KR20210000498A - Cooling device - Google Patents

Abstract

The present invention provides a cooling device, which includes an evaporation unit in which the working fluid is vaporized by a heat source and a condensation unit in which the vaporized working fluid is condensed. The evaporation unit is divided into a first moving space and a second moving space through a partition wall, a first moving passage connecting the first moving space and the second moving space is formed in one area of the partition wall, and the working fluid moving in the condensation unit is introduced into the first moving space through at least two or more inlets, so that the heat is exchanged by moving to the second moving space through the first moving passage.

Description

Cooling device {Cooling device}

The embodiment relates to a cooling device. More specifically, it relates to a cooling device for cooling local heat generation such as sensors and controllers used in mechanical devices.

In recent years, as part of countermeasures against environmental problems, the development of hybrid vehicles, fuel cell vehicles, and electric vehicles using the driving power of a motor is receiving more and more attention.

Vehicles as described above are generally equipped with electronic devices for HSG control and electronic devices for motor control. Since these electronic devices are heated when power is supplied for driving, they must be separately cooled. I need a means.

As a related technology, Japanese Patent Application Laid-Open No. 2001-245478 (published on September 7, 2001, name: inverter cooling device) discloses an inverter in which a semiconductor module including semiconductor elements such as IGBT and a diode is used. Publication No. 2008-294283 (published on December 4, 2008, name: semiconductor device) discloses a heat sink that is installed to contact the lower side of a semiconductor element and formed to heat exchange while a fluid flows therein.

Referring to FIG. 1, in order to cool each electronic device (e) provided in an engine room of a vehicle, a refrigerant is transferred through a pipe line (l), and then the refrigerant and the electronic device (e) are heat-exchanged.

However, such a conventional electronic device cooling method includes a pipe line (l) for transferring the refrigerant to each electronic device (e), and a pump (p) that generates power for the refrigerant to move along the pipe line (l). Since it is necessary, not only complicates the structure of the engine room, but also requires additional power to drive the pump.

In addition, as autonomous driving has recently been in the spotlight, additional heat from sensors and electronic devices on the image processing device has been generated. In the case of adopting the above method as a cooling method for this heat, not only the piping line will be longer, but the internal spatial situation may be worse, and the heat pipe that is mass-produced as a cooling method for electronic devices in PCs In the case of applying, there is a problem that is not suitable for a vehicle that must have durability, because the corrosion problem of the material may be raised.

Accordingly, there is a need for a new cooling device capable of solving the disadvantages of such a conventional cooling device.

(Patent Document 1) Patent Document 1) Korean Patent Publication No. 2017-0079177 (Name: Heat Exchanger for Cooling Electronic Devices, Publication Date: July 10, 2017)

An object of the embodiment is to provide a cooling device using a refrigerant cooling method that is directly attached to a member generating heat and circulates without a pump.

In addition, it is intended to increase the heat absorption effect by separating the configuration of the evaporation unit into a multilayer structure.

In addition, by eliminating the directionality of the condenser piping, it is an object to secure robustness against inclination.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems that are not mentioned herein will be clearly understood by those skilled in the art from the following description.

An embodiment of the present invention, an evaporation unit in which the working fluid is vaporized by a heat source; And a condensing unit in which the vaporized working fluid is condensed, wherein the evaporation unit is divided into a first moving space and a second moving space through a partition wall, and the first moving space and the first moving space are in one area of the partition wall. 2 A first moving passage connecting the moving space is formed, and the working fluid moving in the condensing unit is introduced into the first moving space through at least two inlets, and the second moving space is passed through the first moving passage. It provides a cooling device, characterized in that the heat exchange by moving to.

Preferably, a pair of first recessed spaces to which the inlet is connected are spaced apart from each other on the upper part of the first moving space.

Preferably, it may be characterized in that a plurality of guide portions are disposed below the first recessed space.

Preferably, the guide portion may be characterized in that the width becomes wider toward the first moving passage from the top.

Preferably, the condensing part is partitioned inside through a pair of baffles, the working fluid moving the second moving space moves to the first area, and the working fluid moved from the top to both sides is the first area It may be characterized in that it moves to the second area on both sides of and flows into the evaporation unit.

Preferably, a plurality of projections may be arranged in the second moving space.

Preferably, a third moving space connected to the outlet may be disposed above the second moving space.

Preferably, the third moving space is formed on the same surface as the surface on which the first moving space is formed, and the third moving space and the second moving space are connected through a second moving passage. I can.

Preferably, the upper portion of the second movement passage may be characterized in that it has an inclined surface or a curved surface.

Preferably, the third moving space may be disposed below the first area.

Preferably, the upper surface forming the second movement space may have an inclined surface or a curved surface so that the working fluid moves to the third movement space.

Preferably, the connecting pipe connecting the condensing part and the evaporating part may be arranged in a vertical direction.

In addition, the present invention is an evaporation unit in which the working fluid is vaporized by a heat source; And a condensing unit in which the vaporized working fluid is condensed and disposed above the evaporation unit, wherein the evaporation unit receives the working fluid from the condensation unit through two connection pipes, and is disposed between the connection pipes. It may be implemented as a cooling device, characterized in that transmitting the working fluid to the condensing unit through another connecting pipe.

Preferably, based on the evaporation unit, two connecting pipes for receiving the working fluid are disposed on both sides of the evaporation unit and the condensing unit in the horizontal direction, and the other connection pipe is the center of the evaporation unit and the condensing unit It may be characterized in that it is placed in.

In addition, the present invention is an evaporation unit in which the working fluid is vaporized by a heat source; And a condensing unit in which the vaporized working fluid is condensed and disposed in a vertical direction in the evaporation unit, wherein the working fluid circulating the evaporation unit and the condensation unit is two flow paths for flowing the working fluid in a horizontal direction. Including, but the two flow paths may be implemented as a cooling device, characterized in that in different directions.

Preferably, a first passage of the two passages may flow the working fluid in a clockwise direction, and a second passage may flow the working fluid in a counterclockwise direction.

According to the embodiment, it is attached to one side of the electronic device to increase the cooling efficiency of the electronic device.

In addition, there is an effect of preventing dry-out due to insufficient working fluid.

In addition, there is an effect of increasing cooling efficiency by transferring excess heat to other layers through conduction without being cooled due to the boiling effect of the heat transfer surface.

In addition, since it passes through the front surface before flowing into the heat transfer surface (rear surface), not only can the working fluid flow uniformly, but also the degree of subcooling of the working fluid can be reduced by heat transfer through conduction, thereby increasing the cooling effect.

In addition, by providing a space through which gas can escape, there is an effect of preventing performance degradation due to accumulation of air bubbles in the heat transfer area.

In addition, it is possible to increase the heat exchange effect through equal distribution of the working fluid by using the flow guide.

In addition, since piping for a separate gas passage can be omitted, cost can be reduced.

In addition, it is possible to improve the degree of freedom against inclination by omitting a section parallel to the evaporation part in the pipe in the horizontal direction.

Various and beneficial advantages and effects of the present invention are not limited to the above-described contents, and may be more easily understood in the course of describing specific embodiments of the present invention.

1 is a view showing a structure for cooling each electronic device provided in the engine room of a conventional vehicle,
2 is a structural diagram of a cooling device according to an embodiment of the present invention,
3 is an exploded perspective view as viewed from the rear of the evaporation unit, which is a component of FIG. 2,
FIG. 4 is a view as viewed from the rear of the main body part of FIG. 3,
5 is an exploded perspective view as viewed from the front of the evaporation unit, which is a component of FIG. 2,
6 is a view as viewed from the front of the main body, which is a component of FIG. 5,
7 is a view as viewed from the front of the cooling flow of the working fluid in the evaporation unit, which is a component of FIG. 2,
8 is a view as viewed from the rear of the cooling flow of the automatic fluid in the evaporation unit, which is a component of FIG. 2.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements may be selectively selected between the embodiments. It can be combined with and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are generally understood by those of ordinary skill in the art, unless explicitly defined and described. It can be interpreted as a meaning, and terms generally used, such as terms defined in a dictionary, may be interpreted in consideration of the meaning in the context of the related technology.

In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, the singular form may include the plural form unless specifically stated in the phrase, and when described as “at least one (or more than one) of A and (and) B and C”, it is combined with A, B, and C. It may contain one or more of all possible combinations.

In addition, terms such as first, second, A, B, (a), and (b) may be used in describing the constituent elements of the embodiment of the present invention.

These terms are only for distinguishing the component from other components, and are not limited to the nature, order, or order of the component by the term.

And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also the component and It may also include the case of being'connected','coupled' or'connected' due to another component between the other components.

In addition, when it is described as being formed or disposed on the “top (top) or bottom (bottom)” of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes a case in which the above other component is formed or disposed between the two components. In addition, when expressed as "upper (upper) or lower (lower)", it may include not only an upward direction but also a downward direction based on one component.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, but identical or corresponding components are denoted by the same reference numerals regardless of reference numerals, and redundant descriptions thereof will be omitted.

1 to 8, in order to clearly understand the present invention conceptually, only the main characteristic parts are clearly shown, and as a result, various modifications of the illustration are expected, and the scope of the present invention is limited by the specific shape shown in the drawings. It doesn't have to be.

FIG. 2 is a structural diagram of a cooling device according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of an evaporation unit, which is a component of FIG. 2, viewed from the rear, and FIG. 5 is an exploded perspective view of the evaporation unit as a component of FIG. 2 as viewed from the front, and FIG. 6 is a view as viewed from the front of the body part as a component of FIG. 5.

2 to 6, the cooling device according to the embodiment of the present invention includes an evaporation unit 100 in which a working fluid is vaporized by a heat source and a condensation unit 200 in which the vaporized working fluid moves and condenses. I can.

The evaporation unit 100 receives a working fluid from the condensation unit 200, and the working fluid may circulate inside the evaporation unit 100. The evaporation unit 100 may contact electronic devices that generate heat such as semiconductor devices, diodes, transistors, resistors, and capacitors used in electric devices. In general, when the temperature of such an electronic device rises above a certain temperature, there is a problem in that the performance is deteriorated or not operated.

The evaporation unit 100 of the present invention is connected to the electronic device to perform heat exchange to prevent degradation of the electronic device, and the working fluid is boiled and converted into a gaseous state due to heat generated by the electronic device. In one embodiment, the evaporation unit 100 may be provided in a structure in contact with the electronic device.

The evaporation unit 100 may be formed of a metal material to facilitate heat exchange. In one embodiment, the evaporation unit 100 may be made of aluminum, but is not limited thereto, and various materials having high thermal conductivity may be used.

The condensing unit 200 is disposed above the evaporation unit 100 and may cool the working fluid and supply it to the evaporation unit 100. The condensing unit 200 may heat exchange in the evaporation unit 100 to cool the vaporized working fluid and supply it to the evaporation unit 100. The method of cooling the condensing part 200 is not limited, and various methods such as natural cooling or forced cooling may be used.

The evaporation unit 100 receives the condensed working fluid from the condensation unit 200 through two connecting pipes 300, and the working fluid vaporized through another connecting pipe 300 disposed between the connecting pipes 300 Is moved to the condensing unit 200.

In one embodiment, the two connecting pipes 300 receiving the working fluid based on the evaporation unit 100 are disposed on both sides in the horizontal direction of the evaporation unit 100 and the condensation unit 200, and condense the working fluid. Another connection pipe 300 delivered to the unit 200 may be disposed in a horizontal center region of the evaporation unit 100 and the condensation unit 200.

As shown in FIG. 2, the working fluid circulating the evaporation unit 100 and the condensing unit 200 may include two flow paths L1 and L2 for flowing the working fluid in a horizontal direction.

The working fluid raised through the central connection pipe may be branched in different directions from the top of the condensing part 200 to circulate.

At this time, the first flow path L1 may flow the working fluid in a clockwise direction, and the second flow path L2 may flow the working fluid in a counterclockwise direction.

In FIG. 2, the flow path indicated on the evaporation unit 100 represents the overall flow of the working fluid, and detailed flow will be described again below.

The configuration of the evaporation unit 100 will be described with reference to FIGS. 3 to 6.

The evaporation unit 100 has a plurality of layered structures including a first outer wall 110, a second outer wall 150, and a body portion 130 disposed between the first outer wall 110 and the second outer wall 150. It can be provided. The plurality of layered structures is for convenience in manufacturing, and the number of layers or the connection structure is not limited.

The main body 130 may divide a first moving space 136 and a second moving space 132 through which the working fluid can move through the partition wall 131, and a first moving space 132 under the partition wall 131 A first moving passage 133 connecting the moving space 136 and the second moving space 132 may be formed.

The working fluid flowing into the first moving space 136 descends down by gravity, and the lowered working fluid can move to the second moving space 132 through the first moving passage 133. The working fluid moved to the second moving space 132 may be vaporized by heat exchange with an electronic device connected to the second outer wall 150 to move to the condenser.

The first moving passage 133 provided in an elongated shape allows the working fluid supplied through the inlet 111 to be supplied to the entire second moving space 132. When the working fluid is heated in the second moving space 132, the first moving passage 133 may increase cooling efficiency by supplying the working fluid as a whole instead of a biased supply.

The working fluid moving in the condensing part 200 flows into the first moving space 136 through at least two inlets 111, and moves to the second moving space 132 through the first moving passage 133 Heat exchange is possible.

In one embodiment, two inlets 111 may be formed in the first outer wall 110, and a lower portion of the inlet 111 may be connected to the first moving space 136.

A pair of first mixing spaces to which the inlet 111 is connected may be spaced apart from the top of the first moving space 136. The first consolidation space 138 is disposed above the first moving space 136 and may be provided in a shape in which sidewalls are incorporated.

In addition, a plurality of guide portions 137 may be disposed under the first consolidation space 138.

The guide part 137 enables the working fluid flowing in from the plurality of inlets 111 to be uniformly distributed in the first moving space 136.

The plurality of guide units 137 are disposed at regular intervals to prevent the working fluid from being biased to one side when moving, and serve to transfer the invention occurring in the second moving space 132 to the first moving space 136 can do.

In addition, the guide unit 137 disposed in plural may supply the working fluid to the second moving space 132 by maintaining a certain amount of working fluid in the corresponding space even when the cooling device is attached or the posture is inclined, The heat transferred through the protrusion 134 of the second moving space 132 is transferred to the first moving space 136 to increase a heat transfer area, thereby increasing cooling efficiency.

In one embodiment, the guide portion 137 may be disposed so that the width increases from the top toward the first moving passage 133.

The wider the width of the guide portion 137 is, the narrower the gap between the guide portions 137 arranged in plurality. This interval adjustment not only allows the working fluid to circulate virtuously, but also has a large surface tension when the working fluid has a low temperature or a low calorific value, so that the flow of the working fluid in the second moving space 132 is slowed down and the second moving space ( In 132), heat exchange efficiency can be increased.

On the contrary, when the working fluid has a high temperature or a large calorific value, the surface tension decreases, so that the flow increases and the required working fluid can be quickly supplied from the second moving space 132.

The second moving space 132 is a space into which the working fluid that has passed through the first moving space 136 passes through the first transfer passage.

A plurality of protrusions 134 may be disposed on either the partition wall 131 or the second outer wall 150 forming the second moving space 132 to face the second moving space 132.

The protrusion 134 may protrude vertically from the partition wall 131 to make surface contact with the second outer wall 150. This may increase heat transfer efficiency by transferring heat from the electronic device in contact with the second outer wall 150 to the working fluid.

In one embodiment, the protrusion 134 may be provided in the shape of a square maneuver. The square pillar-shaped protrusion 134 has an upper surface in contact with the second outer wall 150 to transfer heat generated from the electronic device to the protrusion 134, and the side wall of the square pillar may transfer heat to the working fluid.

Due to the protrusion 134 having a structure that protrudes perpendicularly to the partition wall 131, a surface tension of the working fluid is generated at that portion, and it is possible to easily stay.

In addition, the vertically formed sidewalls generate bubbles through boiling in a region in contact with the partition wall 131, and bubbles generated in the vertically connected sidewalls are easily separated from the sidewalls.

In addition, the plurality of protrusions 134 may increase the degree of freedom of bubbles to slow dry-out according to gas flow.

In addition, the plurality of protrusions 134 may have different heights. In one embodiment, the plurality of protrusions 134 may have a proportionally lowered height of the protrusions 134 in the direction of the second moving passage 135 from the first moving passage 133, which is It is possible to increase the performance by facilitating the cooling or the flow of larger air bubbles.

The protrusions 134 provided in plurality are arranged at regular intervals to evenly heat the working gas as a whole. Through this, it is possible to prevent unequal heating due to heat transferred from the electronic device.

A third moving space 139 connected to the outlet 113 may be disposed above the second moving space 132. The third moving space 139 provides a space where the vaporized working fluid gathers while walking through the second moving space 132.

In one embodiment, the third moving space 139 may be formed on the same surface as the surface on which the first moving space 136 is formed in the main body 130, and the third moving space 139 and the second moving The space 132 may be connected through the second moving passage 135.

In the cooling device of the present invention, the working fluid absorbs heat through surface contact with the electronic device. To this end, a space for contact with the surface must be secured, and other components for circulating the working fluid must be arranged so as not to interfere with the contact with the surface.

To this end, the third moving space 139 for moving the working fluid to the condensing unit 200 by vaporization may be formed on the same surface as the first moving space 136, and the first outer wall 110 An outlet 113 for connecting to the third moving space 139 may be formed in the.

In addition, although not shown in the drawings, the third moving space 139 may have a structure that penetrates the upper portion of the main body 130 and is directly connected to the condensing part 200.

The upper portion 135a of the second movement passage may have an inclined surface or a curved surface to help the working fluid vaporized in the second movement space 132 move to the third movement space 139.

In addition, the upper surface forming the second movement space 132 may have an inclined surface or a curved surface to facilitate the movement of the working fluid to the third movement space 139.

The condensing unit 200 may be condensed by moving the working fluid vaporized in the evaporation unit 100. The working fluid vaporized in the second moving space 132 moves to the condensing unit 200, and after being cooled in the condensing unit 200, it may move back to the first moving space 136 of the evaporation unit 100.

The condensing part 200 may be partitioned inside through the baffle 210. The condensing part 200 may be partitioned inside through a pair of baffles 210, and may be divided into a first region 220 in the center and second regions 230 disposed on both sides.

The first region 220 is a passage through which the working fluid vaporized in the second moving space 132 rises, and the second region 230 is a passage through which the working fluid is cooled and descends. The upper portions of the first region 220 and the second region 230 are connected, and the working fluid flowing into the first region 220 passes through the upper space and moves to the second region 230 and then the evaporation unit ( 100).

In one embodiment, a third moving space 139 may be disposed under the first region 220.

This can help the rise of the working fluid rising in the third moving space 139, and can minimize the moving distance of the vaporized working fluid.

The condensing part 200 and the evaporation part 100 may be connected using a plurality of connection pipes 300, and the connection pipe 300 may have a vertical arrangement.

In one embodiment, the first area 220 may be connected to the third moving space 139 and the second area 230 through the first moving space 136 and the connection pipe 300. The connection pipe 300 connecting the first region 220 may be connected to the outlet 113 formed in the first outer wall 110, and the connection pipe 300 connecting the second region 230 is a first It may be connected to a pair of inlets 111 formed in the outer wall 110.

The connection pipe 300 having a vertical arrangement may connect the evaporation unit 100 and the condensation unit 200 so as not to have a horizontal section. This is to ensure robustness against tilt by removing the directionality of the working fluid flowing into the condenser.

In one embodiment, when a cooling device is installed in a vehicle with severe inclination in the front-rear direction, the front of the evaporator 100 is installed to face the front of the vehicle to minimize the effect of the inclination of the vehicle on the working fluid. I can.

In addition, in the description of the present invention, the connection pipe 300 is described as a separate structure, but the present invention is not limited thereto, and when there is a structural combination of the condensing part 200 and the evaporation part 100, You can also omit the configuration.

FIG. 7 is a view as viewed from the front of the cooling flow of the working fluid in the evaporation unit 100, which is a component of FIG. 2, and FIG. 8 is a view of the cooling flow of the automatic fluid in the evaporation unit 100, which is a component of FIG. This is the view you looked at.

7 and 8, the working fluid flowing into the first mixing space is evenly distributed in the first moving space 136 through the guide part 137, and the second moving through the first moving passage 133 It moves to the space 132.

Thereafter, the working fluid that has received heat from the electronic device connected to the second outer wall 150 is vaporized and rises, and moves to the condensing unit 200 through the third moving space 139.

As described above, with reference to the accompanying drawings with respect to an embodiment of the present invention was looked at in detail.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention belongs can make various modifications, changes, and substitutions within the scope not departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

100: evaporation unit 110: first outer wall
111: inlet 113: outlet
130: main body 131: partition wall
132: second moving space 133: first moving passage
134: protrusion 135: second moving passage
135a: upper part of the second moving passage 136: first moving space
137: guide part 138: first recessed space
139: third moving space 150: second outer wall
200: condensation unit 210: baffle
220: first area 230: second area
300: connector

Claims (16)

An evaporation unit in which the working fluid is vaporized by a heat source; And
Includes; a condensing unit in which the vaporized working fluid is condensed,
The evaporation unit is divided into a first moving space and a second moving space through a partition wall, and a first moving passage connecting the first moving space and the second moving space is formed in a region of the partition wall,
The working fluid moving from the condensing unit flows into the first moving space through at least two inlets, moves to the second moving space through the first moving passage, and performs heat exchange. The method of claim 1,
A cooling device, characterized in that a pair of first recessed spaces to which the inlets are connected are spaced apart from each other on the upper part of the first moving space. The method of claim 2,
A cooling device, characterized in that a plurality of guide portions are disposed below the first recessed space. The method of claim 3,
The cooling device, characterized in that the width of the guide portion increases from the top toward the first movement passage. The method of claim 1,
The condensing part is partitioned inside through a pair of baffles,
Cooling characterized in that the working fluid moving the second moving space moves to the first area, and the working fluid moved from the top to both sides moves to the second area on both sides of the first area and flows into the evaporation unit. Device. The method of claim 1,
A cooling device, characterized in that a plurality of projections are arranged in the second moving space. The method of claim 5,
A cooling apparatus, characterized in that a third moving space connected to an outlet is disposed above the second moving space. The method of claim 7,
The third moving space is formed on the same surface as the surface on which the first moving space is formed, and the third moving space and the second moving space are connected through a second moving passage. The method of claim 8,
The cooling device, characterized in that the upper portion of the second movement passage has an inclined or curved surface. The method of claim 8,
The cooling device, characterized in that the third moving space is disposed below the first area. The method of claim 7,
The cooling device, characterized in that the upper surface forming the second movement space has an inclined surface or a curved surface so that the working fluid moves to the third movement space. The method of claim 5,
The cooling device, characterized in that the connecting pipe connecting the condensing part and the evaporating part has a vertical arrangement. An evaporation unit in which the working fluid is vaporized by a heat source; And
A condensing unit in which the vaporized working fluid is condensed and disposed above the evaporation unit;
Including,
The evaporating unit receives the working fluid from the condensing unit through two connecting pipes, and delivers the working fluid to the condensing unit through another connecting pipe disposed between the connecting pipes. The method of claim 13,
Based on the evaporation unit, the two connecting pipes receiving the working fluid are disposed on both sides of the evaporation unit and the condensing unit in the horizontal direction, and the other connecting tube is disposed at the center of the evaporation unit and the condensation unit in the horizontal direction. Cooling device characterized by. An evaporation unit in which the working fluid is vaporized by a heat source; And
Containing; a condensing unit disposed in a vertical direction in which the vaporized working fluid is condensed and the evaporation unit,
The working fluid circulating the evaporating part and the condensing part includes two flow paths for flowing the working fluid in a horizontal direction, wherein the two flow paths are in different directions. The method of claim 15,
A cooling apparatus, wherein a first flow path of the two flow paths flows the working fluid in a clockwise direction, and a second flow path flows the working fluid in a counterclockwise direction.

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