SG11201802991UA - Component handling system - Google Patents

Component handling system

Info

Publication number
SG11201802991UA
SG11201802991UA SG11201802991UA SG11201802991UA SG11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA
Authority
SG
Singapore
Prior art keywords
handling system
component handling
component
handling
Prior art date
Application number
SG11201802991UA
Inventor
Henri Junker
Markus Ferstl
Original Assignee
Muehlbauer Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer Gmbh & Co Kg filed Critical Muehlbauer Gmbh & Co Kg
Publication of SG11201802991UA publication Critical patent/SG11201802991UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H01L2224/75651—Belt conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H01L2224/75823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
SG11201802991UA 2015-10-16 2016-09-22 Component handling system SG11201802991UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015013494.9A DE102015013494B3 (en) 2015-10-16 2015-10-16 Component handling device and method for removing components from a structured component supply and for depositing at a receiving device
PCT/EP2016/072481 WO2017063837A1 (en) 2015-10-16 2016-09-22 Component handling system

Publications (1)

Publication Number Publication Date
SG11201802991UA true SG11201802991UA (en) 2018-05-30

Family

ID=57047184

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802991UA SG11201802991UA (en) 2015-10-16 2016-09-22 Component handling system

Country Status (11)

Country Link
US (2) US10804123B2 (en)
EP (2) EP3576138A1 (en)
JP (2) JP6557413B2 (en)
KR (2) KR102109877B1 (en)
CN (2) CN110459489B (en)
DE (1) DE102015013494B3 (en)
MY (1) MY194251A (en)
PH (1) PH12018500797A1 (en)
SG (1) SG11201802991UA (en)
TW (1) TWI698946B (en)
WO (1) WO2017063837A1 (en)

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CN112351672A (en) * 2020-10-29 2021-02-09 顺德职业技术学院 Roller type plugging device for electric element
CN113137917B (en) * 2021-04-13 2023-01-13 重庆市和鑫达电子有限公司 PCB hole position detection device
DE102021111953A1 (en) * 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optical component inspection
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JP2024016319A (en) * 2022-07-26 2024-02-07 ファスフォードテクノロジ株式会社 Mounting equipment and semiconductor device manufacturing method

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Also Published As

Publication number Publication date
CN108292615B (en) 2022-03-11
CN110459489A (en) 2019-11-15
CN110459489B (en) 2023-04-11
KR20190073613A (en) 2019-06-26
KR102046031B1 (en) 2019-11-18
KR20180071318A (en) 2018-06-27
US10804123B2 (en) 2020-10-13
WO2017063837A1 (en) 2017-04-20
US11232961B2 (en) 2022-01-25
TWI698946B (en) 2020-07-11
JP2019194130A (en) 2019-11-07
JP6880114B2 (en) 2021-06-02
CN108292615A (en) 2018-07-17
EP3363043B1 (en) 2020-01-01
EP3363043A1 (en) 2018-08-22
KR102109877B1 (en) 2020-05-12
PH12018500797A1 (en) 2018-10-29
DE102015013494B3 (en) 2017-04-06
JP2019505453A (en) 2019-02-28
EP3576138A1 (en) 2019-12-04
US20180308727A1 (en) 2018-10-25
US20200035521A1 (en) 2020-01-30
JP6557413B2 (en) 2019-08-07
MY194251A (en) 2022-11-24
TW201724319A (en) 2017-07-01

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