TWI224560B - Structure of inkjet printhead and inkjet printing system - Google Patents

Abstract

The present invention relates to an inkjet printhead for ejecting ink contained in an ink reservoir onto a recording medium. The inkjet printhead comprises a heater IC, a barrier layer and a nozzle plate. The heater IC is substantially in a rectangular shape. The barrier layer is formed on the heater IC but exposes portions of the heater IC on the both side in the width direction. The barrier layer defines a plurality of ink channels and a plurality of ink chambers along with the heater IC. The width of the nozzle plate is greater than that of the heater IC, and the nozzle plate is provided a plurality of nozzles corresponding to the plurality of ink chambers. When the nozzle plate is coupled with the heater IC, the nozzle plate defines a first ink slot and a second ink slot along with the exposed portions of the heater IC. In such configuration, the ink contained in an ink reservoir can be ejected onto the recording medium through the first ink slot, the second ink slot, the plurality of ink channels and the plurality of ink chambers.

Description

1224560 V. Description of the invention (1) The technical field to which the invention belongs This invention relates to an inkjet head structure of an ink cartridge, especially an inkjet head structure having a reduced heating wafer size. This case also relates to an inkjet printing system using such an inkjet head structure. Previous technology With the gradual development of personal computers, inkjet printers (inkjet printers) have become very common peripheral devices, which are widely used in homes, personal studios, and even various industries. The main advantages of inkjet printers are low price, low noise during operation, and excellent print quality, and they can print on a variety of media, such as general paper, special inkjet printing paper, photo paper, and special transparencies. The mechanism for controlling the ink jet head (P r n t he a d) to release ink droplets to the ink jet medium is one of the important factors to consider in designing the ink E. Generally speaking, the inkjet head ejects ink droplets mainly in two types: a thermal bubble type and a piezoelectric type. Taking a thermal bubble type inkjet head as an example, its operation principle is to use a heater resistor to heat it to generate air bubbles, thereby squeezing out the ink, and spraying it onto the inkjet medium through a plurality of nozzle holes. As shown in the first figure, the conventional inkjet head structure is mainly composed of a heater IC 11, a barrier layer 12 and a nozzle plate 13. The heating wafer 1 1 is generally known to those skilled in the art ’, which is a wafer with a resistance heater (r e s i s t r heater). For the convenience of description, hereinafter referred to as heating wafer

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(heater 1C). The heating crystal includes an ink supply port (ink s 1 ot) 1 1 0 located in the center, a set of heating resistors (not shown) surrounding the ink supply port, and welding on both sides of the heating wafer, (contact pa (j) iii The barrier layer 12 is opened > into a plurality of ink chambers (inkchamber) 1 2 1, and an ink supply channel is defined between the P early wall layer 12 on the heating wafer 1 1 (nkchanne 1, not shown). The nozzle holes 1 3 have a plurality of nozzle holes 131 corresponding to the ink chamber 2 i.

Please refer to the second figure. The steps for assembling the inkjet head to the ink cartridge are as follows. First, the nozzle plate (nozzz p 1 ate) 1 3 is precisely positioned on the heating wafer 1 1 to form an I c assembly (jc assembly); then the 1C assembly and a circuit board (TAB) for input and output signals are formed. After the electrical connection is completed; finally, the 丨 c component is glued to the inkjet head carrier 21 at the bottom of the ink cartridge body 2 with an adhesive, and then the inkjet head assembly is completed. Please look at the first and second figures together. When using this ink, the ink stored in the ink reservoir (not shown) in the ink cartridge body 2 first flows from the ink reservoir to the bottom hole 22, Then it flows into the ink supply port 110 'in the center of the heating sheet 11 and enters the ink supply channel defined between the barrier layer 12 and the heating wafer 11, and then flows to the ink chamber 1 2 1 and finally is heated by a heating resistor to generate it. The air bubbles further eject the ink, and spray it onto the inkjet medium through the nozzle holes 131 in the nozzle hole sheet 13.

The above-mentioned inkjet head structure faces the following problems: (1) The step of forming the central ink supply port 1 1 0 of the heating wafer 11 is usually performed using a sand blasting process or a laser perforation process, wherein the sand blasting process has poor cleanliness and the laser The cost of perforation is limited and there are material restrictions.

Page 1224560 X)-3 / «V It is stated that the easiness of the process is passed. 1X 1X D Ink supply center 1 ± 1X plate crystals are hot-formed to make it easy to use. Make the impermanence head 21 or the spray stroke at After the manufacturing process is continued, due to the damage, the seam or cracks will be caused by the road. 1 " " ^ 片 1X 片 晶晶 晶 热. Hot addition addition operation Π Ink supply center has a high-rise conference break and a reduction due to strong structure. 1 氐 1/1 sheet crystal reduction rate thermal good addition of stoma 0 & supply center in the circle around T: -three-*-1 × chip crystal thermal addition common resistance electric heating plus σ ink supply The price of two inks for 110 is easy to accommodate this because of the cavity 0 g spray. , Can k) sex al work SS head Γ0 ink Γ C spurt the sound of a series of shadows: the fluent health is not produced, the image is also visible, and the sound of the sound is similar to the mutual D ink supply system. ο Yes. There are 〇 Avoidance tablets that need local avoidance can be crystallized and not hot. 11α 1 force piece to make large crystals to heat up. § A new kind of supply and delivery system § The main content of the case is clearly stated in the ink. The question is about the immediate use surface, and the structure of the inkjet inkjet seed is designed to be used for the supply of ink. Yang Yizhong's case includes the solution of the head ink spraying the upper body ink and spraying the ink into the ink tank. Including the two right and left exposed and filmed, the thermal moment of the crystal form is added to the upper body. Large, tie film, crystal layer hot wall plus barriers one by one define the crystal heat plus the layer wall and the water in the cavity, the number of crystals reheating and adding the side of the shunt section of the ink supply

Page 10 1224560 V. Description of the invention (4) A plurality of nozzle holes are provided for the plural and the heating crystal heating wafer, and the two ink supply ports are provided with a plurality of nozzle holes as described in the ink chamber, and the thickness is 20 Carry on the two bearing areas as described separately, as described in the loading area and the first piece, each ink sheet is set to determine the ink that passes the spray to the spray one plus the spray to 40 and the inkjet head that sprays the ink. The edge of the inkjet head in the load-bearing area is further provided with the inkjet head of the solder pad being long. If the length of the spray hole sheet exposes the solder pad, such as the length of the spray hole sheet, the second gap is wider than the width of the heated wafer. The width is large, and a plurality of spray holes are set at the phase water cavity. When the spray hole sheet is closed, the spray hole sheet and the exposed left and right sides define a first and a second ink supply port; The ink in the ink storage tank passes through the first and second ink supply channels and the plurality of ink chambers, and then passes through the inkjet medium. Ink head structure, wherein the heating wafer is opposed to each thermal resistor. The inkjet head structure of the ink head structure, wherein the barrier layer is micron. Ink head structure, wherein the first bearing area of the ink jet head support seat of the heating wafer and the nozzle hole water tank and the ink jet head structure of the third structure, wherein the first carriers are located on different horizontal planes. Structure, wherein the heating wafer is above and below the two sides of the structure, wherein the length of the heating wafer is longer than the structure of the inkjet head when the orifice plate is combined with the heating wafer ^ wherein the length of the heating wafer and the degree are substantially Are equal, and the nozzle plate has a first and a first, when the nozzle plate is combined with the heating wafer,

Page 11 1224560 V. Description of the invention (5) The pad is exposed at the first and second notches. The inkjet head structure as described above, wherein the nozzle plate is in a shape of “Η π.” In another aspect, the present invention provides an inkjet printing system, which includes: for accommodating ink; and is generally rectangular and has a plurality of numbers thereon. The plus side edge has one for the electrical connection of the flexible circuit board, a heating pad, a nozzle, an ink, and two sides. The nozzle is exposed to the inkjet cartridge when the nozzle is heated, and the wafer is heated in two holes. A carrier, the first carrier of the sheet is provided with a plus as described above, the carrier area has a width larger than that of the heating wafer, and a plurality of nozzle holes are provided at the resistor; and The inkjet comprising the heating wafer and the spraying first edge as described above and the exiting of the hole piece, the welding as described, such as the two indentations of the hole piece are set in the inkjet step. The inkjet length is 塾. The inkjet length of the inkjet is real, the current area and the second printing system, the thermal resistor. The printing system 'same as the horizontal printing system' welding. The printing system, the loading area. The heated wafer is opposite Each of the first bearing area and the tenth of the heating wafer has a longer length, and when the nozzle plate is combined with the heating wafer in a printing system, the nozzle plate is π Ηπ Form-printing system, wherein the length of the heating wafer is qualitatively equal, and the nozzle plate has a first and when the nozzle plate is combined with the heating wafer, the

Page 12 1224560 V. Description of the invention (6) The pad is exposed at the first and second notches. Another aspect of the present invention is to provide an inkjet printing system, which includes: a sheet for receiving ink; a sheet generally rectangular in shape, having a plurality of edges on both sides, and one for storage and heating welding of a flexible circuit board for electrical connection; Pad; a spray length on the loading seat, which prevents ink leakage by the heating. As stated in the platform. For example, the platform of the groove, such as the thermal barrier of the resistor cartridge, is at least one of a thermal wafer with an axial length greater than that of the heating chip and at least one of the nozzle holes is positioned in a bearing. The loading area is an inkjet printing system located at the periphery of the ink port of the ink cartridge, at least one of the wafer and the nozzle plate seals the ink port, wherein the loading area is a protruding inkjet printing system, wherein The loading area is an inkjet printing system with 0, wherein the nozzle plate is π Ηπ shaped. This case can be understood more clearly by the following drawings and examples. The drawings are briefly explained. The first picture: the inkjet head structure of the conventional art. The second picture: the inkjet head is assembled in the ink cartridge in the conventional art. The third picture: the structure of the inkjet head according to the first embodiment of the present invention. %

Page 13 1224560 V. Description of the invention (7) Figure 4: The case where the inkjet head is assembled in the ink cartridge according to the case. Fifth image: A partially enlarged view according to the fourth image. FIG. 6 is a three-dimensional disassembly view of an inkjet head package according to the present invention. FIG. 7 is a structure of an inkjet head according to a second embodiment of the present invention. Explanation of reference symbols 1 1 · Heating wafer 1 3: Nozzle 1 1 1: Welding pad 1 3 1: Nozzle 21: Inkjet head holder 31: Heated wafer 3 3: Nozzle 3 3: Heated wafer Exposed 3 2 1: Ink cavity 3 3 2: First notch 4: Ink cartridge body 4 1 1 First carrying area 4 1 3: Groove 1 2: Barrier layer 1 1 0: Ink supply port 1 2 1: Ink cavity 2: Ink cartridge body 2 2: Bottom hole 3 2: Barrier layer 31 1: Pad surface 314: Heating wafer exposed surface 3 3 1: Nozzle hole 3 3 3: Second notch 41: Inkjet head holder 412: No. Second load area 4 2: bottom hole

For the implementation, please see the third figure. The structure of the inkjet head according to the first preferred embodiment of the present invention is mainly composed of a heater IC 3 1, a barrier layer 32 and a spray L chip ( Nozzle plate) 33 Group 1224560 V. Description of the invention (8). The heating wafer 3 1 is substantially rectangular, and has pads 3 1 1 at the upper and lower edges. The barrier layer 3 2 is formed on the heating wafer 3 1, and together with the heating wafer 3 1, an ink supply channel and a plurality of ink chambers 3 2 1 are defined. The heating wafer 3 1 is provided with a heating resistor (not shown) at each of the ink chambers 3 2 1. The nozzle holes 3 3 are approximately πΗ, in a zigzag shape, and a plurality of nozzle holes 3 3 1 corresponding to the ink chamber 3 2 1 are provided above the nozzle holes 3 3. The feature of this case is that when the barrier layer 32 is formed on the heating wafer 31, the left and right side heating wafers 3 1 3 and 3 1 4 are exposed (meaning that the barrier layer 3 2 is generally "I" shaped), and sprayed. The width of the hole plate 3 3 is larger than that of the heating wafer 33. Therefore, when the nozzle plate 3 3 is combined with the heating wafer 31, the nozzle plate 3 3 and the exposed left and right sides that are not covered by the barrier layer 32 are heated. The first ink supply port (not shown) and the second ink supply port (not shown) will be jointly defined between the wafers 3 1 3 and 314. Since the thickness of the barrier layer 32 is 20 to 40 m, the height of the first and second ink supply ports is approximately 20 to 40 m. In this embodiment, the length of the heating wafer 31 and the length of the nozzle plate 3 3

The degree is substantially the same. 'In order to avoid the electrical connection between the heating wafer 31 and the spray hole piece 33, the spray hole piece 33 has a first notch 332 and a second notch 333. When the hole piece 33 is combined with the heating wafer 31, the welding can be exposed.塾 311. Referring to the fourth figure, the steps for assembling the inkjet head to the ink cartridge are as follows. First, the fine-fork pair of the nozzle holes 3 3 is located on the heating wafer 3 1 to form a

1C assembly (IC assembly); then use an adhesive to glue the IC assembly: on the inkjet head carrier 41 at the bottom of the ink E body 4, and then complete the assembly of the head. As shown in the fourth and fifth figures, the inkjet head has a first carrying area 4 i i and a knife for carrying a heating wafer and an orifice plate;

Page 15 1224560 V. Description of the invention (9) Load bearing area 41 2 On the horizontal plane, please see the sixth figure of the platform with grooves 4 1 3 grooves. The first load bearing area 411 and the second load bearing area 412 are located at different positions. Improve the sealability of ink and prevent ink leakage. Furthermore, the periphery of the first load-bearing area 411 and the second load-bearing area 412 can be provided with overflow or distribution of the adhesive, and of course, it can also have grooves and the grooves can accommodate the adhesive. Please refer to the third and fourth figures. When using this ink cartridge, the ink stored in the ink tank (not shown) in the ink cartridge body 4 first flows from the ink tank to the bottom hole 4 2 and then flows into the heating. The ink supply port between the wafer 31 and the nozzle plate 3 3, then enters the ink supply channel defined between the barrier layer 32 and the heating wafer 31, and then flows to the ink chamber 3 2 1, and finally uses a heating resistor The air bubbles are generated by heating, and the ink is squeezed out, and sprayed onto the inkjet medium through a plurality of nozzle holes, and sprayed onto the inkjet medium through the nozzle holes 3 3 1 on the nozzle hole sheet 3 3. The seventh figure shows the structure of the inkjet head according to the second preferred embodiment of the present invention, except that the length of the heating wafer 31 is longer than the length of the nozzle plate 33, so as to avoid the electrical connection between the heating wafer 31 and the nozzle plate 33. In addition, the rest is the same as the structure of the third figure, and is not repeated here. To sum up, the advantages of the inkjet head structure in this case compared with the conventional techniques are as follows: (1) The process of forming ink supply holes of the inkjet head does not require sandblasting or laser perforation process, so it can not only improve the production quality Rate, greatly reducing production costs. (2) The inkjet head structure in this case does not have a central ink supply hole, so there are no disadvantages such as cracks in heating wafers, cracking of heating wafers, and low structural strength that conventional techniques face, which helps to improve product yield.

Page 16 1224560 V. Description of the invention (ίο) (3) The two rows of heating resistors on both sides of the heating chip are provided with individual ink supply ports, and the ink supply is relatively smooth, which can reduce the problem of fluid crosstalk (cr 〇ss-ta 1 k). Thus, the working performance of the inkjet head is improved. (4) The central area of the heating wafer can be used to make IC circuits, so the size of the heating wafer can be greatly reduced, and the cost of heating the wafer can be reduced. Therefore, the inkjet head structure provided in this case has the characteristics of simple production, good product yield, reduced size, and low cost, and can avoid the disadvantages encountered in the conventional art. It is a novel, progressive and practical invention.提出 Apply according to law. This case has to be modified by anyone who is familiar with this skill

Page 17 1224560 Schematic illustration of the first picture: the structure of the inkjet head of the conventional art. The second picture: the inkjet head is assembled in the ink cartridge in the conventional art. Third figure: Structure of an inkjet head according to the first embodiment of the present invention. Figure 4: The case where the inkjet head is assembled in an ink cartridge according to the present case. Fifth image: A partially enlarged view according to the fourth image. FIG. 6 is a three-dimensional disassembly view of an inkjet head package according to the present invention. FIG. 7 is a structure of an inkjet head according to a second embodiment of the present invention.

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Claims (1)

1224560 VI. Scope of patent application1. An inkjet head structure for spraying ink from an ink tank ink tank onto an inkjet medium. The inkjet head structure includes: a heating wafer, generally rectangular; A barrier layer is formed on the heating wafer and exposes the left and right sides of the heating wafer, wherein the barrier layer defines an ink supply channel and a plurality of ink chambers on the heating wafer; and an orifice plate having a width It is larger than the width of the heating wafer and is provided with a plurality of nozzle holes relative to the plurality of ink chambers. When the nozzle plate is combined with the heating wafer, the nozzle plate and the exposed left and right sides heat the wafer. A first and a second ink supply port are defined together; thereby, the ink in the ink tank of the ink cartridge passes through the ink supply runner and the plurality of ink chambers through the first and second ink supply ports, Further, the plurality of nozzle holes are sprayed onto the inkjet medium. 2. The inkjet head structure according to item 1 of the application, wherein the heating wafer is provided with a heating resistor with respect to each ink chamber. 3. The inkjet head junction & structure according to item 1 of the patent application scope, wherein the barrier layer has a thickness of 20 to 40 microns. " 4. The inkjet head structure according to item 1 of the patent application scope, wherein the heating wafer and the nozzle hole sheet are respectively carried on the first bearing area and the second bearing area of the inkjet head bearing seat of the ink cartridge. 5. The inkjet head structure according to item 4 of the patent application, wherein the first bearing area and the second bearing area are located on different horizontal planes. 6. The inkjet head structure according to item 1 of the patent application scope, wherein the upper and lower sides of the heating wafer are further provided with solder pads. 1224560 VI. Application for patent scope 7 · If the inkjet head structure of the patent application for item 6 is adopted, wherein the length of the heating wafer is longer than the length of the nozzle plate, and when the nozzle plate is combined with the heating wafer The solder joint is exposed. 8. If the inkjet head structure according to item 6 of the patent application scope, wherein the length of the heating wafer is substantially equal to the length of the nozzle plate, and the nozzle plate has a first and a second gap, when the When the spray hole sheet is combined with the heating wafer, the solder pad is exposed from the first and second notches. 9. The inkjet head structure according to item 1 of the patent application scope, wherein the nozzle hole sheet is in a shape of πΗ ". 10. An inkjet printing system, comprising: an ink cartridge for containing ink; A heating wafer is generally rectangular, has a plurality of heating resistors thereon, and has pads for electrical connection of the flexible circuit board at the edges of both sides; an orifice plate, the width of which is larger than the width of the heating wafer And a plurality of spray holes are provided for the plurality of heating resistors; and a bearing base, which includes a first load area and a second load area for carrying the heating wafer and the spray hole piece, respectively, wherein the heating is performed therein The first one includes the heating 1 1. A heating resistor is provided at each ink cavity of the inkjet printing system wafer according to item 10 of the patent application scope. 1 2. The inkjet device is according to item 10 of the patent application scope. The printing system bearing area and the second bearing area are located on different horizontal planes. 3. For example, the pads on the upper and lower sides of the wafer of the inkjet printing system, such as the item 10 of the patent application scope, are further provided with solder pads. Page 20 1224560 VI. Application for patent scope 1 4 · If the inkjet printing system for the patent application No. 13 scope, the length of the heating wafer is longer than the length of the nozzle plate, and when the nozzle plate and the nozzle plate This solder pad is exposed when the wafer is bonded by heating. ί 5. If the inkjet printing system of item 13 of the scope of patent application, wherein the length of the heating wafer and the length of the nozzle plate are substantially equal, and the nozzle plate has a first and a second gap, 俾When the spray hole sheet is combined with the heating wafer, the solder pad is exposed from the first and second notches. 16 · The inkjet printing system according to item 10 of the patent application scope, wherein the nozzle plate is π Ηπ. 1 7. An inkjet printing system comprising: An ink storage unit to hold the ink; a heating wafer, generally rectangular, having a plurality of heating resistors, and pads on both sides for electrical connection of the flexible circuit board; an orifice plate, It has at least one axial length greater than the length of the heating plate, and at least one of the heating wafer and the nozzle plate is positioned on a bearing seat, wherein the bearing area is located around the ink port of the ink cartridge, by At least one of the heating wafer and the spray hole sheet seals the ink port to prevent ink leakage. 18. The inkjet printing system according to item 17 of the patent application scope, wherein the bearing area is a protruding platform. 19. The inkjet printing system according to item 17 of the patent application scope, wherein the bearing area is a platform with a groove. 2 0. The inkjet printing system according to item 17 of the patent application, wherein the nozzle holes Page 122424560 Page 22