TW200806712A - Polymer and photosensitive resin composition containing the same - Google Patents

Abstract

Disclosed is a polymer having a repeat unit represented by the general formula (1) and a repeat unit represented by the general formula (3).

Description

200806712 (1) EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to an interlayer insulating film (passivation film) and a surface protective film (over co at film) used for a semiconductor element. And a photosensitive resin composition such as an insulating film for a high-density mounting substrate. More specifically, the present invention relates to a high solubility in a general solvent, a high film thickness coating and an alkali development, and a cured product having a high resolution of φ, which is suitable for a surface protective film, an interlayer insulating film, and A photosensitive resin composition for use in an insulating film for high-density mounting substrates. [Prior Art] Conventionally, a polyimide film having excellent heat resistance and mechanical properties, such as a surface protective film and an interlayer insulating film used for a semiconductor device of an electronic device, has been widely used. In addition, due to the high integration of the semiconductor elements, there are various proposals for imparting sensitivity to the improvement of film formation precision. φ Among the photopolymerizable polyimide resins, side chain polymerizable negative photosensitive polymerization is often used. Yttrium. For example, Patent Document 1 discloses a photosensitive composition using an aromatic polyimine precursor having an acrylic side chain. However, this photosensitive composition has difficulty in the correspondence of a high film thickness due to the problem of light transmittance, and has a problem that the residual stress after hardening is large. What's more, solvent development is also problematic for the environment and safety. Further, since it is necessary to use an organic solvent as a developer, development of an alkali-developable radiation sensitive resin composition is desired. In order to solve these problems, various proposals have been made in the past. For example, in the patent document -5-(2) (2) 200806712, 2 and 3, a positive-type photosensitive polyimide composition which is alkali-developable is proposed. However, the coating property of the photosensitive polyimide composition is inevitably good, and for example, it is difficult to cope with a high film thickness of 15 μm or more. Furthermore, there is also the problem that it is difficult to obtain a sufficient high resolution. Therefore, there is a problem in that it is difficult to cope with the use of a surface protective film, an interlayer insulating film, and an insulating film for a high-density mounting substrate which require high film thickness coating and high resolution. Although many other patents have been filed, it is difficult to sufficiently satisfy the characteristics required for high integration and thinning of semiconductor elements. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In view of the problems of the prior art, the object of the present invention is to provide a cured product having high solubility in a general solvent, high film thickness coating and alkaline development, and a cured product having high resolution and high mechanical strength. A closed-loop polyimine polymer which is used for a surface protective film, an interlayer insulating film, and an insulating film for a high-density mounting substrate, and a photosensitive resin composition containing the same. In order to achieve the above-mentioned problems, the inventors of the present invention have found that the above problems can be attained by the following constitutions, and the present invention has been completed. That is, the present invention provides the polymer and photosensitive resin composition shown below. Π] A polymer comprising a repeating unit represented by the formula (1) and a repeating unit represented by the formula (3), -6 - (3) 200806712 [Chemical 1]

(1) In the above formula (1), X represents a tetravalent group and represents a divalent group represented by the following formula (2).

Aromatic or aliphatic hydrocarbon group, A

(In the above formula (2), R1 represents a divalent group, a fluorenyl group or an alkyl group, and at least one of η1 and η2 is at least 1 and R2 is at least (2), and R2 independently represents hydrogen. Original: 〇 to an integer of 2, η1 and η2 are hydrogen atoms)

[化3]

(3): a sulphate or aliphatic hydrocarbon group, a substituted alkyl group, or the following (in the above formula (3), X represents a tetravalent 3 meaning a carbon number of 2 to 20 substituted or unpassed Divalent group represented by formula (4)) · · · · (4) 200806712 (4) [Chemical 4]

(In the above formula (4), Z represents a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms). [2] The polymer according to [1], wherein the oxime in the formula (1) and the formula (3) is a tetravalent aliphatic hydrocarbon group. [3] A photosensitive resin composition comprising (Α) the polymer of the above [1] or [2], a (Β) photoacid generator, and (C) a crosslinking agent. [4] The photosensitive resin composition of [3], which further contains a phenol resin [5], such as the photosensitive resin composition of [3] or [4], wherein the (C) crosslinking agent has a Alkoxyalkylated amine groups. The novel closed-loop polyimine polymer of the present invention and the photosensitive resin composition containing the same exhibit an effect of high solubility in a general solvent, high film thickness coating and alkali development, and at the same time, resolution can be obtained. A cured product having high mechanical strength is suitable for use as a surface protective film, an interlayer insulating film, and an insulating film for a high-density mounting substrate. [Embodiment] The following describes the best mode for carrying out the invention, but the present invention is not limited to 8-(5) (5) 200806712. The following embodiments are defined, and the present invention is not limited to the scope of the present invention. Those skilled in the art can appropriately adapt the following embodiments, and it is understood that such improvements and the like fall within the scope of the present invention. (A) Polymer: The polymer (A) of the present invention contains a repeating unit represented by the above formula (1) and a repeating unit represented by the above formula (3). The details are as follows. X in the above-mentioned general formula (1) is a tetravalent aromatic hydrocarbon group or a tetravalent aliphatic hydrocarbon group, preferably a tetravalent aliphatic hydrocarbon group. Specific examples of the tetravalent aromatic hydrocarbon group include four hydrogen-substituted four-valent groups of the parent skeleton of the aromatic hydrocarbon group. Examples of the aromatic hydrocarbon group include the groups shown below. 【化5】

The tetravalent aliphatic hydrocarbon group may, for example, be a chain hydrocarbon group, an alicyclic hydrocarbon group or a municipal alicyclic hydrocarbon group. More specifically, four hydrogen-substituted tetravalent groups of a chain hydrocarbon group, an alicyclic hydrocarbon or an alkyl alicyclic hydrocarbon parent skeleton may be mentioned. Further, the tetravalent alicyclic hydrocarbon group may have at least a part of its structure containing an aromatic -9 - 200806712 (6) ring. Here, examples of the chain hydrocarbon include ethane, n-propane, n-butane, n-pentane, n-hexane, n-octane, n-decane, n-dodecane and the like. Specific examples of the alicyclic hydrocarbons include monocyclic hydrocarbons, bicyclic hydrocarbons, and tricyclic hydrocarbons. Examples of the monocyclic hydrocarbon include cyclopropane, cyclobutane, cyclopentane, cyclopentene, cyclohexane, cyclohexene, cyclooctane and the like. The bicyclic hydrocarbon may, for example, be bicyclo[2.2.1]heptane, bicyclo[3·1·1]heptane, bicyclo[3·1·1]hept-2-ene, bicycloφ[2·2· 2 ] Octane, bicyclo[2·2 2]oct-7-ene, etc. Examples of the hydrocarbon of the tricyclic or higher ring include a tricyclo[5·2·1·02,6]decane, a tricyclo[5·2.1.2,2,6]non-4-ene, an adamantane, a tetracyclo[ 6· 2· 1· I3'6·〇2,7]Dodecane and the like. The alkyl alicyclic hydrocarbon may be one in which the above alicyclic hydrocarbon is substituted with an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group. More specifically, methylcyclopentane, 3-ethyl-1-methyl-1-cyclohexene, 3-ethyl-1-cyclohexene, and the like can be given. Further, the tetravalent aliphatic hydrocarbon group containing at least a part of the aromatic ring in the structure is preferably one or more of the number of aromatic rings in one molecule, and particularly preferably one. More specifically, 1-ethyl-6-methyl-1,2,3,4·tetrahydronaphthalene, ethylidene-1,2,3,4-tetrahydronaphthalene and the like can be mentioned. The preferred core of the tetravalent group of X may be n-butane, cyclobutane, cyclopentane, cyclohexane, bicyclo[2·1·1]heptane, bicyclo[2·2·2]octane, double ring. [2· 2. 2]oct-7-ene, tetracyclo[6. 2·1·I3,6·02,7]dodecane, methylcyclopentane, and the like. X is better for the following -10- 200806712

In addition, χ特佳 is shown below.

And the best is shown below [Chemical 8]

. These X may be used alone or in combination of two or more. A in the above formula (1) is a divalent group represented by the above formula (2). R1 in the above formula (2) is a divalent group. Specific examples of R1 include an oxygen atom, -11 - 200806712 (8) sulfur atom, sulfon group, ore group, methylene group, stretching group (except methylene group), dimethylmethylene group and Bis(trifluoromethyl)methylene group and the like. R2 in the above formula (2) independently represents a hydrogen atom, a fluorenyl group or an alkyl group. Preferred examples of the fluorenyl group include a decyl group, an ethyl fluorenyl group, a propyl fluorenyl group, a butyl group, an isobutyl group, and the like; preferred alkyl groups include, for example, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, and a positive group. Amyl, n-hexyl, n-octyl, n-decyl, n-dodecyl and the like. Further, at least one of R2 is a hydrogen atom. Further, φ1 and η2 in the above formula (2) are integers of 0 to 2, and at least one of η1 and n2 is 1 or more. Α is preferably shown below.

A is better for the next one [Chemical 1 0]

X in the above formula (3) is a tetravalent aromatic hydrocarbon group or a tetravalent aliphatic hydrocarbon group. The X in the above formula (3) is preferably the same as the X in the above formula (1). -12- 200806712 (9) B in the above formula (3) is a substituted or unsubstituted alkylene group of 2 to 20 or a divalent group represented by the above formula (4). The substituted or unsubstituted alkylene group having 2 to 2 carbon atoms is specifically preferably an alkylene group having 4 or more carbon atoms. The alkylene group having a carbon number of 4 or more may, for example, be an alkylene group having a carbon number of 4 such as fluorene, 4 to butyl group or the alkyl group having a carbon number of 5, such as 1,5-exopentyl group; , a 5-alkylidene group, a 1,6-extended hexyl group and the like, an alkylene group having a carbon number of 6, a 1,10-extended fluorenyl group, a 1,12-extended dodecyl group, an alkylene group having a carbon number of 7 to 20, and the like . Among these, the reason for improving the solubility of the polymer to the solvent is preferably an alkylene group having 6 or more carbon atoms, more preferably an alkylene group having 7 to 20 carbon atoms. Z in the above formula (4) is a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms. The substituted or unsubstituted alkylene group having 2 to 20 carbon atoms is specifically preferably an alkylene group having 3 or more carbon atoms. Examples of the alkylene group having a carbon number of 3 or more include, for example, a 1,3-propyl group, a 2,2-dimethyl-propenyl group, an iota, a butyl group, and a 1,5-amyl group. Alkyl groups up to 5; 2-methyl-1,5-exopentyl, 1,6-extended hexyl and the like, a C 6 alkyl group; 1,1 〇-extension thiol, φ 1,12_ A dodecyl group having a carbon number of 7 to 20, such as dodecyl group. The divalent group represented by the above formula (4) is more preferably the following: 200806712 (10) [Chem. 1 1]

(A) The polymer is usually a monomer represented by the following formula (5) (hereinafter also referred to as "monomer (5)") or a monomer represented by the following formula (6) (hereinafter also referred to as "Monomer (6)") and a monomer represented by the following formula (7) (hereinafter also referred to as "monomer (7)") are reacted in a polymerization solvent to synthesize polyglycine and then hydrazine Obtained by imidization. The order of synthesis of the polyenoic acid is generally synthesized by any of the following two methods. That is, (i) a method of reacting with the monomer (5) after dissolving the monomer (6) and the monomer (7) in a polymerization solvent; (π) dissolving the monomer (5) in a polymerization solvent, and A method in which a monomer (7) is reacted and then reacted with a monomer (6). -14- 200806712

HgN—B—NHa · (7) Further, X in the above formula (5) is the same as X in the above formula (1), and Ri, R2, η1 in the above formula (6) and Η2 is the same as R1, R2, η1 and η2 in the above formula (2), and the oxime in the above formula (7) is the same as those in the above formula (3). The polymerization solvent is usually ruthenium, dimethyl dimethyl decylamine, hydrazine, hydrazine, methyl methacrylate, hydrazine-methyl-2-pyrrolidone, γ-butylide, dimethyl hydrazine. Aprotic solvent; protic solvent such as cresol. Further, if necessary, methanol, ethanol, propanol, butanol, 2-methoxyethanol, 2 · ethoxyethanol, 2-(2·methoxyethoxy)ethanol, 2-(2) may also be added. - an alcohol solvent such as ethoxyethoxy)ethanol; an ether solvent such as diglyme or triethylene glycol dimethyl ether; or an aromatic hydrocarbon solvent such as toluene or xylene. The ruthenium imidization reaction is generally known as heating the hydrazine imidization reaction with a chemical hydrazine imidization reaction, preferably by heating the hydrazine imidization reaction to synthesize the (A) polymer. The heating hydrazine imidization reaction is usually carried out by heating a synthetic solution of valine acid at 1 to 20 ° C for 1 to 16 hours. Further, if necessary, the azeotropic solvent such as toluene or xylene may be used to remove the water of the reaction system to carry out the reverse reaction -15-200806712 (12). (A) Polyphenylstyrene converted by a gel permeation chromatography (GPC) The weight average molecular weight (hereinafter also referred to as "Mw") is usually 2,000 to 500,000, preferably about 3,000 to 200,000. When the Mw is less than 2,000, the insulating film tends to have insufficient mechanical properties. Further, when Mw exceeds 500,000, the photosensitive resin composition obtained by using the (A) polymer tends to have a lack of solubility in a solvent and a developing solution. (A) In the total monomer of the polymer (monomer (5) + monomer (6) + monomer (7)), the proportion of the monomer (5) is usually 40 to 60 mol%, preferably 45 to 55 mol%. In the all monomer, when the proportion of the monomer (5) is less than 40 mol% or more than 60 mol%, the molecular weight of the obtained (A) polymer tends to decrease. Further, in the case of using a diamine compound, the ratio of the monomer (6) is usually from 10 to 99 mol%, preferably from 20 to 95 mol, based on the total of the monomer (6) and the monomer (7). Ear %, more preferably 30 to 90 mole %. 2. Photosensitive resin composition Next, the photosensitive resin composition of the present invention will be described. The photosensitive resin composition of the present invention contains the above (A) polymer, (B) photoacid generator, and (C) a crosslinking agent. The details are as follows. (B) Photoacid generator The (B) photoacid generator contained in the photosensitive resin composition of the present invention is a compound which generates an acid by irradiation of radiation (hereinafter also referred to as "exposure"). (B) Photoacid generator having such properties is an iron iodide compound-16-200806712 (13), a sulfonium salt compound, a hydrazine compound, a sulfonate compound, a _compound, a sulfonimide compound, a diazo Chemical enrichment such as methane compound 畐$% _ generator; naphthoquinonediazide (Nqd) photoacid generator such as diazoketone compound. Examples of the iron iodide compound include diphenyliodonium trifluoromethyl hydrazine ___, 1 phenyl iodide iron nonafluorobutane sulfonate, diphenyl iodine sulfonate, diphenyl iodine iron 12 Benzobenzene sulfonate, diphenyl iodine hexafluoroantimonate, bis(4_ φ tributyl phenyl) iodine trifluoromethane sulfonate, bis (4-tert-butylphenyl) Key: nonafluorobutane sulfonate, bis(4-tert-butylphenyl) iodine iron sulfonate, bis(4-tert-butylphenyl) iodine p-toluenesulfonate, and the like. Examples of the sulphur iron salt compound include triphenylsulfuric iron difluoromethyl sulfonate, triphenyl sulfonium hexafluorobutane sulfonate, triphenylsulfonyl sulfonate, and triphenyl sulfonate naphthalenesulfonic acid. Salt, 4-hydroxyphenyl-benzyl-methylthio-p-toluenesulfonate, 4-(phenylthio)phenyldiphenylsulfanyl hexafluorophosphate, 4,7_-^-n-butyl Oxy-1-caiyl tetrachloroporphin iron dichalcate, 4,7-di_φ n-hydroxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate, 4,7-di n-Butoxy-1-naphthyltetrahydrothienyl hexafluorophosphate, 4-n-butoxyoxy β1-naphthyltetrahydrothiophene trifluoromethanesulfonate, and the like. Examples of the milled compound include β-keto oxime, β-sulfonyl sulphate, and the like α-diazo compounds. More specifically, a benzylphenylhydrazine, a mesitylenebenzylhydrazine methyl milling, a bis(phenylsulfonyl)methane, a 4-tribenzylhydrazinemethylhydrazine, or the like can be given. Examples of the sulfonate compound include a sulfonate, an alkylsulfonate, an arylsulfonate, and an imidosulfonate. More specifically, benzoin-17-200806712 (14) p-toluene oleic acid, gallic phenolic ginseng (trifluoromethane) sulfonate, gallic phenol mesylate, n-benzyl-9, 10 -diethoxyindole·2_sulfonate, α-hydroxymethylphenylene p-toluenesulfonate, 1-hydroxymethylphenylene octane sulfonate, α-hydroxymethyl benzoin Trifluoromethanesulfonate, hydroxymethyl benzoine dodecyl sulfonate, and the like. The ruthenium-containing compound may, for example, be a hydrocarbon compound containing a halogenated alkyl group or a heterocyclic compound containing a halogenated alkyl group. Specific examples of preferred halogen-containing compounds include ii _ • bis(4-chlorophenyl)-2,2,2-trichloroethane, phenyl-bis(trichloromethyl)-s-triazine, 4 -Methoxyphenyl-bis(trichloromethyl)triazine, styryl-bis(trichloromethyl)-s-diazine, 4-methoxystyryl-bis(trichloromethyl) _s_triazine, naphthyl-bis(trichloromethyl)-s-triazine or the like, or an s_triazine derivative represented by the following formula (8). 【化1 3】

R3 • · · · (8) In the above formula (8), R3 represents a hydrogen atom, a carbon number of 1 to *, or a fe number of 1 to 4; t兀oxy 'Y represents a halogen atom, q Indicates an oxygen atom or a sulfur atom. The s-triazine derivative represented by the above formula (8) has broad absorption in the g-line, h-line, and ruthenium lines, and is generally acid in comparison with a general-purpose radioactive acid generator having other triterpene skeletons. The production rate is high, and the residual film rate is obtained. The stomach 1 is an insulating hardened material. Further, in the above formula (8), the Shiji -18 - (15) 200806712 number 1 to 4 represented by R3 may be exemplified by methyl group, ethyl group, n-propyl group, isopropyl group or n-butyl group. , isobutyl, second butyl, tert-butyl, and the like. Further, examples of the alkoxy group having a carbon number of i to 4 include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a n-butoxy group, an isobutoxy group, a second butoxy group and the like. Further, in the above formula (8), R3 is preferably a hydrogen atom or an alkyl group having a carbon number of 丨 to 4, more preferably a hydrogen atom, a methyl group or an ethyl group.

Further, in the above formula (8), the halogen atom represented by γ is preferably a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, more preferably a chlorine atom. Further, in the above formula (8), Q is preferably an oxygen atom. Specific examples of the s-triazine derivative represented by the above formula (8) include 2 _[2-(furan-2-yl)vinyl]-4,6-bis(trichloromethyl)_5-three. Oxazine ((^0, R3 = H, Y = C1), 2-[2-(5·methylfuran-2.yl)ethyl]]4,6_bis(trichloromethyl)-s-three Further, the s-triazine derivatives may be used alone or in combination of two or more. The sulfonium imine compound may be exemplified by N-(trifluoromethyl). Sulfhydryloxy) succinimide, N-(trifluoromethylsulfonyloxy) quinone imine, N-(trifluoromethylsulfonyloxy)diphenylmaleimide , N-(trifluoromethylsulfonyloxy)bicyclo[2·2·1]hept-5-ene-2,3-dicarboximine, N-(trifluoromethylsulfonyloxy) Naphthyl imine, etc. The diazomethane compound may be bis(trifluoromethylsulfonyl)diazide, bis(cyclohexylsulfonyl)diazomethane, bis(phenylsulfonyl) Further, the diazoketone compound may, for example, be a 1,3-diketo-2-dide compound, a diazobenzoxanthene compound, a diazonaphthoquinone compound or the like. Preferred diazoxide-19 - 200806712 ( 1 6) Specific examples of the compound include a 1,2-naphthoquinone azide-4-sulfonate compound of a phenol type. Among the above compounds, a sulfonium salt compound, a hydrazine compound, a halogen-containing compound, and a diazoketone compound are preferred. a sulfonium imide compound, a diazomethane compound, more preferably a pyrite compound, a halogen-containing compound, particularly preferably 4-(phenylthio)phenyldiphenylthiophosphonium hexafluorophosphate, 4,7 -di-n-butoxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate, 4,7-di-n-hydroxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate, 4,7 -di-n-butoxy-1-naphthyltetrahydrothienyl hexafluorophosphate, 4-n-butoxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate, 4-methoxyphenyl - bis(trichloromethyl)-s-triazine, styryl-bis(trichloromethyl)-s-triazine, 4-methoxystyryl-bis(trichloromethyl)-s- Further, the (B) photoacid generator may be used alone or in combination of two or more. (B) The photoacid generator is contained in a proportion of 100 parts by mass relative to the (A) polymer (only, When containing other polymers than (A) polymer, relative (A) 100 parts by mass of the total of the polymer and the other polymer, usually 0.1 to 20 parts by mass, preferably 0.5 to 10 parts by mass. When less than 0.1 part by mass, the catalyst of the acid generated by the exposure is used. In addition, when it is more than 2 parts by mass, coating unevenness occurs when the photosensitive resin composition is applied, and the insulating property after curing may be lowered. (C) Crosslinking agent) (C) The crosslinking agent is a compound in which a resin or the like is compounded by the action of heat or an acid to form a combined compound of -20-(17) (17) 200806712 or other crosslinking agent molecules. Specific examples of the (C) crosslinking agent include a polyfunctional (meth) acrylate compound, an epoxy compound, a hydroxymethyl-substituted phenol compound, a compound having an alkoxyalkylated amine group, and the like. Among these, a compound having an alkoxyalkylated amine group is preferred. Further, the (C) crosslinking agents may be used alone or in combination of two or more. Examples of the polyfunctional (meth) acrylate compound include trimethylolpropane tri(meth) acrylate, di(trimethylolpropane) tetra(meth) acrylate, pentaerythritol tri(meth) acrylate, and pentaerythritol. Tetrakis (meth) acrylate, bis (pentaerythritol) penta (meth) acrylate, bis (pentaerythritol) hexa (meth) acrylate, glycerol tri(meth) acrylate, ginseng (2-hydroxyethyl) three Polyisocyanate tri(meth)acrylate, ethylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate 1,6-hexanediol di(meth)acrylate, neopentyl glycol (meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate Dipropylene glycol di(meth)acrylate, bis(2-hydroxyethyl)trimeric isocyanate di(meth)acrylate, and the like. Examples of the epoxy compound include a varnish type epoxy resin, a bisphenol type epoxy resin, an alicyclic epoxy resin, and an aliphatic epoxy resin. The hydroxymethyl-substituted phenol compound may, for example, be 2-hydroxymethyl-4,6-dimethylhydrazine, 1,3,5-trisylmethylbenzene or 3,5-di-propylmethyl-4-methyl- Oxytoluene [2,6-bis(hydroxymethyl)-p-cresol] and the like. The compound having an alkoxyalkylated amine group may be exemplified by (poly)methylolated melamine, (poly)methylated glycoluril (g 1 y C 0 1 XI ri 1 ), (multi) By methyl-21 - 200806712 (18) Benzene-derived amine, (poly)methylolated urea, etc., a nitrogen-containing compound having a plurality of active methylol groups in one molecule, the hydroxyl group of the methylol group A compound in which at least one of the oxygen atoms is substituted with an alkyl group such as a methyl group or a butyl group. Further, a compound having an alkoxyalkylated amine group is a mixture in which a plurality of substituted compounds are mixed, and an oligomer component in which a part itself is condensed is also present, and both of them can be used. More specific examples of the compound having an alkoxyalkylated amine group can be exemplified by the compounds represented by the formulae (9) to (15) and the like. -22- (19) 200806712 【化14】

(H3COH2C) 2N

h3coh2chN

C4h9oh2c ch2oc4h9

C4H90H2C' CH2OC4H9 (11) H3COH2C ch2och3 'N 丫 Ν' 〇=<丄>=〇 / \ h3coh2c ch2och3 (12) o H3COH2C, human " /CH2OCH3 H3COH2C, o /CH2OCH3 N N 3

(13)

(14) o

H3COH2C\ . Human xCH2OCH3 N N

Ch3 (15) Further, the compound of the above formula (9) (hexa(methoxymethyl)melamine) is sold under the trade name "Cymel 300" (manufactured by Cytec Industries, Inc.). Further, the compound represented by the above formula (11) (tetrakis(butoxymethyl) glycoluril) is sold under the trade name "Cymel 1170" (manufactured by Cytec Industries, Inc.). The compound having an alkoxyalkylated amine group is particularly preferably hexa(methoxy-23-(20)(20)200806712 methyl)melamine (the above formula (9)), tetrakis(methoxymethyl) Glycoluric acid (the above formula (12)), tetrakis(butoxymethyl) glycoluril (the above formula (11)), most preferably hexa(methoxymethyl)melamine (the above formula (9)) ° The content ratio of the (D) crosslinking agent is appropriately set depending on the amount of the film formed of the photosensitive resin composition to be sufficiently cured. Specifically, the content ratio of the (D) crosslinking agent is 100 parts by mass relative to the (A) polymer (except when the polymer other than the (A) polymer is further contained, relative to the (A) polymer and The total of the other polymers is 100 parts by mass), usually 5 to 50 parts by mass, preferably 10 to 40 parts by mass. When the amount is less than 5 parts by mass, the solvent resistance or plating resistance of the obtained insulating layer is insufficient. On the other hand, when it exceeds 50 parts by mass, the developability of the film formed of the photosensitive resin composition may be insufficient. (Other polymer (resin)) The photosensitive resin composition of the present invention may further contain a polymer (resin) other than the above (A) polymer as long as it does not impair the effects of the present invention. The "other polymer (resin)" which may be contained is not particularly limited, and it is preferably an alkali-soluble one. Further, since the resolution is good, it is more preferable to contain an alkali-soluble resin having a phenolic hydroxyl group (hereinafter also It is called "phenol resin"). The phenol resin which may be contained may, for example, be a varnish resin, a polyhydroxystyrene and a copolymer thereof, a phenol-extension xylene glycol dimethyl ether condensation resin, a cresol-methylene glycol dimethyl ether condensation resin, a phenol-two A cyclopentadiene condensation resin or the like. -24 - 200806712 (21) Specific examples of the varnish resin include a phenol/formaldehyde condensation varnish resin, a cresol/formaldehyde condensation varnish resin, and a phenol-naphthol/formaldehyde condensation varnish resin. The varnish resin can be obtained by condensing a phenol with an aldehyde in the presence of a catalyst. Examples of the phenol used in this case include o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, and the like. m-Butylphenol, p-butylphenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-dimethyl Phenol, 3,5-xylene φ phenol, 2,3,5-trimethyl phenol, 3,4,5·trimethyl phenol, catechol, resorcinol, gallic phenol, (X-naphthol) Further, the aldehydes include formaldehyde, formaldehyde, acetaldehyde, benzaldehyde, etc. The monomer other than the hydroxystyrene constituting the copolymer of polyhydroxystyrene is not particularly limited, specifically Examples thereof include styrene derivatives such as styrene, fluorene, p-methoxystyrene, p-butoxystyrene, p-ethoxylated styrene, and p-hydroxy-α-methylstyrene; Methyl)acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (φ meth) acrylate, n-butyl (meth) acrylate, ( Methyl acrylate second butyl ester '(meth)acrylic acid (meth)acrylic acid derivatives such as butyl ester; vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, n-butyl vinyl ether, and tert-butyl vinyl ether; maleic anhydride, ikon An acid anhydride derivative such as an acid anhydride. The content of the phenol resin is preferably from 0 to 90 parts by mass, more preferably from 5 to 80 parts by mass, based on 100 parts by mass of the total of the (Α) polymer and the phenol resin. 10 to 70 parts by mass. When the amount is less than 5 parts by mass, the effect of containing the phenol resin tends to be difficult to exhibit. Further, when it exceeds 90 mass - 25 - 200806712 (22) parts, the mechanical strength of the film tends to decrease. The photosensitive resin composition of the present invention may contain a phenolic low molecular compound in addition to the above phenol resin. Specific examples of the phenolic low molecular compound which may be contained include 4,4'-dihydroxydiphenyl. Methane, 4,4'-dihydroxydiphenyl ether, tris(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, tris(4-hydroxyl Phenyl)ethane, 1,3-bis[1-(4-hydroxyphenyl)-1-methylethyl]benzene, 1,4-bis[1-(4-hydroxyphenyl)-1- Methyl φ ethyl]benzene, 4,6-bis[1-(4-hydroxyphenyl)-1.methylethyl]-1,3-dihydroxybenzene, 1, bis- 4-hydroxybenzene Hydroxyphenyl)-1-methylethyl}phenyl]ethane, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, etc. The proportion of phenolic low molecular compounds, relative to (A) 100 parts by mass of the polymer (except that when the polymer other than the (A) polymer is further contained in an amount of 1 part by mass based on the total of the (A) polymer and the other polymer), it is preferably 0 to 100 parts by mass, more preferably 1 to 60 parts by mass, particularly preferably 5 to 40 parts by mass. When the amount is less than 1 part by mass, the Φ effect containing the phenolic low molecular compound tends to be difficult to exert. On the other hand, when it exceeds 1 part by mass, the mechanical strength of the film tends to decrease. (Solvent) The photosensitive resin composition of the present invention may contain an organic solvent as long as it does not impair the effects of the present invention, in order to improve the usability, adjust the viscosity, and preserve the stability. The type of the organic solvent which may be contained is not particularly limited, and for example, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, or the like can be suitably used. γ Butyrolactone, dimethyl hydrazine, etc. Non--26- 200806712 (23) Protic solvent; phenolic protic solvent such as methyl cresol. Further, the photosensitive resin composition of the present invention may contain a propylene glycol monoalkyl ether, a propylene glycol diether, a propylene glycol monoalkyl ether acetate, an aliphatic alcohol, a lactic acid, or a fat instead of the above solvent. Solvents such as group carboxylic acid esters, alkoxy aliphatic carboxylic acid esters, and ketones. Examples of the propylene glycol monoalkyl ethers include propylene glycol monomethyl ether, propyl monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether. Examples of the propylene glycol ethers include propylene glycol diethyl ether and propylene glycol dipropyl propylene glycol dibutyl ether. Examples of the propylene glycol monoalkyl ether acetates include propylene glycol monomethyl ester, propylene glycol monoethyl ether acetate, and propylene glycol monopropyl ether acetate propylene glycol monobutyl ether acetate. Examples of the aliphatic alcohols include 1-but-2-butanol, 1-pentanol, 2-pentanol, 4-methyl-2-pentanol, and 1-hexanol. Examples of the lactic acid esters include methyl lactate, ethyl lactate, lactic acid, and isopropyl lactate. Examples of the aliphatic carboxylic acid esters include isopropyl n-propyl acetate, n-butyl acetate, isobutyl acetate, isoamyl acetate, isopropyl propionate, n-butyl propionate, and propionic acid. Examples of the alkoxy aliphatic carboxylic acid esters such as isobutyl ester include ethyl 3-methoxypropionic acid methyl 3-methoxypropionate, methyl 3-ethoxypropionate, and 3-ethoxypropane. Ester and the like. Further, examples of the ketone include 2-heptanone, 3-heptanone, 4-heptanone, cyclohexane, cyclohexanone and the like. Among these solvents, preferred are ethyl lactate, 2-heptanone, cyclohexanonediol monomethyl ether, propylene glycol monomethyl ether acetate, butyl acetate, or alkyl ester organic glycol II. Alcohol ether, ether ethyl ester, alcohol, propyl ester, acetoacetate, acid pentanone, propetyl -27-200806712 (24) is ethyl lactate, propylene glycol monomethyl ether. These solvents may be used alone or in combination of two or more. Further, the solvent is usually used in such a manner that the total content of the components other than the solvent is from 1 to 60% by mass. (Other Additives) The photosensitive resin composition of the present invention may contain other additives such as a basic compound, an adhesion aid, and an interface φ active agent as long as it does not impair the effects of the present invention. (Intestinal Compound) The above basic compound may, for example, be triethylamine, tri-n-propylamine, tri-n-butylamine, tri-n-pentylamine, tri-n-hexylamine or tri-n-heptylamine. a trialkylamine such as di-n-hamidoamine, di-n-decylamine, tri-n-decylamine, tri-n-dodecylamine or n-dodecyldimethylamine, or pyridine, A nitrogen-containing heterocyclic compound such as pyridazine or imidazole. The content of the basic compound is usually 5 parts by mass or less, preferably 3 parts by mass or less based on 100 parts by mass of the (A) polymer. When the content of the basic compound is more than '5 parts by mass based on 100 parts by mass of the (A) polymer, the photoacid generator may not have sufficient function. (Adhesive Aid) The photosensitive resin composition of the present invention may contain an adhesion aid in order to improve the adhesion to the substrate. The adhesion aid is effective as a functional decane coupling agent. Herein, the functional decane coupling agent means a decane coupling agent having a reactive substituent such as a carbonyl group, a methacryl fluorenyl group, a -28-200806712 (25) isocyanate group or an epoxy group. Specific examples thereof include trimethoxydecyl benzoic acid, γ-methylpropenyl propyl trimethoxy decane, vinyl triethoxy decane, vinyl trimethoxy decane, and γ - isocyanatopropyl group. Triethoxy oxalate, γ-glycidoxypropyl dimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and the like. The content of the binder is preferably 1 part by mass or less based on 100 parts by mass of the (Α) polymer. (Surfactant) The photosensitive resin composition of the present invention may contain a surfactant for the purpose of improving various properties such as coatability, defoaming property and leveling property. For the surfactant, for example, ΒΜ-1000, ΒΜ-1100 (above ΒΜ Chemmy), MEGAFACE F142D, MEGAFACE F172, MEGAFACE F17 3, MEGAFACE F18 3 (above manufactured by Dainippon Ink Chemical Industry Co., Ltd.), Fluorad FC-135, Fluorad FC· φ 170C, Fluorad FC-43 0, Fluorad FC-43 1 (above Sumitomo 3M), Surflon S-112, Surflon S-113, Surflon S-131, Surflon S-141, Surfloii S-145 (above is manufactured by Asahi Glass Co., Ltd.), SH-28PA, SH-190, SH-193, SZ-6032, SF-8428 (above, manufactured by Toray Dow Corning Silicon Co., Ltd.) Surfactant. The content of the surfactant is preferably 5 parts by mass or less based on 1 part by mass of the (A) polymer. The photosensitive resin composition of the embodiment of the present invention can be suitably used as a surface protective film or an interlayer insulating film material of a semiconductor element. -29-200806712 (26) The photosensitive resin composition of the embodiment of the present invention can be applied to a support (a copper foil with a resin, a copper-plated laminate or a metal-plated film, or a silicon substrate). Drying causes a solvent or the like to volatilize to form a coating film. Thereafter, the film is exposed through a desired mask pattern, and heat treatment (hereinafter referred to as "PEB") is carried out to promote the reaction between the phenol ring and the crosslinking agent. Next, the unexposed portion is dissolved and removed by development with an alkali developer to obtain a desired pattern. Further, a cured film can be obtained by φ through heat treatment for expressing the characteristics of the insulating film. The method of applying the photosensitive resin composition to the support can be, for example, a coating method such as a dipping method, a spray method, a bar coating method, a roll coating method or a spin coating method. Further, the thickness of the coating is adjusted depending on the coating means, the solid content concentration or the viscosity of the composition solution, and can be appropriately controlled. After coating, in order to volatilize the solvent, pre-baking treatment is usually performed. The conditions vary depending on the composition of the photosensitive resin composition, the thickness of the film to be used, and the like, and are usually from about 70 to 150 ° C, preferably from 80 to 140 ° C, for about 1 to 60 minutes. Examples of the radiation used for the φ exposure include ultraviolet rays or electron beams such as a low-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a g-line, and an i-line, and a laser beam. The amount of exposure can be appropriately selected depending on the light source or the thickness of the resin film to be used, for example, when the ultraviolet ray is irradiated by a high pressure mercury lamp, and the thickness of the resin film is from 10 to 50 μm, usually from about 100 to 5,000 mJ/cm 2 . After the exposure, in order to promote the hardening reaction of the phenol ring and the (C) crosslinking agent via the generated acid, PEB is carried out. The conditions of PEB vary depending on the composition of the photosensitive resin composition and the thickness of the film to be used, and are usually 70 to 150 ° C, preferably 80 to 14 (TC, for about 1 to 60 minutes -30 to 200806712). (27) After that, it is developed through an alkaline developer, and is dissolved and removed without being exposed to form a desired pattern. The development method at this time includes a shower, a spray development method, a immersion development method, a paddle development method, and the like. The development is usually carried out at about 20 to 40 ° C for about 1 to 10 minutes. Examples of the alkaline developing solution include sodium hydroxide, hydrogen, hot water, ammoxidation of tetramethyl methoxide, and a test compound. The aqueous alkaline solution is dissolved in an aqueous solution of about 1 to 10% by mass. The aqueous solution may be added with a water-soluble or surfactant such as methanol or ethanol in an appropriate amount, and further developed with an alkaline developing solution and then washed with water. Further, in order to sufficiently express the characteristics of the insulating film after development, it is possible to sufficiently cure by heat treatment. The hardening conditions are not particularly limited to the use of the cured product, and are heated at a temperature of 1 〇 0 to 400 ° C. 0 hour or so, photosensitive resin Hardening of the object. Further, hardening is performed on the ground to prevent the change of the shape of the obtained pattern, and it can be multi-stage. For example, when the two-stage heating is performed, it can be heated at 200 ° C for 5 minutes to 2 hours in the first stage. In the second stage, it is heated at a temperature of 400 ° C for 10 minutes to 10 hours to harden. As long as the hardening conditions for this method can be used, the heating equipment can be used, oven, infrared oven, microwave oven, etc. Second, according to In the drawings, a semiconductor element using the resin composition of the embodiment of the present invention will be described. As shown in Fig. 1, a patterned insulating film using the resin composition of the embodiment of the present invention is formed on the substrate 1 of the formed metal pad 2. 3. Secondly, as long as the concentration of potassium oxide is the same as that of the photo-developing method, the solvent is dried, and the root is used to charge 50 to 100 to the photosensitive metal with the pattern of the hot plate. Pad-31 - 200806712 (28) The semiconductor element can be obtained by forming the metal wiring 4 by the connection method. Further, as shown in Fig. 2, the metal wiring 4 can be formed and used. In the patterned insulating film 5 of the photosensitive resin composition of the embodiment, the semiconductor element having the insulating resin layer formed through the photosensitive resin composition can be obtained by using the photosensitive resin composition of the embodiment of the present invention. Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to the examples. Further, "parts" and "%" in the examples and comparative examples are mass-free unless otherwise specified. Benchmark. Further, the measurement methods of various properties and the evaluation methods of each property are shown below. [Molecular weight (Mw)]: GPC column manufactured by Tosoh Corporation (TSKgel α-Μ 1 root, TSKgel α-2 5) 0 0 1 root), flow rate: 1.0 ml / min, dissolution solvent: N, N-dimercaptocarhamamine, column temperature: 35 ° C analysis conditions, monodisperse polystyrene as standard, infiltrated by silica gel Chromatography (GPC) determination. φ [Mixedness]: When the components are mixed at the composition ratio shown in Table 3, the case of being a transparent and uniform solution is "good", and the case of a translucent or opaque solution is "poor". [Coating property]: 'The photosensitive resin composition was spin-coated on a 6-inch wafer, and heated on a hot plate at 1 l ° C for 3 minutes to prepare a uniform coating film having a thickness of 20 μm. If the coating film is defective such as crack, it is "poor", and if it is not broken, it is "good". [Forming property]: using an aligner (ΜΑ-150 manufactured by Suss Microtec Co., Ltd.), through a pattern mask, with an exposure of wavelength 305 nm - 32 - 200806712 (29) is 1 000 to 5000 In the manner of mJ/cm2, the wafer with the coating film prepared by the coating test was exposed to ultraviolet rays of a high pressure mercury lamp. Next, it was heated at 1 l ° C for 3 minutes (PEB) on a hot plate, and immersed and developed at 23 ° C for 60 seconds using a 2.38 mass% aqueous solution of tetramethylammonium hydroxide. When the pattern was formed through the mask, it was "good", and when the pattern was not formed, it was "poor" (Synthetic Example 1) 2,2-double (3) was added to a separable flask having a capacity of 500 mL. -Amino-4.hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (monomer "MA-1") 41.1 g, 1,10-decanediamine (monomer "MB" -1") 19.4 g and N-methyl-2-pyrrolidone (hereinafter referred to as "NMP") 195 g. After stirring at room temperature, each monomer was dissolved, and then 44.5 g of 1,2,3,4-butanetetracarboxylic dianhydride (monomer "MC-2") was fed. After stirring at 120 ° C for 5 hours under nitrogen, the mixture was heated to 180 ° C for 5 hours to carry out a dehydration reaction. After the completion of the reaction, the reaction mixture was poured into water, and the product was subjected to reprecipitation, filtration, and vacuum drying to obtain 91 g of a polymer. The molecular weight Mw of the obtained polymer was 23,100. Further, it was confirmed by IR analysis that the absorption of 1 78 8 CHT1 of the quinone imine was observed. (Synthesis Examples 2 to 7) Polymers were obtained in the same manner as in the above Synthesis Example 1, except that the molar ratios shown in Table 1 and the monomers shown in Table 2 were used to mix the monomers and NMP. The yield (g) and molecular weight (Mw) of the obtained polymer are not shown in Table 2. Further, any of the polymers prepared was confirmed by IR analysis to have an absorption of 1 78 8 01^1 of quinone imine-33-200806712 (30). Further, the monomer structures used in the respective synthesis examples are as follows. [化1 5]

-34- 200806712 (31) [Chem. 1 7]

[Table 1]

Single f hidden (Mole Ratio) MA-1 MA-2 MB-1 MB-2 MB-3 MB-4 MC-1 MC-2 MC-3 Synthesis Example 1 50 50 100 Synthesis Example 2 70 30 100 Synthesis Example 3 30 70 100 Synthesis Example 4 90 10 100 Synthesis Example 5 80 20 100 Synthesis Example 6 60 40 100 Synthesis Example 7 80 20 100

-35- (32) 200806712

IR (cm'1) 177 8 1778 1778 1778 1778 1778 1778 M woo ro rsj 1 9800 1 3 20 0 3 4200 3 9 5 0 0 5 6 2 0 0 2 5 600 Yield (g) Os CM ON m ON v〇 ON inch a\ ir> On NMP (g) 195 1 95 1 95 195 tn | ON 240 240 Single (g) MC-3 iT) ΓΟ m MC-2 inch inch o inch (N ON pair (N 卜 m ON卜m MC- 1 Bub (N MB-4 m MB-3 beer MB-2 m CN On MBMB- 1 inch OS Bu Bu A-2 Os o <NM A- 1 CN n (N i-lv 〇<N (N rM Synthesis Example 1 Synthesis Example 2 Synthesis Example 3 Inch Synthesis Example 5 v〇 Synthesis Example 7 36 200806712 (33) (Example 1) 100 parts by mass of a polymer obtained by Synthesis Example 1 170 parts by mass of solvent (ethyl lactate (EL)), 1.5 parts of photoacid generator (B-1), and 15 parts of cross-linking agent (C-1) were mixed to prepare a photosensitive resin composition (implementation) Example 1) The miscibility of the photosensitive resin composition prepared was evaluated as "good", the coating property was evaluated as "good", and the patterning property was evaluated as "good". (Examples 2 to 11, Comparative Examples) 1) In addition to the prescriptions shown in Table 3 A resin composition (Examples 2 to 1:1, Comparative Example 1) was obtained in the same manner as in the above Example 1. The results of evaluation of the miscibility, coatability, and patterning property of the obtained photosensitive resin composition were It is shown in Table 4. In addition, the abbreviation symbol in Table 3 means the following. (Phenol resin) P-1 : m-cresol/p-cresol = 6 0/40 (morbi) Phenolic varnish resin (weight average molecular weight = 8,700 in terms of polystyrene) P-2 : Phenol and xylene glycol dimethyl ether condensation resin (manufactured by Mitsui Chemicals, Inc., trade name: MILEX (registered trademark) XLC-3L) EL : Ethyl lactate (photoacid generator) -37- 200806712 (34) B -1 · Phenylethyl-bis(trichloromethyl)-s-triazine B - 2 · 4, /7 - one - n-Butoxy-1-chayltetrachlorothiophene trifluoromethanesulfonate B - 3 : 2-[2-(Phenyl-2-yl)ethylidene]-4,6-bis (two Chloromethyl)-s-triazine (manufactured by Sanwa Chemical Co., Ltd., trade name: TFE-triazine) B-4 : 2-[2-(5·methylfuran-2-yl)vinyl]-4, 6-bis(trichloromethyl)-s-triazine (manufactured by Sanwa Chemical Co., Ltd., trade name: TME-triazine) (crosslinking agent) C-1: hexa(methoxymethyl)melamine (manufactured by Cytec Industries, trade name "Cymel 3 00" C-2: tetrakis(butoxymethyl) glycoluril (manufactured by Cytec Industries) , trade name "Cymel 1174") C-3 : Made by Japan Epoxy Resin, trade name:

Epicoat (registered trademark) 828 -38- 200806712 (35) [Table 3] Polyphthalocyanine Resin Phenol β mm Solvent Photoacid generator ί Types of parts by mass Parts by mass Parts by mass Parts by mass Example 1 Synthesis Example 1 100 EL 170 B-1 1.5 CI 15 Example 2 Synthesis Example 1 70 P-1 30 EL 150 B-2 2 C-1 20 Example 3 Synthesis Example 2 50 P-2 50 EL 140 B- 1 1 C-1 15 Example 4 Synthesis Example 2 100 EL 150 B-2 4 C-2 20 Example 5 Synthesis Example 3 100 EL 220 B-2 6 C-3 25 Example 6 Synthesis Example 4 80 P-1 20 EL 170 B-1 1 C-2 15 Example 7 Synthesis Example 5 60 P-2 40 EL 170 B-1 0.7 C-2 10 Example 8 Synthesis Example 6 100 EL 260 B-2 2 C-1 20 Implementation Example 9 Synthesis Example 7 100 EL 180 B-1 0.8 C-1 18 Example 10 Synthesis Example 1 60 P-1 40 EL 150 B-3 2 C-2 20 Example 11 Synthesis Example 2 70 P-2 30 EL 140 B-4 1 C-1 15 Comparative Example 1 Synthesis Example 1 100 EL 180 C-1 20

[Table 4] Mixed coating property into patterning Example 1 Good and good Example 2 Good and good Good Example 3 Good and good Good Example 4 Good and good Good Example 5 Good good Good Example 6 Good good Good example 7 Good Good Good Example 8 Good Good Good Example 9 Good Good Good: Practice 'Example 10 Good Good Good: Practical' Example 11 Good Good Good Comparative Example 1 Good Good Good -39- 200806712 (36) [Industry Availability The polymer of the present invention and the photosensitive resin composition containing the same are suitable for use in a surface protective film, an interlayer insulating film, and an insulating film for a high-density mounting substrate, and are extremely industrially advantageous. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a pattern of a semiconductor element having an insulating resin layer formed using the photosensitive resin composition of the present invention. Fig. 2 is a cross-sectional view showing a pattern of a semiconductor element having an insulating resin layer formed using the photosensitive resin composition of the present invention. [Description of main component symbols] 1: substrate, 2: metal pad, 3: insulating film, 4: metal wiring, 5: insulating film.

-40-

Claims (1)

200806712 (1) X. Patent application scope 1. A polymer containing a repeating unit represented by the general formula (1) and a repeating unit represented by the general formula (3). (1) (In the above formula (1), X represents a tetravalent aromatic or aliphatic hydrocarbon group, and A represents a divalent group represented by the following formula (2)) (In the above formula (2), R1 represents a divalent group, R2 independently represents a hydrogen atom, a fluorenyl group or an alkyl group, η1 and η2 represent an integer of 0 to 2, and at least one of η1 and η2 is 1 or more. , at least one of R2 is a hydrogen atom) [Chemical 3] Γ〇〇人人一一Ν X Ν—Β一一 L 0 0 • · (3) -41 - 200806712 (2) (In the above formula (1), X represents a tetravalent aromatic or aliphatic hydrocarbon group, and β represents a substituted or unsubstituted carbon number of 2 to 20. An alkyl group or a divalent group represented by the following formula (4)) • (4) Φ (In the above formula, Z represents a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms). 2. The polymer according to claim 1, wherein X in the formula (1) and the formula (3) is a tetravalent aliphatic hydrocarbon group. (3) A photosensitive resin composition comprising (A) a polymer of the first or second aspect of the patent application, (B) a photoacid generator', and (C) a crosslinking agent. %. The photosensitive resin composition of claim 3, wherein the phenol resin is further contained. 5. The photosensitive resin composition of claim 3, wherein the (C) crosslinking agent has a transsiloxane-based amine group. -42-