KR960039113A - How to form an alignment mark - Google Patents

How to form an alignment mark Download PDF

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Publication number
KR960039113A
KR960039113A KR1019950009550A KR19950009550A KR960039113A KR 960039113 A KR960039113 A KR 960039113A KR 1019950009550 A KR1019950009550 A KR 1019950009550A KR 19950009550 A KR19950009550 A KR 19950009550A KR 960039113 A KR960039113 A KR 960039113A
Authority
KR
South Korea
Prior art keywords
alignment mark
forming
groove
mask
box
Prior art date
Application number
KR1019950009550A
Other languages
Korean (ko)
Inventor
김윤장
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950009550A priority Critical patent/KR960039113A/en
Publication of KR960039113A publication Critical patent/KR960039113A/en

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

본 발명은 정렬마크 형성방법에 관한 것으로, 반도체기판 상부에 제1정렬마크마스크를 이용한 식각공정으로 일정깊이 홈을 형성하고 전체표면상부에 초기산화막을 일정두께 형성한 다음, 제2정렬마크마스크를 이용한 식각공정으로 상기 홈의 저부에 감광막패턴을 형성함으로써 박스인 박스 형태의 정렬마스크를 형성하여 반도체소자의 신뢰성 및 수율을 향상시킬 수 있는 기술이다.The present invention relates to a method of forming an alignment mark, wherein a groove having a predetermined depth is formed in an etching process using a first alignment mark mask on an upper surface of a semiconductor substrate, and an initial oxide film is formed on the entire surface, and then a second alignment mark mask is formed. By forming a photoresist pattern on the bottom of the groove by the etching process, a box-type alignment mask is formed to improve reliability and yield of the semiconductor device.

Description

정렬마크 형성방법How to form an alignment mark

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2A도 내지 제2E도는 본 발명의 실시예에 따른 정렬마크 형성방법을 도시한 관계도.2A to 2E are relationship diagrams showing a method for forming an alignment mark according to an embodiment of the present invention.

Claims (4)

반도체기판에 웰을 형성하기위한 박스 인 박스 형태의 정렬마크 형성방법에 있어서, 제1정렬마크마스크를 이용하여 상기 반도체기판의 예정된 부분에 일정깊이의 홈을 형성하는 공정과, 전체표면상부에 초기산화막을 일정두께 형성하는 공정과, 제2정렬마크마스크를 이용하여 상기 홈의 저부에 감광막패턴을 형성하는 공정을 포함하는 정렬마크 형성방법.A method for forming a box-in-box alignment mark for forming a well in a semiconductor substrate, the method comprising: forming a groove having a predetermined depth in a predetermined portion of the semiconductor substrate using a first alignment mark mask; And forming a photoresist pattern on the bottom of the groove by using a second alignment mark mask. 제1항에 있어서, 상기 예정된 부분은 스크라이브 라인인 것을 특징으로 하는 정렬마크 형성방법.The method of claim 1, wherein the predetermined portion is a scribe line. 제1항에 있어서, 상기 일정깊이는 1300 내지 1700Å인 것을 특징으로 하는 정렬마크 형성방법.The method of claim 1, wherein the predetermined depth is 1300 to 1700Å. 제1항에 있어서, 상기 초기산화막은 250 내지 350Å 두께로 형성되는 것을 특징으로 하는 정렬마크 형성 방법.The method of claim 1, wherein the initial oxide film is formed to a thickness of 250 to 350Å. ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019950009550A 1995-04-22 1995-04-22 How to form an alignment mark KR960039113A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950009550A KR960039113A (en) 1995-04-22 1995-04-22 How to form an alignment mark

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950009550A KR960039113A (en) 1995-04-22 1995-04-22 How to form an alignment mark

Publications (1)

Publication Number Publication Date
KR960039113A true KR960039113A (en) 1996-11-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950009550A KR960039113A (en) 1995-04-22 1995-04-22 How to form an alignment mark

Country Status (1)

Country Link
KR (1) KR960039113A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395908B1 (en) * 2001-06-29 2003-08-27 주식회사 하이닉스반도체 Method for manufacturing an alignment key of semiconductor device
KR100815763B1 (en) * 2006-10-13 2008-03-20 삼성에스디아이 주식회사 Mask frame and method for aligning of mask frame and mask

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395908B1 (en) * 2001-06-29 2003-08-27 주식회사 하이닉스반도체 Method for manufacturing an alignment key of semiconductor device
KR100815763B1 (en) * 2006-10-13 2008-03-20 삼성에스디아이 주식회사 Mask frame and method for aligning of mask frame and mask

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