TWI761433B - Photosensitive resin composition, cured film, method for producing the same, and electronic component - Google Patents

Abstract

The present invention achieves both chemical resistance and crack resistance of a cured film obtained from a photosensitive resin composition containing a resin having a phenolic hydroxyl group as an alkali-soluble resin. A photosensitive resin composition containing a resin (A) having a phenolic hydroxyl group, a photoacid generator (B), and a maleimide group-containing compound (C).

Description

Photosensitive resin composition, cured film, method for producing the same, and electronic component

The present invention relates to a photosensitive resin composition preferably used for the formation of a surface protective film, an interlayer insulating film, etc., which electronic parts and the like have, and further relates to a cured film formed from the composition and the like. Its manufacturing method, and the electronic component which has the said cured film.

Conventionally, various photosensitive resin compositions have been proposed as materials used for forming surface protective films, interlayer insulating films, and the like in semiconductor elements used in electronic components. For example, a photosensitive resin composition containing a resin having a phenolic hydroxyl group as an alkali-soluble resin has been studied (Patent Document 1 and Patent Document 2). [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-186300 [Patent Document 2] Japanese Patent Laid-Open No. 2013-210606

In a photosensitive resin composition containing a resin having a phenolic hydroxyl group as an alkali-soluble resin, it is difficult to achieve both chemical resistance and crack resistance of the cured film obtained from the photosensitive resin composition. The following reasons. When, for example, only an epoxy-based crosslinking agent is used for the crosslinking of a resin having a phenolic hydroxyl group, a hydroxyl group is generated by ring-opening of the epoxy ring during the crosslinking reaction, and if only a methylol-based crosslinking agent is used If the agent is used, the phenolic hydroxyl group will remain after the cross-linking reaction, so the chemical resistance will be deteriorated. On the other hand, in order to improve chemical resistance, if the crosslinking density of a cured film is increased using an epoxy-based crosslinking agent or a methylol-based crosslinking agent, the elongation properties of the cured film will decrease, resulting in poor crack resistance.

The inventors of the present invention have made diligent studies in order to solve the above-mentioned problems. As a result, the photosensitive resin composition of the following composition containing the resin which has a phenolic hydroxyl group discovered that the said subject can be solved, and completed this invention.

The present invention is, for example, the following [1] to [8]. [1] A photosensitive resin composition comprising: a resin (A) having a phenolic hydroxyl group, a photoacid generator (B), and a maleimide group-containing compound (C).

[2] The photosensitive resin composition according to the above [1], wherein the maleimide group-containing compound (C) includes a compound (C1) having two or more maleimide groups .

[3] The photosensitive resin composition according to the above [1] or [2], which further contains a crosslinking agent (D) (however, the maleimide group-containing compound (C) is excluded).

[4] The photosensitive resin composition according to the above [3], wherein the crosslinking agent (D) contains an epoxy-based crosslinking agent (D1), and has at least two components consisting of -CH ₂ At least one crosslinking agent among the crosslinking agents (D2) of the group represented by OR (in the above formula, R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an acyl group having 2 to 10 carbon atoms).

[5] The photosensitive resin composition according to any one of the above [1] to [4], wherein the photoacid generator (B) contains a quinonediazide compound (B1).

[6] A method for producing a cured film, comprising: forming a resin film of the photosensitive resin composition according to any one of the above [1] to [5] on a support; The step of exposing the film; the step of developing the resin film with an alkaline developer to form a patterned resin film; and the step of heating the patterned resin film.

[7] A cured film formed from the photosensitive resin composition according to any one of the above [1] to [5].

[8] An electronic component having the cured film according to the above [7].

According to this invention, the chemical resistance and crack resistance of the cured film obtained from the photosensitive resin composition containing the resin which has a phenolic hydroxyl group as an alkali-soluble resin can be made compatible.

Hereinafter, the embodiment for implementing the present invention will also be described including preferred embodiments. [Photosensitive resin composition] The photosensitive resin composition of the present invention contains a resin (A) having a phenolic hydroxyl group, a photoacid generator (B), and a maleimide group-containing compound (C) described below. ).

<Resin (A)> Examples of the resin (A) having a phenolic hydroxyl group include a polymer (a1) (hereinafter, also referred to as "polymerization") containing a structural unit derived from a radically polymerizable monomer having a phenolic hydroxyl group. (a1)｣), novolac resin (a2), polybenzoxazole precursor (a3), polyimide with phenolic hydroxyl group, phenol-xylylene glycol condensation resin, methyl alcohol Phenol-stubble diol condensation resin, phenol-dicyclopentadiene condensation resin. Among these, from the viewpoint of the curability of the composition, the polymer (a1), the novolak resin (a2), and the polybenzoxazole precursor (a3) are preferred, and the polymer (a3) is more preferred. a1). One type of resin (A) may be used, or two or more types may be used in combination.

<<Polymer (a1)>> The polymer (a1) includes, for example, a homopolymer or copolymer of a radically polymerizable monomer having a phenolic hydroxyl group, a radically polymerizable monomer having a phenolic hydroxyl group, and other radicals. Copolymers of polymerizable monomers.

Examples of the radically polymerizable monomer having a phenolic hydroxyl group include o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene, o-isopropenyl phenol, m-isopropenyl phenol, and p-isopropenyl phenol. Hydroxystyrene-based monomers; Hydroxystyrene-based monomers have one or more hydrogen atoms bonded to the aromatic ring carbon through alkyl, alkoxy, halogen, haloalkyl, nitro or cyano Substituted monomers; vinyl hydroquinone, 5-vinyl gallic phenol, 6-vinyl gallic phenol. Moreover, the monomer which the phenolic hydroxyl group of the said monomer was protected by an alkyl group, a silyl group, etc. can also be mentioned. When using the monomer which protected the said phenolic hydroxyl group, it can become the polymer (a1) which has a phenolic hydroxyl group by removing this protection after forming a polymer. These monomers may be used alone, or two or more of them may be used in combination.

Examples of other radically polymerizable monomers include styrenes such as styrene, α-methylstyrene, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether. Monomers; monomers in which one or more hydrogen atoms of styrene-based monomers bonded to aromatic ring carbons are substituted by alkyl, alkoxy, halogen, haloalkyl, nitro or cyano groups; Dienes such as butadiene, isoprene, and chloroprene; unsaturated carboxylic acids such as unsaturated monocarboxylic acids, unsaturated dicarboxylic acids and their half esters; Monomers in which p-vinyl benzoic acid or these monomers have one or more hydrogen atoms bonded to aromatic ring carbons substituted with alkyl, alkoxy, halogen, haloalkyl, nitro or cyano groups ; (Meth)acrylates such as glycidyl (meth)acrylate, (meth)acrylonitrile, acrolein, vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinyl Pyrrolidone, vinylpyridine, vinyl acetate, N-phenylmaleimide, N-cyclohexylmaleimide, N-(meth)acryloyloxyphthalimide, (3,4-Epoxycyclohexyl)methyl (meth)acrylate. These monomers may be used alone, or two or more of them may be used in combination.

In the polymer of the radical polymerizable monomer, the sum of the content ratios relative to the structural unit derived from the radical polymerizable monomer having a phenolic hydroxyl group and the structural unit derived from the other radical polymerizable monomer 100 mol %, the content ratio of the structural unit derived from the radically polymerizable monomer having a phenolic hydroxyl group is preferably 30 mol % or more, more preferably 40 mol % to 95 mol %.

Preferred examples of the polymer of the radically polymerizable monomer include poly-p-hydroxystyrene, m-hydroxystyrene/p-hydroxystyrene copolymer, p-hydroxystyrene/styrene copolymer, p-hydroxystyrene/ p-Vinylbenzyl glycidyl ether/styrene copolymer, p-hydroxystyrene/(3,4-epoxycyclohexyl)methyl methacrylate copolymer, p-hydroxystyrene/methacrylic acid (3,4- Hydroxystyrene-based polymers such as epoxycyclohexyl) methyl ester/styrene copolymers.

<<Novolak Resin (a2)>> The novolak resin (a2) can be obtained, for example, by condensing phenols and aldehydes in the presence of an acid catalyst. Examples of phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butylphenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol, 2, 3,5-trimethylphenol, 3,4,5-trimethylphenol, catechol, resorcinol, gallic phenol, α-naphthol, β-naphthol. Examples of aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, benzaldehyde, and sulfalaldehyde.

Specific examples of the novolak resin (a2) include: phenol/formaldehyde condensed novolak resin, cresol/formaldehyde condensed novolak resin, cresol/salalaldehyde condensed novolak resin, phenol-naphthol/formaldehyde condensed novolak resin, A novolak resin is a resin in which a rubber-like polymer (polymer) having a polymerizable vinyl group, such as a butadiene-based polymer, is modified (for example, the resin described in Japanese Patent Laid-Open No. 2010-015101).

<<Polybenzoxazole Precursor (a3)>> The polybenzoxazole precursor (a3) includes, for example, a polymer having a structural unit represented by formula (1). The polybenzoxazole precursor (a3) may be a polymer having one structural unit or a polymer having two or more structural units.

式（1）中，X為2價的有機基，Y為4價的含芳香環的基，鍵結於Y的N與OH形成對，各對的N與OH鍵結於同一芳香環上的相鄰的碳原子。[hua 1]

In formula (1), X is a divalent organic group, Y is a tetravalent aromatic ring-containing group, N and OH bonded to Y form pairs, and N and OH of each pair are bonded to the same aromatic ring. adjacent carbon atoms.

The divalent organic group in X includes, for example, a halogenated arylidene group having 6 to 20 carbon atoms, a divalent group represented by the formula (g1): -Ar ¹ -R ¹ -Ar ¹ -, carbon Alkanediyl having 1 to 10 carbons, and cycloalkanediyl having 3 to 20 carbons. In the formula (g1), Ar ¹ is each independently a halogenated arylidene group having 6 to 20 carbon atoms, and R ¹ is a direct bond or a divalent group. Examples of the divalent group include an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, and a halogenated alkanediyl group having 1 to 10 carbon atoms.

Examples of arylidene groups having 6 to 20 carbon atoms that may be halogenated include phenylene groups, methylphenylene groups, tert-butylphenylene groups, fluorophenylene groups, chlorophenylene groups, bromophenylene groups, phenylene groups naphthyl. Examples of the alkanediyl group having 1 to 10 carbon atoms include a methylene group and an ethane-1,2-diyl group. Examples of the halogenated alkanediyl group having 1 to 10 carbon atoms include a methylene group, a dimethylmethylene group, and a bis(trifluoromethyl)methylene group. As a C3-C20 cycloalkanediyl group, a cyclobutanediyl group, a cyclopentanediyl group, and a cyclohexanediyl group are mentioned, for example.

Examples of the tetravalent aromatic ring ^- containing group in Y include ^tetravalent groups derived from aromatic hydrocarbons such as a benzene ring, a naphthalene ring, an anthracene ring, and the like ^; The tetravalent base indicated by <.

In formula (g2), Ar ² is each independently a trivalent group derived from an aromatic hydrocarbon such as a benzene ring, a naphthalene ring, and an anthracene ring, and R ² is a direct bond or a divalent group. Examples of the divalent group include an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, and a halogenated alkanediyl group having 1 to 10 carbon atoms.

Examples of the aromatic hydrocarbons that form Y or Ar ² include aromatic hydrocarbons having 6 to 20 carbon atoms such as benzene, naphthalene, and anthracene. Examples of the halogenated alkanediyl group having 1 to 10 carbon atoms include a methylene group, a dimethylmethylene group, and a bis(trifluoromethyl)methylene group.

In the polybenzoxazole precursor (a3), the content ratio of the structural unit represented by the formula (1) is usually 70% by mass or more, preferably 80% by mass or more, and more preferably 90% by mass or more. The content ratio can be measured, for example, by a nuclear magnetic resonance method.

<<Other Resins>> Other specific examples of the resin (A) include: Japanese Patent Laid-Open No. 2002-139835, Japanese Patent Laid-Open No. 2004-240144, Japanese Patent Laid-Open No. 2007-056108, and Japanese Patent Laid-Open No. 2010 - Resins described in Japanese Patent Laid-Open No. 102271, Japanese Patent Laid-Open No. 2007-192936, Japanese Patent Laid-Open No. 2009-237125, and Japanese Patent Laid-Open No. 2012-123378. The details of the manufacturing method of resin (A) are also described in these documents.

<<Constitution of Resin (A)>> From the viewpoints of the analytical properties of the photosensitive resin composition, the elastic modulus of the cured film, and the crack resistance, the resin (A) is subjected to gel permeation chromatography (Gel Permeation Chromatography, The weight average molecular weight (Mw) measured by the GPC) method is usually 1,000 to 200,000 in terms of polystyrene, preferably 2,000 to 100,000, and more preferably 5,000 to 50,000. Details of the method for measuring Mw are as described in Examples.

The resin (A) is preferably a resin in which 0.001 mg/ml or more is dissolved in an aqueous tetramethylammonium hydroxide solution (23° C.) having a concentration of 2.38% by mass. The content of the resin (A) is usually 30 to 95% by mass, preferably 40 to 90% by mass, and more preferably 50% by mass relative to 100% by mass of the solid content of the photosensitive resin composition of the present invention. ~85% by mass. When the content rate of resin (A) is in the said range, there exists a tendency for the photosensitive resin composition which can form the cured film excellent in resolution to be obtained. The solid content refers to all components other than the solvent described later.

<Photoacid generator (B)> The photosensitive resin composition of this invention contains a photoacid generator (B). The photoacid generator (B) is a compound that generates an acid by treatment including light irradiation. By the exposure treatment of the resin film formed from the photosensitive resin composition of the present invention, an acid is generated in the exposed part based on the photoacid generator (B), and by the action of the acid, the exposed part is directed toward the alkaline developer. Solubility changes.

The photosensitive resin composition of this invention may be either positive type or negative type. The type of the photoacid generator (B) can be appropriately selected according to the positive type or the negative type. Examples of the photoacid generator (B) include photoacid generators that can be used in positive resists such as compounds having a quinonediazide group (quinonediazide compound); onium salt compounds and halogen-containing compounds , sulfonic acid compounds, sulfonic acid compounds, sulfonimide compounds, diazomethane compounds, etc., are photoacid generators that generate strong acids by light irradiation and can be used in negative resists. Hereinafter, the quinonediazide compound is also referred to as "quinonediazide compound (B1)", and the photoacid generators exemplified above are also referred to as "other photoacid generators (B2)".

The quinonediazide compound (B1) generates a carboxylic acid by a treatment including light irradiation and development with an alkaline developer. The resin film obtained from the composition containing a quinonediazide compound (B1) is a film which is hardly soluble with respect to an alkaline developer. Therefore, by using the quinonediazide compound (B1), a positive pattern can be formed.

The other acid generator (B2) is a compound which generates a strong acid by light irradiation. The resin film obtained from the composition containing another acid generator (B2) forms a crosslinked structure by acting on the crosslinking agent (D) and the like described later by the acid generated by light irradiation. Therefore, by using another acid generator (B2), a negative pattern can be formed.

<<quinonediazide compound (B1)>> The quinonediazide compound (B1) includes, for example, a naphthoquinonediazide compound, and is a compound having one or more phenolic hydroxyl groups and 1,2-naphthoquinonediazide-4 -Ester compound of sulfonic acid or 1,2-naphthoquinonediazide-5-sulfonic acid. Specific examples of the compound having one or more phenolic hydroxyl groups include compounds described in paragraphs [0065] to [0070] of JP 2014-186300 A, which are described in the present specification.

Specific examples of the quinonediazide compound (B1) include, for example, those selected from the group consisting of 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, and 2,3,4-trihydroxyl Benzophenone, 2,3,4,4'-Tetrahydroxybenzophenone, 2,3,4,2',4'-Pentahydroxybenzophenone, Tris(4-hydroxydiphenyl)methane , Tris(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 1,3-bis[1-(4-hydroxyphenyl)-1-methyl ethyl]benzene, 1,4-bis[1-(4-hydroxyphenyl)-1-methylethyl]benzene, 4,6-bis[1-(4-hydroxyphenyl)-1-methyl] ethyl]-1,3-dihydroxybenzene, and 1,1-bis(4-hydroxyphenyl)-1-[4-[1-(4-hydroxyphenyl)-1-methylethyl] A compound in phenyl]ethane, an ester compound with 1,2-naphthoquinonediazide-4-sulfonic acid or 1,2-naphthoquinonediazide-5-sulfonic acid.

The quinonediazide compound (B1) may be used alone or in combination of two or more. In the photosensitive resin composition of the present invention, when the quinonediazide compound (B1) is used as the photoacid generator (B), the content of the quinonediazide compound (B1) is based on 100 mass of the resin (A) The part is usually 5 parts by mass to 50 parts by mass, preferably 10 parts by mass to 40 parts by mass, and more preferably 15 parts by mass to 35 parts by mass. When the content of the quinonediazide compound (B1) is equal to or more than the above lower limit value, the residual film ratio of the unexposed portion increases, and it becomes easy to obtain an image faithful to the pattern mask. When the content of the quinonediazide compound (B1) is equal to or less than the above upper limit value, a resin film having an excellent pattern shape is easily obtained, and foaming during film formation tends to be prevented.

<<Other Acid Generators (B2)>> The other acid generators (B2) are, for example, at least one selected from the group consisting of onium salt compounds, halogen-containing compounds, sulfur compounds, sulfonic acid compounds, sulfonimide compounds, and diazomethane compounds . Specific examples of these compounds include compounds described in paragraphs [0074] to [0079] of JP 2014-186300 A, which are described in the present specification.

In the photosensitive resin composition of the present invention, when another acid generator (B2) is used as the photoacid generator (B), the content of the acid generator (B2) is usually 100 parts by mass of the resin (A). 0.1 to 10 parts by mass, preferably 0.3 to 5 parts by mass, more preferably 0.5 to 5 parts by mass. When content of another acid generator (B2) is more than the said lower limit, hardening of an exposure part becomes sufficient, and it becomes easy to improve heat resistance. When content of another acid generator (B2) is below the said upper limit, it becomes easy to obtain the pattern with high resolution, and transparency with respect to exposure light falls.

<Maleimide group-containing compound (C)> The photosensitive resin composition of the present invention contains a maleimide group-containing compound (C). The maleimide group-containing compound (C) is a compound having one or more, preferably two or more maleimide groups, and the upper limit of the number of maleimide groups is preferably 10, more preferably 5.

The maleimide group is a group that acts directly on a phenolic hydroxyl group during thermal crosslinking or the like, and for example, it is considered that the following reaction proceeds. In this reaction, the hydroxyl group is not newly formed, and the phenolic hydroxyl group is consumed.

因而，藉由感光性樹脂組成物含有含馬來醯亞胺基的化合物（C），例如能夠以於後烘烤時消耗樹脂（A）的酚性羥基的形式形成交聯結構。此處，藉由硬化膜中的酚性羥基減少，即便不那麼提高交聯密度，亦能夠提升耐化學品性。[hua 2]

Therefore, when the photosensitive resin composition contains the maleimide group-containing compound (C), a crosslinked structure can be formed, for example, in such a manner that the phenolic hydroxyl group of the resin (A) is consumed at the time of post-baking. Here, by reducing the phenolic hydroxyl group in the cured film, the chemical resistance can be improved even if the crosslinking density is not so increased.

The maleimide group-containing compound (C) is preferably a compound (C1) having two or more maleimide groups (hereinafter, also referred to as "crosslinkable maleimide compound (C1)" ), the “cross-linkable maleimide compound (C1) includes, for example, a compound represented by formula (C1). By using the cross-linkable maleimide compound (C1), it is composed of a photosensitive resin. The cured film formed by the material can further exert the improvement effect of the chemical resistance.

式（C1）中，R^C1 為有機基，有機基例如可列舉：烷烴二基、伸芳基等含芳香環的基、伸環烷基等含脂環的基、源於自不飽和脂肪酸所獲得的二聚酸的基。[hua 3]

In the formula (C1), R ^C1 is an organic group, and the organic group includes, for example, an aromatic ring-containing group such as an alkanediyl group and an aryl-extended group, an alicyclic ring-containing group such as a cyclo-extended alkyl group, and a group derived from an unsaturated fatty acid. The base of the dimer acid obtained.

The number of carbon atoms in the alkanediyl group is usually 1-20, preferably 2-10. The aromatic ring-containing group and the alicyclic group-containing group include, for example, a group represented by -AXA-, a group represented by -AOAXAOA-, in addition to an aryl extended group having 6 to 20 carbon atoms and a cycloextended alkyl group having 3 to 20 carbon atoms. A base represented, a base represented by -R ^C2 -AR ^C2 -. A is a benzene ring or a cyclohexane ring, and may each independently have one or more substituents such as an alkyl group having 1 to 10 carbon atoms and an alkoxy group having 1 to 6 carbon atoms. X is a direct bond, -O-, -SO ₂ -, an alkanediyl group having 1 to 10 carbon atoms, or an alicyclic group having 3 to 20 carbon atoms. R ^C2 is an alkanediyl group having 1 to 10 carbon atoms.

The alkanediyl group includes a methylene group, an ethanediyl group, a propanediyl group, a hexanediyl group, an octanediyl group, a nonanediyl group, a decanediyl group, and the like. As an arylidene group, a phenylene group, a methylphenylene group, a tert-butylphenylene group, a naphthylene group, etc. are mentioned. As a cycloextended alkyl group, a cyclobutanediyl group, a cyclopentanediyl group, a cyclohexanediyl group, etc. are mentioned. As an alkyl group, a methyl group, an ethyl group, a propyl group, etc. are mentioned. As an alkoxy group, a methoxy group, an ethoxy group, etc. are mentioned. As an alicyclic ring, a cyclohexane ring, a tricyclodecane ring, etc. are mentioned.

Specific examples of the crosslinkable maleimide compound (C1) include N,N'-ethylidenebismaleimide, N,N'-hexamethylenebismaleimide, for example. Amine, N,N'-(2,2,4-trimethylhexane)bismaleimide, N,N'-p-phenylene bismaleimide, N,N'-dimaleimide Phenylbismaleimide, N,N'-2,4-methylenebismaleimide, N,N'-2,6-methylenebismaleimide, N ,N'-p-xylylenebismaleimide, N,N'-m-xylylenebismaleimide, N,N'-(1,3-dimethylenecyclohexane)bis Maleimide, N,N'-(1,4-dimethylenecyclohexane)bismaleimide, N,N'-(4,4'-biphenylene)bismaleimide Imine, N,N'-(4,4'-diphenylmethane)bismaleimide, N,N'-(4,4'-dicyclohexylmethane)bismaleimide, N , N'-(4,4'-diphenyloxy) bismaleimide, N,N'-(4,4'-diphenyloxy) bismaleimide.

As other specific examples of the crosslinkable maleimide compound (C1), for example, bis[4-(4-maleimidephenoxy)phenyl]methane, 2,2-bis[4 -(4-Maleimidophenoxy)phenyl]propane, bis[4-(4-maleimidophenoxy)phenyl]octane, bis[4-(4-maleimide) iminophenoxy)phenyl]decane, bis[4-(4-maleimidophenoxy)phenyl]cyclohexane, bis[4-(4-maleimidophenoxy) )phenyl]-tricyclo-[ ^5.2.1.O2.6 ]decane.

At least one hydrogen atom in the benzene ring and the cyclohexane ring in the exemplified compounds may also be independently substituted with a C _1-10 alkyl group, respectively. Examples of the alkyl group include a methyl group, an ethyl group, and a propyl group.

In addition, a bismaleimide compound in which both ends of the polyoxyalkylene diamine are sealed with maleic anhydride can also be used. For example, the bismaleimide compound in which both ends of polyoxyethylene diamine are sealed with maleic anhydride, the bismaleimide compound in which both ends of polyoxypropylene diamine are sealed with maleic anhydride, the A bismaleimide compound in which both ends of oxybutenediamine are sealed with maleic anhydride.

In addition, as the maleimide group-containing compound (C), a compound (C2) having one maleimide group (hereinafter, also referred to as "non-crosslinkable maleimide compound (C2)" may be used. '). In the case of using the non-crosslinkable maleimide compound (C2), for example, the phenolic hydroxyl group of the resin (A) can also be consumed during post-baking, so that the chemical resistance of the obtained film can be improved. Moreover, when using a non-crosslinkable maleimide compound (C2), it is preferable to use a crosslinking agent (D) from a sclerosing viewpoint.

Examples of the non-crosslinkable maleimide compound (C2) include NC _6-20 arylmaleimide such as N-phenylmaleimide and N-o-methylphenylmaleimide. Amines; N-methylmaleimide, N-propylmaleimide, N-butylmaleimide, N-decylmaleimide, etc. NC _1-20 alkyl maleimide Imide; N-cyclohexylmaleimide and other NC _3-20 cycloalkylmaleimide.

The maleimide group-containing compound (C) may be used alone or in combination of two or more. In the photosensitive resin composition of the present invention, the content of the maleimide group-containing compound (C) is usually 0.1 parts by mass to 200 parts by mass, preferably 1 part by mass to 100 parts by mass of the resin (A). 100 parts by mass, more preferably 5 parts by mass to 50 parts by mass. When content of the maleimide group-containing compound (C) is within the above range, the cured film obtained from the photosensitive resin composition is excellent in both chemical resistance and crack resistance.

<Crosslinking agent (D)> The photosensitive resin composition of the present invention may contain a crosslinking agent (D) as an optional Element. However, the maleimide group-containing compound (C) is excluded from the self-crosslinking agent (D). The crosslinking agent (D) functions as a resin (A) or a crosslinking component (hardening component) in which the crosslinking agents react with each other.

The crosslinking agent (D) preferably contains an epoxy-based crosslinking agent (D1) and has at least two groups represented by -CH ₂ OR (in the formula, R is a hydrogen atom and has 1 to 1 carbon atoms) At least one cross-linking agent in the cross-linking agent (D2) of an alkyl group of 10 or an acyl group of 2 to 10 carbon atoms).

Examples of the epoxy-based crosslinking agent (D1) include: phenol novolak epoxy resin, cresol novolak epoxy resin, naphthol novolak epoxy resin, and naphthol-phenol co-condensation novolak epoxy resin Resin, naphthol-cresol co-condensation novolac type epoxy resin, bisphenol type epoxy resin, biphenyl type epoxy resin, trisphenol type epoxy resin, tetraphenol type epoxy resin, phenol-xylylene type Epoxy resin, naphthol-xylylene type epoxy resin, phenol-dicyclopentadiene type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, biphenylaralkyl Base type epoxy resin, resorcin type epoxy resin, hydroquinone type epoxy resin, catechol type epoxy resin, dihydroxynaphthalene type epoxy resin, alicyclic epoxy resin , Aliphatic epoxy resin.

The crosslinking agent (D2) has at least two groups represented by _-CH2OR . In the formula, R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an amide group having 2 to 10 carbon atoms, preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, and the like. Examples of the acyl group include an acetyl group and the like. Here, regarding the group represented by -CH ₂ OR, it is considered that the methylene group reacts with the aromatic ring of the resin (A) by heat or acid, and the crosslinking reaction proceeds.

The crosslinking agent (D2) includes, for example, a compound having two or more groups represented by formula (d2-1), a compound having two or more groups represented by formula (d2-2), and a methylol-containing phenol. Compounds, alkylmethylol-containing phenolic compounds, acyloxymethyl-containing phenolic compounds.

式（d2-1）及式（d2-2）中，m為1或2，n為0或1，m+n為2，R為氫原子、碳數1～10的烷基或碳數2～10的醯基，較佳為氫原子或碳數1～6的烷基，*為結合鍵。[hua 4]

In formula (d2-1) and formula (d2-2), m is 1 or 2, n is 0 or 1, m+n is 2, R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a carbon number 2 The acyl group of ~10 is preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and * is a bond.

Examples of the crosslinking agent (D2) include nitrogen compounds such as polymethylolated melamine, polymethylolated glycoluril, polymethylolated guanamine, and polymethylolated urea; the activity of the nitrogen compounds A compound in which all or a part of the methylol group (CH ₂ OH group bonded to the N atom) is alkyl-etherified or oxy-alkylated. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, a propyl group, and a butyl group, and these may be the same or different from each other. In addition, the active methylol group which has not been alkyl-etherified or oxyalkylated can be self-condensed in one molecule or condensed between two molecules, and as a result, an oligomer component can be formed.

As a crosslinking agent (D2), the crosslinking agent described in Unexamined-Japanese-Patent No. 6-180501, Unexamined-Japanese-Patent No. 2006-178059, and Unexamined-Japanese-Patent No. 2012-226297 is mentioned, for example. Specifically, melamine-based crosslinking agents such as polymethylolated melamine, hexamethoxymethyl melamine, hexaethoxymethyl melamine, hexapropoxymethyl melamine, and hexabutoxymethyl melamine may be mentioned. ; Glycoluril based cross-linking agents such as polymethylolated glycoluril, tetramethoxymethyl glycoluril, tetrabutoxymethyl glycoluril; 3,9-bis[2-(3,5-diamino) -2,4,6-Triazaphenyl)ethyl]2,4,8,10-tetraoxospiro[5.5]undecane, 3,9-bis[2-(3,5-diamine hydroxymethylated guanamines such as guanamines such as yl-2,4,6-triazaphenyl)propyl]2,4,8,10-tetraoxospiro[5.5]undecane, and compounds in the compounds A guanamine-based crosslinking agent such as a compound in which all or a part of the active methylol group is alkyl-etherified or oxo-oxylated. Among these, a melamine-based crosslinking agent and a guanamine-based crosslinking agent are preferred.

Examples of the methylol group-containing phenol compound, the alkylmethylol group-containing phenol compound, and the acyloxymethyl group-containing phenol compound include compounds represented by the following formulas, 2,6-dimethoxymethyl yl-4-tert-butylphenol, 2,6-dimethoxymethyl-p-cresol, 2,6-diethyloxymethyl-p-cresol.

交聯劑（D2）可使用一種，或者可併用兩種以上來使用。[hua 5]

One type of crosslinking agent (D2) may be used, or two or more types may be used in combination.

As the crosslinking agent (D), other crosslinking agents (D3) other than the epoxy-based crosslinking agent (D1) and the crosslinking agent (D2) may be used. Examples of other crosslinking agents (D3) include oxetane-containing compounds, oxazoline ring-containing compounds, isocyanate group-containing compounds (including those obtained by blocking), and aldehyde group-containing phenolic compounds .

In the photosensitive resin composition of the present invention, the content of the crosslinking agent (D) is usually 1 to 60 parts by mass, preferably 3 to 50 parts by mass, preferably 3 to 50 parts by mass, relative to 100 parts by mass of the resin (A). Preferably it is 5 mass parts - 40 mass parts. When content of a crosslinking agent (D) exists in the said range, the cured film excellent in both chemical resistance and crack resistance can be formed. In addition, the composition has excellent curability.

<Solvent> The photosensitive resin composition of this invention may contain a solvent. By using a solvent, the handleability of the photosensitive resin composition of the present invention can be improved, or the viscosity or storage stability can be adjusted.

Examples of the solvent include: ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate and ethylene glycol monoethyl ether acetate; propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol propylene glycol monoalkyl ethers such as monobutyl ether; propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dipropyl ether, propylene glycol dibutyl ether and other propylene glycol dialkyl ethers; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate Esters, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate and other propylene glycol monoalkyl ether acetates; ethyl cellosolve, butyl cellosolve and other cellosolves; butyl carbitol and other carbitol Alcohols; lactate esters such as methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate; ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, acetic acid Aliphatic carboxylic acid esters such as n-amyl, isoamyl acetate, isopropyl propionate, n-butyl propionate, isobutyl propionate; methyl 3-methoxypropionate, 3-methoxypropionate Acid ethyl ester, methyl 3-ethoxy propionate, ethyl 3-ethoxy propionate, methyl pyruvate, ethyl pyruvate and other esters; 2-heptanone, 3-heptanone, 4-heptanone Ketones such as heptanone and cyclohexanone; N-dimethylformamide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone and other amides; Lactones such as γ-butyrolactone; Aromatic hydrocarbons such as toluene and xylene.

Among these, lactones, lactate esters, propylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ethers are preferred; γ-butyrolactone, ethyl lactate, propylene glycol monomethyl ether ethyl are more preferred acid ester, propylene glycol monomethyl ether.

One type of solvent may be used, or two or more types may be used in combination. When using a solvent, the content rate of the solvent in the photosensitive resin composition of this invention is 10 mass % - 95 mass % normally, Preferably it is 30 mass % - 90 mass %.

<Other Additives> The photosensitive resin composition of the present invention may contain, in addition to the above, an adhesion adjuvant, a cross-linked fine particle, a leveling agent, a surfactant, a sensitizer, within a range that does not impair the purpose and properties of the present invention. additives, inorganic fillers, quenchers, and alkali solubility enhancers.

<Preparation method of photosensitive resin composition> The photosensitive resin composition of this invention can be prepared by uniformly mixing each component. Moreover, in order to remove a foreign material, after mixing each component uniformly, you may filter the obtained mixture with a filter etc..

THE CURRED FILM AND THE MANUFACTURING METHOD THEREOF The cured film of this invention is formed from the said photosensitive resin composition. By using the photosensitive resin composition, a patterned cured film having high chemical resistance and crack resistance and high resolution can be produced.

Therefore, the photosensitive resin composition of the present invention can be preferably used for the formation of cured films and insulating films, and can be preferably used, for example, as a surface of electronic parts such as circuit boards (semiconductor elements), semiconductor packages, and display elements. Forming materials for protective films, interlayer insulating films, planarizing films, etc., or insulating film materials for high-density mounting substrates.

The manufacture example of the cured film of this invention is shown below. This production example includes: a step of forming a resin film of the photosensitive resin composition of the present invention on a support (film forming step); and a step of exposing the resin film through a desired pattern mask (exposure step) ; The resin film is developed by an alkaline developer, and in the case of a positive type, the exposed part is dissolved and removed, and in the case of a negative type, the non-exposed part is dissolved and removed, thereby forming on the support. A desired step of patterning the resin film (developing step); and a step of heating the patterned resin film (heating step).

[1] Film forming step In the film forming step, the photosensitive resin composition is applied on a support so that the film thickness of the finally obtained cured film may be, for example, 0.1 μm to 100 μm. This is heated at, for example, 50° C. to 140° C. for 10 seconds to 360 seconds using an oven or a hot plate (pre-baking). In this way, the resin film is formed on the support.

Examples of the support include silicon wafers, compound semiconductor wafers, wafers with metal thin films, glass substrates, quartz substrates, ceramic substrates, aluminum substrates, and substrates having semiconductor wafers on the surfaces of these supports. The coating method includes, for example, a dipping method, a spray method, a bar coating method, a roll coating method, a spin coating method, a curtain coating method, a gravure printing method, a screen printing method, and an inkjet method.

[2] Exposure Step In the exposure step, a desired pattern mask is interposed, and the resin film is exposed using, for example, a contact aligner, a stepper, or a scanner. The exposure light includes ultraviolet rays, visible rays, and the like, and for example, light having a wavelength of 200 nm to 500 nm (eg, i-ray (365 nm)) is used. The exposure dose of actinic rays varies depending on the type of each component in the photosensitive resin composition, the mixing ratio, the thickness of the resin film, etc., but the exposure dose is usually 100 mJ/cm ² to 5,000 mJ/cm ² .

Moreover, in the case of a negative type, you may perform heat processing of a resin film after exposure. The conditions of the heat treatment vary depending on the content and film thickness of each component of the photosensitive resin composition, but are usually performed at 70°C to 150°C, preferably 80°C to 120°C for about 1 minute to 60 minutes. .

[3] Development step In the development step, the resin film is developed with an alkaline developer, and in the case of a positive type, the exposed part is dissolved and removed, and in the case of a negative type, the non-exposed part is dissolved and removed , thereby forming the desired pattern on the support. As a development method, a liquid-overlap development method etc. are mentioned. The development conditions are, for example, about 1 minute to 10 minutes at 5°C to 40°C.

Examples of the alkaline developer include those obtained by dissolving basic compounds such as sodium hydroxide, potassium hydroxide, ammonia water, tetramethylammonium hydroxide, and choline in water so as to have a concentration of 1% by mass to 10% by mass. Alkaline aqueous solution. For example, an appropriate amount of water-soluble organic solvents such as methanol and ethanol, surfactants and the like can be added to the alkaline aqueous solution. In addition, after developing a resin film with an alkaline developing solution, it can wash|clean with water, and can be dried.

[4] Heating step The heating step is, for example, a step performed in order to fully express the properties as an insulating film, and the pattern is cured by heating (post-baking). The curing conditions are not particularly limited, but according to the application of the cured film, for example, it is heated at a temperature of 100° C. to 350° C. for about 30 minutes to 10 hours. In order to sufficiently advance hardening or prevent deformation of the pattern shape, heating may be performed in multiple stages. As described above, a cured film can be obtained.

[ELECTRONIC COMPONENTS] When the photosensitive resin composition of the present invention is used, an electronic component having the cured film, for example, one having one or more cured films selected from the group consisting of a surface protective film, an interlayer insulating film, and a planarizing film can be produced. Electronic components such as circuit boards (semiconductor elements), semiconductor packages, or display elements. [Example]

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In the description of the following examples and the like, unless otherwise specified, "parts" are used in the meaning of "parts by mass".

1. Measurement method of physical properties Measurement method of weight average molecular weight (Mw) of resin (A) Mw was measured by gel permeation chromatography under the following conditions.・Column: TSK-M and TSK2500 manufactured by Tosoh Corporation were connected in series ・Solvent: Tetrahydrofuran ・Temperature: 40°C ・Detection method: Refractive index method ・Standard material: Polystyrene ・GPC apparatus: manufactured by Tosoh Corporation Apparatus name "HLC-8220-GPC" Method for measuring the content of the structural unit of the resin (A) The content of the structural unit was measured by ¹³ C-NMR.

2. Synthesis of Resin (A) [Synthesis Example 1] Synthesis of Copolymer (a-1) 70 parts of p-tertiary butoxystyrene and 10 parts of styrene were dissolved in 150 parts of propylene glycol monomethyl ether, and the mixture was heated under nitrogen. The reaction temperature was kept at 70° C. under ambient conditions, and polymerization was performed for 10 hours using 4 parts of azobisisobutyronitrile. Then, sulfuric acid was added to the reaction solution, the reaction temperature was kept at 90° C. and the reaction was carried out for 10 hours to deprotect the tertiary butoxystyrene unit and convert it into a p-hydroxystyrene unit. Ethyl acetate was added to the obtained copolymer, the water washing was repeated five times, the ethyl acetate layer was sorted, and the solvent was removed to obtain a p-hydroxystyrene/styrene copolymer (a-1).

The weight average molecular weight (Mw) of the copolymer (a-1) was 10,000. In addition, the copolymer (a-1) is a copolymer having 80 mol % of p-hydroxystyrene units and 20 mol % of styrene units.

3. Production of Photosensitive Resin Composition [Example 1] 95 parts of the copolymer (a-1) of Synthesis Example 1 as the resin (A) and 1,1-bis( 4-Hydroxyphenyl)-1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethane and 1,2-naphthoquinonediazide-5-sulfonic acid 27.5 parts of the condensate (mol ratio = 1:2) (b-1), 4,4'-biphenylmethanebismaleimide (c) as the maleimide group-containing compound (C) -1) 30 parts, and polyglycidyl ether of dicyclopentadiene-phenol polymer (trade name "XD-1000" manufactured by Nippon Kayaku Co., Ltd.) as a crosslinking agent (D) (d-1) 10 parts were uniformly dissolved in 300 parts of γ-butyrolactone, and then, the photosensitive resin composition of Example 1 was produced by removing foreign matter from the solution by a membrane filter. The predetermined evaluation was performed using the obtained photosensitive resin composition.

[Examples 2 to 11, and Comparative Examples 1 to 3] Except for using the components shown in the following Table 1, each component was uniformly mixed in a solvent in the same manner as in Example 1 to prepare Examples 2 to Example 11 and the photosensitive resin compositions of Comparative Examples 1 to 3. The predetermined evaluation was performed using the obtained photosensitive resin composition.

[Table 1]

Details of the components described in Table 1 are shown below. <<Resin (A)>> a-1: Copolymer (a-1) of Synthesis Example 1 a-2: Cresol novolak resin (m-cresol:p-cresol=6:4 (mol ratio), polystyrene Ethylene conversion weight average molecular weight = 6,000) <Photoacid generator (B)> b-1: 1,1-bis(4-hydroxyphenyl)-1-[4-[1-(4-hydroxyphenyl)- Condensation product of 1-methylethyl]phenyl]ethane and 1,2-naphthoquinonediazide-5-sulfonic acid (mol ratio=1:2) "maleimide-containing compound ( C)" c-1: 4,4'-biphenylmethane bismaleimide c-2: N,N'-m-phenylene bismaleimide c-3: 1,6-bismaleimide Lysimide-(2,2,4-trimethyl)hexane <Crosslinking Agent (D)> d-1: Polyglycidyl ether of dicyclopentadiene-phenol polymer (manufactured by Nippon Kayaku Co., Ltd. The trade name of "XD-1000") d-2: Polymethylolated melamine-based crosslinking agent represented by the following formula

《添加劑（E）》 e-1（密接助劑）：三(三甲氧基矽烷基丙基)異氰脲酸酯 e-2（鹼溶解性促進劑）：4,4'-[1-[4-[1-(4-羥基苯基)-1-甲基乙基]苯基]亞乙基]雙苯酚 《溶劑（F）》 f-1：γ-丁內酯 f-2：乳酸乙酯[hua 6]

"Additive (E)" e-1 (adhesion aid): tris(trimethoxysilylpropyl) isocyanurate e-2 (alkali solubility enhancer): 4,4'-[1-[ 4-[1-(4-Hydroxyphenyl)-1-methylethyl]phenyl]ethylene]bisphenol "Solvent (F)" f-1: γ-butyrolactone f-2: Ethyl lactate ester

4. Evaluation The evaluation method of the photosensitive resin composition is as follows.

4-1. Analytical The photosensitive resin composition was spin-coated on a 6-inch silicon wafer, and then heated at 120° C. for 3 minutes using a hot plate to form a uniform resin film with a thickness of 7 μm. Next, using an aligner (type "MA-150" manufactured by Suss Microtec), through a pattern mask, the ultraviolet rays from the high-pressure mercury lamp were aligned at an exposure amount of 800 mJ/cm ² at a wavelength of 350 nm. Irradiate on the resin film. Next, the resin film was subjected to immersion development for 240 seconds at 23° C. using a 2.38 mass % concentration of tetramethylammonium hydroxide aqueous solution. Next, the developed resin film was washed with ultrapure water for 60 seconds, air-dried with air, and then observed with an optical microscope, and the pattern size of the analyzed minimum pattern was defined as the resolution.

4-2. Chemical resistance The photosensitive resin composition was coated on a 4-inch silicon wafer, and heated at 120°C for 3 minutes using a hot plate to form a resin film with a thickness of 10 μm. Then, in a convection oven, heated at 120°C for 30 minutes, heated at 150°C for 30 minutes, and further heated at 250°C for 1 hour in Example 1, Example 2 and Comparative Example 1, in Example 3 - Example 11, and the comparative example 2 and the comparative example 3 heated at 200 degreeC for 1 hour, and obtained the cured film. A flux (product name "WF-6317", manufactured by Senju Metal Co., Ltd.) was applied to the obtained cured film, and a reflow apparatus (type "STR-2010N2M-III") heated to 260°C in a nitrogen atmosphere was used. ”, manufactured by Senju Metal Co., Ltd.) was heated for 3 minutes, and the swelling ratio (%) of the cured film was measured ((film thickness after immersion−film thickness before immersion)/film thickness before immersion×100(%)).

4-3. Crack resistance Evaluation of crack resistance was performed by measuring the storage elastic modulus (E'). The photosensitive resin composition was apply|coated on the board|substrate with a mold release material, and it heated at 120 degreeC for 5 minutes using a hotplate, and formed the uniform resin film of thickness 15 micrometers. Then, in a nitrogen atmosphere, the resin film was heated at 120° C. for 30 minutes by a convection oven, and heated at 150° C. for 30 minutes, and then in Example 1, Example 2 and Comparative Example 1 at 250° C. The cured film was formed by heating at 200° C. for 1 hour in Examples 3 to 11, and Comparative Example 2 and Comparative Example 3 by heating for 1 hour.

The cured film was peeled off from the release material-attached substrate, and the cured film was cut into a 2.5 cm×0.3 cm strip. The storage elastic modulus (E') of the elongated cured film was measured by a thermomechanical analysis (TMA) apparatus (apparatus name "TMA/SS6100", manufactured by SII Nanotechnology Co., Ltd.). . The measurement conditions are as follows. Chuck distance: 2 cm Measuring frequency: 0.1 Hz Measuring temperature range: 23℃～330℃, heating rate: 5℃/min

[Table 2]

Cured film obtained from a photosensitive resin composition containing a maleimide group-containing compound (C) and a cured film obtained from a photosensitive resin composition containing no maleimide group-containing compound (C) Compared with the cured film, even if it is the same chemical resistance, the curing temperature is higher than the curing temperature (Examples 1 to 2 and Comparative Example 1 are 250°C or more, Examples 3 to 11, and Comparative Examples 2 to Comparative Examples Since the storage elastic modulus (E') in the high temperature region where 3 is 200° C. or higher is also low, that is, the crosslinking density is low, it is judged that the crack resistance is excellent.

none

FIG. 1 shows the storage elastic modulus (E') of the cured films of Examples and Comparative Examples.

FIG. 2 shows the storage elastic modulus (E') of the cured film of the Example.

FIG. 3 shows the storage elastic modulus (E') of the cured film of the Example.

FIG. 4 shows the storage elastic modulus (E') of the cured film of the comparative example.

Claims (8)

A photosensitive resin composition comprising: a resin (A) having a phenolic hydroxyl group, wherein the resin (A) having a phenolic hydroxyl group is a polymer (a1) selected from the group consisting of At least one of a homopolymer or copolymer of a radically polymerizable monomer having a phenolic hydroxyl group, and a copolymer of a radically polymerizable monomer having a phenolic hydroxyl group and another radically polymerizable monomer, and a photoacid generator (B), and the maleimide group-containing compound (C). The photosensitive resin composition according to claim 1, wherein the maleimide group-containing compound (C) includes a compound (C1) having two or more maleimide groups. The photosensitive resin composition according to claim 1 or claim 2, further comprising a crosslinking agent (D) (however, the maleimide group-containing compound (C) is excluded). The photosensitive resin composition according to claim 3, wherein the crosslinking agent (D) is selected from epoxy-based crosslinking agents (D1) and has at least two components represented by -CH ₂ OR (in the formula, R is a hydrogen atom, an alkyl group with 1 to 10 carbons or an acyl group with 2 to 10 carbons) at least one crosslinking agent in the crosslinking agent (D2). The photosensitive resin composition according to claim 1 or claim 2, wherein the photoacid generator (B) contains a quinonediazide compound (B1). A method for producing a cured film, comprising: forming a resin film of the photosensitive resin composition as described in any one of the first to fifth items on a support on a support; the step of exposing; the step of developing the resin film with an alkaline developer to form a patterned resin film; and the step of heating the patterned resin film. A cured film formed from the photosensitive resin composition as described in any one of claim 1 to claim 5. An electronic component having the cured film described in claim 7 of the scope of application.

Images