KR20020079519A - Method of forming fluorescence screen - Google Patents

Abstract

PURPOSE: A method for forming fluorescent surface is provided to easily form a fluorescent surface having a plurality of fluorescent parts by using evaporation method. CONSTITUTION: Conductive films(15) are formed at the part, corresponding to the formation region, to which respective fluorescent layers(13,23) are to be formed. Leader line parts(16), impressing voltages to respective conduction films(15), are formed. Afterwards, by selectively impressing voltages to respective leader line parts(16) in an electrodeposition solution, the fluorescent layers(13,23), covering the conduction films, are selectively formed on the conductive films(15) respectively. As a result of this, respective fluorescent parts are formed by the identical manufacturing method(electrodeposition method) which makes the formation of the fluorescent surface easy, comparing with the method forming the fluorescent parts by the manufacturing methods which are different from each other.

Description

Formation method of fluorescent surface {METHOD OF FORMING FLUORESCENCE SCREEN}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a fluorescent surface having a plurality of phosphor parts, and more particularly, to a method of forming a fluorescent surface using a transfer method.

Background Art Conventionally, cathode ray tubes (CRTs) have been widely used in television receivers and various monitor devices. The cathode ray tube emits an electron beam from an electron gun provided inside the tube (inside the cathode ray tube) toward the fluorescent surface, and forms a scanning screen according to the scanning of the electron beam on the tube surface. As a kind of cathode ray tube, there are a thing of a straight type and a flat type in large division. The straight type cathode ray tube has a structure in which an electron gun is disposed so that the emission port of the electron beam faces the fluorescent surface, and the electron beam is irradiated almost perpendicularly to the center of the fluorescent surface. On the other hand, the flat cathode ray tube has a structure in which the electron gun and the fluorescent surface are provided on substantially the same plane, and the electron beam is inclinedly irradiated with respect to the fluorescent surface. Since flat cathode ray tubes can be made thinner than straight type cathode ray tubes, they are widely used in relatively small devices, for example, the monitor portion of a cycle machine in a door phone device, a portable TV (television) monitor, and the like.

Cathode ray tubes display color on the entire screen, but there is a demand for image display only with monochrome (monochrome), and development has been made. In particular, a flat cathode ray tube of a monochrome display system is frequently used for a door phone device. The cathode ray tube of the monochrome display system forms a whole fluorescent surface by, for example, a white light emitting phosphor, and displays a monochrome image by scanning the fluorescent surface with one electron beam.

By the way, even in the apparatus using the cathode ray tube of the monochrome display system, there is a demand to perform image display partially in color. For example, the door phone device can be combined with various sensor devices such as a fire detector and a gas leak detector to function as a safety system as a whole. In the case of such a system configuration, in the sense of prompting the user, it is preferable to perform a warning display on the main machine side by expressing the occurrence of an abnormal situation in a color different from the normal monochrome display (for example, red). .

Therefore, the applicant of this application proposes the technique which enables partial color display also in the cathode ray tube of a monochrome display system in Japanese patent application 2000-O45114, Japanese patent application 2000-117594, etc.

Hereinafter, with reference to Figs. 14A and 14B, the foregoing invention by the applicant of the present application will be briefly described. 14A and 14B schematically show an image display portion in a flat cathode ray tube. In the conventional monochrome display type flat cathode ray tube 110, as shown in Fig. 14A, the entire phosphor layer (for example, a white light emitting phosphor layer) 112 of which the entire image display region 111 is a single color is shown. It is formed by.

On the other hand, in the flat cathode ray tube 120 according to the present invention of the present applicant, as shown in Fig. 14B, a monochromatic phosphor layer 122 is provided, and the first phosphor portion in which normal monochrome image display is performed ( In addition to 121, a second phosphor portion 123 for color display is provided. The second phosphor part 123 is provided with another phosphor layer 124 which emits light of a color different from that of the phosphor layer 122 provided in the first phosphor part 121. In the phosphor layer 124, a pattern is formed in a shape that mimics an image to be displayed in advance. The phosphor layer 124 of the second phosphor part 123 is formed in a single color (for example, red) or a plurality of colors according to the image to be displayed. As a result, when the second phosphor portion 123 is scanned with an electron beam, the phosphor pattern portion emits light to display an icon-shaped color image. In this case, by forming a plurality of phosphor patterns (icon patterns) 124A, 124B, and 124C in the second phosphor portion 123, a plurality of icon images can be displayed simultaneously or separately.

As described above, the cathode ray tube according to the present invention of the applicant of the present application displays a color image of an icon type image in addition to the monochrome image in the normal display. Hereinafter, the cathode ray tube with this icon display function is simply referred to as "icon CRT".

By the way, in the conventional flat cathode ray tube 110 shown to FIG. 14A, as a method of forming the fluorescent surface, it is by the transfer method disclosed by Unexamined-Japanese-Patent No. 11-247353, etc., for example. Known. The method using this transfer method transfers the phosphor layer or the like onto the transfer surface of the cathode ray tube by using a transfer film on which components of the phosphor surface (phosphor layer, conductive layer, etc.) are laminated. According to this method, all the components of the fluorescent screen can be transferred in one batch with one transfer film.

However, when the fluorescent surface of the icon CRT 120 shown in Fig. 14B is formed by the conventional transfer method using one such transfer film, the following problems arise. First, in order to form the fluorescent surface of the icon CRT 120 using only one transfer film, the fluorescent surface (first phosphor portion 121) of the normal video display portion is added to the fluorescent surface [second phosphor portion 123] of the icon display portion. All laminated components of must be used. In other words, the transfer film for icon CRT has a structure different from the transfer film used in the conventional flat cathode ray tube 110. For this reason, there exists a problem that a manufacturing line with the normal flat cathode ray tube 110 which does not have an icon part about the formation process of a fluorescent surface cannot be common. Moreover, there also exists a problem that the transfer film used conventionally becomes unnecessary. In addition, since the fluorescent surfaces are collectively formed, if only a portion (for example, only the phosphor portion 123 for icon display) is formed, there is a problem that the entire fluorescent surface becomes defective and the productivity is lowered.

SUMMARY OF THE INVENTION The present invention has been made in view of these problems, and its object is to enable formation of a fluorescent surface with excellent productivity by a transfer method, and in particular, to achieve some commonalities with a conventional fluorescent surface forming process having only a single phosphor portion. It is to provide a method for forming a fluorescent surface that can be.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the construction of a principal part of a flat cathode ray tube manufactured using a method for forming a fluorescent surface according to a first embodiment of the present invention.

FIG. 2 is a front view showing the flat cathode ray tube shown in FIG. 1 as viewed from the front (front panel side). FIG.

Fig. 3 is a front view showing the configuration of the first and second transfer films used in the method for forming a fluorescent screen according to the first embodiment of the present invention.

4 is a cross-sectional view showing a cross-sectional structure of the first and second transfer films shown in FIG.

FIG. 5 is a cross-sectional view for explaining a transfer process using the first transfer film shown in FIGS. 3 and 4;

6 is a cross-sectional view for explaining a transfer step using the second transfer film shown in FIGS. 3 and 4;

Fig. 7 is a front view showing the structure of a fluorescent surface of a flat cathode ray tube manufactured using the method for forming a fluorescent surface according to the first embodiment of the present invention.

Fig. 8 is a flowchart for explaining a manufacturing method of a flat cathode ray tube including the method for forming a fluorescent surface according to the first embodiment of the present invention.

Fig. 9 is a front view showing the configuration of the first and second transfer films used in the method for forming a fluorescent screen according to the second embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a cross-sectional structure of the first and second transfer films shown in FIG. 9; FIG.

FIG. 11 is a cross-sectional view for explaining a transfer step using the second transfer film shown in FIGS. 9 and 10.

Fig. 12 is a front view showing the configuration of the first and second transfer films used in the method for forming a fluorescent screen according to the third embodiment of the present invention.

Fig. 13 is a flowchart for explaining a manufacturing method of a flat cathode ray tube including a fluorescent surface forming method according to the third embodiment of the present invention.

Fig. 14 is an explanatory diagram showing a display method of a cathode ray tube, and Fig. 14A shows a conventional flat cathode ray tube capable of monochrome display only, and Fig. 14B is an icon type partly as a monochrome display method. The figure shows the flat cathode ray tube which enabled the color display of.

Fig. 15 is a configuration diagram of an electrodeposition apparatus used in the method for forming a fluorescent screen according to a reference example of the present invention.

Fig. 16 is a front view showing the structure before electrodeposition of the phosphor of the fluorescent surface produced using the method for forming the fluorescent surface according to the reference example of the present invention.

Fig. 17 is a front view showing the structure of the fluorescent surface of the flat cathode ray tube manufactured using the fluorescent surface forming method according to the reference example of the present invention.

<Explanation of symbols for the main parts of the drawings>

1, 1A: first transfer film

2, 2A, 2B: second transfer film

10, 20: transfer layer

11, 21: transfer substrate

12, 22: release layer

13: first phosphor layer

14, 24: reflective layer

15, 25: conductive layer

16, 26: adhesive layer

23: second phosphor layer

30: flat cathode ray tube

31: screen panel

32: front panel

32A: main image display area

32B: Icon display area

33: funnel

35: electron gun

41: main image

42: icon image

50: fluorescent surface

51: first phosphor part

52: second phosphor portion

53: inner conductive film

54: conductive film for conduction

The method for forming a fluorescent surface according to the present invention includes a first step of forming a first phosphor portion by a transfer method using a first transfer film on which at least a first phosphor layer is laminated, and at least a second phosphor layer. And a second step of forming the second phosphor portion by a transfer method in a region different from the region where the first phosphor layer is provided by using the second transfer film.

In the present invention, the first phosphor layer is made of a white light emitting phosphor that emits white light, for example. The white light-emitting phosphor includes not only phosphors that emit white light alone, but also those such as phosphors which, for example, are mixed with a blue light-emitting phosphor and a yellow light-emitting phosphor at an appropriate ratio to emit white light in appearance.

In the method for forming a fluorescent surface according to the present invention, the first phosphor portion is formed by a transfer method using a first transfer film having at least a first phosphor layer laminated. Moreover, a 2nd fluorescent substance part is formed by the transfer method using the 2nd transfer film in which the 2nd fluorescent substance layer was laminated | stacked. Thus, by forming each phosphor part in a different process using each transfer film, it becomes possible to reuse the transfer film which was used conventionally as a 1st transfer film as it is, for example.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings.

[First Embodiment]

First, with reference to FIG. 1 and FIG. 2, the structure of the flat cathode ray tube manufactured using the fluorescent surface formation method which concerns on 1st Embodiment of this invention is demonstrated. In addition, the drawing shows a reflection type as an example of a flat cathode ray tube. In addition, FIG. 1 is corresponded to the cross section of the I-I line | wire part in FIG.

As shown in FIG. 1, the flat cathode ray tube 30 is provided with the screen panel 31, the front panel 32, and the funnel part 33. As shown in FIG. The screen panel 31, the front panel 32, and the funnel portion 33 are made of, for example, a transparent glass member, and have a flat glass tube member (flat tube) by a three member structure made of these panels. ).

At the rear end of the funnel portion 33, an electron gun 35 for emitting an electron beam EB is disposed. An inner conductive film 53 made of, for example, a carbon film is coated on the inner wall surface of the funnel portion 33. The internal conductive film 53 is electrically connected to an anode terminal (not shown) provided in the funnel portion 33 so that a high voltage (anode voltage) HV is applied. Although not shown, a deflection yoke or the like for deflecting the electron beam EB emitted from the electron gun 35 is disposed on the outer peripheral portion of the funnel portion 33.

The front panel 32 has a flat plate shape. On the other hand, the screen panel 31 has the shape curved in the vertical direction (up-down direction). The fluorescent surface 50 is formed in the inner wall surface side of the screen panel 31, ie, the surface side facing the front panel 32. As shown in FIG. The fluorescent surface 50 has a first phosphor portion 51 and a second phosphor portion 52.

The first phosphor portion 51 is for displaying a normal monochrome image, and the conductive layer 15, the reflective layer 14, and the first phosphor layer 13 are sequentially formed from the inner wall surface side of the screen panel 31. It is laminated | stacked and comprised. On the other hand, the second phosphor portion 51 is for displaying an icon-shaped image, and in order from the inner wall surface side of the screen panel 31, the conductive layer 15, the reflective layer 24, and the second phosphor layer 23 are arranged. ) Is laminated.

The conductive layer 15 is a single continuous layer common to the first phosphor portion 51 and the second phosphor portion 51. The conductive layer 15 is electrically connected to the internal conductive film 53 of the funnel part 33 by the conductive film 54 for conduction which consists of carbon films, for example. As a result, the anode voltage HV is applied to the conductive layer 15 through the internal conductive film 53 and the conductive conductive film 54. Each of the reflective layers 14 and 24 has a function of reflecting each of the emitted light rays R1 and R2 generated by the electron beam EB incident on the phosphor layers 13 and 23 to the front panel 32 side.

Although the first phosphor layer 13 and the second phosphor layer 23 both emit light in response to the incident of the electron beam EB, they are each composed of different kinds of phosphors. More specifically, the first phosphor layer 13 is made of, for example, a white light emitting phosphor. As shown in FIG. 7, the first phosphor layer 13 includes an area including a main video display area 32A (corresponding to a normal effective screen area) (FIG. 2) for displaying at least a normal video. It is installed consistently with the whole.

On the other hand, the second phosphor layer 23 is made of another phosphor that emits light of a color different from that of the first phosphor layer 13. The second phosphor layer 23 displays icon-colored color images (icon images) 42 (42A, 42B, 42C) different from the main image 41 displayed on the main image display region 32A. It is provided for display in 32B (FIG. 2). As shown in Fig. 7, the second phosphor layer 23 is patterned in a shape equivalent to the image to be displayed in advance (the shape imitating the icon image 42). Therefore, the second phosphor layer 23 need not be provided in all of the areas corresponding to the icon display area 32B, and is basically provided only partially in the area where the icon image 42 is to be displayed. In this case, the portion where the icon image 42 is not displayed (the portion where the second phosphor layer 23 is not provided) has, for example, a structure of a so-called black matrix in which black substances (graphite, etc.) are laminated. desirable.

Each phosphor layer 23A, 23B, 23C (FIG. 7) of the second phosphor layer 23 is formed in a single color (for example, red) or a plurality of colors according to the icon image 42 to be displayed. Thus, when scanning from the electron beam EB, the portion of the scanned phosphor pattern emits light, and the icon image 42 corresponding to the phosphor pattern is displayed on the icon display area 32B by the light emission ray R2. A plurality of icon images 42A, 42B, 42C are formed by forming a fluorescent pattern composed of a plurality of phosphor layers 23A, 23B, 23C in a region corresponding to the icon display area 32B, as shown in FIG. It can be displayed simultaneously or separately.

In Fig. 2, as shown in Fig. 7, the second phosphor layer 23 is formed of star, square, and round phosphor layers 23A, 23B, and 23C, thereby forming star, rectangle, and round icon images 42A, 42B and 42C) are shown. However, the shape of the second phosphor layer 23 can be any shape such as a symbol, a character, various patterns, and the like, and an icon image 42 can display an arbitrary shape.

When the flat cathode ray tube 30 of the above structure is applied to the door phone device with a safety function, for example, the following display operation is performed. The door phone device is generally a generic term for a device in which an accessory device and a main device are connected by a communication cable. In the door phone device with a safety function, peripheral devices such as a fire detector are connected to the main machine. The flat cathode ray tube 30 is applied to the monitor portion of the main machine in such a door phone device.

First, an image captured by the video camera of the accessory device is displayed in monochrome (black and white) in the main video display area 32A. In this case, the first phosphor layer 13 in the first phosphor portion 51 is scanned by the electron beam EB. At this time, the light emission R1 generated in the phosphor layer 13 is reflected on the front panel 32 side by the function of the reflective layer 14. An optical image formed by the light ray R1 reflected by the reflective layer 14 is observed as the main image 41 from the front panel 32 side.

On the other hand, in the icon display area 32B, for example, the icon image display in association with the safety system is performed. That is, for example, icon image display is performed according to a detection signal from a peripheral device having a fire detection function. In this case, although the second phosphor layer 23 in the second phosphor portion 52 is scanned by the electron beam EB, the scanned area is provided with a phosphor pattern corresponding to the icon image 42 to be displayed. It is only. That is, it is only the area | region in which the fluorescent substance pattern (for example, fire-shaped fluorescent substance pattern) for fire detection was formed, for example. At this time, the emission light beam R2 generated by scanning from the electron beam EB is reflected to the front panel 32 side by the function of the reflection layer 24. The icon image 42 of the color formed by the light ray R2 reflected by the reflective layer 42 is observed from the front panel 32 side.

Next, the manufacturing method of the flat cathode ray tube 30, especially the formation method of the fluorescent surface 50 is demonstrated.

In this embodiment, the fluorescent surface is formed by the transfer method using the transfer film. Thus, first, two transfer films 1 and 2 shown in Figs. 3A, 3B, 4A, and 4B are prepared. The first transfer film 1 is for forming the first phosphor portion 51, and the second transfer film 2 is for forming the second phosphor portion 52. 4A and 4B, the IVA-IVA line and the IVB-IVB in the transfer film 112 shown in Figs. 3A and 3B, respectively. The cross section of the line part is shown.

In the first transfer film 1, as illustrated in FIGS. 3A and 4A, the transfer layer 10 is laminated on one surface of the transfer substrate 11. The transfer layer 10 is formed by laminating the release layer 12, the phosphor layer 13, the reflective layer 14, the conductive layer 15, and the adhesive layer 16 sequentially from the transfer substrate 11 side. As the first transfer film 1, a conventional transfer film used for the manufacture of a fluorescent surface in a conventional flat cathode ray tube 110 (FIG. 14A) that does not have an icon display region 32B. It is possible to use as is.

This 1st transfer film 1 is produced as follows. First, as the transfer substrate 11, for example, a resin film having a thickness of about 25 μm to 100 μm, preferably about 75 μm is prepared. As a resin film, PET (polyethylene terephthalate) film can be used, for example. Next, the release layer 12, the first phosphor layer 13, the reflective layer 14, the conductive layer 15, and the adhesive layer 16 are sequentially printed on the transfer substrate 11, for example, a screen (eg, a screen). Printing or gravure printing).

More specifically, at first, the peeling is performed on the transfer substrate 11 at a predetermined temperature (for example, about 200 ° C), and at the same time as the peeling temperature. The peeling layer 12 which has a form is formed by the printing method. Acrylic resin may be used for this peeling layer 12, for example, and the thickness is formed in about 6 micrometers-about 10 micrometers.

Next, a first phosphor layer 13 having an area corresponding to the effective screen (main image display area 32A (FIG. 2)) is formed on the release layer 12 by the printing method. The first phosphor layer 13 may be formed of fine particles such as Y ₂ O ₂ S (sulfide yttrium oxide) or Y ₂ O ₂ S: Tb (sulfide yttrium oxide: terbium activation), for example, an average particle diameter of 4.5. [Mu] m or less) is formed to a thickness of about 20 to 30 m.

Next, on the first phosphor layer 13, a reflective layer 13 made of titanium oxide (TiO ₂ ), tin oxide (SnO ₂ ), aluminum oxide (A1 ₂ O ₃ ), or the like is printed. Form by. The thickness of the reflective layer 14 is formed to be, for example, about 10 µm to 15 µm. In the case where the reflective layer 14 is a titanium oxide layer, printing is formed on the first phosphor layer 13 using a coating material (so-called paste member) made of titanium oxide particles and a binder.

Next, the area corresponding to the formation region of the first phosphor portion 51 and the second phosphor portion 52, that is, the area corresponding to the entire fluorescent surface, covers the reflective layer 14 and the first phosphor layer 13. A conductive layer 15 having a film is formed by a printing method. The thickness of this conductive layer 15 is formed to be about 3 micrometers-about 20 micrometers, for example. As the material of the conductive layer 15, for example, fine particles having an average particle diameter of 1 μm or less, and those having a transparent and resistance value of 100 Pa or less after firing are used. Specifically, for example, a transparent conductive film such as indium tin oxide (ITO) is used. In addition, depending on the application of the cathode ray tube, a material which becomes black gray after firing such as carbon or chromium oxide, and may be used as the conductive layer 15 having a resistance of 100 Pa or less after firing.

Finally, on the conductive layer 15, the adhesive layer 16 made of, for example, a butyral resin or a polyamide resin having a function of vaporizing at a temperature higher than the temperature at which the release layer 12 is vaporized, is printed by a printing method. Form. The thickness of the adhesive layer 16 is formed to be, for example, about 6 μm to 10 μm. Further, the butyral resin and the polyamide resin are vaporized at a temperature of about 400 ° C to 485 ° C.

As mentioned above, formation of each layer in the 1st transfer film 1 is performed by screen printing, for example. At this time, after screen printing is performed to form each layer, it is dried by natural drying or a dryer, and the film thickness of each layer is stabilized. This drying treatment is preferably performed for each layer. That is, it is preferable to repeat the process of performing screen printing on a certain layer and performing screen printing of the next layer after drying. In this way, the first transfer film 1 is produced.

On the other hand, the second transfer film 2 corresponds to the formation region of the second phosphor portion 52 on one surface of the transfer substrate 21, as shown in Figs. 3B and 4B. The transfer layer 20 having an area to be laminated is laminated. The transfer layer 20 is formed by laminating the release layer 22, the second phosphor layer 23, the reflective layer 24, and the adhesive layer (b) in order from the transfer substrate 21 side.

Preparation of this 2nd transfer film 2 can also be performed basically similarly to the 1st transfer film 1. That is, the 2nd transfer film 2 is the peeling layer 22, the 2nd fluorescent substance layer 23, and the reflection layer (for example, by screen printing) on the transfer substrate 21 which consists of PET, for example. 24) and the adhesive layer 26 are formed in order. At this time, the layer having the same function as the first transfer film 1 is basically formed of the same material and thickness.

More specifically, it is produced as follows. First, the peeling layer 22 of the same material and thickness as the peeling layer 12 in the 1st transfer film 1 is formed on the transfer substrate 21 by the printing method.

Next, the second phosphor layer 23 (23A, 23B, 23C) having the shape and area corresponding to the shape of the icon image 42 (FIG. 2) to be displayed on the release layer 22 is applied to the printing method. By forming. The second phosphor layer 23 is formed using phosphors corresponding to the type (color) of the icon image 42 to be displayed. For example, when the icon images 42A, 42B, and 42C are displayed in blue, red, and green, the phosphor layers 23A, 23E, and 23C are formed of blue, red, and green phosphors, respectively. Moreover, as a blue fluorescent substance, ZnS: Ag etc. can be used, for example. Moreover, as green phosphor, ZnS: Cu, Al etc. can be used, for example. As a red phosphor, such as Y ₂ O ₂ S: Eu and the like can be used.

Next, on the second phosphor layer 13, a reflecting layer 24 having an area corresponding to the icon display area 32B (FIG. 2) is provided with the reflecting layer 14 in the first transfer film 1; It forms by the printing method with the same material and thickness.

Finally, the adhesive layer 26 having an area corresponding to the formation region of the second phosphor portion 52 is covered with the adhesive layer 16 in the first transfer film 1 so as to cover the reflective layer 24. It is formed by the printing method to the material and thickness.

Also in the formation process for the 2nd transfer film 2 demonstrated above, after each layer is formed, it is made to dry by natural drying, a dryer, etc. similarly to the 1st transfer film 1, and the film thickness of each layer Stabilize. In this way, the second transfer film 2 is produced.

Next, the fluorescent surface 50 is formed using the transfer films 1 and 2 produced as mentioned above, and the flat cathode ray tube 30 is manufactured. The overall flow of this manufacturing process is as shown in FIG.

That is, as shown in Fig. 8, first, the first phosphor portion 51 is formed by the transfer method using the first transfer film 1 (step S1). Next, the second phosphor portion 52 is formed by a transfer method using the second transfer film 2. This is performed by transferring so that the transfer layer 20 of the 2nd transfer film 2 may overlap with the whole on the electrically conductive layer 15 formed by the 1st transfer film 1 (step S2).

Next, the screen panel 31, the front panel 32, and the funnel portion 33 are joined by the frit sealing step (F / S step) (step S3).

Next, the conductive layer 15 of the screen panel 31 and the internal conductive film 53 of the funnel portion 33 are electrically connected by the conductive conductive film 54 (step S4). As shown in FIG. 7, the formation of the conductive conductive film 54 for conduction is performed by, for example, the screen panel 31 of the internal conductive film 53 from the center end of the funnel portion 33 side of the conductive layer 15. It is performed by applying a carbon film, for example, to the area | region to the center part of the side. This conductive conductive film 54 is baked at a temperature of, for example, about 440 ± 20 ° C. By forming the conductive conductive film 54, the anode voltage HV can be applied to the conductive layer 15 through the internal conductive film 53 and the conductive conductive film 54. As described above, the flat cathode ray tube 30 is manufactured.

The formation process (step S1 of FIG. 8) of the 1st fluorescent substance part 51 is performed in detail as shown to FIG. 5 (A)-FIG. 5 (D).

That is, as shown in FIG. 5A, first, the first transfer film 1 is bonded to a predetermined position on the inner surface of the screen panel 31 by the adhesive layer 16. As shown in FIG. This adhesion causes the first phosphor layer 13 to be transferred to a position corresponding to the region where the first phosphor portion 51 is formed, and the conductive layer 15 is also provided with the first phosphor portion 51 and the second phosphor portion 52. Is carried out at a position transferred to a position corresponding to the formation region. Next, the screen panel 31 is heated to a temperature (for example, about 200 ° C.) at which the transfer substrate 11 is peeled off. As a result, as illustrated in FIG. 5B, the transfer substrate 11 is peeled off from the first transfer film 1, and the transfer layer 10 is transferred to the inner surface of the screen panel 31. Moreover, in peeling the transfer board 11, the heat transfer roller heated at predetermined temperature (for example, 200 degreeC-250 degreeC) is heated from the transfer board 11 side, without heating the screen panel 31. FIG. You can also pressurize.

Next, the screen panel 31 from which the transfer substrate 11 has been peeled off is heated to a temperature higher than the peeling temperature of the transfer substrate 11 (for example, about 300 ° C.). As a result, as shown in FIG. 5C, the release layer 12 is vaporized and exhausted from the screen panel 31. After the release layer 12 is removed, the screen panel 31 is then heated to a temperature higher than the temperature at which the release layer 12 vaporizes (for example, about 400 ° C to 485 ° C). As a result, as shown in FIG. 5D, the adhesive layer 16 is vaporized and exhausted from the screen panel 31 through the conductive layer 15, the reflective layer 14, and the first phosphor layer 13. . In this manner, the first phosphor portion 51 including the conductive layer 15, the reflective layer 14, and the first phosphor layer 13 is formed on the inner surface of the screen panel 32. At this time, the conductive layer 15 is formed not only in the first phosphor portion 51 but also in the formation region of the second phosphor portion 52.

In addition, the formation process (step S2 of FIG. 8) of the 2nd fluorescent substance part 52 is performed in detail as shown in FIG.

That is, first, as shown in FIG. 6A, the second transfer film 2 is bonded onto the conductive layer 15 formed by the adhesive layer 26 and transferred by the first transfer film 1. do. This adhesion is performed at the position where the second phosphor layer 23 and the reflective layer 24 are transferred to the position corresponding to the formation region of the second phosphor portion 52 on the conductive layer 15. Next, the screen panel 31 is heated to the temperature (for example, about 20O degreeC) which the transfer substrate 21 peels. As a result, as shown in FIG. 6B, the transfer substrate 21 is peeled off from the second transfer film 2, and the transfer layer 20 passes through the conductive layer 15. Is transferred to the inner surface. When the transfer substrate 21 is peeled off, the thermal transfer roller heated to a predetermined temperature (for example, 200 ° C. to 250 ° C.) may be pressed from the transfer substrate 21 side without heating the screen panel 31. good.

Next, the screen panel 31 from which the transfer substrate 21 has been peeled off is heated to a temperature higher than the peeling temperature of the transfer substrate 21 (for example, about 300 ° C.). As a result, the release layer 22 is vaporized and exhausted from the screen panel 31 as shown in Fig. 6C. After the release layer 22 is removed, the screen panel 31 is then heated to a temperature higher than the temperature at which the release layer 22 is vaporized (for example, about 400 ° C to 485 ° C). As a result, as shown in FIG. 6D, the adhesive layer 26 is vaporized and exhausted from the screen panel 31 via the reflective layer 24 and the second phosphor layer 23. In this manner, the second phosphor portion 52 including the conductive layer 15, the reflective layer 24, and the second phosphor layer 23 is formed on the inner surface of the screen panel 32.

As described above, according to the present embodiment, the first phosphor portion 51 and the second phosphor portion 52 are formed in a separate process by a transfer method using two transfer films 1 and 2, It becomes possible to use the conventional transfer film which was used for manufacture of the normal flat cathode ray tube 110 (FIG. 14 (A)) which does not have the icon display area | region 32B as a 1st transfer film as it is. . This makes it possible to achieve some commonalities with the production line of the conventional flat cathode ray tube which does not have the icon display region 32B in the step of forming the fluorescent surface 50. In addition, unlike the case where the fluorescent surface is collectively formed by only one transfer film, either of the first phosphor portion 51 and the second phosphor portion 52, even if a defect occurs in the forming step of either The yield can be improved only by reprocessing.

Thus, according to this embodiment, the fluorescent surface 50 excellent in productivity is attained by the transfer method, without making the transfer film used conventionally unnecessary.

Second Embodiment

Next, a second embodiment of the present invention will be described. In addition, in the following description, the same code | symbol is attached | subjected to the part same as the component in said 1st Embodiment, and description is abbreviate | omitted suitably. In addition, the description is abbreviate | omitted suitably about the manufacturing process substantially the same as the said 1st Embodiment.

In the first embodiment, the conductive layer 15 on the fluorescent surface 50 is formed as a series of layers common to the first phosphor portion 51 and the second phosphor portion 52 as shown in FIG. For this reason, the conductive layer 15 is laminated only on the 1st transfer film 1 (FIG. 3A, FIG. 4A), and the 2nd transfer film 2 (FIG. 3B). 4 and FIG. 4B, those having a structure in which the conductive layers 15 are not laminated are used.

In the present embodiment, when the fluorescent surface 50 is formed, as shown in FIGS. 9B and 10B, the conductive layer 25 is laminated in the same manner as in the first transfer film 1. The 2nd transfer film 2A of a structure is used. That is, the release layer 22, the second phosphor layer 23, the reflective layer 24, the conductive layer 25, and the adhesive layer 26 are sequentially formed on one surface of the transfer substrate 21 as the second transfer film 2A. What is laminated is used. As the 1st transfer film 1, as shown to FIG. 9 (A) and FIG. 10 (A), the thing similar to the said 1st Embodiment is used. By using the transfer films 1 and 2A having such a structure, the second phosphor portion 52 has a two-layer structure in which the conductive layer 25 is entirely stacked on the conductive layer 15 common to the first phosphor portion 51. Conductive layer is formed. 10A and 10B, cross-sections of XA-XA and XB-XB lines in the transfer films 1 and 2A shown in Figs. 9A and 9B, respectively. To show.

In this embodiment, the conductive layer 15 corresponds to one embodiment of the "first conductive layer" in the present invention, and the conductive layer 25 is the "second conductive layer" in the present invention. Corresponding to one embodiment.

2A of 2nd transfer films can be produced basically similarly to the 2nd transfer film 2 used by the said 1st Embodiment. In other words, the second transfer film 2A is, for example, a peeling layer 22, a second phosphor layer 23, and a reflecting layer 24 by screen printing on a transfer substrate 21 made of PET. ), The conductive layer 25 and the adhesive layer 26 are formed in this order. At this time, the layer which has the same function as the said 1st Embodiment is basically formed with the same material and thickness.

More specifically, first, the release layer 22, the second phosphor layer 23, and the reflective layer 24 are formed on the transfer substrate 21 by the printing method in the same manner as in the first embodiment.

Next, the conductive layer 25 is formed by the printing method so as to cover the reflective layer 24. The material and thickness of the conductive layer 25 may be the same as those of the conductive layer 15 of the first transfer film 1. And the adhesive layer 26 is formed by the printing method so that this conductive layer 25 may be covered.

In the forming process for the second transfer film 2A described above, after each layer is formed, the film thickness of each layer is stabilized by natural drying or by drying like the first transfer film 1. . In this manner, the second transfer film 2A is produced.

The whole flow of the manufacturing process of the flat cathode ray tube 30 in this embodiment is the same as that of the said 1st Embodiment, and is as shown in FIG. However, in the present embodiment, the second transfer film 2A having the structure shown in Figs. 9B and 10B is formed in the process of forming the second phosphor portion 52 in step S2. The used process is performed.

That is, in this embodiment, the process of forming the second phosphor portion 52 is performed as shown in FIG.

First, as shown in FIG. 11A, the second transfer film 2A is adhered onto the conductive layer 15 formed and transferred by the first transfer film 1 by the adhesive layer 26. . This bonding is performed on the conductive layer 15 at a position where the second phosphor layer 23, the reflective layer 24, and the conductive layer 25 are transferred to a position corresponding to the formation region of the second phosphor portion 52. Next, the same heat treatment as that of the first embodiment is performed to peel the transfer substrate 21 from the second transfer film 2A as shown in Fig. 11B, and the transfer layer 20A is removed. It transfers to the inner surface of the screen panel 31 via the conductive layer 15.

Next, the same heat treatment as that of the first embodiment is performed, and as illustrated in FIG. 11C, the release layer 22 is vaporized to evacuate from the screen panel 31. After the peeling layer 22 is removed, the treatment is further performed to a temperature (for example, about 400 ° C. to 485 ° C.) higher than the temperature at which the peeling layer 22 is vaporized similarly to the first embodiment. As a result, as shown in FIG. 11D, the adhesive layer 26 is vaporized and exhausted from the screen panel 31 via the conductive layer 25, the reflective layer 24, and the second phosphor layer 23. . In this way, the second phosphor portion 51 is formed on the inner surface of the screen panel 32 so that the conductive layer 25 is entirely overlapped on the conductive layer 15. That is, as shown in Fig. 11D, the second phosphor composed of the conductive layer 15, the conductive layer 25, the reflective layer 24, and the second phosphor layer 23 in order from the screen panel 32 side. A portion 52 is formed.

As described above, also in the present embodiment, the first phosphor portion 51 and the second phosphor portion 52 are formed in a separate process by a transfer method using two transfer films 1 and 2A. The same effect as in the first embodiment can be obtained, and the fluorescent surface 50 having excellent productivity can be formed.

[Third Embodiment]

Next, a third embodiment of the present invention will be described. In addition, in the following description, the same code | symbol is attached | subjected to the part same as the component in said 1st and 2nd embodiment, and description is abbreviate | omitted suitably. In addition, the description is abbreviate | omitted suitably about the manufacturing process substantially the same as the said 1st and 2nd embodiment.

In the second embodiment, the second phosphor portion 52 is formed on the conductive layer 15 common to the first phosphor portion 51 so that the conductive layer 25 overlaps as a whole. In the present embodiment, the first phosphor portion 51 and the second phosphor portion 52 are formed so that the respective conductive layers partially overlap each other.

In the present embodiment, at the time of forming the fluorescent surface 50, two transfer films 1A and 2B shown in Figs. 12A and 12B are used. The cross-sectional structures of the components of the transfer films 1A and 2B and the main parts thereof are similar to those of the transfer films 1 and 2A shown in Figs. 10A and 10B. In addition, the production method is basically the same as the transfer films 1 and 2A. That is, in the present embodiment, the peeling layer 12A, the first phosphor layer 13, the reflective layer 14, the conductive layer 15A and the adhesive layer (1A) are formed on one surface of the transfer substrate 11 as the first transfer film 1A. 16A) is laminated and formed by the printing method one by one. In addition, as the second transfer film 2B, a release layer 22A, a second phosphor layer 23, a reflective layer 24, a conductive layer 25A, and an adhesive layer 26A are sequentially turned on one surface of the transfer substrate 21. The laminate formed by the printing method is used.

However, in the transfer film 1A, 2B of this embodiment, the formation area of each conductive layer 15A, 25A especially shows the transfer film 1, 2A shown to FIG. 10 (A), (B). It is different from.

That is, as can be seen by comparing Figs. 9A and 12A, the conductive layer 15A of the first transfer film 1A is formed on the formation side of the second phosphor portion 52 (Fig. In the lower side) is formed to be smaller than that of the first transfer film 1 in Fig. 9A. Moreover, the formation area is reduced also with respect to the peeling layer 12A and the contact bonding layer 16A by the type suiting the area of this conductive layer 15A. On the other hand, the formation area of the conductive layer 25A in the second transfer film 2B can be understood by comparing FIG. 9B with FIG. Enlarged to the formation side (upper side in the drawing) of the first phosphor portion 51 as compared with the second transfer film 2A of FIG. 9B so as to partially overlap with the conductive layer 15A of the used film 1A. It is. In Figs. 12A and 12B, portions denoted by reference marks d are overlapping portions at the time of transfer.

In this embodiment, the conductive layer 15A corresponds to one embodiment of the "first conductive layer" in the present invention, and the conductive layer 25A is the "second conductive layer" in the present invention. Corresponding to one embodiment.

The overall flow of the manufacturing process of the flat cathode ray tube 30 in the present embodiment will be described below with reference to FIG.

First, the first phosphor portion 51 is formed by the transfer method using the first transfer film 1A (step S11). This formation process differs only in the formation area of 15 A of conductive layers, and is basically the same as that of the said 1st, 2nd embodiment.

Next, the second phosphor portion 52 is formed by a transfer method using the second transfer film 2B (step S12). At this time, transfer is performed by partially overlapping the transfer layer of the second transfer film 2B, particularly the conductive layer 25A, with the conductive layer 15A formed by the first transfer film 1A. As a result, the conductive layer 15A of the first phosphor portion 51 and the conductive layer 25A of the second phosphor portion 52 are electrically connected.

Next, the screen panel 31, the front panel 32, and the funnel portion 33 are joined by the frit sealing process (F / S process) (step S13).

Next, the conductive layer 25A in the second phosphor portion 52 of the screen panel 31 and the internal conductive film 53 of the funnel portion 33 are electrically connected by the conductive film 54 for conduction. (Step S14). Formation of the conductive conductive film 54 is similar to that shown in FIG. 7, for example, the screen panel 31 of the inner conductive film 53 is formed from the center end of the conductive layer 33 side of the conductive layer 25A. It is performed by applying a carbon film, for example, to the area | region to the center part of the side. This conductive conductive film 54 is baked at a temperature of, for example, about 440 ± 20 ° C. By forming the conductive conductive film 54, the node voltage HV can be applied to the conductive layer 25A in the second phosphor portion 52 via the internal conductive film 53 and the conductive conductive film 54. Can be. In addition, since the conductive layer 15A of the first phosphor portion 51 and the conductive layer 25A of the second phosphor portion 52 are electrically connected, the anode voltage HV can be applied to the conductive layer 15A. have. As described above, the flat cathode ray tube 30 is manufactured.

As described above, also in the present embodiment, the first phosphor portion 51 and the second phosphor portion 52 were formed in separate processes by a transfer method using two transfer films 1A and 2B. For example, unlike the case where the fluorescent surface is collectively formed by only one transfer film, even if a defect occurs in the forming process of either the first phosphor portion 51 or the second phosphor portion 52, either The yield can be improved only by performing only the process of this side, and the formation of the fluorescent surface 50 excellent in productivity is attained.

In addition, although formation of the fluorescent surface by the transfer method was demonstrated in this invention, the separate method using the vapor deposition method and the electrodeposition method is also described as a reference example.

First, a first conductive film 115 and a second conductive film 125 made of, for example, an aluminum (Al) vapor deposition film are deposited on the inner surface of the screen panel 131 as shown in Fig. 16 (step S1). ). At this time, the first conductive film 115 is formed over the entire formation region of the first phosphor portion 151. At the same time, a leader line portion 116 for applying a voltage to the first conductive film 115 is formed. On the other hand, the second conductive film 125 is formed in the same position as the phosphor pattern (icon pattern) at the formation position of the second phosphor layer 123 in the formation region of the second phosphor portion 152. At the same time, lead wire portions 126 (126A, 126B, 126C) for applying a voltage to the second conductive film 125 are formed. These conductive films 115 and 125 and leader lines 116 and 126 cover, for example, regions other than the formation regions of the conductive films 115 and 125 and leader lines 116 and 126 with a mask and are formed by a vapor deposition method. It is possible to form collectively at the same time.

Next, the first phosphor layer 113 and the second phosphor layer 123 are selectively deposited on the first conductive film 115 and the second conductive film 125 by electrodeposition (step S2). ).

The electrodeposition process of the phosphor layers 113 and 123 is performed using, for example, the electrodeposition apparatus shown in FIG. The electrodeposition apparatus holds the electrodeposition layer 161 containing the electrodeposition liquid 162 and the screen panel 131 to be electrodeposition, and the conductive films 115 and 125 serving as the formation surfaces of the phosphor layers 113 and 123. A counter electrode 164 disposed opposite to the formation surface of the electrode and holding portion 163 and the phosphor layers 113 and 123, the electrode and holding portion 163 and the counter electrode 164. It is mainly composed of a power supply 165 for supplying a voltage to ().

As the electrodeposition liquid 62, for example, a mixture of phosphor, indium oxide, aluminum nitrate, and nitrate lantern is mixed with pure water, isopropyl alcohol, and glycerin, and ultrasonically dispersed to produce a mixture. At this time, as the phosphor to be dispersed in the electrodeposition liquid 162, one corresponding to the type (color) of the phosphor layer to be formed is used. For example, when the first phosphor layer 113 is formed, a white light emitting phosphor, for example, Y ₂ O ₂ S (sulfide yttrium oxide) or Y ₂ O ₂ S: Tb (sulfide yttrium oxide: terbium activation) or the like Fluorescent powder is dispersed in the electrodeposition liquid 162. In addition, in the case of forming the second phosphor layer 123, the fluorescent powder of the emission color according to the type of the icon image 42 to be displayed is dispersed in the electrodeposition liquid 162.

The electrodeposition treatment using this electrodeposition apparatus is performed for each phosphor layer, and more specifically for each color. For example, first, the first phosphor layer 113 is formed by electrodeposition, and then the second phosphor layer 123 is formed by electrodeposition. In this case, first, the screen panel 131 is held and disposed by the electrode and the holding portion 163 in the electrodeposition liquid 162 in which the white light-emitting phosphor which is a constituent of the first phosphor layer 113 is dispersed. At this time, the electrode portion of the electrode and holding portion 163 is brought into contact with the leader line portion 116 of the first conductive film 115, which is the formation surface of the first phosphor layer 113. As a result, the voltage from the power source 165 is selectively applied only to the first conductive film 115 via the electrode and holding portion 163. In addition, the counter electrode 164 is disposed to face the first conductive film 115 serving as the formation surface of the first phosphor layer 113. As shown in FIG. 15, for example, a potential potential is applied to the counter electrode 164 via an electrostatic potential, and a first conductive film 115 via an electrode and holding portion 163 and a leader line 116. It is applied and the electrodeposition process of phosphor is performed. As a result, the first phosphor layer 113 is selectively electrodeposited on the first conductive film 115 on the inner surface of the screen panel 131.

Next, the screen panel 131 is held and disposed by the electrode and holding portion 63 in the electrodeposition liquid 162 in which the phosphor powder as the constituent component of the second phosphor layer 123 is dispersed. At this time, the electrode portion of the electrode and holding portion 163 is brought into contact with the leader line portion 126 of the second conductive film 125 which is the formation surface of the second phosphor layer 123. As a result, the voltage from the power supply 165 is selectively applied only to the second conductive film 125 via the electrode and holding portion 163. In addition, the counter electrode 164 is disposed to face the second conductive film 125 serving as the formation surface of the second phosphor layer 123. As shown in FIG. 15, for example, a potential potential is applied to the counter electrode 164 via an electrostatic potential, and a first conductive film 115 via an electrode and holding portion 163 and a leader line 116. It is applied and the electrodeposition process of phosphor is performed. As a result, a second phosphor layer 123 having a desired color is selectively electrodeposited on the second conductive film 125 on the inner surface of the screen panel 131.

In addition, when the second phosphor layer 123 is formed of a plurality of phosphor layers having different emission colors (that is, a plurality of phosphor patterns having different emission colors), electrodeposition treatment is performed for each color. For example, when the phosphor layers 123A, 123B, and 123C constituting the second phosphor layer 123 are formed of blue, red, and green phosphors, respectively, the electrodeposition liquid in which the phosphor powder of each color is dispersed ( The screen panel 131 is placed in 162 to sequentially perform electrodeposition processing. At this time, the electrode portion of the electrode and holding portion 163 is each lead wire portion 125A, 125A, 125B, 125C of each conductive film 125A, 125B, 125C, which is a formation surface of each phosphor layer 123A, 123B, 123C in each electrodeposition treatment step. 125B, 125C). Thereby, in each electrodeposition process, the voltage from the power supply 165 is selectively applied only to the conductive film which becomes an electrodeposition object among each conductive film 125A, 125B, and 125C. As the blue phosphor powder, for example, ZnS: Ag or the like can be used. Moreover, as green phosphor powder, ZnS: Cu, Al etc. can be used, for example. As the phosphor powder of the red, for example, Y ₂ O ₂ S: Eu and the like can be used.

After forming each phosphor layer as described above, as shown in FIG. 17, each lead wire portion 161, 126 of each of the conductive films 125, 125 is made of, for example, a conductive film made of a carbon film. The interconnects are electrically interconnected by the film 154 to form the common connection portion 154A (step S3). As a result, the conductive films 115 and 125 are electrically connected to each other.

Next, the screen panel 131, the front panel 132, and the funnel portion 133 are joined by the frit sealing step (F / S step) (step S4).

Next, the internal conductive film 153 of the funnel portion 133 and the common connecting portion 154A formed in step S3 are electrically connected by, for example, applying a carbon film (step S5). Thereby, as shown in FIG. 17, conduction for conduction to the area | region from each lead wire part 116,126 of each conductive film 115,125 to the edge part of the screen panel 131 side of the internal conductive film 153 is carried out. A film 154 is formed. As a result, each of the conductive films 115 and 125 of the screen panel 131 and the internal conductive film 153 of the funnel portion 133 are electrically connected. In addition, the conductive conductive film 154 is baked at a temperature of, for example, about 440 ± 20 ° C. As a result, the anode voltage HV can be applied to the first conductive film 115 and the second conductive film 125 via the internal conductive film 153 and the conductive conductive film 154. As described above, the flat cathode ray tube 30 is manufactured.

In addition, this invention is not limited to each said embodiment, A various deformation | transformation is possible. For example, the present invention can be applied not only to a flat cathode ray tube but also to a so-called straight type cathode ray tube that irradiates an electron beam from an electron gun perpendicularly to the center of a fluorescent surface.

In each of the above embodiments, an example in which the icon display region 32B (the second phosphor portion 52) is provided below the main image display region 32A (the first phosphor portion 51) has been described. Alternatively, the icon display area 32B may be provided in another area. That is, the icon display area 32B may be provided in an area on the upper side, left side, or right side with respect to the main video display area 32A. In addition, the icon display area 32B may be provided in two or more areas.

As described above, according to the method for forming the fluorescent screen according to any one of claims 1 to 4, the first phosphor part is formed by a transfer method using a first transfer film having at least a first phosphor layer laminated thereon, and the second phosphor. Since the part was formed separately by the transfer method using the 2nd transfer film in which the 2nd fluorescent substance layer was laminated | stacked, it becomes possible to use the transfer film conventionally used as a 1st transfer film as it is, for example. Thereby, the fluorescent surface excellent in productivity can be formed by the transfer method, without wasting the transfer film used conventionally. That is, some commonalization with the formation process of the conventional fluorescent surface which has only a single fluorescent substance part can be aimed at.

Claims (4)

A first step of forming a first phosphor portion by a transfer method using at least a first transfer film having a first phosphor layer laminated thereon; And a second step of forming a second phosphor portion by a transfer method in a region different from a region where the first phosphor layer is provided, using a second transfer film having at least a second phosphor layer laminated thereon. Method of forming a fluorescent surface. The method of claim 1, wherein the first transfer film is further laminated with a conductive layer, In the first step, the conductive layer is transferred to the formation region of the first phosphor portion and the second phosphor portion, and the first phosphor layer is transferred to the formation region of the first phosphor portion, In the second step, the second phosphor layer is entirely overlapped on the conductive layer transferred by the first step, and transferred to the formation region of the second phosphor part. The method of claim 1, wherein a first conductive layer is further laminated on the first transfer film, and a second conductive layer is further laminated on the second transfer film, In the first step, the first conductive layer is transferred to the formation region of the first phosphor portion and the second phosphor portion, and the first phosphor layer is transferred to the formation region of the first phosphor portion, In the second step, the second phosphor layer and the second conductive layer are entirely overlapped on the first conductive layer transferred by the first step, and transferred to the formation region of the second phosphor part. Method of forming a fluorescent surface. The method of claim 1, wherein a first conductive layer is further laminated on the first transfer film, and a second conductive layer is further laminated on the second transfer film, In the first step, the first conductive layer is transferred at least to the formation region of the first phosphor portion, and the first phosphor layer is transferred to the formation region of the first phosphor portion, In the second step, the second conductive layer and the second phosphor layer are formed so that the second conductive layer partially overlaps the first conductive layer transferred by the first process. A method of forming a fluorescent surface, which is transferred to a region.