EP1651020A4 - Packaging electrode, package, device and process for producing device - Google Patents

Packaging electrode, package, device and process for producing device

Info

Publication number
EP1651020A4
EP1651020A4 EP04747168A EP04747168A EP1651020A4 EP 1651020 A4 EP1651020 A4 EP 1651020A4 EP 04747168 A EP04747168 A EP 04747168A EP 04747168 A EP04747168 A EP 04747168A EP 1651020 A4 EP1651020 A4 EP 1651020A4
Authority
EP
European Patent Office
Prior art keywords
bonding
packaging
packaging electrode
package
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04747168A
Other languages
German (de)
French (fr)
Japanese (ja)
Other versions
EP1651020A1 (en
Inventor
Tsuyoshi Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of EP1651020A1 publication Critical patent/EP1651020A1/en
Publication of EP1651020A4 publication Critical patent/EP1651020A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

A packaging electrode being arranged on an insulating substrate and consisting of a conduction pattern being boded electrically to an electronic component or/and a bonding wire for connection therewith, wherein the conduction pattern comprises a plurality of metallization layers laid in layers. A conductive adhesive for bonding and fixing the electronic component and the packaging electrode can thereby be prevented from flowing out from a bonded part so as not to short-circuit the packaging electrodes or to cover the bonding area thus blocking wire bonding.
EP04747168A 2003-07-02 2004-07-01 Packaging electrode, package, device and process for producing device Withdrawn EP1651020A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003190441 2003-07-02
JP2003191154 2003-07-03
PCT/JP2004/009699 WO2005004565A1 (en) 2003-07-02 2004-07-01 Packaging electrode, package, device and process for producing device

Publications (2)

Publication Number Publication Date
EP1651020A1 EP1651020A1 (en) 2006-04-26
EP1651020A4 true EP1651020A4 (en) 2007-02-21

Family

ID=33566751

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04747168A Withdrawn EP1651020A4 (en) 2003-07-02 2004-07-01 Packaging electrode, package, device and process for producing device

Country Status (4)

Country Link
US (1) US20050056458A1 (en)
EP (1) EP1651020A4 (en)
JP (1) JPWO2005004565A1 (en)
WO (1) WO2005004565A1 (en)

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DE102004010396A1 (en) * 2004-03-03 2005-09-29 Infineon Technologies Ag Transceiver filter and a method of manufacturing the same
JP5150076B2 (en) * 2006-09-15 2013-02-20 株式会社豊田自動織機 Surface mounting structure of electronic components for surface mounting
JP2008227055A (en) * 2007-03-12 2008-09-25 Mitsubishi Electric Corp Circuit board
JP4962217B2 (en) * 2007-08-28 2012-06-27 富士通株式会社 Printed wiring board and electronic device manufacturing method
GB2453765A (en) * 2007-10-18 2009-04-22 Novalia Ltd Product packaging with printed circuit and means for preventing a short circuit
CN102047397B (en) * 2008-06-12 2013-10-16 三菱综合材料株式会社 Method for joining substrate and object to be mounted using solder paste
US8759713B2 (en) * 2009-06-14 2014-06-24 Terepac Corporation Methods for interconnecting bonding pads between components
KR20120131726A (en) * 2011-05-26 2012-12-05 삼성전기주식회사 Multi-layered capacitor and manufacturing method thereof
KR101460027B1 (en) * 2013-03-15 2014-11-12 지스마트 주식회사 Pattern safety apparatus capable of preventing happening interface between patterns
US9414486B2 (en) 2013-07-29 2016-08-09 Kyocera Corporation Wiring board, wiring board with lead, and electronic device
JP2015039133A (en) * 2013-08-19 2015-02-26 日本特殊陶業株式会社 Package
JP6206266B2 (en) * 2014-03-14 2017-10-04 東芝ライテック株式会社 LIGHT EMITTING MODULE FOR VEHICLE, LIGHTING DEVICE FOR VEHICLE, AND VEHICLE LIGHT
JP6011573B2 (en) * 2014-03-24 2016-10-19 株式会社村田製作所 Electronic components
WO2017195572A1 (en) * 2016-05-09 2017-11-16 株式会社村田製作所 Ceramic electronic component
JP6888343B2 (en) * 2017-03-14 2021-06-16 セイコーエプソン株式会社 Vibration devices, oscillators, electronics and mobiles
KR20210051346A (en) * 2019-10-30 2021-05-10 삼성전자주식회사 Oscillator structure and electronic device including the same

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US5061552A (en) * 1989-01-24 1991-10-29 Fujitsu Limited Multi-layer ceramic substrate assembly and a process for manufacturing same
JPH05121865A (en) * 1991-10-24 1993-05-18 Sumitomo Kinzoku Ceramics:Kk Ceramic circuit substrate
JPH09246726A (en) * 1996-03-08 1997-09-19 Hoya Corp Printed board and method of forming bumps on printed board
US6111204A (en) * 1999-02-08 2000-08-29 Ford Motor Company Bond pads for fine-pitch applications on air bridge circuit boards
US20020000331A1 (en) * 1998-09-04 2002-01-03 Jairazbhoy Vivek Amir Method for making an electronic circuit assembly
US20020079595A1 (en) * 2000-12-21 2002-06-27 Carpenter Burton J. Apparatus for connecting a semiconductor die to a substrate and method therefor
JP2002353249A (en) * 2001-05-23 2002-12-06 Matsushita Electric Ind Co Ltd Surface mounting substrate
DE10153211A1 (en) * 2001-10-31 2003-01-30 Infineon Technologies Ag Electronic component comprises a semiconductor chip and a wiring plate connected to the active surface of the chip using a double-sided adhering film
JP2003142811A (en) * 2001-11-06 2003-05-16 Ngk Spark Plug Co Ltd Wiring board and manufacturing method therefor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061552A (en) * 1989-01-24 1991-10-29 Fujitsu Limited Multi-layer ceramic substrate assembly and a process for manufacturing same
JPH05121865A (en) * 1991-10-24 1993-05-18 Sumitomo Kinzoku Ceramics:Kk Ceramic circuit substrate
JPH09246726A (en) * 1996-03-08 1997-09-19 Hoya Corp Printed board and method of forming bumps on printed board
US20020000331A1 (en) * 1998-09-04 2002-01-03 Jairazbhoy Vivek Amir Method for making an electronic circuit assembly
US6111204A (en) * 1999-02-08 2000-08-29 Ford Motor Company Bond pads for fine-pitch applications on air bridge circuit boards
US20020079595A1 (en) * 2000-12-21 2002-06-27 Carpenter Burton J. Apparatus for connecting a semiconductor die to a substrate and method therefor
JP2002353249A (en) * 2001-05-23 2002-12-06 Matsushita Electric Ind Co Ltd Surface mounting substrate
DE10153211A1 (en) * 2001-10-31 2003-01-30 Infineon Technologies Ag Electronic component comprises a semiconductor chip and a wiring plate connected to the active surface of the chip using a double-sided adhering film
JP2003142811A (en) * 2001-11-06 2003-05-16 Ngk Spark Plug Co Ltd Wiring board and manufacturing method therefor

Non-Patent Citations (1)

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Title
See also references of WO2005004565A1 *

Also Published As

Publication number Publication date
US20050056458A1 (en) 2005-03-17
JPWO2005004565A1 (en) 2006-08-31
EP1651020A1 (en) 2006-04-26
WO2005004565A1 (en) 2005-01-13

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