KR102126790B1 - Shingled solar cell module - Google Patents

Abstract

High efficiency configurations for solar cell modules include solar cells that are electrically coupled to each other in a shingled manner to form super cells, which effectively utilize the area of the solar module, reduce series resistance, and reduce module efficiency. It can be arranged to increase. The front metallization patterns on the solar cells can be configured to enable single step stencil printing, which is possible by the overlapping configuration of solar cells in the super cells. The photovoltaic system can include two or more of these high voltage solar cell modules that are electrically connected in parallel to each other and the inverter. Solar cell cutting mechanisms and solar cell cutting methods apply a vacuum between the bottom surfaces of the solar cell wafer and the curved support surface to bend the solar cell wafer against a curved support surface, thereby a plurality of solar cells The solar cell wafer is cut along one or more prefabricated scribe lines to provide. The advantage of these cutting tools and cutting methods is that they do not require physical contact with the top surfaces of the solar cell wafer. Solar cells are manufactured with reduced charge recombination losses at the edges of the solar cell, for example, without truncated edges that promote charge recombination. The solar cells can have narrow rectangular gigascopic structures and can advantageously be employed in shingled (overlapping) arrangements to form super cells.

Description

SHINGLED SOLAR CELL MODULE

The present invention relates generally to solar cell modules in which the solar cells are arranged in a shingled manner.

This international patent application was filed on US Patent Application No. 14/530,405 filed on October 31, 2014 (invention name: "Shingled Solar Cell Module"), on November 4, 2014. United States Patent Application No. 14/532,293 filed (invention name: "Shingled Solar Cell Module"), US Patent Application No. 14/536,486 filed on November 7, 2014 (invention) Name: "Shingled Solar Cell Module", U.S. Patent Application No. 14/539,546, filed on November 12, 2014 (Invention Name: "Shingled Solar Cell Module" )"), US Patent Application No. 14/543,580, filed on November 17, 2014 (invention name: "Shingled Solar Cell Module"), filed on November 19, 2014 U.S. Patent Application No. 14/548,081 (invention name: "Shingled Solar Cell Module"), U.S. Patent Application No. 14/550,676 filed on November 21, 2014 (invention name: "Shingled Solar Cell Module", US Patent Application No. 14/552,761 filed on November 25, 2014 (invention name: "Shingled Solar Cell Module") ), U.S. Patent Application No. 14/560,577 filed on December 4, 2014 (invention name: "Shingled Solar Cell Module"), U.S. Patent Filed on December 10, 2014 Application No. 14/566,278 (invention name: "Shingled Solar Cell Module"), US Patent Application No. 14/565,820 filed on December 10, 2014 (invention name: " Shingled Solar Cell Module", US Patent Application No. 14/572,206 filed on December 16, 2014 (invention name: "Shingled Solar Cell Module") , US patent application No. 14/577,593 filed on December 19, 2014 (invention name: "Shingled Solar Cell Module"), US patent application filed on December 30, 2014 No. 14/586,025 (invention name: “Shingled Solar Cell Module”), US Patent Application No. 14/585,917 filed on December 30, 2014 (invention name: “Single "Shingled Solar Cell Module", US Patent Application No. 14/594,439, filed January 12, 2015 (invention name: "Shingled Solar Cell Module"), 2015 U.S. Patent Application No. 14/605,695 filed on January 26, 2017 (invention name: "Shingled Solar Cell Module"), U.S. Provisional Patent Application filed on March 27, 2014 62/003,223 (invention name: "Shingled Solar Cell Module"), US Provisional Patent Application No. 62/036,215 filed on August 12, 2014 (invention name: "Singled" "Shingled Solar Cell Module", US Provisional Patent Application No. 62/042,615, filed August 27, 2014 (invention name: "Shingled Solar Cell Module"), U.S. Provisional Patent Application No. 62/048,858 filed on September 11, 2014 (invention name: "Shingled Solar Cell Module"), October 2014 U.S. Provisional Patent Application No. 62/064,260 filed on the 15th (invention name: "Shingled Solar Cell Module"), U.S. Provisional Patent Application No. 62/ filed on October 16, 2014 064,834 (invention name: “Shingled Solar Cell Module”), US Patent Application No. 14/674,983 filed on March 31, 2015 (invention name: “adopting hidden tabs”) Shingleed Solar Cell Panel Employing Hidden Taps", U.S. Provisional Patent Application No. 62/081,200, filed on November 18, 2014 (invention name: "Solar panel employing hidden tabs ( Solar Cell Panel Employing Hidden Taps"), US Provisional Patent Application No. 62/113,250, filed February 6, 2015 (invention name: "Shingled Solar Cell Panel Employing with Hidden Tabs" Hidden Taps"), US Provisional Patent Application No. 62/082,904, filed on November 21, 2014 (invention name: "High Voltage Solar Panel"), on January 15, 2015 United States Provisional Patent Application No. 62/103,816 filed (invention name: "High Voltage Solar Panel"), United States Provisional Patent Application No. 62/111,757 filed on February 4, 2015 (invention) Name of: "High Voltage Solar Panel", US Provisional Patent Application No. 62/134,176 filed on March 17, 2015 (Invention Name: "Solar Cell Cutting Mechanisms and Methods ( Solar Cell Cleaving Tools and Methods"), US Provisional Patent Application No. 62/150,426 filed April 21, 2015 (invention name: "Stencil Shingleed Solar Cell Panel Comprising Stencil-Printed Cell Metallization", US Provisional Patent Application No. 62/035,624 filed August 11, 2014 (name of invention) : "Solar Cells with Reduced Edge Carrier Recombination"), US Design Patent Application No. 29/506,415 filed on October 15, 2014, October 20, 2014 US Design Patent Application No. 29/506,755 filed, US Design Patent Application No. 29/508,323 filed on November 5, 2014, US Design Patent Application No. 29/509,586 filed on November 19, 2014, And the US design patent application No. 29/509,588 filed on November 19, 2014 is accompanied by priority. Each of the above patent applications listed above is incorporated herein by reference for all purposes.

Alternative sources of energy are being demanded to meet all of the increasing global energy needs. Solar energy resources are sufficient in many geographic regions to meet these needs in part by the supply of power generated by solar (eg, photovoltaic) cells.

Disclosed herein are high efficiency batches of solar cells in a solar cell module and methods of making such solar modules.

In one aspect, the solar module includes a series connected string of N≥25 rectangular or substantially rectangular solar cells having a breakdown voltage greater than about 10 volts. The solar cells are one or more super cells comprising two or more of the solar cells arranged in series with long sides of adjacent solar cells that are conductively bonded to each other with an overlapping and electrically and thermally conductive adhesive ( super cells). A single solar cell or group of <N solar cells in the string of solar cells is not individually electrically connected in parallel to a bypass diode. Safe and reliable operation of the solar module is enabled by effective heat conduction along the super cells through the combined and overlapping portions of adjacent solar cells, which is a hot spot in reverse biased solar cells ( Prevent or reduce the formation of hot spots. The super cells can be encapsulated, for example, in a thermoplastic olefin polymer interposed between the glass front and back sheets, further improving the module's robustness against thermal damage. In some variations, N is ≥30, ≥50 or ≥100.

In another aspect, the super cell has a rectangular shape with shapes defined by first and second opposing parallel long sides and two opposing short sides, respectively. And a plurality of silicon solar cells having a substantially rectangular front side (sun side) and rear sides. Each solar cell is an electrically conductive front metallization pattern having at least one front contact pad positioned adjacent to the first long side and at least one rear contact positioned adjacent to the second long side And an electrically conductive back metallization pattern having a pad. The silicon solar cells are first and second long sides of overlapping and adjacent silicon solar cells to electrically connect the silicon solar cells in series, and adjacent silicon solar cells that are conductively bonded to each other with an overlapping conductive adhesive bonding material. It is arranged in line with the front and rear contact pads on the field. The front metallization pattern of each silicon solar cell is configured to substantially limit the conductive adhesive bonding material to the at least one front contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell. It includes a barrier.

In another aspect, the super cell has a rectangular or substantially rectangular front face (sun side) with shapes defined by parallel long sides and first two oppositely positioned short sides, respectively. ) And a plurality of silicon solar cells having a rear surface. Each solar cell has an electrically conductive front metallization pattern having at least one front contact pad positioned adjacent to the first long side and at least one back contact pad positioned adjacent to the second long side. It includes an electrically conductive back metallization pattern. The silicon solar cells are first and second long sides of overlapping and adjacent silicon solar cells to electrically connect the silicon solar cells in series, and adjacent silicon solar cells that are conductively bonded to each other with an overlapping conductive adhesive bonding material. It is arranged in line with the front and rear contact pads on the field. The back metallization pattern of each silicon solar cell includes a barrier configured to substantially limit the conductive adhesive bonding material to the at least one back contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell. do.

In another aspect, a method of making a string of solar cells includes one or more along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells each having a qualitatively equal length along its long axis. And dicing the above pseudo square silicon wafers. The method also includes arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series. The plurality of rectangular silicon solar cells lacks at least one rectangular solar cell and each chamfered edge having two chamfered edges corresponding to the edges or portions of the edges of the pseudo-square wafer. It includes one or more square silicon solar cells. The spacing between parallel lines along which the pseudo square wafer is diced is a rectangular silicon sun lacking the chamfered edges to a width orthogonal to the long axis of the square silicon solar cells having the chamfered edges. Each of the plurality of square silicon solar cells in the string of solar cells is exposed to light in operation of the string of solar cells, as it is selected to compensate for the chamfered edges by making it larger than the width orthogonal to the long axis of the cells Being substantially has the same area front.

In another aspect, a super cell includes a plurality of silicon solar cells arranged in series with ends of adjacent solar cells that overlap and are conductively coupled to each other to electrically connect the solar cells in series. At least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of the pseudo-square silicon wafer on which it was diced, at least one of the silicon solar cells lacks the chamfered corners, Each of the silicon solar cells has a substantially equal area front surface exposed to light during operation of the string of solar cells.

In another aspect, a method of making two or more super cells comprises a first plurality of rectangular silicon solar cells each having a chamfered edge corresponding to the edges or portions of the edges of the pseudo square silicon wafers and each. Dicing one or more pseudo square silicon wafers to form a second plurality of rectangular silicon solar cells lacking chamfered edges and having a first length that spans the entire width of the pseudo square silicon wafers. do. The method also includes: from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the first length and lacking chamfered edges. And removing the chamfered edges. The method comprises adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the first length. Arranging the second plurality of rectangular silicon solar cells in line with the long sides of the, and the third plurality of rectangular silicon solar cells to form a solar cell string having a width equal to the second length. And arranging the third plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells conductively coupled to each other to electrically connect in series.

In another aspect, a method of making two or more super cells comprises a first plurality of rectangular silicon solar cells and a chamfer having chamfered edges corresponding to edges or portions of edges of pseudo square silicon wafers. Dicing one or more pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a second plurality of rectangular silicon solar cells lacking processed edges, the first plurality Arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the rectangular silicon solar cells of the series; and The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series. It includes the steps.

In another aspect, the super cell is a plurality of silicon solar cells arranged in a first direction with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series, and Conductively coupled to the front or rear of one of the ends of the silicon solar cells at a plurality of distinct positions arranged along the second direction, with its long axis oriented parallel to the second direction orthogonal to the first direction And has a thickness equal to or less than about 100 microns measured orthogonally to the front or rear surface of the end silicon solar cell, and is about 0.012 ohm (Ohm). Provide resistance to current flow in the second direction less than or equal to differential expansion in the second direction between the end silicon solar cell and the interconnect for a temperature range of about -40°C to about 85°C And an extended flexible electrical interconnect that provides flexibility to accommodate.

The flexible electrical interconnect, for example, may have a conductor thickness less than or equal to about 30 microns measured orthogonally to the front and back surfaces of the end silicon solar cell. The electrical interconnect may extend in the second direction past the super cell to provide electrical interconnection to at least the second super cell located parallel and adjacent to the wing super cell in the solar module. Additionally or alternatively, the flexible electrical interconnect can extend in the first direction past the super cell to provide electrical interconnection to a second super cell that is parallel and parallel to the super cell in the solar module. have.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows across the width of the module to form the front side of the module. Each super cell includes a plurality of silicon solar cells arranged in series with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. At least an end of the first super cell adjacent to the edge of the module in the first column is electrically conductive adhesive bonding material coupled to the front surface of the second super cell at a plurality of separate locations, the edge of the module Of a second super cell adjacent to the same edge of the module in a second row through a flexible electrical interconnect that runs parallel to and at least a portion of which folds around the end of the super cell and is hidden from view from the front of the module It is electrically connected to the end.

In another aspect, a method of making a super cell lasers one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular areas on the silicon solar cells. Scribing, applying an electrically conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent to the long side of each rectangular area, each long side Separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells having a portion of the electrically conductive adhesive bonding material disposed on the front surface adjacent to the plurality of rectangles Arranging the silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner as part of the electrically conductive adhesive bonding material disposed therebetween, and Curing the electrically conductive bonding material, coupling adjacent and overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

In another aspect, a method of making a super cell includes laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular areas on the silicon solar cells. Step, applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells, wherein the one or more silicon solar cells are bent against a curved supporting surface. A vacuum is applied between the bottom surfaces of one or more silicon solar cells and the curved support surface, thereby providing a plurality of portions of the electrically conductive adhesive bonding material disposed on their front surfaces, each adjacent to a long side. Cutting the one or more silicon solar cells along the strip lines to provide rectangular silicon solar cells, the electrically conductive adhesive bonding material disposed between the plurality of rectangular silicon solar cells Aligning the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner as part of, and curing the electrically conductive bonding material, thereby adhering adjacent and overlapping rectangular silicon solar cells to each other. Combining and electrically connecting them in series.

In another aspect, a method of making a solar module includes assembling a plurality of super cells, each super cell superimposed in a shingled fashion and aligned with the ends on the long sides of adjacent rectangular silicon solar cells. It includes a plurality of rectangular silicon solar cells arranged as. The method also cures an electrically conductive bonding material disposed between overlapping ends of the adjacent rectangular silicon solar cells by applying heat and pressure to the super cells, thereby adhering adjacent and overlapping rectangular silicon solar. And connecting the cells together and electrically connecting them in series. The method also includes arranging and interconnecting the super cells in a desired solar module configuration in a stack of layers comprising an encapsulant, and stacking the layers to form a laminated structure. And applying heat and pressure.

Some variants of the method cure or partially cure the electrically conductive bonding material by applying heat and pressure to the super cells prior to applying heat and pressure to the stack of layers to form the laminated structure. By curing, forming super cells that are cured or partially cured as an intermediate product prior to forming the laminated structure. In some variations, as each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, any electrically conductive adhesive bonding material between the newly added solar cell and its adjacent and overlapping solar cell is optional. The other rectangular silicon solar cells of the are cured or partially cured before being added to the super cell. Optionally, some variations include curing or partially curing the electrically conductive bonding material in the super cell in the same step.

When the super cells are formed as partially cured intermediate products, the method completes curing of the electrically conductive bonding material while applying heat and pressure to the stack of layers to form the laminated structure. It may include steps.

Some variations of the method do not form super cells that are cured or partially cured as intermediate products prior to forming the laminated structure, while applying heat and pressure to the stack of layers to form the laminated structure. And curing the electrically conductive bonding material.

The method may include dicing one or more standard sized silicon solar cells into smaller area rectangular shapes to provide the rectangular silicon solar cells. The electrically conductive adhesive bonding material is one or more silicon solar cells before dicing the one or more silicon solar cells to provide the rectangular silicon solar cells with a pre-applied electrically conductive adhesive bonding material. Can be applied to Optionally, the electrically conductive adhesive bonding material can be applied to the rectangular silicon solar cells after dicing the one or more silicon solar cells to provide the rectangular silicon solar cells.

In one aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell includes a plurality of rectangular or substantially rectangular silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. A solar panel also includes a first hidden tap contact pad and a first hidden tap contact pad located on the back side of the first solar cell located at an intermediate position along the first one of the super cells. It includes a first electrical interconnect coupled to the conductive. The first electrical interconnect includes a stress relief feature that accommodates differential thermal expansion between the interconnect and the silicon solar cell to which it is coupled. The term “stress relieving feature” is used herein for an interconnect, for example, the thickness of the interconnect (eg, very thin) and/or the kink for the ductility of the interconnect. ), loops or slots (slots). For example, the stress relief feature can be such that the interconnect is formed of a very thin copper ribbon.

The solar module includes a second hidden tab contact pad located on the back of the second solar cell located adjacent to the first solar cell at an intermediate position along the second one of the super cells in an adjacent super cell row. The first hidden tap contact pad may be electrically connected to the second hidden tap contact pad through the first electrical interconnect. In these cases, the first electrical interconnect can extend across a gap between the first super cell and the second super cell, and can be conductively coupled to the second hidden tab contact pad. . Optionally, the electrical connection between the first and second hidden tap contact pads is conductively coupled to the second hidden tab contact pad and electrically connected to the first electrical interconnect (eg, conductively coupled). May include other electrical interconnects. Each interconnection scheme can be selectively extended across additional rows of super cells. For example, each interconnection plan can be selectively extended across the entire width of the module to interconnect the solar cells in each row through the hidden tab contact pads.

The solar module includes a second hidden tab contact pad located on the rear surface of a second solar cell positioned at a different intermediate position along the first ones of the super cells, and a conductive agent coupled to the second hidden tab contact pad 2 an electrical interconnect, and a bypass diode electrically connected in parallel with the solar cells located between the first hidden tap contact pad and the second hidden tap contact pad by the first and second electrical interconnects It can contain.

In any of the above variations, the first hidden tab contact pad is one of a plurality of hidden tab contact pads arranged on the back side of the first solar cell in a row running parallel to the long axis of the first solar cell. Can be, the first electrical interconnect is conductively coupled to each of the plurality of hidden contacts, and substantially traverses the length of the first solar cell along the long axis. Additionally or alternatively, the first hidden tab contact pad may be one of a plurality of hidden tab contact pads arranged on the back side of the first solar cell in a row running perpendicular to the long axis of the first solar cell. Can. In the latter case, the row of hidden tab contact pads may be located adjacent to the short edge of the first solar cell, for example. The first hidden tap contact pad may be one of a plurality of hidden tap contact pads arranged in a two-dimensional array on the back surface of the first solar cell.

Optionally, in any of the preceding variations, the first hidden tab contact pad can be located adjacent to the long side of the back surface of the first solar cell, and the first electrical interconnect is configured to provide a long axis of the solar cell. Accordingly, it does not substantially extend inwardly from the hidden tab contact pad, and the back metallization pattern on the first solar cell is preferably less than or equal to about 5 ohms per square, or greater than about 2.5 ohms per square to the interconnect. It provides a conductive passage having a sheet resistance equal to or smaller than that of the sheet. In these cases, the first interconnect can include, for example, two tabs located on opposite sides of the stress relief feature, one of the tabs being attached to the first hidden tab contact pad. It can be electrically conductive. The two tabs can be of different lengths.

In any of the above variations, the first electrical interconnect confirms a desired alignment with the first hidden tap contact pad, confirms a desired alignment with the edge of the first super cell, or the first hidden tap contact And alignment features that identify desired alignment with a pad and desired alignment with an edge of the first super cell.

In another aspect, the solar module comprises a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Includes. Each super cell includes a plurality of rectangular or substantially rectangular silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. The first flexible electrical interconnect is tightly conductively coupled to the first of the super cells. Flexible conductive bonds between the overlapping solar cells are the super cells and the glass in a direction parallel to the columns for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells It provides mechanical compliance to accommodate the mismatch of thermal expansion between the front sheets. The rigid conductive bond between the first super cell and the first flexible electrical interconnect is applied to the columns for a temperature range of about -40°C to about 180°C without causing the first flexible electrical interconnect to damage the solar module. The orthogonal direction accommodates the mismatch of thermal expansion between the first super cell and the first flexible electrical interconnect.

The conductive bonds between overlapping and adjacent solar cells in a super cell can use a different conductive adhesive than the conductive bonds between the super cell and the flexible electrical interconnect. The conductive bond on one side of at least one solar cell in the super cell may use a conductive adhesive different from the conductive bond on the other side. The conductive adhesive that forms a tight bond between the super cell and the flexible electrical interconnect can be, for example, a solder. In some variations, the conductive bonds between superimposed solar cells in a super cell are formed of a conductive adhesive rather than solder, and the conductive bond between the super cell and the flexible electrical interconnect is formed of solder.

In some variations using two different conductive adhesives as described above, both conductive adhesives will be cured in the same treatment step (eg, at the same temperature, at the same pressure, and/or at the same time interval). You can.

The conductive bonds between the overlapping and adjacent solar cells can accommodate differential motion between each cell and the glass front substrate, for example greater than or equal to about 15 microns.

The conductive bonds between the overlapping and adjacent solar cells are, for example, thicknesses orthogonal to the solar cells less than or equal to about 50 microns and the solar cells greater than or equal to about 1.5 W/(meter-K). It may have a thermal conductivity orthogonal to.

The first flexible electrical interconnect can withstand thermal expansion or contraction of the first flexible interconnect, for example greater than or equal to about 40 microns.

A portion of the first flexible electrical interconnect that is conductively coupled to the super cell can be like a ribbon formed of copper, for example the sun to which it is less than or equal to about 30 microns or less than or equal to about 50 microns It may have a thickness orthogonal to the surface of the battery. The first flexible electrical interconnect may include an essential conductive copper portion that is not coupled to the solar cell and provides higher conductivity than a portion of the first flexible electrical interconnect that is conductively coupled to the solar cell. The first flexible electrical interconnect is less than or equal to about 30 microns, or less than or equal to about 50 microns thick, orthogonal to the surface of the solar cell to which it is coupled and the sun in a direction orthogonal to the flow of current through the interconnect. It may have a width greater than or equal to about 10 mm in the plane of the surface of the cell. The first flexible electrical interconnect may be conductively coupled to a conductor proximate to the solar cell providing a higher conductivity than the first electrical interconnect.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell has a plurality of rectangular or substantially rectangular silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and electrically conductively coupled to each other to electrically connect the silicon solar cells in series. . A hidden tap contact pad that does not conduct effective current in normal operation is located on the back side of the first solar cell located at an intermediate position along the first one of the super cells in the first one of the rows of super cells. The hidden tab contact pad is electrically connected in parallel to at least a second solar cell in a second one of the rows of super cells.

The solar module may include an electrical interconnect coupled to the hidden tap contact pad and electrically interconnecting the hidden tap contact pad to the second solar cell. In some variations, the electrical interconnect does not substantially extend the length of the first solar cell, and the back metallization pattern on the first solar cell has the sheet resistance greater than or equal to about 50Ohm per square. A conductive passage is provided in the tab contact pad.

The plurality of super cells may be arranged in three or more parallel rows across the width of the solar module orthogonal to the rows, and the hidden tap contact pad electrically parallels all rows of the super cells. To be connected electrically to a hidden tab contact pad on at least one solar cell in each row of the super cells. In these variations, the solar module is at least one of the hidden tap contact pads connected to a bypass diode or other electronic device, or at least one bus connection to an interconnect between the hidden tap contact pads It may include.

The solar module may include a flexible electrical interconnect that is conductively coupled to the hidden tab contact pad to electrically connect it to the second solar cell. A portion of the flexible electrical interconnect that is conductively coupled to the hidden tab contact pad is, for example, a ribbon formed of copper, and less than or equal to about 50 microns, orthogonal to the surface of the solar cell to which it is bonded. It can have a thickness. The conductive coupling between the hidden tab contact pad and the flexible electrical interconnect can cause the flexible electrical interconnect to withstand mismatches in thermal expansion between the first solar cell and the flexible interconnect, and without damage to the solar module. The relative motion between the first solar cell and the second solar cell resulting from thermal expansion can be accommodated for a temperature range of 40°C to about 180°C.

In some variations, in operation of the solar module, the first hidden tap contact pad can conduct a current greater than the current generated within any single one of the solar cells.

Typically, the front surface of the first solar cell overlying the first hidden tab contact pad is not occupied by contact pads or any other interconnect features. Typically, any area of the front surface of the first solar cell that is not overlapped by a portion of adjacent solar cells in the first super sal is not occupied by contact pads or any other interconnect features.

In some variations, most of the cells in each super cell do not have hidden tab contact pads. In these variations, cells with hidden tab contact pads may have a larger light collecting area than cells without hidden tab contact pads.

In another aspect, a solar module includes a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Each super cell is a plurality of rectangular or substantially rectangular silicon solar cells arranged in series with long sides of adjacent silicon solar cells that are superposed to electrically connect the silicon solar cells in series and are flexible and conductively coupled to each other. Have them. The first flexible electrical interconnect is tightly conductively coupled to the first of the super cells. Flexible conductive bonds between the overlapping solar cells are formed of a first conductive adhesive, and have a shear modulus less than or equal to about 800 megapascal. The rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed of a second conductive adhesive and has a shear modulus greater than or equal to about 2000 megapascals.

The first conductive adhesive may have, for example, a glass transition temperature less than or equal to about 0°C.

In some variations, the first conductive adhesive and the second conductive adhesive are different, and all of the conductive adhesives can be cured in the same treatment process.

In some variations, the conductive bonds between the overlapping and adjacent solar cells are orthogonal to the solar cells less than or equal to about 50 microns and greater than or equal to about 1.5 W/(meter-K). It may have a thermal conductivity orthogonal to the solar cells.

In one aspect, the solar module includes rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 250 arranged as a plurality of series connected super cells in two or more parallel rows. Each super cell is a plurality of silicon arranged in line with the long sides of adjacent silicon solar cells that are electrically coupled to each other with an electrically and thermally conductive adhesive overlapping to electrically connect the silicon solar cells in the super cell in series. Solar cells are provided. The super cells are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts.

In one variation, the solar module includes one or more flexible electrical interconnects arranged to electrically connect the plurality of super cells in series to provide a high direct current voltage. The solar module may include module level power electronics including an inverter that converts the high DC voltage into an AC voltage. The module level power electronics can sense the high DC voltage and operate the module at an optimal current-voltage power point.

In another variation, the solar module is electrically connected to individual pairs of adjacent series-connected rows of super cells, and electrically series one or more of the pairs of rows of super cells to provide the high DC voltage. And a module level power electronics having an inverter that converts the high DC voltage into an AC voltage. Optionally, the module level power electronics can sense the voltage across each individual pair of columns of the super cells and operate each individual pair of columns of the super cells at an optimal current-voltage power point. Optionally, the module level power electronics can switch individual pairs of rows of super cells from circuitry providing the high direct current voltage when the voltage across the pair of rows is below a threshold value.

In another variation, the solar module is electrically connected to each individual column of the super cells, electrically connecting two or more of the columns of the super cells in series to provide the high DC voltage, and the high direct current And module level power electronics having an inverter that converts voltage to alternating voltage. Optionally, the module level power electronics can sense the voltage across each individual column of the super cells, and operate each individual column of the super cells at an optimal current-voltage power point. Optionally, the module level power electronics can switch individual rows of super cells from circuitry providing the high direct voltage when the voltage across the rows of super cells is below a threshold.

In another variation, the solar module is electrically connected to each individual super cell, electrically connecting two or more of the super cells in series to provide the high DC voltage, and alternating the high DC voltage. And module level power electronics with an inverter that converts to voltage. Optionally, the module level power electronics can sense the voltage across each individual super cell, and operate each individual super cell at an optimum current-voltage power point. Optionally, the module level power electronics can switch individual super cells from circuitry providing the high direct current voltage when the voltage across the super cells is below a threshold.

In another variant, each super cell in the module is electrically divided into a plurality of segments by hidden taps. The solar module is electrically connected to each segment of each super cell through the hidden tabs, electrically connecting two or more segments in series to provide the high DC voltage, and the high DC voltage to the AC voltage. And module level power electronics with an inverter to convert. Optionally, the module level power electronics can sense the voltage across each segment of each super cell, and operate each individual segment at an optimal current-voltage power point. Optionally, the module level power electronics can switch individual segments from circuitry providing the high DC voltage when the voltage across the segments is below a threshold.

In any of the above variations, the optimal current-voltage power point can be a maximum current-voltage power point.

In any of the above variations, the module level power electronics may lack a direct current to direct current boost component.

In any of the above variations, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, It may be greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or about It may be greater than or equal to 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar photovoltaic system includes two or more solar modules and inverters that are electrically connected in parallel. Each solar module includes a rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows. Each solar cell in each module includes two or more of the silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. do. In each module, the super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts. The inverter is electrically connected to the two or more solar modules to convert their high voltage direct current output to alternating current.

Each photovoltaic module may include one or more flexible electrical interconnects arranged to electrically connect super cells in the photovoltaic module in series to provide a high voltage direct current output of the photovoltaic module.

The photovoltaic power generation system may include at least a third photovoltaic module electrically connected in series with the first one of the two or more photovoltaic modules connected in parallel. In these cases, the third solar module may include rectangular or substantially rectangular silicon solar cells of number N'greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows. have. Each super cell in the third solar module is stacked to electrically connect the silicon solar cells in series, and the silicon solar cells in the module are arranged in series with long sides of adjacent silicon solar cells that are conductively coupled to each other. It includes two or more. In the third solar module, the super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

Variations comprising a third photovoltaic module electrically connected in series with the first one of the two or more photovoltaic modules as described above also include the two or more photovoltaic modules that are electrically connected in parallel. And at least a fourth solar module electrically connected in series with the second one. The fourth solar module may include rectangular or substantially rectangular silicon solar cells of number N" greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows. Each super cell in a solar module is two or more of the silicon solar cells in the module arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. The super cells in the fourth solar module are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

The photovoltaic system is fused and/or blocked to prevent short circuits occurring within any of the photovoltaic modules from dissipating power generated within other photovoltaic modules. It may include blocking diodes.

The photovoltaic power generation system may include positive and negative buses in which the two or more solar modules are electrically connected in parallel, and the inverter is connected electrically. Optionally, the solar power system can include a combiner box in which the two or more solar modules are electrically connected by separate conductors. The combiner box is fuses and/or arranged to electrically connect the solar modules in parallel and to prevent short circuits occurring in any of the solar modules from dissipating power generated in other solar modules. Blocking diodes may be optionally included.

The inverter may be configured to operate the solar modules at a DC voltage equal to or greater than a minimum value established to avoid reverse biasing the solar modules.

The inverter may be configured to recognize a reverse bias condition occurring within one or more of the solar modules and operate the solar modules at a voltage that avoids the reverse bias condition.

The solar power system can be located on the roof top.

In any of the above variations, N, N'and N" are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about 400 Greater than or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 N, N'and N" can have the same or different values.

In any of the above variations, the high direct current voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or about 300 volts Greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, greater than or equal to about 600 volts have.

In another aspect, the photovoltaic system comprises a first solar cell having a rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows. Contains modules. Each super cell includes a plurality of silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. The system also includes an inverter. The inverter may be, for example, a micro-inverter integrated with the first solar module. The super cells in the first solar module are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts to the inverter that converts direct current into alternating current.

The first solar module may include one or more flexible electrical interconnects arranged to electrically connect super cells in the solar module in series to provide a high voltage direct current output of the solar module.

The photovoltaic power generation system may include at least a second photovoltaic module electrically connected in series with the first photovoltaic module. The second solar module may include rectangular or substantially rectangular silicon solar cells of number N'greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows. Each super cell in the second photovoltaic module is formed of silicon solar cells in the module arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. It includes two or more. In the second solar module, the super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

The inverter (eg, microinverter) may be deficient in DC to DC boost components.

In any of the above variations, N and N'are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or greater than about 400 Equal, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, greater than or equal to about 700 have. N and N'may have the same or different values.

In any of the above variations, the high direct current voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or about 300 volts Greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, greater than or equal to about 600 volts have.

In another aspect, the solar module comprises rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 250 arranged as a plurality of series connected super cells in two or more parallel rows. Each super cell is a plurality of superimposed and arranged in series with the long sides of adjacent silicon solar cells that are conductively directly bonded to each other with an electrically and thermally conductive adhesive to electrically connect the silicon solar cells in the super cell in series. Silicon solar cells. The solar module includes no more than one bypass diode per 25 solar cells. The electrically and thermally conductive adhesive is applied to the solar cells that are orthogonal to the solar cells less than or equal to about 50 microns between adjacent solar cells and greater than or equal to about 1.5 W/(meter-K). Form bonds with orthogonal thickness thermal conductivity.

The super cells can be encapsulated in a layer of thermoplastic olefin between the front and back sheets. The super cells and their encapsulants can be interposed between the glass front and back sheets.

The solar module may be, for example, no more than one bypass diode per 30 solar cells, or no more than one bypass diode per 50 solar cells, or no more than one bypass diode per 100 solar cells. It may include. The solar module may include, for example, a bypass diode, or only a single single bypass diode, or no more than three bypass diodes, or no more than six bypass diodes, or And bypass diodes that do not exceed heat.

The conductive bonds between the superimposed solar cells do not damage the photovoltaic module to the super cells, and the super cells and the glass front face in the direction parallel to the heat for a temperature range of about -40°C to about 100°C. A mechanical compliance can be selectively provided to accommodate the mismatch of thermal expansion between sheets.

In any of the above variations, N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, It may be greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the super cells are greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or about 360 Electrically connected to provide a high direct current voltage greater than or equal to volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts You can.

The solar energy system is a solar module of any of the preceding modifications and an inverter electrically connected to the solar module and configured to convert a DC output from the solar module to provide AC output (eg For example, a micro-inverter). The inverter may lack DC to DC components. The inverter may be configured to operate the solar module at a DC voltage equal to or greater than a minimum voltage set to avoid reverse biasing of the solar cell. The minimum voltage value may depend on temperature. The inverter may be configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition. For example, the inverter may be configured to operate the solar module in a local maximum region of the voltage-current output curve of the solar module to avoid the reverse bias condition.

Disclosed herein are solar cell cutting tools and solar cell cutting methods.

In one aspect, a method of manufacturing solar cells comprises: advancing a solar cell wafer along a curved surface and between a curved surface and a bottom surface of the solar cell wafer to bend the solar cell wafer against a curved surface. And applying a vacuum to the solar cell wafer, thus cutting the solar cell wafer along one or more pre-prepared scribe lines to separate a plurality of solar cells from the solar cell wafer. The solar cell wafer may, for example, be continuously run along the curved surface. Optionally, the solar cell can proceed along separate surfaces of the curve in separate movements.

The curved surface may be, for example, a portion of the curved surface of the upper surface of a vacuum manifold that applies the vacuum to the bottom surface of the solar cell wafer. The vacuum applied to the bottom surface of the solar cell wafer by the vacuum manifold can be changed along the direction of progress of the solar cell wafer, for example, of the vacuum manifold in which the solar cell wafer is subsequently cut. It can be the strongest in the realm.

The method can include transferring the solar cell wafer to a perforated belt along the upper surface of the curve of the vacuum manifold, the vacuum being applied to the bottom surface of the solar cell wafer through the perforations of the perforated belt. Is authorized. The perforations should be such that leading and trailing edges of the solar cell wafer are placed on top of at least one perforation in the belt along the direction of progression of the solar cell wafer, and accordingly by the vacuum It can be selectively arranged to be pulled towards the curved surface, but this is not required.

The method advances the solar cell wafer along a flat area of the upper surface of the vacuum manifold to reach a transition region of the curve of the upper surface of the vacuum manifold having a first curvature, after which the solar cell wafer is It may include the step of advancing into the cutting area of the upper surface of the vacuum manifold, where the solar cell wafer is subsequently cut, wherein the cutting area of the vacuum manifold has a second curvature that is steeper than the first curvature. The method may further include advancing the cut solar cells into a post-cutting region of the vacuum manifold having a third curvature that is steeper than the curvature.

In any of the above variations, the method provides the opposite end of each scribe line to provide an asymmetric stress distribution along each scribe line that promotes the generation and propagation of a single cleaving crack along each scribe line. The method may further include applying a stronger vacuum between the solar cell wafer and the curved surface at one end of each scribe line. Optionally or additionally, in any of the above variants, the method vacuums the scribe lines on the solar cell wafer such that for each scribe line one end reaches a curved cut area of the vacuum manifold before the other end. And orienting at an angle relative to the manifold.

In any of the above variations, the method may include removing the cut solar cells from the curved surface before the edges of the cut solar cells are contacted. For example, the method may include removing the cells in a direction tangential or approximately tangential to the surface of the curve of the manifold at a rate greater than the rate of progression of the cells along the manifold. You can. This can be implemented, for example, by a moving belt arranged tangentially or any other suitable mechanism.

In any of the above variations, the method may include scribing the scribe lines onto the solar cell wafer and before or after cutting the solar cell wafer along the scribe lines. And applying an electrically conductive adhesive bonding material to the portions. Each resulting cut solar cell may then include a portion of the electrically conductive adhesive bonding material disposed along the cut edge of its top or bottom surface. The scribe lines may be formed before or after the electrically conductive adhesive bonding material is applied using any suitable scribing method. The scribe lines may be formed, for example, by laser scribing.

In any of the above variations, the solar cell wafer can be a square or pseudo square silicon solar cell wafer.

In another aspect, a method of making a string of solar cells is an electrically conductive adhesive bond disposed between a plurality of rectangular solar cells in line with the long sides of adjacent rectangular solar cells overlapping in a shingled manner. Arranging with a material, and curing the electrically conductive bonding material to bond adjacent and overlapping rectangular solar cells to each other, and electrically connecting them in series. The solar cells can be manufactured, for example, by any of the variations of the method for manufacturing the solar cells described above.

In one aspect, a method of making a string of solar cells comprises forming a back metallization pattern on each one or more square solar cells, and on each of the one or more square solar cells The complete front metallization pattern includes stencil printing using a single stencil in a single stencil printing step. These steps can be performed in either order and, if appropriate, simultaneously. "Complete front metallization pattern" means that no additional metallization material needs to be deposited on the front side of the square solar cell to complete the formation of the front side metallization after the stencil printing step. The method also includes placing two or more rectangular solar cells in each square to form a plurality of rectangular solar cells each having a complete front metallization pattern and a back metallization pattern from the one or more square solar cells. Separating into solar cells, arranging the plurality of rectangular solar cells in line with long sides of adjacent rectangular solar cells overlapping in a shingled manner, and each of the adjacent and overlapping rectangular solar cells. The rectangular solar cells in a pair are conductively coupled with an electrically conductive bonding material disposed therebetween, so that one front metallization pattern of the rectangular solar cells in the pair of the rectangular solar cells in the pair And electrically connecting the plurality of rectangular solar cells in series by electrically connecting to the other back metallization pattern.

The stencil is attached to other parts of the stencil such that all parts of the stencil that define one or more features of the front metallization pattern on the one or more square solar cells lie within the plane of the stencil during stencil printing. It can be configured to be limited by the physical connection to.

The front metallization pattern on each rectangular solar cell may include, for example, a plurality of fingers oriented orthogonally to the long sides of the rectangular solar cell, and the fingers in the front metallization pattern They are not physically connected to each other by the front metallization pattern.

Herein, for example, solar cells with reduced charge recombination losses at the edges of the solar cell without cut edges that promote carrier recombination, methods for manufacturing such solar cells, and super The use of these solar cells in shingled (overlapping) batches to form cells is disclosed.

In one aspect, a method of manufacturing a plurality of solar cells comprises depositing one or more front amorphous silicon layers on the front side of a crystalline silicon wafer, the crystalline silicon on the opposite side of the crystalline silicon wafer from the front side Depositing one or more back amorphous silicon layers on the back side of the wafer, the one or more front amorphous silicon layers to form one or more front trenches in the one or more front amorphous silicon layers Patterning them, depositing a top passivating layer within the one or more front amorphous silicon layers and the front trenches, one or more in the one or more back amorphous silicon layers Patterning the one or more back amorphous silicon layers to form back trenches, and depositing a back passivating layer over the one or more back amorphous silicon layers and in the back trenches. Each of the one or more rear trenches is formed in line with a corresponding one of the front trenches. The method further includes cutting the crystalline silicon wafer at one or more cutting planes, each cutting plane centered or substantially centered on a different pair of corresponding front and back trenches. In the operation of the resulting solar cells, the front amorphous silicon layers are illuminated with light.

In some variations, only the front trenches are formed, and the rear trenches are not. In other variations, only the rear trenches are formed, and the front trenches are not.

The method includes forming the one or more front trenches through the front amorphous silicon layer to reach the front surface of the crystalline silicon wafer and/or the one or more back amorphous surfaces to reach the back surface of the crystalline silicon wafer. And forming the one or more rear trenches through the silicon layers.

The method may include forming the front passivating layer with a transparent conductive oxide and/or forming the back passivating layer.

A pulsed laser or diamond tip can be used to initiate the cut point (eg, 100 microns long). CW lasers and cooling nozzles can be used to subsequently induce high compressive and tensile thermal stress, and to guide full cut propagation within the crystalline silicon wafer to separate the crystalline silicon wafer from the one or more cutting planes. . Optionally, the crystalline silicon wafer can be mechanically cut at the one or more cutting planes. Any suitable cutting methods can be used.

The one or more front amorphous crystalline silicon layers may form an n-p junction with the crystalline silicon wafer, in which case it may be desirable to cut the crystalline silicon wafer from its back side. Optionally, the one or more back amorphous crystalline silicon layers can form an n-p junction with the crystalline silicon wafer, in which case it may be desirable to cut the crystalline silicon wafer from its front side.

In another aspect, a method of manufacturing a plurality of solar cells comprises forming one or more trenches in a first surface of a crystalline silicon wafer, one or more amorphous silicon layers on the first surface of the crystalline silicon wafer Depositing a passivating layer on the one or more amorphous silicon layers in the trenches and on a first surface of the crystalline silicon wafer, opposite the crystalline silicon wafer from the first surface Depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer on a side, and cutting the crystalline silicon wafer at one or more cutting planes, each cutting plane being Center or substantially center on other one or more of the trenches.

The method may include forming the passivating layer with a transparent conductive oxide.

A laser can be used to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer at the one or more cutting planes. Optionally, the crystalline silicon wafer can be mechanically cut at the one or more cutting planes. Any suitable cutting method can be used.

The one or more front amorphous crystalline silicon layers may form an n-p junction with the crystalline silicon wafer. Optionally, the one or more back amorphous crystalline silicon layers can form an n-p junction with the crystalline silicon wafer.

In another aspect, a solar panel includes a plurality of super cells, each super cell overlapping in a shingled fashion to electrically connect the solar cells in series and in line with the ends of adjacent solar cells that are conductively coupled to each other. It includes a plurality of solar cells arranged. Each solar cell comprises a crystalline silicon base, one or more first surface amorphous silicon layers disposed on a first surface of the crystalline silicon base to form an np junction, opposite the crystalline silicon base from the first surface One or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon base on a side surface, and edges of the first surface amorphous silicon layers, edges of the second surface amorphous silicon layers, or And passivating layers that prevent charge recombination at the edges of the first surface amorphous silicon layers and the edges of the second surface amorphous silicon layers. The passivating layers may include a transparent conductive oxide.

The solar cells can be formed, for example, by any of the methods summarized above or disclosed herein.

* These and other embodiments, features and advantages of the present invention will become more apparent to those skilled in the art upon reference to the following more detailed description of the invention in conjunction with the accompanying drawings briefly described first.

1 shows a cross-sectional view of a string of series-connected solar cells arranged in a shingled fashion with ends of adjacent solar cells superimposed to form a shingled super cell.
2A shows a diagram of the front (sun side) and front metallization pattern of an exemplary rectangular solar cell that can be used to form shingled super cells.
2B and 2C show views of the front (solar side) and front metallization patterns of two exemplary rectangular solar cells with rounded corners that can be used to form shingled super cells.
2D and 2E show views of the back and exemplary back metallization patterns for the solar cell shown in FIG. 2A.
2F and 2G show views of back and exemplary back metallization patterns for the solar cells shown in FIGS. 2B and 2C, respectively.
2H shows a diagram of the front (sun side) and front metallization pattern of another exemplary rectangular solar cell that can be used to form shingled super cells. The front metallization pattern includes separate contact pads, each of which is surrounded by a barrier configured to prevent the uncured conductive adhesive bonding material deposited on the contact pad from flowing away from the contact pad. .
FIG. 2I shows a cross-sectional view of the solar cell of FIG. 2H and identifies details of the front metallization pattern shown in an enlarged view of FIGS. 2J and 2K including a contact pad and portions of the barrier surrounding the contact pad. .
2J shows an enlarged view of the details from FIG. 2I.
FIG. 2K shows an enlarged view of the details of FIG. 2I with an uncured conductive adhesive bonding material substantially constrained to the position of a separate contact pad by a barrier.
FIG. 2L shows a view of the back and exemplary back metallization patterns for the solar cell of FIG. 2H. The back metallization pattern includes separate contact pads, each of which is surrounded by a barrier configured to prevent the uncured conductive adhesive bonding material deposited on the contact pad from flowing away from the contact pad. .
FIG. 2M shows a cross-sectional view of the solar cell of FIG. 2L and identifies details of the back metallization pattern shown in an enlarged view of FIG. 2N including a contact pad and a barrier surrounding the contact pad.
2N shows an enlarged view of the details from FIG. 2M.
2O shows another variation of a metallization pattern comprising a barrier configured to prevent uncured conductive adhesive bonding material from flowing away from the contact pad. The barrier is adjacent to one side of the contact pad and is larger than the contact pad.
2P shows another variant of the metallization pattern of FIG. 2O with a barrier adjacent at least two sides of the contact pad.
2Q shows a diagram of the back and exemplary back metallization pattern for another exemplary rectangular solar cell. The back metallization pattern includes a continuous contact pad that runs substantially along the edge of the solar cell to the length of the long side of the solar cell. The contact pad is surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on the contact pad from flowing away from the contact pad.
2R shows a diagram of the front (solar side) and front metallization pattern of another exemplary rectangular solar cell that can be used to form shingled super cells. The front metallization pattern includes separate contact pads arranged in rows along the edge of the solar cell and long thin conductors parallel to and extending from the rows of the contact pads into the substrate. The long and thin conductor forms a barrier configured to prevent uncured conductive adhesive bonding material deposited on the contact pads from falling off the contact pads and flowing onto the active area of the solar cell.
3A shows that a standard size and shape pseudo square silicon solar cell can be separated (eg, cut or shredded) into two different length rectangular solar cells that can be used to form shingled super cells. Shown is a diagram illustrating an example method.
3B and 3C show diagrams illustrating another example method in which a pseudo-square silicon solar cell can be separated into rectangular solar cells. 3B shows the front and exemplary front metallization patterns of the wafer. 3C shows the back and exemplary back metallization patterns of the wafer.
3D and 3E show views illustrating an example method in which a square silicon solar cell can be separated into rectangular solar cells. 3D shows the front and exemplary front metallization patterns of the wafer. 3E shows the back and exemplary back metallization patterns of the wafer.
FIG. 4A shows a partial view of the front side of an exemplary rectangular super cell comprising rectangular solar cells, eg, as shown in FIG. 2A, arranged in a shingled manner as shown in FIG. 1.
4B and 4C are exemplary rectangular arrangements including “Chevron” rectangular solar cells arranged in a shingled manner as shown in FIG. 1, for example, with chamfered edges as shown in FIG. 2B. The front and rear views of the super cell are respectively shown.
5A shows a diagram of an exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having a length that is approximately half the length of the short sides of the module. The pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the short sides of the module.
5B shows a diagram of another exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having approximately the same length of the short sides of the module. The super cells are arranged with their long sides parallel to the short sides of the module.
5C shows a diagram of another exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged with their long sides parallel to the sides of the module.
5D shows a diagram of an exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell having a length that is approximately half the length of the long sides of the module. The pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the long sides of the module.
5E shows a diagram of another exemplary rectangular solar module that is similar in configuration to the case of FIG. 5C, where all the solar cells in which the super cells are formed are edges of pseudo-square wafers from which the solar cells were separated. Chevron solar cells with chamfered edges corresponding to.
FIG. 5F shows a view of another exemplary rectangular solar module that is similar in configuration to the case of FIG. 5C, where all the solar cells in which the super cells are formed are arranged to reproduce the shapes of the pseudo-square wafers from which they were separated. It includes a mixture of chevron and square solar cells.
5G is a diagram of another exemplary rectangular solar module similar in configuration to that of FIG. 5E except that adjacent chevron solar cells in the super cell are arranged as mirror images of each other such that their overlapping edges are the same length. City.
6 shows an exemplary arrangement of three columns of super cells interconnected by flexible electrical interconnects to place the super cells in series with each other in each column, and to place the columns in parallel with each other. These can be, for example, three columns in the solar module of FIG. 5D.
7A shows exemplary flexible interconnects that can be used to interconnect super cells in series or parallel. Some of the examples show patterning to increase their flexibility (mechanical compliance) along their long axes, along their short axes, or along their long axes and their short axes. FIG. 7A shows example interconnect structures that eliminate exemplary stress that can be used in hidden tabs for super cells or as interconnects for front or rear super cell terminal contacts as described herein. 7B-1 and 7B-2 illustrate examples of out-of-plane stress relief features. 7B-1 and 7B-2 show an exemplary long interconnect configuration that includes out-of-plane stress relief features and can be used in hidden tabs for super cells or as interconnects for front or rear super cell terminal contacts. .
8A is a cross-sectional view of the exemplary solar module of FIG. 5D showing detail A from FIG. 5D and showing cross-sectional details of flexible electrical interconnects coupled to rear terminal contacts of rows of super cells.
FIG. 8B shows a detail C from FIG. 5D and is a cross-sectional view of the example solar module of FIG. 5D showing cross-sectional details of flexible electrical interconnects coupled to front (sun-side) terminal contacts of rows of super cells. to be.
FIG. 8C is a cross-sectional view of the exemplary solar module of FIG. 5D showing detail D from FIG. 5D and showing cross-sectional details of flexible interconnects arranged to interconnect super cells in series in series.
8D-8G show additional examples of electrical interconnects coupled to the front terminal contact of the super cell at the end of the row of super cells adjacent to the edge of the solar module. The exemplary interconnects are configured to have a small foot print on the front side of the module.
9A shows views of another exemplary square solar module including six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows electrically connected to each other in parallel and electrically connected in parallel with a bypass diode disposed in a junction box on the back side of the solar module. Electrical connections between the super cells and the bypass diode are made through ribbons embedded in the laminate structure of the module.
9B shows a diagram of another exemplary rectangular solar module comprising six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows electrically connected to each other in parallel and electrically connected in parallel to a bypass diode disposed in a junction box on the back side near the edge of the solar module. The second junction box is located on the back side near the opposite end of the solar module. The electrical connection between the super cells and the bypass diode is made through an external cable between the junction boxes.
9C shows an exemplary glass-glass rectangular solar module comprising six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows that are electrically connected in parallel to each other. Both junction boxes are mounted on opposite edges of the module, maximizing the active area of the module.
9D is a side view of the solar module illustrated in FIG. 9C.
9E shows another exemplary solar module comprising six rectangular shingled super cells, each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows, including three pairs of rows individually connected to a power management device on the solar module.
9F shows another exemplary solar module comprising six rectangular shingled super cells, the long side of each super cell having a length approximately equal to the length of the long side of the module. The super cells are arranged in six rows, with each row individually connected to a power management device on the solar module.
9G and 9H show other examples of configurations for module level power management using shingled super cells.
10A shows an exemplary schematic electrical circuit diagram for a solar module as illustrated in FIG. 5B.
10B-1 and 10B-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A.
11A shows an exemplary schematic electrical circuit diagram of a solar module as illustrated in FIG. 5A.
11B-1 and 11B-2 show exemplary physical layouts for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical circuit diagram of FIG. 11A.
11C-1 and 11C-2 show another exemplary physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic electrical circuit diagram of FIG. 11A.
12A shows another exemplary schematic electrical circuit diagram for a solar module as illustrated in FIG. 5A.
12B-1 and 12B-2 show exemplary physical layouts for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A.
12C-1, 12C-2 and 12C-3 show other exemplary physical layouts for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 12A. .
13A shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5A.
13B shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5B.
13C-1 and 13C-2 show exemplary physical layouts for various electrical interconnections for a solar module as illustrated in FIG. 5A with the schematic circuit diagram of FIG. 13A. The slightly modified physical layout of FIGS. 13C-1 and 13C-2 is suitable for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 13B.
14A shows a view of another exemplary rectangular solar module comprising a plurality of rectangular shingled super cells, the long side of each super cell being approximately equal in length to half the length of the short side of the module. Have The pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the short side of the module.
14B shows an exemplary schematic circuit diagram for a solar module as illustrated in FIG. 14A.
14C-1 and 14C-2 show exemplary physical layouts for various electrical interconnects for a solar module as illustrated in FIG. 14A with the schematic circuit diagram of FIG. 14B.
FIG. 15 shows another exemplary physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A.
16 shows an exemplary arrangement of a smart switch interconnecting two solar modules in series.
17 shows a flow chart of an exemplary method of making a solar module with super cells.
18 shows a flow chart of another exemplary method of making a solar module with super cells.
19A-19D show exemplary arrangements in which super cells can be cured with heat and pressure.
20A-20C schematically illustrate an exemplary apparatus that can be used to cut scribed solar cells. The device can be particularly advantageous when used to cut scribed super cells to which a conductive adhesive bonding material has been applied.
FIG. 21 is an example with dark lines that can be used in solar modules including parallel rows of super cells to reduce visible contrast between super cells and portions of the back sheet that can be seen from the front of the module. The white back sheet “zebra striped” is shown.
22A shows a top view of a conventional module utilizing traditional ribbon connections under hot spot conditions. 22B also shows a top view of a module utilizing thermal diffusion according to embodiments under hot spot conditions.
23A-23B show examples of super cell string layouts with chamfered cells.
Figures 24-25 show simplified cross-sectional views of arrays comprising a plurality of modules assembled into shingled configurations.
FIG. 26 shows a view of the back side (shielding) of a solar module illustrating an exemplary electrical interconnection of front (sun side) terminal electrical contacts of a shingled super cell to a junction box on the back side of the module.
FIG. 27 shows views of the back side (shielding) of a solar module illustrating an exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are For and to the junction box on the back of the module.
FIG. 28 shows a view of the back side (shielding) of a solar module illustrating another exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are It is connected to each other and to a junction box on the back side of the module.
29 is a partial cross-sectional and perspective view of two super cells illustrating the use of a flexible interconnect interposed between overlapping ends of adjacent super cells to electrically connect the super cells in series and provide an electrical connection to a junction box. It shows.
FIG. 29A shows an enlarged view of the area of interest in FIG. 29.
30A shows an exemplary super cell with electrical interconnects coupled to its front and rear terminal contacts. 30B shows two of the super cells of FIG. 30A interconnected in parallel.
31A-31C show views of exemplary backside metallization patterns that can be employed to create hidden tabs in super cells as described herein.
32-33 show examples of the use of hidden taps with interconnects running roughly to the full width of the super cell.
34A-34C show examples of interconnects coupled to super cell back (FIG. 34A) and front (FIG. 34B-34C) terminal contacts.
35-36 show examples of the use of hidden tabs with short interconnects that cross the gap between adjacent super cells, but do not substantially extend inward along the long axis of the rectangular solar cells.
37A-1 to 37F-3 show example configurations for short hidden tap interconnects that include in-plane stress relief features.
38A-1 to 38B-2 show example configurations for short hidden tap interconnects that include out-of-plane stress relief features.
39A-1 and 39A-2 show example configurations for short hidden tap interconnects that include alignment features. 39B-1 and 39B-2 show example configurations for short hidden tap interconnects with asymmetric tap lengths.
40 and 42A-44B show exemplary solar module layouts employing hidden tabs.
41 shows exemplary electrical circuit diagrams for the solar module layouts of FIGS. 40 and 42A-44B.
45 shows the current flow in an exemplary solar module with a bypass diode in a conductive state.
46A-46B show the relative motion between solar module components resulting from a heat cycle in a direction parallel to the rows of super cells and a direction perpendicular to the rows of super cells in the solar module, respectively.
47A-47B show another exemplary solar module layout and corresponding electrical circuit diagram each employing hidden tabs.
48A-48B show additional solar module layouts employing hidden tabs in combination with built-in bypass diodes.
49A-49B show block diagrams for a high voltage solar module as described herein providing a high voltage DC module and a solar module providing a conventional DC voltage to the microinverter, respectively.
50A-50B show high voltage solar modules including exemplary physical layout and electrical circuit diagrams, such as bypass diodes.
51A-55B show an exemplary configuration for module-level power management of high voltage solar modules including shingled super cells.
56 shows an exemplary arrangement of six super cells in six parallel rows with ends of adjacent rows offset in series and interconnected by flexible electrical interconnects.
57A schematically illustrates a photovoltaic system comprising a plurality of high DC voltage shingled solar cell modules that are electrically connected in parallel to each other and to a string inverter.
57B shows the photovoltaic system of FIG. 57A disposed on the roof top.
58A-58D can be used to prevent high DC voltage shingled solar cell modules with short circuits from dissipating significant power generated within other high DC voltage shingled solar cell modules electrically connected in parallel. Showing the arrangement of Hallyu fuses and blocking diodes.
59A-59B show exemplary arrangements in which two or more high DC voltage shingled solar cell modules are electrically connected in parallel within a combiner box that may include current-limiting fuses and blocking diodes.
60A-60B show a plot of current versus voltage and a plot of power versus voltage for a plurality of high DC voltage shingled solar cell modules, each electrically connected in parallel. The diagrams in FIG. 60A are for an exemplary case without modules comprising a reverse biased solar cell. The diagrams in FIG. 60B are for an exemplary case where some of the modules include one or more reverse biased solar cells.
61A illustrates an example of a solar module using about one bypass diode per super cell. 61C illustrates an example of a solar module using bypass diodes in an intrinsic configuration. Figure 61B illustrates an exemplary configuration for a bypass diode that is connected between two neighboring super cells using a flexible electrical interconnect.
62A-62B schematically illustrate side and top views of different exemplary cutting instruments.
63A schematically illustrates the use of an exemplary asymmetric vacuum arrangement for controlling the generation and propagation of cracks along scribe lines when cutting a wafer. 63B schematically illustrates the use of an exemplary symmetrical vacuum arrangement that provides less control of the cut than the arrangement of FIG. 63A.
64 schematically illustrates a top view of a portion of an exemplary vacuum manifold that may be used in the cutting apparatus of FIGS. 62A-62B.
65A and 65B provide schematic illustrations of top and perspective views of the exemplary vacuum manifold of FIG. 64 overlaid by a perforated belt, respectively.
66 schematically illustrates a side view of an exemplary vacuum manifold that can be used in the cutting apparatus of FIGS. 62A-62B.
67 schematically illustrates a cut solar cell overlying an exemplary arrangement of perforated belt and vacuum manifold.
68 schematically illustrates the relative positions and orientations of a solar cell that has been cut in an exemplary cutting process and an uncut portion of a standard size wafer on which the solar cell has been cut.
69A-69G schematically illustrate apparatus and methods in which cut solar cells can be continuously removed from a cutting instrument.
70A-C provide orthogonal projection views of another variation of the exemplary cutting mechanism of FIGS. 62A-62B.
71A and 71B provide perspective views of the exemplary cutting instrument of FIGS. 70A-C at two different stages of the cutting process.
72A-74B illustrate details of the perforated belts and vacuum manifolds of the exemplary cutting mechanism of FIGS. 70A-70C.
75A-75G illustrate details of some example hole patterns that can be used for perforated vacuum belts in the example cutting instrument of FIGS. 10A-10C.
76 shows an exemplary front metallization pattern on a rectangular solar cell.
77A-77B show exemplary back metallization patterns on rectangular solar cells.
FIG. 78 shows an exemplary front metallization pattern on a square solar cell that can be diced to form a plurality of rectangular solar cells each having a front metallization pattern shown in FIG. 76.
FIG. 79 shows an exemplary back metallization pattern on a square solar cell that can be diced to form a plurality of rectangular solar cells each having a back metallization pattern shown in FIG. 77A.
80 is a schematic diagram of a conventional sized HIT solar cell diced into narrow strip solar cells using conventional cutting methods that result in cut edges that promote charge recombination.
81A-81J schematically illustrate steps of an exemplary method of dicing a conventional sized HIT solar cell into narrow solar cell strips lacking cut edges that promote charge recombination.
82A-82J schematically illustrate steps of another exemplary method of dicing a conventionally sized HIT solar cell into narrow solar cell strips lacking cut edges that promote charge recombination.

The following detailed description should be understood with reference to the drawings in which the same reference numerals refer to the same elements across different drawings. The drawings, which are not necessarily to scale, illustrate alternative embodiments and are not intended to limit the scope of the invention. The detailed description of the invention illustrates the principles of the invention in the form of examples, not of limitation. This description will obviously enable those skilled in the art to configure and use the present invention, and includes some embodiments, adjustments, modifications, and selections of the present invention, including those currently considered to be the best mode for carrying out the present invention. And uses.

As used in this specification and the appended claims, the singular expressions of “one,” “one,” and “above” include a plurality of directed objects unless expressly stated otherwise herein. Also, the term “parallel” means “parallel or substantially parallel”, and does not require that any parallel arrangements described herein are exactly parallel, rather than deviations from parallel geometries. It is intended to cover. The term "orthogonal" means "orthogonal or substantially orthogonal," to cover minor deviations from orthogonal geometries rather than requiring any orthogonal arrangements described herein to be orthogonal. Is intended The term "square" means "square or substantially square," and square shapes, such as chamfered (eg rounded or otherwise truncated) It is intended to cover minor deviations from substantially square shapes with edges. The term “rectangular” means “rectangular or substantially rectangular” and substantially rectangular with rectangular shapes, eg chamfered (eg rounded or otherwise truncated) edges. It is intended to cover minor deviations from the shapes of.

Herein, high-efficiency shingled arrangements of silicon solar cells in solar cell modules, as well as front and rear surfaces for solar cells that can be used in such arrangements. Metallization patterns and interconnects are disclosed. Also disclosed herein are methods for manufacturing such solar modules. The solar cell modules can be advantageously employed under “one sun” (non-concentrated) illumination, and can have physical dimensions and electrical specifications that allow them to replace conventional silicon solar cell modules.

1 is a series of solar cells 10 connected in series arranged in a shingled manner with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100. A cross-sectional view of a string is shown. Each solar cell 10 provides electrical contacts to the semiconductor diode structure and the semiconductor diode structure caused by current generated in the solar cell 10 that can be provided to an external load when illuminated by light. Includes.

In the examples described herein, each solar cell 10 is a front (sun side) and back (shaded side) metal that provides electrical contacts for opposing sides of the np junction. It is a crystalline silicon solar cell having crystallization patterns, the front metallization pattern is disposed on an n-type conductive semiconductor layer, and the rear metal ash pattern is disposed on a p-type conductive semiconductor layer. However, any other suitable solar cell employing any other suitable material system, diode structure, physical dimensions, or electrical contact arrangement can replace or in addition to the solar cells 10 in the solar modules described herein. Can be used. For example, the front (solar side) metallization pattern may be disposed on a p-type conductive semiconductor layer, and the rear (light blocking side) metallization pattern may be disposed on an n-type conductive semiconductor layer. Can be.

Referring again to FIG. 1, the adjacent solar cells 10 in the super cell 100 are electrically conductive in that they electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell. It is conductively bonded to each other in the region overlapped by the adult bonding material. Suitable electrically conductive conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders. Preferably, the electrically conductive bonding material accommodates stress resulting from a mismatch between the coefficient of thermal expansion (CTE) of the electrically conductive bonding material and the coefficient of thermal expansion of the solar cells (eg, CTE of silicon). To provide mechanical compliance for bonding between adjacent solar cells. In order to provide this mechanical compliance, in some variations the electrically conductive bonding material is selected to have a glass transition temperature less than or equal to about 0°C. To further reduce and accommodate stress parallel to the overlapping edges of the solar cells resulting from a CTE mismatch, the electrically conductive bonding material is a continuous line that optionally extends substantially to the length of the edges of the solar cells. Rather than can be applied only at separate locations along the overlapping regions of the solar cells.

The thickness of the electrically conductive material between adjacent and overlapping solar cells formed by the electrically conductive bonding material and measured orthogonally to the front and rear surfaces of the solar cells is, for example, about 0.1 mm or less. Can be This thin coupling reduces resistive loss at the interconnection between cells, and also heats along the super cell from any hot spot in the super cell that can evolve during operation. Enhance flow. The thermal conductivity of the bond between the solar cells can be, for example, ≥about 1.5 watts/(meter-K).

2A shows the front side of an exemplary rectangular solar cell 10 that can be used within the super cell 100. Other shapes for the solar cell 10 can also be used as appropriate. In the illustrated example, the front metallization pattern of the solar cell 10 is located adjacent to one edge of the long sides of the solar cell 10, and substantially the long side for the length of the long sides. A bus bar 15 running parallel to the fields and orthogonally attached to the bus bar, with respect to each other for short lengths of substantially short sides and the short side of the solar cell 10 And fingers 20 running parallel to the fields.

In the example of FIG. 2A, the solar cell 10 has a length of about 156 mm, a width of about 26 mm and thus an aspect ratio of about 1:6 (short side length/long side length). Six such solar cells can be fabricated on a standard 156 mm x 156 mm dimensioned silicon wafer, and can be separated (dice) to provide solar cells, as illustrated later. In other variations, Eight solar cells 10 with dimensions of about 19.5 mm×156 mm and thus an aspect ratio of about 1:8 can be fabricated from a standard silicon wafer. It can have an aspect ratio of about 1:2 to about 1:20, for example, and can be manufactured from standard size wafers or from wafers of any other suitable dimensions.

FIG. 3A shows that a pseudo square silicon solar cell wafer 45 of standard size and shape can be cut, shattered, or otherwise detached to form rectangular solar cells as described above. Shown is an exemplary method. In this example, some full width rectangular solar cells 10L are cut from the center of the wafer, and additionally some shorter rectangular solar cells 10S are cut from the ends of the wafer, Chamfered or rounded corners are discarded. Solar cells 10L can be used to form shingled super cells of one width, and solar cells 10S can be used to form shingled super cells of narrower width.

Optionally, the chamfered (eg, rounded) edges can be maintained on the solar cells that are cut from the ends of the wafer. 2B-2C are substantially similar to the case of FIG. 2A, but of exemplary “chevron” rectangular solar cells 10 with chamfered edges maintained from the wafer from which the solar cells were cut. Show the fronts. In FIG. 2B, the bus bar 15 is located adjacent to the shorter of the two long sides for substantially the length of the side and runs parallel, at least partially at both ends around the chamfered edges of the solar cell. It extends further. In Fig. 2c, the bus bar 15 is located adjacent to the longer of the two elongated sides for substantially the length of the side and runs parallel. 3B-C show a plurality of solar cells 10 with front metallization patterns similar to those shown in FIG. 2A and two chamfered solar cells with front metallization patterns similar to those shown in FIG. 2B. Shows a front and back view of a pseudo square wafer 45 that can be diced along the dashed lines shown in FIG. 3C to provide the fields 10.

In the exemplary front metallization pattern shown in FIG. 2B, the two ends of the bus bar 15 extending around the chamfered edges of the cell are each of the bus bar located adjacent to the long side of the cell. It may have a tapered (narrowing) width with an increased distance from some. Similarly, in the exemplary front metallization pattern shown in FIG. 3B, the two ends of the thin conductor interconnecting the separate contact pads 15 are the chamfered edges of the solar cell. It extends around and thus tapers with an increased distance from the long side of the solar cell where the separate contact pads are arranged. This tapering is optional, but can advantageously reduce the use of metal and shading of the active area of the solar cell without significantly increasing the resistive loss.

3D-E are complete square wafers 47 that can be diced along the dashed lines shown in FIG. 3E to provide a plurality of solar cells 10 with front metallization patterns similar to the case shown in FIG. 2A. It shows a front view and a rear view.

The chamfered rectangular solar cells can be used to form super cells comprising only chamfered solar cells. Additionally or alternatively, one or more of these chamfered rectangular solar cells can be used in combination with one or more non-chamfered rectangular solar cells (eg, FIG. 2A) to form a super cell. have. For example, the end solar cells of the super cell can be chamfered solar cells, and the central solar cells can be unchamfered solar cells. When chamfered solar cells are used in super cells or more generally in combination with unchamfered solar cells in a solar module, the chamfered and having the same front area exposed to light during operation of the solar cells and It may be desirable to use dimensions for the solar cells that result in unchamfered solar cells. Matching the solar cell areas in this way matches the current generated in the chamfered and unchamfered solar cells, which includes both chamfered and unchamfered solar cells. It improves the performance of serially connected strings. The area of the chamfered and unchamfered solar cells cut from the wafer of the same pseudo square is the chamfer in a direction orthogonal to their long axes, for example to compensate for the missing edges on the chamfered solar cells. It can be matched by adjusting the positions of the lines on which the wafer is diced so that the treated solar cells are slightly wider than the unchamfered solar cells.

The solar module may include only super cells formed from chamfered rectangular solar cells, or may include only super cells formed from chamfered rectangular solar cells, or chamfered and It may include only super cells with unchamfered solar cells, or any combination of these three variations of the super cell.

In some examples, portions of a standard sized square or pseudo square solar cell wafer (eg, wafer 45 or wafer 47) near the edges of the wafer are portions of the wafer located away from the edges It can convert light into electricity with a lower efficiency than these. To improve the efficiency of the resulting rectangular solar cells, in some variations one or more edges of the wafer are trimmed to remove portions of lower efficiency before the wafer is diced. Portions trimmed from the edges of the wafer may have widths of, for example, about 1 mm to about 5 mm. Also, as shown in FIGS. 3B and 3D, the two end solar cells 10 diced from the wafer follow their outer edges and thus their front bus bar along two of the wafer's edges. (bus bars) (or separate contact pads) 15. Since in the super cells disclosed herein the bus bars (or separate contact pads) 15 are typically superimposed by adjacent solar cells, the low light conversion efficiency along these two edges of the wafer is typically the above. It does not affect the performance of solar cells. Accordingly, in some variations the edges of a square or pseudo square wafer oriented parallel to the short sides of the rectangular solar cells are trimmed as described above, but oriented parallel to the long sides of the rectangular solar cells. The edges of the wafer are not. In other variations, one, two, three or four edges of a square wafer (eg, wafer 47 in FIG. 3D) are trimmed as described above. In other variations, one, two, three or four of the long edges of the pseudo-square wafer are trimmed as described above.

Solar cells with long and narrow aspect ratios and smaller areas than in the case of a standard 156 mm×156 mm solar cell are advantageously employed to reduce I ² R resistive output losses in the solar cell modules disclosed herein as illustrated. Can be. In particular, the reduced area of solar cells 10 compared to standard sized silicon solar cells reduces the current generated in the solar cell, thereby reducing the resistive output loss in the solar cell and the series-connected string of these solar cells. Decrease directly. Also, arranging these rectangular solar cells in the super cell 100 so that current flows through the super cell parallel to the short sides of the solar cells is such that the current reaches fingers 20 in the front metallization pattern. This can reduce the distance that must flow through the semiconductor material, and reduce the required length of the fingers, which can also reduce resistive output loss.

As described above, combining the overlapping solar cells 10 within their overlapping region to connect the solar cells in series is adjacent compared to conventional tabbed series connected strings of solar cells. It reduces the length of the electrical connection between solar cells. This also reduces resistive output loss.

Referring again to FIG. 2A, in the illustrated example, the front metallization pattern on the solar cell 10 includes an optional bypass conductor 40 parallel to and spaced from the bus bar 15. (This bypass conductor can also be selectively used in the metallization patterns shown in FIGS. 2B-2C, 3B and 3D, and is also combined with separate contact pads 15 rather than a continuous bus bar. 2q). The bypass conductor 40 interconnects the fingers 20 to electrically bypass cracks that may form between the bus bar 15 and the bypass conductor 40. These cracks, which can cut fingers 20 at locations near bus bar 15, may otherwise separate areas of solar cell 10 from bus bar 15. The bypass conductor provides an optional electrical passage between these broken fingers and the bus bar. The illustrated example shows a bypass conductor 40 located parallel to the bus bar 15, extending to the approximate overall length of the bus bar, and interconnecting all fingers 20. This arrangement may be desirable, but is not required. If present, the bypass conductor need not run parallel to the bus bar and need not extend to the full length of the bus bar. Also, the bypass conductor interconnects at least two fingers, but it is not necessary to interconnect all fingers. Two or more short bypass conductors may be used, for example, instead of longer bypass conductors. Any suitable arrangement of bypass conductors can be used. The use of these bypass conductors was filed on February 13, 2012, and US Patent Application No. 13/371,790, the disclosure of which is incorporated herein by reference (invention name: "Metal that can compensate for or prevent cracking" Solar Cell With Metallization Compensating For Or Preventing Cracking").

The exemplary front metallization pattern of FIG. 2A also includes an optional end conductor 42 that interconnects fingers 20 at their distal ends opposite from the bus bar 15 (such end conductor is It can also be selectively used in the metallization patterns shown in FIGS. 2B-C, 3B and 3D and 2Q). The width of the conductor 42 may be approximately the same as the width of the finger 20, for example. The conductor 42 interconnects the fingers 20 to electrically bypass cracks that may be formed between the bypass conductor 40 and the conductor 42, and thereby electrically separated by these cracks otherwise It provides a current path for the bus bar 15 for areas of the solar cell 10 that can be.

Although some of the illustrated examples show the front bus bar 15 extending to the length of the long sides of the solar cell 10 substantially with a uniform width, this is not required. For example, as previously suggested, the front bus bars 15 may be arranged in line with each other, for example along the side of the solar cell 10 as shown in FIGS. 2H, 2Q and 3B, for example. Can be replaced by two or more separate contact pads 15 on the front. These separate contact pads can be selectively interconnected by thinner conductors running between them, for example, as shown in the figures mentioned above. In these variations, the width of the contact pads measured orthogonally to the long side of the solar cell may be, for example, about 2 to about 20 times the width of thin conductors interconnecting the contact pads. Separate (eg, small) contact pads may be present for each finger in the front metallization pattern, or each contact pad may be connected to two or more fingers. The front contact pads 15 may be square, for example, or may have a rectangular shape extending parallel to the edge of the solar cell. Front contact pads 15 are, for example, widths orthogonal to the long side of the solar cell from about 1 mm to about 1.5 mm and the long side of the solar cell, for example from about 1 mm to about 10 mm. It can have parallel lengths. The distance between the contact pads 15 measured parallel to the long side of the solar cell may be, for example, about 3 mm to about 30 mm.

Optionally, the solar cell 10 can be deficient in both the front bus bar 15 and the separate front contact pads 15, and can include only fingers 20 in the front metallization pattern. In these variations, current-collecting functions, which may otherwise be performed by the front bus bar 15 or contact pads 15, are configured to overlap the two solar cells 10 in the above-described overlapping configuration. It may instead be performed by the conductive materials used to bond with each other, or it may be partially performed.

Solar cells lacking both the bus bar 15 and the contact pads 15 may include the bypass conductor 40 or may not include the bypass conductor 40. When the bus bar 15 and contact pads 15 are not present, a bypass conductor 40 is formed between the bypass conductor and a portion of the front metallization pattern that is conductively coupled to the overlapping solar cell. Can be arranged to bypass cracks.

The front metallization patterns comprising a bus bar or separate contact pads 15, fingers 20, bypass conductor 40 (if present) and end conductor 42 (if present), for example For example, it can be formed from, for example, silver paste, which is conventionally used and deposited for these purposes by conventional screen printing methods. Optionally, the front metallization patterns can be formed from electroplated copper. Any other suitable materials and processes can also be used. In variants in which the front metallization pattern is formed of silver, the use of separate front contact pads 15 rather than a continuous bus bar 15 along the edge of the cell reduces the amount of silver on the solar cell. And this advantageously reduces the cost. In variants where the front metallization pattern is formed from copper or other conductors that are less expensive than silver, a continuous bus bar 15 can be employed without cost problems.

2D-2G, 3C and 3E show exemplary backside metallization patterns for a solar cell. In these examples, the back metallization patterns are separate back contact pads 25 arranged along one of the long edges of the back side of the solar cell and a metal contact covering substantially all of the remaining back side of the solar cell ( 30). In a shingled super cell, the contact pads 25 are separate contact pads arranged to electrically connect the two solar cells in series, e.g. along the edge of the top surface of the solar cell or adjacent and overlapping the bus bar. Is coupled to. For example, each distinct rear contact pad 25 can be aligned with a corresponding distinct front contact pad 15 on the front surface of the overlapping solar cell, and is electrically conductive applied only to the separated contact pads It can be bound by adult binding substances. The separated contact pads 25 may be square (FIG. 2D), for example, or have a rectangular shape extending parallel to the edge of the solar cell (FIGS. 2E-2G, 3C, 3E). Can have The contact pads 25 are, for example, widths orthogonal to the long side of the solar cell from about 1 mm to about 5 mm and parallel to the long side of the solar cell, for example from about 1 mm to about 10 mm. It can have one length. The distance between the contact pads 25 measured parallel to the long side of the solar cell may be, for example, about 3 mm to about 30 mm.

The contact 30 can be formed, for example, from aluminum and/or from electroplated copper. The formation of the aluminum back contact 30 typically provides a back surface field that reduces back surface recombination within the solar cell, thereby improving solar cell efficiency. When the contact 30 is formed from copper rather than aluminum, the contact 30 can be used in combination with other passivation schemes (eg, aluminum oxide) to similarly reduce back recombination. The separate contact pads 25 may be formed from, for example, silver paste. The use of separate silver contact pads 25 rather than a continuous silver contact pad along the edge of the cell can reduce the amount of silver in the back metallization pattern, which can advantageously reduce cost.

Also, if the solar cells rely on the back field provided by the formation of an aluminum contact to reduce back recombination, the use of separate silver contacts rather than a continuous silver contact can improve solar cell efficiency. This is because the silver back contacts do not provide a back electric field and thus tend to promote carrier recombination and create an insoluble (inactive) volume in the solar cells above the silver contacts. In conventional ribbon-tabbed solar cell strings, these dead volumes are typically obscured by ribbons and/or bus bars on the front side of the solar cell, thus any efficiency. There is no additional loss. However, in the solar cells and super cells disclosed herein, the volume of the solar cell above the rear silver contact pads 25 is typically not obscured by any front metallization, resulting from the use of silver back metallization. Any insoluble volumes that become will decrease the efficiency of the cell. The use of separate silver contact pads 25 rather than a continuous silver contact pad along the back edge of the solar cell thus reduces the volume of any corresponding insoluble areas and increases the efficiency of the solar cell.

In variants that do not rely on back field to reduce back recombination, the back metallization pattern is, for example, the length of the solar cell rather than separate contact pads 25, as shown in FIG . 2Q . It is possible to employ a continuous bus bar 25 extending. The bus bar 25 may be formed of, for example, tin or silver.

Other variations of the back metallization patterns may employ separate tin contact pads 25. Variations of the back metallization patterns may employ finger contacts similar to those shown in the front metallization patterns of FIGS. 2A-2C, and may lack contact pads and bus bars.

Although certain exemplary solar cells shown in the figures are described as having specific combinations of front and back metallization patterns, more generally any suitable combination of front and back metallization patterns can be used. For example, one suitable combination is a silver front metallization pattern comprising separate contact pads 15, fingers 20 and an optional bypass conductor 40, and an aluminum contact 30 and separate A back metallization pattern including silver contact pads 25 may be employed. Other suitable combinations include a copper front metallization pattern comprising a continuous bus bar 15, fingers 20 and an optional bypass conductor 40, and a continuous bus bar 25 and a copper contact 30. A back metallization pattern can be employed.

In the super cell manufacturing process (discussed in more detail below), the electrically conductive bonding material used to bond adjacent and overlapping solar cells in the super cell is at the edge of the front or back side of the solar cell ( It may be distributed only on separate or continuous contact pads, and not on portions surrounding the solar cell. This reduces the use of material and can reduce or accommodate stress resulting from a CTE mismatch between the electrically conductive bonding material and the solar cell as described above. However, during or after deposition and prior to curing, portions of the electrically conductive bonding material may tend to diffuse beyond the contact pads and onto the surrounding portions of the solar cell. For example, the bonding resin portion of the electrically conductive bonding material can be pulled out of the contact pad onto the textured or porous adjacent portions of the surface of the solar cell by capillary forces. In addition, during the deposition process, a portion of the conductive bonding material may deviate from the contact pad, and instead may be deposited on adjacent portions of the solar cell surface and possibly diffused therefrom. This diffusion and/or incorrect deposition of the conductive bonding material can weaken the bonding between the overlapping solar cells, and damage the portions of the solar cell on which the conductive bonding material is dispersed or incorrectly deposited thereon. I can do it. This diffusion of the electrically conductive bonding material, for example, forms a dam or barrier around or around each contact pad to keep the electrically conductive bonding material in place. The metallization pattern can be reduced or prevented.

2H-2K, for example, the front metallization pattern may include separate contact pads 15, fingers 20, and barriers 17, each barrier ( 17) surrounds the corresponding contact pad 15, and functions as a dam to form a moat between the contact pad and the barrier. Portions 19 of the uncured conductive adhesive bonding material 18 that flows out or out of the contact pads when dispersed onto the solar cell are attached to the moats by barriers 17. Can be limited. This prevents the conductive adhesive bonding material from further spreading from the contact pads onto the surrounding portions of the cells. The barriers 17 may be formed from the same material (eg, silver) as the fingers 20 and the contact pads 15, for example, from about 10 microns to about 40 microns in height. Can have, for example, widths of about 30 microns to about 100 microns. The mold formed between the barrier 17 and the contact pad 15 may have a width of about 100 microns to about 2 mm, for example. Although the illustrated examples include only a single barrier 17 around each front contact pad 15, in other variations two or more of these barriers may be concentrically positioned, for example, around each contact pad. . The front contact pad and its one or more surrounding barriers may, for example, form a shape similar to a “bulls-eye” target. As shown in FIG. 2H, for example, the barriers 17 may be interconnected with thin conductors interconnecting the fingers 20 and contact pads 15.

Similarly, as shown in FIGS. 2L-2N, for example, the back metallization pattern (eg, silver) is provided with separate rear contact pads 25, substantially all of the back side of the solar cell. It may include a covering (eg, aluminum) contact 30, and (eg, silver) barriers 27, each barrier 27 surrounding a corresponding rear contact pad 25, said It acts as a dam that forms a moat between the contact pad and the barrier. A portion of the contact 30 may fill the mout as illustrated. Portions of the uncured conductive adhesive bonding material that flows out of the contact pads 25 or out of the contact pads when dispersed onto the solar cell may be restricted to the moats by barriers 27. . This prevents the conductive adhesive bonding material from further spreading from the contact pads onto the surrounding portions of the cell. The barriers 27 can have heights of about 10 microns to about 40 microns, for example, and can have widths of about 50 microns to about 500 microns, for example. The mold formed between the barrier 27 and the contact pad 25 may have a width of about 100 microns to about 2 mm, for example. Although the illustrated examples include only a single barrier 27 around each rear contact pad 25, in other variations two or more such barriers may be concentrically disposed, for example, around each contact pad. . The rear contact pad and one or more surrounding barriers thereof, for example, may form a shape similar to a “bulls-eye” target.

A continuous bus bar or contact pad running substantially at the length of the edge of the solar cell can also be surrounded by a barrier preventing diffusion of the conductive adhesive bonding material. For example, FIG. 2Q shows such a barrier 27 surrounding the rear bus bar 25. The front bus bar (e.g., bus bar 15 in FIG. 2A) can be similarly surrounded by a barrier. Similarly, rows of front or rear contact pads may be grouped by such barriers rather than individually surrounded by separate barriers.

As described above, rather than surrounding bus bars or one or more contact pads, a feature of the front or back metallization pattern is that the sun is provided with the bus bars or contact pads positioned between the barrier and the edge of the solar cell. It is possible to form the barrier running parallel to the overlapping edge of the cell substantially to the length of the solar cell. Such a barrier can serve two functions as a bypass conductor (described earlier). For example, in FIG. 2R, the bypass conductor 40 tends to prevent the uncured conductive adhesive bonding material on the contact pads 15 from diffusing onto the active area in front of the solar cell. Provides Similar arrangements can be used for back metallization patterns.

Barriers to the diffusion of the conductive adhesive bonding material may be spaced apart from contact pads or bus bars to form a moat, as described above, but this is not required. These barriers can replace adjacent contact pads or bus bars, for example, as shown in Figures 2o or 2p. In these variations, the barrier is preferably larger than the contact pad or bus bar to hold the uncured conductive adhesive bonding material on the contact pad or bus bar. Although portions of the front metallization pattern are shown in FIGS. 2o and 2p, similar arrangements can be used for the back metallization patterns.

Barriers to the diffusion of the conductive adhesive bonding material and/or the moits between these barriers and the contact pads or bus bars, and any conductive adhesive bonding material diffused into these moats are adjacent to the super cell. It can be selectively placed within an area of the surface of the solar cell superimposed by the solar cell, and thus can be hidden in the field of view and masked from exposure to solar radiation.

Optionally or in addition to the use of barriers as described above, the electrically conductive bonding material can be deposited using a mask or any other suitable method (e.g., screen printing) that enables accurate deposition, Accordingly, reduced amounts of an electrically conductive bonding material that is likely to diffuse over the contact pads or escape the contact pads during deposition may be required.

More generally, solar cells 10 may employ any suitable front and back metallization patterns.

4A shows a portion of the front side of an exemplary rectangular super cell 100 including solar cells 10 as shown in FIG. 2A arranged in a shingled manner as shown in FIG. 1. As a result of the shingling geometry, there is no physical gap between the pairs of solar cells 10. Also, although the bus bar 15 of the solar cell 10 can be seen at one end of the super cell 100, the bus bars (or front contact pads) of the other solar cells overlap the adjacent solar cells. It is hidden under the parts. As a result, the area occupied by the super cell 100 in the solar module is efficiently used. In particular, a larger portion of the area will be used to produce electricity than is the case for conventional tabbed solar cell batches and solar cell batches that include many visible bus bars on the illustrated surface of the solar cells. Can. 4B-4C mainly show front and back views of another exemplary super cell 100 similar to the case of FIG. 4A, although mainly including chamfered chevron rectangular silicon solar cells.

In the example illustrated in FIG. 4A, bypass conductors 40 are hidden by overlapping portions of adjacent cells. Optionally, solar cells comprising bypass conductors 40 can be overlapped similarly as shown in FIG. 4A without covering the bypass conductors.

The exposed front bus bar 15 at one end of the super cell 100 and the rear metallization of the solar cell at the other end of the super cell 100 attach the super cell 100 to other super cells. And/or negative and positive (terminal) end contacts for the super cell that can be used to electrically connect to other electrical components if desired.

Adjacent solar cells in the super cell 100 may overlap in any suitable amount, for example, from about 1 millimeter (mm) to about 5 mm.

5A to 5G, for example, shingled super cells as described above can efficiently fill the area of the solar module. These solar modules can be, for example, square or rectangular. The rectangular solar modules as illustrated in FIGS. 5A-5G have, for example, short sides having a length of about 1 meter and long sides having a length of about 1.5 meters to about 2.0 meters, for example. You can. Any other suitable shapes and dimensions for the solar modules can also be used. Any suitable arrangement of super cells in the solar module can be used.

In a square or rectangular solar module, the super cells are typically arranged in rows parallel to the short or long side of the solar module. Each column can contain one, two or more super cells arranged end-to-end. The super cell 100 forming part of the solar module may include any suitable number of solar cells 10, and may be any suitable length. In some variations, the super cells 100 each have a length approximately equal to the length of the short sides of a rectangular solar module in which they are part. In other variations, the super cells 100 each have a length approximately equal to half the length of the short sides of the rectangular solar module, which are part of them. In other variations, the super cells 100 each have a length approximately equal to the length of the long sides of the rectangular solar module, which are part of them. In other variations, the super cells 100 each have a length approximately equal to half the length of the long sides of the rectangular solar module, which are part of them. The number of solar cells required to make super cells of these lengths depends, of course, on the dimensions of the solar module, the dimensions of the solar cells, and the amount by which adjacent solar cells overlap. Any other suitable lengths for super cells can also be used.

In variants in which the super cell 100 has a length approximately equal to the length of the short sides of the rectangular solar module, the super cell has dimensions of, for example, about 19.5 millimeters (mm) times about 156 mm. It may have 56 rectangular solar cells, and adjacent solar cells may overlap by about 3 mm. Eight such rectangular solar cells can be separated from a conventional square or pseudo square 156 mm wafer. Optionally, such a super cell can include, for example, 38 rectangular solar cells with dimensions of about 26 mm times about 156 mm, and adjacent solar cells can overlap by about 2 mm. . Six such rectangular solar cells can be separated from a conventional square or pseudo square 156 mm wafer. In variations where the super cell 100 has a length approximately equal to half the length of the short sides of the rectangular solar module, the super cell is, for example, about 19.5 millimeters (mm) times about 156 mm. It may include 28 rectangular solar cells with dimensions, and adjacent solar cells may overlap by about 3 mm. Optionally, such a super cell can include, for example, 19 rectangular solar cells having dimensions of about 26 mm times about 156 mm, and adjacent solar cells can overlap by about 2 mm. .

In variants in which the super cell 100 has a length approximately equal to the length of the long sides of the rectangular solar module, the super cell has, for example, 72 pieces having dimensions of about 26 mm times about 156 mm. It may include rectangular solar cells, and adjacent solar cells may overlap approximately 2 mm. In variations where the super cell 100 has a length approximately equal to half the length of the long sides of the rectangular solar module, the super cell has dimensions of, for example, about 26 mm times about 156 mm. It may include 36 rectangular solar cells, and adjacent solar cells may overlap by about 2 mm.

FIG. 5A shows an exemplary rectangular solar module 200 comprising twenty rectangular super cells 100 each having approximately the same length as half the length of the short sides of the solar module. The super cells are arranged end-to-end in pairs to form ten rows of super cells, and the columns and long sides of the super cells are oriented parallel to the short sides of the solar module. In other variations, each column of super cells can include three or more super cells. Also, a similarly configured solar module may include more or fewer columns of super cells than shown in this example (FIG. 14A, for example, arranged in two columns of two super cells, respectively). A solar module containing twenty-four rectangular super cells is shown).

In variants where the super cells in each row are arranged such that at least one of them has a front end contact on the end of the super cell adjacent to the other super cell in the row, the gap 210 shown in FIG. 5A ) Makes it possible to make electrical contact to front end contacts of super cells 100 (eg, exposed bus bars or separate contacts 15) along the centerline of the solar module. For example, the two super cells in a row are arranged into one super cell having its front terminal contact along the center line of the solar module and another super cell having its rear terminal contact along the center line of the solar module. Can be. In this arrangement, the two super cells in a row are arranged along the center line of the solar module, and are coupled to the front terminal contact of the one super cell and the rear terminal contact of the other super cell. Can be electrically connected in series by (for example, see FIG. 8C discussed below). In variations where each row of super cells includes three or more super cells, there may be additional gaps between the super cells, similarly for front end contacts located away from the sides of the solar module. It may be possible to make an electrical contact.

FIG. 5B shows an exemplary rectangular solar module 300 comprising ten rectangular super cells 100 each having a length approximately equal to the length of the short sides of the solar module. The super cells are arranged in ten parallel rows with their long sides oriented parallel to the short sides of the module. A similarly configured solar module can include more or fewer rows of such side length super cells as shown in this example.

5B also shows how the solar module 200 of FIG. 5A looks when there are no gaps between adjacent super cells within the rows of super cells in the solar module 200. The gap 210 of FIG. 5A can be removed, for example, by arranging the super cells such that both super cells in each row have their rear end contacts along the centerline of the module. In this case, the super cells can be arranged close to each other with little or no additional gap between them because access to the front surface of the super cell is not required along the center of the module. Optionally, the two super cells 100 in the row have one front end contact along the side of the module and a rear end contact along the center lines of the module, and the other one along the center line of the module. It has an end contact and has a rear end contact along the opposite side of the module, and adjacent ends of the super cells can be arranged to overlap. Overlapping ends of the super cells without covering any part of the front side of the solar module so that a flexible interconnect provides electrical connection to one front end contact of the super cells and the rear end contact of the other super cell Can be intervened. For columns containing three or more super cells, these two approaches can be used in combination.

The super cells and rows of super cells shown in 5A-5B can be interconnected by any suitable combination of electrical connections in series and parallel, as described further below with respect to FIGS. 10A-15, for example. The interconnections between the super cells can be made, for example, using flexible interconnects similar to that described next for FIGS. 5C-5G and subsequent figures. As evidenced by many of the examples described herein, super cells in the solar modules described herein are coupled in series to provide an output voltage for the module that is substantially the same as in the case of a conventional solar module and It can be interconnected by parallel connections. In these cases, the output current from the solar module can also be substantially the same as for a conventional solar module. Optionally, as described further below, super cells in the solar module can be interconnected to provide a significantly higher output voltage from the solar module than is provided by conventional solar modules.

5C shows an exemplary rectangular solar module 350 including six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly configured solar module can include more or less rows of super cells of this side length in this example. In this example (and in some of the following examples), each super cell contains 72 rectangular solar cells each having a width approximately equal to 1/6 of the width of a wafer of 156 mm square or pseudo square. Any other suitable number of rectangular solar cells, any other suitable dimensions may also be used. In this example, the front terminal contacts of the super cells are positioned adjacent to the edge of one short side of the module and electrically connected to each other with flexible interconnects 400 running in parallel. The rear terminal contacts of the super cells are likewise adjacent to the edge of the other short side of the back of the solar module and electrically connected to each other by flexible interconnects running in parallel. The rear interconnects are hidden in view in FIG. 5C. This arrangement electrically connects the six module length super cells in parallel. The details of the flexible interconnects and their placement in these and other solar module configurations are discussed in more detail below with respect to FIGS. 6-8G.

5D shows an exemplary rectangular solar module 360 including twelve rectangular super cells 100 each having approximately the same length as half the length of the long sides of the solar module. The super cells are arranged end to end in pairs to form six rows of super cells, and the long sides of the columns and the super cells are oriented parallel to the long sides of the solar module. In other variations, each column of super cells can include three or more super cells. In addition, a similarly configured solar module may include more or fewer rows of super cells shown in this example. In this example (and in some of the following examples), each super cell contains 36 rectangular solar cells each having a width approximately equal to 1/6 of the width of a wafer of 156 mm square or pseudo square. Any other suitable number of rectangular solar cells, any other suitable dimensions may also be used. The gap 410 makes it possible to make electrical contact to the front end contacts of the super cells 100 along the centerline of the solar module. In this example, flexible interconnects 400 located adjacent to and parallel to the edge of one short side of the module electrically interconnect the six front terminal contacts of the super cells. Similarly, flexible interconnects located adjacent to and parallel to the edge of the other short side of the module behind the module electrically connect the rear terminal contacts of the other six super cells. Flexible interconnects located along the gap 410 (not shown in this figure) interconnect each pair of super cells in a row in series, and optionally extend laterally to interconnect adjacent rows in parallel. . This arrangement electrically connects the six rows of super cells in parallel. Optionally, in the first group of super cells, the first super cell in each column is electrically connected in parallel with the first super cell in each other column, and in the second group of super cells the second super cell is The second super cell in each other row is electrically connected in parallel, and the two groups of super cells are electrically connected in series. The latter arrangement allows two groups of each of the super cells to be individually input in parallel with a bypass diode.

Detail A of FIG. 5D identifies the location of the cross-sectional view shown in FIG. 8A of interconnection of rear terminal contacts of the super cells along the edge of one short side of the module. Detail B similarly identifies the location of the cross-section shown in FIG. 8B of the interconnection of the front terminal contacts of the super cells along the other short side of the module. Detail C confirms the location of the cross-section shown in FIG. 8C of the series interconnection of the super cells in a row along gap 410.

FIG. 5E is an example of FIG. 5C, except that in this example all of the solar cells in which the super cells are formed are chevron solar cells with chamfered edges corresponding to the edges of the pseudo-square wafers from which the solar cells were separated. An exemplary rectangular solar module 370 constructed similarly to the case is shown.

FIG. 5F is similar to the case of FIG. 5C, except that in this example the solar cells in which the super cells are formed contain a mixture of chevron and rectangular solar cells to reproduce the shapes of the pseudo-square wafers from which they were separated. Another exemplary rectangular solar module 380 is shown. In the example of FIG. 5F, the chevron solar cells and the rectangular solar cell, as the chevron solar cells may be wider orthogonal to their long axes than the rectangular solar cells to compensate for the deviating edges on the chevron cells. They have the same active area exposed to solar radiation during the operation of the module and thus a matching current.

FIG. 5G is the case of FIG. 5E (ie, only the chevron solar cells), except that the adjacent chevron solar cells in the super cell in the solar module of FIG. 5G are arranged in mirror images of each other so that their overlapping edges are the same length. Another exemplary rectangular solar module is configured similarly to (including). This maximizes the length of each overlapping joint, thus allowing heat flow through the super cell.

Other configurations of rectangular solar modules include one or more columns of super cells formed only of rectangular (non-chamfered) solar cells and one or more columns of super cells formed only of chamfered solar cells. You can. For example, the rectangular solar module can be configured similarly to the case of FIG. 5C, except that it has two outer rows of super cells, each replaced by a row of super cells formed only of chamfered solar cells. . The chamfered solar cells in these rows can be arranged in pairs of mirror images, for example, as shown in FIG. 5G.

In the example solar modules shown in FIGS. 5C-5G, the current along each row of super cells is about 1/6 of the activity of the rectangular solar cells in which the super cells are formed in the case of a conventional size solar cell. Because it has an area, it is about 1/6 of a conventional solar module of the same area. However, in these examples, since the six columns of the super cells are electrically connected in parallel, the exemplary solar modules can generate the same total current as generated by a conventional solar module of the same area. This enables a substation of the exemplary solar modules of FIGS. 5C-5G (and other examples described below) for conventional solar modules.

FIG. 6 shows an exemplary arrangement of three columns of super cells interconnected with flexible electrical interconnects to place the super cells in each column in series with each other and to place the columns in parallel with each other in more detail than FIGS. 5C-5G. . These can be, for example, three columns in the solar module of FIG. 5D. In the example of Figure 6, each super cell 100 has a flexible interconnect 400 conductively coupled to its front terminal contact and another flexible interconnect conductively coupled to its rear terminal contact. The two super cells in each row are electrically connected in series by a shared flexible interconnect that is conductively coupled to the front terminal contact of one super cell and the rear terminal contact of the other super cell. Each flexible interconnect is positioned adjacent to and parallel to the end of the super cell to which it is joined, and can extend laterally to conductively couple to the flexible interconnect on the super cell within the adjacent column beyond the super cell, adjacent rows Connect them in parallel. The dashed lines in FIG. 6 represent parts of the flexible interconnects that are obscured by the overlapping parts of the super cells, or parts of the super cells that are hidden in view by overlapping parts of the flexible interconnects.

Flexible interconnects 400 may be conductively coupled to the super cells with a mechanically flexible and electrically conductive bonding material as described above, for example, for use in bonding superimposed solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edges of the super cell resulting from a mismatch between the thermal expansion coefficient of the super cell and the thermal expansion coefficient of the electrically conductive bonding material or interconnects. Or it may be located at separate locations along the edges of the super cell rather than as a continuous line extending substantially the length of the edge of the super cell to accommodate.

Flexible interconnects 400 may be formed of or include, for example, thin copper sheets. Flexible interconnects 400 may be selectively patterned to increase their mechanical compliance (flexibility), both orthogonal and parallel to the edges of the super cells resulting from a mismatch between the CTE of the interconnect and the CTE of the super cells. It may or may not be configured. Such patterning may include, for example, slits, slots, or holes. The conductive portions of interconnects 400 may have a thickness of less than or equal to about 100 microns, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns to increase the flexibility of the interconnects. The mechanical compliance of the flexible interconnect and its coupling to the super cells withstands the stress resulting from a CTE mismatch during the lamination process, which is described in more detail below for methods of manufacturing shingled solar cell modules. It should be sufficient for the interconnected super cells to withstand the stress resulting from CTE mismatch during temperature cycling testing from -40°C to about 85°C.

Preferably, flexible interconnects 400 are less than or equal to about 0.015 ohm (Ohm), less than or equal to about 0.012 ohm, or about 0.01 for current flow parallel to the ends of the super cells to which they are coupled. It is less than or equal to ohm.

7A shows some example configurations denoted by reference numerals 400A-400T that may be suitable for flexible interconnect 400.

8A-8C, for example, the solar modules described herein are typically super cells and a transparent front sheet 420 and back sheet ( 430) includes a laminate structure having one or more encapsulant materials 4101 interposed therebetween. The transparent front sheet may be, for example, glass. Optionally, the back sheet may also be transparent, which may enable double-sided operation of the solar module. The back sheet may be, for example, a polymer sheet. Optionally, the solar module can be a glass-glass module having both front and back sheets of glass.

The cross-sectional view of FIG. 8A (detail A from FIG. 5D) is conductively coupled to the rear terminal contact of the super cell near the edge of the photovoltaic module and extends inwardly below the super cell from the front of the solar module Shown is an example of a flexible interconnect 400 that is hidden from view. An additional strip of encapsulant can be disposed between the interconnect 400 and the back side of the super cell, as illustrated.

8B (detail B from FIG. 5B) shows an example of a flexible interconnect 400 that is conductively coupled to the front terminal contact of the super cell.

The cross-sectional view of FIG. 8C (detail C from FIG. 5B) is a shared flexible conductively coupled to the front terminal contact of one super cell and the rear terminal contact of the other super cell to electrically connect the two super cells in series. An example of interconnect 400 is shown.

Flexible interconnects that are electrically connected to the front terminal contact of the super cell can be configured or arranged to occupy only a narrow width of the front side of the solar module, which can be located, for example, adjacent to the edge of the solar module. . The area of the front side of the module occupied by these interconnects may have a narrow width, for example, ≦about 10 mm, ≦about 5 mm, or ≦about 3 mm orthogonal to the edge of the super cell. In the arrangement shown in FIG. 8B, for example, flexible interconnect 400 may be configured to extend beyond the end of the super cell only at such a distance. 8D-G show additional examples of arrangements in which a flexible interconnect electrically connected to the front terminal contact of the super cell can occupy only a narrow width of the front side of the module. These arrangements enable efficient use of the front area of the module to produce electricity.

FIG. 8D shows a flexible interconnect 400 that is conductively coupled to the front contact of the terminal of the super cell and is folded back of the super cell around the edge of the super cell. An insulating film 435 that may be pre-coated on the flexible interconnect 400 may be disposed between the flexible interconnect 400 and the rear surface of the super cell.

8E shows a flexible interconnect 400 that also includes a thin and narrow ribbon 440 that is conductively coupled to the front contact of the terminal of the super cell and a thin and wide ribbon 445 that extends behind the back of the super cell. An insulating film 435 that may be pre-coated on the ribbon 445 may be disposed between the ribbon 445 and the rear surface of the super cell.

FIG. 8F shows a flexible interconnect 400 coupled to a terminal front contact of a super cell and wound and pressed into a flattened coil that occupies only a narrow width of the front side of the solar module.

FIG. 8G shows a flexible interconnect 400 comprising a thin ribbon section conductively coupled to the terminal front contact of the super cell and a thick cross-section portion located adjacent to the super cell.

In FIGS. 8A-8G, flexible interconnects 400 may extend along the entire lengths of the edges of the super cells (eg, into the ground of the drawing), as shown in FIG. 6, for example.

Optionally, portions of the flexible interconnect 400 that may otherwise be visible from the front of the module are dark colored to reduce the visible contrast between the interconnect and the super cell as recognized by a person with normal color vision. It can be covered with a film, coated, or otherwise colored. For example, the optional black film or coating 425 in FIG. 8C covers portions of the interconnect 400 that would otherwise have been visible from the front of the module. Otherwise, the visible parts of the interconnect 400 shown in other figures may be covered or have a color.

Conventional solar modules typically include three or more bypass diodes, each bypass diode connected in parallel with a series connected group of 18-24 silicon solar cells. This is done to limit the amount of power that can be dissipated as heat in a reverse biased solar cell. The solar cell can be reverse biased, for example, due to defects, dirty fronts, or uneven illumination that reduces its ability to pass current generated within the string. The heat generated in a solar cell at reverse bias depends on the voltage across the solar cell and the current through the solar cell. When the voltage across the reverse biased solar cell exceeds the breakdown voltage of the solar cell, the heat lost in the cell will be equal to the breakdown voltage at the total current times occurring in the string. will be. Silicon solar cells typically have a breakdown voltage of 16 to 30 volts. Since each silicon solar cell produces a voltage of about 0.64 volts in operation, a string of 24 or more solar cells could generate a voltage across the reverse biased solar cell that exceeds the breakdown voltage.

In conventional solar modules where the solar cells are spaced apart from each other and interconnected by ribbons, heat is not easily transported away from the hot solar cells. Accordingly, the power dissipated in the solar cell at breakdown voltage could create hot spots in the solar cell that cause significant thermal damage and possibly fire. In conventional solar modules, a bypass diode is required for all groups of 18-24 series connected solar cells to ensure that there is no solar cell in the string that can thus be reverse biased above the breakdown voltage. Became.

The inventors have found that heat is easily transported through thin electrically and thermally conductive bonds between the adjacent and overlapping silicon solar cells along a silicon super cell. In addition, the current through the super cell in the solar modules described herein is of a rectangular shape where the super cells described herein typically have a smaller (eg 1/6) active area than in the case of conventional solar cells. Because it is formed by shingling solar cells, it is typically smaller than through a string of conventional solar cells. Moreover, the rectangular aspect ratio of solar cells employed herein typically provides extended areas of terminal contact between adjacent solar cells. As a result, less heat is lost in the reverse biased solar cell at the breakdown voltage, and the heat is easily diffused through the super cell and the solar module without creating dangerous hot spots. The inventors have therefore recognized that solar modules formed from super cells as described herein can employ far fewer bypass diodes than would be considered conventionally desired.

For example, in some variations of solar modules as described herein, N>25 solar cells, N≥about 30 solar cells, N≥about 50 solar cells, N≥about 70 A solar cell, or a super cell comprising N≧about 100 solar cells, can be employed without a single solar cell in the super cell, which is electrically connected in parallel with the bypass diode or without a group of <N solar cells. . Optionally, the entire super cell of these lengths can be electrically connected in parallel with a single bypass diode. Optionally, super cells of these lengths can be employed without a bypass diode.

Some additional and optional design features can implement solar modules employing super cells as described herein to withstand the heat lost further in the reverse biased solar cell. Referring back to FIGS. 8A-8C, the encapsulant 4101 can be or include a thermoplastic olefin (TPO) polymer, and the TPO encapsulants are standard ethylene-vinyl acetate: EVA) It is more photo-thermal stable than encapsulants. EVA will turn brown with temperature and ultraviolet light, and will cause hot spot problems created by the current limiting cells. These problems are reduced or avoided with TPO encapsulants. In addition, the solar modules may have a glass-glass structure in which both the transparent front sheet 420 and the back sheet 430 are glass. Such glass-glass allows the solar module to operate stably at a higher temperature than cases withstand by conventional polymer backing sheets. Moreover, junction boxes can be mounted on one or more edges of the solar module rather than behind the solar module, where a junction box is provided for the solar cells in the module above it. An additional layer of thermal insulation could be added.

9A shows an exemplary rectangular solar module comprising six rectangular shingled super cells arranged in six rows extending in the lengths of the long sides of the solar module. The six super cells are electrically connected in parallel to each other and to a bypass diode disposed in a junction box 490 on the back side of the solar module. Electrical connections between the super cells and the bypass diode are made through ribbons 450 embedded in the laminate structure of the module.

9B shows another exemplary rectangular solar module comprising six rectangular shingled super cells arranged in six rows extending in the length of the long sides of the solar module. The super cells are electrically connected in parallel to each other. Separated positive (490P) and negative (490N) terminal junction boxes are disposed on the back of the solar module at opposite ends of the solar module. The super cells are electrically connected in parallel with a bypass diode located within one of the junction boxes by an external cable 455 running between the junction boxes.

9C-9D are exemplary glass comprising six rectangular shingled super cells arranged in six rows extending in length of the long sides of the solar module in a lamination structure comprising glass front and back sheets- Shows a glass rectangular solar module. The super cells are electrically connected in parallel with each other. Separate positive (490P) and negative (490N) terminal junction boxes are mounted on opposite edges of the solar module.

Shingled Super Cells are module level power management devices (e.g. DC/AC microinverters, DC/DC module power optimizers, voltage intelligence and smart) It enables unique opportunities for module layout (for switches, and related devices). An important feature of the module level power management systems is power optimization. Super cells as described and employed herein can produce higher voltages than traditional panels. In addition, the super cell module layout can further divide the module. Both higher voltages and increased division create potential benefits for power optimization.

9E shows one exemplary configuration for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six rectangular shingled super cells arranged in six rows extending into the lengths of the long sides of the solar module. The three pairs of super cells are individually connected to the power management system 460, enabling more separate power optimization of the module.

9F shows another exemplary configuration for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six rectangular shingled super cells arranged in six rows extending into the lengths of the long sides of the solar module. The six super cells are individually connected to the power management system 460, further enabling more separate power optimization of the module.

9G shows another example for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six or more rectangular shingled super cells 998 arranged in six or more columns, where the three or more pairs of super cells are of the module It is individually connected to a bypass diode or power management system 460 to enable even more separate power optimization.

9H shows another exemplary configuration for module level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six or more rectangular shingled super cells 998 arranged in six or more rows, where the two super cells are each connected in series, all pairs Are connected in parallel. The bypass diode or power management system 460 is connected in parallel to all pairs, enabling power optimization of the module.

In some variations, module-level power management enables removal of all bypass diodes on the solar module while still excluding the risk of hot spots. This is achieved by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (eg, one or more super cells) in the photovoltaic module, a “smart switch” power management device can control any aspect where the circuit is in reverse bias. It can be determined whether or not to include the cells. When a reverse biased solar cell is detected, the power management device can disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of the monitored solar cell circuit falls below a predetermined limit (V _Limit ), then the power management device blocks the circuit while the module or string of modules remains connected (open circuit) (open circuit).

In certain embodiments, if the voltage of the circuits falls above a certain percentage or size (eg, 20% or 10V) from other circuits within the same solar cell array, it will be cut off. The electronic device will detect this change based on inter-module communication.

The implementation of this voltage intelligence includes existing module-level power management solutions (e.g., Enphase Energy Inc., Solaredge Technologies, Inc., Tigo Energy, Inc). .))), or can go through a custom circuit design.

Above V _Limit One example of how the threshold voltage can be calculated is:

CellVocc _{@Low Irr & High Temp×} N _{number of cells in series} －Vrb _{Reverse breakdown voltage} ≤V _Limit , where:

● CellVoc _{@Low Irr & High Temp} = Open circuit voltage of the cell operating at low irradiation and high temperature (lowest expected operating Voc),

● N _{number of cells in series} = The _{number of cells connected in series} in each super cell to be monitored.

● Vrb _{Reverse breakdown voltage} = Inverted polarity voltage required to pass current through the cell.

This approach to module-level power management using smart switches can allow more than 100 silicon solar cells, for example, to be connected in series within a single module without affecting stability or module reliability. In addition, such a smart switch can be used to limit the string voltage going to the central inverter (inverter). Longer module strings can thus be installed without allowing for stability or concern with respect to voltage. The weakest module can be bypassed (turned off) if the string voltages rise above the limit.

10A, 11A, 12A, 13A, 13B and 14B described below provide additional exemplary schematic electrical circuits for solar modules employing shingled super cells. 10B-1, 10B-2, 11B-1, 11B-2, 11C-1, 11C-2, 12B-1, 12B-2, 12C-1, 12C-2, 12C-3, 13C-1, 13C-2, 14C-1, and 14C-2 provide example physical layouts corresponding to these schematic circuits. The description of the physical layouts assumes that the front end contact of each super cell is negative polarity, and the rear end contact of each super cell is positive polarity. If the modules instead employ super cells with positive polarity front end contacts and negative polarity back end contacts, then the discussion of the following physical layouts changes the positive and negative orientations of the bypass diodes. It can be changed by inverting. Some of the various buses mentioned in the description of these figures may be formed of, for example, the interconnects 400 described above. The other buses described in these figures can be implemented with ribbons or external cables embedded in the laminate structure of the solar module, for example.

10A shows an exemplary electrical circuit for a solar module as illustrated in FIG. 5B, wherein the solar modules are of ten rectangles each having a length approximately equal to the length of the short sides of the solar module. It includes super cells 100. The super cells are arranged in the solar module with their long sides oriented parallel to the short sides of the module. All of the super cells are electrically connected in parallel with the bypass diode 480.

10B-1 and 10B-2 show exemplary physical layouts for the solar module of FIG. 10A. The bus 485N connects the negative (front) end contacts of the super cells 100 to the positive terminal of the bypass diode 480 in a junction box 490 located on the back side of the module. The bus 485P connects the positive (rear) end contacts of the super cells 100 to the negative terminal of the bypass diode 480. The bus 485P may lie entirely behind the super cells. The bus 485N and/or its interconnection to the super cells occupy a portion of the front side of the module.

11A shows an exemplary schematic electrical circuit for a solar module as illustrated in FIG. 5A, wherein the solar modules each have a length approximately equal to half the length of the short sides of the solar module. It comprises four rectangular super cells 100, which are arranged end to end in pairs to form ten rows of super cells. The first super cell in each column is connected in parallel with the first super cells in other columns, and in parallel with the bypass diode 500. The second super cell in each column is connected in parallel with the second super cells in other columns, and in parallel with the bypass diode 510. The two groups of super cells are connected in series as in the case of the two bypass diodes.

11B-1 and 11B-2 show example physical layouts for the solar module of FIG. 11A. In this layout, the first super cell in each row has its front (negative) end contact along the first side of the module and its rear (positive) end contact along the centerline of the module, and The two super cells have their front (negative) end contacts along the centerline of the module and their rear (positive) end contacts along the second side of the module opposite the first side. The bus 515N connects the front (negative) end contact of the first super cell in each row to the positive terminal of the bypass diode 500. The bus 515P connects the rear (positive) end contact of the second super cell in each row to the negative terminal of the bypass diode 510. The bus 520 includes a negative terminal of the bypass diode 500 and a rear (positive) end contact of the first super cell in each row and a front (negative) end contact of the second super cell in each row. It is connected to the positive terminal of the bypass diode 510.

The bus 515P may lie entirely behind the super cells. The bus 515N and/or its interconnection to the super cells occupy part of the front side of the module. The bus 520 may occupy a part of the front surface of the module, and may require a gap 210 as shown in FIG. 5A. Optionally, the bus 520 may entirely lie behind the super cells, and may be electrically connected to the super cells with hidden interconnects interposed between overlapping ends of the super cells. In this case, a small gap 210 is required, or a gap 210 is not required.

11C-1, 11C-2, and 11C-3 show another exemplary physical layout for the solar module of FIG. 11A. In this layout, the first super cell in each row has its front (negative) end contact along the first side of the module and its rear (positive) end contact along the centerline of the module, and within each row The second super cell has its rear (positive) end contact along the center line of the module and its front (negative) end contact along the second side of the module opposite the first side. The bus 525N connects the front (negative) end contact of the first super cell in each row to the positive terminal of the bypass diode 500. The bus 530N connects the front (negative) end contact of the second cell in each row to the negative terminal of the bypass diode 500 and the positive terminal of the bypass diode 510. The bus 535P connects the rear (positive) end contact of the first cell in each column to the negative terminal of the bypass diode 500 and the positive terminal of the bypass diode 510. The bus 540P connects the rear (positive) end contact of the second cell in each row to the negative terminal of the bypass diode 510.

The bus 535P and the bus 540P may lie entirely behind the super cells. The bus 525N and their interconnection to the bus 530N and/or the super cells occupy a portion of the front side of the module.

12A shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5A, wherein the solar modules each have a length approximately equal to half the length of the short sides of the solar module. It comprises four rectangular super cells 100, which are arranged end to end in pairs to form ten rows of super cells. In the circuit shown in Fig. 12A, the super cells are arranged in four groups. The first super cells of the top five columns in the first group are connected to each other and in parallel to the bypass diode 545, and the second super cells of the top five columns in the second group are in relation to each other. Connected in parallel to the bypass diode 505, the first super cells of the bottom five rows in the third group are connected to each other and in parallel to the bypass diode 560, and the bottom five in the fourth group. The second super cells of the four rows are connected in parallel to each other and to the bypass diode 555. The four groups of super cells are connected in series with each other. The four bypass diodes are also connected in series.

12B-1 and 12B-2 show an example physical layout for the solar module of FIG. 12A. In this layout, the first group of super cells has its front (negative) end contacts along the first side of the module and its rear (positive) end contacts along the centerline of the module, and The second group has its front (negative) end contacts along the centerline of the module and its rear (positive) end contacts along the second side of the module opposite the first side, the third of the super cells The group has its rear (positive) end contacts along the first side of the module and its front (negative) end contacts along the center line of the module, the fourth group of super cells along the center line of the module It has its back (positive) end contact and its front (negative) end contact along the second side of the module.

The bus 565N connects the front (negative) end contacts of the super cells in the first group of super cells to each other and to the positive terminal of the bypass diode 545. Bus 570 communicates with each other the back (positive) end contacts of the super cells in the first group of super cells and the front (negative) end contacts of the super cells in the second group of super cells. It is connected to the negative terminal of the bypass diode 545 and the positive terminal of the bypass diode 550. Bus 575 communicates with each other the back (positive) end contacts of the super cells in the second group of super cells and the front (negative) end contacts of the super cells in the fourth group of super cells with respect to each other. It is connected to the negative terminal of the bypass diode 550 and the positive terminal of the bypass diode 555. Bus 580 communicates with each other the back (positive) end contacts of the super cells in the fourth group of super cells and the front (negative) end contacts of the super cells in the third group of super cells. It is connected to the negative terminal of the diode 555 and the positive terminal of the bypass diode 560. Bus 585P connects rear (positive) end contacts of the super cells in the third group of super cells to each other and to the negative terminal of the bypass diode 560.

The bus 585P and a portion of the bus 575 connecting the super cells in the second group of super cells may entirely lie behind the super cells. The rest of the bus 575 and their interconnection to the bus 565N and/or the super cells occupy part of the front side of the module.

The bus 570 and the bus 580 may occupy a part of the front surface of the module, and may require a gap 210 as shown in FIG. 5A. Optionally, they can entirely lie behind the super cells, and can be electrically connected to the super cells with hidden interconnects interposed between the superimposed ends of the super cells. In this case, a small gap 210 is required or no gap 210 is required.

12C-1, 12C-2, and 12C-3 show an optional physical layout for the solar module of FIG. 12A. This layout uses two junction boxes 490A, 490B instead of the single junction box 490 shown in FIGS. 12B-1 and 12B-2, but otherwise of FIGS. 12B-1 and 12B-2. It is equivalent to the case.

13A shows another exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5A, wherein the solar modules each have a length approximately equal to half the length of the short sides of the solar module. It comprises four rectangular super cells 100, which are arranged end to end in pairs to form ten rows of super cells. In the circuit shown in Fig. 13A, the super cells are arranged in four groups. The first super cells of the top five columns in the first group are connected in parallel to each other, the second super cells of the top five rows in the second group are connected in parallel to each other, and the bottom five of the top rows in the third group. The first super cells of the columns are connected in parallel with each other, and the second super cells of the lower five columns in the fourth group are connected in parallel with each other. The first group and the second group are connected in series with each other, and thus are connected in parallel with the bypass diode 590. The third group and the fourth group are connected in series with each other, and thus are connected in parallel with other bypass diodes 595. The first and second groups are connected in series with the third and fourth groups, and the two bypass diodes are also connected in series.

13C-1 and 13C-2 show exemplary physical layouts for the solar module of FIG. 13A. In this layout, the first group of super cells has its front (negative) end contact along the first side of the module and its rear (positive) end contact along the centerline of the module, the second of the super cells The group has its front (negative) end contact along the centerline of the module and its rear (positive) end contact along the second sides of the module opposite the first side, the third group of super cells comprising The rear (positive) end contact along the first side of the module and its front (negative) end contact along the center line of the module, the fourth group of super cells along the center line of the module It has a positive) end contact and its front (negative) end contact along the second side of the module.

The bus 600 has front (negative) end contacts of the first group of super cells relative to each other and rear (positive) end contacts of the third group of super cells, the cathode of the bypass diode 590 Terminal, and the negative terminal of the bypass diode 595. Bus 605 connects the rear (positive) end contacts of the first group of super cells to each other and to the front (negative) end contacts of the second group of super cells. Bus 610P connects rear (positive) end contacts of the second group of super cells to each other and to the negative terminal of bypass diode 590. Bus 615N connects the front (negative) end contacts of the fourth group of super cells to each other and to the positive terminal of the bypass diode 595. Bus 620 connects the front (negative) end contacts of the third group of super cells to each other and to the rear (positive) end contacts of the fourth group of super cells.

A portion of the bus 600 connecting the bus 610P and the super cells of the third group of super cells may entirely lie behind the super cells. The rest of the bus 600 and their interconnection to the bus 615N and/or the super cells occupy part of the front side of the module.

The bus 605 and the bus 620 occupy a part of the front surface of the module, and require a gap 210 as shown in FIG. 5A. Optionally, they can entirely lie behind the super cells, and can be electrically connected to the super cells with hidden interconnects interposed between the superimposed ends of the super cells. In this case, a small gap 210 is required or no gap 210 is required.

13B shows an exemplary schematic circuit diagram for a solar module as illustrated in FIG. 5B, wherein the solar module has ten rectangular super having approximately the same lengths as the short sides of the solar module. Cells 100 are included. The super cells are arranged in the solar module with their long sides oriented parallel to the short sides of the module. In the circuit shown in Fig. 13B, the super cells are arranged in two groups. In the first group, the top five super cells are connected to each other in parallel to the bypass diode 590, and in the second group, the bottom five super cells are parallel to each other and to the bypass diode 595. Leads to The two groups are connected in series with each other. The bypass diodes are also connected in series.

The schematic circuit of FIG. 13B is different from that of FIG. 13A in which each column of the two super cells of FIG. 13A is replaced by a single super cell. Accordingly, the physical layout of the solar module of FIG. 13B may be as shown in FIGS. 13C-1, 13C-2, and 13C-3 by omitting the bus 605 and the bus 620.

FIG. 14A shows an exemplary rectangular solar module 700 comprising twenty-four rectangular super cells 100 each having a length approximately equal to half the length of the short sides of the solar module. Super cells are arranged in pairs in pairs to form twelve columns of super cells, and the columns and long sides of the super cells are oriented parallel to the short sides of the solar module.

14B shows an exemplary schematic circuit diagram for a solar module as illustrated in FIG. 14A. In the circuit shown in Fig. 14B, the super cells are arranged in three groups. In the first group, the first super cells of the upper eight columns are connected to each other and in parallel to the bypass diode 705, and in the second group, the lower four columns of super cells are to each other and the bypass. It is connected in parallel to the diode 710, and the second super cells of the upper eight columns in the third group are connected in parallel to each other and to the bypass diode 715. The three groups of super cells are connected in series. The three bypass diodes are also connected in series.

14C-1 and 14C-2 show exemplary physical layouts for the solar module of FIG. 14B. In this layout, the first group of super cells has its front (negative) end contacts along the first side of the module and its rear (positive) end contacts along the centerline of the module. In the second group of super cells, the first super cell of each lower four rows has its back (positive) end contact along the first side of the module and its front (negative) along the center line of the module. ) A second super cell of four rows of each bottom having an end contact, along its center line, along its front (negative) end contact and along the second side of the module opposite the first side It has a back (positive) end contact. The third group of solar cells has its rear (positive) end contacts along the center line of the module and its rear (negative) end contacts along the second side of the module.

Bus 720N connects the front (negative) end contacts of the first group of super cells to each other and to the positive terminal of bypass diode 705. The bus 725 includes rear (positive) end contacts of the first group of super cells, front (negative) end contacts of the second group of super cells, negative terminal and bi of the bypass diode 705. It is connected to the positive terminal of the pass diode 710. Bus 730P connects the rear (positive) end contacts of the third group of super cells to each other and to the negative terminal of bypass diode 715. The bus 735 includes front (negative) end contacts of the third group of super cells relative to each other and rear (positive) end contacts of the second group of super cells, of the bypass diode 710. It is connected to the negative terminal and the positive terminal of the bypass diode 715.

A portion of the bus 725 connected to the super cells of the first group of super cells, a bus 730P, and a portion of the bus 735 connected to the super cells of the second group of super cells are entirely the super cells. Can be placed behind. Bus 720N and the rest of bus 725 and their interconnection to bus 735 and/or the super cells occupy a portion of the front side of the module.

Some of the examples described above accommodate the bypass diodes in one or more junction boxes on the back side of the solar module. However, this is not required. For example, some or all of the bypass diodes may be located in plane with the super cells around the perimeter of the solar module, may be located in gaps between super cells, or behind the super cells. have. In these cases, the bypass diodes can be placed, for example, in a laminate structure in which the super cells are sealed. The positions of the bypass diodes can thus be decentralized and removed from the junction boxes, for example two that can be located on the back side of the solar module near the outer edges of the solar module. Two separate single-terminal junction boxes can replace the central junction box with both positive and negative module terminals. This approach generally reduces the current path length in the ribbon conductors in the solar module and in cabling between the solar modules, all of which can reduce material cost and increase module power. Yes (by reducing resistive power losses).

Referring to FIG. 15, for example, the physical layout for various electrical interconnections for a solar module as illustrated in FIG. 5B with the schematic circuit diagram of FIG. 10A is a bypass diode located within the super cell laminate structure. 480 and two single terminal junction boxes 490P, 490N can be employed. 15 may be understood to be the best compared to FIGS. 10B-1 and 10B-2. Other module layouts described above can be similarly changed.

The use of bypass diodes in the laminate as described above is less than if the power dissipated in the bypass diode forward-biased by the reduced current solar cells could be in conventional sized solar cells. This can be made possible by the use of a reduced current (reduced area) rectangular solar cells as described above. Bypass diodes in the solar modules described herein can thus require less heat-sinking than conventional, and as a result can escape the junction box on the backside of the module and move into the laminate. .

A single solar module can include interconnects, other conductors and/or bypass diodes supporting two or more electrical components, for example two or more of the electrical components described above. In these cases, the specific configuration for the operations of the solar module can be selected from two or more options, for example with the use of switches and/or jumpers. Other configurations may inject different numbers of super cells in series and/or in parallel to provide different combinations of voltage and current outputs from the solar module. Such a solar module can thus be a factory or field that can be configured to be selected from two or more different voltage and current combinations, for example to select between a high voltage and low current configuration and a low voltage and high current configuration. have.

16 shows an exemplary arrangement of a smart switch module level power management device 750 between two solar modules as described above.

Referring now to FIG. 17, an exemplary method 800 for making solar modules as disclosed herein includes the following steps. In step 810, conventionally sized solar cells (eg, 156 mm×156 mm or 125 mm×125 mm) are cut and/or cut to form rectangular solar cell “strips” ( See also, for example, FIGS. 3A-3E and related descriptions). The resulting solar cell strips can be selectively tested and classified according to their current-voltage performance. Cells with matching or roughly matching current-voltage performance can advantageously be used in the same super cell or in the same rows of super cells connected in series. For example, it may be advantageous for cells connected in series within a super cell or a row of super cells to produce a matched or roughly matched current under the same illumination.

In step 815, super cells are assembled from the strip solar cells with a conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells in the super cells. The conductive adhesive bonding material may be applied, for example, by ink jet printing or screen printing.

In step 820, heat and pressure are applied to cure or partially cure the conductive adhesive bonding material between solar cells in the super cells. In one variation, as each additional solar cell is added to a super cell, the conductive adhesive bonding material between the newly added solar cell and its adjacent and overlapping solar cell (already part of the super cell) is the next solar cell. Is cured or partially cured before being added to the super cell. In another variation, two or more solar cells or all solar cells in a super cell can be positioned in a desired overlapping manner before the conductive adhesive bonding material is cured or partially cured. The super cells resulting from this step can be selectively tested and classified according to their current-voltage performance. Super cells with matching or roughly matching current-voltage performance can be advantageously used in the same row of super cells or in the same solar module. For example, it may be advantageous for super cells or rows of super cells electrically connected in parallel to generate matching or roughly matching voltages under the same illumination.

In step 825, the cured or partially cured super cells are arranged in a desired module configuration in a layered structure comprising an encapsulant material, a transparent front (sun side) sheet and a (optionally transparent) back sheet. Become interconnected. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnected super cells arranged under the sun side of the first layer of encapsulant, a second layer of encapsulant on the layer of supercells, and the And a second sheet on the second layer of the encapsulant. Any other suitable arrangement can also be used.

In lamination step 830, heat and pressure are applied to the layered structure to form a cured laminate structure.

In one variation of the method of FIG. 17, the conventional sized solar cells are separated into solar cell strips, after which the conductive adhesive bonding material is applied to each individual solar cell strip. In an alternative variant, the conductive adhesive bonding material is applied to the conventional sized solar cells prior to separation of the solar cells into solar cell strips.

In the curing step 820, the conductive adhesive bonding material may be entirely cured, or partially cured. In the latter case, the conductive adhesive bonding material may be partially cured initially in step 820 to sufficiently facilitate handling and interconnection of the super cells, and may be cured entirely during subsequent lamination step 830.

In some variations, the super cell 100 assembled as an intermediate product in the method 800 is at the long sides of adjacent solar cells overlapping and conductively coupled as described above and at opposite ends of the super cell. And a plurality of rectangular solar cells 10 arranged with interconnects coupled to terminal contacts.

30A shows an exemplary super cell with electrical interconnects coupled to its front and rear terminal contacts. The electrical interconnects run parallel to the terminal edges of the super cell and extend laterally past the super cell to enable electrical interconnection with adjacent super cells.

30B shows the two super cells of FIG. 30A connected in parallel. Some of the interconnects that may otherwise be visible from the front of the module can be covered or colored to reduce the visual contrast between the interconnect and the super cells as perceived by a person with normal color vision (eg (For dark, there is). In the example illustrated in FIG. 30A, the interconnect 850 is conductively coupled to the front terminal contact of the first polarity (eg, + or -) at one end (right side of the drawing) of the super cell, and the other interconnect 850 is conductively coupled to the rear terminal contact of the opposite polarity at the other end (left side of the drawing) of the super cell. Similar to the other interconnects described above, the interconnects 850 can be conductively bonded to the super cell with, for example, the same conductive adhesive bonding material used between solar cells, but this is not required. In the illustrated example, a portion of each interconnect 850 extends past the edge of the super cell 100 in a direction orthogonal to the long axis of the super cell (and parallel to the long axes of the solar cells 10). do. As shown in FIG. 30B, this allows two or more super cells 100 to be located in a poor position, and the interconnects 850 of one super cell are adjacent to electrically interconnect the two super cells in parallel. Superimposed on the corresponding interconnects 850 on the super cell and conductively coupled. As previously described, several of these interconnects 850 interconnected in series may form a bus for the module. This arrangement may be suitable, for example, when an individual super cell extends to the full width or full length of the module (eg, FIG. 5B ). In addition, interconnects 850 can also be used to electrically connect the terminal contacts of two adjacent super cells in a row of super cells in series. These interconnected pairs of super cells or long strings in a column are adjacent by overlapping and electrically conductive interconnects 850 in one column to interconnects 850 in an adjacent column as shown in FIG. 30B. It can be electrically connected in parallel with similarly interconnected super cells in a row.

Interconnect 850 can be die cut from a conductive sheet, for example, and stress perpendicular to and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell. It can be selectively patterned to increase its mechanical compliance, both orthogonal and parallel to the edge of the super cell, to reduce or accommodate. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of the interconnect 850 and its coupling or coupling to the super cell should be sufficient for connections to the super cell to withstand the stress resulting from a CTE mismatch during the lamination process described in more detail below. The interconnect 850 can be coupled to the super cell with a mechanically flexible and electrically conductive bonding material, as described above, for example, for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edges of the super cell resulting from a mismatch between the thermal expansion coefficient of the super cell and the thermal expansion coefficient of the electrically conductive bonding material or interconnects. Or it may be located only at separate locations along the edges of the super cell, rather than as a continuous line extending substantially the length of the edge of the super cell to accommodate.

Interconnect 850 can be cut from a thin copper sheet, for example, and super cells 100 are formed from solar cells having smaller areas than standard silicon solar cells, thus lower currents than in the conventional case. When operating at, it can be thinner than conventional conductive interconnects. For example, interconnects 850 may be formed from a copper sheet having a thickness of about 50 microns to about 300 microns. The interconnects 850 can be thin enough and can be flexible to fold around and behind the edge of the super cell to which they are joined, similar to the interconnects described above.

19A-19D show some exemplary arrangements where heat and pressure may be applied during method 800 to cure or partially cure the conductive adhesive bonding material between adjacent solar cells in the super cells. Any other suitable arrangement can also be employed.

In FIG. 19A, heat and local pressure may be applied to one connection site (overlapping area) of the conductive adhesive bonding material 12 at a time to cure or partially cure the conductive adhesive bonding material 12. The super cell can be supported by the surface 1000, and pressure can be mechanically applied to the connection site from above, for example by a bar, pin or other mechanical contact. Heat may be applied to the connection site by, for example, hot air (or other hot gas) or infrared lamp or by heating the mechanical contact applying local pressure to the connection site.

In FIG. 19B, the batch of FIG. 19A can be extended to a batch process that simultaneously applies heat and local pressure to multiple connection sites in a super cell.

In FIG. 19C, the uncured super cell is interposed between release liners 1015 and reusable thermoplastic sheets 1020 and is a carrier plate supported by surface 1000. ) 1010. The thermoplastic material of the sheets 1020 is selected to melt at the temperature at which the super cells are cured. Release liners 1015 may be formed from, for example, glass fiber and PTFE, and do not adhere to the super cell after the curing process. Preferably, release liners 1015 are formed from materials having a coefficient of thermal expansion consistent with or substantially consistent with the coefficient of thermal expansion of the solar cells (eg, CTE of silicon). This means that if the CTE of the release liners differs too much from the CTE of the solar cells, then the solar cells and the release liners will be lengthened in different amounts during the curing process, which will connect the super cell at the connection site. It will tend to fall in the longitudinal direction. A vacuum bladder 1005 is placed over this batch. The uncured super cell is heated from below through, for example, surface 1000 and carrier plate 1010, and a vacuum is created between bladder 1005 and support surface 1000. As a result, bladder 1005 applies hydrostatic pressure to the super cell through the molten thermoplastic sheets 1020.

In FIG. 19D, the uncured super cell is carried by a moving belt 1025 punched through an oven 1035 that heats the super cell. The vacuum applied through the perforations in the belt pulls the solar cells 10 towards the belt, thereby applying pressure to the connection sites between them. The conductive adhesive bonding material in these connection sites is cured as the super cell passes through the oven. Preferably, the perforated belt 1025 is formed from materials having a CTE that matches or substantially matches the CTE of the solar cells (eg, CTE of silicon). This means that if the CTE of the belt 1025 is too different from the CTE of the solar cells, then the solar cells and the belt will be lengthened in different amounts in the oven 1035, which is the super at the connection sites. This is because the cells will tend to fall in the longitudinal direction.

Method 800 of FIG. 17 includes distinct super cell curing and lamination steps, producing an intermediate super cell product. In contrast, in method 900 shown in FIG. 18, the super cell curing and lamination steps are combined. In step 910, conventionally sized solar cells (eg, 156 mm×156 mm or 125 mm×125 mm) are cut and/or cut to form narrow rectangular solar cell strips. The resulting solar cell strips can be selectively tested and sorted.

In step 915, the solar cell strips are arranged in a desired module configuration in a stratified structure comprising an encapsulant material, a transparent front (sun side) sheet and a back sheet. The solar cell strips are arranged as super cells with an uncured conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells in super cells (the conductive adhesive bonding material is, for example, inkjet Can be applied by printing or screen printing). The interconnects are arranged to electrically interconnect the uncured super cells in a desired configuration. The layered structure is, for example, the interconnected super cells arranged under the sun side on the first layer of the encapsulant on the glass substrate, the first layer of the encapsulant. And a second layer of the encapsulant on the layer of super cells, and a back sheet on the second layer of the encapsulant. Any other suitable arrangement can also be used.

In lamination step 920, heat and pressure are applied to the layered structure to cure the conductive adhesive bonding material in the super cells and form a cured laminate structure. The conductive adhesive bonding material used to bond the interconnects to the super cells can also be cured at this stage.

In one variation of method 900, the conventionally sized solar cells are separated into solar cell strips, and then the conductive adhesive bonding material is applied to each individual solar cell strip. In an alternative variant, the conductive adhesive bonding material is applied to the conventional sized solar cells prior to separation of the solar cells into solar cell strips. For example, a plurality of conventionally sized solar cells can be placed on a large template, a conductive adhesive bonding material can then be dispersed on the solar cells, and the solar cells are then simultaneously large fixtures (fixture) can be separated into solar cell strips. The resulting solar cell strips can then be transported as a group and arranged in a desired modular configuration as described above.

As described above, in some variations of methods 800 and 900, the conductive adhesive bonding material is applied to the conventional sized solar cells prior to separating the solar cells into solar cell strips. The conductive adhesive bonding material does not cure (ie, is still “wet”) when the conventional sized solar cell is separated to form the solar cell strips. In some of these variations, the conductive adhesive bonding material is applied to a conventional sized solar cell (eg, by inkjet or screen printing), after which the solar cell is cut so that the laser forms the solar cell strips. It is used for scribe lines on the solar cell that define the locations to be, and then the solar cell is cut along the scribe lines. In these variations, the laser power and/or distance between the scribe lines and the adhesive bonding material can be selected to avoid incidentally curing or partially curing the conductive adhesive bonding material with heat from the laser. have. In other variations, a laser is used on scribe lines on a conventional sized solar cell to define where the solar cell is cut to form the solar cell strips, after which the conductive adhesive bonding material is applied to the solar cell. (Eg, by inkjet or screen printing), after which the solar cell is cut along the scribe lines. In the latter variants, it may be desirable to implement the step of applying the conductive adhesive bonding material without incidentally cutting or breaking the scribed solar cell during this step.

Referring again to FIGS. 20A-20C, FIG. 20A schematically illustrates a side view of an exemplary device 1050 that can be used to cut scribed solar cells to which a conductive adhesive bonding material has been applied (of the conductive adhesive bonding material). Scribing and application could happen in any order). In such a device, the scribed conventionally sized solar cell 45 to which the conductive adhesive bonding material has been applied is conveyed by a perforated moving belt 1060 over a portion of the curve of the vacuum manifold 1070. As the solar cell 45 passes over the portion of the curve of the vacuum manifold, the vacuum applied through the perforations in the belt pulls the bottom surface of the solar cell 45 against the vacuum manifold, and accordingly the sun Bend the battery. The radius of curvature R of the curved portion of the vacuum manifold can be selected such that the solar cell 45 bent in this way cuts the solar cell along the scribe lines. Advantageously, the solar cell 45 can be cut by this method without contacting the top surface of the solar cell 45 to which the conductive adhesive bonding material has been applied.

If it is desired that the cutting begins at one end of the scribe line (i.e., at one edge of the solar cell 45), this is for example the curve of the vacuum manifold, one end of each scribe line before the other end. The scribe lines can be implemented with the device 1050 of FIG. 20A by arranging the scribe lines to be oriented at an angle θ with respect to the vacuum manifold to reach a portion of. As shown in FIG. 20B, for example, the solar cells may be oriented with their scribe lines oblique to the direction of travel of the belt and a manifold oriented perpendicular to the direction of travel of the belt. As another example, FIG. 20C shows their scribe lines orthogonal to the direction of travel of the belt and cells oriented to an oblique manifold.

Any other suitable device can also be used to cut scribed solar cells to which the conductive adhesive bonding material has been applied to form strip solar cells with a pre-applied conductive adhesive bonding material. Such a device may, for example, use rollers to apply pressure to the top surface of the solar cell to which the conductive adhesive bonding material has been applied. In these cases, it is preferred that the rollers only contact the top surface of the solar cell in areas where a conductive adhesive bonding material has not been applied.

In some variations, solar modules include super cells arranged in rows on a white or otherwise reflective back sheet, such that some of the solar radiation that is not initially absorbed by the solar cells and passes through generates electricity. So that it can be reflected back to the solar cells by the back sheet. The reflective back sheet can be seen through the gaps between the rows of super cells, which will result in a solar module appearing to have rows of parallel and bright (eg, white) lines running across its front face. You can. Referring to Figure 5b, for example, parallel and dark lines between the rows of super cells 100 may appear as white lines when the super cells 100 are arranged on a white back sheet. have. This may be aesthetically unsatisfactory for some uses of the solar modules on the roof tops, for example.

Referring to FIG. 21, in order to improve the aesthetic appearance of the solar module, some variations are dark stripes 1105 positioned at positions corresponding to a gap between the rows of super cells arranged on the back sheet. A white back sheet 1100 including) is employed. The stripes 1105 are wide enough so that the white portions of the back sheet are not visible through the gaps between the rows of super cells in the assembled module. This reduces the visual contrast between the super cells and the back sheet when perceived by a person with normal color vision. The resulting module includes a white back sheet, but may have a front surface similar in appearance to the modules illustrated in FIGS. 5A-5B, for example. Dark stripes 1105 can be created, for example, with lengths of dark tape or in any other suitable manner.

As previously mentioned, shading of individual cells in solar modules can create'hot spots', in which case the power of the cells not shaded is lost within the shaded cell. This dissipated power creates local temperature spikes that can degrade the modules.

To minimize the potential severity of these hot spots, bypass diodes have traditionally been inserted as part of the module. The largest number of cells between bypass diodes is set to limit the maximum temperature of the module and prevent irreparable damage to the module. Standard layouts for silicon cells can utilize a bypass diode in all 20 or 24 cells, which are numbered by the typical breakdown voltage of the silicon cells. In certain embodiments, the breakdown voltage may be in the range of about 10V-50V. In certain embodiments, the breakdown voltage may be about 10V, about 15V, about 20V, about 25V, about 30V, or about 35V.

According to embodiments, shingling of the strips of the cut solar cells with thin thermally conductive adhesives enhances the thermal contact between the solar cells. This improved thermal contact allows for a higher degree of thermal diffusion than traditional interconnect technologies. This thermal thermal diffusion design based on shingling allows for a string of solar cells longer than twenty-four (or less) solar cells per bypass diode, limited to conventional designs. This relaxation of the requirement for frequent bypass diodes according to the thermal diffusion made possible by shingling according to embodiments can provide one or more advantages. For example, it is possible to create module layouts of various solar cell string lengths that are not hidden as needed to be provided for a large number of bypass diodes.

According to embodiments, thermal diffusion is implemented by maintaining physical and thermal coupling with the adjacent cells. This allows for sufficient heat dissipation through the combined linkage site.

In certain embodiments, this connection site is maintained at a thickness of about 200 micrometers or less, and proceeds to the length of the solar cell in a segmented pattern. According to an embodiment, the connection site is about 200 micrometers or less, about 150 micrometers or less, about 125 micrometers or less, about 100 micrometers or less, about 90 micrometers or less, about It may have a thickness of 80 micrometers or less, about 70 micrometers or less, about 50 micrometers or less, or about 25 micrometers or less.

Accurate adhesive curing treatment can be important in ensuring that reliable connection sites are maintained while maintaining thickness to promote thermal diffusion between the combined cells.

Allowing longer strings (eg, 24 or more cells) to proceed provides flexibility in the design of solar cells and modules. For example, certain embodiments may utilize strings of cut solar cells assembled in a shingled manner. These configurations can utilize significantly more cells per module than conventional modules.

Without the thermal diffusion properties, a bypass diode can be required for all 24 cells. When the solar cells are cut to 1/6, the bypass diodes per module can be six times that of a conventional module (comprising three uncut cells) and up to 18 diodes in total can be added. have. Thus, thermal diffusion provides a significant reduction in the number of bypass diodes.

Moreover, for all bypass diodes, bypass circuitry is required to complete the bypass electrical path. Each diode requires two interconnect points and a conductor routed to connect them to these interconnect points. This results in complex circuitry and is a significant source of cost for the standard layout costs associated with assembling solar modules.

In contrast, thermal diffusion technology requires only one bypass diode per module, or even bypass diodes. Such a configuration simplifies the module assembly process, and allows simple automation mechanisms to perform the layout manufacturing steps.

Avoiding the need for bypass protects all 24 cells, thus making the cell module easier to manufacture. Complex tap-outs in the center of the module and long parallel connections for bypass circuitry are avoided. This thermal diffusion is achieved by creating long shingled strips of cells that run the width and/or length of the module.

In addition to providing thermal thermal diffusion, shingling according to embodiments also reduces the amount of current lost in the solar cell, thereby enabling improved hot spot performance. Specifically, the amount of current lost in the solar cell during hot spot conditions depends on the cell area.

Since shingling can cut cells into smaller areas, the amount of current through one cell in hot spot conditions is a function of the cut dimensions. During hot spot conditions, current passes through the lowest resistance path, which is typically a cell-level defect interface or grain boundary. It is advantageous to reduce this current and minimize reliability failure under hot spot conditions.

22A shows a top view of a conventional module 2200 utilizing traditional ribbon connections 2201 under hot spot conditions. Here, shading 2202 on one cell 2204 causes heat to be localized to this single cell.

In contrast, FIG. 22B also shows a top view of a module that utilizes thermal diffusion under hot spot conditions. Here, the shading 2250 on the cell 2522 generates heat inside the cell. However, this heat spreads to other electrically and thermally coupled cells 2254 in the module 2256.

It is further noted that the benefit of reducing the lost current is greatly increased for polycrystalline solar cells. These polycrystalline cells are known to operate poorly under hot spot conditions due to the high level of defect interfaces.

As indicated above, certain embodiments may employ shingling of chamfered cut cells. In these cases, there is a thermal diffusion advantage reflected along the bonding line between the adjacent cell and each cell.

This maximizes the binding length of each overlapping connection site. Maximizing this length can ensure that optimum thermal diffusion is achieved, since the bonding link site is the primary interface for cell-to-cell thermal diffusion.

23A shows an example of a super cell string layout 2300 with chamfered cells 2302. In this configuration, the chamfered cells are oriented in the same direction, so that the conduction paths of all the coupled connections are the same (125 mm).

Shading 2306 on one cell 2304 results from the reverse biasing of these cells. Heat spreads to adjacent cells. The non-engaged ends 2304a of the chamfered cell become hottest due to the longer conduction length to the next cell.

23B shows another example of a super cell string layout 2350 with chamfered cells 2352. In this configuration, the chamfered cells are oriented in different directions, and some of the long edges of the chamfered cells face each other. This results in conduction passages in the combined connection of two lengths of 125 mm and 156 mm.

When cell 2354 undergoes shading 2356, the configuration of FIG. 23B shows improved thermal diffusion along the longer bond length. 23B shows the thermal diffusion in the super cell with chamfered cells thus facing each other.

The previous discussion focused on assembling multiple solar cells (which can be cut solar cells) in a shingled manner on a common substrate. This results in the formation of a module with a single electrical interconnect-junction box (or j-box).

However, in order to collect a sufficient amount of solar energy to be useful, the installation typically includes a number of these modules that are assembled together. According to embodiments, a plurality of solar cell modules may also be assembled in a shingled manner to increase the area efficiency of the array.

In certain embodiments, the module may feature a top conductive ribbon facing the direction of solar energy and a bottom conductive ribbon facing away from the direction of solar energy.

The lower ribbon is embedded under the cells. Therefore, it does not block the incident light and does not adversely affect the area efficiency of the module. In contrast, the top ribbon is exposed, can block incoming light, and adversely affects efficiency.

According to embodiments, the modules themselves may be shingled such that the top ribbon is covered by neighboring modules. 24 shows a simplified cross-sectional view of such an arrangement 2400 where the end portion 2401 of the adjacent module 2402 contributes to overlap the top ribbon 2404 of the instance module 2406. do. Each module itself includes a plurality of shingled solar cells 2407.

The lower ribbon 2408 of the instant module 2406 is embedded. It is located on the raised side of the instant shingled module to overlap the next adjacent shingled module.

This shingled module configuration could also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of module elements that may be located within overlapping regions may include, but are not limited to, junction boxes (j-boxes) 2410 and/or bus ribbons.

25 shows another embodiment of a shingled module configuration 2500. Here, the j-boxes 2502, 2504 of each adjacent shingled modules 2506, 2508 are arranged in a row 2510 to implement an electrical connection between them. This simplifies the configuration of the array of shingled modules by removing the wires.

In certain embodiments, the j-boxes can be reinforced and/or combined with additional structural standoffs. Such a configuration could create an integrated inclined module roof mount rack solution, where the dimensions of the junction box determine the slope. Such an implementation can be particularly useful when the array of shingled modules is mounted on a flat roof.

Where the modules include a glass substrate and a glass cover (glass-glass modules), the modules are the total module length (and thus the exposed length L resulting from the shingling) without additional frame members. It could be used by shortening. This shortening allowed the modules of the tilted array to withstand the expected physical loads (eg, 5400 Pa snow load limit) without breaking under the pressure.

The use of super cell structures comprising a plurality of individual solar cells assembled in a shingled manner easily accommodates changing the length of the module to meet a specific length defined by physical loads and other requirements. The point is emphasized.

FIG. 26 shows a view of the back side (shielding) of a solar module illustrating an exemplary electrical interconnection of front (sun side) terminal electrical contacts of a shingled super cell to a junction box on the rear side of the module. The front terminal contacts of the shingled super cell may be located adjacent to the edge of the module.

26 shows the use of a flexible interconnect 400 in electrical contact with the front end contact of the super cell 100. In the illustrated example, a flexible interconnect 400 runs parallel to the end of the super cell 100 and adjoins ribbon portions 9400A and the front metallization pattern of the end solar cells in the super cell to which they are conductively coupled ( Fingers (9400B) extending orthogonally to the ribbon portion to contact (not shown). A ribbon conductor 9410 that is conductively coupled to interconnect 9400 provides electrical components (e.g., bypass diodes in a junction box and/or electrical components) on the back of the solar module where the super cell is part of interconnect 9400. Or through the super cell 100 to electrically connect to the module terminals). An insulating film 9420 may be disposed between the conductor 9410 and the edges and back surfaces of the super cell 100 to electrically insulate the ribbon conductor 9410 from the super cell 100.

The interconnect 400 can be selectively folded around the edge of the super cell such that the ribbon portion 9400A lies behind the super cell or partially behind the super cell. In these cases, an electrical insulating layer is typically provided between the edge 400 and the edges of interconnect 400 and super cell 100.

Interconnect 400 may be die cut from a conductive sheet, for example, to reduce stress perpendicular to and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell, or It can be selectively patterned to increase its mechanical compliance, both orthogonal and parallel to the edges of the super cell to accommodate. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of the interconnect 400 and its coupling to the super cell should be sufficient for connection to the super cell to withstand the stress resulting from CTE mismatch during the lamination process described in more detail below. Interconnect 400 may be coupled to a super cell with a mechanically flexible and electrically conductive bonding material, as described above, for example, for use in bonding superimposed solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edge of the super cell resulting from a mismatch between the thermal expansion coefficient of the electrically conductive bonding material or the interconnect and the super cell thermal expansion coefficient, or To accommodate, rather than a continuous line extending substantially the length of the edge of the super cell, separate locations along the edge of the super cell (eg, locations of separate contact pads on the end solar cell) (Corresponding).

Interconnect 400 may be cut from a thin copper sheet, for example a thin copper sheet, and super cells 100 are formed from solar cells having smaller areas than standard silicon solar cells, and thus are more conventional than When operating at low currents, it can be thinner than conventional conductive interconnects. For example, the interconnects 400 can be formed of a copper sheet having a thickness of about 50 microns to about 300 microns. The interconnect 400 can be thin enough to accommodate stresses that are orthogonal and parallel to the edges of the super cell resulting from mismatches between the CTE of the interconnect and the CTE of the super cell without being patterned as described above. The ribbon conductor 9410 may be formed of, for example, copper.

FIG. 27 shows views of the back side (shielding) of a solar module illustrating an exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are For and to the junction box on the rear side of the module. The front terminal contacts of the shingled super cells may be located adjacent to the edge of the module.

27 shows the use of two flexible interconnects 400 that are in electrical contact with the front terminal contacts of two adjacent super cells 100 as described above. A bus 9430 advancing parallel to the ends of the super cells 100 is conductively coupled to the two flexible interconnects to electrically connect the super cells in parallel. This plan can be extended to interconnecting additional super cells 100 in parallel if desired. The bus 9430 may be formed of a copper ribbon, for example, a copper ribbon.

Similar to that described above with respect to FIG. 26, interconnects 400 and bus 9430 are such that the ribbon portions 9400A and bus 9430 are placed behind the super cells or partially behind the super cells. Can be selectively folded around the edge of the field. In these cases, an electrical insulating layer is typically provided between the interconnects 400 and the edges and backs of the super cells 100 and between the bus 9430 and the edges and backs of the super cells 100. do.

FIG. 28 shows a view of the back side (shielding) of a solar module illustrating another exemplary electrical interconnection of two or more shingled super cells in parallel, wherein the front (solar side) terminal electrical contacts of the super cells are It is connected to each other and to a junction box on the rear side of the module. The front terminal contacts of shingled super cells may be located adjacent to the edge of the module.

28 shows the use of another exemplary flexible interconnect 9440 in electrical contact with the front end contact of the super cell 100. In this example, a flexible interconnect 9404 runs parallel to the end of the super cell 100 and adjoins ribbon portions 9440A, the front metallization pattern of the end solar cells in the super cell to which they are conductively coupled (shown) (9440B) orthogonally extending to the ribbon portion to contact the ribbon portion, and fingers 9410C orthogonal to the ribbon portion and extending behind the super cell. Fingers 9440C are conductively coupled to the bus 9450. The bus 9450 runs parallel and adjacent to the end of the super cell 100 along the rear surface of the super cell 100, and can similarly be electrically connected and thus super adjacent to connect the super cells in parallel. It can be extended to overlap cells. A ribbon conductor 9410 conductively coupled to the bus 9450 connects the super cells to electrical components on the back side of the solar module (eg, bypass diodes and/or module terminals in a junction box). Electrically interconnect. Electrical insulating layers 9420 are between fingers 9440C and the edges and rear surfaces of the super cell 100, between the bus 9450 and the rear surface of the super cell 100, and the ribbon conductor 9410 and the It may be provided between the rear surface of the super cell 100.

Interconnect 9440 may be formed of a conductive sheet, for example, to reduce or accommodate stress that is orthogonal and parallel to the edge of the super cell resulting from a mismatch between the CTE of the interconnect and the CTE of the super cell. In order to do so it can be selectively patterned to increase its mechanical compliance, both orthogonal and parallel to the edges of the super cell. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of the interconnect 9404 and its coupling to the super cell should be sufficient for connection to the super cell to withstand the stress resulting from CTE mismatch during the lamination process described in more detail below. Interconnect 9440 may be coupled to the super cell with a mechanically flexible and electrically conductive bonding material, as described above, for example, for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces or accommodates stress parallel to the edge of the super cell resulting from a mismatch between the thermal expansion coefficient of the electrically conductive bonding material or the interconnect and the thermal expansion coefficient of the super cell. Separate locations along the edge of the super cell (eg, corresponding to locations of separate contact pads on the end solar cell) rather than in a continuous line extending substantially the length of the edge of the super cell to Can only be located at

Interconnect 9440 can be cut from a thin copper sheet, for example, and super cells 100 are formed from solar cells having smaller areas than standard silicon solar cells and thus with lower currents than in the conventional case. When in operation it can be thinner than conventional conductive interconnects. For example, interconnects 9440 may be formed of a copper sheet having a thickness of about 50 microns to about 300 microns. Interconnect 9440 may be thin enough to accommodate stresses that are orthogonal and parallel to the edges of the super cell resulting from mismatches between the CTE of the interconnect and the CTE of the super cell without being patterned as described above. The bus 9450 may be formed of, for example, a copper sheet.

Fingers 9440C may be coupled to bus 9450 after fingers 9440B are coupled to the front of super cell 100. In these cases, fingers 9440C may be bent orthogonally to the super cell 100, for example, away from the rear of the super cell 100 when they are coupled to the bus 9450. Thereafter, the fingers 9440C may be bent to progress along the rear surface of the super cell 100 as shown in FIG. 28.

29 shows a partial cross-sectional view and a perspective view of two super cells illustrating the use of a flexible interconnect between overlapping ends of adjacent super cells to electrically connect the super cells in series and provide an electrical connection to the junction box. do. FIG. 29A shows an enlarged view of the area of interest in FIG. 29.

29 and 29A provide electrical connections to one front end contact of the super cells and to the rear end contact of the other super cell, so that the two super cells 100 are connected in series to connect the super cells in series. Illustrates the use of an exemplary flexible interconnect 2960 partially interposed and electrically interconnected between overlapping ends of the. In the illustrated example, interconnect 2960 is obscured in the field of view from the front of the solar module by the top of the two overlapping solar cells. In another variation, adjacent ends of the two super cells do not overlap, and a portion of the interconnect 2960 connected to one front end contact of the two super cells can be seen from the front side of the solar module. Optionally, in these variations some of the interconnects that would otherwise be visible from the front of the module are covered to reduce the visual contrast between the interconnects and the super cells when perceived by a person with normal color vision. Or it can be colored (eg darkened). Interconnect 2960 is parallel to the adjacent edges of the two super cells beyond the side edges of the super cells to electrically connect the pair of super cells in parallel with similarly arranged pairs of super cells in adjacent columns. Can be extended.

Ribbon conductor 2970 electrically connects adjacent ends of the two super cells to electrical components on the back side of the solar module (eg, bypass diodes and/or module terminals in a junction box). As illustrated, it may be conductively coupled to the interconnect 2960. In another variant (not shown), the ribbon conductor 2970 may be electrically connected to one rear contact of the overlapping super cells away from their overlapping ends instead of being conductively connected to the interconnect 2960. have. This configuration can also provide a hidden tap for one or more bypass diodes or other electrical components on the back side of the solar module.

Interconnect 2960 may be die cut selectively from a conductive sheet, for example, and stress perpendicular and parallel to the edges of the super cells resulting from a mismatch between the CTE of the interconnect and the CTE of the super cells. It can be selectively patterned to increase its mechanical compliance, both orthogonal and parallel to the edges of the super cells, to reduce or accommodate. Such patterning may include, for example, slits, slots (as shown), or holes. The mechanical compliance of the flexible interconnect and its combinations to the super cells should be sufficient for the interconnected super cells to withstand the stress resulting from a CTE mismatch during the lamination process described in detail below. The flexible interconnect can be coupled to the super cells with a mechanically flexible and electrically conductive bonding material as described above, for example, for use in bonding overlapping solar cells. Optionally, the electrically conductive bonding material reduces stress parallel to the edges of the super cells resulting from a mismatch between the thermal expansion coefficient of the electrically conductive bonding material or the interconnect and the thermal expansion coefficients of the super cells, or It may be located only at separate locations along the edges of the super cells rather than as a continuous line extending substantially the length of the edges of the super cells to accommodate. Interconnect 2960 can be cut, for example, from a thin copper sheet.

Embodiments may include one or more features described in United States Published Patent Publications 2014/0124013 and United States Published Patent Publications 2014/0124014, the disclosures of which are all incorporated herein by reference for all purposes. Can.

Disclosed herein are high efficiency photovoltaic modules comprising silicon solar cells arranged in a shingled manner and electrically connected in series to form super cells, wherein the super cells are physically parallel columns within the photovoltaic module. Are arranged. The super cells may, for example, basically have lengths that extend over the entire length or width of the solar module, or two or more super cells may be arranged end to end in a row. This arrangement hides the electrical interconnections of the solar cell to the solar cell, and thus can be used to create a visually attractive solar module with little or no contact between adjacent series-connected solar cells.

A super cell may have any number of solar cells, including, for example, silicon solar cells greater than or equal to 100 in some embodiments, at least nineteen solar cells, and in certain embodiments. Electrical contacts at intermediate positions along the super cell may be desired to electrically divide the super cell into two or more series connected segments while maintaining a physically continuous super cell. These electrical connections are one or more in the super cell to provide electrical tapping points concealed in the field of view from the front of the solar module and thus referred to herein as “hidden taps”. The arrangements made for the back contact pads of the above silicon solar cells are disclosed. The hidden tab is the electrical connection between the back of the solar cell and the conductive interconnect.

Also provided herein are flexible interconnects for electrically interconnecting front super cell terminal contact pads, rear super cell terminal contact pads, or hidden tab contact pads to other solar cells or other electrical components within the solar module. Use begins.

In addition, the present specification includes the use of an electrically conductive adhesive to bond flexible interconnects to the super cells with mechanically stiff bonds that force the flexible interconnects to accommodate the mismatch of thermal expansion between the flexible interconnects and the super cells. Combined, electrical coupling adjacent solar cells directly to each other in a super cell to provide mechanically flexible and electrically conductive bonds that accommodate the mismatch of thermal expansion between the super cells and the glass front sheet of the solar module. Thus, the use of a conductive adhesive is disclosed. This can avoid damage to the photovoltaic module which otherwise could occur as a result of the thermal cycle of the photovoltaic module.

As described further below, electrical connections to hidden tap contact pads electrically connect and/or limit segments of the super cell to corresponding segments of one or more super cells in adjacent columns. Although not intended to be used to provide electrical connections to the solar module circuit for a variety of applications including power optimization (eg bypass diodes, AC/DC microinverters, DC/DC converters) and reliability applications. have.

The use of hidden tabs as described above can be combined with the hidden cell-to-cell connections to substantially enhance the aesthetic appearance of the solar module by providing substantially all the rear appearance of the solar module. A larger portion of the surface area of the module may be filled with active regions of the solar cells, thereby increasing the efficiency of the solar module.

Referring now again to the figures for a more detailed understanding of the solar modules described herein, FIG. 1 is a shingled manner with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100. It shows a cross-sectional view of a string of solar cells 10 connected in series arranged in. Each solar cell 10 includes a semiconductor diode structure and electrical contacts to the semiconductor diode structure where current generated in the solar cell 10 can be provided to an external load when illuminated by light.

In the examples described herein, each solar cell 10 is a rectangular crystalline silicon solar cell with front (sun-side) and back (light-shielding) metallization patterns that provide electrical contact to opposite sides of the np junction. And the front metallization pattern is disposed on the n-type conductive semiconductor layer, and the rear metallization pattern is disposed on the p-type conductive semiconductor layer. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements can be used where appropriate. For example, the front (solar side) metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shielding side) metallization pattern may be disposed on an n-type conductive semiconductor layer. have.

Referring again to FIG. 1, adjacent solar cells 10 in the super cell 100 are electrically conductive to electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell. The bonding material directly conductively bonds to each other within the region where they overlap. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

31AA and 31A are overlapping ends of two super cells 100 to provide electrical connections to one front end contact of the super cells and the rear end contact of the other super cells to interconnect the super cells in series. The use of an exemplary flexible interconnect 3160 that is partially interposed and electrically interconnected between the fields is illustrated. In the illustrated example, interconnect 3160 is hidden in view from the front of the solar module by the top of the two overlapping solar cells. In another variation, the adjacent ends of the two super cells do not overlap, and a portion of the interconnect 3160 connected to one front end contact of the two super cells can be seen from the front side of the solar module. Optionally, in these variations some of the interconnects that would otherwise be visible from the front of the module are covered to reduce the visible contrast between the interconnects and the super cells when perceived by a person with normal color vision. It can be colored or can be colored (eg darkened). Interconnect 3160 is parallel to the adjacent edges of the two super cells beyond the lateral edges of the super cells to electrically connect the pairs of super cells in parallel with the well arranged pairs of super cells in adjacent rows. Can be extended.

Ribbon conductor 3170 is configured to electrically connect adjacent ends of the two super cells to electrical components on the back side of the solar module (eg, bypass diodes and/or module terminals in a junction box). As illustrated, the interconnect 3160 may be electrically connected. In another variant (not shown), the ribbon conductor 3170 is electrically connected to one rear contact of the overlapping super cells away from their overlapping ends instead of being electrically coupled to the interconnect 3160. Can. This configuration can also provide a hidden tab for one or more bypass diodes or other electrical components on the back side of the solar module.

FIG. 2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly configured solar module may include more or fewer rows of super cells of this side length than shown in this example. In other variations, the super cells can each have a length approximately equal to the length of the short side of the rectangular solar module, and parallel with their long sides oriented parallel to the short sides of the module. It can be arranged in one column. In still other arrangements, each row can include two or more super cells that are electrically connected in series. The modules can have, for example, short sides having a length of about 1 meter and long sides having a length of about 1.5 meters to about 2.0 meters, for example. Any other suitable shapes (eg square) and dimensions for the solar modules can also be used.

In this example each super cell contains 72 rectangular solar cells each having a width approximately equal to 1/6 of the width of a 156 mm square or pseudo square wafer. Any other suitable number of rectangular solar cells, any other suitable dimensions, may also be used.

Solar cells with long and narrow aspect ratios and smaller areas than in the case of a standard 156mm×156mm solar cell are advantageously employed to reduce I ² R resistive power losses in the solar cell modules disclosed herein as illustrated. Can be. In particular, the reduced area of solar cells 10 compared to standard sized silicon solar cells reduces the current generated within the solar cell, and directly reduces the resistive loss in the solar cell and the series-connected string of these solar cells. Decreases.

The hidden tab on the back side of the super cell can be made using, for example, an electrical interconnect that is conductively connected to one or more hidden tab contact pads located at the edge portion of the back metallization pattern of the solar cell. . Optionally, the hidden tabs substantially run the entire length of the solar cell (orthogonal to the long axis of the super cell) and a plurality of hidden tabs distributed along the length of the solar cell within the back metallization pattern. It can be implemented using an interconnect that is conductively coupled to the contact pads.

31A illustrates an exemplary solar cell backside metallization pattern 3300 suitable for use with edge-connected hidden tabs. The metallization pattern is a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to adjacent edges of the long side of the back side of the solar cell, and each short side of the back side of the solar cell. And silver hidden tab contact pads 3320 arranged parallel to one adjacent edge of the sides. When the solar cell is placed in a super cell, the contact pads 3315 are overlapped by and coupled directly to the front of an adjacent rectangular solar cell. The interconnect can be conductively coupled to one or the other of the hidden tab contact pads 3320 to provide a hidden tab to the super cell (two such interconnects can be employed to provide two hidden tabs if desired). have).

In the arrangement shown in FIG. 31A, the current flow for the hidden tab is through the back cell metallization and is generally parallel to the long sides of the solar cell up to the interconnect assembly point (contact 3320). To enable current flow along this passage, the back metallized sheet resistance is preferably less than or equal to about 5 ohms per square, or less than or equal to about 2.5 ohms per square.

31B shows another exemplary solar cell back metallization pattern 3301 suitable for use with hidden tabs employing a bus-like interconnect along the length of the back side of the solar cell. The metallization pattern comprises a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel and adjacent to the edge of the long side of the back of the solar cell, and the long sides of the solar cell. And a plurality of silver hidden tab contact pads 3325 arranged in parallel rows and roughly centered on the back side of the solar cell. An interconnect running substantially in the full length of the solar cell can be conductively coupled to hidden tab contact pads 3325 to provide a hidden tab for the super cell. The current flow to the hidden tab is primarily through the bus-like interconnect, making the conductivity of the back metallization pattern less important for the hidden tab.

The location and number of hidden tab contact pads to which the hidden tab interconnect is coupled on the back of the solar cell affects the length of the current path through the back metallization of the solar cell, the hidden tab contact pads, and the interconnect. . Accordingly, the arrangement of the hidden tap contact pads may be selected to minimize resistance to current collection in the current path and through the hidden tap interconnect. In addition to the configurations shown in FIGS. 31A-31B (and FIG. 31C discussed below), suitable hidden tap contact pad arrangements may include, for example, a two-dimensional array and columns running orthogonally to the long axis of the solar cell. Can. In the latter case, the row of hidden tab contact pads may be located adjacent to the short edge of the first solar cell, for example.

31C shows another exemplary solar cell back metallization pattern 3303 suitable for use with edge-connected hidden tabs or hidden tabs employing a bus-like interconnect along the length of the back side of the solar cell. The metallization pattern is a continuous copper contact pad 3315 arranged parallel and adjacent to the edge of the long side of the back surface of the solar cell, a plurality of copper fingers connected to and extending perpendicular to the contact pad 3315 ( 3317), and a continuous copper bus hidden tab contact pad 3325 running parallel to the long sides of the solar cell and approximately centered on the back side of the solar cell. An edge-connected interconnect can be coupled to the end of the copper bus 3325 to provide a hidden tap to the super cell (either of the copper bus 3325 to provide two hidden taps if two such interconnects are desired). Can be employed at the end of). Optionally, an interconnect running substantially the entire length of the solar cell can be conductively coupled to the copper bus 3325 to provide a hidden tab to the super cell.

The interconnect employed to form the hidden tab may be joined to a hidden tab contact pad in the back metallization pattern by soldering, welding, conductive adhesive, or any other suitable method. For metallization patterns employing silver pads as illustrated in FIGS. 31A-31B, the interconnect may be formed of, for example, tin coated copper. Another approach is to make the hidden tab directly to the aluminum back contact 3310 with an aluminum conductor forming an aluminum-to-aluminum bond, which may be formed, for example, by electrical or laser welding, soldering, or conductive adhesive. In certain embodiments, the contacts can include annotation. In the cases described above, the back metallization of the solar cell could be deficient in silver contact pads (3320 (FIG. 31A) or 3325 (FIG. 31B)), but the edge-connected or bus-like aluminum interconnect It could be coupled to the aluminum (or tin) contact 3310 at locations corresponding to these contact pads.

Differential thermal expansion between the hidden tab interconnects (or interconnects to the front rear super cell terminal contacts) and silicon solar cells and consequent stress on the solar cell and the interconnect may degrade the performance of the solar module. This can lead to cracking and other failure modes. Accordingly, it is preferred that the hidden tabs and other interconnects are configured to accommodate this differential expansion without significant stress development. The interconnects are formed of, for example, high ductility materials (eg, soft copper, very thin copper sheets), or materials of low thermal expansion coefficient (eg, Kovar, Invar ( Invar) or other low thermal expansion iron-nickel alloys), or formed of materials having a coefficient of thermal expansion approximately equal to that of silicon, or a slit to accommodate differential thermal expansion between the interconnect and the silicon solar cell. These differentials, such as kinks, jogs, or dimples, and/or include geometric thermal expansion features in the plane, such as fields, slots, holes, or truss structures. By employing out-of-plane geometric features to accommodate thermal expansion, stress and thermal expansion relief can be provided. Some of the interconnects that are coupled to the hidden tab contact pads (or to the super cell front or rear terminal contact pads as described below) to increase the flexibility of the interconnects, for example, about 100 microns Or less, about 50 microns or less, about 30 microns or less, or about 25 microns or less.

Referring again to FIGS. 7A, 7B-1 and 7B-2, these figures are denoted by reference numerals 400A-400U, employing stress-relieving geometric features and use as interconnects for hidden taps. Some example interconnect configurations are shown above or that may be suitable for electrical connections to front or rear super cell terminal contacts. These interconnects typically have approximately the same length as the lengths of the long sides of the rectangular solar cell to which they are joined, but they can have any other suitable length. The exemplary interconnects 400A-400T shown in FIG. 7A employ stress relief features in various planes. The exemplary interconnect 400U shown in the in-plane (xy) view of FIG. 7B-1 and the out-of-plane (xz) view of FIG. 7B-2 is an out-of-plane stress-removal feature that bends with a thin metal ribbon ( 3705). Bends 3705 reduce the apparent tensile stiffness of the metal ribbon. The bends cause the ribbon material to bend locally instead of only stretching when the ribbon material is under tension. For thin ribbons, this can significantly reduce the apparent tensile stiffness, for example by 90% or more. The exact amount of apparent tensile stiffness reduction depends on several factors including the number of bends, the geometry of the bends and the thickness of the ribbon. Interconnect can also be employed by combining in-plane and out-of-plane stress relief features.

37A-1 to 38B-2 employ some geometric features that eliminate in-plane and/or out-of-plane stress discussed further below and may be suitable for use as edge-connected interconnects for hidden taps. Showing the interconnect configurations.

To reduce or minimize the number of conductor runs required to connect each hidden tap, a hidden tap interconnect bus can be utilized. This approach uses a hidden tap interconnect to connect adjacent super cell hidden tap contact pads to each other (the electrical connection is typically positive to positive or negative to negative, ie, the same polarity at each end).

For example, FIG. 32 substantially conducts the entire length of the solar cell 10 in the first super cell 100, and is conductively coupled to the hidden tab contact pads 3325 arranged as shown in FIG. 31B. To the first hidden tab interconnect 3400, and to the entire length of the corresponding solar cell in the super cell 100 in the adjacent column, and to the hidden tab contact pads 3325 arranged as shown in FIG. 31B. Similarly, a second hidden tab interconnect 3400 is conductively coupled. The two interconnects 3400 are arranged together and are optionally adjacent or overlapping, can be conductively coupled to each other, or are otherwise electrically connected to form a bus interconnecting two adjacent super cells. This plan can be extended across additional rows of super cells (eg, all rows) to form a parallel segment of the solar module that includes segments of several adjacent super cells if desired. FIG. 33 shows a perspective view of a portion of the super cell from FIG. 32.

35 shows that super cells in adjacent columns cross the gap between the super cells and are conductively connected to a hidden tap contact pad 3320 on one super cell and another hidden tap contact pad 3320 on the other super cell. It shows an example having contact pads which are interconnected by a short interconnect 3400 and arranged as shown in FIG. 32A. FIG. 36 is a short interconnect crossing the gap between two super cells in adjacent rows, the end of the central copper bus portion of the back metallization on one super cell and the central copper bus portion of the back metallization of the other super cell A similar arrangement is shown with a copper back metallization that is conductively coupled to the adjacent end of and constructed as shown in FIG. 31C. In both examples, the interconnection schemes can be extended over additional rows of super cells (eg, all rows) to form a parallel segment of the solar module, including segments of several adjacent super cells, if desired. have.

37A-1 to 37F-3 show in-plane (xy) and out-of-plane (xz) views of exemplary short hidden tap interconnects 3400 that include planar stress relief features 3405 ( The xy plane is the plane of the solar cell back metallization pattern). In the examples of FIGS. 37A-1 to 37E-2, each interconnect 3400 includes tabs 3400A, 3400B located on opposite sides of the stress relief features in one or more planes. The stress relief features in the exemplary plane include arrangements of one, two or more hollow diamond shapes, zig-zags and arrangements of one, two, or more slots.

The term “in plane stress relieving feature” as used herein may also refer to the thickness or ductility of the interconnect or a portion of the interconnect. For example, the interconnect 3400 shown in FIGS. 37F-1 to 37F-3 may be less than or equal to, for example, a straight, flat length thin copper ribbon or, for example, about 100 microns to increase the flexibility of the interconnect. , Copper foil having a thickness T in the xy plane less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns. The thickness T can be, for example, about 50 microns. The length L of the interconnect can be, for example, about 8 centimeters (cm), and the width W of the interconnect can be, for example, about 0.5 cm. 37F-3 and 37F-1 show front and back views of the interconnect in the x-y plane, respectively. The front surface of the interconnect faces the rear surface of the solar module. Since the interconnect can cross a gap between two parallel rows of super cells in a solar module, a portion of the interconnect can be seen through the gap from the front of the solar module. Optionally, this visible portion of the interconnect can be made black, for example, coated with a black polymer layer to reduce its visibility. In the illustrated example, the central portion 3400C of the front surface of the interconnect having a length L2 of about 0.5 cm is coated with a thin black polymer layer. Typically, L2 is greater than or equal to the width of the gap between super cell rows. The black polymer layer, for example, may have a thickness of about 20 microns. Such a thin copper ribbon interconnect can also optionally employ in-plane or out-of-plane stress relief features as described above. For example, the interconnect may include out-of-plane bends that relieve stress as described above with respect to FIGS. 7B-1 and 7B-2.

38A-1 to 38B-2 show in-plane (x-y) and out-of-plane (x-z) views of exemplary short hidden tap interconnects 3400 including out-of-plane stress relief features 3407. In the examples above, each interconnect 3400 includes tabs 3400A, 3400B located on opposite sides of one or more out-of-plane stress relief features. Exemplary non-planar stress relief features include arrangements of one, two or more bends, kinks, dimples, jogs, or ridges.

The types and arrangements of stress relief features illustrated in FIGS. 37A-1 to 37E-2 and 38A-1 to 38B-2 and the interconnect ribbon thickness described above with respect to FIGS. 37F-1 to 37F-3 are also Where appropriate, long hidden tab interconnects as described above and super cell back or front terminal contacts may be employed in the interconnects. The interconnect can include both in-plane and out-of-plane stress relief features in combination. The in-plane and out-of-plane stress relief features are designed to reduce or minimize the strain and stress effects on the solar cell connection site, thus creating highly reliable and elastic electrical connections.

39A-1 and 39A-2 show example configurations for short hidden tap interconnects with cell contact pad alignment and super cell edge alignment features to enable automation, ease of manufacture and placement accuracy. 39B-1 and 39B-2 show example configurations for short hidden tap interconnects with asymmetric tap lengths. These asymmetric interconnects can be used in opposing orientations such that overlap of conductors running parallel to the long axis of the super cells is avoided (see discussion of FIGS. 42A-42B below).

Hidden tabs as described herein can form the necessary electrical connections within the module layout to provide the desired module electrical circuit. Hidden tap connections can be made, for example, at intervals of 12, 24, 36 or 48 solar cells along the super cell, or any other suitable spacing. The spacing between hidden taps can be determined based on application.

Each super cell may typically include a front terminal contact at one end of the super cell and a rear terminal contact at the other end of the super cell. In variations where the super cell traverses the length or width of the solar module, these terminal contacts are located adjacent to opposite edges of the solar module.

A flexible interconnect can be conductively coupled to the front or rear terminal contact of the super cell to electrically connect the super cell to other solar cells or electrical components within the module. For example, FIG. 34A shows a cross-sectional view of an exemplary solar module with an interconnect 3410 conductively coupled to a rear terminal contact at the end of the super cell. The rear terminal contact interconnect 3410 is less than or equal to about 100 microns, less than or equal to about 50 microns, orthogonal to, for example, orthogonal to the surface of the solar cell to be coupled, to increase the flexibility of the interconnect. It may be or include a thin copper ribbon or foil having a thickness less than or equal to 30 microns, or less than or equal to about 25 microns. The interconnect may have a width greater than or equal to, for example, about 10 mm in the plane of the surface of the solar cell in a direction orthogonal to the flow of current through the interconnect to improve conduction. As illustrated, a rear terminal contact interconnect 3410 may be placed behind the solar cells without a portion of the interconnect extending beyond the super cell in a direction parallel to the super cell row.

Similar interconnects can be used to connect the front terminal contacts. Optionally, to reduce the area of the front side of the solar module occupied by the front terminal interconnects, the front interconnect includes a thin and flexible portion directly coupled to the super cell and a thicker portion providing higher conductivity. can do. This arrangement can reduce the width of the interconnect needed to achieve the desired conductivity. The thicker portion of the interconnect may be, for example, an integral portion of the interconnect, or it may be a separate piece coupled to the thinner portion of the interconnect. For example, FIGS. 34B-34C show cross-sectional views of an exemplary interconnect 3410 conductively coupled to a front terminal contact at the end of each super cell. In both examples, the thin, flexible portion 3410A of the interconnect that is directly coupled to the super cell is orthogonal to the surface of the solar cell to be joined, less than or equal to about 100 microns, less than or equal to about 50 microns, or about And a thin copper ribbon or foil less than or equal to 30 microns or less than or equal to about 25 microns thick. The thicker copper ribbon portion 3410B of the interconnect is coupled to the thin portion 3410A to improve the conductivity of the interconnect. In FIG. 34B, an electrically conductive tape 3410C on the back side of the thin interconnect portion 3410A couples the thin interconnect portion to the super cell and thick interconnect portion 3410B. In FIG. 34C, a thin interconnect portion 3410A is bonded to a thick interconnect portion 3410B with an electrically conductive adhesive 3410D, and to the super cell with an electrically conductive adhesive 3410E. The electrically conductive adhesives 3410D and 3410E may be the same or different. The electrically conductive adhesive 3410E can be, for example, solder.

The solar modules described herein are laminates as shown in FIG. 34A with super cells and one or more encapsulant materials 3610 interposed between the transparent front sheet 3620 and back sheet 3630. Structure. The transparent front sheet may be, for example, glass. The back sheet can also be glass or any other suitable material. An additional strip of encapsulant may be disposed between the rear terminal interconnect 3410 and the rear surface of the super cell as illustrated.

As described above, hidden tabs provide a modular aesthetic trait that is "all black." Since these connections are typically made of highly reflective conductors, they were able to normally show high contrast for attached solar cells. However, by forming connections on the back side of the solar cells and also routing other conductors in the solar module circuit behind the solar cells, various conductors are hidden from view. This enables multiple connection points (hidden taps) while still attracting the "all black" appearance.

Hidden tabs can be used to form various module layouts. In the examples of FIGS. 40 (physical layout) and 41 (electrical circuit diagram), the solar module includes six super cells each running at the lengths of the module. The hidden tap contact pads and short interconnects 3400 divide each super cell into thirds, electrically connect adjacent super cell segments in parallel, thereby forming three groups of super cell segments connected in parallel. Each group is connected in parallel to the other of the bypass diodes 1300A-1300C incorporated (built-in) into the laminate configuration of the module. The bypass diodes can be located, for example, directly behind super cells or between super cells. The bypass diodes can be located, for example, along the centerline of the solar module, approximately parallel to the long sides of the solar module.

In the example of FIGS. 42A-42B (corresponding to the electrical circuit diagram of FIG. 41), the solar module also includes six super cells each running at the length of the module. The hidden tap contact pads and short interconnects 3400 divide each super cell into thirds, electrically connect adjacent super cell segments in parallel, thereby forming three groups of super cell segments connected in parallel. Each group is connected in parallel to the other of the bypass diodes 1300A-1300C via bus connections 1500A-1500C, which are located behind the super cells, the hidden tap contact pads and short interconnects in the junction box. Connect to the bypass diodes located on the back side of the module.

42B provides a detailed view of the connection of the short hidden tap interconnects 3400 and conductors 1500B, 1500C. As shown, these conductors do not overlap each other. In the illustrated example, this enables the use of asymmetrical interconnects 3400 arranged in opposing directions. An alternative approach to avoiding overlapping of the conductors is to employ a first symmetrical interconnect 3400 with taps of one length and a second symmetrical interconnect 3400 with taps of another length.

In the example of FIG. 43 (corresponding also to the electrical circuit diagram of FIG. 41 ), the solar module has the exception that the hidden tap interconnects 3400 form successive buses running substantially the entire width of the solar module. It is configured similarly to that shown in Fig. 42A. Each bus can be a single long interconnect 3400 conductively coupled to the back metallization of each super cell. Optionally, the buses may each traverse a single super cell and include multiple individual interconnects that are conductively coupled to one another or otherwise electrically interconnected as described above with respect to FIG. 41. Figure 43 also electrically connects the rear terminal contacts of the super cells and the super cell terminal interconnects 3410 forming a continuous bus along one end of the solar module to electrically connect the front terminal contacts of the super cells. Shown are additional super cell terminal interconnects 3410 that form a continuous bus along opposite ends of the solar module to connect.

The exemplary solar modules of FIGS. 44A-44B also correspond to the electrical circuit diagram of FIG. 41. This example employs short hidden tap interconnects 3400 as in FIG. 42A and interconnects 3410 forming successive buses for the super cell front and rear terminal contacts as in FIG. 43.

In the examples of FIGS. 47A (physical layout) and FIG. 47B (electrical circuit diagram), the solar module includes six super cells each running at the full length of the solar module. Hidden tap contact pads and short interconnects 3400 divide each super cell into 2/3 length portions and 1/3 length portions. At the lower edge of the photovoltaic module, interconnects 3410 (as shown in the figure) interconnect the three columns on the left in parallel with each other, the three columns on the right with each other in parallel, and on the left The three columns are interconnected in series with the three columns on the right. This arrangement forms three groups of super cell segments connected in parallel, each super cell group having a length that is 2/3 of the length of the super cell. Each group is connected in parallel with the other of the bypass diodes 2000A-2000C. This arrangement provides about twice the voltage and about half the current than could have been provided by the same super cells if they were instead electrically connected as shown in FIG. 41.

As described above with reference to FIG. 34A, interconnects coupled to the super cell rear terminal contacts can be placed entirely behind the super cells and can be hidden from view from the front (sun) sides of the solar module. The interconnects 3410 coupled to the super cell front terminal contacts are either because they extend beyond the ends of the super cells (eg, as in FIG. 44A), or around and under the ends of the super cells. Because it is folded, it can be seen in the rear view of the solar module (eg, as in FIG. 43).

The use of hidden taps enables the grouping of small numbers of solar cells per bypass diode. In the examples of FIGS. 48A-48B (each showing a physical layout), the solar module includes six super cells each running at the length of the module. Hidden tap contact pads and short interconnects 3400 divide each super cell into fifths, electrically connect adjacent super cell segments in parallel, thereby forming five groups of super cell segments connected in parallel. Each group is connected in parallel with the other of the bypass diodes 2100A-2100E incorporated (built-in) into the laminate configuration of the module. The bypass diodes can be located, for example, directly behind super cells or between super cells. Super cell terminal interconnects 3410 form a continuous bus along one end of the solar module to electrically connect the front terminal contacts of the super cells, and additional super cell terminal interconnects 3410 are the super cell A continuous bus is formed along the opposite end of the solar module to electrically connect the rear terminal contacts of the. In the example of FIG. 48A, a single junction box 2110 is electrically connected to the front and rear terminal interconnect buses by conductors 2115A, 2115B. However, since there are no diodes in the junction box, selectively (FIG. 48B) the long double conductors 2215A, 2115B can be removed, and the single junction box 2110 is, for example, of the module It can be replaced by two single polarity (+ or -) junction boxes 2110A-2110B located on opposite edges. This eliminates resistive losses in the long return conductors.

Although the examples described herein use hidden taps to electrically divide each super cell into three or five groups of solar cells, these examples are intended to be illustrative and not restrictive. More generally, hidden taps can be used to electrically divide the super cell into groups of solar cells, more or less than illustrated, and/or solar cells per group, more or less than illustrated.

In normal operation of the photovoltaic modules described herein without a bypass bias in a forward biased and conductive state, little or no current flows through any hidden tap contact pad. Instead, current flows through the cell-to-cell conductive bonds formed between adjacent overlapping solar cells over the length of each super cell. In contrast, FIG. 45 shows the current flow when a portion of the solar module is bypassed through a forward biased bypass diode. As indicated by the arrows, the current in the leftmost super cell in this example flows along the super cell until it reaches the tapped solar cell, after which the back metallization, hidden tab of the solar cell A contact pad (not shown), a second solar cell in the adjacent super cell via interconnect 3400, to another hidden tab contact pad (not shown) to which the interconnect is coupled on the second solar cell, the agent 2 flows through the back metallization of the solar cell, through the additional hidden tab contact pads, to the bus connection 1500 through the interconnects and the solar cell back metallization and to the bypass diode. The current flow through other super cells is similar. As evident from the example, under these circumstances, the hidden tap contact pads can conduct current from two or more rows of super cells, thus presenting a current greater than the current generated within any single solar cell in the module. You can evangelize.

A bus bar, contact pad, or other light blocking element (other than front metallized fingers or overlapping portions of adjacent solar cells) is typically present on the front of the solar cell opposite the hidden tab contact pad. I never do that. Accordingly, when the hidden tab contact pad is formed of silver on a silicon solar cell, the photoelectric conversion efficiency of the solar cell in the area of the hidden tab contact pad is of a rear electric field that prevents the silver contact pad from recombining back charge. It can be reduced if the effect is reduced. To avoid this loss of efficiency, most solar cells in the super cell typically do not include hidden tap contact pads (eg, those requiring hidden tap contact pads for bypass diode circuits in some variations) Only solar cells will include such a hidden tab contact pad). In addition, in order to match the current generation in solar cells with hidden tab contact pads to the current generation in solar cells lacking the hidden tab contact pads, the solar cells comprising the hidden tab contact pads are Hidden tab contact pads may have a larger condensing area than depleted solar cells.

Individual hidden tab contact pads may have rectangular dimensions less than or equal to about 2 mm, for example less than or equal to about 5 mm.

Solar modules undergo a temperature cycle as a result of temperature changes during the environment, during operation and during the test in which they are installed. As shown in Fig. 46A, during this temperature cycle, the mismatch of thermal expansion between the silicon solar cells in the super cell and other parts of the module, for example the glass front sheet of the module, of the super cell and the module Between different parts, it brings about relative motion along the long axes of the super cell rows. This mismatch tends to stretch or compress the super cells, and may damage the conductive bonds between the solar cells or solar cells in the super cells. Similarly, as shown in FIG. 46B, the mismatch of thermal expansion between the interconnect coupled to a solar cell and the solar cell during a temperature cycle is relative motion in a direction orthogonal to the rows of super cells between the interconnect and the solar cell. Causes This mismatch can deform and damage the conductive bonds between the solar cells, the interconnects, and the like. This may happen for interconnects coupled to hidden tap contact pads and for interconnects coupled to super cell front or rear terminal contacts.

Similarly, the cyclic mechanical load of the solar module is local to the shear forces (shear) to the bonds between the solar cell and the interconnect, and in intercell bonds in the super cell, for example during transportation or from the climate (eg wind and snow). forces). These shear forces can also damage the solar module.

The conductive adhesive used to bond adjacent and overlapping solar cells together to prevent problems resulting from relative motion between the super cells along the long axis of the super cell rows and other parts of the solar module. Providing mechanical compliance to the super cells between overlapping solar cells so that the super cells and the module are in a direction parallel to the columns for a temperature range of about -40°C to about 100°C without damaging the solar module Can be selected to form a flexible conductive bond 3515 (FIG. 46A) that accommodates the mismatch of thermal expansion between the glass front sheets. The conductive adhesive at standard test conditions (i.e., 25 °C), for example, less than or equal to about 100 megapascals (MPa), less than or equal to about 200 MPa, less than or equal to about 300 MPa, or about Less than or equal to 400 MPa, less than or equal to about 500 MPa, less than or equal to about 600 MPa, less than or equal to about 700 MPa, less than or equal to about 800 MPa, less than or equal to about 900 MPa, or greater than about 1000 MPa It can be selected to form conductive bonds having a shear modulus equal to or less than. The flexible conductive bonds between overlapping and adjacent solar cells can accommodate differential motion greater than or equal to about 15 microns between each cell and the glass front sheet, for example. Suitable conductive adhesives can include, for example, ECM 1541-S3 available from Engineered Conductive Materials LLC.

In order to promote heat flow along the super cell reducing the risk of damaging the solar module from hot spots that may be caused during operation of the solar module, the solar cells in the module are the result of shading or some other cause When reverse biased to, conductive bonds between adjacent solar cells that overlap, for example, are less than or equal to about 50 microns orthogonal to the solar cells and about 1.5 W/orthogonal to the solar cells. It may be formed by having a thermal conductivity greater than or equal to (meter-K).

To prevent problems resulting from the relative motion between the interconnect and its attached solar cell, the conductive adhesive used to bond the interconnect to the solar cell is such that the interconnect is about -40°C without damaging the solar module. It may be selected to form a conductive bond between the solar cell and the interconnect that is stiff enough to accommodate a mismatch in thermal expansion between the solar cell and the interconnect for a temperature range of about 180°C. Such conductive adhesives are under standard test conditions (i.e., 25° C.), for example greater than or equal to about 1800 MPa, greater than or equal to about 1900 MPa, greater than or equal to about 2000 MPa, greater than or equal to about 2100 MPa Or greater than or equal to about 2200 MPa, greater than or equal to about 2300 MPa, greater than or equal to about 2400 MPa, greater than or equal to about 2500 MPa, greater than or equal to about 2600 MPa, greater than or equal to about 2700 MPa, Greater than or equal to about 2800 MPa, Greater than or equal to about 2900 MPa, Greater than or equal to about 3000 MPa, Greater than or equal to about 3100 MPa, Greater than or equal to about 3200 MPa, Greater than or equal to about 3300 MPa, About 3400 MPa Greater than or equal to, greater than or equal to about 3500 MPa, greater than or equal to about 3600 MPa, greater than or equal to about 3700 MPa, greater than or equal to about 3800 MPa, greater than or equal to about 3900 MPa, greater than about 4000 MPa Or a conductive bond having the same shear modulus. In these variations, the interconnect can withstand the thermal expansion or contraction of the interconnect, for example greater than or equal to about 40 microns. Suitable conductive adhesives can include, for example, Hitachi CP-450 and solders.

Accordingly, conductive bonds between overlapping and adjacent solar cells in the super cell can utilize a different conductive adhesive than the conductive bonds between the super cell and the flexible electrical interconnect. For example, a conductive bond between the super cell and the flexible electrical interconnect can be formed of solder, and the conductive bonds between the overlapping and adjacent solar cells can be formed of a conductive adhesive rather than solder. In some variations, all of the conductive adhesives can be cured in a single process step, for example in a process window from about 150°C to about 180°C.

The previous discussion focused on assembling a plurality of solar cells (which can be cut solar cells) in a shingled manner on a common substrate. This leads to the formation of a module.

However, in order to collect a sufficient amount of solar energy to be useful, facilities typically have a number of these modules that themselves are assembled together. According to embodiments, a plurality of solar cell modules may also be assembled in a shingled manner to increase the area efficiency of the array.

In certain embodiments, the module may be characterized by a top conductive ribbon facing the direction of solar energy and a bottom conductive ribbon facing away from the direction of solar energy.

The lower ribbon is embedded under the cells. Therefore, it does not block incoming light and does not adversely affect the area efficiency of the module. In contrast, the top ribbon is exposed and can block the incoming light and adversely affect efficiency.

According to embodiments, the modules themselves may be shingled such that the top ribbon is covered by neighboring modules. This shingled module configuration could also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of module elements that may be located within overlapping regions may include, but are not limited to, junction boxes (j-boxes) and/or bus ribbons.

In certain embodiments, the j-boxes of each adjacent shingled modules are arranged in a line to implement a conductive connection between them. This simplifies the configuration of the array of shingled modules by removing the wiring.

In certain embodiments, the j-boxes could be strengthened and/or combined with additional structural standoffs. Such a configuration could create an integrated and inclined modular roof mount rack solution, where the dimensions of the junction box determine the slope. Such an implementation can be particularly useful when the array of shingled modules is mounted on a flat roof.

Shingled super cells are unique for module layout for module level power management devices (eg DC/AC microinverters, DC/DC module power optimizers, voltage intelligence and smart switches, and related devices). Provide opportunities. A feature of module level power management systems is power optimization. Super cells as described and employed herein can produce higher voltages than traditional panels. In addition, the super cell module layout can further divide the module. Both higher voltages and increased division create potential benefits for power optimization.

Disclosed herein are high efficiency solar modules (i.e., solar panels) comprising narrow rectangular silicon solar cells arranged in shingled fashion and electrically connected in series to form super cells, wherein the super cells are The solar modules are arranged in rows that are physically parallel. The super cells may, for example, basically have lengths spanning the entire length or width of the solar module, or two or more super cells may be arranged end to end in a row. Each super cell may include any number of solar cells, including, for example, at least nineteen solar cells in some variations and silicon solar cells greater than or equal to 100 in certain variations. Each photovoltaic module can have a conventional size and shape, and still contains hundreds of silicon solar cells, wherein the super cells in a single photovoltaic module are, for example, about 90 volts (V) to about 450 V, or It can be electrically interconnected to provide the above DC (DC) voltage.

As will be discussed further below, these high DC voltages are DC-to-DC boost (DC) prior to conversion by the inverter to AC by the inverter (e.g., a microinverter located on the solar module). The conversion from direct current to alternating current (AC) is possible by eliminating or reducing the need for step-up of the voltage. In addition, as will be discussed further below, the high DC voltage is also achieved by a central inverter that receives high voltage DC output from two or more high voltage shingled solar cell modules in which the DC/AC conversion is electrically connected in parallel to each other. It enables the use of batches to be performed.

Referring again to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 is a shingled manner with ends of adjacent solar cells overlapping and electrically connected to form the super cell 100. It shows a cross-sectional view of a string of series-connected solar cells 10 arranged. Each solar cell 10 includes a semiconductor diode structure and electrical contacts to the semiconductor diode structure that can be provided to an external load when the current generated by the solar cell 10 is illuminated by light.

In the examples described herein, each solar cell 10 is rectangular crystalline silicon with front (sun-side) and back (light-shielding) metallization patterns that provide electrical contact to the opposite sides of the np junction. In a solar cell, the front metallization pattern is disposed on an n-type conductive semiconductor layer, and the back metallization pattern is disposed on a p-type conductive semiconductor layer. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements can be used where appropriate. For example, the front (solar side) metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shielding side) metallization pattern may be disposed on an n-type conductive semiconductor layer. have.

Referring again to FIG. 1, adjacent solar cells 10 in the super cell 100 are electrically connected such that they electrically connect the front metallization pattern of one solar cell to the rear metallization pattern of the adjacent solar cell. They are conductively bonded to each other in the overlapping region by the conductive bonding material. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

FIG. 2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly configured solar module can include more or less rows of super cells of this lateral length than shown in this example. In other variations, the super cells can each have a length approximately equal to the length of the short side of the rectangular solar module, and the columns with their long sides oriented parallel to the short sides of the module. Can be arranged parallel within. In another arrangement, each row can include two or more super cells that are electrically connected in series. The modules can have, for example, short sides having a length of about 1 meter and long sides having a length of about 1.5 meters to about 2.0 meters, for example. Any other suitable shapes (eg square) and dimensions for solar modules can also be used.

In some variations, conductive bonds between the overlapping solar cells provide mechanical compliance to the super cells, so that the heats for a temperature range of about -40°C to about 100°C without damaging the solar module In the direction parallel to accommodate the mismatch of thermal expansion between the super cells and the front sheet of the solar module.

In the illustrated example, each super cell has a width equal to or approximately equal to 1/6 of the width of a conventionally sized 156 mm square or pseudo square silicon wafer, the same or approximately the width of the square or pseudo square wafer. It includes 72 rectangular solar cells having the same length. More generally, rectangular silicon solar cells employed in the solar modules described herein are of the same or approximately the same lengths as, for example, the width of a conventional sized square or pseudo square silicon wafer and, for example, conventional It may have widths equal to or approximately equal to 1/M of the width of a square or pseudo square wafer of size, where M is any integer of ≦20. M can be, for example, 3, 4, 5, 6 or 12. M may also be 20 or more. The super cell can include any suitable number of these rectangular solar cells.

Since the shingling approach described above includes more cells per module than the conventional case, the super cells in the solar module 200 are electrically interconnected (optional) to provide a higher voltage than the conventional voltage from the solar module of the conventional size. As such, it can be interconnected in series by flexible electrical interconnects) or by module level power electronics as described below. For example, a conventional size solar module comprising super cells made from 1/8 cut silicon solar cells can include more than 600 solar cells per module. By comparison, a conventional size solar module comprising conventional size interconnected silicon solar cells typically includes about 60 solar cells per module. In conventional silicon solar modules, square or pseudo-square solar cells are typically interconnected by copper ribbons and spaced from one another to accommodate the interconnections. In these cases, cutting the conventional sized square or pseudosquare wafers into narrow rectangles could reduce the overall amount of active solar cell area within the module, thus due to the additional cell-to-cell interconnects required. The module power could be reduced. In contrast, in the solar modules disclosed herein, the shingled deployment hides cell-to-cell electrical interconnects under the active solar cell region. Accordingly, the photovoltaic modules disclosed herein have little or no tradeoff between the module power in the photovoltaic module and the number of solar cells (and the required cell-to-cell interconnections), so there is no module output. It is possible to provide high output voltages without reducing power.

When all solar cells are connected in series, a shingled solar cell module as described herein can provide a DC voltage within a range of, for example, about 90 volts to about 450 volts or more. As mentioned above, this high DC voltage can be advantageous.

For example, a microinverter placed near or on top of a solar module can be used for module level power optimization and DC to AC conversion. Referring now to FIGS. 49A-49B, a conventional microinverter 4310 receives a DC input of 25V-40V from a single solar module 4300, and an AC output of 230V to match the connected grid. Output The microinverter typically includes two main components: DC/DC boost and DC/AC inversion. The DC/DC boost is utilized to increase the DC bus voltage required for the DC/AC conversion and is typically the most expensive and lossy (2% efficiency loss) component. Since the solar modules described herein provide high voltage power, the need for DC/DC boost can be reduced or eliminated (FIG. 49B). This can reduce the cost and increase the efficiency and reliability of the solar module 200.

In conventional arrangements using a central ("string") inverter rather than microinverters, conventional low DC output solar modules are electrically connected in series to each other and to the string inverter. The voltage generated by the string of photovoltaic modules is equal to the sum of the individual module voltages because the modules are connected in series. The allowed voltage range determines the maximum and minimum numbers of modules in the string. The maximum number of modules is by the module voltage and code voltage limits: for example N _max ×V _oc <600V (US residential standard) or N _max ×V _oc <1,000V (commercial standard) Is set. The minimum number of modules in series is set by the module voltage and the minimum operating voltage required by the string inverter: N _min ×V _mp >V _Invertermin . The minimum operating voltage V _Invertermin required by the string inverter (e.g., Pronius, Powerone or SMA inverter) is typically about 180V to about 250V. Typically, the operating voltage for the string inverter is about 400V.

A single high DC voltage shingled solar cell module as described herein can generate a voltage that is greater than or equal to the minimum operating voltage required by the string inverter, and is optionally at or near the optimum operating voltage for the string inverter. . As a result, the high DC voltage shingled solar cell modules described herein can be electrically connected in parallel to each other for a string inverter. This avoids the string length requirements of the series connected module strings that can complicate system design and installation. In addition, in a series-connected string of solar modules, the lowest current module is the most important feature, and the system is different in the string as can occur for modules on different roof slopes or as a result of tree shade. The modules may not work efficiently if they accommodate different lighting. The parallel high voltage module configuration described herein can also avoid these problems because the current through each solar module is independent of the current through other solar modules. In addition, these arrangements do not require module level power electronics, and thus can improve the reliability of the solar modules, which can be particularly important in variants where the solar modules are placed on the roof top.

Referring now to FIGS. 50A-50B, as described above, the super cell may proceed approximately to the full length or width of the solar module. In order to enable electrical connections along the length of the super cell, a hidden (from front view) electrical tapping point can be incorporated into the solar module configuration. This can be achieved by connecting an electrical conductor at the end or intermediate position of the super cell to the back metallization of the solar cell. These hidden taps enable electrical division of the super cell, bypass diodes, module level power electronics (e.g., microinverters, power optimizers, voltage intelligence and smart switches, and related devices), or other It enables interconnection of super cells or segments of super cells to components. The use of hidden tabs is further described in U.S. Provisional Patent Application No. 62/081,200, U.S. Provisional Patent Application No. 62/133,205 and U.S. Patent Application No. 14/674,983, each of which is incorporated herein by reference in their entirety.

In the examples of FIGS. 50A (exemplary physical layout) and 50B (exemplary electrical circuit diagram), the illustrated solar modules 200 are six super cells 100 each electrically connected in series to provide a high DC voltage. ). Each super cell is electrically divided into several groups of solar cells by hidden tabs 4400, and each group of solar cells is electrically connected in parallel with another bypass diode 4410. In these examples, the bypass diodes are disposed in the solar module laminate structure with the solar cells in an encapsulant between the front transparent sheet and the backing sheet. Optionally, the bypass diodes can be placed in a junction box located on the back or edge of the solar module and can be interconnected to the hidden tabs by conductor runs.

In the examples of FIGS. 51A (physical layout) and 51B (corresponding electrical circuit diagram), the illustrated solar module 200 also includes six super cells 100 electrically connected in series to provide a high DC voltage. . In this example, the solar module is electrically divided into three pairs of super cells connected in series, and each pair of super cells is electrically connected in parallel with other bypass diodes. In this example, the bypass diodes are placed in a junction box 4500 located on the back side of the solar module. The bypass diodes could instead be located within the solar module laminate structure or edge-mount junction box.

In the examples of FIGS. 50A-51B, in normal operation of the solar module, each solar cell is forward biased, and all bypass diodes are thus reverse biased and are not conducting. However, if one or more solar cells in the group are reverse biased to a sufficiently high voltage, the bypass diode corresponding to this group will be turned on, and the current flow through the module is reverse biased. Will bypass the cells. This prevents the formation of dangerous hot spots in shaded or malfunctioning solar cells.

Optionally, the bypass diode functionality can be implemented within a module level power electronics, for example a microinverter disposed on or near the solar module (module level power electronics and their use also here module level power management Devices or systems and module level power management). This module-level power electronics, optionally integrated with the solar module, can optimize power from groups of super cells, from each super cell, or from each individual super cell segment in electrically divided super cells ( For example, by operating the group of super cells, the super cell, or the super cell segment at its maximum power point), thereby enabling separate power optimization within the module. Since the power electronics can determine when to bypass the entire module, a specific group of super cells, one or more specific individual super cells and/or one or more specific super cell segments, the module level power electronics is the module Eliminates the need for any bypass diodes within.

This can be achieved, for example, by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (eg, one or more super cells or super cell segments) in the photovoltaic module, a “smart switch” power management device is configured to reverse bias this circuit. It can be determined whether it includes any solar cells. When a reverse biased solar cell is detected, the power management device can disconnect the corresponding circuit from the electrical system, for example, using a relay switch or other component. For example, if the voltage of the monitored solar cell circuit falls below a predetermined threshold, then the power management device will cut off (open circuit) the circuit. The predetermined threshold may be, for example, a certain percentage and magnitude (eg, 20% or 10V) compared to the normal operation of the circuit. The implementation of this voltage intelligence can be integrated into existing module-level power electronics products (eg, from Enpas Energy, Solare Technologies, Tigo Energy) or through custom circuit design.

52A (physical layout) and 52B (corresponding electrical circuit diagram) show example configurations for module level power management of a high voltage solar module including shingled super cells. In this example, the rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending into the lengths of the long sides of the solar module. The six super cells are electrically connected in series to provide a high DC voltage. The module level power electronics 4600 may perform voltage sensing, power management, and/or DC/AC conversion for the entire module.

53A (physical layout) and 53B (corresponding electrical circuit diagram) show another exemplary configuration for module level power management of a high voltage solar module including shingled super cells. In this example, the rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending into the lengths of the long sides of the solar module. The six super cells are electrically grouped into three pairs of super cells connected in series. Each pair of super cells can perform voltage sensing and power optimization on the individual pairs of super cells, and serialize two or more of them to provide a high DC voltage and/or to perform DC/AC conversion. The module-level power electronics (4600) to be connected to are individually connected.

54A (physical layout) and FIG. 54B (corresponding electrical circuit diagram) show another exemplary configuration for module level power management of a high voltage solar module including shingled super cells. In this example, the rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending into the lengths of the long sides of the solar module. Each super cell can perform voltage sensing and power optimization for the super cell, and module level power connecting two or more of them in series to provide a high DC voltage and/or to perform DC/AC conversion. It is connected to the electronics 4600 individually.

55A (physical layout) and FIG. 55B (corresponding electrical circuit diagram) show another example configuration for module level power management of a high voltage solar module including shingled super cells. In this example, the rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending into the lengths of the long sides of the solar module. Each super cell is electrically divided into two or more groups of solar cells by hidden tabs 4400. Each resulting group of solar cells can perform voltage sensing and power optimization for each solar cell group, and modules that connect in series of multiple groups to provide high DC voltage and/or perform DC/AC conversion It is individually connected to the level power electronics 4600.

In some variations, two or more high voltage DC shingled solar cell modules as described herein are electrically connected in series to provide a high voltage DC output that is converted to AC by an inverter. The inverter may be, for example, a micro-inverter integrated with one of the solar modules. In these cases, the microinverter may optionally be a component of a module level power management electronics that also performs additional voltage sensing and connects functions as described above. Optionally, the inverter can be a central “string” inverter as discussed further below.

As shown in FIG. 56, stringing super cells in series in adjacent columns of the solar modules of the super cells may be slightly offset along their long axes in a staggered manner. When this staggering not only saves module area (space/length), but also simplifies manufacturing, the interconnects where adjacent ends of the super cell rows are joined to the top of one super cell and the bottom of the other ( 4700). Adjacent rows of super cells may be offset, for example, by about 5 millimeters.

Differential thermal expansion between the electrical interconnects 4700 and the silicon solar cells and the resulting stress on the solar cell and the interconnect can result in cracking and other failure modes that can degrade the performance of the solar module. Accordingly, it is preferred that the interconnect is flexible and configured to accommodate this differential expansion without significant stress development. The interconnect is formed of, for example, very soft materials (eg, soft copper, thin copper sheets), or low thermal expansion coefficient materials (eg, Kovar, Invar or other low thermal expansion iron-nickel). Alloys) or silicon having a coefficient of thermal expansion approximately equal to that of silicon, or slits, slots, holes, or truss structures that accommodate differential thermal expansion between the interconnect and the silicon solar cell. Stress and thermal expansion relief can be provided by incorporating in-plane geometric expansion features and/or employing out-of-plane geometric features such as kinks, jogs or dimples that accommodate such differential thermal expansion. The conductive portions of the interconnects can have a thickness of, for example, about 100 microns or less, about 50 microns or less, about 30 microns or less, or about 25 microns or less to increase the flexibility of the interconnects (these solar modules) The generally low current within allows the use of thin and flexible conductive ribbons without excessive power loss resulting from the electrical resistance of the thin interconnects).

In some variations, the conductive bonds between the super cell and the flexible electrical interconnect are such that the flexible electrical interconnect does not damage the solar module and the super cell and the flexible electrical for a temperature range of about -40°C to about 180°C. Allows for inconsistencies in thermal expansion between interconnects.

7A (discussed above) shows some example interconnect configurations employing stress-relieving geometric features represented by reference numerals 400A-400T, and FIGS. 7B-1 and 7B-2 (also discussed above) ) Shows exemplary interconnect configurations employing geometric features to remove out-of-plane stress, denoted by reference signs 400U and 3705. Any or any combination of these interconnect configurations employing stress relief features can be suitable for electrically interconnecting super cells in series to provide a high DC voltage as desired herein.

The discussion of FIGS. 51A-55B focused on module level power management with possible DC/AC conversion of high DC module voltage by module level power electronics to provide AC output from the module. As described above, DC/AC conversion of high DC voltages from shingled solar cell modules as described herein may be performed instead by a central string inverter. For example, FIG. 57A shows a plurality of high DC voltages electrically connected in parallel with each other to the string inverter 4815 via a high DC voltage negative bus 4820 and a high DC voltage positive bus 4810. The photovoltaic system 4800 including the shingled solar cell modules 200 is schematically illustrated. Typically, each solar module 200 includes a plurality of shingled super cells that are electrically connected in series with electrical interconnects to provide a high DC voltage as described above. The solar modules 200 may optionally include bypass diodes arranged as described above, for example. 57B shows an exemplary arrangement of a photovoltaic system 4800 on the roof top.

In some variations of photovoltaic system 4800, two or more short series-connected strings of high DC voltage shingled solar cell modules may be electrically connected in parallel with a string inverter. Referring again to FIG. 57A, for example, each photovoltaic module 200 may be replaced with a series connected string of two or more high DC voltage shingled solar cell modules 200. This could be achieved, for example, by maximizing the voltage provided to the inverter while following regulatory standards.

Conventional solar modules typically produce about 8 amps of Isc (short circuit current), about 50 Voc (open circuit voltage), and about 35 Vmp (maximum power point voltage). As discussed above, each of the solar cells has a high DC voltage shingled solar cell as described herein, having an area of about 1/M of the area of a conventional solar cell and M times the conventional number of solar cells. The modules produce approximately M times the voltage and current of 1/M higher than conventional solar modules. As described above, M may be any suitable integer, and is usually ≦20, but may be 20 or more. M can be, for example, 3, 4, 5, 6, or 12.

When M=6, Voc for the high DC voltage shingled solar cell modules may be, for example, about 300V. Connecting these two modules in series could provide about 600V DC to the bus and follow the maximum set by US residential standards. When M=4, Voc for the high DC voltage shingled solar cell modules may be, for example, about 200V. Connecting three of these modules in series could provide about 600V DC to the bus. When M=12, Voc for the high DC voltage shingled solar cell modules may be, for example, about 600V. The system could also be configured to have bus voltages below 600V. In these variants, the high DC voltage shingled solar cell modules provide, for example, pairs or triplets or any other suitable in a combiner box to provide the optimum voltage to the inverter. It can be joined in a bond.

The challenge arising from the parallel configuration of the high DC voltage shingled solar cell modules described above is that when one solar module is shorted, the other solar modules potentially transfer their power to the shorted module (ie. It is possible to drive current through the short-circuited module and to dissipate power therein, which may cause danger. This problem is associated with, for example, the use of blocking diodes to prevent other modules from driving current through the shorted module, the use of current limiting fuses, or combined with blocking diodes. It can be prevented by the use of Hallyu fuses. 57B schematically illustrates the use of two Hall current fuses 4830 on the positive and negative terminals of a high DC voltage shingled solar cell module 200.

The protective arrangement of the blocking diodes and/or fuses may depend on whether or not the inverter includes a transformer. Systems using inverters that include transformers typically ground the negative conductor. Systems using transformerless inverters typically do not ground the negative conductor. For an inverter without a transformer, it may be desirable to have a Hallyu fuse connected to the positive terminal of the solar module and another Hallyu fuse connected to the negative terminal.

Blocking diodes and/or current-limiting fuses can be arranged, for example, with a junction box or each module in the module laminate. Suitable junction boxes, blocking diodes (e.g., in-line blocking diodes), and fuses (e.g., in-line fuses) are from Shoals Technology Group. Can include those available.

58A shows an exemplary high voltage DC shingled solar cell module including a junction box 4804 in which a blocking diode 4850 is connected to the positive terminal of the solar module. The junction box does not contain a Hallyu fuse. This configuration may be used in combination with one or more Hallyu fuses located elsewhere (eg, in a combiner box) to be preferably connected to the positive and/or negative terminals of the solar module (eg For example, see Figure 58D below). FIG. 58B shows an exemplary high voltage DC shingled solar cell module that includes a junction box 4840 in which a blocking diode is aligned to the positive terminal of the solar module and a current limit fuse 4830 is aligned to the negative terminal. FIG. 58C is an exemplary high voltage DC shingled solar cell module including a junction box 4840 in which a Hallyu fuse 4830 is aligned to the positive terminal of the solar module and another Hallyu fuse 4830 is aligned to the negative terminal. It shows. FIG. 58D is an exemplary high voltage DC shingled solar cell module comprising a junction box 4840 configured as in FIG. 58A and fuses located outside the junction box aligned with positive and negative terminals of the solar module. It shows.

Referring now to FIGS. 59A-59B, as an optional example of the above-described configurations, blocking diodes and/or current-limiting fuses 4860 for all high DC voltage shingled solar cell modules Can be co-located within. In these variations, one or more individual conductors proceed separately from each module to the combiner box. As shown in FIG. 59A, a single conductor of one polarity (eg, voice as illustrated) in one option is shared among all modules. In another option (FIG. 59B), both polarities have individual conductors for each module. Although FIGS. 59A-59B only show fuses located within combiner box 4860, any suitable coupling of fuses and/or blocking diodes may be located within the combiner box. In addition, electronic devices that perform other functions, such as monitoring, maximum power point tracking and/or disconnecting individual modules or groups of modules, may also be implemented in the combiner box.

The reverse bias operation of a solar module causes one or more solar cells in the solar module to be shaded or otherwise generate a small current, and the solar module can handle the low current of the low current that can be handled through a low current solar cell. It can occur when operating at a voltage-current point that drives a larger current than a solar cell. Reverse biased solar cells can become hot and create a hazardous condition. The parallel arrangement of the high DC voltage shingled solar cell modules can make them protected from reverse bias operation, for example by setting a suitable operating voltage for the inverter, as shown in FIG. 58A. This is illustrated, for example, by FIGS. 60A-60B.

60A shows a plot of current versus voltage (4870) and a plot of power versus voltage (4880) for a parallel connected string of about ten high DC voltage shingled solar modules. These curves were calculated for a model without solar modules that included a reverse biased solar cell. Since the solar modules are electrically connected in parallel, they all have the same operating voltage, and their current is added. Typically, an inverter will change the load on the circuit to experience the power-voltage curve, identify the maximum point on this curve, and then operate the module circuit at this point to maximize the output power.

In contrast, FIG. 60B shows a plot of current versus voltage (4890) and a plot of power versus voltage for the model system of FIG. 60A when some of the solar modules in the circuit include one or more reverse biased solar cells. (4900). The reverse biased modules are exemplary current-voltage by formation of a knee shape with a transition from about 10 amps operation to voltages of about 200 volts or less to about 16 amp operation at a drop of voltages up to about 210 volts. The curves show themselves. The shaded modules at reverse voltages below about 210 volts include reverse biased solar cells. The reverse biased modules also represent themselves in the power-voltage curve by the presence of two maximums, an absolute maximum at about 200 volts and a local maximum at about 240 volts. The inverter can be configured to recognize these signals of reverse biased solar modules, and can operate the solar modules at absolute maximum or maximum power point voltages without reverse biased modules. In the example of FIG. 60B, the inverter can operate the modules at the maximum power point to ensure that there are no reverse biased modules. Additionally or alternatively, a minimum operating voltage can be selected for the inverter below which it is unlikely that any modules are likely to be reverse biased. This minimum operating voltage can be adjusted based on other variables such as ambient temperature, the operating current and the calculated or measured solar module temperature, as well as other information received from external sources such as radiance, for example.

In some embodiments, the high DC voltage photovoltaic modules themselves can be shingled, and adjacent photovoltaic modules are arranged in a partially overlapping manner, and optionally electrically interconnected in their overlapping regions. Connected. These shingled configurations are high voltage solar modules that are electrically connected in parallel to provide a high DC voltage to the string inverter, or microinverters that each convert the high DC voltage of the solar module to an AC module output. It can be optionally used for optical modules. The pair of high voltage solar modules can be shingled as described above and can be electrically connected in series to provide the desired DC voltage, for example.

Conventional string inverters are: 1) they must be compatible with other series connected module string lengths, 2) some modules in the string can be completely or partially shaded, and 3) changes in ambient temperature and radiation change the module voltage. Because of the variation, it often requires a fairly wide range of potential input voltages (or'dynamic ranges'). In systems employing a parallel configuration as described herein, the length of the string of solar modules connected in parallel does not affect the voltage. Also, for cases where some modules are partially shaded and some are not, it can be determined to operate the system at the voltage of unshielded modules (eg, as described above). Therefore, the input voltage range of the inverter in the parallel configuration system may only need to accommodate factor #3-temperature and'dynamic range' of radiative changes. This is, for example, as small as about 30% of the required conventional dynamic range of inverters, so that inverters employed in parallel configuration systems as described herein are of narrow width, for example about 250 volts and high at standard conditions. It may have a maximum power point tracking (MPPT) of between about 175 volts at temperature and low radiation, or between about 450 volts at standard conditions and about 350 volts at high temperature and low radiation (in this case 450 volts MPPT) Operation can correspond to V _OC below 600 volts at the lowest temperature operation). Also, as described above, the inverters can receive sufficient DC voltage to be converted directly to AC without a boost phase. Accordingly, string inverters employed in parallel configuration systems as described herein can be simpler, have the lowest cost, and can operate at higher efficiencies than string inverters employed in conventional systems. have.

For both microinverters and string inverters employed with the high voltage direct current shingled solar cell modules described herein, the peak-to-peak of the AC to eliminate the DC boost requirement of the inverter. It may be desirable to configure the photovoltaic module (or a short series-connected string of photovoltaic modules) to provide a DC voltage above the peak (eg, peak power point Vmp). For example, for 120V AC, the peak-to-peak is sqrt(2)*120V=170V. Thus, the solar modules can be configured to provide a minimum Vmp of about 175V, for example. Under standard conditions, Vmp can then be about 212V (assuming a negative voltage temperature coefficient of 0.35% and a maximum operating temperature of 75°C), at the lowest temperature operating conditions (eg -15°C) Vmp can then be about 242V, so Voc can be about 300V or less (depending on the module charging rate). All these numbers are doubled for the split phase 120V AC (or 240V AC), which is convenient because 600V DC is the maximum allowed in the United States (US) for many residential applications. For commercial applications that require and allow higher voltages, these numbers can be further increased.

High voltage shingled solar cell modules as described herein are >600 V _OC Or >1000V _OC , in which case the module can include an integrated power electronics that prevents the external voltage provided by the module from exceeding the code requirements. Such an arrangement can make the operation V _mp sufficient for a split face 120V (240V, requiring about 350V) without the problem of V _OC at low temperatures exceeding 600V.

When the building's connection to the distribution network is disconnected, for example by firefighters, solar modules (eg, on the roof of a building) that provide electricity to the building are still powered when the sun is shining. Can produce. This raises concerns that these solar modules can maintain electricity on the roof at dangerous voltages after disconnection of the building from the network. To address this concern, the high voltage direct current shingled solar cell modules described herein can optionally include, for example, a disconnect within or adjacent to the module junction box. The disconnect can be, for example, a physical disconnect or a solid state disconnect. Since the disconnect can be configured to be “normally off”, for example, disconnecting the high voltage output of the solar module from the roof circuit when a particular signal (eg, from the inverter) is lost. do. Communication to the disconnect may span high voltage cables, for example, via separate wires or wireless.

An important advantage of shingling for high voltage solar modules is heat diffusion between solar cells in the shingled super cell. The inventors have discovered that heat can be easily transferred along a silicon super cell through thin, electrically and thermally conductive bonds between adjacent and overlapping silicon solar cells. The thickness of the electrically conductive bond between adjacent and overlapping solar cells formed by the electrically conductive bonding material, measured orthogonally to the front and back surfaces of the solar cells, is, for example, about 200 microns. Less than or equal to, less than or equal to about 150 microns, less than or equal to about 125 microns, less than or equal to about 100 microns, less than or equal to about 90 microns, or less than or equal to about 80 microns , Less than or equal to about 70 microns, less than or equal to about 60 microns, less than or equal to about 50 microns, or less than or equal to about 25 microns. This thin coupling reduces the resistive loss in the interconnection between cells and also promotes the flow of heat along the super cell from any hot spot in the super cell that could have evolved during operation. The thermal conductivity of the bonds between the solar cells can be, for example, ≥about 1.5 watts/(meter-K). In addition, the rectangular aspect ratio of solar cells employed herein typically provides extended areas of thermal contact between adjacent solar cells.

In contrast, in conventional solar modules employing ribbon interconnects between adjacent solar cells, heat generated within one solar cell is not easily diffused through the ribbon interconnects to other solar cells in the module. Does not. This makes conventional solar modules easier to advance hot spots than the solar modules described herein.

Moreover, because the super cells described herein are typically formed by shingling rectangular solar cells each having a smaller (eg 1/6) active area than in the case of conventional solar cells, the sun described herein The current through the super cell in the light modules is typically less than through a string of conventional solar cells.

As a result, less heat is lost in the solar cells reverse biased at the breakdown voltage in the solar modules disclosed herein, and the heat is generated through the super cell and the solar module without creating dangerous hot spots. It can spread easily.

Some additional and optional features can make high voltage solar modules employing super cells as described herein more resistant to heat lost in a reverse biased solar cell. For example, the super cells can be encapsulated in a thermoplastic olefin (TPO) polymer. TPO encapsulants are photo-thermal stable than standard ethylene-vinyl acetate (EVA) encapsulants. EVA will be brown in temperature and ultraviolet light, and will cause hot spot problems created by cells that limit current. In addition, the solar modules may have a glass-glass structure in which the sealed super cells are interposed between a glass front sheet and a glass back sheet. Such a glass-glass structure makes it safer to operate at higher temperatures than if it were tolerated by conventional polymer backing sheets. Moreover, junction boxes, if present, are on one or more edges of the solar module rather than behind the solar module, where the junction box could add an additional layer of thermal insulation to the solar cells in the module above it. Can be mounted on.

High voltage solar cells formed from super cells as described herein because the inventors can thus allow the heat flow through the super cells to operate the module without significant risk with one or more reverse biased solar cells. It has been recognized that modules can employ far fewer bypass diodes than within conventional solar modules. For example, in some variations, high voltage solar modules as described herein include less than one bypass diode per 25 solar cells, less than one bypass diode per 30 solar cells, 50 solar cells Less than one bypass diode per field, less than one bypass diode per 75 solar cells, less than one bypass diode per 100 solar cells, employing a single bypass diode, or employing a bypass diode I never do that.

Referring now to FIGS. 61A-61C, exemplary high voltage solar modules utilizing bypass diodes are provided. When a portion of the solar module is shaded, damage to the module can be prevented or reduced through the use of bypass diodes. For the exemplary solar module 4700 shown in FIG. 61A, ten super cells 100 are connected in series. As illustrated, the 10 super cells are arranged in parallel rows. Each super cell includes 40 series-connected solar cells 10, where each of the 40 solar cells is made approximately square or pseudo-square 1/6 as described herein. Under normal non-shielding operation, current flows from junction box 4716 through each of the super cells 100 connected in series through connectors 4715, after which current flows through junction box 4717 Comes out. Optionally, a single junction box can be used in place of the separate junction boxes 4716, 4717, so the current returns to one junction box. The example shown in FIG. 61A shows an implementation with approximately one bypass diode per super cell. As shown, a single bypass diode is electrically connected between a pair of neighboring super cells at a point approximately midway along the super cells (e.g., a single bypass diode 4901A is the first). The 22nd solar cell of the super cell and the neighboring solar cell in the second super cell are electrically connected, and a second bypass diode 4901B is electrically connected between the second super cell and the third super cell. It is connected to, etc.). The first and last strings of cells have only roughly half the number of solar cells in the super cell per bypass diode. For the example shown in FIG. 61A, the first and last strings of the cells include only 22 cells per bypass diode. The total number of bypass diodes 11 for the modification of the high voltage solar module illustrated in FIG. 61A is equal to the number of super cells plus one additional bypass diode.

Each bypass diode can be integrated into a flex circuit, for example. Referring now to FIG. 61B, an enlarged view of a bypass diode coupled region of two neighboring super cells is shown. The time point for FIG. 61B is from the non-solar side. As shown, the two solar cells 10 on neighboring super cells are electrically connected using a flex circuit 4918 that includes a bypass diode 4720. The flex circuit 4918 and bypass diode 4720 are electrically connected to the solar cells 10 using contact pads 4919 located on the back surfaces of the solar cells (also by hiding hidden tabs). See the following detailed discussion of the use of hidden contact pads to provide pass diodes). Additional bypass diode electrical connection schemes can be employed to reduce the number of solar cells per bypass diode. One example is illustrated in FIG. 61C. As shown, one bypass diode is electrically connected between each pair of neighboring super cells approximately midway along the super cells. Bypass diode 4901A is electrically connected between neighboring solar cells on the first and second super cells, and bypass diode 4901B between neighboring solar cells on the second and third super cells. It is electrically connected, and the bypass diode 4901C is electrically connected between neighboring solar cells on the third and fourth super cells. A second set of bypass diodes can be included to reduce the number of solar cells that will be bypassed in case of partial shading. For example, bypass diode 4902A is electrically connected between the first and second super cells at an intermediate point between bypass diodes 4901A, 4901B, and bypass diode 4902B is a bypass diode. It is an electrical connection between the second and third super cells at an intermediate point between the fields 4901B and 4901C, and reduces the number of cells per bypass diode. Optionally, another set of bypass diodes can be electrically connected to further reduce the number of solar cells bypassed in case of partial shading. Bypass diode 4902A is electrically connected between the first and second super cells at an intermediate point between bypass diodes 4902A and 4901B, and bypass diode 4902B is bypass diodes 4902B, 4901C) is electrically connected between the second and third super cells at an intermediate point, further reducing the number of cells per bypass diode. This configuration results in the intrinsic configuration of bypass diodes that allows small groups of cells to be bypassed during partial shading. Additional diodes can be electrically connected in this manner until a desired number per bypass diode, for example, about 8, about 6, about 4 or about 2 solar cells per bypass diode is implemented. In some modules, about 4 solar cells per bypass diode are preferred. If desired, one or more of the bypass diodes illustrated in FIG. 61C can be incorporated into a concealed and flexible interconnect as illustrated in FIG. 61B.

Herein, solar cells and solar cells are used, for example, to cut conventional sized square or pseudo square solar cells into a plurality of narrow rectangular or substantially rectangular solar cells. Cutting methods are disclosed. These cutting tools and methods bend the conventionally sized solar cells against the curved support surface and thus cut the bottoms and curves of the conventionally sized solar cells to cut the solar cells along pre-made scribe lines. Vacuum is applied between the support surfaces. The advantage of these cutting tools and methods is that they do not require physical contact with the top surfaces of the solar cells. Accordingly, these cutting mechanisms and methods can be employed to cut solar cells that contain soft and/or uncured materials on their upper surfaces that could have been damaged by physical contact. Further, in some variations, these cutting mechanisms and cutting methods may only require contact to portions of the bottom surfaces of the solar cells. In these variations, these cutting mechanisms and methods can be employed to cut solar cells comprising soft and/or uncured materials on portions of their bottom surfaces that have not been contacted by the cutting mechanism.

For example, a method of manufacturing one solar cell utilizing the cutting tools and methods disclosed herein may include each one or more conventionally sized silicon solar cells to define a plurality of rectangular areas on the silicon solar cells. Laser scribing one or more scribe lines on the phase, applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells, and on the long side Bend the one or more silicon solar cells against the support surface of the curve to provide a plurality of rectangular silicon solar cells each comprising a portion of the electrically conductive adhesive bonding material disposed on its front side adjacently And thus applying a vacuum between the bottom surfaces of the one or more silicon solar cells and the curved support surface to cut the one or more silicon solar cells along the scribe lines. The conductive adhesive bonding material may be applied to the conventional sized silicon solar cells before or after the solar cells are laser scribed.

The resulting plurality of rectangular silicon solar cells can be arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled fashion with the electrically conductive adhesive bonding material disposed therebetween. The electrically conductive bonding material can then be cured, thereby joining adjacent and overlapping rectangular silicon solar cells to each other and electrically connecting them in series. This process forms a shingled “super cell” as described in the patent applications listed above in “Reference to Related Applications in the Technical Field”.

Referring again to the drawings to further understand the cutting tools and methods disclosed herein, FIG. 20A schematically illustrates a side view of an exemplary apparatus 1050 that can be used to cut scribed solar cells. In such a device, the scribed conventional sized solar cell wafer 45 is carried over a portion of the curve of the vacuum manifold 1070 by a perforated moving belt 1060. As the solar cell wafer 45 passes over the portion of the curve of the vacuum manifold, the vacuum applied through the perforations in the belt pulls the bottom surface of the solar cell wafer 45 against the vacuum manifold, thereby Accordingly, the solar cell is bent. The radius of curvature R of the curved portion of the vacuum manifold will be selected to cut the solar cell along the scribe lines such that bending the solar cell wafer 45 in this way forms rectangular solar cells 10. You can. The rectangular solar cells 10 can be used, for example, in a super cell as illustrated in FIGS. 1 and 2. The solar cell wafer 45 can be cut by this method without contacting the top surface of the solar cell wafer 45 to which the conductive adhesive bonding material has been applied.

Cutting is scribed, for example, for each scribe line by arranging with respect to the scribe lines such that one end is oriented at an angle θ to the vacuum manifold so as to reach a portion of the curve of the vacuum manifold before the other end. It may be initiated preferentially at one end of the line (ie, at one edge of the solar cell 45). As shown in Fig. 20B, for example, the solar cells scribe their scribe lines at an angle to the cutting portion of the curve of the manifold oriented orthogonally to the direction of the belt and the direction of the belt. It can be oriented with the field. As another example, FIG. 20C shows their scribe lines and oriented cells orthogonal to the cutting portion of the curve of the manifold oriented at an angle to the direction of the belt travel and the direction of the belt travel.

The cutting mechanism 1050 can utilize, for example, a single perforated moving belt 1060 having a width orthogonal to the direction of its travel, which is approximately equal to the width of the solar cell wafer 45. Optionally, the instrument 1050 can include, for example, two, three, four or more perforated moving belts 1060 that can be arranged side by side and selectively spaced from one another. The cutting mechanism 1050 can utilize, for example, a single vacuum manifold that can have a width orthogonal to the direction of travel of the solar cells approximately equal to the width of the solar cell wafer 45. Such a vacuum manifold may be employed, for example, with a single full width perforated moving belt 1060, or with two or more such belts arranged side by side and optionally spaced apart from one another, for example. You can.

The cutting instruments 1050 can include two or more curved vacuum manifolds arranged side by side and spaced apart from each other, each vacuum manifold having the same curvature. Such an arrangement may be employed, for example, with a single full length perforated moving belt 1060 or with two or more such belts arranged side by side and optionally spaced apart from one another. For example, the instrument can include a moving belt 1060 perforated for each vacuum manifold. In the latter arrangement, the vacuum manifolds and their corresponding perforated moving belts can be arranged to contact the bottom of the solar cell wafer along only two narrow strips defined by the widths of the belts. In these cases, the solar cell can include the soft materials within an area of the bottom of the solar cell wafer that is not contacted by belts without the risk of damage to the soft materials during the cutting process.

Any suitable arrangement of perforated moving belts and vacuum manifolds can be used within cutting mechanism 1050.

In some variations, the scribed solar cell wafers 45 are conductive adhesive bonding material and/or other that are not cured on their top and/or bottom surfaces prior to cutting using a cutting mechanism 1050. Contains soft materials. Scribing of the solar cell wafer and application of the soft material could occur in any order.

62A illustrates a side view of another exemplary cutting mechanism 5210 similar to the cutting mechanism 1050 described above, and FIG. 62B illustrates a top view. In the use of cutting mechanism 5210, a conventionally sized scribed solar cell wafer 45 is a parallel spaced perforated belt that moves at a constant speed over a pair of corresponding, parallel and spaced vacuum manifolds 5235. Located on a pair of fields 5230. Vacuum manifolds 5235 typically have the same curvature. As the wafer proceeds through the cutting area 5235C to the belts above the vacuum manifolds, the wafer is supported by curved surfaces of the vacuum manifolds by the force of the vacuum pulling against the bottom of the wafer. The cutting radius defined by is bent at the teeth. As the wafer is bent around the cutting radius, the scribe lines become cracks that separate the wafer into individual rectangular solar cells. As described further below, the curvature of the vacuum manifolds is such that the adjacent cut rectangular solar cells are not on the same plane, and the edges of the adjacent cut rectangular solar cells are followed by the cutting process. They are arranged so as not to contact each other. The cut rectangular solar cells can be unloaded continuously from the perforated belts in any suitable way, some of which are described next. Typically, the unloading method further separates adjacent cut solar cells from each other to prevent contact between them when they subsequently lie on the same plane.

Still referring to FIGS. 62A-62B, each vacuum manifold includes, for example, a flat area 5235F that does not provide vacuum or provides low or high vacuum; An optional curved transition region 5235T that provides low or high vacuum, or transitions from low to high vacuum along its length; A cutting area 5235C providing high vacuum; And a post cleave region 5235PC of a sharper radius providing low vacuum. Belts 5230 transfer wafers 45 from and into flat area 5235F into transition area 5235T, and then into cut area 5235C, where the wafers are cut, afterwards The resulting cut solar cells 10 are transferred out of the cutting area 5235C and into the subsequent cutting area 5235PC.

The flat area 5235F is typically operated at a vacuum that is sufficiently low to limit wafers 45 to the belts and vacuum manifolds. Here the vacuum may be low (or may not) because it reduces friction and thus reduces the required belt tension, and it is easier to limit the wafers 45 to a flat surface rather than curved surfaces. The vacuum in the flat area 5235F may be, for example, about 1 inch to about 6 inches of mercury.

Transition region 5235T provides a transition curve from flat region 5235F to cut region 5235C. The radius of curvature or radius of curvature in transition region 5235T is greater than the radius of curvature in cut area 5235C. The curve in the transition region 5235T may be part of an ellipse, for example, but any suitable curve may be used. Wafers 45 approaching the cutting region 5235C through the transition region 5235T at a shallower change in curvature, rather than directly transitioning from a flat orientation in the region 5235F to the cutting radius in the cutting region 5235C. Having has contributed to ensuring that the edges of the wafers 45 do not lift and break the vacuum, which limits the edges of the wafers 45 to the cutting radius in the cutting area 5235C It can make things difficult. The vacuum in the transition region 5235T, for example, may be the same as in the cutting region 5235C, may be intermediate between the regions 5235F, 5235C, or in the region 5235F. In the region 5235C, the transition may be made along the length of the region 5235T therebetween. The vacuum in the transition region 5235T may be, for example, about 2 inches to about 8 inches of mercury.

The cut area 5235C may have a varying radius of curvature or, optionally, a constant radius of curvature. Such a constant radius of curvature may be, for example, between about 11.5 inches, about 12.5 inches, or between about 6 inches and about 18 inches. Any suitable range of curvature can be used and can be selected based in part on the thickness and depth of the wafer 45 and the geometry of the scribe lines in the wafer 45. Typically, the thinner the wafer, the shorter the radius of curvature required to bend the wafer sufficiently to split it along the scribe line. Although any other suitable shallower or deeper scribe line depth may be used, the scribe lines may have a depth of, for example, about 60 microns to about 140 microns. Typically, the shallower the scribe line, the shorter the radius of curvature required to bend the wafer sufficiently to split it along the scribe line. The cross-sectional shape of the scribe line also affects the required radius of curvature. A scribe line having a wedge-shaped or wedge-shaped bottom can concentrate stress more effectively than a scribe line having a round-shaped or rounded bottom. Scribe lines that focus stress more effectively may not require scribe lines that focus stress less effectively by a radius of curvature within a sharp cut area.

The vacuum in the cutting area 5235C for at least one of the two parallel vacuum manifolds is typically another area to ensure that the wafer is properly limited to the radius of curvature it cuts to maintain a constant bending stress. Higher than the field. Optionally and as described further below, one manifold in this region can provide a higher vacuum than the other to better control cutting along the scribe lines.

The post cut area 5235PC typically has a steeper radius of curvature than the cut area 5235C. This means transferring the cut solar cells from belts 5230 without rubbing or contacting the cracked surfaces of adjacent cut solar cells (which could cause solar cell failures from cracks or other failure types). It is possible. In particular, a sharper radius of curvature provides greater separation between the edges of adjacent cut solar cells on the belts. The vacuum in the post-cutting region 5235PC is low because it is no longer required to limit the solar cells to the radius of the curve of the vacuum manifolds, since the wafers 45 have already been cut into solar cells 10. (E.g., similar or identical to the case in the flat area 5235F). Edges of the cut solar cells 10 may be lifted, for example, from belts 5230. It may also be desirable for the cut solar cells 10 not to have excessive stress.

The flat, transitional, cut and post cut areas of the vacuum manifolds can be separate parts of different curves with their ends mating. For example, the top surface of each manifold includes a flat planar portion, a portion of an ellipse for the transition region, a circular arc for the cut region, and a circular arc or part of the ellipse for the post-cutting region. can do. Optionally, some or all of the curved portion of the upper surface of the manifold can have a continuous geometric function of increasing curvatures (reduced diameter of the contact circle). Suitable such functions may include, but are not limited to, helical functions such as, for example, clothoids and natural logarithmic functions. Closoids are curves in which the curvature increases linearly along the path length of the curve. For example, in some variations, the transition, cut and post cut areas are all parts of a single closoid curve having one end connected to the flat area. In some other variations, the transition region is a closoid curve having one end connected to the flat region and the other end connected to a cutting region having a circular curvature. In the latter variants, the post-cutting region may have, for example, a circular curvature of a sharper radius or a closoid curvature of a sharper radius.

As previously described and schematically illustrated in FIGS. 62B and 63A, in some variations, one manifold provides high vacuum in the cut area 5235C, and the other manifold is low in the cut area 5235C. Provide a vacuum. The high vacuum manifold completely limits the end of the supporting wafer to the curvature of the manifold, which provides sufficient stress to the end of the scribe line overlying the high vacuum manifold so that cracking begins along the scribe line. Since the low vacuum manifold does not completely limit the end of the supporting wafer to the curvature of the manifold, the bent radius of the wafer on this side is sufficient to create the stress necessary to cause cracks to start in the scribe line. Not sudden However, the stress is high enough to propagate cracks starting at the other end of the scribe line overlying the high vacuum manifold. Without some vacuum on the "low vacuum" side to partially and sufficiently limit this end of the wafer to the curvature of the manifold, cracks starting on the opposite "high vacuum" end of the wafer are completely across the wafer. There may be a risk of not propagating. In variations as described above, one manifold can selectively provide low vacuum along its entire length from the flat area 5235F to the post-cut area 5235PC.

As previously described, an asymmetric vacuum arrangement within the cutting area 5235C provides asymmetric stress along the scribe lines that control the generation and propagation of cracks along the scribe lines. For example, referring to FIG. 63B, if two vacuum manifolds instead provide the same (eg, high) vacuums within the cutting area 5235C, cracks may be created at both ends of the wafer. , Can propagate towards each other and can meet somewhere within the central region of the wafer. Under these circumstances, the cracks are not connected to each other, so there is a risk that they create a potential mechanical breakdown point in the resulting cut cells where the cracks meet.

As an optional or additional example of the asymmetric vacuum arrangement described above, cutting can be initiated preferentially at one end of the scribe line by arranging one end of the scribe line to reach the cutting area of the manifolds before the other end. This can be achieved, for example, by orienting the solar cell wafers at an angle to the vacuum manifolds as described above with respect to FIG. 20B. Optionally, the vacuum manifolds can be arranged such that one cutting area of the two manifolds follows the belt path more than the cutting area of the other vacuum manifold. For example, since two vacuum manifolds having the same radius of curvature may be slightly offset in the direction of travel of the moving belt, one manifold before the solar cell wafers reach the cutting area of the other vacuum manifold. The fold's cutting area is reached.

Referring now to FIG. 64, in the illustrated example, each vacuum manifold 5235 includes through holes 5240 arranged in a row below the center of the vacuum channel 5245. 65A-65B, a vacuum channel 5245 is recessed into the top surface of the manifold supporting the perforated belt 5230. Each vacuum manifold also includes central pillars 5250 located between the through holes 5240 and arranged in a row below the center of the vacuum channel 5245. The center pillars 5250 effectively separate the vacuum channel 5245 into two parallel vacuum channels on either side of the row of center pillars. Center pillars 5250 also provide support for belt 5230. Without the center pillars 5250, the belt 5230 can be exposed to longer unsupported areas and potentially sucked into the through holes 5240. This can result in three-dimensional bending (bending orthogonal to the cutting radius of the cutting radius) of the wafers 45 which can damage the solar cells and inhibit the cutting process.

As shown in FIGS. 65A-65B and 66-67, the through holes 5240 in the illustrated example have a low vacuum chamber 5260L (flat area 5235F and transition area 5235T in FIG. 62A), It is in communication with the high vacuum chamber 5260H (cutting area 5235C in Fig. 62A), and another low vacuum chamber 5260L (after cutting region 5235PC in Fig. 62A). This arrangement provides a smooth transition between the low and high vacuum regions within the vacuum channel 5245. As the through holes 5240 provide sufficient flow resistance. If the area corresponding to the hole remains completely open, the air flow will not be completely deflected in this one hole, and the next areas will be kept in a vacuum. The vacuum channel 5245 contributes to ensuring that the vacuum belt holes 5255 will always have a vacuum and will not be within a dead spot when located between the through holes 5240.

Referring again to FIGS. 65A-65B, and also referring to FIG. 67, perforated belts 5230 are, for example, leading and trailing of wafer 45 or cut solar cell 10 ( Trailing) edges 527 may include two rows of holes 5255 which are optionally arranged such that the belt is always under vacuum as it travels along the manifold. In particular, the staggered placement of holes 5255 in the illustrated example ensures that the edges of wafer 45 or cut solar cell 10 always overlap with at least one hole 5255 in each belt 5230. This contributes to preventing the edges of the wafer 45 or the cut solar cell 10 from being lifted from the belt 5230 and the manifold 5235. Any other suitable arrangement of holes 5255 can also be used. In some variations, the placement of the holes 5255 does not guarantee that the edges of the wafer 45 or cut solar cell 10 are always under vacuum.

In the illustrated example of cutting mechanism 5210, perforated moving belts 5230 are the bottom of the solar cell wafer 45 along two narrow strips defined by the widths of the belts along the lateral edge of the solar cell wafer. It is only contacted. Accordingly, the solar cell wafer is not cured, for example, within the area of the bottom surface of the solar cell wafer that is not contacted by belts 5230 without the risk of damage to soft materials during the cutting process. Soft materials such as adhesives.

In alternative variations, the cutting mechanism 5210 is approximately equal to the width of the solar cell wafer 45 orthogonal to the direction of its progress rather than, for example, two perforated moving belts as described above. A single perforated moving belt 5230 having a width can be utilized. Optionally, the cutting mechanism 5210 can include three, four or more perforated moving belts 5230, which can be arranged side by side in parallel and optionally spaced apart from each other. The cutting mechanism 5210 may utilize, for example, a single vacuum manifold 5235 that may have a width approximately equal to the width of the solar cell wafer 45 orthogonal to the direction of progress of the solar cells. . Such a vacuum manifold may be employed, for example, with a single full width perforated moving belt 5230, or two or more such belts arranged side by side and optionally spaced apart from one another. The cutting mechanism 5210 is supported, for example, along opposite lateral edges by two curved vacuum manifolds 5235, each vacuum manifold having the same curvature, arranged in parallel and spaced apart from each other. It may include a single perforated moving belt 5230. The cutting mechanism 5210 may include three or more curved vacuum manifolds 5235 arranged side by side and spaced apart from each other, each vacuum manifold having the same curvature. Such an arrangement may be employed, for example, with a single full width perforated moving belt 5230, or three or more such belts arranged side by side and optionally spaced apart from one another. The cutting mechanism can include, for example, a perforated moving belt 5230 for each vacuum manifold.

Any suitable arrangement of perforated moving belts and vacuum manifolds can be used within cutting mechanism 5210.

As noted above, in some variations, the scribed solar cell wafers 45 cut with the cutting mechanism 5210 are conductive adhesive bonds that are not cured on their top and/or bottom surfaces prior to cutting. Materials and/or other soft materials. Scribing of the solar cell wafer and application of the soft material could take place in any order.

The perforated belts 5230 in the cutting tool 5210 (and the perforated belts 1060 in the cutting tool 1050) are used to replace the solar cell wafers 45, for example, about 40 millimeters per second (mm/ s) to about 2000 mm/s or more, or about 40 mm/s to about 500 mm/s or more, or about 80 mm/s or more. Cutting of the solar cell wafers 45 can be facilitated at higher speeds than at lower speeds.

Referring now to FIG. 68, once cut there will be some separation between the leading and trailing edges 527 of adjacent cut cells 10 due to the geometry of the bending around the curve, which adjacent cut aspects A wedge-shaped gap is created between the cells. When the cut cells return to a flat, coplanar orientation without first increasing the separation between the cut cells, there is a possibility that the edges of adjacent cut cells could be contacted and damaged each other. It is therefore advantageous to remove the cut cells from belts 5230 (or belts 1060) while they are still supported by the curved surface.

69A-69G show that the cut solar cells can be removed from belts 5230 (or belts 1060), and with improved separation between the cut solar cells, one or more additional moving belts. Some devices and methods that can be delivered to fields or mobile surfaces are illustrated. In the example of FIG. 69A, the cut solar cells 10 move faster than the belts 5230, thus increasing one or more transfer belts 5265 to increase separation between the cut solar cells 10. ) From belts 5230. The transfer belts 5265 may be located between the two belts 5230, for example. In the example of FIG. 69B, the cut wafers 10 are separated by a sliding slide 5270 located between the two belts 5230. In this example, belts 5230 each cut cell 10 to release the cut cell to slide 5270 while the uncut portion of the wafer 45 is still held by belts 5230. Is advanced into the low vacuum (eg, not vacuum) region of the manifolds 5235. Providing an air cushion between the cut battery 10 and the slide 5270 helps ensure that both the cell and the slide do not wear during operation, and also cut batteries ( 10) This causes the wafer 45 to slide faster and thus enables faster cutting belt operating speeds.

In the example of FIG. 69C, the carriages 5275A in the rotating “Ferris Wheel” arrangement 5245 allow the cut solar cells 10 from the belts 5230 to one or more belts 5280. ).

In the example of FIG. 69D, actuators 5285A to rotate the rotating roller 5285 to pick up the cut solar cells 10 from the belts 5230 and place them on the belts 5280. Vacuum is applied through.

In the example of FIG. 69E, the carriage actuator 5290 includes a carriage 5290A and an extendable and stretchable actuator 5290B mounted on the carriage. The carriage 5290A positions the actuator 5290B to remove the cut solar cell 10 from the belts 5230, and then actuates 5290B to place the cut solar cell on the belts 5280. ) To move back and forth to position.

In the example of FIG. 69F, the carriage track arrangement 5295 positions the carriages 5295A to remove the cut solar cells 10 from the belts 5230, and thereafter the cut solar cells 10. It includes carriages 5295A attached to the moving belt 5300 for positioning the carriages 5295A to place them on the belts 5280, the latter being due to the path of the belts 5230. It occurs while falling off or pulling from the belt 5280.

In the example of FIG. 69G, inverted vacuum belt arrangement 5305 is vacuumed through one or more moving perforated belts to transport cut solar cells 10 from belts 5230 to belts 5280. Is approved.

70A-70C provide orthogonal projections of further variations of the exemplary apparatus described above with reference to FIGS. 62A-62B and subsequent figures. This variation 5310 is such as in the example of FIG. 69A to remove the cut solar cells 10 from the perforated belts 5230 transporting the uncut wafer 45 into the cutting area of the instrument. Use transfer belts 5265. The perspective views of FIGS. 71A-B show this variant of the cutting mechanism at two different stages of operation. In FIG. 71A, the uncut wafer 45 is approaching the cutting area of the apparatus, in FIG. 71B the wafer 45 has entered the cutting area, and the two cut solar cells 10 are the Separated from the wafer, they are further separated from each other as they are conveyed by the transfer belts 5265.

In addition to the features described above, FIGS. 70A-71B show multiple vacuum ports 5315 on each manifold. The use of multiple ports per manifold may allow more control over the variation of vacuum along the length of the top surface of the manifold. For example, other vacuum ports 5315 may be selectively communicated with other vacuum chambers (e.g., 5260L and 5260H in FIGS. 66 and 72B) to provide different vacuum pressures along the manifold, and/or Or it can be selectively connected to other vacuum pumps. 70A-70B also show complete paths of the wheels 5325, top surfaces of the vacuum manifolds 5235, and perforated belts 5230 circulating the wheels 5320. Belts 5230 may be driven, for example, by wheels 5320 or wheels 5325.

72A and 72B show perspective views of a portion of the vacuum manifold 5235 overlaid with a portion of the perforated belt 5230 for the variations of FIGS. 70A-71B, and FIG. 72A is a close-up view of a portion of FIG. 72B Provides 73A shows a top view of a portion of the vacuum manifold 5235 overlaid with the perforated belt 5230, and FIG. 73B is a cross-sectional view of the same vacuum manifold and perforated belt arrangement taken along the CC line shown in FIG. 73A. It shows. As shown in Figure 73B, since the relative orientations of the through holes 5240 can be varied along the length of the vacuum manifold, each through hole is orthogonal to a portion of the top surface of the manifold directly above the through hole. Are arranged. 74A shows another top view of the vacuum manifold 552L overlaid with a perforated belt 5230, and the vacuum chambers 5260L, 5260H are shown in partial perspective views. 74B shows a close-up view of a portion of FIG. 74A.

75A-75G show some example hole patterns that can be selectively used for perforated vacuum belts 5230. A common characteristic of these patterns is that at any location on the belt, a straight edge of a wafer 45 or cut solar cell 10 intersecting a pattern orthogonal to the long axis of the belt is always at least one hole in each belt. It will overlap with (5255). The patterns may be, for example, two or more rows of staggered square or rectangular holes (FIG. 75A, 75D), two or more rows of staggered circular holes (FIG. 75B, 75E, 75G), diameter Two or more rows of photo slots (FIG. 75C, 75F), or any other suitable arrangement of holes.

Disclosed herein are high efficiency photovoltaic modules comprising silicon solar cells arranged in a shingled fashion that overlap to form super cells, and electrically connected by conductive bonds between adjacent and overlapping solar cells, wherein Super cells are arranged in rows that are physically parallel within the solar module. The super cell can include any suitable number of solar cells. The super cells may have, for example, a length substantially covering the entire length or width of the solar module, or two or more super cells may be arranged end to end in a row. This arrangement hides the electrical interconnections of the solar cells to the solar cells, and can thus be used to create a visually attractive solar module with little or no contrast between adjacent series-connected solar cells.

Cell metallization patterns are further disclosed herein that enable stencil printing of metallization onto the front (and optionally) backsides of the solar cells. As used herein, “stencil printing” of cell metallization involves the metallization material (eg, silver paste) otherwise onto the solar cell surface through patterned openings in the impermeable sheet of material. Refer to the application. The stencil can be, for example, a patterned stainless steel sheet. The patterned openings in the stencil are entirely free of stencil material and do not include any mesh or screen, for example. The absence of a mesh or screen material in the patterned stencil openings distinguishes “stencil printing” as used herein from “screen printing”. In contrast, in screen printing, the metallization material is applied onto the surface of the solar cell through a screen (eg, mesh) that supports the patterned impermeable material. The pattern includes openings in the impermeable material through which the metallization material is applied to the solar cell. The support screen extends over openings in the impermeable material.

Compared to screen printing, stencil printing of cell metallization patterns includes narrower line widths, greater aspect ratio (height relative to the line width), better line uniformity and definition, and a longer-lasting stencil of the stencil compared to the screen. Thus providing numerous advantages. However, stencil printing may not be able to print'islands' in one path as may be required in conventional three bus bar metallization designs. In addition, stencil printing is not limited in the plane of the stencil during printing, and does not print a metallization pattern that could require the stencil to include unsupported structures that could interfere with the placement and use of the stencil in one path. May not. For example, stencil printing could include unsupported tongues of sheet material defined by openings for the bus bar and openings for the fingers, as a single stencil for this design would The metallization patterns arranged in parallel may not be printed in one path by a metallization pattern interconnected by bus bars or other metallization features that run perpendicular to the fingers. The tongues could not be restricted to other parts of the stencil so as to lie within the plane of the stencil during printing by physical connections, could move out of the plane, and could change the placement and use of the stencil.

Accordingly, attempts at using stencils to print traditional solar cells require two passages for front-side metallization with a stencil printing step combined with two different stencils or screen printing steps, which is a per-cell print step. Increasing the total number of digits, also creates a'stitching' problem where the two prints overlap and result in double height. The stitching further complicates the processes, and additional printing and related steps increase the cost. Stencil printing is thus not common to solar cells.

As described further below, the front metallization patterns described herein may include an array of fingers (eg, parallel lines) that are not connected to each other by the front metallization pattern. These patterns can be stencil-printed with a single stencil as one passage because the required stencil does not need to include unsupported parts or structures (eg, tongues). These front metallization patterns are interconnected by standard sized solar cells and spaced apart solar cells by copper ribbons because the metallization pattern itself does not provide substantial current spread or electrical conduction orthogonal to the fingers. This can be disadvantageous for strings of solar cells. However, the front metallization patterns described herein are shingled of rectangular solar cells as described herein, where a portion of the front metallization pattern of the solar cell overlaps and is conductively combined with the back metallization pattern of an adjacent solar cell. It can be field operated within batches. This is because the overlapping backside metallization of the adjacent solar cell can provide current spreading or electrical conduction orthogonal to fingers in the frontside metallization pattern.

Referring now to the figures for a more detailed understanding of the solar modules described herein, FIG. 1 is shingled in a manner with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100. It shows a cross-sectional view of a string of solar cells 10 connected in series arranged. Each solar cell 10 includes a semiconductor diode structure and electrical contacts to the semiconductor diode structure that can be provided to an external load when the current generated within the solar cell 10 is illuminated by light.

In the examples described herein, each solar cell 10 is a rectangular crystalline silicon solar with front (sun side) and back (shielding side) metallization patterns providing electrical contact to opposite sides of the np junction. It is a battery, and the front metallization pattern is disposed on the n-type conductive semiconductor layer, and the rear metallization pattern is disposed on the p-type conductive semiconductor layer. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements can be used where appropriate. For example, the front (solar side) metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shielding side) metallization pattern may be disposed on an n-type conductive semiconductor layer. have.

Referring again to FIG. 1, the adjacent solar cells 10 in the super cell 100 are electrically conductive in that they electrically connect the metallization pattern of one front solar cell to the back metallization pattern of the adjacent solar cell. In the region overlapped by the adult binding material, they are directly and conductively bonded to each other. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

Referring again to FIG. 2, FIG. 2 shows an exemplary rectangular solar module 200 including six rectangular super cells 100 each having a length approximately equal to the length of the long sides of the solar module. City. The super cells are arranged as six parallel rows with their long sides oriented parallel to the long sides of the module. A similarly configured solar module can include rows of super cells of this side length that are more or less than those shown in this example. In other variations, the super cells can each have a length approximately equal to the length of the short side of the rectangular solar module, parallel to their long sides oriented parallel to the short sides of the module. Can be arranged in columns. In another arrangement, each row may include two or more super cells that may be electrically interconnected in series, for example. The modules can have, for example, short sides having a length of about 1 meter and long sides having a length of about 1.5 meters to about 2.0 meters, for example. Any other suitable shapes (eg square) and dimensions for the solar modules can also be used. In this example each super cell contains 72 rectangular solar cells each having a width approximately equal to 1/6 of the width of a wafer of 156 millimeter (mm) square or pseudo square, and a length of about 156 mm. Any other suitable any other suitable number of rectangular solar cells can also be used.

76 shows an exemplary front metallization pattern on a rectangular solar cell 10 that enables stencil printing as described above. The front metallization pattern may be formed of, for example, silver paste. In the example of FIG. 76, the front metallization pattern runs parallel to each other, parallel to the short sides of the solar cell, and includes a plurality of fingers 6015 orthogonal to the long sides of the solar cell. The front metallization pattern also includes each contact pad 6020 located at the end of the finger 6015 so that it runs parallel to the edge of the long side of the solar cell and of adjacent optional contact pads 6020. Contains heat. If present, each contact pad 6020 is an electrically conductive adhesive (ECA), solder, or other electrically used to electrically bond the front side of the illustrated solar cell to the overlapping portion of the back side of an adjacent solar cell. Create regions for individual beads of conductive bonding material. The pads may have, for example, circular, square, or rectangular shapes, but any suitable pad shape may be used. As an optional example for using individual beads of electrically conductive bonding material, a series of ECA, solder, conductive tape, or other electrically conductive bonding material disposed along the edge of the long side of the solar cell Lines or dashed lines can interconnect some or all of the fingers as well as couple the solar cells to adjacent and overlapping solar cells. Such a dashed line or a continuous line of electrically conductive bonding material can be used with or without conductive pads at the ends of the fingers.

The solar cell 10 may, for example, have a length of about 156 mm, a width of about 26 mm, and thus an aspect ratio of about 1:6 (short side length/long side length). The six such solar cells can be fabricated on a standard 156 mm×156 mm dimensioned silicon wafer, and are separated (dice) to provide solar cells as illustrated thereafter. In other variations, eight solar cells 10 with dimensions of 19.5 mm×156 mm and thus an aspect ratio of about 1:8 can be fabricated from a standard silicon wafer. More generally, solar cells 10 may have aspect ratios of, for example, about 1:2 to about 1:20, and may be manufactured from standard size wafers or wafers of any other suitable dimensions. .

Referring back to FIG. 76, the front surface metallization pattern may include, for example, about 60 to about 120 fingers per cell with a width of 156 mm, for example, about 90 fingers. Fingers 6015 may have widths of, for example, about 10 microns to about 90 microns, for example about 30 microns. Fingers 6015 may have heights orthogonal to the surface of the solar cell, for example, from about 10 microns to about 50 microns. The finger heights can be, for example, about 10 microns or more, about 20 microns or more, about 30 microns or more, about 40 microns or more, or about 50 microns or more. The pads 6020 may have diameters (circles) or side lengths (squares or rectangles) of, for example, about 0.1 mm to about 1 mm, for example about 0.5 mm.

The back metallization pattern for the rectangular solar cell 10 is, for example, a series of adjacent contact pads, a row of interconnected contact pads, or continuous and running parallel to and adjacent to the edge of the long side of the solar cell. May include a bus bar. However, such contact pads or bus bars are not required. If the front metallization pattern includes contact pads 6020 arranged along one edge of the long sides of the solar cell, then the row or bus bar (if present) of the contact pads in the back metallization pattern It is arranged along the edge of the other long side of the solar cell. The back metallization pattern may further include a metal back contact substantially covering all of the remaining back surfaces of the solar cell. The example back metallization pattern of FIG. 77A includes a row of separate contact pads 6025 in combination with a metal back contact 6030 as described above, and the example back metallization pattern of FIG. 77B is as described above. It includes a continuous bus bar 35 in combination with the same metal back contact (6030).

In a shingled super cell, the front metallization pattern of the solar cell is conductively coupled to the overlapping portion of the back metallization pattern of the adjacent solar cell. For example, if the solar cells include front metallized contact pads 6020, each contact pad 6020 can be aligned and coupled with a corresponding back metallized contact pad 6025 (if present), or , Can be aligned and coupled with the back metallized bus bar 35 (if present), or can be coupled to a metal back contact 6030 (if present) on the adjacent solar cell. This is, for example, separate parts (eg, beads) of electrically conductive bonding material disposed on each contact pad 6020, or parallel to the edge of the solar cell and optionally the contact. The pads 6020 may be embodied as a broken line or a continuous line of an electrically conductive bonding material that electrically interconnects two or more of the pads 6020.

If the solar cells lack the front metallized contact pads 6020, then, for example, each front metallized pattern finger 6015 is aligned and mated with a corresponding back metallized contact pad 6025 (if present) It can be, or can be combined with, a back metallized bus bar 35 (if present), or a metal back contact 6030 (if present) on the adjacent solar cell. This can be done, for example, to separate portions (eg, beads) of electrically conductive bonding material disposed on the overlapped end of each finger 6015 or parallel to the edge of the solar cell and optional As a result, the two or more fingers 6015 may be embodied as a dashed line or a continuous line of an electrically conductive bonding material that electrically connects each other.

As described above, portions of the overlapping back metallization of the adjacent solar cell, for example the backside bus bar 35 and/or the backside metal contact 6030 when present, are the fingers in the frontal metallization pattern. Orthogonal current spreading and electrical conductivity. In variants that utilize dashed lines or continuous lines of electrically conductive bonding material as described above, the electrically conductive bonding material is a current spread and electrical conductivity orthogonal to the fingers in the front metallization pattern. Can provide The overlapping back metallization and/or the electrically conductive bonding material may carry current to bypass broken fingers or other finger breakages in the front metallization pattern, for example.

The rear metallized contact pads 6025 and bus bar 35, if present, may be formed of silver paste, which may be applied, for example, by stencil printing, screen printing or any other suitable method. The metal back contact 6030 may be formed of, for example, aluminum.

Any other suitable back metallization patterns and materials can also be used.

FIG. 78 shows an exemplary front metallization pattern on a square solar cell 6300 that can be diced to form a plurality of rectangular solar cells each having a front metallization pattern shown in FIG. 76.

FIG. 79 shows an exemplary back metallization pattern on a square solar cell 6300 that can be diced to form a plurality of rectangular solar cells each having a back metallization pattern shown in FIG. 77A.

The front metallization patterns described herein can enable stencil printing of the front metallization on a standard three printer solar cell production line. For example, the production process may include stenciling or screen printing a silver paste onto the back of a square solar cell to form rear contact pads or rear silver bus bars using a first printer, after which the rear silver paste is In the process of drying, stenciling or screen printing an aluminum contact on the back side of the solar cell using a second printer, and then drying the aluminum contact, thereafter in a single stencil step to a third printer. A process of stencil printing a silver paste onto the front surface of the solar cell to form a complete front metallization pattern using a single stencil, followed by drying the silver paste, followed by firing the solar cell It may include. These printing and related steps can occur in any other order, if appropriate, or can be omitted.

The use of a stencil to print the front metallization pattern enables the production of narrower fingers than is possible with screen printing, which can improve solar cell efficiency and reduce the use of silver and thus production costs. Stencil printing of the front metallization pattern in a single stencil printing step to a single stencil is combined with screen printing, for example, to print multiple overlapping stencils or stencil printing to define features extending in different directions. It enables the production of a front metallization pattern having a uniform height without showing the stitching that may occur when used for them.

After the front and back metallization patterns are formed on the square solar cells, each square solar cell can be separated into two or more rectangular solar cells. This can be done, for example, by cutting or laser scribing followed by any other suitable method. The rectangular solar cells can then be arranged in a shingled manner that overlaps, and can be conductively coupled to each other as described above to form a super cell. Disclosed herein are methods for manufacturing solar cells with reduced charge recombination losses at the edges of the solar cell without, for example, cut edges that promote charge recombination. The solar cells may be, for example, silicon solar cells, and more specifically, HIT silicon solar cells. Shingled (overlapping) super cell arrangements of these solar cells are also disclosed herein. The individual solar cells in such a super cell may have narrow rectangular geometries (eg, strip-like shapes) with long sides of adjacent solar cells arranged to overlap.

A major challenge for cost-effective implementation of high-efficiency solar cells, such as HIT solar cells, is the need for large amounts of metal to carry large currents from one such high-efficiency solar cell to an adjacent series-connected high-efficiency solar cell. Is to recognize. The process of dicing these highly efficient solar cells into narrow rectangular solar cell strips and then overlapping with conductive bonds between overlapping portions of adjacent solar cells to form a series connected string of solar cells in the super cell. The process of arranging the resulting solar cells in a (single) pattern provides an opportunity to reduce module cost through process simplification. This is because the tabbing process steps required to interconnect adjacent solar cells to metal ribbons can be eliminated. This shingling approach also reduces current through the solar cells (because the individual solar cell strips can have smaller active areas than before), and reduces the current path length between adjacent solar cells. Module efficiency can be improved, all of which tend to reduce resistive losses. The reduced current may also allow replacement of more expensive and less resistive conductors (eg, silver) with less expensive but more resistive conductors (eg, copper) without significant loss of performance. In addition, this shingling approach can reduce the inactive module area by removing interconnect ribbons and associated contacts from the front surfaces of the solar cells.

Solar cells of conventional size may have substantially square front and back sides, for example, with dimensions of about 156 millimeters (mm)×about 156 mm. In the shingling scheme described above, such a solar cell is diced into two or more (eg, two to twenty) 156 mm long solar cell strips. A potential difficulty with this shingling approach is that dicing a conventional sized solar cell into thin strips increases the cell edge length per active area of the solar cell compared to a conventional sized solar cell, which is said edge. Performance may be degraded due to charge recombination in the fields.

For example, FIG. 80 shows a HIT solar cell 7100 with front and back dimensions of about 156 mm×about 156 mm, and several solar cells with narrow rectangular front and back sides of dimensions of about 156 mm×about 40 mm, respectively. The process of dicing into strips 7100a, 7100b, 7100c, 7100d is schematically illustrated (long sides of the 156 mm of the solar cell strips extend into the figure). In the illustrated example, the HIT cell 7100 includes an n-type microcrystalline base 5105, for example, with a front face of a square having a thickness of about 180 microns and dimensions of about 156 mm×about 156 mm. It can have a back. About 5 nanometers (nm) thick layer of intrinsic amorphous Si:H (a-Si:H) and about 5 nm thick layer of n+ doped a-Si:H (both layers together denoted by 7110) It is deposited on the entire surface of the crystalline silicon base 7105. A thick film 5120 about 65 nm thick of transparent conducting oxide (TCO) is deposited on the a-Si:H layers 7110. Conductive metal grid lines 7130 disposed on the TCO layer 7120 provide electrical contact to the front side of the solar cell. A layer of about 5 nm thick of intrinsic a-Si:H and a layer of about 5 nm thick of p+ doped a-Si:H (both layers together are denoted by 7115) is the backside of the crystalline silicon base 7105 It is placed on. A film 7125 of about 65 nm thickness of transparent conductive oxide (TCO) is disposed on the a-Si:H layers 7115 and conductive metal grid lines 7135 disposed on the TCO layer 7125 are mentioned above. Provides electrical contact to the back of the solar cell (the dimensions and materials mentioned above are intended to be illustrative rather than restrictive and can be varied as appropriate).

Referring still to FIG. 80, newly formed cut edges 7140 when HIT solar cell 7100 is cut by conventional methods to form strip solar cells 7100a, 7100b, 7100c, 7100d Is not passivated. These non-passivated edges contain high density dangling chemical bonds, which promote charge recombination and reduce the performance of the solar cells. In particular, the cut surface 7125 exposing the n-p junction and the cut surface exposing a high concentration doped front electric field (in layers 7110) are not passivated, and can significantly enhance charge recombination. Further, when conventional laser cutting or laser scribing processes are used to dice the solar cell 7100, thermal damage such as recrystallization 7150 of amorphous silicon may occur on the newly formed edges. have. As a result of the non-passivated edges and the thermal damage, new edges formed on the cut solar cells 7100a, 7100b, 7100c, 7100d when conventional manufacturing processes are used are short- circuit), it can be expected to reduce the open circuit voltage and the pseudo charge rate of the solar cells. This leads to a significant reduction in the performance of the solar cells.

The formation of edges enhancing the recombination during dicing of a conventional size HIT solar cell into narrower solar cell strips can be avoided by the method illustrated in FIGS. 85A-85J. This method allows the pn junction and the heavily doped front electric field to be electrically isolated from the truncated edges that could otherwise act as recombination sites for minority carriers. Use isolation trenches on the front and back sides. The trench edges are not defined by conventional cutting, but instead are defined by chemical etching or laser patterning, which involves the deposition of a passivation layer, such as TCO, which passivates both the front and rear trenches. Compared to the heavily doped regions, the base doping is low enough to lessen the likelihood of electrons in the junction reaching unpassivated cut edges of the base. In addition, a kerf-free wafer dicing technique, thermal laser separation (TLS) can be used to cut the wafers and avoid potential thermal damage.

In the example illustrated in FIGS. 85A-85J, the starting material is a cut-out wafer of about 156 mm square n-type monocrystalline silicon, for example from about 1 ohm-centimeter to about 3 ohm-centimeter. It can have bulk resistivity, for example about 180 microns thick (wafer 7105 forms the base of the solar cells).

Referring to FIG. 81A, the wafer 7105 as it is cut is typically textured etched, acid washed, cleaned, and dried.

Next, in FIG. 81B, an intrinsic a-Si:H layer about 5 nm thick and a doped n+ a-Si:H layer about 5 nm thick (both layers together are denoted by reference numeral 7110), for example, It is deposited on the front surface of the wafer 7105 at a temperature of about 150°C to about 200°C, for example by plasma enhanced chemical vapor deposition (PECVD).

Next, in FIG. 81C, an intrinsic a-Si:H layer about 5 nm thick and a doped p+ a-Si:H layer about 5 nm thick (both layers together are denoted by reference numeral 7115), for example, It is deposited on the back side of the wafer 7105 at a temperature of about 150°C to about 200°C, for example by PECVD.

Next, in Figure 81D, the front a-Si:H layers 7110 are patterned to form isolation trenches 7112. The isolation trenches 7112 typically penetrate the layers 7110 to reach the wafer 7105 and can have widths of, for example, about 100 microns to about 1000 microns, for example about 200 microns. Typically, the trenches have the smallest width that can be used depending on the accuracy of the patterning technique and subsequently applied cutting techniques. The patterning of the trenches 7112 can be made using, for example, laser patterning or chemical etching (eg, inkjet wet patterning).

Next, in FIG. 81E, the rear a-Si:H layers 7115 are patterned to form isolation trenches 7171. Similar to the isolation trenches 7112, the isolation trenches 7171 typically penetrate the layers 7115 to reach the wafer 7105, for example from about 100 microns to about 1000 microns, for example It can have widths of about 200 microns. Patterning of the trenches 7171 can be implemented using, for example, laser patterning or chemical etching (eg, inkjet wet patterning). Each trench 7171 is lined with a corresponding trench 7112 on the front side of the structure.

Next, a TCO layer 7120 about 65 nm thick in FIG. 81F is deposited on the patterned front a-Si:H layers 7110. This can be done, for example, by physical vapor deposition (PVD) or by ion plating. TCO layer 7120 fills trenches 7112 in a-Si:H layers 7110, coats the outer edges of layers 7110, and thus passivates the surfaces of the layers 7110. The TCO layer 7120 also functions as an anti-reflective coating.

Next, a thick TCO layer 7125 of about 65 nm in FIG. 81G is deposited on the patterned back a-Si:H layers 7115. This can be done, for example, by PVD or by ion plating. TCO layer 7125 fills trenches 7171 in a-Si:H layers 7115, coats the outer edges of layers 115, and thus passivates the surfaces of the layers 7115. The TCO layer 7125 also functions as an antireflective coating.

Next, conductive (eg, metal) front grid lines 7130 in FIG. 81H are screen printed onto the TCO layer 7120. The grid lines 7130 may be formed of, for example, low temperature silver pastes.

Next, conductive (eg, metal) back grid lines 7135 in FIG. 81i are screen printed onto the TCO layer 7125. The grid lines 7135 may be formed of low temperature silver pastes, for example.

Next, after deposition of grid lines 7130 and grid lines 7135, the solar cell is cured, for example, at a temperature of about 200° C. for about 30 minutes.

Next, in FIG. 81J, the solar cell is separated into solar cell strips 7155a, 7155b, 7155c, and 7155d by dicing the solar cell at the center of the trenches. Dicing can be done using conventional laser scribing and mechanical cutting at the centers of the trenches to cut the solar cell in line with the trenches. Optionally, dicing is a thermal laser separation process (e.g., Genoptics, Inc.) that induces a mechanical stress that results in the cutting of the solar cell such that laser induced heating at the centers of the trenches coincides with the trenches. Jenoptik AG). The latter approach can avoid thermal damage to the edges of the solar cells.

The resulting strip solar cells 7155a-7155d are different from the strip solar cells 7100a-7100d shown in FIG. 80. In particular, the edges of the a-Si:H layers 7110 and a-Si:H layers 7115 in the solar cells 7140a-7140d are formed by etching or laser patterning, not by mechanical cutting. In addition, the edges of the layers 7110 and layers 7115 in the solar cells 7155a-7155d are passivated by the TCO layer. As a result, the solar cells 7140a-7140d lack cut edges that enhance the charge recombination present in the solar cells 7100a-7100d.

The methods described with respect to FIGS. 81A-81J are intended to be illustrative rather than limiting. The steps described as being performed in specific sequences may be performed side by side with other sequences as appropriate. The steps and material layers can be omitted, added or substituted as appropriate. For example, if copper-plated metallization is used, then additional patterning and seed layer deposition steps can be included in the process. Also, in some variations, only the front a-Si:H layers 7110 are patterned to form isolation trenches, and isolation isolation trenches are not formed in the back a-Si:H layers 7115. In other variations, only the back a-Si:H layers 7115 are patterned to form isolation trenches, and isolation isolation trenches are not formed in the front a-Si:H layers 7115. As in the examples of FIGS. 81A-81J, dicing takes place at the centers of the trenches in these variations.

The formation of edges that promote the recombination during dicing of a conventional size HIT solar cell into narrow solar cell strips also uses the isolation trenches similar to that employed in the method described with respect to FIGS. 81A-81J. The method illustrated in Fig. 82j can be avoided.

Referring to FIG. 82A, in this example, the starting material is a cut-away wafer 7105 that is again about 156 mm square n-type monocrystalline silicon, for example about 1 ohm-centimeter to about 3 ohm- It can have a bulk resistivity of centimeters, for example about 180 microns thick.

Referring to FIG. 82B, trenches 7160 are formed in the front surface of the wafer 7105. These trenches can have depths of, for example, about 80 microns to about 150 microns, for example about 90 microns, and can have widths of about 10 microns to about 100 microns, for example. Device isolation trenches 7160 define the geometry of the solar cell strips formed from wafer 7105. As will be described next, the wafer 7105 will be cut to match these trenches. The trenches 7160 may be formed, for example, by conventional laser wafer scribing.

Next, the wafer 7105 in FIG. 82C is typically textured etched, acid washed, cleaned, and dried. The etch removes damage that is initially present in the wafer 7105 surfaces as it is typically cut or caused during the formation of the trenches 7160. The etch can also widen and deepen the trenches 7160.

Next, in Figure 82d, an intrinsic a-Si:H layer about 5 nm thick and a doped n+ a-Si:H layer about 5 nm thick (both layers together are denoted by reference numeral 7110), for example, about It is deposited on the front surface of the wafer 7105 at a temperature of 150°C to about 200°C, for example by PECVD.

Next, in FIG. 82E, an intrinsic a-Si:H layer about 5 nm thick and a doped p+ a-Si:H layer about 5 nm thick (both layers together are denoted by reference numeral 7115), for example, It is deposited on the back side of the wafer 7105 at a temperature of about 150°C to about 200°C, for example by PECVD.

Next, a TCO layer 7120 about 65 nm thick in FIG. 82F is deposited on the front a-Si:H layers 7110. This can be done, for example, by physical vapor deposition (PVD) or by ion plating. The TCO layer 7120 can fill the trenches 7160 and typically coat the walls and floors of the trenches 7160 and the outer edges of the layers 7110, thus passivating the coated surfaces. . The TCO layer 7120 also functions as an anti-reflective coating.

Next, a thick TCO layer 7125 of about 65 nm in FIG. 82G is deposited on the back a-Si:H layers 7115. This can be done, for example, by PVD or by ion plating. The TCO layer 7125 passivates the surfaces of the layers 7115 (eg, including the outer edges), and also functions as an anti-reflective coating.

Next, conductive (eg, metal) front grid lines 7130 in FIG. 82H are screen printed onto the TCO layer 7120. The grid lines 7130 may be formed of, for example, low temperature silver pastes.

Next, conductive (eg, metal) back grid lines 7135 in FIG. 82i are screen printed onto the TCO layer 7125. The grid lines 7135 may be formed of low temperature silver pastes, for example.

Next, after deposition of grid lines 7130 and grid lines 7135, the solar cell is cured, for example, at a temperature of about 200° C. for about 30 minutes.

Next, in FIG. 82J, the solar cell is separated into solar cell strips 7165a, 7165b, 7165c, and 7165d by dicing the solar cell in the trenches. Dicing can be accomplished using conventional mechanical cutting at the center of the trenches to cut the solar cell in line with the trenches. Optionally, dicing can be implemented using, for example, a thermal laser separation process as described above.

The resulting strip solar cells 7165a-7165d are different from the strip solar cells 7100a-7100d shown in FIG. 80. In particular, the edges of the a-Si:H layers 7110 in the solar cells 7165a-7165d are formed by etching, not by mechanical cutting. Also, the edges of the layers 7110 in the solar cells 7165a-7165d are passivated by the TCO layer. As a result, the solar cells 7165a-7165d lack cut edges that promote charge recombination present in the solar cells 7100a-7100d.

The methods described with respect to FIGS. 82A-82J are intended to be illustrative rather than restrictive. The steps described as being performed in a particular order may be performed side by side with other orders as appropriate. Steps and materials and layers may be omitted, added or substituted as appropriate. For example, if copper plated metallization is used, then additional patterning and seed layer deposition steps can be included in the process. Also, in some variations, trenches 7160 may be formed at the back side of the wafer 7105 rather than at the front side of the wafer 7105.

The methods described with respect to FIGS. 81A-81J and 86A-86J are applicable to both n-type and p-type HIT solar cells. The solar cells can be either front emitters or rear emitters. It may be desirable to apply a separation process to the side without the emitter. In addition, the use of isolation trenches and passivation layers as described above to reduce recombination on cut wafer edges can be applied to solar cells using other solar cell designs and materials systems other than silicon.

Referring again to FIG. 1, the string of series-connected solar cells 10 formed by the methods described above is shingled with ends of adjacent solar cells overlapping and electrically connected to form a super cell 100. Can be advantageously arranged in a de way. In the super cell 100, adjacent solar cells 10 are formed by an electrically conductive bonding material that electrically connects the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell. In the overlapping regions, they are conductively coupled to each other. Suitable electrically conductive bonding materials may include, for example, electrically conductive adhesives and electrically conductive adhesive films and adhesive tapes, and conventional solders.

Referring again to FIGS. 5A-5B, FIG. 5A is an exemplary rectangular solar light comprising twenty rectangular super cells 100 each having approximately the same length as half the length of the short sides of the solar module. The module 200 is shown. Super cells are arranged end to end in pairs to form ten rows of super cells, with the rows and super sides of the super cells being oriented parallel to the short sides of the solar module. In other variations, each column of super cells can include three or more super cells. Further, in other variations, the super cells can be arranged end to end in rows, and the rows and long sides of the super cells can be oriented parallel to the long sides of a rectangular solar module, or a square sun It can be oriented parallel to the side of the optical module. Moreover, the solar module may include more or fewer super cells than those shown in this example and more or fewer rows of super cells.

In variations where the super cells in each row are arranged such that at least one of them has a front end contact on the end of the super cell adjacent to the other super cell in the row, the optional gap shown in FIG. 5A ( 210) may be present to enable electrical contact to the front end contacts of the super cells 100 along the centerline of the solar module. In variants where each row of super cells includes three or more super cells, additional optional gaps between the super cells are similarly in electrical contact to front end contacts located away from the sides of the solar module. It can exist to make it possible.

5B shows another exemplary rectangular solar module 300 including ten rectangular super cells 100 each having a length approximately equal to the length of the short sides of the solar module. The super cells are arranged with their long sides oriented parallel to the short sides of the module. In other variations, the super cells can have approximately the same lengths as the lengths of the long sides of the rectangular solar module, and will be oriented with their long sides parallel to the long sides of the solar module. Can. The super cells may also have lengths approximately equal to the lengths of the sides of the square solar module, and may be arranged with their long sides oriented parallel to the sides of the solar module. In addition, the solar module can include more or less of these side length super cells than shown in this example.

FIG. 5B also shows how the solar module 200 of FIG. 5A looks when there is no gap between super cells adjacent to each other within the rows of super cells in the solar module 200. Any other suitable arrangement of super cells 100 within the solar module can also be used.

The following paragraphs provide additional, non-limiting aspects of the invention.

1.Solar module,

Having a series-connected string of rectangular or substantially rectangular solar cells having an average breakdown voltage of at least about 10 volts of N≥25, the solar cells being adjacent and electrically conductively bonded to each other with an overlapping electrically and thermally conductive adhesive Grouped into one or more super cells comprising two or more of the solar cells arranged in line with the long sides of the solar cells;

A single solar cell or group of <N solar cells in the string of solar cells is not individually electrically connected in parallel with the bypass diode.

2. In the solar module of item 1, N is an integer greater than or equal to 30.

3. In the solar module of item 1, N is an integer greater than or equal to 50.

4. In the solar module of item 1, N is an integer greater than or equal to 100.

5. In the solar module of item 1, the adhesive is less than or equal to about 0.1 mm in thickness or less orthogonal to the solar cells between adjacent solar cells and about 1.5w/m/k orthogonal to the solar cells. Form bonds with greater or equal thermal conductivity.

6. In the solar module of item 1, the N solar cells are grouped into a single super cell.

7. In the solar module of item 1, the super cells are sealed with a polymer.

7A. In the solar module of item 7, the polymer comprises a thermoplastic olefin polymer.

7B. In the solar module of item 7, the polymer is interposed between the glass front sheet and the back sheet.

7C. In the solar module of item 7B, the back sheet comprises glass.

8. In the solar module of item 1, the solar cells are silicon solar cells.

9. Solar modules,

A super cell substantially crossing the entire length or width of the photovoltaic module parallel to the edge of the photovoltaic module, wherein the super cells are adjacent to each other and are electrically and thermally conductive adhesives that are conductively coupled to each other. A series of strings of N rectangular or substantially rectangular solar cells having a breakdown voltage of at least about 10 volts arranged in line with the long sides of the solar cells;

A single solar cell or group of <N solar cells in the super cell is not individually electrically connected in parallel with the bypass diode.

10. In the solar module of item 9, N>24.

11. In the solar module of item 9, the super cell has a length in the direction of current flow of at least about 500 mm.

12. In the solar module of item 9, the super cells are encapsulated in a thermoplastic olefin polymer interposed between the glass front and back sheets.

13. Super Cell,

It is provided with a plurality of silicon solar cells, each silicon solar cell comprising:

And a rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second opposing parallel long sides and two opposing short sides. Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and including at least one front contact pad positioned adjacent to the first long side surface;

An electrically conductive back metallization pattern disposed on the back surface and including at least one back contact pad positioned adjacent to the second long side;

The silicon solar cells are in line with the first and second long sides of overlapping adjacent silicon solar cells, overlapping to electrically connect the silicon solar cells in series, and conductively bonded with a conductive adhesive bonding material Are arranged in line with the front and rear contact pads on the silicon solar cells;

The front metallization pattern of each silicon solar cell includes a barrier configured to substantially limit the conductive adhesive bonding material to at least one front contact pad prior to curing of the conductive adhesive bonding material during manufacture of the super cell. .

14. In the super cell of clause 13, for each pair of adjacent and overlapping silicon solar cells, the barrier on one front surface of the silicon solar cells is overlapped and hidden by a portion of the other silicon solar cell, and accordingly The conductive adhesive bonding material is substantially limited to overlapping areas of the front surface of the silicon solar cell prior to curing of the conductive adhesive bonding material during manufacture of a super cell.

15. In the super cell of item 13, the barrier has at least one front contact pad positioned between the continuous conductive line and the first long side of the solar cell, such that the substantially full length of the first long side. It includes a series of conductive lines that run parallel to.

16. In the super cell of item 15, the front metallization pattern is electrically connected to the at least one front contact pads, and includes fingers running perpendicular to the first long side, and the continuous conductive line is The fingers are electrically interconnected to provide multiple conduction passages from each finger to at least one front contact pad.

17. In the super cell of item 13, the front metallization pattern includes a plurality of distinct contact pads arranged in rows adjacent to and parallel to the first long side, the barrier being conductive during manufacture of the super cell And a plurality of features forming separate barriers for each separate contact pad that substantially constrains the conductive adhesive bonding material to the separate contact pads prior to curing of the adhesive bonding material.

18. In the super cell of matter 17, the separated barriers are adjacent to and larger than their corresponding separate contact pads.

19. Super Cell,

It includes a plurality of silicon solar cells, each silicon solar cell,

Having rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second opposingly positioned parallel long sides and two opposingly positioned short sides, wherein at least some of the front surfaces are Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and including at least one front contact pad positioned adjacent to the first long side surface;

An electrically conductive back metallization pattern disposed on the back surface and including at least one back contact pad positioned adjacent to the second long side;

The silicon solar cells are overlapped and adjacent silicon solar cells having front and rear contact pads on adjacent silicon solar cells that are overlapped to electrically connect the silicon solar cells in series and conductively coupled to each other with a conductive adhesive bonding material. Arranged in line with the first and second long sides of the;

The back metallization pattern of each silicon solar cell provides a barrier configured to substantially limit the conductive adhesive bonding material to the at least one back contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell. Includes.

20. In the super cell of matter 19, the back metallization pattern comprises one or more distinct contact pads arranged in rows adjacent and parallel to the second long side, the barrier during the manufacture of the super cell And a plurality of features forming separate barriers for each distinct contact pad that substantially limits the conductive adhesive bonding material to the separate contact pads prior to curing of the conductive adhesive bonding material.

21. In the super cell of point 20, the separate barriers are adjacent to their corresponding separate contact pads. Bigger than that.

22. A method of making a string of solar cells, the method comprising:

Dicing one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells each having substantially the same length along its long axis; And

Arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

The plurality of rectangular silicon solar cells includes at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of corners of the pseudo-square wafer, and one or more rectangular solar cells Silicon solar cells each lack chamfered edges;

The gap between the parallel lines on which the pseudo-square wafer is diced accordingly is the rectangular silicon lacking the chamfered edges to a width orthogonal to the long axis of the rectangular silicon solar cells including the chamfered edges. Compensating the chamfered edges by making it larger than the width orthogonal to the long axis of the solar cells, such that each of the plurality of rectangular silicon solar cells in the string of solar cells is exposed to light in operation of the string of solar cells. It is selected to have a front face with substantially the same area.

23. The string of solar cells,

A plurality of silicon solar cells arranged in series with ends of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

At least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of a pseudo-square silicon wafer that has been diced therefrom, and at least one of the silicon solar cells lacks the chamfered corners, Each of the silicon solar cells has a substantially equal area front surface exposed to light during operation of the string of solar cells.

24. A method of making two or more strings of solar cells, the method comprising:

* A first plurality of rectangular silicon solar cells comprising chamfered corners corresponding to the corners or portions of the corners of the pseudo square silicon wafers, and the total width of each first length of the pseudo square silicon wafers Dicing one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a second plurality of rectangular silicon solar cells overlying and lacking chamfered edges;

The chamfered edge from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each shorter than the first length and lacking chamfered edges. Removing them;

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the first length. Arranging the second plurality of rectangular silicon solar cells in line with a field; And

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the third plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the second length. And arranging the third plurality of rectangular silicon solar cells in line with the field.

25. A method of making two or more strings of solar cells, the method comprising:

First plurality of rectangular silicon solar cells comprising chamfered corners corresponding to corners or portions of corners of pseudo square silicon wafers and second plurality of rectangular silicon solar cells lacking chamfered corners Dicing one or more pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form them;

The first plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the first plurality of rectangular silicon solar cells in series. To do; And

The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series. It includes the steps.

26. In the method of making a solar module, the method,

A plurality of rectangular silicon solar cells including chamfered edges corresponding to edges of the pseudo square silicon wafers from a plurality of pseudo square silicon wafers and a plurality of rectangular silicon suns lacking the chamfered edges. Dicing each of the plurality of pseudo square silicon wafers along a plurality of lines parallel to the long edge of the wafer to form cells;

A product comprising only rectangular silicon solar cells each lacking chamfered edges arranged in line with long sides of the silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; 1 arranging at least some of the rectangular silicon solar cells lacking chamfered edges to form a plurality of super cells;

A product comprising only rectangular silicon solar cells each including chamfered edges arranged in line with long sides of the silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. 2 arranging at least a portion of the rectangular silicon solar cells including chamfered edges to form a plurality of super cells; And

And arranging the super cells in parallel rows of super cells of substantially the same length to form the front surface of the solar module.

27. The solar module of item 26, wherein two of the rows of super cells adjacent to the parallel opposing edges of the solar module include only super cells from the second plurality of super cells, and a super cell. All other columns of include only super cells from the first plurality of super cells.

28. The solar module of item 27, wherein the solar module includes a total of six rows of super cells.

29. Super Cell,

A plurality of silicon solar cells arranged in a first direction with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; And

Conductive to the front or rear of one of the ends of the silicon solar cells at three or more distinct positions arranged along the second direction, having its long axis oriented parallel to the second direction orthogonal to the first direction Coupled, and running in at least the full width of the end solar cell in the second direction, having a conductor thickness less than or equal to about 100 microns, measured orthogonally to the front or rear of the end silicon solar cell, about 0.012 ohm Provides resistance to current flow in the second direction that is less than or equal, and provides differential expansion between the end silicon solar cell and the interconnect in the second direction for a temperature range of about -40°C to about 85°C And an extended and flexible electrical interconnect configured to provide accepting flexibility.

30. In the super cell of point 29, the dielectric electrical interconnect has a conductor thickness less than or equal to about 30 microns, measured orthogonally to the front and back of the end silicon solar cell.

31. In the super cell of point 29, the flexible electrical interconnect passes through the super cell to provide electrical interconnection to at least a second super cell located parallel and adjacent to the super cell in the solar module in the second direction. Is extended.

32. In the super cell of matter 29, the flexible electrical interconnect is:

It extends in the first direction past the super cell to provide electrical interconnection to at least the second super cell located parallel and in parallel with the super cell in the solar module.

33. Solar modules,

It comprises a plurality of super cells arranged in two or more parallel rows across the width of the module to form the front side of the module, each super cell overlapping and electrically conductive with each other to electrically connect the silicon solar cells in series. A plurality of silicon solar cells arranged in line with ends of adjacent silicon solar cells to be joined;

At least an end of the first super cell adjacent to the edge of the module in the first row is electrically conductive adhesive bonding material coupled to the front surface of the first super cell at a plurality of separate locations, the edge of the module A second super adjacent to the same edge of the module in a second row through a flexible electrical interconnect that runs parallel to and at least partially folds around the end of the first super cell and is hidden from view from the front of the module It is electrically connected to the end of the cell.

34. In the solar module of item 33, the surfaces of the flexible electrical interconnect on the front of the module are covered or colored to reduce visual contrast with the super cells.

35. In the solar module of item 33, two or more parallel rows of the super cells are arranged on a white back sheet to form the front side of the solar module illuminated by solar radiation during operation of the solar module. Wherein the white back sheet includes darkened stripes with positions and widths corresponding to the widths and positions of the gaps between the parallel rows of super cells, and the white portions of the back sheets are the gaps between the columns. Invisible through them.

36. A method of making a string of solar cells, the method comprising:

Laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular areas on the silicon solar cells;

Applying the one or more scribed silicon solar cells to an electrically conductive adhesive bonding material at one or more locations adjacent to the long side of each rectangular area;

Separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bonding material disposed on its front side adjacent to the long side;

Arranging the plurality of rectangular silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween. ; And

Curing the electrically conductive bonding material, coupling adjacent and overlapping rectangular silicon solar cells to each other and electrically connecting them in series.

37. A method of making a string of solar cells, the method comprising:

Laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular areas on the silicon solar cells, each solar cell having a top surface and an opposite surface. It has a bottom surface to be located;

Applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells;

A vacuum is applied between the bottom surfaces of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against a curved support surface, and each is placed on its front side along a long side. Cutting the one or more silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells having a portion of the electrically conductive adhesive bonding material;

Arranging the plurality of rectangular silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween. It includes;

Curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

38. In the method of matter 37, the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and then one or more scribes on each of the one or more silicon solar cells. And laser scribing the lines.

9. In the method of matter 37, laser scribing the one or more scribe lines on each of the one or more silicon solar cells, followed by the one or more of the electrically conductive adhesive bonding material. And applying the above silicon solar cells.

40. The solar module,

A plurality of super cells arranged in two or more parallel rows to form the front surface of the solar module, each super cell overlapping and electrically conductively coupled to each other to electrically connect the silicon solar cells in series. A plurality of silicon solar cells arranged in line with the ends of the silicon solar cells, each super cell having a front end contact at one end of the super cell and a rear end of opposite polarity at the opposite end of the super cell Contacts;

The first row of super cells comprises a first super cell arranged with its front end contacts adjacent and parallel to the first edge of the solar module, wherein the solar module extends and Running parallel to the first edge, conductively coupled to the front end contact of the first super cell, occupying only a narrow portion of the front side of the solar module adjacent to the first edge of the solar module, the sun And a first flexible electrical interconnect not wider than about 1 centimeter measured orthogonal to the first edge of the optical module.

41. In the solar module of item 40, a portion of the first flexible electrical interconnect extends around the end of the first super cell closest to the first edge of the solar module and behind the first super cell.

42. In the solar module of item 40, the first flexible interconnect comprises a thin ribbon portion conductively coupled to the front end contact of the first super cell and a thick portion running parallel to the first edge of the solar module. Includes.

43. In the solar module of item 40, the first flexible interconnect comprises a thin ribbon portion conductively coupled to the front end contact of the first super cell and a coiled (parallel) parallel to the first edge of the solar module ( colied) includes the ribbon part.

44. In the solar module of matter 40, the second row of super cells comprises a second super cell arranged with its front end contact adjacent and parallel to the first edge of the solar module, the first The front end contact of the super cell is electrically connected to the front end contact of the second super cell via the first flexible electrical interconnect.

45. In the solar module of item 40, the rear end contact of the first super cell is located adjacent to and parallel to the second edge of the solar module opposite from the first edge of the solar module, extending and And a second flexible electrical interconnect running parallel to the second edge of the solar module, conductively coupled to the rear end contact of the first super cell, and placed entirely behind the super cells.

46. In the solar module of matter 45,

The second row of super cells is arranged with a front end contact adjacent to and parallel to the first edge of the photovoltaic module and its rear end contact adjacent to and parallel to the second edge of the photovoltaic module. 2 super cells;

The front end contact of the first super cell is electrically connected to the front end contact of the second super cell via the first flexible electrical interconnect;

The rear end contact of the first super cell is electrically connected to the rear end contact of the second super cell via the second flexible electrical interconnect.

47. In the solar module of matter 40,

A second rear end contact arranged in series with the first super cell in the first row of super cells and adjacent to the second edge of the solar module opposite the first edge of the solar module Super cell; And

And a second flexible electrical interconnect that extends and runs parallel to the second edge of the solar module, is conductively coupled to the rear end contact of the first super cell, and lies entirely behind the super cells.

48. In the solar module of matter 47,

The second row of super cells includes a third super cell and a fourth super cell arranged in series, wherein the front end contact of the third super cell is adjacent to the first edge of the solar module, and the fourth super The rear end contact of the cell is adjacent to the second edge of the solar module;

The front end contact of the first super cell is electrically connected to the front end contact of the third super cell through the first flexible electrical interconnect, and the rear end contact of the second super cell connects the second flexible electrical interconnect. It is electrically connected to the rear end contact of the fourth super cell.

49. In the solar module of item 40, the super cells are white back sheets comprising darkened stripes having positions and widths corresponding to positions and widths of gaps between parallel rows of the super cells. Arranged on top, the white portions of the back sheets are not visible through the gaps between the rows.

50. In the solar module of item 40, all parts of the first flexible electrical interconnect located on the front side of the solar module are covered or colored to reduce visible contrast with the super cells.

51. In the solar module of matter 40,

Each silicon solar cell,

A rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, at least a portion of the front surfaces Are exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization comprising a plurality of fingers disposed perpendicularly to the long sides and orthogonal to the long sides and a plurality of separate front contact pads located in a row adjacent to the first long side. A pattern, each front contact pad being electrically connected to at least one of the fingers;

An electrically conductive back metallization pattern disposed on the back surface and including a plurality of separate back contact pads located in a row adjacent to the second long side;

Within each super cell, the silicon solar cells are aligned with separate front contact pads that overlap and correspond to the first and second long sides of adjacent silicon solar cells to electrically connect the silicon solar cells in series, and They are arranged in series with separate back contact pads on adjacent silicon solar cells that overlap and are conductively bonded to each other with a conductive adhesive bonding material.

52. In the solar module of item 51, the front metallization pattern of the silicon solar cell comprises a plurality of thin conductors electrically interconnecting adjacent separate front contact pads, each thin conductor of the solar cells. It is thinner than the width of the separate contact pads, measured perpendicular to the long sides.

53. In the solar module of item 51, the conductive adhesive bonding material is characterized by the features of the front metallization pattern forming one or more barriers adjacent to the separate front contact pads, thereby providing the distinct front contact pads. Practically limited to their locations.

54. In the solar module of item 51, the conductive adhesive bonding material is positioned on the separate rear contact pads by the back metallization pattern features forming one or more barriers adjacent to the separate back contact pad. It is practically limited to.

55. A method of making a solar module, the method comprising:

Assembling a plurality of super cells, each super cell having a plurality of rectangular silicon solar cells arranged in series at ends on long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner. And;

The electrically conductive bonding material disposed between the overlapping ends of the adjacent rectangular silicon solar cells is cured by applying heat and pressure to the super cells, thereby adhering adjacent and overlapping rectangular silicon solar cells to each other. Combining and electrically connecting them in series;

Arranging and interconnecting the super cells in a desired solar module configuration with a stack of layers comprising encapsulant;

And applying heat and pressure to the stack of layers to form a laminated structure.

56. In the method of item 55, apply heat and pressure to the super cells prior to applying heat and pressure to the stack of layers to form the laminated structure to cure or partially cure the electrically conductive bonding material. Curing, to form cured or partially cured super cells as an incremental product prior to forming the laminated structure.

57. In the method of item 56, each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, while the electrically conductive adhesive bond between the newly added solar cell and its adjacent and overlapping solar cell. A rectangular silicon solar cell with different materials is cured or partially cured before being added to the super cell.

58. In the method of item 56, curing or partially curing all of the electrically conductive binding materials in the super cell in the same step.

59. In the method of matter 56,

Before applying the heat and pressure to the stack of layers to form a laminated structure, partially apply the heat and pressure to the super cells to partially cure the electrically conductive bonding material, before forming the laminated structure. Forming partially cured super cells as an intermediate product; And

And completing curing of the electrically conductive bonding material while applying heat and pressure to the stack of layers to form the laminated structure.

60. In the method of item 55, heat and pressure are applied to the stack of layers to form the laminated structure without forming cured or partially cured super cells as an intermediate product prior to forming the laminated structure. While, it comprises the step of curing the electrically conductive bonding material.

61. In the method of item 55, dicing one or more silicon solar cells into rectangular shapes to provide the rectangular silicon solar cells.

62. The method of clause 61, wherein the electrically conductive adhesive bonding material is re-divided prior to dicing the one or more silicon solar cells to provide rectangular silicon solar cells having a pre-applied electrically conductive adhesive bonding material. And applying to one or more silicon solar cells.

63. In the method of matter 62, the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and thereafter one or more lines on each of the one or more silicon solar cells. Using a laser to scribe them, and then cutting the one or more silicon solar cells along the scribe lines.

64. In the method of matter 62, a laser is used to scribe one or more lines on each of the one or more silicon solar cells, and then the electrically conductive adhesive bonding material is applied to the one or more. Applying to silicon solar cells, and then cutting the one or more silicon solar cells along the scribe lines.

65. In the method of matter 62, the electrically conductive adhesive bonding material is applied to the top surface of each of the one or more silicon solar cells, and the oppositely located bottom surface of each of the one or more silicon solar cells. Not applied, and vacuum is applied between the bottom surfaces of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface, thereby scribing lines. Thus cutting the one or more silicon solar cells.

66. In the method of clause 61, dicing the one or more silicon solar cells to provide the rectangular silicon solar cells and applying the electrically conductive adhesive bonding material to the rectangular silicon solar cells. It includes.

67. In the method of item 55, the conductive adhesive bonding material has a glass transition temperature less than or equal to about 0°C.

1A. The solar module,

A plurality of super cells arranged in two or more parallel rows to form the front surface of the photovoltaic module, each super cell overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. A plurality of silicon solar cells arranged in line with the ends of the silicon solar cells, each super cell having a front end contact at one end of the super cell and a rear end of opposite polarity at the opposite end of the super cell. Having a contact;

The first row of super cells has a first super cell arranged with a front end contact adjacent and parallel to the first edge of the solar module, wherein the solar module is

It extends and runs parallel to the first edge of the photovoltaic module, is conductively coupled to the front end contact of the first super cell, and narrows the front of the photovoltaic module adjacent to the first edge of the photovoltaic module. And a first flexible electrical interconnect that occupies only a portion and is not wider than about 1 centimeter measured orthogonally to the first edge of the solar module.

2A. In the solar module of item 1A, a portion of the first flexible electrical interconnect extends around the end of the first super cell closest to the first edge of the solar module and behind the first super cell.

3A. In the solar module of item 1A, the first flexible interconnect includes a thin ribbon portion conductively coupled to the front end contact of the first super cell and a thicker portion running parallel to the first edge of the solar module. do.

4A. In the solar module of item 1A, the first flexible interconnect comprises a thin ribbon portion that is conductively coupled to the front end contact of the first super cell and a coiled ribbon portion that runs parallel to the first edge of the solar module. Includes.

5A. In the solar module of item 1A, the second row of super cells comprises a second super cell arranged with its front end contact adjacent and parallel to the first edge of the solar module, the first super cell The front end contact of is electrically connected to the front end contact of the second super cell through the first flexible electrical interconnect.

6A. In the solar module of item 1A, the rear end contact of the first super cell is located adjacent to and parallel to the second edge of the solar module opposite the first edge of the solar module, and And a second flexible electrical interconnect extending and running parallel to the second edge, conductively coupled to the rear end contact of the first super cell, and placed entirely behind the super cells.

7A. In solar module of matter 6A,

The second row of super cells is arranged with a front end contact adjacent to and parallel to the first edge of the photovoltaic module and its rear end contact adjacent to and parallel to the second edge of the photovoltaic module. 2 super cells;

The front end contact of the first super cell is electrically connected to the front end contact of the second super cell via the first flexible electrical interconnect;

The rear end contact of the first super cell is electrically connected to the rear end contact of the second super cell through the second flexible electrical interconnect.

8A. In the solar module of matter 1A,

A second super cell arranged in a first row of super cells in series with the first super cell and having a rear end contact adjacent a second edge of the solar module opposite the first edge of the solar module; And

And a second flexible electrical interconnect extending and running parallel to the second edge of the photovoltaic module, conductively coupled to the rear end contact of the first super cell, and placed entirely behind the super cells.

9A. In solar module of matter 8A,

The second row of super cells is in series with a front end contact of a third super cell adjacent to the first edge of the solar module and a rear end contact of a fourth super cell adjacent to the second edge of the solar module. And a third super cell and a fourth super cell arranged in;

The front end contact of the first super cell is electrically connected to the front end contact of the third super cell through the first flexible electrical interconnect, and the rear end contact of the second super cell connects the second flexible electrical interconnect. It is then electrically connected to the rear end contact of the fourth super cell.

10A. In the solar module of item 1A, there are no electrical interconnects between the super cells that reduce the active areas in front of the module away from the outer edges of the solar module.

11A. In the solar module of item 1A, at least one pair of super cells has one rear end contact of the pair of super cells adjacent to the other rear end contact of the pair of super cells and is arranged in a row in a row. do.

12A. In the solar module of matter 1A,

At least one pair of super cells is arranged in a row in a row with adjacent ends of the two super cells having end contacts of opposite polarity;

The adjacent ends of the pair of super cells overlap;

The super cells in the pair of super cells are interposed between their overlapping ends and electrically connected in series by a flexible electrical interconnect that does not shade the front surface.

13A. In the solar module of item 1A, the super cells are arranged on a white back sheet having parallel darkened stripes with positions and widths corresponding to positions and widths of gaps between parallel rows of the super cells. And the white portions of the back sheets are not visible through the gaps between the rows.

14A. In the solar module of item 1A, all parts of the first flexible electrical interconnect located on the front side of the solar module are covered or colored to reduce visible contrast with the super cells.

15A. In the solar module of matter 1A,

Each silicon solar cell,

A rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and having a plurality of fingers orthogonal to the long side surfaces and a plurality of separate front contact pads positioned in rows adjacent to the first long side surface. And, each front contact pad is electrically connected to at least one of the fingers;

An electrically conductive back metallization pattern disposed on the back surface and having a plurality of distinct back contact pads positioned in rows adjacent to the second long side;

Within each super cell, the silicon solar cells are first and second long sides of overlapping adjacent silicon solar cells and aligned, overlapped, and made of a conductive adhesive bonding material to electrically connect the silicon solar cells in series. It is arranged in line with corresponding separate front contact pads and separate rear contact pads on adjacent silicon solar cells that are conductively coupled to each other.

16A. In the solar module of item 15A, the front metallization pattern of each silicon solar cell comprises a plurality of thin conductors electrically interconnecting adjacent separate front contact pads, each thin conductor being a long side of the solar cells. It is thinner than the width of the separate contact pads measured orthogonally to the side surfaces.

17A. In the solar module of item 15A, the conductive adhesive bonding material is substantially limited to the positions of the separate front contact pads by the features of the front metallization pattern forming barriers around each separate front contact pad. do.

18A. In the solar module of item 15A, the conductive adhesive bonding material is substantially limited to the positions of the separate rear contact pads by the features of the rear metallization pattern forming barriers around each separate rear contact pad. do.

19A. In the solar module of item 15A, the separate rear contact pads are separate silver rear contact pads, and except for the separate silver rear contact pads, the rear metallization pattern of each silicon solar cell is attached to an adjacent silicon solar cell. Does not contain silver contacts in any position that lies beneath a portion of the front of the solar cell that is not overlapped by.

20A. The solar module,

Comprising a plurality of super cells, each super cell having a plurality of silicon solar cells arranged in series with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; ;

Each silicon solar cell,

A rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and having a plurality of fingers orthogonal to the long side surfaces and a plurality of separate front contact pads positioned in rows adjacent to the first long side surface. Including,

Each front contact pad is electrically connected to at least one of the fingers;

An electrically conductive back metallization pattern disposed on the back surface and having a plurality of distinct back contact pads positioned in rows adjacent to the second long side;

The silicon solar cells in each super cell are first and second long sides of the overlapping and adjacent silicon solar cells and aligned, overlapped, conductive to each other with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. Arranged in series with corresponding separate front contact pads and separate rear contact pads on adjacent silicon solar cells coupled to;

The super cells are a single row or two or more parallel rows that substantially traverse the length or width of the solar module to form the front side of the solar module illuminated by solar radiation during operation of the solar module. It is arranged as

21A. In the solar module of item 20A, the separate rear contact pads are separate silver rear contact pads, and except for the separate silver rear contact pads, the rear metallization pattern of each silicon solar cell is attached to an adjacent silicon solar cell. It does not contain a silver contact at any location that lies beneath a portion of the front side of the solar cell that is not overlapped by it.

22A. In the solar module of item 20A, the front metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent separate front contact pads, each thin conductor being a long side of the solar cells. It is thinner than the width of the separate contact pads measured orthogonally to the side surfaces.

23A. In the solar module of item 20A, the conductive adhesive bonding material is substantially limited to the positions of the separate front contact pads by the features of the front metallization pattern forming barriers around each separate front contact pad. do.

24A. In the solar module of item 20A, the conductive adhesive bonding material is substantially limited to the positions of the separate rear contact pads by the features of the rear metallization pattern forming barriers around each separate rear contact pad. do.

25A. Super Cell,

It includes a plurality of silicon solar cells, each silicon solar cell,

A rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and having a plurality of fingers orthogonal to the long side surfaces and a plurality of separate front contact pads positioned in rows adjacent to the first long side surface. And, each front contact pad is electrically connected to at least one of the fingers;

An electrically conductive back metallization pattern disposed on the back surface and having a plurality of distinct silver back contact pads positioned in rows adjacent to the second long side;

The silicon solar cells are first and second long sides of the overlapping and adjacent silicon solar cells and the adjacent, which are arranged, overlapped and electrically conductively coupled to each other with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. To be arranged in line with separate front contact pads and separate back contact pads on the silicon solar cells.

26A. In the solar module of item 25A, the separate rear contact pads are separate silver rear contact pads, and except for the separate silver rear contact pads, the rear metallization pattern of each silicon solar cell is attached to an adjacent silicon solar cell. It does not contain a silver contact at any location that lies beneath a portion of the front side of the solar cell that is not overlapped by it.

27A. In the string of solar cells of item 25A, the front metallization pattern comprises a plurality of thin conductors electrically interconnecting adjacent separate front contact pads, each thin conductor orthogonal to the long sides of the solar cells. Is thinner than the width of the separate contact pads.

28A. In the string of solar cells of item 25A, the conductive adhesive bonding material is substantially limited to the locations of the separate front contact pads by features of the front metallization pattern forming barriers around each separate front contact pad. do.

29A. In the string of solar cells of item 25A, the conductive adhesive bonding material is substantially limited to the locations of the separate rear contact pads by the features of the rear metallization pattern forming barriers around each separate rear contact pad. do.

30A. In the string of solar cells of item 25A, the conductive adhesive bonding material has a glass transition less than or equal to about 0°C.

31A. In the method of making a solar module, the method,

* Comprising assembling a plurality of super cells, each super cell comprising a plurality of rectangular silicon solar cells arranged in line with ends on long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner. Equipped;

Curing an electrically conductive bonding material disposed between overlapping ends of the adjacent rectangular silicon solar cells by applying heat and pressure to the super cells to couple adjacent and overlapping rectangular silicon solar cells to each other And electrically connecting them in series;

Arranging and interconnecting the super cells in a desired solar module configuration with a stack of layers comprising an encapsulant;

And applying heat and pressure to the stack of layers to form a laminated structure.

32A. In the method of item 31A, prior to applying heat and pressure to the stack of layers to form the laminated structure, heat or pressure is applied to the super cells to cure or partially cure the electrically conductive bonding material. Curing to form cured or partially cured super cells as an intermediate product prior to forming the laminated structure.

33A. In the method of item 32A, as each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the electrically conductive adhesive bond between the newly added solar cell and its adjacent and overlapping solar cell. A rectangular silicon solar cell with different materials is cured or partially cured before being added to the super cell.

34A. In the method of item 32A, curing or partially curing all of the electrically conductive binding materials in the super cell in the same step.

35A. In the method of matter 32A,

Forming the laminated structure by partially curing the electrically conductive bonding material by applying heat and pressure to the super cells prior to applying heat and pressure to the stack of layers to form a laminated structure Forming partially cured super cells as an intermediate product prior to; And

And completely curing the electrically conductive bonding material while applying heat and pressure to the stack of layers to form the laminated structure.

36A. In the method of item 31A, the electrically conductive, applying heat and pressure to the stack of layers to form the laminated structure without forming partially cured super cells as an intermediate product prior to forming the laminated structure. Curing the adult binding material.

37A. In the method of item 31A, dicing one or more silicon solar cells into rectangular shapes to provide the rectangular silicon solar cells.

38A. In the method of clause 37A, before dicing the one or more silicon solar cells to provide rectangular silicon solar cells having a pre-applied electrically conductive adhesive bonding material, the one or And applying to further silicon solar cells.

39A. In the method of item 38A, the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and then scribe one or more lines on each of the one or more silicon solar cells. And subsequently cutting the one or more silicon solar cells along the scribe lines.

40A. In the method of clause 38A, a laser is used to scribe one or more lines on the one or more silicon solar cells, and then the electrically conductive adhesive bonding material is used to form the one or more silicon solar cells. And subsequently cutting the one or more silicon solar cells along the scribe lines.

41A. In the method of item 38A, the electrically conductive adhesive bonding material is applied to the top surface of each of the one or more silicon solar cells, and is not applied to the oppositely located bottom surface of each of the one or more silicon solar cells. A vacuum is applied between the bottom surfaces of the one or more silicon solar cells and the support surface of the curve to bend the one or more silicon solar cells against a curved support surface, thus along the scribe lines And cutting one or more silicon solar cells.

42A. In the method of item 37A, dicing the one or more silicon solar cells to provide the rectangular silicon solar cells and applying the electrically conductive adhesive bonding material to the rectangular silicon solar cells. do.

43A. In the method of item 31A, the conductive adhesive bonding material has a glass transition temperature less than or equal to about 0°C.

44A. In the method of making a super cell, the method,

Laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular areas on the silicon solar cells, the long side of each rectangular area. Applying an electrically conductive adhesive bonding material at one or more locations adjacent to the one or more scribed silicon solar cells;

Separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells each comprising a portion of the electrically conductive adhesive bonding material disposed on its front side adjacent to the long side. and;

Arranging the plurality of rectangular silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween. It includes;

And curing the electrically conductive bonding material to bond the adjacent and overlapping rectangular silicon solar cells, and electrically connecting them in series.

45A. In the method of making a super cell, the method,

Laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell having a top surface and an opposite surface. It has a bottom surface to be located;

Applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells;

A vacuum is applied between the bottom surfaces of the one or more silicon solar cells and the support surface of the curve to bend the one or more silicon solar cells against a curved support surface, thereby adjoining each of the long side surfaces. Cutting the one or more silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells comprising a portion of the electrically conductive adhesive bonding material disposed on the front surface;

Arranging the plurality of rectangular silicon solar cells in series on long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween. It includes;

Curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

46A. In the method of making a super cell, the method,

Dicing one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells each having substantially the same length along its long axis; And

Arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

The plurality of rectangular silicon solar cells have at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of corners of the pseudo-square wafer and one lacking chamfered corners, or Having more rectangular silicon solar cells;

The spacing between parallel lines along which the pseudo-square wafer is diced is a rectangular silicon sun lacking the chamfered edges and a width perpendicular to the progress of the rectangular silicon solar cells having the chamfered corners. Make it larger than the width orthogonal to the tightening of the cells, so that each of the plurality of rectangular silicon solar cells in the string of solar cells has a substantially equal area front surface exposed to light during operation of the string of solar cells. do.

47A. Super Cell,

A plurality of silicon solar cells arranged in series with the dents of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

* At least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of the pseudo-square silicon wafer on which it is diced, and at least one of the silicon solar cells lacks the chamfered corners , Each of the silicon solar cells has a substantially equal area front surface exposed to light during operation of the string of solar cells.

48A. A method of making two or more super cells, the method comprising:

A first plurality of rectangular silicon solar cells having chamfered edges corresponding to the edges or portions of the edges of the pseudo square silicon wafers and a second length each spanning the entire length of the pseudo square silicon wafers Dicing one or more pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a second plurality of rectangular silicon solar cells having and lacking chamfered edges;

The chamfered edge from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the second length and lacking chamfered edges. Removing them;

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the first length Arranging the second plurality of rectangular silicon solar cells in line with a field; And

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the third plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the second length. And arranging the third plurality of rectangular silicon solar cells in line with the field.

49A. A method of making two or more super cells, the method comprising:

First plurality of rectangular silicon solar cells having chamfered corners corresponding to corners or portions of corners of the pseudo square silicon wafers and the second plurality of rectangular silicon solar cells lacking chamfered corners Dicing one or more pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form them;

The first plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the first plurality of rectangular silicon solar cells in series. To do; And

The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series. It includes the steps.

50A. The solar module,

A series of strings of rectangular or substantially rectangular solar cells of N≥25 having an average breakdown voltage greater than about 10 volts, wherein the solar cells are conductively bonded to each other with overlapping and electrically and thermally conductive adhesive Grouped into one or more super cells each having two or more of the solar cells arranged in line with the long sides of adjacent solar cells;

A single solar cell or group of <N solar cells in the string of solar cells is not individually electrically connected in parallel with the bypass diode.

51A. In the solar module of matter 50A, N is an integer greater than or equal to 30.

52A. In the solar module of matter 50A, N is an integer greater than or equal to 50.

53A. In the solar module of matter 50A, N is an integer greater than or equal to 100.

54A. In the solar module of item 50A, the adhesive has a thickness orthogonal to the solar cells less than or equal to about 0.1 mm and a thermal conductivity orthogonal to the solar cells greater than or equal to about 1.5 w/m/k. Forms bonds between adjacent solar cells.

55A. In the solar module of item 50A, the solar cells of N are grouped into a single super cell.

56A. In the solar module of item 50A, the solar cells are silicon solar cells.

57A. The solar module,

A super cell substantially covering the entire length or width of the photovoltaic module parallel to the edge of the photovoltaic module, wherein the super cells are superimposed and electrically adjacent to each other with electrically and thermally conductive adhesives. A series connected string of N rectangular or substantially rectangular solar cells having an average breakdown voltage greater than about 10 volts arranged in line with the long sides of the cells;

A single solar cell or group of <N solar cells in the super cell is not individually electrically connected in parallel with the bypass diode.

58A. In the solar module of item 57A, N>24.

59A. In the solar module of item 57A, the super cell has a length in the direction of current flow of at least about 500 mm.

60A. Super Cell,

It includes a plurality of silicon solar cells, each silicon solar cell,

A rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and having at least one front contact pad positioned adjacent to the first long side surface;

An electrically conductive back metallization pattern disposed on the back surface and having at least one back contact pad positioned adjacent to the second long side;

The silicon solar cells are first and second long sides of the overlapping and adjacent silicon solar cells and adjacent silicon solar cells overlapping and electrically bonding to each other with a conductive adhesive bonding material to electrically connect the silicon solar cells in series. Arranged in line with front and rear contact pads on the field;

The front metallization pattern of each silicon solar cell includes a barrier that substantially limits the conductive adhesive bonding material to the at least one front contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell. .

61A. In the super cell of matter 60A, for each pair of adjacent and overlapping silicon solar cells, as the barrier on one front of the silicon solar cells overlaps and hides a portion of the other silicon solar cell, the super cell The conductive adhesive bonding material is substantially limited to the overlapping areas of the front surface of the silicon solar cell prior to curing of the conductive adhesive bonding material during the manufacture of.

62A. In the super cell of clause 60A, the barrier comprises a continuous conductive line running parallel to or running substantially the entire length of the first long side, wherein the at least one front contact pads are the continuous conductive line and the sun Located between the first long side of the cell.

63A. In the super cell of point 62A, the front metallization pattern is electrically connected to the at least one front contact pads, and includes fingers that are orthogonal to the first long side, and the continuous conductive line is each finger. The fingers are electrically interconnected to provide multiple conductive passages from to the at least one front contact pads.

64A. In the super cell of item 60A, the front metallization pattern includes a plurality of distinct contact pads arranged in rows adjacent and parallel to the first long side, the barrier comprising the conductive adhesive bonding material during manufacture of the super cell. And a plurality of features forming separate barriers for each separate contact pad to substantially limit the conductive adhesive bonding material to separate contact pads prior to curing.

65A. In the super cell of item 64A, the separated barriers are adjacent to and larger than their corresponding separate contact pads.

66A. Super Cell,

It includes a plurality of silicon solar cells, each silicon solar cell,

A rectangular or substantially rectangular front and rear surfaces having shapes defined by first and second oppositely positioned parallel long sides and two oppositely positioned short sides, wherein at least some of the front surfaces are Exposed to solar radiation during operation of the string of solar cells;

An electrically conductive front metallization pattern disposed on the front surface and having at least one front contact pad positioned adjacent to the first long side surface;

An electrically conductive back metallization pattern disposed on the back surface and having at least one back contact pad positioned adjacent to the second long side;

The silicon solar cells are first and second sides of overlapping and adjacent silicon solar cells and front and back contacts on adjacent silicon solar cells that are overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series. Arranged in line with the pads;

The back metallization pattern of each silicon solar cell is

And a barrier configured to substantially limit the conductive adhesive bonding material to the at least one back contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell.

67A. In the super cell of item 66A, the back metallization pattern includes one or more separate contact pads arranged in rows parallel to and adjacent to the second long sides, the barrier being conductive during manufacturing of the super cell It includes a plurality of features that form separate barriers for each separate contact pad that substantially limits the conductive adhesive bonding material to separate contact pads prior to curing of the adhesive bonding material.

68A. In the super cell of item 67A, the separate barriers are adjacent to and larger than their corresponding separate contact pads.

69A. A method of making a string of solar cells, the method comprising:

Dicing one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells each having substantially the same length along its long axis; And

Arranging the rectangular silicon solar cells in line with long sides of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

The plurality of rectangular silicon solar cells have at least one rectangular solar cell having two chamfered corners corresponding to corners or portions of corners of the pseudo-square wafer and one lacking each chamfered corner. Or more rectangular silicon solar cells;

The spacing between parallel lines along which the pseudo square wafer is diced is a rectangular silicon lacking the chamfered edges to a width perpendicular to the progress of the rectangular silicon solar cells with the chamfered edges. Made larger than a width orthogonal to the long axis of the solar cells, each of the plurality of rectangular silicon solar cells in the string of solar cells has a substantially equal area front surface exposed to light during operation of the string of solar cells. To compensate for the chamfered edges.

70A. The string of solar cells,

* Comprising a plurality of silicon solar cells arranged in series with ends of adjacent solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series;

At least one of the silicon solar cells has chamfered corners corresponding to corners or portions of corners of the pseudo-square silicon wafer on which it was diced, at least one of the silicon solar cells lacks the chamfered corners, Each of the silicon solar cells has a substantially equal area front surface exposed to light during operation of the string of solar cells.

71A. A method of making two or more strings of solar cells, the method comprising:

A first plurality of rectangular silicon solar cells having chamfered edges corresponding to corners or portions of the corners of the pseudo-square silicon wafers and a first length each spanning the entire length of the pseudo-square silicon wafers Dicing one or more pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a second plurality of rectangular silicon solar cells having and lacking chamfered edges;

The chamfered edge from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells each having a second length shorter than the first length and lacking chamfered edges. Removing them;

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the first length Arranging the second plurality of rectangular silicon solar cells in line with a field; And

Long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the third plurality of rectangular silicon solar cells to form a string of solar cells having the same width as the second length. And arranging the third plurality of rectangular silicon solar cells in line with the field.

72A. A method of making two or more strings of solar cells, the method comprising:

First plurality of rectangular silicon solar cells having chamfered corners corresponding to corners or portions of corners of the pseudo square silicon wafers and the second plurality of rectangular silicon solar cells lacking chamfered corners Dicing one or more pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a field;

The first plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the first plurality of rectangular silicon solar cells in series. To do; And

The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively coupled to each other to electrically connect the second plurality of rectangular silicon solar cells in series. It includes the steps.

73A. In the method of making a solar module, the method,

A plurality of rectangular silicon solar cells with chamfered edges corresponding to the edges of the pseudo square silicon wafers from a plurality of pseudo square silicon wafers and a plurality of rectangular silicon suns lacking the chamfered edges. Dicing a plurality of pseudo square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form cells;

Rectangular silicon lacking the chamfered edges to electrically connect the silicon solar cells to form first plurality of super cells each having only rectangular silicon solar cells lacking the chamfered corners. Arranging at least some of the solar cells in line with long sides of the silicon solar cells overlapping and conductively bonding to each other;

Rectangular silicon having the chamfered edges to electrically connect the silicon solar cells in series to form a second plurality of super cells each having only rectangular silicon solar cells having the chamfered edges Arranging at least some of the solar cells in line with long sides of the silicon solar cells overlapping and conductively bonding to each other; And

Arranging the super cells in parallel rows of super cells of substantially the same length to form the front surface of the solar module, each row comprising only super cells from the first plurality of super cells or the first 2 Only super cells from a plurality of super cells are provided.

74A. In the solar module of item 73A, two of the rows of super cells adjacent to the parallel and opposite edges of the solar module include only super cells from the second plurality of super cells, and the super cell. All other columns of include only super cells from the first plurality of super cells.

75A. In the solar module of item 74A, the solar module comprises a total of six rows of super cells.

76A. Super Cell,

A plurality of silicon solar cells arranged in a first direction with ends of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series; And

Conductive to the front or rear of one of the ends of the silicon solar cells at three or more distinct positions arranged along the second direction, having its long axis oriented parallel to the second direction orthogonal to the first direction Coupled, and running in at least the full width of the end solar cell in the second direction, having a conductor thickness less than or equal to about 100 microns, measured orthogonally to the front or rear of the end silicon solar cell, about 0.012 ohm Provides resistance to current flow in the second direction less than or equal to accommodate differential expansion in the second direction between the end silicon solar cell and the interconnect for temperatures between about -40°C and about 85°C And an extended flexible electrical interconnect that provides flexibility.

77A. In the super cell of matter 76A, the flexible electrical interconnect has a conductor thickness less than or equal to about 30 microns, measured orthogonally to the front or back of the end silicon solar cell.

78A. In the super cell of matter 76A, the flexible electrical interconnect extends in the second direction beyond the super cell for electrical interconnection to at least a second super cell located parallel and adjacent to the super cell in a solar module. .

79A. In the super cell of matter 76A, the flexible electrical interconnect extends in the first direction past the super cell for electrical interconnection to at least a second super cell located parallel and parallel to the super cell in a solar module. .

80A. The solar module,

Includes a plurality of super cells arranged in two or more parallel rows across the width of the module to form the front side of the module, each super cell overlapping and electrically conductive to connect silicon solar cells in series in series. A plurality of silicon solar cells arranged in line with ends of adjacent silicon solar cells coupled to each other;

At least an end of the first super cell adjacent to the edge of the module in the first row is electrically conductive adhesive bonding material coupled to the front surface of the first super cell at a plurality of separate locations, and at the edge of the module A second super adjacent to the same edge of the module in a second row through a flexible electrical interconnect that runs in parallel, at least a portion of which folds around the end of the first super cell and is hidden from view from the front of the module It is electrically connected to the end of the cell.

81A. In the solar module of item 80A, the surfaces of the flexible electrical interconnect on the front side of the module are covered or colored to reduce visible contrast with the super cells.

82A. In the solar module of item 80A, two or more parallel rows of the super cells are arranged on a white back sheet to form the front side of the solar module illuminated by solar radiation during operation of the solar module, The white back sheet includes parallel darkened stripes with positions and widths corresponding to the positions and widths of the gaps between the parallel rows of super cells, and the white portions of the back sheets are the gaps between the columns. Invisible through them.

83A. A method of making a string of solar cells, the method comprising:

Laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular areas on the silicon solar cells;

Applying an electrically conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent to the long side of each rectangular area;

Separating the silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells each having a portion of the electrically conductive adhesive bonding material disposed on its front surface along long sides;

Arranging the plurality of rectangular silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween. ; And

Curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

84A. A method of making a string of solar cells, the method comprising:

Laser scribing one or more scribe lines on each one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell having a top surface and an opposite surface. It has a bottom surface to be located;

Applying an electrically conductive adhesive bonding material to portions of the top surfaces of the one or more silicon solar cells;

A vacuum is applied between the bottom surfaces of the one or more silicon solar cells and the support surface of the curve to bend the one or more silicon solar cells against a curved support surface, thereby adjoining each of the long side surfaces. Cutting the one or more silicon solar cells along the scribe lines to provide a plurality of rectangular silicon solar cells having a portion of the electrically conductive adhesive bonding material disposed on the front surface;

Arranging the plurality of rectangular silicon solar cells in line with the long sides of adjacent rectangular silicon solar cells overlapping in a shingled manner with a portion of the electrically conductive adhesive bonding material disposed therebetween. It includes;

Curing the electrically conductive bonding material, bonding adjacent and overlapping rectangular silicon solar cells to each other, and electrically connecting them in series.

85A. In the method of item 84A, the electrically conductive adhesive bonding material is applied to the one or more silicon solar cells, and then the one or more scribe lines on each of the one or more silicon solar cells. And laser scribing them.

86A. In the method of item 84A, laser scribing the one or more scribe lines on each of the one or more silicon solar cells, followed by the electrically conductive adhesive bonding material to the one or more silicon. And applying to solar cells.

1B. The device,

Includes a series-connected string of at least 25 solar cells connected in parallel with a common bypass diode, each solar cell having a breakdown voltage greater than about 10 volts, and overlapping and lengthening of adjacent solar cells conductively coupled with adhesive. It is grouped into a super cell having the solar cells arranged with the side surfaces.

2B. In the same device as in item 1B, N is an integer greater than or equal to 30.

3B. In the same device as in item 1B, N is an integer greater than or equal to 50.

4B. In the same device as in item 1B, N is an integer greater than or equal to 100.

5B. In a device as in item 1B, the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 W/m/K.

6B. In a device as in item 1B, the solar cells of N are grouped into a single super cell.

7B. In a device as in item 1B, the solar cells of N are grouped into a plurality of super cells on the same backing.

8B. In a device as in item 1B, the solar cells are silicon solar cells.

9B. In a device as in item 1B, the super cell has a length in the direction of current flow of at least about 500 mm.

10B. In a device as in item 1B, the solar cells include a feature configured to limit diffusion of the adhesive.

11B. In a device as in item 1B, the feature comprises a raised feature.

12B. In a device as in item 10B, the feature comprises metallization.

*13B. In a device as in item 12B, the metallization comprises a line running through the entire length of the first long side, and the device further comprises at least one contact pad located between the line and the first long side. Includes.

14B. On devices such as in matter 13B,

The metallization further comprises fingers electrically connected to the at least one contact pad and running orthogonally to the first long side;

The conductive line interconnects the fingers.

15B. In a device as in item 10B, the feature is on the front side of the solar cell.

16B. In a device as in item 10B, the feature is on the back side of the solar cell.

17B. In a device as in item 10B, the feature comprises a recessed feature.

18B. In a device as in item 10B, the feature is hidden by the adjacent solar cell of the super cell.

19B. In a device as in item 1B, the first solar cell of the super cell has chamfered edges, the second solar cell of the super cell lacks chamfered edges, and the first solar cell and the second The solar cell has the same area exposed to light.

20B. In a device as in item 1B, further comprising a flexible electrical interconnect having an elongated axis parallel to the second direction orthogonal to the first direction, the flexible electrical interconnect being conductively coupled to the surface of the solar cell, two dimensions Delo to accommodate the thermal expansion of solar cells.

21B. In devices such as in item 20B, the flexible electrical interconnect has a thickness less than or equal to about 100 microns to provide a resistance less than or equal to about 0.012 ohms.

22B. In devices such as in item 20B, the surface includes a back surface.

23B. In a device such as in item 20B, the flexible electrical interconnect is contacted with another super cell.

24B. In the same device as in item 23B, the other super cell is in line with the super cell.

25B. In the same device as in item 23B, the other super cell is adjacent to the super cell.

26B. In a device as in item 20B, the first portion of the interconnect is folded around the edge of the super cell such that the remaining second interconnect portion is on the back side of the super cell.

27B. In devices such as in item 20B, the flexible electrical interconnect is electrically connected to the bypass diode.

28B. In a device as in item 1B, a plurality of super cells are arranged in two or more parallel rows on a back sheet to form a solar module front surface, the back sheet is white, corresponding to the gaps between the super cells It includes darkened stripes of the position and width.

29B. In a device as in item 1B, the super cell includes at least one pair of cell strings connected to a power management system.

30B. On devices such as in matter 1B,

In electrical communication with the super cell,

Receiving the voltage output of the super cell;

Determine whether the solar cell is reverse biased based on the voltage;

And a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

31B. In a device as in item 1B, the super cell is disposed on a first backing to form a first module having a top conductive ribbon on a first side facing the direction of solar energy, the device comprising:

Further comprising another super cell disposed on a second backing to form a second module having a bottom ribbon on a second side facing a direction away from the direction of the solar energy,

The second module overlaps and is coupled to a portion of the first module including the top ribbon.

32B. In a device as in item 31B, the second module is coupled to the first module by an adhesive.

33B. In a device as in item 31B, the second module is combined with the first module by a matching arrangement.

34B. In the same device as in item 31B, it further comprises a junction box superimposed by the second module.

35B. In a device as in item 34B, the second module is combined with the first module by a matching arrangement.

36B. In a device as in item 35B, the matching arrangement is between the junction box on the second module and another junction box.

37B. In a device as in item 31B, the first backing comprises glass.

38B. In a device as in item 31B, the first backing comprises glass and another.

39B. In an apparatus as in item 1B, the solar cell comprises a chamfered portion cut from a larger piece.

40B. In a device as in item 39B, the super cell further comprises another solar cell having a chamfered portion, the long side of the solar cell being in electrical contact with the long side of another solar cell having a similar length.

1C1. Way,

Forming a super cell comprising a series-connected string of at least N≧25 solar cells on the same backing, each solar cell having a breakdown voltage greater than about 10 volts, overlapping and conductively bonded with an adhesive Arranged with the long sides of the solar cells;

Each super cell is connected to a single bypass diode as much as possible.

2C1. In the same way as in matter 1C1, N is an integer greater than or equal to 30.

3C1. In the same way as in matter 1C1, N is an integer greater than or equal to 50.

4C1. In the same way as in matter 1C1, N is an integer greater than or equal to 100.

5C1. In the same method as in item 1C1, the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 w/m/k.

6C1. In the same method as in matter 1C1, the solar cells are silicon solar cells.

7C1. In the same method as in item 1C1, the super cell has a length in the direction of current flow of at least about 500 mm.

8C1. In the same method as in item 1C1, the first solar cell of the super cell has chamfered edges, the second solar cell of the super cell lacks chamfered edges, and the first solar cell and the second The solar cell has the same area exposed to light.

9C1. In the same method as in item 1C1, further comprising the step of limiting the diffusion of the adhesive by utilizing features on the surface of the solar cell.

10C1. In the same way as in item 9C1, the feature comprises a protruding feature.

11C1. In the same method as in item 9C1, the feature comprises metallization.

12C1. In the same method as in item 11C1, the metallization comprises a line running through the entire length of the first long side, and at least one contact pad is located between the line and the first long side.

13C1. In the same way as in matter 12C1,

The metallization further comprises fingers electrically connected to the at least one contact pad and running orthogonally to the first long side;

The conductive line interconnects the fingers.

14C1. In the same method as in matter 9C1, the feature is on the front side of the solar cell.

15C1. In the same method as in matter 9C1, the feature is on the back side of the solar cell.

16C1. In the same way as in item 9C1, the feature comprises a recessed feature.

17C1. In the same way as in item 9C1, the feature is hidden by the adjacent solar cell of the super cell.

18C1. In the same method as in item 1C1, further comprising forming another super cell on the same backing.

19C1. In the same way as in matter 1C1,

Conductively coupling a flexible electrical interconnect having a long axis parallel to the second direction orthogonal to the first direction to the surface of the solar cell; And

And causing the flexible electrical interconnect to accommodate thermal expansion of the solar cell in two dimensions.

20C1. In the same method as in item 19C1, the flexible electrical interconnect has a thickness less than or equal to about 100 microns to provide a resistance less than or equal to about 0.012 ohms.

21C1. In the same way as in item 19C1, the surface comprises a back surface.

22C1. In the same method as in item 19C1, further comprising contacting another super cell with the flexible electrical interconnect.

23C1. In the same way as in matter 22C1, the other super cells are arranged in line with the super cells.

24C1. In the same way as in item 22C1, the other super cell is adjacent to the super cell.

25C1. In the same method as in item 19C1, further comprising folding the first portion of the interconnect around the edge of the super cell such that the remaining second interconnect portion is on the rear side of the super cell.

26C1. In the same method as in item 19C1, the method further comprises electrically connecting the flexible electrical interconnect to a bypass diode.

27C1. In the same way as in matter 1C1,

Further comprising arranging a plurality of super cells in two or more parallel rows on the same backing to form a solar module front surface, the back sheet being white, the position and width corresponding to the gaps between the super cells Includes darkened stripes.

28C1. In the same method as in item 1C1, the method further comprises connecting at least one pair of cell strings to the power management system.

29C1. In the same way as in matter 1C1,

Electrically connecting a power management device to the super cell;

Causing the power management to receive the voltage output of the super cell;

Causing the power management device to determine if the solar cell is in reverse bias, based on the voltage; And

And causing the power management device to disconnect the reverse biased solar cell from a super cell module circuit.

30C1. In the same method as in item 1C1, the super cell is disposed on the backing to form a first module having a top conductive ribbon on a first side facing the direction of solar energy, the method comprising:

Further comprising placing different super cells on different backings to form a second module with a bottom ribbon on a second side facing away from the direction of the solar energy,

The second module overlaps and is coupled to a portion of the first module including the top ribbon.

31C1. In the same method as in item 30C1, the second module is coupled to the first module by an adhesive.

32C1. In the same way as in item 30C1, the second module is coupled to the first module by a matching arrangement.

33C1. In the same method as in item 30C1, the method further comprises overlapping the junction box with the second module.

34C1. In the same way as in item 33C1, the second module is coupled to the first module by a matching arrangement.

35C1. In the same way as in item 34C1, the matching arrangement is between the junction box on the second module and another junction box.

36C1. In the same method as in item 30C1, the backing comprises glass.

37C1. In the same method as in item 30C1, the backing comprises anything other than glass.

38C1. In the same way as in matter 30C1,

Electrically connecting a relay switch in series between the first module and the second module;

Sensing a voltage output of the first module by a controller; And

And activating the relay switch with the controller, wherein the output voltage falls below a limit.

39C1. In the same method as in item 1C1, the solar cell comprises a chamfered portion cut from a larger piece.

40C1. In the same method as in item 39C1, forming the super cell includes placing the long side of the solar cell in electrical contact with a long side of a similar length of another solar cell having a chamfered portion.

1C2. The device,

A photovoltaic module having a front surface comprising a first series-connected string of at least 19 solar cells grouped into a first super cell arranged with long sides of adjacent solar cells overlapping and conductively bonded with an adhesive; And

And a ribbon conductor electrically connected to the rear contact of the first super cell to provide a hidden tab to the electrical component.

2C2. In a device as in matter 1C2, the electrical component comprises a bypass diode.

3C2. In a device as in point 2C2, the bypass diode is located on the back side of the solar module.

4C2. In a device as in point 3C2, the bypass diode is located outside the junction box.

5C2. In a device as in point 4C2, the junction box comprises a single terminal.

6C2. In a device as in point 3C2, the bypass diode is located near the edge of the solar module.

7C2. In devices such as in point 2C2, the bypass diode is located within the laminate structure.

8C2. In a device as in point 7C2, the first super cell is encapsulated within the laminate structure.

9C2. In a device as in point 2C2, the bypass diode is located around the perimeter of the solar module.

10C2. In devices such as in point 1C2, the electrical components may include module terminals, junction boxes, power management systems, smart switches, relays, voltage sensing controllers, central inverters, DC/AC microinverters, or DC/DC module power optimizers. Includes.

11C2. In a device as in item 1C1, the electrical component is located on the back side of the solar module.

12C2. In a device as in matter 1C1, the solar module further adds a second series connected string of at least 19 solar cells grouped into a second super cell having a first end electrically connected in series to the first super cell. Includes.

13C2. In a device as in matter 12C2, the second super cell overlaps the first super cell and is electrically connected in series with a conductive adhesive.

14C2. In a device as in item 12C2, the rear contact is located away from the first end.

15C2. In a device such as in item 12C2, further comprising a flexible interconnect between the first end and the first super cell.

16C2. In a device as in matter 15C2, the flexible interconnect extends past the side edges of the first and second super cells to electrically connect the first and second super cells with other super cells in parallel.

17C2. In a device as in item 1C2, the adhesive has a thickness less than or equal to about 0.1 mm and a thermal conductivity greater than or equal to about 1.5 w/m/k.

18C2. In a device as in matter 1C2, the solar cells are silicon solar cells having a breakdown voltage greater than about 10V.

19C2. In a device as in item 1C2, the first super cell has a length in the direction of current flow of at least about 500 mm.

20C2. In a device as in item 1C2, the solar cell of the first super cell comprises a feature configured to limit the diffusion of the adhesive.

21C2. In a device as in item 20C2, the feature comprises a protruding feature.

22C2. In a device as in item 21C2, the feature comprises metallization.

23C2. In a device as in matter 22C2, the metallization comprises a conductive line running through the entire length of the first long side, the device comprising at least one contact pad located between the line and the first long side. It includes more.

24C2. On devices such as in item 23C2,

The metallization further comprises fingers electrically connected to the at least one contact pad and running orthogonally to the first long side;

The conductive line interconnects the fingers.

25C2. In a device as in item 20C2, the feature is on the front side of the solar cell.

26C2. In a device as in item 20C2, the feature is on the back side of the solar cell.

27C2. In a device as in item 20C2, the feature comprises a recessed feature.

28C2. In a device as in matter 20C2, the feature is hidden by the adjacent solar cell of the first super cell.

29C2. In a device as in item 1C2, the solar cell of the first super cell includes a chamfered portion.

30C2. In a device as in point 29C2, the first super cell further comprises another solar cell comprising a chamfered portion, the long side of the solar cell in electrical contact with the long side of another solar cell of similar length. do.

31C2. In a device as in item 29C2, the first super cell further comprises a solar cell lacking chamfered edges, and the solar cell and the other solar cell have the same area exposed to light.

32C2. On devices such as in matter 1C2,

The first super cell is aligned with the second super cell in rows parallel to the front of the backing sheet;

The backing sheet is white and includes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

33C2. In a device as in item 1C2, the first super cell includes at least one pair of strings connected to a power management system.

34C2. In the same device as in matter 1C2, in electrical communication with the first super cell,

Receiving the voltage output of the first super cell;

Based on the voltage, determine whether the solar cell of the first super cell is reverse biased;

And a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

35C2. In a device as in item 34C2, the power management device includes a relay.

36C2. In a device as in matter 1C2, the first super cell is disposed on a first backing to form a module having a top conductive ribbon on a first side facing the direction of solar energy, the device comprising:

Further comprising another super cell disposed on the second backing to form another module having a lower ribbon on the second side facing the direction away from the direction of the solar energy,

The other module overlaps and joins a portion of the module including the top ribbon.

37C2. In a device as in matter 36C2, the other module is attached to the module by an adhesive.

38C2. In a device as in point 36C2, the other modules are coupled to the modules by matching arrangements.

39C2. In the same device as in item 36C2, it further comprises a junction box superimposed by said other module.

40C2. In a device such as in item 39C2, the other module is coupled to the module by a matching arrangement located between the junction box and the other junction box on another solar module.

1C3. The device,

A first super cell disposed on the front surface of the photovoltaic module and having a plurality of solar cells each having a breakdown voltage greater than about 10V;

A first ribbon conductor electrically connected to a rear contact of the first super cell to provide a first hidden tab to the electrical component;

A second super cell disposed on the front surface of the solar module and having a plurality of solar cells each having a breakdown voltage greater than about 10V; And

And a second ribbon conductor electrically connected to a rear contact of the second super cell to provide a second hidden tab.

2C3. In a device as in item 1C3, the electrical component comprises a bypass diode.

3C3. In a device as in matter 2C3, the bypass diode is located on the back of the solar module.

4C3. In a device as in point 3C3, the bypass diode is located outside the junction box.

5C3. In a device as in point 4C3, the junction box comprises a single terminal.

6C3. In a device as in point 3C3, the bypass diode is located near the edge of the solar module.

7C3. In a device as in point 2C3, the bypass diode is located within the laminate structure.

8C3. In a device as in point 7C3, the first super cell is sealed in the laminate structure.

9C3. In a device as in matter 8C3, the bypass diode is located around the solar module.

10C3. In a device as in matter 1C3, the first super cell is connected in series with the second super cell.

11C3. On devices such as in matter 10C3,

The first super cell and the second super cell form a first pair;

The device further comprises two additional super cells in a second pair connected in parallel with the first pair.

12C3. In a device as in item 10C3, the second hidden tab is connected to the electrical component.

13C3. In a device as in matter 12C3, the electrical component comprises a bypass diode.

14C3. In a device as in matter 13C3, the first super cell comprises fewer than 19 solar cells.

15C3. In a device as in item 12C3, the electrical component comprises a power management system.

16C3. In a device as in item 1C3, the electrical component comprises a switch.

17C3. In a device as in matter 16C3, it further comprises a voltage sensing controller in communication with the switch.

18C3. In a device as in point 16C3, the switch communicates with the central inverter.

19C3. In a device as in matter 1C3, the electrical component,

Receiving the voltage output of the first super cell;

Based on the voltage, determine whether the solar cell of the first super cell is reverse biased;

And a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

20C3. In a device as in item 1, the electrical component comprises an inverter.

21C3. In a device as in point 20C3, the inverter comprises a DC/AC microinverter.

22C3. In a device as in item 1C3, the electrical component comprises a solar module terminal.

23C3. In a device as in matter 22C3, the solar module terminal is a single solar module terminal in the junction box.

24C3. In a device as in matter 1C3, the electrical component is located on the back of the solar module.

25C3. In a device as in matter 1C3, the back contact is located away from the end of the first super cell overlapping the second super cell.

26C3. In a device as in item 1C3, the first super cell has a length in the direction of current flow of at least about 500 mm.

27C3. In a device as in item 1C3, the solar cell of the first super cell comprises a feature configured to limit the diffusion of the adhesive.

28C3. In a device as in item 27C3, the feature comprises a protruding feature.

29C3. In a device as in matter 28C3, the feature comprises metallization.

30C3. In a device as in item 27C3, the feature comprises a recessed feature.

31C3. In a device as in matter 27C3, the feature is on the rear side of the solar cell.

32C3. In a device as in item 27C3, the feature is hidden by the adjacent solar cell of the first super cell.

33C3. In a device as in item 1C3, the solar cell of the first super cell includes a chamfered portion.

34C3. In a device as in matter 33C3, the first super cell further comprises another solar cell having a chamfered portion, the long side of the solar cell being in electrical contact with the long side of another solar cell having a similar length. .

35C3. In a device as in item 33C3, the first super cell further comprises another solar cell lacking chamfered edges, and the solar cell and the other solar cell have the same area exposed to light.

36C3. On devices such as in matter 1C3,

The first super cell is arranged with the second super cell in rows parallel to the front of the backing sheet;

The backing sheet is white and includes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

37C3. In a device as in matter 1C3, the first super cell is disposed on a first backing to form a module with a top conductive ribbon on the front of the module facing the direction of solar energy, the device comprising:

And a third super cell disposed on the second backing to form another module having a bottom ribbon on the second side facing the direction away from the direction of the tagging energy,

The other module overlaps and joins a portion of the module including the top ribbon.

38C3. In the same device as in item 37C3, the other module is combined with the module by an adhesive.

39C3. In the same device as in item 37C3, it further comprises a junction box superimposed by said other module.

40C3. In the same device as in item 39C3, the other module is combined with the other module by a matching arrangement between the junction box and the other junction box on the other module.

1C4. The device,

A solar module having a front surface including a first series-connected string of solar cells grouped into a first super cell arranged with side surfaces of adjacent solar cells overlapping and adhesively conductive; And

And solar cell surface features configured to define the adhesive.

2C4. In a device as in item 1C4, the solar cell surface features include recessed features.

3C4. In devices such as in item 1C4, the solar cell surface features include protruding features.

4C4. In a device as in item 3C4, the projected feature is on the front side of the solar cell.

5C4. In a device as in item 4C4, the projected feature comprises a metallization pattern.

6C4. In a device as in item 5C4, the metallization pattern comprises conductive lines parallel to and substantially along the long side of the solar cell.

7C4. In a device as in item 6C4, the contact pad between the conductive line and the long side is further included.

8C4. On devices such as in matter 7C4,

The metallization pattern further comprises a plurality of fingers;

The conductive line electrically interconnects the fingers to provide multiple conductive passages from each finger to the contact pad.

9C4. In a device as in matter 7C4, further comprising a plurality of distinct contact pads arranged in rows parallel to and adjacent to the long side, the metallization pattern comprising a plurality of separations limiting the adhesive to the separate contact pads Form barriers.

10C4. In a device as in item 8C4, the plurality of separate barriers are adjacent to corresponding separate contact pads.

11C4. In a device as in item 8C4, the plurality of separate barriers is larger than corresponding separate contact pads.

12C4. In a device as in matter 1C4, the solar cell surface features are hidden by overlapping sides of the other solar cells.

13C4. In a device as in matter 12C4, the other solar cell is part of the super cell.

14C4. In the same device as in matter 12C4, the other solar cell is part of another super cell.

15C4. In a device as in matter 3C4, the projected feature is on the back of the solar cell.

16C4. In a device as in item 15C4, the projected feature comprises a metallization pattern.

17C4. In a device as in matter 16C4, the metallization pattern forms a plurality of separate barriers to limit the adhesive to a plurality of separate contact pads located on the front side of another solar cell overlaid by the solar cell. .

18C4. In a device as in item 17C4, the plurality of separate barriers are adjacent to corresponding separate contact pads.

19C4. In a device as in item 17C4, the plurality of separate barriers is larger than corresponding separate contact pads.

*20C4. In a device as in matter 1C1, each solar cell of the super cell has a breakdown voltage of 10 V or higher.

21C4. In a device as in item 1C1, the super cell has a length in the direction of current flow of at least about 500 mm.

22C4. In a device as in matter 1C1, the solar cell of the super cell comprises a chamfered portion.

23C4. In a device as in matter 22C4, the super cell further comprises another solar cell having a chamfered portion, the long side of the solar cell being in electrical contact with the long side of the other solar cell having a similar length.

24C4. In a device as in matter 22C4, the super cell further comprises another solar cell lacking chamfered edges, the solar cell and the other solar cell having the same area exposed to light.

25C4. In a device as in matter 1C4, the super cell is arranged with the second super cell on the front of the first backing sheet to form a first module.

26C4. In a device as in matter 25C4, the backing sheet is white and includes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

27C4. In a device as in matter 25C4, the first module has a significant conductive ribbon on the front of the first module facing the direction of solar energy, the device comprising:

Further comprising a third super cell disposed on a second backing to form a second module having a bottom ribbon on the side of the second module facing away from the solar energy,

The second module overlaps and is coupled to a portion of the first module including the top ribbon.

28C4. In a device as in item 27C4, the second module is joined by the first module with an adhesive.

29C4. In the same apparatus as in item 27C4, the junction box overlapped by the second module is further included.

30C4. In a device as in item 29C4, the second module is coupled to the first module by a matching arrangement between the junction box on the second module and another junction box.

31C4. In devices as in point 29C4, the junction box accommodates a single module terminal.

32C4. In a device as in item 27C4, the switch further comprises a switch between the first module and the second module.

33C4. In a device as in point 32C4, it further comprises a voltage sensing controller in communication with the switch.

34C4. In a device as in matter 27C4, the super cell comprises fewer than nineteen solar cells individually and electrically connected in parallel with a single bypass diode.

35C4. In a device as in matter 34C4, the single bypass diode is located near the edge of the first module.

36C4. In a device as in matter 34C4, the single bypass diode is located within the laminate structure.

37C4. In a device as in matter 36C4, the super cell is encapsulated within the laminate structure.

38C4. In a device as in matter 34C4, the single bypass diode is located around the first module.

39C4. In a device as in matter 25C4, the super cell and the second super cell include a pair individually connected to a power management device.

40C4. On devices such as in matter 25C4,

Receiving the voltage output of the super cell;

Based on the voltage, determine whether the solar cell of the super cell is reverse biased;

And a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

1C5. The device,

A first series of silicon solar cells grouped into a first super cell comprising chamfered edges, the first silicon solar cell being superimposed with the second silicon solar cell and arranged with adhesively conductive side surfaces. And a solar module having a front surface including a string.

2C5. In a device as in matter 1C5, the second silicon solar cell lacks chamfered edges, and each silicon solar cell of the first super cell has a substantially equal front area exposed to light.

3C5. On devices such as in matter 2C5,

The first silicon solar cell and the second silicon solar cell have the same length;

The width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C5. In a device as in matter 3C5, the length reproduces the shape of a pseudo-square wafer.

5C5. In a device as in item 3C5, the length is 156 mm.

6C5. In a device as in item 3C5, the length is 125 mm.

7C5. In a device as in item 3C5, the aspect ratio between the width and length of the first solar cell is from about 1:2 to about 1:20.

8C5. In a device as in item 3C5, the first silicon solar cell overlaps the second silicon solar cell from about 1 mm to about 5 mm.

9C5. In a device as in matter 3C5, the first super cell comprises at least nineteen silicon solar cells each having a breakdown voltage greater than about 10 volts.

10C5. In a device as in matter 3C5, the first super cell has a length in the direction of current flow of at least about 500 mm.

11C5. On devices such as in matter 3C5,

The first super cell is connected in parallel with the second super cell on the front side;

The front side includes a white backing that characterizes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

12C5. In a device as in item 1C5, the second silicon solar cell includes chamfered edges.

13C5. In a device as in matter 12C5, the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C5. In a device as in matter 12C5, the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C5. In the same device as in matter 1C5, the front side is,

A first row comprising the first super cell composed of solar cells with chamfered edges; And

A second column having a second series connected string of silicon solar cells grouped into a second super cell, which is connected in parallel with the first super cell, and which consists of solar cells lacking chamfered edges, The length of the second column is substantially the same as the length of the first column.

16C5. In a device as in matter 15C5, the first row is adjacent to the module edge, and the second row is not adjacent to the module edge.

17C5. In a device as in matter 15C5, the first super cell comprises at least nineteen solar cells each having a breakdown voltage greater than about 10 volts, the first super cell in the direction of a current flow of at least about 500 mm. Has the length of

18C5. In a device as in matter 15C5, the front side includes a white backing that characterizes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

19C5. In the device as in item 1C5, the metallization pattern on the front side of the second solar cell is further included.

20C5. In devices such as in item 19C5, the metallization pattern includes a tapered portion extending around the chamfered edge.

21C5. In devices such as in item 19C5, the metallization pattern includes protruding features to limit diffusion of the adhesive.

22C5. In a device as in matter 19C5, the metallization pattern,

A plurality of distinct contact pads;

Fingers electrically connected to the plurality of separate contact pads; And

And a conductive line interconnecting the fingers.

23C5. In a device as in item 22C5, the metallization pattern forms a plurality of separate barriers that restrict the adhesive to the separate contact pads.

24C5. In a device as in item 23C5, the plurality of separate barriers are adjacent to and larger than the corresponding separate contact pads.

25C5. In a device such as in item 1C5, further comprising a flexible electrical interconnect that is conductively coupled to the surface of the first solar cell and accommodates thermal expansion of the first solar cell in two dimensions.

26C5. In a device as in matter 25C5, the first portion of the interconnect is folded around the edge of the first super cell such that the remaining second interconnect is on the back side of the first super cell.

27C5. In a device as in item 1C5, the module has a top conductive ribbon on the front side facing the direction of solar energy, the device comprising:

A second super cell disposed on the front surface, the other module further comprising a bottom ribbon on another module facing away from the solar energy,

The second module overlaps and is coupled to a portion of the first module including the top ribbon.

28C5. In a device as in matter 27C5, the other module is attached to the module by an adhesive.

29C5. In the same device as in item 27C5, it further comprises a junction box superimposed by said other module.

30C5. In a device as in item 29C5, the other module is coupled to the other module by a matching arrangement between the other box and the junction box on the other module.

31C5. In devices as in point 29C5, the junction box accommodates a single module terminal.

32C5. In the device as in item 27C5, it further comprises a switch between the module and the other module.

33C5. In a device as in point 32C5, it further comprises a voltage sensing controller in communication with the switch.

34C5. In a device as in matter 27C5, the first super cell comprises fewer than nineteen solar cells electrically connected to a single bypass diode.

35C5. In a device as in matter 34C5, the single bypass diode is located near the edge of the first module.

36C5. In a device as in matter 34C5, the single bypass diode is located within the laminate structure.

37C5. In a device as in matter 36C5, the super cell is encapsulated within the laminate structure.

38C5. In a device as in matter 34C5, it is located around the single bypass diode first module.

39C5. In a device as in matter 27C5, the first super cell and the second super cell include a pair connected to a power management device.

40C5. On devices such as in matter 27C5,

Receiving the voltage output of the first super cell;

Based on the voltage, determine whether the solar cell of the first super cell is reverse biased;

And a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

1C6. The device,

A first series of silicon solar cells grouped into a first super cell comprising chamfered edges and overlapping the second silicon solar cell and including a first silicon solar cell arranged with adhesively conductive side surfaces. And a solar module having a front surface including a string.

2C6. In a device as in matter 1C6, the second silicon solar cell lacks chamfered edges, and each silicon solar cell of the first super cell has a substantially equal front area exposed to light.

3C6. On devices such as in item 2C6,

The first silicon solar cell and the second silicon solar cell have the same length;

The width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C6. In a device such as in item 3C6, the length reproduces the shape of a pseudo-square wafer.

5C6. In a device as in item 3C6, the length is 156 mm.

6C6. In a device as in item 3C6, the length is 125 mm.

7C6. In a device as in item 3C6, the aspect ratio between the width and length of the first solar cell is from about 1:2 to about 1:20.

8C6. In a device as in item 3C6, the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C6. In a device as in matter 3C6, the first super cell comprises at least nineteen silicon solar cells each having a breakdown voltage greater than about 10 volts.

10C6. In a device as in item 3C6, the first super cell has a length in the direction of current flow of at least about 500 mm.

11C6. On devices such as in matter 3C6,

The first super cell is connected in parallel with the second super cell on the front side;

The front side includes a white backing that characterizes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

12C6. In a device as in item 1C6, the second silicon solar cell includes chamfered edges.

13C6. In a device as in matter 12C6, the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C6. In a device as in matter 12C6, the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C6. In the same device as in matter 1C6, the front side is,

A first row comprising the first super cell composed of solar cells with chamfered edges; And

A second column having a second series-connected string of silicon solar cells grouped into a second super cell, which is connected in parallel with the super cell, and which is composed of solar cells lacking chamfered edges, wherein the second The length of the second row is substantially the same as the length of the first row.

16C6. In a device as in item 15C6, the first row is adjacent to the module edge, and the second row is not adjacent to the module edge.

17C6. In a device as in matter 15C6, the first super cell comprises at least nineteen solar cells each having a breakdown voltage greater than about 10 volts, the first super cell in the direction of a current flow of at least about 500 mm. Has the length of

18C6. In a device as in matter 1C6, the front side comprises a white backing that characterizes darkened stripes of position and width corresponding to the gaps between the first super cell and the second super cell.

19C6. In the device as in item 1C6, the metallization pattern on the front side of the second solar cell is further included.

20C6. In a device as in matter 19C6, the metallization pattern includes a tapered portion extending around the chamfered edge.

21C6. In devices such as in item 19C6, the metallization pattern includes protruding features to limit diffusion of the adhesive.

22C6. In a device as in matter 19C6, the metallization pattern is:

A plurality of distinct contact pads;

Fingers electrically connected to a plurality of separate contact pads; And

And a conductive line interconnecting the fingers.

23C6. In a device as in item 22C6, the metallization pattern forms a plurality of separate barriers to limit the adhesive to the separate contact pads.

24C6. In a device as in item 23C6, the plurality of separate barriers are adjacent to and larger than the corresponding separate contact pads.

25C6. In a device such as in item 1C6, further comprising a flexible electrical interconnect that is conductively coupled to the surface of the first solar cell and accommodates thermal expansion of the first solar cell in two dimensions.

26C6. In a device as in matter 25C6, the first portion of the interconnect is folded around the edge of the first super cell such that the remaining second interconnect is on the back side of the first super cell.

27C6. In a device as in matter 1C6, the module has a top conductive ribbon on the front facing the direction of solar energy, the device comprising:

A second super cell disposed on the front side, the other module having a bottom ribbon on another module facing away from the solar energy,

The second module overlaps a portion of the first module including the upper ribbon and is conductively coupled.

28C6. In a device as in matter 27C6, the other module is attached to the module by an adhesive.

29C6. In the same device as in item 27C6, it further comprises a junction box superimposed by said other module.

30C6. In a device as in item 29C6, the other module is combined with the module by a matching arrangement between the junction box and the other junction box on the other module.

31C6. In devices as in point 29C6, the junction box accommodates a single module terminal.

32C6. In a device as in item 27C6, a switch is further included between the module and the other module.

33C6. In a device as in point 32C6, it further comprises a voltage sensing controller in communication with the switch.

34C6. In a device as in matter 27C6, the first super cell comprises fewer than nineteen solar cells electrically connected to a single bypass diode.

35C6. In a device as in matter 34C6, the single bypass diode is located near the edge of the first module.

36C6. In a device as in matter 34C6, the single bypass diode is located within the laminate structure.

37C6. In a device as in matter 36C6, the super cell is encapsulated within the laminate structure.

38C6. In a device as in matter 34C6, the single bypass diode is located around the first module.

39C6. In a device as in matter 27C6, the first super cell and the second super cell include a pair connected to a power management device.

40C6. On devices such as in matter 27C6,

Receiving the voltage output of the first super cell;

Based on the voltage, determine whether the solar cell of the first super cell is reverse biased;

And a power management device configured to disconnect the reverse biased solar cell from the super cell module circuit.

1C7. The device,

Of at least nineteen solar cells grouped into a super cell comprising a first silicon solar cell, each having a breakdown voltage greater than about 10 V and overlapping the second silicon solar cell and having an electrically conductive end coupled with an adhesive. A solar module having a front surface including a first series-connected string; And

And an interconnect that is electrically conductive to the surface of the solar cell.

2C7. In a device as in matter 1C7, the solar cell surface comprises the back surfaces of the first silicon solar cell.

3C7. In a device as in point 2C7, the ribbon further comprises a ribbon conductor electrically connecting the super cell to an electrical component.

4C7. In a device as in matter 3C7, the ribbon conductor is conductively coupled to the surface of the solar cell away from the overlapping end.

5C7. In a device such as in item 4C7, the electrical component is on the back of the solar module.

6C7. In a device as in item 4C7, the electrical component comprises a junction box.

7C7. In a device as in item 6C7, the junction box is an arrangement that matches other junction boxes on other modules superimposed by the module.

8C7. In devices such as in item 4C7, the electrical component comprises a bypass diode.

9C7. In a device as in item 4C7, the electrical component comprises a module terminal.

10C7. In a device as in point 4C7, the electrical component comprises an inverter.

11C7. In a device as in item 10C7, the inverter comprises a DC/AC microinverter.

12C7. In a device such as in item 11C7, the DC/AC microinverter is on the back of the solar module.

13C7. In a device as in item 4C7, the electrical component includes a power management device.

14C7. In a device as in item 13C7, the power management device includes a switch.

15C7. In a device such as in item 14C7, the voltage sensing controller further communicates with the switch.

16C7. In a device as in matter 13C7, the power management device,

Receiving the voltage output of the super cell;

Based on the voltage, determine whether the super cell's solar cell is reverse biased;

The reverse biased solar cell is configured to disconnect from the super cell module circuit.

17C7. In a device as in matter 16C7, the power management device is in electrical communication with the central inverter.

18C7. In a device as in item 13C7, the power management device comprises a DC/DC module power optimizer.

19C7. In a device as in point 3C7, the interconnect is interposed between the super cell on the front side and another super cell.

20C7. In a device as in point 3C7, the ribbon conductor is conductively coupled to the interconnect.

21C7. In devices such as in point 3C7, the interconnect provides resistance to current flows less than or equal to about 0.012 ohms.

22C7. In a device as in item 3C7, the interconnect is configured to accommodate differential thermal expansion between the first silicon solar cell and the interconnect for a temperature range of about -40°C to about 85°C.

23C7. In devices such as in item 3C7, the thickness of the interconnect is less than or equal to about 100 microns.

24C7. In devices such as in item 3C7, the thickness of the interconnect is less than or equal to about 30 microns.

25C7. In a device as in item 3C7, the super cell has a length in the direction of current flow of at least about 500 mm.

26C7. In the same device as in item 3C7, another super cell is further included on the front side of the module.

27C7. In a device as in matter 26C7, the interconnect connects the other super cell in series with the super cell.

28C7. In a device as in matter 26C7, the interconnect connects the other super cell in parallel with the super cell.

29C7. In a device as in matter 26C7, the front side comprises a white backing that characterizes darkened stripes of position and width corresponding to the gaps between the super cell and the other super cell.

30C7. In a device as in point 3C7, the interconnect comprises a pattern.

31C7. In a device as in item 3C7, the pattern comprises slits, slots and/or holes.

32C7. In devices such as in item 3C7, a portion of the interconnect is dark.

33C7. On devices like in matter 3C7,

The first silicon solar cell includes chamfered edges;

The second silicon solar cell lacks chamfered edges;

Each silicon solar cell of the super cell has a substantially equal front area exposed to light.

34C7. On devices like in matter 3C7,

The first silicon solar cell includes chamfered edges;

The second silicon solar cell includes chamfered edges;

And a side surface having a long side surface overlapping with the long side surface of the second silicon solar cell.

35C7. In a device as in point 3C7, the interconnect forms a bus.

36C7. In a device such as in item 3C7, the interconnect is conductively coupled to the surface of the solar cell at the junction to which it is attached.

37C7. In a device as in point 3C7, the first portion of the interconnect is folded around the edge of the super cell such that the remaining second portion is located on the back side of the super cell.

38C7. In a device as in point 3C7, the device further comprises a metallization pattern on the front surface with a line running along the long side, the device further comprising a plurality of distinct contact pads located between the line and the long side. Includes.

39C7. On devices such as in matter 38C7,

The metallization further includes fingers electrically connected to each of the separate contact pads, and orthogonal to the long side;

The conductive line interconnects the fingers.

40C7. In a device such as in item 38C7, the metallization pattern includes protruding features to limit diffusion of the adhesive.

1C8. The device,

An adjacent silicon solar that includes a plurality of super cells arranged in rows on the front side of the solar module, each super cell having a breakdown voltage of at least 10V and overlapping and conductively coupled to electrically connect the silicon solar cells in series. At least nineteen silicon solar cells arranged in line with the ends of the cells;

The end of the first super cell adjacent to the module edge in the first row is electrically connected to the end of the second super cell adjacent to the module edge in the second row via a flexible electrical interconnect coupled to the front side of the first super cell. Connected.

2C8. In a device as in point 1C8, part of the flexible electrical interconnect is covered by a dark film.

3C8. In a device such as in item 2C8, the solar module front side includes a backing sheet exhibiting reduced visible contrast with the flexible electrical interconnect.

4C98. In devices such as in item 1C8, a portion of the flexible electrical interconnect is colored.

5C8. In a device such as in item 4C8, the solar module front side includes a backing sheet exhibiting reduced visible contrast with the flexible electrical interconnect.

6C8. In a device as in item 1C8, the solar module front side comprises a white backing sheet.

7C8. In a device as in item 6C8, it further comprises darkened stripes corresponding to the gaps between the rows.

8C8. In a device as in matter 6C8, the n-type semiconductor layer of the silicon solar cell faces the backing sheet.

9C8. On devices such as in matter 1C8,

The front surface of the solar module includes a back sheet;

The back sheet, the flexible electrical interconnect, the first super cell, and the encapsulant include a laminated structure.

10C8. In a device as in item 9C8, the encapsulant comprises a thermoplastic polymer.

11C8. In a device as in item 10C8, the thermoplastic polymer comprises a thermoplastic olefin polymer.

12C8. In a device as in point 9C8, the windshield sheet is further included.

13C8. In a device as in item 12C8, the back sheet comprises glass.

14C8. In a device as in item 1C8, the flexible electrical interconnect is coupled at a plurality of separate locations.

15C8. In a device as in item 1C8, the flexible electrical interconnect is bonded with an electrically conductive adhesive bonding material.

16C8. In the device as in item 1C8, the connection site to be adhered is further included.

17C8. In a device as in matter 1C8, the flexible electrical interconnect runs parallel to the module edge.

18C8. In a device as in item 1C8, a portion of the flexible electrical interconnect is folded and hidden around the first super cell.

19C8. In a device as in item 1C8, the ribbon further comprises a ribbon conductor electrically connecting the first super cell to an electrical component.

20C8. In a device as in matter 19C8, the ribbon conductor is conductively connected to the flexible electrical interconnect.

21C8. In a device as in matter 19C8, the ribbon conductor is conductively coupled to the surface of the solar cell away from the overlapping end.

*22C8. In devices such as in item 19C8, the electrical component is on the back of the solar module.

23C8. In a device as in point 19C8, the electrical component comprises a junction box.

24C8. In a device such as in item 23C8, the junction box is arranged to match another junction box on the front of another solar module.

25C8. In a device as in item 23C8, the junction box comprises a single terminal junction box.

26C8. In a device as in matter 19C8, the electrical component comprises a bypass diode.

27C8. In a device as in point 19C8, the electrical component comprises a switch.

28C8. On devices such as in matter 27C8,

Receiving the voltage output of the first super cell;

Based on the voltage, determine whether the solar cell of the first super cell is reverse biased;

And a voltage sensing controller configured to communicate with the switch to disconnect the reverse biased solar cell from the super cell module circuit.

29C8. In a device as in matter 1C8, the first super cell is in series with the second super cell.

30C8. On devices such as in matter 1C8,

The first silicon solar cell of the first super cell includes chamfered edges;

The second silicon solar cell of the first super cell lacks chamfered edges;

Each silicon solar cell of the first super cell has a substantially equal front area exposed to light.

31C8. On devices such as in matter 1C8,

The first silicon solar cell of the first super cell includes chamfered edges;

The second silicon solar cell of the first super cell includes chamfered edges;

The long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

32C8. In a device as in matter 1C8, the silicon solar cell of the first super cell comprises a strip having a length of about 156 mm.

33C8. In a device as in matter 1C8, the silicon solar cell of the first super cell comprises a strip having a length of about 125 mm.

34C8. In a device as in matter 1C8, the silicon solar cell of the first super cell comprises a strip having an aspect ratio between width and length of from about 1:2 to about 1:20.

35C8. In a device as in matter 1C8, the overlapping and adjacent silicon solar cells of the first super cell are conductively bonded with an adhesive, and the device further comprises a feature configured to limit diffusion of the adhesive.

36C8. In a device as in matter 35C8, the feature comprises a moat.

37C8. In a device as in point 36C8, the mout is formed by a metallization pattern.

38C8. In a device as in matter 37C8, the metallization pattern comprises a line running along the long side of the silicon solar cell, the device further comprising a plurality of distinct contact pads positioned between the line and the long side. Includes.

39C8. In a device as in matter 37C8, the metallization pattern is located on the front surface of the silicon solar cell of the first super cell.

40C8. In a device as in matter 37C8, the metallization pattern is located on the back side of the silicon solar cell of the second super cell.

1C9. The device,

Photovoltaic with a front surface comprising series connected silicon solar cells grouped into a first super cell comprising a first cut strip having a front metallization pattern along a first outer edge overlapped by a second cut strip Includes modules.

2C9. In a device as in item 1C9, the first cut strip and the second cut strip have a length to reproduce the shape of the wafer into which the first cut strip is divided.

3C9. In a device as in item 2C9, the length is 156 mm.

4C9. In a device as in item 2C9, the length is 125 mm.

5C9. In a device as in item 2C9, the aspect ratio between the width of the first cut strip and the length is from about 1:2 to about 1:20.

6C9. In a device such as in item 2C9, the first cut strip comprises a first chamfered edge.

7C9. In a device as in item 6C9, the first chamfered edge follows the first outer edge.

8C9. In a device as in item 6C9, the first chamfered edge does not follow the first outer edge.

9C9. In a device as in matter 6C9, the second cut strip comprises a second chamfered edge.

10C9. In a device such as in item 9C9, the overlapping edge of the second cut strip includes the second chamfered edge.

11C9. In a device as in item 9C9, the overlapping edge of the second cut strip does not include the second chamfered edge.

12C9. In a device as in item 6C9, the length reproduces the shape of a pseudo square wafer into which the first cut strip is divided.

13C9. In a device as in matter 6C9, the width of the first cut strip is different from the width of the second cut strip so that the first cut strip and the second cut strip have approximately the same area.

14C9. In a device as in item 1C9, the second cut strip overlaps the first cut strip by about 1 mm-5 mm.

15C9. In a device as in matter 1C9, the front metallization pattern comprises a bus bar.

16C9. In a device as in item 15C9, the bus bar comprises a tapered portion.

17C9. In a device as in item 1C9, the front metallization pattern includes a separate contact pad.

18C9. On devices such as in matter 17C9,

A second cut strip is adhered to the first cut strip by an adhesive;

The separate contact pad further includes features that limit adhesive diffusion.

19C9. In a device such as in item 18C9, the feature includes a mout.

20C9. In a device as in item 1C9, the front metallization pattern comprises a bypass conductor.

21C9. In a device as in item 1C9, the front metallization pattern includes a finger.

22C9. In a device as in item 1C9, the first cut strip further comprises a back metallization pattern along a second outer edge opposite the first outer edge.

23C9. In a device as in matter 22C9, the back metallization pattern includes a contact pad.

24C9. In a device as in matter 22C9, the rear metallization pattern comprises a bus bar.

25C9. In a device as in point 1C9, the super cell comprises at least nineteen silicon cut strips each having a breakdown voltage greater than about 10 volts.

26C9. In a device as in matter 1C9, the super cell is connected to another super cell on the front of the module.

27C9. In a device as in matter 26C9, the front of the module includes a white backing that characterizes darkened stripes corresponding to the gaps between the super cell and the other super cell.

28C9. On devices such as in matter 26C9,

The front surface of the solar module includes a back sheet;

The back sheet, the interconnect, the super cell, and the encapsulant include a laminated structure.

29C9. In a device as in item 28C9, the encapsulant comprises a thermoplastic polymer.

30C9. In a device as in item 26C9, the thermoplastic polymer comprises a thermoplastic olefin polymer.

31C9. In a device as in point 26C9, an interconnect is further included between the super cell and the other super cell.

32C9. In a device as in matter 31C9, part of the interconnect is covered by a dark film.

33C9. In devices such as in item 31C9, a portion of the interconnect is colored.

34C9. In a device such as in item 31C9, the ribbon further comprises a ribbon conductor electrically connecting the super cell to an electrical component.

35C9. In a device as in matter 34C9, the ribbon conductor is conductively coupled to the back side of the first cut strip.

36C9. In a device as in matter 34C9, the electrical component comprises a bypass diode.

37C9. In a device as in item 34C9, the electrical component comprises a switch.

38C9. In a device as in item 34C9, the electrical component comprises a junction box.

39C9. In a device as in point 38C9, the junction box is of an overlapping and coincident arrangement with another junction box.

40C9. In a device as in matter 26C9, the super cell and the other super cell are connected in series.

1C10. Way,

Laser scribing a scribe line on a silicon wafer to define a solar cell area;

Applying an electrically conductive adhesive bonding material to the top surface of the scribed silicon wafer adjacent to the long side of the solar cell region; And

And separating a silicon wafer along the scribe line to provide a solar cell strip comprising a portion of the electrically conductive adhesive bonding material disposed adjacent the long side of the solar cell strip.

2C10. In the same method as in item 1C10, the separating step further comprises providing the metallization pattern to the silicon wafer to produce the solar cell strip having the metallization pattern along the long side.

3C10. In the same method as in item 2C10, the metallization pattern comprises a bus bar or a separate contact pad.

4C10. In the same method as in matter 2C10, the providing step includes printing the metallization pattern.

5C10. In the same method as in item 2C10, the providing step includes electroplating the metallization pattern.

6C10. In the same method as in item 2C10, the metallization pattern comprises a feature configured to limit diffusion of the electrically conductive adhesive bonding material.

7C10. In the same manner as in matter 6C10, the feature comprises a moot.

8C10. In the same method as in item 1C10, the applying step includes printing.

9C10. In the same method as in item 1C10, the applying step includes depositing using a mask.

10C10. In the same method as in item 1C10, the length of the long side of the solar cell strip reproduces the shape of the wafer.

11C10. In the same method as in item 10C10, the length is 156 mm or 125 mm.

12C10. In the same method as in item 10C10, the aspect ratio between the width of the solar cell strip and the length is from about 1:2 to about 1:20.

13C10. In the same method as in matter 1C10, the separating step is:

And applying a vacuum between the bottom surface of the wafer and the curved support surface to bend the solar cell region against the curved support surface, thereby cutting the silicon wafer along the scribe line.

14C10. In the same way as in matter 1C10,

Arranging a plurality of solar cell strips in line with the overlapping and long sides of adjacent solar cell strips and a portion of the electrically conductive adhesive bonding material disposed between them; And

Curing the electrically conductive bonding material, bonding adjacent and overlapping solar cell strips to each other and electrically connecting them in series.

15C10. In the same method as in matter 14C10, the curing step includes applying heat.

16C10. In the same method as in matter 14C10, the curing step includes applying pressure.

17C10. In the same method as in matter 14C10, the arranging includes forming a stratified structure.

18C10. In the same method as in matter 17C10, the curing step includes applying heat and pressure to the stratified structure.

19C10. In the same manner as in matter 17C10, the stratified structure comprises an encapsulant.

20C10. In the same method as in item 19C10, the encapsulant comprises a thermoplastic polymer.

21C10. In the same method as in item 20C10, the thermoplastic polymer comprises a thermoplastic olefin polymer.

22C10. In the same method as in item 17C10, the layered structure comprises a backing sheet.

23C10. In the same way as in matter 22C10,

The backing sheet is white;

The layered structure further includes darkened stripes.

24C10. In the same method as in matter 14C10, said arranging comprises arranging at least nineteen solar cell strips in a row.

25C10. In the same method as in matter 24C10, each of the at least nineteen solar cell strips has a breakdown voltage of at least 10V.

26C10. In the same method as in matter 24C10, further comprising placing at least nineteen solar cell strips in communication with a single bypass diode.

27C10. In the same method as in matter 26C10, further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode.

28C10. In the same way as in matter 27C10, the single bypass diode is located in the junction box.

29C10. In the same manner as in matter 28C10, the junction box is on the back of the solar module in an arrangement that matches other junction boxes of the other solar modules.

30C10. In the same method as in matter 14C10, the overlapping cell strips of the plurality of solar cell strips overlap with the solar cell strip by about 1 mm-5 mm.

31C10. In the same method as in matter 14C10, the solar cell strip includes a first chamfered edge.

32C10. In the same method as in item 31C10, the long side of the overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge.

33C10. In the method as in matter 32C10, the width of the solar cell strip is greater than the width of the overlapping solar cell strip so that the solar cell strip and the overlapping solar cell strip have approximately the same area.

34C10. In the same method as in item 31C10, the long side of the overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered edge.

35C10. In the same method as in item 34C10, the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip comprising the first chamfered edge.

36C10. In the same method as in item 34C10, the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip that does not include the first chamfered edge.

37C10. In the same method as in item 14C10, the method further includes connecting the plurality of solar cell strips to the other plurality of solar cell strips using an interconnect.

38C10. In the same method as in matter 37C10, part of the interconnect is covered with a dark film.

39C10. In the same method as in matter 37C10, part of the interconnect is colored.

40C10. In the same method as in item 37C10, the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C11. Way,

Providing a silicon wafer having a length;

Scribing a scribe line on the silicon wafer to define a solar cell area;

Applying an electrically conductive adhesive bonding material to the surface of the silicon wafer; And

And separating the silicon wafer along the scribe line to provide a solar cell strip comprising a portion of the electrically conductive adhesive bonding material disposed adjacent the long side of the solar cell strip.

2C11. In the same method as in matter 1C11, the step of scribing includes laser scribing.

3C11. In the same method as in item 1C11, laser scribing the scribe line and subsequently applying the electrically conductive adhesive bonding material.

4C11. In the same method as in item 2C11, applying the electrically conductive adhesive bonding material to the wafer, followed by laser scribing the scribe line.

5C11. In the same way as in matter 4C11,

The applying step includes applying an uncured electrically conductive adhesive bonding material;

The step of laser scribing includes avoiding the step of curing the uncured conductive adhesive bonding material with heat from the laser.

6C11. In a method as in matter 5C11, the avoiding step includes selecting a laser power and/or a distance between the scribe line and the uncured conductive adhesive bonding material.

7C11. In the same method as in matter 1C11, the applying step includes the step of printing.

8C11. In the same method as in item 1C11, the applying step includes depositing using a mask.

9C11. In the same method as in item 1C11, the scribe line and the electrically conductive adhesive bonding material are on the surface.

10C11. In the same method as in matter 1C11, the separating step comprises:

And applying a vacuum between the surface of the wafer and the curved support surface to bend the solar cell region against a curved support surface, thereby cutting the silicon wafer along the scribe line.

11C11. In the same method as in item 10C11, the separating step comprises arranging the scribe line at an angle to the vacuum manifold.

12C11. In the same method as in item 1C11, the separating step includes using a roller to apply pressure to the wafer.

13C11. In a method as in matter 1C11, the providing step further comprises providing the metallization pattern to the silicon wafer such that the separating step produces a solar cell strip having a metallization pattern along the long side. .

14C11. In the same method as in matter 13C11, the metallization pattern comprises a bus bar or a separate contact pad.

15C11. In the same method as in item 13C11, the providing step includes printing the metallization pattern.

16C11. In the same method as in item 13C11, the providing step includes electroplating the metallization pattern.

17C11. In the same method as in item 13C11, the metallization pattern comprises a feature configured to limit diffusion of the electrically conductive adhesive bonding material.

18C11. In the same method as in item 1C11, the length of the long side of the solar cell strip reproduces the shape of the wafer.

19C11. In the same method as in matter 18C11, the length is 156 mm or 125 mm.

20C11. In the same method as in matter 18C11, the aspect ratio of the width and the length of the solar cell strip is from about 1:2 to about 1:20.

21C11. In the same way as in matter 1C11,

Arranging a plurality of solar cell strips in line with the overlapping and long sides of adjacent solar cell strips and a portion of the electrically conductive adhesive bonding material disposed therebetween; And

The method further includes curing the electrically conductive bonding material, bonding adjacent and overlapping solar cell strips to each other and electrically connecting them in series.

22C11. In the same way as in matter 21C11,

The arranging step includes forming a stratified structure;

The curing step includes application of heat and/or pressure to the stratified structure.

23C11. In the same method as in item 22C11, the layered structure comprises a thermoplastic olefin polymer encapsulant.

24C11. In the same manner as in matter 22C11, the stratified structure is:

White backing sheet; And

And darkened stripes on the white backing sheet.

25C11. In the same way as in matter 22C11,

A plurality of wafers is provided on the template;

The conductive adhesive bonding material is distributed on the plurality of wafers;

The plurality of wafers are cells that are simultaneously separated into a plurality of solar cell strips as a fixture.

26C11. In the same method as in item 25C11, the method further comprises transferring the plurality of solar cell strips as a group, wherein the arranging includes arranging the plurality of solar cell strips into a module.

27C11. In the same method as in matter 21C11, the step of arranging comprises arranging at least nineteen solar cell strips with a breakdown voltage of at least 10V in series with only a single bypass diode.

28C11. In the same method as in item 27C11, further comprising forming a ribbon conductor between one of said at least nineteen solar cell strips and said single bypass diode.

29C11. In the same method as in matter 28C11, the single bypass diode is located in the first junction box of the first solar module in an arrangement matching the second junction box of the second solar module.

30C11. In the same method as in matter 27C11, further comprising forming a ribbon conductor between the smart switch and one of the at least nineteen solar cell strips.

31C11. In the same method as in item 21C11, the overlapping cell strips of the plurality of solar cell strips overlap the solar cell strip by about 1 mm-5 mm.

32C11. In the same method as in item 21C11, the solar cell strip includes a first chamfered edge.

33C11. In the same method as in matter 32C11, the long side of the overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge.

34C11. In the same method as in item 33C11, the width of the solar cell strip is larger than the overlapping solar cell strip so that the solar cell strip and the overlapping solar cell strip have approximately the same area.

35C11. In the same method as in matter 32C11, the long side of the overlapping solar cell strip of the plurality of solar cell strips comprises a second chamfered edge.

36C11. In the same method as in item 35C11, the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip comprising the first chamfered edge.

37C11. In the same method as in item 35C11, the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip that does not include the first chamfered edge.

38C11. In the same method as in item 21C11, the method further includes connecting the plurality of solar cell strips to the other plurality of solar cell strips using an interconnect.

39C11. In the same method as in matter 38C11, part of the interconnect is covered or colored by a dark film.

40C11. In the same method as in matter 38C11, the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C12. Way,

Providing a silicon wafer having a length;

Scribing a scribe line on a silicon wafer to define a solar cell area;

Separating the silicon wafer along the scribe line to provide a solar cell strip; And

Disposed adjacent to the long side of the solar cell strip

And applying an electrically conductive adhesive bonding material.

2C12. In the same method as in matter 1C12, the step of scribing includes laser scribing.

3C12. In the same method as in item 1C12, the applying step includes screen printing.

4C12. In the same method as in matter 1C12, the applying step includes inkjet printing.

5C12. In the same method as in item 1C12, the applying step includes depositing using a mask.

6C12. In the same method as in item 1C12, the separating step includes applying a vacuum between the surface of the wafer and the curved surface.

7C12. In the same method as in matter 6C12, the curved surface comprises a vacuum manifold, and the separating step comprises orienting the scribe line at an angle relative to the vacuum manifold.

8C12. In the same way as in matter 7C12, the angle is a right angle.

9C12. In the same method as in matter 7C12, the angle is an angle other than a right angle.

10C12. In the same way as in matter 6C12, the vacuum is applied through the transfer belt.

11C12. In the same way as in matter 1C12,

Arranging in series with the adjacent solar cell strips overlapping with the electrically conductive adhesive bonding material disposed therebetween; And

Curing the electrically conductive bonding material to join adjacent and overlapping solar cell strips that are electrically connected in series.

12C12. In the same method as in item 11C12, the arranging step includes forming a stratified structure including an encapsulant, and the method further includes laminating the stratified structure.

13C12. In the same method as in item 12C12, the curing step occurs at least partially during the laminating step.

14C12. In the same method as in item 12C12, the curing step occurs separately from the laminating step.

15C12. In the same method as in matter 12C12, the laminating step includes applying a vacuum.

16C12. In the same way as in item 15C12, the vacuum is applied to the bladder.

17C12. In the same way as in item 15C12, the vacuum is applied to the belt.

18C12. In the same method as in item 12C12, the encapsulant comprises a thermoplastic olefin polymer.

19C12. In the same manner as in matter 12C12, the stratified structure is

White backing sheet; And

And darkened stripes on the white backing sheet.

20C12. In a method as in matter 11C12, the providing step includes providing the metallization pattern to the silicon wafer such that the separating step produces a solar cell strip having a metallization pattern along the long side.

21C12. In the same manner as in matter 20C12, the metallization pattern comprises a bus bar or a separate contact pad.

22C12. In the same method as in matter 20C12, the providing step includes printing or electroplating the metallization pattern.

23C12. In the same method as in item 20C12, the step of arranging includes limiting the diffusion of the electrically conductive adhesive bonding material using the features of the metallization pattern.

24C12. In the same way as in item 23C12, the feature is on the front side of the solar cell strip.

25C12. In the same way as in item 23C12, the feature is on the back side of the solar cell strip.

26C12. In the same method as in item 11C12, the length of the long side of the solar cell strip reproduces the shape of the wafer.

27C12. In the same method as in matter 26C12, the length is 156 mm or 125 mm.

28C12. In the method as in matter 26C12, the aspect ratio between the width of the solar cell strip and the length is from about 1:2 to about 1:20.

29C12. In the same method as in item 11C12, the arranging includes arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V in line with only a single bypass diode as a first super cell.

30C12. In the same method as in item 29C12, further comprising applying the electrically conductive adhesive bonding material between the first super cell and the interconnect.

31C12. In the same method as in item 30C12, the interconnect connects the first super cell in parallel with the second super cell.

32C12. In the same manner as in item 30C12, the interconnect connects the first super cell in series with the second super cell.

33C12. In the same method as in item 29C12, further comprising forming a ribbon conductor between the first super cell and the single bypass diode.

34C12. In the same method as in item 33C12, the single bypass diode is located in the first junction box of the first solar module in an arrangement that matches the second junction box of the second solar module.

35C12. In the same method as in item 11C12, the solar cell strip includes a first chamfered edge.

36C12. In the same method as in matter 35C12, the long side of the overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge.

37C12. In the same method as in item 36C12, the width of the solar cell strip is greater than the width of the overlapping solar cell strip so that the solar cell strip and the overlapping solar cell strip have approximately the same area.

38C12. In the same method as in item 35C12, the long side of the overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered edge.

39C12. In the same method as in matter 38C12, the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip comprising the first chamfered edge.

40C12. In the same method as in matter 38C12, the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip that does not include the first chamfered edge.

1C13. The device,

A semiconductor wafer having a first surface having a first metallization pattern along a first outer edge and a second metallization pattern along a second outer edge opposite the first outer edge, the semiconductor wafer comprising A first scribe line between the first metallization pattern and the second metallization pattern is further provided.

2C13. In a device as in item 1C13, the first metallization pattern includes a separate contact pad.

3C13. In a device as in item 1C13, the first metallization pattern is directed away from the first outer edge toward the second metallization pattern. It includes a first finger.

4C13. In a device as in item 3C13, the first metallization pattern further comprises a bus bar that runs along the first outer edge and intersects the first finger.

5C13. In a device as in matter 4C13, the second metallization pattern is:

A second finger pointing away from the second outer edge toward the first metallization pattern; And

And a second bus bar running along the second outer edge and intersecting the second finger.

6C13. In a device as in item 3C13, further comprising an electrically conductive adhesive that runs along the first outer edge and contacts the first finger.

7C13. In a device as in item 3C13, the first metallization pattern further comprises a first bypass conductor.

8C13. In a device as in item 3C13, the first metallization pattern further comprises a first end conductor.

9C13. In a device as in item 1C13, the first metallization pattern comprises silver.

10C13. In a device as in item 9C13, the first metallization pattern comprises silver paste.

11C13. In a device as in item 9C13, the first metallization pattern includes separate contacts.

12C13. In a device as in point 1C13, the first metallization pattern comprises tin, aluminum, or other conductors that are less expensive than silver.

13C13. In a device as in item 1C13, the first metallization pattern comprises copper.

14C13. In a device as in item 13C13, the first metallization pattern comprises electroplated copper.

15C13. In devices such as in item 13C13, a passivation scheme to reduce recombination is further included.

16C13. On devices such as in matter 1C13,

A third metallization pattern on the first surface of the semiconductor wafer that is not proximate to the first outer edge or the second outer edge; And

Further comprising a second scribe line between the third metallization pattern and the second metallization pattern, the first scribe line is between the first metallization pattern and the third metallization pattern.

17C13. In an apparatus as in matter 16C13, the ratio of the first width defined between the first scribe line and the second scribe line divided by the length of the semiconductor wafer is from about 1:2 to about 1:20.

18C13. In a device as in matter 17C13, the length is about 156 mm or about 125 mm.

19C13. In an apparatus as in item 17C13, the semiconductor wafer includes chamfered edges.

20C13. On devices such as in matter 19C13,

The first scribe line is defined by the first outer edge, the area of the first rectangle includes two chamfered edges and the first metallization pattern, and the area of the first rectangle is applied to the product of the length. A second width greater than a corresponding area and a combined area of the two chamfered corners minus the first width;

The second scribe line is defined as the first scribe line, wherein the area of the second rectangle does not include chamfered edges and includes the third metallization pattern, and the area of the second rectangle is a product of the length And an area corresponding to the first width.

21C13. In a device as in matter 16C13, the third metallization pattern includes a finger facing the second metallization pattern.

22C13. In a device as in item 1C13, further comprising a third metallization pattern on the second surface of the semiconductor wafer facing the first surface.

23C13. In a device as in item 22C13, the third metallization pattern includes a contact pad proximate the location of the first scribe line.

24C13. In a device as in point 1C13, the first scribe line is formed by a laser.

25C13. In a device as in item 1C13, the first scribe line is within the first surface.

26C13. In a device such as in item 1C13, the first metallization pattern includes features configured to limit diffusion of the electrically conductive adhesive.

27C13. In a device as in item 26C13, the feature comprises a protruding feature.

28C13. In a device as in item 27C13, the first metallization pattern comprises a contact pad, and the feature is adjacent the contact pad and includes a larger dam.

29C13. In a device as in item 26C13, the feature comprises a recessed feature.

30C13. In a device such as in item 29C13, the recessed feature includes a mout.

31C13. In a device as in item 26C13, further comprising the electrically conductive adhesive in contact with the first metallization pattern.

32C13. In a device as in item 31C13, the electrically conductive adhesive is printed.

33C13. In a device as in item 1C13, the semiconductor wafer comprises silicon.

34C13. In a device as in item 33C13, the semiconductor wafer comprises crystalline silicon.

35C13. In a device as in item 33C13, the first surface is an n-type conductivity type.

36C13. In a device as in item 33C13, the first surface is a p-type conductivity type.

37C13. On devices such as in matter 1C13,

The first metallization pattern is 5 mm or less from the first outer edge;

The second metallization pattern is 5 mm or less from the second outer edge.

38C13. In a device as in item 1C13, the semiconductor wafer includes chamfered edges, and the first metallization pattern includes a tapered portion extending around the chamfered edge.

39C13. In a device as in matter 38C13, the tapered portion comprises a bus bar.

40C13. In a device as in matter 38C13, the tapered portion comprises a conductor connecting a separate contact pad.

1C14. Way,

Scribing a first scribe line on the wafer; And

And separating the wafer along the first scribe line using a vacuum to provide a solar cell strip.

2C14. In the same method as in matter 1C14, the step of scribing includes laser scribing.

3C14. In the same method as in item 2C14, the separating step includes applying the vacuum between the surface of the wafer and the curved surface.

4C14. In the same method as in matter 3C14, the surface of the curve comprises a vacuum manifold.

5C14. In the same method as in item 4C14, the wafer is supported on a moving belt to the vacuum manifold, and the vacuum is applied through the belt.

6C14. In the same method as in matter 5C14, the separating step comprises:

Orienting the first scribe line at an angle with respect to the vacuum manifold; And

And starting cutting at one end of the first scribe line.

7C14. In the same method as in matter 6C14, the angle is substantially perpendicular.

8C14. In the same method as in matter 6C14, the angle is substantially an angle other than a right angle.

9C14. In the same method as in item 3C14, further comprising applying an uncured electrically conductive adhesive bonding material.

10C14. In the same method as in item 9C14, the first scribe line and the uncured electrically conductive adhesive bonding material are on the same surface of the wafer.

11C14. In the same method as in item 10C14, the laser scribing is performed by laser power and/or by selecting a distance between the first scribe line and the uncured conductive adhesive bonding material. Avoids curing.

12C14. In the same method as in item 10C14, the same surface is opposed to the wafer surface supported by a belt that moves the wafer to the curved surface.

13C14. In the same method as in matter 12C14, the surface of the curve comprises a vacuum manifold.

14C14. In the same method as in matter 9C14, the applying step occurs after the scribing step.

15C14. In the same method as in item 9C14, the applying step occurs after the separating step.

16C14. In the same method as in item 9C14, the applying step includes screen printing.

17C14. In the same method as in matter 9C14, the applying step includes inkjet printing.

18C14. In the same method as in item 9C14, the applying step includes depositing using a mask.

19C14. In the same method as in matter 3C14, the first scribe line,

A first metallization pattern on the surface of the wafer along a first outer edge and

Between the second metallization pattern on the surface of the wafer along the second outer edge.

20C14. In the same method as in item 19C14, the wafer further comprises a third metallization pattern on the surface of the semiconductor wafer not proximate to the first outer edge and the second outer edge, the method comprising:

Scribing a second scribe line between the third metallization pattern and the second metallization pattern such that the first scribe line is between the first metallization pattern and the third metallization pattern; And

And separating the wafer along the second scribe line to provide another solar cell strip.

21C14. In the same method as in matter 20C14, the distance between the first scribe line and the second scribe line defines an aspect ratio of about 1:2 to about 1:20 to the length of the wafer having about 125 mm or about 156 mm. To form a width.

22C14. In the same method as in item 19C14, the first metallization pattern includes a finger facing the second metallization pattern.

23C14. In the same method as in item 22C14, the first metallization pattern further comprises a bus bar intersecting the finger.

24C14. In the same way as in item 23C14, the bus bar is within 5 mm of the first outer edge.

25C14. In the same method as in item 22C14, further comprises an uncured electrically conductive adhesive bonding material in contact with the finger.

26C14. In the same method as in item 19C14, the first metallization pattern includes a separate contact pad.

27C14. In the same method as in item 19C14, the method further comprises printing or electroplating the first metallization pattern on the wafer.

28C14. In the same way as in item 3,

Further comprising arranging the solar cell strip in a first super cell comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10V, the long sides of adjacent solar cell strips having the electrical therebetween. Overlaps with a conductive adhesive bonding material;

Further comprising curing the electrically conductive bonding material to join adjacent and overlapping solar cell strips that are electrically connected in series.

29C14. In the same method as in item 28C14, the arranging step includes forming a stratified structure including an encapsulant, and the method further includes laminating the stratified structure.

30C14. In the same method as in item 29C14, the curing occurs at least partially during the laminating step.

31C14. In the same manner as in item 29C14, the curing occurs separately from the laminating step.

32C14. In the same method as in item 29C14, the encapsulant comprises a thermoplastic olefin polymer.

33C14. In the same manner as in matter 29C14, the stratified structure is:

White backing sheet; And

And darkened stripes on the white backing sheet.

34C14. In the same method as in matter 28C14, the arranging includes limiting the diffusion of the electrically conductive adhesive bonding material using metallization pattern features.

35C14. In the same method as in item 34C14, the metallization pattern feature is on the front side of the solar cell strip.

36C14. In the same method as in item 34C14, the metallization pattern feature is on the back side of the solar cell strip.

37C14. In the same method as in matter 28C14, the method further comprises applying an electrically conductive adhesive bonding material between the interconnects connecting the first super cell and the second super cell directly.

38C14. In the same method as in matter 28C14, further comprising forming a ribbon conductor between the first super cell and a single bypass diode, wherein the single bypass diode is in contact with the second junction box of the second solar module. It is located within the first junction box of the first solar module in a matching arrangement.

39C14. In the same way as in matter 28C14,

The solar cell strip includes a first chamfered edge;

The long side of the overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered edge;

The width of the solar cell strip is greater than the width of the overlapping solar cell strip so that the solar cell strip and the overlapping solar cell strip have approximately the same area.

40C14. In the same way as in matter 28C14,

The solar cell strip includes a first chamfered edge;

The long side of the overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered edge;

The long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the solar cell strip that does not include the first chamfered edge.

1C15. Way,

Forming a first metallization pattern along a first outer edge of the first surface of the semiconductor wafer;

Forming a second metallization pattern along a second outer edge of the first surface, wherein the second outer edge is opposite the first outer edge;

And forming a first scribe line between the first metallization pattern and the second metallization pattern.

2C15. In the same way as in matter 1C15,

The first metallization pattern includes a first finger facing the second metallization pattern;

The second metallization pattern includes a second finger facing the first metallization pattern.

3C15. In the same way as in matter 2C15,

The first metallization pattern further includes a first bus bar intersecting the first finger and positioned within 5 mm of the first outer edge;

The second metallization pattern includes a second bus bar intersecting the second finger and positioned within 5 mm of the second outer edge.

4C15. In the same way as in matter 3C15,

And forming a third metallization pattern on the first surface that does not follow the first outer edge or does not follow the second outer edge, wherein the third metallization pattern comprises:

A third bus bar parallel to the first bus bar and

A third finger facing the second metallization pattern;

And forming a second scribe line between the third metallization pattern and the second metallization pattern, wherein the first scribe line is between the first metallization pattern and the third metallization pattern. .

5C15. In the same method as in item 4C15, the first scribe line and the second scribe line are separated by a width having a ratio to the length of the semiconductor wafer of about 1:2 to about 1:20.

6C15. In the same method as in item 5C15, the length of the semiconductor wafer is about 156 mm or about 125 mm.

7C15. In the same method as in item 4C15, the semiconductor wafer includes chamfered edges.

8C15. In the same way as in matter 7C15,

The first scribe line is defined by a first outer edge, the first solar cell area includes two chamfered edges and the first metallization pattern, and the first solar cell area is the length of the semiconductor wafer. A first area corresponding to the product and a first width minus the combined area of the two chamfered edges;

The second scribe line is defined as the first scribe line, the second solar cell area does not include chamfered edges and includes the third metallization pattern, and the second solar cell area is a product of the length. Has a second area corresponding to and a second width narrower than the first width, so that the first area and the second area are approximately the same.

9C15. In the same method as in matter 8C15, the length is about 156 mm or about 125 mm.

10C15. In the same method as in item 4C15, the step of forming the first scribe line and the step of forming the second scribe line include laser scribing.

11C15. In the same method as in item 4C15, the step of forming the first metallization pattern, the step of forming the second metallization pattern, and the step of forming the third metallization pattern include printing.

12C15. In the same method as in item 11C15, the step of forming the first metallization pattern, the step of forming the second metallization pattern, and the step of forming the third metallization pattern include screen printing.

13C15. In the same method as in item 11C15, forming the first metallization pattern includes forming a plurality of contact pads containing silver.

14C15. In the same method as in item 4C15, the step of forming the first metallization pattern, the step of forming the second metallization pattern, and the step of forming the third metallization pattern include electroplating.

15C15. In the same method as in item 14C15, the first metallization pattern, the second metallization pattern and the third metallization pattern include copper.

16C15. In the same method as in item 4C15, the first metallization pattern comprises aluminum, tin, silver, copper and/or conductors that are less expensive than silver.

17C15. In the same method as in item 4C15, the semiconductor wafer comprises silicon.

18C15. In the same method as in item 17C15, the semiconductor wafer comprises crystalline silicon.

19C15. In the same method as in item 4C15, further comprising forming a fourth metallization pattern on the second surface of the semiconductor wafer between 5 mm of the position of the first outer edge and the second scribe line.

20C15. In the same method as in item 4C15, the first surface has a first conductivity type, and the second surface has a second conductivity type opposite to the first conductivity type.

21C15. In the same method as in item 4C15, the fourth metallization pattern includes a contact pad.

22C15. In the same method as in item 3C15, further comprising applying a conductive adhesive to the semiconductor wafer.

23C15. In the same method as in item 22C15, the method further comprises applying the conductive adhesive in contact with the first finger.

24C15. In the same method as in item 23C15, applying the conductive adhesive comprises depositing using screen printing or a mask.

25C15. In the same method as in item 3C15, the method further comprises separating the semiconductor wafer along the first scribe line to form a first solar cell strip comprising the first metallization pattern.

26C15. In the same method as in item 25C15, the step of separating comprises applying a vacuum to the first scribe line.

27C15. In the same method as in item 26C15, the method further comprises placing the semiconductor wafer on a belt that moves to the vacuum.

28C15. In the method as in matter 25C15, further comprising applying a conductive adhesive to the first solar cell strip.

29C15. In the same way as in matter 25C15,

Further comprising arranging the first solar cell strip in a first super cell comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10V, the long sides of adjacent solar cell strips in between. Overlaps the conductive adhesive being placed;

Curing the conductive adhesive to bond adjacent and overlapping solar cell strips that are electrically connected in series.

30C15. In the same method as in item 29C15, the arranging step includes forming a stratified structure comprising an encapsulant, the method further comprising laminating the stratified structure.

31C15. In the same method as in item 30C15, the curing step occurs at least partially during the laminating step.

32C15. In the same method as in item 30C15, the curing step occurs separately from the laminating step.

33C15. In the same method as in item 30C15, the encapsulant comprises a thermoplastic olefin polymer.

34C15. In the same way as in matter 30C15, the stratified structure is,

White backing sheet; And

And darkened stripes on the white backing sheet.

35C15. In the same method as in item 29C15, the step of arranging includes limiting the diffusion of the conductive adhesive with a metallization pattern feature.

36C15. In the same method as in matter 35C15, the metallization pattern feature is on the front side of the first solar cell strip.

37C15. In the same method as in item 29C15, the method further includes applying the conductive adhesive between interconnects connecting the first super cell and the second super cell in series.

38C15. In the same method as in item 29C15, further comprising forming a ribbon conductor between a single bypass diode and the first super cell, wherein the single bypass diode is in contact with the second junction box of the second solar module. It is located within the first junction box of the first solar module in a matching arrangement.

39C15. In the same way as in matter 29C15,

The first solar cell strip includes a first chamfered edge;

The long side of the overlapping solar cell strip of the first super cell does not include a second chamfered edge;

The width of the first solar cell strip is greater than the width of the overlapping solar cell strip so that the first solar cell strip and the overlapping solar cell strip have approximately the same area.

40C15. In the same way as in matter 29C15,

The first solar cell strip includes a first chamfered edge;

The long side of the overlapping solar cell strip of the first super cell includes a second chamfered edge;

The long side of the overlapping solar cell strip overlaps the long side of the first solar cell strip that does not include the first chamfered edge.

1C16. Way,

A row of first bus bars or contact pads arranged parallel and adjacent to the first outer edge of the wafer and a second arranged parallel and adjacent to the second outer edge of the wafer opposite and parallel to the first edge of the wafer A step of killing or providing a silicon wafer having a front metallization pattern comprising a row of bus bars or contact pads;

Separating the silicon wafer along one or more scribe lines parallel to the first and second outer edges of the wafer to form a plurality of rectangular solar cells, wherein the first bus bar or contact pad The row of solar cells is arranged parallel and adjacent to the long outer edge of the first one of the rectangular solar cells, and the row of the second bus bar or contact pads is parallel to the long outer edge of the second one of the rectangular solar cells. And adjacently arranged;

And arranging the rectangular solar cells in series with long sides of adjacent solar cells that are overlapping and conductively coupled to each other to electrically connect the solar cells in series to form a super cell;

The rows of the first bus bar or contact pads on the first one of the rectangular solar cells overlap and are conductively coupled by the bottom surface of the adjacent rectangular solar cell in the super cell.

2C16. In the same method as in item 1C16, the rows of the second bus bar or contact pads on the second one of the rectangular solar cells are superimposed and conductively bound by the bottom of an adjacent rectangular solar cell in the super cell. do.

3C16. In the same method as in item 1C16, the silicon wafer is a square or pseudo square silicon wafer.

4C16. In the same method as in item 3C16, the silicon wafer comprises sides of about 125 mm long or about 156 mm long.

5C16. In the same method as in matter 3C16, the ratio of the length to the width of each rectangular solar cell is from about 2:1 to about 20:1.

6C16. In the same method as in matter 1C16, the silicon wafer is a crystalline silicon wafer.

7C16. In the same method as in matter 1C16, the row of the first bus bar or contact pads and the row of the second bus bar or contact pads convert the light into electricity less efficiently than the central regions of the silicon wafer. It is located within the edge regions.

8C16. In the same method as in item 1C16, the front metallization pattern is first plurality of parallel fingers electrically connected to the row of the first bus bar or contact pads and extending inwardly from the first outer edge of the wafer, and And a second plurality of parallel fingers electrically connected to the second bus bar or row of contact pads and extending inwardly from the second outer edge of the wafer.

9C16. In the same method as in item 1C16, the front metallization pattern is located between the rows of the first bus bar or contact pads and the rows of the second bus bar or contact pads and is oriented parallel to at least a third bus bar or contact pad. And a third plurality of parallel fingers oriented and electrically connected orthogonally to a row of the third bus bar or contact pads, wherein the row of the third bus bar or contact pads comprises the plurality of rectangular solar cells After the silicon wafer is separated to form them, it is arranged parallel and adjacent to the long outer edge of the third one of the rectangular solar cells.

10C16. In the same method as in item 1C16, applying a conductive adhesive to the rows of the first bus bar or contact pads to conductively couple the first rectangular solar cell to an adjacent solar cell.

11C16. In the same method as in item 10C16, the metallization pattern includes a barrier configured to limit diffusion of the conductive adhesive.

12C16. In the same method as in item 10C16, applying the conductive adhesive by screen printing.

13C16. In the same method as in item 10C16, applying the conductive adhesive by inkjet printing.

14C16. In the same method as in item 10C16, the conductive adhesive is applied before the formation of the scribe lines in the silicon wafer.

15C16. In the same method as in item 1C16, the step of separating the silicon wafer along the one or more scribe lines is between the bottom surface of the silicon wafer and the support surface of the curve to bend the silicon wafer against a curved support surface. And applying a vacuum, thus cutting the silicon wafer along the one or more scribe lines.

16C16. In the same way as in matter 1C16,

The silicon wafer is a pseudo-square silicon wafer comprising chamfered edges, and after separation of the silicon wafer to form a plurality of rectangular solar cells, one or more of the rectangular solar cells is one of chamfered edges. Or more;

The spacing between the scribe lines makes the width perpendicular to the long axis of the rectangular solar cells including the chamfered edges larger than the width perpendicular to the long axis of the rectangular solar cells lacking the chamfered edges, the chamfer Being selected to compensate for the processed edges, each of the plurality of rectangular solar cells in the super cell has a substantially equal area front surface exposed to light in the operation of the super cell.

17C16. In the same method as in item 1C16, arranging the super cells in a stratified structure between a transparent front sheet and a back sheet and laminating the stratified structure.

18C16. In the same method as in matter 17C16, the step of laminating the stratified structure cures a conductive adhesive disposed between the adjacent rectangular solar cells in the super cell to conductively connect adjacent rectangular solar cells to each other. Complete.

19C16. In the same method as in matter 17C16, the super cell is arranged in the stratified structure in one of two or more parallel rows of super cells, and the back sheet is positioned of gaps between two or more rows of the super cells. Since it is a white sheet comprising parallel and darkened stripes with positions and widths corresponding to the fields and widths, the white portions of the back sheet are not visible through the gaps between the rows of super cells in the assembled module.

20C16. In the same method as in item 17C16, the front sheet and the back sheet are glass sheets, and the super cell is sealed in a layer of thermoplastic olefin interposed between the glass sheets.

21C16. In the same method as in item 1C16, the step of arranging the super cells in a first module comprising a junction box in an arrangement consistent with the second junction box of the second solar module.

1D. The solar module,

Comprising a plurality of super cells arranged in two or more parallel rows, each super cell overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series with the long sides of adjacent silicon solar cells A plurality of rectangular or substantially rectangular silicon solar cells arranged in a line;

A first hidden tab contact pad located on the rear surface of the first solar cell located at an intermediate position along the first one of the super cells;

A first electrical interconnect conductively coupled to the first hidden tab contact pad;

The first electrical interconnect has a stress relief feature that accommodates differential thermal expansion between the interconnect and the silicon solar cell to which it is coupled.

2D. In item 1D and in the solar module, comprising a second hidden tab contact pad located on the back of the second solar cell located adjacent to the first solar cell in an intermediate position along the second one of the super cells, , The first hidden tap contact pad is electrically connected to the second hidden tap contact pad through the first electrical interconnect.

3D. In matter 2D and in the solar module, the first electrical interconnect extends across the gap between the first super cell and the second super cell, and is conductively coupled to the second hidden tab contact pad.

4D. In item 1D and in the solar module, a second hidden tap contact pad located on the back of the second solar cell located at another intermediate position along the first one of the super cells, the second hidden tap contact pad conductive A second electrical interconnect coupled to and electrically connected by the first and second electrical interconnects parallel to the solar cells located between the first hidden tab contact pad and the second hidden tab contact pad And a bypass diode.

5D. In item 1D and in the solar module, the first hidden tab contact pads are a plurality of hidden tab contact pads arranged on the back side of the first solar cell in a row running parallel to the long axis of the first solar cell. One, the first electrical interconnect is conductively coupled to each of the plurality of hidden contacts and substantially traverses the length of the first solar cell along the long axis.

6D. In item 1D and in the solar module, the first hidden tab contact pad is located adjacent to a short side of the back side of the first solar cell, and the first electrical interconnect is the hidden tab contact pad along the long axis of the solar cell. The back metallization pattern on the first solar cell, which does not extend substantially from inside, provides a conduction passageway for the interconnect having a sheet resistance less than or equal to about 5 ohms per square.

7D. In matter 6D and in the solar module, the sheet resistance is less than or equal to about 2.5 ohms per square.

8D. In matter 6D and in the solar module, the first interconnect comprises two tabs located on opposite sides of the stress relief feature, one of the tabs being attached to the first hidden tab contact pad. It is electrically conductive.

9D. In matter 8D and in the solar module, the two tabs are of different lengths.

10D. In item 1D and in the solar module, the first electrical interconnect includes alignment features that identify a desired alignment with the first hidden tap contact pad.

11D. In item 1D and in the solar module, the first electrical interconnect includes alignment features that identify a desired alignment of the edge of the first super cell.

12D. In item 1D and in the solar module, the solar modules are arranged in a shingled manner overlapping with other solar modules that are electrically connected in overlapping regions.

13D. The solar module,

A glass front sheet;

Includes a back seat;

A plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet, each super cell overlapping and electrically conductively bonding to each other to electrically connect the silicon solar cells in series. A plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells;

A first flexible electrical interconnect is tightly conductively coupled to the first of the super cells;

The flexible conductive bonds between overlapping solar cells are the front surface of the super cells and the glass in a direction parallel to the columns for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. Providing mechanical compliance to accommodate mismatches in thermal expansion between sheets;

A tight conductive bond between the first super cell and the first flexible electrical interconnect is such that the first flexible electrical interconnect is orthogonal to the columns for a temperature range of about -40°C to about 180°C without damaging the solar module. Direction to accommodate mismatch of thermal expansion between the first super cell and the first flexible interconnect.

14D. In matter 13D and in the solar module, conductive bonds between the superimposed and adjacent solar cells in a super cell use a conductive adhesive different from the conductive bonds between the super cell and the flexible electrical interconnect.

15D. In matter 14D and in the solar module, all of the conductive adhesives can be cured in the same processing step.

16D. In item 13D and in the solar module, the conductive bond at one side of at least one solar cell in a super cell uses a conductive adhesive different from the conductive bond at the other side.

17D. In matter 16D and in the solar module, all of the conductive adhesives can be cured in the same processing step.

18D. In matter 13D and in the solar module, the conductive bonds between the overlapping and adjacent solar cells accommodate differential motion between each cell and the glass front sheet greater than or equal to about 15 microns.

19D. In item 13D and in the solar module, conductive bonds between the overlapping and adjacent solar cells are orthogonal to the solar cells less than or equal to about 50 microns and greater than or equal to about 1.5 W/(meter rK). It has a thermal conductivity orthogonal to the solar cells.

20D. In item 13D and in the solar module, the first flexible electrical interconnect resists thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.

21D. In item 13D and in the solar module, a portion of the first flexible electrical interconnect that is conductively coupled to the super cell is like a ribbon formed of copper and less than or equal to about 50 microns, the surface of the solar cell to which it is bonded Has a thickness orthogonal to.

22D. In item 21D and in the solar module, a portion of the first flexible electrical interconnect that is conductively coupled to the super cell is like a ribbon formed of copper and less than or equal to about 30 microns, the surface of the solar cell to which it is bonded Has a thickness orthogonal to.

23D. In item 21D and in the solar module, the first flexible electrical interconnect is not coupled to the solar cell, and the required conductivity copper provides higher conductivity than a portion of the first flexible electrical interconnect that is conductively coupled to the solar cell. Includes part.

24D. In item 21D and in the solar module, the first flexible electrical interconnect has a width greater than or equal to about 10 mm in the plane of the surface of the solar cell in a direction orthogonal to the flow of current through the interconnect.

25D. In item 21D and in the solar module, the first flexible electrical interconnect is conductively coupled to a conductor proximate to the solar cell providing higher conductivity than the first electrical interconnect.

26D. In item 13D and in the solar module, the solar modules are arranged in a shingled fashion that overlaps other solar modules that are electrically connected in overlapping regions.

27D. The solar module,

Elongated sides of adjacent silicon solar cells comprising a plurality of super cells arranged in two or more parallel rows, each super cell superimposed and electrically coupled directly to each other to electrically connect the silicon solar cells in series. A plurality of rectangular or substantially rectangular silicon solar cells arranged in line with;

A hidden tab contact pad that does not conduct effective current in normal operation located on the back side of the first solar cell;

The first solar cell is located in an intermediate position along the first one of the super cells in the first one of the rows of super cells, and the hidden tap contact pad is at least within the second one of the rows of super cells. The second solar cell is electrically connected in parallel.

28D. In item 27D and in the solar module, an electrical interconnect coupled to the hidden tap contact pad and electrically interconnecting the hidden tap contact pad to the second solar cell, wherein the electrical interconnect comprises: Not substantially striking in length, the back metallization pattern of the first solar cell provides a conductive passageway to the hidden tab contact pad having a sheet resistance less than or equal to about 5 ohms per square.

29D. In matter 27D and in the solar module, the plurality of super cells are arranged in three or more rows spanning the width of the solar module orthogonal to the rows, and the hidden tap contact pad electrically conducts the rows of the super cells. Electrically connected to a hidden contact pad on at least one solar cell in each column of the super cells to connect in parallel, at least one of the hidden tab contact pads or at least one of interconnects between the hidden tab contact pads The bus connection is connected to a bypass diode or other electronic device.

30D. In item 27D and in the solar module, a flexible electrical interconnect is conductively coupled to the hidden tab contact pad to be electrically connected to the second solar cell,

A portion of the flexible electrical interconnect that is conductively coupled to the hidden tab contact pad is like a ribbon formed of copper and has a thickness orthogonal to the surface of the solar cell to which it is bonded, less than or equal to about 50 microns;

The conductive coupling between the hidden tab contact pad and the flexible electrical interconnect allows the flexible electrical interconnect to withstand mismatch in thermal expansion between the first solar cell and the flexible interconnect, and from about -40°C to without damaging the solar module The relative motion between the first solar cell and the second solar cell resulting from thermal expansion is accommodated for a temperature range of about 180°C.

31D. In item 27D and in the solar module, in operation of the solar module, the first hidden tap contact pad can conduct a current greater than the current generated within any single of the solar cells.

32D. In item 27D and in the solar module, the front surface of the first solar cell overlying the first hidden tab contact pad is not occupied by contact pads or any other interconnect features.

33D. In item 27D and in the solar module, any area of the front side of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is by contact pads or any other interconnect features. It is not occupied by.

34D. In matter 27D and in the solar module, most of the cells within each super cell do not have hidden tap contact pads.

35D. In item 34D and in the solar module, the cells with the hidden tap contact pads have a larger condensing area than the cells without the hidden tap contact pads.

36D. In item 27D and in the solar module, the solar modules are arranged in a shingled fashion that overlaps other solar modules that are electrically connected in overlapping regions.

37D. The solar module,

A glass front sheet;

Includes a back seat;

A plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet, each super cell superimposed to electrically connect the silicon solar cells in series and flexibly conductive directly to each other A plurality of rectangular or substantially rectangular silicon solar cells arranged in line with long sides of adjacent silicon solar cells to be joined;

A first flexible electrical interconnect tightly conductively coupled to the first one of the super cells;

Flexible conductive bonds between the overlapping solar cells are formed of a first conductive adhesive, and have a shear modulus of elasticity less than or equal to about 800 megapascals;

The rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed of a second conductive adhesive, and has a shear modulus greater than or equal to about 2000 megapascals.

38D. In the solar module as in item 37D, the first conductive adhesive and the second conductive adhesive are different, and all of the conductive adhesives can be cured in the same processing step.

39D. In a solar module as in matter 37D, the conductive bonds between the overlapping and adjacent solar cells are less than or equal to about 50 microns, orthogonal to the solar cells and greater than about 1.5 W/(meter-K). Or has a thermal conductivity orthogonal to the same solar cells.

40D. In a solar module as in matter 37D, the solar modules are arranged in a shingled manner overlapping with other solar modules electrically connected in the overlapping region.

1E. The solar module comprises rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows, each super cell comprising silicon solar cells. A plurality of silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to electrically connect in series; The super cells are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts.

2E. In a solar module as in item 1E, it comprises one or more flexible electrical interconnects arranged to electrically connect the plurality of super cells in series to provide the high direct current voltage.

3E. In a solar module as in item 2E, it includes a module level power electronics having an inverter that converts the high direct current voltage to an alternating voltage.

4E. In a solar module as in item 3E, the module level power electronics senses the high DC voltage and operates the module at the optimum current-voltage power point.

5E. In a solar module as in item 1E, electrically connected to individual pairs of adjacent series-connected rows of super cells, and electrically one or more of the pairs of rows of super cells to provide the high DC voltage. And a module-level power electronics connected in series and having an inverter that converts the high DC voltage into an AC voltage.

6E. In a solar module as in item 5E, the module level power electronics senses the voltage across each individual pair of rows of super cells, and each individual pair of columns of the super cells at an optimal current-voltage power point. Operate it.

7E. In a solar module as in matter 6E, the module level power electronics switches individual pairs of rows of super cells from circuitry providing the high direct voltage when the voltage across the pairs of rows is below a threshold. do.

8E. In a solar module as in item 1E, it is electrically connected to each individual column of super cells, electrically connecting two or more of the rows of super cells in series to provide the high DC voltage, and the high direct current And module level power electronics having an inverter that converts voltage to alternating voltage.

9E. In a solar module as in matter 8E, the module level power electronics senses the voltage across each individual row of super cells and operates each individual row of super cells at an optimal current-voltage power point.

10E. In a solar module as in item 9E, the module level power electronics switches individual pairs of columns of the super cells from circuitry providing the high direct voltage when the voltage across the pair of columns is below a threshold. do.

11E. In the solar module as in item 1E, it is electrically connected to each individual super cell, electrically connecting two or more of the super cells in series to provide the high DC voltage, and alternating the high DC voltage. And module level power electronics with an inverter that converts to voltage.

12E. In a solar module as in item 11E, the module level power electronics senses the voltage across each individual super cell and operates each individual super cell at the optimum current-voltage power point.

13E. In a solar module as in item 12E, the module level power electronics switches individual super cells from circuitry providing the high DC voltage when the voltage across the super cells is below a threshold.

14E. In the solar module as in item 1E, each super cell is electrically divided into a plurality of segments by hidden taps, and the solar module is electrically connected to each segment of each super cell through the hidden tabs. And a module-level power electronics having an inverter connected to two or more segments in series to provide the high DC voltage and converting the high DC voltage to AC voltage.

15E. In a solar module as in matter 14E, the module level power electronics senses the voltage across each segment of each super cell, and operates each segment at the optimum current-voltage power point.

16E. In a solar module as in item 15E, the module level power electronics switches individual segments from circuitry providing the high direct current voltage when the voltage across the segment is below a threshold.

17E. In photovoltaic modules such as items 4E, 6E, 9E, 12E or 15E, the optimal current-voltage power point is the maximum current-voltage power point.

18E. In a solar module as in any of items 3E-17E, the module level power electronics lacks a DC to DC boost component.

19E. In a solar module as in any of items 1E-18E, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, Greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or about 700 Greater than or equal to

20E. In a solar module as in any of items 1E-19E, the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or about 300 Greater than or equal to the bolt, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, greater than or equal to about 600 volts .

21E. Solar photovoltaic system,

Two or more solar modules electrically connected in parallel; And

An inverter;

Each solar module has a rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows, each super cell in each module being silicon Two or more of the silicon solar cells in the module arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the solar cells in series, within each module The super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts;

The inverter is electrically connected to the two or more solar modules to convert their high voltage direct current output to alternating current.

22E. In the solar power system of item 21E, each photovoltaic module comprises one or more flexible electrical interconnects arranged to electrically connect super cells in the photovoltaic module in series to provide a high voltage direct current output of the photovoltaic module. Includes.

23E. In the photovoltaic system of item 21E, the third photovoltaic module includes at least a third photovoltaic module electrically connected in series with the first one of the two or more photovoltaic modules connected in parallel, the third photovoltaic module Having a rectangular or substantially rectangular silicon solar cells of number N'greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows, each super cell in the third solar module being the Two or more of the silicon solar cells in the module arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series, and wherein the third sun Within the optical module, the super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

24E. In the photovoltaic system of item 23E, the second photovoltaic module comprises at least a fourth photovoltaic module electrically connected in series with a second one of the two or more photovoltaic modules connected in parallel, the fourth photovoltaic module comprising: A rectangular or substantially rectangular silicon solar cells of number N" greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows, each super cell in the fourth solar module being the And two or more silicon solar cells in the module arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series, and wherein the fourth sun Within the optical module, the super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

25E. In the photovoltaic system of items 21E-24E, fuses are arranged to prevent a short circuit occurring within any of the solar modules from dissipating power generated in other solar modules.

26E. In the photovoltaic system of any of items 21E-25E, a blocking arranged to prevent a short circuit occurring within any of the photovoltaic modules from dissipating power generated within others of the photovoltaic modules. Diodes.

27E. In the photovoltaic system of any of items 21E-26E, two or more solar modules are electrically connected in parallel, and the inverter includes positive and negative buses electrically connected.

*28E. In the photovoltaic system of any of items 21E-26E, comprising a combiner box in which the two or more solar modules are electrically connected by separate conductors, wherein the combiner box is electrically connected to the solar modules. Are connected in parallel.

29E. In the solar power system of item 28E, the combiner box includes fuses arranged to prevent short circuits occurring within any of the solar modules from dissipating power generated in other solar modules.

30E. In the solar power system of item 28E or item 29E, the combiner box is arranged to prevent a short circuit occurring within any of the solar modules from dissipating power generated within others of the solar modules. Blocking diodes.

31E. In the photovoltaic system of any of items 21E- 30E, the inverter is configured to operate the solar modules at a DC voltage above a minimum value set to avoid reverse biasing the module.

32E. In the photovoltaic system of any of items 21E-30E, the inverter recognizes a reverse bias condition and is configured to operate the solar modules at a voltage that avoids the reverse bias condition.

33E. In the solar module of any one of items 21E-32E, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about 400 Greater than or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 Is the same.

34E. In the solar module of any of items 21E-33E, the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts Greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

35E. In the photovoltaic system of any of items 21E-34E, it is located at the top of the roof.

36E. Solar power system,

A first solar module comprising a rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 150 arranged as a plurality of super cells in two or more parallel rows, each super cell comprising A plurality of silicon solar cells arranged in series with long sides of adjacent silicon solar cells overlapping and conductively coupled to each other to electrically connect the silicon solar cells in series;

An inverter;

The super cells are electrically connected to provide a high direct current voltage greater than or equal to about 90 volts to the inverter that converts direct current into alternating current.

37E. In the solar power system of item 36E, the inverter is a micro-inverter integrated with the first solar module.

38E. In the solar power system of item 36E, the first solar module is one or more flexible electrical arranged to be electrically connected in series to super cells in the solar module to provide a high voltage direct current output of the solar module. Interconnects are provided.

39E. In the photovoltaic system of any of items 36E-38E, comprising at least a second photovoltaic module electrically connected in series to the first photovoltaic module, the second photovoltaic module being parallel to two or more. A rectangular or substantially rectangular silicon solar cells of the number N'greater than or equal to about 150 arranged as a plurality of super cells in a row, each super cell in the second solar module electrically conducting the silicon solar cells. And two or more of the silicon solar cells in the module arranged in series with long sides of adjacent silicon solar cells overlapping and electrically conductively coupled to each other in series, and within the second solar module Super cells are electrically connected to provide a high voltage DC module output greater than or equal to about 90 volts.

40E. In the solar module of any of items 36E-39E, the inverter lacks a direct-to-DC boost component.

41E. In the solar module of any of clauses 36E-40E, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about 400 Greater than or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than about 700 Is the same.

42E. In the solar module of any of clauses 36E-41E, a high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. Or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

43E. The solar module,

A rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 250 arranged as a plurality of series-connected super cells in two or more parallel rows, each super cell comprising a silicon solar cell in the super cell A plurality of silicon solar cells arranged in series with long sides of adjacent silicon solar cells that are overlapped and electrically and thermally conductive adhesive to each other and electrically coupled to each other to electrically connect them in series;

Less than one bypass diode per 25 solar cells;

The electrically and thermally conductive adhesive is applied to the solar cells that are orthogonal to the solar cells less than or equal to about 50 microns between adjacent solar cells and greater than or equal to about 1.5 W/(meter-K). Forms bonds with orthogonal thermal conductivity.

44E. In the solar module of item 43E, the super cells are sealed in a thermoplastic olefin layer between the front and back sheets.

45E. In the solar module of item 43E, the super cells are sealed between the front and rear sheets.

46E. In the solar module of item 43E, no more than one bypass diode per 30 solar cells, or no more than one bypass diode per 50 solar cells, or no more than one bypass diode per 100 solar cells, or It contains only a single bypass diode or no bypass diode.

47E. In the solar module of clause 43E, no bypass diodes are included, only a single bypass diode, or no more than three bypass diodes, no more than six bypass diodes, or no more than a heat bypass diode Diodes.

48E. In the solar module of item 43E, conductive bonds between the overlapping solar cells are in a direction parallel to the columns for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. And mechanical compliance to accommodate the mismatch of thermal expansion between the super cells and the glass front sheet.

49E. In the solar module of any of clauses 43E-48E, N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, or about 500 Greater than or equal to, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

50E. In the solar module of any of items 43E-49E, the super cells are greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. High DC voltage equal to or greater than, approximately greater than or equal to approximately 360 volts, greater than or equal to approximately 420 volts, greater than or equal to approximately 480 volts, greater than or equal to approximately 540 volts, or greater than approximately 600 volts It is electrically connected to provide.

51E. Solar power systems,

Solar module of matter 43E; And

And an inverter electrically connected to the solar module and configured to convert a DC output from the solar module to provide AC output.

52E. In the solar energy system of item 51E, the inverter lacks a DC to DC boost component.

53E. In the solar energy system of item 51E, the inverter is configured to operate the solar module at a DC voltage equal to or greater than a minimum value set to avoid reverse biasing the solar cell.

54E. In the solar energy system of item 53E, the minimum voltage value is temperature dependent.

55E. In the solar energy system of item 51E, the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

56E. In the solar energy system of item 55E, the inverter is configured to operate the solar module in a maximum region of the voltage-current output curve of the solar module to avoid the reverse bias condition.

57E. In the solar energy system of any of items 51E-56E, the inverter is a microinverter integrated with the solar module.

1F. A method of manufacturing solar cells, the method comprising:

Advancing the solar cell wafer along a curved surface; And

Applying a vacuum between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer against the curved surface, thereby one or more presets to separate a plurality of solar cells from the solar cell wafer. And cutting the solar cell wafer along the prepared scribe lines.

2F. In the method of item 1F, it is a curved portion of the upper surface of the vacuum manifold that applies the vacuum to the bottom surface of the solar cell wafer.

3F. In the method of item 2F, the vacuum applied to the bottom surface of the solar cell wafer by the vacuum manifold varies along the direction of progression of the solar cell wafer, and is simulated in the area of the vacuum manifold where the solar cell wafer is cut. It becomes stronger.

4F. In the method of item 2F or item 3F, transferring the solar cell wafer to a perforated belt along the upper surface of the curve of the vacuum manifold, the vacuum passing the solar cell through perforations in the perforated belt. It is applied to the bottom surface of the wafer.

5F. In the method of item 4F, the perforations in the belt are arranged such that leading and trailing edges of the solar cell wafer must lie on top of at least one perforation in the belt along the direction of the progress of the solar cell wafer.

6F. In the method of any of items 2F-F, the solar cell wafer is advanced along a flat area of the top surface of the vacuum manifold to reach a transition region of the curve of the top surface of the vacuum manifold having a first curvature. And then, advancing the solar cell wafer into a cutting area of the upper surface of the vacuum manifold where the solar cell wafer is cut, wherein the cutting area of the vacuum manifold is a second steeper than the first curvature. Have curvature

7F. In the method of item 6F, the curvature of the transition region is defined by a continuous geometric function of increasing curvature.

8F. In the method of item 7F, the curvature of the cut area is defined by a continuous geometric function of increasing curvature.

9F. In the method of item 6F, the step of advancing into a post-cutting region of the vacuum manifold having a third curvature that is steeper than the second curvature.

10F. In the method of item 9F, the curvatures of the transition region of the curve, the cut region and the post cut region are defined by a continuous geometric function of increasing curvature.

11F. In the method of item 7F, item 8F, or item 10F, the continuous geometric function of the increasing curvature is a clothoid.

12F. In the method of any of items 1F-11F, each rather than the opposite end of each scribe line to provide an asymmetric stress distribution along each scribe line that promotes the generation and propagation of a single cleaving crack along each scribe line. And applying a stronger vacuum between the solar cell wafer and the curved surface at one end of the scribe line.

13F. In the method of any one of items 1F-12F, removing the cut solar cells from the surface of the curve, wherein the edges of the cut solar cells are prior to removal of the solar cells from the surface of the curve. Is not in contact with.

14F. In the method of any of items 1F-13F,

Laser scribing onto the solar cell wafer; And

Applying an electrically conductive adhesive bonding material to portions of the upper surface of the solar cell wafer prior to cutting the solar cell wafer along the scribe lines;

Each cut solar cell includes a portion of the electrically conductive adhesive bonding material disposed along the cut edge of its top surface.

15F. In the method of item 14F, laser scribing the scribe lines and subsequently applying the electrically conductive adhesive bonding material.

16F. In the method of item 14F, applying the electrically conductive adhesive bonding material, followed by laser scribing the scribe lines.

17F. A method of making a string of solar cells from cut solar cells produced by the method of any of items 14F-16F, wherein the cut solar cells are rectangular, the method comprising:

Arranging the plurality of rectangular solar cells in line with long sides of adjacent rectangular solar cells overlapping in a shingled manner as part of the electrically conductive adhesive bonding material disposed therebetween; And

Curing the electrically conductive bonding material, joining adjacent and overlapping rectangular solar cells, and electrically connecting them in series.

18F. In the method of any one of items 1F-17F, the solar cell wafer is a silicon solar cell wafer of square or pseudo square.

1G. A method of making a string of cells, the method comprising:

Forming a back metallization pattern on each one or more square solar cells;

Stencil printing a complete front metallization pattern using a single stencil in a single stencil printing step on each of the one or more square solar cells;

Each square solar cell into two or more rectangular solar cells to form a plurality of rectangular solar cells each having a complete front metallization pattern and a rear metallization pattern from the one or more square solar cells. Separating;

Arranging the plurality of rectangular solar cells in a shingled manner and in line with the long sides of adjacent rectangular solar cells; And

The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are electrically connected to one front metallization pattern of the rectangular solar cells in the pair with the other back metallization pattern of the rectangular solar cells in the pair. And electrically connecting to the plurality of rectangular solar cells in series with electrically conductive bonding materials disposed between them to connect to each other.

2G. In the method of item 1G, all parts of the stencil that define one or more features of the front metallization pattern on the one or more square solar cells are different from the stencil so as to lie within the plane of the stencil during stencil printing. Limited by the physical connections to the parts.

3G. In the method of item 1G, the front metallization pattern on each rectangular solar cell comprises a plurality of fingers oriented orthogonally to the long sides of the rectangular solar cell, wherein the fingers in the front metallization pattern are the front surface. They are not physically connected to each other by metallization patterns.

4G. In the method of item 3G, the fingers have widths of about 10 microns to about 90 microns.

5G. In the method of item 3G, the fingers have widths of about 10 microns to about 50 microns.

6G. In the method of item 3G, the fingers have widths of about 10 microns to about 30 microns.

7G. In the method of item 3G, the fingers have heights orthogonal to the front surface of the rectangular solar cell of about 10 microns to about 50 microns.

8G. In the method of item 3G, the fingers have heights orthogonal to the front surface of the rectangular solar cell of about 30 microns or more.

9G. In the method of item 3G, the front metallization pattern on each rectangular solar cell comprises a plurality of contact pads parallel and adjacent to the edge of the long side of the rectangular solar cell, each contact pad being at an end of a corresponding finger. Is located in

10G. In the method of item 3G, the back metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged in rows parallel and adjacent to the edge of the long side of the rectangular solar cell, the adjacent and overlapping rectangular Each pair of solar cells is each of the rear contact pads on one of the pair of rectangular solar cells aligned and electrically connected with corresponding fingers in the front metallization pattern on the other of the rectangular solar cells in the pair. And is arranged.

11G. In the method of item 3G, the back metallization pattern on each rectangular solar cell comprises a bus bar running parallel and adjacent to the edge of the long side of the rectangular solar cell, and each of the adjacent and overlapping rectangular solar cells. The pair is arranged with a bus bar on one of the pair of rectangular solar cells that overlaps and electrically connects the fingers in the front metallization pattern on the other of the rectangular solar cells in the pair.

12G. In the way of matter 3G,

The front metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel and adjacent to the edge of the long side of the rectangular solar cell, each contact pad located at the end of a corresponding finger;

The back metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in rows parallel and adjacent to the edge of the long side of the rectangular solar cell;

Each pair of adjacent and overlapping rectangular solar cells overlaps and is electrically connected with a contact pad in the front metallization pattern on the other rectangular solar cells in the pair and each of the back surfaces on one of the pair of rectangular solar cells. It is arranged with contact pads.

13G. In the method of item 12G, the rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are separated by separate portions of an electrically conductive bonding material disposed between the overlapping front and back contact pads. They are conductively coupled to each other.

14G. In the method of item 3G, the rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are one front metallized pattern of the pair of rectangular solar cells and the other of the pair of rectangular solar cells. They are conductively coupled to each other by separate parts of the electrically conductive bonding material between the overlapping ends of the fingers in the back metallization pattern.

15G. In the method of item 3G, the rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are one front metallized pattern of the pair of rectangular solar cells and the other of the pair of rectangular solar cells. The dashed lines or continuous lines of the electrically conductive bonding material between overlapping ends of the fingers in the back metallization pattern are conductively coupled to each other, and the dashed lines or continuous lines of the electrically conductive bonding material are the fingers One or more of them are electrically interconnected.

16G. In the way of matter 3G,

The front metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel and adjacent to the edge of the long side of the rectangular solar cell, each contact pad located at the end of a corresponding finger;

The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are one in the front metallization pattern of the pair of rectangular solar cells and the other in the back metallization pattern of the other pair of rectangular solar cells. They are conductively coupled to each other by separate parts of the electrically conductive bonding material disposed between the contact pads.

17G. In the way of matter 3G,

The front metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel and adjacent to the edge of the long side of the rectangular solar cell, each contact pad located at the end of a corresponding finger;

The rectangular solar cells in each pair of adjacent and overlapping rectangular solar cells are contacted in one front metallization pattern of the pair of rectangular solar cells and the other rear metallization pattern of the pair of rectangular solar cells. The dashed or continuous lines of electrically conductive bonding material between the pads are conductively coupled to each other, and the dashed or continuous lines of the electrically conductive bonding material electrically interconnect one or more of the fingers. Connect.

18G. In the method of any of items 1G-17G, the front metallization pattern is formed of a silver paste.

1H. A method of manufacturing a plurality of solar cells, the method comprising:

Depositing one or more front side amorphous silicon layers on the front side of the crystalline silicon wafer, the front side amorphous silicon layers being illuminated by light in the operation of the solar cells;

Depositing one or more backside amorphous silicon layers from the front side on the back side of the crystalline silicon wafer on opposite sides of the crystalline silicon wafer;

Patterning the one or more front amorphous silicon layers to form one or more front trenches in the one or more front amorphous silicon layers;

Depositing a front passivation layer over the one or more front amorphous silicon layers and in the front trenches;

Patterning the one or more back amorphous silicon layers to form one or more back trenches in the one or more back amorphous silicon layers, each of the one or more back trenches being the front trench Formed in line with their counterparts;

Depositing a back passivation layer over the one or more back amorphous silicon layers and in the back trenches;

Cutting the crystalline silicon wafer at one or more cleavage planes, each cut plane centered or substantially centered on a different pair of corresponding front and back trenches.

2H. In the method of item 1H, forming the one or more front trenches through the front amorphous silicon layers to reach the front surface of the crystalline silicon wafer.

3H. In the method of item 1H, forming the one or more back trenches through the one or more back amorphous silicon layers to reach the back side of the crystalline silicon wafer.

4H. In the method of item 1H, forming the front passivation layer and the back passivation layer with a transparent conductive oxide.

5H. In the method of item 1H, using a laser to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer at the one or more cutting planes.

6H. In the method of item 1H, mechanically cutting the crystalline silicon wafer at the one or more cutting planes.

7H. In the method of item 1H, the one or more overlying amorphous crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

8H. In the method of item 7H, cutting the crystalline silicon wafer from its back side.

9H. In the method of item 1H, the one or more back amorphous crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

10H. In the method of item 9H, cutting the crystalline silicon wafer from its front side.

11H. A method of manufacturing a plurality of solar cells, the method comprising:

Forming one or more trenches in the first surface of the crystalline silicon wafer;

Depositing one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;

Depositing a passivation layer in the trenches and on one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;

Depositing one or more amorphous silicon layers on the second surface of the crystalline silicon wafer on the opposite edge of the crystalline silicon wafer from the first surface; And

And cutting the crystalline silicon wafer at one or more cutting planes, each cutting plane centering or substantially centering the other of the one or more trenches.

12H. In the method of item 11H, forming the passivation layer with a transparent conductive material.

13H. In the method of item 11H, using a laser to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer at the one or more cutting planes.

14H. In the method of item 11H, mechanically cutting the crystalline silicon wafer at the one or more cutting planes.

15H. In the method of item 11H, the one or more first surface amorphous crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

16H. In the method of item 11H, the one or more second surface amorphous crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

17H. In the method of item 11H, the first surface of the crystalline silicon wafer is illuminated by light in the operation of the solar cells.

18H. In the method of item 11H, the second surface of the crystalline silicon wafer is illuminated by light in the operation of the solar cells.

19H. The solar panel (solar panel),

It includes a plurality of super cells, each super cell having a plurality of solar cells arranged in series with the parts of adjacent solar cells overlapping in a shingled manner and electrically conductively coupled to each other to electrically connect the solar cells in series. And;

Each solar cell is a crystalline silicon base, one or more first surface amorphous silicon layers disposed on a first surface of the crystalline silicon base to form an np junction, from the first surface of the crystalline silicon base One or more second surface amorphous silicon layers disposed on the second surface of the crystalline silicon base on opposite sides, and edges of the first surface amorphous silicon layers, edges of the second surface amorphous silicon layers Or passivation layers that prevent charge recombination at the edges of the first surface amorphous silicon layers and the edges of the second surface amorphous silicon layers.

20H. In the solar panel of item 19H, the passivation layers include a transparent conductive oxide.

21H. In the solar panel of item 19H, the super cells are arranged in a single row, or two or more parallel rows, to form the front side of the solar panel illuminated by solar radiation during operation of the solar panel.

Z1. The solar module,

A rectangular or substantially rectangular silicon solar cells of number N greater than or equal to about 250 arranged as a plurality of series-connected super cells in two or more parallel rows, each super cell comprising a silicon solar cell in the super cell A plurality of silicon solar cells arranged in series with long sides of adjacent silicon solar cells which are superposed and electrically and thermally conductive adhesives and are directly conductively bonded to each other to electrically connect them in series;

One or more bypass diodes;

Each pair of adjacent parallel rows in the photovoltaic module is conductively coupled to a rear electrical contact on a solar cell centrally located within one column of the pair, and on a pair of adjacent solar cells in the other column of the pair It is electrically connected by a bypass diode that is conductively coupled to the rear electrical contact.

Z2. In the solar module of item Z1, each pair of adjacent parallel rows is conductively coupled to a backside electrical contact on the solar cell in the other row of the pair, and on the adjacent solar cell in the other row of the pair. It is electrically connected by at least one other bypass diode that is conductively coupled to the rear electrical contact.

Z3. In the solar module of item Z2, each pair of adjacent parallel rows is conductively coupled to a backside electrical contact on the solar cell in the other row of the pair, and on the adjacent solar cell in the other row of the pair. It is electrically connected by at least one other bypass diode that is conductively coupled to the rear electrical contact.

Z4. In the solar module of item Z1, the electrically and thermally conductive adhesive has a thickness orthogonal to the solar cells less than or equal to about 50 microns between adjacent solar cells and greater than about 1.5 W/(meter-K). Form bonds having a thermal conductivity that is orthogonal to the large or equal solar cells.

Z5. In the solar module of item Z1, the super cells are encapsulated in a layer of thermoplastic olefin between the front and back glass sheets.

Z6. In the solar module of item Z1, conductive bonds between the overlapping solar cells are in a direction parallel to the columns for a temperature range of about -40°C to about 100°C without damaging the solar module to the super cells. And mechanical compliance to accommodate the mismatch of thermal expansion between the super cells and the glass front sheet.

Z7. In the solar module of any one of clauses Z1 to Z6, N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, or about 500 Greater than or equal to, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

Z8. In the solar module of any one of clauses Z1 to Z7, the super cells are greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, or greater than about 300 volts. Electrically equal to or greater than or equal to, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts Connected.

Z9. Solar power systems,

Solar module of matter Z1; And

And an inverter electrically connected to the solar module and configured to convert a DC output from the solar module to provide AC output.

Z10. In the solar energy system of matter Z9, the inverter lacks a DC to DC boost component.

Z11. In the solar energy system of item Z9, the inverter is configured to operate the solar module at a direct current voltage above a minimum voltage set to avoid reverse biasing the solar cell.

Z12. In the solar energy system of matter Z11, the minimum voltage value is temperature-dependent.

Z13. In the solar energy system of item Z9, the inverter recognizes a reverse bias condition and is configured to operate the solar module at a voltage that avoids the reverse bias condition.

Z14. In the solar energy system of item Z13, the inverter is configured to operate the solar module in the maximum area of the voltage-current output curve of the solar module to avoid the reverse bias condition.

Z15. In the solar energy system of any of clauses Z9-Z14, the inverter is a microinverter integrated with the solar module.

The invention disclosed herein is exemplary and not limiting. Other modifications will be apparent to those skilled in the art from the point of view of the present invention, and are intended to be included within the scope of the appended claims.

Claims (23)

In the solar module,
Comprising a plurality of super cells arranged in two or more physically parallel rows, each super cell arranged with adjacent and overlapping severable crystalline solar cells, the severable crystalline solar cell A plurality of severable crystalline solar cells that are conductively coupled to each other to electrically connect them in series, each severable crystalline solar cell facing and facing the front where the sunlight is illuminated during operation of the module A rear surface located;
A first terminal interconnect or a plurality of first terminal interconnects extending across the rows to electrically interconnect each cuttable crystalline solar cell located at the first end of each row;
A second terminal interconnect or a plurality of second terminal interconnects extending across the rows to electrically interconnect each cuttable crystalline solar cell located at the second end of each row opposite from the first end and;
A plurality of hidden taps extending across the columns along the back surfaces of crystalline solar cells that can be cut at positions of one or more lengths of the columns between the first and second ends of the columns. ) Interconnects, wherein the hidden tap interconnects electrically interconnect the severable crystalline solar cells located at the same of the positions of the one or the length of the gas phase in each row;
A plurality of bypass diodes;
The first terminal interconnect or a plurality of first terminal interconnects, the second terminal interconnect or a plurality of second terminal interconnects, and the plurality of hidden tap interconnects are each segment of two or more lengths of each row Dividing into two, electrically connecting adjacent column segments in adjacent columns in parallel, thereby forming two or more groups of column segments;
Each group of the column segments is electrically connected in parallel to the other of the bypass diodes,
Wherein the hidden tab interconnects electrically connect hidden tab contact pads on the back surfaces of the severable crystalline solar cells. The solar module according to claim 1, wherein each column includes two or more super cells connected in series electrically. According to claim 1,
Each row contains only a single super cell;
The first terminal interconnect or a plurality of first terminal interconnects, the second terminal interconnect or a plurality of second terminal interconnects, and the plurality of hidden tap interconnects together make each super cell into segments of two or more lengths Electrically dividing, electrically connecting adjacent super cell segments in adjacent columns, thereby forming two or more groups of super cell segments;
Each group of the super cell segments is electrically connected in parallel to the other of the bypass diodes solar module. The photovoltaic of claim 1, wherein a single first terminal interconnect extends across the rows to electrically interconnect each cuttable crystalline solar cell located at the first end of each row. module. The photovoltaic of claim 1, wherein a plurality of first terminal interconnects extend across the rows to electrically interconnect each cuttable crystalline solar cell located at the first end of each row. module. The solar cell of claim 1, wherein a single hidden tap interconnect at each of the one or more length locations is to electrically interconnect the cuttable crystalline solar cells located at the location of the length within each row. A solar module, which extends across the rows along the back surfaces of the cells. The solar module of claim 1, wherein the bypass diodes are located along one or more peripheral edges of the solar module. The solar module of claim 1, wherein the bypass diodes are located behind one or more of the super cells. The solar module according to claim 1, wherein the bypass diodes are located in a plane with the super cells. The solar module of claim 1, wherein the bypass diodes are located between adjacent rows of super cells. The solar module of claim 1, wherein the bypass diodes are located along the center line of the module oriented parallel to the rows of super cells. The solar light of claim 1, wherein the bypass diodes are located in a junction box located on the back side of the solar module that is not directly illuminated by the sun during operation of the solar module. module. According to claim 1,
Each row contains only a single super cell;
A single first terminal interconnect extends across the rows to electrically interconnect the end solar cells of each super cell at the first end of each row;
A single second terminal interconnect extends across the rows to electrically interconnect the end solar cells of each super cell at the second end of each row;
A single hidden tap interconnect at each of the one or more length locations can be cut to electrically interconnect the cuttable crystalline solar cells located at the location of the length in each row. Extend across the rows along the back surfaces of the cells;
The first terminal interconnect or a plurality of first terminal interconnects, the second terminal interconnect or a plurality of second terminal interconnects, and the plurality of hidden tap interconnects together make each super cell into segments of two or more lengths. Electrically dividing, electrically connecting adjacent super cell segments in adjacent columns, thereby forming two or more groups of super cell segments;
Each group of the super cell segments is electrically connected in parallel to the other of the bypass diodes solar module. 14. The solar module of claim 13, wherein the bypass diodes are located along one or more peripheral edges of the solar module. 14. The solar module of claim 13, wherein the bypass diodes are located along the centerline of the solar module oriented parallel to the rows of super cells. In the solar module,
Comprising a plurality of super cells arranged in two or more physically parallel rows, each super cell arranged in line with adjacent and overlapping severable crystalline solar cells, the severable crystalline And a plurality of severable crystalline solar cells that are conductively coupled to each other to electrically connect the solar cells in series, each severable crystalline solar cell having a front face illuminated with sunlight during operation of the module, and It has a rear surface facing each other;
A first terminal interconnect or a plurality of first terminal interconnects extending across the rows to electrically interconnect each cuttable crystalline solar cell located at the first end of each row;
A second terminal interconnect or a plurality of second terminal interconnects extending across the rows to electrically interconnect each cuttable crystalline solar cell located at the second end of each row opposite from the first end and;
A first hidden tab interconnect or a plurality of agents extending across the columns along the back surfaces of crystalline solar cells that can be cut at a position of the first length of the columns between the first and second ends of the columns One hidden tap interconnects, the first hidden tap interconnect or a plurality of first hidden tap interconnects electrically interconnecting the solar cells located at a location of the first length in each row;
A second hidden tab interconnect or a plurality of agents extending across the columns along the back surfaces of crystalline solar cells that can be cut at a location of a second length of the columns between the first and second ends of the columns Two hidden tap interconnects, the second hidden tap interconnect or a plurality of second hidden tap interconnects electrically interconnecting the severable crystalline solar cells located at the location of the second length in each row and;
A first bypass diode electrically interconnected between the first terminal interconnect or a plurality of first terminal interconnects and the first hidden tap interconnect or a plurality of hidden tap interconnects;
A second bypass diode electrically connected between the first hidden tap interconnect or a plurality of first hidden tap interconnects and the second hidden tap interconnect or a plurality of second hidden tap interconnects;
And a third bypass diode electrically connected between the second hidden tap interconnect or a plurality of second hidden tap interconnects and the second terminal interconnect or a plurality of second terminal interconnects. module. 17. The solar module of claim 16, wherein each column includes two or more super cells that are electrically connected in series. 17. The solar module of claim 16, wherein each row comprises a single super cell. The method of claim 18,
A single first terminal interconnect extends across the rows to electrically interconnect the end solar cells of each super cell at the first end of each row;
A single second terminal interconnect extends across the rows to electrically interconnect the end solar cells of each super cell at the second end of each row;
A single first hidden tab interconnect extends across the columns along the back surfaces of crystalline solar cells that can be cut at a location of the first length of the columns between the first and second ends of the columns , The first hidden tab interconnect electrically interconnects the severable crystalline solar cells located at a location of the first length in each row;
A single second hidden tab interconnect extends across the rows along the back surfaces of crystalline solar cells that can be cut at the location of the second length of the rows between the first and second ends of the rows, The second hidden tap interconnect is a photovoltaic module, characterized by electrically interconnecting the severable crystalline solar cells located at a location of the second length in each row. In the solar module,
Comprising a plurality of super cells arranged in two or more physically parallel rows, each super cell arranged with adjacent and overlapping severable crystalline solar cells, the severable crystalline solar cell A plurality of severable crystalline solar cells that are conductively coupled to each other to electrically connect them in series, each severable crystalline solar cell facing and facing the front where the sunlight is illuminated during operation of the module A rear surface located;
A plurality of hidden tap interconnects extending across the rows along the back surfaces of the severable crystalline solar cells, wherein the plurality of hidden tap interconnects are adjacent series connected electrically connecting each super cell in parallel. Electrically interconnecting severable crystalline solar cells located along each hidden tab interconnect to electrically divide into a plurality of series-connected segments having segments, the hidden tab interconnects severable crystalline A solar module, characterized by electrically connecting hidden tab contact pads on the back surfaces of the solar cells. delete delete The solar module of claim 1, wherein each thermal segment electrically connected in parallel with a bypass diode comprises 24 or more solar cells.

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