KR200336984Y1 - A device for inspecting surface and shape of an object of examination - Google Patents

Abstract

The present invention relates to a surface and shape inspection device, the upper top illumination having light of the same specific wavelength band is located on the upper top surface of the inspection unit, the lower top illumination having the light of the same specific wavelength band inspection unit Located at the lower side of the upper end of the light, the lower end of the light having the same specific wavelength band of light is located at the bottom of the inspection unit, the illumination unit for irradiating light evenly by these lights at the same time, each wavelength irradiated from the illumination unit An inspection area unit that illuminates the band lights on the surface of the object to be inspected, and an image signal of light of a specific wavelength band emitted from the object by the light emitted from the illumination unit in the inspection area unit as one image. Receive the video signal for the light of the other specific wavelength band as another image, and An image input unit for receiving an image signal for light as another image, an image processor for inspecting whether the surface and shape of the object to be inspected are defective by using the image information of the light of one or more specific wavelength bands; And a control unit which displays the result of the processing in the image processing unit on a screen, determines whether there is a defect in the object to be inspected, and outputs the result value.

Description

A device for inspecting surface and shape of an object of examination}

The present invention relates to a surface and shape inspection apparatus, and to a surface and shape inspection apparatus that can inspect the scratches, marks, cracks, surface contamination and the contour of the inspection object using a more optimized image.

In general, a vision system for inspecting contamination or surface contamination (stains, fingerprints), scratches, surface peeling, internal bubbles, etc. of inspection objects such as PCB copper plates, printed circuit boards, lead frames, or plate glass is a line scan. Scan) The method of inspecting the defective state of the surface using a camera is used.

In addition, by using an area camera, an inspection method of a chip scale packaging (CSP) semiconductor is also used in a semiconductor process, and a chip crack inspection process causes damage to a chip or a portion of the chip. In addition to checking whether it has fallen off, it also checks whether the mark is correctly printed on the semiconductor surface.

The difficulty in this inspection method is to optimize for the specific types of defective items for the inspection object by the angle between the illumination irradiated to the inspection object and the camera receiving the image of the inspection object, thereby preventing other types of defects. There was a problem that it was difficult to detect the type.

In addition, the inspection of the object to be inspected usually uses a black and white camera, and by appropriately disposing the position of the light using the method of acquiring and analyzing the image of the information on the defect of the object to be examined, the conventional technique for this As follows.

1A is a schematic diagram showing an illumination unit and an image input unit of a surface and shape inspection apparatus according to a first conventional example.

The surface and shape inspection apparatus according to the first conventional example, irradiates the surface of the object to be inspected using the general inspection light 119 irradiated from the upper surface illumination, the inspection object using the monochrome camera 321 Perform surface inspection of the object.

The inspection method by the upper surface illumination is a method in which the reflected light is input to the camera according to the roughness of the surface of the object to be inspected, and the field applicable to such inspection method is the inspection of the plane unevenness of the surface. It is mainly applicable to the scratch 261, the crack (surface crack 262), the 1Pin 263, and the surface peeling 264.

Therefore, as an example of the application of Fig. 1A illustrated, there is no difficulty in judging chip crack defects of CSP semiconductors and determining scratch defects of copper plates and plate glass.

However, there is a disadvantage in that it is not properly inspected at the time of the inspection of the mark defect, surface contamination (stains, fingerprints), for example, as a shape defect of the surface.

1B is a schematic diagram showing an illumination unit and an image input unit of a surface and shape inspection apparatus according to a second conventional example.

In the surface and shape inspection apparatus according to the second conventional example, the illumination of the surface of the object to be inspected by using a general inspection light 119 irradiated from the upper side lighting device, using a monochrome camera 321 Perform surface inspection on the object to be inspected.

The inspection method by the upper and lower side illumination is a method in which the reflected light is input to the camera according to the amount of light reflected from the shape of the surface of the object to be inspected. For example, it is mainly applicable to the mark defect 251, surface contamination (stain, fingerprint-252).

However, as an example of the application of FIG. 1B, there is a disadvantage in that it is difficult to acquire an image for determining a chip crack defect of a CSP semiconductor and for determining a scratch defect of a copper plate and a plate glass.

1C is a schematic diagram showing an illumination unit and an image input unit of a surface and shape inspection apparatus according to a third conventional example.

The surface and shape inspection apparatus according to the third conventional example, irradiates the surface of the object to be inspected using the general inspection light 119 irradiated from the lower illumination device, the inspection object using the monochrome camera 321 Perform surface inspection of the object.

The inspection method by the lower illumination is a method of inspecting according to the state of the shape of the object to be inspected and the amount of light input to the camera according to the internal bubble 272, the field which can be applied to such an inspection method, for example, It is mainly applicable to the shape defect 271 of the lead frame, the inner bubble 272 of the plate glass.

The lighting of the surface and shape inspection apparatus according to the conventional example as described above can be used in a combination of two or more, but when using only the change in the position of a single inspection light 119, the defect type of different properties by the illumination of different angles. Due to the generated interference, it was difficult to optimize the inspection image.

In addition, in order to construct an appropriate lighting condition according to the defect type for analyzing various defects on the object to be inspected, the cost of the system is increased by using multiple cameras and various lighting devices, and the complexity of the system is increased. There was a disadvantage of this being done.

The present invention has been made to solve the disadvantages of the prior art as described above, by using a single camera to inspect the inspection object to extract the image of the defect by the illumination of various angles, The object of the present invention is to provide a surface and shape inspection apparatus capable of inspecting and providing an optimal inspection image of an object to be inspected, so that defects can be easily detected.

1A is a schematic diagram showing an illumination unit and an image input unit of a surface and shape inspection apparatus according to a first conventional example;

1B is a schematic diagram showing an illumination unit and an image input unit of a surface and shape inspection apparatus according to a second conventional example;

1C is a schematic diagram showing an illumination unit and an image input unit of a surface and shape inspection apparatus according to a third conventional example;

Figure 2 is a schematic diagram showing the overall surface and shape inspection apparatus according to the present invention,

3A is a schematic diagram showing a first embodiment of the lighting unit shown in FIG. 2;

3b is a schematic view showing a second embodiment of the lighting unit shown in FIG. 2;

3C is a schematic view showing a third embodiment of the lighting unit shown in FIG. 2;

FIG. 4A is a schematic diagram showing a path through which an image using an upper surface illumination of a specific wavelength band is input to a camera by an arrow in FIG. 3A;

Figure 4b is a schematic diagram showing an arrow path of the image input to the camera using the upper and lower side lighting of the specific wavelength band in the illumination unit of Figure 3a,

Figure 4c is a schematic diagram showing the path in which the image is input to the camera using the lower illumination of another specific wavelength band in the illumination unit of Figure 3a with an arrow,

Figure 4d is a schematic diagram showing the path of the image input to the camera using the image of the side light of the specific wavelength band in the illumination unit of Figure 3c,

Figure 4e is a schematic diagram showing the path of the image input to the camera using the image of the top upper surface of another specific wavelength band in the illumination unit of Figure 3b,

Figure 5a is the transmission path of the light upon irradiation of the upper top lighting to the defect of the object to be inspected,

Figure 5b is the transmission path of light during irradiation of the upper and lower side illumination to the defect of the object to be inspected,

Figure 5c is the transmission path of the light when irradiating the bottom light on the defect of the object to be inspected,

5d is a light transmission path of the side lighting to the defect of the object to be inspected,

Figure 6a is a plan view showing a lead frame with a shape defect, surface contamination and scratches,

Figure 6b is a plan view showing a plate glass with internal bubbles, surface contamination and scratches,

Figure 6c is a side view showing a plate glass with internal bubbles, surface contamination and scratches,

6D is a plan view showing a CSP semiconductor with mark defects and crack defects,

6E is a side view showing a CSP semiconductor with mark defects and crack defects;

6F is a plan view showing a Gull Wing semiconductor with mark defects and 1 Pin;

6G is a side view showing a Gull Wing semiconductor with mark defects and 1 Pin;

Figure 6h is a plan view showing a PCB copper plate with surface contamination and scratches,

6i is a plan view of the pane with outer cracks and scratches;

6J is a side view of the pane with outer cracks and scratches;

FIG. 7A is an example of an image illustrating a state of scratching 261 from a planar image of an inspection target object 6a obtained by using top lighting in the illumination unit of FIG. 3A;

7B is an example of the image showing the state of the surface defects 252 from the planar image of the inspection target object 6a obtained by using the upper and lower side surface illumination in the illumination unit of FIG.

FIG. 7C is an example of an image showing a state of a shape defect 271 from a planar image of an inspection target object 6a obtained by using the lower illumination in the lighting unit of FIG. 3A;

FIG. 8A is an example of an image showing a state of the scratch 261 from the planar image of the inspection target object 6b obtained by using the upper surface illumination in the lighting unit of FIG. 3A;

FIG. 8B is an example of the image showing the state of the surface defects 252 from the planar image of the inspection target object 6b obtained by using upper and lower side surface illumination in the illumination unit of FIG. 3A;

FIG. 8C is an example of the image showing the state of the internal bubble 272 from the planar image of the inspection target object 6b obtained using the lower illumination in the illumination unit of FIG. 3A;

FIG. 9A is an example of an image showing a state of crack defects 262 from a planar image of an inspection object 6d obtained by using top lighting in the lighting unit of FIG. 3B;

FIG. 9B is an example of an image showing a state of a mark and a mark defect 251 from a planar image of an inspection object 6d obtained by using upper and lower side surface illumination in the lighting unit of FIG. 3B;

10A is an example of the image showing the state of 1Pin 263 from the planar image of the inspection target object 6f obtained using the upper surface illumination in the illuminating unit of FIG. 3B;

FIG. 10B is an example of an image showing a state of a mark and a mark defect 251 from a planar image of the inspection target object 6f obtained by using upper and lower side surface illumination in the lighting unit of FIG. 3B;

FIG. 11A is an example of an image showing a state of scratching 261 and surface peeling 261 from a planar image of the inspection target object 6h obtained by using the upper surface illumination in the lighting unit of FIG. 3B;

FIG. 11B is an example of the image showing the state of the surface defect 252 from the planar image of the inspection object 6h obtained by using the upper and lower side surface illumination in the lighting unit of FIG. 3B;

12A is an example of the image showing the state of the scratch 261 from the planar image of the inspection target object 6i obtained by using the top surface illumination in the illumination unit of FIG.

FIG. 12B is an example of the image showing the state of the outer crack 262 from the planar image of the inspection target object 6i obtained by using side lighting in the illumination unit of FIG. 3C;

FIG. 12C is an example of the image showing the state of the scratch 269 from the planar image of the inspection target object 6i obtained using the lower illumination in the illumination unit of FIG. 3C;

13A is a graph of light distribution in the RGB wavelength band in the visible light band,

13B is a structural diagram of a band pass filter;

13c is a structural diagram of a light transmitting membrane,

13d is an exemplary view of a modification of the light transmitting film;

Figure 14a is a table showing the angle of the position of each type of lighting in the lighting unit,

14b is a table separating the types of defects;

FIG. 15A is an example of an image synthesized from FIGS. 7A and 7B to facilitate detection of a scratch 261 defect.

Fig. 15B is an example of detection of a scratch 261 defect found from the work of the images synthesized by 7A and 7B.

Figure 16a is a schematic view showing the lighting unit as an example 1 of the modification of the surface and shape inspection apparatus according to the present invention,

Figure 16b is a schematic view showing the lighting unit as an example 2 of the modification of the surface and shape inspection apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

100: lighting unit 110: type of lighting

111: top top side lighting 112: top top side lighting

113: upper and lower side lighting 114: side lighting

115: bottom lighting 119: general inspection lighting

120: light transmission membrane 130: half mirror

140: band pass filter 150: visible light band light

180: light of RGB wavelength band 181: light of red wavelength band

182: light of green wavelength band 183: light of blue wavelength band

190: light of a specific wavelength band 191: light of a specific wavelength band

192: light of another specific wavelength band 193: light of another specific wavelength band

200: inspection unit 210: the object to be inspected

211: plate glass 212: lead frame

213: PCB Copper Plate 214: Gull-Wing Semiconductor

215: CSP semiconductor 250: surface color defect type

251: Mark defects 252: Surface contamination-stains, fingerprints

260: surface plane defect type 261: scratch

262: Crack-Crack 263: 1 Pin

264: Surface scraping 270: Internal / external shape defect type

271: shape defect 272: internal bubble

300: image input unit 310: lens

320: RGB camera 321: monochrome camera

330: Image input board 340: Type of input image

341: Image input to the image input unit in the upper top lighting

342: Image input to the image input unit in the upper upper side lighting

343: Image input to the image input unit in the upper and lower side lighting

344: Image input to the image input unit in the side lighting

345: Image input to the image input unit in the lower light

400: image processing unit 410: CPU

420: memory 500: control unit

510: monitor 520: secondary memory device

530: communication device 600: external signal

Surface and shape inspection apparatus according to the present invention for achieving the above object, the upper surface illumination having one light of the same specific wavelength band is located on the upper surface of the inspection unit, the other having the light of the same specific wavelength band The lower side illumination is located at the lower side of the upper end of the inspection unit, and the lower end illumination having the same specific wavelength band of light is located at the lower end of the inspection unit, which illuminates the light evenly by these lights at the same time, and the illumination unit An image signal for a light of a specific wavelength band emitted from the object to be inspected by the illumination region irradiated from the illumination unit in the inspection region portion to illuminate the light of each wavelength band irradiated from the inspection object portion; Is input as one image, video signal for light of a specific wavelength band is input as another image, and Examine the surface and shape of the object to be inspected for defects by using an image input unit which receives an image signal of light of another specific wavelength band as another image, and image information of the light of the one or more specific wavelength bands. And an image processing unit configured to display a result of the processing in the image processing unit on a screen, determine whether the object to be inspected is defective, and output a result value thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic view showing the surface and shape inspection apparatus according to the present invention as a whole, as can be seen with reference to the same figure, the surface and shape inspection apparatus according to the present invention, the lighting unit 100, the inspection unit 200, the image The input unit 300 includes an image processing unit 400 and a control unit 500.

The image input unit 300 is a portion that receives an image of the object to be inspected 210 from the inspection unit 200, and is composed of a lens 310, an RGB camera 320, and an image input board 330. The image processing unit 400 is a section for determining whether an image of an object to be inspected is defective or not, and includes a CPU (Central Processing Unit) 410, a memory 420, and an object to be inspected for defects. .

The control unit 500 may control the lighting of the lighting unit 100 and the control of the external signal 600, the control of the object to be inspected by the image processing unit 400, the monitor 510, the auxiliary memory Device 520, communication device 530, and the like.

FIG. 3A is a schematic view showing a first embodiment of the lighting unit shown in FIG. 2, and illustrates the configuration of the lighting unit 100 when the inspection object 210 is the plate glass 211 in the same view.

As the configuration of the apparatus, the upper top lighting 111, the upper lower lighting 113, the lower lighting 115, the light transmitting film 120, the half mirror 130 in the lighting unit 100 And arrangement of the RGB camera 320 of the surface contamination-stain, fingerprint 252, scratch 261, internal bubble 272, and image input unit 300 with respect to the plate glass 211.

FIG. 3B is a schematic view showing a second embodiment of the lighting unit shown in FIG. 2, which shows the configuration of the lighting unit 100 when the inspection object 210 is the CSP semiconductor 215.

As the configuration of the apparatus, the upper top lighting 111, the upper upper lighting 112, the upper lower lighting 113, the light transmitting film 120, the half mirror (Half Mirrior) in the lighting unit 100 ( 130 and the arrangement of the mark defect 251, the crack-break 262, and the RGB camera 320 of the image input unit 300 with respect to the CSP semiconductor 215.

FIG. 3C is a schematic view showing a third embodiment of the lighting unit shown in FIG. 2. In FIG. 3C, the structure of the lighting unit 100 when the inspection object 210 is an edge inspection of the plate glass 211 is illustrated.

As a structure of the apparatus, the upper top lighting 111, the side lighting 114, the lower lighting 115, the light transmitting film 120, the half mirror (130) and the plate glass in the lighting unit 100 The arrangement of the scratch 261, the internal bubble 262, and the RGB camera 320 of the image input unit 300 with respect to 211 is shown.

FIG. 4A is a schematic diagram showing, as an arrow, a path through which an image using the top top light 111 that emits light 191 of a specific wavelength band from the illumination unit of FIG. 3A is input to the image input unit, with the top top light 111 The irradiated light is reflected on the half mirror 130 and irradiated to the inspection object 210, and the light reflected from the inspection object 210 passes through the half maze and is input to the RGB camera 320 so that The configuration of the path to the image 341 input to the image input unit is shown.

FIG. 4B is a schematic diagram showing, as an arrow, a path through which an image using the top and bottom side lighting 113, which emits light 192 of another specific wavelength band from the illumination unit of FIG. 3A, is input to the image input unit, with the top and bottom side lighting ( The light irradiated from 113 is irradiated to the inspection object 210, and the light reflected from the inspection object 210 passes through the half-maze and is input to the RGB camera 320 to be input to the image input unit in the upper and lower side lighting. The configuration of the path to the image 342 is shown.

FIG. 4C is a schematic diagram showing, as an arrow, a path through which an image using a lower light 115 that emits light 193 of another specific wavelength band from the illumination unit of FIG. 3A is input to the image input unit, as shown in FIG. The irradiated light passes through the inspection object 210, and the light transmitted through the inspection object 210 passes through the half-maze and is input to the RGB camera 320 to be input to the image input unit in the lower light. The path to the configuration is shown.

FIG. 4D is a schematic diagram showing, as an arrow, a path through which an image using a side light 114, which emits light 192 of another specific wavelength band from the illumination unit of FIG. 3C, is input to the image input unit. The reflected light irradiates the object 210, and the light reflected from the object 210 passes through the half-maze and is input to the RGB camera 320 to the image 344 input from the side light to the image input unit. The path configuration is shown.

FIG. 4E is a schematic diagram showing, as an arrow, a path through which an image using the upper top lighting 112 for emitting light 193 of another specific wavelength band from the illumination unit of FIG. 3B to the image input unit, with an upper upper side lighting The light irradiated from 112 irradiates the inspection object 210, and the light reflected from the inspection object 210 penetrates the half-maze and is inputted to the RGB camera 320 so that the image input unit is connected to the image input unit. The configuration of the path to the input image 342 is shown.

5A to 5D illustrate a method of irradiating general lighting according to the type of defect of the object to be inspected 210. The object to be inspected 210 includes at least one item of such defects.

FIG. 5A illustrates light reflection characteristics of an example of a defect of the scratch 261 caused by light reflection when the top object is irradiated when the object to be inspected 210 is a PCB copper plate 213. FIG. Detection of the optimized image for the case of 260 is possible.

In general, according to the degree of uniformity of the surface of the surface is determined the degree to which the light irradiated from the upper surface illumination is reflected from the surface, the rougher the surface of the surface is reduced the amount of light reflected from the surface. Therefore, the types of surface planar defect types 260 that can be inspected by this type include plate glass 211, lead frame 212, scratch 261 of PCB copper plate 213, surface peeling 264, and cracks of CSP semiconductors. Crack 262, 1Pin 263 of a Gull-Wing semiconductor, or the like.

FIG. 5B shows the surface contamination-staining according to the reflection of light when the upper object side lighting 112 and the upper side lighting 113 are irradiated when the object to be inspected 210 is a PCB copper plate 213, and a fingerprint 252. As an example of the reflection of light with respect to an example of the defect, it is possible to detect an optimized image for the case of the surface color defect type 250.

In general, the degree of reflection of light emitted from the upper upper side lighting 112 or the upper lower side lighting 113 is reflected from the surface according to the discoloration or contamination of the surface, the color of the surface is dark, As the uniformity increases, the amount of light input to the image input unit decreases. Therefore, the types of surface color defect types 250 that can be inspected by this type include the surface contamination of the plate glass 211, the lead frame 212, the PCB copper plate 213, the stains, the fingerprints 252, and the Gull Wing semiconductor 214. And the defective mark 251 of the CSP semiconductor 215.

FIG. 5C illustrates light reflection characteristics of an example of a defect in the internal bubble 272 according to the reflection of light when the lower illumination 115 is irradiated when the object 210 is the plate glass 211. It is possible to detect an optimized image in the case of the external shape defect type 270.

In general, the degree of light transmitted from the bottom light is determined according to the type of shape, and the internal bubble 272 of the plate glass 211 is included in the type of the internal and external shape defect type 270 that can be inspected by this type. For example, the external shape defect 271 of the lead frame 212 is an example.

FIG. 5D illustrates a light reflection feature for an example of a crack-broken 262 defect due to light reflection when the object to be inspected 210 is irradiated to the outer side of the plate glass 211 with the side light 114. Optimized image detection is possible.

6A to 6J illustrate an example of the type of inspection object 210 and the kind of defect.

7A to 12B illustrate an upper upper surface light 111, an upper upper light side 112, an upper lower side light 113, a side light 114, and a lower side light 115 in the lighting unit of the inspection object 210. The types of defects are illustrated at the time of investigation.

FIG. 13A illustrates a graph of the distribution of the RGB wavelength band in the light 150 of the general visible light band, wherein the light section 181 of the red wavelength band, the light section 182 of the green wavelength band, and blue The light section 183 of the wavelength band is shown.

FIG. 13B illustrates an example of a structure diagram of the band pass filter 140, which is a method for configuring lighting of a specific wavelength band using a lamp of a general visible light band, As a configuration method, the configuration of the lighting using a lamp that emits light of a specific wavelength band, such as a red LED, a green LED, a blue LED, etc., and in another way, the light 150 of the visible light band is specified as shown in the figure. An example of a method of transmitting only light in a wavelength band is presented.

For example, when the band pass filter 140 is configured to transmit only a light section 620 to 680 nanometers of light in the red wavelength band, the irradiated visible light passes through the filter to emit only light in the red wavelength band. It is possible to configure.

FIG. 13C illustrates an example of the structural diagram of the light transmitting film 120. Light irradiated from the light is made of a material that evenly scatters through the light transmitting film. For example, the light transmitting film 120 may be made of opaque acrylic and opaque glass. have.

FIG. 13D is an exemplary diagram of a deformation of the light transmission film, and shows an example in which a pattern 121 is formed on the light transmission film so that a pattern for transmitted light can be projected onto the inspection object.

FIG. 14A is a table illustrating angles between the lights of a specific wavelength band and an object to be inspected according to the present invention.

FIG. 14B is a table illustrating types of inspection defects 280, which are classified into a surface color defect type 250, a surface plane defect type 260, and an internal / external shape defect type 270.

Now with reference to the accompanying drawings will be described the effect of the present invention configured as described above.

Hereinafter, first, the operation of the lighting unit 100, the inspection unit 200, and the image input unit 300 will be described. Secondly, the operation of the image processing unit 400 and the control unit 500 will be described. do.

First, the operation of the lighting unit 100, the inspection unit 200 and the image input unit 300 is as follows.

As shown in FIG. 2, when the test start signal is input to the controller 500 by the external signal 600, the controller 500 outputs a signal for controlling the illumination to the illumination unit 100 at the same time. .

Hereinafter, the first embodiment of the lighting unit, the second embodiment of the lighting unit, and the third embodiment of the lighting unit will be described according to the inspection type of the inspection object 210.

An embodiment of the first lighting unit is described in detail as follows.

As shown in FIG. 3A, as a main feature of the first embodiment of the lighting unit, as shown in 14b of the inspection object, the surface color defect type 250, the surface plane defect type 260, and the internal / external shape defects The main feature is that the type of the defect of the type 270 is included, for example, it can be applied to the inspection of the presence or absence of the inspection object such as the plate glass 211, the lead frame (212).

As shown in FIG. 3A, the lighting unit 100 irradiates the upper and upper side lights 111, the upper and lower side lights 113, and the lower side lights 115 at the same time as shown in FIG. 3A.

The upper top lighting 111 is composed of lights consisting of light 191 in a specific wavelength region. For example, only a red light emitting diode or a light having a red wavelength band may emit light 181 in a red wavelength band. It can comprise a lamp etc. provided with the bandpass filter which permeate | transmits.

Light generated from the upper top light 111 is scattered through the light transmission film 120, as shown in Figure 4a, the scattered light is reflected in the half mirror 130, reflected from the half mirror 130 The reflected light is irradiated to the inspection unit 200 to irradiate the light to the inspection object 210 as a whole to reflect the light from the surface of the inspection object 210, and the reflected light passes through the half-mirror to the RGB camera 320. The image is captured by the red image pickup device, and the captured image signal is transferred to the image input board 330 to form an image 341 input to the image input unit in the top light.

The upper and lower side surface lighting 113 is made up of lights composed of light 192 in other specific wavelength ranges. For example, a green light emitting diode or a green wavelength band capable of emitting light 182 in a green wavelength band. And a lamp having a band pass filter that transmits only the light.

Light generated from the upper and lower side surface lighting 113 is scattered through the light transmitting film 120, as shown in Figure 4b, the scattered light is irradiated to the inspection unit 200, the object to be inspected 210 By irradiating light on the entire surface reflects the light according to the type of the surface color of the inspection object 210, the reflected light is transmitted through the half mirror to be imaged on the green image pickup device of the RGB camera 320, the image signal Is transmitted to the image input board 330 is composed of an image 343 input to the image input unit in the upper and lower side lighting.

The lower light 115 is made of lights made of light 193 of another specific wavelength region, for example, a blue light emitting diode or a blue wavelength band capable of emitting light 183 of a blue wavelength band. It can comprise a lamp etc. provided with the bandpass filter which transmits only light.

The lower illumination light generated from the lower illumination 115 is scattered through the light transmission film 120 as shown in FIG. 4C, and the scattered light is irradiated to the inspection unit 200 to emit light to the inspection object 210. The light is transmitted through the entire object according to the internal / external shape of the inspection object 210, and the transmitted light is transmitted through the half mirror to be captured by the blue image pickup device of the RGB camera 320. The signal is transmitted to the image input board 330 is composed of the image 345 input to the image input unit in the lower light.

As described above, in the first exemplary embodiment of the lighting unit, the upper lower side lighting 113 may be changed to the upper upper side lighting 112 as necessary to obtain an optimal state of the bad image.

In the first embodiment of the lighting unit, a process of acquiring an image of the image input unit according to the type of defect of the inspection target object 210 for each lighting of FIG. 3A will be described below.

In the inspection of the defect of the lead frame shown in FIG. 6A, there are a scratch 261, surface contamination 252, and shape defect 271. In FIG. 7A, an image inputted to the image input unit from the upper surface illumination ( 341) can receive a bad type image for the scratch 261, in Figure 7b the image of the poor type for the surface contamination 252 in the image 343 input to the image input unit in the upper and lower side lighting In FIG. 7C, the image of the defective type for the shape defect 271 may be input from the image 345 input to the image input unit in the lower light.

In the inspection of the defect of the plate glass shown in FIG. 6B, there is a scratch 261, surface contamination 252, and internal bubbles 272. In FIG. 8A, the image 341 inputted to the image input unit in the upper surface illumination is shown. ) Can receive an image of the defect type for the scratch 261, and in FIG. 8b receives an image of the defect type for the surface contamination 252 from the image 343 input to the image input unit in the upper and lower side lighting. In FIG. 8C, a bad type image of the shape defect 271 may be input from the image 345 input to the image input unit in the bottom light.

Next, a second embodiment of the lighting unit will be described.

As shown in FIG. 3B, the main feature of the second embodiment of the lighting unit is that the object to be inspected includes a defect type of the surface color defect type 250 and the surface plane defect type 260 as shown in FIG. 14B. The main feature is, for example, it can be applied to the inspection of the inspection target object, such as CSP semiconductor 215, Gull-Wing semiconductor 214, PCB copper plate 213.

The lighting unit 100 is irradiated by the signal of the control unit 500, as shown in Figure 3b, to irradiate the upper top lighting 111, the upper upper side lighting 112, the upper lower side lighting 113 at the same time. do.

The upper top lighting 111 is composed of lights consisting of light 191 of a specific wavelength region, for example, may be configured as an illumination capable of emitting light 181 of the red wavelength band, the upper top surface The light generated from the illumination 111 is transmitted to the image input board 330 through the same procedure as illustrated in FIG. 4A to form an image 341 input to the image input unit in the top light.

The upper upper side light 112 is made of lights made of light 193 of another specific wavelength region, for example, it may be configured as an illumination that can emit light 182 of the green wavelength band, The light generated from the upper upper side lighting 112 is transmitted to the image input board 330 through the same process as shown in FIG. 4E to form an image 342 input to the image input unit in the upper upper side lighting.

The upper and lower side side lighting 113 is made up of lights consisting of light 192 in another specific wavelength region, for example, a green light emitting diode or a blue wavelength capable of emitting light 183 in a blue wavelength band. It can be configured as a lamp having a band pass filter for transmitting only the light of the band.

As shown in FIG. 4B, the light generated from the upper and lower side surface lighting 113 is scattered through the illumination transmitting film 120 in the same manner as the upper and upper side lighting 112, and the scattered light is inspected ( 200 is irradiated with light, and reflects the light to the inspection object 210 as a whole according to the type of the surface color of the inspection object 210, the reflected light is transmitted through the half mirror to the RGB camera 320 The image is captured by a blue image pickup device, and the captured image signal is transmitted to the image input board 330 to form an image 343 input to the image input unit in the upper and lower side lighting.

In the second embodiment of the lighting unit, the upper upper side lighting 112 and the upper lower side lighting 113 may be selectively used as necessary to obtain the optimal state of the bad image for the surface color defect type 250. Do.

In the second embodiment of the lighting unit, a process of acquiring an image of the image input unit according to the type of defect of the inspection target object 210 for each lighting of FIG. 3B will be described below.

In the inspection of the defect of the CSP semiconductor 215 in FIG. 6D shown above, there is a mark defect 251 and a crack-break 262 for the chip 219 in FIG. 6E. From the image 341, which is input to the image input unit in illumination, a bad type image of the crack-break 262 of the chip may be input. In FIG. 9B, the image 342 inputted to the image input unit in the upper upper side illumination is In the upper and lower side lighting, the image of the defective type for the mark defect 251 may be input from the image 343 input to the image input unit.

In the inspection of the failure of the Gull-Wing semiconductor 214 shown in FIG. 6F, there are mark defects 251 and 1Pin 263. In FIG. 10A, an image 341 inputted to the image input unit in the upper surface illumination is shown. ) Can receive an image of the position of the 1Pin 263, and in FIG. 10B, the image 342 inputted to the image input unit in the upper side lighting or the image 343 inputted to the image input unit in the lower side illumination. It is possible to receive an image of the defect type for the mark defect 251 from.

In the inspection of the defect of the PCB copper plate 213 shown in FIG. 6H, surface contamination-staining, fingerprint 252, scratch 261, surface peeling 264, and the like are inspected. From the image 341, which is input to the image input unit in illumination, the image of the defective type for the scratch 261 and the surface peeling 264 may be input. In FIG. 11B, the image 343 input to the image input unit in the upper and lower side illuminations. ) Or a bad type image of the surface contamination-stain, fingerprint 252 may be input from the image 343 input to the image input unit in the upper and lower side illumination.

Next, a third embodiment of the lighting unit will be described.

As shown in FIG. 3C, the main features of the third embodiment of the lighting unit include types of defects of the surface plane defect type 260 and the internal / external shape defect type 270 as shown in 14c in which the object to be inspected is shown. The main feature is that it can be applied to the inspection of the presence or absence of the inspection target object, such as the outer inspection of the plate glass 211.

As shown in FIG. 3C, the lighting unit 100 simultaneously irradiates the upper and upper side lights 111, the side lights 114, and the lower side lights 115 by the signal of the controller 500.

The upper top lighting 111 is composed of lights consisting of light 191 of a specific wavelength region, for example, may be configured as an illumination that can emit light 181 of the red wavelength band, the upper top surface The light generated from the illumination 111 is transmitted to the image input board 330 through the same procedure as illustrated in FIG. 4A to form an image 341 input to the image input unit in the top light.

The side light 114 is composed of lights consisting of light 192 of another specific wavelength region, for example, a green light emitting diode or a light of green wavelength band which can emit light 182 of green wavelength band. It can comprise a lamp etc. provided with the bandpass filter which permeate | transmits only.

Light generated from the side light 114, as shown in Figure 4d, is scattered through the light transmission film 120, the scattered light is irradiated to the inspection unit 200, the inspection object 200 By irradiating the light as a whole reflects the light according to the type of the surface color of the inspection object 210, the reflected light is transmitted through the half mirror to be imaged on the green image pickup device of the RGB camera 320, the image signal The image 344 is transmitted to the image input board 330 and input to the image input unit in side lighting.

The lower light 115 is made of lights consisting of light 193 of another specific wavelength region, for example, may be configured as an illumination that can emit light 183 of the blue wavelength band, The lower illumination light generated from the illumination 115 is transmitted to the image input board 330 through the same procedure as illustrated in FIG. 4C to form an image 345 input to the image input unit in the lower illumination.

In the third embodiment of the lighting unit, a process of acquiring an image of the image input unit according to the type of defect of the inspection target object 210 for each lighting of FIG. 3C will be described below.

In the outline inspection of the plate glass shown in FIG. 6I, there are scratches 261 and 269, crack-breaks 262, and shape defects 271. In FIG. From the image of the bad type for the upper surface scratch 261 can be received from, in Figure 12b is a defect for the information on the side shape and crack-break (262) from the image 344 input to the image input unit in the side lighting 12C may receive a type of image, and in FIG. 12C, a bad type image of the bottom surface scratch 269 may be input from the image 345 input to the image input unit in the bottom light.

Secondly, the operations of the image processor 400 and the controller 500 for extracting defect information from an image using the image information input from the image input unit are as follows.

In the image processing unit 400, an image captured in a red wavelength band captured by an RGB camera from the image input unit 300, an image captured in a green wavelength band, an image captured in a blue wavelength band, and the auxiliary storage device 520. After loading the program of the surface and shape inspection device stored in the main memory device 420, the defect type of the object to be inspected is determined through the image processing process using the image information and the CPU transferred from the image input unit.

An example of an image processing process will be described in detail as to the detection of defects in scratches in the inspection of lead frame defects.

In one of the conventional methods for inspecting the scratch defect of a lead frame, a general inspection lighting apparatus in the visible light region is mainly used in addition to the use of a black and white (B / W) camera.

Therefore, the image 341 input to the image input unit in the upper top lighting and the image 345 input to the image input unit in the lower lighting cannot be simultaneously input at the same position. After storing the image of the standard lead frame in the memory using the image 341, compared with the image 341 input to the image input unit from the upper surface illumination input from the object to be inspected, the presence of scratch defects and the surface of the lead frame The presence of contamination-stain / fingerprints was detected.

In the existing inspection method, in addition to inputting a standard image similar to a standard lead frame to detect a scratch of the lead frame, the image of the lead frame is rotated or shifted in the position of the lead frame in the image input from the inspection object. Position interpolation and calculation were difficult to detect the presence or absence of defects.

The scratch frame inspection method of the lead frame in the image processing unit according to the present invention is as follows.

Image 341 input to the image input unit from the upper surface illumination at the same position of the object to be inspected by using the RGB camera of the image input unit and lighting devices that emit light of a specific wavelength band of the illumination unit, and the image from the upper lower side illumination Since the image 343 inputted to the input unit and the image 345 inputted to the image input unit at the bottom light can be simultaneously input, the image from the upper top to the image input unit using the image 345 inputted to the image input unit at the lower light. By combining with the input image 341, it is possible to easily detect the presence or absence of scratch failure of the lead frame.

In detail, when the object to be inspected is a lead frame having a shape defect, surface contamination and scratches as shown in FIG. The image 345 input to the image input unit in the lower light is shown in FIG. 7C.

The image processor synthesizes two images in the following manner.

Frame A: Lead frame image input to the image input unit in the upper top lighting (Fig. 7a)

Frame B: Lead frame image input to the image input unit in the lower light (Fig. 7c)

Frame C: Image composed of Frame A and Frame B (FIG. 15A)

Therefore, Frame C can be calculated as follows.

Frame C = ((Frame A) OR (Frame B))

That is, it is assumed that arbitrary position coordinates 412 in the image of the object to be inspected are (x, y), and pixels in the image are composed of 8-bit values (0 to 255), and FIGS. 7A and 7C. Assuming that the position 412 of any position coordinate of is located in the outer region of the lead frame, the operation using the two coordinates is as follows.

Pixel (x, y) A: Pixel value of (x, y) position coordinate in Frame A (412 in FIG. 7A)

Pixel (x, y) B: Pixel value of (x, y) position coordinate in Frame B (412 in FIG. 7C)

Pixel (x, y) C: Pixel value of (x, y) position coordinate in Frame C (412 in FIG. 15A)

Assume that Pixel (x, y) A = 100,

Assuming Pixel (x, y) B = 255,

Pixel (x, y) C = (Pixel (x, y) A | Pixel (x, y) B) = 255.

(Where the symbol | is a bit operator.)

After the background is removed as shown in FIG. 15A, the operation processing procedure of the image processing unit may synthesize leadframe image information including only scratch defects.

Therefore, by extracting the outline of the defect image using the image information in Figure 15a to calculate the size of the scratch defect (461), it can be determined whether there is a defect as shown in Figure 15b, among the elements of the difficult point in the conventional inspection method The difference in displacement when one object is changed (position change in x, y, rotation of the object) is calculated through the synthesis of two images only, without calculating the position interpolation. Accurate information about scratches can be calculated easily.

Surface contamination-stain / fingerprints (252) defects can also be detected in this way by using the image (343) input from the upper and lower side lighting to the image input unit, plate glass, lead frame, PCB copper plate, Gull-Wing semiconductor, Surface and shape using an appropriate image input according to the surface color defect type 250, the surface plane defect type 260, the internal / external shape defect type 270 according to the type of the inspection object 210 such as CSP semiconductor, etc. By using the inspection apparatus program, the image processor may calculate the inspection failure 280.

In the control unit 500, the image of the inspection target object processed by the image processing unit 40 is displayed on the monitor 50, and is provided through the communication device 530 to an external computer or a control device. .

In the present invention, when inspection of a bad type of the object to be inspected, when the state of the image is insufficient to adjust the position of the illumination, the light device of the specific wavelength band input to the image input unit by the illumination device 191 The synthesized image, the image composed of the light 192 of another specific wavelength band, and the image composed of the light 193 of another specific wavelength band may be synthesized, respectively, to achieve the same effect as adjusting the position of the height of the illumination.

Therefore, it is possible to shorten the inspection setup time during the semiconductor inspection because no position adjustment for lighting is required.

In addition, the present invention is described by illustrating a specific embodiment, but the present invention is not limited to the above embodiment. A person skilled in the art can easily make various modifications or modifications to the present invention, such as the deformation of the top light as shown in FIG. 16A or the angle of the RGB camera as shown in FIG. It should be kept in mind that it is included in the scope of the present invention as long as it uses.

As described above, the surface and shape inspection apparatus according to the present invention, the illumination of a specific wavelength band irradiated simultaneously at different positions and angles of the lighting unit, and the image of the light of the specific wavelength bands captured by the RGB camera Therefore, the optimal inspection image for the defect type of the object to be inspected can be easily extracted.

Therefore, it is possible to easily extract the optimized images of the types of the defect types according to the position and angle of the inspection object and the illumination, which is the most problem in the defect type of the inspection object using the existing image processing, It reduces the error of inspection caused by improper image input during image processing, and can extract the image information of the optimal state for deterioration of reliability, increase of cost, and defect of system due to the configuration of multiple cameras and lighting devices. have.

Such, the present invention is possible in a variety of applications in the field of using a plurality of cameras and lighting devices for the inspection of one inspection object.

Claims (22)

One top top light with light of the same specific wavelength band is located on the top top of the inspection part, and the top bottom light with light of the same specific wavelength band is located on the top bottom side of the inspection part, and another same specific wavelength A lighting unit having a band of light located at the bottom of the inspection unit and irradiating light evenly by these lights at the same time; An inspection region unit for illuminating the illumination of each wavelength band irradiated from the illumination unit on the surface of the inspection object; In the inspection area unit, an image signal of light of a specific wavelength band emitted from an object to be emitted from the object to be inspected by the lights irradiated from the illumination unit is input as one image, and an image signal of light of another specific wavelength band is converted into another image. An image input unit which receives an image signal of light of another specific wavelength band as another image; An image processing unit for inspecting whether the surface and shape of the object to be inspected are defective by using the image information of the light of the one or more specific wavelength bands; And a control unit which displays the result of the processing in the image processing unit on a screen, determines whether there is a defect in the object to be inspected, and outputs the result value. The surface and shape inspection apparatus according to claim 1, wherein the illumination unit is configured such that the same light sources in a specific wavelength region are positioned at a constant height. The surface and shape inspection apparatus according to claim 1, wherein the illumination unit is configured to emit light of each specific wavelength region in a light source of each specific wavelength region. The surface and shape inspection apparatus according to claim 1, wherein the illumination unit uses light emitting diodes in the red wavelength region, light emitting diodes in the green wavelength region, and light emitting diodes in the blue wavelength region. The illumination device of claim 1, wherein the illumination unit includes a band pass filter in the red wavelength region, a band pass filter in the green wavelength region, and a band pass filter in the blue wavelength region. Surface and shape inspection device, characterized in that each used. The surface and shape inspection apparatus according to claim 1, wherein the illumination unit is provided with an illumination transmitting film for transmitting the irradiated light source to the entire inspection area. The surface and shape inspection apparatus according to claim 6, wherein the light transmitting film is made of opaque acrylic. The surface and shape inspection apparatus according to claim 6, wherein the opaque glass is used for the light transmitting film. The surface and shape inspection apparatus according to claim 1, wherein the illumination unit is provided with an illumination transmitting film for projecting light from the irradiated light source to the inspection area through a pattern formed thereon. The surface and shape inspection apparatus according to claim 1, wherein the upper surface illumination of the illumination unit is configured to reflect light by a half mirror further provided to evenly irradiate the inspection area as a whole. The surface and shape inspection apparatus of claim 1, wherein the image input unit converts light of specific wavelength bands irradiated from the illumination unit and reflected from the inspection unit into an image of specific wavelength bands and transmits the image to the image processing unit. The surface and shape inspection apparatus according to claim 11, wherein the image input unit comprises a camera capable of simultaneously receiving light of different wavelength ranges as different images. The surface and shape inspection apparatus according to claim 11, wherein an image camera is provided as a camera of the video input unit. The surface and shape inspection apparatus according to claim 11, wherein the image input unit comprises an image input board capable of transmitting a signal image of the camera to the image processing unit. The image processing unit of claim 1, wherein the image processor is further configured to determine the presence of scratches, cracks, cracks, pins, and surface peeling defects for the surface plane defect type by using the upper image of the lighting of the upper surface of the lighting unit. Surface and shape inspection device, characterized in that According to claim 1, wherein the lighting unit further comprises a top upper side lighting, And the image processing unit is configured to determine whether there are mark defects, surface contamination-stains, and fingerprint defects for the surface color defect type by using the upper upper side image by the upper upper side illumination. The image processing unit of claim 1, wherein the image processor is further configured to determine whether there are mark defects, surface contamination-stains, and fingerprint defects for the surface color defect type by using the upper surface image by the upper surface lighting of the lighting unit. Surface and shape inspection apparatus. The method of claim 1, wherein the lighting unit further comprises side lighting, And the image processing unit is configured to determine whether there is a shape defect or an internal bubble defect for an internal / external shape defect type by using the side image by the side lighting. The surface and shape inspection of claim 1, wherein the image processor is further configured to determine whether there is a shape defect or an internal bubble defect for an internal / external shape defect type by using an image of the bottom of the lighting unit. Device. According to claim 1, wherein the lighting unit further comprises a top side lighting and side lighting, The image processing unit is a top image by the top top light of the lighting unit, the top top image by the top top side lighting, the top bottom side image by the top bottom side lighting, the side image by the side light, the bottom image by the bottom light Surface and shape inspection device, characterized in that configured to determine the presence or absence of defects on the surface color defect type, surface plane defect type, internal / external shape defect type. According to claim 1, wherein the image processing unit, Surface and characterized in that for selectively synthesizing each image by the upper and upper top lighting and the upper and lower side lighting of the lighting unit to show the effect of the position adjustment of the illumination and Shape inspection device. The surface and shape inspection apparatus according to claim 1, wherein the illumination unit comprises illumination of two or more different wavelength bands.