1297223 九、發明說明： ' 【發明所屬之技術領域】 本發明係關於一種二極體封裝模組，特別關於一種發 光二極體封裝模紐。 【先前技術】 隨著科技的高度發展，發光二極體（Light Emitted Diode，LED)具有輕巧、省電及壽命長等優點，故目前已 被廣泛的應用於資訊、通訊、消費性電子產品的指示器及 顯示裝置上，例如：指示燈、攜帶式手電筒、LCD背光板、 地面燈、逃生燈、醫療設備光源、輔助照明、主照明等， 故為重要的電子元件之一。目前白光發光二極體之應用亦 逐漸展開，且已由小型照明市場，帶入另一個境界，更被 利用於液晶顯示器（Liquid crystal Display，LCD )之背光 源中，並有逐漸取代傳統冷陰極螢光燈管的趨勢。 請同時參考圖1及圖2，於習知技術中，以發光二極 體作為光源之背光模組1，係具有一殼體11、複數個發光 二極體封裝模組12、一載板13、一驅動電路板14、以及 至少一光學薄膜15。 各發光二極體封裝模組12分別具有複數發光二極體 元件121 ( LED Device )及一印刷電路板122。各發光二 極體元件121係設置於印刷電路板122上，再將各個發光 二極體封裝模組12固定於載板I3上’載板13係與殼體 11鎖固（圖中未顯示）；而驅動電路板14係用以驅動發光二 5 1297223 、、’ I、主要係具有—包含主動元件及被動元 件之驅動迴路，且驅動電路板14係固定於鄱妬13而盥恭 光二極體封|軸12相對二固疋於載板1而與發 有電晶體141等元件，以二:二驅動電路板14上係設置 之發光強h 動控制發光二極體封裝模組12 =而’通常各發光二極_裝触12之複數個發光 121需事先以―個―個先封裝好的方式，再設 體14:辇-ί板122上。另外，驅動電路板14上之電晶 …如此—來，十分浪費設置於驅動電路板 承上所述，如何提供—種能夠解決光二 極體封裝模組，正是當前的重要課題之一。之又、一 【發明内容】 有鑑於上述課題，本發gjg 二極體及電晶體封裝於同H 提j *可將發光 本之發光二極體封裝模組。料中，以㈣封裝製程成 本發明之另-目的為提供一種 2光感測元件之其中任：封裝於同一㈣體體= 封裝製程成本之發光二極體封襞模組。 中，以即癌 %包:=達上Γ的，依本發:二發光二极體封裝模 :包含一基板、一第-發光二極體以及-電晶懸二 性=體==而電晶體係與第-發光二極體電 連接U於基板上，Μ制[發體之開、 6 1297223 關，其中，第一發光二極體及電晶體係位於同一封裝體内。 為達上述目的，依本發明之發光二極體封裝模組包含 一基板、一第一發光二極體、一光感測元件以及一電晶 體。第一發光二極體係設置於基板，而光感測元件係設置 於基板，電晶體係與第一發光二極體電性連接，並設置於 基板上，以控制第一發光二極體之開、關，其中，第一發 光二極體、光感測元件或電晶體之其中任二係位於同一封 裝體内。 承上所述，因依據本發明之發光二極體封裝模組，係 將第一發光二極體及電晶體分別設置於基板，更使第一發 光二極體及電晶體位於同一封裝體。與習知技術相較，藉 由使第一發光二極體及電晶體位於同一封裝體中，係可降 低封裝製程之成本。另外，於本發明之實施例中，當第二 發光二極體於反向偏壓驅動時，則可形成光感測元件，即 可作為感測發光強度，故可迴饋以調整發光二極體強度， 並可少去額外設置光感測元件來感測光強度。 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之發 光二極體封裝模組，其中相同的元件將以相同的參照符號 加以說明。 請同時參照圖3與圖4所示，本發明較佳實施例之發 光二極體封裝模組2，包含一基板21、一第一發光二極體 22以及一電晶體23，其中，第一發光二極體22及電晶體 7 1297223 23係位於同一封裝體24内。 、 於本實施例中，基板21並無限制，係可為一印刷電 路板、一散熱板或一玻璃基板；而封裝體24之材質亦無 限制，可使用一透明樹脂，例如透明的環氧樹脂（ep0Xy resin) ’或使用一透明膠，例如梦膠(siHc〇ne)為材質。1297223 IX. Description of the invention: 'Technical field to which the invention pertains>> The present invention relates to a diode package module, and more particularly to a light-emitting diode package mold. [Prior Art] With the development of technology, Light Emitted Diode (LED) has the advantages of light weight, power saving and long life, so it has been widely used in information, communication and consumer electronics. Indicators and display devices, such as indicators, portable flashlights, LCD backlights, floor lights, escape lights, medical equipment light sources, auxiliary lighting, main lighting, etc., are one of the important electronic components. At present, the application of white light emitting diodes is gradually unfolding, and has been brought into another realm by the small lighting market. It is also used in the backlight of liquid crystal display (LCD), and gradually replaces the traditional cold cathode. The trend of fluorescent tubes. Please refer to FIG. 1 and FIG. 2 simultaneously. In the prior art, the backlight module 1 with the light-emitting diode as the light source has a casing 11 , a plurality of LED package modules 12 , and a carrier 13 . A driver circuit board 14, and at least one optical film 15. Each of the LED package modules 12 has a plurality of LED devices 121 (LED Device) and a printed circuit board 122. Each of the LED components 121 is disposed on the printed circuit board 122, and each LED package module 12 is fixed on the carrier board I3. The carrier 13 is locked to the housing 11 (not shown). The driving circuit board 14 is used to drive the light-emitting diodes 5, 12,972,223, 'I, mainly has a driving circuit including active components and passive components, and the driving circuit board 14 is fixed to the 鄱妒13 and the 盥Guangguang diode The shaft 12 is relatively fixed to the carrier board 1 and is coupled with a component such as a transistor 141, and the light-emitting intensity of the second driving circuit board 14 is used to control the LED package module 12 = Generally, the plurality of light-emitting electrodes 121 of each of the light-emitting diodes 12 are required to be packaged in advance in a manner of "first" and then placed on the body 14: 板-ί board 122. In addition, the electro-optical crystal on the driving circuit board 14 is so wasteful that it is disposed on the driving circuit board. How to provide a photodiode package module is one of the current important topics. In addition, in view of the above problems, the gjg diode and the transistor are packaged in a light-emitting diode package module which can emit light. In the material, the (four) packaging process is another object of the present invention to provide a light-sensing diode package which is packaged in the same (four) body body = packaging process cost. In the case of cancer, the package is as follows: = up to the top, according to the hair: two light-emitting diode package: including a substrate, a first-light diode and - electro-optic suspension = body == and electricity The crystal system is electrically connected to the first light-emitting diode on the substrate, and is formed by the opening of the body, 6 1297223, wherein the first light-emitting diode and the electro-crystal system are located in the same package. To achieve the above object, a light emitting diode package module according to the present invention comprises a substrate, a first light emitting diode, a light sensing element, and an electric crystal. The first light-emitting diode system is disposed on the substrate, and the light-sensing component is disposed on the substrate, and the electro-crystal system is electrically connected to the first light-emitting diode and disposed on the substrate to control the opening of the first light-emitting diode And off, wherein any one of the first light emitting diode, the light sensing element or the transistor is located in the same package. As described above, in the light-emitting diode package module according to the present invention, the first light-emitting diode and the transistor are respectively disposed on the substrate, and the first light-emitting diode and the transistor are located in the same package. Compared with the prior art, the cost of the packaging process can be reduced by having the first light-emitting diode and the transistor in the same package. In addition, in the embodiment of the present invention, when the second LED is driven by the reverse bias, the photo sensing element can be formed, which can be used as the sensing luminous intensity, so that the LED can be fed back to adjust the LED. Intensity, and the light sensing element can be additionally set to sense the light intensity. [Embodiment] Hereinafter, a light-emitting diode package module according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein like elements will be described with the same reference numerals. As shown in FIG. 3 and FIG. 4, the LED package module 2 of the preferred embodiment of the present invention comprises a substrate 21, a first LED 22 and a transistor 23, wherein The light-emitting diode 22 and the transistor 7 1297223 23 are located in the same package 24. In this embodiment, the substrate 21 is not limited, and may be a printed circuit board, a heat sink or a glass substrate; and the material of the package 24 is not limited, and a transparent resin such as a transparent epoxy may be used. Resin (ep0Xy resin) 'Or use a transparent adhesive, such as miHc〇ne.
請再參照圖4所示，本實施例之第一發光二極體22， 係可以一發光二極體晶片或一發光二極體晶粒(裸晶，die) 的形式，而直接設置於基板21上。 電晶體23則與第一發光二極體22電性連接，並役置 於基板21上，係用以控制第一發光二極體22之開、關， 其中電晶體23可為一開關之元件，例如：一雙^子電晶 體(BJT)、一場效電晶體(FET)或一金屬氧化半導體 = (MOSFET) 〇 的 請再參照圖4所示，發光二極體封裴模組2更勺人Referring to FIG. 4 again, the first LEDs 22 of the present embodiment may be directly disposed on the substrate in the form of a light-emitting diode chip or a light-emitting diode (die). 21 on. The transistor 23 is electrically connected to the first light-emitting diode 22 and is placed on the substrate 21 for controlling the opening and closing of the first light-emitting diode 22, wherein the transistor 23 can be a component of a switch. For example, a pair of transistor (BJT), a transistor (FET) or a metal oxide semiconductor = (MOSFET) 〇 please refer to Figure 4 again, the LED package 2 is more scoop people
驅動控制迴路25，係分別與第一發光二炻脚， ^ S 一 22及電晶體 23電性連接，並藉由驅動控制迴路25 〇輸出一脈衝寬度調 變訊號(PWM)至電晶體23，以使電晶體又月 口《助：依據脈衝寶 調變訊號而關、關作動，並進而控制第一 知无—極體22 之責任週期（duty cycle)。另外，亦可孩 猎由驅動控制迴路 25輸出一直流電源(DC)訊號至第一菸本 x尤—極體22，並藉 由調整直流電源訊號之大小，以控制筮—& 4昂一發光二極體22 之發光強度。本實施例之驅動控制迴路25， ^ 板21之另一侧，並與第一發光二極髀固疋於基 以及電晶體23相 對而設並電性連接；另外’請參照圖5裕- 斤7^，當驅動控制 8 1297223 迴絡25芳整合成一晶片25,形式時，則可設置於封裝體24 内。請同時參照圖6及圖7所示，發光二極體封裝模組2 更 < 包含光感測元件(photosensor)26，其可位於封裝體 24内（如圖6所示），也可以設置於基板21上但位於封裝 雜24之外（如圖7所示）。於本實施例中，當光感測元件 ， 26位於封裝體24内，且封裝體24為不透光時，係用以同 ， 時或分別感測封裝體24内之第.一發光二極體22或其他複 數個發光一極體（圖未示）之發光強度；當光感測元件26位 • 於封裝體外時 ，係用以同時或分別感測鄰近之封震體24 内之第/發光二極體22或其他發光二極體封裝模組2之 發光二極體（圖未示）之發光強度。 請參照圖8，本實施例之發光二極體封裝模組2更包 含一透明蓋體27，係蓋設於光感測元件26之上，形成一 透明窗口’可使光感測元件26自透明窗口感測其他設置 於背光模組中之發光二極體之發光強度。另外，當封裝體 φ 24使用透明材質時，光感測元件26則可不需藉由透明蓋 體27 ’即可感測發光二極體之發光強度（圖未示）。 請參照圖9所示，於本實施例中，發光二極體封裝模 〜 組2更包含一記憶體28，其係設置於基板21並與驅動控 〜 制迴路25電性連接，而記憶體28之設置並無限制，係可 位於封裝體24内，或位於基板21之另一側並與第一發光 一極體22相對而設（圖未示）。本實施例之記憶體，在此 以一非揮發性記憶體為例，其内可儲存有複數筆發光強度 對電流資料之對照表(l〇〇k up table)，驅動控制迴路25可 9 1297223 查閱記憶體28内之對照表以作為控制第一發光二極體22 之發光強度之參考資料。 再請參照圖9,以說明本實施例之發光二極體封裝模 組2之作動。當光感測元件26係感測第一發光二極體22 之發光強度時，則會將感測到之發光強度轉換為一電流’ 並送至驅動控制迴路25，而驅動控制迴路25依據接收之 電流，至記憶體28中查詢與該電流相對應之發光強度之 參考值，以調整第一發光二極體22之發光強度至該參考 值。 請參照圖10所示，本實施例之發光二極體封裝模組 2，更包含一第二發光二極體29，係與第一發光二極體22 電性連接，並設置於基板21。而第二發光二極體29亦位 於封裝體24内，並可藉由同一驅動控制迴路25，以驅動 及控制第二發光二極體29之發光強度。於本實施例中， 第一發光二極體22與第二發光二極體29之連接方式並無 限制，第一發光二極體22與第二發光二極體29可為串聯 連接或並聯連接，並皆可分別以直流(DC)電源或交流(AC) 電源驅動。另外，當第一發光二極體22與第二發光二極 體29為並聯且相互反接方式連接時，若輪入交流(AC)電 源，則可輪流驅動第一發光二極體22及第二發光二極體 29發光；若輸入直流電源時，則可使其中一發光二極體發 光，另一發光二極體則反向偏壓形成一光感測元件26，用 以感測週圍之光強度（圖未示）。 睛參照圖11所示，本實施例之發光二極體封裴模組 1297223 2，於製程時，除可將第一發光二極體22及第二發光二極 體29封裝於同一封裝體24，更可將複數個發光二極體d 皆封裝於同一封裝體24内，並藉由電晶體23控制第一發 光二極體22、第二發光二極體29及各發光二極體d之開、 關，及藉由驅動控制迴路25以驅動及控制第一發光二極 體22及第二發光二極體29及各發光二極體d之發光強 度。於本實施中，更可將複數個發光二極體封裝模組2覆 晶設置或表面安裝於一固定板P上，而固定板P在此並無 限制，係可為一背光模組的殼體、一散熱片或一印刷電路 板。 由於發光二極體封裝模組2係將第一發光二極體22、 第二發光二極體29、電晶體23、光感測元件26以及驅動 控制迴路25皆設置於同一基板21，更將上述元件及複數 個發光二極體d皆封裝於同一封裝體24中，此種方式， 節省封裝製程成本；另外，當第二發光二極體29於逆向 偏塵驅動時，則形成光感測元件26，即可作為感測其他發 光二極體之發光強度，更可節省使用之光感測元件26個 數。 請參照圖12所示，本發明另一較佳實施例之發光二 極體封裝模組3，包含一基板31、一第一發光二極體32、 一電晶體33以及一光感測元件34。第一發光二極體32係 設置於基板31，光感測元件33係設置於基板31，而電晶 體34係與第一發光二極體32電性連接，並設置於基板31 上，以控制第一發光二極體32之開、關，其中，第一發 11 1297223The driving control circuit 25 is electrically connected to the first light-emitting diodes, ^S-22, and the transistor 23, and outputs a pulse width modulation signal (PWM) to the transistor 23 through the driving control circuit 25? In order to make the transistor and the moon mouth "help: according to the pulse treasure modulation signal to turn off, turn off the action, and then control the first know no - the body 22 duty cycle (duty cycle). In addition, the driver control circuit 25 can also output a direct current power (DC) signal to the first cigarette x the pole body 22, and adjust the size of the DC power signal to control the 筮-& The luminous intensity of the light-emitting diode 22. The drive control circuit 25 of the present embodiment, the other side of the board 21, is disposed opposite to the first light-emitting diode and the transistor 23, and is electrically connected; 7^, when the drive control 8 1297223 retrace 25 is integrated into a wafer 25, the form can be disposed in the package 24. Referring to FIG. 6 and FIG. 7 simultaneously, the LED package module 2 further includes a photosensor 26, which may be located in the package 24 (as shown in FIG. 6), or may be disposed. On the substrate 21 but outside the package 24 (as shown in Figure 7). In this embodiment, when the light sensing component 26 is located in the package body 24, and the package body 24 is opaque, it is used to sense the first light emitting diode in the package 24 at the same time or separately. The luminous intensity of the body 22 or other plurality of light-emitting diodes (not shown); when the light sensing element 26 is placed outside the package, it is used to simultaneously or separately sense the first in the adjacent sealed body 24 The luminous intensity of the light-emitting diode (not shown) of the light-emitting diode 22 or other light-emitting diode package module 2. Referring to FIG. 8 , the LED package module 2 of the present embodiment further includes a transparent cover 27 disposed on the light sensing component 26 to form a transparent window ′ to enable the light sensing component 26 The transparent window senses the luminous intensity of other light-emitting diodes disposed in the backlight module. Further, when the package φ 24 is made of a transparent material, the light sensing element 26 can sense the light-emitting intensity of the light-emitting diode (not shown) without using the transparent cover 27'. As shown in FIG. 9, in the embodiment, the LED package module 2 includes a memory 28 disposed on the substrate 21 and electrically connected to the driving control circuit 25, and the memory is The arrangement of 28 is not limited, and may be located in the package body 24 or on the other side of the substrate 21 and opposite to the first light-emitting body 22 (not shown). In the memory of this embodiment, a non-volatile memory is taken as an example, and a comparison table (l〇〇k up table) of a plurality of luminous intensity versus current data can be stored therein, and the driving control circuit 25 can be 9 1297223 The comparison table in the memory 28 is referred to as a reference for controlling the luminous intensity of the first light-emitting diode 22. Referring to Fig. 9, the operation of the LED package 2 of the present embodiment will be described. When the light sensing element 26 senses the light intensity of the first light emitting diode 22, the sensed light intensity is converted into a current 'and sent to the drive control loop 25, and the drive control loop 25 receives the light. The current is supplied to the memory 28 for a reference value of the illuminance corresponding to the current to adjust the illuminance of the first illuminating diode 22 to the reference value. As shown in FIG. 10 , the LED package 2 of the present embodiment further includes a second LED 29 electrically connected to the first LED 22 and disposed on the substrate 21 . The second LED 29 is also located in the package body 24, and the same driving control circuit 25 can be used to drive and control the luminous intensity of the second LED body 29. In this embodiment, the connection manner of the first LEDs 22 and the second LEDs 29 is not limited, and the first LEDs 22 and the second LEDs 29 may be connected in series or in parallel. Both can be driven by direct current (DC) power or alternating current (AC) power. In addition, when the first light-emitting diode 22 and the second light-emitting diode 29 are connected in parallel and connected to each other in reverse, if the alternating current (AC) power source is turned on, the first light-emitting diode 22 and the first light-emitting diode 22 can be driven in turn. The two light-emitting diodes 29 emit light; if a DC power source is input, one of the light-emitting diodes can be illuminated, and the other light-emitting diode is reverse-biased to form a light-sensing element 26 for sensing the surrounding Light intensity (not shown). Referring to FIG. 11 , the LED diode package 1297223 2 of the present embodiment can be packaged in the same package 24 except for the first LEDs 22 and the second LEDs 29 during the manufacturing process. The plurality of LEDs d can be packaged in the same package 24, and the first LEDs 22, the second LEDs 29, and the LEDs d are controlled by the transistor 23. The light-emitting intensity of the first light-emitting diode 22 and the second light-emitting diode 29 and each of the light-emitting diodes d is driven and controlled by driving the control circuit 25 to be turned on and off. In this embodiment, a plurality of LED packages 2 can be flip-chip mounted or surface mounted on a fixed board P, and the fixing board P is not limited thereto, and can be a shell of a backlight module. Body, a heat sink or a printed circuit board. The light-emitting diode package module 2 has the first light-emitting diode 22, the second light-emitting diode 29, the transistor 23, the light-sensing element 26, and the drive control circuit 25 all disposed on the same substrate 21, and more The component and the plurality of LEDs d are all packaged in the same package 24, which saves packaging process cost. In addition, when the second LED 29 is driven by reverse dust, light sensing is formed. The component 26 can be used to sense the luminous intensity of other light-emitting diodes, and the number of light sensing elements 26 used can be saved. The LED module 3 includes a substrate 31, a first LED 32, a transistor 33, and a light sensing component 34. . The first light-emitting diodes 32 are disposed on the substrate 31, the light sensing elements 33 are disposed on the substrate 31, and the transistors 34 are electrically connected to the first light-emitting diodes 32, and are disposed on the substrate 31 for control. Opening and closing of the first light-emitting diode 32, wherein the first hair 11 1297223
光感測元件34位於同一封裴體％内為例，電晶體33則 位於另一封裝體35’内。 本實施例中之第一發光二極體32、電晶體33、光感 測兀件34、驅動迴路36以及封裝體35、35,，係與上述較 佳實施例（如圖3與圖4所示）之第一發光二極體22、光感 測元件26、電晶體23、驅動迴路25以及封裝體24具有 相同之構成、功能與作動，故於此不再贅述。 作為感測發光強度， 综上所述，因依據本發明之發光二極體封裝模組，係 將第一發光二極體及電晶體分別設置於基板，更使第一發 光二極體及電晶體位於同一封裝體。與習知技術相較，藉 由使第一發光二極體及電晶體位於同一封裝體中，係可降 低封裝製程之成本。另外，於本發明之實施例中，當第二 發光二極體於反向偏壓驅動時，則形成光感測元件，即可 可少去額外設置域測元件來❹ 。 故可迴饋以調整發光二極體強度，並The light sensing element 34 is located within the same package body %, and the transistor 33 is located within the other package body 35'. The first light-emitting diode 32, the transistor 33, the light sensing element 34, the driving circuit 36, and the packages 35 and 35 in this embodiment are the same as the above-described preferred embodiment (as shown in FIG. 3 and FIG. 4). The first light-emitting diode 22, the light-sensing element 26, the transistor 23, the driving circuit 25, and the package 24 have the same configuration, function, and operation, and thus will not be described again. As described above, in the light emitting diode package module according to the present invention, the first light emitting diode and the transistor are respectively disposed on the substrate, and the first light emitting diode and the electric light are further disposed. The crystals are in the same package. Compared with the prior art, the cost of the packaging process can be reduced by having the first light-emitting diode and the transistor in the same package. In addition, in the embodiment of the present invention, when the second LED is driven by the reverse bias, the photo sensing element is formed, so that the additional field detecting component can be removed. Therefore, feedback can be applied to adjust the intensity of the light-emitting diode, and
【圖式簡單說明】 圖1為顯示習知 圖2為顯示圖i 之發光二極體作為光源之背光模組； 之發光二極體之剖面圖； 12 1297223 圖3為顯示依本發明較佳實施例之發光二極體封裝模 組之立體圖； 圖4為顯示依本發明較佳實施例之發光二極體封裝模 組之剖面圖； 圖5為顯示依本發明較佳實施例之發光二極體封裝模 組，且第一發光二極體、電晶體及驅動控制迴路皆位於同 一封裝體内之示意圖； 圖6為顯示依本發明較佳實施例之發光二極體封裝模 組，且具有一光感測元件，並位於封裝體内之示意圖； 圖7為顯示依本發明較佳實施例之發光二極體封裝模 組，且具有一光感測元件，並位於封裝體外之示意圖； 圖8為顯示依本發明較佳實施例之發光二極體封裝模 組，且具有一透明蓋體之示意圖； 圖9為顯示依本發明較佳實施例之發光二極體封裝模 組，且第一發光二極體、電晶體、光感測元件、記憶體及 驅動控制迴路皆位於同一封裝體之示意圖； 圖10為顯示依本發明較佳實施例之發光二極體封裝 模組，且第一發光二極體、第二發光二極體、電晶體及驅 動控制迴路皆位於同一封裝體之示意圖； 圖11為顯示依本發明較佳實施例之發光二極體封裝 模組，且第一發光二極體、第二發光二極體、複數個發光 二極體、電晶體及驅動控制迴路皆位於同一封裝體之示意 圖；以及 圖12為顯示依本發明較佳實施例之發光二極體封裝 13 1297223 模組，且第一發光二極體及電晶體位於同一封裝體；而光 感測元件位於另一封裝體之示意圖。 元件符號說明： 1 背光模組 11 殼體 12 發光二極體單元 121 發光二極體元件 122 印刷電路板 13 載板 14 驅動電路板 15 光學薄膜 2 發光二極體封裝模組 21 基板 22 第一發光二極體 23 電晶體 24 封裝體 25 驅動控制迴路 25， 晶片 26 光感測元件 27 透明蓋體 28 記憶體 29 第二發光二極體 3 發光二極體封裝模組 1297223 31 基板 32 第一發光二極體 33 光感測元件 34 電晶體 35、35, 封裝體 36 驅動控制迴路 A-A5 剖面線 B-B’ 剖面線 d 發光二極體 P 固定板 15BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a backlight module of the light-emitting diode of FIG. i as a light source; a cross-sectional view of the light-emitting diode; 12 1297223 FIG. 3 is a view showing a preferred embodiment of the present invention. FIG. 4 is a cross-sectional view showing a light emitting diode package module according to a preferred embodiment of the present invention; FIG. 5 is a view showing a light emitting device according to a preferred embodiment of the present invention; FIG. 6 is a schematic diagram showing a light emitting diode package module according to a preferred embodiment of the present invention; and FIG. 6 is a schematic diagram of a first embodiment of the present invention; FIG. 7 is a schematic view showing a light-emitting diode package module according to a preferred embodiment of the present invention, and having a light sensing component and located outside the package; FIG. 8 is a schematic view showing a light emitting diode package module according to a preferred embodiment of the present invention, and FIG. 9 is a schematic view showing a light emitting diode package module according to a preferred embodiment of the present invention; First light emitting diode FIG. 10 is a schematic diagram showing a light emitting diode package module according to a preferred embodiment of the present invention, and a first light emitting diode; FIG. 10 is a schematic view showing a light emitting diode package according to a preferred embodiment of the present invention; The second LED, the transistor, and the driving control circuit are all located in the same package. FIG. 11 is a schematic diagram of a light emitting diode package according to a preferred embodiment of the present invention, and the first LED, The second light emitting diode, the plurality of light emitting diodes, the transistor and the driving control circuit are all located in the same package; and FIG. 12 is a schematic diagram of the LED 1213122 module according to the preferred embodiment of the present invention. And the first light emitting diode and the transistor are located in the same package; and the light sensing component is located in another package. Description of the components: 1 backlight module 11 housing 12 LED unit 121 LED component 122 printed circuit board 13 carrier 14 driver board 15 optical film 2 LED package module 21 substrate 22 first Light-emitting diode 23 transistor 24 package 25 drive control circuit 25, wafer 26 light sensing element 27 transparent cover 28 memory 29 second light-emitting diode 3 light-emitting diode package module 1297223 31 substrate 32 first Light Emitting Diode 33 Light Sensing Element 34 Transistor 35, 35, Package 36 Drive Control Loop A-A5 Section Line B-B' Section Line d Light Emitting P P Fixing Plate 15