TW200705117A - Measuring apparatus, exposure apparatus, and device manufacturing method - Google Patents

Measuring apparatus, exposure apparatus, and device manufacturing method

Info

Publication number
TW200705117A
TW200705117A TW095122451A TW95122451A TW200705117A TW 200705117 A TW200705117 A TW 200705117A TW 095122451 A TW095122451 A TW 095122451A TW 95122451 A TW95122451 A TW 95122451A TW 200705117 A TW200705117 A TW 200705117A
Authority
TW
Taiwan
Prior art keywords
device manufacturing
measuring apparatus
exposure apparatus
exposure beam
substrate stage
Prior art date
Application number
TW095122451A
Other languages
Chinese (zh)
Inventor
Ikuo Hikima
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200705117A publication Critical patent/TW200705117A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Abstract

A substrate stage (4) holds a substrate whereupon an exposure beam is applied through a liquid (LQ). A measuring apparatus (30) measures information relating to the exposure beam and has a light receiving system which can be removed from the substrate stage (4). The light receiving system receives the exposure beam through the liquid (LQ) by being held by the substrate stage (4).
TW095122451A 2005-06-22 2006-06-22 Measuring apparatus, exposure apparatus, and device manufacturing method TW200705117A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181712 2005-06-22

Publications (1)

Publication Number Publication Date
TW200705117A true TW200705117A (en) 2007-02-01

Family

ID=37570468

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122451A TW200705117A (en) 2005-06-22 2006-06-22 Measuring apparatus, exposure apparatus, and device manufacturing method

Country Status (4)

Country Link
JP (1) JPWO2006137440A1 (en)
KR (1) KR20080017299A (en)
TW (1) TW200705117A (en)
WO (1) WO2006137440A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454852B (en) * 2008-05-13 2014-10-01 尼康股份有限公司 A moving body system and a moving body driving method, a pattern forming apparatus and a pattern forming method, an exposure apparatus and an exposure method, and an element manufacturing method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9025126B2 (en) * 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
KR101160948B1 (en) * 2008-04-16 2012-06-28 에이에스엠엘 네델란즈 비.브이. Lithographic Apparatus
EP2249205B1 (en) 2008-05-08 2012-03-07 ASML Netherlands BV Immersion lithographic apparatus, drying device, immersion metrology apparatus and device manufacturing method
EP2131241B1 (en) * 2008-05-08 2019-07-31 ASML Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US8421993B2 (en) 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
JP5127677B2 (en) * 2008-11-25 2013-01-23 新光電気工業株式会社 Light source control circuit and direct exposure apparatus
CN104321702B (en) * 2012-05-22 2016-11-23 Asml荷兰有限公司 Sensor, lithographic equipment and device making method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201806001A (en) * 2003-05-23 2018-02-16 尼康股份有限公司 Exposure device and device manufacturing method
JP5143331B2 (en) * 2003-05-28 2013-02-13 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
EP1650787A4 (en) * 2003-07-25 2007-09-19 Nikon Corp Inspection method and inspection device for projection optical system, and production method for projection optical system
JP2005093948A (en) * 2003-09-19 2005-04-07 Nikon Corp Aligner and its adjustment method, exposure method, and device manufacturing method
JP4470433B2 (en) * 2003-10-02 2010-06-02 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP4515209B2 (en) * 2003-10-02 2010-07-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454852B (en) * 2008-05-13 2014-10-01 尼康股份有限公司 A moving body system and a moving body driving method, a pattern forming apparatus and a pattern forming method, an exposure apparatus and an exposure method, and an element manufacturing method

Also Published As

Publication number Publication date
JPWO2006137440A1 (en) 2009-01-22
KR20080017299A (en) 2008-02-26
WO2006137440A1 (en) 2006-12-28

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