KR20140096552A - Improved photoimaging - Google Patents

Improved photoimaging Download PDF

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Publication number
KR20140096552A
KR20140096552A KR1020130009233A KR20130009233A KR20140096552A KR 20140096552 A KR20140096552 A KR 20140096552A KR 1020130009233 A KR1020130009233 A KR 1020130009233A KR 20130009233 A KR20130009233 A KR 20130009233A KR 20140096552 A KR20140096552 A KR 20140096552A
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KR
South Korea
Prior art keywords
substrate
photopolymer
phototool
liquid photopolymer
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Prior art date
Application number
KR1020130009233A
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Korean (ko)
Inventor
찰스 조나단 케네트
존 커닝햄
로버트 깁슨
Original Assignee
레인보우 테크놀로지 시스템스 리미티드
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Priority to KR1020130009233A priority Critical patent/KR20140096552A/en
Publication of KR20140096552A publication Critical patent/KR20140096552A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F3/00—Colour separation; Correction of tonal value
    • G03F3/10—Checking the colour or tonal value of separation negatives or positives
    • G03F3/103—Checking the colour or tonal value of separation negatives or positives using tonable photoresist or photopolymerisable systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/0027—Devices or apparatus characterised by pressure means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting

Abstract

An apparatus and method for optical shaping are provided. In particular, the present invention is directed to an apparatus and method for optically shaping a substrate coated with a wet-curable photopolymerizable material, wherein the optically-shaped substrate is provided with an electrical circuit, for example a thin line, a rectangle, a spiral, a circle or other geometric and non- Are used to form images such as other shapes used in photochemical machine industry (PCMI) including geometric shapes.

Description

[0001] IMPROVED PHOTOIMAGING [0002]

The present invention relates to an apparatus and method for optical shaping. More particularly, the present invention relates to an apparatus and method for an optically shaped substrate covered with a wet-curable photopolymerizable material, wherein the optically-shaped substrate is an electrical circuit, for example a thin line, a rectangle, a spiral, And other shapes used in photochemical machine industry (PCMI) including non-geometric shapes.

Although there are existing techniques within the art to produce shapes suitable for forming thin lines and PCBs or structures in PCMI, many of these techniques suffer from a number of significant drawbacks. For example, many existing technologies suffer from insufficient resolution. In addition, high resolution technologies typically require complex devices such as sophisticated laser equipment. A further problem is that existing techniques require the use of a partially cured dry film of a photopolymer that is usually supported on a polyester (e.g., Mylar) film. Because of the undesirable undercutting (i.e., light shadowing) that occurs during the optical shaping process, the thickness of these dry films can cause detrimental effects on the resolution and / or meaning of the photo- I have. There are also problems in the process of adhering a partially cured dry film to a substrate and contamination problems that again cause problems in the optical shaping process. Partially cured dry films are also expensive when used in large quantities. Such systems are described in U.S. 4,888,270 and U.S. 4,954,421, which are incorporated herein by reference.

It is an object of at least one aspect of the present invention to mitigate or eliminate at least one of the aforementioned problems.

It is a further object of at least one aspect of the present invention to provide an improved method for optically shaped surfaces.

It is a further object of at least one aspect of the present invention to provide a cost-effective method for producing electrical circuitry with high resolution and small track widths (i.e. thin lines) or shapes for use in PCMI.

It is a further object of at least one aspect of the present invention to provide a cost effective method for producing high density electrical circuitry suitable for PCBs.

It is a further object of at least one aspect of the present invention to provide an improved method for optically shaped surfaces with high resolution and small track widths over large areas.

It is a further object of at least one aspect of the present invention to provide a method for shaping an inkjet deposit of a conductive material.

Embodiments of the invention are described, by way of example only, with reference to the accompanying drawings, in which:
Figure 1 is a partial side view of a three-layer structure in accordance with an embodiment of the present invention.
Figure 2 shows a sealed pouch according to an embodiment of the present invention.
3 is a side view of a substrate having a deposited photopolymerizable layer according to an embodiment of the present invention.
FIG. 4 is a side view of the substrate having the wet photopolymer layer shown in FIG. 3, wherein the phototool is used in an optical shaping process according to an embodiment of the present invention.
Figure 5 illustrates the process steps in the optical shaping process wherein phototools are being applied to both sides of the substrate during the optical shaping process according to an embodiment of the present invention.
6A and 6B illustrate an alternative optical shaping process in accordance with a further embodiment of the present invention.
7A is a cross-sectional view of an optical shaping process according to the prior art.
Figure 7b is a cross-sectional view of an optical shaping process in accordance with an embodiment of the present invention.
8A is a cross-sectional view of an optical shaping process according to the prior art showing growth occurring.
8B is a cross-sectional view of the optical shaping process according to an embodiment of the present invention showing the growth occurrence.
9A is a cross-sectional view of an optical shaping process according to the prior art showing a cured line width.
9B is a cross-sectional view of the optical shaping process according to an embodiment of the present invention showing the cured line width.

SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing cladding to a substrate; Depositing a liquid UV curable photopolymer on at least a portion of said coating to form a UV curable photopolymer film having a thickness of less than about 178 m (0.007 inches); Placing a phototool onto the liquid UV curable photopolymer; And applying radiation through the phototool to the liquid UV curable photopolymer to cure the photopolymer in the exposed region. ≪ RTI ID = 0.0 > [0008] < / RTI >

It is important that the present invention is free of pre-drying prior to shaping.

The present invention therefore relates to a method of photo-shaping a substrate covered with a wet-liquid curable photopolymerizable material, wherein said photo-shaped substrate forms an electrical circuit such as, for example, PCBs and a flat panel display, Can be used to create fine details such as geometric and non-geometric shapes. The invention may also relate to forming an image of the dielectric on dielectrics. Therefore, unlike many existing art techniques, the present invention relates to the use of wet films rather than expensive dry films such as Riston (trademark, DuPont). Dry films are considerably more expensive than the use of wet films. The use of 100% solids wet film also overcomes the need for pre-drying compared to currently used solvents based on wet film and results in a highly controllable process.

In the present invention, there is no drying step (i. E., Pre-drying step) before the wet photopolymer film is irradiated with, for example, UV radiation. This is in stark contrast to existing techniques for drying wet films before irradiation occurs.

It is preferred in the present invention that the photopolymerizable material can be substantially all solids, i. E. Zero or very small amounts of solvent may be present. This has surprisingly been found to provide improved visualization and resolution. However, the present invention also covers having a small amount of solvent present. And therefore may be less than about 1% solvent, less than about 3% solvent, less than about 10% solvent, or less than about 15% solvent in the present invention.

In particular, there is a three-layer structure used in the present invention in the embodiment. The lower layer is a substrate, the intermediate layer is the UV curable light polymer, and the upper layer is plastic or transparent plastic covered with a protective chemical layer.

The substrate coating may be made of any suitable material or composition, or it may include any suitable material or composition, for example metallic or non-metallic. As a result, it can be a metallic coating in certain embodiments, and a non-metallic coating in alternative embodiments.

The coating may extend partially or fully around the substrate. Alternatively, the substrate may include first and second surfaces and the coating may extend over one or both surfaces of the first and second surfaces of the substrate. The substrate can therefore be covered with the coating on one or both sides of the first and second sides of the substrate. The coating may be in the form of a film or layer attached to and / or adhered to the substrate.

Typically, the metal sheath comprises a conductive material or may be comprised of a conductive material. For example, the substrate, which may be a dielectric material, may be completely or at least substantially encapsulated by the metal sheath. The metal coating may comprise or consist of a conducting material such as any suitable metallic material. For example, suitable metals may be of the same type as copper, silver, gold, and the like.

Alternatively, the coating may be made or included with a conductive oxide or graphene, such as conductive polymers (PEDOTT), indium tin oxide (ITO).

In the non-metallic embodiments, the coating may comprise or consist of a dielectric material.

The substrate with the coating may be substantially flat and may range in size up to about 1 m x 1 m. The invention has the advantage that the device is virtually dimensionless on the substrate, except that the device actually forms the optical shaping process.

The liquid photopolymer is of the wet type (i.e., flowable type). The physical properties of the liquid light polymer can be matched to the requisite curing properties.

Typically, the liquid-state light polymer is less than or equal to about 150, 125, 100, 75, 50, 25, 10, 5, 1, Thickness. ≪ / RTI > Alternatively, the liquid-state light polymer may be present in an amount ranging from about 177 to about 0.1, about 125 to about 0.1, about 100 to about 0.1, about 75 to about 0.1, about 50 to about 0.1, From about 25 microns to about 0.1 microns, or from about 10 microns to about 0.1 microns. Preferably, the liquid photopolymer may have a thickness of about 5 占 퐉.

By using a thin liquid photopolymer film, low intensity radiation (e.g., UV light) can be used in the light shaping process.

The liquid photopolymer can be applied to only one or both the first and second sides of the substrate, wherein both the first and second sides of the substrate comprise a coating. Thus, the present invention will relate, for example, to single-sided or double-sided exposure as in the case of rear registration (see, for example, a single-sided exposure or a double- )

The liquid light polymer may be deposited in a substantially flat and continuous manner using any suitable technique. For example, the liquid photopolymer layer may be deposited using a spray, brush, roller and / or dip coating system.

Prior to application of the liquid light polymer, the substrate comprising the coating may be cleaned using a contact cleaning process to remove debris and / or contamination from the surface of the coating.

When the liquid photopolymer is applied to the substrate having the coating, the phototool may be disposed on the substrate. The compressive force then can be applied to the deposited liquid photopolymer. By applying a compressive force, the liquid photopolymer can be widened and / or squeezed such that a substantially flat, continuous film of photopolymer can be achieved with a substantially flat thickness. In particular embodiments, roller-based systems can be used to apply a compressive rolling force and can therefore be used to diffuse the liquid photopolymer. Typically, the rubber cylindrical roller can be rotated through a phototool applying a compressive force to the liquid photopolymer. The spreading out and / or squeezing may occur substantially simultaneously on both sides of the substrate. A particular function of the spreading out and / or squeezing is to substantially eliminate air and substantially prevent oxygen underneath the liquid light polymer from being trapped. There is no trapped air below the liquid light polymer and no oxygen. This overcomes the need to have a complex optical system and also provides significant improvements in the speed of the process because the trapped oxygen slows down the photo-shaping (i.e., curing) process.

The phototool is used in the optical shaping process. The phototool may be a negative or positive image of a desired electrical circuit and may allow light to penetrate portions other than the other portions of the phototool. The phototool can be made from a flexible plastic material and can be connected to a mechanism for accurately positioning the phototool on at least one or both sides of the substrate. The phototool can be tensioned and wound around rollers such as solid steel rollers. In particular embodiments, the phototool may also include a protective layer that allows the phototool to be easily peeled off from the substrate after shaping has occurred. The protective layer may be any suitable non-stick material. The protective coating has the additional advantage that it provides the ability to protect against chemical attack and humidity changes during the optical shaping process along the full length of the photostimulated area. This means that the humidity need not be maintained at a constant level while providing a more controllable process environment.

In further embodiments, the phototool may be made of an imaged material, a transparent plastic, or any other proprietary material capable of acting as an emissive coating to protect the plastics from chemical or moisture attack May be coated plastic.

The radiation used may be any suitable radiation to cure the liquid light polymer. In particular embodiments, UV radiation can be used to polymerize and / or harden and / or set the exposed liquid (e.g., wet) photopolymer. The UV radiation may have a wavelength of about 20400 nm and may have a specific intensity to cure the photopolymer used. Particularly preferred UV light sources may be UV LEDs, which produce very little heat, have a long lamp life, start up immediately, have no substantial reduction in power output, have low maintenance, And can produce a high level of light intensity. Therefore, LEDs can be used to print fine lines in an inexpensive optical shaping process according to the present invention. An alternative light source may be a digital mirror device (DMD) or a laser light source that is used to image the photopolymer immediately.

In particular embodiments of the present invention, the radiation may be collimated to improve the quality and / or resolution and / or definition of the optical shaping process.

At least one or both phototools can be precisely positioned by using a registration system on one or both sides of the substrate. The substrate may be disposed substantially vertically with at least one or both phototools being applied.

The optical shaping device of the present invention can be used to process about one panel of the substrate every about 10 seconds.

After applying the radiation of the optical shaping process, the liquid photopolymer not exposed to radiation can be removed using standard wash off or development processes.

The method of the present invention can also be self-contained in a mini-clean room that provides significant cost savings within the optical shaping process since no large industrial clean room is required.

Using the method described in the present invention, a high resolution fine line suitable for an electrical circuit can be obtained. Said thin line being less than or equal to about 200 탆; About 150 탆 or less; 140 μm or less; About 130 탆 or less; About 120 탆 or less; About 110 microns or less; About 100 microns or less; About 90 탆 or less; About 80 탆 or less; About 75 microns or less; About 70 microns or less; About 60 탆 or less; About 50 탆 or less; About 40 탆 or less; About 30 탆 or less; About 20 탆 or less; About 10 탆 or less; Or about 5 占 퐉 or less. Instead, the thin line is: greater than about 200 [mu] m; Greater than about 150 microns; Greater than about 100 microns; Greater than about 75 microns; Greater than about 50 microns; Greater than about 20 microns; Or greater than about 10 [mu] m. Instead, the thin line has the following: about 0.1200 mu m; About 1150 占 퐉; About 1100 [mu] m; About 20100 mu m or about 575 mu m. The thin lines can be used in PCBs and other electronic components such as flat screen displays.

The method of the present invention has the added advantage that all steps such as deposition of the liquid light polymer and removal of the phototool can occur in a single pass through the device according to the invention Lt; / RTI > For example, it may be desirable to deposit a liquid photopolymer on at least one or both sides of the substrate, to place the phototool (s) onto the liquid photopolymer on at least one side or both sides of the substrate, The application of a compressive force to the deposited liquid photopolymer and the radiation application of the liquid photopolymer to cure the photopolymer can all occur within a single pass through the optical shaping device of the present invention. Therefore, this one-step process provides an apparatus that increases the throughput of the photo-shaped substrate through the apparatus and is also easy to control and monitor.

The present invention has a number of advantages obtained by optical shaping through a much smaller depth as compared to the prior art. For example, the depth formed by a thin film of a photopolymer and an optional protective layer for the photolithography in which the photolithography can occur (the depth formed by the thin film of photopolymer and optionally a protective layer for the phototool through which the photoimaging may occur as follows: about 0.150 占 퐉; About 150 [mu] m; About 125 탆; About 110 [mu] m; About 1 占 퐉 or about 15 占 퐉. Typically, the depth formed by a thin film of photopolymer and an optional protective layer for the phototool may be about 8 microns. Having a relatively small depth provides reduced line growth through which optical shaping occurs and therefore very small line widths can be formed. The amount of line growth that occurs in the present invention can be determined, for example, using an illumination angle [theta] in vertical (see Figures 8a and 8b), of less than about 10 [micro] m; Less than about 5 탆; Less than about 2 microns; Less than about 1 micron; Less than about 0.84 m; Less than about 0.8 microns; Less than about 0.5 占 퐉; Or less than about 0.25 [mu] m. The invention can also be used in the electronics industry as well as in the Photo Chemical Machine Industries (PCMI).

The optical shaping can be assisted by a positioning device capable of precisely positioning the first and second carrier members, wherein the position ball on the first carrier member is received in the annular member on the second member do. This allows very accurate placement of the phototool.

According to a second aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing cladding to a substrate;

Depositing a liquid photopolymer on at least a portion of said coating to form a thin film of photopolymer;

Disposing a phototool onto the liquid photopolymer; And

Applying radiation through the phototool to the liquid photopolymer to cure the photopolymer layer in the exposed area;

A method of photoimaging a substrate is provided.

Also in the present invention, for example, there is no drying step (i.e. pre-drying step) before the film of wet photopolymer is irradiated with UV radiation.

According to a third aspect of the present invention there is provided a photo-shaped circuit formed according to the first or second aspect.

Typically, the optically-shaped circuit can be, for example, an electrical circuit that can be used in the manufacture of PCBs and flat panel displays.

According to a fourth aspect of the present invention, a dielectric image is provided on the dielectric formed according to the first or second aspect.

According to a fifth aspect of the present invention

At least one phototool that can be disposed on the liquid photopolymer on at least one side of the substrate having the coating;

A roller capable of applying a compressive force to the liquid photopolymer on the substrate having the coating to form a photopolymer film having a thickness of less than about 178 占 퐉 (0.007 inch); And

There is provided an apparatus for optically shaping a substrate, comprising a radiation source capable of curing the liquid photopolymer.

The coating may be made or constructed from any suitable material or composition, for example metallic or non-metallic.

Also in the present invention there is no drying step (i. E. Pre-drying step) before the film of the wettable photopolymer is irradiated with, for example, UV radiation. The apparatus therefore does not include a device for pre-drying the wet film of the photopolymer before applying the film to the source.

Said thin line being less than or equal to about 200 탆; About 150 탆 or less; 140 μm or less; About 130 탆 or less; About 120 탆 or less; About 110 microns or less; About 100 microns or less; About 90 탆 or less; About 80 탆 or less; About 75 microns or less; About 70 microns or less; About 60 탆 or less; About 50 탆 or less; About 40 탆 or less; About 30 탆 or less; About 20 탆 or less; About 10 탆 or less; Or about 5 占 퐉 or less. Instead, the thin line is: greater than about 200 [mu] m; Greater than about 150 microns; Greater than about 100 microns; Greater than about 75 microns; Greater than about 50 microns; Greater than about 20 microns; Or greater than about 10 [mu] m. Instead, the thin line has the following: about 0.1200 mu m; About 1150 占 퐉; About 1100 [mu] m; About 20100 mu m or about 575 mu m. The thin lines can be used in PCBs and other electronic components such as flat screen displays.

Typically, the compressive force can be applied on at least one or both of the phototools, wherein the phototool (s) applies the compressive force to the liquid photopolymer (whereupon the phototool (s) applies the compressive force to the liquid photopolymer) .

The apparatus may also include a collimating means to collimate the emitting radiation from the radiation source.

In particular embodiments, the radiation source may comprise LEDs and / or a laser light source or a DMD digital shaping device. Preferably, the radiation source is capable of emitting UV radiation.

The apparatus may also include positioning means for positioning at least one phototool on the substrate.

The device of the present invention also has the advantage of having a small footprint. This makes the device extremely adaptable. For example, the device may have a footprint of about 6 m X 2 m or much smaller.

The apparatus of the present invention may also have low power consumption because there is no required curing process for the wet film (i.e. without the pre-drying step). The device can therefore be operated at low power, such as less than about 10 kW or preferably less than about 5 kW. In comparison, existing techniques operate within a range of greater than about 100 kW. Therefore, the device of the present invention can provide about 50 times or even about 100 times improvement in energy consumption. The device can therefore have little environmental impact.

The device of the present invention may also be operated at high doses such as about 100 to 500 panels per hour or typically about 360 panels per hour.

The device can also be fully automated and therefore requires minimal manipulation. The device may also be easier to maintain.

According to a seventh aspect of the present invention,

At least one phototool that can be disposed on the liquid photopolymer on at least one side of the substrate having the coating;

A roller capable of applying a compressive force to the liquid photopolymer on the substrate having the coating to form a thin film of the photopolymer; And

A radiation source capable of curing the liquid photopolymer;

An apparatus for photo-shaping a substrate is provided.

The apparatus does not include an apparatus for pre-drying a wet film of a photopolymer before applying the film to the source.

According to an eighth aspect of the present invention

Providing a substrate;

Providing an inkjet deposit comprising conductive particles on at least one side of a substrate;

Depositing a liquid photopolymer on at least one side of the substrate comprising the inkjet deposit;

Disposing a phototool over the liquid photopolymer on at least one side of the substrate;

Applying a compressive force to the deposited liquid photopolymer to form a photopolymer film having a thickness of less than about 178 m (0.007 inches); And

Applying radiation to the liquid photopolymer to cure the photopolymer in the exposed region through the phototool;

A method of fabricating a track and / or an electrical circuit on a substrate is provided.

Typically, the inkjet depot may comprise conductive particles, such as seeding materials for initiating electroless plating of nickel or copper, such as silver, gold and / or a mixture of copper or palladium and tin.

Also, in the present invention, the film of the wettable photopolymer is free from a drying step (i.e., a pre-drying step), for example, before being irradiated with UV radiation.

The inkjet depot may have a width of about 50 microns to 500 microns, 50 microns to 250 microns, 75 microns to 150 microns, or typically about 100 microns. The inkjet depot can therefore be adjusted using the optical shaping concept described in the present invention. For example, the inkjet depot may be formed, for example, on a substrate of a plastic sheet. The inkjet depot can form an essentially required track on the plastic sheet. Typically, at least one or a plurality of tracks can be formed in the inkjet depot using the optical shaping concept described in the present invention.

According to a ninth aspect of the present invention

At least one phototool that can be disposed on the liquid photopolymer on at least one side of the substrate having the coating;

A roller capable of applying a compressive force to the liquid photopolymer on the substrate having the coating to form a thin film of the photopolymer; And

A radiation source capable of curing the liquid photopolymer;

An apparatus for photo-shaping a substrate is provided.

Also in the present invention, the film of the wet photopolymer is also free from a drying step (i. E., A pre-drying step) before being irradiated with, for example, UV radiation.

A rough description

Figure 1 shows an embodiment of the present invention comprising a substrate layer 12, a layer of intermediate UV-curable photopolymerization 14, and a transparent plastic or phototool, or preferably a protective layer that acts as a release coat and also provides both chemical and moisture resistance Layer structure 10 of the present invention, which can be embodied as an upper layer 16 which is a plastic or phototool (Fig. 1). Fig. 1 is a side view of a three-layer structure 10 of the present invention which is capable of being imaged It is a photocatalyst or a photocatalyst, which is a photocatalyst or a photocatalyst, which is a photocatalyst or a photocatalyst. as a release coat and also provides both chemical and moisture resistance.

As shown in FIG. 2, the sealing pouch 20 of the present invention may be formed. The sealing pouch 20 includes a sealing border 24 formed around the pouch of the liquid UV light polymer 22.

3 is a side view of a generally designed, laminated structure 100 in accordance with an embodiment of the present invention. The laminated structure 100 includes a substrate 110, such as a dielectric layer and a metal coating 112, on both sides. (The above description is for metal coatings below, but a similar process can also be used for non-metallic coatings.) There is a layer of liquid photopolymer 114 on top of the laminated structure 100. Therefore, the photopolymerizable layer 114 is wet. The liquid photopolymer layer 114 has a thickness of about 5 mu m. Although not shown in FIG. 3, the photopolymer layer 114 will be applied to both sides of the laminated structure 100.

The photopolymer layer 114 is deposited, among other things, on the laminated structure 100 in a substantially flat (even) continuous or at least substantially continuous manner using any suitable technique. For example, the photopolymer layer 114 is applied using a spray, brush, roller, and / or dip coating system. In the present invention, there is no drying step (i. E., A pre-drying step) before the film of the wettable photopolymer is irradiated with, for example, UV radiation.

When the photopolymer layer 114 is applied to the laminated structure 100, the phototool 116 is applied to the photopolymer layer 114. The phototool 116 is a negative (or positive) image of a desired electrical circuit and allows light to penetrate portions other than the rest of the phototool 116. The phototool is made from a flexible plastic material or possibly from glass or even possibly from plexiglass.

Fig. 4 shows the phototool 116 applied to the laminated structure 100. Fig. After the phototool 116 is applied to the laminated structure 100 comprising the liquid photopolymer 114, a compression device may be used to ensure that the flat spread of the photopolymer 114 is substantially < RTI ID = 0.0 > (A compression system is used to spread out and / or squeeze the photopolymer 114 so that an even spread of the photopolymer 114 is achieved the phototool 116 and the substrate cladding 112.). The compression device also ensures that oxygen is trapped below the photopolymer 114 for lack of air. For example, a roller-based system is used to apply a compressive force and spread the photopolymer 114. Therefore, a rubber cylindrical roller can be used to spread the photopolymer 114. This can be on both sides of the laminated structure 100. This overcomes the need to have complex optical systems including parabolic mirrors by removing all air and oxygen.

As shown in FIG. 4, UV radiation may be used to polymerize and / or harden and / or set the exposed liquid photopolymer 114. The UV radiation has a wavelength of about 200400 nm and has the intensity adjusted to cure the exposed liquid light polymer 114. Although any suitable UV light source may be used, UV LEDs are particularly suitable, because they produce very little heat, have a long lamp life, are instantly started, and have a substantial fall-off in power output Low maintenance, and can produce light with a high level of intensity. Thus, LEDs can be used to produce fine lines, rectangles, spirals, circles, or other geometric and non-geometric shapes in an inexpensive optical shaping process. Instead, a laser light source or a DMD digital shaping unit is used. An important advantage to be noticed is that there is no need for partially cured dried films of photopolymer (e.g. Riston, trade name DuPont), which significantly reduces any line growth while the shaping process provides a significantly improved resolution (eg, Riston, Trade Mark, DuPont) are required to significantly reduce any line growth during the imaging process. Therefore, the resolution of the method of the present invention is enhanced by not having a partially cured dry film or by overcoming the need to have a pre-dry solvent based wet resistance (The resolution of the present invention is enhanced by over-the-cured dry films or pre-dried solvent based wet resists).

Figure 5 shows an optical shaping device according to the present invention showing the laminated structure 100 being substantially vertically aligned in the device, wherein the phototool 116 is applied to both sides of the laminated structure 100. The phototool 116 becomes taut and extends around the rollers 118,120. Advantageously, the phototool 116 has a surface attraction to the photopolymer 114 and is self-adhesive to the photopolymer 114 through weak interactive forces such as van der Waals and / or electrostatic forces. stick '. The phototool 116 may also include a protective non-adhesive layer that facilitates removal (i.e., peeling) of the phototool 116 from the laminated structure 100 when shaping occurs.

Although not shown, a registration system is used to accurately align the phototools 116 on both sides of the laminate structure.

The optical shaping device may be used to process about one panel of the laminated structure 100 every 10 seconds. When the optical shaping occurs, the phototool 116 is removed from the laminated structure 100 using any suitable mechanical means. The photo-shaping process is very fast because air and oxygen are not trapped under the liquid light polymer 114. Thus, this provides a drying time for the photopolymer 114 of less than about 5 seconds or preferably less than 1 second.

After the photo-shaping process, the liquid photopolymer 114 that is not exposed to UV radiation is removed, for example, using an aqueous alkaline solution through a cleaning procedure. A standard chemical etching process may then be used. For example, acids or alkalis can be used to make dielectric substrates that contain the requisite metal (i.e., copper) circuits covered with polymerized photopolymerizable materials. The polymerized photopolymer can then be removed to produce a substrate having the requisite electrically conductive circuitry.

The apparatus described in the present invention can also be fully embedded in a local clean room that provides significant cost savings within the optical shaping process.

Using this method as described in the present invention, high-resolution thin lines suitable for electrical circuits and shapes such as rectangles, spirals, circles or other geometric and non-geometric shapes in PCMI are obtained. The thin lines, rectangles, spirals, circles, or other geometric and non-geometric shapes may include: less than or equal to about 200 탆; About 150 탆 or less; 140 μm or less; About 130 탆 or less; About 120 탆 or less; About 110 microns or less; About 100 microns or less; About 90 탆 or less; About 80 탆 or less; About 75 microns or less; About 70 microns or less; About 60 탆 or less; About 50 탆 or less; About 40 탆 or less; About 30 탆 or less; About 20 탆 or less; About 10 탆 or less; Or about 5 占 퐉 or less. Instead, the thin line is: greater than about 200 [mu] m; Greater than about 150 microns; Greater than about 100 microns; Greater than about 75 microns; Greater than about 50 microns; Greater than about 20 microns; Or greater than about 10 [mu] m. Instead, the thin line has the following: about 0.1200 mu m; About 1150 占 퐉; About 1100 [mu] m; About 20100 mu m or about 575 mu m.

The thin lines can be used in PCBs and other electronic components such as flat screen displays.

The present invention can be used in the electronics industry as well as in the Photochemical Machine Industry (PCMI).

The optical shaping may also be assisted by a positioning device capable of precisely positioning the first and second carrier members, wherein a locating ball on the first carrier member engages a ring on the second member Shaped member. This allows very accurate placement of the phototool.

Figures 6a and 6b illustrate an alternative optical shaping process in accordance with the present invention. 6A shows the deposit of the ink from the ink jet. The inkjet depot 200 is generally designated. The inkjet deposition 200 includes conductive particles such as seeding materials for initiating electroless plating of nickel or copper, such as silver, gold and / or a mixture of copper or palladium and tin. As shown in FIG. 6A, the inkjet deposition 200 has a series of outer undulations 202 due to the ink that does not have a straight surface but is deposited in a series of droplets. The inkjet deposition 200 has a width 'd' of about 100 μm. It is difficult to form a line track for an electric circuit while using such an inkjet deposit 200. However, the inkjet depot 200 can be adjusted using the optical shaping concept described in the present invention. For example, the inkjet depot 200 may be formed on a plastic sheeting. The inkjet deposition 200 is used to form an almost exact required electrically conductive track on the plastic sheeting. As mentioned above, the process is also used to improve the quality of formed tracks. As mentioned above, the photopolymer is applied over plastic sheeting. The phototool is then applied to the plastic sheeting, and the radiation is applied after the compressive force is applied. As shown in FIG. 6B, the applied optical shaping can be used to produce an improved track 210 within the inkjet depot 200. For example, if the ink-jet depot 200 has a width 'd' of about 100 μm, a number of individual high-resolution tracks can be formed within an existing single track formed by the ink-jet depot. For example, four tracks can be formed within a 100 [mu] m ink deposit track.

Figures 7a and 7b are a comparison of the present process and existing technology processes currently in use. FIG. 7A relates to a conventional technology process 300 that is generally designed. 7A shows a dry film layer 312 having a thickness of about 35 mu m remaining on the upper layer of the copper panel 310, a protective Mylar layer 314 having a thickness of about 25 mu m, and an emulsion protection Lt; RTI ID = 0.0 > 310 < / RTI > A thin line or track image 320 is also visible. Figure 7b relates to a process 400 in accordance with the present invention as generally contemplated. 7B shows that there is a copper panel 410, a wet photopolymer layer 412 having a thickness of about 5 mu m, and an ultra thin protective film 414 having a thickness of about 3 mu m used for the phototool 416. Fig. A thin line or track image 418 is also visible. Figures 7A and 7B clearly show that the process of the present invention provides much smaller depths because photo-shaping must occur. Process 400 of the present invention 300 imaged through an overall thickness of about 8 microns whereas the prior art process 300 shown imaged through a total thickness of about 69 microns. There is also no need for a mylar layer.

Figures 8a and 8b show additional advantages of the present invention in relation to line growth. Figure 8a shows that there is a small line growth of about 0.84 占 퐉 in the process 400 of the present invention while there is a large line growth of about 14.5 占 퐉 in the process 300 of the prior art. Small line growth in the present invention can be achieved by having a much reduced depth through the occurrence of the optical shaping, which significantly shrinks the shaded area compared to a shaded area at a greater depth in FIG. 8A. This is related to the comparison of the formation of 20 [mu] m tracks with [theta] = 6 [deg.] In Figures 8a and 8b (Relate to the formation of a 20 [ 6 °).

Figures 9a and 9b show a further advantage of the present invention relating to the cured line widths in which the light sources 350 and 450 are respectively used. Both Figures 9a and 9b relate to a comparison of the formation of a 20 m space with &thetas; = 6 DEG. The resulting cured line width in the present invention process 400 is 21.7 占 퐉 (only 8% line growth is shown), whereas the resultant cured line width is 49 占 퐉 (145% will be.

Although specific embodiments of the invention have been described above, departures from the described embodiments will still fall within the scope of the present invention. For example, any suitable type of substrate will be used. The coating may also be metallic or non-metallic. Moreover, any suitable liquid light polymer or combination thereof will be used. In addition, any mechanical means may be used to apply a compressive force to the deposited liquid photopolymer to form a thin film of trapped air and oxygen free material (any mechanical means may also be used to apply a compressive force to the deposited liquid photopolymer to form a thin film of material with no trapped air and oxygen underneath. The radiation used may be of any suitable wavelength capable of curing the liquid light polymer.

Claims (46)

Providing cladding to the substrate;
Depositing a liquid photopolymer on at least a portion of said coating to form a photopolymer film having a thickness of less than about 178 m (0.007 inches);
Disposing a phototool onto the liquid photopolymer; And
Applying radiation through the phototool to the liquid photopolymer to cure the photopolymer in the exposed area;
Wherein the substrate is photoimaged.
The method according to claim 1,
Wherein the liquid photopolymer is free of pre-drying prior to curing of the liquid light polymer.
3. The method according to claim 1 or 2,
Wherein the photopolymer comprises less than about 1% solvent, less than about 3% solvent, less than about 10% solvent, or less than about 15% solvent.
3. The method according to claim 1 or 2,
Wherein the photopolymer is substantially all solid, i. E., The amount of solvent present is zero.
5. The method according to any one of claims 1 to 4,
Wherein the coating is metallic or non-metallic or alternatively the layer of seeding material is deposited on plastics that can act as an initiator to allow electroless plating of copper or nickel A method of photo-shaping a substrate.
6. The method of claim 5,
Wherein the coating comprises a conductive material such as a conductive oxide such as a conductive polymer (PEDOTT), graphene, or tin oxide (ITO) on the first and second sides of the substrate.
7. The method according to any one of claims 1 to 6,
Wherein the substrate is a dielectric material.
8. The method according to any one of claims 1 to 7,
Wherein the coating is metallic and comprises any one or combination of copper, silver and gold.
9. The method according to any one of claims 1 to 8,
Wherein the substrate having the coating is substantially flat and has a size of up to about 1 m x 1 m.
10. The method according to any one of claims 1 to 9,
Wherein the liquid photopolymer is deposited in a thickness of less than about 150, 125, 100, 75, 50, 25, 10, 5, 1, 0.5 or 0.1 microns Method of optical shaping.
11. The method according to any one of claims 1 to 10,
Wherein the liquid photopolymer is present in an amount ranging from about 177 to about 0.1, about 125 to about 0.1, about 100 to about 0.1, about 75 to about 0.1, about 50 to about 0.1, 0.1 μm or from about 10 μm to about 0.1 μm.
12. The method according to any one of claims 1 to 11,
Wherein the liquid photopolymer is applied to both sides of the substrate at the same time.
13. The method according to any one of claims 1 to 12,
Wherein the liquid photopolymer is deposited in a substantially and / or continuously manner.
14. The method according to any one of claims 1 to 13,
Wherein the liquid photopolymer is deposited using an inkjet deposition technique, a spray, a brush, a roller, and / or a dip coating system.
15. The method according to any one of claims 1 to 14,
Wherein when the liquid photopolymer is applied to the substrate having the coating and the phototool is disposed on the substrate, a compressive force is applied to the deposited liquid photopolymer.
16. The method of claim 15,
Wherein the liquid photopolymer is widened and / or compressed by applying the compressive force to achieve a substantially flat continuous film of photopolymer with a substantially flat thickness. Liquid photopolymer is spread out and / or squeezed so even in a continuous film of photopolymer.
17. The method according to claim 15 or 16,
Wherein the compressive force is a roller-based system that applies a compressive rolling load.
18. The method according to any one of claims 1 to 17,
Wherein the phototool is a negative or positive image of a desired electrical circuit.
19. The method according to any one of claims 1 to 18,
Wherein the phototool is connected to a mechanism for accurately positioning the phototool on at least one or both sides of the substrate having the coating.
20. The method according to any one of claims 1 to 19,
Wherein the phototool does not include a protective layer.
20. The method according to any one of claims 1 to 19,
Wherein the phototool comprises a protective layer that allows the phototool to be easily peeled off from the substrate having the coating after imaging occurs.
22. The method according to any one of claims 1 to 21,
Wherein the radiation is UV radiation.
23. The method according to any one of claims 1 to 22,
Wherein a UV LED or a laser is used as said source of radiation.
24. The method according to any one of claims 1 to 23,
Wherein the radiation is collimated or partially collimated to improve the quality of the optical shaping process.
25. The method according to any one of claims 1 to 24,
A series of wet processes, including a wash-off process, are performed to produce an electrical circuit.
26. The method according to any one of claims 1 to 25,
Wherein the method is performed in a self-contained mini-clean room.
27. The method according to any one of claims 1 to 26,
The optical shaping process may be performed using a fine line and / or a pattern having a line and / or a width of about 200, 150, 140, 130, 120, 110, 100, 90, 80, 70, (PCMI) features such as lines, rectangles, spirals, circles, or other geometric and non-geometric shapes of less than 50 μm, 40 μm, 30 μm, 20 μm, 10 μm or 5 μm, ≪ / RTI > wherein the substrate is optically shaped.
28. The method according to any one of claims 1 to 27,
Depositing a liquid photopolymer on at least one or both sides of the substrate;
Placing a phototool over the liquid photopolymer on at least one side or both sides of the substrate;
Applying a compressive force to the deposited liquid photopolymer to form a film of the photopolymer; And
Applying radiation to the liquid photopolymer to cure the photopolymer;
Wherein each of said processes proceeds in either a single pass or a series of discrete passes. ≪ RTI ID = 0.0 > 11. < / RTI >
29. The method according to any one of claims 1 to 28,
Wherein there is no pre-drying step of the photopolymer wet film prior to radiation exposure.
An electronic component produced according to the method of any one of claims 1 to 29.
31. The method of claim 30,
Wherein the electronic component is an electric circuit.
31. The method of claim 30,
Wherein the electronic component is included in a PCB or a flat screen display.
31. The method of claim 30,
Wherein the electronic component is an image of a dielectric on dielectrics.
29. Forms used in a photochemical machine industry (PCMI), including thin lines, rectangles, spirals, circles or other geometric and non-geometric shapes, prepared in accordance with one of the preceding claims.
At least one phototool that can be disposed on the liquid photopolymer on at least one side of the substrate having the coating;
A roller capable of applying a compressive force to the liquid photopolymer on the substrate having the coating to form a photopolymer film having a thickness of less than about 178 占 퐉 (0.007 inch); And
A radiation source capable of curing the liquid photopolymer;
And wherein the substrate is optically shaped.
36. The method of claim 35,
Wherein said coating is metallic or non-metallic.
36. The method of claim 35,
The apparatus may comprise a thin line and / or, for example, about 200, 150, 140, 130, 120, 110, 100, 90, 80, 70, 60, (PCMI), such as lines, rectangles, spirals, circles, or other geometric and non-geometric shapes of less than 30 urn, 20 urn, 10 urn or 5 urn, Lt; / RTI >
37. The method according to any one of claims 35 to 37,
The apparatus comprising positioning means for positioning at least one or both phototools on at least one or both sides of the substrate.
Providing a substrate;
Providing an inkjet deposit comprising conductive particles on at least one side of a substrate;
Depositing a liquid photopolymer on at least one side of the substrate comprising the inkjet deposit;
Disposing a phototool over the liquid photopolymer on at least one side of the substrate;
Applying a compressive force to the deposited liquid photopolymer to form a photopolymer film having a thickness of less than about 178 m (0.007 inches); And
Applying radiation to the liquid photopolymer to cure the photopolymer in the exposed region through the phototool;
/ RTI > A method of fabricating a track and / or an electrical circuit on a substrate.
40. The method of claim 39,
Wherein the inkjet depot forms an approximate required track and / or electrical circuit on the substrate. ≪ Desc / Clms Page number 20 >
41. The method according to claim 39 or 40,
The conductive particles may be coated on the substrate with at least one of a track and / or a layer of metal, including any or a combination of silver and / or copper, or seeding materials for initiating electroless plating of nickel or copper, such as a mixture of palladium and tin A method for manufacturing an electric circuit.
42. The method according to any one of claims 39 to 41,
Wherein the inkjet depot has a width of from about 50 mu m to about 500 mu m.
43. The method according to any one of claims 39 to 42,
Wherein the substrate is fabricated from a plastic sheet.
44. The method according to any one of claims 39 to 43,
Wherein an etching process is performed to produce an electrical circuit after said optical shaping has occurred.
45. The method according to any one of claims 39 to 44,
Wherein at least one or a plurality of tracks are formed in the inkjet deposit.
45. The method according to any one of claims 39 to 44,
Wherein the pre-drying step of the photopolymer wet film prior to radiation exposure is absent.
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