SG11201702959YA - Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles - Google Patents
Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articlesInfo
- Publication number
- SG11201702959YA SG11201702959YA SG11201702959YA SG11201702959YA SG11201702959YA SG 11201702959Y A SG11201702959Y A SG 11201702959YA SG 11201702959Y A SG11201702959Y A SG 11201702959YA SG 11201702959Y A SG11201702959Y A SG 11201702959YA SG 11201702959Y A SG11201702959Y A SG 11201702959YA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing articles
- methods
- chemical mechanical
- integrated system
- manufacturing chemical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/007—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/736—Grinding or polishing equipment
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462065533P | 2014-10-17 | 2014-10-17 | |
PCT/US2015/053465 WO2016060857A1 (en) | 2014-10-17 | 2015-10-01 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201702959YA true SG11201702959YA (en) | 2017-05-30 |
Family
ID=55747131
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202110980SA SG10202110980SA (en) | 2014-10-17 | 2015-10-01 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
SG11201702959YA SG11201702959YA (en) | 2014-10-17 | 2015-10-01 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202110980SA SG10202110980SA (en) | 2014-10-17 | 2015-10-01 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Country Status (8)
Country | Link |
---|---|
US (3) | US9776361B2 (en) |
EP (2) | EP3207559B1 (en) |
JP (1) | JP6760930B2 (en) |
KR (3) | KR102351409B1 (en) |
CN (2) | CN107073679B (en) |
SG (2) | SG10202110980SA (en) |
TW (3) | TWI671162B (en) |
WO (1) | WO2016060857A1 (en) |
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US9776361B2 (en) * | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
JP6940495B2 (en) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Equipment and methods for forming abrasive articles with the desired zeta potential |
CN106853610B (en) * | 2015-12-08 | 2019-11-01 | 中芯国际集成电路制造(北京)有限公司 | Polishing pad and its monitoring method and monitoring system |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
WO2017139766A1 (en) * | 2016-02-12 | 2017-08-17 | Impossible Objects, LLC | Method and apparatus for automated composite-based additive manufacturing |
TWM573509U (en) * | 2017-01-20 | 2019-01-21 | 美商應用材料股份有限公司 | Thin plastic polishing tools and support elements for CMP applications |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
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CN112654655A (en) | 2018-09-04 | 2021-04-13 | 应用材料公司 | Advanced polishing pad formulations |
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CN109999687A (en) * | 2019-04-29 | 2019-07-12 | 宝盈联华(厦门)生物科技有限公司 | It is a kind of addition Lei mountain flour except stinkstone dedicated high performance produce tooling |
JP2022545469A (en) | 2019-08-21 | 2022-10-27 | アプライド マテリアルズ インコーポレイテッド | Additive Manufacturing of Polishing Pads |
KR102293781B1 (en) * | 2019-11-11 | 2021-08-25 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof, and preparation method of semiconductor device using same |
TWI734309B (en) * | 2019-12-19 | 2021-07-21 | 水星生醫股份有限公司 | Permeable spraying device for making tablets |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
CN115151380A (en) * | 2020-02-25 | 2022-10-04 | 3M创新有限公司 | Bonded abrasive article and method of manufacture |
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-
2015
- 2015-09-23 US US14/863,409 patent/US9776361B2/en active Active
- 2015-10-01 CN CN201580056366.3A patent/CN107073679B/en active Active
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- 2015-10-01 EP EP15850855.6A patent/EP3207559B1/en active Active
- 2015-10-01 WO PCT/US2015/053465 patent/WO2016060857A1/en active Application Filing
- 2015-10-01 EP EP23182827.8A patent/EP4276885A1/en active Pending
- 2015-10-01 KR KR1020177013107A patent/KR102351409B1/en active IP Right Grant
- 2015-10-01 CN CN201910517080.0A patent/CN110238752B/en active Active
- 2015-10-01 KR KR1020227035681A patent/KR102598725B1/en active IP Right Grant
- 2015-10-01 KR KR1020227000942A patent/KR102456039B1/en active IP Right Grant
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- 2015-10-01 JP JP2017520353A patent/JP6760930B2/en active Active
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KR102351409B1 (en) | 2022-01-17 |
KR102456039B1 (en) | 2022-10-19 |
TW201945129A (en) | 2019-12-01 |
JP6760930B2 (en) | 2020-09-23 |
US9776361B2 (en) | 2017-10-03 |
TWI671162B (en) | 2019-09-11 |
EP4276885A1 (en) | 2023-11-15 |
CN110238752B (en) | 2021-12-10 |
SG10202110980SA (en) | 2021-11-29 |
US20180043613A1 (en) | 2018-02-15 |
EP3207559A1 (en) | 2017-08-23 |
KR20170072261A (en) | 2017-06-26 |
US20160107381A1 (en) | 2016-04-21 |
EP3207559B1 (en) | 2023-07-12 |
CN107073679A (en) | 2017-08-18 |
TW202208113A (en) | 2022-03-01 |
EP3207559A4 (en) | 2018-06-13 |
US20200101657A1 (en) | 2020-04-02 |
CN107073679B (en) | 2019-06-28 |
TWI788070B (en) | 2022-12-21 |
TW201622894A (en) | 2016-07-01 |
KR102598725B1 (en) | 2023-11-07 |
CN110238752A (en) | 2019-09-17 |
KR20220011210A (en) | 2022-01-27 |
JP2017533105A (en) | 2017-11-09 |
TWI748222B (en) | 2021-12-01 |
US10493691B2 (en) | 2019-12-03 |
KR20220142548A (en) | 2022-10-21 |
WO2016060857A1 (en) | 2016-04-21 |
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