SG11201809509SA - Dual-layer alignment device and method - Google Patents
Dual-layer alignment device and methodInfo
- Publication number
- SG11201809509SA SG11201809509SA SG11201809509SA SG11201809509SA SG11201809509SA SG 11201809509S A SG11201809509S A SG 11201809509SA SG 11201809509S A SG11201809509S A SG 11201809509SA SG 11201809509S A SG11201809509S A SG 11201809509SA SG 11201809509S A SG11201809509S A SG 11201809509SA
- Authority
- SG
- Singapore
- Prior art keywords
- movable platform
- mark
- dual
- marking
- measurement device
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/70683—Mark designs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lens Barrels (AREA)
Abstract
A dual-layer alignment device comprises a fixing frame (); a first measurement device (50) and a marking plate (41) disposed on the fixing frame (40), wherein a fixed frame mark (20) is configured on the marking plate (41); and a movable platform (60) and a reference mark (30), a movable platform mark (70), and a second measurement device (10) configured on the movable platform (60). The first measurement device (50) is configured to measure a relative location relationship between the reference mark (30) and the movable platform mark (70). The second measurement device (10) is configured to measure a relative location relationship between the reference mark (30) and the fixed frame mark (20), so as to obtain a final relative location relationship between the movable platform mark (70) and the fixed frame mark (20). The movable platform (60) is moved according to the final relative location relationship to a configured location. A dual-layer alignment method is provided correspondingly. The movable platform is the only movable component in the system, and employs a static marking method to implement marking a coordinate relationship, and therefore, marking precision is unaffected by positioning precision of the movable platform (60), and consequently, alignment precision can be increased. The embodiment can employ a dual-lens or multi-lens design, providing flexible configurations and increasing the alignment precision. 15
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610284287.4A CN107329379B (en) | 2016-04-29 | 2016-04-29 | The double-deck alignment device and the double-deck alignment methods |
PCT/CN2017/082493 WO2017186170A1 (en) | 2016-04-29 | 2017-04-28 | Dual-layer alignment device and method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201809509SA true SG11201809509SA (en) | 2018-11-29 |
Family
ID=60161822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201809509SA SG11201809509SA (en) | 2016-04-29 | 2017-04-28 | Dual-layer alignment device and method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10578986B2 (en) |
JP (1) | JP6700424B2 (en) |
KR (1) | KR102160351B1 (en) |
CN (1) | CN107329379B (en) |
SG (1) | SG11201809509SA (en) |
TW (1) | TWI614823B (en) |
WO (1) | WO2017186170A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665461B (en) * | 2018-05-04 | 2019-07-11 | 財團法人工業技術研究院 | Laser positioning system and method thereof |
CN109240047B (en) * | 2018-11-06 | 2023-11-21 | 苏州源卓光电科技有限公司 | Direct-writing type exposure machine and calibration method thereof |
KR20220150942A (en) * | 2020-04-06 | 2022-11-11 | 가부시키가이샤 니콘 | Pattern forming device and pattern forming method |
CN113625532B (en) * | 2020-05-08 | 2022-10-25 | 上海微电子装备(集团)股份有限公司 | Substrate mark position detection method and device |
US11867501B2 (en) * | 2021-12-28 | 2024-01-09 | Mloptic Corp. | Integrated calibration tool for optical instrument entrance pupil 6-axis spatial allocation |
CN115031626B (en) * | 2022-05-05 | 2023-08-18 | 智慧星空(上海)工程技术有限公司 | Substrate coordinate measuring method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4573791A (en) * | 1979-04-03 | 1986-03-04 | Optimetrix Corporation | Step-and-repeat projection alignment and exposure system |
US4557599A (en) * | 1984-03-06 | 1985-12-10 | General Signal Corporation | Calibration and alignment target plate |
US5929997A (en) * | 1997-07-02 | 1999-07-27 | Winbond Electronics Corp. | Alignment-mark measurements on the backside of a wafer for synchronous wafer alignment |
JP3065612B1 (en) * | 1999-06-01 | 2000-07-17 | 日本電産リード株式会社 | Board inspection equipment |
JP2001332490A (en) * | 2000-03-14 | 2001-11-30 | Nikon Corp | Aligning method, exposure method, aligner, and device- manufacturing method |
JP2004510129A (en) * | 2000-05-17 | 2004-04-02 | ザイゴ コーポレイション | Interference device and interference method |
US6642995B2 (en) | 2001-11-07 | 2003-11-04 | Euv Llc | Mask-to-wafer alignment system |
WO2005067815A1 (en) * | 2004-01-05 | 2005-07-28 | Zygo Corporation | Stage alignment in lithography tools |
JP2006258845A (en) * | 2005-03-15 | 2006-09-28 | Dainippon Printing Co Ltd | Pattern forming device and head correcting method |
CN1794097A (en) * | 2006-01-06 | 2006-06-28 | 上海微电子装备有限公司 | Off-axis position aligning system and aligning method in projection exposure device |
CN1794096A (en) * | 2006-01-06 | 2006-06-28 | 上海微电子装备有限公司 | Automatic aligning device |
CN100480867C (en) * | 2007-03-06 | 2009-04-22 | 上海微电子装备有限公司 | Aligning system and aligning method based on image technique |
CN101158818A (en) | 2007-11-16 | 2008-04-09 | 上海微电子装备有限公司 | Alignment apparatus, alignment method and imagery quality detecting method |
US8139219B2 (en) | 2008-04-02 | 2012-03-20 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor wafer alignment |
KR101678050B1 (en) * | 2009-11-16 | 2016-12-07 | 삼성전자 주식회사 | Maskless exposure apparatus using off-axis alignment and method |
WO2012013451A1 (en) * | 2010-07-30 | 2012-02-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
NL2007279A (en) * | 2010-09-28 | 2012-03-29 | Asml Netherlands Bv | Method for calibrating a target surface of a position measurement system, position measurement system, and lithographic apparatus. |
KR102068950B1 (en) * | 2011-02-10 | 2020-01-21 | 케이엘에이 코포레이션 | Structured illumination for contrast enhancement in overlay metrology |
US8489225B2 (en) * | 2011-03-08 | 2013-07-16 | International Business Machines Corporation | Wafer alignment system with optical coherence tomography |
CN104272191B (en) * | 2012-04-26 | 2017-06-09 | Asml荷兰有限公司 | Lithographic equipment and device making method |
JP6264831B2 (en) * | 2012-11-06 | 2018-01-24 | 株式会社ニコン | Alignment apparatus, alignment method, and manufacturing method of laminated semiconductor device |
-
2016
- 2016-04-29 CN CN201610284287.4A patent/CN107329379B/en active Active
-
2017
- 2017-04-28 TW TW106114361A patent/TWI614823B/en active
- 2017-04-28 SG SG11201809509SA patent/SG11201809509SA/en unknown
- 2017-04-28 KR KR1020187034544A patent/KR102160351B1/en active IP Right Grant
- 2017-04-28 US US16/097,500 patent/US10578986B2/en active Active
- 2017-04-28 JP JP2018555975A patent/JP6700424B2/en active Active
- 2017-04-28 WO PCT/CN2017/082493 patent/WO2017186170A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20190003668A (en) | 2019-01-09 |
CN107329379B (en) | 2019-01-18 |
CN107329379A (en) | 2017-11-07 |
TW201738986A (en) | 2017-11-01 |
JP2019515273A (en) | 2019-06-06 |
US10578986B2 (en) | 2020-03-03 |
WO2017186170A1 (en) | 2017-11-02 |
KR102160351B1 (en) | 2020-09-25 |
JP6700424B2 (en) | 2020-05-27 |
US20190146364A1 (en) | 2019-05-16 |
TWI614823B (en) | 2018-02-11 |
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