TW200729290A - Carrier platform apparatus and correcting method of the coordinates, exposure apparatus, and manufacturing method of device - Google Patents

Carrier platform apparatus and correcting method of the coordinates, exposure apparatus, and manufacturing method of device

Info

Publication number
TW200729290A
TW200729290A TW095139124A TW95139124A TW200729290A TW 200729290 A TW200729290 A TW 200729290A TW 095139124 A TW095139124 A TW 095139124A TW 95139124 A TW95139124 A TW 95139124A TW 200729290 A TW200729290 A TW 200729290A
Authority
TW
Taiwan
Prior art keywords
platform
coordinates
manufacturing
carrier platform
exposure apparatus
Prior art date
Application number
TW095139124A
Other languages
Chinese (zh)
Other versions
TWI433210B (en
Inventor
Akimitsu Ebihara
Masato Takahashi
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200729290A publication Critical patent/TW200729290A/en
Application granted granted Critical
Publication of TWI433210B publication Critical patent/TWI433210B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Abstract

The invention provides a carrier platform apparatus. It includes: platform; moving platform (WTB) installed on the platform; measuring section of position information for measuring the position information of the moving platform (WTB); measuring section (45) of the deformation amount for measuring the correlation deformation amount of at least one of the platform and the moving platform (WTB); and correction section, which corrects the measured result from the measuring section of position information according to the measured result from the measuring section (45) of the deformation amount.
TW095139124A 2005-10-24 2006-10-24 An exposure apparatus, an exposure method, and an element manufacturing method TWI433210B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005308326 2005-10-24

Publications (2)

Publication Number Publication Date
TW200729290A true TW200729290A (en) 2007-08-01
TWI433210B TWI433210B (en) 2014-04-01

Family

ID=37967715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139124A TWI433210B (en) 2005-10-24 2006-10-24 An exposure apparatus, an exposure method, and an element manufacturing method

Country Status (3)

Country Link
JP (1) JP5040657B2 (en)
TW (1) TWI433210B (en)
WO (1) WO2007049603A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8421994B2 (en) * 2007-09-27 2013-04-16 Nikon Corporation Exposure apparatus
US8994923B2 (en) * 2008-09-22 2015-03-31 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8325325B2 (en) 2008-09-22 2012-12-04 Nikon Corporation Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method
NL2005013A (en) * 2009-07-31 2011-02-02 Asml Netherlands Bv Positioning system, lithographic apparatus and method.
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
JP5717431B2 (en) 2010-12-14 2015-05-13 キヤノン株式会社 Stage apparatus, exposure apparatus, and device manufacturing method
NL2009357A (en) 2011-09-27 2013-03-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
TWI468880B (en) * 2012-06-15 2015-01-11 Asml Netherlands Bv Positioning system, lithographic apparatus and device manufacturing method
KR102299921B1 (en) 2014-10-07 2021-09-09 삼성전자주식회사 Optical apparatus
CN112204707A (en) * 2018-05-31 2021-01-08 应用材料公司 Multi-substrate processing for digital lithography systems

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998446U (en) * 1982-12-22 1984-07-03 株式会社日立製作所 Reduction projection exposure equipment
JP3097319B2 (en) * 1992-06-18 2000-10-10 株式会社安川電機 Non-contact power supply control method for electric motor, separated control electric motor by the method, and mechanical device using the separated control electric motor
JPH09275072A (en) * 1996-04-05 1997-10-21 Nikon Corp Straightness error correction method for moving mirror and stage device
JP3809676B2 (en) * 1996-10-21 2006-08-16 株式会社ニコン Scanning exposure equipment
JPH10260009A (en) * 1997-03-21 1998-09-29 Nikon Corp Coordinate measuring device
JP3445102B2 (en) * 1997-06-13 2003-09-08 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP3849266B2 (en) * 1997-12-18 2006-11-22 株式会社ニコン Laser interference length measuring method and apparatus, stage apparatus using the same, and exposure apparatus using the same
JPH11233403A (en) * 1998-02-10 1999-08-27 Nikon Corp Method for adjusting stage and scanning aligner using the same
JP2000240717A (en) * 1999-02-19 2000-09-05 Canon Inc Active vibration resistant device
JP3518400B2 (en) * 1999-03-18 2004-04-12 株式会社日立製作所 Electron beam drawing apparatus and drawing method using electron beam
JP2002118050A (en) * 2000-10-10 2002-04-19 Canon Inc Stage device, aligner, method for manufacturing semiconductor device, semiconductor manufacturing plant, and maintenance method for the aligner
JP2003209044A (en) * 2002-01-16 2003-07-25 Canon Inc Exposure device employing specific small power radio system between special environment and normal environment
JP3984841B2 (en) * 2002-03-07 2007-10-03 キヤノン株式会社 Distortion measuring apparatus, distortion suppressing apparatus, exposure apparatus, and device manufacturing method
JP4350941B2 (en) * 2002-11-14 2009-10-28 キヤノン株式会社 Charged particle beam exposure apparatus and device manufacturing method
JP4546255B2 (en) * 2002-12-12 2010-09-15 ザイゴ コーポレーション In-process correction of stage mirror distortion during photolithographic exposure cycles
TWI338323B (en) * 2003-02-17 2011-03-01 Nikon Corp Stage device, exposure device and manufacguring method of devices
JP2005252246A (en) * 2004-02-04 2005-09-15 Nikon Corp Exposure device and exposure method, method of controlling position and method of fabricating the device

Also Published As

Publication number Publication date
WO2007049603A1 (en) 2007-05-03
JPWO2007049603A1 (en) 2009-04-30
TWI433210B (en) 2014-04-01
JP5040657B2 (en) 2012-10-03

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