TWI324890B - Micro electro-mechanical system device and manufacturing method thereof - Google Patents

Description

1324890

达达编号号: TW3334PA IX. Description of the Invention: [Technical Field] The present invention relates to a MEMS device and a method of fabricating the same, and particularly to a MEMS device as a microelectromechanical microphone and Its manufacturing method. [Prior Art] In order to cope with the miniaturization and functional complication of electronic products in today's market, the integration and miniaturization of systems using Micro Electro-Mechanical Syste= 'MEMS' technology is目目) The direction of research and development in the industry. In general, MEMS systems use sensors such as sensors (sensc) r), actuators (a_t〇r), and circuits to be fabricated by micro-integration technology. On the wafer substrate, it can be widely used in wireless communication, optical communication, medical, bio-wafer and semiconductor. Common commercial MEMS systems such as digital microlens elements, inkjet heads, acceleration sensors, pressure sensors, hemocytometry sensors, electrostatic triaxial accelerometers, and microelectromechanical microphones, and the like. Since the overall structure of the MEMS is quite small and precise, various components are susceptible to external electromagnetic radiation, even light interference, or the damage of the grain to the physical. As a result, the stability of the MEMS operation is reduced. For example, in a MEMS package for a microelectromechanical microphone, generally, a micro mic chip and other passive components are disposed on a substrate, and then a metal cover or a metal plate is added on the substrate. Or a metal plate covering a plurality of components on the substrate for the screen 1324890

Sanda number: TW3334PA covers and protects these components. However, the manner of providing the metal cover or the metal plate needs to be separately set on each package, which increases the overall process steps and increases the time and cost required for the process. SUMMARY OF THE INVENTION The present invention relates to a microelectromechanical system device and a method of fabricating the same, in which a wafer level cover structure is directly disposed on a microelectromechanical wafer in a process, so that the microelectromechanical device according to the present invention System devices and their manufacturing methods have the advantages of shorter process times, simplified process steps, and cost savings. According to one aspect of the invention, a MEMS device is provided, comprising a substrate, a MEMS wafer, a cover structure, and a glue. The MEMS wafer is disposed on the substrate. The cover structure is disposed on the MEMS wafer and only partially covers the MEMS wafer. The encapsulant is disposed on the substrate and covers the substrate, the microelectromechanical wafer, and at least a portion of the cover structure. According to another aspect of the present invention, a method of manufacturing a MEMS device is proposed. This manufacturing method includes the following steps. First, a cover wafer and a MEMS wafer are provided. The lid wafer and MEMS wafer are then bonded. Next, the MEMS wafer is placed on a tape. Second, the bonded cover wafer and MEMS wafer are cut to form a plurality of MEMS structures. Then, the MEMS structures are connected to a substrate. Further, the substrate is encapsulated by a glue and the MEMS structure, the seal covering the substrate and at least a portion of the top surface of each of the MEMS structures. Finally, the MEMS structure and substrate are cut. 1324890

。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Detailed description of the invention. However, the invention is not limited thereto, and such embodiments are not intended to limit the scope of the invention. Furthermore, the illustrations in the embodiments also omit unnecessary elements to clearly show the technical features of the present invention. In the first embodiment, please refer to FIGS. 1 and 2A to 2H, and FIG. 1 is a flow chart showing a method of manufacturing the MEMS device according to the first embodiment of the present invention; FIGS. 2A to 2H are respectively shown as the first A schematic diagram of steps 101 to 108 in the figure. First, as shown in steps 101 and 2A, a cap wafer 11 and a MEMS wafer 13 are provided, and the cover wafer 11 is bonded to the MEMS. On wafer 13. In the present embodiment, the cover wafer 11 has a plurality of through holes 11c extending through an upper surface 11a of the cover wafer 11 and a lower surface 11b. Next, in step 102, a film is adhered to the cover wafer 11. As shown in Fig. 2B, the film 15 covers the through holes 11c, which ensures that other foreign matter or chemicals do not enter the through holes 11c during the manufacturing process, thereby preventing the MEMS wafer 13 from being contaminated. The film 15 is preferably a transparent material. 1324890

Sanda number: TW3334PA Next, proceed to step 103 to set the MEMS wafer 13 on a tape. As shown in Fig. 2C, the bonded cover wafer 11 and the MEMS wafer 13 are fixed to the tape 16. This tape 16 is, for example, a 'UV tape. Then, in step 104, as shown in FIG. 2D, the bonded cover wafer 11 and the MEMS wafer 13 are cut, and the cover wafer 11 is cut into a plurality of cover structures 12, and the MEMS wafer 13 The system is cut into a plurality of microelectromechanical wafers 14. Each of the cover structures 12 has a through hole 11c, and each of the upper surface 14a of the microelectromechanical wafer 14 has a wire-bonding region 141, and the wire bonding region 141 is exposed to the cover. Structure 12 is outside. In addition, each of the cover structures 12 and each of the microelectromechanical wafers 14 form a MEMS structure 17. Then, as shown in steps 105 and 2E, the MEMS structure 17 is attached to the substrate 18 by the tape 16, and the wire bonding regions 141 and the substrate 18 of each MEMS wafer 14 are wire bonded to each. A microelectromechanical wafer 14 is electrically connected to the substrate 18. The substrate 18 includes an integrated circuit wafer 19. In the present embodiment, each MEMS structure 17 is disposed adjacent to each integrated circuit die 19. However, those skilled in the art can understand that the technology of the present invention is not limited thereto, and each MEMS structure 17 can also be disposed on the integrated circuit chip 19, that is, the integrated circuit chip 19 is located. Between each microelectromechanical wafer 14 and the substrate 18, the space of the substrate 18 can be saved. Then, in step 106, the substrate 18 and the MEMS structures 17 are encapsulated with a glue. As shown in Figure 2F, the sealant 1324890

_ Sanda number: TW3334PA 20 is disposed on the substrate 18 and covers the integrated circuit wafer 19 and a portion of the surface of each MEMS structure 17. Further, the film 15 described above is not covered by the sealant 20 and is exposed to the outside of the sealant 20. Next, as shown in steps 107 and 2G, the film 15 is removed. Since the sealant 20 is disposed so as not to cover the adhesive film 15, the through holes 11c are exposed to the outside of the sealant 20 after the adhesive film 15 is removed. Thus, a signal S can be transmitted to the microelectromechanical wafers 14 through the through holes 11c. In addition, step 108 is performed to singulating the micro-electromechanical system structure 17 and the substrate 18. 2H is a microelectromechanical system device 1 according to a first embodiment of the present invention. The MEMS device 100 manufactured in accordance with the above steps 1 〇 1 to 108 includes a cover structure 12, a microelectromechanical wafer 14, a substrate 18, an integrated circuit wafer 19, and a sealant 20. The MEMS device 1 is, for example, a microelectromechanical microphone, and the MEMS 14 is configured to receive a signal S, such as an acoustic signal, and correspondingly generate an electrical signal, and the integrated circuit The chip 19 is used to receive the electrical signal. The MEMS device according to the first embodiment of the present invention and the method of manufacturing the same according to the first embodiment of the present invention are provided by providing a cover wafer such that the cover structure is disposed on the MEMS wafer while the MEMS device is being fabricated. The MEMS device has a wafer level cover structure that simplifies the process steps and reduces costs. It is also preferred to provide a transparent film on the cover wafer to ensure that the MEMS wafer is not contaminated during the process. 1324890

Sanda number: TW3334PA Second embodiment The MEMS device of the present embodiment is different from the MEMS device 100 of the first embodiment described above (shown in FIG. 2H) in the position of the through hole, and the rest are the same. The department will not repeat them. Referring to Figure 3, there is shown a schematic diagram of a microcomputer system apparatus in accordance with a second embodiment of the present invention. The MEMS device 200 includes a cover structure 22, a microelectromechanical wafer 14, a substrate 28, an integrated circuit wafer 19, and a sealant 30. The cover structure 22 and the microelectromechanical wafer 14 form a MEMS structure 27. The substrate 28 has a through hole 28c which penetrates through one of the upper surface 28a and the lower surface 28b of the substrate 28. When the microcomputer system structure 27 is connected to the substrate 28 by the tape 26, the MEMS structure 27 corresponds to the position of the through hole 28c. Further, the tape 26 has an opening 26a at the corresponding through hole 28c so that a signal S can be transmitted to the microelectromechanical wafer 14 through the through hole 28c and the opening 26a. In the present embodiment, the integrated circuit wafer 19 is disposed beside the microelectromechanical wafer 14, and the encapsulant 30 covers the integrated circuit wafer 19 and the microelectromechanical system structure 27. That is, all of the components on the substrate 28 are encapsulated within the encapsulant 30 such that the MEMS device 200 has good protection. The MEMS device and the method for manufacturing the same according to the preferred embodiment of the present invention utilize a method of bonding a cover wafer and a MEMS wafer 5 and performing the cutting and packaging steps together to make the MEMS package. The system device has a wafer level cover structure. The advantage is that, by simultaneously cutting and encapsulating two wafers, a cover structure is formed in the process in the computer 1324890

The Sanda numbering: TW3334PA on the wafer allows for simplified process steps and simultaneous completion of multiple MEMS devices. This increases productivity, reduces process time and saves manufacturing costs. In addition, the microelectromechanical wafer is protected by the cover structure during the cutting and packaging steps, and the microelectromechanical wafer is prevented from being contaminated by the adhesive film covering the through holes. In the process of making the MEMS wafer, it is easier to carry out various processing actions. In view of the foregoing, the invention has been described above in terms of preferred embodiments, which are not intended to limit the invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

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3: TW3334PA [Simplified description of the drawings] Fig. 1 is a flow chart showing a method of manufacturing a MEMS device according to a first embodiment of the present invention; and Fig. 2A is a view showing a step 101 of Fig. 1; 2B is a schematic diagram of step 102 in FIG. 1; FIG. 2C is a schematic diagram of step 103 in FIG. 1; FIG. 2D is a schematic diagram of step 104 in FIG. 1; FIG. 2F is a schematic diagram of step 1〇6 in FIG. 1; FIG. 2G is a schematic diagram showing step 107 in FIG. 1; FIG. 2H is a schematic diagram showing step 108 in FIG. And FIG. 3 is a schematic diagram of a MEMS device in accordance with a second embodiment of the present invention.

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Claims (1)

1324890 (10) February 2, is replacing i. Patent application scope: 1. A Micro Electro-Mechanical System (MEMS) device, comprising: a substrate; a microelectromechanical chip disposed on the substrate; a cover structure disposed on the MEMS pad, wherein a side of the cover structure is flush with a side of the MEMS pad to form a continuous plane, and the cover structure partially covers the MEMS a wafer; and a glue disposed on the substrate, the seal covering the substrate, the MEMS wafer, and at least a portion of the cover structure. 2. The MEMS device of claim 1, wherein the cover structure has a through hole extending through the upper surface and the lower surface of the cover structure, the sealant exposing the pass a hole for transmitting a signal to the MEMS wafer. 3. The MEMS device of claim 2, wherein the MEMS device is a MEMS Microphone, the signal being an acoustic signal. 4. The MEMS device of claim 2, further comprising: an integrated circuit chip disposed on the substrate and located adjacent to the MEMS wafer, the integrated circuit chip for receiving the The MEMS chip transmits an electrical signal. 5. The MEMS device of claim 4, wherein the encapsulant further covers the integrated circuit chip. 1324890 * ".·| I II I .......... ' Amendment of February 22, 1999. 6. The MEMS device as described in claim 2, including: The integrated circuit chip is disposed between the MEMS chip and the substrate, and the integrated circuit chip is configured to receive an electrical signal transmitted by the MEMS. 7. The micro device according to claim 1 An electromechanical system device, wherein an upper surface of the MEMS wafer has a wire bonding region, and the MEMS wafer is wire bonded to the substrate via the wire bonding region to electrically connect the MEMS wafer to the MEMS device. 8. The MEMS device of claim 7, wherein the cover structure does not cover the wire bonding region. 9. The MEMS device according to claim 1, The substrate has a through hole extending through the upper surface and the lower surface of the substrate for transmitting a signal to the MEMS wafer. 10. The MEMS device according to claim 9 of the patent application, Where the MEMS is installed The MEMS device is a MEMS device. The MEMS device of claim 9 wherein the sealant completely covers the cover structure. The MEMS device of claim 9, further comprising: an integrated circuit chip disposed on the substrate and located adjacent to the MEMS chip, the integrated circuit chip is configured to receive the MEMS transmission 15 1324890 _ Y «5 I Amendment Replacement Page i 99. 2. 22 _i A galvanic signal. 13. The MEMS device of claim 12, wherein the sealant covers the integrated circuit more A method of manufacturing a MEMS device, comprising: providing a cap wafer and a MEMS wafer; bonding the lid wafer and the MEMS wafer; setting the micro The electromechanical system wafer is on a tape; dicing the bonded cover wafer and the MEMS wafer to form a plurality of MEMS structures, and wherein all sides of the cover wafer and the micro The entire surface of the electrical system wafer is flush and is a continuous cut surface; the MEMS structure is connected to a substrate; the substrate and the MEMS structure are encapsulated by an adhesive, the sealant covers the substrate And at least a portion of the surface of each of the MEMS structures; and singulating the MEMS structure and the substrate. 15. The method of manufacturing of claim 14, wherein in the cutting step, The cover wafer is cut into a plurality of cover structures, and the MEMS wafer is cut into a plurality of MEMS wafers, and the MEMS structures respectively include the cover structures and the MEMS wafers. 16. The manufacturing method of claim 15, wherein the cover wafer has a plurality of through holes extending through the upper surface and the lower surface of the cover wafer for performing the cutting. After the step, the through holes are respectively disposed corresponding to each of the cover structures. 1324890 _, • · 9 cooking February 22 revision replacement page kw .......... 17. As described in the scope of the patent application, in the method of the connection, after the step The method includes: -* adhering a film to the cover wafer to cover the through holes. 18. The method of manufacture of claim 17, wherein the film is a transparent material. 19. The method of manufacturing of claim 17, further comprising: removing the film after the step of packaging. 20. The method of manufacturing of claim 16, wherein in the encapsulating step, the encapsulant exposes the through holes. 21. The method of manufacturing of claim 15, wherein the upper surface of the MEMS wafer has a wire bonding region that does not cover the wire bonding region. 22. The manufacturing method of claim 21, after the connecting step, further comprising: wire bonding the wire bonding region and the substrate for electrically connecting the MEMS pad to the Substrate. The manufacturing method according to claim 15, wherein the substrate has a plurality of through holes penetrating through the upper surface and the lower surface of the substrate. 24. The method of manufacture of claim 23, wherein in the joining step, each of the MEMS structures is coupled to a location on the substrate corresponding to each of the vias. 17