KR200456997Y1 - Circuit substrate with removing area - Google Patents

Abstract

The circuit board having the removable region is disposed on the first insulating layer, the first insulating layer positioned around the removable region, the first laser resistance structure, the second insulating layer disposed on the first insulating layer, And a circuit layer, a second laser resistance structure, and a third insulating layer disposed on the second insulating layer. The second laser resistive structure is disposed on the second face and is positioned around the removable region and insulated from the circuit layer. There is at least one gap between the second laser resistance structure and the circuit layer, and the vertical projection of the gap on the first face overlaps the first laser resistance structure. The third insulating layer is disposed on the second insulating layer and exposes the portion of the circuit layer located in the removable region and the portion of the second laser resistive structure located in the removable region.

Description

Circuit board with removable area {CIRCUIT SUBSTRATE WITH REMOVING AREA}

The present invention generally relates to circuit boards having removable areas, and more particularly to circuit boards having removable areas in which the depth of laser processing can be controlled efficiently.

In response to the great demands of the market for light and thin construction and portability of electronic products, electronic components have been developed in a tendency to be small and thin in electronic products. In this regard, the prior art has provided a method of locally reducing the thickness of a circuit board.

1A-1C are sectional views showing the processing of a conventional circuit board, FIG. 2 is a top view of the circuit board of FIGS. 1A-1C, and sectional views of FIGS. 1A-1C showing the processing of a conventional circuit board are shown in FIG. Is cut along the line I-I '.

1A and 2, first, a circuit board 100 is provided, and the circuit board 100 includes a first insulating layer 110, a second insulating layer 120, a circuit layer 130, and a third The insulating layer 140 and the fourth insulating layer 150 are included. The second insulating layer 120, the third insulating layer 140, and the fourth insulating layer 150 are sequentially stacked on the first insulating layer 110, and the circuit layer 130 is the second insulating layer 120. ) Is disposed between the second insulating layer 120 and the third insulating layer 140. The circuit board 100 includes a pre-removable region L.

Next, referring to FIG. 1B, laser processing is used to remove portions of the third insulating layer 140 and the fourth insulating layer 150 located around the pre-removable region L. As shown in FIG. Also, referring to FIG. 1C, portions of the third insulating layer 140 and the fourth insulating layer 150 positioned in the pre-removable region L are removed to form the removable region L1. At this time, the circuit board P is almost formed. The thickness of the removable region L1 of the circuit board P is smaller than the thickness of the other regions of the circuit board P, so that in practical applications, the electronic device 200 may be disposed inside the removable region L1. Can be. In this way, the total thickness of the circuit board P with the electronic device 200 disposed therein can be reduced.

However, the laser processing for removing the third insulating layer 140 and the fourth insulating layer 150 is not easy to control the depth of the laser processing, and the second insulating layer 120 or even the first insulating layer ( It is ablation over the trench up to 110.

Therefore, the present invention provides a circuit board having a removable region, in particular a circuit board structure in which the depth of laser processing can be efficiently controlled.

The present invention provides a circuit board having a removable region. The circuit board includes a first insulating layer, a first laser resistance structure, a second insulating layer, a circuit layer, a second laser resistance structure and a third insulating layer. The first laser resistive structure is disposed on the first side of the first insulating layer and is positioned around the removable region. The second insulating layer is disposed on the first insulating layer and covers the first laser resistance structure. The circuit layer is disposed on the second side of the second insulating layer, and portions of the circuit layer extend out of the removable area to the removable area. The second laser resistive structure is disposed on the second face and is positioned around the removable region and insulated from the circuit layer. At least one gap exists between the second laser resistance structure and the circuit layer, and the vertical projection of the gap on the first face overlaps the first laser resistance structure. The third insulating layer is disposed on the second insulating layer and has an opening corresponding to the removable region, the opening exposing a portion of the circuit layer located in the removable region. The third insulating layer covers the portion of the second laser resistor structure.

In one embodiment of the present invention, the second laser resistance structure is a ring shaped structure, the ring shaped structure having at least one notch, and the circuit layer extends from the notch to the removable region. .

In an embodiment of the present invention, a plurality of gaps are present between the second laser resistor structure and the circuit layer, and the first laser resistor structures each independently include a plurality of dot-shaped structures.

In one embodiment of the present invention, the first laser resistance structure includes a rod-shaped structure or a ring-shaped structure, wherein the rod-shaped structure or the ring-shaped structure is perpendicular to the second laser resistance structure on the first surface. Overlap with the projection of

In one embodiment of the present invention, the second insulating layer has at least one pupil, the pupil located below the gap, the pupil revealing the first laser resistance structure.

In one embodiment of the present invention, a third laser resistance structure disposed on the second surface and located at the periphery of the preliminary removable region, wherein the third laser resistance structure is located at the periphery of the removable region. And a third laser resistor structure coupled to the portion of the circuit layer and insulated from the second laser resistor structure.

In one embodiment of the present invention, it further comprises a protective layer covering said portion of said circuit layer located in said removable region.

In one embodiment of the present invention, the opening exposes the portion of the second laser resistance structure located in the removable region.

The present invention provides a circuit board having a removable region, the circuit board comprising a first insulating layer, a circuit layer, a laser resistive structure, and a second insulating layer. The circuit layer is disposed on the face of the first insulating layer and extends from the outside of the removable area to the removable area. The laser resistive structure is disposed on the face, positioned around the removable region, and insulated from the circuit layer. At least one gap is present between the laser resistor structure and the circuit layer. The second insulating layer is disposed on the first insulating layer and has an opening corresponding to the removable region, the opening exposing a portion of the circuit layer located in the removable region.

The present invention also provides a circuit board having a removable region, the circuit board comprising a first insulating layer, a circuit layer and a second insulating layer. The circuit layer is disposed on the face of the first insulating layer, and portions of the circuit layer extend out of the removable area to the removable area. The second insulating layer is disposed on the first insulating layer and has an opening corresponding to the removable region, the opening exposing a portion of the circuit layer located within the removable region. A lateral groove is between the second insulating layer and the first insulating layer, the lateral groove is located around the removable area and in communication with the opening.

In summary, a circuit board having a removable region of the present invention may utilize a second laser resistor structure in which the present invention controls the depth of laser processing, and a first insulating layer under the first laser resistor structure may be used for laser processing. And a first laser resistor structure and a second laser resistor structure to enable use of the first laser resistor structure to prevent it from being affected.

The accompanying drawings are included to provide a further understanding of the subject innovation, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the subject innovation, and together with the description serve to explain the principles of the subject innovation.
1A-1C are cross-sectional views illustrating the processing of a conventional circuit board.
2 is a top view of the circuit board of FIGS. 1A-1C.
3A-3E and 4A-4C are cross-sectional views illustrating the processing of a circuit board according to an embodiment of the present invention.
5 is a top view of the second laser resistance structure and circuit layer of the substrates of FIGS. 3A-3C and 4A-4C.
6 is a top view of the substrate of FIGS. 3A-3C and 4A-4C.

Reference is made in detail to show preferred embodiments of the invention, and examples thereof are shown in the accompanying drawings. Wherever the same reference numerals are used in the drawings and description to refer to the same or like parts.

3A-3E and 4A-4C are cross-sectional views illustrating processing of a circuit board according to an embodiment of the present invention, and FIG. 5 is a second laser resistance structure and circuit of the substrate of FIGS. 3A-3C and 4A-4C. 6 is a top view of the substrate of FIGS. 3A-3C and 4A-4C.

In accordance with one embodiment of the present invention, the position of line I-I 'in FIG. 5 corresponds to the position of line I-I' in FIG. 6, and FIGS. 3A-3C illustrate processing of a circuit board. Note that in Figure 6 this is a cross sectional view along the line I-I '. In accordance with one embodiment of the present invention, the position of line II-II 'in FIG. 5 corresponds to the position of line II-II' in FIG. 6, and FIGS. 4A-4C illustrate processing of a circuit board. 6 is a cross-sectional view along the line II-II '.

First, with respect to Figs. 3A, 4A, 5 and 6, a substrate S is provided. The substrate S has a pre-removable region L, and includes a first insulating layer 310, a first laser resistance structure 320, a second insulating layer 330, a circuit layer 340, and a second A laser resistive structure 350, and a third insulating layer 360.

The first laser resistive structure 320 is disposed on the first face 312 of the first insulating layer 310 and is positioned around the pre-removable region L. FIG. The second insulating layer 330 is disposed on the first insulating layer 310 and covers the first laser resistance structure 320. The circuit layer 340 is disposed on the second side 332 of the second insulating layer 330, and a portion of the circuit layer 340 is outside the pre-removable region L. Expand to L).

The second laser resistive structure 350 is disposed on the second face 332 and is positioned around the pre-removable region L and insulated from the circuit layer 340. A portion of the second laser resistive structure 350 is located in the pre-removable region L and another portion of the second laser resistive structure 350 is located outside the pre-removable region L. FIG. A plurality of gaps G are between the second laser resistance structure 350 and the circuit layer 340, and the vertical projection of the gap G on the first surface 312 is dependent on the first laser resistance structure 320. Overlaps.

The third insulating layer 360 is disposed on the second insulating layer 330 and covers the circuit layer 340 and the second laser resistance structure 350. In an embodiment, the substrate S includes a fourth insulating layer 370 disposed on the third insulating layer 360.

In an embodiment, the substrate S further comprises a protective layer 380 covering a portion of the circuit layer 340 located in the pre-removable region L, so that the circuit layer 340 can be removed in subsequent processing. Protecting the affected by removing the third insulating layer 360 and the fourth insulating layer 370.

Next, with respect to FIGS. 3B, 4B, 5, and 6, the laser processing is performed to etch portions of the third insulating layer 360 and the fourth insulating layer 370 located around the pre-removable region. To be performed. The laser processing process forms a plurality of pupils T on the third insulating layer 360 and the fourth insulating layer 370, and the pupils T are located in the periphery of the pre-removable region L. FIG. Reveals portions of laser resist structure 350 and circuit layer 340.

In more detail, the laser machining is carried out in the periphery of the pre-removable region L (ie the portion indicated by dashed lines in FIGS. 5 and 6). Thus, when the laser light passes through the third insulating layer 360 and the fourth insulating layer 370, the laser light is blocked by the second laser resistance structure 350. In this way, the embodiment can use the second laser resistance structure 350 to control the depth of laser processing, increasing the yield of the article.

 In order to increase the effect that the second laser resistance structure 350 resists laser processing, the width D of the second laser resistance structure 350 is greater than the beam diameter of the laser light by design in an embodiment. Big. Preferably, the pupil T exposes only a portion of the second laser resistive structure 350 located in the periphery of the pre-removable region L.

The substrate S of the embodiment has a first laser resistance structure such that the laser light passing through the second insulating layer 330 under the gap G is resisted by the first laser resistance structure 320 under the gap G. Note that 320 is included. Thus, the first laser resistance structure 320 helps to protect the first insulating layer 310 below it from being affected by the laser processing and to control the depth of the laser processing. At this time, the laser processing is, for example, to form a plurality of pupils 334 on the second insulating layer 330 under the gap G.

3C, 4C, 5 and 6, portions of the third insulating layer 360 and the fourth insulating layer 370 positioned in the pre-removable region L may be removed from the removable region L1. The third insulating layer 360 and the fourth insulating layer 370 may be removed to form the openings O1 on the third insulating layer 360 and the openings O1 on the fourth insulating layer 370. The method of removal includes lifting off the treatment. In an embodiment, the third insulating layer 360 covers a portion of the second laser resistance structure 350, and the protective layer 380 is located in the third insulating layer 360 located in the pre-removable region L and It may be removed while removing a portion of the fourth insulating layer 370.

With respect to FIG. 3D, in an embodiment, mechanical machining is used to remove a portion of the second laser resistive structure 350 located in the removable region L1. In addition, mechanical processing is used to remove portions of the first laser resistance structure 320.

With respect to FIG. 3E, in other embodiments, the second laser resist structure 350 is removed by an etching process. Since the etching process entirely removes the second laser resistive structure 350, the third insulating layer 360 (to accommodate the portion of the laser resistive structure 350 originally covered by the third insulating layer 360). And a horizontal groove R is formed between the second insulating layers 330 by an etching process. The lateral groove R is located in the periphery of the removable area L1 and communicates with the openings O and O1. In addition, the first laser resistance structure 320 may be removed by an etching process.

The structure of the circuit board 300 in FIG. 3C is described in detail below.

3C, 4C, 5, and 6, the circuit board 300 of the embodiment includes a removable region L1, and the removable region L1 is a caved region. The circuit board 300 includes a first insulating layer 310, a first laser resistance structure 320, a second insulating layer 330, a circuit layer 340, a second laser resistance structure 350 and a third insulating layer. 360.

The first laser resistive structure 320 is disposed on the first surface 312 of the first insulating layer 310 and is positioned around the removable region L1. The second insulating layer 330 is disposed on the first insulating layer 310 and covers the first laser resistance structure 320. The circuit layer 340 is disposed on the second surface 332 of the second insulating layer 330, and the portion of the circuit layer 340 is from the outside of the removable region L1 to the removable region L1. Expand.

In an embodiment, the circuit board 300 includes a plurality of third laser resistance structures 390. The third laser resistance structures 390 are disposed on the second surface 332 and are positioned around the removable region L1. The third laser resistance structures 390 are connected to a portion of the circuit layer 340, and the circuit layer 340 is positioned around the removable region L1 and is insulated from the second laser resistance structure 350.

The second laser resistive structure 350 is disposed on the second surface 332 and is positioned around the removable region L1 and insulated from the circuit layer 340. A plurality of gaps G exist between the second laser resistance structure 350 and the circuit layer 340, and the vertical projection of the gap G on the first face 312 may result in the first laser resistance structure 320. )

In order to increase the effect that the first laser resistance structure 320 resists laser processing, the vertical projection of the gap on the first face 312 falls to the first laser resistance structure 320, such that The area of the first laser resistance structure 320 in an embodiment may be larger than the vertical projection area of the gap G on 312. In an embodiment, the second insulating layer 330 may have a plurality of pupils 334 positioned below the gap G. The cavities 334 expose the first laser resistive structure 320.

Specifically, in an embodiment, the second laser resistance structure 350 is a ring shaped structure, the ring shaped structure includes a plurality of notches B, and the portion of the circuit layer 340 is removed from the notch. It extends to the possible area L1. In addition, in an embodiment, each of the first laser resistance structures 320 may be a plurality of dot-shaped structures independently. In another embodiment, the first laser resistance structure 320 may be a rod-shaped structure or a ring-shaped structure, the rod-shaped structure or ring-shaped structure of the second laser resistance structure 350 on the first face 312 Can be superimposed in a vertical projection.

The third insulating layer 360 is disposed on the second insulating layer 330 and includes an opening O corresponding to the removable region L1. In an embodiment, the circuit board 300 further includes a fourth insulating layer 370. The fourth insulating layer 370 is disposed on the third insulating layer 360 and includes an opening O1 corresponding to the opening O. Openings O and O1 expose a portion of circuit layer 340 located in removable region L1 and a portion of second laser resistive structure 350 positioned in removable region L1. Further, in an embodiment, the protective layer 380 covers a portion of the circuit layer 340 located on the removable region L1 to protect the circuit layer 340 exposed by the openings O and O1. Is disposed in the removable region L1.

Note that, for example, the removable region L1 is not a limitation of the present invention. In other embodiments, the circuit board 300 may include, for example, a plurality of removable regions, the removable regions may optionally be located on the same side of the circuit board, and opposite sides of the circuit board. It can also be located at.

In summary, a circuit board having a removable region of the present invention may include a first laser resistor structure and a second laser resistor structure so that the present invention can utilize a second laser resistor structure to control the depth of laser processing. Include. In addition, the first laser resistance structure is used to prevent the first insulating layer below it from being affected by laser processing.

It will be apparent to those skilled in the art that various modifications and variations can be made in the structure of the present invention without departing from its scope and spirit. As seen above, the subject innovations cover modifications and variations of the subject innovations provided by them in the scope of the following claims and their equivalents.

Claims (10)

In a circuit board having a removable region,
A first insulating layer;
A first laser resistance structure disposed on a first side of the first insulating layer and positioned around the removable region;
A second insulating layer disposed on the first insulating layer and covering the first laser resistance structure;
A circuit layer disposed on a second surface of the second insulating layer, the circuit layer in which a portion of the circuit layer extends outside the removable region to the removable region;
A second laser resistor structure disposed on the second surface and positioned around the removable region and insulated from the circuit layer, the at least one gap between the second laser resistor structure and the circuit layer. The second laser resistor structure in which the vertical projection of the gap on the first surface overlaps with the first laser resistor structure; And
A third insulating layer disposed on the second insulating layer, the third insulating layer having an opening corresponding to the removable region, wherein the opening exposes a portion of the circuit layer located within the removable region, and the third insulating layer And a removable region comprising the third insulating layer covering a portion of the second laser resistive structure. The removable region of claim 1, wherein the second laser resistance structure is a ring shaped structure, the ring shaped structure having at least one notch, wherein the circuit layer extends from the notch to the removable region. Circuit board having a. The circuit of claim 1 wherein a plurality of gaps are present between the second laser resistor structure and the circuit layer, the first laser resistor structure having a removable region comprising a plurality of point-shaped structures independently of each other. Board. 4. The method of claim 1 or 3, wherein the first laser resistance structure comprises a rod-shaped structure or a ring-shaped structure, wherein the rod-shaped structure or the ring-shaped structure is on the first side of the vertical of the second laser resistance structure. A circuit board having a removable region overlapping the projection. The circuit board of claim 1, wherein the second insulating layer has at least one pupil, the pupil located below the gap, the pupil having a removable region exposing the first laser resistive structure. The circuit according to claim 1, wherein a third laser resistance structure disposed on the second surface and positioned around the removable region, wherein the third laser resistance structure is positioned around the removable region. And a removable region connected to said portion of said second laser resistor structure, said third laser resistor structure being insulated from said second laser resistor structure. The circuit board of claim 1, further comprising a protective layer covering the portion of the circuit layer located in the removable region. The circuit board of claim 1, wherein the opening has a removable region exposing the portion of the second laser resistive structure located in the removable region. In a circuit board having a removable region,
A first insulating layer;
A circuit layer disposed on the first insulating layer, the circuit layer in which a portion of the circuit layer extends outside the removable region to the removable region;
A laser resistor structure disposed on the face and positioned around the removable region and insulated from the circuit layer, the laser resistor structure comprising at least one gap between the laser resistor structure and the circuit layer; And
A second insulating layer disposed on said first insulating layer, said second insulating layer having an opening corresponding to said removable region, said opening defining said second insulating layer exposing said portion of said circuit layer located in said removable region; A circuit board having a removable region comprising. In a circuit board having a removable region,
A first insulating layer;
A circuit layer disposed on a face of the first insulating layer, the circuit layer extending a portion of the circuit layer from the removable region to the removable region; And
A second insulating layer disposed on the first insulating layer, the second insulating layer having an opening corresponding to the removable region, wherein the opening exposes the portion of the circuit layer located within the removable region; And a transverse groove between the first insulating layer and the transverse groove positioned around the removable region and including the second insulating layer in communication with the opening.

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