CN1794096A - Automatic aligning device - Google Patents
Automatic aligning device Download PDFInfo
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- CN1794096A CN1794096A CN 200610023154 CN200610023154A CN1794096A CN 1794096 A CN1794096 A CN 1794096A CN 200610023154 CN200610023154 CN 200610023154 CN 200610023154 A CN200610023154 A CN 200610023154A CN 1794096 A CN1794096 A CN 1794096A
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Abstract
An automatic alignment device is prepared as leading outgoing light from light source to label lighting unit being used to project light uniformly on label for aligning, imaging label and projecting it on target surface of label shooting unit, receiving image of label by label shooting unit and transmitting calculated out and obtained position error to motion control unit after image of label is processed by image processing unit.
Description
Affiliated technical field
The present invention relates to the optical devices technologies field, particularly about the automatic alignment device in a kind of projection aligner.
Background technology
With the circuit pattern that is depicted on the mask, be imaged on by projection aligner on the silicon chip surface of the manufacturing integrated circuit that scribbles photosensitive materials such as photoresist, on the silicon chip surface of making integrated circuit, form the shadow etching method of pattern afterwards by etching technics, be widely used in various fields, printed circuit board (PCB) is also used recent exposure device manufacturing.
Projection aligner is with the circuit pattern on the mask, do projection exposure through optical systems such as projection exposure lens, with circuit pattern with certain amplification or the multiplying power projection dwindled on the silicon chip surface of making integrated circuit, become known for the manufacturing of integrated circuit, this projection aligner also is applicable to the manufacturing of printed circuit board (PCB) in recent years.
When doing exposure with projection aligner, mask must be aimed at the position of exposure object (for example silicon chip, printed circuit board (PCB) etc.), usually the mask top all disposes the mark that position alignment is used with the exposure object top, by certain position alignment device and position alignment method, set up accurate relative position relation between mask and the exposure object.
The position alignment device and the position alignment method that are used for projection aligner at present are a lot, but because the complicacy of its position alignment device, not only increase Design of device cost and dress school difficulty, and make the position alignment process become complicated, increase position alignment error link, finally influence alignment precision.
Summary of the invention
Purpose of the present invention realizes that for solving above-mentioned prior art problem the high precision position between mask and the exposure object is aimed at.
The invention provides a kind of automatic alignment device, has a lighting source, this lighting source imports to the mark lighting unit by lighting fiber with the emergent light of lighting source, and this mark lighting unit projects light the mark that is used to aim at that will throw light on equably; Mark image-generating unit will be marked as picture and project on the mark camera target surface, and this mark camera receives the picture of mark, send the site error that calculates to motion control device after graphics processing unit is handled.
Wherein, the sensor of described mark camera is CCD or CMOS.The light of described mark lighting unit converges on the Amici prism by one first lens combination, and is reflexed to after second lens combination evenly disperses by this Amici prism, again through mirror reflects to mark.Described mark image-generating unit is by catoptron, second lens combination, and the Amici prism composition, passes Amici prism after picture to the second lens combination of mirror reflects mark converges and projects on the mark camera target surface.Therefore, the shared same set of optical system of described mark illuminator and mark imaging system forms coaxial-illuminating.
Automatically alignment device has two covers, and a cover is used to set up the relative position relation between mask mark and the wafer-supporting platform reference mark; The another set of relative position relation that is used to set up between exposure object mark and the wafer-supporting platform reference mark.A plurality of described automatic alignment devices can be formed a cover Automatic Alignment System.
The shared cover optical system of mark illuminator of the present invention and mark imaging system, will be more on the space structure size compact, be convenient to integrated.
And above-mentioned position alignment device all is in and holds the bed top, is convenient to and the integrated of other equipment and test.It is mobile in a big way to hold bed, holds the bed top like this and only needs mask set markers align device, can reduce alignment device design and processing cost, also can reduce the integrated level of alignment error link, raising equipment.
In addition, be used among the present invention mask position can have punctual mask mark quantity a plurality of, translational movement and mask rotation amount that can high precision location mask center.
Description of drawings
Fig. 1 is a system architecture synoptic diagram of the present invention.
Fig. 2 is mask mark used in the present invention and the position view of logical light window on mask.
Fig. 3 is the position view of wafer-supporting platform reference mark used in the present invention on wafer-supporting platform.
Fig. 4 is an exposure object mark partial enlarged drawing used in the present invention.
Embodiment
Existing exposure system generally is made up of following components: the mask of describing circuit pattern; Be used to support the bed that holds of mask with circuit pattern; The wavelength that utilizes exposure light source with the circuit pattern described on the mask with certain amplification or the multiplying power projection imaging the dwindled optical projection system on the exposure object; And exposure object, its upper surface scribbles photoresist, and the circuit pattern that is used to receive on the mask passes through the optical projection system imaging; Wafer-supporting platform is used to support exposure object; Hold bed and wafer-supporting platform motion control device, in the process of setting up mask mark and exposure object mark relative position, the motion of holding bed and wafer-supporting platform by control makes mask aim at exposure object.The mask mark is located on the mask, is used for the position alignment of mask; The wafer-supporting platform reference mark is used to establish the relative position relation between mask and the wafer-supporting platform.
Two cover position alignment devices have been installed in the present invention on this basis additional, are used for determining of relative position between above-mentioned each mark, and then determine accurate position relation between mask and the current exposure object by motion control device.These two position alignment apparatus structures are basic identical.Wherein, the mask position alignment device also claims the coaxial position alignment device, is used to set up the relative position relation between mask mark and the wafer-supporting platform reference mark; Exposure object position alignment device also claims the off-axis position alignment device, is used to set up the relative position relation between exposure object mark and the wafer-supporting platform reference mark.
The mask position alignment device is positioned at a side of holding the bed top, and exposure object position alignment device is positioned at a side of wafer-supporting platform top.
Described alignment device comprises: lighting source is used for the illumination of mark; Lighting fiber is used for the emergent light of lighting source is imported to the mark illuminator; The mark illuminator is used for mark is evenly thrown light on; The mark imaging system is used for alignment mark is imaged onto mark camera target surface; The mark camera, be used to receive the picture of mark, its sensor is CCD (Charge Coupled Device charge-coupled image sensor) or CMOS (Complementary Metal-Oxide-Semiconductor Transistor complementary metal oxide semiconductor (CMOS)).
In above structure, the shared cover optical system of mark illuminator and mark imaging system can improve the homogeneity of illumination and can save the space again, reduce cost.In addition, exposure object position alignment device adopts the lighting source away from exposure wavelength, avoids in exposure object mark position alignment procedures photoresist generation sensitization like this.
Below in conjunction with accompanying drawing and specific implementation method, the present invention is further illustrated.
Fig. 1 is the projection aligner for manufacturing integrated circuit or printed circuit board (PCB), the mask 21 of describing the exposure circuit pattern places and holds on the bed 20, can move in X ', Y ', θ ' direction by holding bed motion control device 30, wherein θ ' is the anglec of rotation (not shown) around the Z axle.The exposure object 26 that scribbles photoresist places on the wafer-supporting platform 24, moves in X, Y, θ direction by wafer-supporting platform motion control device 31 may command wafer-supporting platforms 24, and wherein θ is the anglec of rotation (not shown) around the Z axle.Projection aligner can be transferred to the circuit pattern on the mask on the exposure object 26 with certain amplification or reduction magnification through optical projection system 23 by exposure light source 22 exposures.
With position alignment device 1 is the structure of example explanation position alignment device: position alignment device 1 is made up of with being marked as system the mark illuminator, illuminator comprises mark lighting unit 3, lens combination 4, Amici prism 5, lens combination 6 and catoptron 7, its objective is that forming even illumination light is evenly thrown light on mask alignment mark 18,19 and wafer-supporting platform reference mark 25, the optical texture of this illuminator can be the Kohler illumination system, also can be other coaxial-illuminating system; Imaging system comprises catoptron 7, lens combination 6, Amici prism 5 and mark camera 8, by this imaging system mask alignment mark 18,19 and wafer-supporting platform reference mark 25 is imaged on the mark camera 8.
Similarly, position alignment device 2 is made up of with being marked as system the mark illuminator, and the mark illuminator comprises mark lighting unit 10, lens combination 11, Amici prism 12, lens combination 13 and catoptron 14; The mark imaging system comprises catoptron 14, lens combination 13, Amici prism 12 and mark camera 15.
29 pairs of marking image processing units of overhead control device 9,16, projection aligner, hold subsystems such as bed motion control device 30 and wafer-supporting platform motion control device 31 and do unified control, and realize the position alignment algorithm.
Fig. 2 is the mask mark 18,19 on the mask 21 and the position description figure of logical light window 17. Mask mark 18,19 is located at the periphery of circuit pattern 32, and logical light window 17 is in order to allow the illumination and the imaging of wafer-supporting platform reference mark 25 can pass through mask 21.With respect to the circuit pattern of being located on the mask 21 32, the mask mark is very little, and size is in the submillimeter rank.Mask mark 18,19 is shaped as " ten " font among Fig. 2, and actual conditions are: mark shape can be set as required, no particular determination.
Fig. 3 is the position description figure of wafer-supporting platform reference mark 25 on wafer-supporting platform 24, and this is labeled as reflection-type amplitude mark, and with respect to little many of exposure object 26, size is in the submillimeter rank.Also indicated the position of exposure object 26 on wafer-supporting platform 24 among the figure, the diverse location of same circuit pattern on exposure object 26 exposes, and through postchannel process machine-shaping.
Fig. 4 is exposure object mark 27,28 operation instruction figure, exposure object mark 27,28 among the figure is exaggerated demonstration, actual conditions are: this mark is formed on the formed circuit pattern 33 of preceding road technology, and is very little with respect to circuit pattern 33, and size is in the submillimeter rank; This mark shape can be set as required in addition, Any shape all can, no particular determination.
Its alignment actions below is described:
The alignment actions of mask mark camera 8 and wafer-supporting platform reference mark 25
Wafer-supporting platform motion control device 31 moves wafer-supporting platform 24 to the precalculated position, makes wafer-supporting platform reference mark 25 in the field range of mark camera 8; Hold bed motion control device 30 and will hold bed 20 and move to the precalculated position, make logical light window 17 in the field range of mark camera 8, hold bed motion control device 30 and will write down the positional information of holding bed 20 at this moment this moment.
Light the lighting unit 3 of position alignment device 1, make position alignment device 1 and graphics processing unit 9 in running order, irradiate light is on wafer-supporting platform reference mark 25, the picture of 19 pairs of wafer-supporting platform reference marks 25 of graphics processing unit on mark camera 8 handled, and the center information of record wafer-supporting platform reference mark this moment 25 pictures, write down the positional information of wafer-supporting platforms 24 at this moment by wafer-supporting platform motion control device 31 simultaneously.
The alignment actions of mask mark 18,19 and mask mark camera 8
Move and hold bed 20 by holding bed motion control device 30, mask mark 18 is in the imaging viewing field scope of mask mark camera 8 to the precalculated position.
In like manner, move and hold bed 20, mask mark 19 is in the imaging viewing field scope of mask mark camera 8 to the precalculated position by holding bed motion control device 30.1 pair of mask mark 19 of position alignment device throws light on, imaging and Flame Image Process, obtains the positional information of its center on mask mark camera 8.Hold the positional information that bed motion control device 30 records hold bed 20 at this moment simultaneously.
According to the center of the above-mentioned mask marker image that writes down and the center information of wafer-supporting platform reference mark picture, and the corresponding positional information of holding bed 20 and wafer-supporting platform 24, by a series of coordinate transforms and related algorithm, hold required amount of movement (the Δ X ' of bed 20 when in overhead control device 29, calculating mask registration, Δ Y ', Δ θ '), send to and with this result and to hold bed motion control device 30 to finish aiming at of mask 21 and wafer-supporting platform reference mark 25.
The alignment actions of exposure object mark camera 15 and wafer-supporting platform reference mark 25
Light the lighting unit 10 of position alignment device 2, make position alignment device 2 and graphics processing unit 16 in running order, irradiate light is on wafer-supporting platform reference mark 25, wafer-supporting platform motion control device 31 moves wafer-supporting platform 24 to the precalculated position, make wafer-supporting platform reference mark 25 in the field range of exposure object mark camera 15,16 pairs of wafer-supporting platform reference marks 25 of graphics processing unit are handled at the picture of exposure object mark camera 15, and writing down its center positional information, wafer-supporting platform motion control device 31 writes down the positional information of wafer-supporting platforms 24 this moment simultaneously.
The alignment actions of exposure object mark 27,28 and exposure object mark camera 15
Wafer-supporting platform motion control device 31 moves wafer-supporting platform 24 to the precalculated position, make exposure object mark 27 in the field range of exposure object mark camera 15, the picture of 16 pairs of exposure object marks 27 of graphics processing unit is handled, and write down its center positional information, write down the positional information of wafer-supporting platforms 24 this moment simultaneously by wafer-supporting platform motion control device 31.
Wafer-supporting platform motion control device 31 moves wafer-supporting platform 24 to the precalculated position, make exposure object mark 28 in the field range of exposure object mark camera 15, the picture of 16 pairs of exposure object marks 28 of graphics processing unit is handled, and write down its center positional information, write down the positional information of wafer-supporting platforms 24 this moment simultaneously by wafer-supporting platform motion control device 31.
Pass through said process, the positional information of center on exposure object mark camera 15 according to exposure object mark 27,28 pictures that write down, and the positional information of corresponding wafer-supporting platform, by a series of coordinate transforms and related algorithm, in overhead control device 29, finish exposure object amount of movement (the Δ X required to punctual wafer-supporting platform 24, Δ Y, Δ θ), and with this result send to wafer-supporting platform motion control device 31 to finish aiming at of exposure object mark 27,28 and wafer-supporting platform reference mark 25.
In the said process, according to the requirement of position alignment precision, the quantity of exposure object mark is optional a plurality of.
After above-mentioned a series of alignment actions, set up the accurate relative position relation between mask and the exposure object.
That more than introduces only is based on several preferred embodiment of the present invention, can not limit scope of the present invention with this.Any device of the present invention is done replacement, the combination, discrete of parts well know in the art, and the invention process step is done well know in the art being equal to change or replace and all do not exceed exposure of the present invention and protection domain.
Claims (8)
1, a kind of automatic alignment device, it is characterized in that it has a lighting source, this lighting source imports to the mark lighting unit by lighting fiber with the emergent light of lighting source, and this mark lighting unit projects light the mark that is used to aim at that will throw light on equably; Mark image-generating unit will be marked as picture and project on the mark camera target surface, and this mark camera receives the picture of mark, send the site error that calculates to motion control device after graphics processing unit is handled.
2, automatic alignment device as claimed in claim 1, the sensor that it is characterized in that described mark camera is CCD.
3, automatic alignment device as claimed in claim 1, the sensor that it is characterized in that described mark camera is CMOS.
4, automatic alignment device as claimed in claim 1, the light that it is characterized in that described mark lighting unit converges on the Amici prism by one first lens combination, and reflex to after second lens combination evenly disperses by this Amici prism, again through mirror reflects to mark.
5, automatic alignment device as claimed in claim 1, it is characterized in that described mark image-generating unit is by catoptron, second lens combination, and the Amici prism composition, pass Amici prism after picture to the second lens combination of mirror reflects mark converges and project on the mark camera target surface.
6, automatic alignment device as claimed in claim 1 is characterized in that the shared same set of optical system of described mark illuminator and mark imaging system forms coaxial-illuminating.
7, automatic alignment device as claimed in claim 1 is characterized in that described automatic alignment device has two covers, and a cover is used to set up the relative position relation between mask mark and the wafer-supporting platform reference mark; The another set of relative position relation that is used to set up between exposure object mark and the wafer-supporting platform reference mark.
8, automatic alignment device as claimed in claim 7, it is characterized in that a plurality of described automatic alignment devices can form one the cover Automatic Alignment System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610023154 CN1794096A (en) | 2006-01-06 | 2006-01-06 | Automatic aligning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610023154 CN1794096A (en) | 2006-01-06 | 2006-01-06 | Automatic aligning device |
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| CN1794096A true CN1794096A (en) | 2006-06-28 |
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| CN 200610023154 Pending CN1794096A (en) | 2006-01-06 | 2006-01-06 | Automatic aligning device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303533B (en) * | 2008-06-24 | 2010-06-02 | 上海微电子装备有限公司 | Aligning system, aligning method for photolithography equipment and enhancement type aligning mark |
| CN101329515B (en) * | 2008-07-29 | 2010-06-09 | 上海微电子装备有限公司 | Device and method for measuring and checking step photoetching machine aligning system |
| CN102722087A (en) * | 2012-06-01 | 2012-10-10 | 中山新诺科技有限公司 | Novel vision system for photoetching equipment |
| CN102842529A (en) * | 2007-10-24 | 2012-12-26 | 应用材料意大利有限公司 | Alignment device and method to align plates for electronic circuits |
| CN105990204A (en) * | 2015-02-15 | 2016-10-05 | 盛美半导体设备（上海）有限公司 | Dual-axis alignment apparatus and method in semiconductor device |
| WO2017186170A1 (en) * | 2016-04-29 | 2017-11-02 | 上海微电子装备（集团）股份有限公司 | Dual-layer alignment device and method |
| CN107331643A (en) * | 2016-04-29 | 2017-11-07 | 上海微电子装备（集团）股份有限公司 | Alignment device and its method |
| WO2019076160A1 (en) * | 2017-10-17 | 2019-04-25 | 歌尔股份有限公司 | Optical module assembly device and method |
| WO2019076159A1 (en) * | 2017-10-17 | 2019-04-25 | 歌尔股份有限公司 | Optical module assembly device and method |
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2006
- 2006-01-06 CN CN 200610023154 patent/CN1794096A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842529A (en) * | 2007-10-24 | 2012-12-26 | 应用材料意大利有限公司 | Alignment device and method to align plates for electronic circuits |
| CN102842529B (en) * | 2007-10-24 | 2015-07-08 | 应用材料意大利有限公司 | Alignment device and method to align plates for electronic circuits |
| CN101303533B (en) * | 2008-06-24 | 2010-06-02 | 上海微电子装备有限公司 | Aligning system, aligning method for photolithography equipment and enhancement type aligning mark |
| CN101329515B (en) * | 2008-07-29 | 2010-06-09 | 上海微电子装备有限公司 | Device and method for measuring and checking step photoetching machine aligning system |
| CN102722087A (en) * | 2012-06-01 | 2012-10-10 | 中山新诺科技有限公司 | Novel vision system for photoetching equipment |
| CN102722087B (en) * | 2012-06-01 | 2014-12-03 | 中山新诺科技股份有限公司 | Novel vision system for photoetching equipment |
| CN105990204A (en) * | 2015-02-15 | 2016-10-05 | 盛美半导体设备（上海）有限公司 | Dual-axis alignment apparatus and method in semiconductor device |
| CN105990204B (en) * | 2015-02-15 | 2020-03-27 | 盛美半导体设备(上海)股份有限公司 | Biaxial alignment apparatus and method in semiconductor device |
| CN107329379A (en) * | 2016-04-29 | 2017-11-07 | 上海微电子装备（集团）股份有限公司 | Double-deck alignment device and double-deck alignment methods |
| CN107331643A (en) * | 2016-04-29 | 2017-11-07 | 上海微电子装备（集团）股份有限公司 | Alignment device and its method |
| CN107329379B (en) * | 2016-04-29 | 2019-01-18 | 上海微电子装备（集团）股份有限公司 | The double-deck alignment device and the double-deck alignment methods |
| JP2019515273A (en) * | 2016-04-29 | 2019-06-06 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Dual layer alignment device and method |
| US10578986B2 (en) | 2016-04-29 | 2020-03-03 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Dual-layer alignment device and method |
| WO2017186170A1 (en) * | 2016-04-29 | 2017-11-02 | 上海微电子装备（集团）股份有限公司 | Dual-layer alignment device and method |
| WO2019076160A1 (en) * | 2017-10-17 | 2019-04-25 | 歌尔股份有限公司 | Optical module assembly device and method |
| WO2019076159A1 (en) * | 2017-10-17 | 2019-04-25 | 歌尔股份有限公司 | Optical module assembly device and method |
| US11253962B2 (en) | 2017-10-17 | 2022-02-22 | Goertek Inc. | Apparatus and method for assembling optical module |
| US11899221B2 (en) | 2017-10-17 | 2024-02-13 | Goer Optical Technology Co., Ltd. | Apparatus and method for assembling optical module |
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