KR20140123480A

KR20140123480A - Method of providing an electronic device structure and related electronic device structures

Info

Publication number: KR20140123480A
Application number: KR1020147017870A
Authority: KR
Inventors: 에메트 하워드; 더글라스 이 로이; 니콜라스 무니자
Original assignee: 아리조나 보드 오브 리전트스, 아리조나주의 아리조나 주립대 대행법인
Priority date: 2011-11-29
Filing date: 2012-11-28
Publication date: 2014-10-22
Also published as: CN104041199A; EP2786645A1; WO2013082138A1; JP2014533893A; SG11201402622YA; TW201345726A; EP2786645A4

Abstract

Some embodiments include a method of providing an electronic device structure. Related methods and other embodiments for electronic device structures are also disclosed.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a method of providing an electronic device structure, and related electronic device structures. BACKGROUND OF THE INVENTION < RTI ID = 0.0 >

[Related Application]

Statement of federally sponsored research or development

The present invention was made with government support under W911NF-04-2-0005 awarded by the Army Research Office. The government has certain rights in the invention.

Cross reference to related applications

This application claims the benefit of U.S. Provisional Patent Application No. 61 / 564,535, filed November 29, 2011.

This application is also a continuation-in-part of U.S. Patent Application No. 13 / 118,225, filed May 27, No. 13 / 118,225 is a continuation-in-part application of PCT Application No. PCT / US2009 / 066259, filed December 1, PCT Application No. PCT / US2009 / 066259 discloses (a) U.S. Provisional Application No. 61 / 230,051, filed July 30, 2009, (b) U.S. Provisional Application No. 61 / 182,464, filed May 29, 2009, And (c) U.S. Provisional Application No. 61 / 119,217, filed December 2, 2008.

U.S. Provisional Patent Application No. 61 / 564,535, U.S. Patent Application No. 13 / 118,225, PCT Application No. PCT / US2009 / 066259, U.S. Provisional Patent Application No. 61 / 230,051, U.S. Provisional Application No. 61 / 182,464, 119,217 are hereby incorporated by reference in their entirety.

FIELD OF THE INVENTION The present invention relates generally to methods of providing electronic device structures, and more particularly to such methods and associated methods and electronic device structures for joining and separating flexible substrates in rigid substrates.

Flexible electronic devices can be used in a variety of ways that can not be hard electronic devices, but manufacturing flexible electronic devices can be difficult and / or costly. The difficulty and / or cost of fabricating flexible electronic devices, however, is that the flexible substrates can be mounted on rigid substrates such that the electronic devices can be fabricated on flexible substrates using conventional equipment and / or techniques for manufacturing rigid electronic devices. Can be reduced. Thus, there is a need or potential for the advantages of methods and associated methods and electronic device structures for separating flexible substrates from hard substrates after manufacturing electronic devices.

To facilitate further explanation of the embodiments, the following figures are provided.
1 shows a flow diagram of an embodiment of a method for providing one or more electronic devices.
FIG. 2 illustrates an exemplary procedure for providing a carrier substrate according to the embodiment of FIG.
FIG. 3 illustrates an exemplary process for processing a carrier substrate according to the embodiment of FIG.
Figure 4 shows a partial cross-sectional view of an exemplary electronic device structure after the step of providing a carrier substrate according to the embodiment of Figure 1;
FIG. 5 illustrates an exemplary procedure for providing an intermediate substrate according to the embodiment of FIG.
Figure 6 shows a partial cross-sectional view of the electronic device structure of Figure 4 after the step of applying and / or depositing a first adhesive according to the embodiment of Figure 1 on the first carrier substrate surface of the carrier substrate of Figure 4;
FIG. 7 illustrates an exemplary procedure for interposing the intermediate substrate of FIG. 5 between the carrier substrate and the flexible substrate of FIG. 2 to couple the flexible substrate to the carrier substrate according to the embodiment of FIG.
FIG. 8 illustrates an exemplary process for bonding the first intermediate substrate surface of the intermediate substrate of FIG. 5 to the carrier substrate of FIG. 2 with a first adhesive according to the embodiment of FIG.
FIG. 9 is a cross-sectional view of the electronic device structure of FIG. 4 after the step of bonding the first intermediate substrate surface of the intermediate substrate according to the embodiment of FIG. 1 to the first carrier substrate surface of the carrier substrate of FIG. Fig.
10 illustrates an exemplary process for coupling a second intermediate substrate surface of the intermediate substrate of FIG. 5, according to the embodiment of FIG. 1, to a first flexible substrate with a second adhesive.
FIG. 11 is a cross-sectional view of the first intermediate substrate surface of FIG. 9 after the step of applying and / or depositing a second adhesive according to the embodiment of FIG. 1 at the second intermediate substrate surface of the intermediate substrate of FIG. 9, 4 shows a partial cross-sectional view of the electronic device structure of Fig. 4 after bonding to the first carrier substrate surface of the carrier substrate of Fig. 4 with a first adhesive.
Fig. 12 shows a step of bonding the second intermediate substrate surface of Fig. 11 of the intermediate substrate of Fig. 9 according to the embodiment of Fig. 1 to the first flexible substrate surface of the flexible substrate with the second adhesive of Fig. After the step of applying and / or depositing at the second intermediate substrate surface, and bonding the first intermediate substrate surface of the intermediate substrate of Figure 9 to the first carrier substrate surface of the carrier substrate of Figure 4 with the first adhesive of Figure 6 4 shows a cross-sectional view of the electronic device structure of FIG.
FIG. 13 is a schematic view of a state in which the intermediate substrate of FIG. 9 according to the embodiment of FIG. 1 is interposed between the carrier substrate of FIG. 4 and the soft substrate of FIG. 12, Lt; RTI ID = 0.0 > 4 < / RTI >
Figure 14 illustrates the process of forming the electronic device (s) of Figure 13 in accordance with the embodiment of Figure 1 on the second flexible substrate surface of Figure 12 and after the step of forming the first intermediate substrate surface Lt; RTI ID = 0.0 > 4 < / RTI >
Fig. 15 is a cross-sectional view of the electronic device (s) of Fig. 13 according to the embodiment of Fig. 1 after the step of forming the electronic device (s) on the second flexible substrate surface of Fig. 12, And after the step of separating the second intermediate substrate surface of Fig. 11 from the first flexible substrate surface of the flexible substrate of Fig. 12, Fig.

For simplicity and clarity of illustration, the drawn figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted so as not to unnecessarily obscure the present invention. In addition, the elements in the drawn figures are inevitably not drawn at a certain rate. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of embodiments of the present invention. Like reference numerals in different drawings denote like elements.

The terms "first," "second," "third," "fourth," etc. in the description and claims are used, if necessary, to distinguish between similar elements, It is not used to describe sequential or chronological order. It should be understood that the terms so used are interchangeable under appropriate circumstances so that the embodiments described herein are operable, for example, in the order shown or in a different order than those described herein. It is also to be understood that the terms " comprises, " and "have," and any variations thereof, are not necessarily limited to such elements as a process, method, system, article, And is intended to cover a non-exclusive inclusion such that it may include other elements not specifically listed or inherent to such process, method, system, article, device, or apparatus.

The terms "left," "right," "front," "rear," "top," "bottom," "above," "below," and the like in the description and claims, It is used for purposes and is not necessarily used to describe permanent relative positions. It should be understood that the terms so used are interchangeable under appropriate circumstances so that the embodiments of the invention described herein are operable, for example, in the orientations shown or different from those described herein.

The terms "coupled," "coupled," "coupled," "coupled," and the like are to be understood broadly and refer to connecting two or more elements or signals electrically, mechanically and / do. Two or more electrical components are electrically coupled together but can not be mechanically or otherwise coupled together; Two or more mechanical elements are mechanically coupled together but can not be electrically or otherwise coupled together; Two or more electrical components are mechanically coupled together, but can not be electrically or otherwise coupled together. The coupling may be for any length of time, for example, permanent or semi-permanent, or for a moment.

Electrical coupling ", etc. should be broadly understood and include any combination of electrical signals, whether it be a power signal, a data signal, and / or other types or combinations of electrical signals. "Mechanical coupling ", etc. should be broadly understood and include all types of mechanical coupling.

The absence of words such as " removable, "" removable, ", etc. that are closely related to the word" coupled, " does not mean that the combination of problems, etc. is not removable or removable.

The term "CTE matched material" as used herein means a material having a coefficient of thermal expansion (CTE) that is different from the CTE of the reference material by less than about 20 percent (%). In some embodiments, the CTEs are less than about 10%, 5%, 3%, or 1%.

Detailed Description of Examples of Embodiments

Some embodiments include a method of providing one or more electronic devices. The method includes: providing a carrier substrate; Providing an intermediate substrate comprising a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface; Providing a flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface; Bonding the first intermediate substrate surface to the carrier substrate with a first adhesive; And bonding the second intermediate substrate surface with a second adhesive to the first flexible substrate surface.

Various embodiments include a method of providing one or more electronic devices. The method includes: providing a carrier substrate; Providing a flexible substrate; And interposing a strong film between the carrier substrate and the soft substrate to bond the soft substrate to the carrier substrate. The robust film can be configured to substantially mitigate stresses formed in the flexible substrate when the flexible substrate is detached from the carrier substrate.

Additional embodiments include an electronic device structure. The electronic device structure includes an intermediate substrate. The substrate includes a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface. On the other hand, the first intermediate substrate surface can be configured to be coupled to the carrier substrate by the first adhesive. The electronic device structure further includes a flexible substrate. The flexible substrate includes a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface. The first flexible substrate surface may be configured to be coupled to the second intermediate substrate surface by a second adhesive, and the second flexible substrate surface may be configured such that one or more electronic devices are disposed on the first substrate surface when the first intermediate substrate surface is coupled to the carrier substrate, And may be formed on the second flexible substrate surface when the flexible substrate surface is coupled to the second intermediate substrate surface.

1 illustrates a flow diagram of an embodiment of a method 100 for providing one or more electronic devices. The method 100 is illustrative only and is not limited to the embodiments provided herein. The method 100 may be employed in many different embodiments or examples not shown or described in detail herein. In some embodiments, the procedures, processes, and / or operations of method 100 may be performed in the order presented. In other embodiments, the procedures, processes, and / or operations of method 100 may be performed in any other suitable order. In yet other embodiments, one or more of the procedures, processes, and / or operations of method 100 may be combined or omitted.

Referring to Figure 1, a method 100 includes a procedure 101 for providing a carrier substrate. The carrier substrate may be a wafer or a panel. Thus, the carrier substrate includes a first carrier substrate surface and a second carrier substrate surface opposite the first carrier substrate surface. The carrier substrate may comprise any suitable geometric structure (e.g., circular, rectangular, square, any other suitable polygon, etc.). Likewise, the carrier substrate may include any suitable dimensions (e.g., diameter, thickness, length, width, etc.), if applicable. For example, where the carrier substrate is circular, the carrier substrate may comprise a diameter of about 25 millimeters, 51 millimeters, 76 millimeters, 130 millimeters, 150 millimeters, 200 millimeters, 300 millimeters, 450 millimeters, In these examples, the carrier substrate may also include a thickness of about 0.3 millimeters or greater and about 1.5 millimeters or less. On the other hand, in other examples, when the carrier substrate is rectangular, the carrier substrate may have a width of 370 millimeters x 470 millimeters, 550 millimeters x 650 millimeters, 1500 millimeters x 1800 millimeters, 2160 millimeters x 2400 millimeters, 2880 millimeters x 3130 millimeters, And if the carrier substrate is square, the carrier substrate may include widths and lengths such as 150 millimeters x 150 millimeters, 200 millimeters x 200 millimeters, 300 millimeters x 300 millimeters, and the like. In these examples, the carrier substrate may comprise a thickness of about 0.3 millimeters or less and about 2.0 millimeters or less. FIG. 2 illustrates an exemplary procedure 101 for providing a carrier substrate according to the embodiment of FIG.

Referring to Figure 2, procedure 101 is a process for providing a carrier substrate having a carrier substrate material CTE matched to a soft substrate, described below, with respect to procedure 103 (Figure 1) of method 100 (Figure 1) 201). For example, the carrier substrate material may comprise alumina, silicon, steel, sapphire, barium borosilicate, soda lime silicate, alkali silicate, or any other suitably CTE matched material. In various more specific examples, the carrier substrate may comprise sapphire having a thickness between approximately 0.7 mm and approximately 1.1 mm. The carrier substrate may also comprise 96% alumina having a thickness between approximately 0.7 mm and approximately 1.1 mm. In a different embodiment, the 96% alumina thickness is approximately 2.0 mm. In another example, the carrier substrate may be a single crystal silicon wafer having a thickness of at least about 0.65 mm. In a further embodiment, the carrier substrate may comprise stainless steel having a thickness of at least about 0.5 mm. In these or other embodiments, the carrier substrate may comprise any other suitable thickness.

In many embodiments, the procedure 101 may also include a process 202 for processing the carrier substrate. In many embodiments, the process 202 may be performed prior to performing the procedure 106. FIG. 3 illustrates an exemplary process 202 for processing a carrier substrate according to the embodiment of FIG.

In some embodiments, performing the procedure 101 may also include providing a carrier substrate, wherein the carrier substrate comprises, for example, a first adhesive on the first carrier substrate surface. In these embodiments, the process 202 may be omitted (although the carrier substrate may still be processed before the adhesive is applied thereto).

Referring to FIG. 3, the process 202 may include an operation 301 to clean the carrier substrate. Performing job 301 may include washing the carrier substrate in a sonic bath (e.g., megasonic bucket, Ultrasonic bath, etc.). In the same or other embodiments, performing the job 301 may also include washing the carrier substrate with a surfactant solution. For example, the surfactant may be a solution consisting of 5% by volume of a surfactant from Alconox, White Plains, New York, sold under the brand "Detergent 8®. However, the surfactant may also be any other suitable surfactant, for example a surfactant with properties similar to the Detergent 8® brand. After the step of washing the carrier substrate with the surfactant solution, the semiconductor device may be cleaned with deionized water and dried. In some instances, the cleaning step may be performed with a fast dump cleaner. In these or other instances, the drying step may be performed, for example, with a spin cleaning drier if the carrier substrate is circular. In still other instances, the drying step may be performed by isopropyl alcohol vapor drying and / or air drying of the carrier substrate.

On the other hand, the process 202 also may include, for example, the operation 302 for etching the carrier substrate to the carrier substrate by ashing (ashing) to a plasma of oxygen (O _2). Thus, in some instances, operation 302 may include etching the carrier substrate by ashing the carrier substrate with a Tegal 965 ash manufactured by Tegal Corporation of Petaluma, California or other suitable device that ashes the carrier substrate . The device that ashes the carrier substrate may be operated at a power level of approximately 250 watts (or approximately 200-300 watts). On the other hand, the operation 302 may be performed at a pressure of approximately 0.16 kilopascals (or approximately 0.1 to 0.2 kilopascals) and / or approximately 30 minutes (or approximately 15 to 45 minutes).

Referring to the drawings, FIG. 4 illustrates a partial cross-sectional view of an exemplary electronic device structure 400 after the step of providing a carrier substrate 401 according to the embodiment of FIG. Thus, the carrier substrate 401 may be similar or identical to the carrier substrate described above for the procedure 101 of the method 100 (FIG. 1). The electronic device structure 400 may include a carrier substrate 400.

Referring again to FIG. 1, the method 100 may include a procedure 102 for providing an intermediate substrate. The intermediate substrate includes a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface. The first intermediate substrate surface may be configured to be coupled to the carrier substrate by a first adhesive. In some embodiments, the intermediate substrate may be referred to as a robust film. FIG. 5 illustrates an exemplary procedure 102 for providing an intermediate substrate in accordance with the embodiment of FIG.

Referring to Fig. 5, procedure 102 may include a process 501 for providing an intermediate substrate having an intermediate substrate material. In many embodiments, the intermediate substrate material is selected from the group consisting of polyethylene naphthalate, polyethylene terephthalate, polyethersulfone, polyimide, polycarbonate, cyclic olefin copolymer, liquid crystal polymer, any other suitable polymeric material, aluminum foil, mylar ), And the like. In other embodiments, the intermediate substrate material may comprise a tape (e.g., a double-sided tape), such as when the intermediate substrate material comprises a first adhesive and / or a second adhesive, as described below.

The procedure 102 may also be performed by, for example, a Yamato oven manufactured by Yamato Scientific America, Inc. of Santa Clara, Calif., Or other suitable device for baking an intermediate substrate without damaging the intermediate substrate And a process 502 for baking. Process 502 may be performed in prebaking conditions. The prebaking conditions may include a prebaking temperature, a prebaking pressure, and / or a prebaking time. For example, the prebaking temperature may be approximately 200 < 0 > C. On the other hand, the prebaking pressure may be approximately 0.004 kiloPascal (or approximately 0 to 0.010 kilopascal). In addition, the prebaking time may be approximately one hour. In various embodiments, performing the process 502 includes exposing the first intermediate substrate surface and the second intermediate substrate surface to an ion blower for greater than about 10 seconds prior to baking the intermediate substrate . &Lt; / RTI > In some embodiments, process 502 may be omitted.

The procedure 102 may further comprise a process 503 for cutting the intermediate substrate. In many embodiments, performing the process 503 may include scaling the intermediate substrate based on the carrier substrate and / or the flexible substrate. For example, performing the process 503 may be performed such that the periphery of the intermediate substrate is offset from the periphery of the carrier substrate by about 1.5 millimeters or more, or 2 millimeters, or the like (or about 1 to 5 millimeters) (E. G., Scaling) the intermediate substrate so that the side dimensions of the intermediate substrate are smaller. &Lt; RTI ID = 0.0 > Likewise, performing the process 503 may also include cutting the intermediate substrate such that the periphery of the intermediate substrate is offset (e.g., by at least one larger side dimension) than the periphery of the flexible substrate (e.g., A step of scaling). The step of performing the process 503 in this manner may be followed by a procedure 112 (FIG. 1) in the method 100 (FIG. 1) by distributing the stresses formed by performing the procedure 112 and / ) And / or procedure 113 (FIG. 1). In some embodiments, the process 503 may be omitted, for example, if the intermediate substrate 503 is pre-scaled.

In some embodiments, the procedure 102 may also include the process of providing an intermediate substrate when the first intermediate substrate surface comprises a first adhesive (e.g., where the intermediate substrate comprises a tape) have. In these embodiments, process 502 and / or process 503 may be omitted. In further embodiments, such a process may be omitted.

On the other hand, in the same or different embodiments, the procedure 102 may also be used in the case where the second intermediate substrate surface comprises a second adhesive (e.g., the intermediate substrate comprises a tape such as a double- The process of providing an intermediate substrate to the substrate. In these embodiments, process 502 and / or process 503 may also be omitted. Likewise, in many embodiments, such a process may be performed in a manner similar to the process of providing an intermediate substrate when the first intermediate substrate surface comprises a first adhesive, as described for procedure 101 (FIG. 1) .

Referring again to FIG. 1, the method 100 may include a procedure 103 for providing a flexible substrate. As used herein, the term "flexible substrate" means a stand-alone substrate comprising a flexible material that readily adjusts its shape. In some embodiments, the flexible substrate may comprise a low modulus of elasticity. For example, a low modulus of elasticity can be considered an elastic modulus less than approximately 5 gauge pascals.

The flexible substrate includes a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface. The first flexible substrate surface may be configured to be coupled to the second intermediate substrate surface by a second adhesive. The second flexible substrate surface, on the other hand, is configured such that when the electronic device (s) is coupled to the carrier substrate, for example, the first intermediate substrate surface and the first flexible substrate surface is bonded to the second intermediate substrate surface, Can be configured to be formed on the surface.

In some embodiments, the step of performing procedure 103 may include providing a flexible substrate material lacking sufficient mechanical strength to prevent the flexible substrate from being damaged if the flexible substrate is directly bonded to and separated from the carrier substrate, If so, it may include a process to provide a flexible substrate.

On the other hand, similar to that described above for procedure 101 and / or procedure 102, in some embodiments, performing the procedure 103 may be performed when the first flexible substrate surface comprises a second adhesive To provide a flexible substrate to the substrate. In other embodiments, such a process may be omitted as well.

In many embodiments, procedure 103 may include a process for processing a flexible substrate. The process may be similar or identical to performing the process 202 (FIG. 2) for the carrier substrate. In many instances, such processes and processes 202 (FIG. 2) may be performed substantially simultaneously with each other and / or such processes may be performed as part of process 202.

On the other hand, the method 100 may include a procedure 104 for providing a first adhesive. In various embodiments, performing the procedure 104 may include applying and / or depositing a first adhesive to the first carrier substrate surface and / or the first intermediate substrate surface. In general, the procedure 104 may be performed when the first carrier substrate surface and / or the first intermediate substrate surface does not include the first adhesive. Performing procedure 104 may be accomplished by any suitable technique of applying and / or depositing the first adhesive (e.g., spin coating, spray coating, extrusion coating, preform laminating, slot die coating, Screen laminating, screen printing, etc.) to the first carrier substrate surface and / or the first intermediate substrate surface. For example, performing the process 104 may include providing a first carrier substrate surface and / or a first intermediate substrate surface with a rotational speed of about 1000 rotations per minute for about 25 seconds and / or a rotational speed of about 3500 rotations per minute for about 20 seconds. Coating and / or depositing the first adhesive on the first carrier substrate surface and / or the first intermediate substrate surface by spin coating the first adhesive on the substrate surface. In some embodiments, the procedure 104 may be omitted, for example, where the first carrier substrate surface and / or the first intermediate substrate surface already comprise the first adhesive.

6, a step of applying and / or depositing a first adhesive 602 according to the embodiment of FIG. 1 at the first carrier substrate surface 603 of the carrier substrate 401 (FIG. 4) Sectional view of a later electronic device structure 400 (Fig. 4). The first adhesive 602 may be similar or identical to the first adhesive described above for the procedure 104 (FIG. 1) of the method 100 (FIG. 1). On the other hand, the first carrier substrate surface 603 may be similar or identical to the first carrier substrate surface described above for the procedure 101 (FIG. 1) of the method 100 (FIG. 1). 4) may include a first adhesive 602 and the carrier substrate 401 (FIG. 4) may include a first carrier substrate surface 603.

Returning to FIG. 1, the method 100 may include a procedure 105 for providing a second adhesive. In various embodiments, performing the procedure (105) further comprises applying a second adhesive to the second intermediate substrate surface and / or the first flexible substrate surface (104) in a manner similar to that of performing the procedure (104) for the first adhesive. And / or < / RTI >

In various embodiments, procedure 104 and / or procedure 105 may be performed as part of procedure 106. For example, procedure 104 may be performed prior to performing steps 701 and 702, and procedure 105 may be performed after process 701 but before process 702 . In a different example, procedure 104 may be performed before process 701 and after process 702, while procedure 105 may be performed prior to both process 701 and process 702 . In other instances, procedures 104 and 105 may be performed prior to performing the procedure 106, for example, when process 701 and process 702 are performed substantially simultaneously with each other.

In some embodiments, the first adhesive and the second adhesive may comprise the same adhesive material, and in other embodiments, the first adhesive and the second adhesive may comprise different adhesive materials. The first adhesive and / or the second adhesive may be applied by any suitable adhesive material (e.g., Henkel NS122 adhesive manufactured by Henkel AG & Company, KGaA of Dusseldorf, Germany; Henkel AG & EccoCoat 3613 adhesives manufactured; etc.). In these or other embodiments, the adhesive material may include a thermosetting adhesive, a pressure sensitive adhesive, an ultraviolet curable adhesive, and the like. In many embodiments, the first adhesive may be selected according to the material properties of the carrier substrate and the intermediate substrate. Likewise, the second adhesive can be selected according to the material properties of the intermediate substrate and the flexible substrate. For example, the first adhesive and / or the second adhesive may comprise a Henkel NS122 adhesive when the intermediate substrate comprises polyethylene naphthalate or polyethylene terephthalate. On the other hand, if the intermediate substrate comprises polyimide, the first adhesive and / or the second adhesive may comprise an EccoCoat 3613 adhesive.

On the other hand, the method 100 may include a procedure 106 for interposing an intermediate substrate between the carrier substrate and the flexible substrate to bond the flexible substrate to the carrier substrate. In some embodiments, performing the procedures 106 and / or 702 may include coupling the intermediate substrate to the flexible substrate to strengthen the flexible substrate. FIG. 7 illustrates an exemplary procedure 106 for interposing an intermediate substrate between a carrier substrate and a flexible substrate to couple the flexible substrate to the carrier substrate according to the embodiment of FIG.

Referring to FIG. 7, procedure 106 may include a process 701 for coupling a first intermediate substrate surface to a carrier substrate (e.g., a first carrier substrate surface) with a first adhesive. FIG. 8 illustrates an exemplary process 701. FIG.

Referring to Fig. 8, process 701 may include an operation 801 of providing a protective layer to either the first intermediate substrate surface or the second intermediate substrate surface. In many embodiments, the protective layer may comprise a tape (e.g., Blue Low Tack Squares, product number 18133-7.50, manufactured by Semiconductor Equipment Corporation of Moorpark, Calif.). In many embodiments, the step of performing task 801 may comprise, if applicable, scaling the protective layer to conform to the lateral surface area of the first intermediate substrate surface or the second intermediate substrate surface .

Performing task 801 may, when performing task 802, prevent damage and / or contamination of the first intermediate substrate surface or second intermediate substrate surface, if applicable. Thus, if process 701 is performed prior to process 702, performing task 801 may include providing a protective layer to the second intermediate substrate surface. Alternatively, if process 701 is performed after process 702, performing task 801 may include providing a protective layer to the first intermediate substrate surface. In some embodiments, task 801 may be omitted.

Process 701, on the other hand, is an operation that joins the first intermediate substrate surface with the first adhesive to the carrier substrate using any suitable lamination device (e.g., a roll press, a bladder press, etc.) 802). In many embodiments, the step of bonding the first intermediate substrate surface to the carrier substrate may occur under the first condition. The first condition may comprise a first pressure, a first temperature, and / or a first feed rate. For example, the first pressure may be greater than or equal to about 0 kilo pascals (i.e., in vacuum), less than or equal to about 69 kilo pascals (e.g., if the intermediate substrate comprises polyimide) Lt; / RTI > Also, the first feed rate may be greater than about 0.25 meters per minute and less than about 0.5 meters per minute (or about 0.10 to 1.0 meters per minute). On the other hand, the first temperature may be approximately 20 ° C or higher and may be approximately 100 ° C, 160 ° C, 220 ° C, 350 ° C, and the like. For example, the first temperature may be below about 220 캜 (e.g., about 100 캜) when the intermediate substrate comprises polyethylene naphthalate, and less than about 160 캜 when the intermediate substrate comprises polyethylene terephthalate (E.g., about 100 < 0 > C). On the other hand, the first temperature may be about 350 캜 or less (for example, about 100 캜) when the intermediate substrate includes polyimide. Generally speaking, the first pressure and / or the first temperature may be in accordance with the material properties and / or limitations of the intermediate substrate.

In some embodiments, the process 701 may also include an operation 803 of removing the protective layer from one of the first intermediate substrate surface or the second intermediate substrate surface. In some embodiments, job 803 may be omitted, for example, if job 801 is omitted.

9 shows the first intermediate substrate surface 904 of the intermediate substrate 905 according to the embodiment of Figure 1 as the first adhesive 602 (Figure 6) Sectional view of the electronic device structure 400 (FIG. 4) after the step of bonding to the carrier substrate surface 603 (FIG. 6). The first intermediate substrate surface 904 and the intermediate substrate 905 are similar or identical to the first intermediate substrate surface and the intermediate substrate respectively described above for the procedure 102 (Figure 1) of the method 100 . 4) may include an intermediate substrate 905 and the intermediate substrate 905 may include a first intermediate substrate surface 904. In one embodiment, the electronic device structure 400 (FIG.

Returning to Fig. 7, procedure 106 may also include a process 702 for coupling the second intermediate substrate surface to the first flexible substrate surface with a second adhesive. FIG. 10 illustrates an exemplary process 702.

Referring to FIG. 10, process 702 may include an operation 1001 of providing a protective layer to a second flexible substrate surface. The protective layer may be similar or identical to the protective layer described above for task 801 (FIG. 8).

The process 702 may include an operation 1002 of bonding the second intermediate substrate surface with the second adhesive to the first flexible substrate surface using any suitable lamination device (e.g., roll press, bladder press, etc.) I can continue. In many embodiments, the step of bonding the second intermediate substrate surface to the first flexible substrate surface occurs in a second condition. The second condition may be similar or identical to the first condition described above for task 802 (FIG. 8). Thus, in some embodiments, the first condition and the second condition may be the same, while in other embodiments, the first condition and the second condition may be different. For example, the second condition may comprise a second pressure, which may be greater than or equal to approximately 0 kilopascals (i.e., in vacuum), and may be less than or equal to approximately 128 kilopascals (or approximately 150 kilopascals or less). In more specific examples, when the intermediate substrate comprises polyimide, the second pressure may be less than or equal to about 69 kilo Pascals, and when the intermediate substrate comprises polyethylene naphthalate or polyethylene terephthalate, the second pressure may be about 128 kilo pascals &Lt; / RTI >

The process 702 includes bonding the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive to the first intermediate substrate surface after bonding the first intermediate substrate surface to the carrier substrate and bonding the second intermediate substrate surface to the first flexible substrate surface And an etching operation (1003). In some embodiments, the step of performing job 1003 may be performed using a Tegal 901 asher manufactured by Tegal Corporation of Petaluma, California, or a combination of a carrier substrate, an intermediate substrate, a flexible substrate, a first adhesive, The intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive with another suitable device. Task 1003 may be performed for approximately 900 seconds or more. In many embodiments, performing step 1003 may remove excess of the first adhesive and / or the second adhesive.

In some embodiments, task 1003 may be performed as part of process 701 (Fig. 7) instead of process 702 (Fig. 7). For example, task 1003 may be performed as part of process 701 (FIG. 7) if process 701 is performed after process 702 (FIG. 7). Still, in many embodiments, job 1003 may be performed after job 1001 and job 1002 and may be performed prior to job 1004. On the other hand, in further embodiments, task 1003 may be performed after procedure 107 (FIG. 1). In still other embodiments, job 1003 may be omitted, for example, where the intermediate substrate comprises polyimide.

In some embodiments, the process 702 may also include an operation 1004 of removing the protective layer from the second flexible substrate. In some embodiments, if process 701 is performed after process 702, job 1004 may be performed after process 701 is performed.

11, the second adhesive 1106 according to the embodiment of FIG. 1 is applied and / or deposited on the second intermediate substrate surface 1107 of the intermediate substrate 905 (FIG. 9) The first intermediate substrate surface 904 (Figure 9) of the substrate 905 is bonded to the first carrier substrate surface 603 (Figure 6) of the carrier substrate 401 with a first adhesive 602 (Figure 6) Sectional view of a later electronic device structure 400 (Fig. 4). The electronic device structure 400 (FIG. 4) may include a second adhesive 1106 and the intermediate substrate 905 (FIG. 9) may include a second intermediate substrate surface 1107.

12 depicts a second intermediate substrate surface 1107 (FIG. 11) according to the embodiment of FIG. 1 with a second adhesive 1106 (FIG. 11) on a first flexible substrate surface 1208 of the flexible substrate 1209 After the second adhesive 1106 is applied and / or deposited on the second intermediate substrate surface 1107 of the intermediate substrate 905 (FIG. 9), and after the first adhesive 1106 is bonded to the second intermediate substrate surface 1107 of the intermediate substrate 905 The electronic device structure 400 (Fig. 9) after bonding the substrate surface 904 (Fig. 9) to the first carrier substrate surface 603 (Fig. 6) of the carrier substrate 401 with the first adhesive 602 4). &Lt; / RTI > The first flexible substrate surface 1208 and the flexible substrate 1209 are similar or identical to the first flexible substrate surface and the flexible substrate described above with respect to procedure 103 (Figure 1) of method 100 (Figure 1) . 4) may include a flexible substrate 1209 and the flexible substrate 1209 may include a first flexible substrate surface 1208. In one embodiment,

Although FIGS. 6, 9, 11, and 12 illustrate performing the method 100 in a manner where the process 701 (FIG. 7) is performed prior to the process 702 (FIG. 7) The process 702 (FIG. 7) may instead be performed after performing the process 701 (FIG. 7). On the other hand, in other embodiments, process 701 (FIG. 7) and process 702 (FIG. 7) may be performed substantially simultaneously.

Returning now to Figure 1, the method 100 includes a procedure of bonding the first intermediate substrate surface to the carrier substrate, bonding the second intermediate substrate surface to the first flexible substrate surface, and then curing the first adhesive and the second adhesive (107). The step of performing the procedure 107 may include curing the first adhesive and / or the second adhesive (e.g., UV curing, thermosetting, pressure curing, etc.) without damaging the carrier substrate, the intermediate substrate, or the flexible substrate And curing the first adhesive and the second adhesive in accordance with any suitable combination of techniques and / or techniques. For example, if the first adhesive and / or the second adhesive comprises a Henkel NS122 adhesive, the step of performing procedure 107 may be performed, for example, with a Dymax UV curing system manufactured by Dymax Corporation of Torrington, Connecticut And ultraviolet curing the first adhesive and / or the second adhesive using the same ultraviolet curing system. In these embodiments, procedure 107 may be performed for approximately 20 seconds or more (or approximately 10-30 seconds). On the other hand, if the first adhesive and / or the second adhesive comprises an EccoCoat 3613 adhesive, the step of performing the procedure 107 may be carried out using, for example, a Yamato (registered trademark) Yamato Scientific America, Inc., Santa Clara, Calif. And thermosetting the first adhesive and / or the second adhesive in an oven such as an oven. In these embodiments, procedure 107 may be performed at a temperature of about 150 占 폚 (or about 200 占 폚) for about 30 minutes or more (or about 20-40 minutes).

The method 100 can include a procedure 108 for cleaning the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. Procedure 108 may be similar to job 301 (Figure 3). In many embodiments, procedure 108 may be performed after procedure 106 and / or procedure 107. [ In other embodiments, the procedure 108 may be omitted, for example if the intermediate substrate comprises polyimide.

The method 100 may include a step 109 of baking a carrier substrate, an intermediate substrate, a flexible substrate, a first adhesive, and a second adhesive. The procedure 109 may be similar to the process 502 (FIG. 5). In many embodiments, the procedure 109 may be performed after the procedure 108.

The method 100 may also include a procedure 110 for cleaning the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. Procedure 110 may be similar to job 301 (Figure 3). In many embodiments, the procedure 110 may be performed after the procedure 109.

The method 100 may additionally comprise a procedure 111 for drying the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. In some embodiments, the procedure 111 may be performed in an oven such as, for example, a Yamato oven manufactured by Yamato Scientific America, Inc. of Santa Clara, Calif. Or other suitable device for baking an intermediate substrate, , A flexible substrate, a first adhesive, and a second adhesive. Process 502 may be performed under dry baking conditions. The dry baking conditions may include a dry baking temperature (e.g., about 80-120 占 폚, e.g., about 100 占 폚) and / or a dry baking time (e.g., about 1 hour or more and about 4 hours or less, , About 3 hours). In many embodiments, procedure 111 may be performed after procedure 110. [ Procedure 111 may also include cooling and / or cooling the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive for at least about 30 minutes. Performing procedure 111 may remove moisture and / or remove moisture from the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. Thus, the length of the dry baking time is dependent on the material used for the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and / or the second adhesive as well as the materials used for the carrier substrate, the intermediate substrate, the flexible substrate, The gas release rate of the adhesive and / or the external diffusion rate.

The method 100 may further comprise a step 112 of depositing a nitride barrier layer on the second flexible substrate surface. The procedure 112 may include depositing a nitride barrier to a nitride barrier thickness of approximately 0.3 micrometer (or approximately 0.2 to 0.5 micrometer). In many embodiments, the procedure 112 may be performed after the procedure 111.

The method 100 may also include inspecting the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive to determine whether any of the carrier substrate, the intermediate substrate, and / Gt; 113 < / RTI > In some embodiments, procedure 113 may be omitted. The procedure 113 may be performed after the procedure 112.

The method 100 may include a procedure 114 of forming one or more electronic devices on a second flexible substrate surface. The electronic device (s) may include one or more electronic sensors, one or more electronic displays, one or more electronic transistors (e.g., thin film transistors), one or more electronic diodes, one or more micro-electromechanical systems, Other suitable electronic device (s) of < / RTI > In many embodiments, the procedure 114 may be performed after performing the steps 101 to 113.

FIG. 13 is a cross-sectional view of the second flexible substrate surface 1311 after the step of interposing the intermediate substrate 905 (FIG. 9) between the carrier substrate 401 (FIG. 4) and the flexible substrate 1209 according to the embodiment of FIG. Sectional view of the electronic device structure 400 (FIG. 4) after the step of forming the electronic device (s) 1310 on top of the electronic device structure. 4) may include electronic device (s) 1310 and the flexible substrate 1209 (FIG. 12) may include a second flexible substrate surface 1311. The electronic device structure 400 (FIG.

Returning to FIG. 1, the method 100 may further comprise a procedure 115 for separating the first intermediate substrate surface from the carrier substrate (e.g., the first carrier substrate surface). The intermediate substrate may be configured to substantially mitigate stresses formed in the flexible substrate when the flexible substrate is detached from the carrier substrate. Thus, performing the procedure 115 may include substantially mitigating the stress formed in the flexible substrate to the intermediate layer while the flexible substrate is being separated from the carrier substrate. The step of relieving the stress formed in the substantially flexible substrate may refer to the step of relaxing sufficient stress to prevent damage to the flexible substrate and / or electronic device (s) when performing the procedure (115). As a result, the method 100 uses electronic device manufacturing equipment and / or techniques that are configured for use with rigid substrates, while absorbing stresses when separating the flexible substrate (s) from the carrier substrate (s) (S) to prevent damage to the flexible substrate (s) by interposing one or more respective intermediate substrates between the rigid carrier substrate (s) and the flexible substrate (s) (E. G., The electronic device (s) discussed above with respect to procedure 114) is coupled to one or more rigid carrier substrates (e. G., The carrier substrate described above with respect to procedure 101) The flexible substrate described above with respect to procedure 103).

In many embodiments, the procedure 115 may comprise mechanically separating the first intermediate substrate surface from the carrier substrate. For example, in these embodiments, the procedure 115 may be performed by placing a tool (e.g., a blade edge) on the first intermediate substrate surface (e.g., (Between the first adhesive and the first intermediate substrate surface) and pushing the tool along the first intermediate substrate surface at an angle that is at least about 0 degrees and no more than about 45 degrees to the first intermediate substrate surface have.

In other embodiments, the procedure 115 may be carried out in accordance with any other suitable technique (e.g., chemical, laser, ultraviolet, thermal, etc.) for separating the first intermediate substrate surface from the carrier substrate And separating the intermediate substrate surface. Accordingly, U.S. Patent Application Publication No. 20100297829, U.S. Patent Application Serial No. 20110023672, U.S. Patent Application Serial No. 20110064953, U.S. Patent Application Publication No. 20110228492, SM O 'Rourke , such as a technical document, Direct Fabrication of a-Si: H Thin Film Transistor Arrays on Flexible Plastic and Metal Foils for Displays, ADM002187, official records (26th), pp of Army Science Conference. 1 and 4, December 2008, and Satoshi Inoue, et al., Surfac-Free Technology by Laser Annealing (SUFTLA) and its Application to Poly-Si TFT- Transactions, Vol. 49, No. 8, pp. 1353-1360, August 2002, can be used to perform procedure 115. [0060]

In many embodiments, the procedure 115 may be performed in a manner such that the first adhesive remains with the carrier substrate. However, in some embodiments, the first intermediate substrate surface may be etched in a manner similar to operation 302 (FIG. 3) to remove any residues of the first adhesive at the first intermediate substrate surface.

Figure 14 illustrates the process of forming the electronic device (s) 1310 (Figure 13) on the second flexible substrate surface 1208 (Figure 12) according to the embodiment of Figure 1, Sectional view of the electronic device structure 400 (FIG. 4) after the step of detaching the first intermediate substrate surface 904 (FIG. 9) of the intermediate substrate 905 (FIG. 9)

Returning to FIG. 1, after performing the procedure 115, the method 100 may also include a procedure 116 to separate the second intermediate substrate surface from the first flexible substrate surface. The intermediate substrate may be configured to separate from the carrier substrate and the flexible substrate without damaging the electronic device (s). On the other hand, in some embodiments, procedure 116 may be omitted and the intermediate substrate may remain bonded to the flexible substrate by a second adhesive to strengthen the flexible substrate.

Despite such embodiments where it is desirable to leave the intermediate substrate bonded to the flexible substrate, the procedure 116 may include mechanically separating the second intermediate substrate surface from the first flexible substrate surface. For example, the step of mechanically separating the second intermediate substrate surface from the first flexible substrate surface may be performed with a constant force to release the second intermediate substrate surface from the first flexible substrate surface and with a small angle And manually pulling the intermediate substrate from the flexible substrate with the substrate (for example, about 5 to 45 degrees). In these examples, the procedure 116 may include providing a protective layer over the second flexible substrate surface to protect any electronic device (s) formed on the second flexible substrate surface during performing the procedure 116 .

Alternatively, the procedure 116 may also be used to remove the first intermediate substrate surface from the first flexible substrate surface in accordance with any other suitable technique (e. G., Chemical, laser, ultraviolet, 2 intermediate substrate surface. Thus, procedure 116 may be similar or identical to procedure 115. [

FIG. 15 illustrates a cross-sectional view of a carrier substrate 401 (FIG. 4) after the step of forming electronic device (s) 1310 (FIG. 13) on a second flexible substrate surface 1208 (FIG. 9) of the intermediate substrate 905 (FIG. 9) and the first flexible substrate surface 1208 (FIG. 9) of the flexible substrate 1209 Sectional view of the electronic device structure 400 (FIG. 4) after the step of separating the second intermediate substrate surface 1107 (FIG.

In some embodiments, the procedure 116 further includes etching the flexible substrate in a manner similar to job 302 (FIG. 3) to remove any residues of the second adhesive at the first flexible substrate surface can do. Thus, the step of etching the flexible substrate may be performed after the step of detaching the second intermediate substrate surface from the first flexible substrate surface.

In many embodiments, procedures 102 to 116 may be performed on both sides of the carrier substrate of procedure 101 of method 100. In such embodiments, one or more of procedures 102 through 116 may be performed substantially simultaneously on both sides of the carrier substrate. On the other hand, in these or other embodiments, one or more of the procedures (102) through (116) may be repeated and performed separately for each side of the carrier substrate.

Although the present invention has been described with reference to particular embodiments, it will be understood by those skilled in the art that various changes may be made therein without departing from the spirit or scope of the invention. Accordingly, the disclosure of the embodiments of the invention is not intended and should be construed as being illustrative of the scope of the invention. It is intended that the scope of the invention will be limited only to the extent required by the appended claims. For example, those skilled in the art will appreciate that the procedures 101 through 116, processes 201 and 202 of FIG. 2, tasks 301 and 302 of FIG. 3, processes 501 through 503 of FIG. The processes 701 and 702 of FIG. 7, the jobs 801 to 803 of FIG. 8, and the jobs 1001 to 1004 of FIG. 10 are composed of many different procedures, processes, It should be understood that many different modules can be implemented in many different orders, that any element of FIGS. 1-15 can be modified, and that the foregoing discussion of some of these embodiments is applicable to all possible embodiments It will be readily appreciated that a complete description does not necessarily appear.

All elements recited in any particular claim are inevitable in the embodiment claimed in such specific claim. Thus, the replacement of one or more claimed components constitutes representation and does not constitute recovery. In addition, benefits, other advantages, and solutions to problems have been described with regard to specific embodiments. However, any element or elements that may cause benefits, advantages, solutions to problems, and any benefit, advantage, or solution to occur or become more pronounced are not to be regarded as a departure from the spirit and scope of the invention, Should not be construed as critical, necessary, or essential features or elements of any or all of the claims, unless the context, means, solutions, or elements are explicitly stated in such claim.

In addition, the embodiments and limitations disclosed herein are not intended to limit the embodiments and / or limitations to: (1) the claims; (2) are not transferred to the public under the exclusive principle if they are equal or potentially equivalent to the elements and / or limitations specified in the claims under the principle of equivalents.

Claims

Providing a carrier substrate;
Providing an intermediate substrate comprising a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface;
Providing a flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface;
Coupling the first intermediate substrate surface to the carrier substrate with a first adhesive; And
And bonding the second intermediate substrate surface with a second adhesive to the first flexible substrate surface.

The method according to claim 1,
Wherein coupling the first intermediate substrate surface to the carrier substrate with the first adhesive comprises bonding the first intermediate substrate surface to the carrier substrate with an adhesive material, Include;
Wherein coupling the second intermediate substrate surface to the carrier substrate with the second adhesive comprises bonding the second intermediate substrate surface to the carrier substrate with the adhesive material, / RTI >

3. The method according to claim 1 or 2,
Providing the first adhesive; or
And providing the second adhesive. &Lt; Desc / Clms Page number 21 >

The method of claim 3,
Wherein providing the first adhesive comprises applying the first adhesive, wherein:
The step of applying the first adhesive may include spin coating the first adhesive on one or both of the carrier substrate and the first intermediate substrate surface, spray coating, extrusion coating, preform laminating, A step of slot die coating, a step of screen laminating, or a step of screen printing;
Wherein providing the second adhesive comprises applying the second adhesive, wherein:
The step of applying the second adhesive may include spin coating the second adhesive on one or both of the second intermediate substrate surface and the first flexible substrate surface, spray coating, extrusion coating, preform laminating A step of coating a slot die, a step of screen laminating, or a step of screen printing.

5. The method according to any one of claims 1 to 4,
Wherein providing the carrier substrate comprises providing the carrier substrate with a carrier substrate material comprising at least one of alumina, silicon, steel, sapphire, barium borosilicate, soda lime silicate, or alkali silicate;
Providing the flexible substrate comprises providing the flexible substrate with a soft glass material;
Wherein providing the intermediate substrate comprises providing the intermediate substrate with an intermediate substrate material comprising at least one of polyethylene naphthalate, polyethylene terephthalate, polyethersulfone, polyimide, polycarbonate, cyclic olefin copolymer, or liquid crystal polymer &Lt; / RTI >

6. The method according to any one of claims 1 to 5,
Wherein coupling the first intermediate substrate surface to the carrier substrate with the first adhesive comprises bonding the first intermediate substrate surface to the carrier substrate with the first adhesive using one or more of a roll press or a bladder press Step;
Wherein coupling the second intermediate substrate surface to the first flexible substrate surface with the second adhesive comprises coupling the second intermediate substrate surface with the second adhesive using one or more of the roll press or the bladder press, And bonding the first flexible substrate surface to the first flexible substrate surface.

The method according to claim 6,
The step of bonding the first intermediate substrate surface to the carrier substrate comprises:
A first pressure of about 0 kilo Pascal or greater and about 69 kilo Pascal or less;
A first temperature of greater than or equal to about 20 캜 and less than or equal to about 100 캜; or
A first feed rate of at least about 0.25 meters per minute and a first feed rate of about 0.5 meters per minute or less;
Wherein bonding the second intermediate substrate surface to the first flexible substrate surface comprises:
A second pressure of about 0 kilo Pascal or greater and about 138 kilo Pascal or less;
A second temperature of greater than or equal to about 20 캜 and less than or equal to about 100 캜; or
A second conveying speed of at least about 0.25 meters per minute and a second conveying speed of at most about 0.5 meters per minute.

8. The method according to any one of claims 1 to 7,
Wherein providing the carrier substrate includes treating the carrier substrate prior to bonding the first intermediate substrate surface to the carrier substrate, wherein treating the carrier substrate comprises:
Cleaning the carrier substrate; or
And ashing the carrier substrate.

9. The method according to any one of claims 1 to 8,
Wherein providing the intermediate substrate comprises:
A prebaking temperature of about 200 < 0 >C;
A prebaking pressure of approximately 0.004 kilo Pascal; or
Baking the intermediate substrate in a prebaking condition comprising at least one of a prebaking time of about 1 hour;
or
And cutting the intermediate substrate, wherein cutting the intermediate substrate comprises scaling the intermediate substrate based on at least one size of the carrier substrate or the flexible substrate.

10. The method according to any one of claims 1 to 9,
After the step of bonding the first intermediate substrate surface to the carrier substrate and bonding the second intermediate substrate surface to the first flexible substrate surface, the step of bonding the carrier substrate, the intermediate substrate, the flexible substrate, And baking the second adhesive.

11. The method according to any one of claims 1 to 10,
Further comprising forming one or more electronic devices on the second flexible substrate surface after coupling the first intermediate substrate surface to the carrier substrate and bonding the second intermediate substrate surface to the first flexible substrate surface, / RTI >

12. The method according to any one of claims 1 to 11,
Further comprising disengaging said first intermediate substrate surface from said carrier substrate after engaging said first intermediate substrate surface to said carrier substrate and engaging said second intermediate substrate surface to said first flexible substrate surface How to.

13. The method of claim 12,
After coupling the first intermediate substrate surface to the carrier substrate and bonding the second intermediate substrate surface to the first flexible substrate surface, separating the first intermediate substrate from the carrier substrate, Further comprising separating the second intermediate substrate surface from the substrate surface.

A method for providing one or more electronic devices comprising:
Providing a carrier substrate;
Providing a flexible substrate; And
And interposing a strong film between the carrier substrate and the soft substrate to bond the soft substrate to the carrier substrate, wherein when the soft substrate is separated from the carrier substrate, And to substantially mitigate the stresses that are produced.

15. The method of claim 14,
Interposing the strong film between the carrier substrate and the soft substrate comprises:
(A) at least one of the carrier substrate or the first hard film surface comprises the first adhesive, or (b) the first hard film surface of the hard film is bonded to the carrier substrate with a first adhesive, ) Coupling the first hard film surface to the carrier substrate comprises providing the first adhesive to the carrier substrate or providing the first adhesive to the first hard film surface Coupling; And
Bonding the surface of the second robust film of the robust film to the surface of the first soft substrate of the soft substrate with a second adhesive after bonding the surface of the first robust film to the carrier substrate, (A) at least one of the surface of the second robust film or the surface of the first flexible substrate comprises the second adhesive, or (b) the surface of the second robust film is bonded to the surface of the first robust film, Wherein bonding to the first flexible substrate surface comprises providing at least one of providing the second adhesive to the surface of the second robust film or providing the second adhesive to the first flexible substrate surface / RTI >

15. The method of claim 14,
Interposing the robust film between the carrier substrate and the flexible substrate includes:
Bonding the surface of the second robust film of the robust film to a surface of the first soft substrate of the soft substrate with a second adhesive, wherein: (a) the surface of the second robust film or the surface of the first soft substrate is (B) bonding the surface of the second hard film to the surface of the first flexible substrate comprises providing the second adhesive to the surface of the second hardfacing film, or providing the second adhesive to the surface of the second soft substrate, Providing at least one flexible film surface; And
Bonding the surface of the first hard film of the hard film to the carrier substrate with a second adhesive after bonding the surface of the second hard film to the first soft substrate, (A) the at least one of the first robust film surface or the carrier substrate comprises the second adhesive, or (b) the step of bonding the first robust film surface to the carrier substrate comprises: Providing the first adhesive to the surface of the first hard film, or providing the first adhesive to the carrier substrate.

15. The method of claim 14,
Interposing the robust film between the carrier substrate and the flexible substrate includes:
(A) at least one of the carrier substrate or the surface of the first hard film comprises the first adhesive; or (b) the first hard film surface of the hard film is bonded to the carrier substrate with a first adhesive, Wherein bonding the first hard film surface to the carrier substrate comprises providing the first adhesive to the carrier substrate or providing the first adhesive to the first hard film surface ; And
Bonding the surface of the second hard film of the hard film to a surface of the first soft substrate of the soft substrate with a second adhesive, the surface of the second hard film facing the surface of the first hard film; Wherein at least one of the second hard film surface or the first soft substrate surface comprises the second adhesive, or (b) the step of bonding the second hard film surface to the first soft substrate surface comprises: Providing the second hard film surface to the first flexible substrate surface or providing the second adhesive to the first flexible substrate surface;
Wherein bonding the first hard film surface to the carrier substrate and bonding the second hard film surface to the first soft substrate surface occur substantially simultaneously with each other.

18. The method according to any one of claims 15 to 17,
Further comprising forming the one or more electronic devices on a second flexible substrate surface of the flexible substrate, wherein the second flexible substrate surface is opposite the first flexible substrate surface.

19. The method according to any one of claims 14 to 18,
Wherein interposing the robust film between the carrier substrate and the flexible substrate comprises bonding the robust film to the flexible substrate to strengthen the flexible substrate.

20. The method according to any one of claims 14 to 19,
Separating the first hard film surface from the carrier substrate after interposing the hard film between the carrier substrate and the soft substrate; And
Further comprising substantially mitigating a stress formed in the flexible substrate with the robust film while the flexible substrate is separated from the carrier substrate.

An intermediate substrate comprising a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface, the first intermediate substrate surface being configured to be coupled to the carrier substrate by a first adhesive; And
A flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface, wherein the first flexible substrate surface is configured to be coupled to the second intermediate substrate surface by a second adhesive Wherein the second flexible substrate surface is configured such that when the first intermediate substrate surface is bonded to the carrier substrate and when the first flexible substrate surface is bonded to the second intermediate substrate surface, And a flexible substrate configured to be formed on the surface of the substrate.

22. The method of claim 21,
Further comprising the carrier substrate.

23. The method of claim 21 or 22,
Wherein the first adhesive agent bonds the first intermediate substrate surface to the carrier substrate and the second adhesive agent bonds the second intermediate substrate surface to the first flexible substrate surface To the electronic device structure.

24. The method according to any one of claims 21 to 23,
The first adhesive comprising an adhesive material;
Wherein the second adhesive comprises the adhesive material.

25. The method according to any one of claims 21 to 24,
Wherein the first adhesive comprises one of Henkel NS122 adhesive, EccoCoat 3613 adhesive, or pressure sensitive adhesive;
Wherein the second adhesive comprises one of the Henkel NS122 adhesive, the EccoCoat 3613 adhesive, or the pressure sensitive adhesive.

26. The method according to any one of claims 21 to 25,
Wherein the carrier substrate comprises at least one of alumina, silicon, steel, sapphire, barium borosilicate, soda lime silicate, or alkali silicate;
Wherein the flexible substrate comprises a soft glass material;
Wherein the intermediate substrate comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polyether sulfone, polyimide, polycarbonate, cyclic olefin copolymer, or liquid crystal polymer.

27. The method according to any one of claims 21 to 26,
Further comprising a nitride barrier layer between the second flexible substrate surface and the one or more electronic devices.

28. The method according to any one of claims 21-27,
And the one or more electronic devices on the second flexible substrate surface.

29. The method according to any one of claims 21 to 28,
Wherein the one or more electronic devices comprise one or more of an electronic sensor, an electronic display, an electronic transistor, an electronic diode, or a micro-electro-mechanical system.

30. The method according to any one of claims 21 to 29,
Wherein the intermediate substrate is configured to separate from the carrier substrate and the flexible substrate without damaging the one or more electronic devices or the flexible substrate.