KR20120031698A - Method of fabricating display device using flexible plastic substrate - Google Patents

Abstract

PURPOSE: A method for manufacturing a display device using a plastic board is provided to reduce product manufacturing costs by deleting initial facility costs. CONSTITUTION: A plurality of first bonding reinforcing patterns(105) is formed on a bonding alleviating layer(102). A second bonding reinforcing pattern(106) is formed on the outside of gate and data pad units. A plastic board(110) is formed on a frontal side of a carrier board(101). A plurality of components for image implementation are formed on each display device area on the plastic board. The outside of each display device area is cut by a cutting wheel(197). The plastic board is separated from the carrier board.

Description

Method of fabricating display device using flexible plastic substrate

The present invention relates to a method of manufacturing a display device, and more particularly, to enable a flexible substrate to be easily detached from a carrier substrate without using expensive laser equipment, and to prevent misalignment when attaching an external driving circuit. An electrophoretic display and a method of manufacturing the same.

In general, liquid crystal displays, plasma displays, and organic field displays have become mainstream display devices. However, recently, various types of display devices have been introduced to satisfy rapidly changing consumer demands.

In particular, with the advancement and portability of the information usage environment, the company is accelerating to realize light weight, thin film, high efficiency and color video. As a part of this, research on electrophoretic display devices combining only the advantages of paper and existing display devices is being actively conducted.

The electrophoretic display device is in the spotlight as a next generation display device having an advantage of ease of portability, and unlike a liquid crystal display device, it does not require a polarizing plate, a backlight unit, a liquid crystal layer, etc., thereby reducing manufacturing costs.

Hereinafter, a conventional electrophoretic display device will be described with reference to the accompanying drawings.

1 is a view briefly showing a structure of the electrophoretic display to explain the driving principle.

As shown in the drawing, the conventional electrophoretic display device 1 includes an ink layer 57 interposed between the first and second substrates 11 and 36 and the first and second substrates 11 and 36. Include. The ink layer 57 includes a plurality of capsules 63 filled with a plurality of white pigments 59 and black pigments 61 charged through a condensation polymerization reaction.

Meanwhile, a plurality of pixel electrodes 28 connected to a plurality of thin film transistors (not shown) are formed in each pixel area (not shown) on the first substrate 11. That is, the plurality of pixel electrodes 28 are selectively applied with a positive voltage or a negative voltage, respectively. In this case, when the size of the capsule 63 including the white pigment 59 and the black pigment 61 is not constant, only a capsule 63 having a predetermined size may be selectively used.

Applying a voltage of positive or negative polarity to the ink layer 57 described above, the charged white pigments and black pigments 59 and 61 inside the capsule 63 are attracted toward opposite polarities. . That is, when the black pigment 61 moves upward, black is displayed. When the white pigment 59 moves upward, white is displayed.

The electrophoretic display device 1 having the above-described configuration uses a pixel light including external light including natural light or room light as a light source and is selectively applied with a positive polarity or a negative polarity by the thin film transistor Tr. (28) induces a positional change of the plurality of white pigments (59) and the black pigments (61) filled in the capsule (63) to implement an image or text.

The electrophoretic display device 1 having the above-described configuration can be manufactured by greatly proceeding two processes. The first process is an array process for completing the array substrate 11 including the pixel electrode 28 including the thin film transistor Tr, and the second process is to attach the electrophoretic film 60 to the array substrate 11. It is a film laminating process which completes the display apparatus 1 by this.

On the other hand, in view of the low power consumption and light weight, such an electrophoretic display device is mainly used as an e-book or an electronic paper, a low power consumption situation, especially when used as an electronic paper, it is required to have flexibility for easy portability.

Therefore, recently, the electrophoretic display has been commercialized based on a plastic substrate having a thickness of about 10 μm to about 200 μm in order to maximize flexibility. In the case of manufacturing an electrophoretic display using a flexible plastic substrate, the flexible nature of the plastic substrate causes problems between the use of unit processing lines and difficulty in maintaining a flat state on the stage. A separate carrier substrate that can maintain a flat state on the stage is separately provided to bond the plastic substrate to the carrier substrate, and then the carrier substrate is removed in a later step to complete an electrophoretic display device having excellent flexibility.

2A through 2D are cross-sectional views illustrating a part of a process of manufacturing a conventional electrophoretic display device.

First, as illustrated in FIG. 2A, hydrogenated hydrogen gas is generated on a glass carrier substrate 5 capable of laser beam transmission by generating a hydrogen gas by laser beam irradiation to enable detachment with a plastic substrate. Amorphous silicon (a-Si: H) is deposited to form the laser ablation layer 7.

Next, as illustrated in FIG. 2B, the plastic substrate 11 is formed by coating the plastic in a liquid state on the ablation layer 7 and continuously heat treating it.

Next, as shown in FIG. 2C, a plurality of gates and data lines (not shown) 19 that cross each other on the plastic substrate 11, a thin film transistor Tr, and a drain electrode of the thin film transistor Tr A pixel electrode 28 connected to 22 is formed. At this time, by forming the thin film transistor Tr and the pixel electrode 28, an array substrate for an electrophoretic display device is completed.

Thereafter, as illustrated in FIG. 2D, the hydrogenated amorphous silicon constituting the ablation layer 7 is irradiated with the laser beam LB through the laser beam irradiation apparatus 99 to the rear surface of the carrier substrate 5. By discharging hydrogen (H) gas from a-Si: H, the plastic substrate 11 having the thin film transistor Tr is detached from the carrier substrate 5.

Subsequently, although not shown in the drawings, an electrophoretic film (not shown) including an electrophoretic ink layer and a common electrode is formed on the thin film transistor Tr with respect to the plastic substrate 11 detached from the carrier substrate 5. The electrophoretic display device is completed by further performing a laminating process to attach the protective film and attaching a protective film on the electrophoretic film (not shown).

However, the conventional electrophoretic display device, which is completed by the above-described steps, uses an expensive laser beam (LB) irradiation device 99 when the plastic substrate 11 is detached from the carrier substrate 5. In this case, the manufacturing cost is increased, and the time for irradiating the laser beam LB on the entire surface of the carrier substrate 5 varies depending on the size of the area of the plastic substrate 11. Relatively, manufacturing productivity per unit time is falling.

In addition, the product production yield is deteriorated by causing a defect such as deterioration of the characteristics of the thin film transistor Tr by laser beam LB irradiation or disconnection of the gate and data wirings 19 (not shown). It is true.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to reduce the manufacturing cost by reducing the flexible plastic substrate from the carrier substrate without the use of expensive laser beam irradiation apparatus, to reduce the manufacturing time per unit time, and to the laser beam irradiation It is an object of the present invention to provide a method for manufacturing an electrophoretic display device which can prevent a defect caused by the product and improve the production yield of the product.

According to an aspect of the present invention, there is provided a method of manufacturing a display device using a flexible plastic substrate, wherein a plurality of display device regions, each of which forms a display device after cutting, are defined on a front surface of a carrier substrate. Forming a bonding mitigating layer made of an inorganic material; Forming a plurality of first bonding reinforcement patterns having a first width and a first thickness as a metal material on the junction alleviation layer, and corresponding to the gate and data pad portions provided in the respective display device regions, and forming the first bonding strengthening pattern. Forming a second bond reinforcement pattern having a second width with the same material as the first bond reinforcement pattern; Forming a plastic substrate by applying a liquid plastic to the entire surface of the carrier substrate over the first and second bonding reinforcement patterns and performing heat treatment; Forming a plurality of components for implementing an image in each display area on the plastic substrate; Cutting the outside of each display device area using a cutting wheel to separate the display panels into each display panel; Separating the plastic substrate from the carrier substrate in each of the display panels.

In addition, the carrier substrate is a glass material, the inorganic material is silicon oxide (SiO ₂ ) or silicon nitride (SiNx), the metal material is molybdenum (Mo), molybdenum tungsten (MoW), aluminum (Al), aluminum alloy (AlNd), copper (Cu), molybdenum (MoTi), amorphous indium-tin-oxide (a-ITO), indium-gallium-zinc-oxide (IGZO), and wherein the first The width is 1 μm to 500 μm, the second width is 0.5 μm to 5 μm, the first thickness is 50 μs to 150 μm, and the bonding relaxation exposed to the outside of the first bond strengthening pattern with respect to the entire surface of the carrier substrate. The area ratio of the area of the layer to the first bonding reinforcement pattern is 90:10 to 99: 1. In addition, the average bonding force between the carrier substrate and the plastic substrate bonded through the bonding relaxation layer and the first and second bonding reinforcing patterns is 10 gf / cm 2 to 100 gf / cm 2.

The first bonding reinforcement pattern may have any one of a shape that borders the display device area outside the display device area, a plurality of spaced stripe shapes, and a lattice shape having a plurality of openings on the carrier substrate. It is characteristic to form.

According to still another aspect of the present invention, there is provided a method of manufacturing a display device using a flexible plastic substrate, comprising: a plurality of display device regions each of which forms a display device after cutting, and an amino acid on a carrier substrate having a removal region defined outside thereof. Partial application of a junction improver composed of a silane-based material and an organic solvent results in a first junction improvement pattern having a particular shape, and a first junction improvement outwardly corresponding to gate and data pad portions provided in the respective display device regions. Forming a second bond improvement pattern made of the same material as the pattern; Forming a plastic substrate by applying a liquid plastic to the entire surface of the carrier substrate and heat-treating the first and second bonding improving patterns; Forming a plurality of components for implementing an image in each display area on the plastic substrate; Cutting the outside of each display device area using a cutting wheel to separate the display panels into each display panel; Separating the plastic substrate from the carrier substrate in each of the display panels.

The method may also include drying the first and second bonding improvement patterns before forming the plastic substrate.

In addition, the bonding improving agent is characterized by consisting of 0.1% to 10% by weight of the amino silane-based material and 99.1% to 90% by weight of the organic solvent.

The first and second bonding improving patterns may be formed using any one of a syringe, a brush, and a roller, and the first bonding improving pattern is formed on the entire surface of the removal region outside the display device region. Alternatively, the display device may be formed in a shape that borders the display device area, or may be formed to have a plurality of stripe shapes and grids on the entire surface of the carrier substrate without dividing the display device area and the removal area.

In addition, the plastic substrate is separated from the carrier substrate in response to a width of 1 mm to 2 mm along the edge of each display panel, which is a part cut during the cutting using the cutting wheel. Corresponding to the data pad portion, it is characterized in that the lifting is prevented by the second junction reinforcement pattern provided outside the gate and the data pad portion.

In the forming of the plurality of components for implementing an image in each display device area on the plastic substrate, the plurality of pixel areas may be intersected with each other through an insulating layer corresponding to each display device area on the plastic substrate. A gate wiring and a data wiring to be defined, a thin film transistor connected to the gate and data wiring, a gate pad and a first alignment mark connected to the gate wiring in the gate pad portion, and a data wiring connected to the data wiring in the data pad portion. Forming a data pad and a second align mark; Forming a pixel electrode connected to the thin film transistor in each pixel region in each display device region; Attaching an electrophoretic film while exposing the gate and data pad portions corresponding to a display area for displaying an image in each display device area; Bonding the first and second alignment marks to the gate and data pad parts, and then bonding an external driving circuit board. In this case, the electrophoretic film includes an ink layer including a base film, a common electrode sequentially stacked below the base film, and a plurality of capsules filled with a plurality of white pigments and black pigments charged through a condensation polymerization reaction; And an adhesive layer, wherein the attaching of the electrophoretic film is characterized in that the ink layer is positioned between the common electrode and the pixel electrode and is in contact with the adhesive layer and the pixel electrode.

The method may further include forming a color filter layer over the electrophoretic film before bonding the external driving circuit board.

In addition, the separation of the plastic substrate and the carrier substrate is made by applying a force to one side in a state in which one end surface of the plastic substrate with a plurality of components for the image realization is tightly fixed using a close fixing means or It is characterized by the worker's manual work.

The manufacturing method of the display device using the flexible plastic substrate according to the present invention does not require an expensive laser beam irradiation apparatus by detaching the plastic substrate from the carrier substrate without irradiating the laser beam through the laser beam irradiation apparatus, so that the initial facility investment cost There is an effect of reducing the manufacturing cost of the product by elimination.

In addition, since defects such as deterioration of characteristics of the thin film transistor and disconnection of the wiring due to laser beam irradiation can be prevented at the source, there is an effect of improving the yield.

By separating from the carrier substrate within a few seconds immediately after the cutting process proceeds the separation time of the plastic substrate per unit time is reduced by several tens of times compared to the conventional has the effect of improving the product productivity per unit time.

In addition, an adhesive force reinforcement pattern is provided corresponding to the gate and data pad portion to which the external driving circuit board is attached to prevent the plastic substrate from being lifted when cut to the outside of the plastic substrate. Lifting is prevented, thereby preventing the misalignment caused by the misalignment recognition mark generated by lifting when the external drive circuit board is attached.

1 is a view for explaining a driving principle of an electrophoretic display.
2A to 2D are cross sectional views of a portion of a process of manufacturing a conventional electrophoretic display.
3A to 3H are cross-sectional views illustrating manufacturing steps of an electrophoretic display device having a flexible plastic substrate according to a first embodiment of the present invention.
4A to 4C illustrate planar shapes of first and second bonding reinforcement patterns formed on a carrier substrate in an electrophoretic display device according to a first embodiment of the present invention.
5A through 5C are cross-sectional views illustrating manufacturing steps of an electrophoretic display device having a flexible plastic substrate according to a second exemplary embodiment of the present invention.

Hereinafter, a manufacturing method of an electrophoretic display device using a flexible plastic substrate according to the present invention will be described with reference to the accompanying drawings.

First, in the method of manufacturing an electrophoretic display using the flexible plastic substrate according to the first embodiment of the present invention, the characteristics of the inorganic material and the metal material used for controlling the bonding force between the carrier substrate and the plastic substrate will be described. .

Table 1 measures the contact angle and bonding force between the plastic substrate and each material.

Material layer Contact angle (degrees) Bonding force (gf / ㎠) Silicon Oxide (SiO ₂ ) 52.4 3.39 Silicon Nitride (SiNx) 48.1 3.85 Amorphous indium-tin-oxide (a-ITO) 6.2 554.68 Aluminum Alloy (AlNd) 5.6 132.82 Copper (Cu) 2.5 Measurement not possible (over 600) Molecular Titanium (MoTi) 8.7 328.54

Referring to Table 1, the contact angle between the plastic substrate (110 in FIG. 3C) and the inorganic material, for example, silicon oxide (SiO ₂ ) or silicon nitride (SiNx) has a relatively large angle and the metal material has a relatively small value. It can be seen that. That is, the contact angles of the inorganic materials with respect to the surface of the plastic substrate (110 in FIG. 3c) all have a large angle of 45 degrees or more, indicating a weak cohesion force on the surface. Therefore, the bonding force with the plastic substrate (110 in Fig. 3c) has a value less than 5gf / ㎠.

On the other hand, the metal material on the surface of the plastic substrate (110 in Figure 3c), for example, amorphous indium-tin-oxide (a-ITO), aluminum alloy (AlNd), copper (Cu), molybdenum (MoTi) are all 10 degrees It has a smaller contact angle, and it can be seen that the bonding force with the plastic substrate (110 in FIG. 3C) has a value larger than 100 gf / cm 2 due to this characteristic.

Therefore, by using the difference in the bonding strength between the inorganic material and the metal material on the plastic substrate (110 in FIG. 3c), the bonding relaxation layer (Fig. By forming the bonding reinforcement pattern 105 and 102 of 3a, the overall bonding force between the carrier substrate (101 of FIG. 3a) and the plastic substrate (110 of FIG. 3c) can be controlled.

As in the first embodiment of the present invention, the bonding relaxation layer 102 made of an inorganic material having a relatively weak bonding force with the plastic substrate (110 of FIG. 3C) and the bonding strengthening pattern 105 made of a metal material having a relatively strong bonding force When the ratio of the area is formed to be about 99: 1 to 90:10, the bonding force between the entire plastic substrate (110 in FIG. 3C) and the carrier substrate (101 in FIG. 3A) is about 10 gf / cm 2 to about 100 gf / cm 2, In the present invention, the average bonding force between the carrier substrate and the subsequently formed plastic substrate (110 in FIG. 3C) is further adjusted by appropriately adjusting the area ratio between the bonding relaxation layer (102 in FIG. 3A) and the bonding reinforcement pattern (105 in FIG. 3A). It is characterized in that it is about 20gf / cm <2> most appropriately.

On the other hand, as a comparative example, the bonding strength of commercially available post it is about 23 gf / cm 2 to 26 gf / cm 2, and the bonding strength of 3M's opaque tape is

It is about 190 gf / cm <2> -200 gf / cm <2>.

Therefore, in the manufacturing method of the electrophoretic display device according to the first embodiment of the present invention, the bonding relaxation layer (102 in FIG. 3A) and the bonding strengthening pattern (105 in FIG. 3A) on the carrier substrate (101 in FIG. 3A). When formed with an appropriate area ratio of about 20 gf / cm 2, which is about the bonding force of the post-it, the lifting and separation of the plastic substrate (110 of FIG. 3 c) from the carrier substrate (101 of FIG. 3 a) is performed during the process. After the process is completed, a plastic substrate (110 of FIG. 3C) having the electrophoretic device may be easily separated from the carrier substrate (101 of FIG. 3A) by using an operator's hand or a device such as a clamp.

On the other hand, since the surface of the carrier substrate (101 in Fig. 3a) made of a glass material has a very flat structure, the bonding strength with the plastic substrate (110 in Fig. 3c) is usually 7gf / ㎠ to about 8gf / ㎠ about relatively weak bonding When the bonding force reinforcing pattern (105 in FIG. 3A) is not formed on the carrier substrate (101 in FIG. 3A) of the glass material by being attached to the glass substrate, partial separation occurs during the unit process, so that patterning failure or the It may cause defects such as tearing of the plastic substrate.

Therefore, in the first embodiment of the present invention has a rougher surface than the carrier substrate (101 in Fig. 3a) made of glass material and plastic substrate (110 in Fig. 3c) than the carrier substrate (101 in Fig. 3a) of the glass material A metal material having excellent bonding strength, each of which has a first bonding reinforcement pattern (105 in FIG. 3A) having a width of about 1 μm to 500 μm so as to be 10% or less of the area of the entire carrier substrate (101 in FIG. 3A). And the entire carrier substrate (FIG. 3A) as an inorganic material having a smaller bonding force than the glass carrier substrate (101 in FIG. 3A) in a region other than the second bonding reinforcement pattern (105 in FIG. 3A). 101) solved the above-mentioned problems by forming the total bonding force between the carrier substrate (101 of FIG. 3A) and the plastic substrate (110 of FIG. 3C) to about 10 gf / cm 2 to 100 gf / cm 2 by forming 90% or more of the area. will be.

Furthermore, in the first embodiment of the present invention, the second junction reinforcement pattern is formed outside the side surfaces of the gate and data pad portions of each display device region, so that the plastics generated when cutting the gate and data pad portions of the display device regions are formed. It is characterized by suppressing occurrence of alignment mark recognition failure for attaching an external driving circuit board by preventing the substrate from being lifted.

Subsequently, electrophoresis according to the first embodiment of the present invention is characterized in that the bonding alleviation layer and the first and second bonding reinforcement patterns are formed on the carrier substrate by using the inorganic material and the metal material having the aforementioned characteristics. The manufacturing method of a display apparatus is demonstrated.

<First Embodiment>

3A to 3H are cross-sectional views illustrating manufacturing steps of an electrophoretic display device having a flexible plastic substrate according to a first embodiment of the present invention. In this case, for convenience of description, a portion of an array element such as a thin film transistor is formed to form each unit electrophoretic display device after the cutting process is defined as a display device area, and is removed after the cutting process is performed outside the display device area. The portion where the gate and data pads are formed is a removal region and each of the display device regions is defined as a gate and data pad portion, and the pad and the gate and data pad portion are defined.

First, as illustrated in FIG. 3A, an inorganic material such as silicon oxide (SiO ₂ ) and silicon nitride (SiNx) is deposited on the carrier substrate 101, for example, a glass substrate, to form a bonding relaxation layer ( 102).

Next, as illustrated in FIG. 3B, a metal material such as molybdenum (Mo), molybdenum tungsten (MoW), aluminum (Al), aluminum alloy (AlNd), copper (Cu), and the like may be disposed on the junction relaxation layer 102. A metal layer (not shown) is formed by depositing any one of molybdenum (MoTi), amorphous indium-tin-oxide (a-ITO), and indium-gallium-zinc-oxide (IGZO), and the first metal layer ( (Not shown) by patterning a mask process including a series of unit processes such as application of photoresist, exposure using an exposure mask, development of photoresist, etching, strip of photoresist and the like. A lattice shape with a plurality of openings exposing 102 (see FIG. 4C), a bar shape of a plurality of stripe types (see FIG. 4B), and a shape bordering each display area DA (see FIG. 4A). To form a first bonding reinforcement pattern 105 and each display device region ( A second adhesive reinforcement pattern 106 having a width of about 0.5 μm to about 5 μm is formed outside the DA to correspond to the gate and data pad part PA where the gate pad and the data pad are formed.

In this case, each of the first bonding reinforcement patterns 105 is formed to have a width of about 1 μm to about 500 μm and a thickness of about 50 μm to about 150 μm. The reason why the width of the first bonding reinforcement pattern 105 is formed to have a range of 1 μm to 500 μm is to prevent tearing due to strong bonding force when the plastic substrate (110 of FIG. 3C) formed later is separated. to be. At this time, the width of the first adhesive reinforcement pattern 105 will vary depending on its formation. When only the outer side of the display device area DA is formed (see FIG. 4A), it is formed to have a width of several tens of micrometers or more and has a lattice shape having a plurality of openings regardless of the display device area DA (see FIG. 4C). Or a stripe shape (see FIG. 4B), a portion penetrating the display device area DA is generated and relatively between the first adhesive reinforcement pattern 105 compared to the shape formed only outside the display device area DA. As the spacing becomes very small, the width may be several to several tens of micrometers.

On the other hand, when the width of each of the first bonding reinforcement pattern 105 is formed to have a width more than 500㎛ wider portion to be bonded relatively strongly per unit area should be applied to a larger force, that is, a tensile force when detaching. In this case, the tensile force applied to the plastic substrate (110 of FIG. 3C) upon separation from the carrier substrate 101 may be greater than the burst strength of the plastic substrate (110 of FIG. 3C). Therefore, since the tearing of the plastic substrate (110 of FIG. 3C) may occur, the width of each first bonding reinforcement pattern 105 is formed to be 500 μm or less in order to prevent such a tear.

In the case of the second bonding reinforcement pattern 106, the width of the second bonding reinforcement pattern 106 is about 0.5 μm to about 5 μm. For the portion adjacent to the gate and the data pad part PA, the plastic substrate (FIG. The reason for this is to prevent the occurrence of field floats from the carrier substrate 101.

An external driving circuit board is attached to the gate and data pad part PA so that the external driving circuit board can be electrically connected to the gate and the data pad, respectively. Align marks (not shown) are formed.

On the other hand, the cutting process is performed in units of each display device area DA, and the plastic substrate 110 of the portion corresponding to the width of about 1 mm to 2 mm from the end of the cut portion by the pressure applied when cutting along the cutting line is carried by the carrier. Lifting to fall off from the substrate 101 automatically occurs.

Thus, the separation of the plastic substrate 110 from the carrier substrate 101 can be facilitated by using the floating of the plastic substrate 110 naturally occurring after the cutting process. Since the alignment mark (not shown) is formed in the portion where the external driving circuit board is lifted up to), the alignment mark recognition failure is frequently generated, which causes the external driving circuit board bonding failure.

Therefore, in order to prevent such poor bonding of the external driving circuit board, in the first exemplary embodiment of the present invention, the second bonding reinforcement pattern having a predetermined width outside the area corresponding to the gate and data pad portions in each display device area DA is formed. It is characterized in that the 106 is formed to prevent the plastic substrate 110 from lifting.

In this case, in the case of the second bonding reinforcement pattern 106, only the lifting of the plastic substrate 110 generated during cutting may be prevented. It is characterized by having only a width of 0.5㎛ to 5㎛ reflecting this because it needs to have only.

 On the other hand, the first bonding reinforcement pattern 105 is shown in Figure 4a to 4c (first bonding reinforcement provided in the carrier substrate used in the manufacture of the electrophoretic display device with a plastic substrate according to the first embodiment of the present invention) As a diagram showing a planar shape of the pattern, as shown in the cutting line and the second bonding reinforcement pattern which are cut during the cutting process, various forms may be achieved.

As shown in FIG. 4A, the first bonding reinforcement pattern 105 has a planar shape, each of the plurality of display device areas DA on a plastic substrate (not shown) to be formed later on the carrier substrate 101. Each of the display device areas DA may be formed so as to border the display device DA at a predetermined interval. As shown in FIG. 4B, the display area DA and the removal area are formed on the front surface of the carrier substrate 101. It may be formed as a stripe type having a plurality of spaced apart (bar) without a distinction (CA) spaced apart from a certain interval.

In addition, as shown in FIG. 4C, the first bonding reinforcement pattern 105 has an area smaller than the area of the display device area DA regardless of the display device area DA on the front surface of the carrier substrate 101. It may be formed in the form of a grid having a plurality of openings having, and may have a variety of forms in addition to those shown in the drawings.

In this case, the bonding relaxation layer 102 made of an inorganic material is exposed between the first adhesion reinforcing patterns 105 in the carrier substrate 201. The area ratio occupied by the portion where the first sum reinforcement pattern 105 is formed, that is, the area ratio of the bonding relaxation layer 102 exposed to the outside of the first bonding reinforcement pattern 105 and the first bonding reinforcement pattern 105 is determined. The first adhesive reinforcement pattern 105 is preferably formed to have a range of about 99: 1 to 90:10.

Meanwhile, the bonding relaxation layer 102 is formed of an inorganic material on the carrier substrate 101, and a plurality of first bonding reinforcement patterns 105 having a predetermined width and thickness as a metal material are formed on the carrier substrate 101. During manufacture of the electrophoretic display device, the plastic substrate (110 of FIG. 3C) formed later from the carrier substrate 101 remains attached, and the electrophoretic device using the plastic substrate (110 of FIG. 3C) is completed. The plastic substrate (110 of FIG. 3C) equipped with the electrophoretic element may be easily separated from the carrier substrate 101 by using a simple mechanism such as a clamp without irradiation with a laser beam or by a worker's manual operation. To do so.

In addition, a second junction reinforcement pattern 106 having a predetermined width is formed outside the first junction reinforcement pattern 105 to correspond to the gate and data pad portion PA of each display device area DA. One is to prevent the lifting of the plastic substrate (110 in FIG. 3C) of about 1 mm to 2 mm that occurs when cutting the carrier substrate 101 and the plastic substrate (110 in FIG. 3C) attached to each display device area DA. It is for.

Since the second junction reinforcement pattern 106 is not formed in regions other than the gate and data pad portion PA of each display device area DA, two side surfaces on which the gate and data pad portion PA are formed (electrophoresis). According to the model of the display device, the gate and the data pad part may be formed on one surface or on three surfaces, and in the first embodiment of the present invention, the gate and data pad parts may be formed on two surfaces. Except for the remaining two sides of the plastic substrate (110 in FIG. 3c) is generated for the width of about 1mm to 2mm on the basis of the cutting line so that the plastic substrate (110 in FIG. 3c) can be easily removed using this. Therefore, even if the second bonding reinforcement pattern 106 is provided, it is not a problem when the plastic substrate (110 of FIG. 3C) is separated.

Next, as shown in FIG. 3C, a plastic layer in a liquid state is coated on the entire surface of the first and second bonding reinforcement patterns 105 and 106 and the bonding alleviation layer 102 to form a plastic layer (not shown). And, by performing a heat treatment to harden the plastic layer (not shown) to form a plastic substrate 110. At this time, the plastic substrate 110 is characterized in that the thickness of about 10㎛ to 100㎛.

Next, as shown in FIG. 3D, a gate line (not shown) and a data line 129 are formed on the plastic substrate 110 to intersect with each other via the gate insulating layer 120 to define a pixel area. A gate pad 117 and a data pad (not shown) connected to one end of the gate line and the data line 129 are respectively disposed in the gate and data pad part PA of each display device area DA. In addition, an alignment mark (not shown) for aligning the external driving circuit board is formed at a predetermined interval adjacent to the gate pad 117 and the data pad (not shown).

In addition, a thin film transistor Tr connected to the gate line and the data line 129 is formed in each pixel area surrounded by the gate line and the data line 129.

In more detail, the manufacturing process for forming the gate and data wiring (not shown) 129 and the thin film transistor Tr will be described. A first metal material, for example, aluminum (Al) or aluminum, may be formed on the plastic substrate 110. An alloy (AlNd), copper (Cu), copper alloy, chromium (Cr), or a titanium alloy is deposited to form a first metal layer (not shown), and then patterned to form a first metal layer in each display area DA. A gate line (not shown) extending in the direction is formed, and a gate pad 117 connected to the gate line (not shown) is formed in the gate pad part PA. At the same time, the gate electrode 113 and the first storage electrode 115 connected to the gate line (not shown) are formed in each display area DA. In this case, the first storage electrode 115 may be formed as a part of the common wiring (not shown) by forming a common wiring (not shown) in parallel with the gate wiring (not shown), or may further include a gate wiring (not shown). It may be precisely made of the gate wiring itself (not shown) that is involved in the pixel region of the front end. In the drawing, a common wiring (not shown) is formed, and thus, a portion of the common wiring (not shown) forms the first storage electrode 115 as an example.

Next, an inorganic insulating material such as silicon oxide (SiO ₂ ) or silicon nitride (SiNx) is deposited on the entire surface of the gate wiring (not shown), the gate electrode 113, and the first storage electrode 115. 120).

Subsequently, pure amorphous silicon and impurity amorphous silicon are sequentially deposited on the gate insulating layer 120 to form a pure amorphous silicon layer (not shown) and an impurity amorphous silicon layer (not shown), and patterning the same by performing a mask process. The impurity amorphous silicon pattern 125b is formed on the active layer 125a and the upper portion corresponding to each of the gate electrodes 113.

Next, a second metal material such as molybdenum (Mo), copper (Cu), a titanium alloy, and an aluminum alloy (AlNd) may be disposed on the active layer 125a, the impurity amorphous silicon pattern 125b, and the gate insulating layer 120. By depositing any one to form a second metal layer (not shown) on the front surface, and patterning it to form a data line 129 crossing the gate line (not shown) in each display device area DA, each data A data pad (not shown) connected to one end of the data line is formed in a pad part (not shown). In addition, a plurality of alignment marks (not shown) for aligning the external driving circuit boards are formed on the gate pad part PA and the data pad part (not shown) in each display device area DA.

At the same time, source and drain electrodes 130 and 132 are formed on the impurity amorphous silicon pattern 125b in each pixel area within each display device area DA, and formed on the first storage electrode 115. The first storage electrode 115, the gate insulating layer 120, and the second storage electrode 134 overlapping each other by forming a second storage electrode 134 connected to the drain electrode 132 correspond to a storage capacitor StgC. ) In this case, the source electrode 130 is connected to the data line 129.

Subsequently, the active layer 125a is exposed between the source and drain electrodes 130 and 132 by removing the impurity amorphous silicon pattern 125b between the source and drain electrodes 130 and 132 by performing dry etching. The ohmic contact layer 125c of impurity amorphous silicon is formed on the active layer 125a to contact the source and drain electrodes 130 and 132 and to be spaced apart from each other. At this time, the active layer 125a and the ohmic contact layer 125b spaced apart from each other form the semiconductor layer 125.

On the other hand, the gate electrode 113, the gate insulating film 120 and the semiconductor layer 125 and the source and drain electrodes 130 and 132 which are sequentially stacked in each pixel region are formed of a thin film transistor Tr as a switching element. Achieve.

Next, an organic insulating material such as photo acryl or benzocyclobutene (BCB) is coated on the data line 129, the source and drain electrodes 130 and 132, and the second storage electrode 134. Thus, the first protective layer 140 having a flat surface is formed. In this case, before forming the first passivation layer 140, an inorganic insulating material such as silicon oxide (SiO ₂ ) or silicon nitride (SiNx) is deposited on the entire surface of the thin film transistor Tr to form a second passivation layer ( Not shown) may be formed first, and the first protective layer 140 may be continuously formed.

Thereafter, the first and second passivation layers 140 (not shown) are patterned by performing a mask process to expose the drain contact hole 142 and the gate and data to expose the drain electrode 132 of the thin film transistor Tr. Pad holes 143 are formed to expose the pads, respectively. In this case, a third protective layer (not shown) may be further formed by depositing an inorganic insulating material on the first protective layer 140 made of an organic insulating material. In this case, the drain contact hole 142 and the pad may be formed. The patterning process for forming the hole 143 is performed after forming the third protective layer (not shown).

The reason why the second and third passivation layers (not shown) are formed in addition to the first passivation layer 140 using the organic insulating material is to improve the characteristics of the thin film transistor Tr and to form the pixel electrode 150 (see FIG. 3H). This is to enhance the bonding strength of the. Since the bonding strength between the organic insulating material and the conductive material is weaker than the bonding strength between the organic insulating material and the inorganic insulating material and between the inorganic insulating material and the conductive material, the bonding property is improved by interposing the inorganic insulating material layer between the organic insulating material and the conductive material. You can.

In addition, the active layer 125a exposed between the source and drain electrodes 130 and 132 may be degraded when its surface is in contact with an organic insulating material. This is to improve the characteristics by interposing excellent inorganic insulating material.

Next, a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), and indium is deposited on the first passivation layer 140 (or a third passivation layer (not shown) in the modification). A conductive material layer (not shown) is formed by depositing one of tin-zinc-oxide (ITZO).

Thereafter, the conductive material layer (not shown) is patterned to form the pixel electrode 150 in contact with the drain electrode 132 through the drain contact hole 142, and at the same time, the gate and data pads are formed through the pad hole. A gate and a data auxiliary pad which contact each other are formed.

Next, as shown in FIG. 3E, a base having a transparent and flexible characteristic, for example, PET, corresponding to a display area displaying an actual image of each display device area DA on the pixel electrode 150. The film 160, a lower portion of the common electrode 163 formed on the front surface of the transparent conductive material, and a plurality of white pigments 166 and black pigments 168 charged through the condensation polymerization reaction under the plurality of layers. An ink layer 173 including a capsule 170 and an electrophoretic film 177 including a first adhesive layer 175 below the ink layer 173 may be formed of the common electrode 163 and the pixel. Located between the electrodes 150 and attached so that the first adhesive layer 175 and the pixel electrode 150 contact. In this case, the electrophoretic film may expose the gate auxiliary pad 151 and the data auxiliary pad (not shown) to the gate pad part PA and the data pad part (not shown) in each display device area DA. It is characterized by being attached.

On the other hand, after the electrophoretic film 177 is attached to the color filter layer in the form of repeated red, green, blue color filter pattern sequentially corresponding to each pixel area (P) on the electrophoretic film 177 ( 180 may be formed, and a protective film 182 for protecting the color filter layer 180 may be further attached onto the color filter layer 180 to form a display device capable of displaying a full color image.

Next, as shown in FIG. 3F, each display is performed using a scribe device (not shown) including a cutting wheel 185 in a state in which the electrophoretic film 177 is attached to each display device area DA. The cutting process is performed along the cutting lines (SL of FIGS. 4A, 4B, and 4C) positioned outside the area forming the device, and separated by each display device area DA. Hereinafter, for convenience of description, the unit divided by each display device area DA is called a unit display panel.

At this time, the plastic substrate 110 and the glass carrier substrate 101 are in direct contact with each other on the cutting surface of each unit display panel cut by the cutting wheel 197. As the bonding force is relatively weak, the plastic substrate 110 falls from the carrier substrate 101 with respect to a width of about 1 mm to 2 mm based on the cutting surface due to the external force applied by the cutting wheel 197 or the like during the cutting process. .

Meanwhile, even during the cutting process, a second bonding reinforcement pattern 106 having a width of about 0.5 μm to 2 μm is provided outside the gate and the data pad of each unit display panel 199. 4A, 4B, and 4C are positioned outside the second bonding reinforcement pattern 106, so that an external pressure is applied by the cutting wheel 197 during cutting, so that the cutting lines 1A, 4B, and 4C Lifting of the plastic substrate 110 is prevented with respect to the gate and data pad part PA positioned inside the second bonding reinforcement pattern 106 by the second bonding reinforcement pattern 106 provided adjacent to the SL. do.

Next, as shown in FIG. 3G, the driving IC is attached to the gate and the data pad part PA of each display panel 199 while being separated into the plurality of unit display panels 199 by the cutting process. Alternatively, an external driving circuit board 183 having a flexible printed circuit board (FPC) 181 provided with a driving IC is positioned, and an outer opening provided in the gate and data pad part PA of each unit display panel 199. After the alignment is performed based on the alignment mark (not shown) for driving circuit board alignment, the FPC 181 connected to the external driving circuit board 183 is attached to the gate and data pad of the unit display panel.

In this case, the gate and data pads PA of the plurality of unit display panels 199 are provided with second bonding reinforcement patterns 106 on the outside thereof, respectively, from the carrier substrate 101 of the plastic substrate 110. No falling up occurs. Therefore, the alignment mark detection means is normally driven in the alignment step before bonding the external driving circuit board 183 to align the external driving circuit board provided in the gate and data pad unit PA of each unit display panel 199. The alignment mark (not shown) is well recognized, whereby the alignment of the external driving circuit board 183 is normally performed, and then bonding is performed to align due to the lifting of the plastic substrate 110 of the cut portion during cutting. The failure of bonding the external driving circuit board 183 due to the poor mark recognition does not occur.

Next, as shown in FIG. 3H, a separation process of separating the plastic substrate 110 from the carrier substrate 101 is performed on each unit display panel 199 having finished bonding the external driving circuit board 183. This completes the display device according to the first embodiment of the present invention.

In more detail, in the separation display, in the unit display panel 199 in which the plastic substrate 110 is lifted with a width of about 1 mm to 2 mm from the other side except for the gate and the data pad part PA, After fixing the carrier substrate 101, the plastic substrate 110 in the portion where the lifting occurs is vacuum-adsorbed, or by using a mechanism such as a clamp (not shown), or the like, between the clamps of the plastic substrate 110. The plastic substrate 110 is gradually separated from the carrier substrate 101 by gradually applying a force to the outside of the carrier substrate 110 in a tightly supported state after the end is positioned. Separation of the plastic substrate 110 from the carrier substrate 101 may be made by hand through the operator's hand without a mechanism (not shown) such as the clamp.

On the other hand, since the separation of the plastic substrate 110 from the carrier substrate 101, which proceeds as described above is substantially several seconds to several tens of seconds, the progress of the separation of the plastic substrate through the conventional laser beam irradiation several ten times faster Since it is made there is an effect to improve the production productivity per unit time.

&Lt; Embodiment 2 >

The second embodiment of the present invention is characterized by using a bonding improving agent to improve the bonding characteristics of the plastic substrate and the glass substrate carrier substrate, the gate wiring, data wiring, thin film transistor and pixel electrode formed on the plastic substrate array Completing the substrate, attaching the electrophoretic film to complete the electrophoretic display device, forming the color filter layer to enable full color image display and detaching the plastic substrate are the same as the first embodiment described above. Since it is the same, a description of these steps will be omitted, and focusing on forming a plastic substrate, including forming a joint improvement pattern or a joint improvement layer on a part different from the first embodiment, that is, the carrier substrate. Explain. In this case, for convenience of description, the same reference numerals are added to the same elements as in the first embodiment.

5A through 5C are cross-sectional views illustrating manufacturing steps of an electrophoretic display device according to a second exemplary embodiment of the present invention.

First, as shown in FIG. 5A, a bonding improving agent for improving the bonding force between the glass material and the plastic material on the glass carrier substrate 201 is dispensed through the syringe 298, or a brush (not shown) or a roller is used. After drawing in contact with the carrier substrate 201 using a (not shown) or the like, the first and second bonding improvement patterns 205 and 206 are formed by heating and drying.

In this case, the first junction improvement pattern 205 is formed later on the plastic substrate (210 of FIG. 5B), except for each display device area DA in which an electrophoretic element is formed. It is characterized in that it is formed corresponding to an area excluding the area DA, more precisely, a part to be removed during a later cutting process (hereinafter referred to as a 'removal area' CA). In this case, the first bonding improvement pattern 205 may be formed on the entire surface of the removal region CS or may be formed only on a part of the removal region CS. In this case, when the first junction improvement pattern 205 is formed only in a part of the removal area CS, the removal area CS has a predetermined width and borders each display device area DA. The first bonding reinforcement pattern illustrated in FIG. 4A may be formed.

In addition, the first bonding improvement pattern 205 may be formed in the same shape as that in which the first bonding enhancement pattern shown in FIGS. 4B and 4C is formed without distinguishing the display device area DA and the removal area CS. have.

In this case, the second junction improvement pattern 206 is the region where the gate and the data pad of each display device area DA are formed, that is, the gate pad part and the data pad part as shown in the first embodiment. It is characterized by being formed in the outer side corresponding to (PA). In this case, although the second bonding improvement pattern 206 is formed outside each display device area DA, the second bonding improvement pattern 206 is located inside the cutting line and remains unremoved even after the cutting process. At this time, the second bonding improvement pattern 206 is characterized in that the width is formed smaller than 10㎛. In the case of the first embodiment, the second bonding reinforcement pattern was easily formed by the mask process so that the width thereof was 5 μm or less. In the case of the second embodiment, the second bonding improvement pattern 206 was formed by using a syringe or a brush. It is formed by using a larger range than the width of the second bonding reinforcement pattern because the error range is larger than that formed by the patterning.

On the other hand, the composition of the bonding improving agent used for formation of the 1st and 2nd bonding improvement patterns 205 and 206 is demonstrated.

The bonding improving agent used in the second embodiment of the present invention is characterized by improving bonding characteristics between the plastic substrate 210 (FIG. 5C) and the carrier substrate 201 of FIG. 5C. Such a junction improving agent is a solution consisting of an amino silane-based material ((Ro) 3-Si-R'-NH ₂ ) and an organic solvent, for example, organic solvent (1-methoxy-2-propanol), the composition ratio of which is the amino silane-based It is characterized by consisting of 0.1% to 10% by weight of the material and 90% to 99.9% by weight of the organic solvent.

At this time, by changing the weight percent of the amino silane-based material ((Ro) 3-Si-R'-NH ₂ ) and the weight percent of the organic solvent (1-methoxy-2-propanol) in the above-described range by varying the material The average bonding force between the carrier substrate 201 and the plastic substrate (210 in FIG. 5C) bonded through the bonding improving pattern or the bonding improving layer is in the range of about 10 gf / cm 2 to about 100 gf / cm 2 mentioned in the first embodiment. The feature is that it is possible.

For example, as in the second embodiment (see FIG. 5A), the entire surface or part of the removal area CS, or the display device area DA and the removal area CS using the syringe 298 or a brush (not shown). When the plurality of first bonding improving patterns 205 are formed on the carrier substrate 201 as a plurality of stripe types or lattice forms, the amino silane-based material ((Ro) 3 -Si-R'-NH ₂ ) Is determined in the range of greater than 1% by weight and less than 10% by weight, and the remainder by weight using a bonding improving agent having a composition ratio of organic solvent (1-methoxy-2-propanol) to the overall carrier substrate 201 And the bonding force between the plastic substrate (210 in FIG. 5C) may be about 10 gf / cm 2 to about 100 gf / cm 2.

Since the width of the second junction improvement pattern 206 is relatively thin compared to the first junction improvement pattern 205 and is determined by the number of display area areas DA, the actual junction area is the first junction improvement pattern 205. The bonding force between the carrier substrate 201 and the plastic substrate (210 in FIG. 5C), which is affected by the composition ratio of the bonding improving agent, is relatively small compared to the formed area, mainly due to the first bonding improving pattern 205. Will be decided by.

Next, as shown in FIG. 5B, a plastic layer (not shown) is formed by applying liquid plastic on the entire surface of the carrier substrate 201 over the first and second bonding improvement patterns 205 and 206. In this case, the bonding strength with the plastic substrate 210 is strengthened with respect to the portion where the first and second bonding improving patterns 205 and 206 are formed, thereby forming a strong bonding (bonding force is 10 gf / cm 2 to 100 gf / cm 2). For the openings (op) in which the first and second bonding improving patterns 205 and 206 are not formed, a weak bonding (that is, 7 gf / cm 2 to 8 gf / cm 2, which is the bonding force between the original glass material and the plastic material) is made. do.

Thereafter, the process proceeds in the same manner as in the above-described first embodiment, and thus description thereof is omitted.

On the other hand, in the first and second embodiments and modified examples of the present invention, an electrophoretic display device is shown as an example, but all display devices in which a flexible plastic substrate is used via a carrier substrate, for example, a liquid crystal display device or It is apparent that a manufacturing method of forming a plastic substrate on the carrier substrate and detaching the plastic substrate from the carrier substrate without using a laser beam irradiation apparatus in a specific step required for the organic electroluminescent device may be extended. It will be apparent that various modifications and changes can be made without departing from the spirit and spirit of the present invention.

101 carrier substrate 102 bonding relaxation layer
105: first bonding reinforcement pattern 106: second bonding reinforcement pattern
110: plastic substrate 113: gate electrode
115: first storage electrode 120: gate insulating film
125: semiconductor layer 125a: active layer
125c: ohmic contact layer 129: data wiring
130: source electrode 132: drain electrode
134: second storage electrode 140: first protective layer
142: drain contact hole 143: pad hole
150: pixel electrode 151: auxiliary gate pad
160: base film 163: common electrode
166: white pigment 168: black pigment
170: capsule 173: ink layer
175: first adhesive layer 177: electrophoretic film
197: cutting wheel

Claims (15)

Forming a bonding alleviation layer made of an inorganic material on a front surface of a carrier substrate on which a plurality of display device regions, each of which forms a display device after cutting, are formed;
Forming a plurality of first bonding reinforcement patterns having a first width and a first thickness as a metal material on the junction alleviation layer, and corresponding to the gate and data pad portions provided in the respective display device regions, and forming the first bonding strengthening pattern. Forming a second bond reinforcement pattern having a second width with the same material as the first bond reinforcement pattern;
Forming a plastic substrate by applying a liquid plastic to the entire surface of the carrier substrate over the first and second bonding reinforcement patterns and performing heat treatment;
Forming a plurality of components for implementing an image in each display area on the plastic substrate;
Cutting the outside of each display device area using a cutting wheel to separate the display panels into each display panel;
Separating the plastic substrate from the carrier substrate in each of the display panels
Method of manufacturing a display device using a flexible plastic substrate comprising a.
The method of claim 1,
The carrier substrate is a glass material,
The inorganic material is silicon oxide (SiO ₂ ) or silicon nitride (SiNx),
The metal material is molybdenum (Mo), molybdenum (MoW), aluminum (Al), aluminum alloy (AlNd), copper (Cu), molybdenum (MoTi), amorphous indium-tin-oxide (a-ITO), indium -A method of manufacturing a display device using a flexible plastic substrate, characterized in that it is any one of gallium-zinc-oxide (IGZO).
The method of claim 2,
The first width is 1 μm to 500 μm,
The second width is 0.5 μm to 5 μm,
And a first thickness of 50 kV to 150 kV.
The method of claim 3, wherein
The area ratio of the area of the bonding alleviation layer exposed to the outside of the first bonding reinforcement pattern to the surface of the carrier substrate to the area of the first bonding reinforcement pattern is 90:10 to 99: 1. Method of manufacturing the device.
The method of claim 4, wherein
Display using a flexible plastic substrate, characterized in that the average bonding force between the carrier substrate and the plastic substrate bonded through the bonding relaxation layer and the first and second bonding reinforcement patterns is 10gf / ㎠ to 100gf / ㎠ Method of manufacturing the device.
The method of claim 1,
The first bonding reinforcement pattern may be formed on the carrier substrate to have any one of a shape that borders the display device area outside the display device area, a plurality of spaced stripe shapes, and a lattice shape having a plurality of openings. A method of manufacturing a display device using a flexible plastic substrate, characterized in that.
A first bonding having a specific shape by partially applying a bonding improver composed of an amino silane-based material and an organic solvent on a plurality of display regions each of which forms a display after cutting and a removal region outside thereof Forming an improvement pattern and a second junction improvement pattern formed of the same material as the first junction improvement pattern on an outer side thereof corresponding to the gate and data pad parts provided in each display device area;
Forming a plastic substrate by applying a liquid plastic to the entire surface of the carrier substrate and heat-treating the first and second bonding improving patterns;
Forming a plurality of components for implementing an image in each display area on the plastic substrate;
Cutting the outside of each display device area using a cutting wheel to separate the display panels into each display panel;
Separating the plastic substrate from the carrier substrate in each of the display panels
Method of manufacturing a display device using a flexible plastic substrate comprising a.
The method of claim 7, wherein
A method of manufacturing a display device using a flexible plastic substrate, comprising drying the first and second bonding improvement patterns before forming the plastic substrate.
The method of claim 7, wherein
The bonding improving agent is a manufacturing method of a display device using a flexible plastic substrate, characterized in that composed of 0.1% to 10% by weight of the amino silane-based material and 99.1% to 90% by weight of the organic solvent.
The method of claim 7, wherein
The first and second bonding improving pattern is formed by using any one of a syringe, a brush, a roller, the bonding improving agent,
The first bonding improvement pattern may be formed on the entire surface of the removal area outside the display device area, in a form bordering the display device area, or a plurality of stripes on the entire surface of the carrier substrate without dividing the display device area and the removal area. A method of manufacturing a display device using a flexible plastic substrate, characterized in that it has a shape and a lattice shape.
The method according to claim 1 or 7,
Lifting of the plastic substrate is separated from the carrier substrate in correspondence with a width of 1mm to 2mm along the edge of each display panel, which is a part cut when the cutting wheel is cut.
The second method of manufacturing a display device using a flexible plastic substrate is characterized in that the lifting is prevented by the second bonding reinforcement pattern provided on the outside of the gate and data pad part.
The method according to claim 1 or 7,
Forming a plurality of components for implementing an image in each display area on the plastic substrate,
A gate wiring and a data wiring crossing the insulating substrate corresponding to each display device region and defining a plurality of pixel regions on the plastic substrate, a thin film transistor connected to the gate and the data wiring, and the gate pad part Forming a gate pad and a first align mark connected to a gate line, and a data pad and a second align mark connected to the data line in the data pad part;
Forming a pixel electrode connected to the thin film transistor in each pixel region in each display device region;
Attaching an electrophoretic film while exposing the gate and data pad portions corresponding to a display area for displaying an image in each display device area;
Bonding an external driving circuit board after aligning the gate and data pad parts using the first and second alignment marks;
Method of manufacturing a display device using a flexible plastic substrate comprising a.
The method of claim 12,
The electrophoretic film includes an ink layer including a base film, a common electrode sequentially stacked below the base film, a plurality of capsules filled with a plurality of white pigments and black pigments charged through a condensation polymerization reaction, and adhesion. Consists of layers,
The attaching of the electrophoretic film may include manufacturing the display device using the flexible plastic substrate, wherein the ink layer is positioned between the common electrode and the pixel electrode and is attached to contact the adhesive layer and the pixel electrode. Way.
The method of claim 12,
Forming a color filter layer over the electrophoretic film before bonding the external driving circuit board;
Method of manufacturing a display device using a flexible plastic substrate comprising a.
The method according to claim 1 or 7,
Separation of the plastic substrate and the carrier substrate is made by applying a force to one side in a state in which one end surface of the plastic substrate provided with a plurality of components for the image realization in close contact with the fixing means, or the operator Method of manufacturing a display device using a flexible plastic substrate, characterized in that through the manual operation.

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