TWI220889B - Process for assembling inkjet printhead - Google Patents

Abstract

The present invention relates to a method for assembling an inkjet printhead. Firstly, a barrier layer is formed on a heater IC but exposes portions of the heater IC on the both side in the width direction such that the barrier layer defines a plurality of ink channels and a plurality of ink chambers along with the heater IC. Then, a nozzle plate having a plurality of nozzles is provided, wherein the width of the nozzle plate is greater than that of the heater IC. Then, the nozzle plate is coupled with the heater IC so as to form an IC assembly, wherein the plurality of nozzles are disposed corresponding to the plurality of ink chambers, and the nozzle plate defines a first ink slot and a second ink slot along with the exposed portions of the heater IC. Then, a supporting base having a first portion and a second portion is provided, and adhesive is coated on the first and the second portions. Afterwards, the IC assembly is boned to the first and the second portions and fixed on the supporting base. In such way, the ink contained in the ink reservoir of an ink cartridge can be prevented from leaking.

Description

1220889

TECHNICAL FIELD The present invention relates to a method for packaging an inkjet head. Prior technology With the gradual development of personal computers, ink printers (ink = A ρ β = $ to, or even all walks of life. The main inkjet printers.

,,,, account for the talent. Low cost, low noise during operation, and excellent print f, and J

It can be printed on various carriers, such as ordinary paper, Xiaoshu inkjet printing paper, photo paper and special slides. 1. A mechanism for controlling the inkjet head (prlnthead) to release ink droplets to the inkjet media. One of the important factors to consider when designing an ink cartridge. Generally speaking, the inkjet head ejects ink droplets mainly in two types: a thermal bubble type and a piezoelectric piezo type. Taking a thermal bubble type inkjet head as an example, its operation principle is to use a heater resistor to heat it to generate air bubbles, thereby squeezing out the ink, and spraying it to the inkjet medium through a plurality of whistle holes. '

As shown in the first figure, the structure of the conventional inkjet head is mainly composed of a heating wafer 11, a barrier layer 12 and a nozzle plate 13. The heating wafer n is generally known to those skilled in the art ′, which is a wafer having a resistance heater, and for the sake of convenience, it is hereinafter referred to as a heating wafer (h e a7 e r I C). The heating wafer 11 includes an ink supply slot (10) provided in the center, a set of heating resistors (not shown) surrounding the ink supply port, and contact pads 111 on both sides of the heating wafer. A plurality of ink chambers (inks) are formed in the barrier layer 12

Page 10 1220889 " Year Case No. 92109666, Description of Invention (2)

Chamber) 121, and the barrier layer 12 is an ink channel (not shown) on the heating wafer n. The nozzle holes 13 :, β should be in the nozzle holes 1 3 1 of the ink chamber 1 2 1. 'There are several pairs. Please see the second figure. The method of packaging the inkjet head in the ink cartridge is as follows. First make the orifice sheet

The precision pair is located on the heating chip U 'to form an IC and a piece (M WatOU ΓΓ electric bir is followed by the most chip. After the piece is electrically connected to the circuit soft board for the input and output signals of the wheel, after the defect, the adhesive is used to The inkjet head carrier 21 at the bottom of the Ic group Kuang body 2 is finished, two :: two work. Please look at the first-and second ®, when using this Λ Guangshi stored in the ink cartridge body 2 to store black; The water tank can be stored daily. ^^ „, k Γ; Γ: 01; for the black port 1 1 η ^ ^ The receiver flows into the heating wafer 11 in the center of the black nibble, five weeping, into the early wall layer 12 2 on the heating wafer The supply 定义 defined in 11 is equal to the ink chamber m. Finally, the ink is ejected by using the spray iuil heated by the heating resistor, and the ink is ejected to the inkjet medium through the nozzle 131 on the nozzle sheet 13. The method of packaging the inkjet head faces the following problems: The sand blasting process ^ it i wafer 11 central ink supply port 110 steps are usually used, where the cleanliness of the sand blasting process is relatively easy to make the heating wafer limit consideration, Furthermore, 'this step is likely to cause heating of the wafer and thus cause normal operation in subsequent processes. , So that the inkjet head can not be ^ I > has the strength of Nakamoto T-711Λ, so the breaking machine: Ergu, the heating wafer 11 has a weakened structure ... -two -... Lowered; secondly, heating the crystal

1220889 Amended case number 9210% fifi 5. Description of the invention (3) The two rows of heating resistors on both sides share the same fluid; the phenomenon of steam and ink irregularities is 1, and it is easy to produce ground shadows = the two inkjet cavities interact with each other Edge = spray = Furthermore, in order to make the central ink supply port 110, the heating wafer 11 inevitably needs to have a relatively large size, which greatly increases the cost of manufacturing the heating wafer. Third, because the inkjet head carrier 21 is generally a flat surface, so in order to ensure that the 10 components are effectively adhered to the nozzle w and provide good sealing, the inkjet head carrier 21 on; the cloth contains Daqianwei's adhesive 23, which increases the packaging cost of the inkjet head. Another method of packaging the inkjet head is to use Tape Automated Bonding (TAB). First, a circuit is made on a conductive trace j & roll T (tape), and then a 7-person circuit board is used at a predetermined position on the flexible circuit board; 311; The way to form the nozzle hole is to make the heating wafer's addition in lean alignment mode. It corresponds to the nozzle hole 3U-one, so that it is combined with the soft circuit ^ resistance factory (not shown as a TAB assembly); finally On the board, the shape is glued to the inkjet head bearing seat of the ink cartridge body 32. The inkjet head shown in Figure 4 of the TAB group is packaged. The Si7 fancheng uses the tape automatic bonding technology. Encapsulating inkjet to animate the encapsulation effect, but in practice faces many problems: The cost of forming the spray hole by the hole method is very high; lack: capacity = say 'remaining carbides, which are detrimental to print quality. F When the nozzle hole is not well made, it must be combined with the soft shape'. Therefore, the cost is quite high; furthermore, this method needs to be scrapped,

Accuracy (requires 1220889 case number 92109666 V. Description of invention (4)

Correction: It is necessary to set the nozzle hole and the pad 1 1 of the heating chip and the flexible circuit at the same time, so that both the cost of heating the wafer and the production cost of the heating chip are quite high. The main purpose of the control cost and production case is to have another purpose of the central ink supply case. The automatic joining technology project on the one hand is to provide a packaged ink jet head and a packaged ink head. The barrier layer is a water cavity; the width is larger than the combined area of the ink chip, the thermal wafer has a bearing area, and the bearing area is glued to the ink. The heating wafer is said to be the invention, the package, the package, the tape, and the nozzle holes defined on the right side of the following steps are large; in this case, the multi-layer is adhered to a second ink head bearing so that the second one is set as a plus Step · Add a part of the ink-supply sheet, the nozzle holes, and the left ink-supply port carrier, and the agent; and the thermal resistor described in the heating crystal bearing area, a barrier thermal wafer path, and re-injection. Holes are attached to the right side; the chip and the method are provided. The conventional system is provided with a package spray for a layer formation, and the plurality of thermal wafers of the plurality of ink hole sheets are provided with the first component nozzle hole sheet to prevent leakage of the ink jet head. The question on the square of the question head and the supply method has the same definition as the heating and the second question on the second method of the second inkjet head. Method, in which a wide-wafer assembly of a plurality of wafers is exposed, and a first load-bearing area, a load-bearing seat, a load-bearing solution, and a solution include a left common spray hole degree, and the spray holes On, and relative to each ink chamber

Page 13 1220889

The method is as described above, wherein the barrier layer has a thickness of 20 to 40 m. Different: where the first-bearing area and the second-bearing area are located in the step of the method 'where the upper and lower sides of the heating wafer are advanced-long production 2 Ϊ f: method, where the length of the heating wafer and the spray == 上相 # of the hole sheet, and the spray hole sheet has -first- and -second notches, and when combined with the heating wafer, the -and-second notch electroforming i ::: method, wherein the The plurality of nozzle holes on the nozzle plate are loaded with a seat ϊ Ξ: ί The step in which the wafer component is glued to the inkjet head holder is performed using a compression jig. The following another aspect provides a method for packaging an inkjet head, which includes: providing a wafer assembly, the wafer assembly is composed of a barrier layer, a nozzle plate with pre-made nozzle holes, and heating the wafer; The width of the nozzle is larger than that of the Hi: ink cavity and the lateral ink supply port, in which the nozzle hole has a greater visibility on the second day, and an inkjet head having a first bearing area and a second bearing port is provided. A carrier seat, and in the first bearing area and the first: the carrier: the agent; and the wafer component is glued to the nozzle ink head to carry: and the and the orifice plate are respectively positioned in the first-try 'where The heated wafer is relatively

--i 的 方法 __ ^ The barrier layer has a thickness of 20 to 40 microns Page 14 1220889

4 The second load-bearing area and the second load-bearing area are located in the nozzle holes, and the plurality of nozzle holes are performed by a sheet assembly. The length of the inkjet wafer assembly is composed; the area of the nozzle is the method of gluing the inkjet head holder, and its inclusions are made up of-having a plurality of, the nozzle plate has at least a periphery with a bearing area ; And a heated platform with the heating. A grooved case No. 92109666 V. Description of the invention (6) The method as described above, wherein the horizontal planes are different. As described, it is formed by electroforming. As described in the method, the step on the carrier is to use another aspect of the present case is the following steps: the length of the heating crystal provided in a crystal heating resistor is greater than that of the ink cartridge, wherein the carrier wafer and the nozzle plate are sealed The method as described, the method as described, Taiwan. The method as described, wherein the crystal-compression jig is provided with a cover sheet assembly, and the area of the sheet and an injection hole heating wafer is located at the ink port. Wherein, the bearing, wherein the bearing is in the form of "H", the solution can be explained by the following drawings and examples, which is clearer and simpler. Ⅱ: Inkjet technology头 结构。 Head structure. The feeling of the agent A method of packaging the ink head in the art. shape. Figure: The method of packaging the ink head of the knowing technique. Page 15 1220889 _Case No. 92109666,} April, 2014. $, Revised__ Explanation of the invention (7) Fourth figure: Another kind of packaging in the conventional technique Method of inkjet head. Fifth Figure ... An ink jet head structure suitable for use in a method of packaging an ink jet head according to the present invention. FIG. 6 shows a case where the ink jet head according to the present invention is packaged in an ink cartridge. Figure 7: A partially enlarged view according to Figure 6. FIG. 8 is a view showing a state in which an adhesive is applied when the inkjet head is packaged according to the method of the present invention. Ninth figure: A three-dimensional disassembly view of an inkjet head package according to the present invention.

Icon symbol description

11: 1 heating wafer 12: barrier layer 13:: nozzle hole 11 0: ink supply port 111: solder pad 1 2 1: ink cavity 131: nozzle hole 2: ink cartridge body 21 inkjet head holder 2 2: bottom Hole 23 Adhesive 30: Tape 31 Nozzle 3 3 11: Nozzle 32 Ink cartridge body 51: Heated wafer 52 Barrier layer 5 3: Nozzle piece 511: Solder pad 513: Heated wafer exposed surface 514: Heated wafer exposed surface 5 2 1: Ink chamber 531: Nozzle 5 32: First notch 533: Second notch 6: Ink cartridge body 61: Inkjet head holder 6 11: First bearing area

Page 16 1220889

6 1 3 ·· groove 6 3: adhesive 6 1 2: second bearing area 6 2: bottom hole Embodiment 1 Please refer to the fifth figure, which is applicable to the soil jet head according to the method for packaging the ink jet head according to the present invention, The mouth structure is mainly composed of a heater chip 51, a barrier layer 52 and a nozzle plate 53. The heating wafer 5 1 is substantially moment-%, and has pads 1 on the upper and lower sides. The barrier layer 52 is formed on the heating wafer 51, and an ink supply channel and a plurality of ink chambers 521 are defined on the heating wafer 51 together. The heating wafer 设 is provided with a heating resistor (not shown) at each of the ink chambers 521. The nozzle holes 5 3 are generally in the shape of “η”, and the Japanese beans are ancient, such as, the nozzle holes 531 of 1521. In this embodiment, the lengths of the nozzle holes 53 of the heating wafer 51 are substantially the same. In order to prepare for the length τ, the beeper has sought to avoid the electrical connection of the heater chip 51 and the nozzle holes 53. 53 has a first gap 532 and a second gap 33 '俾 When the nozzle hole 53 is combined with the heating wafer 51, the solder pad can be exposed which is not shown in the fifth figure. The structure of the inkjet head is characterized in that when the barrier 5 is formed When heated on the wafer 51, the left and right sides of the wafer will be exposed to heat and 514 (meaning that the barrier layer 52 is generally "Γ"), and sprayed = ίϋΓΓϊ The wafer 51 is large, so when the nozzle hole 53 and the heating When the wafer 51⑽s, the nozzle holes 53 and the exposed left and right side portions not covered by the barrier layer 52 heat the wafers 513 and 514 to jointly define the first black supply port and the second ink supply port (not shown). Layer 52: the degree is 20 to 4G microns, so the height of the first and second ink supply ports is about 20.222889

t 92109fiftR, invention description (9) to 40 microns. Furthermore, the blackheads' of the main body 6 of the thousand-head structure m as shown in the sixth and seventh figures are special inkjets of the present case, which are used to carry the heating wafer and the nozzle hole holder 61, and are also designed to have a sub-area 612. The first bearing area 611 and the second bearing of the film will further explain the method according to the present inkjet head, which includes the following steps: The first embodiment is packaged into a package (for example, with pre-made nozzle holes (such as by electroforming or The nozzle plate 51 is protected by the laser method); ~ Hada Ayano is A-shaped (b)-the barrier layer 52 is formed on the heating wafer 51, and the ink supply channel and a plurality of ink supply channels are the same as those of Jahba Ink cavity 521; ',', (c) Precisely position the nozzle plate 5 3 ^^ Said μ., Τρ, * 耵 are located on the heating wafer 51 to form an IC assembly; 乂 (¢ 1) ¼ Supply the body as shown in the sixth figure, and apply ink to the first bearing area 611 and the ink head bearing seat 61; apply the adhesive on the war dagger 611 and the second bearing area 612. (e) The wafer assembly Glue to the spray, r 1. Becha head support seat 6 1, so that the wafer chip 5 1 and the nozzle hole 53 are respectively positioned at the same position, so that Shijia has long been in the first bearing area 6 丨Zone 1 and Zone 612. Of course, this step can also be performed by Wei Tanyi. It is equipped with a suitable jig pressing piece to improve the sealing performance and make it dark. The first and second notches 532 and 533 can be entered from the inside of the ink cartridge body 6 without leaking. Of course, the above step ⑷ can be performed before / after step ⑻, and step (c) can be performed at Step (d) is performed before / after.

Please refer to the eighth figure, because the first bearing area 611 and the second bearing area 612 of the inkjet head carrier 61 are located on the horizontal plane, not only can effectively support 1220889, ie, correction number 92109666. V. Description of the invention (1〇)- The heating wafer +51 and the spraying sheet 53 and the application range of the spotting agent 63 can be appropriately reduced, thereby reducing the packaging cost. Figure 9: The periphery of the load-bearing area 611 and the second load-bearing area 612 may have a groove 61 for the adhesive to overflow or distribute. Of course, a grooved platform may also be provided, and the groove can accommodate the adhesive 63. Please look at the fifth and sixth figures together. When the blackhead is sealed by the present invention, the wings and soil i are stored in the ink tank (not shown) in the ink s body 6 from the hole 6! The supply between the wafer 51 and the "chip 53" ▲ enters the ink supply channel defined between the barrier layer 52 and the heating wafer 51, and then flows through the ink f cavity 521. Finally, the heating resistor is used to heat and ink to make the ink. The heart rate gasifies, and then sprays onto the inkjet media. Then through the nozzle holes 531 on the beaker piece 53 In summary, the method of packaging the inkjet head in this case is compared with the heating chip package of the central inkjet hole of the appliance. The advantages of the inkjet head are as follows-make wear Λ-j 本 = into the ink supply hole of the ink head without sand blasting or laser 2; go: can improve production yield, but also greatly reduce production = cost. There are no shortcomings such as the heating wafer that the conventional technology faces, such as cracks in the heating rate, fracture of the heating wafer, and low structural strength, which can help improve the product port. (B) The two rows of heating resistors on both sides of the wafer have individual ink supply. The ink is relatively smooth, which can reduce the problem of fluid crosstalk (cr〇ss_taik). The working performance of the head. In addition, 'the central area of the heating wafer is available ^ η:' Therefore, the size of the heating wafer can be greatly reduced, thereby reducing the cost of adding Japanese and Japanese wafers. 3.) The range of coating agent coated on the inkjet head carrier is reduced, Can also confirm page 19 1220889

Page 20 1220889 _Case No. 92109666_ 气 Λ 年 \ 月 ^ 月 Correction_, the diagram is briefly explained. The first picture: the inkjet head structure of the conventional art. -Second picture: a method of packaging inkjet head in the conventional art. The third picture: the case of applying the adhesive by the method of packaging inkjet heads in the conventional art. Figure 4: Another method of packaging inkjet heads in the conventional art. Fifth figure: Structure of an ink jet head suitable for use in the method of packaging an ink jet head according to the present invention. Sixth Fig. · A case where the ink jet head according to the present invention is packaged in an ink cartridge. Figure 7: A partially enlarged view according to Figure 6. FIG. 8 is a view showing a state in which an adhesive is applied when the inkjet head is packaged according to the method of the present invention. Ninth figure: A three-dimensional disassembly view of an inkjet head package according to the present invention.

Page 21

Claims (1)

1220889 6. Please apply for the patent scope i · / A method for packaging an inkjet head, which includes the following steps: forming a barrier layer on a heating wafer, exposing a component wafer to heat the wafer, and making the barrier layer and the = 2 Then the flow channel and a plurality of ink chambers; ... said that the film /, the same as the ink supply provides a nozzle plate with a plurality of nozzle holes, which is larger than the width of the heating wafer; The nozzle hole sheet is combined with the heating wafer to form a wafer group = a plurality of nozzle holes are opposite to the ink chambers, and the 加热 :: left and right sides of the heated wafer are jointly defined-第 ″ ί- The first is to provide an inkjet cartridge bearing base with a first-bearing region & a second bearing region, and apply an adhesive on the first and second bearing regions; The ink head carrier is positioned so that the heating chip and the nozzle sheet are respectively positioned on the first bearing region and the second bearing region to prevent ink leakage. Wherein the heating wherein the barrier is among the first 0 where the heating is among the heating 2. As in the method for encapsulating the inkjet head in the first scope of the patent application, the chip is provided with a heating resistor at each ink cavity. 3. The method for packaging an inkjet head according to item i of the patent application, wherein the thickness of the layer is 20 to 40 microns. 4 · If the method of packaging the inkjet head is covered by the first item of the patent application, the bearing area and the second bearing area are located on different horizontal planes. Further set the pads. • If the method of encapsulating the inkjet head in the first scope of the patent application, Page 22 6. The scope of the patent application wafer, the length is substantially equal to the length of the nozzle plate, and the nozzle plate has a first and a second notch. When the nozzle plate is combined with the heating wafer, , The solder pad is exposed from the first and second notches. Wherein the nozzle hole wherein the nozzle hole is pressed together, the first is the first, and the first is the method of packaging the inkjet head as described in the first patent application. The film system is πΗ " shape.彳 8. If the method of encapsulating the inkjet head according to item 1 of the patent application, the plurality of nozzle holes on the chip are formed by electroforming. / 9 · If the method of encapsulating the inkjet head in the first item of the scope of the patent application, Dan Tau listen to the steps of the two components glued to the inkjet head carrier by pressing the jig. 1 〇. If the scope of the application for the scope of the patent application of the first method of packaging the inkjet head and the second loading area is a protruding flat two \ u. If the scope of the scope of the application for the patent application 丨 method of packaging the inkjet head And the second supporting region is a flat surface having a trench. 12. A method of packaging an inkjet head, comprising the following steps: a sheet and a piece, the gastric chip assembly is composed of-a barrier layer,-a thermal crystal t, and an orifice sheet of an orifice and collectively defines the ink supply flow And the ink supply σ, wherein the width of the nozzle plate is larger than that of the heating head and the carrier area of the inkjet head carrier and the second carrier area, and the coating is adhered to the carrier area and the second carrier area. And the cymbal sheet assembly is glued to the inkjet head carrier so that the heating sheet and the hole sheet are positioned at the first-bearing region and the second bearing region, respectively. Page 23Ϊ220889 -mk .Q2109666 MainΗ 6 7 i 3. As the patent application scope of the 12th package inkjet head, the chip is provided with a plus resistor J wall relative to each ink cavity. Λ 申 Λ 专 / J The square V soil layer of the range No. 12 encapsulated inkjet head has a thickness of 20 to 40 microns. For example, if the bearing area of the inkjet head in the 12th area of the patent application and the second bearing area are located on different water surfaces, if the application is in the 10th area of the patent scope, please enclose it. Among them, the first, the spray, the spray, and the first-bearing area and the second-bearing area are prominent: the second method 'wherein the same as in the patent application No. 12 package inkjet head. 18 Chengruzai Shenshen Area Λ The second loading area is flat with grooves 1. As shown in the patent application No. 12 of the package, the spray-drying orifice plate is in the shape of “Η,”. The method of chanting '1 9 · If the multiple nozzle holes on the black hole film of the package No. 2 of the patent application are applied by electroforming, ^ -shaped method, 20. If the patent No. 12 of the patent scope, the seal / square chip component is glued to the nozzle. The ink head has a master method, in which the tool is used. The above steps are using a compression method 21 · —a method of packaging the inkjet head, providing H ^ &, including the following steps. Day-to-day wafer assembly, the wafer cylinder will be a heating chip of the resistor and a spray hole, and the length of the heating wafer is greater than the length of the heating wafer with a plurality of heating power: Cheng, the nozzle hole at least-axially provided An ink cartridge with a bearing area, the periphery of the i-port; and the eighth-bearing area is located at the ink sealing the ink port with the heating wafer and the nozzle hole. 页 Page 1212889 Amendment No. 92109666 VI. Application Patent Scope 2 2 .If the method of encapsulating the inkjet head in the 21st scope of the patent application, The bearing area is a protruding platform. 2 3. The method for packaging an inkjet head according to item 21 of the patent application scope, wherein the bearing area is a platform with a groove. 2 4. If the patent scope is applied Item 21: A method for packaging an inkjet head, wherein the orifice plate is πππ shaped. Page 25