TWI576670B - Network architecture for lithography machine cluster - Google Patents

Network architecture for lithography machine cluster Download PDF

Info

Publication number
TWI576670B
TWI576670B TW101114468A TW101114468A TWI576670B TW I576670 B TWI576670 B TW I576670B TW 101114468 A TW101114468 A TW 101114468A TW 101114468 A TW101114468 A TW 101114468A TW I576670 B TWI576670 B TW I576670B
Authority
TW
Taiwan
Prior art keywords
lithography
data
subsystem
network
information
Prior art date
Application number
TW101114468A
Other languages
Chinese (zh)
Other versions
TW201303521A (en
Inventor
歐文 史羅特
克芬尼克 馬賽 尼可拉斯 賈考柏斯 凡
芬森特 席爾菲斯特 庫柏
Original Assignee
瑪波微影Ip公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑪波微影Ip公司 filed Critical 瑪波微影Ip公司
Publication of TW201303521A publication Critical patent/TW201303521A/en
Application granted granted Critical
Publication of TWI576670B publication Critical patent/TWI576670B/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46Multiprogramming arrangements
    • G06F9/48Program initiating; Program switching, e.g. by interrupt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46Multiprogramming arrangements
    • G06F9/48Program initiating; Program switching, e.g. by interrupt
    • G06F9/4806Task transfer initiation or dispatching
    • G06F9/4843Task transfer initiation or dispatching by program, e.g. task dispatcher, supervisor, operating system
    • G06F9/4881Scheduling strategies for dispatcher, e.g. round robin, multi-level priority queues

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Analytical Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

用於微影蝕刻機器群聚的網路架構 Network architecture for lithography etching machine clustering

本發明係有關於一種包含複數微影蝕刻元件的群聚式基板處理系統,該等元件各自被配置成用於依據圖案資料的基板獨立曝光,特別是關於用於此種群聚式基板處理系統的網路架構。 The present invention is directed to a cluster substrate processing system including a plurality of lithography etch elements, each of which is configured for independent exposure of a substrate in accordance with pattern data, particularly with respect to the substrate processing system for use in the population. Network architecture.

在半導體工業中產製具備高精確度及高可靠度之結構的需求始終不減。在微影蝕刻系統中,此種需求導致有關晶圓生產之數量和速度上的極高要求。實現此目標的方法之一將受控於網路架構的複數個微影蝕刻元件聚集成群。該網路架構本身從而能藉由一自動化主機或一使用者來控制。其存在將控制及資料服務結合成單一網路並採用高級服務技術以優先化特定資料之傳送而提供關鍵控制資料及時送達之網路架構,但已被證明在此環境中仍有不足處。 The demand for high-accuracy and high-reliability structures in the semiconductor industry has not diminished. In lithography systems, this demand leads to extremely high demands on the quantity and speed of wafer production. One of the ways to achieve this goal is to aggregate a plurality of lithography etch elements controlled by the network architecture. The network architecture itself can thus be controlled by an automated host or by a user. Its existence combines control and data services into a single network and uses advanced service technologies to prioritize the delivery of specific data to provide a network structure for the timely delivery of critical control data, but it has proven to be a disadvantage in this environment.

本發明針對用於一微影蝕刻元件群聚之網路架構提供一可供選替的解決方案。 The present invention provides an alternative solution for a network architecture for a group of lithographically etched elements.

其有必要將複數微影機器聚集成群,其中控制及資料服務均納入於此群聚網路架構中。在一特色中,本發明提出一種包含複數微影蝕刻元件的群聚式基板處理系統,每一微影蝕刻元件均被配置成用於依據圖案資料之基板獨立 曝光。每一微影蝕刻元件均包含複數微影蝕刻次系統、一控制網路以及一資料網路,該控制網路被配置成用於該複數微影蝕刻次系統與至少一元件控制單元之間的控制資訊通信,該元件控制單元被配置成傳送指令至該複數微影蝕刻次系統且該複數微影蝕刻次系統被配置成傳送回應至該元件控制單元,該資料網路被配置成用於從該複數微影蝕刻次系統到至少一資料網路集線器的資料記錄資訊通信,該複數微影蝕刻次系統被配置成將資料記錄資訊傳送至該資料網路集線器而該資料網路集線器被配置成用於接收並儲存資料記錄資訊。該系統另包含一群聚前端以做為通往一操作者或主控系統之介面,該群聚前端被配置成用於傳送控制資訊至該至少一元件控制單元以控制該等微影蝕刻次系統對於一或多個晶圓曝光之運作,且該群聚前端進一步被配置成用於接收該資料網路集線器所接收之資料記錄資訊的至少一部分。 It is necessary to integrate multiple lithography machines into a group, in which control and data services are included in this cluster network architecture. In one feature, the present invention provides a cluster substrate processing system including a plurality of lithography etch elements, each lithographic etch element being configured for substrate independence based on pattern data exposure. Each lithography etch element includes a complex lithography etching subsystem, a control network, and a data network configured for use between the complex lithography etching subsystem and the at least one component control unit Controlling information communication, the component control unit is configured to transmit an instruction to the complex lithography etch subsystem and the complex lithography etch subsystem is configured to transmit a response to the component control unit, the data network configured to be used Recording information communication of the plurality of lithography etching subsystems to at least one data network hub, the complex lithography etching subsystem configured to transmit data recording information to the data network hub, the data network hub being configured to Used to receive and store data record information. The system further includes a cluster front end as an interface to an operator or a master system, the cluster front end configured to transmit control information to the at least one component control unit to control the lithography etch subsystem The operation of one or more wafer exposures, and the cluster front end is further configured to receive at least a portion of the data record information received by the data hub.

該網路架構將控制及資料功能分成不同的網路。控制功能需要雙向的資料流動,且需要透過控制網路的可預測資訊傳輸。資料收集及管理功能一般而言需要單向流動,在資料網路中從微影蝕刻次系統向上通往資料網路集線器以及向前通往群聚介面,並可以牽涉到極為大量的資料。將此等控制及資料服務結合成單一網路並採用高級服務技術以優先化特定資料之傳送而提供關鍵控制資料及時送達之解決方案已被證明在此環境中有所不足。本發明根據以下所述的一些設計特色提出一種可供選替的解決方案。 The network architecture divides control and data functions into different networks. The control function requires two-way data flow and requires predictable information transmission through the control network. Data collection and management functions generally require one-way flow, moving from the lithography subsystem to the data hub and forward to the cluster interface in the data network, and can involve extremely large amounts of data. The combination of these control and data services into a single network and the use of advanced service technologies to prioritize the delivery of specific data to provide timely delivery of critical control data has proven to be inadequate in this environment. The present invention proposes an alternative solution based on some of the design features described below.

控制網路在元件控制單元與微影蝕刻次系統之間形成一控制網路路徑,而資料網路在資料網路集線器與微影蝕刻次系統之間形成一資料網路路徑,且該控制網路路徑和該資料網路路徑可以包含實體上不同的媒介。控制網路可以具有其自身的接線及開關,用以在控制網路之中傳送資料,其並未使用於資料網路之中。情況類似地,資料網路可以具有其自身的接線及開關,用以在資料網路之中傳送資料,其並未使用於控制網路之中。二網路之間的此種組件分隔防止或降低該二網路之間的干擾,使得一個網路之中的高負載或擁塞不會影響另一網路。 The control network forms a control network path between the component control unit and the lithography etching subsystem, and the data network forms a data network path between the data network hub and the lithography etching subsystem, and the control network The path and the data path can contain physically distinct media. The control network can have its own wiring and switches for transmitting data within the control network, which is not used in the data network. Similarly, a data network can have its own wiring and switches for transmitting data in a data network that is not used in the control network. This separation of components between the two networks prevents or reduces interference between the two networks such that high load or congestion in one network does not affect the other.

每一微影蝕刻次系統均可以具有一通往控制網路之第一連接,該第一連接被配置成透過控制網路自元件控制單元接收指令並傳送回應至元件控制單元,且每一微影蝕刻次系統同時亦可以具有一通往資料網路的不同第二連接,該第二連接被調構成透過資料網路傳送資料記錄資訊至資料網路集線器。每一次系統通往控制及資料網路的不同連接均可被用以降低同時自控制網路傳送及/或接收資料與自資料網路傳送及/或接收資料之間的干擾。 Each lithography etch subsystem can have a first connection to a control network, the first connection configured to receive an instruction from the component control unit and transmit a response to the component control unit through the control network, and each micro The shadow etching subsystem can also have a different second connection to the data network, and the second connection is configured to transmit data recording information to the data network hub through the data network. Each connection to the control and data network of each system can be used to reduce interference between simultaneous transmission and/or reception of data from the control network and transmission and/or reception of data from the data network.

該元件控制單元亦可以被配置成用於透過控制網路傳送至微影蝕刻次系統之指令以及接收自一微影蝕刻次系統之回應的相關資料通往資料網路集線器之通信。此連接使得資料網路集線器能夠儲存次系統指令及回應資訊以及來自次系統的資料記錄數據。此使得二種類型的資料能夠被儲存於一資料儲存系統之中,且不需要資料網路集線器在 控制網路上進行通信。 The component control unit can also be configured to communicate to the data network hub via instructions from the control network to the lithography etch subsystem and related data received from a lithography etch subsystem. This connection enables the data hub to store secondary system commands and response information as well as data logging data from the secondary system. This allows two types of data to be stored in a data storage system without the need for a data network hub. Control communication on the network.

在其中一個微影蝕刻元件的運作期間,微影蝕刻元件中的微影蝕刻次系統可以被配置成透過資料網路連續地傳送資料記錄資訊至資料網路集線器。該等次系統可以被配置成在運作時傳送資料記錄資訊,不需要來自資料網路集線器的命令起始。資料記錄資訊可以包含識別傳送該資料記錄資訊的次系統之資料以及自次系統感測器取得之測定資料與指出該測定的時間之時間戳記資料。 During operation of one of the lithography etch elements, the lithography etch subsystem in the lithography etch element can be configured to continuously transmit data record information to the data network hub through the data network. The secondary systems can be configured to transmit data logging information during operation without the need for command initiation from the data network hub. The data record information may include data identifying the secondary system transmitting the data record information, and measurement data obtained from the secondary system sensor and time stamp data indicating the time of the measurement.

該系統可以另包含一資料路徑,被配置成用於通往一或多個微影蝕刻次系統的圖案資料傳輸,該資料路徑形成一條不同於控制網路及資料網路的傳輸路徑。該資料路徑可以包含一圖案處理系統以及一圖案串流系統。圖案資料被微影蝕刻元件使用於小射束之控制及調變以曝光每一片基板。圖案資料可以自該資料路徑供應至一小射束切換或調變次系統,以在一基板的曝光期間致能小射束的切換或調變。圖案資料可以在未於控制網路或資料網路上傳送之下,被傳送至小射束切換或調變次系統。此等圖案資料通常包含用於預定被曝光之基板上每一區域的非常大量的資料,且提供一條不同於控制及資料網路的資料路徑,以避免因為該等資料之傳輸所造成的網路擁塞。 The system can further include a data path configured for transmission of pattern data to one or more lithography etching subsystems that form a transmission path different from the control network and the data network. The data path can include a pattern processing system and a pattern stream system. The pattern data is used by the lithography etch element for the control and modulation of the beamlets to expose each of the substrates. Pattern data can be supplied from the data path to a beamlet switching or modulation subsystem to enable switching or modulation of the beamlets during exposure of a substrate. Pattern data can be transmitted to the beamlet switching or modulation subsystem without being transmitted over the control network or data network. Such pattern data typically contains a very large amount of data for each area on the substrate to be exposed and provides a data path different from the control and data network to avoid network due to the transmission of such data. congestion.

資料網路集線器可儲存初始化微影蝕刻次系統所需的資訊,此用於一微影蝕刻次系統之初始化資訊在微影蝕刻次系統的起始期間被傳送至微影蝕刻次系統。該初始化資訊可包含針對該等次系統中之處理器之基本作業系統軟 體、該等次系統所使用的預設或特定設定及參數、及/或在次系統處理器上運行以使該等次系統執行其功能的應用軟體。資料網路集線器可做為該等次系統的啟動節點。資料網路集線器亦可以儲存指出哪些初始化資訊預定被傳送至哪個次系統的初始化資訊,以使得其能夠針對不同的次系統儲存不同資訊。經由資料網路集線器的初始化資訊儲存提供一個有效率的方式以對多個次系統的資訊提供單一貯藏處,且能夠被用來避免要求每一個次系統均納入一巨大的非揮發性記憶體以儲存該次系統的初始化資訊。針對初始化資訊的軟體更新、升級、及/或修正可以被下載至資料網路集線器並儲存於該處以供後續下載至次系統。此設計致能初始化資訊的有效率修改而不致在運作期間打擾到次系統且此等修改期間不需在控制或資料網路上進行傳輸。 The data hub can store the information needed to initialize the lithography etch subsystem. The initialization information for a lithography etch subsystem is transferred to the lithography subsystem during the beginning of the lithography subsystem. The initialization information may include a basic operating system soft for the processor in the secondary system The default or specific settings and parameters used by the subsystems, and/or application software running on the secondary system processor to cause the secondary systems to perform their functions. The data hub can act as a boot node for these secondary systems. The data hub can also store initialization information indicating which initialization information is scheduled to be transmitted to which subsystem, so that it can store different information for different subsystems. The initial information store via the data hub provides an efficient way to provide a single repository of information for multiple subsystems and can be used to avoid requiring each subsystem to incorporate a large non-volatile memory. Store initialization information for this system. Software updates, upgrades, and/or fixes for initialization information can be downloaded to the data hub and stored there for subsequent downloads to the secondary system. This design enables efficient modification of the initialization information without disturbing the secondary system during operation and without the need to transmit over the control or data network during such modifications.

微影蝕刻次系統中至少一者可被配置成在微影蝕刻次系統起始之時傳送資訊至元件控制單元,該資訊指示出控制網路上一微影蝕刻次系統之存在以及微影蝕刻次系統之一識別身分,並指出微影蝕刻次系統能夠執行的一或多個指令。元件控制單元可以被组構成在次系統本身提供相關資訊之前不具有關於連接至控制網路的次系統之識別身分以及每一次系統能夠執行的指令之資訊。此種設計使其更易於藉由修改或升級連接至控制網路的個別次系統而對其中一個微影蝕刻元件進行修改或升級,且不需要修改或升級元件控制單元。舉例而言,其可以升級一個次系統的軟體以使得該次系統能夠執行一個新的或經過修改的指令, 且可以寫下一個需要該新的或經過修改的指令被該次系統執行之新的製程程式。次系統起始之後,其將回報至元件控制單元,表示其能夠執行該新的或經過修改的指令,且元件控制集線器其後可以針對該製程程式排定一個製程作業以在該次系統之上執行該新的或經過修改之指令。 At least one of the lithography etch subsystems can be configured to transmit information to the component control unit at the start of the lithography etch subsystem, the information indicating the presence of a lithography etch subsystem and the lithography etch times on the control network One of the systems identifies the identity and indicates one or more instructions that the lithography etch subsystem can execute. The component control unit can be grouped to have no information about the identity of the secondary system connected to the control network and the instructions that each system can execute before the secondary system itself provides relevant information. This design makes it easier to modify or upgrade one of the lithographic etch elements by modifying or upgrading individual subsystems connected to the control network without modifying or upgrading the component control unit. For example, it can upgrade the software of a secondary system to enable the secondary system to execute a new or modified instruction, And you can write a new process that requires the new or modified instruction to be executed by the system. After the secondary system starts, it will report back to the component control unit indicating that it can execute the new or modified command, and the component control hub can then schedule a process job for the process program to be above the secondary system. Execute this new or modified instruction.

控制網路可被配置成用於元件控制單元與微影蝕刻次系統之間的服務資訊之通信,且該群聚前端可被調構成配發用以在一或多個微影蝕刻元件上執行服務功能的服務資訊。以此種方式,其可以從用於控制功能的同一介面執行服務動作,且服務資訊之傳輸不需要另外的網路設施。 The control network can be configured for communication of service information between the component control unit and the lithography etch subsystem, and the cluster front end can be configured to dispense for execution on one or more lithography etch elements Service information for service functions. In this way, it is possible to perform service actions from the same interface used to control the function, and the transmission of service information does not require additional network facilities.

該系統可以被配置成提供二時脈信號給微影蝕刻次系統,其中一時脈信號具有一高於另一時脈頻率至少100倍的時脈頻率,且其中該微影蝕刻次系統被配置成使用該等時脈信號同步其動作。該二時脈信號提供不同時序精確度之同步時脈予次系統。例如,一時脈信號之精確度可以是毫秒,而另一時脈信號之精確度則是奈秒。 The system can be configured to provide a two-clock signal to the lithography etching subsystem, wherein one clock signal has a clock frequency that is at least 100 times higher than the other clock frequency, and wherein the lithography etch subsystem is configured to use The clock signals synchronize their actions. The two-clock signal provides a synchronized clock with different timing accuracy to the secondary system. For example, the accuracy of one clock signal can be milliseconds, while the accuracy of another clock signal is nanoseconds.

微影蝕刻次系統可以未被提供任何通往操作員或主控系統之介面,而是僅透過該群聚前端提供此等介面給次系統。操作員或主控系統僅需要單一介面連接至群聚前端。其不需要一個連接至多個不同次系統的介面,以簡化設計並使得其能夠在不需要修改連接操作員或主控系統的介面下進行次系統之修改。一使用者可藉由製造一通往前端之介面而設計出其自身的通往群聚式基板處理系統之介面,無需詳盡知悉控制網路和資料網路的內部架構及協定。 The lithography sub-system may not provide any interface to the operator or the host system, but rather provide such interfaces to the subsystem via only the cluster front end. The operator or master system requires only a single interface to connect to the cluster front end. It does not require an interface to multiple different subsystems to simplify the design and enable it to be modified by sub-systems without the need to modify the interface of the connection operator or the master system. A user can design their own interface to the clustered substrate processing system by fabricating a front-end interface without having to fully understand the internal architecture and protocols of the control network and data network.

在另一特色之中,本發明包含一種用於在一包含複數微影蝕刻元件之群聚式基板處理系統內之資料通信的方法,每一微影蝕刻元件均被配置成用於依據圖案資料之基板獨立曝光,且每一微影蝕刻元件均包含一控制網路,連接一元件控制單元與複數微影蝕刻次系統、一資料網路,連接一資料網路集線器與該該複數微影蝕刻次系統、以及一群聚前端。該方法包含透過該控制網路自該元件控制單元傳送控制資訊至該複數微影蝕刻次系統中的一或多者、透過該控制網路自該複數微影蝕刻次系統傳送回應至該元件控制單元、自該複數微影蝕刻次系統傳送資料記錄資訊至該資料網路集線器、接收並儲存該資料記錄資訊於該資料網路集線器之中、自該群聚前端傳送控制資訊至該機器控制單元以控制該複數微影蝕刻次系統對於一或多個基板之曝光動作、以及傳送該資料網路集線器所儲存之資料記錄資訊的至少一部分至該群聚前端。 In another feature, the invention comprises a method for data communication in a cluster substrate processing system comprising a plurality of lithography etch elements, each lithographic etch element being configured for pattern data The substrate is independently exposed, and each lithography etch element comprises a control network, a component control unit and a plurality of lithography etching subsystems, a data network, a data network hub and the complex lithography etching Sub-systems, as well as a group of poly front ends. The method includes transmitting control information from the component control unit to one or more of the plurality of lithography etching subsystems through the control network, and transmitting a response from the plurality of lithography etching subsystems to the component control through the control network And transmitting, by the plurality of lithography etching subsystems, data recording information to the data network hub, receiving and storing the data recording information in the data network hub, and transmitting control information from the cluster front end to the machine control unit Controlling the exposure of the plurality of lithography etching subsystems to one or more substrates, and transmitting at least a portion of the data recording information stored by the data hub to the cluster front end.

傳送至微影蝕刻次系統之控制資訊以及來自微影蝕刻次系統之回應可以是僅透過該控制網路傳送至該元件控制單元,且來自微影蝕刻次系統之資料記錄資訊可以是僅透過該資料網路傳送至該資料網路集線器。該方法可以另包含將有關於傳送至微影蝕刻次系統之指令與接收自一微影蝕刻次系統之回應的資料,自該元件控制單元傳送至該資料網路集線器。自一微影蝕刻次系統傳送該資料記錄資訊至該資料網路集線器可以是在一指令被微影蝕刻次系統執行期間被連續地執行。 The control information transmitted to the lithography etching subsystem and the response from the lithography etching subsystem may be transmitted to the component control unit only through the control network, and the data recording information from the lithography etching subsystem may be only The data network is transmitted to the data network hub. The method can further include transmitting information from the component control unit to the data hub for instructions relating to the transfer to the lithography subsystem and the response received from a lithography subsystem. Transferring the data record information from a lithography etch sub-system to the data network hub may be performed continuously during an instruction being executed by the lithography subsystem.

該方法可另包含透過一資料路徑傳送圖案資料至一或多個微影蝕刻次系統,該資料路徑形成一條不同於該控制網路及該資料網路的傳輸路徑。該方法同時亦可以包含將初始化微影蝕刻次系統所需要的資訊儲存於該資料網路集線器之中,並在微影蝕刻次系統的起始期間傳送該初始化資訊至一微影蝕刻次系統。該方法同時亦可以包含在微影蝕刻次系統起始之時自其中一微影蝕刻次系統傳送資訊至元件控制單元,該資訊指示出控制網路上一微影蝕刻次系統之存在以及微影蝕刻次系統之一識別身分,並指出微影蝕刻次系統能夠執行的一或多個指令。 The method can further include transmitting the pattern data to the one or more lithography etching subsystems via a data path, the data path forming a transmission path different from the control network and the data network. The method can also include storing information needed to initialize the lithography etch subsystem in the data hub, and transmitting the initialization information to a lithography etch subsystem during the beginning of the lithography subsystem. The method can also include transmitting information from one of the lithography etching subsystems to the component control unit at the beginning of the lithography etching system, the information indicating the presence of a lithography etching subsystem and the lithography etching on the control network. One of the secondary systems identifies the identity and indicates one or more instructions that the lithography etch subsystem can perform.

以下說明本發明之特定實施例,其參照圖式進行,且僅係示範性質。 Specific embodiments of the invention are described below with reference to the drawings and are merely exemplary.

圖1係依據本發明之具備控制及資料介面之微影蝕刻系統1之一實施例之一示意圖。該示意圖顯示一具有三個介面之階層式配置,一群聚介面3、群聚元件介面5、以及微影蝕刻次系統介面7。圖1例示之組態具有一包含一微影蝕刻元件10之微影蝕刻系統群聚,其中包含多個微影蝕刻次系統16。該微影蝕刻系統可以包含多個微影蝕刻元件10,舉例而言,如圖2實施例之中所示。 1 is a schematic illustration of one embodiment of a lithography etching system 1 having a control and data interface in accordance with the present invention. The schematic shows a hierarchical configuration with three interfaces, a population of polymeric interfaces 3, a clustering component interface 5, and a lithographic etching subsystem interface 7. The configuration illustrated in FIG. 1 has a lithography etching system cluster including a lithography etch element 10 including a plurality of lithography etching subsystems 16. The lithography etching system can include a plurality of lithography etch elements 10, as shown, for example, in the embodiment of FIG.

群聚介面3包含用於一微影蝕刻群聚前端6與一或多個主控系統2之間及/或群聚前端6與一或多個操作者操控台4之間的通信之介面。 The clustering interface 3 includes an interface for communication between a lithography etch cluster front end 6 and one or more master systems 2 and/or between the cluster front end 6 and one or more operator consoles 4.

群聚元件介面5包含用於群聚前端6與一微影蝕刻元件網路之間通信之介面,該微影蝕刻元件網路一元件控制單元12及/或一資料網路集線器14。元件控制單元12可透過連結106通連一資料網路集線器14,其中該通連較佳係從元件控制單元12單向通往資料網路集線器14。 The clustering component interface 5 includes an interface for communication between the cluster front end 6 and a network of lithographic etch elements, the lithography etch element network component control unit 12 and/or a data network hub 14. The component control unit 12 can be coupled to a data network hub 14 via a link 106, wherein the communication is preferably unidirectionally directed from the component control unit 12 to the data network hub 14.

微影蝕刻次系統介面7包含元件控制單元12與微影蝕刻次系統16之間以及資料網路集線器14與微影蝕刻次系統16之間的介面。次系統16透過控制網路120通連元件控制單元12,且次系統16透過資料網路140通連資料網路集線器14。 The lithography etch sub-system interface 7 includes an interface between the component control unit 12 and the lithography etch sub-system 16 and between the data network hub 14 and the lithography etch sub-system 16. Secondary system 16 is coupled to component control unit 12 via control network 120, and secondary system 16 is coupled to data network hub 14 via data network 140.

圖2係一微影蝕刻系統1之一實施例之示意圖,其中之微影蝕刻系統群聚包含多個微影蝕刻元件10,每一元件均包含多個微影蝕刻次系統16。每一元件均可以包含一元件控制單元12及資料網路集線器14,通連該元件之微影蝕刻次系統16。每一元件均可以做為一獨立之微影蝕刻元件,能夠獨立地運作以利用一微影蝕刻製程曝光晶圓。在此實施例之中,該多個微影蝕刻元件10各自均通連單一前端6,而前端6通連對整個群具均有作用的一或多個主控系統2及/或操作者介面4。 2 is a schematic diagram of an embodiment of a lithography etching system 1 in which a lithography etching system cluster comprises a plurality of lithography etch elements 10, each of which includes a plurality of lithography etching subsystems 16. Each component can include a component control unit 12 and a data network hub 14 that interconnects the component's lithography etch subsystem 16. Each component can be used as a separate lithography etch component that can operate independently to expose the wafer using a lithography process. In this embodiment, the plurality of lithography etch elements 10 are each connected to a single front end 6, and the front end 6 is connected to one or more main control systems 2 and/or operator interfaces that function for the entire group. 4.

圖1和圖2中的實施例較佳係設計成輔助一微影蝕刻元件群聚之有效率控制。每一微影蝕刻元件10較佳係僅具有網路介面,通往控制網路120及資料網路140。此設計規則之一例外係資料路徑20直接將圖案串流器19連接至負責調變或切換帶電微粒射束的次系統。圖案資料最初在圖 案資料處理系統18之中準備,並被傳送至圖案串流器19以進行資料轉換並串流至次系統。此設計著眼於傳送至相關次系統的極其大量的圖案資料。圖案資料通常係以位元映像(bit-map)格式被串流至相關次系統,因為對於位於次系統處的本地端儲存而言,資料之數量過於龐大。 The embodiment of Figures 1 and 2 is preferably designed to assist in the efficient control of a group of lithographically etched elements. Each lithography etch element 10 preferably has only a network interface to the control network 120 and the data network 140. An exception to this design rule is that the data path 20 directly connects the pattern streamer 19 to a subsystem that is responsible for modulating or switching the charged particle beam. Pattern data is initially in the map Prepared in the file processing system 18 and transmitted to the pattern streamer 19 for data conversion and streaming to the subsystem. This design focuses on the extremely large amount of pattern data that is transmitted to the relevant subsystem. Pattern data is typically streamed to the associated subsystem in a bit-map format because the amount of data is too large for local-side storage at the secondary system.

操作者介面以及通往更高層級主機管控及自動化電腦的介面並非由個別的微影蝕刻元件構成,而是位於群聚前端6處。此使得該等介面之開發能夠在不需要微影蝕刻元件10之介面協定之知識下且未增加額外要求或干涉在控制網路120及資料網路140上的通信下針對群聚進行。 The operator interface and the interface to the higher level host management and automation computer are not comprised of individual lithographic etched elements, but are located at the cluster front end 6. This enables the development of such interfaces to be performed for clustering without the knowledge of the interface agreement of the lithography etch element 10 and without additional requirements or interference with communication over the control network 120 and the data network 140.

圖3顯示一微影蝕刻系統群聚100之一簡化上視圖。在此實施例之中,該群聚包含一個由十個微影蝕刻元件10所構成之群組,配置成並列的二個包含五個元件之橫列。直接毗鄰群聚100,底層空間被保留成服務區域23。每一微影蝕刻元件均包含一電子光學腔體,包含於其自身的真空處理室中,其中每一真空處理室之一邊均面對一基板投送系統22以及服務區域23。基板投送系統22自一基板供應系統24接收基板且將其提供給微影蝕刻元件10以進行處理,並自微影蝕刻元件10接收經過處理之基板且將其提供給基板供應系統24以轉移至晶圓廠中的其他系統。 Figure 3 shows a simplified top view of a lithography etching system cluster 100. In this embodiment, the cluster comprises a group of ten lithographic etch elements 10 arranged in parallel to include two courses of five elements. Directly adjacent to the cluster 100, the underlying space is reserved as the service area 23. Each lithographic etch element includes an electro-optical cavity contained in its own vacuum processing chamber, with one of the vacuum processing chambers facing a substrate delivery system 22 and a service area 23. The substrate delivery system 22 receives the substrate from a substrate supply system 24 and provides it to the lithography etch element 10 for processing, and receives the processed substrate from the lithography etch element 10 and provides it to the substrate supply system 24 for transfer To other systems in the fab.

在帶電微粒微影蝕刻設備的情況下,真空處理室較佳係密封住用於產生多個帶電微粒小射束之帶電微粒源及組件、一切換或調變該等小射束之射束調變系統、一用於投射該等小射束至一預定被圖案化之基板上投射器系統、以 及一可移動基板平台。真空處理室較佳係包含一加載互鎖系統以自基板投送系統22將基板轉入及轉出真空處理室,且亦包含一面朝服務區域23之進出艙門,其可被開啟以進行對電子光學腔體之服務。 In the case of a charged particle lithography apparatus, the vacuum processing chamber preferably seals the charged particle source and assembly for generating a plurality of charged particle beamlets, and switches or modulates the beamlets of the beamlets. a variable system, a projector system for projecting the beamlets onto a predetermined patterned substrate, And a movable substrate platform. The vacuum processing chamber preferably includes a load lock system for transferring the substrate from and to the vacuum processing chamber from the substrate delivery system 22, and also includes an access door toward the service area 23 that can be opened for operation. Service to electro-optical chambers.

每一微影蝕刻元件10均獨立運作以接收及處理晶圓。每一微影蝕刻元件均包含其自身之電腦處理系統,用以處理資料及操控微影蝕刻元件之組件和次系統。每一微影蝕刻次系統16較佳係具有其自身之電腦處理器和記憶體系統,以執行導控次系統運作之指令、收集次系統運作所產生之資料、並通連控制及資料網路。控制元件單元12和資料網路集線器14較佳係各自包含其本身之電腦處理器和記憶體系統以執行其功能。一微影蝕刻元件10的控制元件單元12、資料網路集線器14和次系統16中的電腦處理器及記憶體系統可設置於極為靠近微影蝕刻元件的真空處理室處,例如設置於固定在真空處理室上方的機櫃中、設置於真空處理室下方的基座中、或是設置於各個位置的局部。 Each lithography etch element 10 operates independently to receive and process the wafer. Each lithography etch component includes its own computer processing system for processing data and manipulating the components and subsystems of the lithographic etch component. Each lithography etch sub-system 16 preferably has its own computer processor and memory system to perform the instructions for guiding the operation of the sub-system, collecting data generated by the operation of the sub-system, and communicating control and data networks. . Control component unit 12 and data network hub 14 preferably each include their own computer processor and memory system to perform their functions. The control unit 12 of the lithography etch element 10, the data network hub 14 and the computer processor and memory system in the subsystem 16 can be disposed at a vacuum processing chamber that is in close proximity to the lithographic etch element, for example, In the cabinet above the vacuum processing chamber, in the base below the vacuum processing chamber, or in a part of each position.

群聚之微影蝕刻元件之並列式佈局使一系統具備有限佔用面積,而直接置放於真空處理室上方或下方之電腦處理器及記憶體系統亦降低佔用面積。晶圓廠內之樓層空間極為珍貴,因此有效率使用晶圓廠之樓層空間係相當重要。 The side-by-side layout of the lithographic etched elements of the cluster allows a system to have a limited footprint, while the computer processor and memory system placed directly above or below the vacuum processing chamber also reduces the footprint. The floor space within the fab is extremely valuable, so efficient use of the floor space of the fab is important.

圖4顯示一帶電微粒微影蝕刻元件之電子光學腔體之一簡化示意圖。舉例而言,此種微影蝕刻系統描述於編號6,897,458、6,958,804、7,019,908、7,084,414、以及7,129,502的美國專利案之中、編號2007/0064213的美國專利公開案 之中、以及編號61/031,573、61/031,594、61/045,243、61/055,839、61/058,596、以及61/101,682的共同待審美國專利申請案之中,其均受讓予本發明之擁有者,故均以其整體參照之形式納入本說明書。 Figure 4 shows a simplified schematic of one of the electro-optical cavities of a charged particulate lithography etch element. For example, such a lithography etching system is described in U.S. Patent Nos. 6,897,458, 6,958,804, 7, 019, 908, 7, 084, 414, and 7, 129, 502, U.S. Patent Publication No. 2007/0064213 And the copending U.S. Patent Application Serial Nos. 61/031,573, 61/031,594, 61/045, 243, 61/055, 839, 61/058, 596, and 61/101, 682, all assigned to the owner of the present invention. Therefore, they are included in this specification in the form of their overall reference.

在圖4所示的實施例之中,該微影蝕刻元件腔體包含一產生擴張電子射束130之電子源110,其藉由準直儀透鏡系統113被進行準直化。被準直化之電子射束照射至一孔隙陣列114a之上,其阻擋部分射束以產生複數子射束134,該等子射束通過一聚焦子射束之聚光器透鏡陣列116。該等子射束照射至一第二孔隙陣列114b之上,其自每一子射束134產生複數小射束133。此系統產生數量極為龐大之小射束133,較佳係大約10,000至1,000,000個小射束。 In the embodiment illustrated in FIG. 4, the lithography etch element cavity includes an electron source 110 that produces an expanded electron beam 130 that is collimated by a collimator lens system 113. The collimated electron beam impinges on an aperture array 114a that blocks a portion of the beam to produce a plurality of sub-beams 134 that pass through a focused sub-beam concentrator lens array 116. The sub-beams are directed onto a second array of apertures 114b that produce a plurality of beamlets 133 from each of the sub-beams 134. This system produces an extremely large number of small beams 133, preferably about 10,000 to 1,000,000 beamlets.

一小射束消隱器陣列117,包含複數消隱電極,將所選擇之一些小射束加以偏轉。未被偏轉的小射束抵達射束光欄陣列118並通過一對應孔隙,而被偏轉之小射束錯過對應孔隙而被射束光欄陣列擋住。因此,小射束消隱器陣列117以及射束光欄陣列118共同運作以開關個別的小射束。未被偏轉的小射束通過射束光欄陣列118,並穿過一射束偏轉器陣列119,其偏轉該等小射束以將小射束掃描過標靶或基板121之表面。其後,小射束通過投射透鏡陣列120並被投射至基板121之上,該基板被設置於一用於攜載該基板的可移動平台之上。對於微影蝕刻應用,基板通常包含一個具備帶電微粒感應層或光阻層的晶圓。 A beamlet blanker array 117 includes a plurality of blanking electrodes that deflect selected selected beamlets. The undeflected beamlets arrive at the beam stop array 118 and pass through a corresponding aperture, while the deflected beamlets miss the corresponding aperture and are blocked by the beam array. Thus, the beamlet blanker array 117 and the beam stop array 118 operate in concert to switch individual beamlets. The undeflected beamlets pass through the beam stop array 118 and pass through a beam deflector array 119 which deflects the beamlets to scan the beamlets across the surface of the target or substrate 121. Thereafter, the beamlets pass through the projection lens array 120 and are projected onto the substrate 121, which is placed over a movable platform for carrying the substrate. For lithography applications, the substrate typically contains a wafer with a charged particle sensing layer or photoresist layer.

該微影蝕刻元件腔體運作於一真空環境中。其需要真 空狀態以移除微粒,該等微粒可能被帶電微粒射束離子化而被吸引至源頭、可能游離並沉積至機器組件上、並且可能分散帶電微粒射束。通常其需要至少10-6巴(bar)之真空狀態。為了維持真空環境,帶電微粒微影蝕刻系統被設置於一真空處理室之中。微影蝕刻元件中的所有主要元件較佳係容納於一共同真空處理室中,包含帶電微粒源、用以投射小射束於基板上的投射器系統、以及可移動平台。 The lithography etch element cavity operates in a vacuum environment. It requires a vacuum state to remove particles that may be ionized by the charged particle beam to be attracted to the source, may be freed and deposited onto the machine components, and may disperse the charged particle beam. Usually it requires a vacuum of at least 10 -6 bar. To maintain the vacuum environment, a charged particle lithography system is placed in a vacuum processing chamber. Preferably, all of the primary components of the lithographic etched component are housed in a common vacuum processing chamber, including a source of charged particles, a projector system for projecting a small beam onto the substrate, and a movable platform.

次系統Secondary system

在圖1及圖2的實施例之中,每一微影蝕刻元件10均形成一用以曝光晶圓之獨立運作微影蝕刻元件。每一微影蝕刻元件10均包含多個次系統16,用以執行元件所需之功能。每一個次系統均執行一特定之功能。典型的次系統16包含,舉例而言,一晶圓載入次系統(WLS)、一晶圓定位次系統(WPS)、一用以產生電子小射束之照射光學模組次系統(ILO)、一用以將射束切換資料串流至微影蝕刻元件之圖案串流次系統(PSS)、一用以將電子小射束切換成開或關的射束切換次系統(BSS)、一用以將小射束投射至晶圓上的投射光學模組次系統(POS)、一射束測定次系統(BMS)、一度量次系統(MES)等等。每一微影蝕刻元件10較佳係被組構成用以接收晶圓、將每一晶圓箝夾至一夾盤(chuck)並備妥被箝夾之晶圓以供曝光、曝光被箝夾之晶圓、及自夾盤鬆釋已曝光之晶圓並提交該已曝光之晶圓以將其自元件移除。 In the embodiment of Figures 1 and 2, each lithography etch element 10 forms an independently operated lithography etch element for exposing the wafer. Each lithography etch element 10 includes a plurality of subsystems 16 for performing the functions required for the components. Each secondary system performs a specific function. A typical subsystem 16 includes, for example, a wafer loading subsystem (WLS), a wafer positioning subsystem (WPS), and an illumination optical module subsystem (ILO) for generating electron beamlets. a pattern stream sub-system (PSS) for streaming beam switching data to the lithography etch element, a beam switching subsystem (BSS) for switching the electron beamlet to on or off, A projection optical module subsystem (POS), a beam measurement subsystem (BMS), a metrology system (MES), and the like for projecting a beam onto a wafer. Each lithography etch element 10 is preferably configured to receive wafers, clamp each wafer to a chuck, and prepare a clamped wafer for exposure, exposure, and clamping. The wafer, and the self-clamp release the exposed wafer and submit the exposed wafer to remove it from the component.

每一個次系統16均可包含一或多個模組17,專責特定之子功能,且較佳係設計成可置換之組件。模組17可以包 含致動器19以及感測器21,致動器19能夠執行一指令,而感測器21能夠偵測一指令執行期間、執行之前及/或執行之後的動作及結果。 Each subsystem 16 can include one or more modules 17 dedicated to a particular sub-function and preferably designed as a replaceable component. Module 17 can be packaged With an actuator 19 and a sensor 21, the actuator 19 is capable of executing an instruction, and the sensor 21 is capable of detecting actions and results during, during, and/or after execution of an instruction.

每一個次系統16均獨立運作且包含一用以儲存指令之記憶體及一用以執行指令之電腦處理器。該記憶體和處理器可在每一個次系統中被實施成一外掛用戶(PIC)15之形式。次系統之適當實施方式可包含例如一執行Linux作業系統的個人電腦。該等次系統可包含一硬碟或非揮發性記憶體以儲存其作業系統,使得每一次系統均自該硬碟或記憶體啟動。以上所述之特徵以及以下所述之其他特徵促成一種其中每一個次系統均係一自主單元之設計,其可以是以一獨立單元之形式被設計、建構及測試,無須考慮其他次系統所強加之限制。舉例而言,每一個次系統均可以被設計成具有充分的記憶體及處理容量以在其運作期間正確地執行該次系統之功能,無須考慮其他次系統對於記憶體及處理容量之要求。此在系統的開發和升級期間特別有利,因為此時該等需求仍不斷變化。此設計之缺點在於所需要的總記憶體及處理容量增加,及過多的該等組件必須實施於每一個次系統中。然而,相較於促使開發更快速以及升級更簡單的設計簡化,該等缺點顯得瑕不掩瑜。 Each subsystem 16 operates independently and includes a memory for storing instructions and a computer processor for executing instructions. The memory and processor can be implemented in the form of a plug-in user (PIC) 15 in each subsystem. Suitable implementations of the secondary system may include, for example, a personal computer that executes a Linux operating system. The secondary systems may include a hard disk or non-volatile memory to store their operating system such that each time the system is booted from the hard disk or memory. The features described above and other features described below facilitate a design in which each subsystem is an autonomous unit that can be designed, constructed, and tested in the form of a single unit, regardless of other subsystems. Plus the limit. For example, each subsystem can be designed to have sufficient memory and processing capacity to properly perform the functions of the subsystem during its operation, regardless of the memory and processing capacity requirements of other subsystems. This is particularly advantageous during system development and upgrades as these requirements are constantly changing. The disadvantage of this design is that the total memory and processing capacity required is increased, and too many of these components must be implemented in each subsystem. However, these shortcomings seem to be inconspicuous compared to design simplifications that make development faster and upgrade easier.

次系統16被設計成透過控制網路120接收指令並以獨立於其他次系統的方式執行指令,且根據要求回報指令執行結果和傳出產生的任何執行資料。 The secondary system 16 is designed to receive instructions through the control network 120 and execute the instructions in a manner independent of other secondary systems, and to report the execution results of the instructions and any execution data generated by the outgoings as required.

次系統16可被設計成自主單元,但被設計成自一中央 磁碟或記憶體啟動,例如位於資料網路集線器之上者。此降低每一個次系統之中個別硬碟或非揮發性記憶體的可靠度問題及成本,並藉由更新次系統在中央位置的啟動映像而容許次系統更簡易的軟體升級。 The secondary system 16 can be designed as an autonomous unit but designed to be self-centered The disk or memory is booted, for example, on a data hub. This reduces the reliability issues and costs of individual hard disk or non-volatile memory in each sub-system, and allows for a simpler software upgrade of the secondary system by updating the boot image of the secondary system at a central location.

通訊協定Communication protocol

次系統16透過一控制網路連接至一元件控制單元12,其亦被稱為一支援次系統控制或SUSC。元件控制單元12包含記憶體以及一電腦處理器以針對微影蝕刻元件10控制其次系統之運作。 The secondary system 16 is coupled to a component control unit 12 via a control network, which is also referred to as a secondary subsystem control or SUSC. The component control unit 12 includes a memory and a computer processor to control the operation of the secondary system for the lithography etch component 10.

介於群聚前端6與SUSC 12之間的通信102被設計成用以進行PP至SUSC 12之傳輸。其可使用一種基於Java描述物件表示法(JSON)之協定。JSON係一文字式的開放性標準,針對人類可讀資料之交換而設計,用以表示簡單的資料結構和陣列,且適合於在一網路連接上串列及傳送結構性資料。協定使用的較佳實施方式係限定於群聚處之使用者,而非限定於潔淨室環境外部的使用者。該協定較佳係提供一指令用於PJ之建立,傳輸PP檔案和任何相關參數,以指示SUSC根據該PP產生一PJ。其他更多指令可包含Abort以及Cancel指令。從SUSC 12通往群聚前端6之通信可以包含應答訊息、進度回報、及錯誤和警示訊息。 The communication 102 between the cluster front end 6 and the SUSC 12 is designed to perform PP to SUSC 12 transmission. It can use a protocol based on Java Description Object Representation (JSON). JSON is a textual open standard designed for the exchange of human readable data to represent simple data structures and arrays, and is suitable for arranging and transmitting structured data over a network connection. Preferred embodiments for use in the agreement are limited to users at the cluster, and are not limited to users outside the clean room environment. Preferably, the agreement provides an instruction for the establishment of the PJ, transmitting the PP file and any associated parameters to instruct SUSC to generate a PJ based on the PP. Other more instructions can include Abort and Cancel instructions. The communication from SUSC 12 to the cluster front end 6 can include response messages, progress reports, and error and alert messages.

控制網路120上介於SUSC 12與微影蝕刻次系統16之間的通信101較佳係僅使用元件控制單元協定加以嚴格控制,以確保網路上的準即時(quasi real-time)效能。 The communication 101 between the SUSC 12 and the lithography etch subsystem 16 on the control network 120 is preferably tightly controlled using only component control unit protocols to ensure quasi real-time performance on the network.

介於SUSD 14與群聚前端6之間的通信105係設計用 於PJ結果之擷取、作業追蹤以及SUSD 14的資料記錄。對於此種通信連結,其可以使用超文字傳輸協定(HTTP)。 Communication 105 between SUSD 14 and cluster front end 6 Acquisition of PJ results, job tracking, and data logging of SUSD 14. For such a communication link, it is possible to use Hypertext Transfer Protocol (HTTP).

介於微影蝕刻次系統16與SUSD 14之間的通信103係設計用於次系統16的資料單向收集。其可以使用各種協定傳送該資料,諸如syslog、HDF5、UDP及其他協定。 The communication 103 between the lithography etch subsystem 16 and the SUSD 14 is designed for unidirectional collection of data for the subsystem 16. It can use a variety of protocols to transfer this material, such as syslog, HDF5, UDP, and other protocols.

其可以使用使用者數據電報協定(UDP)傳送大量資料,以在免於交握、錯誤檢查及修正的巨大經常性負擔下傳送資料。由於其產生極低的經常性傳輸負擔,使得資料能夠被視為被即時地接收。 It can use the User Data Telegraph Protocol (UDP) to transfer large amounts of data to transfer data under the enormous recurring burden of avoiding handshakes, error checking and corrections. Data can be considered to be received on the fly due to its extremely low recurring transmission burden.

階層式資料格式HDF5可被用於高頻率資料的傳輸及儲存。HDF5極為適合儲存和組織大量的數值資料,但通常不使用於一UDP環境。其亦可以採用其他資料格式,諸如CSV或TCP,特別是對於低層級(小量)資料。 The hierarchical data format HDF5 can be used for transmission and storage of high frequency data. HDF5 is ideal for storing and organizing large amounts of data, but is usually not used in a UDP environment. It can also use other data formats, such as CSV or TCP, especially for low-level (small) data.

製程程式Process program

微影蝕刻元件10之運作係使用一製程程式(PP)11加以控制,其包含一連串待執行的動作。元件控制單元12被載入一PP,並經由一主控系統2或一操作者透過一操控台4之要求而排定及執行PP 11。PP 11可以採取一收訊(recipe)之形式,並被架構成SEMI E40標準中所定義之形式。 The operation of the lithography etch element 10 is controlled using a process program (PP) 11, which includes a series of actions to be performed. The component control unit 12 is loaded with a PP and is scheduled and executed via a master control system 2 or an operator via a console 4 request. The PP 11 can take the form of a receipt and is framed to form the form defined in the SEMI E40 standard.

PP係一组預先設定且可重覆使用部分的指令、設定及參數,其決定晶圓之處理環境且可以在執行或處理周期之間受到變更。其可以藉由微影蝕刻工具設計器設計PP,或藉由工具產生。 The PP is a set of pre-set and reusable portions of instructions, settings, and parameters that determine the processing environment of the wafer and can be changed between execution or processing cycles. It can be designed by the lithography etch tool designer PP or by tools.

其可以透過使用者將PP上傳至微影蝕刻系統。其使用 PP產生製程作業(PJ)。製程作業(PJ)指定預定藉由微影蝕刻元件10套用至一晶圓或一组晶圓之處理。PJ定義處理一组特定晶圓之時使用哪個PP,且可以包含來自PP(以及選擇性地來自使用者)之參數。PJ係由一使用者或主控系統起始之一系統活動。 It can upload the PP to the lithography etching system through the user. Its use PP generates process operations (PJ). The process operation (PJ) designates the process of applying the lithography etch component 10 to a wafer or a group of wafers. The PJ defines which PP to use when processing a particular set of wafers, and may include parameters from the PP (and optionally from the user). A PJ is a system activity initiated by a user or master system.

其不僅可以使用PP控制晶圓之處理,亦可用於服務動作、校準功能、微影蝕刻元件測試、修改元件設定、更新及升級軟體等。較佳是次系統僅執行預先指定於PP之中的動作,除了某些被允許的額外項目之外,諸如模組或次系統電力之啟動期間的自動初始化、次系統的週期性及無條件動作(只要是不影響PJ執行)、以及對一非預期關機、突發事件或EMO觸動之回應。 It can not only use PP to control the processing of wafers, but also for service operations, calibration functions, lithography etch component testing, component modification, update and upgrade software. Preferably, the secondary system only performs actions pre-assigned to the PP, except for certain allowed additional items, such as automatic initialization during startup of the module or subsystem power, periodic and unconditional actions of the secondary system ( As long as it does not affect PJ execution), and respond to an unexpected shutdown, emergency or EMO trigger.

一個PP被分成多個步驟。多數步驟包含一指令並指定一個預定執行該指令的次系統。步驟亦可以包含執行該指令時預定使用的參數,以及參數限制。PP亦可以包含排程參數,以指出預定何時執行一步驟。 A PP is divided into multiple steps. Most steps include an instruction and specify a secondary system that is scheduled to execute the instruction. The steps may also include parameters that are intended to be used when the instruction is executed, as well as parameter limits. The PP may also contain scheduling parameters to indicate when a step is scheduled to be performed.

針對PJ之一指令步驟之執行,元件控制單元12將指定於PJ中之指令傳送至PJ相關步驟中所指定的次系統。元件控制單元12監測時序並自次系統接收結果。特定指令之執行實例被例示於圖6-13之中,並說明如下。 For execution of one of the instruction steps of the PJ, the component control unit 12 transmits the instruction designated in the PJ to the secondary system specified in the PJ correlation step. The component control unit 12 monitors the timing and receives the results from the secondary system. An example of execution of a specific instruction is illustrated in Figures 6-13 and is explained below.

外掛指令概念Plug-in instruction concept

元件控制單元(SUSC)12將一PP(其代表一邏輯計畫)轉換成次系統動作之排程。系統可以被設計成使得SUSC 12不具有已安裝哪個次系統16、存在哪些次系統指令以及其 性質為何之先驗知識。在此情況下,此等資訊係在起始期間由次系統16在執行時刻提供給SUSC 12。 A component control unit (SUSC) 12 converts a PP (which represents a logic plan) into a schedule of secondary system actions. The system can be designed such that the SUSC 12 does not have which subsystem 16 is installed, which subsystem instructions exist, and A priori knowledge of the nature. In this case, such information is provided to the SUSC 12 by the secondary system 16 at the time of execution during the initial period.

每一個次系統16均可以被設計成在次系統開機及初始化之時將其存在及性能回報至SUSC 12。次系統建立控制網路120上之通信並將其識別身分及狀態回報給SUSC 12,且亦可以回報其性能,諸如其能夠執行哪些指令。SUSC 12可以在一PP 11執行之前或執行期間進行一檢查,檢查該PP所需要的每一個次系統均已回報其存在及一就緒狀態,且亦可以檢查每一個次系統均已回報其性能以執行該PP中的次系統所需要的指令。 Each secondary system 16 can be designed to return its presence and performance to the SUSC 12 at the time the secondary system is powered up and initialized. The secondary system establishes communication on the control network 120 and reports its identity and status to the SUSC 12, and can also report its performance, such as which instructions it can execute. The SUSC 12 may perform a check before or during the execution of the PP 11 to check that each sub-system required for the PP has returned its presence and a ready state, and may also check that each sub-system has returned its performance. The instructions required to execute the secondary system in the PP.

此種次系統的自行回報使得微影蝕刻系統僅使用升級至次系統的區域性軟體,或甚至在全無軟體升級的情況下,即能夠擴充或升級新的功能。舉例而言,一特定次系統16可以升級其軟體,使得其能夠執行一新指令。SUSC 12即可以載入一個新的PP 11,其包含已升級次系統之新指令。當已升級之次系統16開機之時,其與元件控制單元12通信,指出其識別身分和狀態,以及其能夠執行哪些指令,包含該新指令。SUSC 12對PP進行排程,以產生一個包含指示該次系統執行該新指令之步驟的PJ。SUSC 12可以執行一檢查,確認已升級之次系統有回報其能夠執行該新指令。此升級因此僅需要相關次系統及PP之升級,但不需要SUSC 12或者任一個其他次系統16之升級。 The self-reward of such subsystems allows the lithography system to use only regional software upgraded to the secondary system, or even to upgrade or upgrade new features without software upgrades. For example, a particular subsystem 16 can upgrade its software to enable it to execute a new instruction. SUSC 12 can load a new PP 11, which contains new instructions for the upgraded subsystem. When the upgraded secondary system 16 is powered on, it communicates with the component control unit 12 indicating its identity and status, and which instructions it can execute, including the new instructions. The SUSC 12 schedules the PP to generate a PJ containing steps indicating that the system is executing the new instruction. SUSC 12 can perform a check to confirm that the upgraded system has reported that it can execute the new instruction. This upgrade therefore only requires an upgrade of the relevant secondary system and PP, but does not require an upgrade of SUSC 12 or any other secondary system 16.

控制網路Control network

控制網路120較佳係不使用一即時通訊協定,而是被 設計成提供準即時性能,提供次系統與SUSC 12之間具有高可重複性的通信,例如一個大致在1毫秒內的可重複性。 Control network 120 preferably does not use an instant messaging protocol, but is instead Designed to provide near-instant performance, providing highly repeatable communication between the subsystem and SUSC 12, such as a repeatability of approximately one millisecond.

此種在控制網路120上的準即時效能可以藉由實施以下的全部或其中的若干措施而達成。 Such quasi-instant performance on the control network 120 can be achieved by implementing all or some of the following measures.

(a)微影蝕刻系統排定每一個PP在PJ開始執行之前產生一PJ,決定開始該PJ每一步驟的時間(以及亦可以包含完成每一步驟的時間)。針對每一步驟和整個PJ所排定的開始時間(和完成時間)可以在該PJ被起始之前完全決定,且該等時間可以回報給群聚前端。 (a) The lithography etching system schedules each PP to generate a PJ before the PJ begins execution, and determines the time at which each step of the PJ is initiated (and may also include the time to complete each step). The start time (and completion time) scheduled for each step and the entire PJ can be completely determined before the PJ is initiated, and the time can be reported back to the cluster front end.

(b)其可以將PP(以及PJ)設計成不具有條件式步驟或動作,且無再試之動作。PP/PJ之步驟描述一連串動作,雖然一微影蝕刻元件內的動作可以平行執行,例如在不同的次系統上平行執行之指令。其可以藉由定義二(或多)個可供選替之待執行步驟而將一條件式步驟或動作編程於一PP之中,其中該等可供選替之步驟被安排成平行路徑。該等可供選替之步驟在PJ之中被排定成平行路徑,各自均被指派相同的執行時間,使得PJ的執行時間整體而言並不隨著選擇哪一條選替路徑在次系統之上執行而改變。 (b) It is possible to design PP (and PJ) to have no conditional steps or actions and no retrying actions. The PP/PJ steps describe a series of actions, although the actions within a lithographic etched element can be performed in parallel, such as instructions that are executed in parallel on different subsystems. It may program a conditional step or action into a PP by defining two (or more) alternative steps to be performed, wherein the alternative steps are arranged in parallel paths. The alternative steps are scheduled into parallel paths among the PJs, each of which is assigned the same execution time, so that the execution time of the PJ does not generally follow which of the alternative paths is selected in the secondary system. Change on execution.

PJ之步驟之執行時間並不取決於一先前步驟或平行步驟之結果,而是依據預定之排程執行。若一步驟並未正確完成或者未能在排定的時間之內完成,則將不會被再次執行(亦即無再試之動作),而是下一個排定的步驟將被執行。 The execution time of the steps of the PJ does not depend on the result of a previous step or a parallel step, but is performed in accordance with a predetermined schedule. If a step is not completed correctly or is not completed within the scheduled time, it will not be executed again (ie no retry), but the next scheduled step will be executed.

(c)排定之後,每一步驟均將由SUSC 12在其預定的排定時間點執行,較佳係在大約1毫秒的時序精確度之內。 在排定時間處,SUSC 12將執行相關步驟並傳送該步驟之任何指令給相關次系統16以供該次系統執行。SUSC 12中的排定時序不依賴來自次系統16關於前一步驟指令執行成功完成或甚至失敗的回饋。只要一步驟界定一執行時間長度,SUSC 12等待該時間長度耗盡才進入PJ的下一步驟。若次系統在該時間長度逾時前傳回一指令執行之結果,則SUSC 12仍舊等待該時間長度逾時才進入PJ的下一步驟。若次系統未能回傳一錯誤訊息,則SUSC 12還是等待該時間長度逾時,之後將進入下一步驟。若次系統無法正確執行一指令,則操作者或主控系統將決定需要何種糾正動作。 (c) After the schedule, each step will be performed by the SUSC 12 at its predetermined scheduled time point, preferably within about 1 millisecond of timing accuracy. At the scheduled time, the SUSC 12 will perform the relevant steps and transmit any instructions of this step to the associated subsystem 16 for execution by the subsystem. The scheduling timing in SUSC 12 does not depend on feedback from sub-system 16 regarding the successful completion or even failure of the previous step instruction execution. As long as a step defines an execution time length, the SUSC 12 waits for the length of time to exhaust before entering the next step of the PJ. If the secondary system returns the result of an instruction execution before the time length expires, the SUSC 12 still waits for the length of time to enter the next step of the PJ. If the secondary system fails to return an error message, the SUSC 12 waits for the length of time to expire, after which it proceeds to the next step. If the secondary system fails to execute an instruction correctly, the operator or the master system will determine what corrective action is required.

步驟執行之任何時序變異均在排程之中列入考慮,使得排定的步驟執行時間大於最大的預期執行時間。時間排程通常是界定於PP之中。排程時刻可以是"剛好及時"在執行開始之前,或者執行之前的某一時點,例如,當步驟被加入一執行佇列時。 Any timing variation of the step execution is considered in the schedule so that the scheduled step execution time is greater than the maximum expected execution time. Time scheduling is usually defined in the PP. The scheduling time can be "just in time" before execution begins, or at some point before execution, for example, when a step is added to an execution queue.

(d)次系統16所傳送及執行的指令針對指令之執行具體指定一個固定的最大時間。若此時間超過,則操作者或主控系統將決定需要何種糾正動作。 (d) The instructions transmitted and executed by subsystems 16 specify a fixed maximum time for the execution of the instructions. If this time is exceeded, the operator or master system will determine what corrective action is required.

(e)當執行一PJ步驟且此PJ步驟具有讓次系統執行的指令以及關聯傳送至相關次系統之指令的資料之時,其可以在指令本身被傳送至次系統之前傳送該資料至次系統。該資料被以一或多個訊息之形式傳送,使得任一個訊息均在長度上受限。資料之傳送充分地提前,以確保其已然先被次系統接收,換言之,介於傳送資料與傳送指令之間的 時間遠遠大於預期的傳輸時間,且次系統可以應答以確認資料之接收。此使得包含資料的較大訊息可以在時間不緊迫時提前傳送,而僅包含指令之一遠遠較小之訊息(不含相關資料)可以在排定的時間傳送。此措施分散網路上的負載並避免傳送指令時發生擁塞,以降低傳輸時間並增加指令的及時和可靠傳輸。 (e) when a PJ step is executed and the PJ step has instructions for the secondary system to execute and associated data transmitted to the associated subsystem, it may transmit the data to the secondary system before the instruction itself is transmitted to the secondary system. . The material is transmitted in the form of one or more messages such that any message is limited in length. The transfer of data is sufficiently advanced to ensure that it has been received by the secondary system, in other words, between the transfer of data and the transfer of instructions. The time is much longer than the expected transmission time, and the secondary system can respond to confirm receipt of the data. This allows larger messages containing data to be transmitted in advance when time is not tight, and messages containing only one of the instructions that are much smaller (without relevant information) can be transmitted at the scheduled time. This measure spreads the load on the network and avoids congestion when transmitting instructions to reduce transmission time and increase the timely and reliable transmission of instructions.

(f)類似地,當一個次系統完成指令的執行時,其可傳送一個短訊給SUSC 12,指出指令已然完成,但保留該指令執行所產生的任何資料,以待SUSC 12在稍後擷取。當SUSC 12接收指令完成的指示時,其可接著傳送一請求給次系統以擷取產生的資料。此分散網路上的負載並避免傳送指令完成指示時發生擁塞,以降低傳輸時間並增加及時且可靠的傳輸,並可以在之後時間不緊迫時進行資料之擷取。 (f) Similarly, when a secondary system completes the execution of an instruction, it can send a short message to SUSC 12 indicating that the instruction has been completed, but retains any information generated by the execution of the instruction, pending that SUSC 12 later take. When the SUSC 12 receives an indication that the instruction is complete, it can then transmit a request to the secondary system to retrieve the generated data. This distributes the load on the network and avoids congestion when transmitting instruction completion indications to reduce transmission time and increase timely and reliable transmission, and can be used for data retrieval after a short time.

(g)次系統16與SUSC 12之間的訊息交換包含回覆訊息以確認自SUSC 12收到指令。該回覆訊息除了次系統16已自SUSC 12收到相關訊息且仍正常運作中的確認之外,並未攜載其他資訊。此使得SUSC 12能夠偵測到次系統16已無法如期回應,而可及時地回報給群聚前端。為使軟體的實施方式維持簡單,次系統16並無時限之設計。對於回覆訊息的預期總反應時間基本上不長,例如來回小於0.5毫秒。為偵測無法回應的次系統16,SUSC 12具有一時限之設計,其遠超過預期的回應時間,例如預期接收到一個回應30秒鐘後。此時限大到足以毫無疑問地斷定次系統16已不能正常運作,但小到足以在一操作者4通常會如此處 理之前偵測到一失效,故操作者4不必懷疑發生了甚麼事。 (g) The message exchange between the secondary system 16 and the SUSC 12 contains a reply message to confirm receipt of the command from the SUSC 12. This reply message does not carry other information except that the secondary system 16 has received the relevant information from the SUSC 12 and is still in the normal operation. This allows the SUSC 12 to detect that the secondary system 16 has failed to respond as expected, and can report back to the cluster front end in time. In order to keep the implementation of the software simple, the subsystem 16 has no time limit design. The expected total response time for a reply message is not substantially long, such as less than 0.5 milliseconds back and forth. To detect sub-systems 16 that are unresponsive, SUSC 12 has a time-limited design that far exceeds the expected response time, such as 30 seconds after an expected response is received. The limit is large enough to undoubtedly conclude that the subsystem 16 is no longer functioning, but small enough to be as usual here in an operator 4. The operator has detected a failure before, so the operator 4 does not have to suspect what happened.

(h)控制網路120被設計成具有之頻寬遠大於次系統16所使用之傳輸率。舉例而言,控制網路120可以具有每秒1 Gbit之頻寬,而次系統被設計成以每秒100 Mbit的速率傳輸。此增加在網路上的傳輸時間之可預測性。 (h) The control network 120 is designed to have a bandwidth that is much greater than the transmission rate used by the subsystem 16. For example, control network 120 can have a bandwidth of 1 Gbit per second, while a secondary system is designed to transmit at a rate of 100 Mbits per second. This increases the predictability of transmission time over the network.

(i)控制網路使用一簡單的傳輸協定,例如TCP連結上的位元組協定。避免使用複雜或者包含不可預測元素之傳輸協定。 (i) The control network uses a simple transport protocol, such as a byte concatenation on a TCP link. Avoid using transport protocols that are complex or contain unpredictable elements.

一TCP連接係由二個位元組資料流構成,每一方向一個。此協定將該二個資料流分成離散訊息,每一訊息均包含任意資料之一個0或多個位元組的序列,前面加上表示該序列之長度的4個位元組。此長度可以被編碼成一個無號整數,例如具有一個網路順序("big-endian")的32位元整數,提供一(232-1)個位元組之最大訊息長度。此訊息分隔機制可以是以Python程式語言中的"Connection Object"實施而成。藉由使用標準的多重處理連接套件(multiprocessing connection package),Python本身可處理此部分之協定。在其他編程環境中,其將需要以明確詳盡的形式實施此特色。訊息可由任一方起始,只要符合規定的順序即可。 A TCP connection consists of two byte data streams, one in each direction. This protocol divides the two streams into discrete messages, each of which contains a sequence of zero or more bytes of any data, preceded by four bytes representing the length of the sequence. This length can be encoded as an unsigned integer, such as a 32-bit integer with a network order ("big-endian"), providing a maximum message length of one (2 32 -1) bytes. This message separation mechanism can be implemented as a "Connection Object" in the Python programming language. By using the standard multiprocessing connection package, Python itself can handle this part of the contract. In other programming environments, it will need to implement this feature in a clear and detailed form. Messages can be initiated by either party as long as they conform to the specified order.

訊息序列中的每一第一個訊息均可以包含一個以JavaScript物件表示法(JSON)編碼的控制資料結構。所有的SUSC協定JSON訊息均可以具有同一基本結構:一個由2個元素構成的陣列,第一個包含一個具有訊息型態的字串,而第二個係一個具有針對該訊息之命名引數的字典, 例如["<messageType>",{"param1":<value1>,"param2":<value2>,...}]。 Each first message in the message sequence can contain a control data structure encoded in JavaScript Object Notation (JSON). All SUSC-compliant JSON messages can have the same basic structure: an array of two elements, the first containing a message-type string, and the second one having a named argument for the message. dictionary, For example ["<messageType>", {"param1":<value1>,"param2":<value2>,...}].

在某些訊息序列之中,例如,用以傳輸介面指令的輸入及輸出項目者,此控制/指令訊息其後緊跟著數個資料訊息,例如,每個輸入/輸出項目一個資料訊息。該協定對於訊息之中所使用的編碼方式並無任何假設,解譯方式係描述於指明次系統指令、資料及行為的設計文件之中,例如,"2個浮點數的元組(tuple)之列表,以pickle形式編碼",或者"描繪成影像/pgn的壓力曲線"。 In some message sequences, such as input and output items for transmitting interface instructions, the control/command message is followed by a number of data messages, for example, one data message per input/output item. The agreement does not make any assumptions about the encoding used in the message. The interpretation is described in the design file specifying the sub-system instructions, data and behavior, for example, "two floats of tuples." The list, encoded in pickle form, or "painted as a pressure curve for image/pgn".

此種具備JSON控制訊息的混合任意訊息之機制,允許製程作業輸出藉由外掛軟體被直接產生成操作者可理解之資料格式,諸如CSV、PDF、PNG等格式。其亦意味此等物件之傳輸可以在無額外編碼或換碼(escaping)之下以資料流一部分的形式完成,例如藉由使用Linux的sendfile函數。此自由度亦可以被用以在次系統之間明確地針對更適合特定介面功能之編碼方式達成共識。然而,若每一個次系統均具有其本身的編碼機制,則將顯得不明智,故若次系統並無特定需求,其應選用一預設機制以在多種規格之間實做出最佳的權衡。 This mechanism of mixing arbitrary messages with JSON control messages allows the process output to be directly generated by the plug-in software into an understandable data format such as CSV, PDF, PNG, and the like. It also means that the transmission of such objects can be done in the form of a part of the data stream without additional coding or escaping, for example by using the Linux sendfile function. This degree of freedom can also be used to explicitly agree on a coding scheme that is more suitable for a particular interface function between subsystems. However, it would be unwise for each sub-system to have its own coding mechanism. Therefore, if the sub-system has no specific requirements, it should use a preset mechanism to make the best trade-off between multiple specifications. .

(j)次系統並不負責查核SUSC 12之正確行為和偵測SUSC協定錯誤,以簡化PIC 15之設計。SUSC協定之目的係執行使用者所建立的製程作業中的製程程式的製程步驟。其使用例外以傳送非預期之行為給使用者。除了指令執行的錯誤之外,當然亦可由於不遵從SUSC協定而發生錯 誤。SUSC 12負責記錄例外且當PIC之動作不依照SUSC協定進行(或已然完全停止回應)時可關閉通往一PIC之連接,但PIC並不負責查核SUSC的正確行為,以保持PIC之規格簡單化。若一PIC遭遇協定之違反,其可以正式地回應,也可以置之不理,且其並無規定後續之訊息必須被理解。其建議試著記錄若干診斷、記錄一例外、當無法處理一訊息時加以斷線而後重新連接。此係建議,而非規定,因為其無法保證或期待PIC在重新連接之後又再次處於一可使用之狀態(但至少其將處於一多少可理解之狀態)。 (j) The secondary system is not responsible for checking the correct behavior of SUSC 12 and detecting SUSC agreement errors to simplify the design of PIC 15. The purpose of the SUSC Agreement is to perform the process steps of the process program in the process operations established by the user. It uses exceptions to convey unintended behavior to the user. In addition to the errors in the execution of the instructions, of course, errors may occur due to non-compliance with the SUSC Agreement. error. SUSC 12 is responsible for recording exceptions and can close the connection to a PIC when the PIC action does not follow the SUSC agreement (or has completely stopped responding), but PIC is not responsible for checking the correct behavior of SUSC to keep the PIC specification simple. . If a PIC encounters a breach of the agreement, it can formally respond, or it can be ignored, and it does not stipulate that the subsequent message must be understood. It is recommended to try to record a number of diagnoses, record an exception, disconnect when disconnected from a message, and then reconnect. This is a recommendation, not a rule, because it cannot guarantee or expect the PIC to be in a usable state again after reconnection (but at least it will be in a somewhat understandable state).

(k)操作者之介面以及較高層級自動化或監控晶圓廠電腦系統被自控制網路120上之通信移除。此等介面係提供自群聚前端6,故其並未在控制網路120上產生擁塞且不會影響與次系統16之通信時序。 (k) The operator interface and the higher level automation or monitoring fab computer system are removed by communication on the control network 120. These interfaces are provided from the cluster front end 6, so they do not create congestion on the control network 120 and do not affect the timing of communication with the secondary system 16.

(l)資料收集被完全隔離於一個不同於在控制網路120上控制通信的資料網路140。此功能之分離更詳述於下。 (1) The data collection is completely isolated from a data network 140 that is different from the control communication on the control network 120. The separation of this function is described in more detail below.

同步時脈Synchronous clock

微影蝕刻系統提供一時脈信號於控制網路上,以致能系統內及透過次系統的動作同步。系統可以提供二個位於不同頻率之時脈信號以提供時脈給基於不同時序精確度的次系統,例如精確度分別係毫秒級和奈秒級的時脈信號。舉例而言,用以串流射束切換資料的圖案串流次系統及用以將電子小射束切換成開或關的射束切換次系統需要以非常高的頻率交換資料以致能小射束之高頻率切換,而射束測定次系統需要以非常高的頻率傳送射束之位置測定。 The lithography system provides a clock signal to the control network to synchronize the motion within and across the subsystem. The system can provide two clock signals at different frequencies to provide clocks to sub-systems based on different timing accuracy, such as clock signals with accuracy of milliseconds and nanoseconds, respectively. For example, a pattern stream sub-system for streaming beam switching data and a beam switching subsystem for switching the electron beamlets to on or off need to exchange data at very high frequencies to enable beamlets. The high frequency switching, and the beam measurement subsystem requires the position measurement of the transmitted beam at a very high frequency.

資料網路Data network

次系統16透過資料網路140連接至資料網路集線器14。資料收集、儲存及管理係透過資料網路140執行。控制網路120在元件控制單元12與微影蝕刻次系統16之間形成一控制網路路徑,而資料網路140在資料網路集線器14與微影蝕刻次系統16之間形成一資料網路路徑。控制網路120和資料網路140係實體上不同之網路。每一網路均具有其自身的個別實體媒介,包括接線、諸如開關之網路組件、以及通往次系統16的網路連接。因此,該控制網路路徑與資料網路路徑包含實體上不同的媒介,且形成不同且獨立的通信路徑。 Secondary system 16 is coupled to data network hub 14 via data network 140. Data collection, storage and management are performed via data network 140. Control network 120 forms a control network path between component control unit 12 and lithography etch subsystem 16, and data network 140 forms a data network between data hub 14 and lithography subsystem 16 path. Control network 120 and data network 140 are physically distinct networks. Each network has its own individual physical medium, including wiring, network components such as switches, and network connections to the secondary system 16. Thus, the control network path and the data network path contain physically distinct media and form different and independent communication paths.

每一微影蝕刻次系統16均具有一通往控制網路140的連接,被調構成透過控制網路接收及傳送往返元件控制單元12的控制資訊。每一微影蝕刻次系統16均具有一個別之連接通往資料網路140,被調構成透過資料網路傳送資料資訊至資料網路集線器14。 Each lithography etch sub-system 16 has a connection to the control network 140 that is configured to receive and transmit control information to and from the component control unit 12 via the control network. Each lithography etch sub-system 16 has a separate connection to the data network 140 that is tuned to transmit data information to the data network hub 14 over the data network.

資料網路集線器14被調構成連續記錄接收自次系統16的資料。此等資料可包含次系統在一PJ執行期間所採納的測定資料、次系統之設定、及用於除錯及故障追蹤的資料。資料網路集線器14較佳係一直記錄所有資料(包含低層級追蹤資料),故無需啟動資料記錄。此種連續性的資料記錄加速問題診斷、降低重新啟動的需要、並重現錯誤或問題。 The data hub 14 is tuned to continuously record data received from the secondary system 16. Such information may include the measurement data adopted by the subsystem during the execution of the PJ, the setting of the secondary system, and the information used for debugging and fault tracing. Preferably, the data hub 14 always records all data (including low-level tracking data), so there is no need to initiate data logging. This continuous data record speeds up problem diagnosis, reduces the need for restarts, and reproduces errors or problems.

元件控制單元12連接至資料網路集線器14以傳送有關執行於元件控制單元12中的PJ進度之資訊而讓資料網路 集線器14加以記錄。資料網路集線器14連續地記錄接收自元件控制單元12的資料。 The component control unit 12 is coupled to the data hub 14 to communicate information about the progress of the PJs executed in the component control unit 12 for the data network The hub 14 records it. The data hub 14 continuously records the data received from the component control unit 12.

資料網路集線器14包含非常大量的資料儲存容量,足以在一段長久的運作時間長度內用於儲存來自所有次系統16的極其大量的低層級資料,例如數個月或數年等級的一段時間。資料網路集線器14所儲存的資料被組織及加上標籤,較佳係附加一時間戳記以及PJ識別標誌。被儲存的資料可以自資料網路集線器14擷取出來並加以分析及過濾,較佳的實施方式係以離線方式進行。 The data hub 14 contains a very large amount of data storage capacity sufficient to store an extremely large amount of low-level data from all of the secondary systems 16 over a long period of operation, such as a period of several months or years. The data stored by the data hub 14 is organized and tagged, preferably with a time stamp and a PJ identification. The stored data can be retrieved from the data hub 14 and analyzed and filtered. The preferred embodiment is performed offline.

透過資料網路140的資料收集與透過控制網路120的控制通信之分離,使得其能夠在不拖累控制網路上的通信下,進行資料網路上大量資料的高頻率收集。藉由對控制網路120上的擁塞加以控制,並且避免巨大流量出現在資料網路140之上,使得控制網路能夠以準即時的形式運作。資料網路集線器14中的資料管理及儲存功能與元件控制單元12中的PJ執行之分離,使得其能夠在不拖累元件控制單元12的PJ處理下,進行資料網路集線器14的大量資料處理。控制與資料收集及管理之分離使得設計能夠較簡單,不需要考慮二個系統之間的交互作用。 The separation of the data collection through the data network 140 from the control communication through the control network 120 enables it to perform high frequency collection of large amounts of data on the data network without confusing communication over the control network. By controlling congestion on the control network 120 and avoiding large amounts of traffic appearing on the data network 140, the control network can operate in a quasi-instantaneous manner. The data management and storage functions in the data hub 14 are separated from the PJ execution in the component control unit 12 so that it can perform a large amount of data processing of the data network hub 14 without dragging the PJ processing of the component control unit 12. The separation of control and data collection and management makes the design simpler and does not require consideration of the interaction between the two systems.

本發明已藉由特定實施例說明如上。其應能體認,該等實施例容許各種修改及替代形式,為熟習相關技術者所周知,且均未脫離本發明之精神和範疇。因此,雖然藉由特定實施例之說明,然僅係示範性質,並非用於限制本發明之範疇,本發明之範疇係由後附之申請專利範圍所界定。 The invention has been described above by way of specific embodiments. It is to be understood that the embodiments are susceptible to various modifications and alternative forms, which are well known to those skilled in the art and without departing from the spirit and scope of the invention. Accordingly, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧微影蝕刻系統 1‧‧‧Photolithography etching system

2‧‧‧主控系統 2‧‧‧Master Control System

3‧‧‧群聚介面 3‧‧‧Group interface

4‧‧‧操作者操控台 4‧‧‧Operator console

5‧‧‧群聚元件介面 5‧‧‧Communication component interface

6‧‧‧微影蝕刻群聚前端 6‧‧‧Photolithography etch cluster front end

7‧‧‧微影蝕刻次系統介面 7‧‧‧Photolithography etching system interface

10‧‧‧微影蝕刻元件 10‧‧‧ lithography etching elements

12‧‧‧元件控制單元(SUSC) 12‧‧‧Component Control Unit (SUSC)

14‧‧‧資料網路集線器(SUSD) 14‧‧‧Data Network Hub (SUSD)

15‧‧‧外掛用戶(PIC) 15‧‧‧Plugin User (PIC)

16‧‧‧微影蝕刻次系統 16‧‧‧Photolithography etching system

18‧‧‧圖案資料處理系統 18‧‧‧Pattern Data Processing System

19‧‧‧致動器/圖案串流器(系統) 19‧‧‧Actuator/pattern streamer (system)

20‧‧‧資料路徑 20‧‧‧data path

22‧‧‧基板投送系統 22‧‧‧Substrate delivery system

23‧‧‧服務區域 23‧‧‧Service area

24‧‧‧基板供應系統 24‧‧‧Substrate supply system

100‧‧‧微影蝕刻系統群聚 100‧‧‧Photolithography etching system clustering

101-103、105‧‧‧通信 101-103, 105‧‧‧ communication

106‧‧‧連結 106‧‧‧ links

110‧‧‧電子源 110‧‧‧Electronic source

113‧‧‧準直儀透鏡系統 113‧‧‧ collimator lens system

114a‧‧‧孔隙陣列 114a‧‧‧Pore array

114b‧‧‧第二孔隙陣列 114b‧‧‧Second pore array

116‧‧‧聚光器透鏡陣列 116‧‧‧ concentrator lens array

117‧‧‧小射束消隱器陣列 117‧‧‧Small beam blanker array

118‧‧‧射束光欄陣列 118‧‧‧beam beam array

119‧‧‧射束偏轉器陣列 119‧‧‧beam deflector array

120‧‧‧控制網路/投射透鏡陣列 120‧‧‧Control Network/Projection Lens Array

121‧‧‧基板 121‧‧‧Substrate

130‧‧‧擴張電子射束 130‧‧‧Expanded electron beam

133‧‧‧小射束 133‧‧‧Small beam

134‧‧‧子射束 134‧‧‧Subbeam

140‧‧‧資料網路 140‧‧‧Information Network

本發明實施例之說明係參照所附之示意性圖式進行,且僅係示範性質,其中:圖1係依據本發明之用於微影蝕刻系統之網路架構之一實施例之一示意圖;圖2係用於包含一微影蝕刻元件群聚之微影蝕刻系統之網路架構之一實施例之一示意圖;圖3係一微影蝕刻元件群聚之一佈局之一示意圖;而圖4係一帶電微粒微影蝕刻元件之電子光學腔體之一簡化示意圖。 The description of the embodiments of the present invention is made with reference to the accompanying schematic drawings, and is merely exemplary. FIG. 1 is a schematic diagram of one embodiment of a network architecture for a lithography etching system according to the present invention; 2 is a schematic diagram of one embodiment of a network architecture for a lithography etching system including a group of lithographic etched elements; FIG. 3 is a schematic diagram of a layout of a lithographic etched element cluster; A simplified schematic diagram of one of the electro-optical cavities of a charged particle lithography etch element.

1‧‧‧微影蝕刻系統 1‧‧‧Photolithography etching system

2‧‧‧主控系統 2‧‧‧Master Control System

3‧‧‧群聚介面 3‧‧‧Group interface

4‧‧‧操作者操控台 4‧‧‧Operator console

5‧‧‧群聚元件介面 5‧‧‧Communication component interface

6‧‧‧微影蝕刻群聚前端 6‧‧‧Photolithography etch cluster front end

7‧‧‧微影蝕刻次系統介面 7‧‧‧Photolithography etching system interface

10‧‧‧微影蝕刻元件 10‧‧‧ lithography etching elements

12‧‧‧元件控制單元(SUSC) 12‧‧‧Component Control Unit (SUSC)

14‧‧‧資料網路集線器(SUSD) 14‧‧‧Data Network Hub (SUSD)

15‧‧‧外掛用戶(PIC) 15‧‧‧Plugin User (PIC)

16‧‧‧微影蝕刻次系統 16‧‧‧Photolithography etching system

18‧‧‧圖案資料處理系統 18‧‧‧Pattern Data Processing System

19‧‧‧圖案串流器 19‧‧‧ pattern streamer

20‧‧‧資料路徑 20‧‧‧data path

101-103、105‧‧‧通信 101-103, 105‧‧‧ communication

106‧‧‧連結 106‧‧‧ links

120‧‧‧控制網路 120‧‧‧Control network

140‧‧‧資料網路 140‧‧‧Information Network

Claims (16)

一種群聚式基板處理系統,包含複數微影蝕刻元件(10),每一微影蝕刻元件均被配置成用於依據圖案資料進行基板的獨立曝光,且每一微影蝕刻元件均包含:複數個微影蝕刻次系統(16);一控制網路(120),被配置成用於在該等微影蝕刻次系統與至少一元件控制單元(12)間之控制資訊的通信,該元件控制單元被配置成傳送指令至該等微影蝕刻次系統且該等微影蝕刻次系統被配置成傳送回應至該元件控制單元;及一資料網路(140),被配置成用於從該等微影蝕刻次系統到至少一資料網路集線器(14)之資料記錄資訊的通信,該等微影蝕刻次系統被配置成傳送該資料記錄資訊至該資料網路集線器,且該資料網路集線器被配置成用以接收及儲存該資料記錄資訊,該群聚式基板處理系統另包含一群聚前端(6)以做為通往一操作者或主控系統(2、4)之介面,該群聚前端被配置成用於傳送控制資訊至該至少一元件控制單元,以控制該等微影蝕刻次系統對於一或多個晶圓之曝光的運作,且該群聚前端進一步被配置成用於接收該資料網路集線器所接收之該資料記錄資訊的至少一部分,且該群聚式基板處理系統另包含一資料路徑(20),被配置成用於該圖案資料到該等微影蝕刻次系統中的一或多個微影蝕刻次系統的傳輸,該資料路徑形成不同於該控制網路及該資料網路的一傳輸路徑,該圖案資料在不需經過該控 制網路或該資料網路予以傳送下被傳送到該一或多個微影蝕刻次系統,其中該資料路徑包含一圖案串流系統(19)。 A cluster substrate processing system comprising a plurality of lithography etch elements (10), each lithography etch element being configured for independent exposure of a substrate according to pattern data, and each lithography etch element comprises: a plurality a lithography etching subsystem (16); a control network (120) configured to communicate control information between the lithography subsystem and the at least one component control unit (12), the component control The unit is configured to transmit instructions to the lithography etch subsystems and the lithography etch subsystem is configured to transmit a response to the component control unit; and a data network (140) configured to be used from the The lithography etching subsystem communicates with the data recording information of the at least one data network hub (14), the lithography etching subsystem is configured to transmit the data recording information to the data network hub, and the data network hub Configuring to receive and store the data record information, the cluster substrate processing system further includes a group of front ends (6) as an interface to an operator or a master system (2, 4), the group Poly front end is configured Transmitting control information to the at least one component control unit to control operation of exposure of the lithography subsystem to one or more wafers, and the cluster front end is further configured to receive the data network At least a portion of the data record information received by the hub, and the cluster substrate processing system further includes a data path (20) configured to use the pattern data to one or more of the lithography subsystems Transmission of a lithography etching subsystem, the data path forming a transmission path different from the control network and the data network, the pattern data does not need to pass the control The network or the data network is transmitted and transmitted to the one or more lithography etching subsystems, wherein the data path includes a pattern stream system (19). 依據申請專利範圍中第1項之群聚式基板處理系統,其中該控制網路在該元件控制單元與該等微影蝕刻次系統之間形成一控制網路路徑,且該資料網路在該資料網路集線器與該等微影蝕刻次系統之間形成一資料網路路徑,且其中該控制網路路徑和該資料網路路徑包含實體上不同的媒介。 The cluster substrate processing system of claim 1, wherein the control network forms a control network path between the component control unit and the lithography etching subsystem, and the data network is A data network hub forms a data network path with the lithography etch subsystems, and wherein the control network path and the data network path comprise physically distinct media. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中每一微影蝕刻次系統均具有一通往該控制網路之第一連接,該第一連接被配置成透過該控制網路自該元件控制單元接收指令並傳送回應至該元件控制單元,且每一微影蝕刻次系統均具有一通往該資料網路的不同第二連接,該第二連接被調構成透過該資料網路傳送該資料記錄資訊至該資料網路集線器。 A grouping substrate processing system according to claim 1 or 2, wherein each lithography etching system has a first connection to the control network, the first connection being configured to pass through the control network Receiving an instruction from the component control unit and transmitting a response to the component control unit, and each lithography etching system has a different second connection to the data network, the second connection being modulated to transmit the data The network transmits the data record information to the data network hub. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中該元件控制單元被配置成用於進行透過該控制網路傳送至該複數微影蝕刻次系統之指令及接收自一微影蝕刻次系統之回應的相關資料通信到該資料網路集線器。 The cluster substrate processing system of claim 1 or 2, wherein the component control unit is configured to transmit an instruction to the complex lithography etching subsystem through the control network and receive from a lithography The relevant information of the response of the etching subsystem is communicated to the data network hub. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中在該等微影蝕刻元件中一者的運作期間,該等微影蝕刻元件中的微影蝕刻次系統被配置成透過該資料網路連續地傳送記錄資料至該資料網路集線器。 A grouping substrate processing system according to claim 1 or 2, wherein during operation of one of the lithographic etch elements, a lithography etching subsystem in the lithography etch elements is configured to transmit The data network continuously transmits the recorded data to the data network hub. 依據申請專利範圍第1或2項之群聚式基板處理系 統,其中該資料網路集線器儲存初始化該等微影蝕刻次系統所需的資訊,用於一微影蝕刻次系統之初始化資訊在該微影蝕刻次系統的起始期間被傳送至該微影蝕刻次系統。 Grouped substrate processing system according to claim 1 or 2 The data hub stores information required to initialize the lithography subsystem, and initialization information for a lithography subsystem is transmitted to the lithography during the beginning of the lithography system Etching the secondary system. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中該等微影蝕刻次系統中至少一微影蝕刻次系統被配置成在該微影蝕刻次系統起始時傳送資訊至該元件控制單元,該資訊指示該微影蝕刻次系統在該控制網路上之一存在以及該微影蝕刻次系統之一識別身分,並指出該微影蝕刻次系統能夠執行的一或多個指令。 A grouping substrate processing system according to claim 1 or 2, wherein at least one lithography etching subsystem of the lithography subsystem is configured to transmit information to the lithography etching system at the beginning A component control unit that indicates the presence of one of the lithography subsystems on the control network and one of the lithography subsystems identifies an identity and indicates one or more instructions that the lithography subsystem can execute. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中該控制網路被配置成用於該元件控制單元與該等微影蝕刻次系統之間的服務資訊之通信,且該群聚前端被調構成配發用以執行在該等微影蝕刻元件中一或多者上之服務功能的服務資訊。 A cluster substrate processing system according to claim 1 or 2, wherein the control network is configured for communication of service information between the component control unit and the lithography etching subsystem, and the group The poly front end is tuned to provide service information for performing service functions on one or more of the lithographic etch elements. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中該系統被配置成提供二時脈信號給該等微影蝕刻次系統,該二時脈信號中之一具有一高於另一時脈頻率至少100倍的時脈頻率,且其中該等微影蝕刻次系統被配置成使用該等時脈信號同步其動作。 A cluster substrate processing system according to claim 1 or 2, wherein the system is configured to provide a second clock signal to the lithography subsystem, one of the two clock signals having a higher than the other A clock frequency having a clock frequency of at least 100 times, and wherein the lithography subsystems are configured to synchronize their actions using the clock signals. 依據申請專利範圍第1或2項之群聚式基板處理系統,其中該等微影蝕刻次系統未提供任何通往操作員或主控系統之介面,而是僅透過該群聚前端提供此通往該等微影蝕刻次系統之介面。 A grouping substrate processing system according to claim 1 or 2, wherein the lithography etching subsystem does not provide any interface to an operator or a master system, but provides the communication only through the cluster front end To the interface of the lithography etching subsystem. 一種用於在群聚式基板處理系統內之資料通信的方 法,該群聚式基板處理系統包含複數個微影蝕刻元件(10),每一微影蝕刻元件均被配置成用於依據圖案資料進行基板的獨立曝光,且每一微影蝕刻元件均包含一控制網路(120),連接一元件控制單元(12)與複數個微影蝕刻次系統(16)、一資料網路(140),連接一資料網路集線器(14)與該複數個微影蝕刻次系統(16)、以及一群聚前端(6),該方法包含:透過該控制網路(120)自該元件控制單元(12)傳送控制資訊至該等微影蝕刻次系統(16)中的一或多個微影蝕刻次系統;透過該控制網路(120)自該等微影蝕刻次系統(16)傳送回應至該元件控制單元(12);透過該資料網路(140)自該等微影蝕刻次系統(16)傳送資料記錄資訊至該資料網路集線器(14);接收並儲存該資料記錄資訊於資料網路集線器(14)中;自該群聚前端(6)傳送控制資訊至該元件控制單元(12)以控制該等微影蝕刻次系統對於一或多個基板之曝光的運作;傳送該資料網路集線器(14)所儲存的該資料記錄資訊中的至少一部分至該群聚前端(6);以及透過一資料路徑(20)傳送圖案資料至該等微影蝕刻次系統中的該一或多個微影蝕刻次系統,該資料路徑形成不同於該控制網路及該資料網路的一傳輸路徑,並且該圖案資料在不需經過該控制網路或該資料網路予以傳送下被傳送到該一或多個微影蝕刻次系統。 A method for data communication in a cluster substrate processing system The grouped substrate processing system includes a plurality of lithography etch elements (10), each lithographic etch element being configured for independent exposure of the substrate in accordance with pattern data, and each lithographic etch element comprises a control network (120), connected to a component control unit (12) and a plurality of lithography etching subsystems (16), a data network (140), connected to a data network hub (14) and the plurality of micro a shadow etching subsystem (16), and a group of poly front ends (6), the method comprising: transmitting control information from the component control unit (12) to the lithography etching subsystem (16) through the control network (120) One or more lithography etching subsystems; transmitting a response from the lithography subsystem (16) to the component control unit (12) through the control network (120); through the data network (140) Receiving data record information from the lithography subsystem (16) to the data network hub (14); receiving and storing the data record information in the data network hub (14); from the cluster front end (6) Transmitting control information to the component control unit (12) to control the lithography etching subsystem for one or The operation of exposing the substrates; transmitting at least a portion of the data record information stored by the data hub (14) to the cluster front end (6); and transmitting the pattern data through a data path (20) to the The one or more lithography etching subsystems in the lithography subsystem, the data path forming a transmission path different from the control network and the data network, and the pattern data does not need to pass through the control network Or the data network is transmitted and transmitted to the one or more lithography etching subsystems. 依據申請專利範圍第11項之方法,其中傳送至該等微影蝕刻次系統之控制資訊以及來自該等微影蝕刻次系統之回應僅透過該控制網路傳送至該元件控制單元,且來自該等微影蝕刻次系統之資料記錄資訊僅透過該資料網路傳送至該資料網路集線器。 According to the method of claim 11, wherein the control information transmitted to the lithography subsystem and the response from the lithography subsystem are transmitted to the component control unit only through the control network, and from the The data recording information of the lithography etching system is transmitted to the data network hub only through the data network. 依據申請專利範圍第11或12項之方法,另包含將有關傳送至該複數微影蝕刻次系統之指令與接收自一微影蝕刻次系統之回應的資料自該元件控制單元傳送至該資料網路集線器。 According to the method of claim 11 or 12, further comprising transmitting, from the component control unit, the instruction relating to the transmission to the complex lithography etching system and the data received from a lithography etching system to the data network Road hub. 依據申請專利範圍第11或12項之方法,其中自一微影蝕刻次系統傳送該資料記錄資訊至該資料網路集線器係在一指令被該微影蝕刻次系統執行期間被連續地執行。 The method of claim 11 or 12, wherein transmitting the data record information from a lithography etch subsystem to the data hub is performed continuously during execution of the lithography subsystem. 依據申請專利範圍第11或12項之方法,另包含將初始化該等微影蝕刻次系統所需要的資訊儲存於該資料網路集線器之中,並在一微影蝕刻次系統的起始期間傳送該初始化資訊至該微影蝕刻次系統。 According to the method of claim 11 or 12, the information required to initialize the lithography etching subsystem is stored in the data network hub and transmitted during the beginning of a lithography etching system. The initialization information is sent to the lithography etching subsystem. 依據申請專利範圍第11或12項之方法,另包含在該等微影蝕刻次系統中一微影蝕刻次系統起始時自該微影蝕刻次系統傳送資訊至該元件控制單元,該資訊指示該微影蝕刻次系統在該控制網路上之一存在以及該微影蝕刻次系統之一識別身分,並指出該微影蝕刻次系統能夠執行的一或多個指令。 According to the method of claim 11 or 12, further comprising transmitting information from the lithography etching system to the component control unit at the beginning of a lithography etching system in the lithography etching subsystem, the information indication The presence of the lithography etch subsystem on the control network and one of the lithography subsystems identifies the identity and indicates one or more instructions that the lithography subsystem can execute.
TW101114468A 2011-04-22 2012-04-23 Network architecture for lithography machine cluster TWI576670B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161478117P 2011-04-22 2011-04-22
US201161533673P 2011-09-12 2011-09-12

Publications (2)

Publication Number Publication Date
TW201303521A TW201303521A (en) 2013-01-16
TWI576670B true TWI576670B (en) 2017-04-01

Family

ID=45998374

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101114467A TWI526789B (en) 2011-04-22 2012-04-23 Network architecture and protocol for cluster of lithography machines
TW101114468A TWI576670B (en) 2011-04-22 2012-04-23 Network architecture for lithography machine cluster

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW101114467A TWI526789B (en) 2011-04-22 2012-04-23 Network architecture and protocol for cluster of lithography machines

Country Status (8)

Country Link
US (3) US9086912B2 (en)
EP (2) EP2699966B1 (en)
JP (3) JP5951753B2 (en)
KR (2) KR102072200B1 (en)
CN (2) CN105974743B (en)
RU (1) RU2573398C2 (en)
TW (2) TWI526789B (en)
WO (2) WO2012143555A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2579533C2 (en) * 2010-12-14 2016-04-10 МЭППЕР ЛИТОГРАФИ АйПи Б. В. Lithographic system and processing of substrates in said system
US8893059B2 (en) 2012-02-06 2014-11-18 Kla-Tencor Corporation Pattern data system for high-performance maskless electron beam lithography
JP2014204012A (en) * 2013-04-05 2014-10-27 キヤノン株式会社 Image rendering device and article manufacturing method
CN103389625A (en) * 2013-07-11 2013-11-13 浙江大学 Communication method of immersion liquid transmission system applied to immersion lithography machine
JP6312379B2 (en) * 2013-07-19 2018-04-18 キヤノン株式会社 Lithographic apparatus, lithography method, lithography system, program, and article manufacturing method
JP2015204401A (en) * 2014-04-15 2015-11-16 キヤノン株式会社 Lithography apparatus, and method of manufacturing article
JP6198805B2 (en) * 2015-02-16 2017-09-20 キヤノン株式会社 Lithographic apparatus, lithography method, program, lithography system, and article manufacturing method
US9927725B2 (en) 2015-02-16 2018-03-27 Canon Kabushiki Kaisha Lithography apparatus, lithography method, program, lithography system, and article manufacturing method
US10527950B2 (en) * 2016-07-19 2020-01-07 Asml Netherlands B.V. Apparatus for direct write maskless lithography
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
NL2019502B1 (en) * 2016-09-08 2018-08-31 Mapper Lithography Ip Bv Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
CN106647181B (en) * 2016-12-19 2018-03-09 电子科技大学 A kind of high speed image exposure method for DMD maskless photoetching machines
CN115297183B (en) * 2022-07-29 2023-11-03 天翼云科技有限公司 Data processing method and device, electronic equipment and storage medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040125355A1 (en) * 2002-08-22 2004-07-01 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20060102853A1 (en) * 2004-11-16 2006-05-18 Leica Microsystems Lithography Gmbh Device and method for imaging a multiple particle beam on a substrate
US7149792B1 (en) * 2000-11-20 2006-12-12 Axeda Corporation Device registration mechanism
US20070067725A1 (en) * 2005-09-22 2007-03-22 Fisher-Rosemount Systems, Inc. Use of a really simple syndication communication format in a process control system

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
JP3336436B2 (en) * 1991-04-02 2002-10-21 株式会社ニコン Lithography system, information collecting apparatus, exposure apparatus, and semiconductor device manufacturing method
AU6449994A (en) 1993-04-30 1994-11-21 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
TW276353B (en) 1993-07-15 1996-05-21 Hitachi Seisakusyo Kk
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
US5778386A (en) 1996-05-28 1998-07-07 Taiwan Semiconductor Manufacturing Company Ltd. Global view storage management system for semiconductor manufacturing plants
JP3087696B2 (en) * 1997-07-25 2000-09-11 日本電気株式会社 Distributed memory type multiprocessor system control method and computer readable recording medium
KR19990062942A (en) * 1997-12-10 1999-07-26 히로시 오우라 Charge particle beam exposure device
US6011952A (en) * 1998-01-20 2000-01-04 Viasat, Inc. Self-interference cancellation for relayed communication networks
US6610150B1 (en) 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
AU2001238036A1 (en) * 2000-02-16 2001-08-27 Cymer, Inc. Process monitoring system for lithography lasers
US6714830B2 (en) * 2000-02-28 2004-03-30 Canon Kabushiki Kaisha Push-type scheduling for semiconductor fabrication
US6689519B2 (en) 2000-05-04 2004-02-10 Kla-Tencor Technologies Corp. Methods and systems for lithography process control
JP2002252161A (en) 2001-02-23 2002-09-06 Hitachi Ltd Semiconductor manufacturing system
JP4713773B2 (en) * 2001-07-09 2011-06-29 株式会社アドバンテスト Electron beam exposure apparatus and electron beam exposure method
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
JP2003288496A (en) 2002-03-27 2003-10-10 Toshiba Corp Plotting support system, plotting support method, mask manufacture support system, and mask manufacture support method
KR100523839B1 (en) * 2002-10-07 2005-10-27 한국전자통신연구원 Dry lithography process and method of forming gate pattern using the same
EP2302459A3 (en) 2002-10-25 2011-04-06 Mapper Lithography Ip B.V. Lithography system
CN101414127A (en) 2002-10-30 2009-04-22 迈普尔平版印刷Ip有限公司 Electron beam exposure system
US7129502B2 (en) 2003-03-10 2006-10-31 Mapper Lithography Ip B.V. Apparatus for generating a plurality of beamlets
ATE524822T1 (en) 2003-05-28 2011-09-15 Mapper Lithography Ip Bv EXPOSURE METHOD FOR CHARGED PARTICLE RAYS
JP4664293B2 (en) 2003-07-30 2011-04-06 マッパー・リソグラフィー・アイピー・ビー.ブイ. Modulator circuit
US7094613B2 (en) 2003-10-21 2006-08-22 Applied Materials, Inc. Method for controlling accuracy and repeatability of an etch process
JP2005174959A (en) * 2003-12-05 2005-06-30 Nikon Corp Lithographic system, program and information recording medium, support device and exposure method
US7728880B2 (en) * 2004-06-25 2010-06-01 Qualcomm Incorporated Automatic white balance method and apparatus
JP2006113705A (en) * 2004-10-13 2006-04-27 Nikon Corp Information processing system and program
CN100361113C (en) * 2005-02-05 2008-01-09 上海微电子装备有限公司 High speed synchronous broadcast bus and bus platform of step scanning projection photo etching machine
JP2006338232A (en) * 2005-06-01 2006-12-14 Murata Mach Ltd Communication system
US20070010905A1 (en) * 2005-07-07 2007-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for monitoring processing tool
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
WO2007049704A1 (en) * 2005-10-28 2007-05-03 Nikon Corporation Device manufacturing apparatus connecting apparatus and connecting method, program, device manufacturing system, exposing apparatus, exposing method, determining/testing apparatus and determining/testing method
US8090875B2 (en) * 2005-10-28 2012-01-03 Nikon Corporation Device and method for connecting device manufacturing processing apparatuses, program, device manufacturing processing system, exposure apparatus and method, and measurement and inspection apparatus and method
US7652749B2 (en) * 2006-02-14 2010-01-26 Asml Netherlands B.V. Software upgrades in a lithographic apparatus
TW200745771A (en) * 2006-02-17 2007-12-16 Nikon Corp Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
US8134681B2 (en) * 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
JP4682107B2 (en) 2006-08-28 2011-05-11 株式会社リコー Image forming apparatus, information processing method, and information processing program
US7801635B2 (en) * 2007-01-30 2010-09-21 Tokyo Electron Limited Real-time parameter tuning for etch processes
US8636458B2 (en) 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
JP4992750B2 (en) * 2008-02-14 2012-08-08 日本電気株式会社 Relay device
KR101481950B1 (en) 2008-02-26 2015-01-14 마퍼 리쏘그라피 아이피 비.브이. Projection lens arrangement
EP2260499B1 (en) 2008-02-26 2016-11-30 Mapper Lithography IP B.V. Projection lens arrangement
US8445869B2 (en) 2008-04-15 2013-05-21 Mapper Lithography Ip B.V. Projection lens arrangement
US8258484B2 (en) 2008-04-15 2012-09-04 Mapper Lithography Ip B.V. Beamlet blanker arrangement
US8502176B2 (en) 2008-05-23 2013-08-06 Mapper Lithography Ip B.V. Imaging system
JP5743886B2 (en) 2008-06-04 2015-07-01 マッパー・リソグラフィー・アイピー・ビー.ブイ. Method and system for exposing a target
JP2010067759A (en) * 2008-09-10 2010-03-25 Canon Inc Exposure apparatus
WO2010037832A2 (en) 2008-10-01 2010-04-08 Mapper Lithography Ip B.V. Electrostatic lens structure
JP2010093125A (en) * 2008-10-09 2010-04-22 Toray Eng Co Ltd Substrate processing system and substrate processing method
JP5008768B2 (en) 2008-12-15 2012-08-22 東京エレクトロン株式会社 Substrate processing system, substrate processing method, storage medium storing program, and valve
JP4615071B2 (en) * 2008-12-29 2011-01-19 キヤノンアネルバ株式会社 Substrate processing system and substrate processing apparatus
NL2004392A (en) * 2009-04-15 2010-10-18 Asml Netherlands Bv Lithographic apparatus, control system, multi-core processor, and a method to start tasks on a multi-core processor.
CN104795303B (en) 2009-05-20 2017-12-05 迈普尔平版印刷Ip有限公司 Method for pattern Processing data
JP5801289B2 (en) * 2009-05-20 2015-10-28 マッパー・リソグラフィー・アイピー・ビー.ブイ. Pattern data conversion for lithographic systems.
JP2011054679A (en) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc Substrate processor
JP5392190B2 (en) 2010-06-01 2014-01-22 東京エレクトロン株式会社 Substrate processing system and substrate processing method
US8822106B2 (en) * 2012-04-13 2014-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Grid refinement method
JP6352529B2 (en) 2015-04-03 2018-07-04 株式会社日立ハイテクノロジーズ Light amount detection device, immunoassay device using the same, and charged particle beam device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7149792B1 (en) * 2000-11-20 2006-12-12 Axeda Corporation Device registration mechanism
US20040125355A1 (en) * 2002-08-22 2004-07-01 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20060102853A1 (en) * 2004-11-16 2006-05-18 Leica Microsystems Lithography Gmbh Device and method for imaging a multiple particle beam on a substrate
US20070067725A1 (en) * 2005-09-22 2007-03-22 Fisher-Rosemount Systems, Inc. Use of a really simple syndication communication format in a process control system

Also Published As

Publication number Publication date
JP5951753B2 (en) 2016-07-13
TW201250401A (en) 2012-12-16
CN103649836B (en) 2016-09-28
US9507629B2 (en) 2016-11-29
CN105974743B (en) 2019-04-23
CN103649836A (en) 2014-03-19
US20150309424A1 (en) 2015-10-29
US20130037730A1 (en) 2013-02-14
KR101791252B1 (en) 2017-10-27
US9244726B2 (en) 2016-01-26
JP6550623B2 (en) 2019-07-31
US9086912B2 (en) 2015-07-21
EP2700081A2 (en) 2014-02-26
KR102072200B1 (en) 2020-01-31
KR20170120194A (en) 2017-10-30
JP6042410B2 (en) 2016-12-14
RU2013151876A (en) 2015-05-27
CN105974743A (en) 2016-09-28
TW201303521A (en) 2013-01-16
WO2012143555A3 (en) 2012-12-27
EP2699966B1 (en) 2021-04-07
EP2699966A2 (en) 2014-02-26
JP2014515885A (en) 2014-07-03
RU2573398C2 (en) 2016-01-20
JP2014512683A (en) 2014-05-22
EP2700081B1 (en) 2022-11-02
WO2012143548A3 (en) 2012-12-13
KR20140041495A (en) 2014-04-04
WO2012143555A2 (en) 2012-10-26
JP2016219812A (en) 2016-12-22
TWI526789B (en) 2016-03-21
US20130111485A1 (en) 2013-05-02
WO2012143548A2 (en) 2012-10-26

Similar Documents

Publication Publication Date Title
TWI576670B (en) Network architecture for lithography machine cluster
US20030005273A1 (en) Initialization, reconfiguration, and shut down of a module function
CN101652838B (en) A recipe-and-component control module and methods thereof
US11153409B2 (en) Redundancy in a network centric process control system
US20180068047A1 (en) Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
JP4474166B2 (en) System for mediating fault detection data
US9009631B2 (en) Lithography system and method for storing positional data of a target
KR102405067B1 (en) Substrate processing system, method of controlling substrate processing system, computer-readable storage medium, and method of manufacturing article
Hall et al. Software development for the Hobby-Eberly Telescope's segment alignment maintenance system using LabVIEW
CN117426079A (en) Automated application service detection for configuring industrial communication networks
Ingalls et al. MODELING REAL-WORLD CONTROL SYSTEMS: BEYOND HYBRID SYSTEMS
JP2005057566A (en) Communication control processor and program