TWI652567B - Heat sink device with a plurality of heat dissipation areas and motherboard with the heat sink device - Google Patents

Abstract

A heat dissipating device capable of partitioning heat dissipation for dissipating heat of a plurality of electronic components, including a heat sink, a plurality of fan modules, and a control circuit. The heat sink has a plurality of heat dissipation zones, and each heat dissipation zone is configured to conduct heat to at least one electronic component. The plurality of fan modules are disposed on the heat sink, and at least one fan module is disposed on each of the heat dissipation zones. The control circuit signal is connected to the electronic component and the fan module, and the control circuit detects the operating state of the electronic component, and controls at least one fan module in the heat dissipation zone to operate according to the operating state of the electronic component. The invention also proposes a motherboard with the heat sink.

Description

Heat sink capable of partitioning heat dissipation and motherboard with heat sink

A heat dissipating device, especially a heat dissipating device having a plurality of heat dissipating regions and capable of dissipating heat.

With the rapid development of technology, the application of computers has become more and more extensive, and people's demand for computers has become higher and higher. And for the quality of the computer, the emphasis is on high performance and good stability.

However, regarding the operation efficiency and stability of the computer, the main key lies in the operation of the motherboard, the central processing unit and the electronic components. During operation, a large amount of thermal energy will be generated. In the serious case, it will accumulate in the interior of the host and cannot be easily dissipated outward, so that the central processing The device and electronic components are overheated and lost, thus reducing operational efficiency.

For electronic components, such as power supply components, they generate a large amount of thermal energy during operation. Generally, metal heat dissipation plates and heat-conducting media are used, which conduct heat through contact with power supply components, and conduct heat to the heat dissipation plate to achieve heat dissipation. Thus, heat dissipation The presence or absence of airflow in the surrounding environment of the board will affect the efficiency of heat dissipation and also affect the performance of the motherboard.

In view of the above problems, one or more embodiments of the present invention provide a heat dissipating device capable of partitioning heat dissipation for dissipating heat of a plurality of electronic components, including a heat sink and a plurality of fan modules. And control circuitry. The heat sink has a plurality of heat dissipation zones, and each heat dissipation zone is configured to conduct heat to at least one electronic component. The plurality of fan modules are disposed on the heat sink, and at least one fan module is disposed on each of the heat dissipation zones. The control circuit signal is connected to the electronic component and the fan module, and the control circuit detects the operating state of the electronic component, and controls at least one fan module in the heat dissipation zone to operate according to the operating state of the electronic component.

In the above embodiment, the control circuit includes a control unit and a detecting unit. The detecting unit is connected to the control unit, and the detecting unit detects at least one of the temperature and the clock of the electronic component, and transmits at least one detecting signal to the control unit according to the detection result, and the control unit transmits the corresponding signal according to each detecting signal. Start the signal to at least one fan module in the heat dissipation area to activate it.

In one embodiment, the activation signal includes at least one of setting a rotational speed, a forward rotation, and a reverse rotation of the fan module.

In one embodiment, each of the fan modules includes a frame, a fan, and a locking component. The fan is disposed in the frame, and the locking component positions the frame on the heat sink.

In one embodiment, the heat dissipating device further includes a fan assembly, the fan assembly is connected to the heat sink, the fan module is disposed in the fan assembly, and each fan module includes a frame. With the fan, the fan is placed inside the frame.

In the embodiment, the heat dissipating device further comprises a liquid cooling structure, including a liquid storage tank, a water pump and a transmission tube, and the transmission tube is respectively connected to the liquid storage tank, the water pump and the radiator, and the liquid storage tank The water cooling liquid is stored, and the water pump drives the water cooling liquid to flow in the transmission pipe, guiding the water cooling liquid into and out of the radiator.

A motherboard includes a circuit board, a central processing unit, a plurality of electronic components, a heat sink, a plurality of fan modules, and a control circuit. The central processing unit and the plurality of electronic components are disposed on the circuit board. The heat sink is disposed on the electronic component and does not contact the central processing unit, and the heat sink has a plurality of heat dissipation zones. The plurality of fan modules are disposed on the heat sink, and at least one fan module is disposed on each of the heat dissipation zones. The control circuit signal is connected to the electronic component and the fan module, and the control circuit detects the operating state of the electronic component, and controls at least one fan module in the heat dissipation zone to operate according to the operating state.

In the above embodiment, the control circuit includes a control unit and a detection unit. The detecting unit is connected to the control unit, and the detecting unit detects at least one of the temperature and the clock of the electronic component, and transmits at least one detecting signal to the control unit according to the detection result, and the control unit responds according to each detecting signal. The start signal is transmitted to at least one fan module in the heat dissipation area to be activated.

In one embodiment, the activation signal includes at least one of setting a rotational speed, a forward rotation, and a reverse rotation of the fan module.

In the embodiment, the fan module includes a frame, a fan and a locking component. The fan is disposed in the frame, and the locking component positions the frame on the heat sink.

In an embodiment, the motherboard further includes a fan assembly, the fan assembly is connected to the heat sink, and the fan module is disposed in the fan assembly, and each fan module includes a frame and a fan, and the fan Set in the frame.

In the embodiment, the motherboard further includes a liquid-cooling structure, including a liquid storage tank, a water pump, and a transmission tube. The transmission tube is respectively connected to the liquid storage tank, the water pump and the radiator, and the liquid storage tank stores the water cooling liquid. The water pump drives the water-cooled liquid to flow in the transfer tube, guiding the water-cooled liquid into and out of the heat sink. Device.

The heat dissipating device disclosed in the embodiment of the invention generates thermal energy during operation of the electronic component, detects the temperature of the electronic component through the control circuit, and controls the operation of the fan module to change the temperature of the motherboard, the electronic component and the central processing unit, and maintains The performance and stability of the motherboard. The fan module can be operated in a partition. When the temperature of the electronic component at a specific position changes greatly, the control circuit controls the operation of the fan module corresponding to the heat dissipation zone to change the temperature of the electronic component at a specific position so as not to overheat. The phenomenon. The control circuit controls the operation of the fan module, including setting the fan speed, forward running or reverse running and running time, etc., so as to achieve the effect of controlling air volume, air intake or exhaust, effectively achieving the overall performance and stability of the main board. Sexual purpose.

100‧‧‧heating device

200‧‧‧ motherboard

1‧‧‧heatsink

10‧‧‧heating area

2‧‧‧Fan module

20‧‧‧Fan rack

21‧‧‧Frame

22‧‧‧Fan

23‧‧‧Locking components

3‧‧‧Control circuit

31‧‧‧Control unit

32‧‧‧Detection unit

4‧‧‧Electronic parts

5‧‧‧Liquid cooling structure

51‧‧‧ liquid storage tank

52‧‧‧Transmission tube

53‧‧‧Water pump

6‧‧‧Circuit board

7‧‧‧Central processor

A~f‧‧‧heating area

Fig. 1A is a schematic view showing an embodiment of a heat sink mounting type of the present invention.

Fig. 1B is a schematic view showing an embodiment of a heat sink mounting type of the present invention.

Fig. 1C is a schematic view showing an embodiment of a heat sink mounting type of the present invention.

2A is a schematic structural view of an embodiment of a plurality of fan modules of the present invention.

2B is a schematic structural view of an embodiment of a plurality of fan modules of the present invention.

2C is a schematic structural view of an embodiment of a plurality of fan modules of the present invention.

Fig. 3 is a schematic structural view showing an embodiment of the liquid-cooled structure of the present invention.

4 is a schematic structural view of an embodiment of a control circuit of the present invention.

Fig. 5A is a schematic view showing the state of use of an embodiment of the heat sink of the present invention.

Fig. 5B is a schematic view showing the state of use of an embodiment of the heat sink of the present invention.

Fig. 5C is a schematic view showing the state of use of an embodiment of the heat sink of the present invention.

6 is a schematic structural view of an embodiment of a motherboard of the present invention.

Fig. 7 is a schematic view showing an embodiment of a heat sink mounting type of a motherboard of the present invention.

Please refer to FIG. 1A to FIG. 1C , which are schematic views of an embodiment of a heat sink mounting type according to the present invention. The heat sink 100 can be used to dissipate heat from the plurality of electronic components 4. The heat sink 100 includes a heat sink 1, a plurality of fan modules 2, and a control circuit 3. The heat sink 1 can conduct heat for each electronic component 4. In the embodiment shown in FIG. 1A to FIG. 1C, the upper surface of the heat sink 1 is divided into a plurality of heat dissipation regions 10, and each of the heat dissipation regions 10 is used for conducting heat to at least one electronic component 4, in particular, the electronic component 4 is adjacent to the heat dissipation region. 10 is located below the heat sink area 10. In one embodiment, electronic component 4 refers to a component of a power source, such as a capacitor. The heat sink 1 is made of metal, and in one embodiment, the heat sink 1 has a fin structure. The type of the heat sink 1 is not limited and may vary depending on the arrangement of the circuit board 6, the central processing unit 7, and the electronic component 4. For example, as shown in FIG. 1A, in this embodiment, the heat sink 1 is substantially L-shaped. In FIGS. 1B and 1C, the heat sink 1 is of a horizontal or straight type.

2A to 2C are schematic structural views of an embodiment of a plurality of fan modules of the present invention. The plurality of fan modules 2 are mounted on the heat sink 1. The heat sink 1 has a plurality of heat dissipation zones 10, and a fan module 2 is disposed on each of the heat dissipation zones 10. As shown in FIG. 1A, there are six heat dissipation zones 10, However, the number of the heat dissipation regions 10 is determined by the size of the heat sink 1, and is not limited.

As shown in FIG. 2A , in this embodiment, the fan module 2 includes a frame 21 , a fan 22 and a locking component 23 . The fan 22 is positioned in the frame 21 , and the locking component 23 positions the frame 21 on the heat sink 1 . The locking element 23 is for example a screw.

As shown in FIG. 2B, in this embodiment, the fan module 2 includes a fan 22 and a lock. The element 23 is positioned by the locking element 23 on the heat sink 1.

As shown in FIG. 2C , in this embodiment, the heat dissipation device 100 includes a fan assembly 20 , the fan assembly 20 is externally connected to the heat sink 1 , the fan module 2 is disposed in the fan assembly 20 , and the fan module 2 includes a frame. 21 and the fan 22, the fan 22 is positioned within the frame 21. It can be seen from the embodiments that the structure of the fan module 2 has various types, and the invention is not limited.

Please refer to FIG. 3 , which is a schematic structural view of an embodiment of the liquid cooling structure of the present invention. The heat sink 100 further includes a liquid cooling structure 5 including a liquid storage tank 51, a water pump 53 and a transfer pipe 52. The transfer pipe 52 communicates with the liquid storage tank 51, the water pump 53, and the radiator 1, respectively, and the liquid storage tank 51 stores water cooling liquid and water cooling. The liquid can flow in the transfer pipe 52, and the water pump 53 can drive the flow of the water-cooled liquid to guide the water-cooled liquid into and out of the radiator 1, so that when the water-cooled liquid flows through the radiator 1, the heat of the radiator 1 can be absorbed, and the heat is taken out Outside the radiator 1, it returns to the reservoir 51. This cycle process has the effect of helping the heat sink 1 to dissipate heat. The water-cooling liquid may be composed of propylene glycol (or other alcohol) plus distilled water and additives (pigments, rust inhibitors). In some embodiments, the water-cooled liquid is pure water or distilled water.

Please refer to FIG. 4 , which is a schematic structural diagram of an embodiment of a control circuit according to the present invention.

The control circuit 3 is connected to the electronic component 4 and the fan module 2, and the control circuit 3 can detect the operating state of the electronic component 4. Further, the control circuit 3 includes a control unit 31 and a detection unit 32.

The detecting unit 32 is connected to the control unit 31. The detecting unit 32 can detect at least one of the temperature and the clock of the electronic component 4, and transmit at least one detecting signal to the control unit 31 according to the detection result, and the control unit 31 is configured according to the detection unit 31. Each of the detection signals transmits a start signal to at least one of the fan modules 2 in the heat dissipation area 10 to be activated. In other words, the user can preset a temperature limit value or a clock limit value in the control unit 31, for example, in a basic input/output system (Basic) Input/Output System, BIOS) or the application to set the temperature limit value or clock limit value.

When the detecting unit 32 transmits the detecting signal to the control unit 31, the control unit 31 determines whether the temperature or the clock of the operation of the electronic component 4 exceeds the temperature limit value or the clock limit value according to the detecting signal, and the control unit 31 determines the electronic component 4 The operating temperature or clock is beyond the temperature limit value or the clock limit value (ie, overclocking), and the control unit 31 correspondingly controls the operation of the fan module 2 corresponding to the heat dissipation area 10 of the electronic component 4, and the fan module 2 is operated. It may be one or more, and the heat generated by the electronic component 4 is led out so that the electronic component 4 does not overheat and maintain stability.

In an embodiment, the control circuit 3 is connected to the central processing unit 7 and the control circuit 3 can detect the temperature and the clock of the central processing unit 7. When the control circuit 3 determines that the temperature of the central processing unit 7 is overheated or overclocked, The control unit 31 correspondingly controls the operation of the fan module 2 corresponding to the heat dissipation area 10 of the central processing unit 7, and the heat dissipation maintains the central processing unit 7 with high efficiency.

In the above, the activation signal includes at least one of setting a rotational speed, a forward rotation, and a reverse rotation of the fan module 2. For example, the rotation speed per minute (rpm) of the fan 22 is set to rotate clockwise or counterclockwise, and the operation time, etc., and the start signals received by the fan modules 2 are not necessarily the same. In other words, the wind speed of the fan 22 and the effect of the wind flow generated by the reverse rotation are different, and the heat dissipation effect is also different. The user can set the operation mode of each fan module 2 to achieve the best heat dissipation effect.

In one embodiment, the control circuit 3 is also coupled to the water pump 53 signal, and the control circuit 3 further transmits a signal to activate the water pump 53 for liquid (water) cooling.

Please refer to FIG. 5A to FIG. 5C , which are respectively schematic diagrams showing the use state of an embodiment of the heat dissipation device of the present invention.

As shown in FIG. 5A, the control circuit 3 can control the fan module 2 of the heat dissipation zone 10 to operate alone or in plurality for the high-temperature or over-frequency electronic component 4 or/and the central processing unit 7 adjacent to or underneath, in this embodiment. The control circuit 3 controls the fan modules 2 of the heat dissipation zones a to d to operate, while the fan modules 2 of the other heat dissipation zones e and f do not operate.

As shown in FIG. 5B, in this embodiment, for the high-temperature or over-frequency electronic component 4 or/and the central processing unit 7 adjacent or located below, the control circuit 3 can control the fan modules 2 of the heat-dissipating zones e, f together/ Or run in stages, while the fan modules 2 of other heat dissipation zones a~d do not operate.

As shown in FIG. 5C, in this embodiment, for the high-temperature or over-frequency electronic component 4 or/and the central processing unit 7 adjacent or located below, the control circuit 3 can control the fan modules 2 of the heat dissipation zones b, f together or Run in stages. It can be seen from the above embodiments that the control circuit 3 can control the fan module 2 to operate alone or in multiple operations for high temperature or overclocked electronic components 4, and operate at the same time or before and after, and the fan module 2 operates under the conditions of The above can be set by the user according to the characteristics of the electronic component 4 and the central processing unit 7 to achieve the best heat dissipation effect when the fan module 2 is operated. In addition, this heat dissipation method can achieve energy saving effects.

Please refer to FIG. 6 to FIG. 7. FIG. 6 is a schematic structural diagram of an embodiment of a motherboard according to the present invention. Fig. 7 is a schematic view showing an embodiment of a heat sink mounting type of a motherboard of the present invention. The motherboard 200 includes a circuit board 6, a central processing unit 7, a plurality of electronic components 4, a heat sink 1, a plurality of fan modules 2, and a control circuit 3. Regarding the electronic component 4, the central processing unit 7, and the heat sink 1, please refer to FIGS. 1A to 1C and related descriptions.

For the setting and structure of the plurality of fan modules 2, please refer to FIG. 2A to FIG. 2C and related descriptions. For the liquid-cooled structure 5, please refer to FIG. 3 and related descriptions; the start signal transmitted by the control circuit 3 and the control of heat dissipation. The fan module 2 on the zone 10 is running, please refer to FIG. 4 and FIG. 5A again. To 5C and related instructions, no longer rumors here.

An embodiment of the present invention describes that heat is generated during operation of an electronic component, and the temperature of the electronic component or the central processing unit is detected by the control circuit, and the operation of the fan module is controlled to change the temperature of the motherboard, the electronic component, and the central processing unit. Maintain the performance and stability of the host. In an embodiment, the fan module can be operated in a partitioning manner. When the temperature of the electronic component or the central processing unit of the specific position changes greatly or when the overclocking is performed, the control circuit controls the operation of the fan module at the corresponding position to Change the temperature of a particular location of an electronic part or central processing unit so that it does not overheat to maintain performance. The control circuit controls the operation of the fan module, and includes setting a fan speed, a clockwise operation or a counterclockwise operation, and an operation time, etc., and is set according to the user's demand to achieve the effect of controlling the air volume, the air intake or the ventilation. Efficient heat dissipation to maintain the overall performance and stability of the motherboard.

Claims (12)

A heat dissipating device capable of dissipating heat for dissipating heat for a plurality of electronic components, comprising: a heat sink having a plurality of heat dissipating regions, wherein each of the heat dissipating regions is configured to conduct heat to at least one of the electronic components; and the plurality of fan modules are disposed And at least one of the fan modules is disposed on the heat sink; and a control circuit is connected to the electronic components and the fan modules, wherein the control circuit detects the operation of the electronic components The state controls the at least one fan module in the heat dissipation zones to operate according to the operating state. The heat dissipating device capable of partitioning heat dissipation according to claim 1, wherein the control circuit comprises: a control unit; and a detecting unit connected to the control unit, the detecting unit detecting temperature and time of the electronic components At least one of the at least one detection signal is transmitted to the control unit according to the detection result, and the control unit transmits an activation signal to the at least one fan module in the heat dissipation regions according to the detection signals. Make it work. The heat dissipating device capable of dissipating heat according to claim 2, wherein the activation signal comprises at least one of setting a rotational speed, a forward rotation and a reverse rotation of the fan module. The heat dissipating device capable of dissipating heat according to claim 1, wherein each of the fan modules comprises a frame, a fan and a locking component, wherein the fan is disposed in the frame, and the locking component positions the frame in the frame On the radiator. The heat dissipating device for partitioning heat dissipation according to claim 1, further comprising a fan assembly, which is disposed on the heat sink, wherein the fan modules are disposed in the fan assembly, each fan module includes a frame With a fan, the fan is disposed within the frame. The heat dissipating device capable of dissipating heat according to claim 1, further comprising a liquid cooling structure, comprising a liquid storage tank, a water pump and a transmission tube, wherein the transmission tube respectively communicates with the liquid storage tank, the water pump and the radiator The liquid storage tank stores a water cooling liquid, and the water pump drives the water cooling liquid to flow in the transmission pipe, and guides the water cooling liquid to enter and exit the radiator. A motherboard includes: a circuit board; a central processing unit disposed on the circuit board; a plurality of electronic components disposed on the circuit board; a heat sink disposed on the electronic components and not in contact with the central processing The heat sink has a plurality of heat dissipating regions; a plurality of fan modules are disposed on the heat sink, and at least one of the fan modules is disposed on each of the heat dissipating regions; and a control circuit is connected to the electronic components and the signal In the fan modules, the control circuit detects the operating states of the electronic components, and controls the operation of the at least one fan module in the heat dissipation regions corresponding to the operating states. The motherboard of claim 7, wherein the control circuit comprises: a control unit; and a detecting unit connected to the control unit, the detecting unit detecting at least one of a temperature and a clock of the electronic components Transmitting at least one detection signal to the control list according to the detection result And the control unit transmits an activation signal to the at least one fan module in the heat dissipation area according to each of the detection signals, so as to be activated. The motherboard of claim 8, wherein the activation signal comprises at least one of setting a rotational speed, a forward rotation and a reverse rotation of the fan module. The motherboard of claim 7, wherein each of the fan modules comprises a frame, a fan and a locking component, the fan being disposed in the frame, the locking component positioning the frame on the heat sink. The motherboard of claim 7 further includes a fan set, which is connected to the heat sink, and the fan modules are disposed in the fan set. Each fan module includes a frame and a fan. The fan is disposed within the frame. The motherboard of claim 7 further comprising a liquid-cooling structure comprising a liquid storage tank, a water pump and a transfer tube, wherein the transfer tube communicates with the liquid storage tank, the water pump and the heat sink, respectively, the liquid storage The tank stores a water-cooling liquid, and the water pump drives the water-cooling liquid to flow in the conveying pipe, and guides the water-cooling liquid into and out of the radiator.