TW201305522A - Fluid heat exchange systems - Google Patents

Fluid heat exchange systems Download PDF

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TW201305522A
TW201305522A TW101110072A TW101110072A TW201305522A TW 201305522 A TW201305522 A TW 201305522A TW 101110072 A TW101110072 A TW 101110072A TW 101110072 A TW101110072 A TW 101110072A TW 201305522 A TW201305522 A TW 201305522A
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heat
heat exchange
exchange system
recess
recessed
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TW101110072A
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Chinese (zh)
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TWI606224B (en
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Geoff Sean Lyon
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Coolit Systems Inc
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Priority claimed from US13/401,618 external-priority patent/US9453691B2/en
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Publication of TWI606224B publication Critical patent/TWI606224B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08Fluid driving means, e.g. pumps, fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microchannels, flows along any flow of heat transfer fluid that passes into the plurality of microchannels, flows along the full length of each of the plurality of microchannels in two directions outwardly from the fluid inlet opening. A method of cooling a heat generating component uses a fluid heat exchanger that splits a mass flow of coolant.

Description

流體熱交換系統 Fluid heat exchange system 相關申請案Related application

此申請案主張申請中之2012年2月12日提出的美國專利申請案第13/401,618號;申請中之2011年7月27日提出的美國臨時專利申請案第61/512,379號;申請中之2008年8月11日提出的美國專利申請案第12/189,476號;及2007年8月9日提出的美國臨時專利申請案第60/954,987號之利益及優先權,用於所有目的,該申請案係於其個別之全部中以引用的方式併入本文中。 U.S. Patent Application Serial No. 13/ 401, 618 filed on Feb. 12, 2012, filed on Jan. U.S. Patent Application Serial No. 12/189,476, filed on Aug. 11, 2008, and the benefit and priority of U.S. Provisional Patent Application Serial No. 60/954,987, filed on Aug. The text is incorporated herein by reference in its entirety.

在此中所揭示之革新及相關主題(共同地被稱為該“揭示內容”)大致上關於流體熱交換系統。一些系統係關於當作範例之電子元件冷卻應用的敘述,雖然所揭示之革新可被使用於各種其他應用中。 The innovations and related subject matter disclosed herein (collectively referred to as the "disclosed content") are generally related to fluid heat exchange systems. Some systems are described as examples of electronic component cooling applications, although the disclosed innovations can be used in a variety of other applications.

流體熱交換器被使用於藉由承接及消散來自電子及其他裝置的熱能而冷卻該電子及其他裝置。 Fluid heat exchangers are used to cool the electronics and other devices by receiving and dissipating thermal energy from electronics and other devices.

流體熱交換器尋求將熱能消散至一通過該流體熱交換器之流體,該熱能由一熱源連通該流體熱交換器。 The fluid heat exchanger seeks to dissipate thermal energy to a fluid passing through the fluid heat exchanger that is in communication with the fluid heat exchanger by a heat source.

儘管很多先前提出之流體熱交換系統的存在,在此留下一對於熱交換系統的需求,該熱交換系統被建構來提供改善之熱性能。同樣地,在此留下一對於系統的需求,且更特別地是,該系統被建構用於持續及開發小形狀因素。譬如,在此留下一對於低輪廓熱交換組件(例如整合式散熱 器與泵浦組件)的需求,該輪廓具有大約27毫米之直立的分量高度,諸如於大約24毫米至大約27.5毫米之間、或更少。在此亦留下一對於整合式零組件及具有更少之流體連接件的系統之需求。此外,在此對於整合式熱交換零組件中之低壓力損失流動變遷有一需求。 Despite the existence of many previously proposed fluid heat exchange systems, there is a need for a heat exchange system that is constructed to provide improved thermal performance. As such, there is a need for a system here, and more particularly, the system is constructed to continue and develop small form factors. For example, leave a low profile heat exchange component here (eg integrated heat sink) The need for a pump and pump assembly having an upright component height of about 27 millimeters, such as between about 24 millimeters and about 27.5 millimeters, or less. There is also a need for a system for integrated components and with fewer fluid connections. In addition, there is a need for low pressure loss flow transitions in integrated heat exchange components.

在此中所揭示之革新克服該先前技藝中之很多問題,並處理該前述、以及其他需求。在此中所揭示之革新大致上關於流體熱交換系統,且更特別地是、但不排他地關於用於此等系統中之整合式零組件的方法。譬如,一些革新係針對低輪廓泵浦外殼。其他革新係針對製造改良之熱傳送及/或壓力損失性能的散熱器設計。且其他革新係針對用於消除系統零組件、同時保留其個別之功能的方法。 The innovations disclosed herein overcome many of the problems of the prior art and address the foregoing and other needs. The innovations disclosed herein relate generally to fluid heat exchange systems, and more particularly, but not exclusively, to methods for integrated components in such systems. For example, some innovations are directed to low profile pump housings. Other innovations are directed to heat sink designs that produce improved heat transfer and/or pressure loss performance. And other innovations are directed to methods for eliminating system components while preserving their individual functions.

按照在此中所揭示之革新的一概括態樣,在此提供有一流體熱交換器,包括:均熱片板件,包含一預期的生熱零組件接觸區域;複數微型通道,用於將熱傳送流體引導在該均熱片板件之上,該複數微型通道之每一者具有第一端部及一相對的端部,且該複數微型通道之每一者大體上與其它微型通道彼此平行地延伸,及該複數微型通道之每一者在其第一端部與其相對的端部之間具有一連續式通道流動路徑;流體入口開口,用於該複數微型通道及定位在該微型通道的第一與相對的端部之間;第一流體出口開口,在該微型通道第一端部之每一者處來自該複數微型通道;及一相對的流體出口開口,在該微型通道相對的端部 之每一者處來自該複數微型通道,該流體入口開口與第一及相對的流體出口開口提供通入該複數微型通道之熱傳送流體的任何流動,其沿著該複數微型通道之每一者的全長於二方向中由該流體入口開口向外流動。 In accordance with a generalized aspect of the innovations disclosed herein, there is provided a fluid heat exchanger comprising: a heat spreader plate member comprising an intended heat generating component contact area; and a plurality of microchannels for heat A transfer fluid is directed over the heat spreader plate member, each of the plurality of microchannels having a first end and an opposite end, and each of the plurality of microchannels is substantially parallel to the other microchannels Extending, and each of the plurality of microchannels has a continuous channel flow path between its first end and its opposite end; a fluid inlet opening for the plurality of microchannels and positioned in the microchannel Between the first and opposite ends; a first fluid outlet opening from each of the plurality of microchannels at each of the first ends of the microchannel; and an opposite fluid outlet opening at an opposite end of the microchannel unit Each of the plurality of microchannels from the plurality of microchannels, the fluid inlet opening and the first and opposite fluid outlet openings providing any flow of heat transfer fluid to the plurality of microchannels along each of the plurality of microchannels The full length flows outwardly from the fluid inlet opening in the two directions.

按照所揭示之革新的另一概括態樣,在此提供有一用於冷卻生熱零組件的方法包括:提供一流體熱交換器,包含均熱片板件;複數微型通道,用於引導熱傳送流體在該均熱片板件之上,該複數微型通道之每一者具有第一端部及一相對的端部,且該複數微型通道之每一者在其第一端部與其相對的端部之間具有一連續式通道流動路徑;流體入口開口,用於該複數微型通道及定位在該微型通道的第一與相對的端部之間;第一流體出口開口,在該微型通道第一端部之每一者處來自該複數微型通道;及一相對的流體出口開口,在該微型通道相對的端部之每一者處來自該複數微型通道;將該均熱片板件安裝至該生熱零組件上,建立一生熱零組件接觸區域,在此該生熱零組件接觸該均熱片板件;將熱交換流體之流動導入至該流體熱交換器;驅策該熱交換流體之流動經過該流體入口進入該複數微型通道,首先至該微型通道的端部間之微型通道區域;及將該熱交換流體之流動轉向成複數子流動(subflow),每一子流動遠離彼此地流動,該複數子流動之第一子流動由該流體入口流動朝向該第一流體出口,且該複數子流動之第二子流動由該流體入口流動朝向該相對的流體出口。 In accordance with another general aspect of the disclosed innovations, a method for cooling a heat generating component is provided herein comprising: providing a fluid heat exchanger comprising a heat spreader plate member; and a plurality of microchannels for directing heat transfer Fluid is above the heat spreader plate member, each of the plurality of microchannels having a first end and an opposite end, and each of the plurality of microchannels is at a first end thereof opposite the end thereof Between the portions having a continuous channel flow path; a fluid inlet opening for the plurality of microchannels and positioned between the first and opposite ends of the microchannel; a first fluid outlet opening, first in the microchannel Each of the ends is from the plurality of microchannels; and an opposing fluid outlet opening is from the plurality of microchannels at each of the opposite ends of the microchannel; mounting the heat spreader plate member to the a heat generating component is formed, wherein the heat generating component contacts the heat equalizing plate member; and the flow of the heat exchange fluid is introduced into the fluid heat exchanger; and the flow of the heat exchange fluid is driven Passing through the fluid inlet into the plurality of microchannels, first to the microchannel region between the ends of the microchannel; and diverting the flow of the heat exchange fluid into a plurality of subflows, each of which flows away from each other, The first sub-flow of the plurality of sub-flows flows from the fluid inlet toward the first fluid outlet, and the second sub-flow of the plurality of sub-flows flows from the fluid inlet toward the opposite fluid outlet.

根據所揭示之革新的另一概括態樣,熱交換系統被揭 示。 According to another general aspect of the disclosed innovation, the heat exchange system is exposed Show.

一些被敘述之熱交換系統具有散熱器,該散熱器具有複數並列的散熱片,而在鄰接的散熱片之間界定對應的複數微型通道;及一凹入的溝槽,其相對該散熱片橫向地延伸。集流管本體至少局部地界定一大致上位在該溝槽上面的開口。 Some of the described heat exchange systems have a heat sink having a plurality of parallel fins defining a corresponding plurality of microchannels between adjacent fins; and a recessed trench transverse to the heat sink Extend the ground. The manifold body at least partially defines an opening generally above the groove.

該集流管本體及該溝槽可一起界定入口集流管的一部份。該入口集流管能被建構來通過液壓地將該微型通道之每一者平行地耦接至該微型通道之至少另一微型通道。 The manifold body and the groove may together define a portion of the inlet header. The inlet header can be configured to hydraulically couple each of the microchannels in parallel to at least one other microchannel of the microchannel.

該散熱器能具有一均熱片,使該散熱片之每一者由該均熱片延伸。於一些散熱器具體實施例中,該散熱片及該均熱片能形成單一結構。該散熱片之每一者能界定一與該均熱片隔開之對應的遠側邊緣,且該溝槽可為由該個別之複數遠側邊緣凹入。於一些散熱器具體實施例中,該凹入溝槽之最低範圍係與該均熱片隔開。於其他散熱器具體實施例中,該凹入溝槽之最低範圍係大體上與該均熱片有同等範圍。如在下面所敘述,該個別之遠側邊緣的每一者能界定一對應的凹入部份,藉此界定該凹入溝槽。 The heat sink can have a heat spreader such that each of the heat sinks extends from the heat spreader. In some embodiments of the heat sink, the heat sink and the heat spreader can form a unitary structure. Each of the fins can define a corresponding distal edge spaced from the heat spreader, and the groove can be recessed by the individual plurality of distal edges. In some embodiments of the heat sink, the lowest extent of the recessed trench is spaced from the heat spreader. In other embodiments of the heat sink, the minimum extent of the recessed trench is substantially the same as the heat spreader. As described below, each of the individual distal edges can define a corresponding recessed portion thereby defining the recessed recess.

於一些具體實施例中,該凹入溝槽包括被定位鄰接該散熱片之第一端部的第一溝槽、及被定位鄰接該散熱片之第二、相對端部的第二溝槽。譬如,該第一溝槽及該第二溝槽能界定一排出集流管之個別部份。 In some embodiments, the recessed trench includes a first trench positioned adjacent the first end of the heat sink and a second trench positioned adjacent the second, opposite end of the heat sink. For example, the first trench and the second trench can define an individual portion of the exhaust manifold.

該凹入溝槽之橫截面輪廓可具有各種形狀之任一種。譬如,於一些散熱器具體實施例中,該凹入溝槽之橫截面 輪廓包括以下群組之被選擇的一或多種,該群組包含v字形刻槽、半圓、拋物線、雙曲線、及至少具有一個大體上筆直邊緣的刻槽。 The cross-sectional profile of the recessed groove can have any of a variety of shapes. For example, in some embodiments of the heat sink, the cross section of the recessed groove The profile includes one or more selected groups of v-shaped grooves, semi-circles, parabolas, hyperbola, and grooves having at least one substantially straight edge.

於一些散熱器具體實施例中,該複數散熱片之代表性高度對該溝槽之代表性深度的比率係於大約10:1及大約10:7之間。譬如,該代表性高度對該代表性深度之比率可為於大約3:1及大約2:1之間。 In some embodiments of the heat sink, the representative height of the plurality of fins is a ratio of the representative depth of the trench to between about 10:1 and about 10:7. For example, the ratio of the representative height to the representative depth can be between about 3:1 and about 2:1.

該集流管本體中之開口可具有一凹入區域及一由該凹入區域延伸經過該集流管本體的孔口。於一些情況中,該集流管本體中之凹入區域係逐漸縮小的凹入區域,具有隨著該凹入區域之增加的深度而縮小之至少一橫截面尺寸。 該凹入溝槽鄰接該集流管本體之斜面與鄰接該溝槽的集流管本體中之凹入區域的斜面大體上可為連續的。該凹入區域、該孔口及該溝槽可一起界定一流動變遷,並具有一於大約百分之150及大約百分之200之間的特徵長度尺度,且大於該孔口之對應的特徵長度尺度。 The opening in the manifold body can have a recessed region and an aperture extending through the manifold body from the recessed region. In some cases, the recessed region in the manifold body is a tapered recessed region having at least one cross-sectional dimension that decreases as the recessed region increases in depth. The concave groove may be substantially continuous adjacent the slope of the header body and the slope of the recessed region in the header body adjacent the groove. The recessed region, the aperture, and the trench may together define a flow transition and have a feature length dimension between about 150 percent and about 200 percent greater than a corresponding feature of the aperture Length scale.

於在此中所敘述之一些熱交換系統型式中,該入口集流管能被建構來於橫截方向中相對該個別微型通道之縱向軸線運送一流體之流動至該微型通道之每一者。一些熱交換系統具有界定一入口高壓間的一本體。該入口高壓間及該入口集流管可被一起建構來運送一流體流動至於一大致上橫截於該散熱片之方向中。譬如,該入口集流管能被建構來運送該流體之撞擊流動至該微型通道之每一者。 In some of the heat exchange system versions described herein, the inlet header can be configured to carry a flow of fluid to each of the microchannels in a cross-sectional direction relative to a longitudinal axis of the individual microchannels. Some heat exchange systems have a body that defines an inlet high pressure chamber. The inlet high pressure chamber and the inlet header can be constructed together to transport a fluid flow in a direction generally transverse to the fin. For example, the inlet header can be constructed to carry the impact of the fluid to each of the microchannels.

於一些散熱器具體實施例中,該複數散熱片中之散熱 片的每一者界定一對應的形成斜面之遠側邊緣。 In some embodiments of the heat sink, the heat dissipation in the plurality of heat sinks Each of the sheets defines a corresponding distal edge forming a bevel.

一些熱交換系統亦具有單一的本體,其界定第一側面及第二側面,該第二側面與該第一側面相對地定位。該入口高壓間的一部份及該入口集流管的一部份可為由該第一側面分別地凹入。一來自該第二側面的凹部能界定一泵浦蝸殼,且該入口高壓間之由該第一側面凹入的部份能被定位鄰接該泵浦蝸殼。界定該泵浦蝸殼的凹部可為一大體上圓柱形凹部,並具有大體上垂直於該第二側面延伸之縱向軸線。該單一的本體能界定一開口,其大致上沿著該圓柱形凹部切線地延伸,且通過液壓地將該泵浦蝸殼耦接至該入口高壓間。 Some heat exchange systems also have a single body that defines a first side and a second side that are positioned opposite the first side. A portion of the inlet high pressure chamber and a portion of the inlet header may be recessed from the first side, respectively. A recess from the second side defines a pump volute, and a portion of the inlet high pressure recessed by the first side can be positioned adjacent to the pump volute. The recess defining the pump volute may be a generally cylindrical recess and have a longitudinal axis extending generally perpendicular to the second side. The single body can define an opening that extends generally tangentially along the cylindrical recess and that hydraulically couples the pump volute to the inlet high pressure chamber.

該本體能界定鄰接該入口集流管凹部的第二凹入區域及一分開該第二凹入區域與該入口集流管凹部的壁面。該集流管本體能被建構來跨越該入口集流管凹部及配套地嚙合該本體,使得該集流管本體如此佔據該第二凹入區域的一部份,以便界定一大致上位在該微型通道之每一者的個別部份上面之排出集流管。該複數微型通道之個別部份可由該入口集流管隔開。 The body can define a second recessed region adjacent the recess of the inlet header and a wall separating the second recessed region from the recess of the inlet header. The header body can be configured to span the inlet header recess and matingly engage the body such that the header body occupies a portion of the second recessed region to define a substantially upper position The discharge header above the individual portions of each of the channels. Individual portions of the plurality of microchannels may be separated by the inlet header.

按照所揭示之革新的又另一概括態樣,一些被敘述之熱交換系統具有一散熱器,該散熱器具有複數並列的散熱片,而在鄰接的散熱片之間界定對應的複數微型通道。該散熱片之每一者能界定一個別之形成斜面的遠側邊緣。集流管本體能位在該形成斜面之遠側邊緣的每一者之至少一部份上面,且界定一被建構來在橫截於該微型通道之方向 中運送流體之流動至該微型通道的開口。 In accordance with yet another generalized aspect of the disclosed innovations, some of the described heat exchange systems have a heat sink having a plurality of parallel fins defining a plurality of corresponding microchannels between adjacent fins. Each of the fins can define a further peripheral edge that forms a bevel. The manifold body can be positioned over at least a portion of each of the distal edges forming the ramp and defines a direction to be transverse to the microchannel The flow of the transport fluid to the opening of the microchannel.

個別之形成斜面的遠側邊緣及該均熱片間之距離能界定該個別散熱片之高度。每一個別之散熱片能界定第一端部及第二端部,且於該第一及該第二端部之間在翼展方向中相對該均熱片縱向地延伸。該複數散熱片之一或多個的個別散熱片高度能沿著該翼展方向變化。該集流管本體能具有一驅策抵靠著該遠側邊緣之每一者的至少一部份之順應部份。例如,散熱片高度沿著該翼展方向中之變化能界定該個別之遠側邊緣的一非線性輪廓,且該集流管本體之順應部份大致上能夠配合該非線性輪廓。 The distance between the individual beveled distal edges and the heat spreader can define the height of the individual fins. Each of the individual fins can define a first end and a second end and extend longitudinally relative to the heat spreader in the spanwise direction between the first and second ends. The individual fin heights of one or more of the plurality of fins can vary along the spanwise direction. The manifold body can have a compliant portion that urges against at least a portion of each of the distal edges. For example, a change in fin height along the spanwise direction can define a non-linear profile of the individual distal edge, and the compliant portion of the manifold body can substantially conform to the non-linear profile.

一凹入溝槽可相對該散熱片橫截地延伸,且該開口可大致上位在該溝槽上面。該個別之遠側邊緣的每一者能界定一對應的凹入部份,藉此界定該凹入溝槽。 A recessed groove may extend transversely relative to the heat sink and the opening may be substantially above the groove. Each of the individual distal edges can define a corresponding recessed portion thereby defining the recessed recess.

該複數散熱片之代表性高度對該溝槽之代表性深度的比率係於大約10:1及大約10:7之間。譬如,該代表性高度對該代表性深度之比率可為於大約3:1及大約2:1之間。 The representative height of the plurality of fins is a ratio of the representative depth of the trench to between about 10:1 and about 10:7. For example, the ratio of the representative height to the representative depth can be between about 3:1 and about 2:1.

根據所揭示之革新的另一概括態樣,單一的構造被敘述。譬如,單一的構造能具有第一側面、與該第一側面相對地定位的第二側面、及一延伸於該第一側面及該第二側面之間的大體上連續之周邊壁面。一底板能夠大致上分開該第一側面與該第二側面。該第一側面能界定一大體上圓柱形的凹部,且該第二側面能界定具有一區域的凹部,該區域被由大體上圓柱形凹部徑向地往外定位,該圓柱形凹部係藉由該第一側面所界定。 According to another general aspect of the disclosed innovation, a single construction is described. For example, a single configuration can have a first side, a second side positioned opposite the first side, and a substantially continuous peripheral wall extending between the first side and the second side. A bottom plate is capable of substantially separating the first side and the second side. The first side can define a generally cylindrical recess and the second side can define a recess having a region that is radially outwardly positioned by a generally cylindrical recess, the cylindrical recess being The first side is defined.

於一些情況中,該單一的構造能界定一孔口,該孔口延伸於該大體上圓柱形凹部及該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份之間。 In some cases, the unitary configuration can define an aperture extending from the generally cylindrical recess and the portion of the recess that is positioned radially outwardly from the generally cylindrical recess. between.

該周邊壁面能界定一或多個周邊凹部。該構造可於延伸在該周邊凹部之一及該大體上圓柱形凹部之間的底板中界定一孔口。該構造能界定一延伸在該周邊凹部之一及藉由該第二側面所界定的凹部之間的孔口。該構造能界定一孔口,該孔口延伸在該周邊凹部之一及該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份之間。 The perimeter wall can define one or more perimeter recesses. The configuration can define an aperture in the bottom plate extending between one of the perimeter recesses and the generally cylindrical recess. The configuration can define an aperture extending between one of the perimeter recesses and the recess defined by the second side. The configuration can define an aperture extending between one of the peripheral recesses and a portion of the recess from a second side that is radially outwardly defined by the generally cylindrical recess.

該一或多個周邊凹部可包含第一周邊凹部及第二周邊凹部。該構造能界定一延伸於該第二周邊凹部及藉由該第二側面所界定的凹部之間的孔口。該周邊壁面亦可界定第三周邊凹部,且該構造能界定一孔口,該孔口延伸在該第三周邊凹部及該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份之間。 The one or more peripheral recesses can include a first perimeter recess and a second perimeter recess. The configuration can define an aperture extending between the second peripheral recess and the recess defined by the second side. The peripheral wall surface can also define a third peripheral recess, and the configuration can define an aperture extending in the third peripheral recess and the second side of the recess that is radially outwardly positioned from the generally cylindrical recess Between the parts.

該構造的一些具體實施例大致上界定一外殼。該大體上圓柱形凹部能界定一泵浦蝸殼,且來自該第二側面之凹部能界定一高壓間。該高壓間可為一藉由該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份所界定之散熱器入口高壓間。來自該第二側面之凹部能界定散熱器入口集流管的一部份、及散熱器出口集流管的一部份。 Some embodiments of this configuration generally define an outer casing. The generally cylindrical recess defines a pump volute and the recess from the second side defines a high pressure chamber. The high pressure chamber may be a heat sink inlet high pressure space defined by a portion of the recess that is positioned radially outwardly from the generally cylindrical recess. The recess from the second side can define a portion of the radiator inlet header and a portion of the radiator outlet header.

應了解的是對於那些熟諳此技藝者,由以下之詳細敘述,其他創新之態樣將輕易地變得明顯,其中各種具體實施例經由說明被顯示及敘述。如將被施行,其他及不同的 具體實施例為可能的,且數個細節能夠於各種其他方面中修改,所有皆未由在此中所揭示之原理的精神及範圍脫離。 It will be apparent that those skilled in the art will be readily apparent from the following detailed description. If it will be implemented, other and different The specific embodiments are possible, and the details can be modified in various other aspects, all without departing from the spirit and scope of the principles disclosed herein.

據此,該圖面及詳細之敘述本質上將被視為說明性及不被視為限制性的。 Accordingly, the drawings and detailed description are to be regarded as illustrative and not restrictive.

下文經由參考特定之範例敘述關於熱交換系統的各種創新之原理。然而,所揭示之原理的一或多個可被併入各種系統組構中,以達成各種對應系統特徵之任一種。在下面有關所附圖面所提出之詳細的敘述係意欲當作各種具體實施例之敘述,且不意欲僅只代表藉由本發明家所考慮之具體實施例。為提供在此中所揭示之原理的廣泛理解之目的,該詳細之敘述包含特定之細節。然而,對於那些熟諳此技藝者在回顧此揭示內容之後將變得明顯的是,所主張之發明的一或更多項可被實踐,而沒有所說明之細節的一或多個。 The various innovative principles of the heat exchange system are described below with reference to specific examples. However, one or more of the disclosed principles can be incorporated into various system configurations to achieve any of a variety of corresponding system features. The detailed description of the drawings, which are set forth below, are intended to be illustrative of the specific embodiments. The detailed description contains specific details for the purpose of providing a broad understanding of the principles disclosed herein. It will be apparent, however, that those skilled in the art, after reviewing this disclosure, that one or more of the claimed invention may be practiced without one or more of the details described.

不同地陳述之,關於特別組構、應用、或使用所敘述之系統僅只是併入在此中所揭示之創新原理的一或多個之系統的範例,且被使用於說明所揭示之原理的一或多個創新態樣。如此,具有與那些在此中所討論之特定範例不同的屬性之熱交換系統能具體化該創新原理的一或多個,且能夠被使用在於此中未詳細地敘述的應用中,譬如將熱傳送至資料中心中之零組件、雷射零組件、發光二極體、化學反應、光電池、太陽能集熱器、電子零組件、功率電子元件、光電子元件(例如被使用於開關中)、及現在已知或此 後被開發的各種其他工業、軍事與消費者裝置,或由以上之裝置傳送熱。據此,此等另外選擇的具體實施例亦落在此揭示內容之範圍內。 It is stated differently that the system described with respect to a particular configuration, application, or use is merely an example of one or more systems incorporating the innovative principles disclosed herein, and is used to illustrate the disclosed principles. One or more innovative aspects. As such, a heat exchange system having properties different from those of the specific examples discussed herein can exemplify one or more of the innovative principles and can be used in applications not described in detail herein, such as heat. Transfer to components in the data center, laser components, light-emitting diodes, chemical reactions, photovoltaic cells, solar collectors, electronic components, power electronics, optoelectronic components (eg used in switches), and now Known or this Various other industrial, military, and consumer devices that were later developed, or that transmit heat from the above devices. Accordingly, such alternative embodiments are also within the scope of this disclosure.

流體迴路Fluid circuit

圖1中之概要說明圖顯示在所揭示之以流體為基礎的熱交換器系統之中的數個共通之功能性特色。譬如,該流體迴路10具有被建構來吸收來自熱源(於圖1中未示出)之熱的第一熱交換器11、及被建構來由該迴路10排出熱之第二熱交換器12。如在圖1中所指示,工作流體、或冷卻劑能於該熱交換器11、12之間循環,以將藉由該第一熱交換器中之工作流體所吸收之能量載送至該第二熱交換器12,在此能量能被由該流體排出。該熱交換器11、12的一或兩者可為微型通道熱交換器。 The schematic illustration in Figure 1 shows several common functional features in the disclosed fluid-based heat exchanger system. For example, the fluid circuit 10 has a first heat exchanger 11 that is configured to absorb heat from a heat source (not shown in FIG. 1), and a second heat exchanger 12 that is configured to discharge heat from the circuit 10. As indicated in Figure 1, a working fluid, or coolant, can be circulated between the heat exchangers 11, 12 to carry energy absorbed by the working fluid in the first heat exchanger to the first The second heat exchanger 12, where energy can be discharged from the fluid. One or both of the heat exchangers 11, 12 may be microchannel heat exchangers.

如在此中使用,“微型通道”意指一流體導管、或通道,具有譬如測量少於大約1毫米、諸如大約0,1毫米、或十分之數毫米的至少一主要尺寸(例如通道寬度)。 As used herein, "microchannel" means a fluid conduit, or channel, having at least one major dimension (eg, channel width), such as measuring less than about 1 millimeter, such as about 0, 1 millimeter, or tenths of a millimeter. .

如在此中使用,“流體性”意指或關於一流體(例如氣體、液體、液相及氣相之混合物等)。如此,“流體性地耦接”的二區域係如此彼此耦接,以便對該區域間之壓力梯度作出回應而允許流體由該區域之一者流動至另一區域。 As used herein, "fluid" means or relates to a fluid (eg, a mixture of a gas, a liquid, a liquid phase, and a gas phase, etc.). As such, the two regions that are "fluidly coupled" are coupled to each other such that fluid is allowed to flow from one of the regions to another region in response to the pressure gradient between the regions.

如在此中使用,該“工作流體”及“冷卻劑”等詞係可互換的。雖然很多配方的工作流體係可能的,共通之配方包含蒸餾水、乙二醇、丙二醇、及其混合物。 As used herein, the terms "working fluid" and "coolant" are used interchangeably. While many formulations of workflow systems are possible, common formulations include distilled water, ethylene glycol, propylene glycol, and mixtures thereof.

如在此中使用,該“散熱器”及“熱交換器”等詞係 可互換的,且意指一被建構來經過對流(亦即,傳導及平流之組合)熱傳送而傳送能量至流體或由流體傳送能量的裝置。 As used herein, the words "heat sink" and "heat exchanger" Interchangeable, and means a device that is configured to transfer energy to or from a fluid through convection (ie, a combination of conduction and advection).

再次參考圖1,該工作流體典型進入第一集流管13(有時候在通過一入口高壓間之後,用於易於說明之故,該入口高壓間被由圖1省略)。由該集流管13,該流體能被分佈在複數流體通道14之中,該流體通道14被建構來將來自熱傳送表面、例如該熱交換器11中之壁面的熱傳送至該工作流體。於一些具體實施例中,諸如在下面所敘述之範例,該流體通道14被建構為微型通道,且該壁面被建構為延伸的熱傳送表面、或散熱片。 Referring again to Figure 1, the working fluid typically enters the first header 13 (sometimes after passing through an inlet high pressure chamber for ease of explanation, the inlet high pressure chamber is omitted from Figure 1). From the header 13, the fluid can be distributed among a plurality of fluid passages 14 that are configured to transfer heat from a heat transfer surface, such as a wall in the heat exchanger 11, to the working fluid. In some embodiments, such as the examples described below, the fluid channel 14 is constructed as a microchannel and the wall is constructed as an extended heat transfer surface, or fin.

於該迴路10之操作期間,能量由該第一熱交換器之壁面傳導(例如擴散)進入該通道14內之鄰接的流體微粒,且該鄰接之流體微粒被由該壁面掃除、或平流傳送,載送藉由該壁面所吸收之能量。該被掃除之微粒係藉由其他、通常較冷的流體微粒所替換,該較冷的流體微粒更輕易地吸收來自該壁面之能量(例如,由於其通常較低的溫度)。傳導及平流(亦即,對流)之此一組合提供一用於冷卻裝置的有效率之方式,該裝置譬如具有相當高的熱通量、諸如為電子裝置。 During operation of the circuit 10, energy is conducted (eg, diffused) from the wall of the first heat exchanger into adjacent fluid particles within the channel 14, and the adjacent fluid particles are swept away or advected by the wall. Carrying energy absorbed by the wall. The swept particles are replaced by other, generally cooler, fluid particles that more readily absorb energy from the wall (e.g., due to their generally lower temperature). This combination of conduction and advection (i.e., convection) provides an efficient means of cooling the device, such as having a relatively high heat flux, such as an electronic device.

在通過該第一熱交換器11中的複數通道14之後,該被加熱之工作流體收集在一排出集流管15中,且通過至該第二熱交換器12,以該被加熱之工作流體載送由該第一熱交換器11所吸收之能量。當該被加熱之流體通過該第二熱 交換器12時,能量經過類似於那些上面所述之對流製程被由該流體排出(譬如至另一工作流體,諸如該空氣或建築物之供水源)。由該第二熱交換器,該被冷卻之工作流體通過一泵浦16及回至該第一熱交換器11。 After passing through the plurality of channels 14 in the first heat exchanger 11, the heated working fluid is collected in a discharge header 15 and passed to the second heat exchanger 12 to the heated working fluid The energy absorbed by the first heat exchanger 11 is carried. When the heated fluid passes the second heat At the time of exchanger 12, energy is discharged by the fluid through a convection process similar to those described above (e.g., to another working fluid, such as a source of water for the air or building). From the second heat exchanger, the cooled working fluid passes through a pump 16 and back to the first heat exchanger 11.

圖1中之虛線盒子指示該迴路10之數個功能性零組件能被整合成單一個次組件。當作一範例,該次組件20包含該泵浦16、該集流管13、15、及該通道14,以及例如該泵浦及該集流管13間之導管。入口21及出口22操作地耦接該次組件20至該第二熱交換器12。此一次組件20之工作具體實施例係有關圖7以及下列等被敘述在下面。 The dashed box in Figure 1 indicates that several of the functional components of the loop 10 can be integrated into a single sub-assembly. As an example, the subassembly 20 includes the pump 16, the headers 13, 15 and the passage 14, and a conduit between the pump and the header 13, for example. The inlet 21 and the outlet 22 are operatively coupled to the secondary assembly 20 to the second heat exchanger 12. The specific embodiment of this primary assembly 20 is described below with respect to Figure 7 and the following.

有關該第一熱交換器11、該第二熱交換器12、或兩者,在此中所敘述之創新特色的每一者可單獨或結合地被併入。 Each of the innovative features described herein with respect to the first heat exchanger 11, the second heat exchanger 12, or both may be incorporated separately or in combination.

熱交換器範例Heat exchanger example

參考圖2至4,流體熱交換器100被顯示。流體熱交換器100包含一均熱片板件102、被界定於壁面110間之流體微型通道103的配置、流體入口通道104、及流體出口通道106。外殼109與均熱片板件102一起作用,以形成該散熱器的外部限制及界定流體流動通道104、106。 Referring to Figures 2 through 4, fluid heat exchanger 100 is shown. Fluid heat exchanger 100 includes a heat spreader plate member 102, a configuration of fluid microchannels 103 defined between wall faces 110, a fluid inlet passage 104, and a fluid outlet passage 106. The outer casing 109 cooperates with the heat spreader plate member 102 to form an outer limit of the heat sink and define fluid flow passages 104,106.

如圖3及4中所顯示,於使用中,該熱交換器100被耦接至一熱源107、諸如一電子裝置,該電子裝置包含、但不被限制於微晶片或積體電路。該熱交換器可藉由一設置在其間之熱介面材料、藉由直接耦接至該熱源之表面、或藉由一體形成該熱源及至少該流體熱交換器之均熱片板件 102而被熱耦接至該熱源。該熱交換器100可採取各種形式及形狀,但均熱片板件102被形成,以由熱源107承接熱能。均熱片板件102包含一預期的生熱零組件接觸區域102b,該生熱零組件接觸區域102b被定位在該均熱片板件102上之習知位置上。於所說明之具體實施例中,均熱片板件102在區域102b包含一突出部份,該突出部份控制該均熱片板件相對該熱源之定位,但此一突出部份不須被包含。假如想要,則均熱片板件102可包含更具傳導性之材料的一部份,以有利於熱傳送及控制熱傳送。於任一案例中,均熱片板件20被形成來裝在區域102b中的熱源之上,並與該熱源熱連通,且通常相對該均熱片板件之邊緣中心地安置。 As shown in Figures 3 and 4, in use, the heat exchanger 100 is coupled to a heat source 107, such as an electronic device, including, but not limited to, a microchip or integrated circuit. The heat exchanger may be formed by a thermal interface material disposed therebetween, by directly coupling to the surface of the heat source, or by integrally forming the heat source and at least the heat plate member of the fluid heat exchanger 102 is thermally coupled to the heat source. The heat exchanger 100 can take a variety of forms and shapes, but the heat plate member 102 is formed to receive thermal energy from the heat source 107. The heat spreader plate member 102 includes a desired heat generating component contact region 102b that is positioned at a known location on the heat spreader plate member 102. In the illustrated embodiment, the heat spreader plate member 102 includes a protruding portion in the region 102b that controls the positioning of the heat spreader plate member relative to the heat source, but the protruding portion does not need to be contain. If desired, the heat spreader sheet 102 can include a portion of a more conductive material to facilitate heat transfer and control heat transfer. In either case, the heat spreader sheet member 20 is formed over the heat source in the region 102b and is in thermal communication with the heat source and is generally centrally disposed relative to the edge of the heat spreader sheet member.

微型通道103被形成,以承接及允許熱交換流體之流動通過該微型通道,使得該流體可沿著均熱片板件102及壁面110移動,並由均熱片板件102及壁面110承接及消散熱能。於所說明之具體實施例中,微型通道103被熱耦接至該均熱片板件的壁面110所界定,以承接來自該壁面110之熱能。譬如,均熱片板件102可包含一面朝內、上表面102a,且複數微型通道壁面110可由該上表面102a向上地延伸,藉此被界定於上表面102a及該微型通道壁面110間之通道區域輸送或引導流體,以建立一流體流動路徑。該通道區域可為開放式或導熱之多小孔材料、諸如金屬或矽發泡材料、燒結的金屬等充填。導熱的、多小孔材料允許流經該通道,但建立一迂迴曲折的流動路徑。 A microchannel 103 is formed to receive and allow the flow of heat exchange fluid to pass through the microchannel such that the fluid can move along the heat spreader plate member 102 and the wall surface 110, and is supported by the heat spreader plate member 102 and the wall surface 110 and Eliminate heat dissipation. In the illustrated embodiment, the microchannel 103 is thermally coupled to the wall surface 110 of the heat spreader plate member to receive thermal energy from the wall surface 110. For example, the heat spreader plate member 102 can include an inwardly facing, upper surface 102a, and the plurality of microchannel wall faces 110 can extend upwardly from the upper surface 102a, thereby being defined between the upper surface 102a and the microchannel wall surface 110. The channel region transports or directs fluid to establish a fluid flow path. The channel region may be filled with an open or thermally conductive aperture material such as a metal or tantalum foam material, sintered metal, or the like. A thermally conductive, multi-porous material allows flow through the channel but creates a tortuous flow path.

表面102a及微型通道壁面110允許該流體遭受來自該均熱片板件的熱能之變換,以冷卻耦接至該均熱片板件的熱源。該上表面102a及壁面110具有一高導熱性,以允許由該熱源107至通過通道103之流體的熱傳送。形成通道103的表面可為平滑及堅固的,並以諸如燒結的金屬及/或金屬或矽發泡材料之多小孔組結構來形成,或為表面粗糙的,譬如,包含凹陷部及/或凸出處,其被設計來由一特別位置收集或排出流體、或建立所選擇之流體流動性質。面朝微型通道壁面110可被以一平行之組構來建構,如所顯示,或可被以別的方式所形成,倘若流體能沿著一流體路徑流動於該微型通道壁面110之間。對於一熟諳此技藝者將變得明顯的是該微型通道壁面110可被以任何另一適當之組構來另一選擇地建構,視所想要之流動的各種因素、熱交換等而定。例如,溝槽可被形成於微型通道壁面110的各區段之間。大致上,微型通道壁面110可合意地具有各種尺寸及性質,該尺寸及性質企圖減少或盡可能使流動經過被界定在壁面110之間的通道103之流體的壓降或差壓減至最小。 The surface 102a and the microchannel wall 110 allow the fluid to undergo thermal energy conversion from the heat spreader plate to cool the heat source coupled to the heat spreader plate. The upper surface 102a and the wall surface 110 have a high thermal conductivity to allow heat transfer from the heat source 107 to the fluid passing through the passage 103. The surface forming the channel 103 may be smooth and strong and formed in a multi-hole group structure such as sintered metal and/or metal or tantalum foam material, or may be roughened, for example, including depressions and/or A projection that is designed to collect or drain fluid from a particular location or to establish a selected fluid flow property. The facing microchannel walls 110 can be constructed in a parallel configuration, as shown, or can be otherwise formed, provided that fluid can flow between the microchannel walls 110 along a fluid path. It will be apparent to those skilled in the art that the microchannel wall 110 can be alternatively constructed in any other suitable configuration, depending on various factors of desired flow, heat exchange, and the like. For example, a groove can be formed between the sections of the microchannel wall 110. In general, the microchannel wall 110 can desirably have various dimensions and properties that attempt to reduce or minimize the pressure drop or differential pressure of fluid flowing through the channel 103 defined between the walls 110 as much as possible.

該微型通道壁面110可具有一在20微米至1毫米的範圍內之寬度尺寸、及一在100微米至五毫米之範圍內的高度尺寸,視該熱源107之功率、想要之冷卻效果等而定。該微型通道壁面110可具有一長度尺寸,該長度尺寸之範圍在100微米及數公分之間,視該熱源之尺寸、及來自該熱源之熱通量密度而定。於一具體實施例中,該壁面110 延伸完全通過區域102b之均熱片板件的全長尺寸(其可為一寬度)。這些為示範尺寸,且當然,其他微型通道壁面尺寸係可能的。該微型通道壁面110可藉由20微米至1毫米之分離尺寸範圍被隔開,視該熱源107之功率而定,雖然其他分離尺寸被考慮。 The microchannel wall 110 may have a width dimension in the range of 20 micrometers to 1 millimeter and a height dimension in the range of 100 micrometers to 5 millimeters depending on the power of the heat source 107, the desired cooling effect, and the like. set. The microchannel wall 110 can have a length dimension ranging between 100 microns and a few centimeters, depending on the size of the heat source and the heat flux density from the heat source. In a specific embodiment, the wall 110 The full length dimension (which may be a width) of the heat spreader sheet extending completely through region 102b. These are exemplary sizes and, of course, other microchannel wall sizes are possible. The microchannel wall 110 can be separated by a separation size range of 20 microns to 1 mm, depending on the power of the heat source 107, although other separation dimensions are contemplated.

其他多微孔的通道組構可被另一選擇地使用於微型通道、或譬如隨同微型通道被使用,該微型通道諸如一系列導柱、散熱片、或起伏部等,其由該均熱片板件上表面或迂迴曲折的通道往上地延伸,如藉由發泡材料或燒結的表面所形成。 Other microporous channel configurations may alternatively be used in microchannels, such as with a microchannel, such as a series of pillars, fins, or undulations, etc., from which the fins are The upper surface of the panel or the meandering channel extends upwardly, such as by a foamed material or a sintered surface.

流體熱交換器100另包含一流體入口通道104,於所說明之具體實施例中,該流體入口通道104包含穿過該外殼開口至集管頭112的通口111、及此後一至該多微孔的流體通道103之流體入口開口114。 The fluid heat exchanger 100 further includes a fluid inlet passage 104. In the illustrated embodiment, the fluid inlet passage 104 includes a port 111 through the housing opening to the header 112, and thereafter to the microporous The fluid inlet opening 114 of the fluid passage 103.

流體分佈Fluid distribution

該通口及該集管頭能夠以各種方式及組構被形成。譬如,如想要,通口111可如所顯示被定位在該熱交換器之頂部、側面、或端部區域上。通口111及集管頭112大致上具有比開口114較大的橫截面積,以致流體之質量流大體上可被連通,而不會限制於開口114。 The port and the header can be formed in a variety of ways and configurations. For example, if desired, the port 111 can be positioned on the top, side, or end regions of the heat exchanger as shown. The port 111 and the header 112 generally have a larger cross-sectional area than the opening 114 such that the mass flow of fluid is substantially communicable without being limited to the opening 114.

雖然僅只單一個流體入口開口114被顯示,在此可有一或多個流體入口開口,並提供由該集管頭至該流體微型通道103的連通。 Although only a single fluid inlet opening 114 is shown, there may be one or more fluid inlet openings and provide communication from the header to the fluid microchannel 103.

流體入口開口114可通至與該均熱片板件相向的微型 通道103,使得通過該開口之流體可在沿著該通道的軸向長度轉向之前通過壁面110之間朝向表面102a,該通道延伸平行於x軸。既然大部份裝置將定位該均熱片板件當作熱交換器100之最低、如藉由重力所決定的零組件,該流體入口開口114大致上可被敘述為定位在該微型通道103上方,使得流體可於一相對表面102a的平面正交之方向中流經開口114向下進入該通道,並朝向表面102a,且接著改變方向,以沿著通道103之長度大體上平行於表面102a與x軸地通過。此方向變化係藉由流體之撞擊抵靠著表面102a所驅動。 The fluid inlet opening 114 can open to a miniature opposite the heat spreader plate The passage 103 is such that fluid passing through the opening can pass between the wall faces 110 toward the surface 102a prior to turning along the axial length of the passage, the passage extending parallel to the x-axis. Since most of the devices will position the heat spreader plate as the lowest of the heat exchanger 100, such as by gravity, the fluid inlet opening 114 can be generally described as being positioned above the microchannel 103. So that fluid can flow down through the opening 114 into the channel in a direction orthogonal to the plane of the opposing surface 102a, and toward the surface 102a, and then change direction to be substantially parallel to the surface 102a and x along the length of the channel 103. Pass through the shaft. This change in direction is driven against the surface 102a by the impact of the fluid.

流體入口開口114可被定位毗連該習知之預期的生熱零組件接觸區域102b,因為該均熱片板件之此區域可被暴露至比板件102上之其他區域較大的熱能輸入。鄰接區域102b定位該流體入口開口企圖首先導入新鮮的熱交換流體及直接至該熱交換器之最熱的區域。開口114的位置、配置、及/或尺寸可考慮區域102b之位置被決定,使得開口114可被放置成鄰接該熱板上之預期的生熱零組件接觸區域102b、譬如與該生熱零組件接觸區域102b正交地相向、或根據該常見之安裝組構而在該生熱零組件接觸區域102b上方。新鮮流體之首先運送至與待冷卻的生熱零組件直接連通之區域企圖在該接觸區域以及在該均熱片板件中遠離該接觸區域的區域建立一均勻之溫度。 The fluid inlet opening 114 can be positioned adjacent the conventionally contemplated heat generating component contact region 102b because this region of the heat spreader plate member can be exposed to a greater thermal energy input than other regions on the panel member 102. The contiguous region 102b positions the fluid inlet opening in an attempt to first introduce fresh heat exchange fluid and directly into the hottest zone of the heat exchanger. The position, configuration, and/or size of the opening 114 can be determined in consideration of the location of the region 102b such that the opening 114 can be placed adjacent to the desired heat generating component contact region 102b on the hot plate, such as with the heat generating component. Contact regions 102b are oriented orthogonally or above the heat generating component contact region 102b in accordance with the conventional mounting configuration. The fresh fluid is first transported to the area in direct communication with the heat generating component to be cooled in an attempt to establish a uniform temperature in the contact area and in the area of the heat spreader sheet that is remote from the contact area.

於所說明之具體實施例中,開口114被定位至使其幾何中心對齊在區域102b的中心、譬如幾何中心之上。應注 意的是其可藉由意圖、及盡可能形成該散熱器均熱片板件而有利於建構及安裝,該均熱片板件將安裝有該生熱零組件,該生熱零組件大體上相對於該板件之周邊被中心地定位在該板件上,且接著開口114亦可被定位,使其幾何中心大體上相對於該均熱片板件之周邊被中心地定位。這樣一來,該開口114、該均熱片板件、及該生熱零組件之每一者的幾何中心點大體上可全部被對齊,如在C。 In the particular embodiment illustrated, the opening 114 is positioned such that its geometric center is aligned at the center of the region 102b, such as above the geometric center. Note It is intended that it can be advantageously constructed and installed by intent and as much as possible to form the heat sink sheet of the heat sink, which will be fitted with the heat generating component, which is substantially The perimeter of the panel is centrally positioned relative to the panel, and then the opening 114 can be positioned such that its geometric center is generally centrally positioned relative to the perimeter of the heat spreader panel. As such, the geometric center points of each of the opening 114, the heat spreader plate member, and the heat generating component can be substantially all aligned, such as at C.

開口114可延伸在任一通道103之上,其想要的是該熱交換流體流動經過該通道103。如想要,開口114可採取各種形式,包含譬如各種形狀、各種寬度、筆直或彎曲之邊緣(平面內或拆開的),以提供流體流動特色、開放區域等。 The opening 114 can extend over any of the channels 103 through which it is desirable for the heat exchange fluid to flow. If desired, the opening 114 can take a variety of forms including, for example, various shapes, various widths, straight or curved edges (in-plane or disassembled) to provide fluid flow characteristics, open areas, and the like.

熱交換器100另包含一流體出口通道106,於所說明之具體實施例中,該流體出口通道106包含來自該多微孔的流體通道103之一或多個流體出口開口124、集管頭126、及一由該外殼打開之出口通口128。雖然二流體出口開口124被顯示,在此可有一或多個流體出口開口,並由該流體通道103提供連通至該集管頭。 The heat exchanger 100 further includes a fluid outlet passage 106 that, in the illustrated embodiment, includes one or more fluid outlet openings 124, headers 126 from the microporous fluid passage 103. And an outlet port 128 that is opened by the outer casing. Although the two fluid outlet openings 124 are shown, there may be one or more fluid outlet openings therein and the fluid passages 103 provide communication to the header.

該通口及該集管頭能夠以各種方式及組構被形成。譬如,如想要,通口128可如所顯示地被定位在該熱交換器之頂部、側面或端部區域上。 The port and the header can be formed in a variety of ways and configurations. For example, if desired, the port 128 can be positioned as shown on the top, side or end regions of the heat exchanger.

流體出口開口124可被定位在微型通道103之端部。交互地或此外,如所顯示,流體出口開口124可建立一相向於均熱片板件102的開口,使得通過該通道的流體沿著該通道之長度於壁面110之間軸向地通過,且接著改變方 向,以通過遠離表面102a而由該壁面110之間離開,以經過開口124出去。既然大部份裝置將該均熱片板件定位當作熱交換器100的最低、如由重力所決定之零組件,該流體出口開口124將大致上被定位在該微型通道103上方,使得該流體可由該通道向上地流動經過開口124。 The fluid outlet opening 124 can be positioned at the end of the microchannel 103. Interactively or in addition, as shown, the fluid outlet opening 124 can establish an opening that faces the heat equalizer plate member 102 such that fluid passing through the passageway passes axially between the wall faces 110 along the length of the passageway, and Then change the party To exit away from the wall 110 by passing away from the surface 102a to exit through the opening 124. Since most of the devices position the heat spreader plate as the lowest of the heat exchanger 100, as determined by gravity, the fluid outlet opening 124 will be positioned substantially above the microchannel 103 such that Fluid can flow upwardly through the opening 124 through the passage.

流體出口開口124可被與流體入口開口114隔開,以致流體被強迫通過通道103之長度的至少一部份,在此熱交換在離開該微型通道之前發生。大致上,流體出口開口124可為與該習知之預期的生熱零組件接觸區域102b隔開。 The fluid outlet opening 124 can be spaced from the fluid inlet opening 114 such that fluid is forced through at least a portion of the length of the passage 103 where heat exchange occurs prior to exiting the microchannel. In general, the fluid outlet opening 124 can be spaced from the conventionally contemplated heat generating component contact area 102b.

於所說明之具體實施例中,在此熱交換器100係意欲安裝有大致上相對均熱片板件102之周邊、且藉此相對該通道之端部103a來中心地定位的熱源107,開口124可被定位在通道端部103a或鄰接通道端部103a。 In the particular embodiment illustrated, the heat exchanger 100 is intended to be mounted with a heat source 107 that is substantially centrally positioned relative to the periphery of the heat spreader plate member 102 and thereby centrally positioned relative to the end portion 103a of the passageway. 124 can be positioned at the channel end 103a or adjacent the channel end 103a.

至少一開口124延伸在任一通道103之上,其想要的是該熱交換流體流動經過該通道103。如想要,開口124可採取各種形式,包含譬如各種形狀、各種寬度、筆直或彎曲之邊緣(平面內或拆開的),以提供流體流動特色、開放區域等。 At least one opening 124 extends over either channel 103, it is desirable for the heat exchange fluid to flow through the channel 103. If desired, the opening 124 can take a variety of forms including, for example, various shapes, various widths, straight or curved edges (in-plane or disassembled) to provide fluid flow characteristics, open areas, and the like.

流體入口開口114可遠離該微型通道之端部打開,譬如沿著微型通道於其端部間之長度。這樣一來,流體被導入一連續通道103的中間區域而非流體被導入至通道的一端部,且允許其流動該通道之整個長度。於所說明之具體實施例中,熱交換器100係意欲以熱源107被安裝,該熱源107大致上相對均熱片板件102之周邊被中心地定位。 如此,於所說明之具體實施例中,開口114大致上相對該熱板件102之邊緣被中心地定位。於所說明之具體實施例中,既然該通道大體上沿著該熱板件之長度於其相對的側面周邊之間連續地延伸,開口114大致上於每一通道的端部103a之間中心地打開。譬如,開口114可被定位在該熱交換器的中間百分之50中、或盡可能在該熱交換器的中間百分之20中。首先在通過通道的其餘長度之前,新鮮流體之運送至該中心區域企圖在區域102b以及在該均熱片板件毗連該預期的安裝位置中之區域建立一均勻之溫度,在此該生熱零組件係與該均熱片板件直接連通。流體之沿著該微型通道的中間區域引導至一區域將由該入口向外地通過朝向一對出口,該流動在該區域之後分裂為二子流動,該對出口之每一者被定位在該通道之端部,而減少沿著該通道所通過之流體的壓降,如果該流體沿著每一通道之整個長度通過,該壓降將被造成。分開該流體流動以允許僅只大約該入口質量流動的一半沿著該微型通道之任一特別區域通過,建立更少之背壓及更少之流動阻抗,允許經過該通道之更快的流體流動及減少移動該流體經過該熱交換器所需之泵浦力量。 The fluid inlet opening 114 can be opened away from the end of the microchannel, such as along the length of the microchannel between its ends. In this way, the fluid is introduced into the intermediate region of a continuous passage 103 rather than the fluid being introduced into one end of the passage and allowing it to flow the entire length of the passage. In the particular embodiment illustrated, heat exchanger 100 is intended to be mounted with a heat source 107 that is generally centrally positioned relative to the perimeter of the heat spreader plate member 102. As such, in the particular embodiment illustrated, the opening 114 is generally centrally positioned relative to the edge of the thermal plate member 102. In the illustrated embodiment, the opening 114 is substantially centrally between the ends 103a of each channel since the passage extends generally along the length of the hot plate member between its opposite side edges. turn on. For example, the opening 114 can be positioned in the middle 50 percent of the heat exchanger, or as much as 20 percent in the middle of the heat exchanger. First, prior to passing the remaining length of the passage, fresh fluid is transported to the central region in an attempt to establish a uniform temperature in the region 102b and in the region of the heat spreader panel adjacent the intended mounting location, where the heat is zero. The component is in direct communication with the heat spreader plate. The fluid is directed along an intermediate region of the microchannel to an area that will pass outwardly from the inlet toward a pair of outlets, the flow splitting into two sub-flows after the region, each of the pair of outlets being positioned at the end of the passage And reducing the pressure drop of the fluid passing along the passage, which will be caused if the fluid passes along the entire length of each passage. Separating the fluid flow to allow only about half of the inlet mass flow to pass along any particular region of the microchannel, establishing less back pressure and less flow resistance, allowing for faster fluid flow through the passage and The pumping force required to move the fluid through the heat exchanger is reduced.

於使用中,在區域102b,均熱片板件102被定位在與熱源107熱連通。藉由熱源107所產生之熱被向上傳導經過均熱片板件102至表面102a及壁面110。如藉由箭頭F所顯示,熱交換流體經過通口111進入該流體熱交換器、通入該集管頭112及經過開口114。該熱交換流體接著向下 通過壁面110之間而進入通道103,在此該流體承接來自該壁面110及表面102a的熱能。在向下通過進入該通道之後,該熱交換流體接著撞擊抵靠著表面102a,以將轉向朝向該通道之端部103a朝向出口開口124。這樣一來,於所說明之具體實施例中,該流體大致上被分裂為二子流動,並在該微型通道之端部彼此移動遠離及遠離入口114朝向開口124。通過通道之流體變得被加熱,特別是當通過與該熱源直接接觸的區域之上時,於所說明之具體實施例中,該區域諸如該均熱片板件的中心區域。被加熱之流體離開開口124通過進入集管頭及此後經過通口128。該被加熱之流體將循環經過一散熱器,在此其熱能在循環回至通口111之前被排出。 In use, in region 102b, the soaked sheet member 102 is positioned in thermal communication with heat source 107. The heat generated by the heat source 107 is conducted upwardly through the heat equalizing sheet member 102 to the surface 102a and the wall surface 110. As indicated by arrow F, the heat exchange fluid enters the fluid heat exchanger through port 111, into the header 112, and through opening 114. The heat exchange fluid then goes down Passing between the walls 110 enters the channel 103 where it receives thermal energy from the wall 110 and surface 102a. After passing down into the passage, the heat exchange fluid then impinges against the surface 102a to direct the turn toward the end 103a of the passage toward the outlet opening 124. Thus, in the particular embodiment illustrated, the fluid is substantially split into two sub-flows and moves away from and away from the inlet 114 toward the opening 124 at the ends of the microchannel. The fluid passing through the passage becomes heated, particularly when passing over a region in direct contact with the heat source, such as the central region of the heat spreader sheet member in the particular embodiment illustrated. The heated fluid exits the opening 124 through the header and thereafter passes through the port 128. The heated fluid will circulate through a heat sink where its thermal energy is discharged before it is circulated back to the port 111.

當比較於其它的定位及定尺寸時,開口114及124之個別與相對定位及定尺寸可允許流體循環經過該熱交換通道103,同時減少通過該熱交換器100的流體中所產生之壓降。於所說明之具體實施例中,譬如,出口開口124的中心區域124a被作成扇形,以由該中心定位的通道提供一相對那些在該邊緣者放大的出口區域。此塑形提供相對該熱交換器之側面,來自一些中心定位通道103的出口開口係比來自其它較接近至該邊緣之通道的出口開口較大。這提供如下:流動經過該更中心地定位的通道之流體遭遇更少之阻抗,以流動經過該通道,再者有利於流動通過均熱片板件102上之中心安裝區域102b。 When compared to other positioning and sizing, the individual and relative positioning and sizing of the openings 114 and 124 may allow fluid to circulate through the heat exchange passage 103 while reducing the pressure drop generated in the fluid passing through the heat exchanger 100. . In the illustrated embodiment, for example, the central region 124a of the outlet opening 124 is fanned to provide an outlet region that is enlarged relative to those at the edge by the centrally located passage. This shaping provides a side opening relative to the heat exchanger, and the outlet opening from some of the central positioning channels 103 is larger than the outlet opening from other channels closer to the edge. This is provided as follows: the fluid flowing through the more centrally located passage encounters less impedance to flow through the passage and again facilitates flow through the central mounting region 102b on the heat spreader plate member 102.

一密封件130分開流體入口通道104與流體出口通道 106,以致流體必需通過該多微孔的通道103,並通過均熱片板件表面102a。 A seal 130 separates the fluid inlet passage 104 from the fluid outlet passage 106, so that fluid must pass through the microporous channel 103 and through the soaked sheet surface 102a.

製造之方法Manufacturing method

參考圖5及6,用於製造一流體熱交換器之有用的方法被敘述。一均熱片板件202可被提供,其具有經過至少大約其中心區域之厚度的熱傳導性質。 Referring to Figures 5 and 6, a useful method for making a fluid heat exchanger is described. A heat spread sheet member 202 can be provided having a heat transfer property through a thickness at least about its central region.

微型通道可被形成在該均熱片板件之表面上,如藉由累積材料或從該熱板件之表面移除材料而加入壁面或形成壁面。於一具體實施例中,削片被使用於形成壁面210。 A microchannel may be formed on the surface of the heat spreader plate member, such as by adding or removing material from the surface of the heat plate member to join the wall or form a wall. In a specific embodiment, the shavings are used to form the wall 210.

一板件240可被安裝在該壁面210之上,以封閉越過壁面210的上限之通道。板件240已部份被移除,以分別於該最後的熱交換器中建立入口及出口開口214及224。翼片242可被用來輔助板件240之定位及安裝,其中翼片242被向下彎曲在該二最外邊壁面之上。 A panel 240 can be mounted over the wall 210 to close the passage of the upper limit of the wall 210. The plate 240 has been partially removed to establish inlet and outlet openings 214 and 224 in the final heat exchanger, respectively. The tab 242 can be used to aid in the positioning and mounting of the panel 240, wherein the tab 242 is bent downward over the two outermost walls.

密封件230可被安裝當作板件240的一部份或分開地安裝。 The seal 230 can be mounted as part of the panel 240 or separately.

在板件240及密封件230被定位之後,一頂部蓋子244能被安裝在該組件之上。頂部蓋子244能包含向下延伸直至一鄰接均熱片板件之位置的側壁。該零件可於其組裝期間被連接或其後大致藉由熔合技術被連接。這樣一來,該零件被連接,以致由入口通道至出口通道之短的迴路大體上被避免,設定如上文在此中所敘述之流體迴路,其中該流體經過壁面210之間所界定的通道由開口214流動至開口224。 After the panel 240 and seal 230 are positioned, a top cover 244 can be mounted over the assembly. The top cover 244 can include side walls that extend downwardly up to a position adjacent the heat spreader panel. The parts may be joined during their assembly or may be joined substantially by fusion techniques. In this way, the part is connected such that a short loop from the inlet passage to the outlet passage is substantially avoided, setting the fluid circuit as described herein above, wherein the fluid passes through the passage defined between the walls 210 Opening 214 flows to opening 224.

系統整合System integration

現在參考圖7,整合式次組件20(圖1)之工作範例被敘述。所說明之次組件300包括一泵浦310(例如312及313,不計保留機件302)與一熱交換器320以及外殼330,並具有延伸在其間之整合式流體導管。該次組件300僅只係方法之一範例,用於將圖1中所顯示之流體迴路10的數個元件(例如該泵浦16及該第一熱交換器11,包含該入口集流管13、該流體通道14、該排出集流管15)整合成單一元件,同時保留該數個元件之個別功能。所說明之外殼330被建構來由一入口通口331運送工作流體至一泵浦蝸殼311、由該泵浦蝸殼至一入口321(圖11)至該熱交換器320、及由該熱交換器的一出口322(圖11)至一出口通口332。 Referring now to Figure 7, a working example of integrated subassembly 20 (Figure 1) is described. The illustrated subassembly 300 includes a pump 310 (e.g., 312 and 313, excluding the retention mechanism 302) and a heat exchanger 320 and housing 330, and has an integrated fluid conduit extending therebetween. The subassembly 300 is merely an example of a method for the several components of the fluid circuit 10 shown in FIG. 1 (eg, the pump 16 and the first heat exchanger 11 including the inlet header 13 The fluid passages 14, the discharge headers 15) are integrated into a single component while retaining the individual functions of the plurality of components. The illustrated housing 330 is constructed to carry a working fluid from an inlet port 331 to a pump volute 311, from the pump volute to an inlet 321 (Fig. 11) to the heat exchanger 320, and from the heat An outlet 322 (Fig. 11) of the exchanger is connected to an outlet port 332.

該泵浦葉輪312能夠被承納在該泵浦蝸殼311中。該葉輪能以傳統方式藉由電動馬達313旋轉地驅動。蓋子301能位在該馬達313上面及緊固至該外殼330,以使該次組件300設有一完成之外觀,而適合供與譬如消費者電子元件一起使用。 The pump impeller 312 can be received in the pump volute 311. The impeller can be rotationally driven by the electric motor 313 in a conventional manner. A cover 301 can be positioned over the motor 313 and secured to the outer casing 330 to provide the finished assembly 300 with a finished appearance suitable for use with, for example, consumer electronic components.

被定位相向於該泵浦蝸殼311的外殼330之側面333能承納一插件334及該熱交換器320。一密封件(例如O形環)323可被定位在該外殼330及該熱交換器320之間,以減少及/或消除來自該熱交換器320及該外殼330之間的介面之工作流體的滲漏。 A side 333 of the outer casing 330 positioned opposite to the pump volute 311 can receive an insert 334 and the heat exchanger 320. A seal (e.g., O-ring) 323 can be positioned between the outer casing 330 and the heat exchanger 320 to reduce and/or eliminate working fluid from the interface between the heat exchanger 320 and the outer casing 330. leakage.

該熱交換器320界定該組件300之最下面,以及一表面被建構來熱耦接至一積體電路(IC)封裝(未示出)。保留機 件302可機械式地將該組件耦接至一基板、諸如印刷電路板,而該IC封裝被組裝至該印刷電路板。 The heat exchanger 320 defines the lowermost portion of the assembly 300 and a surface is constructed to be thermally coupled to an integrated circuit (IC) package (not shown). Retention machine The member 302 can mechanically couple the assembly to a substrate, such as a printed circuit board, and the IC package is assembled to the printed circuit board.

關於圖1中所顯示之次組件20,一流體導管、或另一流體耦合器能夠將一遠端定位之熱交換器的出口通口流體性地耦接至該外殼330的入口通口331。同樣地,一流體導管、或另一流體耦合器能夠將該外殼330之出口通口332流體性地耦接至該遠端定位的熱交換器之入口通口。於一冷卻應用中,該個別之流體導管由該出口通口332至該遠端之熱交換器運送相對較高溫度的流體、由該遠端之熱交換器至該入口通口331運送相對較低溫度的流體。 With respect to the secondary assembly 20 shown in FIG. 1, a fluid conduit, or another fluid coupler, can fluidly couple the outlet port of a remotely located heat exchanger to the inlet port 331 of the outer casing 330. Likewise, a fluid conduit, or another fluid coupler, can fluidly couple the outlet port 332 of the outer casing 330 to the inlet port of the remotely located heat exchanger. In a cooling application, the individual fluid conduits carry relatively high temperature fluid from the outlet port 332 to the remote heat exchanger, and are relatively transported by the remote heat exchanger to the inlet port 331 Low temperature fluid.

整合式外殼Integrated housing

現在經由參考圖7、8、9、10及11敘述單一外殼330之具體實施例。所說明的外殼330具有第一側面340、與該第一側面相向地定位之第二側面333、及一延伸於該第一側面及該第二側面之間而大體上連續的周邊壁面348。一底板、或下壁面341(圖9)大致上分開該第一側面與該第二側面。該相向之第一側面340及第二側面333界定個別之凹入特色,當與對應的零組件結合時,該特色界定整合式流體導管及腔室,並可操作來在小形狀因素內(例如在一具有譬如少於大約1.5吋、諸如大約0.75吋及大約1.4吋間之最大直立尺寸的容量內)運送一工作流體。 A specific embodiment of a single housing 330 will now be described with reference to Figures 7, 8, 9, 10 and 11. The illustrated housing 330 has a first side 340, a second side 333 positioned opposite the first side, and a substantially continuous peripheral wall 348 extending between the first side and the second side. A bottom plate or lower wall 341 (Fig. 9) substantially separates the first side from the second side. The opposing first side 340 and second side 333 define individual recessed features that, when combined with corresponding components, define an integrated fluid conduit and chamber and are operable to be within a small form factor (eg, A working fluid is carried within a capacity having a maximum upright dimension of, for example, less than about 1.5 inches, such as about 0.75 inches and about 1.4 inches.

譬如,該外殼具有流體性地互相耦接之入口通口331、泵浦蝸殼311、一入口高壓間335(圖10)、對應於該入口高壓間的入口集流管部份336、排出(出口)集流管部份337、 對應於該排出集流管部份的排出(出口)高壓間338、及出口通口332。 For example, the outer casing has fluidly coupled inlet ports 331, a pump volute 311, an inlet high pressure chamber 335 (Fig. 10), an inlet header portion 336 corresponding to the inlet high pressure, and a discharge ( Export) manifold portion 337, A discharge (outlet) high pressure chamber 338 and an outlet port 332 corresponding to the discharge manifold portion.

圖8及9顯示該周邊壁面能界定一凹入的入口通口331。該外殼330的第一側面340界定一形成該泵浦蝸殼311之大體上圓柱形凹部,且該凹入蝸殼311之底板係藉由一大體上圓形的下壁面341所界定。該下壁面中之孔口342形成一由該入口通口至該泵浦蝸殼311的入口,使一入口通道343於該入口通口331及該入口342之間延伸至該泵浦蝸殼311,流體性地彼此耦接該泵浦蝸殼及該入口通口。 Figures 8 and 9 show that the peripheral wall surface can define a recessed inlet port 331. The first side 340 of the outer casing 330 defines a generally cylindrical recess forming the pump volute 311, and the bottom plate of the recessed volute 311 is defined by a generally circular lower wall surface 341. The opening 342 in the lower wall surface forms an inlet from the inlet port to the pump volute 311, so that an inlet passage 343 extends between the inlet port 331 and the inlet 342 to the pump volute 311. The pump volute and the inlet port are fluidly coupled to each other.

該外殼330的相向(例如第二)側面333界定第二凹入區域350,該第二凹入區域350界定該入口(例如第一)高壓間335及該出口集流管區域336。一開口344延伸經過一分開該入口高壓間335與該泵浦蝸殼311(於圖10中未示出)之共用的壁面345,並流體性地互相耦接該泵浦蝸殼與該第一高壓間。於一些具體實施例中,該開口344大致上由該圓柱形泵浦蝸殼311切線地延伸。 The opposing (eg, second) side 333 of the outer casing 330 defines a second recessed region 350 that defines the inlet (eg, first) high pressure chamber 335 and the outlet header region 336. An opening 344 extends through a common wall 345 separating the inlet high pressure chamber 335 from the pump volute 311 (not shown in FIG. 10) and fluidly coupling the pump volute to the first High pressure room. In some embodiments, the opening 344 extends substantially tangentially from the cylindrical pump volute 311.

一裝載通口349能延伸經過該周邊壁面348及進入該入口高壓間335,在組裝完成之後,允許一已組裝之系統被以工作流體裝載。在裝載之後,一插塞(未示出)能被插入該裝載通口349以密封之。 A loading port 349 can extend through the peripheral wall 348 and into the inlet high pressure chamber 335, allowing an assembled system to be loaded with working fluid after assembly is complete. After loading, a plug (not shown) can be inserted into the loading port 349 to seal it.

如圖10中所顯示,入口集流管336之深度可由一鄰接該入口高壓間335的相對更深之區域逐漸變小至一與該入口高壓間隔開的相對更淺之區域。如圖11中所顯示及在下面更充分地敘述,如圖7中所顯示,一集流管插件334能 被定位鄰接該集流管區域336之傾斜凹部、例如“位在其上面”,且至少局部地形成一至該散熱器320的入口集流管及沿著流動方向具有一逐漸縮小的橫截面區域。該逐漸縮小的集流管能在該散熱器320的複數通道之中分佈工作流體的一大體上均勻之質量流動率。 As shown in Figure 10, the depth of the inlet header 336 can be tapered from a relatively deeper region adjacent the inlet high pressure chamber 335 to a relatively shallower region spaced from the inlet high pressure. As shown in FIG. 11 and described more fully below, a manifold plug 334 can be as shown in FIG. An inclined recess positioned adjacent to the header region 336, such as "on top of", and at least partially forms an inlet header to the heat sink 320 and has a tapered cross-sectional area along the flow direction. The tapered header can distribute a substantially uniform mass flow rate of the working fluid among the plurality of channels of the heat sink 320.

該外殼330之第二側面333可界定第三凹入區域351(圖10),該第三凹入區域351界定一排出集流管337之個別部份(圖11)。如在下面更充分地敘述者,該第三凹入區域351能位在該熱交換器320的一部份上面,且藉此承接一來自該微型通道之排出工作流體。 The second side 333 of the outer casing 330 can define a third recessed region 351 (Fig. 10) that defines an individual portion of the discharge header 337 (Fig. 11). As described more fully below, the third recessed region 351 can be positioned over a portion of the heat exchanger 320 and thereby receive a discharge working fluid from the microchannel.

第四凹入區域352(圖10)能至少局部地界定一出口高壓間338。該第三凹部351及該第四凹部352可為流體性地耦接至彼此,且藉由一壁面346與該第二凹入區域350分開。一開口347(圖9)能延伸於該出口高壓間338及該出口通口332之間。 The fourth recessed region 352 (Fig. 10) can at least partially define an outlet high pressure chamber 338. The third recess 351 and the fourth recess 352 may be fluidly coupled to each other and separated from the second recessed area 350 by a wall surface 346. An opening 347 (Fig. 9) can extend between the outlet high pressure chamber 338 and the outlet port 332.

如上述之集流管外殼、或整合式外殼能具有單一的結構,且譬如使用現在已知或此後被開發的射出成形技術、機械加工技術、或另一合適之製程所形成。任何合適之材料亦可被使用在該外殼之結構中,倘若該材料係與該次組件300之其他零組件及該工作流體相容。譬如,射出成形的外殼能由其所形成之共通的材料包含聚苯硫醚(通常被稱為“PPS”)、聚四氟乙烯(通常被稱為“PTFE”或來自杜邦公司之商品名TEFLON)、及丙烯腈-丁二烯-苯乙烯(通常被稱為“ABS”)。 The header housing, or the integrated housing, as described above, can have a unitary construction and is formed, for example, using injection molding techniques, machining techniques, or another suitable process now known or later developed. Any suitable material may also be used in the construction of the outer casing provided that the material is compatible with the other components of the subassembly 300 and the working fluid. For example, the common material from which the injection molded outer casing can be formed comprises polyphenylene sulfide (commonly referred to as "PPS"), polytetrafluoroethylene (commonly referred to as "PTFE" or trade name TEFLON from DuPont). And acrylonitrile-butadiene-styrene (commonly referred to as "ABS").

雖然上述外殼具有單一的結構,該外殼330之其他具體實施例能包括子零組件之總成。儘管如此,單一的結構典型具有更少之可分開的耦接件,而工作流體能由該耦接件滲漏。 While the housing described above has a unitary construction, other embodiments of the housing 330 can include an assembly of sub-components. Nonetheless, a single structure typically has fewer separable couplings from which the working fluid can leak.

集流管插件Collector plug

如上面所提及在圖7及11中所顯示,一插件334可被定位於該熱交換器320及該外殼330之間。另外,該插件334能具有一輪廓,其大致上對應於該外殼330的第二側面333中之一或多個該凹入區域350、351、352的組構。當該插件334係與該外殼330咬合時,與該輪廓插件334結合的凹入區域350、351及352能界定數個導管、或流體耦合器,並適合用於運送一工作流體,以便用流體地耦接該熱交換器320與該泵浦蝸殼311及該出口通口332。 As shown above in Figures 7 and 11, an insert 334 can be positioned between the heat exchanger 320 and the outer casing 330. Additionally, the insert 334 can have a contour that generally corresponds to the configuration of one or more of the recessed regions 350, 351, 352 in the second side 333 of the outer casing 330. When the insert 334 is engaged with the outer casing 330, the recessed regions 350, 351 and 352 associated with the contour insert 334 can define a plurality of conduits, or fluid couplers, and are adapted to carry a working fluid for use with a fluid The heat exchanger 320 is coupled to the pump volute 311 and the outlet port 332.

譬如,該插件334能界定一開口,其延伸經過該本體360及大致上位在藉由該外殼330所界定之逐漸縮小的集流管部份336上面。該開口能包含一凹入區域365及一孔口361。該外殼中之凹入區域365及該逐漸縮小的凹部336一起界定該入口集流管之腔室。如在下面被敘述,該集流管能在該散熱器內的數個微型通道之中分佈工作流體。 For example, the insert 334 can define an opening that extends through the body 360 and over the tapered header portion 336 that is substantially constricted by the outer casing 330. The opening can include a recessed area 365 and an aperture 361. The recessed area 365 in the outer casing and the tapered recess 336 together define a chamber of the inlet header. As described below, the header can distribute the working fluid among a plurality of microchannels within the heat sink.

該插件334的本體360可與該外殼330之一或更多特色配套地嚙合。譬如,該本體360能界定複數隔開構件362a,b,c,d及一相對該孔口361橫向地延伸之槽形凹部363。該槽形凹部363能延伸於該構件362a,c之間及該構件362b,d之間。當該插件334係與該外殼330組裝時,該構件362a, b,c,d被定位在該第二凹入區域351的對應部份中,且一對應的背脊339(圖10)被定位在該槽形凹部363內。藉由用該外殼所界定之跨騎特色,該插件被建構來以大致上可重複的方式對齊該孔口361與該逐漸縮小的集流管區域336。 The body 360 of the insert 334 can be mated with one or more features of the outer casing 330. For example, the body 360 can define a plurality of spaced apart members 362a, b, c, d and a slotted recess 363 that extends transversely relative to the aperture 361. The slotted recess 363 can extend between the members 362a, c and between the members 362b, d. When the insert 334 is assembled with the outer casing 330, the member 362a, b, c, d are positioned in corresponding portions of the second recessed region 351, and a corresponding back ridge 339 (Fig. 10) is positioned within the slotted recess 363. The insert is configured to align the aperture 361 with the tapered header region 336 in a substantially repeatable manner by virtue of the straddle feature defined by the outer casing.

該插件本體360亦界定一輪廓翼片364,其被建構來位在該凹入的入口高壓間335上面。此外,該插件的第二凹入區域365內之肩部366驅策抵靠著壁面346(圖10),提供一分開該入口集流管與該排出集流管及出口高壓間的密封。 The insert body 360 also defines a contour flap 364 that is configured to seat over the recessed inlet high pressure chamber 335. In addition, the shoulder 366 in the second recessed region 365 of the insert urges against the wall 346 (Fig. 10) to provide a seal separating the inlet header from the discharge header and the outlet high pressure.

於一工作具體實施例中,該凹入區域365(圖19)係逐漸縮小的,至少具有一隨著該凹部之增加的深度而縮小之橫截面尺寸。如在下面更充分地說明,該插件中之凹部365及該孔口361能大致上位在該散熱器散熱片中之溝槽325(圖19)上面。於一些情況中,一鄰接該孔口361界定該逐漸縮小之凹部365的壁面之斜面能被匹配至該凹入溝槽325鄰接該散熱器散熱片之遠側端部的斜面(例如能與其對應、或另一選擇係與其相同),提供一相當平順及連續之流動變遷。 In a working embodiment, the recessed region 365 (Fig. 19) is tapered, having at least a cross-sectional dimension that decreases as the depth of the recess increases. As explained more fully below, the recess 365 and the aperture 361 in the insert can be substantially over the groove 325 (Fig. 19) in the heat sink fin. In some cases, a bevel adjacent the aperture 361 defining the wall of the tapered recess 365 can be matched to the bevel of the recessed end 325 abutting the distal end of the heat sink fin (eg, corresponding thereto) Or another option is the same) to provide a fairly smooth and continuous flow change.

該插件能具有橫側地相接該孔口361(圖11)之一或多個(例如一對)大致上相似的、平坦表面367。如在圖19中所顯示,該表面367可大致上位在該熱交換器320之個別部份(例如散熱器散熱片400之遠側端部401(圖16及17))上面,界定該微型通道延伸於鄰接散熱片之間的一上流動邊界,類似於圖5及6中所顯示之板件240。該相似的表面 367能驅策抵靠著該個別之遠側端部,且在該複數散熱片之中、及在一給定的散熱片內配合高度中之變化(例如具有源自散熱片高度h2中之變化的非線性縱向輪廓的散熱片(圖18A及18B))。該相似的表面367能減少或消除用於二次機械加工操作之需求,該機械加工操作被使用於造成該散熱片的個別遠側端部大致上為與譬如一堅硬的板件同平面及相容。同樣地,驅策抵靠著該散熱片400(400’)之遠側端部401的相似表面367能與該散熱片形成一密封,且防止一工作流體繞過被界定於鄰接散熱片之間的通道。 The insert can have a substantially similar flat surface 367 that laterally abuts one or more (e.g., a pair) of the apertures 361 (Fig. 11). As shown in FIG. 19, the surface 367 can be substantially above the individual portions of the heat exchanger 320 (e.g., the distal end 401 (FIGS. 16 and 17) of the heat sink fin 400) defining the microchannel. Extending from an upper flow boundary between adjacent fins, similar to the panel 240 shown in Figures 5 and 6. The similar surface 367 can urge against the individual distal end and vary in the mating height of the plurality of fins and within a given fin (eg, having a fin height h) linear longitudinal profile of the fin 2 in the change (FIGS. 18A and 18B)). The similar surface 367 can reduce or eliminate the need for secondary machining operations that are used to cause the individual distal ends of the fins to be substantially coplanar and phase with, for example, a rigid panel. Rong. Similarly, a similar surface 367 that urges against the distal end 401 of the heat sink 400 (400') can form a seal with the heat sink and prevent a working fluid from bypassing between the adjacent heat sinks. aisle.

該插件本體360能譬如使用現在已知或此後被開發的射出成形技術、機械加工技術、或另一合適之製程所形成。於一工作具體實施例中,該本體360係由順應的的聚合材料所形成,該聚合材料大致上配合及密封抵靠著鄰接表面。任一合適之材料能被使用來形成該插件本體360,倘若所選擇之材料係與該次組件300之其他零組件及該被選擇之工作流體相容。譬如,該插件本體能由其所形成之共通的材料包含聚矽氧烷或任一種另一適當的順應材料。 The insert body 360 can be formed, for example, using injection molding techniques, machining techniques, or another suitable process that is now known or later developed. In a working embodiment, the body 360 is formed from a compliant polymeric material that substantially fits and seals against the abutment surface. Any suitable material can be used to form the insert body 360, provided that the selected material is compatible with the other components of the subassembly 300 and the selected working fluid. For example, the insert body can comprise a polyoxane or any other suitable compliant material from the common material it forms.

流動分佈Flow distribution

工作流體之流動經過該整合式組件300現在被敘述。由一遠端定位的熱交換器(未示出),一工作流體通過進入該入口通口331及進入延伸於該入口通口及該入口342間之通道343至該泵浦蝸殼311。該泵浦蝸殼之底板341界定一分開該通道343與該泵浦蝸殼的壁面。由該通道343,該工作流體通過該孔口342及進入該蝸殼311。在該流體由該泵 浦蝸殼通過該開口344及進入該入口高壓間335之前,被定位在該泵浦蝸殼311中之葉輪312旋轉及增加該工作流體中之壓力頭。 The flow of working fluid through the integrated assembly 300 is now described. From a remotely located heat exchanger (not shown), a working fluid passes into the inlet port 331 and into a passage 343 extending between the inlet port and the inlet 342 to the pump volute 311. The bottom plate 341 of the pump volute defines a wall separating the passage 343 from the pump volute. From the passage 343, the working fluid passes through the orifice 342 and enters the volute 311. In the fluid by the pump Before the volute passes through the opening 344 and into the inlet high pressure chamber 335, the impeller 312 positioned in the pump volute 311 rotates and increases the pressure head in the working fluid.

如藉由圖10中之箭頭所指示,該工作流體能由該入口高壓間335通過及進入一形成於該插件334中之第二凹入區域365及該外殼的入口集流管部份336間之腔室。由該腔室,該工作流體通過該孔口361。 As indicated by the arrows in FIG. 10, the working fluid can pass through the inlet high pressure chamber 335 and into a second recessed region 365 formed in the insert 334 and the inlet header portion 336 of the outer casing. The chamber. From the chamber, the working fluid passes through the orifice 361.

如上面有關圖2、3及4所敘述,圖7、11、13及14中所顯示之熱交換器能包括一熱傳送區域324,其界定複數微型通道。該孔口361能位在該熱傳送區域324上面,且工作流體之流動能被分佈在該散熱器中的複數微型通道之中。關於圖5及6中所顯示之組件,工作流體在該微型通道內之流動大致上可為一撞擊流動,其分成第一部份及第二部份,於大致上相對的方向中由該撞擊區域向外流動。 As described above with respect to Figures 2, 3 and 4, the heat exchangers shown in Figures 7, 11, 13 and 14 can include a heat transfer region 324 that defines a plurality of microchannels. The orifice 361 can be positioned over the heat transfer region 324 and the flow of working fluid can be distributed among the plurality of microchannels in the heat sink. With respect to the assembly shown in Figures 5 and 6, the flow of the working fluid within the microchannel can be substantially an impinging flow divided into a first portion and a second portion, the impact being substantially in the opposite direction. The area flows outward.

於所說明之組件300(圖7)中,該插件334(例如該構件362a、b、c、d)局部地佔據該第三凹入區域351,留下該區域的一對相對部份未充填,且界定相對之排出集流管部份337,其位在該微型通道之端部區域上面及側邊接合鄰接該孔口361的中心區域。冷卻劑之向外引導流動能由該微型通道排出進入該排出集流管部份337的一個別部份。由該集流管部份337,該工作流體通過進入該出口高壓間338(圖11),且經過該導管347至該出口通口332。 In the illustrated assembly 300 (FIG. 7), the insert 334 (eg, the member 362a, b, c, d) locally occupies the third recessed region 351 leaving a pair of opposing portions of the region unfilled And defining a discharge manifold portion 337 opposite the end region of the microchannel and engaging a central region adjacent the aperture 361. The outwardly directed flow of coolant can be discharged from the microchannel into a portion of the discharge header portion 337. From the header portion 337, the working fluid passes into the outlet high pressure chamber 338 (Fig. 11) and passes through the conduit 347, to the outlet port 332.

額外之熱交換器組構Additional heat exchanger organization

額外之散熱器具體實施例係參考圖13、13A、14、14A、 15、16、17、18A及18B及19敘述。關於圖2至圖6中所說明之散熱器,圖13及14中所顯示之散熱器320、320'界定個別之熱傳送區域324、324',並具有複數並列的散熱片(例如散熱片400),且於鄰接的散熱片之間界定對應的複數微型通道(例如微型通道404、404')。 Additional heat sink embodiments are described with reference to Figures 13, 13A, 14, 14A, 15, 16, 17, 18A and 18B and 19 are described. With respect to the heat sink illustrated in Figures 2 through 6, the heat sinks 320, 320' shown in Figures 13 and 14 define individual heat transfer regions 324, 324' and have a plurality of parallel heat sinks (e.g., heat sink 400). And defining a corresponding plurality of microchannels (eg, microchannels 404, 404') between adjacent fins.

該散熱片400、400'之每一者由一均熱片、或基底326延伸至一個別之遠側端部401、401'。側面相接溝槽322、322'(圖13及14)能相對該微型通道404、404'之相對外側端部正交地延伸,形成排出集流管的一部份。當被併入在該組件300中時,該溝槽322、322'大致上被定位鄰接相對之排出集流管部份337。 Each of the fins 400, 400' is extended by a heat spreader, or substrate 326, to a further distal end 401, 401'. The side landing grooves 322, 322' (Figs. 13 and 14) can extend orthogonally relative to the opposite outer ends of the microchannels 404, 404' to form a portion of the discharge header. When incorporated in the assembly 300, the grooves 322, 322' are generally positioned adjacent to the opposing discharge header portion 337.

圖15分別沿著剖線15-15(圖13)或15'-15'(圖14)顯示該散熱器320、320'之典型的橫截面視圖。圖16及17由圖15中之橫截面所顯示的典型之熱傳送區域的圓圈部份“A”顯示另一選擇之散熱片組構。 Figure 15 shows a typical cross-sectional view of the heat sink 320, 320' along section line 15-15 (Figure 13) or 15'-15' (Figure 14), respectively. Figures 16 and 17 show a further selected fin assembly from the circled portion "A" of a typical heat transfer region shown in cross section in Figure 15.

該散熱片之遠側端部能具有各種組構,如在圖16及17中所指示。譬如,該粗直的遠側端部405'被顯示為相當平坦及大致上同平面式。另一選擇係,該遠側端部401被顯示為形成斜面的,為每一散熱片400a給與一稍微較短之面及一稍微較高的面,使一相當尖銳之頂部405定位在其間。 The distal ends of the fins can have various configurations, as indicated in Figures 16 and 17. For example, the thick distal end 405' is shown as being relatively flat and substantially coplanar. Alternatively, the distal end 401 is shown as being beveled, with a slightly shorter face and a slightly higher face for each fin 400a, with a rather sharp top 405 positioned therebetween. .

吾人相信藉由該形成斜面之遠側端部401所形成的尖銳之頂部405能改善流動方向之變遷(例如90度彎頭),其係由大致上平行於該基底326及正交於該散熱片400變遷至一大致上正交於該基底326及大致上平行於該散熱片的 方向。據此,譬如當該工作流體由該插件集流管365通過至該微型通道404時,如與具有大致上粗直的遠側端部405'之散熱片400'作比較,其被揣測具有藉由該形成斜面之遠側端部401所形成的尖銳頂部405之散熱片400能減少該工作流體中之壓頭損失。吾人相信在給定散熱片的相對較短之面的上游定位該相同散熱片的相對較高之面(例如相對該個別之散熱片將該尖銳之頂部放置於一上游位置中),比如果該流動由一相對的方向接近該形成斜面之散熱片,於壓頭損失中提供一相對較大的減少。 It is believed that the sharpened top portion 405 formed by the distal end 401 forming the bevel can improve the flow direction transition (e.g., a 90 degree elbow) that is substantially parallel to the substrate 326 and orthogonal to the heat dissipation. The sheet 400 transitions to a direction substantially orthogonal to the substrate 326 and substantially parallel to the heat sink direction. Accordingly, for example, when the working fluid passes through the insert manifold 365 to the microchannel 404, as compared to the fin 400' having the substantially thick distal end 405', it is speculated to have a borrow The fins 400 of the sharp top portion 405 formed by the beveled distal end 401 can reduce head loss in the working fluid. I believe that positioning the relatively high face of the same heat sink upstream of a relatively short face of a given heat sink (eg, placing the sharp top in an upstream position relative to the individual heat sink), if The flow is directed from an opposite direction to the beveled fin to provide a relatively large reduction in head loss.

該形成斜面之遠側端部401可使用任何合適之技術所形成,用於使薄壁面形成斜面。譬如,當使用削片技術形成該散熱片400時,此等斜面能被產生。其他、例如專有之技術能被使用來形成該斜面。譬如,吾人相信藉由高克聯管件公司(Wolverine Tube Inc.)所採用之散熱片形成技術能被使用於生產具有形成斜面之散熱片的微型通道散熱器。然而,吾人亦相信此等“原始”散熱片之個別的遠側端部不能同平面(隔開一凹入區域,其形成橫向溝槽的一部份)。藉由併入該順應插件334,其能驅策抵靠著不平坦之散熱片及與該不平坦之散熱片形成一密封,將傾向於使該尖銳頂部405變鈍的二次機械加工操作能被消除,節省成本及改善性能。維持尖銳頂部405及與該集流管插件形成一密封可減少該冷卻劑中之壓頭損失,同時仍然減少或消除鄰接微型通道404間之滲漏,該滲漏能以別的方式經過間隙發生,該間隙將以別的方式被形成於該“原始”散熱 片及例如大致上一平面式、堅硬的板件之間。 The beveled distal end 401 can be formed using any suitable technique for forming the thin wall face into a bevel. For example, when the heat sink 400 is formed using a chipping technique, such slopes can be produced. Other, for example proprietary techniques can be used to form the bevel. For example, we believe that the fin formation technology employed by Wolverine Tube Inc. can be used to produce microchannel heat sinks with beveled fins. However, we also believe that the individual distal ends of such "original" fins cannot be flush with the plane (separating a recessed region that forms part of the lateral trench). By incorporating the compliant insert 334, which is capable of urging against a non-flat fin and forming a seal with the uneven fin, a secondary machining operation that tends to blunt the sharp top 405 can be Eliminate, save costs and improve performance. Maintaining the sharp top 405 and forming a seal with the header insert reduces drag loss in the coolant while still reducing or eliminating leakage between adjacent microchannels 404, which can otherwise occur through the gap The gap will be formed in the "primitive" heat sink in other ways. The sheet is between, for example, substantially a flat, rigid panel.

如圖14中所顯示,橫向溝槽325能相對該散熱片400橫向地延伸。如上面所提及,該集流管插件334中之孔口361大致上可位在該溝槽325上面,界定一流動變遷,其平行該微型通道404之每一者通過液壓地耦接至該微型通道之至少另一者。 As shown in FIG. 14, the lateral grooves 325 can extend transversely relative to the heat sink 400. As mentioned above, the aperture 361 in the header insert 334 can be substantially above the groove 325 defining a flow transition that is hydraulically coupled to each of the microchannels 404 in parallel thereto. At least the other of the microchannels.

圖19顯示此一流動變遷的一範例之橫截面視圖。藉由該插件本體360所界定之凹入區域365及該凹入溝槽325一起界定一獨自比該孔口361大體上較大的特徵長度、例如液壓直徑。譬如,該凹入區域365、該孔口361、及該溝槽325可一起界定一流動變遷,其獨自具有大於該孔口361的對應液壓直徑大約百分之150及大約百分之200之間的液壓直徑,並可為該被組裝之流動變遷提供一大體上較低的壓頭損失係數。 Figure 19 shows a cross-sectional view of an example of such a flow transition. The recessed region 365 defined by the insert body 360 and the recessed groove 325 together define a feature length, such as a hydraulic diameter, that is substantially larger than the aperture 361. For example, the recessed region 365, the aperture 361, and the groove 325 can together define a flow transition that alone has a corresponding hydraulic diameter greater than the aperture 361 of between about 150 percent and about 200 percent The hydraulic diameter provides a substantially lower head loss factor for the assembled flow transition.

由該入口集流管至該散熱器320之微型通道增加該變遷的特徵長度尺度能減少通過該變遷的流體中之壓力損失,且與該泵浦之性能對應地增加該流體之流動速率。與該孔口361位在一陣列之均勻高度散熱片上面的組構作比較,源自較低的壓頭損失係數之流體流動速率中的增加能改善來自該散熱片之局部熱傳送速率。於鄰接該孔口361的區域中之微型通道中,比該流體將以別的方式不存在該溝槽中,該逐漸縮小的凹部365及該散熱器溝槽325之組合(例如於圖19A中)允許該工作流體相對更深地貫穿(例如於圖19A中所顯示之均勻高度散熱片陣列的案例中)。 Increasing the characteristic length dimension of the transition from the inlet header to the microchannel of the heat sink 320 reduces the pressure loss in the fluid passing through the transition and increases the flow rate of the fluid corresponding to the performance of the pump. An increase in the fluid flow rate resulting from a lower head loss coefficient improves the local heat transfer rate from the heat sink as compared to the configuration of the orifice 361 on an array of uniform height fins. In the microchannel in the region adjacent to the aperture 361, the fluid will otherwise be absent from the trench, the combination of the tapered recess 365 and the heat sink trench 325 (eg, in FIG. 19A) The working fluid is allowed to penetrate relatively deeper (e.g., in the case of a uniform height fin array as shown in Figure 19A).

該溝槽325能藉由在該複數散熱片400之每一者中界定個別之凹部所形成。該複數凹入區域可如此被並列,以便界定該溝槽325。 The trench 325 can be formed by defining individual recesses in each of the plurality of heat sinks 400. The plurality of recessed regions can be juxtaposed in order to define the trench 325.

於圖18A及18B中,每一凹入溝槽325a、325b之最低範圍係與該均熱片326隔開一段距離h1。於其他具體實施例中,該凹入溝槽325之最低範圍大體上係與該均熱片326有同等範圍(亦即,h1≦0)。於一些具體實施例中,該散熱片之代表性高度h2對該距離h1之比率可為於例如大約10:1及大約10:7之間、諸如於於大約3:1及大約2:1之間。 In Figures 18A and 18B, each of the recessed grooves 325a, 325b the minimum range of the system and the heat spreader 326 at a distance h 1. In other embodiments, the lowest extent of the recessed trench 325 is substantially the same as the heat spreader 326 (ie, h 1 ≦ 0). In some embodiments, the ratio of the representative height h 2 of the heat sink to the distance h 1 can be, for example, between about 10:1 and about 10:7, such as at about 3:1 and about 2: Between 1.

雖然v字形刻槽被顯示在圖18A中,且一大致上拋物線凹部被顯示在圖18B中,其他凹入溝槽組構係可能的。譬如,該溝槽能具有一大致上雙曲線的橫截面形狀、或具有一大體上筆直邊緣的橫截面(例如L形凹部、變平坦之“V”字形溝槽,如圖19B中所顯示)。如上面所提及,當該整合式組件300被組裝時,鄰接該集流管本體的溝槽325之斜面可為與一壁面之斜面大體上連續的,該壁面界定該集流管本體360中鄰接該溝槽之凹入區域365。此一連續之斜面能經過該變遷提供大致上比在具有壁面斜面中之不連續的變遷(例如於該插件中的凹部及該溝槽之間)較低的壓頭損失。 Although a v-shaped notch is shown in Figure 18A, and a substantially parabolic recess is shown in Figure 18B, other concave groove configurations are possible. For example, the trench can have a substantially hyperbolic cross-sectional shape, or a cross-section having a generally straight edge (eg, an L-shaped recess, a flattened "V" shaped trench, as shown in Figure 19B). . As mentioned above, when the integrated assembly 300 is assembled, the slope of the groove 325 adjacent the manifold body may be substantially continuous with a slope of a wall defining the header body 360. Adjacent to the recessed area 365 of the trench. This continuous bevel can provide a lower head loss substantially than the discontinuous transition in the walled bevel (e.g., between the recess in the insert and the groove).

其他示範具體實施例Other exemplary embodiments

上面所敘述之範例大致上有關流體性熱傳送系統,其被建構來冷卻一或多個電子零組件、諸如整合式迴路。儘管如此,用於所揭示之熱傳送系統的其他應用隨同所揭示 裝置的組構中之任何附帶變化被考慮。併入在此中所揭示之原理,其係可能提供寬廣變化性的系統,該系統被建構來使用一流體迴路傳送熱。譬如,所揭示之系統能被使用來將熱傳送至資料中心中之零組件、雷射零組件、發光二極體、化學反應、光電池、太陽能集熱器、及現在已知與此後被開發的各種其他工業、軍事與消費者裝置,或由以上之裝置傳送熱。 The examples described above relate generally to fluid heat transfer systems that are configured to cool one or more electronic components, such as an integrated circuit. Nonetheless, other applications for the disclosed heat transfer system are disclosed Any accompanying changes in the organization of the device are considered. Incorporating the principles disclosed herein, it is possible to provide a system of broad variability that is constructed to transfer heat using a fluid circuit. For example, the disclosed system can be used to transfer heat to components in a data center, laser components, light-emitting diodes, chemical reactions, photovoltaic cells, solar collectors, and now known and subsequently developed. Various other industrial, military, and consumer devices, or heat transfer from the above devices.

方向及參考(例如上、下、頂部、底部、左側、右側、向後、向前等)可被使用來有利於該圖面之討論,但不意欲受限制。譬如,某些術語可被使用,諸如“上”、“下”、“上方”、“下方”、“水平的”、“直立的”、“左側”、“右側”等等。在可應用之處,當處理相對關係時,尤其相對於所說明之具體實施例,此等術語被使用來提供敘述之某一明確性。然而,此等術語係不意欲包含有絕對關係、位置、及/或方位。譬如,相對於一物件,“上”表面能僅只藉由將該物件翻轉而變成“下”表面。雖然如此,其仍然為相同之表面,且該物件保持相同。如在此中所使用,“及/或”意指“及”或“或”,以及“及”與“或”。再者,在此中所引用之所有專利及非專利文獻係全部為所有目的以引用的方式併入本文中。 Directions and references (eg, up, down, top, bottom, left, right, backward, forward, etc.) may be used to facilitate discussion of the drawing, but are not intended to be limiting. For example, certain terms may be used such as "upper", "lower", "above", "below", "horizontal", "upright", "left", "right", and the like. Where applicable, such terms are used to provide a certain ambiguity of the description when dealing with relative relationships, particularly with respect to the specific embodiments illustrated. However, such terms are not intended to encompass absolute relationships, locations, and/or orientations. For example, an "upper" surface can become a "lower" surface only by flipping the object relative to an object. Nonetheless, it is still the same surface and the object remains the same. "and/or" means "and" or "or", and "and" and "or". Moreover, all of the patents and non-patent documents cited herein are hereby incorporated by reference in their entirety for all purposes.

上面有關任何特別範例所敘述之原理能被與有關其他範例之任一個或多個所敘述的原理結合。據此,此詳細之敘述將不以限制之意義被解釋,且隨後回顧此揭示內容,那些普通熟諳該技藝者將了解該寬廣變化性之流體熱交換 系統能使用在此中所敘述之各種概念被設計。再者,那些普通熟諳該技藝者將了解在此中所揭示之示範具體實施例可被設計成適用於各種組構,而不會由該揭示之原理脫離。 The principles described above in relation to any particular example can be combined with the principles described in any one or more of the other examples. Accordingly, the detailed description is not to be interpreted in a limiting sense, and the disclosure of this disclosure will be understood by those skilled in the art The system can be designed using the various concepts described herein. In addition, those skilled in the art will appreciate that the exemplary embodiments disclosed herein may be embodied in a variety of configurations without departing from the principles of the disclosure.

所揭示之具體實施例的先前敘述被提供,以能夠使熟諳此技藝之任何人作成或使用該被揭示之革新。對那些具體實施例之各種修改將對於那些熟諳此技藝者輕易地變得明顯,且在此中所界定之一般原理可被應用至其他具體實施例,而不會由此揭示內容之精神或範圍脫離。如此,所主張之發明係不意欲受限於在此中所顯示之具體實施例,但將與該申請專利範圍之用語一致地被給予該完整的範圍,其中諸如藉由使用該冠詞“a”或“an”參考為單數的元件係不意欲意指“一個且僅只一個”,除非特別地如此陳述,反之為“一或多個”。與遍及該揭示內容所敘述的各種具體實施例之元件同等的所有結構及功能性同等項係意欲被該申請專利範圍之元件所涵括,該元件係已知的或稍後將被那些普通熟諳該技藝者所得知。再者,在此中未揭示者係意欲開放給公眾做為公共用途,而不管此揭示內容是否在該申請專利範圍中被明確地列舉。沒有申請專利範圍之元件將被解釋為在35 USC 112、第六段落的條款之下,除非該元件係使用該片語“用於...之機構”或“用於...之步驟”被明確地列舉。 The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the disclosed innovation. Various modifications to those specific embodiments will be readily apparent to those skilled in the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Get rid of. Thus, the claimed invention is not intended to be limited to the particular embodiments shown herein, but the scope of the scope of the application is to be accorded to the full scope, such as by the use of the article "a" Or "an" is an singular element that is not intended to mean "one and only one" unless specifically stated otherwise, and vice versa. All structural and functional equivalents to the elements of the various embodiments described in the disclosure are intended to be encompassed by the elements of the scope of the application, which are known or will be The artist knows. Furthermore, those not disclosed herein are intended to be open to the public for public use, regardless of whether the disclosure is explicitly recited in the scope of the patent application. An element that does not have a patentable scope will be interpreted as under 35 USC 112, paragraph 6, unless the element uses the phrase "institution for" or "step for" It is clearly listed.

如此,由於該被揭示之原理能被應用的很多可能之具體實施例,應被認知該上述具體實施例係僅只範例,且將不被視為範圍中之限制。吾人因此對在此中所揭示之主題 保留所有權力,包含對申請專利範圍以及在此中所顯示或所敘述之任何革新的所有態樣之權力,其落在以下申請專利之範圍及精神內。 As such, many of the specific embodiments of the disclosed embodiments are to be construed as illustrative and not limited I therefore have the subject matter disclosed here. All rights reserved, including all rights to the patent application and any innovations shown or described herein, fall within the scope and spirit of the following claims.

除非以別的方式指定,否則所附之圖面說明在此中所揭示的創新主題之態樣。參考該圖面,其中遍及該數個視圖之類似的參考數字指示類似的零件,目前所揭示之原理的數個態樣於該圖面中被當作範例來詳細地說明,且非其限制地被說明,其中:圖1顯示一流體迴路,被建構來以能循環的工作流體由一區域至另一區域傳送熱。 The accompanying drawings illustrate aspects of the innovative subject matter disclosed herein unless otherwise specified. Reference is made to the drawings, in which like reference numerals refer to the like parts, and the various aspects of the presently disclosed embodiments are illustrated by way of example and not limitation Illustrated, wherein: Figure 1 shows a fluid circuit constructed to transfer heat from one zone to another with a circulating working fluid.

圖2顯示一流體熱交換器之頂部平面圖,並已切開一頂部蓋子,以有利於觀看內部零組件;圖3顯示沿著圖2之剖線I-I的剖視圖;圖4顯示沿著圖3之剖線II-II的剖視圖;圖5顯示另一流體熱交換器的分解、立體圖;圖6顯示圖5中所顯示之流體熱交換器的頂部平面圖,並與其被移除之頂部蓋子組裝;圖7說明一整合式泵浦及熱交換器組件之具體實施例的分解視圖。 Figure 2 shows a top plan view of a fluid heat exchanger with a top cover cut away to facilitate viewing of internal components; Figure 3 shows a cross-sectional view along section line II of Figure 2; Figure 4 shows a section along Figure 3. Section II-II is a cross-sectional view; Figure 5 shows an exploded, perspective view of another fluid heat exchanger; Figure 6 shows a top plan view of the fluid heat exchanger shown in Figure 5, assembled with its removed top cover; Figure 7 An exploded view of a specific embodiment of an integrated pump and heat exchanger assembly is illustrated.

圖8說明圖7中所顯示之整合式外殼及泵浦葉輪的分解次組件之等角視圖。 Figure 8 illustrates an isometric view of the integrated housing and the exploded subassembly of the pump impeller shown in Figure 7.

圖9由圖7及8中所顯示的整合式外殼上方說明一局部橫截面視圖。 Figure 9 is a partial cross-sectional view from the top of the integrated housing shown in Figures 7 and 8.

圖10由圖7、8及9中所顯示之整合式外殼下方說明一等角視圖,而使流體之流動路徑被顯示為一虛線。 Figure 10 is an isometric view of the underside of the integrated housing shown in Figures 7, 8 and 9, with the flow path of the fluid shown as a dashed line.

圖11說明包括該散熱器、該整合式外殼、及圖7中所顯示之集流管插入件的次組件之分解視圖。 Figure 11 illustrates an exploded view of the subassembly including the heat sink, the integrated housing, and the header insert shown in Figure 7.

圖12說明由圖7及11中所顯示的插件上方之等角視圖。 Figure 12 illustrates an isometric view from above the insert shown in Figures 7 and 11.

圖13說明如圖7中所顯示之散熱器的等角視圖。 Figure 13 illustrates an isometric view of the heat sink as shown in Figure 7.

圖13A顯示圖13中所顯示之散熱器的一部份之放大視圖。 Figure 13A shows an enlarged view of a portion of the heat sink shown in Figure 13.

圖14說明圖7中所顯示之散熱器的另一具體實施例之等角視圖。 Figure 14 illustrates an isometric view of another embodiment of the heat sink shown in Figure 7.

圖14A顯示圖14中所顯示之散熱器的一部份之放大視圖。 Figure 14A shows an enlarged view of a portion of the heat sink shown in Figure 14.

圖15說明如圖7中所顯示之散熱器的典型橫截面視圖,例如,取自沿著圖13或圖14中之剖面15-15。 Figure 15 illustrates a typical cross-sectional view of the heat sink as shown in Figure 7, for example taken from section 15-15 along Figure 13 or Figure 14.

圖16說明形成斜面之散熱片的範例。 Figure 16 illustrates an example of a beveled heat sink.

圖17說明粗直的散熱片之範例。 Figure 17 illustrates an example of a thick heat sink.

圖18A說明一散熱器之橫截面視圖,而於其散熱片中具有v字形、橫向溝槽,如取自沿著圖14中之剖線18-18。 Figure 18A illustrates a cross-sectional view of a heat sink having a v-shaped, lateral groove in its heat sink, as taken from section 18-18 along Figure 14.

圖18B說明一散熱器之橫截面視圖,而於其散熱片中具有大致上拋物線、橫向溝槽,如取自沿著圖14中之剖線18-18。 Figure 18B illustrates a cross-sectional view of a heat sink having substantially parabolic, lateral grooves in its fins, such as taken along line 18-18 of Figure 14.

圖19說明如圖18A中所顯示的散熱器之橫截面視圖,使圖12中所顯示的集流管插件位在該散熱器之散熱片上 面。 Figure 19 illustrates a cross-sectional view of the heat sink as shown in Figure 18A, with the header insert shown in Figure 12 positioned on the heat sink of the heat sink surface.

圖19A說明如圖18A中所顯示的散熱器之橫截面視圖,使圖12中所顯示的集流管插件位在該散熱器之散熱片上面。 Figure 19A illustrates a cross-sectional view of the heat sink as shown in Figure 18A, with the header insert shown in Figure 12 positioned over the heat sink of the heat sink.

圖19B說明散熱器之另一橫截面視圖,該散熱器界定一橫向溝槽及使圖12中所顯示的集流管插件位在該散熱片上面。 Figure 19B illustrates another cross-sectional view of the heat sink defining a lateral groove and positioning the header insert shown in Figure 12 over the heat sink.

Claims (48)

一種熱交換系統,包括:散熱器,具有複數並列的散熱片,而在鄰接的散熱片之間界定對應的複數微型通道,其中一凹入溝槽相對該散熱片橫向地延伸;集流管本體,其至少局部地界定一大致上位在該溝槽上面的開口。 A heat exchange system comprising: a heat sink having a plurality of parallel fins, and defining a corresponding plurality of microchannels between adjacent fins, wherein a recessed groove extends laterally relative to the fin; the manifold body And at least partially defining an opening substantially above the trench. 如申請專利範圍第1項之熱交換系統,其中該集流管本體及該溝槽一起界定入口集流管的一部份,該入口集流管被建構來通過液壓地將該微型通道之每一者平行地耦接至該微型通道之至少另一者。 A heat exchange system according to claim 1, wherein the header body and the groove together define a portion of the inlet header, the inlet header being constructed to hydraulically each of the microchannels One is coupled in parallel to at least one of the other of the microchannels. 如申請專利範圍第1項之熱交換系統,其中該散熱器包括一均熱片,使該散熱片之每一者由該均熱片延伸,且界定一與該均熱片隔開之對應的遠側邊緣,及該溝槽可為由該個別之複數遠側邊緣凹入。 The heat exchange system of claim 1, wherein the heat sink comprises a heat spreader such that each of the heat sinks extends from the heat spreader and defines a space corresponding to the heat spreader. The distal edge, and the groove, may be recessed by the individual plurality of distal edges. 如申請專利範圍第3項之熱交換系統,其中該凹入溝槽之最低範圍係與該均熱片隔開。 The heat exchange system of claim 3, wherein the lowest extent of the recessed groove is spaced apart from the heat spreader. 如申請專利範圍第3項之熱交換系統,其中該凹入溝槽之最低範圍係大體上與該均熱片有同等範圍。 The heat exchange system of claim 3, wherein the lowest range of the recessed grooves is substantially the same as the heat spreader. 如申請專利範圍第3項之熱交換系統,其中該均熱片及該散熱片形成單一的結構。 The heat exchange system of claim 3, wherein the heat spreader and the heat sink form a single structure. 如申請專利範圍第3項之熱交換系統,其中該個別之遠側邊緣的每一者界定一對應的凹入部份,藉此界定該凹入溝槽。 A heat exchange system according to claim 3, wherein each of the individual distal edges defines a corresponding recessed portion, thereby defining the recessed groove. 如申請專利範圍第1項之熱交換系統,其中該溝槽包括被定位鄰接該散熱片之第一端部的第一溝槽、及被定位鄰接該散熱片之第二、相對端部的第二溝槽,其中該第一溝槽及該第二溝槽界定一排出集流管之個別部份。 The heat exchange system of claim 1, wherein the trench includes a first trench positioned adjacent to the first end of the heat sink, and a second end positioned opposite the second heat sink The second trench, wherein the first trench and the second trench define a separate portion of the exhaust manifold. 如申請專利範圍第1項之熱交換系統,其中該凹入溝槽之橫截面輪廓包括以下群組之被選擇的一或多種,該群組包含v字形刻槽、半圓、拋物線、雙曲線、及具有至少一個大體上筆直邊緣的刻槽。 The heat exchange system of claim 1, wherein the cross-sectional profile of the recessed groove comprises one or more selected ones of the group consisting of a v-shaped groove, a semi-circle, a parabola, a hyperbola, And a groove having at least one substantially straight edge. 如申請專利範圍第7項之熱交換系統,其中每一個別凹入部份之橫截面輪廓包括以下群組之被選擇的一或多種,該群組包含v字形刻槽、半圓、拋物線、雙曲線、及具有至少一個大體上筆直邊緣的刻槽。 The heat exchange system of claim 7, wherein the cross-sectional profile of each of the individual concave portions comprises one or more selected ones of the group consisting of a v-shaped groove, a semi-circle, a parabola, and a double A curve, and a groove having at least one substantially straight edge. 如申請專利範圍第3項之熱交換系統,其中該複數散熱片之代表性高度對該溝槽之代表性深度的比率係於大約10:1及大約10:7之間。 A heat exchange system according to claim 3, wherein the ratio of the representative height of the plurality of fins to the representative depth of the trench is between about 10:1 and about 10:7. 如申請專利範圍第11項之熱交換系統,其中該代表性高度對該代表性深度之比率係於大約3:1及大約2:1之間。 The heat exchange system of claim 11, wherein the ratio of the representative height to the representative depth is between about 3:1 and about 2:1. 如申請專利範圍第1項之熱交換系統,其中該集流管本體中之開口具有一凹入區域及一由該凹入區域延伸經過該集流管本體的孔口。 The heat exchange system of claim 1, wherein the opening in the header body has a recessed region and an aperture extending through the recessed region through the manifold body. 如申請專利範圍第13項之熱交換系統,其中該集流管本體中之凹入區域係逐漸縮小的凹入區域,具有隨著該凹入區域之增加的深度而縮小之至少一橫截面尺寸。 The heat exchange system of claim 13, wherein the recessed area in the header body is a gradually reduced recessed area having at least one cross-sectional dimension that decreases as the recessed area increases in depth . 如申請專利範圍第13項之熱交換系統,其中該溝槽鄰接該集流管本體之斜面與鄰接該溝槽的集流管本體中之凹入區域的斜面大體上為連續的。 A heat exchange system according to claim 13 wherein the groove is adjacent to the slope of the header body and the slope of the recessed region in the header body adjacent the groove is substantially continuous. 如申請專利範圍第13項之熱交換系統,其中該凹入區域、該孔口及該溝槽一起界定一流動變遷,並具有一於大約百分之150及大約百分之200之間的特徵長度尺度,且該特徵長度尺度大於該孔口之對應的特徵長度尺度。 The heat exchange system of claim 13, wherein the recessed region, the aperture and the trench together define a flow transition and have a characteristic of between about 150 percent and about 200 percent A length dimension, and the feature length dimension is greater than a corresponding feature length dimension of the aperture. 如申請專利範圍第2項之熱交換系統,其中該入口集流管被建構來於正交方向中相對該個別微型通道之縱向軸線運送一流體之流動至該微型通道之每一者。 A heat exchange system according to claim 2, wherein the inlet header is configured to transport a fluid flow to each of the microchannels in an orthogonal direction relative to a longitudinal axis of the individual microchannels. 如申請專利範圍第1項之熱交換系統,其中該複數散熱片中之散熱片的每一者界定一對應的形成斜面之遠側邊緣。 The heat exchange system of claim 1, wherein each of the heat sinks in the plurality of fins defines a corresponding distal edge forming a bevel. 如申請專利範圍第2項之熱交換系統,另包括界定一入口高壓間之本體,其中該入口高壓間及該入口集流管被一起建構來在大致上橫截於該散熱片的方向中運送一流體流動。 The heat exchange system of claim 2, further comprising a body defining an inlet high pressure chamber, wherein the inlet high pressure chamber and the inlet header tube are constructed together to convey in a direction substantially transverse to the heat sink A fluid flows. 如申請專利範圍第19項之熱交換系統,其中該入口集流管被建構來將該流體的一撞擊流動運送至該微型通道之每一者。 A heat exchange system according to claim 19, wherein the inlet header is configured to transport an impinging flow of the fluid to each of the microchannels. 如申請專利範圍第20項之熱交換系統,其中該複數散熱片中之散熱片的每一者界定一對應的形成斜面之遠側邊緣。 A heat exchange system according to claim 20, wherein each of the fins in the plurality of fins defines a corresponding distal edge forming a bevel. 如申請專利範圍第19項之熱交換系統,另包括界定 第一側面的單一本體,其中該入口高壓間的一部份及該入口集流管的一部份係分別由該第一側面凹入,其中該單一的本體界定與該第一側面相對地定位之第二側面,且來自該第二側面之凹部界定一泵浦蝸殼,其中該入口高壓間的一部份被定位鄰接該泵浦蝸殼。 Such as the heat exchange system of claim 19, including the definition a single body of the first side, wherein a portion of the inlet high pressure chamber and a portion of the inlet header are respectively recessed by the first side, wherein the single body defines a position opposite the first side The second side, and the recess from the second side defines a pump volute, wherein a portion of the inlet high pressure is positioned adjacent to the pump volute. 如申請專利範圍第22項之熱交換系統,其中界定該泵浦蝸殼的凹部為一大體上圓柱形凹部,並具有大體上垂直於該第二側面延伸之縱向軸線,及其中該本體界定一開口,該開口大致上沿著該圓柱形凹部切線地延伸,且通過液壓地將該泵浦蝸殼耦接至該入口高壓間。 The heat exchange system of claim 22, wherein the recess defining the pump volute is a generally cylindrical recess and has a longitudinal axis extending substantially perpendicular to the second side, and wherein the body defines a An opening extending substantially tangentially along the cylindrical recess and hydraulically coupling the pump volute to the inlet high pressure chamber. 如申請專利範圍第19項之熱交換系統,其中該本體界定鄰接該入口集流管凹部的第二凹入區域及一分開該第二凹入區域與該入口集流管凹部的壁面,其中該集流管本體被建構來跨越該入口集流管凹部及配套地嚙合該本體,使得該集流管本體如此佔據該第二凹入區域的一部份,以便界定一大致上位在該微型通道之每一者的個別部份上面之排出集流管,其中該複數微型通道之個別部份與該入口開口/集流管隔開。 The heat exchange system of claim 19, wherein the body defines a second recessed region adjacent to the inlet header recess and a wall separating the second recessed region from the inlet header recess, wherein A manifold body is constructed to span the inlet manifold recess and matingly engage the body such that the manifold body occupies a portion of the second recessed region to define a substantially upper portion of the microchannel Each of the individual portions of each of the discharge headers, wherein the individual portions of the plurality of microchannels are spaced from the inlet opening/collector. 一種熱交換系統,包括:散熱器,具有複數並列的散熱片,而在鄰接的散熱片之間界定對應的複數微型通道,其中該散熱片之每一者界定一個別之形成斜面的遠側邊緣;及集流管本體,其位在該形成斜面之遠側邊緣的每一者之至少一部份上面,且界定一開口,該開口被建構來於一 橫截於該微型通道的方向中將流體之流動運送至該微型通道。 A heat exchange system comprising: a heat sink having a plurality of parallel fins defining a plurality of corresponding microchannels between adjacent fins, wherein each of the fins defines a further peripheral edge forming a bevel And a manifold body positioned over at least a portion of each of the distal edges forming the ramp and defining an opening configured to The flow of fluid is transported to the microchannel in a direction transverse to the microchannel. 如申請專利範圍第25項之熱交換系統,其中該散熱器包括一均熱片,該散熱片之每一者由該均熱片延伸,且每一個對應的形成斜面之遠側邊緣係與該均熱片隔開。 The heat exchange system of claim 25, wherein the heat sink comprises a heat spreader, each of the heat sinks extending from the heat spreader, and each correspondingly formed beveled distal edge is associated with the heat sink The heat spreaders are separated. 如申請專利範圍第26項之熱交換系統,其中該均熱片及該散熱片形成單一的結構。 The heat exchange system of claim 26, wherein the heat spreader and the heat sink form a single structure. 如申請專利範圍第26項之熱交換系統,其中個別之形成斜面的遠側邊緣及該均熱片之間的距離界定該個別之散熱片的高度,其中每一個別之散熱片界定第一端部及第二端部,並在翼展方向中相對該均熱片於該第一及該第二端部之間縱向地延伸,其中該複數散熱片之一或多個的散熱片高度沿著該翼展方向變化。 The heat exchange system of claim 26, wherein the distance between the distal edge forming the bevel and the heat spreader defines the height of the individual fins, wherein each individual fin defines the first end And a second end portion extending longitudinally between the first and second end portions relative to the heat spreader in a spanwise direction, wherein a heat sink of one or more of the plurality of heat sinks is along a height The spanwise direction changes. 如申請專利範圍第28項之熱交換系統,其中該集流管本體包括一順應部份,其驅策抵靠著該遠側邊緣之每一者的至少一部份。 The heat exchange system of claim 28, wherein the manifold body includes a compliant portion that urges against at least a portion of each of the distal edges. 如申請專利範圍第29項之熱交換系統,其中散熱片沿著該翼展方向中之高度的變化界定該個別遠側邊緣之非線性輪廓,其中該集流管本體之順應部份大致上配合該非線性輪廓。 The heat exchange system of claim 29, wherein the change in the height of the fin along the spanwise direction defines a non-linear profile of the individual distal edge, wherein the compliant portion of the manifold body substantially matches This non-linear contour. 如申請專利範圍第23項之熱交換系統,其中凹入溝槽相對該散熱片橫向地延伸,且該開口大致上位在該溝槽上面。 The heat exchange system of claim 23, wherein the recessed groove extends laterally relative to the heat sink and the opening is substantially above the groove. 如申請專利範圍第31項之熱交換系統,其中該個別 遠側邊緣之每一者界定一對應的凹入部份,藉此界定該凹入溝槽。 Such as the heat exchange system of claim 31, wherein the individual Each of the distal edges defines a corresponding recessed portion thereby defining the recessed groove. 如申請專利範圍第25項之熱交換系統,其中該複數散熱片之代表性高度對該溝槽之代表性深度的比率係於大約10:1及大約10:7之間。 A heat exchange system according to claim 25, wherein the ratio of the representative height of the plurality of fins to the representative depth of the trench is between about 10:1 and about 10:7. 如申請專利範圍第33項之熱交換系統,其中該代表性高度對該代表性深度之比率係於大約3:1及大約2:1之間。 A heat exchange system according to claim 33, wherein the ratio of the representative height to the representative depth is between about 3:1 and about 2:1. 如申請專利範圍第31項之熱交換系統,其中該集流管本體中之開口具有一凹入區域及一由該凹入區域延伸經過該集流管本體的孔口,其中該凹入區域、該孔口及該溝槽一起界定一流動變遷,並具有一於大約百分之150及大約百分之200之間的特徵長度尺度,且該特徵長度尺度大於該孔口之對應的特徵長度尺度。 The heat exchange system of claim 31, wherein the opening in the header body has a recessed area and an aperture extending through the recessed area through the manifold body, wherein the recessed area, The aperture and the trench together define a flow transition and have a feature length dimension between about 150 percent and about 200 percent, and the feature length dimension is greater than a corresponding feature length dimension of the aperture . 如申請專利範圍第25項之熱交換系統,另包括單一的本體,其具有第一側面及與該第一側面相對的第二側面,其中該本體界定由該第一側面凹入之入口高壓間的一部份、及由該第一側面凹入之入口集流管的一部份,其中該本體另界定一由該第二側面凹入的泵浦蝸殼,其中該入口高壓間的一部份被定位鄰接該泵浦蝸殼。 The heat exchange system of claim 25, further comprising a single body having a first side and a second side opposite the first side, wherein the body defines an inlet high pressure chamber recessed by the first side a portion of the inlet header that is recessed by the first side, wherein the body further defines a pump volute recessed by the second side, wherein a portion of the inlet high pressure The portion is positioned adjacent to the pump volute. 如申請專利範圍第36項之熱交換系統,其中界定該泵浦蝸殼的凹部係一大體上圓柱形凹部,並具有大體上垂直於該第二側面延伸之縱向軸線,且其中該本體界定一開口,該開口大致上沿著該圓柱形凹部切線地延伸,且通過 液壓地將該泵浦蝸殼耦接至由該第一側面凹入之入口高壓間的一部份。 The heat exchange system of claim 36, wherein the recess defining the pump volute is a generally cylindrical recess and has a longitudinal axis extending generally perpendicular to the second side, and wherein the body defines a An opening extending substantially tangentially along the cylindrical recess and passing The pump volute is hydraulically coupled to a portion of the inlet high pressure that is recessed by the first side. 如申請專利範圍第36項之熱交換系統,其中該本體界定一鄰接該入口集流管之凹入部份的第三凹入區域、及一分開該第三凹入區域與該入口集流管之凹入部份的壁面,其中該集流管本體被建構來跨越該入口集流管之凹入部份,及配套地嚙合該本體,使得該集流管本體如此佔據該第三凹入區域的一部份,以便界定一大致上位在該微型通道之每一者的個別部份上面之排出集流管,其中該複數微型通道之個別部份可與該入口開口/集流管隔開。 The heat exchange system of claim 36, wherein the body defines a third recessed region adjacent to the recessed portion of the inlet header, and a third recessed region and the inlet header are separated a recessed wall portion, wherein the header body is constructed to span a recessed portion of the inlet header and cooperatively engage the body such that the header body occupies the third recessed region A portion of the plurality of discharge channels that are substantially above the individual portions of each of the microchannels, wherein individual portions of the plurality of microchannels are separable from the inlet opening/collector. 一種單一構造,包括第一側面、與該第一側面相對地定位的第二側面、及一延伸於該第一側面與該第二側面之間的大體上連續之周邊壁面,且一底板大致上分開該第一側面與該第二側面,其中該第一側面界定一大體上圓柱形的凹部,且該第二側面界定具有一區域的凹部,該區域係在藉由該第一側面所界定之大體上圓柱形凹部徑向地往外定位。 A unitary structure includes a first side, a second side positioned opposite the first side, and a substantially continuous peripheral wall extending between the first side and the second side, and a bottom panel substantially Separating the first side from the second side, wherein the first side defines a generally cylindrical recess and the second side defines a recess having a region defined by the first side The generally cylindrical recess is positioned radially outward. 如申請專利範圍第39項之單一構造,另界定一孔口,該孔口延伸於該大體上圓柱形凹部及該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份之間。 A single configuration of claim 39, further defining an aperture extending from the generally cylindrical recess and the portion of the recess that is positioned radially outwardly from the generally cylindrical recess Between the shares. 如申請專利範圍第39項之單一構造,其中該周邊壁面界定一周邊凹部,且該構造在延伸於該第一周邊凹部及該大體上圓柱形凹部之間的底板中界定一孔口。 A unitary construction according to claim 39, wherein the peripheral wall defines a peripheral recess and the formation defines an aperture in the floor extending between the first perimeter recess and the generally cylindrical recess. 如申請專利範圍第39項之單一構造,其中該周邊壁 面界定一周邊凹部,且該構造界定一延伸在該周邊凹部及藉由該第二側面所界定的凹部之間的孔口。 a single structure as claimed in claim 39, wherein the peripheral wall The face defines a perimeter recess and the configuration defines an aperture extending between the perimeter recess and the recess defined by the second side. 如申請專利範圍第39項之單一構造,其中該周邊壁面界定一周邊凹部,且該構造界定一孔口,該孔口延伸在該周邊凹部及該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份之間。 A unitary construction according to claim 39, wherein the peripheral wall defines a peripheral recess, and the configuration defines an aperture extending in the peripheral recess and the recess is radially from the substantially cylindrical recess Positioning between the portions of the second side that are positioned outward. 如申請專利範圍第41項之單一構造,其中該周邊凹部包括第一周邊凹部,其中該周邊壁面界定第二周邊凹部,且該構造界定一延伸於該第二周邊凹部及藉由該第二側面所界定的凹部之間的孔口。 A single configuration of claim 41, wherein the peripheral recess comprises a first peripheral recess, wherein the peripheral wall defines a second peripheral recess, and the configuration defines an extension of the second perimeter recess and by the second side An aperture between the defined recesses. 如申請專利範圍第44項之單一構造,其中該周邊壁面界定第三周邊凹部,且該構造界定一孔口,該孔口延伸在該第三周邊凹部及該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份之間。 A single configuration of claim 44, wherein the peripheral wall defines a third peripheral recess, and the configuration defines an aperture extending in the third peripheral recess and the recess is away from the substantially cylindrical recess Between the portions of the second side that are positioned radially outward. 如申請專利範圍第39項之單一構造,其中該構造包括外殼,該大體上圓柱形凹部包括泵浦蝸殼,且來自該第二側面的凹部包括一高壓間。 A unitary construction according to claim 39, wherein the construction comprises a casing, the substantially cylindrical recess comprising a pump volute, and the recess from the second side comprises a high pressure chamber. 如申請專利範圍第46項之單一構造,其中該高壓間包括一藉由該凹部離由該大體上圓柱形凹部徑向地往外定位之第二側面的部份所界定之散熱器入口高壓間。 A unitary construction according to claim 46, wherein the high pressure chamber includes a heat sink inlet high pressure space defined by a portion of the recess that is positioned radially outwardly from the generally cylindrical recess. 如申請專利範圍第47項之單一構造,其中來自該第二側面的凹部另包括散熱器入口集流管的一部份、及散熱器出口集流管的一部份。 A single configuration of claim 47, wherein the recess from the second side further comprises a portion of the radiator inlet header and a portion of the radiator outlet header.
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