KR20070007494A - A cooling device of electro static chuck - Google Patents

A cooling device of electro static chuck Download PDF

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Publication number
KR20070007494A
KR20070007494A KR1020050062148A KR20050062148A KR20070007494A KR 20070007494 A KR20070007494 A KR 20070007494A KR 1020050062148 A KR1020050062148 A KR 1020050062148A KR 20050062148 A KR20050062148 A KR 20050062148A KR 20070007494 A KR20070007494 A KR 20070007494A
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South Korea
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cooling
cooling unit
electrostatic chuck
edge
central
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KR1020050062148A
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Korean (ko)
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김용한
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동부일렉트로닉스 주식회사
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Priority to KR1020050062148A priority Critical patent/KR20070007494A/en
Publication of KR20070007494A publication Critical patent/KR20070007494A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A cooling apparatus of an electrostatic chuck is provided to increase uniformity of a wafer etching by dividing the electrostatic chuck into two regions to form respectively independent cooling water supplying systems. A central cooling unit(7) is formed on a center in an inner region of an electrostatic chuck(3). Cooling water circulates to cool the center of the electrostatic chuck. An edge cooling unit(6) is formed on an edge of the central cooling unit. Cooling water circulates to cool the edge of the electrostatic chuck. Cooling water inlet holes(11,13) are respectively connected to the central cooling unit and the edge cooling unit. The cooling water inlet holes allow the cooling water to have different temperatures into the central cooling unit and the edge cooling unit. Cooling outlet holes(12,14) are respectively connected to the central cooling unit and the edge cooling unit. The cooling outlet holes flow out the cooling water of the central cooling unit and the edge cooling unit.

Description

정전척의 냉각 장치{A cooling device of Electro Static Chuck}A cooling device of Electro Static Chuck

도 1은 종래 정전척의 냉각라인 구성을 나타내는 단면도1 is a cross-sectional view showing a configuration of a cooling line of a conventional electrostatic chuck.

도 2는 도 1에 도시된 정전척의 저면도2 is a bottom view of the electrostatic chuck shown in FIG.

도 3a는 본 발명의 일실시예에 따른 정전척의 평면도3A is a plan view of an electrostatic chuck in accordance with an embodiment of the present invention.

도 3b는 본 발명의 다른 일실시예에 따른 코일형식의 관이 형성된 정전척의 평면도Figure 3b is a plan view of the electrostatic chuck formed with a coil-shaped tube according to another embodiment of the present invention

도 4는 본 발명에 따른 정전척의 단면도4 is a cross-sectional view of an electrostatic chuck in accordance with the present invention.

<도면의 주요부분에 대한 부호 설명><Description of Signs of Major Parts of Drawings>

1, 11, 13: 냉각수 유입구 2, 12, 14: 냉각수 유출구1, 11, 13: Cooling water inlet 2, 12, 14: Cooling water outlet

3: 정전척 4: 웨이퍼3: electrostatic chuck 4: wafer

5: 정전척 하부 6: 가장자리 냉각부5: lower electrostatic chuck 6: edge cooling part

7: 중앙 냉각부 8: 경계면7: center cooling part 8: interface

본 발명은 정전척의 냉각 장치에 관한 것으로서, 더욱 상세하게는 정전척 내부에 설치되어 정전척에 가해지는 열부하를 효과적으로 제어할 수 있는 정전척의 냉각 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electrostatic chuck, and more particularly, to a cooling device for an electrostatic chuck installed inside the electrostatic chuck to effectively control the heat load applied to the electrostatic chuck.

통상 반도체 소자를 제조하기 위하여 행하여지는 웨이퍼 표면의 도전 층과 절연 층을 패터닝하기 위한 박경계면 증착 및 식각 공정은 가장자리 냉각부으로부터 밀폐된 챔버 내부에 설치되는 정전척에 웨이퍼가 고정된 상태에서 이루어진다. 특히 최근에는 증착시키고자 하는 공정가스를 상기 공정챔버 내부로 분사함과 동시에 전원을 인가하여 발생하는 플라즈마 분위기에서 증착 및 식각 공정이 수행된다.The thin surface interface deposition and etching processes for patterning the conductive and insulating layers on the wafer surface, which are usually performed for manufacturing semiconductor devices, are performed while the wafer is fixed to an electrostatic chuck installed inside the hermetically sealed chamber from the edge cooling portion. In particular, in recent years, the deposition and etching process is performed in a plasma atmosphere generated by applying power to the process gas to be deposited into the process chamber.

상기 식각 공정이 진행중일 경우에는 웨이퍼가 안착되는 정전척을 일정한 온도로 유지시켜 상기 웨이퍼에 가해지는 열부하를 적절하게 제어해야 하는데, 이는 플라즈마가 형성됨으로써 발생하는 고온의 열로 인하여 웨이퍼가 버닝(그을림)되는 현상을 방지하기 위한 것으로 통상적으로 정전척은 상온보다 낮은 온도인 -30℃ 내지 80℃로 냉각된다.When the etching process is in progress, the electrostatic chuck on which the wafer is placed should be maintained at a constant temperature to properly control the heat load applied to the wafer, which is caused by burning of the wafer due to the high temperature heat generated by plasma formation. The electrostatic chuck is typically cooled to -30 ° C to 80 ° C, which is lower than room temperature.

도 1은 종래 정전척의 냉각라인 구성을 나타내는 단면도로서, 정전척(3) 내부에 냉각라인이 형성되어 있으며, 상기 냉각라인은 냉각수 유입구(1)를 통해서 냉각수가 들어가서 정전척(3) 내부를 순환한 후 냉각수 유출구(2)를 통하여 외부로 유출된다. 1 is a cross-sectional view showing a configuration of a cooling line of a conventional electrostatic chuck, wherein a cooling line is formed inside the electrostatic chuck 3, and the cooling line enters the cooling water through the cooling water inlet 1 and circulates inside the electrostatic chuck 3. After that it flows out through the cooling water outlet (2).

도 2는 냉각수 유입구 및 유출구를 설명하기 위한 정전척의 저면도로서, 정 전척 하부(5)에는 냉각수 유입구(1)와 유출구(2)가 형성되어 있는 것을 볼 수 있다.2 is a bottom view of the electrostatic chuck for explaining the cooling water inlet and outlet, it can be seen that the lower portion of the electrostatic chuck 5 is formed with the cooling water inlet 1 and the outlet (2).

상기 냉각수의 온도는 도면에는 도시되지 않은 냉각기를 통하여 온도가 제어되는데, 웨이퍼(4)의 크기가 커지면서 정전척(3)의 표면 온도의 제어가 용이하지 않게 되고, 결과적으로 웨이퍼(4) 중심과 가장자리 사이의 식각이 균일하지 않게 되는 문제점이 있었다. 이러한 문제는 식각중에 발생하는 부산물이 상대적으로 온도가 낮은 부분에서 생성되고, 이 부산물이 식각을 방해하기 때문에 상대적으로 온도가 높은 부분은 식각이 빠르게 진행되고, 온도가 낮은 부분은 식각이 느리게 되기 때문에 발생하는 현상이다.The temperature of the coolant is controlled by a cooler (not shown). As the size of the wafer 4 increases, the temperature of the surface of the electrostatic chuck 3 is not easily controlled. There was a problem that the etching between the edges is not uniform. This problem occurs because the by-products generated during etching are generated in a relatively low temperature part, and the by-products interfere with the etching, so that the relatively high temperature part is rapidly etched and the low temperature part is slow in etching. It is a phenomenon that occurs.

본 발명은 상기 문제점을 개선하기 위하여 안출한 것으로서, 정전척에 냉각수를 2개의 채널(chanel)을 이용하여 공급함으로써 정전척 중심과 가장자리의 온도제어를 보다 정밀하게 하여 웨이퍼 식각의 균일성을 향상시킬 수 있도록 된 정전척의 냉각장치를 제공하고자 함에 발명의 목적이 있다.The present invention has been made to solve the above problems, by supplying the coolant to the electrostatic chuck by using two channels (chanel) to improve the temperature control of the center and the edge of the electrostatic chuck to improve the uniformity of the wafer etching It is an object of the invention to provide a cooling device of an electrostatic chuck which is made possible.

상기 목적을 달성하기 위하여 본 발명은 냉각수가 정전척 내부 영역을 순환하면서 정전척을 냉각하는 정전척 냉각장치에 있어서, 상기 정전척 내부 영역의 중앙에 형성되며 냉각수가 순환하여 상기 정전척의 중앙 냉각부를 냉각시키는 중앙 냉각부와; 상기 중앙 냉각부의 가장자리에 형성되며 냉각수가 순화하여 상기 정전척의 가장자리 냉각부를 냉각시키는 가장자리 냉각부와; 상기 중앙 냉각부와 가장자리 냉각부에 각각 연결되며 별개의 온도를 가진 냉각수를 각각 상기 중앙 냉각부와 가장자리 냉각부로 유입하는 냉각수 유입구와; 상기 중앙 냉각부와 가장자리 냉각부에 각각 연결되며 상기 중앙 냉각부와 가장자리 냉각부의 냉각수를 유출하는 유출구를 포함하는 것을 특징으로 한다In order to achieve the above object, the present invention provides an electrostatic chuck cooling apparatus for cooling an electrostatic chuck while cooling water circulates through an internal area of the electrostatic chuck, wherein the central cooling portion of the electrostatic chuck is formed by circulating cooling water. A central cooling unit for cooling; An edge cooling unit formed at an edge of the central cooling unit to cool the edge cooling unit of the electrostatic chuck by cooling water; A cooling water inlet connected to the central cooling unit and the edge cooling unit, respectively, and cooling water having a separate temperature to the central cooling unit and the edge cooling unit, respectively; It is connected to the central cooling unit and the edge cooling unit, respectively, characterized in that it comprises an outlet for outgoing the cooling water of the central cooling unit and the edge cooling unit

이하 본 발명의 바람직한 일실시 예에 대한 구성 및 작용을 예시도면에 의거하여 상세히 설명한다.Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 3a는 본 발명의 일실시예에 따른 정전척의 평면도이다.3A is a plan view of an electrostatic chuck in accordance with an embodiment of the present invention.

정전척(3)의 내부는 가운데 원형의 경계면(8)을 경계로 하여 중앙 냉각부(7)와 가장자리 냉각부(6)로 나누어져 있다. 도면에는 도시되지 않았으나 나누어진 영역에는 각각 냉각수 유입구(11, 13)와 유출구(12, 14)가 설치되어 있어 중앙 냉각부(7)와 가장자리 냉각부( 6)에 냉각수를 공급한다.The interior of the electrostatic chuck 3 is divided into a central cooling unit 7 and an edge cooling unit 6 with the boundary of the center circular boundary 8 as the boundary. Although not shown in the drawing, the divided areas are provided with coolant inlets 11 and 13 and outlets 12 and 14, respectively, to supply coolant to the central cooling unit 7 and the edge cooling unit 6.

경계면(8)은 가상적인 면으로 중앙 냉각부(7)와 가장자리 냉각부(6)를 나누는 경계가 되며, 이를 중심으로 각각의 영역은 온도가 다른 냉각수로 제어된다. 중앙 냉각부(7)보다 가장자리 냉각부(6)의 온도가 낮으므로 온도가 높은 냉각수를 가장자리 냉각부(6)로 공급하여 중앙 냉각부(7)와의 온도차이를 줄인다.The interface 8 is a boundary that divides the central cooling unit 7 and the edge cooling unit 6 into an imaginary plane, with each zone being controlled by cooling water having a different temperature. Since the temperature of the edge cooling unit 6 is lower than that of the central cooling unit 7, the cooling water having a higher temperature is supplied to the edge cooling unit 6 to reduce the temperature difference from the central cooling unit 7.

도 3b는 본 발명의 다른 일실시예에 따른 코일형식의 관이 형성된 정전척의 평면도로서, 냉각수 유입구(11) 및 냉각수 유입구(13)로 들어간 냉각수는 각각 코일형식의 관을 따라 정전척(3) 내부를 순환하여 외부로 배출된다. 이때 각각의 냉각수 유입구(11, 13)로 들어간 냉각수는 충분히 정전척의 열을 흡수하여 외부로 유출하는 구조를 이룬다. 3B is a plan view of an electrostatic chuck having a tube of a coil type according to another embodiment of the present invention, in which the coolant entering the cooling water inlet 11 and the cooling water inlet 13 is respectively electrostatic chuck 3 along the coil type tube. Circulates inside and is discharged to the outside. At this time, the cooling water entering each of the cooling water inlets 11 and 13 has a structure that absorbs the heat of the electrostatic chuck sufficiently and flows out.

따라서, 냉각수 유입구(11, 13)와 냉각수 유출구(12, 14) 사이의 온도차이는 도 3a의 구조와는 확연히 차이가 난다. 이는 효율적인 냉각이 이루어짐을 의미한다.Therefore, the temperature difference between the coolant inlets 11 and 13 and the coolant outlets 12 and 14 is significantly different from the structure of FIG. 3A. This means efficient cooling is achieved.

한편, 냉각수 유입구(11)와 냉각수 유입구(13)로 들어가는 냉각수는 각각 달리 제어된다. 상대적으로 고온인 중앙 냉각부(7)의 냉각수보다는 가장자리 냉각부(6)의 냉각수 유입구(11)로 고온의 냉각수가 유입된다.Meanwhile, the coolant entering the coolant inlet 11 and the coolant inlet 13 is controlled differently. The high temperature coolant flows into the coolant inlet 11 of the edge cooler 6 rather than the coolant of the relatively high central cooler 7.

상기 중앙 냉각부(7)와 가장자리 냉각부(6)를 분리하는 경계면(8)은 원형인 것이 일반적이다. 이는 웨이퍼(4)의 모양이 원형이기 때문이다. 경계면(8)의 직경은 웨이퍼(4)의 식각의 균일성을 높이기 위하여 다양한 크기로 변형할 수 있다.The interface 8 separating the central cooling section 7 and the edge cooling section 6 is generally circular. This is because the shape of the wafer 4 is circular. The diameter of the interface 8 can be varied in various sizes to increase the uniformity of etching of the wafer 4.

도 4는 본 발명에 따른 정전척의 단면도로서, 중앙 냉각부(7)와 가장자리 냉각부(6)에 각각 냉각수가 공급되고, 중앙 냉각부(7)와 가장자리 냉각부(6) 사이는 가상의 경계면(8)에 의하여 분리되어 있는 것을 볼 수 있다. 4 is a cross-sectional view of the electrostatic chuck according to the present invention, in which cooling water is supplied to the central cooling unit 7 and the edge cooling unit 6, respectively, between the central cooling unit 7 and the edge cooling unit 6. It can be seen that it is separated by (8).

상기 실시예들은 두 개의 영역을 가지는 정전척의 냉각 장치에 관한 것이나, 경계면을 2개 이상일 경우 영역이 세분화되어 보다 세밀한 온도 제어가 가능할 것이다. The above embodiments relate to a cooling apparatus of an electrostatic chuck having two regions, but when two or more interfaces are used, the regions may be subdivided to allow more precise temperature control.

상기한 바와 같이 본 발명은 정전척을 2개의 영역으로 나누어 각각 독립된 냉각수 공급 시스템을 형성함으로써 웨이퍼의 식각의 균일성을 높이는 장점이 있다.As described above, the present invention has an advantage of increasing the uniformity of etching of the wafer by dividing the electrostatic chuck into two regions to form independent cooling water supply systems.

Claims (2)

냉각수가 정전척 내부 영역을 순환하면서 정전척을 냉각하는 정전척 냉각장치에 있어서,In the electrostatic chuck cooling device for cooling the electrostatic chuck while cooling water circulates inside the electrostatic chuck, 상기 정전척 내부 영역의 중앙에 형성되며 냉각수가 순환하여 상기 정전척의 중앙부를 냉각시키는 중앙 냉각부와; 상기 중앙 냉각부의 가장자리에 형성되며 냉각수가 순화하여 상기 정전척의 가장자리부를 냉각시키는 가장자리 냉각부와; 상기 중앙 냉각부와 가장자리 냉각부에 각각 연결되며 별개의 온도를 가진 냉각수를 각각 상기 중앙 냉각부와 가장자리 냉각부로 유입하는 냉각수 유입구와; 상기 중앙 냉각부와 가장자리 냉각부에 각각 연결되며 상기 중앙 냉각부와 가장자리 냉각부의 냉각수를 유출하는 유출구를 포함하는 정전척의 냉각 장치.A central cooling unit formed in the center of the internal area of the electrostatic chuck and cooling water circulating to cool the central portion of the electrostatic chuck; An edge cooling unit formed at an edge of the central cooling unit to cool the edge of the electrostatic chuck by cooling the cooling water; A cooling water inlet connected to the central cooling unit and the edge cooling unit, respectively, and cooling water having a separate temperature to the central cooling unit and the edge cooling unit, respectively; Cooling device of the electrostatic chuck connected to the central cooling unit and the edge cooling unit, respectively, and comprises an outlet for outflow of the cooling water of the central cooling unit and the edge cooling unit. 제 1항에 있어서,The method of claim 1, 상기 중앙 냉각부와 가장자리 냉각부의 냉각수 순환 통로는 코일형의 관으로 이루어진 것을 특징으로 하는 정전척의 냉각 장치.The cooling water circulation passage of the central cooling unit and the edge cooling unit is a cooling device of the electrostatic chuck, characterized in that consisting of a coiled tube.
KR1020050062148A 2005-07-11 2005-07-11 A cooling device of electro static chuck KR20070007494A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9912258B2 (en) 2014-09-04 2018-03-06 Samsung Electronics Co., Ltd. Electrostatic chuck assemblies capable of bidirectional flow of coolant and semiconductor fabricating apparatus having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9912258B2 (en) 2014-09-04 2018-03-06 Samsung Electronics Co., Ltd. Electrostatic chuck assemblies capable of bidirectional flow of coolant and semiconductor fabricating apparatus having the same

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