有第一工作溫度之第一溫度回饋信號傳送至管理控制模組,藉以使管理控制模組獲取第一工作溫度。另外,管理控制模組係通信連接於該第二處理單元,並更用以將一第一重新啟動指令傳送至第二處理單元,藉以使第二處理單元依據第一重新啟動指令將一第一重新啟動信號發送至第一處理單元,藉以使第一處理單元自停止運作狀態轉換為第一運作狀態。On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is that the data processing device is a network card, the working device is a motherboard of a server, and the network card is an intelligent network card ( Smart Network interface controller, Smart NIC). In addition, the temperature monitoring unit is further configured to transmit a first temperature feedback signal including the first working temperature to the management control module when receiving the first sensing signal, so that the management control module can obtain the first working temperature . In addition, the management control module is communicatively connected to the second processing unit, and is further configured to transmit a first restart command to the second processing unit, so that the second processing unit can execute a first restart command according to the first restart command. The restart signal is sent to the first processing unit, so that the first processing unit is converted from the stopped operation state to the first operation state.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為資料處理裝置更包含一第二處理模組,第二處理模組包含一第三處理單元以及一第二溫度感測單元,第三處理單元處於一第二運作狀態,第二溫度感測單元係電性連接於第三處理單元,通信連接於溫度監測單元,用以感測第三處理單元之一第二工作溫度,並將一包含第二工作溫度之第二感測信號傳送至溫度監測單元。其中,溫度監測單元更設有一第二警示溫度,並在第二工作溫度大於或等於第二警示溫度時,將一第二監測信號發送至第二處理單元,藉以觸發第二處理單元將停止運作信號傳送至第三處理單元,藉以使第三處理單元自第二運作狀態轉換為停止運作狀態。On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is that the data processing device further includes a second processing module, and the second processing module includes a third processing unit and a second temperature sensing unit , the third processing unit is in a second operating state, the second temperature sensing unit is electrically connected to the third processing unit, and is communicatively connected to the temperature monitoring unit for sensing a second operating temperature of the third processing unit, and transmits a second sensing signal including the second working temperature to the temperature monitoring unit. The temperature monitoring unit is further provided with a second warning temperature, and when the second operating temperature is greater than or equal to the second warning temperature, a second monitoring signal is sent to the second processing unit, thereby triggering the second processing unit to stop operating The signal is transmitted to the third processing unit, so that the third processing unit is converted from the second operating state to the non-operating state.

在上述附屬技術手段的基礎下,本發明所衍生之一附屬技術手段為溫度監測單元更用以在接收到第二感測信號時,將一包含有第二工作溫度之第二溫度回饋信號傳送至管理控制模組,藉以使管理控制模組獲取該第二工作溫度。此外,管理控制模組係通信連接於該第二處理單元,並更用以將一第二重新啟動指令傳送至第二處理單元,藉以使第二處理單元依據第二重新啟動指令將一第二重新啟動信號發送至第三處理單元,藉以使第三處理單元自停止運作狀態轉換為第二運作狀態。On the basis of the above-mentioned auxiliary technical means, an auxiliary technical means derived from the present invention is that the temperature monitoring unit is further used for transmitting a second temperature feedback signal including the second working temperature when receiving the second sensing signal to the management control module, so that the management control module obtains the second working temperature. In addition, the management control module is communicatively connected to the second processing unit, and is further used for transmitting a second restart command to the second processing unit, so that the second processing unit executes a second restart command according to the second restart command. The restart signal is sent to the third processing unit, so that the third processing unit is converted from the stopped operation state to the second operation state.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為第二處理模組為一系統單晶片(System On a Chip, SOC),第一處理模組為一現場可程式化邏輯閘陣列(Field Programmable Gate Array, FPGA),邏輯處理模組為一複雜可程式邏輯裝置(Complex Programmable Logic Device, CPLD),警示時間為3秒,第一警示溫度為80度,第二警示溫度為104度。此外,管理控制模組為一基板管理控制器(Baseboard Management Controller, BMC)。On the basis of the above necessary technical means, an auxiliary technical means derived from the present invention is that the second processing module is a System On a Chip (SOC), and the first processing module is a field programmable logic Field Programmable Gate Array (FPGA), the logic processing module is a Complex Programmable Logic Device (CPLD), the warning time is 3 seconds, the first warning temperature is 80 degrees, and the second warning temperature is 104 degrees. In addition, the management control module is a baseboard management controller (Baseboard Management Controller, BMC).

承上所述,在採用本發明所提供之溫度管理系統後,由於在第一處理模組之溫度過高,且透過風扇加速運轉後溫度仍無法降低時,邏輯處理模組可即時觸發第一處理模組停止工作,因此可有效保護資料處理裝置損壞,因而可防止降低工作效率之情況發生。Based on the above, after using the temperature management system provided by the present invention, since the temperature of the first processing module is too high and the temperature cannot be lowered after the fan is accelerated, the logic processing module can immediately trigger the first processing module. The processing module stops working, so it can effectively protect the data processing device from damage, thereby preventing the occurrence of reduced work efficiency.

下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本發明的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本發明實施例的目的。The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the present invention will become more apparent from the following description and the scope of the claims. It should be noted that the drawings are all in a very simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

請參閱第一圖,第一圖係顯示本發明較佳實施例所提供之溫度管理系統之方塊圖。如圖所示,本發明所提供之溫度管理系統1係包含一資料處理裝置11以及一工作裝置12。資料處理裝置11例如可為一網路卡,並且網路卡例如可為一智慧型網卡(Smart Network interface controller, Smart NIC)。資料處理裝置11包含一第一處理模組111、一邏輯處理模組112以及一第二處理模組113。第一處理模組111例如可為一現場可程式化邏輯閘陣列(Field Programmable Gate Array, FPGA),並且係包含一第一處理單元1111以及一第一溫度感測單元1112,其中第一處理單元1111例如可為現有之處理器,並且在運作時處於一第一運作狀態,第一溫度感測單元1112例如可為現有之溫度感測器。Please refer to the first figure, which is a block diagram of a temperature management system provided by a preferred embodiment of the present invention. As shown in the figure, the temperature management system 1 provided by the present invention includes a data processing device 11 and a working device 12 . The data processing device 11 may be, for example, a network card, and the network card may be, for example, a smart network interface controller (Smart NIC). The data processing device 11 includes a first processing module 111 , a logic processing module 112 and a second processing module 113 . The first processing module 111 can be, for example, a Field Programmable Gate Array (FPGA), and includes a first processing unit 1111 and a first temperature sensing unit 1112 , wherein the first processing unit is 1111 can be, for example, an existing processor, and is in a first operating state during operation, and the first temperature sensing unit 1112 can be, for example, an existing temperature sensor.

邏輯處理模組112例如可為一複雜可程式邏輯裝置(Complex Programmable Logic Device, CPLD),並包含一溫度監測單元1121以及一第二處理單元1122。溫度監測單元1121例如可為現有之處理器,係通信連接於第一溫度感測單元1112,設有一第一警示溫度以及一第二警示溫度,其中第一警示溫度例如為80度(°C),第二警示溫度例如為104度(°C),但其他實施例中不限於此。The logic processing module 112 can be, for example, a complex programmable logic device (CPLD), and includes a temperature monitoring unit 1121 and a second processing unit 1122 . The temperature monitoring unit 1121 can be, for example, an existing processor, is communicatively connected to the first temperature sensing unit 1112, and has a first warning temperature and a second warning temperature, wherein the first warning temperature is, for example, 80 degrees (°C) , the second warning temperature is, for example, 104 degrees (°C), but is not limited to this in other embodiments.

另外,需要一提的是,上述第一警示溫度與第二警示溫度的設定是因應於本案第一處理模組111為現場可程式化邏輯閘陣列,其功耗一般為35瓦特,而第二處理模組113為系統單晶片,其功耗一般為22瓦特,因而設定兩種不同的警示溫度,其他實施例中可為相同,其係視實務上之設計而定。此外,本發明較佳實施例中所指之通信連接皆為有線通信連接,但其他實施例中可為無線通信連接,其係視實務上之設計而定。In addition, it should be mentioned that the above-mentioned setting of the first warning temperature and the second warning temperature is based on the fact that the first processing module 111 is a field programmable logic gate array, and its power consumption is generally 35 watts, and the second The processing module 113 is a system-on-chip, and its power consumption is generally 22 watts, so two different warning temperatures are set, which can be the same in other embodiments, depending on practical design. In addition, the communication connections referred to in the preferred embodiments of the present invention are all wired communication connections, but other embodiments may be wireless communication connections, which depend on practical designs.

第二處理單元1122例如也可為現有之處理器,並可與溫度監測單元1121整合為同一處理器中,其係視實務上之設計而定。第二處理單元1122係電性連接於溫度監測單元1121與第一處理單元1111,並設有一警示時間,且警示時間例如是3秒,但其他實施例中不限於此。The second processing unit 1122 can also be, for example, an existing processor, and can be integrated with the temperature monitoring unit 1121 into the same processor, which depends on the practical design. The second processing unit 1122 is electrically connected to the temperature monitoring unit 1121 and the first processing unit 1111, and has a warning time, and the warning time is, for example, 3 seconds, but is not limited to this in other embodiments.

第二處理模組113例如可為一系統單晶片(System On a Chip, SOC),可透過外圍組件互連(Peripheral Component Interconnect Express, PCIE)介面與第一處理模組111彼此通信連接。第二處理模組113包含一第三處理單元1131以及一第二溫度感測單元1132。第三處理單元1131例如可為一現有之處理器,並在運作時處於一第二運作狀態。第二溫度感測單元1132例如可為現有之溫度感測器,並電性連接於第三處理單元1131,通信連接於溫度監測單元1121。The second processing module 113 can be, for example, a System On a Chip (SOC), and can communicate with the first processing module 111 through a Peripheral Component Interconnect Express (PCIE) interface. The second processing module 113 includes a third processing unit 1131 and a second temperature sensing unit 1132 . The third processing unit 1131 can be, for example, an existing processor, and is in a second operating state during operation. The second temperature sensing unit 1132 can be, for example, an existing temperature sensor, and is electrically connected to the third processing unit 1131 and communicatively connected to the temperature monitoring unit 1121 .

工作裝置12例如可為一伺服器之主機板,並且可透過外圍組件互連(Peripheral Component Interconnect Express, PCIE)介面通信連接於第一處理模組111。工作裝置12包含一管理控制模組121以及至少一風扇122(圖中僅繪示一個)。管理控制模組121例如可為基板管理控制器(Baseboard Management Controller, BMC),並通信連接於溫度監測單元1121以及第二處理單元1122。該至少一風扇122係電性連接於管理控制模組121,並鄰近於第一處理模組111而設置,其具體設置位置係視實務上之配置而定。The working device 12 can be, for example, a motherboard of a server, and can be communicatively connected to the first processing module 111 through a Peripheral Component Interconnect Express (PCIE) interface. The working device 12 includes a management control module 121 and at least one fan 122 (only one is shown in the figure). The management control module 121 can be, for example, a baseboard management controller (BMC), and is communicatively connected to the temperature monitoring unit 1121 and the second processing unit 1122 . The at least one fan 122 is electrically connected to the management control module 121 and is disposed adjacent to the first processing module 111 , and the specific installation position thereof depends on the actual configuration.

第一溫度感測單元1112用以感測第一處理單元1111之一第一工作溫度,並傳送出一包含第一工作溫度之第一感測信號S1。溫度監測單元1121用以接收第一感測信號S1,並在第一工作溫度大於或等於第一警示溫度時,發送出一第一監測信號S2。The first temperature sensing unit 1112 is used for sensing a first working temperature of the first processing unit 1111 and sending a first sensing signal S1 including the first working temperature. The temperature monitoring unit 1121 is used for receiving the first sensing signal S1 and sending a first monitoring signal S2 when the first operating temperature is greater than or equal to the first warning temperature.

管理控制模組121用以在接收到第一監測信號S2時,發送出一風扇加速運轉信號S3,其中,風扇加速運轉信號S3例如為一脈衝寬度調變(Pulse Width Modulation, PWM)信號。The management control module 121 is used for sending a fan acceleration operation signal S3 when receiving the first monitoring signal S2, wherein the fan acceleration operation signal S3 is, for example, a pulse width modulation (Pulse Width Modulation, PWM) signal.

該至少一風扇122在接收到風扇加速運轉信號S3時加速運轉,在該至少一風扇122加速運轉後,第二處理單元1122在超過警示時間仍接收到溫度監測單元1121所發送出之第一監測信號S2時,係將一停止運作信號S4傳送至第一處理單元1111,藉以使第一處理單元1111自第一運作狀態轉換為一停止運作狀態。The at least one fan 122 accelerates operation when receiving the fan acceleration operation signal S3. After the at least one fan 122 accelerates operation, the second processing unit 1122 still receives the first monitoring sent by the temperature monitoring unit 1121 after the warning time expires. When the signal S2 is used, a stop operation signal S4 is transmitted to the first processing unit 1111 , so as to make the first processing unit 1111 switch from the first operation state to a stop operation state.

也就是說,本發明較佳實施例中,由於第二處理單元1122在第一工作溫度大於或等於第一警示溫度時,會即時接收溫度監測單元1121所發送出之第一監測信號S2,只要在風扇122加速運轉3秒後仍接收到第一監測信號S2即認定無法確實冷卻下來,因而進一步將停止運作信號S4傳送至第一處理單元1111,藉以使第一處理單元1111停止運作。That is to say, in the preferred embodiment of the present invention, since the second processing unit 1122 will immediately receive the first monitoring signal S2 sent by the temperature monitoring unit 1121 when the first operating temperature is greater than or equal to the first warning temperature, as long as After the fan 122 accelerates for 3 seconds and still receives the first monitoring signal S2, it is determined that it cannot be cooled down, so the stop signal S4 is further transmitted to the first processing unit 1111 to stop the first processing unit 1111 from operating.

另外,本發明較佳實施例之停止運作狀態可進一步定義為關閉狀態,由於一般來說,第一處理模組111的電源可來自於邏輯處理模組112,因此停止運作信號S4例如可為一個關電(Power off)信號,但其他實施例中不限於此。In addition, the stop operation state of the preferred embodiment of the present invention can be further defined as an off state. Generally speaking, the power supply of the first processing module 111 can come from the logic processing module 112, so the stop operation signal S4 can be, for example, a Power off (Power off) signal, but not limited to this in other embodiments.

同樣地,第二溫度感測單元1132用以感測第三處理單元1131之一第二工作溫度,並將一包含第二工作溫度之第二感測信號S5傳送至溫度監測單元1121。溫度監測單元1121在第二工作溫度大於或等於第二警示溫度時,將一第二監測信號S6發送至第二處理單元1122,藉以觸發第二處理單元1122將停止運作信號S4傳送至第三處理單元1131,藉以使第三處理單元1131自第二運作狀態轉換為停止運作狀態。Similarly, the second temperature sensing unit 1132 is used for sensing a second operating temperature of the third processing unit 1131 , and transmits a second sensing signal S5 including the second operating temperature to the temperature monitoring unit 1121 . When the second working temperature is greater than or equal to the second warning temperature, the temperature monitoring unit 1121 sends a second monitoring signal S6 to the second processing unit 1122, thereby triggering the second processing unit 1122 to send the stop operation signal S4 to the third processing unit The unit 1131 is used to make the third processing unit 1131 transition from the second operation state to the stop operation state.

其中,上述關閉第三處理單元1131的具體運作與關閉第一處理單元1111的具體運作相同,因此不再贅述,差別僅在於第三處理單元1131只要第二工作溫度大於或等於第二警示溫度就直接觸發被關閉而不需再等待警示時間,主要原因在於實務上第三處理單元1131主要還進一步處理資料處理裝置11與工作裝置12之間的網路傳輸資料,而第一處理單元1111在實務上是處理與資料處理裝置11與工作裝置12之間的連接狀態,不立即斷電即可保護資料處理裝置11與工作裝置12之間的連接狀態。The above-mentioned specific operation of turning off the third processing unit 1131 is the same as the specific operation of turning off the first processing unit 1111 , so it will not be repeated here. The main reason is that the third processing unit 1131 further processes the network transmission data between the data processing device 11 and the working device 12 in practice, while the first processing unit 1111 is in practice. The above is the connection state between the processing and data processing device 11 and the working device 12 , and the connection state between the data processing device 11 and the working device 12 can be protected without immediate power failure.

另外,本發明較佳實施例中,溫度監測單元1121在接收到第一感測信號S1時,進一步將一包含有第一工作溫度之第一溫度回饋信號S7傳送至管理控制模組121,藉以使管理控制模組121可以隨時得知目前第一處理單元1111的工作溫度,以供產線人員了解。In addition, in the preferred embodiment of the present invention, when the temperature monitoring unit 1121 receives the first sensing signal S1, it further transmits a first temperature feedback signal S7 including the first operating temperature to the management control module 121, thereby The management control module 121 can know the current working temperature of the first processing unit 1111 at any time for the production line personnel to know.

同樣地,本發明較佳實施例中,溫度監測單元1121在接收到第二感測信號S5時,進一步將一包含有第二工作溫度之第二溫度回饋信號S8傳送至管理控制模組121,藉以使管理控制模組121可以隨時得知目前第三處理單元1131的工作溫度,以供產線人員了解。Similarly, in the preferred embodiment of the present invention, when the temperature monitoring unit 1121 receives the second sensing signal S5, it further transmits a second temperature feedback signal S8 including the second operating temperature to the management control module 121, In this way, the management control module 121 can know the current working temperature of the third processing unit 1131 at any time for the production line personnel to know.

其中,需要一提的是,若第二處理單元1122在超過警示時間未接收到溫度監測單元1121所發送出之第一監測信號S2時,係可另外將一降速信號S9傳送至管理控制模組121,藉以觸發管理控制模組121將一為脈衝寬度調變信號之風扇減速運轉信號S10傳送至該至少一風扇122,藉以使該至少一風扇122減速運轉。It should be mentioned that if the second processing unit 1122 does not receive the first monitoring signal S2 sent by the temperature monitoring unit 1121 after the warning time, it can additionally transmit a deceleration signal S9 to the management control module The group 121 is used to trigger the management control module 121 to transmit a fan deceleration operation signal S10 which is a pulse width modulation signal to the at least one fan 122 , so as to decelerate the at least one fan 122 .

此外,需要一提的是,上述風扇加速運轉信號S3與風扇減速運轉信號S10中所包含的資訊可具體定義為使風扇122的轉速增加至設定的轉速與使風扇122的轉速降低至設定的轉速。In addition, it should be mentioned that the information contained in the fan acceleration operation signal S3 and the fan deceleration operation signal S10 can be specifically defined as increasing the rotation speed of the fan 122 to the set rotation speed and decreasing the rotation speed of the fan 122 to the set rotation speed .

其中,本發明較佳實施例中,在第一處理單元1111自第一運作狀態轉換為停止運作狀態後,管理控制模組121係更用以將一第一重新啟動指令S11傳送至第二處理單元1122,藉以使第二處理單元1122依據第一重新啟動指令S11將一第一重新啟動信號S12發送至第一處理單元1111,藉以使第一處理單元1111自停止運作狀態轉換為第一運作狀態,因此,本發明較佳實施例中,管理控制模組121可遠端喚醒第一處理單元1111之功能。Wherein, in the preferred embodiment of the present invention, after the first processing unit 1111 transitions from the first operation state to the stop operation state, the management control module 121 is further configured to transmit a first restart command S11 to the second processing unit unit 1122, so that the second processing unit 1122 sends a first restart signal S12 to the first processing unit 1111 according to the first restart instruction S11, so as to make the first processing unit 1111 switch from the stop operation state to the first operation state Therefore, in the preferred embodiment of the present invention, the management control module 121 can remotely wake up the function of the first processing unit 1111 .

同樣地,第三處理單元1131自第二運作狀態轉換為停止運作狀態後,管理控制模組121係更用以將一第二重新啟動指令S13傳送至第二處理單元1122,藉以使第二處理單元1122依據第二重新啟動指令S13將一第二重新啟動信號S14發送至第三處理單元1131,藉以使第三處理單元1131自停止運作狀態轉換為第二運作狀態,因此,本發明較佳實施例中,管理控制模組121可遠端喚醒第三處理單元1131之功能。Similarly, after the third processing unit 1131 transitions from the second operation state to the stop operation state, the management control module 121 is further configured to transmit a second restart command S13 to the second processing unit 1122, so as to enable the second processing The unit 1122 sends a second restart signal S14 to the third processing unit 1131 according to the second restart command S13, so as to make the third processing unit 1131 switch from the stop operation state to the second operation state. Therefore, the present invention is preferably implemented For example, the management control module 121 can remotely wake up the function of the third processing unit 1131 .

需要一提的是,第一重新啟動信號S12與第二重新啟動信號S14都可以是上電(Power on)信號,但其他實施例中不限於此。It should be mentioned that both the first restart signal S12 and the second restart signal S14 may be power-on (Power on) signals, but other embodiments are not limited thereto.

綜上所述,在採用本發明所提供之溫度管理系統後,由於在第一處理模組之溫度過高,且透過風扇加速運轉後溫度仍無法降低時,邏輯處理模組可即時觸發第一處理模組停止工作,因此可有效保護資料處理裝置損壞,因而可防止降低工作效率之情況發生。To sum up, after adopting the temperature management system provided by the present invention, when the temperature of the first processing module is too high and the temperature cannot be lowered after the fan is accelerated, the logic processing module can immediately trigger the first processing module. The processing module stops working, so it can effectively protect the data processing device from damage, thereby preventing the occurrence of reduced work efficiency.

藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。Through the detailed description of the preferred embodiments above, it is hoped that the features and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the claimed scope of the present invention.

1:溫度管理系統 11:資料處理裝置 111:第一處理模組 1111:第一處理單元 1112:第一溫度感測單元 112:邏輯處理模組 1121:溫度監測單元 1122:第二處理單元 113:第二處理模組 1131:第三處理單元 1132:第二溫度感測單元 12:工作裝置 121:管理控制模組 122:風扇 S1:第一感測信號 S2:第一監測信號 S3:風扇加速運轉信號 S4:停止運作信號 S5:第二感測信號 S6:第二監測信號 S7:第一溫度回饋信號 S8:第二溫度回饋信號 S9:降速信號 S10:風扇減速運轉信號 S11:第一重新啟動指令 S12:第一重新啟動信號 S13:第二重新啟動指令 S14:第二重新啟動信號1: Temperature management system 11: Data processing device 111: The first processing module 1111: The first processing unit 1112: the first temperature sensing unit 112: Logic processing module 1121: Temperature Monitoring Unit 1122: Second processing unit 113: Second processing module 1131: The third processing unit 1132: The second temperature sensing unit 12: Working device 121: Management control module 122: Fan S1: the first sensing signal S2: The first monitoring signal S3: Fan acceleration operation signal S4: stop operation signal S5: the second sensing signal S6: Second monitoring signal S7: The first temperature feedback signal S8: The second temperature feedback signal S9: Slow down signal S10: Fan deceleration operation signal S11: The first restart command S12: First restart signal S13: Second restart command S14: Second restart signal

第一圖係顯示本發明較佳實施例所提供之溫度管理系統之方塊圖。The first figure is a block diagram showing a temperature management system provided by a preferred embodiment of the present invention.

1:溫度管理系統 1: Temperature management system

11:資料處理裝置 11: Data processing device

111:第一處理模組 111: The first processing module

1111:第一處理單元 1111: The first processing unit

1112:第一溫度感測單元 1112: the first temperature sensing unit

112:邏輯處理模組 112: Logic processing module

1121:溫度監測單元 1121: Temperature Monitoring Unit

1122:第二處理單元 1122: Second processing unit

113:第二處理模組 113: Second processing module

1131:第三處理單元 1131: The third processing unit

1132:第二溫度感測單元 1132: The second temperature sensing unit

12:工作裝置 12: Working device

121:管理控制模組 121: Management control module

122:風扇 122: Fan

S1:第一感測信號 S1: the first sensing signal

S2:第一監測信號 S2: The first monitoring signal

S3:風扇加速運轉信號 S3: Fan acceleration operation signal

S4:停止運作信號 S4: stop operation signal

S5:第二感測信號 S5: the second sensing signal

S6:第二監測信號 S6: Second monitoring signal

S7:第一溫度回饋信號 S7: The first temperature feedback signal

S8:第二溫度回饋信號 S8: The second temperature feedback signal

S9:降速信號 S9: Slow down signal

S10:風扇減速運轉信號 S10: Fan deceleration operation signal

S11:第一重新啟動指令 S11: The first restart command

S12:第一重新啟動信號 S12: First restart signal

S13:第二重新啟動指令 S13: Second restart command

S14:第二重新啟動信號 S14: Second restart signal

Claims (10)

一種溫度管理系統,係包含: 一資料處理裝置,包含: 一第一處理模組,係包含: 一第一處理單元,並處於一第一運作狀態;以及 一第一溫度感測單元,係電性連接於該第一處理單元,用以感測該第一處理單元之一第一工作溫度,並傳送出一包含該第一工作溫度之第一感測信號;以及 一邏輯處理模組,係包含: 一溫度監測單元,係通信連接於該第一溫度感測單元,設有一第一警示溫度,用以接收該第一感測信號,並用以在該第一工作溫度大於或等於該第一警示溫度時,發送出一第一監測信號;以及 一第二處理單元,係電性連接於該溫度監測單元與該第一處理單元,並設有一警示時間;以及 一工作裝置,係包含: 一管理控制模組,係通信連接於該溫度監測單元,用以在接收到該第一監測信號時,發送出一風扇加速運轉信號;以及 至少一風扇,係電性連接於該管理控制模組,並鄰近於該第一處理模組而設置,用以在接收到該風扇加速運轉信號時加速運轉; 其中,在該至少一風扇加速運轉後,該第二處理單元在超過該警示時間仍接收到該溫度監測單元所發送出之該第一監測信號時,係將一停止運作信號傳送至該第一處理單元,藉以使該第一處理單元自該第一運作狀態轉換為一停止運作狀態。 A temperature management system comprising: A data processing device, comprising: A first processing module, comprising: a first processing unit in a first operating state; and a first temperature sensing unit electrically connected to the first processing unit for sensing a first working temperature of the first processing unit and transmitting a first sensing unit including the first working temperature signal; and A logic processing module, including: A temperature monitoring unit is communicatively connected to the first temperature sensing unit, and is provided with a first warning temperature for receiving the first sensing signal and used for when the first operating temperature is greater than or equal to the first warning temperature When , a first monitoring signal is sent; and a second processing unit electrically connected to the temperature monitoring unit and the first processing unit and provided with a warning time; and A working device, comprising: a management control module, communicatively connected to the temperature monitoring unit, for sending a fan acceleration operation signal when receiving the first monitoring signal; and at least one fan, which is electrically connected to the management control module and disposed adjacent to the first processing module, for accelerating the operation when receiving the fan acceleration operation signal; Wherein, after the at least one fan is accelerated, when the second processing unit still receives the first monitoring signal sent by the temperature monitoring unit beyond the warning time, it transmits a stop operation signal to the first The processing unit is used to make the first processing unit transition from the first operating state to a stopped operating state. 如請求項1所述之溫度管理系統,其中,該資料處理裝置為一智慧型網卡(Smart Network interface controller, Smart NIC),該工作裝置為一伺服器之主機板。The temperature management system of claim 1, wherein the data processing device is a smart network interface controller (Smart NIC), and the working device is a motherboard of a server. 如請求項1所述之溫度管理系統,其中,該溫度監測單元更用以在接收到該第一感測信號時,將一包含有該第一工作溫度之第一溫度回饋信號傳送至該管理控制模組,藉以使該管理控制模組獲取該第一工作溫度。The temperature management system of claim 1, wherein the temperature monitoring unit is further configured to transmit a first temperature feedback signal including the first operating temperature to the management when receiving the first sensing signal The control module enables the management control module to obtain the first working temperature. 如請求項1所述之溫度管理系統,其中,該管理控制模組係通信連接於該第二處理單元,並更用以將一第一重新啟動指令傳送至該第二處理單元,藉以使該第二處理單元依據該第一重新啟動指令將一第一重新啟動信號發送至該第一處理單元,藉以使該第一處理單元自該停止運作狀態轉換為該第一運作狀態。The temperature management system of claim 1, wherein the management control module is communicatively connected to the second processing unit, and is further configured to transmit a first restart command to the second processing unit, thereby enabling the The second processing unit sends a first restart signal to the first processing unit according to the first restart command, so as to make the first processing unit transition from the stop operation state to the first operation state. 如請求項1所述之溫度管理系統,其中,該資料處理裝置更包含一第二處理模組,該第二處理模組包含: 一第三處理單元,並處於一第二運作狀態;以及 一第二溫度感測單元,係電性連接於該第三處理單元,通信連接於該溫度監測單元,用以感測該第三處理單元之一第二工作溫度,並將一包含該第二工作溫度之第二感測信號傳送至該溫度監測單元; 其中,該溫度監測單元更設有一第二警示溫度,並在該第二工作溫度大於或等於該第二警示溫度時,將一第二監測信號發送至該第二處理單元,藉以觸發該第二處理單元將該停止運作信號傳送至該第三處理單元,藉以使該第三處理單元自該第二運作狀態轉換為該停止運作狀態。 The temperature management system of claim 1, wherein the data processing device further comprises a second processing module, and the second processing module comprises: a third processing unit in a second operating state; and A second temperature sensing unit is electrically connected to the third processing unit and communicatively connected to the temperature monitoring unit for sensing a second operating temperature of the third processing unit, and includes a second temperature sensing unit including the second temperature sensing unit. a second sensing signal of the working temperature is sent to the temperature monitoring unit; Wherein, the temperature monitoring unit is further provided with a second warning temperature, and when the second working temperature is greater than or equal to the second warning temperature, a second monitoring signal is sent to the second processing unit, so as to trigger the second warning temperature The processing unit transmits the stop operation signal to the third processing unit, so as to make the third processing unit transition from the second operation state to the stop operation state. 如請求項5所述之溫度管理系統,其中,該第二處理模組為一系統單晶片(System On a Chip, SOC)。The temperature management system of claim 5, wherein the second processing module is a System On a Chip (SOC). 如請求項5所述之溫度管理系統,其中,該溫度監測單元更用以在接收到該第二感測信號時,將一包含有該第二工作溫度之第二溫度回饋信號傳送至該管理控制模組,藉以使該管理控制模組獲取該第二工作溫度。The temperature management system of claim 5, wherein the temperature monitoring unit is further configured to transmit a second temperature feedback signal including the second operating temperature to the management when receiving the second sensing signal The control module enables the management control module to obtain the second working temperature. 如請求項5所述之溫度管理系統,其中,該管理控制模組係通信連接於該第二處理單元,並更用以將一第二重新啟動指令傳送至該第二處理單元,藉以使該第二處理單元依據該第二重新啟動指令將一第二重新啟動信號發送至該第三處理單元,藉以使該第三處理單元自該停止運作狀態轉換為該第二運作狀態。The temperature management system of claim 5, wherein the management control module is communicatively connected to the second processing unit, and is further configured to transmit a second restart command to the second processing unit, so as to enable the The second processing unit sends a second restart signal to the third processing unit according to the second restart command, so as to make the third processing unit transition from the stop operation state to the second operation state. 如請求項5所述之溫度管理系統,其中,該警示時間為3秒,該第一警示溫度為80度,該第二警示溫度為104度。The temperature management system of claim 5, wherein the warning time is 3 seconds, the first warning temperature is 80 degrees, and the second warning temperature is 104 degrees. 如請求項1所述之溫度管理系統,其中,該第一處理模組為一現場可程式化邏輯閘陣列(Field Programmable Gate Array, FPGA),該邏輯處理模組為一複雜可程式邏輯裝置(Complex Programmable Logic Device, CPLD),該管理控制模組為一基板管理控制器(Baseboard Management Controller, BMC)。The temperature management system of claim 1, wherein the first processing module is a Field Programmable Gate Array (FPGA), and the logic processing module is a complex programmable logic device ( Complex Programmable Logic Device, CPLD), the management control module is a baseboard management controller (Baseboard Management Controller, BMC).
TW109137472A 2020-10-28 2020-10-28 Temperature management system TWI752696B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109137472A TWI752696B (en) 2020-10-28 2020-10-28 Temperature management system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109137472A TWI752696B (en) 2020-10-28 2020-10-28 Temperature management system

Publications (2)

Publication Number Publication Date
TWI752696B true TWI752696B (en) 2022-01-11
TW202217570A TW202217570A (en) 2022-05-01

Family

ID=80809319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109137472A TWI752696B (en) 2020-10-28 2020-10-28 Temperature management system

Country Status (1)

Country Link
TW (1) TWI752696B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM289500U (en) * 2005-11-10 2006-04-11 Inventec Corp Heat dissipation management device
TW201530304A (en) * 2014-01-21 2015-08-01 Celestica Technology Consultancy Shanghai Co Ltd Method for alarming abnormal status
TW201740791A (en) * 2016-05-03 2017-11-16 廣達電腦股份有限公司 Server system and cooling method
TW201911045A (en) * 2017-08-09 2019-03-16 廣達電腦股份有限公司 Server system, computer-implemented method and non-transitory computer-readable medium

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM289500U (en) * 2005-11-10 2006-04-11 Inventec Corp Heat dissipation management device
TW201530304A (en) * 2014-01-21 2015-08-01 Celestica Technology Consultancy Shanghai Co Ltd Method for alarming abnormal status
TW201740791A (en) * 2016-05-03 2017-11-16 廣達電腦股份有限公司 Server system and cooling method
TW201911045A (en) * 2017-08-09 2019-03-16 廣達電腦股份有限公司 Server system, computer-implemented method and non-transitory computer-readable medium

Also Published As

Publication number Publication date
TW202217570A (en) 2022-05-01

Similar Documents

Publication Publication Date Title
US20150127814A1 (en) Monitoring Server Method
TWI618380B (en) Management methods, service controller devices and non-stransitory, computer-readable media
US8656003B2 (en) Method for controlling rack system using RMC to determine type of node based on FRU's message when status of chassis is changed
US9146797B2 (en) Method for ensuring remediation of hung multiplexer bus channels
US7596638B2 (en) Method, system, and apparatus to decrease CPU temperature through I/O bus throttling
CN102478006A (en) Fan speed control system and method for reading rotating speed of fan thereof
US8612509B2 (en) Resetting a hypertransport link in a blade server
US7694159B2 (en) Method of remotely controlling the power consumption of one or more servers
US10678592B2 (en) Process control system
JPS62247436A (en) Computer diagnosing system
CN107895937B (en) Redundant protection circuit of motor controller and electronic equipment
CN109857614A (en) A kind of disaster tolerance device and method of rack server
CN104317682A (en) Design method for quickly distinguishing and recognizing abnormal condition of fan stalling
CN111324503B (en) Machine frame management device, method and computer readable storage medium
TWI752696B (en) Temperature management system
CN112199257B (en) Temperature management system
US20130138852A1 (en) Electronic device with baseboard management controller
CN114281172A (en) Server fan management method, system, equipment and storage medium
CN104571098A (en) Remote self-diagnosis method based on Atom platform
TWM598968U (en) Out-of-band external control equipment and system
CN117369612B (en) Server hardware management system and method
US6304831B1 (en) Computer having multiple alarm function communication paths
JP2000307600A (en) Heart beat circuit for device system
CN116303213B (en) System and method for improving BMC chip computing efficiency
TWI724700B (en) Out-of-band external control device, system and method therefore