SG11201607890SA - Imprint apparatus and article manufacturing method - Google Patents

Imprint apparatus and article manufacturing method

Info

Publication number
SG11201607890SA
SG11201607890SA SG11201607890SA SG11201607890SA SG11201607890SA SG 11201607890S A SG11201607890S A SG 11201607890SA SG 11201607890S A SG11201607890S A SG 11201607890SA SG 11201607890S A SG11201607890S A SG 11201607890SA SG 11201607890S A SG11201607890S A SG 11201607890SA
Authority
SG
Singapore
Prior art keywords
imprint apparatus
article manufacturing
article
manufacturing
imprint
Prior art date
Application number
SG11201607890SA
Inventor
Byung-Jin Choi
Anshuman Cherala
Zhengmao Ye
Xiaoming Lu
Kang Luo
Nobuto Kawahara
Yoshikazu Miyajima
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG11201607890SA publication Critical patent/SG11201607890SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3205—Particular pressure exerting means for making definite articles
    • B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3652—Elastic moulds or mould parts, e.g. cores or inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5866—Measuring, controlling or regulating ejection of moulded articles
SG11201607890SA 2014-04-09 2015-04-07 Imprint apparatus and article manufacturing method SG11201607890SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014079980A JP6333031B2 (en) 2014-04-09 2014-04-09 Imprint apparatus and article manufacturing method
PCT/JP2015/001970 WO2015155988A1 (en) 2014-04-09 2015-04-07 Imprint apparatus and article manufacturing method

Publications (1)

Publication Number Publication Date
SG11201607890SA true SG11201607890SA (en) 2016-10-28

Family

ID=54287573

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607890SA SG11201607890SA (en) 2014-04-09 2015-04-07 Imprint apparatus and article manufacturing method

Country Status (6)

Country Link
US (1) US10335984B2 (en)
JP (1) JP6333031B2 (en)
KR (1) KR101901041B1 (en)
CN (1) CN106165064A (en)
SG (1) SG11201607890SA (en)
WO (1) WO2015155988A1 (en)

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* Cited by examiner, † Cited by third party
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JP6774178B2 (en) * 2015-11-16 2020-10-21 キヤノン株式会社 Equipment for processing substrates and manufacturing methods for articles
US11104057B2 (en) 2015-12-11 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus and method of imprinting a partial field
US10654216B2 (en) * 2016-03-30 2020-05-19 Canon Kabushiki Kaisha System and methods for nanoimprint lithography
JP6762853B2 (en) 2016-11-11 2020-09-30 キヤノン株式会社 Equipment, methods, and article manufacturing methods
KR102434811B1 (en) * 2018-02-20 2022-08-22 어플라이드 머티어리얼스, 인코포레이티드 Patterned vacuum chuck for double-sided processing
JP7132739B2 (en) * 2018-04-06 2022-09-07 キヤノン株式会社 Imprinting apparatus, imprinting method and article manufacturing method
JP7033994B2 (en) * 2018-04-11 2022-03-11 キヤノン株式会社 Molding equipment and manufacturing method of articles
JP7218114B2 (en) * 2018-07-12 2023-02-06 キヤノン株式会社 Flattening apparatus, flattening method and article manufacturing method
JP7204457B2 (en) 2018-12-06 2023-01-16 キヤノン株式会社 IMPRINT APPARATUS, IMPRINT METHOD, AND PRODUCT MANUFACTURING METHOD

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JPH0851143A (en) * 1992-07-20 1996-02-20 Nikon Corp Board holding apparatus
JP3332425B2 (en) * 1992-11-10 2002-10-07 キヤノン株式会社 Substrate holding apparatus, exposure apparatus and semiconductor device manufacturing method using the same
JP4490539B2 (en) * 2000-02-15 2010-06-30 東京エレクトロン株式会社 Wafer chuck and semiconductor wafer inspection method
US6746318B2 (en) * 2001-10-11 2004-06-08 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
EP2099066B1 (en) * 2002-11-13 2012-01-04 Molecular Imprints, Inc. Method for modulating shapes of substrates
SG116533A1 (en) * 2003-03-26 2005-11-28 Toshiba Kk Semiconductor manufacturing apparatus and method of manufacturing semiconductor device.
JP3956135B2 (en) * 2003-03-28 2007-08-08 ブラザー工業株式会社 Image forming apparatus and suction type paper tray used therefor
JP2005024807A (en) * 2003-07-01 2005-01-27 Hitachi Ltd Projection type video display device
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
KR101254042B1 (en) * 2005-01-31 2013-04-12 몰레큘러 임프린츠 인코퍼레이티드 Method for separating a mold from a solidified layer disposed on a substrate
WO2007126767A2 (en) * 2006-04-03 2007-11-08 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
DE102006042026B4 (en) * 2006-09-07 2016-08-04 Infineon Technologies Ag Device for holding a substrate and method for treating a substrate
NL2003380A (en) * 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
JP2010269580A (en) * 2009-05-25 2010-12-02 Canon Inc Imprint apparatus and manufacturing method for article
JP5810517B2 (en) * 2010-12-02 2015-11-11 富士電機株式会社 Adsorption device and adsorption method
JP5875250B2 (en) * 2011-04-28 2016-03-02 キヤノン株式会社 Imprint apparatus, imprint method, and device manufacturing method
SG185838A1 (en) * 2011-05-12 2012-12-28 Semiconductor Technologies And Instr Pte Ltd A component pane handler configured to handle component panes of multiple sizes
KR102350216B1 (en) * 2011-08-12 2022-01-11 에베 그룹 에. 탈너 게엠베하 Apparatus and method for bonding substrates
JP5893303B2 (en) * 2011-09-07 2016-03-23 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same
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CN102866582B (en) * 2012-09-29 2014-09-10 兰红波 Nanometer impression device and nanometer impression method for high-brightness light-emitting diode (LED) graphics
JP5521066B1 (en) * 2013-01-25 2014-06-11 東京エレクトロン株式会社 Joining apparatus and joining system
JP6306830B2 (en) * 2013-06-26 2018-04-04 キヤノン株式会社 Imprint apparatus and article manufacturing method
KR102294035B1 (en) * 2013-11-08 2021-08-27 캐논 나노테크놀로지즈 인코퍼레이티드 Low contact imprint lithography template chuck system for improved overlay correction
KR20160113724A (en) * 2014-02-07 2016-09-30 어플라이드 머티어리얼스, 인코포레이티드 Chucking capability for bowed wafers on dsa

Also Published As

Publication number Publication date
JP2015201556A (en) 2015-11-12
WO2015155988A1 (en) 2015-10-15
US10335984B2 (en) 2019-07-02
JP6333031B2 (en) 2018-05-30
CN106165064A (en) 2016-11-23
US20170028598A1 (en) 2017-02-02
KR101901041B1 (en) 2018-09-20
KR20160130802A (en) 2016-11-14

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