TW200414395A - User interface for quantifying wafer non-uniformities and graphically explore significance - Google Patents

Abstract

A wafer viewer system is provided for graphical presentation and analysis of a wafer and a wafer series. More specifically, the wafer viewer system includes a graphical user interface for displaying a wafer, graphically selecting regions of the wafer for analysis, performing analysis on the selected regions of the wafer, and displaying results of the analysis.

Description

200414395

1. [Technical Field to which the Invention belongs] ^ The present invention is generally related to the evaluation of processed wafers. More specifically, the present invention relates to the ability to graphically present and control wafer evaluation after processing. [Prior art] Many processes. . After the processing of each process, many operation changes are recorded so that they can be related to the inspection method including subjective sinking, or the orientation description on the wafer after processing, and the processed wafer quantified on the wafer to provide a clear Usually poor or innumerable (such as the description of the conditions on the left side of any wafer with uneven wafers on the corners of the text. Objective, semiconductor wafers undergo layer addition, patterning, etching, removal, and removal during the semiconductor process Polish the wafer to confirm that the previous process was completed with an acceptable level of uniformity. Each process that will be performed on the wafer will be 2 pieces of time, gas pressure, concentration, temperature, etc.) Any changes in variables are quickly identified and potentially discovered Any post-processing errors or inhomogeneities. The description of the non-uniformity of the prior art after Zhu Ming's treatment stated that the circular non-uniformity is "central deep, and the sentence is" left-side descent ". The central depth is that the general central area removes more material than the surrounding area on the wafer. However, ‘Central Shen’ does not provide a clear, balanced sentence. Similarly, the left ramp down is a general description. The domain removes less material than the remaining areas on the wafer. For example, the center is deep, the left ramp down cannot be quantified to account for unevenness. Use post-processing nonuniformity to perform inconsistencies in wafer processing. Provides feedback to correct errors and can also use processed non-uniformity

200414395

3. SUMMARY OF THE INVENTION Broadly speaking, the present invention satisfies these needs by providing a wafer viewing system for chart display and analysis of wafers. More specifically, the wafer viewing system includes a graphic user interface to display the wafer, and the wafer area is selected graphically for analysis' to perform analysis on the selected wafer area and display the analysis results.

In one embodiment, a graphical user interface is disclosed to control the analysis of a wafer position map. The user interface provides chart selection control to select a region of the wafer position map for statistical analysis. The user interface is used to generate statistical data for selected areas for statistical analysis. The statistics are then presented to the selected area. The display statistics are reproduced when a change in the selected area is detected. In another embodiment, a graphical user interface is disclosed to analyze data used to generate a wafer location map. Wafer Location Map Confirms Etched

200414395 V. Description of the invention (3) Heterogeneous profile of the surface. The user interface selects the secondary parent surface with respect to the surface non-uniformity profile, selects a specific spatial distribution option, and can be used for secondary parent lean materials. User Interface When a change in the area's chart confirmation is detected. In one embodiment, a graph circle 'measurement data is disclosed. The graphical user interface provides data and setup data for the second set of wafer measurements. Control to perform the first set of wafer measurement data and gate mathematical operations. Mathematical operation to create a wafer. The user interface further includes displaying wafer data. In another embodiment, a type of flattened wafer measurement data is disclosed. Graph Select a collection of wafer measurement data. The diagram enables the collection of evaluation wafer measurement data to be built. The user interface further includes displaying this set of evaluation results. In another embodiment, a kind of temple analysis is revealed. The graphical user interface includes controls for adjusting the electron microscope image. Instrument chart measurement control. The other viewpoints and advantages of the present invention are described below, and the present invention will be illustrated by examples to include spatial data. The chart confirms the display area. The measurement is controlled by the user of the table to select the chart. The distribution option is used to dynamically update the interface of the area to select the first interface. The first group of crystal solid measurement data is a group of results. The chart uses the user interface to create a set of comments. When the chart is displayed by electronic display, select the chart to select the chart. This area ′ also provides data for the wafer analysis wafer. The charter interface provides control with management and also provides control to evaluate results. Graphical user interface for micromirror imaging. The user interface provides detailed instructions and accompanying drawings for clarity. Fourth [Embodiment 200414395] 5. Description of the invention (4) Beifaner 5, the present invention discloses a crystal and analysis wafer. More specifically, the t system is used for the graphic display interface to display the wafer. The graphic system includes the user's wafer area for analysis: = analysis, in the selected thorough: middle pair; ί many clear details to provide this The invention of these inventions; II ;; ΐ This artist obviously does not need some or all of the known processing operations in order to not unnecessarily confuse this without detailing the already mastered: 1 picture is a two-two formula: people show according to the present invention -One Example-Wafer Viewing: First Graphical User Interface (GUI, Graphical User: GUI 10) GUI 10 includes a function menu row m, with many images launched by the messenger, which can be launched for many tasks .

A clean wafer / XSEM image 103 is provided to enable the user to clear the wafer or XSEM / TEM image currently loaded into the wafer viewer. The clear wafer / XSEM image 103 provides a pull-down menu to present the clear wafer and clear XSEM / TEM options. Load data / XSEM image 105 is provided to enable a user to load data of wafer a, wafer B, or XSEM / TEM images. Load Data / XSEM Image 105 provides a pull-down menu to present wafer a, wafer β, or xsem / tem image options for loading data. In one embodiment, the wafer viewer can read the output file from the measurement tool without intermediate processing. In this embodiment, the 'wafer viewer' identifies the file format by the associated file extension. For example, the wafer viewer can identify from measurement tools such as Hitachi CD SEM, KLA-Tencor CD SEM,

Page 9 200414395

〇ptiPr〇be Ellipsometer, Rudoliph Ellipsometer,

Company: Ellipsometers and scatterometers), and X-Files with Scattering. The same day temple ’wafer viewer can load user-defined files. In addition to loading data for individual wafers and XSEM / TEM images, the wafer viewer also supports loading files containing data for individual or multiple wafers or measurements for specific wafers. Yi provides the storage file image 107 so that the user's stored data corresponds to the currently presented wafer. In one embodiment, the stored file image 〇07 provides a pull-down menu to present options for storing wafer data, diameter data, or optical profile data. —Provide print image 10 to enable users to print wafer reports. In one example, the wafer report includes a header (including wafer name, date, number of locations, etc.), a set of wafer statistics (average, three standard deviations, full distance, maximum: minimum), The wafer position map currently displayed by the wafer viewer, a set of k-broken statistics (mean, three standard deviations, full distance, maximum, minimum), and a cross-section chart visually displayed by the wafer viewer. Provide copy to clipboard image UI 1 to enable users to copy data to virtual and paste boards for transfer to other applications. In one embodiment, the Copy to Clipboard image 1 1 1 provides a pull-down menu to present many data options that can be copied to a virtual < circle clipboard. For example, in one embodiment, the pull-down function menu may include position map, scale, and statistics options, wafer position map options, color scale options, diameter options, radial chart options, azimuth chart options, and XSEM / optical profile Graphic options. Provides the image of the deleted wafer position 丨 3 to enable the user to restore the previous

Page 10 200414395 V. Description of the invention (6) "-The position of the circle is deleted. In one embodiment, the image position 1 of the deleted wafer is restored. A pull-down menu is provided to present the last point option and all clicks = the last wafer position to be restored and deleted. Select all previously deleted wafer locations. Such as i, Japanese yen collection management diagram silly round collection. The wafer set represents a set of multiple data sets for a user to create and manage crystal wafers ^. The number of wafer identification symbols associated with the same data measurement position mode, and the date and time are shown in the data set. The number of wafers in the wafer set that is also included in the wafer set can be noted. ^ Note. In one embodiment, in this embodiment, there are two different position modes in the wafer set. However, the main position pattern in the circle set. Since one wafer will decide to insert the entire crystal to fit the main position, the remaining wafers in the wafer set will be added to the wafer set, and Ij will be added. For example, if there is a deletion position, this embodiment avoids inserting the deletion position with respect to the analysis threshold. The wafer and / or the measurement position pattern from different measurement industries with different edge exclusion areas) ^ = measurement data of the wafer set (that is, the wafer set has three functions in different embodiments in one embodiment) In order to present many wafers, the management image 115 provides the following options: rounding to collection, and deleting from collection. The item includes adding crystals from all wafer batch properties to create a collection. Changes in the storage wafer set. From two: == insert in the wafer-the option of the user to set up a collective set of multiple wafers together. Since the properties of all wafer batches ^ = building of data Create a wafer set from many types of wafers containing multiple wafers ::: 2 items to allow users to create multiple wafer sets simultaneously

200414395 V. Description of Invention (7). Separate wafer sets can be created for the number of each data type. Each sub-wafer set will contain corresponding data for each multi-wafer. A help image 129 is provided so that the user is provided with the auxiliary operation Gun0. In one embodiment, the help image 129 is provided—a pull-down function menu for presentation, options for general help, or help in a file rotation format. An email technical support image 131 is provided to enable the user to send an email to a designated GUI 10 technical support email address. Startup electronic support image 1 3 1 Automatically expands a new e-mail preparation object residing in the mail program on the host computer system. Get the auxiliary operation GUI10. In one embodiment, the help image 129 provides a pull-down function to get general help early to present options or to get help by entering files. The hanger provides information about the image 133 so that the user can get information about the wafer viewer. In one embodiment, About Image 33 provides a pull-down menu to present options to get information about the wafer viewer system or visit the website of the wafer viewer system. Selecting the option to visit the website of the wafer viewer system automatically expands the network resident in the host computer system and leads to a pre-designated wafer viewer system web page. The registration image 135 is used to enable the user to register the wafer viewer system. In the Λ embodiment, the registration of the wafer viewer system is used as a security feature to control the distribution and installation of the wafer viewer system on the host computer system. In addition to the aforementioned user-startable images, the function menu column 101 also includes analysis image 117, diameter / bar graph image 119, azimuth / amplification, large distribution image 121, XSEM / contour image 123.Bar graph image

200414395 V. Description of the invention (8) 1 2 5 and wafer spread page image 1 2 7 These other user-startable images are discussed below in relation to the corresponding wafer viewer system features. GUI 10 also includes the first wafer identification and selection area μ? And the second wafer timing and selection area 39. Each of the first and second wafer identification and selection fields (137 and 139) shows a name corresponding to the wafer data set currently loaded for wafer A and wafer b, respectively. In addition, each of the first and second wafer clocking and selection fields (137 and 139) provides pull-down menus to select the available wafer data sets loaded into wafer A and wafer B, respectively.

a G U I 1 〇 also includes the display control field 丨 4} to enable users to select the wafer data to be displayed and analyzed by the wafer viewer system. In one embodiment, the display control area 141 provides a pull-down menu to present different wafer data sets for display and analysis. For example, the pull-down menu may include wafer A, wafer B, (wafer A_wafer B), (wafer A + wafer B), (wafer a X wafer b), (wafer a / wafer B), and [(1 / wafer A) — (1 / wafer B)] and other options. The option selected will determine the wafer data currently being displayed and analyzed by the wafer viewer system.

In addition, by using the operator field 4 3 and the operation field 4 5, further mathematical operations can be performed on the wafer data selected in the display control field 141. Operator field 丨 43 provides a pull-down menu to display multiplication (X), addition (+) 'subtraction (1), division (/), power (^), and the wafer to be selected in the display control field 141 Operation on data. Operation field 145 provides a pull-down menu to allow users to select items, average, or minimum operation field options. Select the number of operations

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200414395 V. Description of the invention (9) The __ Π term φ allows two users to enter a number in the operation field 145: which is to be used as the operation field. Selecting the average operation field option will cause display control: the average value of the wafer data selected in the operation field 141 will be used as the operation field. Choosing the minimum value and applying the foreign field option will cause the minimum value of the 1 4 f circle data in the display control field to be used as the operation field. The operator's 3 input fields in the operator field 145 are used for display control = circle data. The result of the mathematical operation will be displayed and analyzed. Looking at the operator field 143? : "Zhong 'will be used in the calculation field 145 to display the currently selected wafer data. 疋 GUi 10 also includes the unit field 147 to enable users to select the wafer data displayed and analyzed by the target system. The unit of measurement. Photo taken by Yu Zhong: two f Zhong, nanometers / minute, thousand angstroms / minute, and meters; select ;; early position field 1 47 provides a pull-down menu to present many of the measurement unit options that can be selected In order to: Brother: Load data for multi-layer or pair-specific wafer measurement. Class f month, Gu! 10 includes internal wafer math selection 149. Report field 5k for pull-down menu to allow users to choose Make the selection of special circle number 149 cause the mathematical operation to be selected; or 1 5 1 mention: ° between private data sets. The first internal mathematical operation field π k? Pull down the function menu to allow use The user chooses to use: the data of the first operation field in the mathematical calculation of the wafer.

Page 14 200414395 V. Description of the Invention (ίο) The data set used as the second operation domain in the internal wafer mathematical calculation. The internal math operator field 1 53 provides a pull-down menu to allow the user to select the internal math operation performed by the slave (ie, subtraction (_), addition (+),, law, (X), or division (/)). The selected internal mathematical operation is selected between the corresponding data values of the selected first and second internal mathematical operation fields. Results from selected internal mathematical operations will be used by the wafer viewer system for display and analysis. GU I 1 〇 also includes the wafer description area 丨 5 7. In one embodiment, the wafer description area 157 includes a location area 159, an edge area 161, and a size area 163. The position field 159 provides information on the number of wafer ^ data measurement positions currently displayed and analyzed. The fringe area 丨 6 丨 provides the size of the edge exclusion zone for wafers that are currently less than analyzed. The size field 163 provides the diameter of wafers currently displayed and analyzed. The GUI 10 further includes a wafer information area 65. In one embodiment, the wafer information area 165 includes a wafer identification symbol field 167, a date field 169, a method field 1 71, and a comment field 73. Wafer ID field 1 6 7 shows the IDs of the wafers displayed and analyzed. The date field 169 shows the date that the currently loaded wafer data was created or obtained. The date field 169 also provides a pull-down control that when activated causes a manipulable calendar to appear. Method field 17i displays information on wafer processing methods for currently loaded wafer data. The annotation field 173 shows annotations for the currently loaded wafer data. The annotation field 173 has a vertical scroll control. The expanded image 175 is also accompanied by the annotation field 173. When activated, the expanded image 175 causes the annotation field 173 to be presented in a larger pop-up window. Large pop-up window provides close image

200414395

Like ', you can activate it and close the pop-up window. The GUI 10 further includes a wafer display area 201 and a spatial statistics area 3101. In one embodiment, the remaining part of the GUI is used to display the characteristics of the currently selected analysis method. For example, in Figure 丨, the currently selected analysis method is an expanded page. Therefore, the remaining part of the GUI is used to display the wafer data area 401 regarding the spread page analysis method. The choice of analysis methods and related features available in wafer data area 401 and multiples will be described in detail below. FIG. 2 is a diagram showing an embodiment according to the present invention

~ 5 defines the Cartesian coordinate system in the wafer display window 2 1 5. Place the origin of the Cartesian coordinate system in the center of the wafer display window 215. ^ Display a wafer image 217 in the wafer display window 215. The wafer image 2 1 7 is centered on the Cartesian = system, ’first origin defined in the wafer display window 2 丨 5. The wafer image 2 1 7 includes the position 2 j 9 at which the actual data is measured and the related measurement data values. The wafer image 21 7 also includes colored or monochrome position maps drawn by numerical differences between data measurements. When the user moves the mouse over the wafer image 217, the vertical guide 2 23, the horizontal guide 221, and the alum box 225 are displayed at the mouse position. The information box 225 displays a set of Cartesian coordinates and data values corresponding to the mouse position. The vertical guide 2 2 3 and the horizontal finger bow I 2 2 1 can be combined with the ruler 2 2 7 provided at the lower edge of the wafer display window 2 1 5 to accurately place the mouse in the ideal position. . The a-circle display area 201 also includes color scales 2 2 9 corresponding to different colors or shadows used to display color or monochrome position maps throughout the f-circle image 217. According to the color scale 229, the change in color or shadow is equivalent to the data value

Page 16 200414395 V. Description of the invention (12) The size changes 4 daggers. Said η, ί :: Circle viewing selection area 231 Yujing 1 display area 2G1 1 ^ collar, 231 provides a pull-down menu to present wafer display, i, two to one, in the embodiment, wafer display options Includes color contours, f-degrees, monochrome, one standard deviation, and position values. The color contour options: f color f degree 229 becomes the number of separate steps. In one embodiment, the color f is divided into 9 separate steps with the far-line division color scale. The color contour 4 items are fortunate to show areas of the wafer with similar values. Color Gradient Options Define the color scale 229 using a succession ladder. The Color Gradient option has more details than the South Line option such as Color. The monochrome option defines a color scale 229 as a gray scale. Monochrome options are available to provide wafer images, which are more suitable for black and white printers. A standard deviation option shows that the first color is that the data value is less than the standard deviation, the second color is that the data value is within a standard deviation of positive or negative 'and the second color is that the data value is greater than one standard deviation. A standard deviation option is useful for displaying data values that are far from average. The position value option only displays the position 2 1 9 and related measurement data values at the actual data measurement. A dot density display selection area 233 is provided in the wafer display area 201. Dot, Do Not Select Field 2 33 provides a pull-down menu to show 4 dot densities for the purpose of inserting grid lines. In one embodiment, the point density options include low (50 points by 50 points inserted into the grid), normal (100 points by 100 points inserted, lines), and 鬲 (200 points by 200 points inserted). Grid). For example, selecting the Low option will cause the insertion grid to be defined in the wafer display window 215 with 50 uniform width rows and 50 uniform heights. Selecting the normal option will cause the inserted grid lines to be displayed on the wafer with 100 uniform width rows and 100 uniform heights.

200414395

Windows 2 1 5 are defined. The width of the ancient sentence and the average sentence height of 200 pendulum lines are equal to 200. The high value option # # > is selected for inserting the data value pair definition into the long / circle display window 215. Insert the points in this book. Therefore, select the same k-terms for the maximum resolution and ^ into the resolution. The k-selection low-distance item provides the lowest insertion. Provides the insertion selection field _ selection field 23 5 provides the following pull power. Insertion selections have been made from rendering interpolation based on the selected insertion grids. For example, the insertion options include sheep soft and = data values. In one implementation

The reciprocal algorithm produces proportional to (18): the distance between the position 219 at the distance and the position to be inserted, and η is an adjustable parameter with: straight and 4. For locations with less data measurement The value of the car is the same as η. In contrast, for more data measurement positions, the low η value is better. The soft option is set equal to 2. The rough option is set equal to 4. The normal option is based on the displayed Calculate the number of data measurement positions η Value 0 Provide display position selection 2 3 9 in wafer display area 2 01. Display position selection 2 3 9 can be triggered to display and move wafer image 2 1 7 Data measurement position position 219 &Amp; For display value selection 241 in the wafer display area 201. The display value selection 24 1 can be triggered to display and move the wafer image 21 7 at the data measurement position 2 1 9. Provide the display ruler selection 2 6 3 in Wafer display area 2 0 1. You can trigger the display ruler selection 2 6 3 to display and move the wafer display window 2 1 5 side ruler

Page 18 200414395 V. Description of Invention (14) Regulate the day. A warning limit area 243 is provided in the wafer display area 201. The warning limit area 243 includes a warning limit activation option 2 45 'upper warning limit area 247, and lower warning limit area 249. When the warning limit is activated, the selection 2 4 5 ′ will have the position 219 of each data measurement location having the relevant data value greater than the upper warning limit area 2 4 7 or lower than the lower warning limit area value 249 in the wafer image 2 1 7.

A scale limit area 251 is provided in the wafer display area 201. The scale limit area 251 includes a scale limit activation option 2 53 and a pull-down function menu 259, providing options to establish upper and lower scale limits. The pull-down function menu 259 includes user-supplied options, average percentage options, and three standard deviation options. Selecting the user-supplied option allows the input upscale to be limited to the upper scale limit field 255 and the input downscale to be limited to the lower scale limit field. Selecting the Percent Mean option allows the percentage value to be entered in the numeric field 2 6 j. Calculate the upper and lower scale limits as a percentage of the corresponding average. Select the three standard deviation option to establish upper and lower scale limits at three times the standard deviation of the mean. ,,

A die layout area 265 is provided in the wafer display area 201. The grain layout local area 265 includes a display grain layout selection 2 67, a horizontal grain size area 269a, a vertical grain size area 2 6 9b, a horizontal grain shift area 271 &, and a vertical grain shift area 271b. The horizontal grain size field 269a and the vertical grain size field 26 9b allow the user to provide a single grain size. The water grain offset area 271a and the vertical grain offset area 271b allow the user to provide the offset of the grain grid lines from the center of the wafer. The wafer display area 201 also includes a wafer statistics area 203. Wafer Statistics

Page 19 200414395 V. Description of the invention (15) The area 203 shows the average value of 205, the second half Θ H before fishing m ^ ^ one bismuth early difference 207 (ie three times about n Zhuo difference), the total distance value 209 ( That is, the difference between the maximum value and the minimum value): the maximum value 211 and the minimum value 213 correspond to the wafer data shown. The Japanese yen display area 201 also includes the analysis option f37 to provide a pull-down function menu to present the analysis mode option knife. Analysis options include cross-section analysis options, distribution analysis options, XSEM / profile analysis options, and expanded page analysis options. The analysis options cause a set of corresponding features and controls to be displayed in the GUI 10. The characteristics and control of each analysis method option are described below with reference to FIGS. 3 to 3. In FIG. 2, the analysis selection area 237 indicates that the expanded page is selected. Referring back to FIG. 1 ′, when the expanded page analysis option is selected, the wafer data area 401 is displayed. In addition to using the analysis selection area 23 7, the wafer development page image 127 in the start function menu 101 can also select the development page analysis option. 3 ^ A diagram showing a separate view of one of the wafer data areas 401 according to an embodiment of the present invention. The wafer data area 401 includes an expanded page display. The expanded page display includes position line 407 to enter and / or display some data measurement positions. Contains X line 4 09 and Y line 411 to input and / or display the X and γ Cartesian coordinates of the measured position relative to the deer data, respectively. Contains Z lines 4 丨 3 to enter and / or display the wafer thickness at the corresponding data measurement location. Data is entered and / or displayed on separate columns for each data measurement location. The user can select the header of the position line 407, X line 409, Y line 411, or Z line 41 3 to borrow the data in each line to sort the data in the expanded page display. Continuous selection of a particular header will trigger sorting between ascending and descending order. Provides vertical scroll control to allow search

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200414395 V. Description of the Invention (16)-Search and expand the page display. At the same time, a 405 is provided which allows the addition of new location options. Start allows adding new location selections. 405 allows the user to manually enter new data to measure location data in the expanded page display. If the addition of a new location selection 405 is not activated, the user cannot enter or change the data in the expanded page display. Therefore, the expanded page analysis option allows users to edit data for existing wafers or enter data for new wafers. The wafer data area 401 also includes a wafer size selection area 403. A pull-down menu is provided to present wafer size options. In one embodiment, wafer size options include 75mm, 100mm, 125mm, 15Qmm, 2QQmm, 0mm, and 450mm diameter wafers. Select a specific wafer size option to adjust the ruler 2 2 7 provided on the lower edge of the wafer display window 2 1 5. FIG. 4 is a diagram showing a GUI 10 when a cross-section analysis option is selected according to an embodiment of the present invention. You can select the cross-section analysis option by analyzing selection field 237, diameter / bar graph image 119, or bar graph image. When you select the cross-section analysis option, the GUI 10 displays the cross-section analysis area 501 and the bar graph area 601.

FIG. 5 is a separate view schematically showing a cross-sectional area 50 j according to an embodiment of the present invention. The cross-sectional area 501 includes a cross-sectional display 523. Transverse display = 3 Displays the cross-section through the center of the wafer according to a set of traverse controls. The f-segment display 523 includes a horizontal scale representing the radial distance from the center of the wafer. It also shows a thick straight scale representing the wafer thickness. Therefore, the cross section display 523 shows the image of the wafer thickness change as a function of the distance from the wafer center. Provides a cross control group to allow the user to select the precise cross section to be displayed

200414395 V. Description of Invention (17)

It is displayed in the cross section 5 2 3. The traverse control group includes angle selection chart control 515, angle value field 517, color selection 51 9 and scale limit synchronization selection 521. The angle selection chart control 515 and the angle value field 517 can be used by the user to select the precise cross section to be analyzed. The user can select and drag a break control line 5 2 5 to obtain the ideal cross section for analysis. The traverse control line 525 is defined as a rotation centered on the center of the angle selection chart control 515. Alternatively, the user can directly input the angle in the angle value field 5 j 7 to obtain the ideal cross section for analysis. If you use the angle selection chart control 5 丨 5, the corresponding angle is displayed in the angle value field 517. If the angle value is directly input into the angle value field 517, the angle selection chart control 515 is adjusted in response to the input angle value. Use color selection 519 to switch between color cross-line display 5 23 and line graph ^ k-line display 5 2 3. When starting the color selection 5 丨 g, the color scale displayed in the wafer display area 2 01 is also used for the color transversal display 5 2 3. Use Scale Limit Synchronization Select 5 21 to synchronize the vertical scale across 5 2 3 and the scale limit entered in the scale limit area 251.

The cross-sectional area 501 also includes a cross-sectional statistical area 503. The statistic area 503 is displayed across the statistical area. The average value is 505, the three standard deviation value is 507 (that is, three times the standard deviation of the mean), and the full range value is 509 (the difference between the maximum and minimum values, The maximum value 5 1 1 and the minimum value 5 丨 3 correspond to a set of cross-sections currently selected and displayed by the cross control group. Fig. 6 is a diagram showing a bar graph according to an embodiment of the present invention Regional anti-minimum * early alone view. Bar graph area 601 includes bar graph display 605 and Changkang source selection 603. Bar graph display 605 can be used to evaluate current wafer data Gaussian nature of the value. Bar graph showing 6 0 5 packs

Page 22 200414395 V. Description of the invention (18) = = bar graph of data value of data source selection 603. The bar i-finf bars represent one quarter of the standard deviation of the mean. County mean and standard deviation are also selected from the current bar chart data source 03 03 function menu, allowing users to choose the data source that generates the bar chart Ϊ 2. In one embodiment, the data source of the bar graph is selected as j = including the data value corresponding to the data measurement position or corresponding to the insertion = direct determination, where the insertion is determined by the point density selection field 233 and the insertion selection collar.

FIG. 7 is a diagram showing a GUI 10 when a distribution analysis option is selected according to an embodiment of the present invention. Select the analysis area 237 or azimuth / radiation distribution image 1 2 1 to select the distribution analysis option. When the distribution analysis option is selected, the GUI 10 displays the radiation / angle distribution area 701. FIG. 8 is a diagrammatic view showing a separate radiation / angle distribution area 701 according to an embodiment of the present invention. The radiation / angle distribution area 701 includes a radiation distribution display 7 3 9, an angle distribution display 7 4 1. a group of radiation and angle distribution display controls, a radiation distribution statistics area 03, and an angle distribution statistics area 715.

The radiation distribution display 7 3 9 shows the wafer thickness map from the center of the distribution to the edge of the wafer. The vertical distribution of the emission profile 739 corresponds to the wafer thickness value. The radiation distribution shows that the horizontal scale of 7 3 9 corresponds to the distance from the center of the distribution to the edge of the wafer. By displaying the distribution in the control group of the radiation and angular distribution selection field 7 2 7, the user can choose to set the distribution center to the geometric center of the wafer or the center of mass of the wafer. Display control group via radiation and angular distribution

Page 23 200414395 V. The chart distribution control 7 3 3 in the description of the invention (19). The user can select and drag a radiation distribution control line 7 4 5 to obtain the ideal radiation distribution Buddha. The radiation distribution control line 745 is defined to rotate around the distribution center selected in the distribution selection area 727 as the main axis. Alternatively, the user can directly input the angle in the angle value field 731 to obtain the ideal radiation distribution for analysis. If the radiation distribution control line 745 is used, the corresponding angle is displayed in the angle value field 731. If the angle value is directly input into the angle value field 731, the radiation distribution control line 745 is adjusted in response to the input angle value.

The angular distribution display 7 4 1 shows the wafer thickness map around the annular area of the wafer. The angular distribution shows that the vertical scale of 7 4 1 corresponds to the wafer thickness value. The horizontal scale of the angular distribution display 7 41 is equivalent to the angular distance (ie, Q degrees to 360 degrees) about the starting point of the center of the distribution. Via distribution selection field 727,

The user can choose to set the distribution center to the geometric center of the wafer or the center of mass of the wafer. Via the graph distribution control 733, the user can select and drag the Wuyi mounted distribution control line 7 4 3 to obtain the ideal circular distribution radius for analysis. The circular distribution control line 743 is defined as a radial adjustment of the distribution center selected in the distribution selection area 727. Alternatively, the user can directly enter a radius in the radius value field 729 to obtain the ideal circular distribution for analysis. If a circular knife cloth control line 7 4 3 is used, the corresponding radius is displayed in the radius value field 7 2 g. If the radius value is directly input into the radius value field 729, the circular distribution control line 7 4 3 is adjusted in response to the entered radius value. -Use color selection 735 to switch the radiation distribution display 739 and angular distribution ", page 7 4 1 between the color form and line graph form. When the color selection 7 3 5 is activated, it is displayed in the wafer display area 2 001. The displayed color scale is also used for radiometric analysis

Page 24 200414395 V. Description of the invention (20) 1 Color form of cloth display 739 and angle distribution display 741. Similarly, the scale limit synchronization selection 737 is used to synchronize the vertical scale of the radiation distribution display 739 and the angle distribution display 7 4 1 with the scale limit input in the scale limit area 2 5 1. '' Radiation distribution statistics area 7 0 3 shows the average value 7 0 5 7 0 7 (that is, three times the standard deviation of the mean), the total distance value 7 0 9 (the difference between the maximum and minimum values), and the maximum value 711, and the minimum value 7 丨 3, correspond to a group of radiation distributions currently selected and displayed by the radiation and angular distribution display control group. Similarly, the angular distribution statistics area 715 displays the mean value 717, the three standard deviation value 719 (three times the standard about the mean), the full range value 7 2 1 (the difference between the maximum and minimum values), 723, The minimum value of 7 25 corresponds to a set of angle distributions currently selected and displayed by the radiation and angle display control group. The cloth 739 and the radiation distribution statistics area 703 are used to fix the fixed angle at which the wafer's mass center crosses the wafer at a fixed angle. Unevenness at distance 咴 Π Figure 9 is a graphical representation of a GUI 10 when one of the careful A / contour analysis options according to the present invention is used, and XSEM is a case of horizontal / selective XSEM mirror image. Select the analysis area 23 7 or "⑽ ▼ Mada / Electron Microscopy XSEM / Contour Analysis Options. When you select 肫 / Round ^ Image 123, you can select GH 10 to display XSEM / Contour area deletion.-When the contour analysis option is selected ' 10 is a diagram showing a separate view of the area 80 1 according to the present invention. XSEM / XSEM / profile only

That display area 803 is in XSEM

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/ Within the round area 801. You can use it to enter the 嫱 嫱 / γς title ... Use the function menu to list the data in 101 / XSE Μ image 1 〇5style XSF Μ / identify + »1 pi ^ γςPM + ^ ^ ^ EM / contour Open the file image in the area 801 and enable XSi / M or round virtual ifj. Next, you will see a file named 825 in the file name field, but it is not displayed in the XSEM / profile display area 80. The file name field 825 also provides the following, for example: Tian tired person quickly selects another picture currently stored in the scene but from the mouth τ / ^ ^, s-Γ- body to display in the XSEM / corridor display area 803 .

-A zoom lens selection field 817 is provided to allow the user to select the size of the picture currently displayed in the XSEM / outline display area 803. In one embodiment, the zoom lens selection field 817 can be used to enlarge the displayed picture by two times its original size. A rotation selection field 819 is provided to allow the user to rotate the moon displayed in the XSEM / outline display area 803. The rotation selection field 8 1 9 is used to correct an angular error that occurs during shooting the currently displayed picture. An offset selection field 821 is provided to allow the user to correct distortions that occur during the shooting of the currently displayed picture. For example, the offset selection field 82 1 is used to correct distortion caused by the movement of the stage during the electron beam scanning when the currently displayed picture is taken. A horizontal mover 805 and a vertical mover 807 are provided to allow the user to move the currently displayed picture to the left, right, up, and down. The horizontal mover 805 and vertical mover 807 are used to center the target feature when the lens is zooming in on the size of the currently displayed picture. The XESM setting button 827 is provided to allow the user to reset the horizontal mover 805, the vertical mover 807, the zoom lens selection area 81, the rotation selection area 819, and the offset selection area 821 to the system implicit value. Provide remove xsem 8 2 9 to allow users to remove the currently displayed picture from memory. Provide one

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Move @All Is 8 3 1 to allow the user to remove all pictures currently stored in memory to be displayed in the XSEM / outline display area 803. Provide display contour selection 833] Allows you to quickly display # with * and remove the currently selected wheel mill picture. A display XSEM selection 83 5 is provided to allow the user to quickly display and remove the currently selected χδΕΜ picture. A display spindle selection 837 is provided to allow 4 users to display and remove the horizontal axis 802 and the vertical axis 804 from the XSEM / profile display area 803. Use the first calibration shifter 809 and the second calibration shifter 811 to calibrate the scale used to measure the distance in the XSEM / profile display area 803. To provide a calibration distance, select the field 81 3 to allow the user to specify a value The distance between the first calibration mover 809 and the second calibration mover 811. After calibration, the user can place the mouse cursor in the XSEM / outline display area 803 to obtain a set of Cartesian coordinates equivalent to The position of the mouse cursor is relative to the horizontal and vertical axes presented by the display main axis selection = 837. The Cartesian coordinate group is presented in the label area 806 next to the mouse cursor position. The user can press the mouse cursor to select the distance measurement The starting position M holds the mouse cursor down, and the user can move the mouse cursor to the end position of the distance measurement. The wearing area 8 0 6 displayed next to the mouse cursor position will display the horizontal distance value, vertical distance value, The linear distance value, and the linear distance direction and the angle value between the horizontal and vertical axis. The distance calculated in the label area 806 is equivalent to using the first correction mover, 809, the second correction mover 8U, and the correction. In addition to the calibration V & established in the selection field 813, the user can drop a mark line group at the desired position in the XSEM / contour display area 803 by double-clicking the mouse cursor at the desired position. In one embodiment, XSEM / Rotation analysis options allowed

V. Description of the invention (23) 々 卩 8 ϋ 8 Yu Xian is not better than 6 L Μ / round. As before, use the display wheel temple to open and close. The cover uses the result of the contour parameter to establish the XSEM picture in the display area 8 0 3. Selecting 8 3 3 can display the contour 8 08. Figure 11 is a diagram showing the GU when the flail-analysis option is selected according to an embodiment of the present invention. I 1 0. Analyze images continuously 丨 7 Select continuous analysis options. When the continuous analysis option is selected, G U 丨 丨 〇 displays continuous plotting-field 901. FIG. 12 is a separate view schematically showing a continuous drawing area 901 according to an embodiment of the present invention. As discussed earlier, the wafer set management image 11 5 'wafer set represents a multiple data set set of many wafers where data is measured at a common pattern. Depending on the wafer processing process, the wafer collection can represent a process database, a statistical process control (SPC) sequence, or a tool comparison sequence. In the process database, a collection of multiple data sets represents the results in different processing conditions. In the SPC sequence, the collection of multiple data sets represents the results obtained by the same process in the same tool at different times. In a tool alignment sequence, a collection of multiple data sets represents the results of the same process in different tools.

The data components of each wafer in the wafer set can be displayed and analyzed. At the same time, spatially resolved statistics can be calculated for the collection of multiple data sets. In one embodiment, an average wafer data set is calculated based on a set of multiple data sets. The average wafer data set can be displayed and analyzed. Similarly, three standard deviation wafer data sets, full range wafer data sets, maximum data sets, and minimum data sets are calculated based on the collection of multiple data sets and can be displayed and analyzed.

Page 28 200414395 V. Description of the invention (24) The continuous drawing area 901 shows the current information. The continuous mapping area 901 is included in the wafer set 22 and the continuous mapping display 9.3 according to a value of 905. According to the chart style, the number of choices is 90, the data source is selected, 91 is selected, 907 is continuously plotted, and 9.3 is depicted; 9 is selected in order of 9.2. ^ ^ The performance is displayed on the crystal 9 0 3 Yuan Yuanren: The number of wafers is 909. Select the number 9; for: =; = to allow the user to choose the average value, the standard deviation of the three standard = # T and J, the full range value (that is, between the maximum and minimum values or the minimum value. Sequence order selection 913 provided-next door on the second month: = Allow users to choose the number of wafers or the date of the wafer in the array crystal display 903. The chart style selection 907 provides a pull function ΚΓΓί user selection straight line + circle format, straight line Format, circle = ί9, ηΛ are displayed in a continuous graph at 9 ° 3. In addition, the data comes from the idt pull function menu to allow the user to select the data point group used to count: select the value selected in number 9 0 9. In one embodiment, the base population group can be all wafer data points, the spatial statistical area 301: the black area, or the spatial white interval statistical area in the spatial statistical area 301. Regarding the empty sequence agreement, the control limit selection 9 31 is displayed to allow the user to display the control limit ^, 'Only the picture is displayed on the display 903. The control limit selection 915 provides the user with an order to select the control limit. In one embodiment , Control limit lever difference) · 5 Ί 5, 3 3.5, and the standard deviation 4 (i.e., on the average difference ^) also provides a display 929 a moving average selected to allow

Page 29 200414395 V. Description of the invention (25) The average of the moving average and the control limit on the selection of the average is shown on the continuous plot display 903. In one embodiment, the user can select a wafer by continuous mapping display 903 and display the corresponding wafer data in the wafer display window 2 j 5. In another embodiment, the user can activate the movie button 933 in the continuous drawing area 901 to automatically and continuously display each wafer data set in the wafer set in the wafer display window 2 15.

The continuous mapping area 901 also includes a continuous statistical area 917. The continuous statistical area 917 shows the average value 919, three standard deviation values 921 (three times the standard deviation of the mean), full distance value 923 (the difference between the maximum and minimum values), the maximum value 925, and the minimum value 9 27, corresponding to the currently loaded wafer set and data source selection 911.

Fig. 13 is a diagrammatic view showing a separate view of the spatial statistics area 301 according to an embodiment of the present invention. The spatial statistics area 301 includes a space control to remotely select a wafer area for statistical analysis. Spatial distribution selection 3.0 is provided. The user pulls down the function menu to select the type of inter-distribution to be used in spatial control 303. In one embodiment, a user center to a side door knife cloth is provided. The telecentric center-to-edge spatial distribution allows the user to select and drag a control line 3 3 5 to obtain the ideal center-to-edge area for analysis. The middle: to = area is defined as extending from the wafer center to the control line 335; the 2 center to edge area is called a black area for statistical analysis purposes. ^ Shake: The remaining part from the center of the edge to the other side of the edge area is statistical analysis 3 (πΛ field. The center-to-edge embodiment further includes a half-grid display field. The radius distance from the center of the wafer to the control line 3 3 5 is not included.

200414395 V. Description of the invention (26) Generally speaking, ‘provide a set of data measurement points Zi at the position (Xi, yi) across the wafer defined by X2 + y2 < = R2, where r is the radius of the wafer. The entire wafer statistics are based on the inclusion of all points6. Alternatively, the space control 303 allows the user to obtain the statistics of the sub-areas (ie, the black and white areas) of the wafer. The statistics of each sub-region are calculated based on the data points & included only in each sub-region. .

The spatial statistical area 30] further includes a black area statistical area 309. The black area statistics area 309 shows the average value 311, the three standard deviation value 313 (that is, twice the standard deviation of the mean), the full range value 315 (the difference between the maximum and minimum values), the maximum value 3 1 7, And the minimum value 3 1 9 corresponds to the black area about the currently selected center to edge area. In addition, the black area statistics area 309 includes a position display 321 to present a number of data measurement positions contained in the selected black area. When the user adjusts the control line 3 3 5 that defines the middle to the edge area of the selection, the statistics presented in the black area statistics area 3 0 9 are automatically recalculated. The spatial statistical area 3 0 1 further includes the white area statistical area 3 2 3. The white area statistics area 323 shows the average value 325, the three standard deviation value 327 (that is, three times the standard deviation of the mean), the full range value 3 2 9 (the difference between the maximum and minimum values), the maximum value 331, And the minimum value 333 corresponds to the white area about the currently selected center to edge area. In addition, the white area statistics area 3 2 3 includes a position display 335 to present a number of data measurement locations contained in the selected white area. When the user adjusts the control line 3 3 5 that defines the selected center to the edge area, the statistics presented in the white area statistical area 3 2 3 are automatically recalculated.

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V. Description of the invention (27) The spatial statistical area 3 0 1 further includes the mass center area 3 4 3. Mass center area 34 3 shows a set of polar coordinates corresponding to the mass center of the wafer '. Polar Block-The standard set includes a radius display of 34 5 and an angle display of 34 ° to confirm the quality center position of the wafer. Although the center deduction 3 4 1 is also displayed in the space control 3 q 3. Fig. 14 is a separate view diagrammatically showing a spatial statistical region 301 with edge-to-edge spatial distribution selection according to an embodiment of the present invention. In the embodiment of FIG. 4, an edge-to-edge spatial distribution is selected in the spatial distribution selection 305. Select the edge-to-edge spatial distribution to change the spatial control 3 to the edge-to-edge control. Edge-to-edge control allows the user to select and drag a control line 3 3 7 to obtain the desired analysis area. The edge-to-edge area is defined to cover half of the wafer with a boundary _ extending through the wafer center. By adjusting the control line 337, the user can rotate the edge-to-edge area about the center of the wafer. The value presented in the black area statistics area 309 corresponds to the selected edge-to-edge area. The value presented in the white area statistical area 3 2 3 is equivalent to the remaining area of the selected edge-to-edge area. The edge-to-edge embodiment further includes an angle display area 3 31 to show the angle of the control line 3 3 7 position to the center of the wafer. Also in the edge-to-edge embodiment, the center-of-mass area 343 shows that the polar coordinate set corresponds to the center of mass of the wafer. Fig. 15 is a separate view schematically showing a spatial statistical area 301 with a circular space distribution selection according to an embodiment of the present invention. In the embodiment of FIG. 5, the annular spatial distribution is selected in the spatial distribution selection 305. Selecting the annular space distribution changes the space control from 3 0 3 to the annular control. The loop control allows the user to select and drag a control line 3 3 9 to obtain the desired loop area for analysis. The ring region is defined as a ring about the center of the wafer. By adjusting the control line 3 3 9 ′, the user can move the ring region toward or away from the center of the wafer.

Page 32 ι ^ ϋ 200414395 V. Description of the invention (28) —---- The value in the black area statistical area 3 0 9 is equivalent to the selected ring area. The value presented in the white area statistical area 323 corresponds to the remaining area of the selected circular area. The ring-shaped embodiment further includes a radius " display collar 3 3 3 to display the radius distance from the center of the wafer to the control line 3 3 9. As in the circular embodiment, the center of mass area 343 shows the center of the polar coordinate set at the center of mass of the wafer. With the above embodiments in mind, it should be understood that the operations of the present invention that can be used with many computer applications include data stored in a computer system. These operations; ^ are physical users who need physical quantities. Usually, though not necessarily, these quantities take the form of electronic magnetic signals that can be stored, transferred, combined, compared, and otherwise used. Furthermore, the use of implementation is often referred to by words such as generation, recognition, decision, or comparison. Any operations described herein that form part of the invention are useful for machine operation. The invention also relates to a device or equipment for performing such operations. The equipment may be specially constructed for this necessary purpose, or it may be a general-purpose electric device, optionally activated or installed by a computer program stored in a computer. In particular, many general-purpose machines can be used together with computer programs written in accordance with the teachings herein, or they can be more convenient to construct a more specialized device to perform the necessary operations. The invention is also embodied as a computer-readable code on a computer-readable medium. A computer-readable medium is any data storage device that can store data, which is thereafter read by a computer system. Examples of computer-readable media include hard disks, network attached storage (NAS), read-only memory, random-access memory, CD-ROMs, CD-Rs, CD-200414395 Note (29) RWs, magnetic tapes, and other optical and non-optical data storage devices. Computer-readable media can also be distributed across network-connected computer systems to make computers readable—encoded for decentralized storage and execution. -Although the present invention has been described with several embodiments, it should be understood that one skilled in the art will understand many modifications, additions, exchanges, and equivalents when reading the foregoing description and studying the drawings. It is therefore intended that the present invention include all such modifications, additions, interchanges and equivalents which fall within the true spirit and scope of the present invention.

Page 34 200414395 Brief description of the drawings ^ ~ ___________ V. [Schematic i%, early description] By referring to the following detailed description and accompanying drawings, the present invention and other advantages can be best understood. ^ FIG. 1 is a diagram showing a graphical user interface (GU) [, graphical user interface) of a wafer viewing device according to an embodiment of the present invention; FIG. 2 is a diagram showing an embodiment according to the present invention A separate view of a wafer display area; FIG. 3 is a separate view showing a wafer data area according to an embodiment of the present invention; FIG. 4 is a schematic view showing a cross-sectional analysis option when a cross-sectional analysis option is selected according to an embodiment of the present invention GUI; FIG. 5 is a diagram showing a separate view of a cross-sectional area according to an embodiment of the present invention; FIG. 6 is a diagram showing a separate view of a bar graph area according to an embodiment of the present invention; and FIG. 7 is a diagrammatic display GUI when the split analysis option is selected according to an embodiment of the present invention; FIG. 8 is a diagram showing a separate view of the radiation / angle 77 cloth area according to an embodiment of the present invention; / FIG. 9 is a diagram showing a basis A GUI when an XsEM / profile analysis option is selected according to an embodiment of the present invention; FIG. 10 is a schematic view showing a separate view of an XSEM / wheel domain according to an embodiment of the present invention;

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Example When quick continuation is selected, FIG. 11 is a diagram showing a GU I when an analysis option according to the present invention is shown; FIG. 12 is a separate view of a graphical beta sub-area sub-area; FIG. 1 is a spatial statistical view of an embodiment of the present invention 3 is a separate view of a schematic field; FIG. 14 is a separate view showing a spatially statistical area selected by cloth according to an embodiment of the present invention. 5 is a diagram showing a space statistical region without a μ θ 丄 distribution selection according to the present invention. ^ View 7 ~ Example with circular empty element symbol description: 10 、 / User interface 101 ～ Function menu row 103 ～ Clear Wafer / XSEM image 105 ~ Load data / XSEM image 107 ~ Store archive image 109 ~ Print image 111 ~ Copy to clipboard image 113 ~ Restore deleted wafer position image 115 ~ Wafer collection management Image 117 to Continuous Analysis Image 119 to Diameter / Bar Graph Image 121 to Azimuth / Radial Distribution Image

200414395 Brief description of the drawings 123 ~ XSEM / outline image 1 2 5 ~ bar graph image 127 ~ wafer spread page image. 1 2 9 ~ help image 1 3 1 ~ email technical support image 1 3 3 ~ about image 1 3 5 ~ registered image 1 3 7 ~ first wafer identification and selection area 1 3 9 ~ second 1 wafer identification and selection area 1 4 1 ~ display control area 1 4 3 ~ operator area 1 4 5 ~ operation area 1 4 7 ~ unit area 1 4 9 ~ internal wafer math selection 1 5 1 ~ first internal Mathematical operation domain 1 5 3 ~ Internal math operator domain 1 5 5 ~ Second internal math operation domain 1 5 7 ~ Wafer description area 1 5 9 ~ Position area 1 6 1 ~ Edge area 1 6 3 ~ Size area 165 ~ Wafer poor area 1 6 7 ~ Wafer identification symbol area 1 6 9 ~ Date area

Page 37 200414395 Simple illustration of the diagram 171 ~ Method area 173 ~ Annotation area 175 ~ Expanded image 201 ~ Wafer display area 203 ~ Wafer statistical area 205 Mean value 207 IT Standard deviation value 209 Distance value 211 ~ Maximum value 213 ~ Minimum value 215 to wafer display window 217 to wafer image 219 to actual data measurement position 221 to 7jC flat guide 223 vertical guide 225 to information box 227 to ruler 229 to color scale 231 to wafer viewing selection area 233 to point Density display selection area 235 to Insert selection area 237 to Analysis selection area 239 to Display position selection 241 to Display value selection

P.38 200414395 Schematic description 243 ~ Notification limit area 245 ~ Warning limit start selection 247 ~ Upper warning limit area 249 ~ Lower notification limit area 251 ~ Scale limit area 253 ~ Scale limit start selection 2 5 5 ~ Upper scale Limit area 2 57 ~ Lower scale limit area 259 ~ Pull-down function menu 261 ~ Percent value numerical area 263 ~ Display ruler selection 265 ~ Grain layout area 2 67 ~ Display grain layout selection 2 6 9a ^ Horizontal grain size area 2 6 9 b ~ Vertical grain size area 271a-^ Horizontal grain offset area 271b--Vertical grain offset area 301 ~ Spatial statistical area 30 3 ~ Spatial control 3 0 5 ~ Spatial distribution selection 30 7 ~ Radius display Field 3 0 9 ~ Black area Statistics area 311 ~ Average value 313 ~ Standard deviation

P.39 200414395 简单 Schematic description 3 1 5 ~ Total distance value 3 1 7 ~ Maximum value 3 1 9 ~ Minimum value 3 2 1 ~ Position display 3 2 3 ~ White area Statistics area 325 ~ Average value 327 ~ Three standards Difference 3 2 9 ~ Total distance 3 3 1 ~ Maximum 3 3 3 ~ Min. 3 3 5 ~ Control line 3 3 7 ~ Control line 3 3 9 ~ Control line 3 4 1 ~ Mass center indicator 343 ~ Mass Center area 3 4 5 ~ Radius display 347 ~ Angle display 4 0 1 ~ Wafer data area 4 0 3 ~ Wafer size selection area 4 0 5 ~ Allows new position selection 4 0 7 ~ Position line 40 9 ~ X line 411 ~ Y rows 4 1 3 ~ Z rows

Page 40 200414395 Simple description of the diagram 501 ~ Transverse analysis area 503 ~ Transverse statistical area 505 ~ Average value 507 ~ Three standard deviation value 509 ~ Total distance value 511 ~ Maximum value 513 ~ Minimum value 515 ~ Angle selection chart control 517 ~ Angle value field 519 ~ Color selection 521 ~ Scale limit synchronization selection 523 ~ Transverse display 525 ~ Transverse control line 601 ~ Bar graph area 603 ~ Bar graph data source selection 605 ~ Bar graph display 607 ~ Ideal Gauss Distribution 701 ~ Radiation / Angle distribution area 703 ~ Radiation distribution statistical area 705 ~ Average value 707 ~ Three standard deviation value 709 ~ Total distance value 711 ~ Maximum value 713 ~ Minimum value

Page 41 200414395 Simple illustration of the diagram 71 5 ~ Angular distribution statistical area 71 7 ~ Average value 7 1 9 ~ Three standard deviation value 7 2 1 ~ Total distance value 7 2 3 ~ Maximum 72 5 ~ Minimum value 7 2 7 ~ Distribution selection area 7 2 9 ~ Radius value area 7 3 1 ~ Angle value area 733 ~ Graph distribution control 73 5 ~ Color selection 737 ~ Scale limit synchronization selection 7 3 9 ~ Radiation distribution display 741 ~ Angle distribution display 7 4 3 ~ Circular distribution control line 7 4 5 ~ Radiation distribution control line 801 ~ XSEM / profile area 8 0 2 ~ Horizontal axis 8 0 3 ~ XSEM / profile display area 8 0 4 ~ Vertical axis 8 0 5 ~ Horizontal mover 8 0 6 ~ Label area 8 0 7 ~ Vertical mover 8 0 8 ~ Outline

P.42 200414395 Brief description of the diagram 809 ~ First correction No. rotation, deviation, slotting, relocation, shift, display, display, serial number, sequential control, second correction, positive distance, focus, lens shift, selection, selection, file name, XESM except XSEM Except all outlines XSEM shows the main axis Continued drawing Continuation drawing Data value table Model quantity selection According to the source sequence order limit limit statistical average value 811 813 817 819 821 823 825 827 829 831 831 833 835 837 901 903 905 907 909 911 913 915 917 ~ even 919 ~ flat mover mover selection area selection area area area image area setting 4 button selection selection selection area display selection selection selection area

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Page 44

Claims (1)

200414395 6. Scope of patent application 1. A chart user interface for controlling wafer position map analysis, including: Provide chart selection control to select the area of wafer position map for statistical analysis; generate statistical data for the selected area To complete the statistical analysis; display the statistical data of the selected area; and regenerate the statistical data for display when a change in the selected area is detected. 2. For example, the user interface of the chart for controlling the analysis of the wafer position map in the first scope of the patent application, including: Provide a cross-section to analyze the wafer position map, and the cross-section can be adjusted by the chart to the new cross-section position for selection Changes in the area; and statistics when new cross-section positions are detected. 3. If the user interface of the chart used to control the analysis of the wafer position map in item 1 of the patent application scope, further includes: providing chart control to select the radius value and angle value of the statistical distribution; and enabling the chart to adjust the radius value and The angle value, radius value and angle value define the selected area. 4. If the user interface of the chart used to control the analysis of the wafer position map according to item 1 of the patent application scope, it further includes: A graphical representation of the center of mass provided for the surface unevenness confirmed in the wafer position map. 5. If the user interface of the map for controlling wafer position map analysis in item 1 of the scope of the patent application is used, the selected area defines the sub-maternal analysis, which is completed. Page 45 200414395 VI. Scope of patent application The whole body analysis system is the entire wafer. 6 · A kind of chart used to analyze the interface used to generate Yueyuan # strike @ 者 Interface, wafer position map using Ij31 bit / layout data, user interface bread contains The wheel provides spatial distribution options for volume data and secondary mother data rabbits, explaining the secondary mother domain with uneven surface contours; ^, the target area of the wafer on the entire wafer surface enables the month b to execute a specific external enable to perform a The chart selection of area 2 and 3 options is not available; and, the chart confirms that this area displays the measurement of this area for the number of secondary populations, and the measurement is automatically updated when it is displayed.彳 Measured changes in the chart confirmation area. 7 · For example, the user interface of the chart using the data of 8 and 4 in the scope of patent application, knife analysis is used to generate wafer position maps to define the secondary data for overlapping analysis. ^ Divided, one of the options becomes a change in the confirmation area. And the clothing shape can be placed in the user interface of the chart, such as the data used in the 6th scope of the patent application, to generate a wafer location map that defines a semicircle, and the semicircle can be heavy; Π = Changes to one of the items. In order to cause the confirmation area, such as the user interface of the chart for analyzing the data of the patent application No. 6, the space two is used to generate the wafer position map to define the HI open name, H m · 0: / > ^ JA- A, ^ 200414395 VI. Patent Application Scope 10 · —A graphical user interface for analyzing wafer measurement data, including: providing-providing-providing the results between a quantity of data; and displaying crystals 11. Such as The application form user agent data represents a common subset. 12. If the application form user agent provides one episode. 13. If the user form data of the application form and the second data are removed 14. If the user form of the application form is circular, the position on the surface is controlled to select the first set of wafer measurement data; the control is to select the second set of crystals Circle measurement data; control to perform a mathematical operation on the first set of wafer measurement data and the second set of wafer measurements, and the mathematical operation to create a result combination of a set of circle data of the wafer data. The 10th item of the patent scope is used to analyze the wafer measurement data. The first group of wafer measurement data and the second group of wafer measurement wafer measurement data are a common subset. The wafer measurement data is about the wafer. Part of it. The drawing for analyzing wafer measurement data in item 11 of the patent scope, further includes: Subset selection control to select common wafer measurement data. The drawing for analyzing wafer measurement data in item 12 of the patent scope Among them, the subset selection control is used for wafer measurement data from the first wafer measurement group, and wafer-specific measurement data from the first and second wafer measurement numbers. The 10th area of the patent scope is used to analyze the wafer measurement data. The result combination of displaying the wafer data includes displaying the wafer wafer position map. Different results in the result set of the data Page 47 200414395 VI. Scope of patent application Use one-man color scale or single-color scale to illustrate. User interface types ::: diagrams for the collection and evaluation of wafer measurement data use: one $: 丨 to select the collection of wafer measurement data; to improve control to advance lessons / 4 * Q asked Results; and the collection of Lang measurement data, the evaluation builds a combination of evaluation results. «It is used to manage and evaluate the number of wafer measurements. Provide control even more: Collection of circle measurement data. In addition to s, the combination of round rigidity data to or from the crystal is used to manage and evaluate the number of wafer measurements provided by the chart using the collection of graphs, such as patents and patents 1 π ^ according to the set-control: more include: The data of wafer measurement circle / period are used to generate wafer measurement data. The number of measurements of the same type for multiple wafers 18. If the scope of the patent application is not covered by the chart, the control of the items used in the chart to manage and evaluate the set of wafer measurement numbers includes two sides, where the wafer is evaluated A set of options for the measurement data includes the control of the amount of flat and optional evaluation, the amount is selected from the total value between the small value = number, the standard deviation of the average, the maximum value and the most 19. If you apply for special ^, And minimum. According to the collection of Figure 15, the user interface for managing and evaluating the collection of wafer measurement numbers is used in the user interface, where the evaluation wafer is performed. The quantity data includes the measurement data used to select the wafer to be evaluated. Set Page 48 200414395 VI. Application for Patent Scope Control. The subset of wafer measurement data is a part of the wafer. 20. The user interface of the chart used to manage and evaluate the collection of wafer measurement data as described in item 19 of the scope of the patent application, wherein the control of selecting a subset of wafer measurement data is included in any half of the wafer, from the wafer The option to select wafer measurement data in one of any area where the center can extend outwards, and an optional ring area at any distance from the center of the wafer. 2 1. A chart user interface for contour analysis, including: displaying an electron microscope image; providing controls to adjust the electron microscope image; and providing chart measurement control. 22. The chart user interface for contour analysis according to item 21 of the scope of patent application, further including: Provide control to correct chart measurement control. 2 3. If the user interface of the chart used for contour analysis in item 21 of the patent application scope further includes: displaying a contour on the electron microscope image. Page 49