SG145540A1 - Semiconductor package singulating system and method - Google Patents

Semiconductor package singulating system and method

Info

Publication number
SG145540A1
SG145540A1 SG200401337-1A SG2004013371A SG145540A1 SG 145540 A1 SG145540 A1 SG 145540A1 SG 2004013371 A SG2004013371 A SG 2004013371A SG 145540 A1 SG145540 A1 SG 145540A1
Authority
SG
Singapore
Prior art keywords
semiconductor package
singulating system
package singulating
semiconductor
singulating
Prior art date
Application number
SG200401337-1A
Inventor
Fulin Liu
Kok Yeow Eddy Lim
Hwee Seng Jimmy Chew
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG200401337-1A priority Critical patent/SG145540A1/en
Priority to KR1020040031334A priority patent/KR100693334B1/en
Priority to PCT/SG2004/000157 priority patent/WO2005087471A1/en
Priority to MYPI20042234A priority patent/MY143145A/en
Priority to TW093127237A priority patent/TWI250621B/en
Publication of SG145540A1 publication Critical patent/SG145540A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
SG200401337-1A 2004-03-12 2004-03-12 Semiconductor package singulating system and method SG145540A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG200401337-1A SG145540A1 (en) 2004-03-12 2004-03-12 Semiconductor package singulating system and method
KR1020040031334A KR100693334B1 (en) 2004-03-12 2004-05-04 Semiconductor package singulating system and method
PCT/SG2004/000157 WO2005087471A1 (en) 2004-03-12 2004-05-31 Semiconductor package singulating system and method
MYPI20042234A MY143145A (en) 2004-03-12 2004-06-10 Semiconductor package singulating system and method
TW093127237A TWI250621B (en) 2004-03-12 2004-09-08 Semiconductor package singulating system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200401337-1A SG145540A1 (en) 2004-03-12 2004-03-12 Semiconductor package singulating system and method

Publications (1)

Publication Number Publication Date
SG145540A1 true SG145540A1 (en) 2008-09-29

Family

ID=34957445

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200401337-1A SG145540A1 (en) 2004-03-12 2004-03-12 Semiconductor package singulating system and method

Country Status (5)

Country Link
KR (1) KR100693334B1 (en)
MY (1) MY143145A (en)
SG (1) SG145540A1 (en)
TW (1) TWI250621B (en)
WO (1) WO2005087471A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410329B (en) * 2009-03-09 2013-10-01 Ind Tech Res Inst Apparatus for releasing a flexible device and method thereof
CN102658394B (en) * 2012-04-25 2014-03-26 深南电路有限公司 Method and device for profile forming of packaging substrate
CN102903679B (en) * 2012-11-09 2014-11-05 日月光半导体制造股份有限公司 Incision fixing fixture
US9618653B2 (en) 2013-03-29 2017-04-11 Stmicroelectronics Pte Ltd. Microelectronic environmental sensing module
US9082681B2 (en) 2013-03-29 2015-07-14 Stmicroelectronics Pte Ltd. Adhesive bonding technique for use with capacitive micro-sensors
US10254261B2 (en) 2016-07-18 2019-04-09 Stmicroelectronics Pte Ltd Integrated air quality sensor that detects multiple gas species
US10429330B2 (en) 2016-07-18 2019-10-01 Stmicroelectronics Pte Ltd Gas analyzer that detects gases, humidity, and temperature
US10557812B2 (en) 2016-12-01 2020-02-11 Stmicroelectronics Pte Ltd Gas sensors

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
EP1193738A2 (en) * 2000-09-22 2002-04-03 Ishii Tool & Engineering Corporation Method and apparatus for manufacturing chips
US20020083938A1 (en) * 1999-04-08 2002-07-04 Alois Tieber Techniques for dicing substrates during integrated circuit fabrication

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165232A (en) * 1998-03-13 2000-12-26 Towa Corporation Method and apparatus for securely holding a substrate during dicing
US6150240A (en) * 1998-07-27 2000-11-21 Motorola, Inc. Method and apparatus for singulating semiconductor devices
TW423113B (en) * 1998-09-18 2001-02-21 Towa Corp Arrangement configured to support substrate during dicing process, and apparatus and method for cutting tapeless substrate using the arrangement
US20020185121A1 (en) * 2001-06-06 2002-12-12 Farnworth Warren M. Group encapsulated dicing chuck

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
US20020083938A1 (en) * 1999-04-08 2002-07-04 Alois Tieber Techniques for dicing substrates during integrated circuit fabrication
EP1193738A2 (en) * 2000-09-22 2002-04-03 Ishii Tool & Engineering Corporation Method and apparatus for manufacturing chips

Also Published As

Publication number Publication date
TW200531224A (en) 2005-09-16
KR20050091614A (en) 2005-09-15
TWI250621B (en) 2006-03-01
KR100693334B1 (en) 2007-03-09
MY143145A (en) 2011-03-15
WO2005087471A1 (en) 2005-09-22

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