TW201329005A - Tempered glass plate cutting method - Google Patents

Abstract

In this tempered glass plate cutting method, laser light (L) is applied to a tempered glass plate (1) at a predetermined pulse pitch (PT) along a planned cutting line (5). As a result, a reformed region (7) is formed within the tempered glass plate (1) along the planned cutting line (5). The reformed region (7) formed within the tempered glass plate (1) becomes the starting point of release of internal stress as described above. Therefore, cracking progresses along the reformed region (7) by the release of the internal stress. Consequently, according to this tempered glass plate cutting method, the tempered glass plate (1) can be cut along the planned cutting line (5), that is, into a desired shape.

Description

Method for cutting tempered glass sheet

The present invention relates to a tempered glass sheet cutting method for cutting a tempered glass sheet along a line to cut.

A glass plate processing apparatus described in Patent Document 1 is known as a conventional technique for cutting a sheet-shaped object to be formed of glass. This processing apparatus includes a support base for forming a cutting line, a cutting line forming means, a support base for breaking, and a breaking means. In the processing apparatus, first, a glass plate is placed on a support table for forming a cutting line, and a cutting line is formed on the surface of the glass plate by a cutting line forming means. Next, in the processing apparatus, the glass plate on which the cutting line has been formed is conveyed to the support stand for breaking, and the glass plate is cut along the cutting line by the breaking means.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-110882

However, in order to manufacture a touch panel such as a portable terminal device, the need for strengthening the processing of the glass plate is rapidly increasing. The tempered glass sheet can be obtained by, for example, immersing a general glass plate in a potassium solution, and performing displacement of sodium ions and potassium ions on the surface of the glass plate (that is, performing chemical strengthening). Keeping in the interior of such a tempered glass sheet force. Therefore, when the tempered glass sheet is cut, once the cutting line is formed on the surface thereof by the above-described conventional processing apparatus, the internal stress is released from the cutting line, causing the crack to be formed in an unintended direction. Therefore, in the above-described conventional processing apparatus, it is difficult to cut the tempered glass sheet into a desired shape.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a tempered glass sheet cutting method capable of cutting a tempered glass sheet into a desired shape.

In order to solve the above problems, the inventors of the present invention have repeatedly researched and found that the field of modification can be formed in the interior of the tempered glass sheet along the line to cut by the irradiation of the laser light, and the tempered glass sheet is effectively cut. Break into the desired shape. Once the modified field is formed inside the strengthened glass sheet along the line to cut by the irradiation of the laser light, the modified field becomes the starting point for the release of the internal stress, as the crack moves along the modified field. Development, so it can be cut along the cut line, that is, the tempered glass sheet is cut into a desired shape. In particular, the inventors have found that by performing the irradiation of the "light used to form the modified field" by using a specific pulse pitch, and after forming a modified field and passing a certain time, from the field of reforming The crack that occurs can reach the surface and back of the strengthened glass sheet. The present invention has been developed in accordance with the above findings.

In other words, one of the tempered glass sheet cutting methods of the present invention is to illuminate the tempered glass sheet by cutting the predetermined line along the tempered glass sheet. A tempered glass sheet cutting method in which a tempered glass sheet is cut along a line to be cut and a tempered glass sheet is cut along a line to cut, and the following steps are provided: : a step of irradiating the tempered glass sheet with laser light along a line to cut by using a specific pulse pitch, and forming a modified field in the interior of the tempered glass sheet along a line to cut; and along a line to cut The step of cutting the tempered glass sheet; the specific pulse spacing is a crack that can occur from the modified field, and by strengthening the internal stress of the glass sheet, after a certain period of time from the formation of the modified field, the reinforced glass sheet is reached. The spacing between at least one of the surface and the back surface.

In the tempered glass sheet cutting method, laser light is irradiated onto the tempered glass sheet at a specific pulse pitch along a line to cut. As a result, a modified field is formed inside the tempered glass sheet along the line to cut. The field of modification formed inside the tempered glass sheet, as described above, serves as a starting point for the release of internal stress. Therefore, the crack develops along the field of reformation by the release of internal stress. Therefore, according to the tempered glass sheet cutting method, the tempered glass sheet can be cut along the line to cut, that is, the tempered glass sheet is cut into a desired shape. In particular, in the tempered glass sheet cutting method, the irradiation of the laser light for forming the modified field is performed by using "the crack generated from the modified field, after a certain period of time has elapsed since the formation of the modified field. The pulse pitch of the surface and the back surface of the tempered glass sheet is implemented. Therefore, since it is possible to suppress the crack from stretching along the reforming field at a specific time, it is easy to handle the tempered glass sheet after the reforming field is formed.

In one of the tempered glass sheet cutting methods of the present invention, the specific pulse pitch may be 20 μm or more and 100 μm or less. In this case, After a certain period of time has elapsed since the formation of the modified field, the crack can surely reach the surface and the back of the strengthened glass sheet.

In one of the tempered glass sheet cutting methods of the present invention, the tempered glass sheet comprises: an outer portion including a rim portion of the tempered glass and an inner portion portion located further inside than the outer portion, and in the step of forming a modified region, The modified field is formed in such a manner that an extension is formed along the entire cutting line and throughout the inner portion, and the field of modification is not formed in the outer field. In this case, since the outer portion of the modified region is not formed, the resistance to the release of the internal stress is prevented, so that the tempered glass sheet can be prevented from being cut at an unexpected timing.

In the above-described one of the tempered glass sheet cutting methods of the present invention, in the step of cutting the tempered glass sheet, after the outer portion is cut from the tempered glass sheet, the internal stress is used to cause the crack by placing the tempered glass sheet. The tempered glass sheet is cut by stretching along the line to cut. In this case, the step of cutting the tempered glass sheet can be simplified as compared with the case where the tempered glass sheet is cut by applying stress from the outside.

Alternatively, in the above-described one method of cutting a tempered glass sheet according to the present invention, in the step of cutting the tempered glass sheet, the tempered glass sheet can be cut by applying stress to the tempered glass sheet along the line to cut. In this case, the tempered glass sheet can be cut at a desired timing.

In one of the tempered glass sheet cutting methods of the present invention, the tempered glass sheet comprises: an outer portion including a rim portion of the tempered glass, and an inner portion portion located at a more inner side than the outer portion, in the step of forming a modified region, It may extend along the entire cutting line and the inner portion along the cutting line Reform field. Even in this case, in the step of cutting the tempered glass sheet, the tempered glass sheet is placed, and the crack is stretched along the line to cut by internal stress to cut the tempered glass sheet. Alternatively, in the step of cutting the tempered glass sheet, the tempered glass sheet can be cut by applying stress to the tempered glass sheet along the line to cut. In the above case, the step of cutting the tempered glass sheet can be simplified as compared with the case where the outer portion is cut.

Further, in the method for cutting a tempered glass sheet of the present invention, the method of removing the modified region from the cut surface of the "effective portion cut out from the tempered glass sheet" after the tempered glass sheet is cut may be further provided. . In this case, the bending strength of the effective portion can be increased.

According to the present invention, there is provided a method of cutting a tempered glass sheet which can cut a tempered glass sheet into a desired shape.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. In the respective drawings, the same reference numerals are given to the same or corresponding parts, and the repeated description is omitted.

In the tempered glass sheet cutting method according to one embodiment of the present invention, the tempered glass sheet is irradiated with laser light along a line to cut, and the slab is cut along the line to be cut to form a cut line. The field of improvement of the starting point. Therefore, first of all, for the formation of the field of reform, refer to the first ~6 figure to illustrate.

As shown in Fig. 1, the laser processing apparatus 100 includes a laser light source 101 that oscillates the laser light L, and a spectroscopic light that is disposed so that the direction of the optical axis (optical path) of the laser light L is turned by 90°. The mirror 103; and a collecting lens 105 for collecting the laser light L. Further, the laser processing apparatus 100 includes a support base 107 for supporting the object 1 to be irradiated by the "laser light L" collected by the collecting lens 105, and a stage 111 for moving the support table 107. And a laser light source control unit 102 that controls the laser light source 101 in order to adjust the output and pulse width of the laser light L, and a platform control unit 115 for controlling the driving of the stage 111.

In the laser processing apparatus 100, the laser light L emitted from the laser light source 101 is deflected by the beam splitter 103 so that the direction of the optical axis is 90°, and is concentrated by the collecting lens 105. The inside of the object 1 to be placed on the support table 107 is placed. With the execution of the above-described operation, the stage 111 is moved, and the object 1 is relatively moved along the line to cut 5 with respect to the laser light L. Thereby, the modified region along the line to cut 5 is formed in the object 1 to be processed.

As the object 1 to be processed, a plate-like member (for example, a substrate, a wafer, or the like) formed of various materials (for example, glass, a semiconductor material, a piezoelectric material, or the like) can be used. As shown in FIG. 2, a cutting line 5 for cutting the object 1 is set in the object 1 to be processed. The cutting planned line 5 is a virtual line extending linearly. In the case where the modified region is formed in the inside of the object 1 as shown in Fig. 3, the laser light L is cut along the state in which "the light collecting point P is collected inside the object 1". The predetermined line 5 (that is, the direction of the arrow A in Fig. 2) forms a relative movement. As a result, as shown in FIGS. 4 to 6, the modified region 7 is formed inside the object 1 along the line to cut 5, and the modified region 7 formed along the line to cut 5 is formed. Become the cut-off starting point area 8.

The so-called condensed spot P refers to a portion where the laser light L is concentrated. Further, the cutting planned line 5 is not limited to a straight line, and may be curved, and is not limited to a virtual line, and may be a lead actually formed on the surface 3 of the object 1 to be processed. Further, the modified field 7 is sometimes formed continuously or sometimes intermittently. Further, the modified field 7 may be in a row or a dot shape, and an emphasis is placed on the fact that the modified field 7 is formed at least inside the object 1 to be processed. Further, in the modified region 7, cracks may be formed at the starting point, and the cracked and modified region 7 may be exposed on the outer surface (surface, back surface, or outer peripheral surface) of the object 1 to be processed.

Here, the laser light L is penetrated by the object 1 and is absorbed particularly in the vicinity of the light-converging point P inside the object 1 , whereby the modified object 7 can be formed in the object 1 (that is, the inside) Absorption laser processing). According to this, since the laser light L is hardly absorbed at the surface 3 of the object 1 to be processed, the surface 3 of the object 1 does not melt. In general, when the surface 3 is melted and removed to form a removal portion such as a hole or a groove (surface absorption type laser processing), the processing area is gradually performed from the surface 3 side toward the back surface side.

However, the field of modification formed in the present embodiment is a field in which density, refractive index, mechanical strength, and other physical properties are different from the surroundings. As far as the field of upgrading is concerned, there is such a thing as: Domain (including at least one of the following fields: a field of solidification after temporary melting, a field in a molten state, and a field in a state of forming a resolidification process from a molten state), a fracture domain, an insulation failure domain, and a refractive index change In the field, etc., there are also fields in which various states described above are mixed. In addition, in the field of upgrading, there are also: in the material of the object to be processed, the density of the modified field is changed compared to the density of the non-modified domain, or a lattice defect is formed. The domain (the above states are also collectively referred to as the high-density transfer domain).

In addition, in the field of melt processing or the field of refractive index change, the density in the field of reforming, the field in which the density of the non-modification field changes, and the field in which lattice defects are formed, sometimes further in the above-mentioned various fields, Or cracks (cracks, fine cracks, etc.) are contained in the interface between the modified field and the non-modified field. The cracks contained in the whole are sometimes spread throughout the field of modification, sometimes only in local or plural parts. The object to be processed 1 may be, for example, a substrate or a wafer formed of ruthenium, glass, LiTaO ₂ or sapphire (Al ₂ O ₂ ), or a substrate or a wafer as described above.

Further, in the present embodiment, the modified region 7 is formed by forming a plurality of modified portions (machining marks) along the line to cut 5 . The so-called modified portion refers to a modified portion formed by the impact of one pulse of pulsed laser light (that is, one pulse of laser irradiation; laser shock), by concentrating the modified portion. Forming a field of upgrading 7. Examples of the modified portion include a crack portion, a molten portion, or a refractive index change portion, or a portion in which at least two kinds of the above-described types are mixed. For such modified parts, it is best to consider the required cutting accuracy and the required cutting. The flatness of the cross section, the thickness, the type, the crystal orientation of the object to be processed, and the like, and the size and the length of the crack generated are appropriately controlled.

Next, a method of cutting a tempered glass sheet according to one embodiment of the present invention will be described with reference to Figs. 7 to 13. Figure 8 is a partial cross-sectional view taken along line VIII-VIII of Figure 7. The tempered glass sheet cutting method is characterized in that the tempered glass sheet is irradiated with laser light by a line to cut along the tempered glass sheet, and a modified region is formed along the line to cut along the inside of the tempered glass sheet, and along the cut line. Cutting the predetermined line cuts the tempered glass sheet. By using the tempered glass sheet cutting method, a tempered glass member such as a touch panel of a portable terminal device can be produced from a tempered glass sheet.

In the tempered glass sheet cutting method, first, as shown in Fig. 7, a tempered glass sheet 1 having a rectangular plate shape as an object to be processed is prepared. A cut line 5 is set in the tempered glass sheet 1. The line to cut 5 can be arbitrarily set in accordance with the shape of the tempered glass sheet 1 or the shape of the tempered glass member desired. Here, the cutting planned line 5 is formed in a rectangular lattice shape along the surface 3 of the tempered glass sheet 1. Therefore, the tempered glass member produced by the tempered glass sheet cutting method is formed into a rectangular plate shape.

The so-called tempered glass is a glass having a tensile stress layer and a compressive stress layer covering the tensile stress layer. In other words, stress is maintained inside the tempered glass. The tempered glass can be produced by, for example, immersing a general glass in a potassium solution to form a replacement of sodium ions and potassium ions on the surface, and forming a compressive stress layer on the surface thereof (chemical strengthening method). Alternatively, the tempered glass can be manufactured in the following manner: for example, after heating the general glass, it forms a rapid speed by blowing air on the surface thereof. Cooling (quick cooling method).

Next, the prepared tempered glass sheet 1 is placed on the support table 107 of the laser processing apparatus 100. Here, the back surface 4 of the tempered glass sheet 1 is directed to the support surface side of the support base 107 (that is, the surface 3 of the tempered glass sheet 1 is directed toward the condensing lens 105 side, and the tempered glass sheet 1 is placed on the support side. The stage 107 (please refer to Fig. 1). At this time, the tempered glass sheet 1 is directly placed on the support table 107. In other words, on the back surface 4 of the tempered glass sheet 1, no dicing film or the like is attached. Thin slices.

Next, as shown in part (a) of Fig. 8, the condensed spot P of the laser light L is positioned inside the specific distance from the front surface 3, the back surface 4, and the side surface 6 of the tempered glass sheet 1. The change of the position of the condensed point P of the laser light L can be performed, for example, by "driving the stage 111 by the control of the platform control unit 115 and moving the support table 107".

Next, as shown in part (b) of Fig. 8, the surface 3 of the tempered glass sheet 1 is used as a laser light incident surface, and the predetermined line 5 is cut along one of the plurality of planned cutting lines 5 to the tempered glass sheet. 1 Irradiation of laser light L. In other words, the condensing point P of the laser light L is relatively moved (scanned) along the line to cut 5 (that is, along the direction of the arrow A in the drawing). For the relative movement of the condensed spot P of the laser light L here, for example, "the platform 111 is driven by the control of the platform control unit 115, and the support table 107 is moved".

At this time, the pulse pitch (speed V/frequency F) PT of the laser light L is adjusted by adjusting the frequency F of the pulse oscillation of the laser light L or the moving speed V of the focused spot P of the laser light L. In other words, in this step, it is along The laser beam L is irradiated onto the tempered glass sheet 1 at a predetermined pulse pitch PT. The pulse pitch PT is, for example, the distance between the light collecting point P1 adjacent to each other and the light collecting point P2 in the portion (b) of Fig. 8.

The pulse pitch PT is a crack generated from the "modified region 7 formed by the irradiation of the laser light L", and the internal stress of the glass sheet 1 is strengthened to form the modified field 7 (more specifically, It is a distance from at least one of the front surface 3 and the back surface 4 of the tempered glass sheet 1 after a predetermined period of time has elapsed from the state in which the reforming field 7 is used as a starting point to release the internal stress. The details will be described later, and the pulse pitch PT can be set to, for example, a range of 20 μm or more and 100 μm or less.

By the irradiation of the above-described laser light L, the modified region 7 can be formed inside the strengthened glass sheet 1 along the line to cut 5 . Since the laser beam L irradiates the tempered glass sheet 1 at a specific pulse pitch PT, the modified field 7 constitutes a set of modified portions 9 formed inside the strengthened glass sheet 1 at intervals corresponding to the pulse pitch PT. The modified field 7 (that is, the modified portion 9) formed at this time includes, for example, a fractured region (rupture site) or a molten treatment field (melted treatment site).

Fig. 9 is an enlarged plan view of the tempered glass sheet when the irradiation of the laser light L is actually performed. The processing conditions in this case are as follows.

Laser output: 20μJ

Wavelength: 532nm

Pulse width: 600ps

Pulse spacing PT: 66.7μm

Concentration position: 150 μm from the incident surface of the laser light.

As shown in FIG. 9, the modified portion 9 is formed inside the strengthened glass sheet 1 at intervals corresponding to the pulse pitch PT. Further, a plurality of cracks 9a are extended from the modified portion 9. The modified field 7 includes these modified portions 9 and cracks 9a.

The irradiation of the above-described laser light L is performed along all the planned cutting lines 5, and as shown in Fig. 10, a lattice-shaped modification along the line to cut 5 is formed inside the tempered glass sheet 1. Field 7". The portion surrounded by the modified field 7 means the portion corresponding to "each small lattice defined by the lattice-shaped modified field 7", and becomes an effective portion 12 of the tempered glass member. Each of the effective portions 12 is defined by the modified region 7a in the first direction and the modified region 7b extending in the second direction intersecting the first direction. In particular, even in the corner portion CP of the continuous outer effective portion 12, the modified field 7a and the modified region 7b form an intersection with each other. In other words, the modified field 7a and the modified field 7b extend further beyond the corner CP of the outermost effective portion 12 in the respective extending directions. By forming the above-described modified field 7, the processing of the corner portion CP of the effective portion 12 is facilitated.

The irradiation of the laser light L is performed on the inner side of a specific distance from the side surface 6 of the tempered glass sheet 1. In other words, the tempered glass sheet 1 is formed by a rectangular annular outer portion 1a including "the edge portion of the tempered glass sheet 1" and a rectangular inner portion 1b "located inside the outer portion 1a", and only the inner portion 1b illuminates the laser light L to form a modified field 7. More specifically, by cutting the predetermined line 5 and throughout the entire inner side The laser light L is irradiated (scanned) in 1b, and the modified region 7 is formed along the line to cut 5 and extending over the entire inner portion 1b. The modified field 7 is not formed in the outer portion 1a. Therefore, the modified field 7 is not exposed to the side surface 6 of the tempered glass sheet 1.

Next, as shown in part (a) of Fig. 11, the tempered glass sheet 1 on which the modified region 7 is formed is transferred from the support table 107 to the other support table 108. More specifically, the tempered glass sheet 1 is detached from the support table 107 for irradiating the laser light L, and the other support table 108 placed in the subsequent step for performing the cutting is transferred. At this time, the back surface 4 of the tempered glass sheet 1 is directed to the support surface side of the support table 108, and the tempered glass sheet 1 is placed on the support table 108. As described above, since the sheet such as the dicing film is not attached to the back surface 4 of the tempered glass sheet 1, the tempered glass sheet 1 is directly placed on the support table 108. The transfer of the tempered glass sheet 1 can be performed, for example, by using an adsorption pad or the like.

In the next step, the cutting of the tempered glass sheet 1 is performed. In the tempered glass sheet cutting method, there is a method in which stress is not applied to the tempered glass sheet 1 along the line to cut 5 (that is, along the modified field 7), but by placing the tempered glass sheet. 1 , the tempered glass sheet 1 is cut; and the tempered glass sheet 1 is cut by applying stress to the tempered glass sheet 1 along the line to cut 5 (that is, along the modified field 7). First, the description will be made on "the stress is not applied to the tempered glass sheet 1 along the modified field 7 but the tempered glass sheet 1 is placed by placing the tempered glass sheet 1".

In this case, first, the outer portion 1a is taken from the tempered glass sheet 1. Remove it. More specifically, first, as shown in part (a) of Fig. 11, a plurality of (four in this example) damaged portions 11 are formed on the side surface 6 of the tempered glass sheet 1. The damaged portion 11 is formed on the outer portion 1a of the strengthened glass sheet 1. The damaged portion 11 can be formed using a line forming device such as a diamond cutter or a laser line.

Then, the damaged portion 11 is used, and the tempered glass sheet 1 is cut along a straight line (the dotted line BL in the drawing direction: the extending direction of the damaged portion 11) along the line connecting the damaged portion 11 and the opposite side faces 6 . Thereby, as shown in part (b) of Fig. 11, the outer portion 1a is cut away from the tempered glass sheet 1, and the tempered glass sheet 1A is formed. As described above, in the inner portion 1b of the tempered glass sheet 1, the modified region 7 is formed integrally therewith. Therefore, the modified region 7 is exposed on the cut surface 6A of the tempered glass sheet 1A. Thereby, a state in which the modified field 7 is used as a starting point and internal stress can be released is formed.

Next, stress is not applied to the strengthened glass sheet 1A along the modified field 7, but the strengthened glass sheet 1A is placed for a specific period of time. Thereby, the crack generated from the modified field 7 reaches the surface 3 or the back surface 4 of the strengthened glass sheet 1A after a certain period of time by strengthening the release of the internal stress of the glass sheet 1A. Then, the crack is stretched along the modified field 7 by the release of internal stress, so that the strengthened glass sheet 1A is naturally cut along the modified field 7.

The time required to cut the strengthened glass sheet 1A (i.e., the time required from the crack occurring at the modified field 7 to reach the surface 3 or the back surface 4 of the strengthened glass sheet 1A) can be formed by modifying the above-mentioned field 7 Pulse in the step The pitch PT is adjusted to obtain control. More specifically, the shorter the pulse pitch PT is, the shorter the time is, and the longer the pulse pitch PT is, the longer the time is.

By forming the pulse pitch PT to 20 μm or more, it is possible to prevent the tempered glass 1 from being immediately after the irradiation of the laser light L (that is, the moment after the formation of the modified field 7, more specifically, when the formation can release the internal stress The moment of the state) is naturally cut off. In other words, when the pulse pitch PT is set to be shorter than 20 μm, the release of the internal stress is caused when the laser light L is irradiated, and sometimes the crack is caused to be "in addition to the portion containing the portion not irradiated with the laser light L". The direction is progressing. Therefore, once the pulse pitch PT is set to be shorter than 20 μm, the processing quality is lowered.

Further, by forming the pulse pitch PT to be 100 μm or less, it is possible to prevent the tempered glass sheet 1A from being cut. In other words, if the pulse pitch PT is formed to be longer than 100 μm, the effect of releasing the internal stress is weakened, and thus the tempered glass sheet 1A may not be cut naturally. For the above reasons, in the step of forming the modified region 7, the pulse pitch PT is preferably in the range of 20 μm or more and 100 μm or less.

Next, a case where "the tempered glass sheet 1 is cut by applying stress to the tempered glass sheet 1 along the modified field 7" will be described. In this case, a stress device such as a knife-edge is used to apply stress to the tempered glass sheet 1 along the tempered glass sheet 1. Thereby, the tempered glass sheet 1 can be cut along the modified field 7. In this case, although it is not necessary to cut the outer portion 1a from the tempered glass sheet 1, the outer portion 1a may be cut off in advance as described above.

Even in the application of the tempered glass sheet 1 by modifying the field 7 In the case where the tempered glass sheet 1 is cut, the internal stress is released by using the modified field 7 as a starting point, and the crack is progressed along the modified field 7 on the tempered glass sheet 1 to obtain a tempered glass. The plate 1 is cut along the modified field 7. In this case, the tempered glass sheet 1 can be cut at a desired timing by adjusting the timing of "stress is applied to the tempered glass sheet 1 along the line to cut 5".

As described above, by cutting the tempered glass sheet 1 (the tempered glass sheet 1A) along the modified region 7, the effective portion (cut sheet) 12 can be cut out from the tempered glass sheet 1 (the tempered glass sheet 1A). As shown in Fig. 12, the modified region 7 is exposed on the cut surface 12a of the cut effective portion 12. Therefore, in the next step, the modified region 7 is removed from the cut surface 12a of the effective portion 12.

The removal of the modified field 7 can be performed, for example, by mechanically grinding the cut surface 12a of the effective portion 12. Alternatively, the removal of the modified region 7 can be performed by "etching the cut surface 12a of the effective portion 12 with an acid or a base". In this way, as long as the modified region 7 is removed from the cut surface 12a of the effective portion 12, the bending strength can be improved.

After that, the cut surface 12a of the effective portion 12 of "after the modified field 7 has been removed" can be reinforced as needed. The strengthening of the cut surface 12a of the effective portion 12 can be performed, for example, by providing a resin film or an aluminum oxynitride film on the cut surface 12a. Alternatively, the strengthening of 12a of the effective portion 12 can be performed by chemically strengthening the cut surface 12a.

According to the above steps, from tempered glass plate 1 (reinforced glass plate 1A) The effective portion 12 is cut out, and the tempered glass member is manufactured from the effective portion 12.

As described above, in the tempered glass sheet cutting method of the present embodiment, the tempered glass 1 is irradiated with the laser light L at a predetermined pulse pitch PT along the line to cut 5 . Thereby, the modified region 7 is formed inside the strengthened glass sheet 1 along the line to cut 5 . The modified field 7 formed inside the tempered glass sheet 1 serves as a starting point for the release of internal stress. Therefore, the crack progresses along the modified field 7 by the release of internal stress. According to this, according to the tempered glass sheet cutting method, the tempered glass sheet 1 can be cut along the line to cut 5, that is, the tempered glass sheet 1 can be cut into a desired shape.

In particular, in the tempered glass cutting method of the present embodiment, the irradiation of the laser light L for forming the modified region 7 is performed by using a crack that occurs in the modified field 7 in the field of reforming. In this embodiment, it is assumed that the pulse pitch PT reaches the surface 3 or the back surface 4 of the tempered glass sheet 1 after a certain period of time has elapsed from the state in which the internal stress is released. Therefore, it is possible to suppress the tempered glass sheet 1 from being cut at an unexpected time point (for example, a point in time at which the tempered glass sheet 1 is placed on the support table 107 or a time point at which the tempered glass sheet 1 is transferred from the support table 107). According to this, according to the tempered glass sheet cutting method, the treatment of the tempered glass sheet 1 in which the modified field 7 has been formed is facilitated.

Further, in the tempered glass sheet cutting method of the present embodiment, the modified region 7 is formed only at the inner portion 1b of the tempered glass sheet 1 (that is, the edge portion of the tempered glass sheet 1 is not provided with the modified field 7 Outer part 1a). Therefore, the outer portion 1a becomes the inner portion of the tempered glass sheet 1 The resistance of the force release prevents the strengthened glass sheet 1 from being cut at the above-mentioned unexpected time point.

Further, in the tempered glass sheet cutting method of the present embodiment, a sheet such as a dicing film is not attached to the back surface 4 of the tempered glass sheet 1, and the tempered glass sheet 1 is directly placed on the support tables 107 and 108. Therefore, the sheet such as the dicing film does not interfere with the release of the internal stress in the tempered glass sheet 1 (the tempered glass sheet 1A). According to this, the tempered glass sheet 1 can be surely cut.

The above embodiment is merely an embodiment for explaining the method of cutting a tempered glass sheet of the present invention. Therefore, the tempered glass sheet cutting method of the present invention is not limited to the above-described tempered glass sheet cutting method. In the tempered glass sheet cutting method of the present invention, the above-described tempered glass sheet cutting method can be arbitrarily changed within the range in which the respective claims are not changed.

For example, in the step of forming the modified field 7, although the modified portion 7 is formed by irradiating the inner portion 1b of the strengthened glass sheet 1 with the laser light L, the steps for forming the modified field 7 are not limited. This aspect. That is, in the step for forming the modified field 7, the laser light L may be irradiated (scanned) by the entire outer portion 1a and the inner portion 1b of the strengthened glass sheet 1 along the line to cut 5, The modified field 7 is formed by extending along the entire cutting line 5 and the entire outer portion 1a and the inner portion 1b (i.e., extending over the entire tempered glass sheet 1).

In this case, although the state in which the internal stress can be released is formed while forming the modified region 7, the pulse pitch PT can be set to the above-described pitch so that the tempered glass sheet is not generated for a certain period of time. 1 Cut off. Further, even in this case, as described above, the tempered glass sheet 1 may not be stressed along the line to cut 5, and the tempered glass sheet 1 may be cut by placing the tempered glass sheet 1, and the tempered glass sheet 1 may be cut. The tempered glass sheet 1 is cut by applying a stress of the tempered glass sheet 1 along the line to cut 5 . In this way, the step for forming the tempered glass sheet 1 can be simplified as long as the entire tempered glass sheet 1 is extended to form the modified field 7.

Further, in the step for forming the modified region 7, the irradiation conditions of the laser light L other than the above-described pulse pitch PT may be adjusted. For example, by reducing the pulse width of the laser light L, the processing performance can be improved and the processing energy can be reduced. In addition, the convergence point P of the laser light L is located closer to the laser light incident surface (here, the surface 3) than the center of the enhanced glass plate 1 (that is, by being closer to the surface 3). Partial processing), and easier to form the modified field 7, can reduce processing energy.

Figure 13 is an enlarged plan view of a tempered glass sheet when the modified field is formed by two kinds of processing energy. In Fig. 13, the modified field 7A is a modified field formed in a case where the processing energy is small, and the modified field 7B is a modified field formed in a case where the processing energy is large. As shown in Fig. 13, if the processing energy is lowered, the size of the modified region (i.e., the modified portion 9 and the crack 9a) formed inside the tempered glass sheet can be reduced. In this way, as long as the size of the modified field is reduced, the bending strength can be improved and the end face processing procedure can be reduced.

Here, the processing conditions are preferably the same as those described in FIG. 9, but may be appropriately changed in accordance with the degree of strengthening of the tempered glass sheet 1 or other various conditions. For example, the laser output is more certain From the standpoint of performing the cutting, it is preferable to have a higher output (for example, preferably 20 μJ or more). Further, from the same viewpoint, it is preferable that the condensing position of the laser light L is a position closer to the surface 3 and the back surface 4 of the tempered glass sheet 1 (for example, 70 μm). For example, when the thickness of the tempered glass sheet 1 is 100 μm or more, the condensing position of the laser light L is preferably set to be about 50 μm from the surface 3 and the back surface 4 of the tempered glass sheet 1 Inside.

Further, as for the pulse pitch PT, as described in the above embodiment, it is preferably in the range of 20 μm to 100 μm so that the tempered glass sheet 1 is cut after a certain period of time from the irradiation of the laser light L. The tempered glass sheet 1 is not immediately cut after the irradiation of the laser light L. However, if the tempered glass sheet 1 is simply cut, it may be in the range of, for example, 8 μm to 12 μm. When the pulse pitch PT is set to a range of 8 μm to 12 μm, the tempered glass sheet 1 is cut immediately after the irradiation of the laser light L, and the tempered glass is cut as long as the irradiation of the laser light L is completed. Nearly the status of completion.

However, if the pulse pitch PT is set in the range of 20 μm to 100 μm, compared with the case where the pulse pitch PT is set in the range of 8 μm to 12 μm, the bending strength of the effective portion 12 can be increased and the number of modified portions 9 can be reduced. Therefore, the grinding step of the cut surface 12a of the effective portion 12 can be facilitated. For example, when the effective portion 12 as large as the touch panel of the portable terminal device is cut out, it is particularly effective to set the pulse pitch PT to a range of 20 μm to 100 μm. In addition, when the smaller effective portion 12 of 10 mm × 10 mm or less is cut out, the pulse pitch can also be used. The PT is set to a range of 8 μm to 12 μm. Then, when the effective portion 12 of a medium size is cut out, the pulse pitch PT can be set to a range in which a range of 8 μm to 12 μm and a range of 20 μm to 100 μm are combined.

Further, in the tempered glass sheet 1, an IR-cut coating may be provided on the incident surface of the laser light L. In this case, it is preferable to set the wavelength of the laser light L to 532 nm. Degree (the penetration cannot be achieved in the case of a wavelength of 1064 nm). In addition, the pulse width is preferably 100 ps or more (for example, about 100 ps to 800 ps) from the viewpoint of "stretching the crack from the modified field 7 well".

Further, in the step for forming the modified region 7, the polarization direction of the laser light L may be changed. In this case, the processing performance can be changed in accordance with the change in the polarization direction of the laser light L. Further, in the step for forming the modified region 7, by improving the condensing performance of the condensing lens 105, the modified region 7 can be formed with a low processing energy. Further, in the step for forming the modified region 7, the size of the modified region 7 can be controlled by changing the beam shape of the laser light L. Moreover, in the step for forming the modified field 7, multi-point processing can be performed. In this case, by simultaneously collecting the electroluminescence light L at a plurality of points inside the tempered glass sheet 1, the effect of heating attraction and internal stress release can be improved.

[Industrial availability]

The invention provides that the tempered glass sheet can be cut into a desired shape The method of cutting the tempered glass sheet.

1, 1A‧‧‧ tempered glass plate

1a‧‧‧Outer part

1b‧‧‧ inside part

3‧‧‧ surface

4‧‧‧Back

5‧‧‧ cut the booking line

7‧‧‧Change field

12‧‧‧Efficient part

L‧‧‧Laser light

PT‧‧‧pulse spacing

Fig. 1 is a schematic structural view of a laser processing apparatus for forming a modified field.

Fig. 2 is a plan view of an object to be processed which is an object of forming a modified field.

Fig. 3 is a cross-sectional view taken along line III-III of the object to be processed in Fig. 2;

Fig. 4 is a plan view of the object to be processed after laser processing.

Fig. 5 is a cross-sectional view taken along line V-V of the object to be processed in Fig. 4.

Fig. 6 is a cross-sectional view taken along line VI-VI of the object to be processed in Fig. 4.

Fig. 7 is a view for explaining main steps of a method for cutting a tempered glass sheet according to an embodiment of the present invention.

Fig. 8 is a view for explaining main steps of a method for cutting a tempered glass sheet according to an embodiment of the present invention.

Fig. 9 is a top-down enlarged photograph of a tempered glass sheet after forming a modified field.

Fig. 10 is a view for explaining main steps of a method for cutting a tempered glass sheet according to an embodiment of the present invention.

Fig. 11 is a view for explaining main steps of a method for cutting a tempered glass sheet according to an embodiment of the present invention.

Fig. 12 is a perspective view showing an effective portion cut by a tempered glass sheet cutting method according to an embodiment of the present invention.

Fig. 13 is a top-down enlarged photograph of a tempered glass sheet after forming a modified field.

L‧‧‧Laser light

P, P1, P2‧‧‧ spotlights

PT‧‧‧pulse spacing

1‧‧‧Strengthened glass plate

3‧‧‧ surface

4‧‧‧Back

6‧‧‧ side

7‧‧‧Change field

9‧‧‧Modified parts

107‧‧‧Support table

Claims (9)

A method for cutting a tempered glass by irradiating the tempered glass sheet with laser light along a line to cut along a tempered glass sheet, and forming a modified region inside the tempered glass sheet along the line to cut. A tempered glass sheet cutting method for cutting the tempered glass sheet along the line to cut, characterized in that the tempered glass sheet is formed along the line to cut by using a specific pulse pitch a step of forming the aforementioned modified region in the inside of the tempered glass sheet along the line to cut along the cutting line; and a step of cutting the tempered glass sheet along the line to cut; the specific pulse pitch Is a crack that can occur from the modified region, and the internal stress of the tempered glass sheet reaches at least one of the surface and the back surface of the tempered glass sheet after a certain period of time from the formation of the modified field. Pitch. The tempered glass sheet cutting method according to the first aspect of the invention, wherein the specific pulse pitch is 20 μm or more and 100 μm or less. The tempered glass sheet cutting method according to the first or second aspect of the invention, wherein the tempered glass sheet includes an outer portion including an edge portion of the tempered glass and an inner portion located further inside than the outer portion. In the step of forming the aforementioned modified field, along the aforementioned cutting line And the above-mentioned modified field is formed extending over the entire inner portion, and the aforementioned modified field is not formed in the aforementioned outer portion. The tempered glass sheet cutting method according to the third aspect of the invention, wherein in the step of cutting the tempered glass sheet, after the outer portion is cut out from the tempered glass sheet, the tempered glass sheet is placed And using the aforementioned internal stress to cause the crack to extend along the aforementioned cutting line to cut the tempered glass sheet. The tempered glass sheet cutting method according to the first, second or third aspect of the invention, wherein in the step of cutting the tempered glass sheet, the tempered glass sheet is applied along the line to cut Stress, while cutting the aforementioned tempered glass sheet. The tempered glass sheet cutting method according to the first or second aspect of the invention, wherein the tempered glass sheet includes an outer portion including an edge portion of the tempered glass and an inner portion located further inside than the outer portion. In the step for forming the above-described modified field, the modified region is formed to extend over the entire outer portion and the inner portion along the line to cut. The tempered glass sheet cutting method according to claim 6, wherein in the step of cutting the tempered glass sheet, the tempered glass sheet is placed and the crack is cut along the aforementioned by using the internal stress. The predetermined line is stretched to cut the aforementioned tempered glass sheet. The method for cutting a tempered glass sheet according to the sixth aspect of the invention, wherein in the step of cutting the tempered glass sheet, The tempered glass sheet is subjected to stress by applying the stress to the tempered glass sheet, and the tempered glass sheet is cut. The method for cutting a tempered glass sheet according to the first, second, third, fourth, fifth, sixth, seventh or eighth aspect of the patent application, further comprising: after the tempered glass sheet is cut, The cut surface of the effective portion cut out of the glass plate removes the steps in the above-mentioned field of modification.