TW201928581A - A heat sink device with a flippable fan and a motherboard with the heat sink device - Google Patents

Abstract

A heat sink device with a flippable fan for dissipating a plurality of electronic components is disposed around a central processing unit (CPU). The heat sink device includes a heat sink, a fan frame, a rotation assembly and a control circuit. The heat sink has a plurality of heat dissipation areas, and each of the heat dissipation areas is used to conduct heat from at least one of the electronic components. The fan frame includes a plurality of fan modules, and the fan frame is disposed on the heat sink. At least one of the fan modules is disposed on each of the heat dissipation areas. The rotation assembly is connected to the fan frame to drive the fan modules to be flipped in an axial direction parallel to the upper surface of the heat sink. The control circuit detects an operation state of each of the electronic component and the CPU and controls the rotation assembly to flip the at least one of fan modules in the heat dissipation area.

Description

Heat sink with reversible fan and motherboard with heat sink

A heat dissipating device, especially a heat dissipating device having a plurality of reversible fans.

With the rapid development of technology, the application of computers is becoming more and more extensive, and the demand for computers is getting higher and higher. Especially for applications with complicated calculations and rapid response, such as e-sports, it is high in computer performance and better. Stability.

However, regarding the operation efficiency and stability of the computer, the main key lies in the operation of the motherboard, the central processing unit and the electronic components. The traditional manufacturer provides a high-end central processor to improve the overall operation of the computer. However, the central processor needs to operate. A large number of stable power supplies, so that a large amount of heat energy will be generated during the operation of the electronic components on the motherboard, and in serious cases, it will not easily dissipate outwards in the interior of the host, causing overheating and loss of the central processing unit and electronic components. Reduce operational efficiency.

For electronic components, such as power supply components, they generate a large amount of thermal energy during operation. Generally, metal heat dissipation plates and heat-conducting media are used, which conduct heat through contact with power supply components, and conduct heat to the heat dissipation plate to achieve heat dissipation. Thus, heat dissipation The presence or absence of airflow around the board surface will affect the efficiency of heat dissipation and will also affect the performance of the motherboard.

In addition, the fan module of the heat sink of the conventional central processor can be basically divided into two heat dissipation modes, wherein the wind direction of one fan flows downward from the heat dissipation plate to remove heat; the wind direction of the other fan is parallel circuit board. Flow in the direction to remove heat. Although the former can exclude the heat generated by some electronic components, the heat that can be eliminated is limited, so the heat dissipation effect is limited. In the latter case, for electronic parts, there is no wind flow that dissipates the heat generated by the electronic parts, so that the electronic parts continue to wear.

In view of the above problems, one or more embodiments of the present invention provide a heat dissipating device with a reversible fan for dissipating heat from a plurality of electronic components disposed around a central processing unit, the heat dissipating device including a heat sink and a fan assembly Rack, steering assembly and control circuitry. The heat sink has a plurality of heat dissipation zones, and each heat dissipation zone is used to conduct heat to the electronic components. The fan assembly includes a plurality of fan modules, and the fan assembly is disposed on the heat sink, and at least one fan module is disposed on each of the heat dissipation regions. The steering assembly is coupled to the fan assembly to drive the fan modules to flip in an axial direction parallel to the upper surface of the heat sink. The control circuit signal connects the electronic component, the central processing unit, the fan module and the steering component, and the control circuit detects the operating state of the electronic component and the central processing unit, and controls at least one fan module in the cooling zone of the steering component to be reversed according to the operating state.

In the above embodiment, the heat dissipation device with the reversible fan, in an embodiment, the control circuit comprises a control unit and a detection unit. The detecting unit is connected to the control unit, and the detecting unit detects at least one of the temperature and the clock of the electronic component and the central processing unit, and transmits the detecting signal to the control unit according to the detection result, and the control unit is configured according to each detecting signal. Corresponding to send the start signal to at least one fan module in the heat dissipation area to make it act. The control unit further transmits a flip signal to the steering assembly to drive at least one fan module to flip in the axial direction.

In one embodiment, the activation signal includes at least one of setting a rotational speed, a forward rotation, or a reverse rotation of the fan module.

In the above embodiment, the reversing signal includes setting a direction in which the steering unit drives the fan module to flip and an angle of inversion.

In the above embodiment, the heat sink with the reversible fan, in one embodiment, the steering assembly comprises a base, a connecting line and a steering motor, the base is disposed on the circuit board, the steering motor is connected with the fan frame, and the steering motor is connected The wire is connected to the base.

A motherboard includes a circuit board, a plurality of electronic components, a central processing unit, a heat sink, a fan assembly, a steering assembly, and a control circuit. The central processing unit and the plurality of electronic components are disposed on the circuit board. The heat sink is disposed on the electronic component and does not contact the central processor, and the heat sink has a plurality of heat dissipation zones. The fan assembly includes a plurality of fan modules, and the fan assembly is disposed on the heat sink, and at least one fan module is disposed on each of the heat dissipation regions. The steering assembly is coupled to the fan assembly to drive the fan modules to flip in an axial direction parallel to the upper surface of the heat sink. The control circuit signal connects the electronic component, the central processing unit, the fan module and the steering component, and the control circuit detects the operating state of the electronic component and the central processing unit, and controls at least one fan module in the cooling zone of the steering component to be reversed according to the operating state.

In the above embodiment, the control circuit includes a control unit and a detection unit. The detecting unit is connected to the control unit, and the detecting unit detects at least one of the temperature and the clock of the electronic component and the central processing unit, and transmits at least one detecting signal to the control unit according to the detection result, and the control unit is configured according to each detecting signal. And correspondingly transmitting the startup signal to at least one fan module in the heat dissipation area to make it act. The control unit further transmits a flip signal to the steering assembly to drive at least one fan module to flip in the axial direction.

In one embodiment, the activation signal includes at least one of setting a rotational speed, a forward rotation, or a reverse rotation of the fan module.

In the embodiment of the motherboard, in one embodiment, the flipping signal includes setting a direction in which the steering component drives the fan module to flip and an angle of flipping.

In the above embodiment, the steering assembly includes a base, a connecting line and a steering motor. The base is disposed on the circuit board, and the steering motor is coupled to the fan assembly. Turn the motor and connect it to the base via a cable.

The heat dissipating device with the reversible fan disclosed in the embodiment of the invention generates a large amount of thermal energy when the central processing unit and the electronic component are in operation, and detects the temperature of the central processing unit and the electronic component through the control circuit, and controls the operation of the fan module correspondingly. To maintain the temperature and stability of the motherboard, electronic components and CPU, to maintain the performance and stability of the motherboard. The control circuit also controls the steering component so that the fan module can be flipped according to one axis, and the fan module has different angles of turning, and the generated wind flow is different, and the heat generated by the electronic component or the central processor can be timely dissipated. In addition, the fan module can also be partitioned and operated to dissipate heat for specific electronic components, thereby effectively achieving the above-mentioned performance and stability of the motherboard (electronic components, central processing unit).

Please refer to FIG. 1A to FIG. 1C , which are schematic diagrams showing an embodiment of a heat dissipating device with a reversible fan according to an embodiment of the present invention. The heat dissipating device 100 is configured to dissipate heat from a plurality of electronic components 4 disposed around the central processing unit 7. The heat dissipating device 100 includes a heat sink 1, a fan assembly 20, and a steering assembly 5 (see FIG. 2A to FIG. 2B) and control circuit 3. The heat sink 1 can conduct heat to the electronic component 4, wherein the upper surface of the heat dissipation zone is divided into a plurality of heat dissipation zones 10, and each of the heat dissipation zones 10 can be used to conduct heat to the corresponding electronic component 4, for example, an electronic component adjacent to or located below the heat dissipation zone 10. 4. In one embodiment, electronic component 4 refers to a component of a power source, such as a capacitor. The heat sink 1 is made of metal, and in one embodiment, the heat sink 1 has a fin structure. The type in which the heat sink 1 is mounted is not limited and may vary depending on the arrangement of the circuit board 6, the central processing unit 7, and the electronic component 4. As shown in FIG. 1A, in this embodiment, the heat sink 1 is substantially L-shaped. In FIGS. 1B and 1C, the heat sink 1 is of a horizontal or straight type.

Please refer to FIG. 2A to FIG. 2B , which are structural diagrams of an embodiment of a plurality of fan modules and steering assemblies according to the present invention.

The fan assembly 20 includes a plurality of fan modules 2, and the fan assembly 20 is disposed on the heat sink 1. A fan module 2 is disposed on each of the heat dissipation regions 10. The fan module 2 includes a frame 21 and a fan 22 , and the fan 22 is disposed in the frame 21 . The steering assembly 5 is connected to the fan assembly 20, and the steering assembly 5 is used to drive the fan modules 2 to be inverted by a pivot axis Z parallel to the upper surface of the heat sink 1, that is, the axis extending by the pivot axis Z is inverted by the axis of symmetry.

More specifically, in this embodiment, the steering assembly 5 includes a base 51, a connecting line 52, and a steering motor 53. The base 51 is disposed on the circuit board 6, and the steering motor 53 and the fan module 2 of the fan assembly 20 The steering motor 53 is connected to the base 51 via the connecting line 52. Thus, the steering motor 53 can receive the signal starting operation transmitted by the control circuit 3, and drive each fan module 2 to extend the axial direction of the pivot axis Z as an axis of symmetry. Flip.

Please refer to FIG. 3A to FIG. 3C , which are respectively used state diagrams of an embodiment of a plurality of fan modules and steering assemblies of the present invention.

As shown in FIG. 3A, in this embodiment, there is more than one steering assembly 5, and the steering assembly 5 is respectively disposed at two ends of the "L" type heat sink 1, and the steering assembly 5 is connected to the fan module 2 of the fan assembly 20. The steering module 5 can drive the fan module 2 of the heat dissipation area a~d to be inverted by the first axial direction X, and the other steering component 5 can drive the fan module 2 of the heat dissipation area e~f to be inverted by the second axial direction Y. Achieve the effect of partition manufacturing airflow and partition heat dissipation. In some embodiments, a fan module 2 can be driven by one of the two steering components 5 and flipped according to different axial directions. For example, the fan module 2 of the heat dissipation zone d can be in the first axial direction X. Or the second axial Y is inverted. The invention is not limited thereto.

As shown in FIG. 3B to FIG. 3C, each fan module 2 can be respectively connected to the steering assembly 5, so that the direction in which each fan module 2 is reversed is not necessarily the same as the degree of inversion. In this embodiment, the fan module of the heat dissipation area d The group 2 can then be flipped in the first axial direction X or the second axial direction Y depending on its combination of the steering assembly 5. The invention is not limited thereto and should be installed as desired by the user and the manufacturer.

In an embodiment, the heat dissipating device 100 further comprises a liquid cooling structure (not shown), the liquid cooling structure comprises a liquid storage tank, a water pump and a transmission tube, and the transmission tube is respectively connected to the liquid storage tank, the water pump and the radiator 1 , and the liquid storage The tank stores water-cooling liquid, and the water-cooling liquid can flow in the conveying pipe. The water pump can drive the water-cooling liquid to flow, and guide the water-cooling liquid into and out of the radiator 1, so that when the water-cooling liquid flows through the radiator 1, the heat of the radiator 1 can be absorbed. Bring the heat out of the radiator 1 and back to the reservoir. This cycle process has the effect of helping the heat sink 1 to dissipate heat. The water-cooling liquid may be composed of propylene glycol (or some other alcohol) plus distilled water and additives (pigments, rust inhibitors). In some embodiments, the water-cooled liquid is pure water or distilled water.

Please refer to FIG. 4 , which is a schematic structural diagram of an embodiment of a heat dissipation device with a reversible fan according to the present invention. The control circuit 3 is connected to the central processing unit 7, the electronic component 4, the steering unit 5 and the fan module 2. The control circuit 3 can detect the operating states of the electronic component 4 and the central processing unit 7.

Further, the control circuit 3 includes a control unit 31 and a detection unit 32. The detecting unit 32 is connected to the control unit 31. The detecting unit 32 can detect at least one of the temperature and the clock of the electronic component 4 and the central processing unit 7, and transmit the detecting signal to the control unit 31 according to the detection result, and control The unit 31 determines, according to the respective detection signals, which fan module 2 in the heat dissipation area 10 needs to be started to reduce the temperature of the corresponding electronic component 4 or the central processing unit 7, and correspondingly transmits the startup signal to the heat dissipation area 10. The fan module 2 is made to operate. The control unit 31 also transmits a flip signal to the steering assembly 5 to drive the fan module 2 on the heat dissipation area 10 of the corresponding electronic component 4 or the central processing unit 7 according to the above axial direction (first axial X or second axial direction). Y) is inverted for the axis of symmetry.

In other words, the user can preset a temperature limit value or a clock limit value in the control unit 31, for example, setting the temperature limit value or the clock limit value in a Basic Input/Output System (BIOS). When the detecting unit 32 transmits the detecting signal to the control unit 31, the control unit 31 determines whether the temperature or the clock of the operation of the electronic component 4 or the central processing unit 7 exceeds the temperature limit value or the clock limit value according to the detecting signal. When the control unit 31 determines that the operating temperature or clock of the electronic component 4 or the central processing unit 7 has exceeded the set value (ie, overheating or overclocking), the control unit 31 correspondingly controls the heat dissipation area corresponding to the electronic component 4 or the central processing unit 7. The fan module 2 of 10 is operated or turned over, generating a wind flow to conduct heat, so that the electronic component 4 or the central processing unit 7 does not overheat and maintain stability. The fan module 2 that is driven to be turned over and operated may be one or more, depending on the setting of the user and the detection result of the detecting unit 32 and the installation of the fan module 2 and the steering assembly 5.

In the above, the activation signal includes at least one of setting a rotational speed, a forward rotation, or a reverse rotation of the fan module 2. For example, the speed of the fan 22 of the fan module 2 is set to rotate in a clockwise manner or in a counterclockwise manner, and the fan 22 rotates. The start signal received by each fan module 2 is not Must be the same. The flipping signal includes setting the direction in which the steering assembly 5 drives the fan module 2 to flip and the angle of the flip. For example, the steering unit 5 is driven to drive the fan module 2 to rotate clockwise or counterclockwise according to the pivot axis Z, and the angle of the flip (the degree of flipping) can be preset in the basic input/output system or the application. . The fan module 2 has different rotational speeds, positive and negative rotations, and reversed directions and angles, and the heat dissipation effect is different. Therefore, the user can individually set the optimal operation mode for each fan module 2 operation mode. effect.

In an embodiment, the control circuit 3 is further connected to the pump signal, and the control circuit 3 further transmits a signal, activates the water pump, and performs liquid (water) cooling.

Please refer to FIG. 5A to FIG. 5C , which are respectively schematic diagrams showing a state of use of an embodiment of a heat dissipation device with a reversible fan according to the present invention. There are electronic components 4 distributed under the heat dissipation areas a~f, such as power supply parts, and the state of division of power supply parts is different. Therefore, when the central processing unit 7 operates, there are different power supply requirements, and the temperature of the power supply parts under the heat dissipation areas a~d When the temperature is increased, the fan module 2 must be operated during the heat dissipation process, that is, the fan 22 rotates to generate the wind flow. The following describes the flip mode of the fan module 2 more specifically.

As shown in FIG. 5A, in this embodiment, for the high temperature or overclocked electronic component 4 or/and the central processing unit 7 adjacent to or under the heat dissipation zones a~d, the control circuit 3 can control the steering component 5 to drive the heat dissipation zone a. The fan module 2 of the ~d is turned over, and the fan modules 2 of the other heat dissipation areas e, f are not turned over. As shown in FIG. 3B, the control circuit can control the fan module 2 of the steering unit 5 to drive the heat dissipation area a to be individually flipped, and the fan modules 2 of the other heat dissipation areas b~f are not turned over, and the control circuit 3 should be regarded. The settings and detection results depend on.

As shown in FIG. 5B, in this embodiment, for the high temperature or overclocked electronic component 4 or/and the central processing unit 7 adjacent to or under the heat dissipation regions e, f, the control circuit 3 controls the steering assembly 5 to drive the heat dissipation region e, The fan module 2 of f is flipped together, and the fan modules 2 of other heat dissipation zones a~d are not flipped.

As shown in FIG. 5C, in this embodiment, the electronic component 4 or/and the central processor of the high temperature or overclocking electronic component 4 or/and the central processing unit 7 adjacent to or under the heat dissipation zones b, f are 7. The fan modules 2 of the heat dissipation zones b and f can be flipped at the same time or at different times to achieve the effect of heat dissipation.

Therefore, in the above embodiments, it can be seen that there are multiple ways to realize the flipping of the fan module 2. When the fan modules 2 of the plurality of heat dissipation zones 10 (such as the heat dissipation zones a~d) are driven by the same steering component 5, the heat dissipation is performed. The direction and angle of the fan module 2 in the area a~d are the same (clockwise or counterclockwise). In contrast, if the plurality of steering components 5 are respectively connected to the fan modules 2 of the heat dissipation areas a to f, the fan modules 2 of the driven heat dissipation areas a to d can be respectively flipped and operated, and the fan modules 2 are turned over. The direction or the flip angle may be different. As described above, the configuration of the steering assembly 5 and the fan assembly 20 (fan module 2) should be determined according to the needs of the user or the operator, and the present invention is not limited.

According to the characteristics of the electronic component 4 and the central processing unit 7, the user sets the operating conditions (rotation speed, fan rotation direction and rotation time) and the turning condition (flip angle, flip direction) of the driven fan module 2 to the control circuit 3, respectively. In this way, the fan module 2 achieves the best heat dissipation effect during operation (the fan module 2 is operated and turned). In this way, the area where the temperature of the power supply part is higher and the area where the temperature of the power supply part is lower can be operated by the fan module 2 to perform heat dissipation through different settings. In addition to the advantages of energy saving, the stability and high performance of the host can be maintained. .

In one embodiment, the heat sink 100 with the reversible fan is used in conjunction with a central processing unit 7 having a heat sink (not shown). The heat sink is provided with a fan (not shown), and the fan generates a wind flow. The heat sink 100 flows from the heat sink to the circuit board 6. The heat sink 100 with the reversible fan can be turned over by the fan module 2, so that the generated wind flow can effectively avoid the wind flow generated by the fan of the heat sink. For optimum heat dissipation.

In another embodiment, the airflow generated by the fan on the heat dissipation plate of the central processing unit 7 flows in the direction of the parallel circuit board 6, so that the electronic component 4 cannot effectively take away the heat generated by the electronic component 4. The heat sink 100 of the reversible fan can assist the central processor 7 in dissipating heat in addition to dissipating the heat generated by the electronic component 4.

Please refer to FIG. 6 to FIG. 7. FIG. 6 is a schematic structural diagram of an embodiment of a motherboard according to the present invention. Fig. 7 is a schematic view showing an embodiment of a heat sink mounting type of a motherboard of the present invention. The motherboard 200 includes a circuit board 6, a central processing unit 7, a plurality of electronic components 4, a heat sink 1, a plurality of fan modules 2, and a control circuit 3. Regarding the circuit board 6, the central processing unit 7, the plurality of electronic components 4, the heat sink 1, the plurality of fan modules 2, and the control circuit 3, please refer to FIG. 1A to FIG. 1C and related descriptions.

For the arrangement and structure of the fan assembly 20, the plurality of fan modules 2, and the steering assembly 5, please refer to FIG. 2A to FIG. 3C and related descriptions; and the control circuit 3 controls the operation and control of the fan module 2 on the heat dissipation area 10. The steering module 5 drives the fan module 2 to flip. Please refer to FIG. 4 and related descriptions. For the start signal and the flip signal transmitted by the control circuit 3, refer to the above related description. For the use state of the heat sink 100 with the reversible fan, please Referring to Figures 5A through 5C and related descriptions, it is no longer ambiguous.

An embodiment of the present invention illustrates that a central processor and an electronic component generate a large amount of thermal energy during operation, and the temperature of the central processing unit and the electronic component is detected through the control circuit, and the operation of the fan module is controlled to change the motherboard, the electronic component, and the central processing. The temperature of the device maintains the performance and stability of the motherboard. Electronic components are distributed on the board, adjacent to the heat sink or under the heat sink. In an embodiment, the control circuit further controls the steering component so that the fan module can be flipped in an axial direction, and the fan module has different turning angles, and the generated wind flow is different, and the heat energy generated by the electronic component or the central processing unit can be timely Cool down.

In addition, the fan module can also be turned over and operated in a partition. When the temperature of the electronic component at a specific position changes greatly, the control circuit controls the operation of the fan module at the corresponding position on one hand, and controls the steering module to drive the fan module to flip on the other hand. The temperature of the electronic component at a specific position is changed so that it does not overheat, and it is known that the heat sink having the reversible fan has the advantage of energy saving. The control circuit controls the operation of the fan module, including setting the fan speed, forward running or reverse running, and fan rotation time, and also setting the flipping direction, the flip angle, and the time after the flipping of the fan module. To achieve the control of air volume, air intake or ventilation and effectively achieve the above purpose of maintaining the performance and stability of the motherboard (electronic parts, central processing unit).

100‧‧‧heating device

200‧‧‧ motherboard

1‧‧‧heatsink

10/a~f‧‧‧heating area

2‧‧‧Fan module

20‧‧‧Fan rack

21‧‧‧Frame

22‧‧‧Fan

3‧‧‧Control circuit

31‧‧‧Control unit

32‧‧‧Detection unit

4‧‧‧Electronic parts

5‧‧‧Steering components

51‧‧‧Base

52‧‧‧Connecting line

53‧‧‧Steering motor

6‧‧‧Circuit board

X/Y/Z‧‧‧ axial

7‧‧‧Central processor

[Fig. 1A] Fig. 1A is a schematic view showing an embodiment of a heat dissipating device mounting type with a reversible fan of the present invention. [Fig. 1B] Fig. 1B is a schematic view showing an embodiment of a heat dissipating device mounting type with a reversible fan of the present invention. 1C is a schematic view showing an embodiment of a heat dissipating device mounting type with a reversible fan of the present invention. 2A is a schematic structural view of an embodiment of a plurality of fan modules and steering assemblies of the present invention. Fig. 2B is a view showing a state of use of an embodiment of a plurality of fan modules and steering assemblies of the present invention. Fig. 3A is a view showing a state of use of an embodiment of a plurality of fan modules and steering assemblies of the present invention. Fig. 3B is a view showing a state of use of an embodiment of a plurality of fan modules and steering assemblies of the present invention. Fig. 3C is a view showing a state of use of an embodiment of a plurality of fan modules and steering assemblies of the present invention. 4 is a schematic structural view of an embodiment of a heat sink having a reversible fan according to the present invention. Fig. 5A is a schematic view showing the state of use of an embodiment of a heat sink having a reversible fan of the present invention. [Fig. 5B] Fig. 5B is a schematic view showing a state of use of an embodiment of a heat sink having a reversible fan of the present invention. Fig. 5C is a schematic view showing the state of use of an embodiment of a heat sink having a reversible fan of the present invention. 6 is a schematic structural view of an embodiment of a motherboard of the present invention. Fig. 7 is a schematic view showing an embodiment of a heat sink mounting type of a motherboard of the present invention.

Claims (10)

A heat dissipating device with a reversible fan for dissipating heat from a plurality of electronic components, wherein the electronic components are disposed around a central processing unit, the heat dissipating device comprising: a heat sink having a plurality of heat dissipating regions, and each of the heat dissipating The area is configured to conduct heat to at least one of the electronic components; a fan assembly includes a plurality of fan modules, the fan assembly is disposed on the heat sink, and at least one of the fan modules is disposed on each of the heat dissipation regions; An assembly that connects the fan tray to drive each of the fan modules to rotate in an axial direction parallel to the upper surface of the heat sink; and a control circuit that signals the electronic components, the central processing unit, and the fans The module and the steering component, the control circuit detects an operating state of the electronic component and the central processor, and controls the steering component to control the steering component to invert the at least one fan module in the heat dissipation zones. The heat dissipation device with a reversible fan according to claim 1, wherein the control circuit comprises: a control unit; and a detecting unit connected to the control unit, the detecting unit detecting the electronic components and the central processing At least one of the temperature and the clock of the device transmits at least one detection signal to the control unit according to the detection result, and the control unit transmits a start signal to the heat dissipation regions according to the detection signals. At least one fan module is activated, and the control unit further transmits a flip signal to the steering component to drive the at least one fan module to flip in the axial direction. The heat sink with a reversible fan according to claim 2, wherein the activation signal comprises at least one of setting a rotational speed, a forward rotation or a reverse rotation of the fan module. The heat sink of the reversible fan of claim 2, wherein the flipping signal comprises setting a direction in which the steering component drives the fan module to flip and an angle of flipping. The heat sink with a reversible fan according to claim 1, wherein the steering assembly comprises a base, a connecting wire and a steering motor, the base is disposed on a circuit board, the steering motor and the fan frame Connected and connected to the base via the connecting line. A motherboard includes: a circuit board; a plurality of electronic components disposed on the circuit board; a central processing unit disposed on the circuit board; a heat sink disposed on the electronic components and not in contact with the central processing The fan assembly has a plurality of heat dissipation zones; a fan assembly includes a plurality of fan modules, the fan assembly is disposed on the heat sink, and at least one fan module is disposed on each of the heat dissipation zones; a steering assembly, the fan assembly is connected to drive each of the fan modules to be turned in an axial direction parallel to the upper surface of the heat sink; and a control circuit is connected to the electronic components, the central processing unit, and the The fan module and the steering component, the control circuit detects an operating state of the electronic components and the central processing unit, and controls the steering component to control the steering component to invert the at least one fan module in the heat dissipation zones. The motherboard of claim 6, wherein the control circuit comprises: a control unit; and a detecting unit connected to the control unit, the detecting unit detecting temperature and time of the electronic components and the central processing unit At least one of the pulses transmits at least one detection signal to the control unit according to the detection result, and the control unit transmits an activation signal to the at least one fan module in the heat dissipation regions according to the detection signals. The control unit further transmits a flip signal to the steering component to drive the at least one fan module to flip in the axial direction. The motherboard of claim 7, wherein the activation signal comprises at least one of setting a rotational speed, a forward rotation or a reverse rotation of the fan module. The motherboard of claim 7, wherein the flipping signal includes setting a direction in which the steering component drives the fan module to flip and an angle of flipping. The motherboard of claim 6, wherein the steering assembly comprises a base, a connecting wire and a steering motor, the base is disposed on the circuit board, and the steering motor is connected to the fan frame and connected via the connection The wire is connected to the base.