KR101300013B1

KR101300013B1 - Led lamp

Info

Publication number: KR101300013B1
Application number: KR1020110009928A
Authority: KR
Inventors: 심현섭
Original assignee: 심현섭
Priority date: 2011-02-01
Filing date: 2011-02-01
Publication date: 2013-08-26
Also published as: KR20120088940A

Abstract

The present invention relates to an LED lighting lamp, and according to the present invention comprises a heat spreader and a plurality of rotatable heat dissipation plates having a central opening and an outer periphery and a central opening in which the outer periphery and the outer periphery are alternately repeated; A heat sink for LED lighting lamp according to the present invention, comprising: a plurality of heat pipes passing through the plurality of crimped heat dissipation plates from the heat spreader so that the plurality of crimped heat dissipation plates are maintained to be mutually balanced up and down via the space portion on the heat spreader. Is achieved by assembling the heat dissipation piece, so it has better heat dissipation characteristics than forged molded products, and can effectively solve the problem of shortening the life span of LED lamps and the heat dissipation efficiency caused by the deterioration of heat dissipation characteristics of LED chips. And installation work performance, manufacturing economy and repair maintenance Has the property, the LED lighting lamp according to the invention using the same are very useful as a medium to large LED lamps in indoor having a relatively wide space such as a factory or a hall or gymnasium.

Description

LED lighting lamp {LED LAMP}

The present invention relates to an LED (Light Emitting Diode) light lamp, and more particularly, it is suitable for indoor use, preferably for indoor use having a relatively large space such as a factory, an auditorium or a gymnasium. In addition, it has high heat dissipation efficiency, high manufacturing and maintenance economics, and no need to make or modify molds, so it has high deformation applicability to its structure or form. Relates to indoor LED lighting lamps.

LED (Light Emitting Diode) is a photoelectric device that has a junction structure of P-type and N-type semiconductors and emits light of energy corresponding to the band gap of the semiconductor by combining electrons and holes when power is applied. High efficiency, relatively low power consumption, infinitely extended installation, semi-permanent life, no preheating, fast response speed, relatively simple lighting circuit, no gas and filament for discharge Therefore, it has the advantages of high impact resistance, safety, low environmental pollution, high repetitive pulse operation, less optic nerve fatigue, and full color implementation. As a trend, the applications and applications of high power and high efficiency LEDs are rapidly expanding.

In general, the LED lighting lamp adopts a method of integrating and arranging a plurality of LED elements on the same plane with high density in series and / or in parallel, thereby dramatically increasing the brightness or luminance of the LED lighting lamp. As the integration density of the LED is increased, the heat generated by the driving is also significantly increased. Therefore, a problem arises that the optical output characteristic of the LED is reduced, the lifetime is shortened, and the efficiency is lowered.

Thus, sufficient heat dissipation from the LEDs is essential to maintain certain optical characteristics of the high power and high efficiency LEDs.

In order to solve the problems of LED as described above, a wide range of methods for dissipating heat generated from semiconductor components such as LEDs into the air by using a heat radiator made of a metal such as copper or aluminum having excellent thermal conductivity. Is being applied.

The heat dissipation method can be roughly classified into a conventional passive air-cooled heat dissipation method using a heat dissipation body made of a metal material having excellent thermal conductivity and forming a plurality of fin structures to increase the surface area, and using the same heat dissipation unit as described above. Active air-cooled heat dissipation method to increase heat dissipation by forced air blowing, Passive water-cooled heat dissipation method to cool by natural convection due to density difference according to water temperature, Active water-cooled heat dissipation method to force water circulation using pump, There is a heat dissipation method using a heat pipe in which a heat transfer refrigerant is stored in a heat sink to radiate heat while the heat transfer refrigerant cycles through vaporization and liquefaction.

However, in the LED lighting lamp field, a water-cooled heat dissipation method having a separate water circulation pipe structure or an active air-cooled heat dissipation method using a fan inevitably leads to an increase in the weight of the lighting equipment, which entails a complicated structure, and accordingly, a manufacturing and maintenance cost It is rarely adopted because of the increase.

Mainly used in the art is a passive air-cooled heat dissipation method, or a heat dissipation method with a heat pipe added thereto, will be briefly described with reference to the accompanying drawings, a typical conventional technique for this.

First, Korean Patent Publication No. 2010-0081262 (published on July 14, 2010) proposes a heat sink 1 'for an LED lighting lamp as shown in the exemplary perspective view of FIG.

The conventional most conventional structure is a form other than the hole of the reference numeral 22 in FIG. 6, the metal disk 20 and the metal disk 20 for transferring heat generated from the LED module (not shown). It is composed of a plurality of heat dissipation fins 21 for dissipating evenly distributed heat to the outside of the back direction of the LED module, in this case, in order to fix the heat dissipation fins 21 to the back of the metal disc 20 (Dovetail) to insert the insert or to go through a cumbersome and laborious work to use a fixing means such as a separate screw or pin, in particular the heat of contact due to the poor contact of the metal disk 20 and the heat radiation fin 21 In addition, there is a problem that the resistance is likely to increase, and since the heat dissipation is made in only one direction, there is a problem that the efficiency is relatively low.

Therefore, Figure 6 is a conventional solution to solve the above-described problems, by forming a plurality of holes (22) in the metal plate 20, heat generated from the LED module (not shown) is directly transferred to the heat radiation fin (21). The structure which reduced the contact heat resistance between metal interfaces is proposed by making it possible.

However, this structure has a problem that it is still not satisfactory since it is essentially the same structure as the conventional one except that a plurality of perforation holes 22 are formed in the metal disc 20.

Subsequently, FIG. 7 is a perspective view of the heat sink 1a 'disclosed in Korean Patent Registration No. 0891433 (registered on March 25, 2009), wherein the conventional heat sink 1a' improves heat dissipation characteristics. In order to attach the 'U' shaped heat pipe 35 having both wings to the bottom surface of the LED module, the first heat sink 33 having a plurality of vertical fins 34 between the wings of the heat pipe 35 described above. ) And a cylindrical second heat dissipation plate 30 having a plurality of horizontal fins 31 and heat dissipation holes 32 on the outside of the two wings.

However, since the conventional heat sink 1a 'has a complicated three-dimensional structure, it is inevitably manufactured by aluminum casting or die casting, so that a large amount of time and cost are required to manufacture a mold. If the medium or large sized LED lighting lamp is manufactured, the heat dissipation characteristics are significantly increased, but the weight is remarkably large, resulting in low practicality in terms of production, transportation, and installation.

In addition, Korean Patent Publication No. 2009-0093492 (published on Feb. 2, 2009) proposes a large LED security light 10 'as shown in FIGS. 8A and 8B, and the LED security light 10' is disclosed. A body having LED transparent lamps 42 installed on the first and second inclined surfaces 43 and 43a, which are alternately and repeatedly arranged alternately, to be irradiated in different directions and having a transparent cover 45 around them. Reference numeral 44 denotes a support fastener as a structure having a heat radiating portion 40 formed radially with a plurality of heat radiating fins 41.

However, the above-described conventional LED security light (10 ') has a three-dimensional structure of the heat dissipation portion 40 and the body 46 has a complex shape, so it must be produced by aluminum casting or die casting, a lot of time and cost in the manufacture of the mold Of course, the modification or modification of the mold is inevitable in order to deform the shape or structure thereof, and thus the deformation or change is not free. Similarly, the weight is significantly increased, which makes it difficult to manufacture, transport, and install the product.

Meanwhile, Korean Utility Model Publication No. 2010-0008208 (published Aug. 18, 2010) proposes an LED lighting device 10a 'as shown in FIGS. 9A and 9B, and the LED lighting device 10a' is disclosed. A heat sink 50 formed of a plurality of pieces to be mutually fastened to form a housing, a plurality of LED lighting lamp units 51 fastened to the heat sink 50 in the housing, and a floodlight cover 52 It consists of).

Since the large LED lighting device 10a 'as shown also has a complicated three-dimensional structure of the heat sink 50, it can only be manufactured by aluminum casting or die casting. However, there is a problem in that the deformation of the form or structure is not free, and the weight is so large that the production, transportation, installation and the like are not easy.

In addition, Korean Patent Publication No. 2010-0102056 (published Sep. 20, 2010) proposes an LED lamp assembly (not shown) having an extruded heat sink, wherein an extruded material is more than a cast material or a material before extrusion molding. It has been found that it has a high thermal conductivity, for example, extruded aluminum exhibits a thermal conductivity of about 200 W / mK, while cast aluminum alloys exhibit a thermal conductivity of less than 100 W / mK, and also the metal heatsink is extruded by It is mentioned that manufacturing can significantly reduce production costs.

Therefore, there has been a demand in the art for the development of a heat sink for a medium-large size indoor LED lighting lamp and a medium-large size indoor LED lighting lamp using the same, which overcome all the problems of the prior art as described above.

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Accordingly, it is an object of the present invention to provide a medium to large indoor LED lighting lamp that is suitable for indoor use, especially for a room having a relatively large space such as a factory, an auditorium, or a gymnasium.

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According to a first preferred aspect of the present invention for smoothly achieving the object of the present invention, a plurality of wheels having a heat spreader and an outer periphery having a central opening and an outer periphery and an outer periphery are alternately repeated Iii) a plurality of heat penetrating the heat dissipation plate and the plurality of heat dissipation plates from the heat spreader so that the plurality of heat dissipation plates above the heat spreader are kept in equilibrium with each other through the space part. A heat sink for an LED lighting lamp composed of a pipe; The heat sink for the LED lighting lamp is surrounded by a first cover member having a heat dissipation fin and a lateral extension, and a second cover member having a lateral extension, and the lateral extension and the second of the first cover member. A cylindrical heat dissipation cover having a heat dissipation gap between the lateral extensions of the cover member; A plurality of COB (Chip on Board) fixed on the heat spreader of the heat sink; A transparent cover mounted to the front of the COB; There is provided an LED lighting lamp comprising a back heat spreader positioned behind the heat sink for the LED lighting lamp.

According to a second preferred aspect of the present invention for smoothly achieving the fifth object of the present invention, there is provided a heat spreader and a plurality of outer periphery portions having a central opening and an outer periphery protrusion and an outer periphery recessed portion alternately repeated. A plurality of penetrating heat dissipation plates and a plurality of penetrating heat dissipation plates penetrating the plurality of crimp heat dissipation plates from the heat spreader so that the plurality of crimp heat dissipation plates on the heat spreader are kept in mutual equilibrium vertically through a space. A heat sink for an LED lighting lamp composed of two heat pipes; A cylindrical heat dissipation cover surrounding the heat sink for the LED lighting lamp; A plurality of COB (Chip on Board) fixed on the heat spreader of the heat sink; A transparent cover mounted to the front of the COB; A rear heat spreader located behind the heat sink for LED lighting lamps; A switching mode power supply (SMPS) circuit-embedded member (drive unit) positioned behind the rear heat spreader; There is provided an LED lighting lamp composed of a front and rear heat spreader and a heat dissipation cover for accommodating the SMPS circuit embedded member.

According to a third preferred aspect of the present invention for smoothly achieving the fifth object of the present invention, a reflector is provided on the plurality of COBs described above, and the transparent cover and the rear heat spreader are respectively provided by a cover holder and a fixed rim. There is provided an LED lighting lamp fixed to the heat dissipation cover.

According to a fourth preferred embodiment of the present invention for smoothly achieving the fifth object of the present invention, the heat dissipation cover includes a first cover member having a heat dissipation fin and a lateral extension and a second cover member having a lateral extension. An LED lighting lamp is provided in which a gap for heat radiation exists between the lateral extension of one first cover member and the lateral extension of the second cover member.

According to a fifth preferred embodiment of the present invention for smoothly achieving the fifth object of the present invention, in the fourth aspect, the heat dissipation cover includes two, four, or six first and second cover members, respectively. An LED lighting lamp is provided.

According to a sixth preferred aspect of the present invention for smoothly achieving the fifth object of the present invention, there is provided an LED lighting lamp in which a plurality of heat radiating holes are formed in the rear heat spreader in the second aspect described above.

According to a seventh aspect of the present invention for smoothly achieving the fifth object of the present invention, a plurality of fixing holes are formed in the outer periphery of each of the heat spreader and the rear heat spreader of the heat sink for the LED lighting lamp. An LED lighting lamp is provided in which at least one through hole is formed in a central portion of a rear heat spreader.

According to a eighth preferred aspect of the present invention for smoothly achieving the fifth object of the present invention, in the second aspect described above, the rear heat spreader and the front heat spreader accommodating and adjacent to the SMPS circuit-embedded member are accommodated. In order to avoid the plurality of heat dissipation positions formed on the rear heat spreader, an LED lighting lamp having a neck interposed in the center is provided.

According to a ninth aspect of the present invention for smoothly achieving the fifth object of the present invention, in the above-described second aspect, the front and rear heat spreaders for receiving the SMPS circuit embedded member are fixed to the heat dissipation cover by fixed rims, respectively. LED lighting lamps are provided.

According to a tenth aspect of the present invention for smoothly achieving the fifth object of the present invention, an LED lighting device in which a fastener is fastened through a through hole formed in a rear heat spreader or a rear heat spreader for accommodating an SMPS circuit embedded member is provided. A lamp is provided.

Heat sink for LED lighting lamp applied to the present invention can be formed by the assembly of the extruded heat dissipation piece is excellent heat dissipation characteristics compared to the case of forging shortening the lifespan of LED lamps due to degradation of heat dissipation characteristics of the LED chip and heat dissipation efficiency It has a high heat dissipation characteristic that can effectively solve the problem, and in particular, it is relatively light weight, so it has good transportability and installation workability, and since the use of a mold is unnecessary, its production economy and repairability are good. The LED lighting lamp according to the present invention using the same is very useful as a medium-large LED lighting lamp for indoor use, preferably for a room having a relatively large space such as a factory, an auditorium, or a gymnasium.

1A and 1B are top and bottom perspective views, respectively, of a heat sink for an LED lighting lamp.
1C and 1D are plan and bottom views, respectively, of FIG. 1A.
1E is a side view of FIG. 1A.
Figures 2a to 2c is a top perspective view, a bottom perspective view and a side view of the LED lighting lamp according to a preferred embodiment of the present invention to which the heat sink for the LED lighting lamp of Figures 1a to 1e is applied, respectively.
3 is an exploded perspective perspective view illustrating the LED lighting lamp of FIGS. 2A to 2C.
Figures 4a to 4c is a top perspective view, a bottom perspective view and a side view of an LED lighting lamp according to another preferred embodiment of the present invention to which the heat sink for the LED lighting lamp of Figures 1a to 1e is applied, respectively.
5 is an exploded perspective perspective view illustrating the LED lighting lamp of FIGS. 4A to 4C.
6 is an exemplary perspective view of a heat sink for a conventional conventional LED lighting lamp.
7 is a perspective view of another conventional heat sink.
8A and 8B are a perspective view and a side view, respectively, of a substructure of a conventional LED lighting lamp and a LED lighting lamp with a heat sink, respectively.
9A and 9B are perspective and side cross-sectional views, respectively, of another conventional heat sink-attached LED lighting lamp.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

1A and 1B are top and bottom perspective views, respectively, of a heat sink 1 for an LED lighting lamp applied to the present invention, and FIGS. 1C and 1D are top and bottom views of FIG. 1A, respectively, and FIG. 1E is of FIG. 1A. As a side view, it mentions together for convenience of description.

The heat sink 1 for an LED lighting lamp applied to the present invention has a heat spreader 4, a central opening 2e, and the outer circumferential protrusion 2a and the outer circumferential recess 2b are alternately repeated. A plurality of thin plate-shaped rolling heat dissipation plates 2 having outer peripheral edges to be formed, and the plurality of rolling-shaped heat dissipation plates 2 described above on the heat spreader 4 are space portions 6 (FIG. 1E). And a plurality of heat pipes 3 passing from the heat spreader 4 described above to the plurality of crimped heat dissipation plates 2 so as to be mutually balanced up and down with each other. The outer circumferential protrusions 2a and the outer circumferential indentations 2b of the adjacent upper and lower annular heat dissipation plates 2 which are kept in a stable manner are alternately positioned up and down alternately.

Further, in each of the plurality of annular heat dissipation plates 2, radial slots 2c are positioned between the plurality of heat pipes 3, and the inner periphery of the central opening 2e is spaced at equal intervals. A plurality of inner circumferential protrusions 2f are formed.

In the illustrated example, the number of the outer circumferential protrusions 2a and the outer circumferential recessed portions 2b of each of the above-described cricket heat dissipation plates 2 is 12, respectively, and the number of the inner circumferential protrusions 2f and the radial slots 2c is respectively. In eight, the number of heat pipes 3 is shown as eight, but their number in the present invention is not limited and is optional.

For example, although not limiting, the number of the outer circumferential protrusions 2a and the outer circumferential recesses 2b of each of the above-described cricket heat dissipation plates 2 may be in the range of 6 to 24, preferably 8 to 16, respectively. The inner circumferential protrusion 2f and the radial slot 2c may be in the range of 6-16, preferably 8-12, and the heat pipes 3 are 4-12, preferably 6-8. Can be.

The outer circumferential protrusion 2a and the inner circumferential protrusion 2f are manufactured in the form of an arc having a protruding end (not shown), or a polygonal shape such as a trapezoid, a rectangle, a square, or a triangle so that efficient heat dissipation can be achieved. Although not shown, a plurality of micro slits may be formed at the protruding end so that a plurality of terminal pins may be formed for improving heat dissipation efficiency.

On the other hand, the shape of the outer periphery recessed part (2b) can also be produced in the form of a circular arc, or a polygonal trapezoid, rectangle, square, triangle, etc. inward with the side shape of the outer periphery protrusion (2a), although not shown Of course, a plurality of micro slits may be formed at the protruding end so that a plurality of terminal pins may be formed for improving heat dissipation efficiency.

The presence of the central opening 2e and the radial slot 2c also facilitates upward discharge due to the difference in density of the heat flow generated by the operation of the LED.

In particular, the outer circumferential protrusions 2a and the outer circumferential indentations 2b of the adjacent upper and lower annular heat dissipation plates 2 which are held in parallel with each other up and down are alternately positioned up and down alternately, whereby a plurality of positions are positioned up and down. The heat dissipation efficiency at the outer periphery of the crimp heat dissipation plate 2 can be maximized.

Subsequently, the heat pipe 3 is projected and fixed through the bottom of the base 3b and the heat spreader 4 so that the tip 3a is exposed upward through the top annular heat dissipation plate 2. The heat dissipation effect of the heat pipe 3 is increased by forming a curved portion 3c between the lowermost round heat dissipation plate 2 and the heat spreader 4. It is formed in the form to enhance.

In addition, in the illustrated example, the heat pipe 3 is vertically positioned with respect to the heat spreader 4 between the plurality of fin-shaped heat-dissipating plates 2, but the heat pipe 3 is not limited thereto. Any form may be used as long as it has an upward curve gradient.

On the other hand, the heat pipe 3 is formed of a refrigerant partially filled copper pipe, and the heat-rotating heat dissipation plate 2 is generally formed of a thin plate made of aluminum, copper, or an alloy thereof. It may be preferable to press and shape the silicon carbide thin plate manufactured by heating in an electric furnace. The silicon carbide is lightweight, has a low coefficient of thermal expansion, and exhibits high thermal conductivity at low temperatures to room temperature.

Laser spot welding or bonding with silver-filled epoxy is preferably performed at the through interface through which the heat pipe 3 penetrates through the insertion hole 2d of the columnar heat-dissipating plate 2 so that a small gap does not exist in order to increase thermal conductivity. Do.

Subsequently, the above-described heat spreader 4 attached to one surface of the heat sink 1 for LED lighting lamps applied to the present invention has a flange 4a having a plurality of fixing holes 4d formed at its outer periphery, and at the center thereof. The heat radiation hole 4b as a through hole is formed.

In addition, although the opening 4c is formed around the heat dissipation hole 4b in the illustrated example, an upward heat flow through the heat dissipation hole 4b can be more smoothly transferred upward. 4c) is optional.

When the rotatable heat dissipation plate 2 is formed of aluminum or an alloy thereof, the extruded heat dissipation plate 2 is preferably extruded into a thin plate and then pressed to produce high thermal conductivity of about 200 W / mK in order to improve heat dissipation and improve manufacturing efficiency. In addition, it can be formed by pressing after rolling, but casting molding is not preferable because the casting molding is relatively low in thermal conductivity of about 100 W / mK.

In addition, according to the above-mentioned extrusion molding, since the mold is unnecessary, there is no cost problem associated with the mold or the need for cumbersome work related to the mold, and high process efficiency and weight can be achieved.

Also, of course, a plurality of heat dissipation through holes (not shown) may be formed in the annular heat dissipation plate 2 to improve heat dissipation.

Therefore, the heat sink 1 for the LED lighting lamp of the present invention is the heat generated by the COB 15a (see FIG. 3) adjacent to the heat spreader 4 is dispersed on the heat spreader 4 and at the same time, the heat pipe ( 3) is transmitted upward through the heat dissipation plate in the horizontal direction along the thin plate-shaped annular heat dissipation plate (2) which is installed in the height direction of the heat pipe (3), and of the heat dissipation plate (2) It has an efficient heat dissipation structure which is discharged upward through the central through hole 5 formed by the center opening 2e and the radial slot 2c of the said crimp heat dissipation plate 2 above.

2A to 2C are top, bottom, and side views of the LED lighting lamp 10 according to the preferred embodiment of the present invention to which the heat sink 1 for the LED lighting lamp of FIGS. 1A to 1E is applied, respectively. 3 is an exploded perspective perspective view illustrating the LED lighting lamp 10 of FIGS. 2A to 2C, which will be described together.

The LED lighting lamp 10 according to the first embodiment of the present invention is for an SMPS external type in which a member (drive part) with a built-in switching mode power supply (SMPS) circuit is separately installed, and the LED according to the present invention as described above. On the heat spreader 4 of the heat sink 1 for an illumination lamp, the cylindrical heat dissipation cover 14 which encloses the said heat sink 1 for LED lamps, and the heat sink 1 for said LED light lamps. A plurality of COB (Chip on Board) 15a fixed to the rear cover, a transparent cover 16a mounted in front of the COB 15a, and the rear side of the heat sink 1 for the LED lighting lamp. The back heat spreader 12 is comprised.

The heat dissipation cover 14 is composed of a first cover member 14a having a heat dissipation fin 14c and a lateral extension 14d and a second cover member 14b having a lateral extension 14e. A heat dissipation gap 14f exists between the lateral extension 14d of the first cover member 14a and the lateral extension 14e of the second cover member 14b.

The heat dissipation cover 14 is composed of two, four, or six first and second cover members 14a, 14b, respectively.

The heat dissipation cover 14 is made of aluminum or an alloy thereof, or silicon carbide, but in some cases, may be formed of a thermally conductive resin including carbon black, carbon nanotubes, or metal flakes.

On one surface of the heat spreader 4 of the heat sink 1 for the LED lighting lamp, a plurality of COBs 15a are positioned on the circuit board 15 fixed by the fixing screw 20b. The reflector 11 is mounted on the COB 15a of the light emitting device, and the light emitted from the plurality of COBs 15a is transmitted through the transparent cover 16a of the front surface mounted on the cover holder 16.

The transparent member 16a may be tempered glass or a heat resistant transparent resin, and if necessary, may be a surface interglass treatment or a light diffusing agent-added heat resistant transparent resin to prevent glare.

The cover holder 16 is fixed on the circuit board 15 by a fixing screw 20a.

On the other hand, a plurality of fixing holes 4d and 12b for fastening with the heat dissipation cover 14 are provided at outer peripheries of each of the heat spreader 4 and the rear heat spreader 12 of the heat sink 1 for the LED lighting lamp. The through hole 12c and the wire inlet 12d for mounting the binding hole 19 are formed at the center of the rear heat spreader 12 through the nut or the washer 21.

The rear heat spreader 12 is fastened to the heat dissipation cover 14 by a fixing screw 20 through a fixing rim 12e having a plurality of fixing holes 12f.

The binder 19 is an installation means for suspending through a fixing cord such as a ceiling of a factory or the like.

Although not shown, the rear heat spreader 12 may be formed with a plurality of heat dissipation holes (for example, reference numeral 12a in FIG. 5).

4A to 4C are top, bottom, and side views of the LED lighting lamp 10a according to another preferred embodiment of the present invention, to which the heat sink 1 for the LED lighting lamp of FIGS. 1A to 1E is applied, respectively. 5 will be described together as an exploded perspective perspective explanatory view of the LED lighting lamp 10a of FIGS. 4A to 4C, and the basic configuration thereof is substantially the same as that of the first embodiment described above, and thus only for the difference thereof. Mainly explained.

The LED lighting lamp 10a according to the second embodiment of the present invention is for the SMPS built-in type in which a switching mode power supply (SMPS) built-in member (drive part) is installed therein, and the LED lights according to the present invention as described above. On the heat sink 1 for a lamp, the cylindrical heat dissipation cover 14 which encloses the heat sink 1 for LED lighting lamps, and the heat spreader 4 of the heat sink 1 for LED lighting lamps mentioned above. A plurality of COBs (Chip on Board) 15a fixed, a transparent cover 16a mounted in front of the COB 15a, and a rear surface located behind the LED heat lamp heat sink 1 above. A heat spreader 12, a switching mode power supply (SMPS) circuit built-in member (drive part) 13 positioned behind the rear heat spreader 12, and the SMPS circuit built-in member 13 are housed. It consists of front and rear heat spreaders 18, 18 and heat dissipation cover 14.

Compared with the LED lighting lamp 10 according to the first embodiment of the present invention, the LED lighting lamp 10a according to the second embodiment of the present invention has a SMPS circuit built-in member separately installed at the rear and a front for storing the same. And except for the rear heat spreaders 18 and 18 and the heat dissipation cover 14 and the neck 17.

In the illustrated example, a plurality of heat dissipation holes 12a are formed in the outer circumferential edge portion of the rear heat spreader 12, avoiding the center portion.

Therefore, since the plurality of heat dissipation holes 12a in the rear heat spreader 12 are located in the outer region adjacent to the outer periphery of the neck 17, heat dissipation is smoothly performed.

Further, the rear heat spreader 12 described above is disposed between the rear heat spreader 12 and the front heat spreader (see reference numeral 18 on the left in FIG. 5) adjacent to and containing the SMPS circuit-embedded member 13. The neck 17 is interposed substantially in the center to avoid the position of the plurality of heat radiating holes 12a formed therein, and each of the front and rear heat spreaders 18 and 18 for accommodating the SMPS circuit-embedded member 13 are each large. It is fixed to the heat dissipation cover 14 by the fixing screw 20c through the fixing rim 18d which has the fixing hole 18e.

The heat dissipation cover 14 for accommodating the SMPS circuit built-in member 13 has a structure except for the heat dissipation cover 14 for accommodating the heat sink 1 for the LED lighting lamp according to the present invention and its position and length. Since is essentially the same configuration, the same reference numerals are used without distinguishing them and the present invention can be clearly understood.

In other words, the heat dissipation cover 14 for accommodating the SMPS circuit-embedded member 13 includes a first cover member 14a having a heat dissipation fin 14c and a side extension 14d and a side extension 14e. And a second cover member 14b having a heat dissipation between the lateral extension 14d of the first cover member 14a and the lateral extension 14e of the second cover member 14b. The presence of the gap 14f is the same as in the case of the heat dissipation cover 14 containing the heat sink 1 for the LED lighting lamp according to the present invention.

In the illustrated example, two through-holes are formed in the rear heat spreader (see reference numeral 18 on the right side in FIG. 5) for accommodating the SMPS circuit-embedded member 13, one of which engages the fastener 19. Ball (not shown), and the other is formed by wire entry 18c.

Since other configurations are the same as those of the first embodiment described above, further description thereof will be omitted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. This is also within the scope of the present invention.

1: Heat sink for LED light lamp
2: crimp heat dissipation plate
2a: outer periphery 2b: outer periphery
2c: radial slot 2d: insertion hole
2e: central opening 2f: inner circumferential protrusion
3: heat pipe
3a: tip 3b: base
3c: bend
4: heat spreader
4a: flange 4b: through hole
4c: opening 4d: fixing hole
5: central through 6: space part
10,10a: LED lighting lamp according to the present invention
11: reflector 12: rear heat spreader
12a: heat sink 12b: fixing hole
12c: through hole 12d: wire inlet
12e: fixed rim 12f: fixed hole
13: SMPS circuit built-in member (drive part)
14: heat dissipation cover 14a: first cover member
14b: second cover member 14c: heat dissipation fin
14d, 14e: Lateral extension 14f: Clearance
15: circuit board 15a: chip on board (COB)
16: cover holder 16a: transparent cover
17: Neck
18: Front and rear heat spreaders
18a, 18b: fixing hole 18c: wire inlet
18d: fixed rim 18e: fixed hole
19: fastener
20, 20a, 20b, 20c: Set screw 21: Nut or washer

Claims

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A plurality of annular heat dissipation plates having a heat spreader, an outer periphery having a central opening and an outer periphery and an outer periphery recessed alternately; A heat sink for an LED lighting lamp composed of a plurality of heat pipes passing through the plurality of annular heat dissipation plates from the heat spreader such that the plates are held in equilibrium with each other through spaces;
It encloses the heat sink for LED lighting lamps, and consists of the 1st cover member which has a heat radiation fin and a lateral extension, and the 2nd cover member which has a lateral extension, The lateral extension of the said 1st cover member, and said 2nd A cylindrical heat dissipation cover having a heat dissipation gap between the lateral extensions of the cover member;
A plurality of COB (Chip on Board) fixed on the heat spreader of the heat sink for the LED lighting lamp;
A transparent cover mounted to the front of the COB;
Consists of the rear heat spreader located behind the heat sink for the LED lighting lamp
LED light lamp.

A plurality of annular heat dissipation plates having a heat spreader, an outer periphery having a central opening and an outer periphery and an outer periphery recessed alternately; A heat sink for an LED lighting lamp composed of a plurality of heat pipes passing through the plurality of annular heat dissipation plates from the heat spreader such that the plates are held in equilibrium with each other through spaces;
A cylindrical heat dissipation cover surrounding the heat sink for the LED lighting lamp;
A plurality of COB (Chip on Board) fixed on the heat spreader of the heat sink for the LED lighting lamp;
A transparent cover mounted to the front of the COB;
A rear heat spreader located behind the heat sink for LED lighting lamps;
A switching mode power supply (SMPS) circuit-embedded member (drive unit) positioned behind the rear heat spreader;
An LED lighting lamp comprising a front and rear heat spreader and a heat dissipation cover for accommodating the SMPS circuit embedded member.

The LED lighting lamp according to claim 9 or 10, wherein a reflector is provided on the plurality of COBs, and the transparent cover and the rear heat spreader are fixed to the heat dissipation cover by a cover holder and a fixed rim, respectively. .

The heat dissipation cover according to claim 10, wherein the heat dissipation cover comprises a first cover member having a heat dissipation fin and a lateral extension, and a second cover member having a lateral extension, and the lateral extension and the second cover of the first cover member. An LED lighting lamp having a heat dissipation gap between the lateral extensions of the members.

The LED lighting lamp according to claim 9 or 10, wherein the heat dissipation cover is composed of two, four, or six first and second cover members, respectively.

The LED lighting lamp according to claim 10, wherein a plurality of heat dissipation holes are formed in the rear heat spreader.

The method according to claim 9 or 10, wherein a plurality of fixing holes for fastening with the heat dissipation cover are formed in the outer periphery of each of the heat spreader and rear heat spreader of the heat sink for LED lighting lamp described above, At least one through-hole is formed in the center of the LED lighting lamp.

11. The neck of claim 10 wherein the neck is interposed between the rear heat spreader and the front heat spreader at a position adjacent to the SMPS circuit-embedded member and avoiding a plurality of heat radiating positions formed in the rear heat spreader. LED light lamp.

The LED lighting lamp according to claim 10, wherein the front and rear heat spreaders for accommodating the SMPS circuit embedded member are fixed to the heat dissipation cover by fixed rims, respectively.

18. The heat dissipation cover according to claim 17, wherein the heat dissipation cover comprises a first cover member having a heat dissipation fin and a lateral extension, and a second cover member having a lateral extension, and the lateral extension of the first cover member and the second cover. An LED lighting lamp having a heat dissipation gap between the lateral extensions of the members.

16. The LED lighting lamp according to claim 15, wherein two through holes are formed in the rear heat spreader, one is a fastener fastening hole, and the other is a wire inlet.

The LED lighting lamp according to claim 10, wherein two through holes are formed in a rear heat spreader for accommodating the SMPS circuit embedded member, one of which is a fastener fastening hole, and the other of which is formed of an electric wire inlet.