JP2720759B2 - Automatic bonding wire inspection system - Google Patents
Automatic bonding wire inspection systemInfo
- Publication number
- JP2720759B2 JP2720759B2 JP5179642A JP17964293A JP2720759B2 JP 2720759 B2 JP2720759 B2 JP 2720759B2 JP 5179642 A JP5179642 A JP 5179642A JP 17964293 A JP17964293 A JP 17964293A JP 2720759 B2 JP2720759 B2 JP 2720759B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- image
- light source
- wire
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はボンディングワイヤー外
観自動検査装置に関し、特に波長の異なる複数の照明光
を有し、ワークの良，不良判定を自動で行うボンディン
グワイヤー外観自動検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic bonding wire appearance inspection apparatus, and more particularly to an automatic bonding wire appearance inspection apparatus having a plurality of illumination lights having different wavelengths and automatically determining whether a workpiece is good or bad.
【０００２】[0002]
【従来の技術】従来のボンディングワイヤー外観自動検
査装置は、図１０に示すように、ワイヤーボンディング
済のＩＣ２８を、Ｘ，Ｙステージ８上に載せ、光源（白
色リング照明）３１で単一種類の光を当て、ＩＣの真上
にＣＣＤカメラ２９を設置し、その画像を取り入れ、カ
メラコントローラ３０，画像処理ユニット４で、２値化
処理を行い、２次元画像の情報のみで、正常なワークの
パタンと比較することにより、ワイヤーボール径，ボー
ル位置，ワイヤーカール量等の良否判定を行っていた。2. Description of the Related Art As shown in FIG. 10, a conventional bonding wire appearance automatic inspection apparatus mounts a wire-bonded IC 28 on an X, Y stage 8 and uses a light source (white ring illumination) 31 to generate a single type of light. A CCD camera 29 is placed just above the IC, the image is taken in, the camera controller 30 and the image processing unit 4 perform a binarization process, and the information of the two-dimensional image is used for normal work. By comparing with the pattern, the quality of the wire ball diameter, the ball position, the amount of wire curl and the like was determined.
【０００３】なお図１０において、５はモニタ、６はコ
ンピュータ、７は照明コントローラ、９はＬ／Ｆ幅調整
機構、１０はワーク高さ調整機構、１１はコントロール
ユニットを示している。In FIG. 10, 5 is a monitor, 6 is a computer, 7 is a lighting controller, 9 is an L / F width adjustment mechanism, 10 is a work height adjustment mechanism, and 11 is a control unit.
【０００４】[0004]
【発明が解決しようとする課題】ＩＣのパッケージの薄
型化が進んでくるに伴ない、ワイヤーボンディングの
際、ボンディングワイヤーのループ形状において、その
低ループ化が非常に重要になってきている。しかしなが
ら低ループの場合、ワイヤー垂れおよびエッジタッチの
危険性があるので、ワイヤーボンディング後に、そのル
ープ形状を厳重にチェックする必要が出てきた。As the thickness of IC packages has been reduced, it has become very important to reduce the loop shape of the bonding wire during wire bonding. However, in the case of a low loop, there is a danger of wire dripping and edge touch, so that it is necessary to closely check the loop shape after wire bonding.
【０００５】しかしながら、従来のようなボンディング
ワイヤー外観自動検査装置では、２次元画像データにて
良否判定を行っているので、ボンディングワイヤーのル
ープ形状のような３次元形状の良否判定はできないとい
う問題点があった。[0005] However, in the conventional automatic inspection apparatus for bonding wire appearance, the quality is judged based on the two-dimensional image data, so that the quality of a three-dimensional shape such as the loop shape of the bonding wire cannot be judged. was there.
【０００６】本発明の目的は、このような問題点を解決
し、２次元画像データより、ボンディングワイヤーの２
次元および３次元形状の良否判定を自動で行えるボンデ
ィングワイヤー外観自動検査装置を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem and solve the problem of two-dimensional image data by using two-dimensional image data.
It is an object of the present invention to provide an automatic bonding wire appearance inspection apparatus capable of automatically determining the quality of three-dimensional and three-dimensional shapes.
【０００７】[0007]
【課題を解決するための手段】本発明は、ＩＣのボンデ
ィングワイヤーの外観を自動的に検査する装置におい
て、波長の異なる複数の照明光源であって、前記ボンデ
ィングワイヤーに対する照明角度がそれぞれ異なるよう
に配置された照明光源と、前記各照明光源により照射さ
れたＩＣのボンディングワイヤーの画像を取り込むカラ
ーカメラと、各波長の光ごとのボンディングワイヤーの
画像を、良品ＩＣのボンディングワイヤーの画像と比較
する手段と、比較結果が所望のマッチング率以上か否か
によってボンディング済ＩＣのボンディングワイヤーの
３次元形状の良否判定を行う手段と、を備えることを特
徴とする。According to the present invention, there is provided an apparatus for automatically inspecting the appearance of a bonding wire of an IC, comprising: a plurality of illumination light sources having different wavelengths; The arranged illumination light source, a color camera for capturing an image of the bonding wire of the IC illuminated by each of the illumination light sources, and means for comparing the image of the bonding wire for each light of each wavelength with the image of the bonding wire of a good IC And whether the comparison result is greater than or equal to the desired matching rate
Characterized in that it comprises means for performing a quality determination of the three-dimensional shape of the bonding wire of the bonding already IC, and the.
【０００８】本発明は、さらに、照明光源がレーザスリ
ット光源であることを特徴とする。 According to the present invention, the illumination light source may be a laser slide.
It is a light source.
【０００９】[0009]
【実施例】次に本発明の実施例について図面を参照して
説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【００１０】図１は、本発明の一実施例であるボンディ
ングワイヤー外観自動検査装置の構成を示すブロック図
である。図１０と同じ構成要素には、同一の参照番号を
付して示してある。本実施例の装置では、光源２とし
て、波長の異なる赤，緑，青のリング照明を使用し、カ
メラにはカラーカメラ１を用いる。FIG. 1 is a block diagram showing a configuration of an automatic bonding wire appearance inspection apparatus according to an embodiment of the present invention. The same components as those in FIG. 10 are denoted by the same reference numerals. In the apparatus of the present embodiment, red, green, and blue ring illuminations having different wavelengths are used as the light source 2, and the color camera 1 is used as the camera.
【００１１】ボンディングワイヤー１８のボンディング
済みの被検査ＩＣ２８を、Ｘ，Ｙステージ８により所定
の場所に位置決めし、光源２（赤，緑，青）によってそ
れぞれ照射し、ボンディング済みＩＣ２８のワイヤー部
１８の画像をカラーカメラ１によって各色毎に取り込
み、カラーカメラ１，カラーカメラコントローラ３，画
像処理ユニット４によって２値化処理し、コンピュータ
６で各色の反射光の２値化パタンを良品のパタンと比較
する。赤，緑，青の各光の画像のパタンでマッチング率
により、総合的に良品，不良品の判断を行う。The IC 28 to be inspected after the bonding of the bonding wires 18 is positioned at a predetermined position by the X and Y stages 8 and irradiated by the light sources 2 (red, green and blue), respectively. The image is captured by the color camera 1 for each color, binarized by the color camera 1, the color camera controller 3, and the image processing unit 4, and the computer 6 compares the binarized pattern of the reflected light of each color with a non-defective pattern. . Non-defective products and defective products are comprehensively determined based on the matching ratio using the patterns of the red, green, and blue light images.
【００１２】図２は、各色の光源（赤光源１２，緑光源
１３，青光源１４）を照射し、カラーカメラ１によって
取り込まれるボンディングワイヤーの面の傾き角を示し
た図である。カラーカメラ１の光軸に対し、赤光源１２
は２α、緑光源１３は２β、青光源１４は２γの角度で
設けられているとする。光の入射角と反射角は等しいの
で、カラーカメラ１の光学軸に直角な面に対し傾き角α
のボンディングワイヤー面１７の画像は、赤光源１２の
光がボンディングワイヤー１８で反射してカラーカメラ
１に入射することにより取り込まれる。また、傾き角β
のボンディングワイヤー面１６の画像は、緑光源１３の
光がボンディングワイヤー１８で反射してカラーカメラ
１に入射することにより取り込まれる。また、傾き角γ
のボンディングワイヤー面１５の画像は、青光源１４の
光がボンディングワイヤー１８で反射してカラーカメラ
１に入射することにより取り込まれる。FIG. 2 is a view showing the inclination angle of the surface of the bonding wire captured by the color camera 1 when the light sources (red light source 12, green light source 13, and blue light source 14) of each color are irradiated. The red light source 12 with respect to the optical axis of the color camera 1
, The green light source 13 is provided at an angle of 2β, and the blue light source 14 is provided at an angle of 2γ. Since the incident angle and the reflection angle of light are equal, the inclination angle α with respect to the plane perpendicular to the optical axis of the color camera 1
The image of the bonding wire surface 17 is captured by the light of the red light source 12 being reflected by the bonding wire 18 and entering the color camera 1. Also, the inclination angle β
The image of the bonding wire surface 16 is captured by the light of the green light source 13 being reflected by the bonding wire 18 and entering the color camera 1. Also, the inclination angle γ
The image of the bonding wire surface 15 is captured by the light of the blue light source 14 being reflected by the bonding wire 18 and entering the color camera 1.
【００１３】図３は、正常なボンディングワイヤー１８
の側面図である。図中、２０はリードフレームアイラン
ド部、１９はＩＣペレット、２１はリードフレームイン
ナーリード部２１を示している。破線３５は、点Ａでの
ボンディングワイヤー１８の傾きを示している。FIG. 3 shows a normal bonding wire 18.
FIG. In the drawing, reference numeral 20 denotes a lead frame island portion, 19 denotes an IC pellet, and 21 denotes a lead frame inner lead portion 21. The broken line 35 indicates the inclination of the bonding wire 18 at the point A.
【００１４】図４は、各光源１２，１３，１４によって
照射され、カラーカメラ１によって取り込まれた図３の
正常なボンディングワイヤーの２次元画像のパタンを示
す図である。図４（Ａ）は赤（Ｒ），緑（Ｇ），青
（Ｂ）の合成画像によるボンディングワイヤーの全体
像、図４（Ｂ）は赤成分の２値化パタン、図４（Ｃ）は
緑成分の２値化パタン、図４（Ｃ）は青成分の２値化パ
タン、図４（Ｄ）は青成分の２値化パタンである。これ
らパタンは、カラーカメラコントローラ３および画像処
理ユニット４による処理により得られる。これらパタン
は、コンピュータ６に送られると共に、モニタ５に表示
することができる。コンピュータ６では、ボンディング
ワイヤーの良否判定を行う。FIG. 4 is a diagram showing a pattern of a two-dimensional image of the normal bonding wire shown in FIG. 3 illuminated by each of the light sources 12, 13, and 14 and captured by the color camera 1. 4A is an overall image of a bonding wire based on a composite image of red (R), green (G), and blue (B), FIG. 4B is a binarized pattern of a red component, and FIG. FIG. 4C shows a binarization pattern of a green component, and FIG. 4D shows a binarization pattern of a blue component. These patterns are obtained by processing by the color camera controller 3 and the image processing unit 4. These patterns are sent to the computer 6 and can be displayed on the monitor 5. The computer 6 determines the quality of the bonding wire.
【００１５】次に、本実施例のボンディングワイヤー外
観自動検査装置の、ボンディングワイヤーの良否判定
を、図５のフローチャートを参照して説明する。Next, a description will be given, with reference to the flow chart of FIG. 5, of the quality judgment of the bonding wire by the automatic bonding wire appearance inspection apparatus of this embodiment.
【００１６】まず、カラーカメラ１の赤（Ｒ），緑
（Ｇ），青（Ｂ）成分の合成により、ボンディング済ワ
イヤー１８の真上からの画像により、図４（Ａ）に示す
全体像の二値化パタンを作成する（ステップＳ１）。First, by combining the red (R), green (G), and blue (B) components of the color camera 1, an image of the whole image shown in FIG. A binary pattern is created (step S1).
【００１７】次に、良品パタンと比較し、ボール径，ワ
イヤーカール量等２次元の形状の良否判定を行う（ステ
ップＳ２）。Next, the quality of the two-dimensional shape such as the ball diameter and the amount of wire curl is determined by comparing with the non-defective pattern (step S2).
【００１８】次に、カメラ画像の赤成分の部分のみを抽
出し、２値化処理し図４（Ｂ）に示す２値化パタンを得
て、良品パタンとマッチングする（ステップＳ３）。Next, only the red component portion of the camera image is extracted and binarized to obtain a binarized pattern shown in FIG. 4B, which is matched with a non-defective pattern (step S3).
【００１９】緑成分，青成分についても同様に処理し、
図４（Ｃ），（Ｄ）に示す２値化パタンを得て、良品パ
タンとマッチングする（ステップＳ４）。The green component and the blue component are processed in the same manner.
The binarized patterns shown in FIGS. 4C and 4D are obtained and matched with the non-defective patterns (step S4).
【００２０】ステップＳ３，Ｓ４の各マッチング率の値
により、ループ形状の良否判定を行う（ステップＳ
５）。Based on the values of the matching ratios in steps S3 and S4, the quality of the loop shape is determined (step S4).
5).
【００２１】図６は、２２で示す部分でエッジタッチを
起こし、またボール径も小さく、不良と判断するボンデ
ィングワイヤー１８の側面図である。FIG. 6 is a side view of the bonding wire 18 which causes an edge touch at the portion indicated by 22 and has a small ball diameter and is judged to be defective.
【００２２】図７は、図６で示したワイヤーの２値化パ
タンを示す図であり、（Ａ），（Ｂ），（Ｃ），（Ｄ）
は図４と同様にそれぞれ、赤（Ｒ），緑（Ｇ），青
（Ｂ）の合成画像によるボンディングワイヤーの全体
像、赤成分の２値化パタン、緑成分の２値化パタン、青
成分の２値化パタン、青成分の２値化パタンである。FIG. 7 is a diagram showing the binarization pattern of the wire shown in FIG. 6, wherein (A), (B), (C), and (D)
4, as in FIG. 4, respectively, the whole image of the bonding wire by a composite image of red (R), green (G), and blue (B), a binarized pattern of red component, a binarized pattern of green component, and a blue component. And the binary pattern of the blue component.
【００２３】これらパタンは、明らかに図４に示した良
品のもののパタンと違っていることがわかり、これによ
りボンディングボール形（２次元形状），ループ形（３
次元形状）の良否判定が可能であることがわかる。It can be seen that these patterns are clearly different from those of non-defective products shown in FIG. 4, whereby the bonding ball shape (two-dimensional shape) and the loop shape (3
It can be seen that the quality of the (dimensional shape) can be determined.
【００２４】図８は、本発明の他の実施例であるボンデ
ィングワイヤー外観自動検査装置を示す図である。図１
と同じ構成要素には、同一の参照番号を付して示してあ
る。FIG. 8 is a view showing a bonding wire appearance automatic inspection apparatus according to another embodiment of the present invention. FIG.
The same components as those described above are denoted by the same reference numerals.
【００２５】本実施例ではボンディングワイヤーの照射
光に、図１の実施例のような円形の照明光を用いず、照
明角度の異なるレーザスリット光源２５（赤），２６
（緑），２７（青）を用い、１〜３ワイヤーずつ照射す
るようにする。そのため、ワーク載せ台には、Ｘ，Ｙス
テージに代え、回転も可能なＸ，Ｙ，θステージ２４を
用いる。また、各レーザスリット光源は、レーザ光発振
コントローラ２３により制御される。In this embodiment, the circular slit illumination light as in the embodiment of FIG. 1 is not used as the irradiation light of the bonding wire, and the laser slit light sources 25 (red) and 26 having different illumination angles are used.
(Green) and 27 (blue), and irradiate 1 to 3 wires at a time. Therefore, instead of the X and Y stages, a rotatable X, Y and θ stage 24 is used for the work mounting table. Each laser slit light source is controlled by a laser light oscillation controller 23.
【００２６】図９は、レーザスリット光２５（２６，２
７）が、ボンディングワイヤー１８を照射しているとこ
ろを真上から見た図である。FIG. 9 shows a laser slit beam 25 (26, 2).
FIG. 7) is a view of the portion irradiated with the bonding wire 18 as viewed from directly above.
【００２７】レーザスリット光源からのレーザスリット
光は広がることなく直進するので、各色の光を図１の実
施例と比べ確実に照射でき、そのため各色の反射光の２
値化パタンも確実に作成でき、ボンディングワイヤーの
ループ形状等の３次元形状の良否判定が確実に行えると
いう利点がある。Since the laser slit light from the laser slit light source travels straight without spreading, the light of each color can be more reliably irradiated as compared with the embodiment of FIG.
There is an advantage that a quantified pattern can be reliably created, and the quality of a three-dimensional shape such as a loop shape of a bonding wire can be reliably determined.
【００２８】[0028]
【発明の効果】以上説明した本発明のボンディングワイ
ヤー外観自動検査装置では、波長の異なる光を各々違っ
た角度からワイヤーボンディング済ＩＣのワイヤーに照
射し、カラーカメラによってワイヤーの画像を取り込む
ことによって、各光のワイヤーからの反射光による画像
の２値化パタンを、良品サンプルのパタンと比較するこ
とによって、２次元画像データよりボンディングワイヤ
ーの２次元および３次元形状の良否判定を自動で行える
という効果を有する。In the bonding wire appearance automatic inspection apparatus of the present invention described above, the wires of the wire-bonded IC are irradiated with light having different wavelengths from different angles, and an image of the wire is captured by a color camera. By comparing the binarized pattern of the image by the reflected light of each light from the wire with the pattern of a non-defective sample, it is possible to automatically determine the quality of the two-dimensional and three-dimensional shapes of the bonding wires from the two-dimensional image data. Having.
【図１】本発明のボンディングワイヤー外観自動検査装
置の一実施例の構成を示すブロック図である。FIG. 1 is a block diagram showing a configuration of an embodiment of an automatic bonding wire appearance inspection apparatus according to the present invention.
【図２】波長の異なる各色の光源が照射し、カラーカメ
ラによって取り込まれる面の傾き角を示した図である。FIG. 2 is a diagram showing inclination angles of a plane captured by a color camera when irradiated by light sources of different colors having different wavelengths.
【図３】正常なボンディング済ワイヤーの側面図であ
る。FIG. 3 is a side view of a normal bonded wire.
【図４】各光源により照射され、カラーカメラによって
取り込まれる正常なボンディングワイヤーの２次元画像
のパタンを示す図である。FIG. 4 is a diagram showing a pattern of a two-dimensional image of a normal bonding wire illuminated by each light source and taken in by a color camera.
【図５】本発明のボンディングワイヤー外観自動検査装
置のボンディングワイヤーの良否判定のフローチャート
を示す図である。FIG. 5 is a view showing a flowchart of a pass / fail judgment of a bonding wire of the automatic bonding wire appearance inspection apparatus of the present invention.
【図６】エッジタッチを起こし、またボール径も小さ
く、不良と判断するボンディングワイヤーの側面図であ
る。FIG. 6 is a side view of a bonding wire that causes edge touch, has a small ball diameter, and is determined to be defective.
【図７】図６のワイヤーの各色の２値化パタンを示す図
である。FIG. 7 is a diagram showing a binarized pattern of each color of the wire of FIG. 6;
【図８】本発明のボンディングワイヤー外観自動検査装
置の他の実施例の構成を示すブロック図である。FIG. 8 is a block diagram showing the configuration of another embodiment of the bonding wire appearance automatic inspection device of the present invention.
【図９】レーザスリット光が、ボンディングワイヤーを
照射しているところを真上から見た図である。FIG. 9 is a view of a portion where the laser slit light irradiates the bonding wire as viewed from directly above.
【図１０】従来のボンディングワイヤー外観自動検査装
置を示す図である。FIG. 10 is a view showing a conventional bonding wire appearance automatic inspection device.
１ カラーカメラ ２ 光源（赤，緑，青） ３ カラーカメラコントローラ ４ 画像処理ユニット ５ モニタ ６ コンピュータ ７ 照明コントローラ ８ Ｘ，Ｙステージ ９ Ｌ／Ｆ幅調整機構 １０ ワーク高さ調整機構 １１ コントロールユニット １２ 赤光源 １３ 緑光源 １４ 青光源 １５ 傾き角γの面 １６ 傾き角βの面 １７ 傾き角αの面 １８ ボンディングワイヤー １９ ＩＣペレット ２０ リードフレームアイランド部 ２１ リードフレームインナーリード部 ２２ エッジタッチ部 ２３ レーザ光発振コントローラ ２４ Ｘ，Ｙ，θステージ ２５ レーザスリット光源（赤） ２６ レーザスリット光源（緑） ２７ レーザスリット光源（青） ２８ ボンディング済ＩＣ ２９ ＣＣＤカメラ ３０ カメラコントローラ ３１ 光源（白色リング照明） Reference Signs List 1 color camera 2 light source (red, green, blue) 3 color camera controller 4 image processing unit 5 monitor 6 computer 7 lighting controller 8 X, Y stage 9 L / F width adjustment mechanism 10 work height adjustment mechanism 11 control unit 12 red Light source 13 Green light source 14 Blue light source 15 Surface with inclination angle γ 16 Surface with inclination angle β 17 Surface with inclination angle α 18 Bonding wire 19 IC pellet 20 Lead frame island part 21 Lead frame inner lead part 22 Edge touch part 23 Laser light oscillation Controller 24 X, Y, θ stage 25 Laser slit light source (red) 26 Laser slit light source (green) 27 Laser slit light source (blue) 28 Bonded IC 29 CCD camera 30 Camera controller 31 Light source (white ring illumination)
Claims (1)
的に検査する装置において、 波長の異なる複数のレーザスリット光源であって、前記
ボンディングワイヤーに対する照明角度がそれぞれ異な
るように配置された照明光源と、 前記各照明光源により照射されたＩＣのボンディングワ
イヤーの画像を取り込むカラーカメラと、 各波長の光ごとのボンディングワイヤーの画像を、良品
ＩＣのボンディングワイヤーの画像と比較する手段と、 比較結果が所望のマッチング率以上か否かによってボン
ディング済ＩＣのボンディングワイヤーの３次元形状の
良否判定を行う手段と、 を備えることを特徴とするボンディングワイヤー外観自
動検査装置。1. An apparatus for automatically inspecting the appearance of a bonding wire of an IC, comprising: a plurality of laser slit light sources having different wavelengths; A color camera that captures the image of the bonding wire of the IC illuminated by each of the illumination light sources, a unit that compares the image of the bonding wire for each light of each wavelength with the image of the bonding wire of the non-defective IC , Means for determining whether or not the three-dimensional shape of the bonding wire of the bonded IC based on whether or not the matching rate is equal to or higher than the matching ratio .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5179642A JP2720759B2 (en) | 1993-07-21 | 1993-07-21 | Automatic bonding wire inspection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5179642A JP2720759B2 (en) | 1993-07-21 | 1993-07-21 | Automatic bonding wire inspection system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0737955A JPH0737955A (en) | 1995-02-07 |
| JP2720759B2 true JP2720759B2 (en) | 1998-03-04 |
Family
ID=16069343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5179642A Expired - Fee Related JP2720759B2 (en) | 1993-07-21 | 1993-07-21 | Automatic bonding wire inspection system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2720759B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100338194B1 (en) * | 1999-10-16 | 2002-05-27 | 김주환 | Inspection system of Semiconductor device package with 3 dimension type and the inspection method thereof |
| JP4234661B2 (en) | 2004-09-30 | 2009-03-04 | 株式会社カイジョー | Ball inspection method in wire bonding |
| TWI491871B (en) * | 2013-07-05 | 2015-07-11 | Machvision Inc | Illumination system for use in optical inspection, illumination system-based inspection system, and illumination system-based inspection method |
| DE102015109431A1 (en) * | 2015-06-12 | 2016-12-15 | Witrins S.R.O. | Inspection system and method for error analysis of wire connections |
| TWI697656B (en) * | 2017-12-20 | 2020-07-01 | 日商新川股份有限公司 | Line shape inspection device and line shape inspection method |
| CN112233994B (en) * | 2020-10-13 | 2021-08-24 | 珠海市科迪电子科技有限公司 | Chip gold wire detection method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127617A (en) * | 1985-11-29 | 1987-06-09 | Fujitsu Ltd | Inspecting instrument for linear body |
| JPH061173B2 (en) * | 1988-05-09 | 1994-01-05 | オムロン株式会社 | Curved property inspection device |
| JPH02151703A (en) * | 1988-12-02 | 1990-06-11 | Sharp Corp | Apparatus for inspecting mounting of part |
| JPH02213711A (en) * | 1989-02-14 | 1990-08-24 | Omron Tateisi Electron Co | Parts inspecting device |
| JPH05175310A (en) * | 1991-12-26 | 1993-07-13 | Canon Inc | Wire bonding inspecting apparatus |
-
1993
- 1993-07-21 JP JP5179642A patent/JP2720759B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0737955A (en) | 1995-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4719284B2 (en) | Surface inspection device | |
| US9746426B2 (en) | System and method for capturing illumination reflected in multiple directions | |
| JP5323320B2 (en) | Surface inspection device | |
| JP3311135B2 (en) | Inspection range recognition method | |
| JP2002014057A (en) | Defect checking device | |
| JP2010107254A (en) | Device and method for inspecting led chip | |
| US6573987B2 (en) | LCC device inspection module | |
| JP2969403B2 (en) | Bonding wire inspection device | |
| KR100281881B1 (en) | cream solder inspection apparatus and the method thereof | |
| JP2981942B2 (en) | Bonding wire inspection method | |
| JP2720759B2 (en) | Automatic bonding wire inspection system | |
| JP2969402B2 (en) | Bonding wire inspection device | |
| US5225891A (en) | Wire bonding external appearance inspecting apparatus | |
| WO2021033396A1 (en) | Wafer appearance inspection device and method | |
| JP2000131037A (en) | Apparatus for inspecting shape of body | |
| JP2002131238A (en) | Visual inspection apparatus | |
| JPH10122828A (en) | Bump visual inspection equipment | |
| KR200336984Y1 (en) | A device for inspecting surface and shape of an object of examination | |
| JP2005223006A (en) | Inspection method of cream solder print | |
| JP2818347B2 (en) | Appearance inspection device | |
| JPH10160426A (en) | Method and equipment for inspecting object to be inspected | |
| JPS622107A (en) | Thin film inspection and its apparatus | |
| KR200328026Y1 (en) | Apparatus for examining surface of semiconductor | |
| JPH08285548A (en) | Bump appearance inspection device | |
| JPH10112469A (en) | Wirebonding inspection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |