200931550 九、發明說明 【發明所屬之技術領域】 本發明係關於爲了在基板上搭載驅動電路等半導體電 路元件，而於此基板上貼附向異性導電膜（ACF )之ACF 貼附裝置，包含此ACF貼附裝置之平面面板顯示器之製 造裝置及使用此平面面板顯示器之製造裝置所製造之平面 面板顯示器。 【先前技術】The present invention relates to an ACF attaching device for attaching an anisotropic conductive film (ACF) to a substrate in order to mount a semiconductor circuit element such as a driver circuit on a substrate, and the like. A flat panel display manufacturing apparatus of the ACF attaching apparatus and a flat panel display manufactured by the manufacturing apparatus using the flat panel display. [Prior Art]
平面面板顯示器之一爲液晶顯示器。液晶顯示器係於 上下2枚透明基板所構成的液晶面板之間封入液晶而構成 的。於液晶面板，成爲透過驅動電路被連接印刷電路板之 構成，驅動電路之內方側的電極被連接於液晶面板，外方 側的電極被連接於印刷電路板。作爲驅動電路的搭載方 式，以 TAB ( Tape Automated Bonding )方式與 COG (Chip On Glass)方式爲代表，無論哪一種都在液晶面板 的表面之至少2邊被形成配線圖案，此配線圖案之電極與 驅動電路之電極被導電連接。 驅動電路與液晶面板基板之間，驅動電路與印刷電路 板之間的導電連接，使用在具有黏性的黏接劑樹脂均勻分 散微小的導電粒子之ACF。藉由熱壓接此ACF，電極間透 過導電粒子被導電連接，而且藉由加熱使黏接劑硬化，使 驅動電路固定於液晶面板或印刷電路板。 藉由TAB方式將驅動電路搭載於液晶面板的場合， 200931550 在液晶面板的基板之被設有配線圖案的部位貼附ACF，將 作爲驅動電路的TCP (Tape Carrier Package) TAB搭載於 基板上。ACF爲黏接物質，所以透過剝離層被層積於紙帶 上，藉此構成ACF帶。亦即，在將ACF帶按壓於基板的 狀態下，僅剝離紙帶，即將ACF貼附於基板。 然而，在ACF未對基板確實貼附的狀態下由ACF帶 剝離紙帶的話，會有ACF被紙帶拉偏而由基板剝離的情 形。ACF被層積於紙帶之剝離層，於紙帶與ACF之間有 一定的密接力作用，在紙帶剝離時，ACF與紙帶一起受到 由基板剝離的力的作用會有ACF剝離的情形。此外，即 使在ACF未完全剝離的場合，也可能會有一部份產生浮 起或捲起，而引起全體之ACF貼附不良。亦即，將ACF 帶加熱/壓接於基板上時，必需ACF之全面確實移轉至 基板側，確實僅分離而剝離紙帶。 爲了提高ACF與基板之黏接強度，冷卻ACF與基板 之界面的技術揭示於專利文獻1。在專利文獻1中，加熱 ACF轉貼於基板側後，使ACF冷卻而將ACF對基板貼 附。加熱ACF後未充分冷卻而在短時間剝離ACF時會由 基板剝離下ACF，所以熱壓接ACF後強制冷卻ACF與基 板之界面提高黏接強度。 [專利文獻1]日本專利特開平1 1 - 242446號公報 【發明內容】 [發明所欲解決之課題] -6- 200931550 然而，在專利文獻1，爲了要將ACF確實貼附於基 板，進行加熱工程與冷卻工程這2道工程。亦即，因爲需 要2道工程，所以ACF的貼附工程變得複雜化，無法謀 求處理的迅速化。此外，爲了進行分別的工程而要求個別 獨立的構成，所以也招來機構的複雜化或高成本化的問 題。 此處，作爲ACF —般適於使用熱融式的黏接樹脂。 熱融式之黏接樹脂，在常溫下維持高黏度狀態（固形或接 近半固形的狀態），藉由對黏接樹脂加熱使成爲溶融狀 態，沾溼擴開於被附著體。溶融而沾溼擴開的黏接樹脂具 有黏接性，在物體間藉由黏接力發揮使接合之力。亦即， 熱融式的黏接樹脂，在加熱溶融的時間點發揮黏接力。 也就是說，藉由對ACF之黏接樹脂進行加熱至某個 溫度爲止，發揮一定的黏接力而在ACF與基板間使密接 力作用，所以只要能使黏接樹脂在溶融時發揮的黏接力比 剝離紙帶時之力更爲強力，即可在紙帶剝離時使ACF移 轉至基板側。總之，可以不需要特別的冷卻工程，而確實 將ACF貼附於基板。 在此，本發明的目的在於避免工程或機構的複雜化、 高成本化，在剝離紙帶時使ACF對基板確實貼附。 [供解決課題之手段]One of the flat panel displays is a liquid crystal display. The liquid crystal display is composed of a liquid crystal sealed between liquid crystal panels composed of two upper and lower transparent substrates. In the liquid crystal panel, a printed circuit board is connected through a drive circuit, and an electrode on the inner side of the drive circuit is connected to the liquid crystal panel, and an electrode on the outer side is connected to the printed circuit board. As a mounting method of the driving circuit, a TAB (Tape Automated Bonding) method and a COG (Chip On Glass) method are representative, and a wiring pattern is formed on at least two sides of the surface of the liquid crystal panel, and the electrode of the wiring pattern is The electrodes of the drive circuit are electrically connected. The conductive connection between the driving circuit and the liquid crystal panel substrate, between the driving circuit and the printed circuit board, is used to uniformly disperse the ACF of the minute conductive particles in the adhesive resin. By thermally bonding the ACF, the electrodes are electrically connected to each other through the conductive particles, and the adhesive is hardened by heating to fix the driving circuit to the liquid crystal panel or the printed circuit board. When the driving circuit is mounted on the liquid crystal panel by the TAB method, the ACF is attached to the substrate on which the wiring pattern is provided on the substrate of the liquid crystal panel, and the TCP (Tape Carrier Package) TAB as the driving circuit is mounted on the substrate. Since ACF is an adhesive substance, it is laminated on the paper tape through the peeling layer, thereby constituting the ACF tape. That is, in a state where the ACF tape is pressed against the substrate, only the tape is peeled off, that is, the ACF is attached to the substrate. However, if the paper tape is peeled off by the ACF tape in a state where the ACF is not attached to the substrate, the ACF may be peeled off by the paper tape to be peeled off from the substrate. ACF is laminated on the release layer of the paper tape, and has a certain adhesive force between the paper tape and the ACF. When the paper tape is peeled off, the ACF is peeled off by the force of the substrate together with the paper tape. . In addition, even if the ACF is not completely peeled off, a part of the ACF may be floated or rolled up, causing a poor attachment of the entire ACF. That is, when the ACF tape is heated/crimped on the substrate, it is necessary to completely transfer the ACF to the substrate side, and it is only separated and peeled off. A technique for cooling the interface between the ACF and the substrate in order to increase the adhesion strength between the ACF and the substrate is disclosed in Patent Document 1. In Patent Document 1, after the ACF is heated and attached to the substrate side, the ACF is cooled and the ACF is attached to the substrate. After the ACF is heated, it is not sufficiently cooled, and when the ACF is peeled off for a short time, the ACF is peeled off from the substrate. Therefore, the interface between the ACF and the substrate is forcibly cooled by the thermocompression bonding of the ACF to improve the bonding strength. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Engineering and cooling engineering are two projects. That is, since two projects are required, the attachment work of the ACF is complicated, and the processing cannot be speeded up. In addition, in order to carry out separate projects, individual structures are required, and problems such as complication of the organization and high cost are also incurred. Here, as the ACF, a hot-melt adhesive resin is generally used. The hot-melt adhesive resin maintains a high viscosity state (solid or nearly semi-solid state) at a normal temperature, and is melted by heating the adhesive resin, and is wetted to spread to the adherend. The adhesive resin which is melted and wetted has adhesiveness, and the bonding force is exerted by the adhesive force between the objects. That is, the hot-melt adhesive resin exerts a bonding force at the time of heating and melting. In other words, when the adhesive resin of ACF is heated to a certain temperature, a certain adhesive force is exerted to cause an adhesive force between the ACF and the substrate, so that the adhesion of the adhesive resin during melting can be achieved. The force is stronger than when the tape is peeled off, so that the ACF can be transferred to the substrate side when the tape is peeled off. In summary, the ACF can be attached to the substrate without the need for special cooling engineering. Here, an object of the present invention is to avoid complication and cost of engineering or a mechanism, and to reliably attach the ACF to the substrate when the paper tape is peeled off. [Means for solving the problem]
本發明之申請專利範圍第1項之ACF貼附裝置’具 有：對基板的表面將透過紙帶之剝離層保持ACF之ACF 200931550 帶加壓於前述基板的表面之加壓手段、使抵接前述基板的 內面而水平狀態地支撐前述基板的基板承接手段、及以成 爲比前述加壓手段更高的溫度且爲ACF不熱硬化的溫度 的方式，加熱前述基板承接手段的承接側加熱手段。 將ACF貼附於基板時，爲了加熱ACF使其溶融或者 至少使其軟化而提高與基板之密接性，所以加熱壓接 ACF。ACF被層積於紙帶之剝離層，所以ACF與紙帶之密 ^ 接性變弱，加熱壓接ACF的話，通常可以將ACF貼附於 ❹ 基板，而剝離紙帶。但是爲了更爲確實達成ACF對基板 之貼附與由紙帶之剝離，在申請專利範圍第1項之ACF 貼附裝置，設有以比加壓手段更高的溫度加熱基板承接手 段之承接側加熱手段。藉此，抵接於基板之面（承接側抵 接面）之溫度比ACF之被層積於紙帶的面（加壓側抵接 面：藉由加壓手段加壓之側的面）之溫度還要高，可以使 其具有溫度梯度。藉由此溫度梯度，可以使ACF之承接 φ 側抵接面的黏接力比加壓側抵接面之黏接力還要高。而 且，ACF之加壓側抵接面被層積於紙帶之剝離層，所以容 易剝離，可以使ACF對基板更確實地移轉。接著，不需 ' 要冷卻處理等特別的處理，可以避免工程或機構的複雜 ' 化、高成本化。 承接側加熱手段之溫度有必要爲ACF不熱硬化的溫 度。ACF之貼附階段，在驅動電路之接續階段之前進行， 在此階段ACF之黏接樹脂熱硬化的話，分散於其之導電 粒子爲熱硬化的黏接樹指所覆蓋’有可能對於基板與驅動 -8- 200931550 電路之間的導電連接不再有所貢獻。但是，如果是 不熱硬化的溫度的話，例如在短時間加熱基板的場名 亦可使承接側加熱手段的溫度加熱至ACF不熱硬化 度或者其附近的溫度。 本發明之申請專利範圍第2項之ACF貼附裝置 於申請專利範圍第1項之ACF貼附裝置，具有以前 壓手段成爲常溫以上的溫度的方式，加熱前述加壓手 加壓側加熱手段。 根據申請專利範圍第2項之ACF貼附裝置的話 由加壓側加熱手段將加壓手段加熱，加壓手段的溫度 高。加壓手段爲低溫狀態的場合，ACF之熱被加壓手 吸收而使ACF的溫度降低。此外，爲了謀求處理之 化，必須使ACF迅速成爲溶融狀態，所以藉由使加 段也具有熱，可以迅速地使ACF成爲溶融狀態。但 因爲ACF之加壓側抵接面與承接側抵接面之間具有 梯度，所以加壓側加熱手段以並不是那麼高的溫度（ 常溫高上若干的溫度較佳）進行加熱。 本發明之申請專利範圍第3項之ACF貼附裝置 於申請專利範圍第1項之ACF貼附裝置，特徵爲在 基板上形成複數電極群，設有供給ACF帶的供給捲 及把被保持於從此供給捲軸所送出的ACF帶之ACF 爲對前述基板的各個之電極群的貼附長度份之半切 段；以至少具有對各個的電極群之ACF的貼附長度 方式構成前述加壓手段，於前述基板的各電極群個別 ACF 等， 的溫 ，係 述加 段之 ，藉 也變 段側 迅速 壓手 是， 溫度 以比 ，係 前述 軸、 切斷 割手 份的 地貼 -9 - 200931550 附 ACF。 作爲將ACF貼附於基板的手法，以把及於基板的i 邊之全長的ACF —次貼附之統括貼附爲主流，如申請專 利範圍第3項之ACF貼附裝置那樣分割爲每個電極群而 進行個別地貼附ACF之分割貼附亦是可以的。被形成於 基板的微小間距的電極，於每個驅動電路特定數之電極構 成作爲1個集團之群，各電極群，再與鄰接的電極群之間 被形成空白區域。於空白區域沒有必要貼附ACF，所以藉 由採用在不必要的空白區域不貼附ACF之分割貼附，藉 由防止材料的浪費，或者在空白區域使構成ACF的黏接 性樹脂與導電粒子露出，可以避免對搭載驅動電路後之處 理或加工產生不良情形。 分割貼附的場合，以提高紙帶的方式使其動作，由紙 帶滑切 ACF的方式進行剝離。因此，剝離紙帶時，於 ACF由基板剝離的方式之力的作用變大。因此，藉由承接 側加熱手段加熱基板，使ACF之承接側抵接面之黏接力 變強，可以在使 ACF確實貼附於基板的狀態，剝離紙 帶。 本發明之申請專利範圍第4項之ACF貼附裝置，係 如申請專利範圍第3項之ACF貼附裝置，特徵爲以至少 具有對各個的電極群之ACF的貼附長度份的方式構成前 述基板承接手段，使與前述加壓手段對向，在對前述加壓 手段接近•離開的方向上獨立而進行昇降動作的方式設置 驅動前述基板承接手段的承接側昇降驅動手段。 -10- 200931550 根據申請專利範圍第4項之ACF貼附裝置，使基板 承接手段的長度爲1枚ACF貼附長度份之程度，而使基 板承接手段升降動作。亦即藉由基板承接手段與加壓手段 二者之升降動作壓接ACF，可藉以跨幾乎全面而作用均勻 的加壓力。藉此，發揮了可以避免貼附不良產生的效果。 本發明之申請專利範圍第5項之ACF貼附裝置，特 徵爲以具有及於前述基板的全長且成爲固定的狀態之方式 構成前述基板承接手段。 根據申請專利範圍第5項之ACF貼附裝置，使基板 承接手段之長度爲及於基板全長的長度，而基板承接手段 爲固定的狀態。因此，進行升降動作者僅有加壓手段，基 板承接手段可以成爲總是抵接於基板的狀態。亦即，藉由 加壓手段壓接時，基板已經是被加熱的狀態’所以可迅速 使ACF之承接側抵接面之溫度成爲高溫狀態。藉此，可 以謀求處理之效率化。此外，基板與基板承接手段成爲總 是抵接的狀態，所以可以使基板之溫度分佈變得均勻。亦 即，可以進行安定的溫度管理。 本發明之申請專利範圍第6項之平面面板顯示器之製 造裝置，具有申請專利範圍第1至5項之任一項之ACF 貼附裝置。此外，本發明之申請專利範圍第7項之平面面 板顯示器，係藉由申請專利範圍第6項之平面面板顯示器 之製造裝置所製造的。ACF貼附裝置可以適用於平面面板 顯示器之製造裝置，平面面板顯示器可以適用於液晶顯示 器或電漿顯示器、有機EL顯示器等。 -11 - 200931550 [發明之效果] 本發明藉由設置承接側加熱手段來加熱基板，藉 熱與基板抵接的ACF之承接側抵接面，提高基板與 之間的黏接力。藉此，可以不需要冷卻工程或冷卻機 而在紙帶剝離時確實將ACF貼附於基板。 【實施方式】 以下，參照圖面說明本發明之實施型態。首先， 1作爲ACF被貼附的基板之一例顯示液晶面板，此外 透過ACF搭載之半導體電路裝置之一例，顯示於基 TAB搭載的TCP所構成的驅動電路。又，基板不僅 成液晶面板者，亦可爲其他顯示器用之基板，或其他 印刷電路板，此外被搭載於基板者不限於驅動電路， 是透過ACF被導電連接者即可。 於圖1，1係液晶面板，此液晶面板1，係以由玻 板所構成的下基板2與上基板3 —起構成，於兩基板 間被封入液晶。下基板2，於其至少2邊，由上基板 伸出特定寬幅份，於此伸出部2a被搭載複數枚在薄 板4a實裝積體電路元件4b之驅動電路4。 於下基板2之伸出部2a，被設有在兩基板2、3 疊的部位所形成的TFT (薄膜電晶體）分別連接之配 連接的特定數目的電極，這些電極，如圖中之符號 示，於驅動電路4之各搭載部特定數目之電極被形 由加 ACF 構， 於圖 作爲 板被 是構 各種 只要 璃薄 2、3 3僅 膜基 被重 線所 5所 成爲 -12- 200931550 群。接著，各電極群5之左右兩側被形成對準標記6a、 6a。亦即，相鄰皆的電極群5、5間被形成具有特定寬幅 之空白區域。另一方面，於驅動電路4，設有與構成這些 電極群5的各電極導電連接的複數電極，與電極群5連接 的電極群以符號7表示。此外，驅動電路4也在電極群7 的左右兩側被形成對準標記6b、6b，驅動電路4被搭載於 液晶面板1時，以這些對準標記爲基準以構成電極群7的 各電極與構成電極群5的各電極成爲一致的方式調整位 置。 驅動電路4透過ACF 8被搭載於液晶面板1。ACF 8 如眾所周知的，係在具有黏接功能的黏接樹脂分散多數微 小的導電粒子者，藉由在驅動電路4與液晶面板1之間加 熱及加壓ACF 8，透過導電粒子使得構成電極群5的各電 極與構成電極群7的各電極成爲電氣導通狀態，而且藉由 黏接樹脂進行熱硬化，使驅動電路4固接於液晶面板1。 此處，ACF 8被分割於設在下基板2之伸出部2a之電極 群5之各位置，於每長度L份被貼附。藉此，可以無浪費 地使用ACF 8，而且被貼附的ACF幾乎完全藉由驅動電路 4覆蓋" 圖2至圖4顯示在供在下基板2之伸出部2a貼附 ACF 8之用的貼附機構之槪略構成。於這些圖，9係將液 晶面板1保持於水平狀態之支撐基台。液晶面板1，例如 藉由真空吸附手段，安定地被保持於此支撐基台9上。此 處，於支撐基台9液晶面板1係以寬廣的面積抵接，被貼 -13- 200931550 附AC F 8的下基板2的伸出部2a的下部位置是開放的。 此處，於支撐基台9，可以爲了與驅動電路4之位置對準 等的用途，設置往X、Y、0方向之位置調整手段。 此外，10係ACF 8之往液晶面板1的貼附單元，此 貼附單元1 〇係由設在鉛直方向的板體所構成，供給捲軸 1 1係可拆裝地被安裝著。ACF 8被層積於紙帶12之剝離 層上構成ACF帶13，此ACF帶13被捲繞於供給捲軸 1 1。ACF帶13，沿著安裝於貼附單元1〇的輥14〜17所 構成的行進路線被導引前進。進而，18係驅動用輥，挾持 將ACF 8貼附於液晶面板1之後的紙帶12，以送入排出 部1 9的方式被驅動。 輥14、15係ACF帶13之饋送用的導引輥，導引輥 15被安裝於搖擺臂20，此搖擺壁20係以旋轉軸21爲中 心進行擺動。於轉動軸21被連接著馬達等驅動手段（未 圖示）’使搖擺臂20往箭頭F方向搖動時，由供給捲軸 1 1至少送出次貼附份，亦即圖1所示之長度L之份量的 ACF帶13被送出，被供給至輥14、15間。結果，饋送 ACF帶13時作用的反力總是成爲一定，不會隨著供給捲 軸11的捲繞量的差異所導致對饋送力的阻力改變。 輥16、17亦如圖5及圖6所示，係將ACF帶13於 其行進路線導引於水平方向，規定ACF 8之往液晶面板1 之1次份量之貼附長度的水平導引輥。水平導引輥1 7規 定ACF 8之貼附開始位置，水平導引輥〗6規定ACF 8之 貼附終點位置，藉由這些設定ACF 8之貼附區域。這些水 -14- 200931550 平導引輥1 6、1 7由圖6可知係於圓筒部1 6a、1 7a之兩側 部形成鍔部16b、17b者’此鍔部16b、17b之由圓筒部 16a、17a突出的部位的高度與ACF帶13之紙帶12的厚 度份量幾乎相同，或者是僅比其稍大的尺寸。 亦即，在水平導引輥16、1 7間ACF 8被貼附於液晶 面板1，其後由紙帶12分離。接著，在比水平導引軌1 7 更爲下游側的位置，剝離ACF 8後的紙帶1 2被回收。比 _ 藉由水平驅動輥16、17所區隔的ACF 8之貼附區域更下 0 游側的位置設有驅動用輥18。驅動用輥18係由驅動輥 18a與間距輥18b所構成，紙帶12被挾持於這些驅動輥 18a與間距輥18b之間。藉由旋轉驅動驅動輥18a，使 ACF帶12每長度L份量地被斷續饋送。 由圖3可知，貼附單元10被安裝於升降驅動部22, 此升降驅動部22被安裝於前後驅動部23，進而前後驅動 部23被安裝於構成搬送手段的平行移動驅動部24。藉由 ϋ 這些機構，可以使藉由ACF帶13之拉繞路徑之水平導引 輥1 6〜17間（參照圖2 )所規定的ACF 8的貼附區域在 上下方向，亦即Ζ軸方向，在水平面則可以在X軸方向 (與電極群5的排列直交的方向）與Υ軸方向（電極群5 之排列方向）上移動。另一方面，液晶面板1藉由真空吸 附被固定地保持於支撐基台9上。 此處，有必要調整水平導引輥1 6〜1 7間之ACF帶1 3 與下基板2之電極群5之相對位置，但前後移動驅動部 23，係使貼附區域對液晶面板1移動於接近/遠離的方向 -15- 200931550 者’平行移動驅動部24係移動於液晶面板1之與電極群5 的排列方向平行的方向，亦即係於γ軸方向使貼附區域移 動者’所以雖可在貼附單元1 0側可進行位置調整，但如 前所述，於支撐基台9設有往χ、γ、0方向的位置調整 手段的場合，在這支撐基台9側對A C F帶1 3可以進行位 置對準。 升降驅動部22 ’具有傾斜塊30、及使此傾斜塊30移 動於前後方向之用的汽缸31。此外，於貼附單元1〇被連 結者卡合於傾斜塊3 0的傾斜面之滑動構件3 2，此滑動構 件3 2具有與傾斜塊3 0 —致的傾斜面，藉由限制桿3 3而 成爲除上下方向以外無法位移之構成。亦即，藉由驅動汽 缸31’貼附單元10可以在上下方向上位移。此處，取代 汽缸31而使用馬達亦可。 接著，前後移動驅動部2 3，係供使安裝傾斜塊3 0的 台座34前後移動之用者，此台座之往復移動係藉由汽 缸、馬達等所構成的驅動手段35來進行的。接著，水平 移動驅動部24，具有台座34以及安裝了其驅動手段35之 搬送台36，搬送台36藉由以馬達38旋轉驅動構成滾珠螺 桿饋送手段的滾珠螺桿37，而使貼附單元10可以移動於 液晶面板1之與電極群5的排列方向平行的方向上。 於安裝於貼附單元10的ACF帶12之行進路線，如 圖8所示，在比水平導引輥1 6的位置稍微下游側的位置 設有半切割手段40，此半切割手段40係對貼附單元1 〇的 表面可在前後方向往復移動地被安裝著。此半切割手段40 -16- 200931550 如圖7所示，具備切刃4i與切刃承接42，切刃41如該圖 箭頭所示’以軸43爲中心在接近/遠離切刃承接42的方 向上可以轉動。接著，總是藉由作用於切刃41的彈簧44 之彈力保持離開切刃承接42的狀態，藉由設在汽缸45的 壓動輥46將切刃41壓動於抵抗彈簧44的方向上，而使 其擺動位移於接近切刀承接42的方向。接著，切刃41在 最接近切刃承接42的位置，其間被形成爲與ACF帶13 之紙帶12的厚度相同，或者比其稍微短的間隔。藉此， 僅有ACF 8被半切割。 進而，爲了使ACF 8貼附於下基板2之伸出部2a， ACF帶13在水平導引輥16、17間的位置，藉由特定壓力 被壓接於下基板2的表面。因此，在貼附單元10，如圖8 及圖9所示，設有壓接頭50。此處，液晶面板1係被載置 於支撐基台9上，但其下基板2之伸出部2a由支撐基台9 伸出，壓接頭50成爲由上下挾持此伸出部位的構成。 壓接頭50係由作爲加壓手段之加壓刃5 1與作爲基板 承接手段之承接刃52所構成，這些加壓刃51及承接刃 52，分別被安裝於升降塊53、54 ’這些升降塊53、54沿 著設於貼附單元1〇的一對導引軌55可於上下方向位移地 被安裝著。這些加壓刃51與承接刃52係夾著液晶面板1 被配置於上下，被形成爲相同長度。加壓刃51’進而被導 引於水平導引軌1 6、1 7間而被配置在比水平方向上移動 的ACF帶13更爲上方的位置。又，升降塊53、54係成 爲使共通的導引軌55進行升降動作的方式構成’但是亦 -17- 200931550 可設置對應於分別的升降塊53、54之獨立的導引軌。 安裝承接刃52的升降塊54，藉由汽紅50進行特定行 程長度之升降動作。亦即，使汽缸56爲縮小狀態時’承 接刃52下降，成爲被配置在遠離液晶面板1的下方位 置，使汽缸45伸長的話，承接刃52抵接於液晶面板1之 下面。另一方面，在安裝加壓刃51的升降塊53，加壓手 段5 7被連結設置。圖示之加壓手段5 7，係具有以馬達驅 動的饋送螺桿57a，構成所謂的千斤頂（jack) °此加壓 手段5 7，使連結於加壓刃5 1而設的升降塊5 3沿著導引軌 55上下移動，使被承接於承接刃52上的液晶面板1由上 方被作用特定的加壓力。接著，加壓刃51與承接刃52係 以正確地保持平行度的方式構成的。此外，支撐承接承接 刃52的汽缸56，至少在上升行程端位置，不會因加壓手 段57所作用的加壓力而無謂地移動，被導入可以保持伸 長狀態之壓力。 構成壓接頭50的加壓刃51與承接刃52之雙方，內 藏有分別作爲加壓側加熱手段之加壓側加熱器5 1 Η與承接 側加熱手段之承接側加熱器52Η。成爲藉由加壓側加熱器 51Η之熱而加熱加壓刃51，藉由承接側加熱器52Η之熱 而加熱承接刃52的狀態。承接側加熱器52Η之加熱溫度 被設定爲比加壓側加熱器5 1之加熱溫度還要高。因此， 承接刃52成爲比加壓刃5 1更高溫的狀態。加壓側加熱器 5 1 Η與承接側加熱器52Η爲熱源，例如將來自未圖示的電 力供給源之電力變換爲熱能而發熱。 -18 - 200931550 亦即，藉由被加熱的加壓刃51與承接刃52由上 向將ACF帶13熱壓接於液晶面板1。承接側加熱器 加熱的溫度，設定成爲ACF 8不熱硬化的程度之溫度 即，不設定爲相當高的溫度，而設定爲ACF 8之黏接 溶融而發揮黏接力的程度的溫度（例如，14(TC前後 另一方面，加壓側加熱器5 1 Η加熱的溫度比承接側加 5 2Η加熱的溫度還要低溫，設定爲不使被加熱的ACF 溫度降低的程度之溫度（例如5 0 °C前後）。接著，構 接頭50的加壓刃51以及承接刃52，具有可充分 ACF帶13的寬幅之寬幅尺寸，而且於長度方向之尺 少具有ACF 8之貼附長度L。 如以上所述，於貼附單元1 〇，被安裝有供給 1 1、由此供給捲軸1 1供給的ACF帶13之行進路線 切割手段40及壓接頭50。藉由此ACF貼附裝置，在 面板1之下基板2的伸出部2a對被形成特定數目的 群5被貼附供進行TAB搭載驅動電路4之用所必 ACF 8。 因而，於支撐基板9上被貼附ACF 8的液晶面板 平狀態地被配置於特定位置而被吸附保持。在此狀態 液晶面板1之下基板2，圖4所示之伸出部2a由支撐 9突出，於此伸出部2a被搭載特定枚數之驅動電路4 此，藉由滾珠螺桿7而被安裝貼附機構的貼附單元i 每隔圖1所示之間距P在箭頭方向上被間斷饋送。 於液晶面板1被依序貼附長度L份量之ACF 8， 下方 52H 。亦 樹脂 )° 熱器 8的 成壓 對應 寸至 捲軸 、半 液晶 電極 要的 1水 ，於 基台 。因 0以 因此 -19- 200931550 構成平行移動驅動部24之搬送台36被驅動’而貼附單元 10被位移至特定的貼附區域。此時’如圖8及圖9之箭頭 所示，藉由升降驅動部22使貼附單元10保持於上升位 置。構成壓接頭50的加壓刃51保持於上升位置，承接刃 52保持於下降位置。藉此，這些加壓刃51及承接刃52係 與液晶面板1保持在非接觸狀態，貼附單元1 〇之移動圓 滑地進行，不會產生對液晶面板1等同於造成損傷的情 β 況。此外，ACF帶1 3成爲由液晶面板1離開，即使讓半 切割手段40由貼附單元10的表面往前方突出，也不會與 液晶面板1產生干涉。亦即，進行ACF帶13之半切割。 藉由進行此半切割，ACF帶13之被半切割的位置成爲貼 附終點位置，貼附前次ACF 8的端部係貼附開始位置。亦 即，水平導引輥1 7被配置於貼附開始位置，此外水平導 引輥1 6被配置於貼附終點位置。 其後，在使半切割手段40避讓之後，如圖10、圖11 0 箭頭所示，藉由升降驅動部22使貼附單元10下降’使 ACF帶13之中，水平導引軌16、17間的部位配置於接近 液晶面板1之下基板2的表面的位置。其後，使汽缸56 洞做，使升降塊54上升，如圖12、13所示，使承接刃52 抵接於液晶面板1之內面。使承接刃5 2抵接於液晶面板1 的內面時，藉由承接側加熱器52Η加熱承接刃52，所以 在使承接刃52抵接於下基板2的時間點，由薄的玻璃板 所構成的下基板2被加熱而成爲高溫狀態》 在此，承接刃52並未及於液晶面板1之全長，1次的 -20- 200931550 動作使ACF 8被限定於貼附的區域所對應的位置。接著， 如圖14、15之箭頭所示，藉由使加壓手段57動作，使加 壓刃51下降，藉由壓動ACF帶13之紙帶12，使ACF 8 壓接於下基板2。 加壓刃51壓動ACF帶13時，加壓刃51與ACF帶 1 3爲接觸狀態，但加壓刃51藉由加壓側加熱器5 1 Η加熱 而成爲某種程度被加熱之狀態，所以熱也被傳達到紙帶1 2 之剝離層。隨著紙帶1 2的種類不同，藉由對剝離層供熱 而會使A C F 8變得容易由紙帶1 2之剝離層剝離。因此， 對紙帶12之剝離層提供熱，而ACF 8與紙帶12之密接力 弱化成爲可以容易剝離的狀態。 接著，在此狀態，藉由加壓刃51使ACF帶13被壓 接於下基板2。下基板2藉由承接側加熱器52H之加熱成 爲高溫狀態，所以熱被傳達至ACF 8而開始被溶融。此 時，ACF 8爲很薄的膜具有特定的厚度，所以由ACF 8之 承接側抵接面（ACF 8之與下基板2之抵接面）徐徐被溶 融，產生承接側抵接面側比較高溫，而加壓側抵接面側 (ACF 8之被層積於紙帶12的面）爲比較低溫之溫度梯 度。此面逐漸被溶融時，黏接樹脂的黏度降低，沾溼擴開 於下基板同時發揮黏接力。如此一來，ACF 8與下基板2 之間有黏接力起作用，二者成爲密接狀態。 另一方面，加壓刃5 1也藉由加壓側加熱器5 1 Η加 熱，所以熱也被傳達至ACF 8之加壓側抵接面。但是，加 壓側加熱器5 1 Η係以不使ACF 8的溫度降低的程度之較低 200931550 的溫度下進行加熱’所以即使熱被傳達至ACF 8的加壓側 抵接面，此面也不會溶融。亦即’ ACF8與紙帶12之間作 用的黏接力很小。相反地’藉由加熱剝離層，使得剝離變 得容易。 爲了藉由加壓刃51使特定的加壓力作用於液晶面板 1，而驅動構成加壓手段57之饋送螺桿57a。在此，液晶 面板1之下基板2係由薄的玻璃板所構成，容許某種程度 ^ 的變形，而且被挾持於長度相同，而且被正確保持平行度 〇 之加壓刃51與承接刃52之間。亦即，於此挾持時，液晶 面板1之中之被挾持的部位成爲仿效這些加壓刃51與承 接刃52所構成的壓接頭50。接著，加壓刃51、或者承接 刃52也都實質上被限定於ACF帶13之貼附起點位置至 終點位置爲止之部位，所以於ACF帶1 3對加壓刃51之 抵接部全體上變成作用著均等的加壓力，而且從ACF 8存 在的被半切割的貼附終端位置並不會對基端側作用加壓 ❹ 力。 ACF8被壓接於下基板2時，解除根據壓接頭50之對 ACF帶13之加壓力。接著，驅動汽缸56，使承接刃52 ' 位移至下降位置。奇後，使升降驅動部22上升，但此時 如圖16之箭頭所示，與升降驅動部22 —起驅動前後移動 驅動部23，使對ACF帶12之寬幅方向被拉上至斜上方的 方式使其動作的話，紙帶1 2以由ACF8滑切的方式被剝 離。 進行ACF8的分割貼附時，以滑切ACF8的方式進行 -22- 200931550 剝離，所以被紙帶12拉引而對ACF8大大地作用由下基 板2剝離之力（與紙帶12 —起被拉往斜上方的力）。但 是，此時之ACF8之狀態，成爲承接側抵接面藉由黏接力 密接於下基板2的狀態，加壓側抵接面成爲容易由紙帶1 2 剝離的狀態，所以ACF8成爲確實貼附於下基板2的狀 態。 藉由以上，結束對下基板2伸出部2a之1個電極群5 之ACF8的貼附。保持貼附單元10於使其上升的位置， 使驅動用輥1 8動作，由供給捲軸1 1拉出ACF帶1 3而僅 饋送1個間距份量。接著，使平行移動驅動部24動作， 使貼附單元1 0移動1個間距的份量，亦如圖1使其移動 僅間隔P所示之份量。接著，保持液晶面板1之基板支撐 台9不移動。在此狀態藉由反覆進行與前述同樣的動作， 依序對電極群5進行ACF8之貼附。 此處，加壓刃51與承接刃52係採用分別藉由升降塊 (block) 53、54而升降驅動者。亦即，這些升降塊53、 54係沿著設在貼附單元1 〇的導軌5 5而上下移動，加壓刃 51與承接刃52總是以正確保持平行度的狀態由上下挾持 下基板2。於液晶面板1在η個處所形成電極群5的場 合，也隔離著由最初之ACF8之貼附位置至最終之ACF 8 之貼附位置爲止之距離（η · Ρ)份，所有都是以幾乎相同 的條件壓接ACF 8。亦即，不論是小尺寸者，或者是大型 的液晶面板1，對所有的電極群5都可以藉由均等的加壓 力貼附ACF 8，不會發生壓接不良。又，使兩升降塊53、 -23- 200931550 54被導引於相同的導軌55但是沒有共用導軌55的必要。 另一方面，如圖17所示，將承接刃152安裝於支撐 機台9，將承接刃152配置於與支撐機台9相等高度的位 置，以使其具有及於下基板2的全長的長度的方式構成亦 爲可能。接著，以及於承接刃152之全長的方式設置承接 側加熱器1 52H。在此場合，將液晶面板1載置於支撐機 台9時成爲總是被加熱的狀態，變成僅加壓刃51進行升 φ 降動作。藉由使承接刃152如此般地構成，而謀求安定的 溫度管理與處理之迅速化。 總之，因爲承接刃152係被固定住，所以可使其成爲 總是使下基板抵接於承接刃152的狀態。因爲成爲承接刃 1 52藉由承接側加熱器1 52H加熱的狀態，所以總是抵接 於承接刃152的下基板2也成爲總是被加熱的狀態。而 且，因爲承接刃152具有及於下基板2的全長之長度，所 以被形成電極群5的下基板2之部位跨全長能夠以均勻的 Q 溫度分佈來加熱。因此，安定的溫度管理成爲可能。此 外，下基板2係總是被加熱的狀態，所以不需要供加熱下 基板2之用的時間。因而，可以迅速進行ACF 8之貼附， 所以有助於處理之迅速化。亦即，使承接刃152以進行升 降動作的方式進行設定，或者是設定爲被固定的狀態之選 擇，可以隨著目的不同而任意選擇。 此外，於前述，針對分割貼附ACF的機構加以說 明，但進行統括貼附之機構也可以適用本發明。分割貼附 的場合使ACF之尺寸爲每個電極群之貼附長度份，在統 -24- 200931550 括貼附的場合爲及於下基板全長之長度份。即使統括貼附 的場合，也必須要把ACF由紙帶剝離，所以在紙帶剝離 時對ACF作用著由下基板剝離之力。亦即，藉由使其成 爲藉承接側加熱器而加熱下基板的狀態，使下基板與ACF '之間作用著黏接力而使兩者成爲密接狀態的話，即使統括 '貼附的場合也可以在使ACF確實貼附於下基板的狀態下 剝離紙帶。 ❹ 【圖式簡單說明】 圖1係顯示作爲被貼附ACF的基板之液晶胞，與被 搭載於此基板的驅動電路之重要部位平面圖。 圖2係顯示ACF貼附機之槪略構成之正面圖。 圖3爲圖2之左側面圖。 圖4爲圖2之平面圖。 圖5係水平饋送輥之構成說明圖。 Q 圖6係顯示水平饋送輥的構成之側面圖。 圖7係切割單元之構成說明圖。 圖8係顯示ACF帶之半切割狀態之ACF貼附機之重 要部位擴大正面圖。 圖9爲圖8之左側面圖。 圖1 0係顯示貼附單元的下降狀態之ACF貼附機的重 要部位的擴大正面圖。 圖1 1爲圖1 〇之左側面圖。 圖12係顯示承接刃的上昇狀態之ACF帶貼附機之重 -25- 200931550 要部位擴大正面圖。 圖13爲圖12之左側面圖。 圖14係顯示ACF帶之壓接狀態之ACF貼附機之重要 部位擴大正面圖。 圖15爲圖14之左側面圖。 圖1 6係顯示剝離ACF帶之紙帶的狀態之說明圖。 圖17係顯示承接刃之其他例之說明圖。The ACF attaching device of the first aspect of the present invention has an ACF 200931550 for holding the ACF of the peeling layer of the paper through the surface of the substrate, and a pressing means for pressurizing the surface of the substrate to abut the aforementioned The substrate receiving means for supporting the substrate in a horizontal state on the inner surface of the substrate, and the receiving side heating means for heating the substrate receiving means so as to have a higher temperature than the pressing means and a temperature at which the ACF is not thermally cured. When the ACF is attached to the substrate, the ACF is heated and pressure-bonded in order to heat the ACF to melt or at least soften it to improve the adhesion to the substrate. Since the ACF is laminated on the release layer of the paper tape, the adhesion between the ACF and the paper tape is weakened. When the ACF is heated and crimped, the ACF can be attached to the ruthenium substrate to peel off the paper tape. However, in order to more reliably achieve the adhesion of the ACF to the substrate and the peeling of the paper strip, the ACF attaching device of the first application of the patent scope has a receiving side that heats the substrate receiving means at a higher temperature than the pressing means. Heating means. Thereby, the temperature of the surface of the substrate (the receiving side abutting surface) which is in contact with the substrate is higher than the surface of the ACF which is laminated on the paper tape (the pressure side abutting surface: the surface on the side pressurized by the pressurizing means) The temperature is even higher, allowing it to have a temperature gradient. By this temperature gradient, the adhesion force of the ACF receiving surface of the φ side can be made higher than that of the pressing side abutting surface. Further, since the pressing side abutting surface of the ACF is laminated on the peeling layer of the paper tape, it is easily peeled off, and the ACF can be more reliably transferred to the substrate. Then, there is no need for special treatment such as cooling treatment, which avoids the complexity and cost of the engineering or organization. It is necessary for the temperature of the side heating means to be a temperature at which the ACF is not thermally hardened. The attaching stage of ACF is performed before the connection phase of the driving circuit. At this stage, if the bonding resin of ACF is thermally hardened, the conductive particles dispersed therein are covered by the heat-hardened bonding tree fingers. It is possible for the substrate and the driving. -8- 200931550 The conductive connection between the circuits no longer contributes. However, if the temperature is not thermally hardened, for example, the field name of the substrate heated in a short time may be such that the temperature of the receiving side heating means is heated to a temperature at which the ACF is not thermally hardened or a temperature in the vicinity thereof. The ACF attaching device according to the second aspect of the invention is the ACF attaching device according to the first aspect of the patent application, wherein the pressurizing means is heated to a temperature higher than a normal temperature to heat the pressurizing hand side heating means. According to the ACF attaching device of the second aspect of the patent application, the pressurizing means is heated by the pressurizing side heating means, and the temperature of the pressurizing means is high. When the pressurizing means is in a low temperature state, the heat of the ACF is absorbed by the pressurized hand to lower the temperature of the ACF. Further, in order to achieve the treatment, the ACF must be rapidly brought into a molten state. Therefore, by adding heat to the addition, the ACF can be quickly brought into a molten state. However, since there is a gradient between the pressing side abutting surface of the ACF and the receiving side abutting surface, the pressurizing side heating means performs heating at a temperature which is not so high (a temperature which is higher at a normal temperature). The ACF attaching device of the third aspect of the patent application of the present invention is characterized in that the ACF attaching device of claim 1 is characterized in that a plurality of electrode groups are formed on the substrate, and a supply roll for supplying the ACF tape is provided and held thereon. The ACF of the ACF tape fed from the supply reel is a half-cut segment of the attachment length of each electrode group of the substrate; and the pressing means is configured to have at least a length of attachment to the ACF of each electrode group. The temperature of each of the electrode groups of the substrate is increased by ACF, etc., and the pressure is quickly pressed by the variable side, and the temperature is proportional to the axis, and the cut-off hand is attached -9 - 200931550 ACF. As a method of attaching the ACF to the substrate, the ACF attached to the entire length of the i-side of the substrate is attached to the mainstream, and is divided into each of the ACF attaching devices of the third application of the patent scope. It is also possible to perform the split attachment of the ACF individually by the electrode group. The electrodes having a small pitch formed on the substrate are formed as a group of electrodes in a specific number of electrodes per drive circuit, and a blank region is formed between each electrode group and the adjacent electrode group. It is not necessary to attach the ACF to the blank area, so by using the split attachment without attaching the ACF in an unnecessary blank area, by preventing the waste of materials, or by forming the adhesive resin and conductive particles constituting the ACF in the blank area. Exposed, it is possible to avoid a problem in the processing or processing after the driving circuit is mounted. When the tape is attached or detached, the tape is moved to improve the tape, and the tape is slid by cutting the ACF. Therefore, when the paper tape is peeled off, the effect of the force of the ACF peeling off from the substrate becomes large. Therefore, by heating the substrate by the receiving side heating means, the bonding force of the abutting side abutting surface of the ACF is increased, and the tape can be peeled off while the ACF is surely attached to the substrate. The ACF attaching device according to the fourth aspect of the present invention is the ACF attaching device according to claim 3, characterized in that the aforementioned ACF attaching portion having at least the ACF of each electrode group is configured. The substrate receiving means is provided so as to face the pressing means, and the receiving side lifting and lowering driving means for driving the substrate receiving means is provided so as to independently move up and down in the direction in which the pressing means approaches and separates. -10- 200931550 According to the ACF attaching device of the fourth application, the length of the substrate receiving means is one ACF attached to the length of the length, and the substrate receiving means is moved up and down. That is, by crimping the ACF by the lifting action of both the substrate receiving means and the pressing means, it is possible to apply a uniform pressing force across almost all. Thereby, the effect of avoiding the attachment failure can be exerted. The ACF attaching device according to the fifth aspect of the invention is characterized in that the substrate receiving means is configured to have a state of being fixed to the entire length of the substrate. According to the ACF attaching device of the fifth aspect of the patent application, the length of the substrate receiving means is the length of the entire length of the substrate, and the substrate receiving means is in a fixed state. Therefore, the lifting robot only has a pressing means, and the substrate receiving means can always be in a state of abutting against the substrate. In other words, when the pressure is applied by the pressing means, the substrate is already heated. Therefore, the temperature of the abutting surface of the ACF can be quickly brought to a high temperature. Thereby, the efficiency of the processing can be improved. Further, since the substrate and the substrate receiving means are always in contact with each other, the temperature distribution of the substrate can be made uniform. That is, stable temperature management can be performed. The apparatus for manufacturing a flat panel display according to claim 6 of the present invention has the ACF attaching device according to any one of claims 1 to 5. Further, the flat panel display of claim 7 of the present invention is manufactured by the apparatus for manufacturing a flat panel display of claim 6 of the patent application. The ACF attaching device can be applied to a manufacturing device of a flat panel display, and the flat panel display can be applied to a liquid crystal display or a plasma display, an organic EL display, or the like. -11 - 200931550 [Effects of the Invention] In the present invention, the substrate is heated by providing the receiving side heating means, and the abutting side abutting surface of the ACF which abuts against the substrate is heated, thereby improving the adhesion between the substrates. Thereby, the ACF can be surely attached to the substrate when the tape is peeled off without requiring a cooling process or a cooling machine. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a liquid crystal panel is displayed as an example of a substrate to which an ACF is attached, and an example of a semiconductor circuit device mounted on the ACF is shown in a drive circuit composed of TCP mounted on the base TAB. Further, the substrate may be a liquid crystal panel, a substrate for another display, or another printed circuit board, and the substrate to be mounted on the substrate is not limited to a driving circuit, and may be electrically connected to the ACF. In Fig. 1, a liquid crystal panel 1 is composed of a lower substrate 2 composed of a glass plate and an upper substrate 3, and liquid crystal is sealed between the substrates. The lower substrate 2 has a specific wide portion projected from the upper substrate on at least two sides thereof, and the extension portion 2a is mounted with a plurality of driving circuits 4 on which the integrated circuit component 4b is mounted on the thin plate 4a. The protrusion 2a of the lower substrate 2 is provided with a specific number of electrodes respectively connected to the TFTs (thin film transistors) formed at the portions of the two substrates 2 and 3, and the electrodes are as shown in the figure. It is shown that a specific number of electrodes in each of the mounting portions of the driving circuit 4 are formed by adding an ACF structure, and as shown in the figure, as a board, as long as the glass is thin, 2, 3, and only the film base is covered by the heavy line 5 becomes -12-200931550 group. Next, alignment marks 6a and 6a are formed on the left and right sides of each electrode group 5. That is, a gap area having a specific width is formed between the adjacent electrode groups 5, 5. On the other hand, the drive circuit 4 is provided with a plurality of electrodes electrically connected to the respective electrodes constituting the electrode group 5, and the electrode group connected to the electrode group 5 is indicated by reference numeral 7. Further, the drive circuit 4 is formed with alignment marks 6b and 6b on the left and right sides of the electrode group 7, and when the drive circuit 4 is mounted on the liquid crystal panel 1, the electrodes of the electrode group 7 are formed based on these alignment marks. The positions of the electrodes constituting the electrode group 5 are adjusted to match each other. The drive circuit 4 is mounted on the liquid crystal panel 1 through the ACF 8. As is well known, ACF 8 is formed by dispersing a plurality of minute conductive particles in a bonding resin having a bonding function, and heating and pressurizing ACF 8 between the driving circuit 4 and the liquid crystal panel 1 to form an electrode group through the conductive particles. Each of the electrodes of 5 and each of the electrodes constituting the electrode group 7 is electrically connected to each other, and is thermally cured by an adhesive resin to fix the drive circuit 4 to the liquid crystal panel 1. Here, the ACF 8 is divided at each position of the electrode group 5 provided in the overhang portion 2a of the lower substrate 2, and is attached at L portions per length. Thereby, the ACF 8 can be used without waste, and the attached ACF is almost completely covered by the drive circuit 4 " Fig. 2 to Fig. 4 show the attachment of the ACF 8 to the extension 2a of the lower substrate 2 The strategic structure of the attachment mechanism. In these figures, the 9 series holds the liquid crystal panel 1 in a horizontal support base. The liquid crystal panel 1 is stably held on the support base 9 by, for example, a vacuum suction means. Here, the liquid crystal panel 1 on the support base 9 abuts on a wide area, and the lower portion of the projecting portion 2a of the lower substrate 2 to which the AC F 8 is attached is open. Here, the support base 9 can be provided with position adjustment means in the X, Y, and 0 directions for use in alignment with the position of the drive circuit 4. Further, the 10A ACF 8 is attached to the liquid crystal panel 1, and the attaching unit 1 is composed of a plate body disposed in the vertical direction, and the supply reel 1 1 is detachably attached. The ACF 8 is laminated on the peeling layer of the paper tape 12 to constitute an ACF tape 13, which is wound around the supply reel 1 1. The ACF tape 13 is guided forward along the traveling path formed by the rollers 14 to 17 attached to the attaching unit 1A. Further, the 18-series driving roller holds the paper tape 12 after the ACF 8 is attached to the liquid crystal panel 1, and is driven to be fed to the discharge portion 19. The rollers 14, 15 are guide rollers for feeding the ACF tape 13, and the guide roller 15 is attached to the swing arm 20, and the rocking wall 20 is swung with the rotating shaft 21 as a center. When the rotating shaft 21 is connected to a driving means (not shown) such as a motor to swing the rocking arm 20 in the direction of the arrow F, at least the secondary attaching portion is fed from the supply reel 1 1 , that is, the length L shown in FIG. The portion of the ACF tape 13 is fed out and supplied between the rolls 14, 15. As a result, the reaction force acting when the ACF tape 13 is fed is always constant, and the resistance to the feeding force does not change as the winding amount of the supply reel 11 is different. As shown in FIGS. 5 and 6, the rollers 16 and 17 are horizontal guide rollers for guiding the length of the ACF tape 13 to the horizontal direction of the liquid crystal panel 1 by the ACF tape 13 in the horizontal direction. . The horizontal guide roller 17 defines the attachment start position of the ACF 8, and the horizontal guide roller 6 specifies the attachment end position of the ACF 8, by which the attachment area of the ACF 8 is set. These water-14-200931550 flat guide rolls 16 and 17 can be seen from Fig. 6 by the sides of the cylindrical portions 16a, 17a forming the crotch portions 16b, 17b by the circle of the crotch portions 16b, 17b. The height of the portion where the tubular portions 16a, 17a protrude is almost the same as the thickness of the paper strip 12 of the ACF tape 13, or is only slightly larger than this. That is, the ACF 8 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16, 17 and thereafter separated by the paper tape 12. Next, at a position on the downstream side of the horizontal guide rail 17, the paper tape 12 after peeling off the ACF 8 is recovered. The driving roller 18 is provided at a position lower than the attachment area of the ACF 8 separated by the horizontal driving rollers 16, 17. The driving roller 18 is composed of a driving roller 18a and a spacer roller 18b, and the paper tape 12 is held between the driving roller 18a and the spacing roller 18b. By rotationally driving the driving roller 18a, the ACF tape 12 is intermittently fed by a portion of the length L. As is apparent from Fig. 3, the attaching unit 10 is attached to the elevation drive unit 22, and the elevation drive unit 22 is attached to the front and rear drive unit 23, and the front and rear drive unit 23 is attached to the parallel movement drive unit 24 constituting the conveyance means. By means of these mechanisms, the attachment region of the ACF 8 defined by the horizontal guide rollers 16 to 17 (refer to FIG. 2) by the winding path of the ACF tape 13 can be in the up and down direction, that is, the x-axis direction. In the horizontal plane, it is possible to move in the X-axis direction (the direction orthogonal to the arrangement of the electrode group 5) and the x-axis direction (the arrangement direction of the electrode group 5). On the other hand, the liquid crystal panel 1 is fixedly held on the support base 9 by vacuum suction. Here, it is necessary to adjust the relative positions of the ACF tape 1 3 between the horizontal guide rollers 16 to 17 and the electrode group 5 of the lower substrate 2, but move the driving portion 23 back and forth to move the attachment region to the liquid crystal panel 1. In the direction of approaching/away from -15 to 200931550, the 'parallel movement drive unit 24 is moved in a direction parallel to the arrangement direction of the electrode group 5 of the liquid crystal panel 1, that is, the attachment area is moved in the γ-axis direction. Although the position adjustment can be performed on the attachment unit 10 side, as described above, when the support base 9 is provided with the position adjustment means in the χ, γ, and 0 directions, the ACF is placed on the support base 9 side. The belt 1 3 can be aligned. The elevation drive unit 22' has a tilt block 30 and a cylinder 31 for moving the tilt block 30 in the front-rear direction. Further, the attaching unit 1 is engaged with the sliding member 3 2 of the inclined surface of the inclined block 30, and the sliding member 3 2 has an inclined surface which is identical to the inclined block 30 by the restriction lever 3 3 It is a structure that cannot be displaced except for the up and down direction. That is, the attachment unit 10 can be displaced in the up and down direction by driving the cylinder 31'. Here, a motor may be used instead of the cylinder 31. Next, the driving unit 23 is moved back and forth to provide a user who moves the pedestal 34 to which the tilting block 30 is attached, and the reciprocating movement of the pedestal is performed by a driving means 35 composed of a cylinder, a motor or the like. Next, the horizontal movement drive unit 24 includes a pedestal 34 and a transfer table 36 to which the drive means 35 is attached, and the transfer table 36 can drive the ball screw 37 constituting the ball screw feeding means by the motor 38, so that the attaching unit 10 can It moves in the direction parallel to the arrangement direction of the electrode group 5 of the liquid crystal panel 1. As shown in FIG. 8, the traveling path of the ACF tape 12 attached to the attaching unit 10 is provided with a half-cutting means 40 at a position slightly downstream of the position of the horizontal guide roller 16, and the half-cutting means 40 is paired. The surface of the attaching unit 1 is mounted to reciprocate in the front-rear direction. The half-cutting means 40 -16- 200931550 is provided with a cutting edge 4i and a cutting edge receiving 42 as shown in Fig. 7, and the cutting edge 41 is in the direction of approaching/away from the cutting edge receiving 42 centering on the shaft 43 as indicated by the arrow in the figure. It can be rotated. Then, the state of leaving the cutting edge receiving member 42 is always maintained by the elastic force of the spring 44 acting on the cutting edge 41, and the cutting blade 41 is pressed against the direction of the spring 44 by the pressing roller 46 provided in the cylinder 45. The swing is displaced in a direction close to the cutter receiving 42. Next, the cutting edge 41 is at the position closest to the cutting edge receiving portion 42, and is formed to be the same as or slightly shorter than the thickness of the paper tape 12 of the ACF tape 13. Thereby, only the ACF 8 is half cut. Further, in order to attach the ACF 8 to the overhang portion 2a of the lower substrate 2, the ACF tape 13 is pressed against the surface of the lower substrate 2 by a specific pressure at a position between the horizontal guide rolls 16, 17. Therefore, in the attaching unit 10, as shown in Figs. 8 and 9, a press fitting 50 is provided. Here, the liquid crystal panel 1 is placed on the support base 9, but the projecting portion 2a of the lower substrate 2 is extended by the support base 9, and the crimping joint 50 is configured to hold the projecting portion up and down. The press fitting 50 is composed of a pressurizing blade 51 as a pressurizing means and a receiving blade 52 as a substrate receiving means, and the pressurizing blade 51 and the receiving blade 52 are attached to the lifting blocks 53, 54' respectively. 53 and 54 are attached to the pair of guide rails 55 provided on the attaching unit 1A so as to be displaceable in the vertical direction. The pressure blade 51 and the receiving blade 52 are disposed on the upper and lower sides with the liquid crystal panel 1 interposed therebetween, and are formed to have the same length. The pressing blade 51' is further guided between the horizontal guide rails 16 and 17 and placed above the ACF belt 13 which is moved in the horizontal direction. Further, the elevating blocks 53 and 54 are configured such that the common guide rails 55 are moved up and down. However, -17-200931550 may be provided with independent guide rails corresponding to the respective elevating blocks 53, 54. The lifting block 54 of the receiving blade 52 is mounted, and the steam red 50 is used to perform a lifting operation of a specific stroke length. In other words, when the cylinder 56 is in the reduced state, the receiving blade 52 is lowered and placed in a downward position away from the liquid crystal panel 1 to extend the cylinder 45, and the receiving blade 52 abuts against the lower surface of the liquid crystal panel 1. On the other hand, in the elevating block 53 to which the pressurizing blade 51 is attached, the pressurizing means 57 is connected. The pressing means 57, shown in the figure, has a feeding screw 57a driven by a motor to constitute a so-called jack. The pressing means 57, the lifting block 5 3 which is connected to the pressing blade 5 1 The guide rail 55 is moved up and down so that the liquid crystal panel 1 received on the receiving blade 52 is subjected to a specific pressing force from above. Next, the pressing blade 51 and the receiving blade 52 are configured to accurately maintain the parallelism. Further, the cylinder 56 supporting the receiving blade 52 is not moved at least at the position of the rising stroke end without being applied by the pressing force applied by the pressing means 57, and is introduced into a pressure which can maintain the extended state. Both the pressurizing blade 51 and the receiving blade 52 constituting the press fitting 50 include a pressurizing side heater 5 1 作为 as a pressurizing side heating means and a receiving side heater 52A as a receiving side heating means. The pressing blade 51 is heated by the heat of the pressure side heater 51, and the receiving blade 52 is heated by the heat of the side heater 52. The heating temperature of the receiving side heater 52 is set to be higher than the heating temperature of the pressing side heater 51. Therefore, the receiving blade 52 is in a state of being higher than the pressing blade 51. The pressure side heater 5 1 Η and the receiving side heater 52 are heat sources, and for example, electric power from a power supply source (not shown) is converted into heat energy to generate heat. -18 - 200931550 That is, the ACF tape 13 is thermocompression bonded to the liquid crystal panel 1 from the upper side by the heated pressing blade 51 and the receiving blade 52. The temperature at which the side heater is heated is set to a temperature at which the ACF 8 is not thermally hardened, that is, a temperature that is not set to a relatively high temperature, and is set to a degree that the ACF 8 is bonded and melted to exert an adhesive force (for example, 14). (Before and after the TC, on the other hand, the temperature of the heating side heater 5 1 Η is lower than the temperature at which the receiving side is heated by 5 2 ,, and is set to a temperature that does not lower the temperature of the heated ACF (for example, 50 °) Next, the pressing blade 51 and the receiving blade 52 of the fitting 50 have a wide width which can sufficiently cover the ACF tape 13, and have a small length L of the ACF 8 in the longitudinal direction. As described above, in the attaching unit 1A, the traveling path cutting means 40 and the crimping joint 50 of the ACF tape 13 supplied from the supply reel 1 1 are attached to the attaching unit 1 1 . By means of the ACF attaching device, the panel The extension portion 2a of the lower substrate 2 is attached to a certain number of groups 5 to be attached to the TAB for driving the drive circuit 4. The liquid crystal panel to which the ACF 8 is attached to the support substrate 9 is thus attached. The flat state is placed at a specific location and is adsorbed In this state, the substrate 2 below the liquid crystal panel 1 and the projecting portion 2a shown in FIG. 4 are protruded by the support 9, and the projecting portion 2a is mounted with a specific number of drive circuits 4, which are thereby driven by the ball screw 7. The attaching unit i to which the attaching mechanism is attached is intermittently fed in the direction of the arrow every other distance P shown in Fig. 1. The liquid crystal panel 1 is sequentially attached with a length L of ACF 8, a lower portion 52H. Also a resin) ° heat The pressing force of the device 8 corresponds to 1 water required for the reel and the half liquid crystal electrode, and is applied to the base. Since 0 is thus driven by the transfer table 36 constituting the parallel moving drive unit 24, the attaching unit 10 is displaced. To the specific attachment area. At this time, as shown by the arrows in Fig. 8 and Fig. 9, the attachment unit 10 is held in the raised position by the elevation drive unit 22. The pressing blade 51 constituting the pressure fitting 50 is held in the raised position. The receiving blade 52 is held in the lowered position. Thereby, the pressing blade 51 and the receiving blade 52 are kept in a non-contact state with the liquid crystal panel 1, and the movement of the attaching unit 1 is smoothly performed without causing the liquid crystal panel 1 to be Equivalent to the condition of causing damage. In addition, ACF belt 1 3, the liquid crystal panel 1 is separated, and even if the half-cutting means 40 protrudes forward from the surface of the attaching unit 10, it does not interfere with the liquid crystal panel 1. That is, the half cut of the ACF tape 13 is performed. This half-cut, the half-cut position of the ACF tape 13 becomes the attachment end position, and the end of the previous ACF 8 is attached to the start position. That is, the horizontal guide roller 17 is placed at the attachment start position. Further, the horizontal guide roller 16 is disposed at the attachment end position. Thereafter, after the half-cutting means 40 is avoided, the attachment unit 10 is caused by the elevation drive unit 22 as indicated by the arrows in Figs. 10 and 10 0. The lower portion of the ACF tape 13 is disposed at a position close to the surface of the substrate 2 below the liquid crystal panel 1 among the horizontal guide rails 16 and 17. Thereafter, the cylinder 56 is made to have a hole, and the lifting block 54 is raised. As shown in Figs. 12 and 13, the receiving blade 52 is brought into contact with the inner surface of the liquid crystal panel 1. When the receiving blade 52 is brought into contact with the inner surface of the liquid crystal panel 1, the receiving blade 52 is heated by the receiving side heater 52, so that the receiving blade 52 abuts against the lower substrate 2, and is made of a thin glass plate. The lower substrate 2 is heated to a high temperature state. Here, the receiving blade 52 does not have the entire length of the liquid crystal panel 1. The primary operation of -20-200931550 causes the ACF 8 to be limited to the position corresponding to the attached region. . Next, as shown by the arrows in Figs. 14 and 15, the pressing means 57 is operated to lower the pressing blade 51, and the ACF 8 is pressure-bonded to the lower substrate 2 by pressing the paper tape 12 of the ACF tape 13. When the pressure blade 51 presses the ACF tape 13, the pressure blade 51 and the ACF tape 13 are in contact with each other, but the pressure blade 51 is heated to some extent by the heating of the pressure side heater 5 1 ,. Therefore, heat is also transmitted to the peeling layer of the paper tape 1 2 . Depending on the type of the paper tape 12, the A C F 8 is easily peeled off by the release layer of the paper tape 12 by supplying heat to the release layer. Therefore, heat is supplied to the peeling layer of the paper tape 12, and the adhesion between the ACF 8 and the paper tape 12 is weakened to a state where it can be easily peeled off. Next, in this state, the ACF tape 13 is pressed against the lower substrate 2 by the pressing blade 51. The lower substrate 2 is heated to a high temperature by the heating of the receiving side heater 52H, so that heat is transmitted to the ACF 8 and starts to be melted. At this time, since the ACF 8 has a specific thickness of a very thin film, the abutting surface of the ACF 8 (the abutting surface of the ACF 8 and the lower substrate 2) is slowly melted, and the abutting side of the receiving side is compared. The high temperature and the side of the pressure side abutting surface (the surface of the ACF 8 laminated on the paper tape 12) are relatively low temperature gradients. When the surface is gradually melted, the viscosity of the adhesive resin is lowered, and the wetness spreads to the lower substrate while exerting the adhesive force. As a result, an adhesive force acts between the ACF 8 and the lower substrate 2, and the two are in an intimate state. On the other hand, since the pressurizing blade 5 1 is also heated by the pressurizing side heater 5 1 , heat is also transmitted to the pressurizing side abutting surface of the ACF 8 . However, the pressure side heater 5 1 is heated at a temperature lower than the temperature of 200931550 which does not lower the temperature of the ACF 8 'so that even if heat is transmitted to the pressure side abutting surface of the ACF 8, this side is also Will not melt. That is, the adhesion between the ACF8 and the tape 12 is small. Conversely, by peeling off the layer, the peeling becomes easy. In order to apply a specific pressing force to the liquid crystal panel 1 by the pressing blade 51, the feeding screw 57a constituting the pressing means 57 is driven. Here, the lower substrate 2 of the liquid crystal panel 1 is composed of a thin glass plate, which is allowed to be deformed to some extent, and is held by the pressing blade 51 and the receiving blade 52 which are the same length and which are correctly maintained in parallel. between. That is, at the time of holding, the portion to be held in the liquid crystal panel 1 serves as a press fitting 50 which is formed by the pressing blade 51 and the receiving blade 52. Then, the pressing blade 51 or the receiving blade 52 is also substantially limited to the position from the attachment start position to the end position of the ACF tape 13, so that the abutting portion of the ACF tape 13 to the pressing blade 51 is entirely The equalizing pressure is applied, and the position of the half-cut attachment end existing from the ACF 8 does not exert a pressurizing force on the base end side. When the ACF 8 is crimped to the lower substrate 2, the pressing force of the ACF tape 13 according to the press fitting 50 is released. Next, the cylinder 56 is driven to displace the receiving blade 52' to the lowered position. After that, the elevation drive unit 22 is raised. However, as shown by the arrow in FIG. 16, the drive unit 23 is driven to move forward and backward together with the elevation drive unit 22, so that the width direction of the ACF tape 12 is pulled up obliquely upward. In the case of the action, the tape 12 is peeled off by the ACF 8 slip. When the ACF8 is attached and detached, the -22-200931550 peeling is performed by sliding the ACF8, so that the tape 12 is pulled and the ACF8 greatly acts on the lower substrate 2 (stretching with the paper tape 12) The force above the diagonal). However, in the state of the ACF 8 at this time, the receiving side abutting surface is in close contact with the lower substrate 2 by the adhesive force, and the pressing side abutting surface is easily peeled off by the paper tape 12, so that the ACF 8 is reliably attached. In the state of the lower substrate 2. Thereby, the attachment of the ACF 8 to one electrode group 5 of the projecting portion 2a of the lower substrate 2 is completed. At the position where the attaching unit 10 is raised, the driving roller 18 is operated, and the ACF tape 1 is pulled out by the supply reel 1 1 to feed only one pitch amount. Next, the parallel movement drive unit 24 is operated to move the attachment unit 10 by the amount of one pitch, and as shown in Fig. 1, the movement amount is only shown by the interval P. Next, the substrate supporting table 9 of the liquid crystal panel 1 is kept not moved. In this state, the same operation as described above is repeated, and the electrode group 5 is attached to the ACF 8 in order. Here, the pressing blade 51 and the receiving blade 52 are driven up and down by means of the blocks 53 and 54, respectively. That is, the lifting blocks 53, 54 are moved up and down along the guide rails 5 provided on the attaching unit 1 ,, and the pressing blade 51 and the receiving blade 52 always hold the lower substrate 2 up and down in a state of maintaining the parallelism correctly. . When the liquid crystal panel 1 forms the electrode group 5 at n locations, the distance (η · Ρ) from the attachment position of the first ACF 8 to the final attachment position of the ACF 8 is also isolated, all of which are almost Crimp ACF 8 under the same conditions. That is, regardless of the small size or the large liquid crystal panel 1, the ACF 8 can be attached to all of the electrode groups 5 by equal pressing force without causing a pressure failure. Further, the two lifting blocks 53, -23-200931550 54 are guided to the same guide rail 55 but there is no need to share the guide rail 55. On the other hand, as shown in Fig. 17, the receiving blade 152 is attached to the support table 9, and the receiving blade 152 is placed at the same height as the support table 9 so as to have the length of the entire length of the lower substrate 2. The way of doing this is also possible. Next, the receiving side heater 1 52H is provided in such a manner as to support the entire length of the blade 152. In this case, when the liquid crystal panel 1 is placed on the support table 9, it is always heated, and only the pressure blade 51 is lifted and lowered. By making the receiving blade 152 so structured, it is possible to achieve stable temperature management and processing. In short, since the receiving blade 152 is fixed, it can be brought into a state in which the lower substrate is always brought into contact with the receiving blade 152. Since the receiving blade 1 52 is heated by the receiving side heater 1 52H, the lower substrate 2 which always abuts against the receiving blade 152 is always heated. Further, since the receiving blade 152 has the length of the entire length of the lower substrate 2, the portion of the lower substrate 2 on which the electrode group 5 is formed can be heated with a uniform Q temperature distribution over the entire length. Therefore, stable temperature management is possible. Further, since the lower substrate 2 is always heated, the time for heating the lower substrate 2 is not required. Therefore, the attachment of the ACF 8 can be performed quickly, which contributes to the rapid processing. In other words, the receiving blade 152 is set to perform the ascending and descending operation, or the state in which the receiving blade 152 is set to be fixed, can be arbitrarily selected depending on the purpose. Further, in the foregoing, the mechanism for dividing and attaching the ACF will be described, but the present invention can also be applied to a mechanism for collectively attaching. In the case of split attachment, the size of the ACF is the length of the attachment of each electrode group, and the attachment of the ACF to the length of the lower substrate is the length of the total length of the lower substrate. Even in the case of the attachment, the ACF must be peeled off from the paper tape, so that the force of peeling off the lower substrate acts on the ACF when the paper tape is peeled off. In other words, when the lower substrate is heated by the contact-side heater and the adhesive force is applied between the lower substrate and the ACF' to make the two adhere to each other, even if the attachment is attached, The tape is peeled off in a state where the ACF is surely attached to the lower substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an important part of a liquid crystal cell as a substrate to which an ACF is attached and a drive circuit mounted on the substrate. Fig. 2 is a front elevational view showing the outline of the ACF attaching machine. Figure 3 is a left side view of Figure 2. Figure 4 is a plan view of Figure 2. Fig. 5 is an explanatory view showing the configuration of a horizontal feed roller. Q Fig. 6 is a side view showing the configuration of a horizontal feed roller. Fig. 7 is an explanatory view showing the configuration of the cutting unit. Fig. 8 is an enlarged front elevational view showing the essential part of the ACF attaching machine in the half-cut state of the ACF tape. Figure 9 is a left side view of Figure 8. Fig. 10 is an enlarged front elevational view showing the important portion of the ACF attaching machine in the lowered state of the attaching unit. Figure 1 is the left side view of Figure 1. Figure 12 shows the weight of the ACF tape applicator in the ascending state of the receiving blade. -25- 200931550 Figure 13 is a left side view of Figure 12. Fig. 14 is an enlarged front elevational view showing an important part of the ACF attaching machine showing the crimped state of the ACF tape. Figure 15 is a left side view of Figure 14. Fig. 16 is an explanatory view showing a state in which the paper tape of the ACF tape is peeled off. Fig. 17 is an explanatory view showing another example of the receiving blade.
【主要元件符號說明】 1 :液晶面板 2 :下基板 2 a ·伸出部 3 :上基板 4 :驅動電路 5 :電極群[Description of main components] 1 : Liquid crystal panel 2 : Lower substrate 2 a · Extension 3 : Upper substrate 4 : Drive circuit 5 : Electrode group
8 : ACF 9 :支撐基台 1 1 :供給捲軸 1 2 :紙帶 13 : ACF 帶 16，17 :水平導引輥 22 :升降驅動部 23 :前後移動驅動部 24 :平行移動驅動部 -26- 200931550 36 :搬送台 40 :切割單元 41 :切刃 50 :壓接頭 1 5 1 :加壓刃 152 :承接刃 53,54 :升降塊 55 :導引軌 5 6 :汽缸 5 7 :加壓手段8 : ACF 9 : support base 1 1 : supply reel 1 2 : paper tape 13 : ACF belt 16, 17 : horizontal guide roller 22 : lifting drive portion 23 : front and rear movement drive portion 24 : parallel movement drive portion -26 - 200931550 36 : Transfer table 40 : Cutting unit 41 : Cutting edge 50 : Pressing joint 1 5 1 : Pressurizing blade 152 : Receiving blade 53, 54 : Lifting block 55 : Guide rail 5 6 : Cylinder 5 7 : Pressurizing means
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