TW201224588A - Light source device - Google Patents

Abstract

At the time of receiving a liquid crystal display panel 1 and an LED backlight source BL, in the liquid crystal display device having an outer frame attached with a heat dissipating substrate 5, the LED backlight source BL includes a light guide plate 3 and an LED light source array mounted on an installation substrate 21. Heat conductive members 20, 31, 32, 34 are existed between the installation substrate 21 and the heat dissipating substrate 5, which can decrease the accumulated heat on the installation substrate for installing an LED light source, thereby reducing the temperature increase of the LED light source. In addition, the claimed light source device comprises: a light guide plate; an LED light source mounted at the light input side of the light guide plate; an installation substrate for installing the LED light source; a heat dissipating substrate; and a first heat conductive member arranged between the installation substrate and the heat dissipating substrate, wherein adhesive or fluid for conducting heat is provided between the installation substrate and the first heat conductive member and between the first heat conductive member and the heat dissipating substrate.

Description

201224588 VI. Description of the Invention: [Technical Field] The present invention relates to a liquid crystal display device including a liquid crystal display panel and a backlight, and more particularly to a liquid crystal display using a light emitting diode (hereinafter abbreviated as LED) as a light source Device. [Prior Art] In the display mode of a conventional liquid crystal display device, a transmissive or semi-transmissive liquid crystal display device is configured to have a liquid crystal display panel and a backlight for supplying light that has passed through the liquid crystal display panel. The backlight is generally composed of a light source and a light guide plate, and a small fluorescent tube called a CCFL (Cold Cathode Tube) can be used as the light source. Further, the principal plane of the light guide plate is formed to face the main plane of the main plane and the opposite side (referred to as the outer surface) so as to correspond to the display area of the liquid crystal display panel. Light diffuses/reflects the diffusing portion on the surface side. The CCFL light source is disposed on the end surface of the light guide plate, and the light of the CCFL incident on the end surface of the light guide plate is transmitted to the light guide plate, diffused/reflected on the outer surface side of the light guide plate, and emitted from the surface of the light guide plate toward the liquid crystal display panel. Thereby, the light source is converted into a uniform planar light source, and a light source as a liquid crystal display device can be utilized. However, the CCFL light source encapsulates Hg (mercury) in the discharge tube, and the ultraviolet light emitted from the mercury excited by the discharge is irradiated to the phosphor of the CCFL tube wall to be converted into visible light. TF10I8401 3 201224588 Therefore, in consideration of environmental aspects, the use of alternative light sources is required to suppress the use of harmful mercury. In order to illuminate the CCFL·, it is necessary to have a high-voltage and high-frequency circuit, and in order to generate a noise, it is difficult to illuminate at a low temperature in addition to noise countermeasures. On the other hand, as a new type of light source, a backlight which uses a light-emitting diode module (LED light source) containing a light source and a polar light source wafer as a light source has been developed. J used. The backlight of the LED light source is low in price and luminous efficiency, and is used as a backlight for the liquid crystal display panel along with environmental constraints, and continues to be popular. At the same time, with the increase in brightness of the liquid crystal display device and the enlargement of the display area, it is required to equip most of the LED light sources. Therefore, in order to form a led backlight used in a high-brightness/large-size liquid crystal display panel, it is necessary to convert the LED light source belonging to the point light into a uniform light-emitting surface light source (converted into uniform light on the emission surface of the light guide plate). Light source). For this reason, it is necessary to control the material and structure of the diffusing portion outside the light guide plate, and to match the directivity of the LED light source to arrange the LED light source at the optimal position. One of the problems here is that the LED light source generates heat, and the temperature of the LED light source and its periphery rises, and the luminous efficiency or life of the LED light source is reduced. Eight LED light sources have improved luminous efficiency by recent improvements, but the current luminous efficiency is about 1%, and the remaining 9〇% is released in the form of heat. TF1018401 4 201224588. In the backlight with the LED as the light source, this heat will accumulate on the substrate of the LEd and the women's LED, and as the temperature of the LED or its periphery rises, the luminous efficiency of the LED itself will be reduced. Further, regarding the lifetime, the estimated lifetime data (brightness half life) of the forward view of the top view type LED, lF = 20 mA, is shown in Fig. 25. From Fig. 25, it can be seen that the life is about 12 〇〇〇 hours when it is relative to the ambient temperature, and only about 5500 hours at 5 (TC), with the rise of the surrounding temperature of [ΕΕ]. And the life is shortened. Further, the heat generated by the LED can also be regarded as a cause of damage to the LED or the wiring or the like of the mounting substrate on which the LED is mounted. However, if the number of LEDs mounted is increased for the purpose of increasing the brightness of the backlight, the amount of heat generation is increased, and the heat generation is more negligible. An object of the present invention is to provide a liquid crystal display device which can reduce the temperature of an LED light source by reducing the heat accumulated on a mounting substrate on which a LED light source is mounted, in a liquid crystal display device including a LED backlight. The light source has a reduced luminous efficiency and prevents damage of the light-emitting diode wafer, and can have a bright long-life liquid crystal display. The liquid crystal display device of the present invention includes a liquid crystal display panel having a liquid crystal display between a display electrode and an alignment film, and a display region formed by forming a plurality of pixel regions. a light guide plate corresponding to the display area and a backlight of an LED light source array disposed on an end surface of the light guide plate are disposed on a substrate of the liquid crystal display surface TFI018401 5 201224588; and the liquid crystal display panel and the backlight are received Further, a liquid crystal display device having a heat dissipating substrate, wherein the 'LED light source array includes a mounting substrate; and a plurality of LED containers in which LED mounting surfaces of the mounting substrate are mounted and a light emitting diode chip is housed; At the same time, a thermally conductive member is present between the mounting substrate and the heat dissipating substrate. In the liquid crystal display device, since the thermal conductive member is present between the mounting substrate and the heat dissipating substrate on which the LED light source constituting the LED light source array is mounted, the remaining substrate can be conducted by the (four) age t-consumer mounting base (four) Efficiently diffuse heat to the outside.

Reducing the heat build-up of the women's substrate installed in the LED, and reducing the temperature rise of the LED light source, thereby suppressing the decrease in the luminous efficiency of the LED. A liquid crystal display device that prevents the LED from being damaged in advance and can enter the liquid crystal display in a bright and long life. For the heat conductive member, the pressure is made by the heat conductive sheet with high elasticity (the elasticity of the pressure Wel conductive sheet, the material can be used to guide the member, the contact between the female iaftEJn and the female substrate and the heat sink substrate) The surface ί and == r are connected, except for the air layer of the contact surface, the heat transfer wire is used for heat conduction. ', the adhesive is highly adhesive to the TF1018401 201224588 heat sink substrate. "(4) Between the heat-dissipating substrates, there is a high-line bonding agent, and effective heat conduction between the mounting substrate and the heat-dissipating substrate can be performed. As in the conventional conductive resin, since no bubbles are present in the resin, the hot material is hindered. The situation is caused by the fact that the adhesive can be easily and surely supplied even in the bonding operation, and the LED container can be strongly fixed on the mounting substrate. It is also possible to adhere to the heat-dissipating substrate through a fluid with low fluidity. - By (iv) flowing (four) low fluid, the fluid with lower activity can enter the female silk plate moon surface (opposite to the LED Anshang surface) Face) The fine concavities and convexities on the contact surface of the conductive member and the contact surface between the thermally conductive member and the heat dissipating substrate, and the micro-concave-convex@lifting substrate and the thermally conductive member, and the thermally conductive member and the heat dissipating substrate are in close contact with each other. Therefore, the air layer can be excluded. And increasing the heat dissipation efficiency of the self-mounting substrate toward the heat-dissipating substrate. (The mounting substrate of the LED light source array is relative to the main body of the light-guiding plate

The plane is actually arranged in a straight direction to form the LED of the LED light source. The container is of a predetermined configuration: the light emitted from the light-emitting diode chip, the U-face 'and the back surface with respect to the light-emitting surface and * Each of the side frame-shaped LED containers is configured to mount the back surface of the LED container on the LED mounting surface of the LED package. The mounting substrate is actually disposed in the vertical direction with respect to the above-mentioned money guide. TF10I8401 7 201224588 The structure is specifically shown in Fig. 1, Fig. 1, Fig. 12, Fig. 15, and Fig. In the above configuration, the LED container has the back surface of the LED container as the LED mounting surface and is mounted on the mounting substrate. Therefore, the mounting substrate is disposed at an angle perpendicular to the light incident direction of the light guide plate. . The heat dissipating substrate has at least two faces that are bent in a U shape, and each of the faces may be disposed to face the back surface of the mounting substrate and the outside of the light guide plate. By disposing the arrangement on the heat dissipation substrate having the L-shaped cross section so as to correspond to the outside of the light guide plate, the heat accumulated on the mounting substrate can be efficiently transmitted from the back side of the mounting substrate to the heat-dissipating member. Heat sink substrate. The conductive member may include: an i-th heat conductive member covering the back surface of the LED mounting surface of the mounting substrate; and a mounting surface on which the mounting substrate is covered to expose at least the light emitting surface of the LED capacitor H And the second heat conductive member of the LED container. By this, the heat generated by the LED light source is transmitted from the LED container to the mounting substrate. The second heat conductive member can effectively radiate heat to the government, and the substrate X' is formed on the second heat conductive member because the opening of the LED container mounted on the margin plate is formed, which hinders the container Light guide to the light guide plate. The "the fourth conductive member" is equivalent to the thermally conductive elastic member 31 to be described later, and the "second thermal conductive member" TF1018401 8 201224588 corresponds to the thermally conductive elastic members 20, 32, and 34 to be described later. When the second thermal conductive member is placed in close contact with the end surface of the light guide plate and the LED mounting surface of the mounting substrate, heat generated from the LED light source and accumulated on the LED mounting surface side of the mounting substrate passes through the light guide plate side. It can be effectively discharged. The structure in which the "second heat conductive member is in close contact with the end surface of the light guide plate and the LED mounting surface of the mounting substrate" is used as will be described later with reference to Figs. 12 and 18 . The first thermally conductive member may be integrated with the second thermally conductive member. The integrated thermally conductive member exemplifies the thermally conductive elastic member 32 as shown in Figs. 15 to 18 in the following description. Further, in the liquid crystal display device of the present invention, the mounting substrate of the LED light source array faces the light guide plate, and is actually disposed in a parallel direction, and the LED container is a light emitting surface emitted from the light emitting diode wafer, and The frame-shaped LED container having the back surface and the four side faces of the light-emitting surface may be formed as one of the four side faces of the LED container as an LED mounting surface and mounted on the mounting substrate. In the liquid crystal display device, a side type LED container, that is, an LED container having an LED mounting surface with respect to the mounting substrate and having orthogonal side surfaces as a light emitting surface, is mounted on the mounting substrate. Then, the back surface of the mounting substrate is adhered to the heat dissipation substrate or the frame. In the liquid crystal display device, the heat dissipating substrate is actually formed in a planar shape and placed on the back surface of the mounting substrate and the outer surface of the light guiding plate so as to be placed on the TF1018401 201224588. This structure is shown in Fig. 19 which will be described later. The thermally conductive member may be a side surface of the container in which the light-emitting surface of the LED container is exposed to at least the LED light-domain of the field-embedded substrate. In this case, the thermally conductive member existing between the mounting substrate and the heat radiating plate is exemplified by the thermally conductive elastic member 34. Further, the liquid crystal display panel of the present invention includes: a liquid crystal display panel having a liquid crystal display between a pair of substrates having a display electric alignment film; and a plurality of pixel regions and a display region; : _ 4 narrow crystal display panel - the substrate outside the ship is provided with a light guide corresponding to the above-mentioned explicit domain '', the board' and the backlight of the LED light source array disposed at the end surface of the light guide plate to accommodate the above liquid crystal display panel In addition to the above-mentioned backlight, the liquid crystal display device of the secret panel is provided at the same time; the above-mentioned coffee source _ contains a bulk mounting substrate; and a plurality of ampoules are disposed on the mounting surface of the mounting substrate (4), and the light-emitting two is accommodated. An LED container for a polar body wafer; the mounting base is covered by a thermally conductive member such that the LED mounting surface and the back surface thereof are exposed at least in a private light surface of the LED container, and the thermal conductive structure is: touched or adhered to the above Heat-dissipating substrate. On the j-cell-aged device, the (10) cracked surface of the silk substrate is covered with a lunar surface-bodyized heat conductive member. Therefore, it is possible to generate heat from the heat transfer through the substrate, and to radiate heat by dissipating the substrate. The thermally conductive member is formed into a cross-sectional shape (9) and has a notch portion exposing the light-emitting surface of the LED container by TF1018401 201224588. In this configuration, the money has LED_core length: ': will be mounted on the substrate in the direction of the long side, to the main plane, one; 1 side === a section covered by the face, the word one component concealed. The heat-conducting member of the carbon-coated LED surface and the riding surface (9) corresponds to Figure 15.9. The thermal conductivity of the mouth 18 is not: one side of the heat-conducting member of the surface, because of the formation =: the light of the container The missing portion of the surface does not prevent the light from the LED container from being supplied to the light guide plate. == The member is preferably formed of a material having elasticity. Touch =; 弹性 Elasticity </ br> corresponds to the fine concavities and convexities of the mounting substrate and the heat dissipating substrate, and is transmitted through the thermally conductive member conductive sheet to exclude the air layer of the contact surface. Further, it is preferable that the heat-transmissive member is adhered to the heat-dissipating substrate by an adhesive having a high fluidity. Borrowing* There is a flow of heat between the Anban board and the diffuse board compared to ^«#丨, material (4) trace heat recording substrate. The thermally conductive member is also adhered to the heat dissipating substrate by a fluid having a low fluidity. By using a fluid having a lower fluidity, the fluid having a lower fluidity can enter the fine concavities and convexities of the contact surface of the back surface of the mounting substrate and the thermally conductive member, and the fine concave surface of the contact surface of the thermally conductive member and the heat dissipating substrate. TF1018401 11 201224588 The adhesion between the mounting substrate and the thermally conductive member, the thermally conductive member, and the heat dissipating substrate is improved. Therefore, the air layer can be eliminated and the heat release efficiency from the mounting substrate toward the heat dissipation substrate can be improved. In the above-described liquid crystal display device of the present invention, the size of the light guide plate 3 is increased in size as the display area of the liquid crystal display panel 1 is increased, and sufficient light is supplied to the light guide plate 3 which has been enlarged. When a plurality of LED light sources 2 can be mounted on the mounting substrate 21, the effect is greater. The above (or other) advantages, features and effects of the present invention will become apparent from the following description of the appended claims. [Embodiment] FIG. 1 is a schematic cross-sectional view of a liquid crystal display device of the present invention, and FIG. 2 is a perspective view of a liquid crystal display device. Fig. 3 is a cross-sectional view showing a liquid crystal display panel used in the liquid crystal display device of the present invention. The liquid crystal display device of the present invention mainly comprises a liquid crystal display panel 1; a backlight BL including the light guide plate 3 and the LED light source 2; and a case where the upper side frame 4 and the lower side frame 5 are accommodated. The upper frame 4 protects the liquid crystal display panel 1, and the lower frame 5 protects the backlight BL and also serves as a heat dissipation substrate for discharging heat to the outside. Focusing on this heat release function, the lower frame 5 is referred to as "heat dissipation substrate 5". [Liquid crystal display panel] TF1018401 12 201224588 The liquid crystal display panel 1 is as shown in FIG. 3, and has: a transparent substrate 12 belonging to the side portion; a lower side 11 of the other substrate; and a sandwich on the two transparent substrates 11 and 12 The liquid crystal layer 13 is surrounded by the sheet portion 14 and surrounded by the periphery. The liquid crystal layer 13 on the transparent substrate liquid-repellent layer 13 on the side substrate is also formed on the inner surface of the lower-side transparent substrate 11 and formed on the inner surface of the upper-side transparent substrate 12, and the electrode 16, Orientation film, etc. The side transparent display pixel region can form the display region 3 arranged in a matrix by the display electrode 15 of the lower transparent substrate 11 and the display electrode 16 of the upper plate 12, although the lower transparent substrate 11 is disposed on the lower side. The upper transparent substrate 12 is slightly illustrated, and a polarizing plate, a retardation film, a diffusion film, etc. may be disposed as needed. In addition, in the case where the liquid crystal display device is a transmissive liquid crystal display dream _ clothing The display electrode system is entirely composed of a transparent electrode, and the display pixel I field (the light of the self-use light source BL passes through the display surface side. / " 'Pixel region system ― : and the portion is in the case of a transflective liquid crystal display device) And a light-transmitting portion partially formed of a reflective metal film that penetrates the light of the backlight BL. The semi-transmissive liquid crystal display device utilizes light reflection of the pixel region. The external light incident from the display surface side is reflected by the gate on the display surface side, and the light from the backlight BL is transmitted through the light-transmitting portion. Thereby, when the external light is strong, the reflection mode and the reverse alignment can be utilized. No, and TF 1018401 13 201224588 When the external light is weak, the rich mode is displayed. In order to achieve the color display, the color clear substrate η or the upper transparent substrate 12 may be provided in the lower part, and the liquid crystal in the present invention. The transparent substrate on the lower side of the display device is called the ==^ field on the upper transparent substrate 12, and the age is controlled in each pixel region. The correction pixel region is again: upper: transparent substrate 12 or lower transparent substrate u, for example, 'transparent at the upper portion The periphery of the display area of the substrate 12 can be connected to the display circuit of the display device (4) or the switching element, and can be provided with a driving circuit 19 for supplying a predetermined voltage of a predetermined 栌 忑 忑 线 pattern, and the gas can also be connected to an external drive. The input terminal of the circuit also has a transparent substrate-substrate that is not formed with the wiring pattern side η, and is electrically connected to the outer circumference of the upper 12, and the green pattern may be the same. The material of the side transparent substrate 12 is glass, translucent plastic, etc. j. The addition of non-electric materials or tin oxide/non-electrodes 15, 16 are formed by transparent projections which are now formed by the lungs. The reflective metal of the light-reflecting part _(10) Qian 理 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A black resin for the purpose of surrounding the pixel region is attached to the TF1018401 14 201224588 via the sheet portion 14, and the lower side transparent substrate 11 and the upper side moon substrate 12 are bonded and pressure-bonded to form a nematic liquid crystal (nematic). Liquid crystal) is injected into a portion of the opening of the sheet portion 14, and then the injection port is sealed. When the bonding is performed, the '''''''' 16 is formed as if the two are orthogonal. The intersection of the display electrodes and the pixel portion becomes the pixel region. This pixel region is set as the display region. Thus, the liquid crystal display panel 1 is constructed. [Backlight] The outside of the transparent substrate 11 on the lower side of the liquid crystal display panel 1 (n, after West?. Strike ________

Side) is equipped with a backlight BL backlight BL as shown in Fig. i, and includes: a light source 2, a guide 3, a lens sheet Sa, a diffusing sheet %, a reflective sheet &amp; a spot light == (four) W The heat conductive sheet 31 of the boring wheel member is preferably used. Therefore, hereinafter, "the thermally conductive elastic light guide plate 3 has a function corresponding to the liquid crystal". One of the main detectors is emitted by the main plane: the display area is arranged in such a manner as to correct the substrate 11. The light guide plate is made of a transparent resin plate. In one of the light guide plates 3. The resin component is disposed on the main plane of the shoulder TF1018401, and the lens sheet 201224588 3a and the diffusion sheet 3b are disposed on the other main plane of the light guide plate 3 (referred to as the outer surface), and are disposed to be used in the light guide plate 3 The propagating light is radiated to the reflective sheet 3c of one of its principal planes. Instead of the reflective sheet 3c, a groove for directly diffusing/reflecting light or a coating film having a diffusion/reflection function may be formed on the outer surface of the light guide plate 3. Further, the reflective sheet 3c may be formed on three end faces of the light guide plate 3 except for the end faces on which the LED light sources 2 are disposed. The LED light source 2 is mounted on the mounting substrate 21 as shown in FIGS. 4 to 8. The LED light source 2 is a cross-sectional view as shown in Fig. 9. It consists of an LED chip 23a having a light-emitting portion, an anode, and a cathode, which are made of a semiconductor material, and an LED container 23b made of a heat-resistant resin material or a ceramic material. The LED container 23b of the LED light source 2 has a light-emitting surface, a back © with respect to the light-emitting surface, and four _, and the light-emitting surface of the LED container 23b is arranged to face the end surface of the light guide plate 3 as shown in FIG. With. A mortar-shaped recess is formed in the light-emitting surface of the LED container 23b, and the LED chip 23 is placed and housed at the bottom of the recess 23d. The anode and cathode of the LED chip 23a are connected to the terminal portion 23c formed on the outer surface of the LED container 2 except for the light-emitting surface. Alternatively, the reflective coating may be applied to the inner wall surface of the mortar-shaped cavity. Further, the light-transmissive resin may be filled in the cavity by embedding the LED chip 23a. ^ ^ TF1018401 201224588 The LED light source 2 of the structure is as shown in Fig. 8. It is reconfigured at a predetermined interval, and the Anzhen is on the long-turning I substrate 21. The LED light source 2 and the wire substrate 21 which are mounted in plural numbers are referred to as "LED light source arrays". The mounting substrate 21 is formed of a glazing substrate epoxy substrate or a ceramic substrate. A mounting metal film 22 for mounting the jjgD light source 2 is mounted on the LED mounting surface of the mounting substrate 21, and a predetermined driving current is supplied to the metal wiring pattern 25 of the [ED wafer metal driving wiring 24 and the separation metal driving wiring 24. Further, on the surface facing the LED mounting surface, that is, on the back surface of the substrate, as shown in Fig. 5, a heat releasing metal film 26 which is spread over the entire surface is formed. Further, in the thickness direction of the mounting substrate 21, a plurality of metal via conductors 27 connecting the mounting metal film 22 and the heat releasing metal film 26 are formed. The terminal portion 23c of the LED light source 2 is connected to the metal drive wiring 24 via a conductive bonding member such as solder. Each of the mounting metal film 22, the metal driving wiring 24, the metal film pattern 25, the heat releasing metal film 26, and the metal via conductor 27 is formed of copper or a copper-based metal material (copper material or copper plating), among them, in particular, A portion of the metal drive wiring 24 or the mounting metal film 22, the heat release metal film 26, and the metal via conductor 27 are as shown in FIG. 7 of an enlarged view of a region surrounded by a circle of FIG. 6 by the solder layer 28. cover. Further, the surface of the metal film pattern 25 is covered by the resin resistive film 29. If the resistive film 29 is white, the light from the TF1018401 17 201224588 exposed from the LED light source 2 can be efficiently supplied to the light guide plate 3. [Thermal Conductive Member] Next, a structure for radiating heat generated from the LED light source 2 will be described. When the backlight BL of the liquid crystal display device (lighting the LED light source 2) is driven, heat is generated in accordance with the light emission. The heat generated by the LED chip 23a in the LED light source 2 must be transmitted to the member having a wider area via the LED container 23b and the mounting substrate 21, and heat is released from the member toward the outside air. In the present embodiment, the outer surface of the light guide plate 3 and the surface (referred to as the back surface) of the heat releasing metal film 26 on which the mounting substrate 21 is formed face each other so as to be curved in an L shape. The heat dissipation substrate 5 of the metal member. In the flat plate region of the heat dissipation substrate 5, that is, the region facing the outer surface of the light guide plate 3, it is necessary to form a thermally conductive hole in order to increase contact with the outside air. Further, as shown in Fig. 1, the heat-dissipating substrate 5 is bent in an L-shaped region, and the heat-releasing metal film 26 of the substrate 21 is closely attached via the thermally conductive elastic sheet 31. Fig. 10 is a perspective view showing the L-shaped thermally conductive elastic sheet 31. The thermally conductive elastic sheet 31 is formed in a cross-sectional L shape TF1018401 18 201224588 in the form of a heat conductive elastic sheet 3i having an L-shaped cross section, which is in contact with the back surface of the mounting substrate 21 and the lower end surface of the mounting substrate 21 at right angles to the surface. The outside is in surface contact with the metal heat-dissipating substrate 5 having a 4-shaped cross section. 2 Conductive rotation W 31 (4) Plate-shaped elastic rubber with good heat conduction is formed. The shape is a flat plate shape. When the heat conductive elastic sheet 31 is found to have a plaque, the fine unevenness on the surface of the mounting substrate is absorbed, and the mounting conductive substrate 31 and the heat dissipation substrate 5 have almost no air layer. = face flip. The heat generated by the racquet system is transferred from the café to the mounting substrate 2 via the thermally conductive elastic sheet 31, and heat is released to the heat sink substrate 5. Thereby, the heat generated by the LED wafer Da can be corrected by the heat dissipation substrate 5, and the wire system can lower the temperature around the coffee source 2 and the basin. In particular, since the thermally conductive elastic sheet 31 is formed in a L-shaped cross section, not only heat from the back surface of the women's substrate 21 but also heat from the lower end surface of the mounting substrate u can be released through the thermally conductive elastic sheet 31. The heat-sensitive substrate 5 which is gathered on the mounting substrate 21 is read. Here, as shown in FIG. 1G, the longitudinal portion of the thermally conductive elastic sheet η is formed to be spaced apart from the mounting substrate 21 鸠 the substrate 5 == This 'the thermal conductive elastic sheet' is longitudinally attached to: On the other hand, the thickness h of the lateral portion of the thermally conductive elastic sheet 31 is made to be the mounting substrate 21 and the heat dissipation substrate 5, as shown in Fig. TF1018401 19 201224588. The interval between the lateral portions is thicker, whereby the lateral portion of the thermally conductive elastic sheet 31 is between the lower end surface of the mounting substrate 21 and the lateral portion of the heat dissipation substrate 5, and becomes a pressure-free fusion without gap. Further, it is preferable to perform at least the lower end surface of the mounting substrate 21 by grinding and cutting. Thereby, the unevenness of the lower end surface of the mounting substrate 21 can be almost eliminated, and the thermally conductive elastic sheet 31 can be in close contact with each other. By the polishing, the glass swarf and the resin dust generated in the ridge line portion of the lower end surface of the mounting substrate 21 can be eliminated, so that the air layer between the mounting substrate 21 and the thermally conductive elastic sheet 31 can be prevented. Further, heat dissipation can be effectively performed. Further, it is possible to prevent the glass shavings and resin chips generated from the cut surface of the mounting substrate 21 from adhering to the light-emitting surface of the LED light source 2, and to make the light of the LED light source 2 Further, the structure of another heat conductive member which is effective for using the above-described thermally conductive elastic sheet 31 will be described. Fig. 11 is a schematic cross-sectional view showing a liquid crystal display device of the present invention. The same reference numerals are given to the components. The following description differs from Fig. 1. The thermally conductive elastic sheet 31 is made of a rubber-like sheet material having elasticity, and is formed by sandwiching the heat conduction TF1018401 20 201224588 with the mounting substrate 21 and the heat dissipation substrate 5, The pressure-connected state also has a contact surface between the mounting substrate 21 and the heat transfer plate 5, and the contact substrate of the heat-dissipating substrate due to the contact substrate 21 or the heat-dissipating substrate 5 and the thermally conductive elastic sheet 31 is completely flat. However, it is impossible to make a slight unevenness, and the state of the sandwiched state of the elastic sheet 31 is changed by the external impact or the like, and the heat generation is performed. The elastic thin substrate 5 and the hot material-transducing sheet 31 and the fluid 17 having low fluidity have a fluidity 17 or a thinner 17 which is highly fluid, and fixes the thermally conductive elastic dispersion substrate 5 The soil contact surface and the heat conductive elastic sheet μ and the plate 5. The contact surface 'the heat of the coffee money 2 (four) to the heat dissipation base 'such as the higher fluidity agent s_) or the adhesive conductive tape Chest. Gang) Sumitomo Hui heat transfer bonding and 'lower flow fluid 17 is composed of, for example, the oil of the South China ceramics particles (called hot material compounds), conductive fine by the fluid 17 Force, the presence of this gentleman in the future, the shell 1 corresponds to the mounting substrate 21 and the heat-dissipating substrate 5 TF1018401 21 201224588 ^Open small bump, the oil component of the fluid η is infiltrated, and the micro-air layer is excluded. Therefore, the state in which the mounting substrate 21 and the thermally conductive elastic sheet are in contact with each other and the thermal conductive elastic sheet 31 and the heat dissipation substrate 5 are separated from each other, and heat can be transferred from the mounting substrate 21 via the thermally conductive elastic sheet 3ι. And there is Wei heat conduction to the heat dissipation substrate 5. Therefore, the heat generated by the LED light source 2 is effectively radiated to the outside, and it is difficult to accumulate heat on the LED light source 2 or the mounting substrate 21, so that the temperature rise of the coffee light source 2 and its surroundings can be effectively suppressed. Next, other members which are preferably used together with the thermally conductive elastic sheet 31 will be described. Fig. 12 is a schematic cross-sectional view showing a liquid crystal display device of the present invention in another embodiment. The same components as those in Fig. 1 are assigned the same component symbols. The following description differs from Figure 1. In this embodiment, the thermally conductive elastic member 20 is provided in a state in which the mounting surface of the LED light source 2 of the substrate 1 is contacted. Fig. 13 is a perspective view of the thermally conductive elastic member 2''. The thermally conductive elastic member 2 is formed in an elongated plate shape almost corresponding to the mounting substrate B. In the thermally conductive material member 2G, a window-shaped opening portion 2 〇 &amp; which is accommodated in the LED light source 2 mounted on the mounting substrate 21 is formed. The heat conductive elastic member 2 of such a shape is disposed on the LED mounting surface of the mounting substrate. Here, the LED light TF1018401 22 201224588 mounted on the mounting substrate 21 is located at the opening 2〇a and pressed. . Fig. 14 is a perspective view showing a mounting substrate 21 on which a solar light source array to which the thermally conductive elastic member 20 is applied is mounted. "", the conductive f-elastic member 2 is sandwiched between the mounting substrate and the light incident side end surface of the light guide plate 3 as shown in Fig. 12. Around the coffee light source 2, there is actually a thermally conductive elastic member 20 Therefore, the heat of the LED light source 2 released to the periphery of the source 2 and the mounting surface side of the mounting substrate 21 is entirely absorbed by the thermally conductive elastic member such as the light guide plate 3 or the mounting substrate 21. In particular, the heat of the LED light source 2 The metal drive wiring 24 and the metal pattern directly connected to the mounting substrate 直接 are transmitted from the terminal portion 23C formed in the LED container 23b through the metal driving wiring 24 formed on the mounting substrate 21. Further, the connection effect of the terminal portion 23c is increased. Further, as shown in Fig. 12, the heat radiation substrate 5 can be directly radiated toward the heat dissipation substrate 5 via the lower end surface of the thermally conductive elastic member, so that the heat radiation effect is also large. Therefore, the heat generated by the light source 2 is effectively radiated to the outside, and it is difficult to accumulate heat on the LED light source 2 or the mounting substrate 21, so that the temperature rise of the light source 2 and its surroundings can be effectively suppressed. Here, the thickness of the thermally conductive elastic member 2A and the thermally conductive elastic sheet η will be described. The important thing is that the thick material of the miscellaneous material is thicker than the

TF101840I 23 201224588 The design interval between the mounting substrate 21 and the end face of the light guide plate 3, that is, the mounting height of the led. The source 2 also advances the thickness of the thermally conductive elastic sheet 31 to be slightly thicker than the design interval between the a-substrate 21 and the heat-dissipating substrate 5. When the thickness is set to such a thickness, the two thermally conductive elastic members are elastic, so that the mounting substrate 21 to which the LEDs (4) 2 are attached is pressed and connected between the light guide plate 3 or the heat dissipation substrate 5, and the installation can be stably maintained. Board 21. Further, on the end faces of the light guide plate 3, the front and back surfaces of the mounting substrate 21, and the surface of the heat dissipation conforming plate 5, even if there is a state in which fine irregularities are present, the fine protrusions are absorbed. i, the air layer is not present in the contact portion between the light guide plate 3, the thermally conductive elastic member 2, the ampoule plate 21, and the thermally conductive elastic sheet 3 and the heat dissipation substrate 5, and surface contact can be surely performed. At the same time, by making the thermally conductive elastic members 2A and 31 elastic, the impact system can be absorbed by the thermally conductive elastic members 2G and 31 even if the liquid crystal display device is biased from the outside. Therefore, the impact is not directly transmitted to the mounting substrate 2, the position of the mounting substrate 21 is deviated, the mounting substrate 21 itself is broken, or the LED light source 2 is detached. Fig. 15 is a schematic cross-sectional view showing a liquid crystal display device of the present invention in another embodiment. The same components as those in Fig. 1 are given the same component symbols. The following description differs from Figure 1. TF1018401 24 201224588 In this embodiment, the mounting surface of the LED light source 2 on the contact surface substrate 21, the f-plane on the opposite side of the surface, and the lower end surface of the mounting substrate 21 at right angles to the surface are provided. A thermally conductive elastic member 32 having a cross-sectional shape. An example of the thermally conductive elastic member 32 is shown in a perspective view in Fig. 16 . As shown in Fig. 16 (a), the conductive f-elastic member 32 is composed of a first portion 32a sandwiched between the back surface of the mounting substrate 21 and the heat dissipation substrate 5, and an LED mounting © and the light guide plate 3 for mounting the substrate 21. The second portion of the milk is arranged; and is disposed on the lower end surface of the mounting substrate 21 and the third portion 32c' of the heat dissipation substrate 5. The thermally conductive elastic member 32 is viewed from the left and right sides of the drawing, and the second portion 32b and the third portion 32c of the first P position 2a are formed into a cross section 3 (U) shape of the upper opening. Then, the second portion 32bjL is provided at a position corresponding to the LED light source 2 of the mounting substrate 21, and a plurality of opening portions 32d are formed on the upper side opening. However, the mounting substrate 21 is disposed in such thermal conductivity elasticity. In the member 32, the upper side of the second portion and the second portion may be directed downward, and the coffee light source 2 may be placed in the opening portion and pressed. At this time, 'the contact surface between the thermally conductive elastic member Μ and the mounting substrate U, the contact surface between the heat conduction substrate 400 and the heat dissipation substrate 5, and the surface of the heat dissipation substrate $ and the light guide plate 3, the above-mentioned fluidity exists. The higher viscosity TF1018401 25 201224588 is connected to the lower mobility fluid 17' to improve thermal conductivity. / c is another example showing the heat conductive elastic member %. Fig. 16 (5) corresponds to the LED light source 2, and the opening portion 32d formed in the second portion 32b is formed in a window shape. In this case, on the four sides around the LED light source 2, 'because there is actually a '', and the conductive turn-and-turn transfer member Μ, it is released from the [Qiu source 2, and, the king P is thermally conductive. The elastic member is received and released from the heat dissipation substrate 5 or the light guide plate 3. When the female substrate is disposed on the thermally conductive elastic member, the gap between the first portion and the second portion is pulled away from the upper end side, and the silk substrate 21 may be inserted from above in this state. Further, as shown in Fig. 16 (4), the transmission elastic member 32 may be a cross-section u (U) shaped like the upper and lower end faces which are at right angles to the surface of the coffee board of the mounting substrate 21 and the surface of the material. . In the heat conductive elastic member of Fig. 16 (4), the fourth portion 32e is further provided. The LED light source 2 is formed as an exposed opening 32d at a position where the second portion 32b is divided into two in the height direction. The substrate 21 is inserted into the heat conductive elastic member 32 having a U-shaped cross section from the lateral direction. ' ' In addition, when the ampoule substrate 21 is placed on the thermally conductive elastic member, the opening formed in the second portion is formed. The portion is opened in the up-and-down direction, and the mounting substrate 2J is placed in the state of TF101840] 26 201224588. Alternatively, the mounting substrate 21 may be press-fitted from the side surface side. The elastic member 32 is constructed as shown in Fig. 6(c). Because the real 32 will be installed with four (four) (four) 4^ conductive elastic members, and through the cover frame of the liquid crystal display device: (the reference 4 enhances the heat transfer efficiency. The conductive elastic member 32 is clamped from the upper side. °' can also cover the four surfaces of the thermally conductive elastic member 32, so that it is good for heat transfer, and that the heat transfer elastic member 32 is excellent for heat transfer. Pressure refining and clamping the mounting substrate ^Dimming = Elasticity ==: The outer dimension of the _32 is made into a _substrate; the conduction H elastic member 32 is dependent on, so the fine concavities and convexities on the surface of the heat-dissipating substrate 5 of the silk substrate a disk are absorbed, and the mounting substrate 21 and the cymbal conduction ^ = The heat-transducing member 32 or the heat-conducting member such as the diffusing plate has an air layer, and can be in close contact with each other, and is in surface contact. Further, the heat-dissipating substrate 5 contacting the outer surface of the thermally conductive elastic member 32 is in the basin = angle (4), and there is a metal The curved surface (8) occurs when f-curve or metal press working, and the curved surface is absorbed by the elastic property of the thermally conductive elastic member 32. In the case where the elastic property cannot be absorbed, the inner curved surface is contacted, and conduction is performed. The outer corner portion of the green elastic member 32 is taken as the c-plane, whereby the TF1018401 27 201224588 32 and the heat dissipation substrate 5 are eliminated from the curved surface R, and the thermally conductive elastic member is surely adhered* and in surface contact. The mounting gold is described above. The outer surface of the thermally conductive elastic member 32 may be a box. The box diagram (4) to Fig. 17_ shows a perspective view of the shape surrounding the thermally conductive elastic member 33 'the above section' (u) heat conduction The elastic member 32 covers the outer surface thereof by the metal case 33. The heat conductive elastic member % of the (U) shape is closely adhered to the metal case by the contact surface. On the metal case 33, the heat conductive elasticity is attached. The member 32 is identically formed with a thin portion 露出 exposing the light emitting surface of the LED light source 2. The 'metal box 33 also has the effect of improving the utilization efficiency of the LED light source. Specifically, after the light from the LED light source 2 is incident on the light guide plate 3, The light guide plate 3 is not emitted to the side of the liquid crystal display panel, and is reflected by the metal reflector R provided on the end surface of the light guide plate 3, and returns to the end surface side of the LED light source 2 (see Fig. 5). At this time, in the case where the heat conducting member 32 is disposed at the end face of the light-receiving member 3, the heat conductive elastic member 32 which is gray to black absorbs such light, and the light is lost. Here, since the metal case 33 is present on the outer surface of the thermally conductive elastic member 32, the metal case 33 can be used to return the light to the light guide plate 3, and the light can be effectively utilized. TF1018401 28 201224588 In addition, in FIGS. 17(a) to 17(c), the metal case 33 is formed into a cross-sectional shape (u) by metal working, and for example, it may be formed as a cross-sectional opening (U) shape. The thermal conductive elastic member 32 has an overall structure and a cross-sectional shape. Further, it is preferable that the air layer does not enter between the thermally conductive elastic member 32 and the metal case 33, and the adhesion is preferably performed. For example, an adhesive (for example, Sumitomo 3M (heat-transfer bonding adhesive tape No. 8805)) may be filled between the thermally conductive elastic member 32 and the metal case 33. Further, the metal case 33 can be fixed to the heat dissipation substrate 5 by using a thermally conductive adhesive. Thus, the heat of the thermally conductive elastic member 32 can be easily transmitted to the heat dissipation substrate 5. Further, the metal case 33 and the heat dissipation substrate 5 are integrated, and the heat of the metal case 33 can be directly transmitted to the heat dissipation substrate 5. As the above-mentioned heat-conductive adhesive, for example, SE4420, a heat conductive adhesive made by Toray Dow Corning. Fig. 18 is a schematic cross-sectional view showing a liquid crystal display device of the present invention in another embodiment. The same components as those in Fig. 15 are given the same reference numerals. The following description differs from Figure 15. In this embodiment, the second portion of the thermally conductive elastic member 32 is wet-contacted to the end surface of the light guide plate 3. The heat released around the LED light source 2 or the mounting surface side of the substrate is directly transmitted from the second portion 32b of the thermally conductive elastic member 32 to the end face of the light guide plate 3, so that it can be released by the guide 3 . Further, the third portion is transferred to the first portion 32a of the TF1018401 29 201224588 located between the mounting substrate 21 and the end surface of the light guide plate 3, and can be released toward the heat dissipation substrate 5 by the first portion 32a. Here, the first portion 32a and the second portion 32b' of the thermally conductive elastic member 32 are the same as described above, and are formed to be slightly thicker than the design interval between the mounting substrate u and the heat dissipation substrate 5, and the design interval between the mounting substrate 21 and the light guide plate 3. . At this point, the second portion 32b is reliably welded and sandwiched between the mounting substrate and the end surface of the light guide plate 3, and the air layer cannot enter the gap, and t may release heat. Fig. 19 is a schematic cross-sectional view showing a liquid crystal display device according to another embodiment of the present invention. The same components as in Fig. 1 are given the same component symbols. The following description differs from Figure 1. In this embodiment, the heat dissipation substrate 5 is actually formed in a planar shape, and the ampoule substrate 21 is provided on the horizontal surface of the heat dissipation substrate 5. Further, the side surface of the LED container 23b of the LED light source 2 is mounted on the mounting substrate 21 as an LED mounting surface. Therefore, the light-emitting direction of the LED light source 2 is as shown in Fig. 2A, which is a direction parallel to the women's surface of the mounting substrate 21. Then, the upper surface and the back surface (the surface on the opposite side to the light-emitting surface) of the LED light source 2 are covered by the thermally conductive elastic member 34. As shown in FIG. 21, the thermally conductive elastic member 34 is formed to have a shape in which an opening portion 34a for accommodating the downward direction of the LED light source 2 is provided, and is attached to one side of the LED light source 2 of the mounting substrate 21 and emits light. In addition to the surface, it is formed to surround four faces. TF1018401 30 201224588 The thermally conductive elastic member 34 is pressed against the mounting substrate 21 by the upper frame 4, that is, from the upper side of Fig. 19. Further, the upper side frame 4 and the heat dissipation substrate 5 can be pressed from the back surface of the LED light source to the end face of the LED light source. The heat of the LED light source 2 is released to the upper frame 4 or the heat dissipation substrate 5 by the convex portion of the thermally conductive elastic member 34 existing around the LED light source 2. Here, the heat generated by the LED light source 2 becomes effective to radiate heat to the outside. Since it is difficult to accumulate heat in the LED light source 2 or the mounting substrate 21, the temperature rise of the LED shank, 2 or its periphery can be effectively suppressed. / The opening portion 34a of the thermally conductive elastic member 34 which is not shown in Fig. 21 is a plurality of LED light sources 2, S is provided with a window-like opening, and is placed in such a thermally conductive elastic member 34. In this case, the LED light source 2 mounted on the Annon substrate 21 may be placed in the opening portion* and pressed. The thickness of the heat conductive elastic member % is set to be slightly thicker than the design interval between the U and the upper side frame 4, and the P4 port portion 34a is formed to have the same thickness as the mounting thickness of the (4) light source 2. When the thickness of the thermally conductive elastic member 34 is appropriately adjusted, the conductive member ± elastic member 34 can be closely placed on the mounting surface of the mounting substrate and mounted on the surface of the coffee substrate of the mounting substrate 21. This conductive elastic member 34 has an elastic system. Therefore, the heat transfer TF10I8401 201224588 conductive elastic member 34 and the mounting substrate 21, the heat dissipation substrate 5, and the upper frame 4 have almost no air layer, and the heat dissipation TF10I8401 201224588 conductive elastic member 34 and the heat dissipation substrate 5 have an air layer. Close contact and face contact. Further, the heat conductive elastic member 34 is provided with an opening 34a for accommodating the LED light source 2, and the convex portion 34b is in contact with the LED mounting surface of the mounting substrate 21, so that light other than the direction in which the end surface of the light guide plate 3 advances is performed. The shading reflection prevents light leakage and improves light utilization efficiency. Further, the heat of the LED light source 2 is transmitted from the connection terminal portion 23c most through the metal drive wiring 24' formed on the mounting substrate 21, so that the thermally conductive elastic member 34 contacts the metal drive wiring 24 of the mounting substrate 21, and further When the connection terminal portion 23c is in contact, the heat radiation effect is large. Next, an explanation will be given of an embodiment in which the thermal conductivity of the LED light source 2 toward the mounting substrate 21 is raised when the LED light source 2 is mounted on the mounting substrate 21. In this embodiment, the LED light source 2 is as shown in Fig. 6, which is the same as the heat-dissipating bonding material 30 having good heat dissipation and adhesion, and the metal film 22 is mounted. Mounting Substrate The effect of the exothermic bonding material 30 between the LED light source 2 and the ampoule is as follows. The LED light source 2 of the board 21 and the mounting substrate 21 are usually made of two layers of conductive, thin, and bright tin, and are connected only to the connection terminal portion 23c. Therefore, it is usually produced by the LED chip 23a of the LED light source 2, and is transmitted from the LED container 23b to the agricultural and sturdy raw material through the connection terminal portion 23c, and is attached to the substrate 21, and the F1018401 32 201224588 is released from the LED container. In contrast, in the present invention, the gap (air layer) between the led container of the light source 2 and the mounting substrate 21 is excluded, and the heat radiating bonding material is filled with %. Thereby, the LED can be collected in the LED. The heat of the container 23b is efficiently conducted to the mounting metal film 22 of the mounting substrate 21, and is electrically conducted to the heat releasing metal film 26 via the plurality of metal via holes 27. Further, by mounting the metal film 22 with The metal film pattern 25 is integrally formed, or even if the mounting metal film 22 and the metal film pattern 25 are respectively formed and covered so as to cover the heat releasing bonding material 30, the heat of the LED container 23b can be efficiently conducted to The mounting substrate 21 side is transferred to the heat releasing metal film 26 by using a plurality of metal through holes 27. As described above, the heat releasing bonding material 30 or the mounting substrate 21 is configured from the LED mounting surface side to the opposite side. Until Metal through holes are formed, and the heat transfer effect of the metal through holes 27 can be improved. Therefore, by using the metal film 26 for exothermic or the metal films 22 and 26 on the opposite surface; the metal film pattern 25 'metal By using a good copper-based heat conductive material on the through hole 27, the heat of the LED container 23b of the LED light source 2 can be reliably and efficiently conducted to the heat releasing metal film 26 of the mounting substrate 21, and the temperature rise around the LED chip 21a can be effectively suppressed. In addition, as described above, the heat-dissipating bonding material 30 is preferably provided with insulating properties in order to prevent short-circuiting between the terminal portions 23c and 23c of the LED light source 2 in addition to heat dissipation and adhesion. TF10丨8401 33 In addition, as shown in FIG. 22, the heat radiating bonding material 30 may be formed so as to extend from the formation region of the mounting metal film 22 other than the region of the metal driving wiring 24 to which the terminal portions 23c and 23c are bonded, and reach the metal through hole. In this way, the heat accumulated in the LED container 23b of the LED light source 2 can be transmitted not only to the mounting metal film 22 but also directly to the metal film 25 through a plurality of metals via the heat releasing bonding material 30. The hole 27 can be transmitted to the heat releasing metal film 26 on the back side of the mounting substrate 21. Therefore, the heat of the LED container 23b collected in the LED light source 2 can be efficiently released to the heat releasing metal film 26 of the mounting substrate 21. The same effect is as shown in FIG. 23, and the metal film 22 may be extended and attached so as to be integrally formed with the metal film pattern 25 (in combination with the metal film 22 and the metal film pattern 2). Next, the replacement of the heat-dissipating bonding material 30 will be described. Other Embodiments In the case of the surface mount type LED light source 2, the terminal portion 2 provided on both sides of the LED light source 2 and the predetermined metal of the mounting substrate 21 are formed by the method of the bismuth oxide method. The drive wiring 24 is connected at a predetermined position. - Between the container of the LED wafer accommodating the LED light source 2, and the women's substrate 21, an air cavity having a poor thermal conductivity is generated. In the present invention, the adhesive 35 of the lower portion is supplied to the cavity portion by means of a distribution (four) material or the like. For example, the LED light source 2 is mounted on the riot panel 21, and the adhesive 35 is applied from the front side of the inner phase. It is important that the fluidity is high. TF101840] 34 201224588 Agent 35 is a highly fluid material that does not corrode metal wiring. Since the adhesive 35 is highly fluid, it enters the gap between the LED container 23b and the mounting substrate 21, and no layer of air such as bubbles is formed at all, so that the heat conduction of the portion can be enhanced. Therefore, the heat generated by the LED light source 2 is transmitted through the adhesive 35 and the terminal portion 23c, and heat can be efficiently conducted to the mounting substrate 21. Moreover, the mechanical bonding between the LED light source 2 and the mounting substrate 21 is not only the bonding of the terminal portion 23c, but also the bonding agent 35 disposed between the LED container 23b and the mounting substrate 21 can be achieved, so that the LED light source 2 can be improved and mounted. The substrate 21 has a mechanical bonding strength and is a liquid crystal display device excellent in impact resistance. The embodiments of the present invention have been described above, and the implementation of the present invention is not limited to the above embodiments. For example, in most of the embodiments, the thickness of the end surface of the light guide plate 3 on the side where the LED light source 2 is disposed is thinner, and the thickness of both end faces is the same plate member. Further, the lower side frame of the heat dissipating substrate 5 is also the same, and the depth direction of the side surface may be made the same. By further combining the heat-dissipating substrate 5 and the lower frame, the metal material of the heat-dissipating substrate 5 is exposed on the back side of the liquid crystal display device, and the outer surface of the frame 4 can be combined with the different members. The heat dissipation substrate 5 and the lower frame may be patterned by molding the resin only on the surface on the exposed side of the heat dissipation substrate 5. [Example 1] TF1018401 35 201224588 on the thermally conductive elastic sheet 31

The elastic sheet of the glyph (Sumitomo 3M (:.;,: section L 5, ❹m Μ 尔 尔)), on the heat-dissipating substrate, the material is used for the purpose of surface contact, the substrate 2, the thermal conductive elastic sheet 3 吏 Women's long-term heat-releasing substrate 5 is fixed. The thermal conductivity of each material used here is 0 45W/mK from the glass substrate 21, and the female W/m K thermal conductive elastic sheet 31 formed by the smash is 5W. /m · K ' belongs to the heat sink substrate 5, and S is 236 W/m · κ. Further, as the heat sink substrate 5, magnesium or iron may be used. The heat of 157 W/m · K 'iron heat conductivity is 83 5 · κ When the κ is added, the heat dissipation fan blade may be added. The heat generated by the LED light source 2 is not thermally transmitted to the heat dissipation substrate 5 via the heat conductive elastic sheet 31. The lower end surface of the mounting substrate 21 is also transmitted to the heat dissipation substrate 5 to emit heat. Here, the wire substrate 21 or the thermally conductive elastic sheet 31 is extremely low compared to the aluminum of the heat dissipation substrate 5, and is suspended. In order to improve the heat conduction aspect, the mounting substrate 21 and the thermally conductive elastic sheet 31 are thinned. Effect. + Unlimited play of the display area based on the use of liquid crystal size of 4.7 England significant ⑼ ..., will

L6 coffee light source 2 Arranged on the mounting substrate 2 at room temperature (25. 〇 悲 , 对 对 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 T T T T T T T T T T T T T T T T T T T The ambient temperature of the light source 2 can be suppressed to 4.

The estimated lifetime of the light source can be extended to approximately 750 hours. E D # ^ ^ ^ ^ and so on. Further, regarding the ", x illuminance rate, although it is small, a tendency to improve is observed. On the other hand, in the case where the thermally conductive elastic sheet 31 is not contained, "the ambient temperature of the cut is 44 〇 C', and the estimated lifetime of the LED light source is ° 6600 hours. As a result of the above-described experiment, it is understood that the heat conduction (tetra) sheet can be used to improve the heat conduction, and the heat generated by the LED light source 2 can be efficiently radiated toward the heat dissipation substrate 5, thereby reducing the LED light source. 2 and the heat accumulated in the mounting substrate 21, and the temperature rise of the coffee source source 2 and the periphery of the dragon is reduced. [Example 2] A fluid (7) (heat transfer compound) was applied between the mounting substrate 21 and the thermally conductive elastic sheet 31, between the thermally conductive elastic sheet 31 and the heat dissipation substrate 5, and the temperature measurement was the same as in Example 1. . The heat transfer compound was fixed to the mounting substrate 21, the thermally conductive elastic sheet 31, and the heat dissipation substrate 5 by surface contact using SC102 of Toray Dow Corning. The thermal conductivity of the heat transfer compound is 0.8 W/m · K. The heat-transfer compound is a clay-like state in which a high-viscosity oil-and-fat component is mixed with ceramic fine particles having high thermal conductivity, and the oil-and-fat component contained therein is closely adhered to the fine unevenness, and the ceramic particles TFI018401 having high thermal conductivity are interposed therebetween. 37 201224588 Child's good heat conduction. The size of the display area is 4.7 inch LCD panel 1. 16 LEDs 2 are arranged and mounted on the mounting substrate 21. In the normal temperature state, a current of 2 mA is applied to each LED light source 2 to perform a LED source. 2 Measurement of ambient temperature. As a result, it can be seen that the ambient temperature of the LED light source 2 can be suppressed to 39 ΐ, and the estimated lifetime of the light source can be extended to about hours.

、, 丨 ’ 'About the luminous efficiency of the LED light source, although small, but observed a great improvement. On the other hand, in the case where the thermally conductive elastic sheet 31 and the heat conductive compound were not contained, it was found that the ambient temperature of the LED light source was 44 ° C, and the estimated lifetime of the light source was about 6,600 hours. As a result of the above-described experiment, it is understood that the heat conductive compound is present on the contact surface between the thermally conductive elastic sheet 31 and the mounting substrate 2 i and the contact surface between the thermally conductive elastic sheet 31 and the heat dissipation substrate 5, and the surfaces are completely adhered to each other. The heat conduction from the LED light source 2 toward the heat dissipation substrate 5 can be improved step by step. [Example 3] A temperature measurement similar to that of Example 1 was carried out except that the conductive elastic member was chased in addition to the configuration of Example 1. On the thermally conductive elastic member 2G, an elastic sheet (model No. 55〇9 of Sumitomo 3M) is used to make the light incident on the mounting substrate 21 and the light guide plate 3 in surface contact. The side end faces are fixed. The heat generated while the LED light source 2 is emitting light is also radiated to the guide _ via the mounting substrate TF1018401 38 201224588 = scalar guide _31. Therefore, the three sides of the mounting surface side, the back side and the lower end surface of the heat-transmissive substrate η which is transmitted from the anode and the earth are transferred to the heat-dissipating substrate 5 are released. The display area size is 4.7 inch size night crystal display panel i, 16 LED light source 2 _ silk in silk pure 2 ι, at room temperature (called shape, for each LED 総 2 pass 2QmAq flow, backlight inside &lt The measurement of the temperature around the LED light source 2. The result shows that the temperature of the LED light source 2 can be suppressed to the thief, and the estimated life of the led light source can be extended to about 85 〇〇. Further, regarding the luminous efficiency of the [ED light source, although On the other hand, in the case where the thermally conductive elastic member 2〇 and the thermally conductive elastic sheet 31 are not contained, it is understood that the estimated lifetime of the ambient temperature of the LED light source is 4600 hours for the 4th generation light source. As a result of the above-described experiment, it is understood that the thermally conductive elastic member and the thermally conductive elastic sheet 31 are adhered to the mounting substrate 21 and the heat dissipation substrate $, whereby heat conduction can be improved, and the heat generated by the LED light source 2 can be efficiently directed toward the light guide plate. The heat radiating substrate 5 is allowed to radiate heat. [Example 4] The heat conductive elastic member 20 is integrated with the heat conductive elastic sheet 31, and a cross section having an exothermic property: (U)-shaped heat conduction is used. The elastic sheet 32 (Model No. 5509 of Sumitomo 3M) is placed in the same manner as in Embodiment 3 by fixing the mounting substrate 2, the thermally conductive elastic sheet 32, and the heat-dissipating substrate 5 to TF1018401 39 201224588. The temperature is measured. Then, the display area size is made = 2 coffee light sources 2 rows (four) in: substrate shape '4 down' for each led light source m (25C)

Measurement of the temperature around the source 2. When the machine is turned on, the result of LED is found to be LED light 〇 &amp; light source array _ life dragon, coffee - light source array luminous effect hours. Also, about. ..., then, but there is an improvement in the inclination of the other side. In the case where the ambient temperature of the light source 2 is 4n:, in the case of LE ^, it is known to be about 6,400 hours. Predicted lifetime of the ninth/original array As can be seen from the above experimental results, the #conductive elastic sheet 32 is in close contact with the heat transfer of the two sides of the mounting substrate: heat transfer, and the heat conduction can be further improved. ~ soil anti-5 and the light guide plate and 'because the heat conductive elastic sheet 3 is not the inside of the Shanghai-Junzhen hot substrate 5, so it is not a hanging and the mounting substrate can be even from the Bo Peng&lt;&gt; In the position of the 疋, and the 吏 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 施加 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收 吸收[Embodiment 5] As shown in FIG. 19, the mounting substrate 21 is disposed on the horizontal TF1018401 201224588 surface of the heat dissipation substrate 5, and one side of the LED container 23b of the LED light source 2 is regarded as a side surface. The LE; D mounting surface was mounted on the liquid crystal display device of the mounting substrate 21, and the same temperature measurement as in the first embodiment was performed. On the thermally conductive elastic sheet 34, a plate-like elastic sheet having a heat releasing property (Model No. 5509 of Sumitomo 3M) was used to face-contact the LED light source 2, the heat-dissipating substrate 5, and the upper side frame. 4 fixed. When a part of the heat generated by the LED light source 2 is emitted from the led container 23b, the heat is radiated from the upper frame 4 through the thermally conductive elastic sheet 34, and heat can be released from the side surface side of the heat dissipation substrate 5. Display area size (4) 4 7 small LCD display panel 1, I6 LED light source 2 is arranged on the mounting substrate 2 at room temperature (hunger), and each LED light source 2 is connected with a current of 2 mA. The measurement of the temperature around the ED light source 2 in the backlight is performed. As a result, it was found that the ambient temperature of the light source 2 was suppressed to the order, and the coffee stick was extended to 8,500 hours. Also, ^, , θ .. The luminous efficiency of the stomach light source 2, although you have a small i_ observed a tendency to improve. On the other hand, the temperature around the heat-free LED light source is 44. = 4 pieces of 34, 6600 hours. The estimated lifetime of the coffee light source 2 is about the result of the above-described experiment. It is understood that the thermal conductivity is thin and the heat generated by the auxiliary light source 2 is radiated through the heat substrate 5. . Efficiently facing the upper frame 4 and the TF1018401 201224588 [Embodiment 6] As shown in Fig. 6, the thickness of the mounting substrate 21 is 〇.1, and various metal films 22 and 26 are disposed on both surfaces thereof; Pattern 25; metal drive wire 24. The metal film can be used in a thickness of three (four). The metal through hole 27 is provided with a through hole having a diameter of 〇.2, and a copper alloy having a thickness of 25 μm of a plating material is applied to the through hole. Further, the metal film 26 for heat dissipation of the mounting substrate 21 is compared with the other metal film 22 and the metal film pattern 25 on the surface side, and the thickness is made 35 μm to 60 μm thick, thereby making it easy to conduct heat and diffusion. structure. The surface of the metal film of the copper material is covered with a solder layer 28 having a thickness of about 20 μm. As a result, not only the above-described heat radiation effect is enhanced, but also the solder mounting of the mounting substrate 21 LED light source 2 or its driving components is facilitated, and oxidation of each copper surface or discoloration and corrosion of copper can be prevented. The thermal conductivity of the mounting substrate 21 is very small compared to the metal materials used for the metal film 22, 26 or the metal film pattern 25 or the heat dissipation substrate 5. Therefore, in improving the heat conduction of the heat dissipation substrate 5, an effective method is to increase the thickness of the substrate. Unlimited thinning. A thin glass epoxy substrate can be used in terms of insulation reliability and cost. The heat-dissipating substrate 5 can be formed into a rectangular plate having a thickness of 2 mm and made of aluminum, and is bent into a L-shaped section of a cross section so as to be in contact with the heat-releasing metal film 26 of the mounting substrate 21, and is fixed to the mounting substrate 21 by a screw. The thermal conductivity of the material used herein is that the mounting substrate (the base portion of the mounting substrate) formed of the glass cloth substrate epoxy resin is 45.45 W/m · K, and the copper is TF1018401 42 201224588 403 W/m. · Κ, aluminum is 236W/m · Κ, solder is 62.lw/m · κ, and the exothermic bonding material is 0.92W/m · Κ. The heat generated while the LED chip 23a of the LED light source 2 emits light is conducted to the ampoule substrate 21 through the exothermic bonding material 30 placed between the LED container 23b of the LED light source 2 and the ampoule substrate 21. The exothermic bonding material 30 is an exothermic resin (using SE4420 of Toray Dow Corning). The liquid crystal display device uses a 5.7-inch rectangular liquid crystal display panel 1' to mount five LED light sources 2 in a line on the mounting substrate 21, and applies a current of 250 mA to each of the LED light sources 2 to perform an ambient temperature of the mounting surface of the mounting substrate 212Led. Measurement. &lt; As a result, the temperature rise can be suppressed to 25. 〇 Below, or press the temperature & rise on the back side to 18C or less. It is possible to perform bright display as compared with the illuminating effect (10) of about 2% of [the normal temperature luminous efficiency of the printed light source] (4). On the other hand, in the liquid crystal display device including the LED backlight, the temperature rise on the mounting substrate (especially around the LED light source) is large, and the temperature on the LED mounting surface side of the mounting substrate rises to 耽 or more, and (4) the light source The luminous efficiency is reduced to 4% or less, and the environment in which the liquid crystal display is used is lower than the normal temperature (25°c). When the temperature is 7 generations, the temperature of the silk substrate is above the brewing. status. It can be seen from the above-described experimental phase wire that the structure of the coffee system 2 is TF1018401 43 201224588 (there is a heat releasing bonding material 30); the metal films 22 and 26 of the mounting substrate 21; the metal film pattern 25, and various structures of the metal through holes 27, The heat conduction can be improved, and the heat generated by the LED light source 2 can be efficiently radiated toward the heat dissipation substrate 5. [Example 7] The temperature measurement similar to that of Example 6 was carried out by using the adhesive 35 instead of the exothermic bonding material 3G. Further, the same heat conductive elastic member 32 as in the fourth embodiment is also used. Adhesive 35 uses SE9176L from Toray Dow Corning Co., Ltd. The thermal conductivity of air is 0.024 w/m · κ, and the illustrated adhesive 35 has a larger heat transfer effect than air. In the case of the , ’ 您 您 您 您 您 您 您 您 您 您 您 您 ’ ’ ’ ’ ’ 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 The size of the display area is 4.7-inch liquid crystal display panel i, and the light source 2 is arranged in the mounting substrate 21 at a normal temperature (25. 〇 悲 , 对 对 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个 各个Measurement of the temperature around the LED light source 2. L, Haoyue light source, the result shows that the ambient temperature of the LED light source 2 can suppress the estimated life of the light source to extend to about 7500 hours. The luminous efficiency of the light source, although small, is observed to be improved. On the other hand, on the other hand, in the absence of adhesive 35, the ambient temperature of the coffee source 2 is the external _ 32, and the LED FT1018401 201224588 has a measured life of about 6600 hours. As a result of the above-described experiment, it is understood that the application of the adhesive 35 to the gap between the LED container 23b of the LED light source 2 and the mounting substrate 21 allows the thermally conductive elastic member 32 to be in close contact with the mounting substrate 21 and the heat dissipation substrate 5, thereby improving heat conduction and efficiency. Fig. 1 is a cross-sectional view showing a liquid crystal display device according to an embodiment of the present invention. Fig. 2 is a view of the present invention. Fig. 3 is a cross-sectional view showing a structure of a liquid crystal display panel used in a liquid crystal display device of the present invention. Fig. 4 is a schematic perspective view showing a mounting substrate of an LED light source viewed from an LED mounting surface side. Fig. 6 is a schematic cross-sectional view showing a mounting substrate of an LED light source according to the present invention. Fig. 7 is an enlarged cross-sectional view showing a portion A of Fig. 6. Fig. 8 is attached to a mounting substrate. Fig. 9 is a schematic view showing the structure of an LED light source. Fig. 10 is a perspective view of an L-shaped thermally conductive member. Fig. 11 is a schematic view of a liquid crystal display device according to another embodiment of the present invention. Fig. 12 is a schematic cross-sectional view of a liquid crystal display device according to another embodiment of the present invention, TF1018401 45 201224588. Fig. 13 is a perspective view of a second thermally conductive member. Fig. 14 is an LED light source using a second thermally conductive member. Fig. 15 is a schematic cross-sectional view showing a liquid crystal display device according to still another embodiment of the present invention. Fig. 16(a) (c) is a perspective view of a 7: U (U)-shaped heat conductive member used in the liquid crystal display device of Fig. 15. Fig. 17 (a) to (c) are heat conduction in the profile I? (U) shape, respectively. Fig. 18 is a schematic cross-sectional view showing a liquid crystal display device according to still another embodiment of the present invention. Fig. 19 is a schematic cross-sectional view showing a liquid crystal display device according to still another embodiment of the present invention. Figure 20 is a schematic perspective view of an LED light source array used in the liquid crystal display device of Figure 19. Fig. 21 is a perspective view showing a heat conductive member used in the liquid crystal display device of Fig. 19. Fig. 22 is a schematic perspective view showing an embodiment of a mounting substrate. Fig. 23 is a schematic perspective view showing another embodiment of the mounting substrate. Figure 24 is a schematic perspective view of an LED light source array. Figure 25 shows the characteristics of the relationship between the ambient temperature of the LED chip and the life of the LED TF1018401 46 201224588. [Main component symbol description] 1 LCD display panel 2 LED light source 3 Light guide plate 3a Lens sheet 3b Diffusion sheet. 3c Reflective sheet 4 Upper side frame 5 Heat sink substrate (lower side frame) 11 Lower side transparent substrate 12 Upper side transparent substrate 13 Liquid crystal layer 14 Sheet portion 15 Display electrode 16 Display electrode 17 High fluidity adhesive (fluid fluid) 19 Drive circuit 20 Thermally conductive elastic member 20a Opening portion 21 Mounting substrate 22 Mounting metal film TF101840] 47 201224588 23a LED chip 23b LED container 23c Terminal portion 23d Pit 24 Metal drive wiring 25 Metal film pattern 26 Heat release metal film 27 Metal via hole (metal via hole conductor) 28 Solder layer 29 Impedance film 30 Heat release bonding material 31 Thermal conductivity elasticity Sheet 32 Thermally conductive elastic member 32a First portion 32b Second portion 32c Third portion 32d Opening portion 32e Fourth portion 33 Metal case 33a Notch portion 34 Thermal conductive elastic member 34a Opening portion TF1018401 48 201224588

34b 35 BL R Convex Adhesive LED Backlight Surface (Metal Reflector) TF1018401

Claims (1)

201224588 VII. Patent application scope: 1. A light source device comprising: a light guide plate; an LED light source disposed on a side of the entrance surface of the light guide plate; a escaping light source (4) Ml heat dissipation substrate; and a mounting member disposed on the mounting substrate; The first thermal conductivity between the heat dissipating substrates is between the mounting substrate and the upper first thermally conductive member and the L 1 thermal conductive member, and the agent or fluid. 〃 a between the heat-dissipating substrates, which is provided with conductive heat bonding. 2. As on the substrate of the patent application, there are Anshang, Shi, τ, and cutting devices, wherein the above-mentioned coffee source is installed. The metallurgical phase of the light source, and the metal for exothermic metal on the opposite side of the surface, the metallurgical phase and the superiority are as described above. 3. The patented Fanjin phase is electrically connected. (5) Zhuo 2 light source device, 1 command, the upper f light source and the above-mentioned ampoules are all associated with the above-mentioned led metal film with a heat-releasing joint material. 4. If the scope of the patent application has been '丄. ^ circumference 2 or 3 of the light source device, of which, in the upper test of the women's substrate, the system is based on the film thickness of the film, the above-mentioned security, '~ A metal via-hole conductor connected by a metal film. The invention relates to a light source device according to the first item, wherein the LED mounting surface of the above-mentioned Anshangji TF1018401 50 201224588 board is provided with a metal film pattern covered by a white film. 6. The light source device of claim 1, wherein the LED mounting surface of the mounting substrate is provided with a metal driving wiring for supplying a driving current to the LEI) light source; and further comprising: contacting the metal driving wiring. The light source device of the sixth aspect of the invention, wherein the terminal portion of the LED light source is connected to the conductive bonding member via the metal driving wiring, and the second thermally conductive member is The terminal portion of the LED light source is in contact with each other. 8. The light source device according to claim 6 or 7, wherein the second thermally conductive member covers the LED mounting surface of the mounting substrate so as to expose at least the light emitting surface of the LED light source. 9. The light source device of claim 6 or 7, wherein the first thermally conductive member and the second thermally conductive member are integrated. A liquid crystal display device comprising: a light source device according to claim 1; and a liquid crystal display panel disposed opposite to said light guide plate of said light source device 0 TF1018401 51