JP2008117886A - Led package, and lighting device - Google Patents

Led package, and lighting device Download PDF

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Publication number
JP2008117886A
JP2008117886A JP2006298738A JP2006298738A JP2008117886A JP 2008117886 A JP2008117886 A JP 2008117886A JP 2006298738 A JP2006298738 A JP 2006298738A JP 2006298738 A JP2006298738 A JP 2006298738A JP 2008117886 A JP2008117886 A JP 2008117886A
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Prior art keywords
led package
light
led
led chip
heat
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JP2006298738A
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Japanese (ja)
Inventor
Ryuji Tsuchiya
竜二 土屋
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Toshiba Lighting and Technology Corp
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Harison Toshiba Lighting Corp
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Priority to JP2006298738A priority Critical patent/JP2008117886A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin side-view LED package excellent in thermal conductivity, and to provide a lighting device using it for its light source. <P>SOLUTION: The LED package of this invention comprises an LED chip 2, an external enclosure 9 for mounting the LED chip, a transparent resin 6 for covering the LED chip, a plurality of power supplying parts 3a, 3b for supplying the power to the LED chip, and heat radiating parts 4a, 4b for radiating the heat of the LED chip. The power supplying part and the heat radiating part are formed on the mutually different surface of the LED package 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、ＬＥＤパッケージ及びそれを光源とする照明装置に関する。   The present invention relates to an LED package and an illumination device using the LED package as a light source.

従来、ＬＥＤはインジケーター用の砲弾型パッケージとするのがほとんどであった。ところが、高輝度青色ＬＥＤが開発されてからは３波長のＬＥＤが揃い、これら三波長のＬＥＤを同時に実装することで白色ＬＥＤを構成できるようになり、また、青色ＬＥＤと蛍光体とを組合せた白色ＬＥＤも開発されたことで、ＬＥＤの用途が広がり、さまざまなＬＥＤパッケージが開発されるようになっている。また近年は、表面実装タイプのＬＥＤパッケージが多数発売されるようになり、特に携帯電話等の小型液晶用のバックライト装置として、出光面と実装面とを９０°傾けた、いわゆる“サイドビューパッケージ”が広く使用されるようになっている。   Conventionally, most of LEDs are bullet-type packages for indicators. However, since the development of high-intensity blue LEDs, three-wavelength LEDs have been prepared, and by simultaneously mounting these three-wavelength LEDs, a white LED can be configured, and a blue LED and a phosphor are combined. With the development of white LEDs, the use of LEDs has expanded and various LED packages have been developed. In recent years, a large number of surface mount type LED packages have been put on the market. Especially as a backlight device for small liquid crystal such as a mobile phone, a so-called “side view package in which a light emitting surface and a mounting surface are inclined by 90 °. "Is widely used.

このサイドビュータイプのＬＥＤパッケージは、例えば、意匠登録第１１７１１０３号公報に記載されているような構造であり、出光面と実装面とが直交している。このような構造のＬＥＤパッケージは、ＦＰＣ（フレキシブルプリン基板）のような薄い基板に複数個をアレイ配列に実装して光源装置とし、その光源装置を導光板の側方に各ＬＥＤパッケージの出光面が導光板の端面と近接対向する姿勢で配置し、それら光源装置と導光板、さらには導光板の表側の発光面の上方に光拡散シートのような光学シートを配置し、これらをフロントフレームとバックフレームとの間に収容してバックライト装置を構成するのに採用されている。このような構成のバックライト装置は、ＬＥＤパッケージの出光面を導光板の端面に配置しているので、薄型で、導光板への入光効率が良く、高効率なバックライト装置とすることができる。   This side view type LED package has a structure as described in, for example, Design Registration No. 1171103, and the light exit surface and the mounting surface are orthogonal to each other. The LED package having such a structure is a light source device in which a plurality of LED packages are mounted in an array array on a thin substrate such as an FPC (flexible pudding substrate), and the light source device is placed on the side of the light guide plate and the light emitting surface of each LED package. Are arranged in a posture close to and opposed to the end surface of the light guide plate, and an optical sheet such as a light diffusion sheet is arranged above the light source device and the light guide plate, and further above the light emitting surface on the front side of the light guide plate. The backlight device is used by being accommodated between the back frame and the back frame. In the backlight device having such a configuration, the light emitting surface of the LED package is disposed on the end surface of the light guide plate, so that the backlight device is thin, has good light incident efficiency to the light guide plate, and is highly efficient. it can.

しかしながら、従来、サイドビュータイプのＬＥＤパッケージは、ＬＥＤチップの放熱に関して解決すべき課題があった。ＬＥＤパッケージ材料の中で熱伝導の良い金属パターンは、ＬＥＤ実装部から給電部分までの距離が長く、しかも経路が細いため、ＬＥＤチップの発熱を配線パターンに効率良く熱伝導させることができない。さらに、外囲器は樹脂であるために熱伝導が悪い。そのため、携帯電話程度の小型のバックライト装置用には使用することができるが、大型のバックライト装置に対応するには放熱性の改善に技術的課題が残っていた。   However, conventionally, the side-view type LED package has a problem to be solved regarding the heat dissipation of the LED chip. Among the LED package materials, a metal pattern having good heat conduction has a long distance from the LED mounting portion to the power feeding portion and a narrow path, and therefore the heat generated by the LED chip cannot be efficiently conducted to the wiring pattern. Furthermore, since the envelope is a resin, heat conduction is poor. Therefore, although it can be used for a small backlight device such as a mobile phone, a technical problem remains in improving heat dissipation to cope with a large backlight device.

ＬＥＤパッケージには、サイドビュータイプの他に、出光面の裏面に実装面があるトップビュータイプのものがある。このトップビュータイプのＬＥＤパッケージでは、サイドビュータイプのＬＥＤパッケージと比較すると、ＬＥＤチップの発熱を実装基板の金属パターンから熱伝導させやすい。また、ＬＥＤチップの裏面に直接放熱のためのパターンを設けて熱伝導させる対策もとりやすい。しかしながらトップビュータイプのＬＥＤパッケージでは、パターン面が出光面の裏面にあるため、バックライト装置に光源として組込む際、バックライト装置の厚さ方向に基板の配線を設ける必要があり、バックライト装置の薄型化が困難である問題点がある。
意匠登録第１１７１１０３号公報 In addition to the side view type, the LED package includes a top view type having a mounting surface on the back surface of the light emitting surface. In this top view type LED package, the heat generation of the LED chip is easily conducted from the metal pattern of the mounting substrate as compared with the side view type LED package. Moreover, it is easy to take measures to provide heat conduction by providing a pattern for directly radiating heat on the back surface of the LED chip. However, in the top view type LED package, since the pattern surface is on the back surface of the light emitting surface, it is necessary to provide the wiring of the substrate in the thickness direction of the backlight device when incorporating it as a light source in the backlight device. There is a problem that it is difficult to reduce the thickness.
Design Registration No. 1171103

本発明は、上記の従来技術の課題に鑑みてなされたもので、サイドビュータイプのＬＥＤパッケージであって、薄型でかつ熱伝導特性に優れたＬＥＤパッケージを提供することを目的とする。   The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a side view type LED package that is thin and has excellent heat conduction characteristics.

また本発明は、上記のＬＥＤパッケージを光源とすることで薄型化が図れる照明装置を提供することを目的とする。   Another object of the present invention is to provide a lighting device that can be thinned by using the LED package as a light source.

請求項１の発明は、ＬＥＤチップと、前記ＬＥＤチップを搭載する外囲器と、前記ＬＥＤチップを被覆する透明樹脂と、前記ＬＥＤチップに給電するための複数の給電部と、前記ＬＥＤチップの熱を放熱させる放熱部とを具備し、前記給電部と放熱部とは、当該ＬＥＤパッケージの互いに異なる面に形成したＬＥＤパッケージを特徴とする。   The invention of claim 1 includes an LED chip, an envelope on which the LED chip is mounted, a transparent resin that covers the LED chip, a plurality of power feeding units for feeding power to the LED chip, A heat-dissipating part that dissipates heat, and the power supply part and the heat-dissipating part are characterized by LED packages formed on different surfaces of the LED package.

請求項２の発明は、請求項１のＬＥＤパッケージにおいて、前記給電部は、前記ＬＥＤパッケージの出光面と直角な面に形成したことを特徴とする。   According to a second aspect of the present invention, in the LED package of the first aspect, the power feeding portion is formed on a surface perpendicular to the light exit surface of the LED package.

請求項３の発明は、請求項１又は２に記載のＬＥＤパッケージをその放熱部が配線用基板に接触する姿勢にて当該配線用基板上にアレイ配列した光源装置と、前記光源装置の出光面からの光を側面から体内に導光し、体内にて散乱、反射によって表側の発光面から前記光源装置の出光面と直角な方向に出射させる導光板と、前記光源装置と導光板とを収容するフレームとを具備した照明装置を特徴とする。   The invention according to claim 3 is a light source device in which the LED package according to claim 1 or 2 is arrayed on the wiring substrate in a posture in which the heat radiating portion contacts the wiring substrate, and a light exit surface of the light source device A light guide plate that guides light from the side to the inside of the body and emits light from the light emitting surface on the front side in a direction perpendicular to the light exit surface of the light source device by scattering and reflection in the body, and the light source device and the light guide plate are accommodated And an illuminating device including the frame.

請求項４の発明は、請求項３の照明装置において、前記ＬＥＤパッケージの放熱部と前記フレームとの間を熱伝導性材料によって接続したことを特徴とする。   According to a fourth aspect of the present invention, in the illumination device according to the third aspect, the heat radiation portion of the LED package and the frame are connected by a heat conductive material.

本発明のＬＥＤパッケージによれば、ＬＥＤパッケージを光源装置に採用したサイドライト方式の照明装置を構成したときに、ＬＥＤチップの発する光を効率良く導光板に導くことができ、かつ、ＬＥＤチップの発熱を効率良くフレームに熱伝導させることができ、高効率でＬＥＤチップの温度上昇が小さい照明装置を実現できる。   According to the LED package of the present invention, when a sidelight type illumination device employing the LED package as a light source device is configured, the light emitted from the LED chip can be efficiently guided to the light guide plate, and the LED chip Heat generation can be efficiently conducted to the frame, and a lighting device with high efficiency and a small temperature rise of the LED chip can be realized.

また、本発明の照明装置によれば、上記のＬＥＤパッケージを光源とすることで薄型化が図れる。   Moreover, according to the illuminating device of this invention, thickness reduction can be achieved by using said LED package as a light source.

以下、本発明の実施の形態を図に基づいて詳説する。図１及び図２は、本発明の１つの実施の形態のＬＥＤパッケージ１を示している。本実施の形態のＬＥＤパッケージ１は、いわゆるサイドビュータイプのものであり、表面実装タイプのＬＥＤパッケージとなっている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 and 2 show an LED package 1 according to one embodiment of the present invention. The LED package 1 of the present embodiment is of a so-called side view type, and is a surface mount type LED package.

ＬＥＤパッケージ１におけるＬＥＤチップ２は、放熱用パターン３ｃ上に配置されている。ＬＥＤパッケージ１は、ＰＰＡ（ポリフタルアミド）のような高耐熱性樹脂でもよいが、熱伝導率の高いセラミックが好適である。そしてセラミックの場合、放熱の必要性に応じて、アルミナ、窒化ホウ素、窒化アルミニウム等を選択できる。ＬＥＤチップ２に対する給電は、給電用パターン３ａ，３ｂにワイヤーボンドにより給電用ワイヤ７を接続することで行う。   The LED chip 2 in the LED package 1 is disposed on the heat radiation pattern 3c. The LED package 1 may be a high heat resistant resin such as PPA (polyphthalamide), but a ceramic having high thermal conductivity is suitable. In the case of ceramic, alumina, boron nitride, aluminum nitride or the like can be selected according to the necessity of heat dissipation. Power supply to the LED chip 2 is performed by connecting a power supply wire 7 to the power supply patterns 3a and 3b by wire bonding.

図３の断面図に詳しく示すように、放熱用パターン３ｃは、ＬＥＤパッケージ１の外囲器９に形成されたスルーホール１０を通じて出光面５ａの反対面である放熱面５ｃに形成されている外部放熱パターン４ｃに接続されている。   As shown in detail in the cross-sectional view of FIG. 3, the heat radiation pattern 3 c is formed on the heat radiation surface 5 c that is the opposite surface of the light emission surface 5 a through the through hole 10 formed in the envelope 9 of the LED package 1. It is connected to the heat radiation pattern 4c.

給電用パターン３ａ，３ｂは、外囲器９のパターン面を通じて出光面５ａと略直角方向に面している給電面５ｂに形成された外部給電パターン４ａ，４ｂに電気的に接続されている。ＬＥＤチップ２を気密に封止する封止樹脂６が、外囲器９内にＬＥＤチップ２を覆うように充填されている。   The power feeding patterns 3 a and 3 b are electrically connected to the external power feeding patterns 4 a and 4 b formed on the power feeding surface 5 b facing the light exit surface 5 a through the pattern surface of the envelope 9 in a substantially perpendicular direction. A sealing resin 6 that hermetically seals the LED chip 2 is filled in the envelope 9 so as to cover the LED chip 2.

このＬＥＤチップ２の発光色に制限はない。青、緑、赤等の可視光でもよいし、紫外光もしくは赤外光を放射するＬＥＤチップでもよい。また、封止樹脂６には、白色発光を得る場合には蛍光体を混合させて充填することができる。その場合、ＬＥＤチップ２の発光とＬＥＤチップ２からの光に励起された蛍光体の発光とが混合して白色光を得る。   There is no restriction | limiting in the luminescent color of this LED chip 2. FIG. Visible light such as blue, green, and red may be used, and an LED chip that emits ultraviolet light or infrared light may be used. Moreover, when obtaining white light emission, the sealing resin 6 can be filled with a phosphor. In that case, the light emission of the LED chip 2 and the light emission of the phosphor excited by the light from the LED chip 2 are mixed to obtain white light.

本実施の形態のＬＥＤパッケージ１を組み込んだ照明装置としてのバックライト装置１００の構造を図４に示し、その光導入部の断面を図５に示す。多数個のＬＥＤパッケージ１を基板１０１にアレイ状に実装して光源装置１１としている。ＬＥＤパッケージ１を実装した基板１０１で成る光源装置１１は、導光板１０２の入光面１０２ａとなる端面に近接して配置してある。この導光板１０２は図５において下面側を反射面１０２ｂとし、上表面側を発光面１０２ｃとしている。導光板１０２の反射面１０２ｂ側には反射シート１０３を配置し、発光面１０２ｃ側には光拡散、集光のための光学シート類１０４を配置してある。これらの各要素はバックフレーム１０５、フロントフレーム１０６内に収容してバックライト装置１００を構成している。   FIG. 4 shows a structure of a backlight device 100 as an illumination device incorporating the LED package 1 of the present embodiment, and FIG. 5 shows a cross section of the light introducing portion. A large number of LED packages 1 are mounted on a substrate 101 in an array to form a light source device 11. The light source device 11 composed of the substrate 101 on which the LED package 1 is mounted is disposed in the vicinity of the end surface serving as the light incident surface 102 a of the light guide plate 102. In FIG. 5, the light guide plate 102 has a lower surface side as a reflecting surface 102b and an upper surface side as a light emitting surface 102c. A reflective sheet 103 is disposed on the reflective surface 102b side of the light guide plate 102, and optical sheets 104 for light diffusion and condensing are disposed on the light emitting surface 102c side. These elements are housed in the back frame 105 and the front frame 106 to constitute the backlight device 100.

図５に詳しく示してあるように、ＬＥＤパッケージ１は基板１０１に実装されており、ＬＥＤパッケージ１の出光面５ａは導光板１０２の入光面１０２ａとほぼ対向した位置に配置されている。基板１０１は、薄く、かつ熱伝導率が高いほうが望ましい。この基板１０１にはＦＰＣを使用するのが一般的であるが、メタルベースの基板でベース金属を箔状にした基板を採用するとさらに有効である。   As shown in detail in FIG. 5, the LED package 1 is mounted on the substrate 101, and the light output surface 5 a of the LED package 1 is disposed at a position substantially opposite to the light incident surface 102 a of the light guide plate 102. The substrate 101 is desirably thin and has high thermal conductivity. Generally, an FPC is used for the substrate 101, but it is more effective to use a metal base substrate in which a base metal is formed in a foil shape.

基板１０１とバックフレーム１０５とは、両面テープ１０７で固定されている。両面テープ１０７は熱伝導性が良いほうが望ましい。両面テープの代りに熱伝導性が高く、かつ密着性の良いシリコーンなどの熱伝導シートを配置してもよい。ＬＥＤパッケージ１の放熱面５ｃは、バックフレーム１０５の側面と熱伝導性シート１０８で空気層が介在しないように接続されている。熱伝導性シート１０８は弾力性があった方が望ましい。熱伝導性シート１０８は、ＬＥＤパッケージ１の放熱面５ｃのみに配置してもよいし、バックフレーム１０５の側面に帯状の熱伝導性シートを配置してもよい。   The substrate 101 and the back frame 105 are fixed with a double-sided tape 107. The double-sided tape 107 desirably has good thermal conductivity. Instead of the double-sided tape, a heat conductive sheet such as silicone having high heat conductivity and good adhesion may be disposed. The heat radiation surface 5c of the LED package 1 is connected to the side surface of the back frame 105 and the heat conductive sheet 108 so that no air layer is interposed therebetween. It is desirable that the heat conductive sheet 108 has elasticity. The heat conductive sheet 108 may be disposed only on the heat dissipation surface 5 c of the LED package 1, or a belt-shaped heat conductive sheet may be disposed on the side surface of the back frame 105.

本実施の形態のＬＥＤパッケージ１及びそれを光源として用いたバックライト装置１００では、ＬＥＤパッケージ１の発光を効率良く導光板１０２に導くことができ、かつ、ＬＥＤパッケージ１の発熱を効率良くフレーム１０５に熱伝導してＬＥＤチップ２の温度上昇を抑えることができ、高効率で、かつＬＥＤチップ２の温度上昇を抑えることができるために、長期間に渡り使用が可能な信頼性の高いバックライト装置を実現することができる。   In the LED package 1 of the present embodiment and the backlight device 100 using the LED package 1 as a light source, the light emission of the LED package 1 can be efficiently guided to the light guide plate 102, and the heat generation of the LED package 1 can be efficiently performed by the frame 105. The highly reliable backlight that can be used for a long period of time because it is capable of suppressing the temperature rise of the LED chip 2 by conducting heat to the LED chip 2 and being highly efficient and capable of suppressing the temperature rise of the LED chip 2. An apparatus can be realized.

本発明の１つの実施の形態のＬＥＤパッケージの正面図、平面図、底面図、左側面図及び右側面図。The front view, top view, bottom view, left side view, and right side view of the LED package of one embodiment of the present invention. 上記実施の形態のＬＥＤパッケージの背面図。The rear view of the LED package of the said embodiment. 図１の正面図におけるＡ−Ａ線断面図。The AA sectional view taken on the line of the front view of FIG. 上記実施の形態のＬＥＤパッケージを光源として使用したバックライト装置の分解斜視図。The disassembled perspective view of the backlight apparatus which uses the LED package of the said embodiment as a light source. 上記実施の形態のバックライト装置における光源配置部分の拡大断面図。The expanded sectional view of the light source arrangement | positioning part in the backlight apparatus of the said embodiment.

符号の説明Explanation of symbols

１ ＬＥＤパッケージ
２ ＬＥＤチップ
３ａ，３ｂ 給電用パターン
３ｃ 放熱用パターン
４ａ，４ｂ 外部給電パターン
４ｃ 外部放熱パターン
５ａ 出光面
６ 封止樹脂
７ 給電用ワイヤ
９ 外囲器
１０ スルーホール
１１ 光源装置
１００ バックライト装置
１０１ 基板
１０２ 導光板
１０２ａ 入射面
１０２ｂ 反射面
１０２ｃ 発光面
１０３ 反射シート
１０４ 光学シート類
１０５バックフレーム
１０６フロントフレーム
１０７ 両面テープ
１０８ 熱伝導性シート DESCRIPTION OF SYMBOLS 1 LED package 2 LED chip 3a, 3b Power supply pattern 3c Heat dissipation pattern 4a, 4b External power supply pattern 4c External heat dissipation pattern 5a Light exit surface 6 Sealing resin 7 Power supply wire 9 Envelope 10 Through hole 11 Light source device 100 Backlight Device 101 Substrate 102 Light guide plate 102a Incident surface 102b Reflective surface 102c Light emitting surface 103 Reflective sheet 104 Optical sheets 105 Back frame 106 Front frame 107 Double-sided tape 108 Thermally conductive sheet

Claims (4)

ＬＥＤチップと、前記ＬＥＤチップを搭載する外囲器と、前記ＬＥＤチップを被覆する透明樹脂と、前記ＬＥＤチップに給電するための複数の給電部と、前記ＬＥＤチップの熱を放熱させる放熱部とを具備するＬＥＤパッケージにおいて、
前記給電部と放熱部とは、当該ＬＥＤパッケージの互いに異なる面に形成したことを特徴とするＬＥＤパッケージ。 An LED chip, an envelope on which the LED chip is mounted, a transparent resin that covers the LED chip, a plurality of power supply units for supplying power to the LED chip, and a heat dissipation unit that dissipates heat from the LED chip In an LED package comprising:
The LED package, wherein the power feeding unit and the heat radiating unit are formed on different surfaces of the LED package. 前記給電部は、前記ＬＥＤパッケージの出光面と直角な面に形成したことを特徴とする請求項１に記載のＬＥＤパッケージ。   The LED package according to claim 1, wherein the power feeding unit is formed on a surface perpendicular to a light emitting surface of the LED package. 請求項１又は２に記載のＬＥＤパッケージをその放熱部が配線用基板に接触する姿勢にて当該配線用基板上にアレイ配列した光源装置と、
前記光源装置の前記出光面からの光を側面から体内に導光し、体内にて散乱、反射によって表側の発光面から前記光源装置の出光面と直角な方向に出射させる導光板と、
前記光源装置と導光板とを収容するフレームとを具備した照明装置。 A light source device in which the LED package according to claim 1 or 2 is arrayed on the wiring substrate in a posture in which the heat dissipating part contacts the wiring substrate;
A light guide plate that guides light from the light exit surface of the light source device into the body from the side surface, and emits light in a direction perpendicular to the light exit surface of the light source device from the light emitting surface on the front side by scattering and reflection in the body;
An illuminating device comprising a frame for accommodating the light source device and the light guide plate. 前記ＬＥＤパッケージの放熱部と前記フレームとの間を熱伝導性材料によって接続したことを特徴とする請求項３に記載の照明装置。   The lighting device according to claim 3, wherein the heat dissipation portion of the LED package and the frame are connected by a heat conductive material.
JP2006298738A 2006-11-02 2006-11-02 Led package, and lighting device Abandoned JP2008117886A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010130008A (en) * 2008-11-25 2010-06-10 Chi Mei Lighting Technology Corp Side view type led package structure, and manufacturing method and application thereof
JP2010225381A (en) * 2009-03-23 2010-10-07 Kyocera Corp Light source device and liquid crystal display device equipped with light source device
WO2011125359A1 (en) * 2010-04-07 2011-10-13 シャープ株式会社 Led backlight
JP2014010920A (en) * 2012-06-27 2014-01-20 Sharp Corp Light source module and liquid crystal display device
US8684550B2 (en) 2009-01-07 2014-04-01 Samsung Display Co., Ltd. Light source, light-emitting module having the same and backlight unit have the same
JP2016033989A (en) * 2014-07-31 2016-03-10 株式会社アウトスタンディングテクノロジー Floodlight projector for spatial optical communication
CN105842912A (en) * 2015-02-02 2016-08-10 三星显示有限公司 Backlight unit and display device including the same
JP2017112147A (en) * 2015-12-14 2017-06-22 株式会社小糸製作所 Light-emitting module, lamp fitting, and circuit board for light-emitting elements

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2003168829A (en) * 2001-09-19 2003-06-13 Matsushita Electric Works Ltd Light emitting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168829A (en) * 2001-09-19 2003-06-13 Matsushita Electric Works Ltd Light emitting device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010130008A (en) * 2008-11-25 2010-06-10 Chi Mei Lighting Technology Corp Side view type led package structure, and manufacturing method and application thereof
US8684550B2 (en) 2009-01-07 2014-04-01 Samsung Display Co., Ltd. Light source, light-emitting module having the same and backlight unit have the same
JP2010225381A (en) * 2009-03-23 2010-10-07 Kyocera Corp Light source device and liquid crystal display device equipped with light source device
WO2011125359A1 (en) * 2010-04-07 2011-10-13 シャープ株式会社 Led backlight
JP2014010920A (en) * 2012-06-27 2014-01-20 Sharp Corp Light source module and liquid crystal display device
JP2016033989A (en) * 2014-07-31 2016-03-10 株式会社アウトスタンディングテクノロジー Floodlight projector for spatial optical communication
CN105842912A (en) * 2015-02-02 2016-08-10 三星显示有限公司 Backlight unit and display device including the same
JP2017112147A (en) * 2015-12-14 2017-06-22 株式会社小糸製作所 Light-emitting module, lamp fitting, and circuit board for light-emitting elements

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