TW201249643A - Laminate, manufacturing method of the same, display panel with supporting plate, display panel, and display device - Google Patents

Abstract

The present invention provides a laminate and the manufacturing method of the same. Even being treated with the thermal processing at high temperature, the resin of the resin layer is inhibited from adhering onto the peeling surface on the glass substrate side (I.e. the surface of inorganic insulation film) when the resin layer is peeled off from the glass substrate. By applying a cleaning treatment, the peeling surface on the glass substrate side after separation is kept clean, and the chemical endurance and the generation of cracks of the peeling surface on the glass substrate side are further enhanced.

Description

[Technical Field] The present invention relates to a laminated body, a method of manufacturing a laminated body, a panel for a display device with a supporting plate, a panel for a display device, and a display device. [Prior Art] In recent years, devices such as solar cells (PV, Photovoltaic), liquid crystal panels (LCD liquid crystal displays), and organic EL panels (0LEDs) have been thinned and lightened. The substrates used in these devices are being thinned. If the strength of the substrate is insufficient due to the thinning, the handleability of the substrate is lowered in the manufacturing process of the device. Therefore, a method of forming a device member (e.g., a thin film transistor) on a substrate thicker than the final thickness has been widely used, and then the substrate is subjected to a chemical etching treatment to form a thin plate. However, in this method, for example, when the thickness of one substrate is reduced from 0.7 mm to 〇 2 mm 4 〇", most of the materials of the original substrate are peeled off by the surname, so that the productivity or the raw material is The use efficiency is not good. Further, in the thinning method of the substrate using the above-described (four) engraving, when there is a fine flaw on the surface of the substrate, there is a process in which (4) processing is performed to form a fine recess (corrosive pit) from the wound as a starting point. Recently, in order to cope with the above-mentioned problems, the right + i % it it J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 右 右From the town*, the reinforcing plate is separated from the four-plate glass substrate (Example 163953.doc 201249643, see Patent Document 1) ^The reinforcing plate has a support plate and a resin layer fixed to the support plate, and the resin layer and the thin glass substrate are peelable. Closely connected. The interface between the resin layer of the laminate and the thin glass substrate is peeled off, and the reinforcing plate separated from the thin glass substrate can be reused as a laminate with the new thin glass substrate. [Prior Art Document Patent Document 1: International Publication No. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, in the laminated body of the above-described prior art, when the reinforcing plate is separated from the thin glass substrate, a part of the resin layer may adhere to the product side, that is, the thin plate. (4) on the glass substrate. In the case where the laminate is heat-treated by the high-temperature strip, a part of the resin layer frequently adheres to the peeling surface of the thin-plate glass substrate on the side of the product, and as a result, there is a concern that the yield is lowered. In the case of the above-mentioned prior art, in the laminated body of the above-mentioned prior art, the component of the resin layer is adhered to the peeling surface of the separated thin plate, although it is intended to be cleaned by using a solvent or the like. use! · I $ Soil Cleansing and removal of the appendage is practically impossible to remove to the desired level. In the laminate of the previous composition, on the peeling surface of the separated thin-plate glass substrate, sometimes rupture (cracking) may occur in the glass 163953.doc 201249643 at the time of the separation or the subsequent treatment, and sometimes it may cause The yield is reduced. The present invention has been made in view of the above problems, and an object of the invention is to provide a method for producing a laminated body and a laminated body which can suppress a resin layer when the resin layer and the glass substrate are peeled off even after high-temperature heat treatment. By adhering to the peeling surface of the glass substrate, it is possible to maintain the cleansing property of the peeled surface of the separated glass substrate by performing the cleaning treatment, and it is possible to suppress the occurrence of cracks on the peeled surface of the glass substrate. Further, an object of the present invention is to provide a panel for a display device including a support board including the laminate, a panel for a display device formed using a panel for a display device with a support panel, and a display device. Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above problems and have completed the present invention. That is, in order to achieve the above object, the first aspect of the present invention is a laminate comprising a layer of a support plate, a resin layer, and a layer of a glass substrate with an inorganic insulating film, and the inorganic insulating film is attached thereto. An inorganic insulating film of the glass substrate is in contact with the resin layer; and the glass substrate with the inorganic insulating film has an oxide containing at least one selected from the group consisting of ruthenium and aluminum on one surface of the glass substrate Inorganic insulating film of nitride or oxynitride The total content of atoms of alkali metal and alkaline earth metal in the surface of the inorganic insulating film which is in contact with the above resin layer is 〇5 at. /. Hereinafter, the peel strength of the interface between the layer of the support sheet and the resin layer is higher than the peel strength of the interface between the resin layer and the inorganic insulating film. In the first aspect, it is preferable that the inorganic insulating film is a film containing cerium oxide, nitrogen 163953.doc 201249643 fossil, nitrous oxide or oxidized. In the first aspect, it is preferable that a surface roughness (Ra) of the surface of the inorganic insulating film that is in contact with the resin layer is less than 30 nm. In the first aspect, the thickness of the inorganic insulating film is preferably 5 to 5 nm. In the first aspect, the thickness of the glass substrate is preferably 〇〇3 to 〇8 mm. In the first aspect, it is preferred that the resin of the resin layer is a polyoxymethylene resin. In the first aspect, it is preferred that the polyfluorene oxide resin is a reaction hardened product of an organic alkenyl polyfluorene oxide and an organic hydrogen polyoxyalkylene oxide. In the first aspect, it is preferable that the thickness of the resin layer is 1 to 1 〇〇μηΐβ in the first aspect, and preferably the support plate is a glass plate. A second aspect of the present invention provides a method for producing a laminate, which comprises a method of sequentially providing a laminate of a support layer, a resin layer, and a layer of a glass substrate with an inorganic insulating film, the method comprising: preparing a glass substrate with an inorganic insulating film having an inorganic insulating film containing an oxide, a nitride or an oxynitride containing at least one selected from the group consisting of ruthenium and aluminum on one surface of the glass substrate, The total content of the atoms of the alkali metal and the alkaline earth metal in the surface of the inorganic insulating film that is in contact with the resin layer is 〇5 _ or less; and the support layer with the resin layer as follows is prepared and fixed to the support plate. The resin layer on one side, and the exposed surface of the resin layer has non-adhesiveness, the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film, and the resin of the support plate with the resin layer attached thereto The layered surface is used as a buildup layer, and the glass substrate with the inorganic insulating film is laminated with the I63953.doc 201249643 support plate with the resin layer. In the second aspect, preferably, the support layer with the resin layer is a polysiloxane obtained by hardening the organic alkenyl polyoxyalkylene and the organic hydrogen polyoxyalkylene on the support plate. Support plate for the layer of resin. A third aspect of the present invention is a surface plate for a display device with a support plate, which has a laminated body according to a first aspect of the present invention and a member for a display device provided on a surface of a glass substrate provided on the laminated body. The fourth aspect of the present invention is a panel for a display device, wherein the interface between the inorganic insulating film and the resin layer is used as a peeling surface, and a panel for a display device with a support plate attached to the third aspect of the present invention is used. It is formed by peeling off a support board with a resin layer. According to a fifth aspect of the invention, there is provided a display device comprising the panel for a display device according to the fourth aspect of the invention. Advantageous Effects of Invention According to the present invention, it is possible to provide a laminated body and a method for producing a laminated body, which can prevent the resin of the resin layer from adhering to the glass when the resin layer and the glass substrate are peeled off even after the high-temperature heat treatment is performed. On the peeling surface of the substrate (that is, the surface of the inorganic insulating film), the cleaning property of the separated glass substrate can be maintained by the cleaning treatment, and the chemical resistance of the peeling surface on the glass substrate side can be improved. Inhibit the occurrence of cracks. Further, according to the present invention, it is possible to provide a panel for a display device including a support plate, a panel for a display device formed using a panel for a display device with a support plate, and a display device. [Embodiment] 163953.doc 201249643 The present invention is described with reference to the drawings, and the present invention is not limited to the following embodiments, and various modifications and substitutions may be added to the following embodiments without departing from the scope of the invention. . Furthermore, in the present invention, the interface between the layer of the support plate and the resin layer is stronger than the peeling of the interface between the resin layer and the inorganic insulating film, and the following means that the resin layer and the inorganic insulating film are peelably adhered to each other, and the support plate The resin layer is fixed. In the present invention, the term "at%" means the ratio of each atom to the total number of atoms. Fig. 1 is a schematic cross-sectional view showing an example of a laminate of the present invention. As shown in Fig. 1, the laminated body 10 is a laminated body in which a resin layer 32· is present between a layer of a glass substrate 24 having an inorganic insulating film and a layer of the support plate 31. The glass substrate 24 with an inorganic insulating film is provided with a glass substrate 20' and an inorganic insulating film 22 provided on the surface thereof. The layer of the glass substrate 24 with the inorganic insulating film is disposed on the resin layer 32 such that the inorganic insulating film 22 is in contact with the resin layer 32, and the interface between the inorganic insulating film 22 and the resin layer 32 is peelably adhered. Further, the surface of the inorganic insulating film which is the interface between the inorganic insulating film 22 and the resin layer 32 is the surface 221, and the surface of the resin layer is the surface 321 . Further, the resin layer 32 is fixed to the layer of the support plate 31 on one side while the other surface (surface 321) is in contact with the inorganic insulating film 22 of the glass substrate 24 to which the inorganic insulating film is attached, the resin layer 32 and the inorganic insulating film. The interface of 22 is peelably adhered. The two-layer portion including the layer of the support plate 31 and the resin layer 32 is reinforced with the glass substrate 24 to which the inorganic insulating film 163953.doc 201249643 is attached in the step of manufacturing a liquid crystal panel or the like (electronic device). In addition, the layer of the support layer 31 and the two layers of the resin layer 32 are separately referred to as a support layer (hereinafter also referred to as a reinforcing plate) with a resin layer. The two-layer portion of the body 10 is referred to as a layer of the reinforcing plate 30. The resin layer 32 is fixed to the support plate 3 1 in the reinforcing plate 3 . This laminated body 10 is used until the middle of the manufacturing process of the apparatus. In other words, the laminated body 10 is formed by forming a member for a device such as a thin film transistor on the surface of the glass substrate (that is, the second main surface 202 on which the inorganic insulating film 22 is not present on the glass substrate 24 to which the inorganic insulating film is attached). Thereafter, the layer of the reinforcing plate 3 is peeled off at the interface with the layer of the glass substrate 24 to which the inorganic insulating film is attached, and the layer of the reinforcing plate 30 of the laminated body 10 does not form a part constituting the device. The reinforcing plate 30 separated from the glass substrate 24 to which the inorganic insulating film is attached, that is, the supporting plate with the resin layer attached thereto, can be reused as a laminated body 10 by laminating the glass substrate 24 to which the inorganic insulating film is newly attached. In the present invention, it has been found that a desired effect can be obtained by the laminated body 10 having the inorganic insulating film 22 and the resin layer 32 in contact with each other. Hereinafter, each configuration (a glass substrate, a resin layer, and a support plate with an inorganic insulating film) will be described in detail. <Glass substrate with inorganic insulating film> First, the glass substrate 24 to which the inorganic insulating film is attached will be described. The glass substrate 24 with an inorganic insulating film is provided with a glass substrate 20 and an inorganic insulating film 22 provided on the surface thereof. The inorganic insulating film 22 is disposed on the outermost surface of the glass substrate 24 with the inorganic insulating film attached so as to be in close contact with the resin layer 32 to be described later. 163953.doc 201249643 Hereinafter, a method of manufacturing the glass substrate 20, the inorganic insulating film 22, and the inorganic insulating film 22 will be described in detail. (Glass substrate) The glass substrate 20 is provided with the inorganic insulating film 22' on the first main surface 2'1 on the resin layer 32 side, and the device member is formed on the second main surface 2'2 on the side opposite to the resin layer 32 side. Form the device. Here, the member for the device is a member constituting at least a part of the device as a constituent member of the panel for a display device to be described later. Specific examples include a thin film transistor (TFT) and a color filter (CF, c〇1〇r Fiher). As the device, a solar cell (PV), a liquid crystal panel (LCD), an organic EL panel (0 LED), or the like can be exemplified. The type of the glass substrate 20 can be a normal one, and examples thereof include a glass substrate for a display device such as lcd or OLED. The glass substrate 2 is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage rate. As a measure of the heat shrinkage rate, the linear expansion coefficient specified in JIS R 3 102 (1995 Revision) is used. If the linear expansion coefficient of the glass substrate 20 is large, the manufacturing steps of the apparatus are often accompanied by heat treatment, so that various problems are apt to occur. For example, when a TFT is formed on the glass substrate 20, if the glass substrate 20 on which the TFT is formed under heating is cooled, the positional deviation of the TFT becomes excessive due to thermal contraction of the glass substrate 2. The glass substrate 20 is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a forming method may be a normal one, for example, a floating method, a melting method, a flow hole down method, a rich method, a Luber method, etc., in particular, a thickness of 163953.doc -10·201249643 thin glass substrate 2〇 A method in which a glass which is formed into a plate shape is twisted to a moldable temperature and is stretched to a thickness of .k '. The method is obtained by forming. The glass of the glass substrate 20 is not particularly limited, and is preferably a non-destructive stone slab; (iv) glass, (four) glass, high-frequency glass, and other oxide-based ceremonies. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of 40 to 9 % by mass in terms of oxide. As the glass of the glass substrate 20, a glass suitable for the type of the device or a manufacturing step thereof is used. For example, in the glass substrate for a liquid crystal panel, since the elution of the metal component is likely to affect the liquid crystal, a glass (alkali-free glass) containing substantially no alkali metal component (which usually contains an alkaline earth metal component) is contained. Thus, the glass of the glass substrate is appropriately selected depending on the type of the apparatus to be applied and the manufacturing steps thereof. The thickness of the glass substrate 20 is not particularly limited, and is usually 〇8 mm or less, preferably 0.3 mm or less, and more preferably 〇5 mm or less from the viewpoint of thinning and/or weight reduction of the glass substrate 2〇. . When it exceeds 〇 8 mm, the requirements for thinning and/or weight reduction of the glass substrate 20 are not satisfied. When the thickness is 3 mm or less, the glass substrate 2 can be imparted with good flexibility. When the thickness is 0.1 5 mm or less, the glass substrate 2 can be wound into a roll shape. Further, the thickness of the glass substrate 2 is preferably 〇.03 mm or more because the glass substrate 20 is easily manufactured and the glass substrate 20 is easily handled. Further, the glass substrate 20 may have two or more layers. In this case, the materials forming the layers may be the same material or different materials. Further, in - Π 163953.doc 201249643 In the case of the clearing, "the thickness of the glass substrate 2G" means the total thickness of all the layers. (Inorganic Insulating Film) The optical film 22 contains an oxide, a nitride or an oxynitride selected from the group consisting of a cut and a lanthanum, and may also contain the compound β. It is preferable that the inorganic insulating film 22 contains an oxide, a nitride or an oxynitride of lanthanum or aluminum, and may also contain a mixture of the compounds. Inorganic support is preferably any of oxides, nitrides or oxynitrides. Depending on the case, the inorganic insulating film 22 may also contain a metal atom other than the shoulder + and (4) ' as a metal atom. For example, also; = :: original? Button atom, molybdenum atom, etc. However, it is preferred that substantially no alkali metal atoms and alkaline earth metal atoms are contained as described later. _ specific and t ' can be enumerated: dioxane (Si〇2), oxygen fairy (Al2〇3), f fossil (Si_3N4), nitrogen fairy (Α1Ν), oxynitride (SiOxN2_x, χ is (Μ) gas Oxidation (Al2〇yN3.y, y is (U~2 9), yttrium aluminum oxide (Al2.xSixOzN4.x '乂 is 〇9 '鸲〇"~3 material. It may also be a mixture of such Among them, since the heat resistance is excellent and the crack resistance is good, it is preferably exemplified by dioxane (Si〇2), nitrogen cut (Si3N4), (10), and 4, and χ is in the range of 〇.6 to K4. The nitrogen oxynitride eve, the oxidized dynasty (eight) goes to the crystallized sulphur dioxide. The inorganic insulating film 22 preferably contains the above oxide 'nitride or gas oxide as a main component', specifically, the above oxide The content of the nitride and the oxynitride is preferably 98% by mass or more based on the total amount of the inorganic insulating film, more preferably 163953.doc -12· 201249643 or more preferably 99% by mass or more, and particularly preferably 99.999% by mass or more. Film 2 2 exhibits excellent heat resistance. Therefore, even if the laminate 1 is exposed to high temperature conditions, the film itself is not susceptible to chemical changes. Chemical bonding between the resin layers 32 is also less likely to occur, and the resin of the resin layer 32 caused by heavy peeling is less likely to adhere to the glass substrate 24 with the inorganic insulating film attached thereto. Further, the inorganic insulating film 22 itself has excellent mechanical strength. The surface of the glass substrate 20 can be provided with crack resistance. The above-mentioned heavy peeling means that the peeling strength of the interface between the inorganic insulating film 22 and the resin layer 32 becomes larger than the peeling strength of the interface between the support sheet 31 and the resin layer 32, and Any one of the strength (block strength) of the material itself of the resin layer 32. If heavy peeling occurs at the interface between the inorganic insulating film 22 and the resin layer 32, the resin of the surface 321 of the resin layer 32 tends to adhere to the exposed On the surface 221 of the inorganic insulating film, the surface thereof is easily cleaned. The adhesion of the resin to the surface 221 of the inorganic insulating film means that the resin layer 32 is entirely attached to the surface 221 of the inorganic insulating film, and the surface 321 of the resin layer 32 is damaged. A part of the resin of the surface 321 of the resin layer 32 is adhered to the surface 22 of the inorganic insulating film. The thickness of the inorganic insulating film 22 is not particularly limited, and the peeling by the heavy peeling is further suppressed. The resin layer 32 is attached to the glass substrate 24 to which the inorganic insulating film is attached, and is preferably 5 to 5 nm, more preferably 10 to 500 nm in terms of maintaining scratch resistance. The glass substrate 24 having an inorganic insulating film is preferably used for the purpose of mounting. The transparent insulating film 22 is preferably transparent. Specifically, the transmittance at a wavelength of 38 Å to 780 nm, that is, the glass substrate 24 with an inorganic insulating film. The visible light transmittance is preferably 70% or more, more preferably 8% or more. I63953.doc 201249643 The inorganic insulating film 22 is referred to as a single layer in Fig. 1, but may be a laminate of two or more layers. For example, when the inorganic insulating film 22 is two layers, the i-th inorganic insulating film that is in contact with the glass substrate 20 and the second inorganic insulating film that is provided on the first inorganic insulating film are provided. When the inorganic insulating film 22 is two layers, the components of the first inorganic insulating film and the second inorganic insulating film may be different. Further, an inorganic conductive film may be provided between the first inorganic insulating film and the second inorganic insulating film or between the glass substrate 2A and the first inorganic insulating film. Further, for example, in the range where the surface roughness (Ra) of the surface of the inorganic insulating film 22 that is in contact with the resin layer 32 is less than 30 nm, the inorganic conductive film may be provided in an island shape or a stripe shape. Further, a flattening layer that planarizes the surface of the inorganic insulating film 22 may be provided between the glass substrate 20 and the inorganic insulating film 22, for example, a resist layer that prevents diffusion of alkaline ions from the glass substrate 20 to the inorganic insulating film 22. . The inorganic insulating film 22 can be provided on one portion of the surface of the glass substrate 20 within the range in which the effects of the present invention are not impaired. For example, the inorganic insulating film 22 may be provided in an island shape or a stripe shape on the surface of the glass substrate 20. More specifically, the coverage of the inorganic insulating film 22 on the surface of the glass substrate 20 is preferably such that the resin layer 32 is adhered to the glass substrate 24 with the inorganic insulating film by the heavy peeling. 50 to 100%, more preferably 75 to 100%. In the laminated body 10, the total content of the atoms of the alkali metal and the alkaline earth metal in the surface of the inorganic insulating film 22 which is in contact with the resin layer 32 (that is, the surface 221 of the inorganic insulating film) is 0.5 at% or less, more preferably 〇. At or below, in the glass substrate 24 with the inorganic insulating film before the lamination, or after the separation from the laminated body, I63953.doc 14 201249643 In the glass substrate 24 having the inorganic insulating film, the inorganic insulating film 22 is The total content of the atoms of the alkali metal and the alkaline earth metal in the surface on the side opposite to the side on the side of the glass substrate 2 is also the same as '0.5 at% or less, more preferably 〇.1 at% or less. By setting it as the said range, it is not easy to re-peeling, etc., and the adhesion of the resin of the resin layer 32 after the temperature-temperature process can be further suppressed, and the surface of the resin which adhered is also more excellent. . In the following, the surface of the inorganic insulating film 221 in the laminated body 10 and the surface of the inorganic insulating film of the glass substrate 24 with the inorganic insulating film itself are not particularly referred to as the inorganic insulating film surface 221. In the present invention, the total content of the atoms of the alkali metal and the alkaline earth metal means the alkali metal atom and the alkaline earth metal atom of the surface obtained by measuring the surface of the inorganic insulating film by XPS (X-ray photoelectron spectroscopy). content. Further, in the XPS measurement, a known XPS measuring device can be used. In addition, the case where the total content of the alkali metal and the alkaline earth metal atom is 0.5 at% or less is referred to as substantially no alkali metal atom and soil test metal atom. Further, it is preferable that the surface roughness (Ra) of the surface of the inorganic insulating film 22 in contact with the resin layer 32 (i.e., the inorganic insulating film surface 221) in the laminated body 10 is less than 30 nm. Similarly, it is preferable that the surface roughness (Ra) of the surface of the inorganic insulating film is less than 30 nm in the glass substrate 24 with the inorganic insulating film. By setting it to the above range, it is less likely to cause heavy peeling or the like, and the adhesion of the resin of the resin layer 32 after the high-temperature treatment can be further suppressed, and the surface which is more excellent in the removability of the adhered resin can be obtained. Among them, in terms of the effect of the present invention, the surface roughness (Ra) is preferably 10 nm or less, and more preferably 163953.doc -15 to 201249643 is 1 nm. Further, the limit is not particularly limited, and is preferably 〇nm.

Ra is measured in accordance with JIS B 0601 (2001 revision). Further, it is more preferable that the above two surface characteristics of the inorganic insulating film side surface of the glass substrate 24 with the inorganic insulating film are satisfied. That is, the side surface of the inorganic insulating film of the glass substrate 24 with the inorganic insulating film is more preferably substantially free of alkali metal atoms and alkaline earth metal atoms, and its surface roughness (Ra) is less than 30 nm. In a typical glass substrate, a metal atom or a test metal atom exists on the surface thereof because it contains a specific amount of an alkali metal or an alkaline earth metal component. For example, in a glass substrate comprising an alkali-free borosilicate glass, substantially no alkali metal component is contained, and since a specific amount of an alkaline earth metal component is contained, a soil-measuring metal atom exists on the surface thereof. Further, since the glass substrate containing sodium mother glass contains a specific amount of an alkali metal component and an alkaline earth metal component, a metal atom and a soil test metal atom are present on the surface thereof. Therefore, when the glass substrate is brought into direct contact with the resin layer and exposed to high temperature conditions, the alkali metal atom or the soil metal atom is detached and chemically reacts with the components of the resin layer, and as a result, the surface of the glass substrate and the surface thereof The bonding force between the adjacent resin layers is increased. Therefore, it is easy to make it difficult to separate the glass substrate 2 from the resin layer 32, and it is also prone to heavy peeling. Further, the term "alkali metal" means lithium, sodium and lanthanum. The so-called alkaline earth metal means magnesium, calcium, barium and strontium. It is considered that in the glass substrate 24 with the inorganic insulating film, the alkali metal atom or the alkaline earth metal atom in the glass substrate 2 is blocked by the inorganic insulating film 22, and the inorganic insulating film surface 221 is also substantially not included. An alkali metal atom or an alkaline earth metal atom, by which it does not occur in the laminate 1 163 153953.doc • 16 - 201249643 The metal atom or alkaline earth metal atom is detached from the inorganic insulating film surface 221 toward the resin layer 3 2 side. The chemical reaction is caused, and heavy peeling or the like is less likely to occur. By this, in the peeling of the laminated body 1 after the high temperature treatment, the adhesion of the resin to the surface 221 of the inorganic insulating film can be suppressed, and the surface of the adhered resin can be made more excellent. The total content of the atoms of the alkali metal or alkaline earth metal measured by XPS in the surface 221 of the inorganic insulating film is 0.5 at% or less, preferably (M at % or less). The surface system substantially does not contain an alkali metal atom or an alkaline earth metal atom. A material which does not contain an alkali metal atom or an alkaline earth metal atom is used as a material for forming the inorganic insulating film 22. For example, in the case where the inorganic insulating film 22 is formed by a reduced ore method, an alkali metal is used. A material having a small atomic or soil-measured metal atom is used as a material of an inorganic insulating film material such as a sputtering target or a sputtering atmosphere, thereby forming an inorganic insulating layer having a surface substantially containing no alkali metal atom or alkaline earth metal atom. Membrane 22. Generally, if an alkali metal atom or an alkaline earth metal atom is not intentionally added to the material for forming the inorganic insulating film 22 as described above, the alkali metal atom or the alkaline earth metal atom contained in the material as an impurity Therefore, the inorganic insulating film 22 obtained by using a commonly used material becomes substantially free of a metal atom or an alkaline earth metal atom. Further, as long as the inorganic insulating film 22 is not thick (four) thin, the metal atom or the test metal atom of the glass substrate 20 does not penetrate the inorganic insulating film and reaches the surface which is not in contact with the glass substrate. As described above, as long as the thickness of the inorganic insulating film 22 is about 5 (10) or more, the metal atom or the test metal atom of the glass substrate 2 can be sufficiently blocked. 163953.doc -17- 201249643 The surface of the glass substrate 20 generally used is smooth, The surface of the inorganic insulating film 22 formed thereon is also smoothed. That is, the glass of the glass substrate 2 has a rough surface roughness (Ra) of less than 30 nm, and the inorganic insulating film 22 is formed thereon. The surface roughness of the surface (inorganic insulating film surface 221) which is not in contact with the glass substrate 20 becomes less than 30 nm. However, depending on the case, the surface of the glass substrate 20 may be roughened by a surname or the like. For example, depending on the type of the inorganic insulating film 22, the surface of the glass substrate 20 may be roughened in order to increase the bonding strength with the surface of the glass substrate 2. Further, it may be used as a glass base. When the reflected light on the surface of the plate 20 is diffused to reduce the glare caused by the reflected light (anti-glare treatment), the surface of the glass substrate 2 is roughened. When the surface of the glass substrate 20 is roughened, the following are as follows: After the surface roughness (Ra) of the roughened surface is 3 〇 nm or more, the surface of the inorganic insulating film 22 formed thereon that does not contact the glass substrate 2 ( (the inorganic insulating film surface 221) The surface roughness of the surface of the inorganic insulating film 22 is not necessarily the direct surface roughness of the surface 221 of the inorganic insulating film, and the surface roughness of the surface of the glass substrate 2 is not necessarily directly formed by the inorganic insulating film 22. When the surface roughness of the inorganic insulating film 22 is moderated, the surface roughness of the inorganic insulating film surface 221 is not limited to the surface roughness of the surface of the glass substrate 2 (manufacturing method of the inorganic insulating film). The method is not particularly limited, and a known method can be employed, for example, a method in which a specific oxide, a nitride, or an oxynitride is provided on a glass substrate 2 by a vapor deposition method or a non-plating method. For example, plasma nitridation or the like can be used by CVD (Chemical 163953.doc 201249643

Deposition, chemical vapor deposition) The ruthenium dioxide film formed by nitridation is formed into a ruthenium oxynitride film. The ruthenium nitride film formed by CVD can also be formed by a plasma oxidation method. Oxidation treatment forms a ruthenium oxynitride film. The production conditions are appropriately selected depending on the oxide, nitride, and oxynitride of the metal to be used. <Support Plate> The support plate 31 and the resin layer 32 cooperate to support and reinforce the glass substrate 24 with the inorganic insulating film, and prevent deformation and injury of the glass substrate 24 with the inorganic insulating film in the manufacturing process of the device. , damage, etc. Further, one of the purposes of using the support plate 3^ is to produce a laminate 10 having the same thickness as the previous glass substrate when using a glass substrate 24 with an inorganic insulating film which is thinner than before. Thereby, manufacturing techniques or manufacturing equipment suitable for the glass substrate of the previous thickness can be used in the manufacturing steps of the device. As the support plate 31, for example, when a metal plate such as a glass plate or a resin plate is used, and the manufacturing process of the device is accompanied by heat treatment, the support plate 31 preferably has a difference in linear expansion coefficient from the glass substrate 2 The smaller material is formed, more preferably formed of the same material as the glass substrate 20, and preferably the support plate 31 is a glass plate. More preferably, the support plate 31 is a glass plate containing the same glass material as the glass substrate of the glass substrate. The thickness of the support plate 3 can be thicker than the glass substrate 2 〇, and can be thinner than 20. Preferably, the support plate thickness is selected according to the thickness of the glass substrate 24 with the inorganic insulating film, the thickness of the resin layer 32, and the thickness of the laminate body 1 such as the manufacturing process of the current device to process the thickness 〇5. 163953.doc • 19·201249643 The design of the substrate is such that when the sum of the thickness of the glass substrate 24 with the inorganic insulating film and the thickness of the tree layer a layer 32 is 〇·ΐ mm, the support plate 31 is used. The thickness is set to 0.4 mm. » The thickness of the support plate 3 1 is preferably 〇 2 to 5.0 mm in general. In the case where the support plate 31 is a glass plate, the thickness of the glass plate is preferably 〇.08 mm or more for reasons of easy handling, difficulty in cracking, and the like. Further, the thickness of the glass sheet is preferably i 〇 mm or less for the reason that it is desired to be rigidly bent without being broken when the device member is formed after peeling. The difference between the average linear expansion coefficient of the glass substrate 20 and the support plate 31 at 25 to 300 ° C (hereinafter referred to as "average linear expansion coefficient") is preferably 5 〇〇χ 1 〇.7 / β (: α下' Preferably, it is 30 〇χ 1 〇 7 / Χ: the following, and further preferably 2 〇〇χΐ〇 -7 /.. If the difference is too large, the laminate 10 is severely warped when heated and cooled in the manufacturing steps of the apparatus. The curvature of the glass substrate 24 with the inorganic insulating film and the reinforcing plate 30 may be peeled off, etc. When the material of the glass substrate 2 is the same as the material of the support plate 31, such a problem can be suppressed. <Resin Layer> The resin layer 32 is fixed to the support plate 31, and is detachably adhered to the glass substrate 24 to which the inorganic insulating film is attached. The resin layer 32 prevents the position of the glass substrate 24 to which the inorganic insulating film is attached. The operation of separating the glass substrate 24 with the inorganic insulating film from the support plate 31 is performed, and the glass substrate 24 to which the inorganic insulating film is attached is easily peeled off by the separating operation, and the inorganic insulating film is prevented from being attached. The glass substrate 24 or the like is broken by the separation operation. The resin layer 32 is fixed to the support plate 31, and in the separation operation, the resin layer 32 is not peeled off from the support plate 31, and a J63953.doc -20» 201249643 support plate with a resin layer is obtained by a separating operation ( Further, it is preferable that the peeling origin is provided at the interface between the resin layer 32 and the inorganic insulating film 22 at the time of starting the separation operation to be peeled off, so that the interface is easily peeled off by the separating operation. The surface 321 which is in contact with the inorganic insulating film 22 is peelably adhered to the surface 221 of the inorganic insulating film 22. In the present invention, the property of the surface of the resin layer 321 which can be easily peeled off is referred to as releasability. The above-mentioned fixing and (peelable) are intimately adhered to the peeling strength (that is, the stress required for peeling), and the fixing means that the peeling strength is large with respect to the close contact. Further, the peelable close contact means peelable. Further, it is also possible to peel off the surface to be fixed without peeling off. Specifically, it means that the operation of separating the glass substrate 24 with the inorganic insulating film from the support plate 31 is performed in the laminated body 10 of the present invention. In this case, the surface is peeled off on the surface to be adhered, and the surface is not peeled off on the surface to be fixed. Therefore, if the laminated body is subjected to an operation of separating the glass substrate 24 with the inorganic insulating film and the support plate 3, the laminate is laminated. The body 10 is separated into a glass substrate 24 with an inorganic insulating film and a support plate (reinforcing plate 30) with a resin layer. The resin layer 32 is preferably fixed by a strong bonding force such as an adhesive force or an adhesive force. On the surface of the support plate 31, for example, the reaction-hardening resin is hardened by reaction on the surface of the support plate 31, so that the hardened resin is adhered to the surface of the support plate 31. Further, the surface of the support plate 31 can be implemented. The treatment for generating a strong bonding force between the resin layers 32 (for example, treatment using a coupling agent) improves the bonding force between the surface of the support sheet 31 and the resin layer 32. On the other hand, it is preferable that the resin layer 32 is bonded to the surface of the inorganic insulating film 221 with a weak bonding force, for example, by the bonding force of 163953.doc -21·201249643 by the van der Waals force between the solid molecules. The surface 321 of the resin layer before the contact with the inorganic insulating film 22 is preferably a non-adhesive surface ′ by making the non-adhesive resin layer surface 321 contact the inorganic insulating film surface 221, so that the two surfaces are weaker. Combine with force. That is, when the surface 321 of the resin layer is non-adhesive, the peeling property at the interface with the surface 221 of the inorganic insulating film is further improved. The two surfaces are in contact without a gap, and this state is referred to as a close contact in the present invention. Furthermore, the surface of the resin layer can be made non-adhesive by surface treatment which imparts non-adhesiveness to the surface of the resin layer which is not normally non-adhesive, and it is not non-adhesive in the usual sense. The resin layer is a resin which can be adhered to with a bonding force which is sufficiently low with respect to the bonding strength in the above-described fixing (and as long as the inorganic insulating film is not peeled off from the glass substrate, the glass substrate with the inorganic insulating film is not formed) Further, if the support sheet is peeled off or the like, it can be peeled off, and the surface treatment can be used as the material of the resin layer. In particular, when the surface of the resin layer that is in contact with the inorganic insulating film is non-adhesive, it is less likely to remain on the surface of the inorganic insulating film due to the breakage of the surface of the resin layer during peeling, and also because of inorganic insulation. The damage of the film causes a part of the material to remain on the surface of the resin layer to be less. As described above, the bonding force of the resin layer 32 to the surface of the support sheet 31 is relatively higher than the bonding strength of the resin layer 32 to the inorganic insulating film surface 22. Therefore, the peeling strength between the resin layer 32 and the support sheet 31 is higher than the peel strength between the resin layer 32 and the glass substrate 24 to which the inorganic insulating film is attached. Preferably, the resin layer 32 and the support plate 31 are bonded or joined together. However, it is not limited to this as long as the bonding strength of the resin layer 32 to the glass substrate 24 with the inorganic insulating film is relatively high, and the resin layer 32 and the support plate 3丨 are also 163953.doc -22- 201249643 It can be combined by the force caused by other bonding forces. The size of the resin layer 32 is not particularly limited. The size of the resin layer 32 can be larger and smaller than that of the glass substrate 20 or the support plate 31. The thickness of the ruthenium layer 32 is not particularly limited, and is preferably i~丨〇〇μηι, more preferably 5 to 30 μηι, and further preferably 7 to 2 〇μηΐβ because the tree layer is 32 When the thickness is in this range, the resin layer 32 is sufficiently adhered to the glass substrate 24 with the inorganic insulating film. Further, the reason is that even if bubbles or foreign matter are interposed between the resin layer 32 and the glass substrate 24 with the inorganic insulating film, the glass substrate 24 with the inorganic insulating film can be prevented from being deformed by deformation. Further, if the thickness of the resin layer 32 is too thick, it is uneconomical to form a time and material. Further, the resin layer 32 may also contain two or more layers. In this case, "thickness of the resin layer 32" means the total thickness of all the layers. Further, when the resin layer 32 contains two or more layers, the types of the resins forming the respective layers may be different. Preferably, the resin layer 32 comprises a material having a glass transition point lower than room temperature (25 <t<t) or having no glass transition point. The reason for this is that the glass substrate 24 with the inorganic insulating film is more easily peeled off, and the adhesion to the glass substrate 24 with the inorganic insulating film is also sufficient. Further, since the resin layer 32 is often subjected to heat treatment in the manufacturing process of the apparatus, it is preferable to have heat resistance. Further, when the elastic modulus of the resin layer 32 is too high, the adhesion to the glass substrate 24 with the inorganic insulating film tends to be low. On the other hand, if the elastic modulus of the resin layer 32 is too low, the peeling property is lowered. 163953.doc •23- 201249643 The type of the resin forming the resin layer 32 is not particularly limited. For example, an acrylic resin, a polyolefin resin, a polyamino phthalate resin, or a polyoxyxylene resin can be listed. Several resins can also be used in combination. Among them, it is preferred to know the polyoxo tree. The reason for this is that the polysulfide resin is excellent in heat or peelability. Further, the reason is that when the support plate 31 is a glass plate, it is easily fixed to the glass plate by a condensation reaction with a stanol group on the surface of the glass plate. In a state in which the polyoxyxylene resin layer is interposed between the support sheet 31 and the glass substrate 24 with the inorganic insulating film, the peeling property is also treated for about 1 hour at about 2 ° C > c in the atmosphere, for example. It is preferable that it is hardly deteriorated in this respect. It is preferable that the resin layer 32 contains a polyoxyl resin (hardened material) for a release paper in a polyoxyxylene resin. The polyoxyxene resin of the release layer of the release paper is formed by curing the layer of the curable polyoxynoxy resin composition coated on the release paper to form the curable polyoxo resin composition, and comprising the curable poly The resin layer of the hardened polyoxo resin formed by hardening the surface of the support layer 31 on the surface of the support sheet 31 is then adhered to the surface of the support sheet 31 and its free surface has excellent non-adhering enthalpy, which is preferable. Further, since the flexibility is high, even if foreign matter such as bubbles or dust mustard is mixed between the resin layer 32 and the glass substrate 24 with the inorganic insulating film, the glass substrate 24 with the inorganic insulating film can be prevented from being deformed. The curable polyoxo resin composition prepared to form the layer of the (four) paper or the like is classified into a condensation reaction type polyoxo resin composition and an addition reaction type 14 oxygen resin k according to the hardening mechanism. Any of the compounds, the ultraviolet curable polycities, and the electron beam curable polyoxo resin 163953.doc • 24·201249643, any of them can be used. Among these, an addition reaction type polyoxo resin composition is preferred. The reason for this is that the ease of the curing reaction and the degree of non-adhesion of the surface 321 of the resin layer after curing are good, and the heat resistance is also high. The addition-reaction type polyoxo resin composition is a curable composition which is cured by the presence of a host agent and a crosslinking agent in the presence of a catalyst such as a platinum-based catalyst. The hardening of the addition reaction type polyoxyxene resin composition is subjected to heat treatment to promote the addition reaction type. The main component in the polyoxygen resin composition preferably has a bond, 'σ on the fluorene atom. (vinyl or the like) of an organic polyoxyalkylene (i.e., an organic alkenyl polyoxyalkylene. Further, preferably linear), and an alkenyl group or the like is a crosslinking point addition reaction type polyoxyethylene resin composition. The crosslinking agent is preferably an organic polyoxane having a hydrogen atom (hydroalkylene group) bonded to a halogen atom (ie, an organic hydrogen polyoxo. Further, preferably a linear chain). And the hydrogenstone base is a crosslinking point. The addition reaction type polyoxymethylene resin composition is hardened by an addition reaction of a crosslinking point of a main agent and a crosslinking agent. Further, the curable polyoxo resin composition used for forming the release layer such as release paper may be in the form of a solvent type, a nipple type, or a solventless type, and any type may be used. Among these, it is preferably a solventless type. The reason is that it is excellent in terms of productivity, safety, and environmental characteristics. Further, the reason for this is that, in the case of curing at the time of forming the resin layer 32, that is, in the case of heat curing, ultraviolet curing, or electron beam curing, the solvent which causes foaming is not contained, and therefore bubbles are less likely to remain in the resin layer 32. Further, 'the curable polycondensation 163953.doc -25·201249643 oxygen resin composition used for forming a release layer such as release paper, specifically, as a commercially available product name or model, KNS-; 320A, KS- 847 (both manufactured by Shin-Etsu Silicones Co., Ltd.), TPR6700 (manufactured by Momentive Performance Materials Japan Co., Ltd.), vinyl polyoxylium "8500" (manufactured by Arakawa Chemical Industries Co., Ltd.), and methyl hydrogen polychlorite "1203丨" Combination of vinyl polyoxynium "11364" (made by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogen polyoxomethoxane "12031" (made by Arakawa Chemical Industries Co., Ltd.), vinyl A combination of polyoxylium "1 1365" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogen polysulfide "12031" (manufactured by Arakawa Chemical Industries, Ltd.). Further, KNS-320A, KS-847 and TPR6700 are preliminarily containing a curable polyoxyxylene resin composition of a main component and a crosslinking agent. Further, the polyfluorene oxide resin (the cured product of the curable polyanthracene resin composition) forming the resin layer 32 is preferably a compound having a low molecular weight in the polyoxynoxy resin layer, which is difficult to be attached thereto. The property of the glass substrate Μ transfer of the inorganic insulating film, that is, oligomeric oxime transfer property. (Manufacturing Method of Resin Layer) The method of fixing the resin layer 32 to the support sheet 31 is not particularly limited. For example, it is preferable to form a layer of a curable resin composition as the resin layer 32 on the surface of the support sheet 31. Then, the curable resin composition is cured to form the resin layer 32, and the resin layer 32 fixed to the support sheet 31 is formed in this manner. Further, for example, the resin layer 32 may be formed by a method of fixing a film-like resin to the surface of the support sheet 3 . Specifically, the following method can be mentioned. In order to impart a high fixing force (high peel strength) to the surface of the support sheet 31 to the surface of the support sheet 31, the surface of the support sheet 31 is surface-modified (initiated 163953.doc • 26· 201249643 Processing) 'Make it fixed on the support board 1 1 p and on the board 3 1 . For example, a chemical method such as a decane coupling agent, a 揾古田> a α v a dry I chemical method (primer treatment), a physical method of increasing a surface active group such as a flame treatment, spray A mechanical treatment method or the like which increases the resistance by increasing the coarseness of the surface by sand treatment or the like. In the method of forming the layer of the curable resin composition as the resin layer 32 on the surface of the support sheet 31 and then curing the curable resin composition to form the resin layer 32, 'curing property is formed on the surface of the support sheet 31. The method of the layer of the resin composition is, for example, a method of applying the curable resin composition onto the support sheet 31. The method of coating is, for example, f coating method, die coating method, and coating method. , roll coating, bar coating, screen printing, gravure coating, etc. It can be appropriately selected from such a method depending on the kind of the resin composition. Further, when the curable resin composition as the resin layer 32 is applied onto the support sheet 31, the coating amount thereof is preferably from 1 to 1 g/m2, more preferably from 5 to 20 g/m2. For example, in the case where the resin layer 32 is formed from the addition reaction type polyoxyxylene resin composition, a curable resin composition containing a mixture of an organic alkenyl polysiloxane, an organic hydrogen polyoxyalkylene, and a catalyst is used. It is applied to the support sheet 31 by a known method such as the above-described spraying method, and thereafter heat-hardened. The heat-hardening condition differs depending on the preparation 5 of the catalyst. For example, when the platinum-based catalyst is blended in an amount of 1 part by mass based on the total amount of the organic baking polysiloxane and the organic hydrogen polyoxyalkylene oxide, 2 parts by mass of the platinum-based catalyst is blended. At 5 于 in the atmosphere. It is preferably 〇~25〇〇c, preferably reacted at 100 C to 200 °C. Further, the reaction time in this case is 5 to 60 minutes, preferably 1 to 3 minutes. 163953.doc -27- 201249643 By thermally hardening the curable resin composition, the polyoxin resin is chemically bonded to the support plate 3i during the hardening reaction, and further, the polyoxyl resin layer is formed by the anchoring effect. Combined with the support board 31 and then. By these actions, the polyoxo resin layer is firmly fixed to the support plate 31. Further, even in the case where a resin layer containing a resin other than the polyoxynoxy resin is formed from the hard resin composition, the resin layer 32 fixed to the support sheet 31 can be formed by the same method as described above. <Manufacturing Method of Laminated Body and Laminated Body> As described above, the laminated body 10 of the present invention is a laminated body in which the resin layer 32 is present between the glass substrate 24 with the inorganic insulating film and the support plate 31. The manufacturing method of the laminated hair 5 of the present invention is not particularly limited, and it is generally preferred to prepare a glass substrate 24 with an inorganic insulating film and a support plate with a resin layer produced by the above method (reinforcing plate 3) Further, the surface of the inorganic insulating film of the glass substrate 24 with the inorganic insulating film and the surface of the resin layer of the above-mentioned support layer (reinforcing plate 3) with the resin layer are laminated as a layer. In the case where the layer of the resin layer 32 has non-adhesion properties, it is possible to easily peelably adhere the two by conventional superposition and pressurization. Specifically, for example, a method in which the glass substrate 24 with the inorganic insulating film is superposed on the non-adhesive surface of the resin layer 32 in a normal pressure environment is used, and the resin layer 32 is formed by using a roll or a press machine. The glass substrate 24 with an inorganic insulating film is pressed. The resin layer 32 is further adhered to the glass substrate 24 with the inorganic insulating film by pressing with a roll or a press, so that it is relatively easy to use by pressing with a roller or a press machine. The bubble between the resin layer 32 and the glass substrate 24 with the inorganic insulating film is removed, and is preferably 163953.doc • 28· 201249643. If the pressing is carried out by a vacuum lamination method or a vacuum extrusion method, it is preferable to suppress the incorporation of bubbles or to ensure good adhesion. By pressing under vacuum, there is also an advantage that even in the case where minute bubbles remain, the bubbles do not grow by heating, and deformation defects of the glass substrate 24 with the inorganic insulating film are less likely to occur. When the resin layer 32 is detachably adhered to the glass substrate 24 with the inorganic insulating film, it is preferable to sufficiently clean the side of the resin layer 32 and the glass substrate 24 with the inorganic insulating film on the side in contact with each other. Lamination is carried out in a clean environment. That is, the foreign matter is mixed between the resin layer 32 and the glass substrate 24 with the inorganic insulating film, and the resin layer 32 is not deformed, so that the flatness of the surface of the glass substrate 24 with the inorganic insulating film is not affected. However, the higher the degree of cleanliness, the better the flatness, and therefore it is preferred. The laminated body 1 of the present invention can be used in various applications, and examples thereof include the use of an electronic component such as a panel for a display device to be described later, a PV, a secondary battery, and a semiconductor wafer having a circuit formed thereon. Further, in this application, the laminate 10 is exposed to high temperature conditions (for example, 32 (TC or more) (for example, j hours or more). Here, the panel for a display device includes an LCD, an OLED, and an electronic paper. , plasma display panel, field emission panel, quantum dot LED panel, MEMS (MICR0 ELECTRO MECHANICAL SYSTEMS, MEMS) shutter panel, etc. <Display panel for display device with support plate and display device with support plate [Manufacturing Method of Panel] 163953.doc -29- 201249643 A panel is used in the present invention. A display panel with a support plate is manufactured using the above laminated body. FIG. 2 is a cross-sectional view showing a support plate pattern of the present invention. A display panel with a support plate as an example of a panel

The V-use panel 4A includes the above-described laminated body 1A and the constituent members 5 of the panel for a display device. (Constituent members of the panel for a display device) The constituent members of the panel for the display device are not particularly used. For example, in a display device such as an LCD using a glass substrate or a 〇LED, it means a member formed on a glass substrate or a part thereof. For example, in a display device such as lcd or the like, a TFT array (hereinafter simply referred to as "array") is formed on the surface of the substrate, and each of the light-emitting sheets, liquid crystals, and ιτ〇 (ΐη-Μ Th) are formed on the surface of the substrate.

A member such as a transparent electrode of Oxides' indium tin oxide or the like, or a combination of various circuit patterns, or the like. The semiconductor material used in the above array is not particularly limited, and examples thereof include amorphous, microcrystalline, and polycrystalline.

Metal oxides such as ZnO and IGZ0, organic compounds such as thiophene derivatives and condensed penta derivatives. Further, for example, a display device including an OLED includes a transparent electrode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like formed on a substrate - the above-described display device panel 4 with a support plate The manufacturing method of the enamel is not particularly limited to the formation of a panel for a display device on the surface of the glass substrate 24 with the inorganic insulating film on the laminated body 10 by a conventionally known method according to the type of the constituent members of the panel for a display device. Member 5〇. For example, in the case of manufacturing an OLED, the surface of the glass substrate 24 of the inorganic insulating film on the side opposite to the side of the resin layer 32 (corresponding to the glass substrate 20) is attached to the laminated body 1 163953.doc • 30·201249643 An organic EL structure is formed on the second main surface 202), and various layers are formed or processed: a transparent electrode is formed, and a hole injection layer, a hole transport layer, a light-emitting layer, and an electron are deposited on the surface on which the transparent electrode is formed. The transfer layer or the like 'forms the back electrode' is sealed using a sealing plate or the like. Specific examples of the formation or treatment of the layers include a film formation treatment, a vapor deposition treatment, and a subsequent treatment of a sealing plate. The formation of the constituent members may also be part of the formation of all of the constituent members necessary for the panel for a display device. In this case, the glass substrate 24 with the inorganic insulating film formed with a part of the constituent members is separated from the reinforcing plate 30, and the remaining constituent members are formed on the glass substrate 24 with the inorganic insulating film, and the display is manufactured. Panel for the device. <Manufacturing Method of Panel for Display Device and Panel for Display Device> As shown in Fig. 2, the panel 60 for a display device of the present invention includes a glass substrate 24 with an inorganic insulating film and a member 50 for a panel for a display device. In the panel 60 for a display device, the interface between the inorganic insulating film 22 and the resin layer 32 is peeled off from the panel 40 for a display device to which the support plate is attached, and the glass substrate 24 with the inorganic insulating tape is separated from the reinforcing plate 30 to obtain . In the case where the constituent member on the glass substrate 24 with the inorganic insulating film separated is a part of the formation of all the constituent members necessary for the panel for a display device, the glass substrate with the inorganic insulating film is attached thereafter. The remaining constituent members ' are formed on 24 to manufacture the panel 6 for display devices. The method of peeling off the peeling surface of the inorganic insulating film 22 from the resin layer 32 is not particularly limited. However, it is preferable to form a peeling starting point and peel off at the interface between the inorganic insulating film 22 and the resin layer 163953.doc 31 201249643 32. Specifically, for example, it is preferable to insert a sharp blade into the interface between the inorganic insulating film 22 and the resin layer 32 to cause the opening of the peeling, and thereafter, the mixed fluid of the water and the compressed air is sprayed and peeled off. In addition, after the panel 60 for the display device is separated from the panel 4 for the display device to which the support panel is attached, the inorganic insulating film-attached glass substrate 24 may be optionally used in the panel 6 of the display device. A constituent member of the panel for a display device is additionally provided on the film 22. Further, the separated reinforcing plate 30 can be laminated with a glass substrate having a new inorganic insulating film to fabricate the laminated body 1 of the present invention. As a method of producing the new layered product, the above-described production method of the present invention is preferred. <Display device> Further, the display device can be obtained by such a display device panel 6〇. Examples of the display device include an LCD and an OLED. As the LCD, TN (Twisted Nematic ' twisted nematic) type, sTN (Super Twisted)

Nematic, super twisted nematic), FE (Field Emission) type TFT (Thin Film Transistors), MIM (Metal Insulator Metal). Here, the operation of obtaining the display device is not particularly limited, and for example, the display device can be manufactured by a conventionally known method. EXAMPLES Hereinafter, the present invention will be specifically described by way of Examples and the like, but the present invention is not limited to the examples. In the following Examples 1 to 5, Comparative Examples, and 4, as a glass substrate, 163953.doc •32·201249643 was used as a glass plate containing borosilicate-free glass (720 mm in length, 600 mm in width, and 0.3 mm in thickness). , linear expansion coefficient 38x1 (T7/°C, manufactured by Asahi Glass Co., Ltd., trade name "AN100"). Also, as a support plate, a glass plate containing an alkali-free borosilicate glass (720 mm in length and 600 mm in width) is used in the same manner. The plate thickness is 0.4 mm, and the coefficient of linear expansion is 38xl (T7/°C, manufactured by Asahi Glass Co., Ltd., trade name "AN100"). In Example 6 and Comparative Example 2, soda lime glass is used as the glass substrate and the support plate. The glass plate (linear expansion coefficient 85 <1〇-7/. (:, manufactured by Asahi Glass Co., Ltd. 'trade name "AS"). In Example 7 and Comparative Example 3, the soda-lime glass was included. The tempered glass plate obtained by chemically strengthening the glass plate in a molten salt of potassium nitrate at 450 ° C for 1 hour is used as a glass substrate and a support plate. The size and thickness of the glass substrates are the same as in Example 1 The glass substrates used in 5 are the same, and the size of the support plates is The thickness is also the same as that of the support sheets used in the first to fifth embodiments. Further, in the examples and comparative examples described later, the surface roughness (Ra) was measured using an atomic force microscope (Seiko Instruments, SPA300/SPI3800). (Evaluation of the peeling property) The peeling property of the glass substrate with the inorganic insulating film after heating of the laminated body mentioned later is performed, and the glass substrate with the inorganic insulating film and the resin layer are carried out after heating on the specific conditions mentioned later. The peeling was performed by visually observing the surface of the glass substrate with the inorganic insulating film that was in contact with the resin layer, and the residue of the resin-free layer was praised, and the residue of the resin layer was evaluated. 163953. Doc •33-201249643 (Evaluation of cleanliness) After heat treatment under the specific conditions described later, the glass substrate with the inorganic insulating film peeled off from the laminate was subjected to ultrasonic treatment (5 minutes) in hexane, and thereafter A scotch tape (trade name: Sellotape (registered trademark), manufactured by Nichiban) is attached to the surface (inorganic insulating film surface) which is in contact with the resin layer, and 90 is peeled off. The peel strength is determined. The smaller the peel strength, the more the residue of the resin layer exists on the surface of the inorganic insulating film, and the peel strength is preferably 0.5 N/25 mm or more. [Example 1 > The support plate having a thickness of 0.4 mm is cleaned with pure water, and then UV (ultraviolet) is cleaned and cleaned. Then, on the first main surface of the support plate, the solvent-free addition reaction type release paper is used for polymerization. Oxygenation (manufactured by Shin-Etsu Silicones, KNS-3 20 A, viscosity: 0.40 Pa. s' Solubility Parameter (SP): 7.3) 100 parts by mass with platinum-based catalyst (51^11_ 3115 mountain (: 〇11, manufactured by the company, CAT-PL-56) 2 parts by mass of the mixture is coated into a rectangular shape by a screen printing machine with a length of 7〇5 mm and a width of 595 mm (coating amount 3〇g) /m2). Then, it was heat-hardened in the atmosphere at 180 ° C for 30 minutes to form a polyoxyxylene resin layer having a thickness of 20 μm on the first main surface of the support sheet. Further, 'the above-mentioned solvent-free addition reaction type release paper polyfluorene oxide contains a linear organic alkenyl polysiloxane (main agent) having a vinyl group and a fluorenyl group bonded to a ruthenium atom, and has a bond A linear organohydrogenpolyoxyalkylene (crosslinking agent) of a hydrogen atom and a methyl group on a halogen atom. Then, the surface of the glass substrate having a thickness of 0.3 mm and the surface of the 163953.doc -34 - 201249643 (the first main surface) which were in contact with the polyoxyxylene resin were washed with pure water, and then cleaned by UV cleaning. Further, the surface of the cleaned surface was obtained by magnetron sputtering (heating temperature 300 ° C, film formation pressure 4 mTorr, power density 3 w/cm 2 ) to form a Si 2 film having a thickness of 30 nm. A glass substrate of an inorganic insulating film. The surface roughness (Ra) g 〇 8 nm of the surface of the inorganic insulating film (the surface of the inorganic insulating film on the side opposite to the glass substrate side, the same meaning is hereinafter). In addition, the total content of the alkali metal and the alkaline earth metal in the surface of the inorganic insulating film obtained by xps measurement (using Quantera SXM manufactured by ULVAC_PHI Co., Ltd., the same applies hereinafter) is below the detection limit (〇丨at. /. or less). . Thereafter, the SiO 2 film-forming surface of the glass substrate and the polyoxy-oxygen resin layer of the support plate were bonded together under vacuum at room temperature to obtain a layered product A. In the obtained laminated body 8, the holding plate and the glass substrate were in close contact with the polyoxo resin layer without bubbles, and the shape was not changed, and the smoothness was also good. (Evaluation of peelability after heating) The laminate A' was heat-treated at 35 ° C for 1 hour in a nitrogen atmosphere in which atmospheric oxygen was 〇 1% or less. Then, a peeling test was performed. Further, a. Specifically, first, the second main surface of the glass substrate in the laminated body A is fixed to the fixed a to the mouth opening. On the other hand, the second t-dipole 2 main surface of the support plate is adsorbed. Then, at one corner of the corner of the layer body A, insert the thick Tang 〇 4 mm in the interface between the glass substrate and the resin layer with the inorganic insulating film at m ancient & Μ μ μ The blade of η u • mm 'slightly peels off the interface between the inorganic insulating film and the resin layer, and the 忐β k becomes the beginning of the separation. Then, the adsorption pad is moved away from the fixed table to make the interface of the dielectric film and the resin layer 163953.doc

S •35- 201249643 Whole peeling, separating the glass substrate with inorganic insulating film from the supporting plate with resin layer” on the peeling surface (inorganic insulating film) of the separated glass substrate with inorganic insulating film Residue of resin. Further, as a result of the above-described cleanliness evaluation of the separated glass substrate with the inorganic insulating film, it was found that the peel strength was 0.7 n/25 mm, and the surface cleansing property was excellent. Thereafter, the separated glass substrate with the inorganic insulating film was placed in 50 in an anti-surname stripping liquid (manufactured by Parker Corporation, containing 20% by mass of potassium hydroxide as a main component) diluted to 20% by weight. After immersing for 1 〇 minutes, the mixture was brushed with water, and then immersed in a hydrochloric acid aqueous solution having a concentration of 〇·1 mol/liter at 90 ° C for 20 hours to perform water washing and blasting. The peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope, and as a result, no crack was observed. (Example lb) By thermal CVD (heating temperature 400 ° C, reaction pressure 1 Pa, reaction gas is tetraethoxy decane and ozone / oxygen, carrier gas is nitrogen: 2000 seem 'ozone/oxygen ratio: 3% In addition to the magnetron sputtering method, a Si 〇 2 film having a thickness of 1 〇〇 nm was formed. Otherwise, a laminate A was obtained according to the same procedure as in Example 1, and the inorganic layer of the glass substrate with the inorganic insulating film was added. The surface roughness (Ra) of the surface of the insulating film was 2 nm. Further, the total content of the alkali metal and alkaline earth metal atoms in the surface of the inorganic insulating film obtained by XPS measurement was 0.5 at%. Thereafter, for the laminate A, the peeling was performed in the same manner as in Example 1 163953.doc -36 - 201249643. There is no resin residue on the peeled surface of the separated glass substrate with the inorganic insulating film. Further, as a result of the evaluation of the cleanliness of the separated glass substrate with the inorganic insulating film, the peel strength was 0.8 N/25 mm, and the surface cleanliness was excellent. Thereafter, the glass substrate with the inorganic insulating film separated thereon was subjected to alkali washing, pickling, and brushing according to the same procedure as in Example 1, and the peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope. No cracks were seen. Further, it is considered that the metal of the metal oxide and the alkaline earth metal in the surface of the inorganic insulating film is caused by impurities in tetraethoxysilane. &lt;Example 2 &gt; ICP-CVD method (Inductively Coupled Plasma-Chemical Vapor Deposition' Inductively coupled plasma-assisted chemical vapor deposition heating temperature 400 C 'film formation pressure 1 Pa, RF (Radio Frequency, shot. Frequency) Power 400 W' DC (direct-current) power 230 V / 0.5 A / 80 W, gas flow rate (1 〇〇 % SiH4 : 10 seem, N2 : 140 seem)) to form a ShN4 film with a thickness of 100 nm instead A layered body B was obtained in the same manner as in Example 1 except that the SiO 2 film was formed. Further, the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film had a surface roughness (Ra) of 2 nm. Further, the total content of the alkali metal and the alkaline earth metal atom in the surface of the inorganic insulating film obtained by XPS measurement is below the detection limit (0.1 at% or less). Thereafter, the laminate B was subjected to the evaluation of the peeling property 163953.doc -37 - 201249643 in the same manner as in the first embodiment. There is no resin residue on the peeled surface of the separated glass substrate with the inorganic insulating film. Further, it was found that the peeling strength was 〇. 6 n / 2 5 m m, and the surface cleanliness was excellent as a result of the cleanness of the glass substrate with the inorganic insulating film separated. Thereafter, according to the same procedure as in Example 1, the separated glass substrate with the inorganic insulating film was subjected to washing, pickling and brushing, and the peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope. No cracks were seen. &lt;Example 3&gt; A Si〇2 film having a thickness of 1 〇〇nm was formed by magnetron sputtering (heating temperature 300 (:, film formation pressure: 4 mTorr, power density: 3 W/cm 2 ) instead of forming a SiO 2 film 'The plasma nitriding treatment is then carried out (heating temperature 300 ° C, chamber pressure 100 Pa ' gas flow rate (N2 : 1 〇〇 seem, Ar : 1000 seem, H2 : 10 seem)), forming the thickness loo nm si〇 ANb (a = 1, b = 1) film, except that the laminate C was obtained according to the same procedure as in Example 1. Further, the surface roughness of the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film (Ra) In addition, the total content of the alkali metal and the alkaline earth metal atom in the surface of the inorganic insulating film obtained by the xpS measurement is below the detection limit (0.1 at% or less). Thereafter, for the laminated body C and In the same manner as in Example 1, the peeling property evaluation was carried out. On the peeled surface of the separated glass substrate with the inorganic insulating film, there was no resin residue β, and the separated glass substrate with the inorganic insulating film was attached and 163953 was carried out. .doc •38· 201249643 Example 1 for the cleanliness evaluation in the same way As a result, it was found that the peeling strength was 〇.6 N/25 mm, and the surface cleanliness was excellent. Thereafter, the separated glass substrate with the inorganic insulating film was subjected to alkaline washing according to the same procedure as in Example 1. After pickling and brushing, the peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope, and as a result, no crack was observed. <Example 4> Spray buffering on the surface of the glass substrate used in Example 1. Fluoric acid (6 parts by weight of fluoric acid / 〇: 30% by weight of ammonium fluoride 'the rest is water, the same below) (about 20 seconds) and roughened on the roughened surface of the glass substrate A Si 2 film having a thickness of 30 nm was formed on the glass substrate by the magnetron sputtering method carried out in Example 1, and the glass substrate with the inorganic insulating film was used instead of the inorganic material used in Example 1. The glass substrate of the insulating film was obtained by the same procedure as in Example 1. The surface roughness (Ra) of the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film was 25 nm. , inorganic insulating film obtained by XPS measurement The total content of the atoms of the metal and the alkaline earth metal in the surface is below the detection limit (0.1 at% or less). Thereafter, the peeling property was evaluated for the laminate D in the same manner as in Example 1. On the peeling surface of the glass substrate of the insulating film, there is no resin residue. The result of 'cleaning evaluation of the peeled glass substrate with an inorganic insulating film' shows that the peeling strength is 〇6 n/25 mm and has excellent surface. Cleanliness. 163953.doc •39· 201249643 Thereafter, the separated inorganic insulating film-attached glass substrate was subjected to alkaline washing, pickling and brushing according to the same procedure as in Example ,, and observed with an optical microscope. The peeling surface of the glass substrate of the insulating film showed no cracks. &lt;Example 5 &gt; A thickness of 5 〇 (10) was formed by a reactive sputtering method (aluminum target, no heating, film formation pressure 〇·ι, gas flow rate (〇2: 25 sccm, Ar: 25 sccm))

The layered body E was obtained in the same manner as in Example 1 except that the Ah 〇 3 film was used instead of the Si 〇 2 film. Further, in the present embodiment, the surface roughness (Ra) of the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film was 〇 8 nm. Further, the total content of the alkali metal and the earth metal in the surface of the inorganic insulating film obtained by XPS measurement is below the detection limit (〇 i at% or less). Thereafter, the laminate E was subjected to releasability in the same manner as in Example ». Equivalent to the resin-free residue on the peeled surface of the glass substrate to which the inorganic insulating film was attached. Further, as a result of evaluation of the cleanliness of the glass substrate with the inorganic insulating film attached thereto, it was found that the peeling strength was 〇 6 N/25 mm, and the surface cleanliness was excellent. Thereafter, the separated inorganic insulating film-attached glass substrate was subjected to washing, pickling, and brushing according to the same procedure as in Example ,, and the peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope. No cracks were seen. &lt;Example 6&gt; 163953.doc • 40·201249643 A laminate F was obtained by the same method as in Example 1 except that a glass plate containing soda lime glass was used as the support plate and the glass substrate. Further, in the present embodiment, the surface roughness (Ra) of the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film was 0.8 nm. Further, the total content of the alkali metal and the alkaline earth metal atom in the surface of the inorganic insulating film obtained by XPS measurement is not more than the detection limit (0.1 at% or less). Thereafter, the laminate property F was evaluated for the peeling property in the same manner as in Example 1. There is no resin residue on the peeled surface of the separated glass substrate with the inorganic insulating film. Further, as a result of evaluation of the cleanliness of the separated glass substrate with the inorganic insulating film, the peel strength was 〇.6 n / 25 mm, and the surface cleanliness was excellent. Thereafter, according to the same procedure as in Example 1, the separated glass substrate with the inorganic insulating film was subjected to face washing, pickling and brushing, and the peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope. No cracks were seen. &lt;Example 7&gt; A layered body G was obtained by the same method as in Example 2 except that a chemically strengthened glass plate was used as the support plate and the glass substrate. Further, the surface roughness (Ra) of the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film is 0.8 nm, and the atom of the alkali metal and the alkaline earth metal in the surface of the inorganic insulating film obtained by XPS measurement The total content is below the detection limit (0.1 at% or less). Thereafter, the laminate G was subjected to peeling in the same manner as in Example 1 163953.doc 201249643 Evaluation No residue of the resin on the peeled surface of the peeled glass substrate with the inorganic insulating film. Further, as a result of evaluation of the cleanliness of the separated glass substrate with the inorganic insulating film, the peel strength was 〇·6 N/25 mm, and the surface cleanliness was excellent. Thereafter, the glass substrate with the inorganic insulating film separated thereon was subjected to alkali washing, pickling, and brushing according to the same procedure as in Example 1, and the peeling surface of the glass substrate with the inorganic insulating film was observed by an optical microscope. No cracks were seen. Further, in the above-mentioned peeling test, the laminates A to G used in the above Examples 1 to 7 were peeled off between the polyoxynitride resin layer and the inorganic insulating film, and were not in the polyoxyalkylene resin layer. Between the support board and the support board. According to this point, it is confirmed that the adhesion between the polyoxyxene resin layer and the support plate is greater than the adhesion between the poly-sulfur oxide layer and the inorganic insulating film, in other words, the peeling between the poly-stone resin layer and the support plate. The strength is higher than the peel strength between the polysiloxane resin layer and the inorganic insulating film. &lt;Comparative Example 1 &gt; A laminated substrate was obtained by the same procedure as in Example 1 except that the glass substrate not having the inorganic insulating film was used instead of the glass substrate with the inorganic insulating film used in Example 1. . The inorganic insulating film is not contained in the laminated body. Further, the surface of the glass substrate on the side in contact with the surface of the resin layer was washed with pure water, and then UV-cleaned to be cleaned. Further, the surface of the cleaned glass substrate had a roughness (Ra) of 0.5 nm. Further, the total content of 163953.doc -42 - 201249643 of the alkali metal and alkaline earth metal in the surface of the obtained glass substrate by xps was 1. 〇 at%. Then, according to the same procedure as in Example 1, the peeling property was evaluated after the heat treatment, and the glass substrate in the layered product H was separated from the support sheet having the resin layer. A resin having a part of the resin layer adhered to the surface of the separated glass substrate which is in contact with the resin layer is confirmed to be damaged in the portion of the support sheet corresponding to the surface of the resin layer. Further, the cleanness evaluation of the separated glass substrate revealed that the peeling strength was 0.1 N/25 mm', and the resin adhering to the surface could not be sufficiently removed. After the resin was removed by a knife, the peeling surface of the glass substrate was observed with an optical microscope, and as a result, cracking was confirmed in one of the peeling faces. &lt;Comparative Example 2&gt; A laminated body J was obtained by the same method as the comparative example except that a glass plate containing soda lime glass as in the sixth embodiment was used as the support plate and the glass substrate. The inorganic insulating film is not contained in the laminated body j. Further, the surface roughness (Ra) of the cleaned glass substrate was 〇 5 nm. Further, the total content of the alkali metal and alkaline earth metal atoms in the surface of the glass substrate obtained by xps measurement was 1.5 at%. Then, according to the same procedure as in Example 1, the peeling property was evaluated after the heat treatment, and the glass substrate in the layered body j was separated from the support sheet having the resin layer. A resin having a part of the resin layer adhered to the surface of the separated glass substrate which is in contact with the resin layer is attached to the surface of the support layer corresponding to the surface of the resin layer. 163953.doc • 43- 201249643 It is confirmed that there is damage. Further, the cleansing evaluation of the separated glass substrate revealed that the peeling strength was 0.1 N/25 mm', and the resin adhering to the surface could not be sufficiently removed. &lt;Comparative Example 3&gt; A laminated body K was obtained by the same method as the comparative example except that the chemically strengthened glass plate similar to that of Example 7 was used as the support plate and the glass substrate. The inorganic insulating film is not contained in the laminated body κ. Further, the surface roughness (Ra) of the cleaned glass substrate is 〇. 5 nm. Further, the total content of the alkali metal and alkaline earth metal atoms in the surface of the glass substrate obtained by χρ§ was 1.5 at%. Then, according to the same procedure as in Example 1, the peeling property was evaluated after the heat treatment, and the glass substrate in the layered product K was separated from the support sheet having the resin layer. A resin having a part of the resin layer adhered to the surface of the separated glass substrate in contact with the resin layer was confirmed to be damaged on the portion of the support plate corresponding to the surface of the resin layer. Further, the cleansing evaluation of the separated glass substrate revealed that the peeling strength was 0.1 N/25 mm', and the resin adhering to the surface could not be sufficiently removed. &lt;Comparative Example 4 &gt; The surface of the glass substrate used in Comparative Example 1 was sprayed with buffered hydrofluoric acid (about 60 seconds) to be roughened. The roughened glass substrate was used instead of the example i. A glass substrate to which an inorganic insulating film is attached is obtained, and a laminate is obtained in the laminate L without the inorganic insulating film by the same procedure as in Example 163953.doc • 44·201249643. Further, the surface of the roughened glass substrate on the side in contact with the resin layer was washed with pure water, and then UV-cleaned to be cleaned. The surface roughness (Ra) of the cleaned surface (roughened surface) of the obtained roughened glass substrate was 100 nm. Further, the total content of the alkali metal and alkaline earth metal atoms in the cleaned surface of the roughened glass substrate obtained by xps measurement was 1.1 at%. Then, according to the same procedure as in Example ', the peeling property evaluation was performed after the heat treatment, and the glass substrate in the layered product L was separated from the support sheet having the resin layer by 0. The resin layer was in contact with the separated glass substrate. The resin having a part of the resin layer adhered to the surface thereof is damaged on the support plate corresponding to the surface of the resin layer. &lt;Example 8&gt; In this example, an OLED was produced using the layered body C obtained in Example 3. a step of forming a transparent electrode, a step of forming an auxiliary electrode, and a step of depositing a hole: a main layer, a hole transport layer, a light emitting layer, an electron transport layer, etc.,

1. The organic EL is formed on the glass substrate of the laminated body to the sealing step. The laminated body c having the organic EL structure on the glass substrate (the lower handle: the panel C) is the display device with the support of the present invention. Use the panel. The vacuum side of the sealing body of the panel C is vacuum-adsorbed onto the fixing plate, and then a stainless steel thickness of 0.1 mm is inserted into the interface of the glass substrate and the resin layer at the corner of the panel C, and the inorganic insulating layer and the resin on the glass substrate are inserted. The interface between the layers causes the inter-division*. Further, the surface of the support plate of the panel 163953.doc •45-201249643 was adsorbed by 24 vacuum adsorption pads, and thereafter the adsorption pads from the corners of the panel c were sequentially raised. As a result, only the glass substrate on which the organic EL structure is formed remains on the plate, and the support plate with the resin layer can be peeled off. Then, the separated glass substrate is cut by a laser cutting or cutting fracture method, and cut into 288 cells of 41 mm in length and 30 mm in width, and then the glass substrate and the opposite substrate on which the organic EL structure is formed are assembled, and the module is implemented. The formation step produces an OLED. The 〇led obtained in this way does not cause problems in terms of characteristics. The present invention has been described in detail with reference to the preferred embodiments of the invention. This application is based on a patent application 2011-095632 filed on Apr. 22, 2011, the content of which is hereby incorporated by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an embodiment of a laminate of the present invention. Fig. 2 is a schematic cross-sectional view showing an embodiment of a panel for a display device with a support plate according to the present invention. [Main component symbol description] 10 Laminate 20 Glass substrate 22 Inorganic insulating film 24 Glass substrate 30 with inorganic insulating film Reinforced plate (support plate with resin layer) 31 Support plate 163953.doc • 46 · 201249643 32 Resin layer 40 Display panel for display panel 50 Component panel for display panel 60 Display panel panel - 201 First main surface of glass substrate. 202 Second main surface of glass substrate 221 Inorganic insulating film surface 321 Resin layer surface 163953.doc • 47-

Claims (1)

201249643 VII. Patent application scope: 1 . A laminated body which is provided with a layer of a support plate, a resin layer, and a layer of a glass substrate with an inorganic insulating film in sequence, and the inorganic layer of the glass substrate with the inorganic insulating film attached thereto The insulating film is in contact with the resin layer, and the glass substrate with the inorganic insulating film is provided on one surface of the glass substrate and has an oxide, a nitride or a film containing at least one selected from the group consisting of ruthenium and aluminum. The inorganic insulating film of oxynitride, wherein the total content of the atoms of the metal and the soil of the soil in which the inorganic insulating film is in contact with the resin layer is 〇5 at ° /. Hereinafter, the peel strength of the interface between the layer of the support sheet and the resin layer is higher than the peel strength of the interface between the resin layer and the inorganic insulating film. 2. The laminate according to claim 1, wherein the inorganic insulating film is a film comprising oxidized oxidized stone, nitrided, or oxidized by oxynitride or oxidized. 3. The laminate according to claim 1 or 2, wherein a surface roughness (Ra) of the surface of the inorganic insulating film which is in contact with the resin layer is less than 3 〇 nm. 4. The laminate according to any one of items 1 to 3, wherein the inorganic insulating film has a thickness of 5 to 5000 nm. 5. The laminated body of any one of items 1 to 4, wherein the glass substrate has a fullness of 〇.〇3 to 0.8 mm. 6. The laminated body of any one of the items (1), wherein the resin layer of the above resin layer is poly&gt; The layered body of claim 6, wherein the polyfluorene oxide resin is a reaction hardened product of an organic alkenyl group and an organic hydrogen polyoxyalkylene. The laminated body according to any one of claims 1 to 7, wherein the resin layer has a thickness of 1 to 1 Å. 9. The laminate according to any one of claims 1 to 8, wherein the support plate is a glass plate. 10. A method for producing a laminated body, which comprises a method of sequentially providing a laminate of a layer of a support sheet, a resin layer, and a layer of a glass substrate with an inorganic insulating film, and the method comprises preparing an inorganic insulating layer The glass substrate with a film of the inorganic insulating film has a glass substrate on one side of the glass substrate and has an oxide, a nitride or an oxynitride containing at least one selected from the group consisting of Shi Xi and Ming. An inorganic insulating film, wherein a total content of atoms of the metal and the soil of the soil in which the inorganic insulating film is in contact with the resin layer is 〇5 at% or less; and a support plate with a resin layer, which is provided with a resin The support plate of the layer has the resin layer fixed to one surface of the support plate, and the exposed surface of the resin layer has non-adhesiveness; the surface of the inorganic insulating film of the glass substrate with the inorganic insulating film described above, and the above The surface of the resin layer of the support plate with the resin layer is used as an accumulation layer, and the glass substrate with the inorganic insulating film is laminated with the support plate with the resin layer. 11. The method of manufacturing a laminate according to claim 10, wherein the support layer with the resin layer is provided to have an organic thin base and an organic hydrogen polycondensate&gt; A support plate for the layer of polysiloxane resin that has been paid. 163953.doc 201249643 12. 13. 14. A panel for a display device with a support plate, comprising the laminate according to any one of claims 9 to 9 and a surface of the breakage plate provided on the laminate. A member for a display device. A panel for a display device which is formed by peeling off a support plate with a resin layer by using an interface between the inorganic insulating film and the resin layer as a peeling surface on a panel for a display device with a support plate of claim 12 By. A display device 'having a panel for a display device as claimed. 163953.doc