TWI421957B - Manufacturing method for system in package and package structure thereof - Google Patents

Description

System package module manufacturing method and package structure thereof

The invention relates to a method for manufacturing a system package module and a package structure thereof, in particular to a ground pad on a substrate of a system package module, and a solder pad instead of a ground via. Manufacturing method and structure thereof.

With the rapid growth of the portable consumer electronics market, how to accelerate the improvement of the performance of portable products in terms of lightness, thinness, and low power consumption has become an important issue for system manufacturers. The system package (SiP Module, System in Package; or Module IC) with micro-volume and low power consumption is considered to be the most suitable solution for portable products.

The system package module encapsulates some components, including ICs or passive components, in a module using special materials and substrate technology.

The system package module has been applied to wireless communication modules, including WLAN, Bluetooth, GPS, WiMAX, and DVB-H/T-DMB, and can be imported into the portable device through the system package module.

In the prior system package module, in addition to drilling the circuit hole in the substrate for component setting, a grounding type via (VIA) is drilled along the edge of the system package module, and the function of the ground via is to provide signals. One of the shortest return paths. However, the ground vias described above reduce the yield of the substrate, and the other side typically results in additional cost in the manner of laser drilling. Furthermore, the ground via is electrically conductive with a metal filled in the center, and its conductive area is small, so that the conductivity is not ideal.

The reason is that the present inventors have felt that the above problems can be improved, and that the present invention has been deliberately studied and used in conjunction with the theory, and a present invention which is reasonable in design and effective in improving the above problems has been proposed.

The technical problem to be solved by the present invention is to provide a method for manufacturing a system package module and a package structure thereof, wherein a grounded conductive pad is used in place of a solder paste instead of a ground via to improve conductivity and enhance the substrate. Yield.

In order to solve the above problems, according to one aspect of the present invention, a method for manufacturing a system package module includes the steps of: providing a substrate and setting a plurality of cutting lines on the substrate, the plurality of cutting lines dividing the substrate into a plurality of unit module areas, wherein each unit module area is provided with at least one component; a plurality of strip-shaped conductive pads are formed along the cutting line on the upper surface of the substrate, and the conductive pads are electrically connected to the ground potential The plurality of conductive pads extend a predetermined width to each of the unit module regions; applying solder paste to the plurality of conductive pads; curing the solder paste to form a ground tin block; forming a cladding layer to cover the a substrate, the part and the grounding tin block; along the cutting line to distinguish the plurality of unit module regions; and forming a metal shielding layer on an outer surface of the cladding layer of each of the separate unit module regions .

In addition, according to the above manufacturing method of the present invention, the present invention provides a package structure of a system package module, comprising a substrate, at least one component, a plurality of ground tin blocks, a cladding layer, and a metal shielding layer. The substrate is formed with a plurality of strip-shaped conductive pads adjacent to the edges of the upper surface. The at least one component is disposed on the substrate. The plurality of grounding tin blocks are formed on the conductive pads, wherein the covering layer covers the substrate, the part and the grounding tin block, wherein the grounding tin block is exposed on a side of the covering layer. The metal shielding layer covers the outer surface of the cladding layer.

The invention has at least the following beneficial effects:

1. The static electricity can be led out by the grounded conductive pad and the grounding tin block.

Second, the metal shielding layer can avoid electromagnetic interference and provide the function of isolating electromagnetic waves.

Third, the cost of drilling (grounding via) is saved, and the yield of the substrate is also improved.

Fourth, compared with the traditional grounding via, the conductivity of the conductive pad is improved, so the coating time of the system package module is further improved, and the economics of saving time and materials are achieved.

In order to further understand the technology, method and effect of the present invention in order to achieve the intended purpose, reference should be made to the detailed description and drawings of the present invention. The drawings and the annexed drawings are intended to be illustrative and not to limit the invention.

Please refer to the first to fifth figures, which are schematic diagrams of the steps of the method for manufacturing the system package module of the present invention. The method for manufacturing a system package module of the present invention comprises the following steps: First, a substrate 10 is provided. The substrate 10 is a multi-stack circuit board. The substrate 10 may be a BT (Bismaleimide Triazine Resin) resin substrate (embedded fiberglass cloth), an epoxy glass fiber board (FR4, FR5), or a LTCC substrate (Low Temperature Co-fired Ceramic). Composition. For example, a low temperature co-fired ceramic substrate (LTCC) is used to integrate an IC and a passive component into a module in a multi-layer stack.

The substrate 10 is provided with a plurality of cutting lines C1, C2, and C3. The number of the cutting lines depends on the size of the substrate. In the first figure, the cutting lines C1, C2, C3 divide the substrate 10 into two unit module areas D1, D2 from the side view.

A plurality of strip-shaped conductive pads 101, 103, and 105 are formed on the upper surface of the substrate 10 along the dicing lines C1, C2, and C3. The shape of the conductive pads may be continuous or strip-shaped strips, which will be exemplified later. The conductive pads 101, 103, and 105 are electrically connected to a ground potential, that is, to a ground circuit of the substrate 10. The plurality of conductive pads 101, 103, 105 extend a predetermined width to the inside of each of the unit module regions D1, D2. For example, the conductive pads 101, 103, 105 may extend to a width of 4 mils inside each of the unit module regions D1, D2, that is, each conductive pad has a width of 8 mils (mil). ). In the outer frame portion of the substrate 10, the conductive pads 101, 105 also extend outward from the cutting lines C1, C3. Preferably, the conductive pads 101, 103, and 105 are formed by plating a metal layer on the upper surface of the substrate 10, for example, gold plating.

As shown in the second figure, each of the unit module areas D1, D2 forms a plurality of lines 102, 104 for providing at least one electronic component, such as an integrated circuit chip or a passive component. The above mentioned order of the conductive pads by the metallization layer can be completed together when the lines 102, 104 of the substrate 10 are fabricated. As shown, the unit module areas D1, D2 are each provided with a part 21, 22, such as an IC and a passive component. The parts 21, 22 may be disposed on the substrate 10 in a surface mount technique. However, the manner in which the respective components are provided on the substrate 10 is not limited to the above surface adhesion technique.

Next, a solder paste is applied onto the plurality of conductive pads 101, 103, 105, and the solder paste is cured to be hardened to form a ground tin block (indicated by reference numerals S1, S3, and S5). Because the conductive pads 101, 103, and 105 are electrically connected to the ground potential, the grounding tin blocks S1, S3, and S5 are also electrically connected to the ground potential. Regarding the manner in which the solder paste is applied to the conductive pads 101, 103, and 105, it is preferable to apply a solder paste to the conductive pads 101, 103, and 105 by means of a steel plate. Furthermore, the step of curing the solder paste to form the ground pads S1, S3, S5 and the step of providing the parts 21, 22 on the substrate 10 can be performed simultaneously. That is, in the process of attaching the parts 21, 22 to the surface, when the substrate 10 passes through a tin furnace (not shown), the solder paste is simultaneously hardened. This saves time.

Then, a cladding layer 30 is formed to cover the substrate 10, the parts 21, 22, and the ground tin blocks S1, S3, S5. In the step of forming the above-mentioned cladding layer 30, an insulating material may be coated on the surface of the base 10 by molding to provide insulation between the parts. The coating layer 30 can be made of a material such as a molding compound.

Please refer to the fourth figure, which is a schematic diagram of the manufacturing method of the system package module of the present invention after the cutting step. This figure shows that along the cutting lines C1, C2, C3 in the third figure to distinguish the plurality of unit module areas. As described in the unit module area D1, after the cutting, the grounding tin blocks S1, S3 together with the conductive pads 101, 103 are exposed on the side of the unit module area D1.

Please refer to FIG. 5 and FIG. 6 for a cross-sectional view and a perspective view of a system package module according to the method for manufacturing the system package module of the present invention. This figure shows a metal shielding layer 40 formed on the outer surface of the cladding layer 30 to complete the package structure 100 of a system package module. The metal shielding layer 40 may cover the substrate 10 together or not. The metal shielding layer 40 may be a conductive plastic, a conductive ink, a conductive carbon powder, or the like, which may be formed by spraying, sputtering, evaporation, deposition, coating ( Coating), or printing (printing).

As shown in the sixth figure, in the package structure 100 of the system package module completed by the manufacturing method of the present invention, a plurality of strip-shaped conductive pads 101, 103 are formed on the edge of the upper surface of the substrate 10. In addition, a plurality of grounding tin blocks S1 and S3 are formed on the conductive pads 101 and 103. After covering the cladding layer 30, the ground tin blocks S1 and S3 are exposed to be in electrical contact with the metal shielding layer 40. Since the above-mentioned conductive pads 101, 103 are connected to the ground potential, the present invention can derive the static electricity. Furthermore, the metal shielding layer 40 covers the cladding layer 30 in its entirety as a shielding layer for avoiding electromagnetic interference, and provides a function of isolating electromagnetic waves.

The structure of the present invention utilizes a contact surface of a grounded conductive pad as a conductive material, and does not require a via to be drilled on the periphery of the substrate as in the prior art. Furthermore, drilling a via hole can easily increase the damage rate of the substrate. Therefore, the present invention not only saves the cost of drilling, but also improves the yield of the substrate.

In addition to the above advantages, the present invention has a large contact surface of the conductive pad because of a grounded conductive pad instead of a ground via (VIA), thereby improving conductivity. The improvement of conductivity further improves the coating time of the system package module, achieving time-saving and material-saving economy.

Please refer to the seventh to ninth drawings, which are respectively perspective views of different embodiments of the conductive pads disposed in the present invention. The above-mentioned arrangement of the conductive pad and the grounding tin block of the present invention may have different embodiments. In the seventh figure, the conductive pad completely covers the cutting line, and then the solder paste is applied along the conductive pad. At the end, the grounding tin blocks S1, S2, S3, S4, S5, and S6 are formed in the shape of a field. The embodiment in the sixth figure is obtained in accordance with the arrangement of the seventh figure.

The conductive pads shown in the eighth and ninth views partially cover the cutting line, and then apply the solder paste along the conductive pads. The eighth figure forms a grounded tin block S1, S3, S5 like a zigzag shape, and the ninth figure is a ground tin block S11, S21, S22, S23, S30, S51, S61, S62, S63 which form a partial segment. After the cutting according to the above embodiments, each unit module area has a plurality of grounding tin blocks exposed and electrically connected to the ground potential through the conductive pads, thereby achieving the object of the present invention. The eighth embodiment and the ninth embodiment have the advantages that in different system package modules, the arrangement of the conductive pads can be flexibly changed according to the arrangement manner of the parts, so that the parts are optimally conductive. The line is connected to the ground.

However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent technical changes of the present specification and the contents of the drawings are all included in the present invention. Within the scope of the agreement, Chen Ming.

10. . . Substrate

C1, C2, C3. . . Cutting line

S1, S2, S3, S4, S5, S6, S11, S21, S22, S23, S30, S51, S61, S62, S63. . . Grounding tin block

D1, D2. . . Unit module area

101, 103, 105. . . Conductive pad

102, 104. . . line

21, 22. . . Components

30. . . Coating

40. . . Metal shielding layer

100. . . Package structure

The first figure is a schematic diagram of forming a conductive pad and a line in the manufacturing method of the system package module of the present invention;

The second figure is a schematic diagram of applying solder paste and placing parts in the manufacturing method of the system package module of the present invention;

The third figure is a schematic view of a mold in a method of manufacturing a system package module of the present invention;

The fourth figure is a schematic view of the manufacturing method of the system package module of the present invention after the cutting step;

FIG. 5 is a cross-sectional view showing a system package module of the present invention;

FIG. 6 is a cross-sectional view showing a system package module of the method for manufacturing a system package module of the present invention;

7 is a perspective view showing a first embodiment of the conductive pad of the present invention;

Figure 8 is a perspective view showing the first embodiment of the conductive pad of the present invention; and

In a ninth view, a perspective view of a first embodiment of a conductive pad of the present invention is provided.

100. . . Package structure

101, 103. . . Conductive pad

102. . . line

S1, S3. . . Grounding tin block

D1. . . Unit module area

twenty one. . . Components

30. . . Coating

40. . . Metal shielding layer

Claims (9)

A method for manufacturing a system package module includes the steps of: providing a substrate and setting a plurality of cutting lines on the substrate, the plurality of cutting lines dividing the substrate into a plurality of unit module areas, wherein each unit module area is set Having at least one part; forming a plurality of strip-shaped conductive pads on the upper surface of the substrate along the cutting line, the conductive pads are electrically connected to a ground potential, and the plurality of conductive pads extend a predetermined width to each of the Inside the unit module area; applying solder paste on the plurality of conductive pads; curing the solder paste to form a ground tin block; forming a cladding layer to cover the substrate, the part and the grounding tin block; along the cutting line Separating the plurality of unit module regions; and forming a metal shielding layer on an outer surface of the cladding layer of each of the separate unit module regions. The method of manufacturing a system package module according to claim 1, wherein the substrate is a multi-stack circuit board, and the upper surface of the substrate is plated with a metal layer to form the conductive pad. And the part is placed on the substrate by surface adhesion technology. The method for manufacturing a system package module according to claim 2, wherein the step of coating the solder paste on the plurality of conductive pads by using a steel plate printing method and heating the solder paste to form a ground tin block The steps of the part on the substrate are performed simultaneously. The method of manufacturing a system package module according to claim 1, wherein the conductive pad extends to a width of 4 mils inside each of the unit module regions. The method of manufacturing a system package module according to claim 1, wherein the plurality of conductive pads partially cover the cutting line. A package structure of a system package module includes: a substrate formed with a plurality of conductive pads adjacent to an edge of the upper surface; at least one component disposed on the substrate; and a plurality of ground tin blocks formed on the conductive a cover layer covering the substrate, the part and the grounding tin block, wherein each of the grounding tin blocks is partially exposed on a side of the cladding layer; and a metal shielding layer covering the outer surface of the cladding layer . The package structure of the system package module of claim 6, wherein the substrate retains a predetermined width for the conductive pad to be disposed thereon, the predetermined width being 4 mils. The package structure of the system package module according to claim 6, wherein the conductive pad has a continuous or segment-like strip shape. The package structure of the system package module according to claim 6, wherein the substrate is a multi-stack circuit board.