TW223731B - - Google Patents

Info

Publication number
TW223731B
TW223731B TW080106565A TW80106565A TW223731B TW 223731 B TW223731 B TW 223731B TW 080106565 A TW080106565 A TW 080106565A TW 80106565 A TW80106565 A TW 80106565A TW 223731 B TW223731 B TW 223731B
Authority
TW
Taiwan
Application number
TW080106565A
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Application granted granted Critical
Publication of TW223731B publication Critical patent/TW223731B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW080106565A 1990-08-08 1991-08-19 TW223731B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2208239A JP2855824B2 (ja) 1990-08-08 1990-08-08 プリント配線板の孔明け加工法

Publications (1)

Publication Number Publication Date
TW223731B true TW223731B (zh) 1994-05-11

Family

ID=16552963

Family Applications (1)

Application Number Title Priority Date Filing Date
TW080106565A TW223731B (zh) 1990-08-08 1991-08-19

Country Status (6)

Country Link
US (1) US5082402A (zh)
EP (1) EP0470757B1 (zh)
JP (1) JP2855824B2 (zh)
KR (1) KR100225273B1 (zh)
DE (1) DE69106625T2 (zh)
TW (1) TW223731B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304351B2 (en) 2005-06-13 2007-12-04 Au Optronics Corporation Active matrix substrate
TWI503191B (zh) * 2009-06-01 2015-10-11 Mitsubishi Gas Chemical Co 鑽孔用蓋板

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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AU658320B2 (en) * 1992-08-20 1995-04-06 Shell Internationale Research Maatschappij B.V. Copolymer compositions comprising a copolymer and one or more lubricating additives
JP2828129B2 (ja) * 1993-06-07 1998-11-25 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
US5507603A (en) * 1993-08-05 1996-04-16 Dai-Ichi Kogyo Seiyaku Co., Ltd. Method for drilling thru-holes on a lamination substrate and a sheet used therein
US5785465A (en) * 1996-07-30 1998-07-28 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5961255A (en) * 1996-07-30 1999-10-05 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5984523A (en) * 1998-02-03 1999-11-16 International Business Machines Corporation Method for recording the heat generated in a hole wall of a substrate during a drilling operation
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6200074B1 (en) * 1999-04-07 2001-03-13 James J. Miller Method for drilling circuit boards
JP4342119B2 (ja) 2000-04-06 2009-10-14 株式会社神戸製鋼所 孔開け加工時の保護用あて板及びそれを使用したプリント配線基板の孔開け加工方法
SG115399A1 (en) * 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
JP4798327B2 (ja) * 2000-09-14 2011-10-19 大智化学産業株式会社 小径孔あけ加工用あて板
JP4968652B2 (ja) 2001-07-17 2012-07-04 日本合成化学工業株式会社 プリント配線基板穿孔用水分散性樹脂組成物、該組成物よりなるシート及びかかるシートを用いたプリント配線基板の穿孔方法
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
JP3976228B2 (ja) * 2001-11-09 2007-09-12 日本合成化学工業株式会社 プリント配線基板穿孔用シート及びかかるシートを用いたプリント配線基板の穿孔方法
JP3976233B2 (ja) * 2001-12-18 2007-09-12 日本合成化学工業株式会社 プリント配線基板穿孔用シート及びかかるシートを用いたプリント配線基板の穿孔方法
US20030129030A1 (en) * 2002-01-04 2003-07-10 Jja, Inc. Lubricant sheet and method of forming the same
US8062746B2 (en) * 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
CN100348411C (zh) * 2004-04-13 2007-11-14 叶云照 钻孔润滑铝质复合材料
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
CN100478131C (zh) * 2006-04-11 2009-04-15 合正科技股份有限公司 高速钻孔用散热辅助板材
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
WO2008040071A1 (en) * 2006-10-05 2008-04-10 Waratek Pty Limited Contention detection
WO2008072930A2 (en) * 2006-12-15 2008-06-19 Bu Jin Hong Sheets for drilling
KR20080055264A (ko) * 2006-12-15 2008-06-19 홍부진 천공 가공용 쉬트
CN101878678A (zh) 2007-09-28 2010-11-03 三星层板有限公司 用于在印刷电路板中钻孔的改进系统和方法
JP4483929B2 (ja) * 2007-10-30 2010-06-16 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
TWI407854B (zh) 2007-12-26 2013-09-01 Mitsubishi Gas Chemical Co 鑽孔用蓋板之製造方法及蓋板
MY157756A (en) 2010-06-18 2016-07-15 Mitsubishi Gas Chemical Co Entry sheet for drilling
MY165940A (en) 2010-09-17 2018-05-18 Mitsubishi Gas Chemical Co Entry sheet for drilling
WO2013132837A1 (ja) 2012-03-09 2013-09-12 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート
US9826643B2 (en) 2012-03-21 2017-11-21 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and drilling method
KR102066302B1 (ko) 2012-03-27 2020-01-14 미츠비시 가스 가가쿠 가부시키가이샤 드릴 천공용 엔트리 시트
JP6206700B2 (ja) * 2013-03-28 2017-10-04 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法
US9358618B2 (en) 2013-07-29 2016-06-07 Globalfoundries Inc. Implementing reduced drill smear
CN106132646B (zh) 2014-03-31 2019-01-22 三菱瓦斯化学株式会社 钻孔用盖板
MY186196A (en) 2015-03-19 2021-06-30 Mitsubishi Gas Chemical Co Entry sheet for drilling and method for drilling processing using same
CN107428021B (zh) 2015-03-19 2019-06-18 三菱瓦斯化学株式会社 钻孔用盖板和使用其的钻孔加工方法
JP6315226B2 (ja) 2015-09-02 2018-04-25 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
EP3157310A1 (en) 2015-10-12 2017-04-19 Agfa Graphics Nv An entry sheet for perforating electric boards such as printed circuit boards
SG11201801162YA (en) * 2015-11-26 2018-03-28 Mitsubishi Gas Chemical Co Cutting method for fiber reinforced composite material
RU2018115306A (ru) 2016-02-17 2020-03-17 Мицубиси Гэс Кемикал Компани, Инк. Способ обработки резанием и способ изготовления обработанного резанием изделия
JP6369796B2 (ja) 2016-03-14 2018-08-08 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
WO2018088267A1 (ja) 2016-11-14 2018-05-17 三菱瓦斯化学株式会社 構成刃先形成用部材及び構成刃先形成方法
JP7057901B2 (ja) 2017-05-25 2022-04-21 三菱瓦斯化学株式会社 切削加工補助潤滑材、切削加工補助潤滑シート、及び切削加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2488676B1 (fr) * 1980-08-18 1986-03-28 Dacral Procede de traitement de toles prerevetues avant faconnage
JPS5780495A (en) * 1980-11-07 1982-05-20 Kao Corp Plastic working oil composition for metal
US4519732A (en) * 1983-12-09 1985-05-28 United Technologies Corporation Method for the machining of composite materials
JPS619439A (ja) * 1984-06-25 1986-01-17 Hitachi Chem Co Ltd 印刷配線板用プリプレグの製造方法
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304351B2 (en) 2005-06-13 2007-12-04 Au Optronics Corporation Active matrix substrate
TWI503191B (zh) * 2009-06-01 2015-10-11 Mitsubishi Gas Chemical Co 鑽孔用蓋板

Also Published As

Publication number Publication date
EP0470757A2 (en) 1992-02-12
DE69106625D1 (de) 1995-02-23
DE69106625T2 (de) 1995-05-18
KR100225273B1 (ko) 1999-10-15
KR920005676A (ko) 1992-03-28
US5082402A (en) 1992-01-21
JPH0492494A (ja) 1992-03-25
EP0470757A3 (en) 1992-06-24
EP0470757B1 (en) 1995-01-11
JP2855824B2 (ja) 1999-02-10

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees