TW220002B - - Google Patents

Info

Publication number
TW220002B
TW220002B TW081102503A TW81102503A TW220002B TW 220002 B TW220002 B TW 220002B TW 081102503 A TW081102503 A TW 081102503A TW 81102503 A TW81102503 A TW 81102503A TW 220002 B TW220002 B TW 220002B
Authority
TW
Taiwan
Application number
TW081102503A
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of TW220002B publication Critical patent/TW220002B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW081102503A 1991-07-09 1992-04-01 TW220002B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/727,829 US5212910A (en) 1991-07-09 1991-07-09 Composite polishing pad for semiconductor process

Publications (1)

Publication Number Publication Date
TW220002B true TW220002B (zh) 1994-02-01

Family

ID=24924248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081102503A TW220002B (zh) 1991-07-09 1992-04-01

Country Status (8)

Country Link
US (1) US5212910A (zh)
JP (1) JP3099209B2 (zh)
KR (1) KR100214163B1 (zh)
FR (1) FR2679067B1 (zh)
GB (1) GB2257382B (zh)
HK (1) HK66195A (zh)
IE (1) IE66126B1 (zh)
TW (1) TW220002B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
TWI513545B (zh) * 2011-11-29 2015-12-21 Nexplanar Corp 具有基礎層及拋光表層之拋光墊
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9889630B2 (en) 2009-03-06 2018-02-13 Bestac Advanced Material Co., Ltd. Polishing equipment having discontinuous adhesion points and method for making the sheet

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GB9203649D0 (en) 1992-04-08
GB2257382A (en) 1993-01-13
IE66126B1 (en) 1995-12-13
JP3099209B2 (ja) 2000-10-16
KR100214163B1 (ko) 1999-08-02
FR2679067A1 (fr) 1993-01-15
JPH05212669A (ja) 1993-08-24
US5212910A (en) 1993-05-25
HK66195A (en) 1995-05-12
GB2257382B (en) 1994-11-30
IE921103A1 (en) 1993-01-13
FR2679067B1 (fr) 1994-04-29
KR930003269A (ko) 1993-02-24

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