KR101529543B1 - VACUUM PACKAGING METHOD FOR Micro Electro-Mechanical System Devices - Google Patents

Abstract

A vacuum packaging method of a MEMS element according to the present invention includes the steps of: preparing the window lead including forming a getter and a bonding material on a window lead; Mounting the MEMS device on a package substrate; preparing the package substrate; And bonding the window lead to the package substrate on which the MEMS element is mounted so that the MEMS element faces the window lead.

Description

TECHNICAL FIELD [0001] The present invention relates to a vacuum packaging method for a MEMS element,

TECHNICAL FIELD The present invention relates to a high-temperature vacuum packaging method of a MEMS element, and more specifically, to a technique of high-temperature vacuum packaging a microbolometer array.

Infrared detectors are broadly divided into light-based detectors and thermal detectors, which generally respond to far-infrared radiation. Thermal detectors can typically implement an imaging system to generate a temperature image of the object using a thermal sensor array. An apparatus that collects the blackbody radiation energy emitted from an object and obtains a temperature image of the object is called a Far-Infrared Thermal Imaging system.

Open half detectors are known to include bolometers, microbolometers, superconductors and thermocouples. When the far infrared rays in the 8 to 14 mu m band, which is black-body copied from all the objects, are focused on the microbolometer by the lens, the temperature of the microbolometer is raised or lowered, thereby changing the electrical resistance of the microbolometer. Thus, it is possible to remotely image the temperature distribution of the subject scene using an array of microbolometer cells, i.e., a microbolometer array.

Such a microbolometer array is a kind of MEMS (Micro Electro-Mechanical System) device and is fabricated using a semiconductor integrated circuit manufacturing process. Here, a MEMS element such as a microbolometer array must be operated in a vacuum to prevent concentrated heat from escaping. Therefore, there is a growing need for vacuum packaging techniques for MEMS devices, such as microvoltrometer devices, which require vacuum packaging techniques and which are low in vacuum packaging materials, equipment and process costs and are simple to manufacture.

SUMMARY OF THE INVENTION The present invention has been made in order to meet the needs of the prior art, and is intended to provide a vacuum packaging method of a MEMS element, particularly a microbolometer, which is simple in manufacturing and can minimize manufacturing cost.

The technical objects to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical subjects which are not mentioned can be clearly understood by those skilled in the art from the description of the present invention .

A method of vacuum packaging a MEMS device according to an embodiment of the present invention includes the steps of: preparing the window lead including forming a getter and a bonding material on a window lead; Mounting the MEMS device on a package substrate; preparing the package substrate; And adhering the window lead to the package substrate on which the MEMS element is mounted so that the MEMS element faces the window lead.

In an embodiment of the present invention, the step of preparing the window lead further comprises forming a bonding material on the window lead, wherein the height of the bonding material is higher than the height of the bonding material, And may be formed on some regions.

According to an embodiment of the present invention, the step of bonding the window lead to the package substrate includes: arranging and arranging the window lead on the package substrate at normal pressure, The bonding material may not be in contact with the package substrate.

According to an embodiment of the present invention, the step of preparing the package substrate may further include forming at least one gas hole in at least one of a part of the package substrate 200 and the window lead have.

According to an embodiment of the present invention, the step of bonding the window lead to the package substrate includes: positioning the window lead on the first plate at normal pressure and aligning the package substrate on the window lead; And applying pressure to at least one of the package substrate and the first plate while heating the first plate at normal pressure to hermetically bond the window lead to the package substrate through the bonding material.

According to an embodiment of the present invention, the step of bonding the window lead to the package substrate may include: after the sealing and bonding step, the package substrate and the window lead hermetically bonded on the first plate are bonded to the vacuum chamber Mounting; And positioning the hole filling material on the gas hole in the vacuum chamber.

Further, according to an embodiment of the present invention, the step of adhering the window lead to the package substrate further comprises: after the step of positioning the hole filling material, heating the first plate in the vacuum chamber, And performing outgassing and getter activation steps, wherein the outgassing can be performed through the gas holes.

According to an embodiment of the present invention, the step of bonding the window lead to the package substrate further comprises: after the outgassing and the getter activation step, the hole filling material is melted in the vacuum chamber, And sealing the gas hole.

Further, the embodiment of the present invention may include a MEMS element package manufactured according to the vacuum packaging method of the MEMS element described above. In an embodiment of the present invention, the MEMS element may comprise a microbolometer element.

According to the embodiment of the present invention, it is possible to provide a vacuum packaging method of a MEMS element, in particular, a micro-bolometer element, which is simple in manufacturing and can minimize manufacturing cost.

In addition, according to the embodiment of the present invention, it is possible to provide a high-temperature vacuum packaging technique which can drastically lower the vacuum packaging material, equipment, and process cost in the manufacture of an uncooled thermal image sensor using a microbolometer array.

FIG. 1 illustrates a conventional method of packaging a micro-bolometer element.
Fig. 2 shows a packaging method of a micro-bolometer element according to the first embodiment of the present invention.
FIG. 3 is a plan view of a microbolometer device package manufactured according to the method of packaging a microbolometer device according to the first embodiment shown in FIG. 2. FIG.
4 shows a packaging method of a microbolometer element according to a second embodiment of the present invention.
5 is a plan view of a microvolumometer device package manufactured according to a method of packaging a microvolumometer element according to a second embodiment shown in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The shape and the size of the elements in the drawings may be exaggerated for clarity of explanation and the same reference numerals are used for the same elements and the same elements are denoted by the same quote symbols as possible even if they are displayed on different drawings Should be. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

The present invention relates to high vacuum packaging of a MEMS element, and hereinafter, a high vacuum packaging will be described taking a microbolometer array as a MEMS element as an example. It is apparent to those skilled in the art that the high vacuum packaging technique of the present invention can be applied to a MEMS element other than a microbolometer element.

First, referring to FIG. 1, a high-vacuum packaging method for a conventional micro-bolometer element will be described.

FIG. 1 illustrates a conventional method of packaging a micro-bolometer element. 1 shows a cross section of a device at each step of the method of packaging a microbolometer device.

As shown in FIG. 1 (a), a window lead 100 (window lead) used as a sealing lid is prepared at the time of packaging of a microbolometer device. The window lead 100 may serve as an infrared light window to be incident on the micro-bolometer element. The window lead 100 may be a wafer including silicon or germanium depending on the infrared wavelength to be detected through the microbolometer element 240 and depending on the material of the substrate 200 to be started later .

As shown in FIG. 1B, an anti-reflection film 110 may be coated to prevent infrared rays incident on the window lead 100 from being reflected.

A getter 120 is deposited on the window lead 100 coated with the antireflection film 110, as shown in FIG. 1 (c). The getter 120 can adsorb gases such as H ₂ O, O ₂ , CO, CO ₂ , N ₂ and H ₂ generated in the package of the micro-bolometer element 240 to maintain the purity of the vacuum in the package The alloy is generally an alloy containing at least one of titanium (Ti), strontium (Sr), zirconium (Zr), vanadium (V) and iron (Fe). The getter 120 may remain in the package during vacuum sealing or adsorb the generated gas or make a compound with the gas. The getter 120 needs to be activated at a temperature of about 350 ° C or more in a vacuum before it is sealed to operate according to its purpose.

The window lead 100 for the package of the micro-bolometer element 240 can be prepared through FIGS. 1 (a) to (c).

1D to FIG. 1F illustrate a step in which a package substrate 200 on which a micro bolometer array 240 is mounted is prepared. Although it is illustrated in FIG. 1 and the following description that the reference numeral 240 is a microbolometer element, it will be apparent to those skilled in the art that a microbolometer element and another MEMS element can be used.

As shown in FIG. 1 (d), a package substrate 200 for packaging the microbolometer element 240 is prepared. The package substrate 200 may be a ceramic package substrate. Ceramics have high heat resistance, enabling high-temperature processing. In addition, since the ceramics have low thermal conductivity at room temperature, the performance of the microbolometer element 240 can be improved. The package substrate 200 may comprise, for example, alumina ceramics comprising Al ₂ O ₃ or mullite ceramics composed of aluminosilicates.

Conductive pads 210a and 201b for electrical connection to the outside and insulating materials 220a and 220b on the conductive pads 210a and 210b are formed on the package substrate 200 as shown in Figure 1 (d) Respectively.

As shown in FIG. 1 (e), the microbolometer element 240 may be adhered to the package substrate 200 through the adhesive layer 230. The adhesive layer 230 may be formed of a silver paste, a gold-tin (Au-Sn) alloy, or the like.

The microbolometer element 240 may include a microbolometer array in which a plurality of microbolometer cells are aligned. For example, the microbolometer element 240 may be a microbolometer array made of a semiconductor process. The microbolometer element 240 may be electrically connected to the conductive pads 210a and 210b through the wires 250a and 250b to be electrically connected to the external circuit. For example, the package substrate 200 may have a plurality of pins electrically connected to the conductive pads 210a and 210b.

The bonding materials 300a and 300b are formed on the insulating material or the conductive materials 220a and 220b of the package substrate 200, as shown in FIG. 1 (f). Here, the insulating material may include alumina ceramics and the conductive metal material may include a metallic material such as Kovar, which is a ferric oxide-based alloy. The bonding materials 300a and 300b function as a sealing bonding material when the microbolometer element 240 is sealed through the package substrate 200 and the window lead 100 in the future. Conventionally, a material including Au-Sn or In-Ag is used as the bonding materials 300a and 300b. These bonding materials 300 melt at 350 ° C or below.

In the present specification and drawings, it is exemplified that the window lead 100 is prepared first and the package substrate 200 is prepared later, but the order may be changed simultaneously or reversed.

1, a window lead 100 is mounted in a vacuum chamber 700, and a package substrate 200 on which a micro-bolometer element 240 is mounted is mounted on a micro-bolometer The device 240 is mounted in the vacuum chamber 700 upside down. Vacuum packaging is required to minimize heat conduction so as to increase the infrared detection efficiency of the micro-bolometer element.

In this state, the residual gas in the package including the micro-bolometer element is discharged out of the package in the vacuum chamber 700 to perform out-gassing to make a vacuum state. Outgassing can be performed by heating the vacuum chamber 700 to 280 ° C or lower. At this time, the bonding materials 300a and 300b do not melt and the getter 120 is not activated either.

As shown in FIG. 1 (g), the first plate 400 made of graphite or the like is heated by a heater to activate the getter 120. The first plate 400 needs to be heated to 350 ° C or higher to activate the getter 120. If the bonding material 300 including Au-Sn or In-Ag is formed on the window lead 100, the melting temperature of the bonding material 300 is lower than the activation temperature of the getter 120 The bonding material 300 may be deformed when the getter 120 is activated. Therefore, conventionally, the getter 120 is formed on the window lead 100 and the bonding material 300 is formed separately on the package substrate 200 on which the getter 120 is not formed, The getter was activated using local heating, such as joule heating or laser heating.

After the getter 120 is activated, pressure can be applied to the second plate 500 or the first plate 400 to perform hermetic bonding. At this time, the second plate 500 and the first plate 400 should be heated to 150 ° C or higher, for example, to melt the bonding material 300 and to perform sealing bonding.

Thereafter, as shown in Fig. 1 (h), a vacuum package of the micro-bolometer element can be obtained.

The high vacuum packaging method of the conventional micro-bolometer element described with reference to FIG. 1 has the following problems.

First, a material such as Au-Sn or In-Ag is used as the sealing bonding material 300, which is a rare metal and has a high material cost. In addition, when the bonding material 300 is used, the sealing process temperature is lower than the activation temperature of the getter 120, so that the bonding material 300 may be deformed when the getter 120 is activated. As a result, many restrictions are imposed on the packaging process, the cost of the equipment is increased, and the tac time is increased to increase the manufacturing cost.

The getter 120 and the bonding material 300 may be formed on different substrates such as a window lead 100 or a package substrate 200 in order to minimize the deformation of the bonding material 300 when the getter 120 is activated. Two heaters (a second plate heater and a first plate heater) in the vacuum chamber 700 are required.

The bonding material 300 can not be attached to the window lead 100 and must be attached to the package substrate 200.

In addition, since the package substrate 200 is mounted in the vacuum chamber 700 upside down, it is difficult to mount the package substrate 200, and a special jig is required to align and mount the window lead 100 and the package substrate 200 .

Particularly, since all operations requiring fine adjustment such as alignment of the package substrate 200 and the window lead 100 must be performed in the vacuum chamber 700, the packaging device becomes complicated and the manufacturing cost of the device can be increased accordingly. In addition, the tac time may become long and the productivity may be deteriorated.

In order to solve such a problem, the present invention provides an efficient microvolumometer device packaging technique.

Fig. 2 shows a packaging method of a micro-bolometer element according to the first embodiment of the present invention. The packaging method of the microbolometer element according to the first embodiment of the present invention described with reference to FIG. 2 is similar to the packaging method of FIG. 1, and the difference will be mainly described below.

2A and 2B, the window lead 100 is prepared and the antireflection film 110 is coated on both sides of the window lead 100. As shown in FIG.

In the packaging method according to the first embodiment of the present invention, as shown in FIG. 2C, bonding materials 300a and 300b for sealing are formed on the window lead 100 coated with the anti-reflection film 110 As shown in FIG. The sealing material 300 for sealing according to an embodiment of the present invention may include a material that melts at a high sealing process temperature of 400 ° C or higher, such as a glass frit. Accordingly, the bonding material 300 can be prevented from being deformed even in the activation process of the getter 120. Therefore, in the first embodiment of the present invention, the bonding material 300 may be formed on the window lead 100 together with the getter 120, as shown in FIG. 2 (e).

In the packaging method according to the first embodiment of the present invention, the bonding materials 310a and 310b are formed, as shown in Fig. 2 (d). The bonding material 310 may be a material such as silver paste that melts at a lower temperature than the bonding material 300. If the bonding material 300 is formed to have a higher height than the bonding material 300, May be used.

In addition, the bonding material 310 may be formed only in a part of the periphery of the sealing region surrounded by the bonding material 300 so that the gas can be discharged outside the package in order to vacuum the inside of the package. FIG. 3 is a plan view of a microbolometer device package manufactured according to the method of packaging a microbolometer device according to the first embodiment shown in FIG. 2. FIG. For example, in FIG. 3, the bonding material 300 is formed around the entire periphery of the microbolometer element 240 to define a closed region of the package, while the bonding material 310 is a part of the outer region of the bonding material 300 So that it is possible to prevent the inside of the package from being sealed before being evacuated.

The getter 120 is formed in the region to be sealed by the bonding material 300 and on the window lead 100, as shown in FIG. 2 (e). Thus, the preparation of the window lead 100 serving as the lead of the package is completed.

2 (f) and 2 (g), the package substrate 200 on which the microbolometer element 240 is mounted is prepared. At this time, the bonding material 300 for sealing is not formed on the package substrate 200.

The window lead 100 is loaded on the package substrate 200 without mounting the package substrate 200 and the window lead 100 in the vacuum chamber 700 as shown in FIG. 2 (h) . At this time, the window lead 100 can be aligned and positioned on the package substrate 200 upside down. Since the window lead 100 and the package substrate 200 can be aligned with each other in the atmosphere other than the vacuum chamber 700, the increase in the complexity of the vacuum chamber 700 apparatus can be prevented, Can be prevented. Of course, the longer the tack time can be prevented.

At this time, the sealing material 300 for sealing is not brought into contact with the package substrate 200 and the window lead 100 is formed on the package substrate 200 through the bonding material 310 having a higher height than the bonding material 300 Can be adhered. At this time, the bonding material 310 may perform an adhesive function without a high temperature process. At this time, since the sealing is not performed through the sealing material 300 for sealing, a gas or the like may circulate between the inside and the outside of the package.

2 (i), the package substrate 200, in which the window lead 100 is placed on the lower side and the window lead 100 is bonded, is attached to the vacuum chamber 700 do. At this time, the window lead 100 is positioned on the first plate 400.

In this state, the gas is discharged from the vacuum chamber 700 to the outside of the vacuum chamber 700, and out-gassing is performed to create a vacuum state. The outgassing can be performed by heating the first plate 400 to, for example, 280 ° C or lower. Or outgas may be achieved by raising the temperature of the entire vacuum chamber 700. At this time, the bonding materials 300a and 300b do not melt and the getter 120 is not activated either.

That is, after mounting the package substrate 200 and the window lead 100 bonded to each other at normal pressure in the vacuum chamber, outgasing may be performed through a gap formed between the gap between the bonding material 310 and the bonding material 300 have.

Then, the first plate 400 is heated by a heater to activate the getter 120. Further, the temperature of the entire vacuum chamber 700 can be raised in order to activate the getter 120. The first plate 400 needs to be heated to 350 ° C or higher to activate the getter 120. Since the bonding material 300 according to the first embodiment of the present invention is formed of the same material as the glass frit, there is no problem that the bonding material 300 for sealing is deformed in the process of activating the getter 120 .

As shown in FIG. 2 (j), after the getter 120 is activated, pressure can be applied to the package substrate 200 and / or the first plate 400 to perform hermetic bonding. At this time, the first plate 400 may be heated to melt the bonding material 300 to perform the sealing bonding. Sufficient pressure must be applied to the package substrate 200 or the first plate 400 so that the height of the bonding material 310 on which the bonding material 310 is pressed during sealing is equal to the height of the bonding material 300 for sealing do. For example, a pressure of several to several tens of newtons (N: newton) may be applied.

Accordingly, the micro-bolometer element according to the first embodiment of the present invention can be hermetically sealed with vacuum through the bonding material 300.

According to the packaging method of the first embodiment of the present invention, the window lead 100 and the package substrate 200 are bonded at a normal pressure rather than a vacuum as shown in FIG. 2 (h).

Further, since only the minimum operation is performed in the vacuum chamber 700, the apparatus and the process of the vacuum chamber 700 are very simple.

In addition, until the GBD process as shown in FIG. 2 (h), there is an advantage that a mass production facility of a specialized semiconductor package company such as AMKOR can be utilized as it is.

Further, since only one heater for the first plate 400 is required in the vacuum chamber 700, the manufacturing equipment can be simplified.

Also, the packaging time can be reduced and productivity can be increased.

4 shows a packaging method of a microbolometer element according to a second embodiment of the present invention. 4 shows a packaging method of a microbolometer element according to a second embodiment of the present invention. The packaging method of the micro-bolometer element according to the second embodiment of the present invention described with reference to FIG. 4 is similar to the packaging method of FIG. 1 and FIG. 2, and the difference will be mainly described below.

4A and 4B, the window lead 100 is prepared and the antireflection film 110 is coated on both sides of the window lead 100.

In the packaging method according to the second embodiment of the present invention, the bonding materials 300a and 300b for sealing are formed on the window lead 100 coated with the anti-reflection film 110, as shown in FIG. 2 (c) As shown in FIG. The sealing material 300 for sealing according to an embodiment of the present invention may include a substance that melts at a high sealing process temperature such as a glass frit. Accordingly, the bonding material 300 can be prevented from being deformed even in the activation process of the getter 120. Therefore, in the second embodiment of the present invention, the bonding material 300 may be formed on the window lead 100 together with the getter 120, as shown in FIG. 4 (d).

4 (d), in the packaging method according to the second embodiment of the present invention, the getter 120 is formed in the region to be sealed by the bonding material 300 and on the window lead 100 do. Thus, the preparation of the window lead 100 serving as a lid of the package is completed.

As shown in FIGS. 4 (e) and 4 (g), the package substrate 200 on which the microbolometer element 240 is mounted is prepared. At this time, the bonding material 300 for sealing is not formed on the package substrate 200.

4E and 4G, the gas holes H are formed in the package substrate 200 in the packaging method according to the second embodiment of the present invention. The gas holes H have at least one portion formed in a portion of the package substrate 200 so as to allow a gas to circulate between the inside and the outside of the package, and have a diameter of several tens of μm to several mm, Or may be formed through mechanical or laser drilling or the like.

5 is a plan view of a microvolumometer device package manufactured according to a method of packaging a microvolumometer element according to a second embodiment shown in FIG. The gas holes H are formed in the package substrate 200 in the plan view of FIG. 5, and at least one inside the region sealed by the sealing bonding material 300 and outside the region covered by the microvolume element 240 Can be formed. In FIG. 5, it is shown that the gas hole H is filled with the hole filling material 600.

4 (h), the window lead 100 is positioned on the first plate 400 at normal pressure without entering the vacuum chamber 700, and the micro-bolometer element And aligns the package substrate 200 on which the package substrate 240 is mounted.

The window lead 100 and the package substrate 200 are bonded to the bonding material 300 by heating the first plate 400 with a heater while applying pressure to the first plate 400 and / . At this time, since the gas or the like can circulate through the gas hole H inside and outside the package, the package substrate 200 and the window lead 100 can be bonded in advance through the bonding material 300 at normal pressure.

The window lead 100 and the package substrate 200 adhered by the bonding material 300 may be mounted on the vacuum chamber 700 as shown in FIG. First, the hole filling material 600, which melts at a temperature higher than the outgassing process temperature and the getter 120 activation temperature, is disposed on the gas hole H of the package substrate 200 in the form of a micro ball. The perforation material 600 may be a spherical solid material that is easy to fabricate. As the hole filling material 600, Au-Sn, In-Ag or the like which melts at a temperature lower than the melting temperature of the bonding material 300 according to the embodiment of the present invention may be used. If the local heating using a laser or the like is used to melt the hole filling material 600, the above restriction on the melting temperature can be eliminated. Thus, for example, a material such as glass frit used as the bonding material 300 may be used as the hole filling material 600.

In this state, the gas is discharged from the vacuum chamber 700 to the outside of the vacuum chamber 700, and out-gassing is performed to create a vacuum state. The outgassing can be performed by heating the first plate 400 to, for example, 280 ° C or lower. Of course, outgassing can be achieved by raising the temperature of the entire vacuum chamber 700. At this time, since the hole filling material 600 does not melt, the gas inside the package can be discharged through the gas hole H to the outside of the package. Further, the getter 120 is also not activated.

Then, the first plate 400 is heated by a heater to activate the getter 120. The getter 120 can be achieved by raising the temperature of the entire vacuum chamber 700. The first plate 400 needs to be heated to 350 ° C or higher to activate the getter 120. At this time, since the hole filling material 600 according to the second embodiment of the present invention does not melt, the situation where the hole filling material 600 blocks the gas hole H and the package is sealed before the getter 120 is activated is prevented .

4 (i), after the getter 120 is activated, the hole filling material 600 may be melted to fill the gas hole H using laser heating or the like. Accordingly, the micro-bolometer element package can be vacuum-sealed. In order to melt the hole filling material 600 and block the gas hole H, for example, not only can the entire vacuum chamber 700 be heated through a heater, but only the hole filling material 600 can be heated using a laser or the like It can be heated. The perforated material 600 may be melted at, for example, 400 ° C or higher to block the gas holes H.

In the above description, the hole is formed in the package. However, the hole may be formed in the window lead.

According to the packaging method of the second embodiment of the present invention, conventional mass production facilities such as AMKOR can be used up to the bonding process as shown in FIG. 4 (g).

Further, according to the second embodiment of the present invention, the process performed in the vacuum chamber 700 becomes very simple and simple.

Further, according to the second embodiment of the present invention, the apparatus of the vacuum chamber 700 can be very simplified and the tack time can be reduced, so that the productivity can be enhanced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. will be. Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

100: Window Lead
200: package substrate
240: Microbolometer element
300: Bonding material
310: Gaboning material
600: hole filling material
700: Vacuum chamber

Claims (11)

Forming a window lead; forming a getter and a bonding material on the window lead;
Mounting the MEMS device on a package substrate; preparing the package substrate; And
And bonding the window lead to the package substrate on which the MEMS element is mounted so that the MEMS element faces the window lead,
Wherein preparing the window lead comprises:
Further comprising forming a bonding material on the window lead,
Wherein a height of the bonding material is higher than a height of the bonding material and is formed on a portion of the window lead,
A vacuum packaging method of a MEMS element. delete The method according to claim 1,
The step of bonding the window lead to the package substrate comprises:
Aligning and arranging the window leads on the package substrate at normal pressure, and then bonding the package substrate and the window leads through the bonding material,
Here, the bonding material may not contact the package substrate,
A vacuum packaging method of a MEMS element. The method of claim 3,
The step of bonding the window lead to the package substrate comprises:
After the above-mentioned bonding step,
Mounting the bundled window lead and the package substrate in the vacuum chamber so that the window lead is disposed on the first plate;
Heating the first plate in the vacuum chamber or raising the temperature of the vacuum chamber to perform an outgassing and getter activation step; And
And a pressure is applied to at least one of the package substrate and the first plate while the first plate is heated in the vacuum chamber or the temperature of the vacuum chamber is raised to seal the window lead and the package substrate through the bonding material, ≪ / RTI >
A vacuum packaging method of a MEMS element. Forming a window lead; forming a getter and a bonding material on the window lead;
Mounting the MEMS device on a package substrate; preparing the package substrate; And
The method comprising: bonding the window lead to the package substrate on which the MEMS element is mounted so that the MEMS element faces the window lead, positioning the window lead on the first plate at normal pressure and aligning the package substrate on the window lead And applying pressure to at least one of the package substrate and the first plate while heating the first plate at normal pressure to hermetically bond the window lead and the package substrate through the bonding material,
At least one gas hole is formed in a part of at least one of the package substrate and the window lead.
A vacuum packaging method of a MEMS element. delete 6. The method of claim 5,
The step of bonding the window lead to the package substrate comprises:
After the sealing step,
Mounting the sealed package substrate and the window lead on the first plate in a vacuum chamber; And
Further comprising positioning the perforated material on the gas hole in the vacuum chamber.
A vacuum packaging method of a MEMS element. 8. The method of claim 7,
The step of bonding the window lead to the package substrate comprises:
After positioning the puncture material,
Further comprising heating the first plate in the vacuum chamber or raising the temperature of the vacuum chamber to perform an outgassing and getter activation step,
Wherein the outgassing is performed through the gas hole,
A vacuum packaging method of a MEMS element. 9. The method of claim 8,
The step of bonding the window lead to the package substrate comprises:
After the outgasing and the getter activation step,
Further comprising the step of melting the hole filling material in the vacuum chamber to seal the gas hole with the hole filling material.
A vacuum packaging method of a MEMS element. The method according to any one of claims 1, 3, 4, 5, and 7,
Wherein the MEMS element is a microbolometer element. A MEMS device package produced according to the vacuum packaging method of the MEMS element according to any one of claims 1, 3 to 5 or 7 to 9.

Images