KR101015792B1 - Test jig for side luminescence type led array - Google Patents

Test jig for side luminescence type led array Download PDF

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KR101015792B1
KR101015792B1 KR1020100073034A KR20100073034A KR101015792B1 KR 101015792 B1 KR101015792 B1 KR 101015792B1 KR 1020100073034 A KR1020100073034 A KR 1020100073034A KR 20100073034 A KR20100073034 A KR 20100073034A KR 101015792 B1 KR101015792 B1 KR 101015792B1
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South Korea
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jig
emitting led
light emitting
led array
inspection
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KR1020100073034A
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Korean (ko)
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문술갑
채창영
이동형
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주식회사엠시스
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: An inspection jig for a side luminescence type light emitting diode array is provided to adjust the refraction angle of a light source by rotating a reflection unit around a hinge. CONSTITUTION: In an inspection table(10), side luminescence type light emitting diode chips are repeatedly arranged on a substrate to form a light emitting diode array. A top-view type camera recognizing unit is arranged on the upper side of the inspection table. An upper jig(20) is arranged between the side luminescence type light emitting diode chips and transmits the light source of the side luminescence type light emitting diode chips to the camera recognizing unit through a reflection unit. A cover jig(30) is installed on the upper fig and blocks the surround distribution of noise light.

Description

측면 발광 엘이디 어레이용 검사 지그{Test jig for side luminescence type LED array}Test jig for side luminescence type LED array

본 발명은 측면 발광 엘이디 어레이용 검사 지그에 관한 것으로, 보다 상세하게는 엘이디를 원판 상태에서 점등하여 저 전류 검사 및 정격 전압 검사를 수행하기 위한 측면 발광 엘이디 어레이용 검사 지그에 관한 것이다.The present invention relates to an inspection jig for a side-emitting LED array, and more particularly, to an inspection jig for a side-emitting LED array for lighting the LED in a disc state to perform low current inspection and rated voltage inspection.

통상적으로 엘이디(LED: Light emitting diode)는 한쪽으로, 순방향으로는 전기가 통하고 역방향으로는 전기가 통하지 않게 하는 반도체 소자로서, 반도체의 P-N 접합구조를 이용하여 주입된 소수캐리어(전자, 양공)를 만들어내고, 이들의 재결합에 의하여 발광하게 된다. 이는 순방향으로 일정 전압이 인가되었을 때 불빛을 발하게 되는 것이다. In general, a light emitting diode (LED) is a semiconductor device that allows electricity to flow to one side and to prevent electricity from flowing in the reverse direction, and is a minority carrier (electron, hole) injected using a PN junction structure of a semiconductor. And emit light by recombination thereof. This is a light when a constant voltage is applied in the forward direction.

LED는 저에너지 고효율로서, 메탈할라이드나 할로겐의 경우에는 80~90% 정도가 열로 빠져 나가기 때문에 실재 빛으로 나오는 광량이 적지만 그에 비해 LED는 90% 이상이 빛으로 나오는 특성이 있습니다. 따라서 에너지 대비 많은 빛을 얻을 수 있고, 응답속도가 빠르고 하나의 광원으로 Full Color 구현이 가능하여 근자에는 Display시스템의 BLU(Back Light Unit)로 널리 적용되고 있다.LED is low energy and high efficiency, and in case of metal halide or halogen, about 80 ~ 90% is dissipated by heat, so the amount of light emitted by real light is small, but LED has more than 90% of light. Therefore, much light can be obtained compared to energy, and response speed is fast and full color can be realized with one light source. In recent years, it is widely applied as BLU (Back Light Unit) of Display system.

즉, 기판상에 LED칩을 가로 또는 세로방향으로 복열배치하여 LED어레이(arry)를 형성하고, 전압이 인가되면 이들이 동시에 발광하게 된다. 그러나 수백개에 달하는 LED칩 중에 어느 하나가 불량나더라도 화질저하를 포함하는 Display시스템의 불량으로 이어지므로 제조현장에서 검사공정의 중요성이 부각되고 있다. That is, by arranging LED chips on a substrate in a horizontal or vertical direction, LED arrays are formed, and when a voltage is applied, they emit light at the same time. However, even if any one of the hundreds of LED chips is defective, the display system including the image quality deterioration leads to the failure of the inspection process in the manufacturing field.

종래에 개시된 LED칩 검사장치를 살펴보면, 특허등록번호 제10-957748호에서 내부에 암실이 형성된 테스트 본체; 다수의 LED가 배열된 LED 어레이가 장착되며, 상기 암실 내부 및외부로 이동가능하도록 상기 테스트 본체에 설치되는 테스트 트레이; 상기 테스트 트레이를 상기 암실 내부 및외부로 자동으로 인입 및 인출시키는 트레이 이동부; 그리고 상기 암실 내부로 인입된 상기 LED 어레이의 길이방향을 따라 이동하며 상기 LED 어레이에 배열된 각각의 LED를 개별적으로 검사하는 검사부를 포함하는 LED 어레이검사장치를 제공하고 있다Looking at the LED chip inspection apparatus disclosed in the prior art, a test body in which a dark room is formed in the patent registration No. 10-957748; A test tray mounted to an LED array in which a plurality of LEDs are arranged and installed in the test body to be movable in and out of the dark room; A tray moving unit which automatically pulls the test tray into and out of the dark room; And it provides a LED array inspection apparatus including an inspection unit for moving along the longitudinal direction of the LED array introduced into the dark room and inspects each LED arranged in the LED array individually.

또한, 특허등록번호 10-785308호에서 수직조명을 인가하여 불량 칩LED를 검출하고, 다시 경사조명을 인가하여 다시 불량 칩LED를 검출하므로 평면형 뿐만 아니라 요철형에 있어서의 다양한 불량을 모두 자동으로 검출하도록 하는 기술이다.In addition, in Patent Registration No. 10-785308, the vertical chip is applied to detect bad chip LEDs, and the inclined light is applied again to detect bad chip LEDs, so that various defects in both flat and uneven types are automatically detected. It is a technique to make.

그런데, 상기 종래기술은 LED칩의 불량을 검출하기 위한 기술이나, 탑뷰(TOP VIEW)타입의 LED칩 검사용으로 사용범위가 한정되는 실정이다. 즉 LED칩의 광원이 기판과 직교하는 방향으로 조사되므로 탑뷰(TOP VIEW)방식의 검사카메라인식기를 통해 상부에서 그대로 스캔하여 불량을 판별하게 된다. By the way, the prior art is a technique for detecting a defect of the LED chip, the use range of the LED chip inspection of the top view (TOP VIEW) type is limited. That is, since the light source of the LED chip is irradiated in the direction orthogonal to the substrate, it is scanned as it is from the top through the inspection camera recognizer of the top view method to determine the defect.

그러나, 근자에는 Display시스템의 슬림(slim)화를 도모하고자, 탑뷰(TOP VIEW)타입의 LED칩이 측면 발광 방식의 LED칩으로 대체되는바, 여기서 측면 발광 방식의 LED칩은 광원이 기판과 평행하는 방향으로 조사되므로 기존에 탑뷰(TOP VIEW)방식의 카메라인식기를 사용하여 불량 판별이 불가능한 문제점이 따랐다.However, in recent years, in order to slim down the display system, a top view LED chip is replaced by a side emitting type LED chip, where the side emitting type LED chip has a light source parallel to the substrate. Since it is irradiated in the direction of the camera, the problem of the defect identification is impossible using the top view (TOP VIEW) camera recognizer.

이에, 검사공정에서 작업자의 육안에 의존하여 불량검사를 수행함에 따라 검사정밀도가 저하됨과 아울러 검사중 밝은 광원으로 인해 검사자의 시력이 급격히 저하되거나 상실되는 등의 산업재해율이 증가되는 폐단이 따랐다.As a result of poor inspection depending on the human eye in the inspection process, the inspection accuracy is lowered and the industrial disaster rate such as the eyesight of the inspector is sharply lowered or lost due to the bright light source during the inspection is increased.

본 발명은 상기한 점에 착안한 것으로서, 보다 상세하게는 기존에 탑뷰(TOP VIEW)방식의 카메라인식기를 활용하여 측면 발광 엘이디 어레이의 불량검사를 간편하고 정확하게 수행하기 위한 측면 발광 엘이디 어레이용 검사 지그를 제공하는 것을 그 목적으로 한다.The present invention has been made in view of the above, and more specifically, the inspection jig for side-emitting LED array for easily and accurately performing defect inspection of the side-emitting LED array by using a top view (TOP VIEW) camera recognizer. To provide that purpose.

이러한 목적을 달성하기 위해 본 발명의 특징은, 기판(2)상에 측면 발광 엘이디칩(3)이 반복배치되어 형성된 엘이디 어레이(1)가 안착되고, 상부에 탑뷰(TOP VIEW)방식의 카메라인식기(12)가 구비되는 검사테이블(10); 상기 엘이디 어레이(1)상에 안착되고, 측면으로 조사되는 측면 발광 엘이디칩(3)의 광원이 굴절되어 상측의 카메라인식기(12)상으로 전달되도록 반사부재(22)가 구비되는 상부지그(20);를 포함하여 구성되는 것을 특징으로 한다.In order to achieve the above object, a feature of the present invention is that the LED array 1 formed by repeatedly arranging the side-emitting LED chip 3 on the substrate 2 is seated, and a top view camera recognizer is mounted on the top. An examination table 10 provided with 12; The upper jig 20 is provided on the LED array 1, the reflection member 22 is provided so that the light source of the side-emitting LED chip 3 irradiated to the side is refracted and transmitted to the camera recognizer 12 on the upper side. It characterized in that the configuration, including.

이때, 상기 상부지그(20)상에 설치되고, 측면 발광 엘이디칩(3)의 광원조사방향을 제외한 영역이 차폐되도록 차폐홈(32)이 형성되는 커버지그(30)가 구비되는 것을 특징으로 한다.In this case, the cover jig 30 is provided on the upper jig 20 and the shielding groove 32 is formed to shield an area except the light source irradiation direction of the side light emitting LED chip 3. .

또한, 상기 반사부재(22)는 힌지(22a)를 축으로 선회되어 광원의 굴절각도조절이 가능하도록 구비되는 것을 특징으로 한다.In addition, the reflective member 22 is characterized in that the hinge 22a is pivoted about an axis so that the refractive angle of the light source can be adjusted.

이상의 구성 및 작용에 의하면, 본 발명은 광원이 반사부재에 의해 굴절되어 탑뷰(TOP VIEW)방식의 카메라인식기에 스캔됨에 따라 기존에 탑뷰방식의 카메라인식기를 활용하여 광원이 측면으로 조사되는 측면 발광 엘이디 어레이의 불량검사공정이 간편하고 정확하게 수행되는 효과가 있다.According to the above configuration and operation, in the present invention, the light source is refracted by the reflective member and scanned in the top view camera recognizer, so that the side light emitting LED is irradiated to the side by using the camera recognizer of the top view type. There is an effect that the defect inspection process of the array is performed easily and accurately.

도 1은 본 발명에 따른 측면 발광 엘이디 어레이용 검사 지그를 전체적으로 나타내는 구성도.
도 2는 본 발명에 따른 측면 발광 엘이디 어레이용 검사 지그의 요부를 절개하여 나타내는 구성도.
도 3은 본 발명에 따른 변형예로서, 측면 발광 엘이디 어레이용 검사 지그의 커버지그를 나타내는 구성도.
도 1은 본 발명에 따른 다른 변형예로서, 측면 발광 엘이디 어레이용 검사 지그의 반사부재를 나타내는 구성도. 1 is a block diagram showing the inspection jig for the side-emitting LED array according to the invention as a whole.
Figure 2 is a block diagram showing the main portion of the inspection jig for side-emitting LED array according to the present invention cut.
3 is a configuration diagram showing a cover jig of an inspection jig for a side-emitting LED array as a modification according to the present invention.
1 is a configuration diagram showing a reflective member of the inspection jig for a side-emitting LED array as another modification according to the present invention.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명은 측면 발광 엘이디 어레이용 검사 지그에 관련되며, 이때 측면 발광 엘이디 어레이용 검사 지그는 검사테이블(10), 상부지그(20)를 포함하여 주요구성으로 이루어진다.The present invention relates to an inspection jig for a side-emitting LED array, wherein the inspection jig for a side-emitting LED array has a main configuration including an inspection table 10 and an upper jig 20.

본 발명에 따른 검사테이블(10)은 기판(2)상에 측면 발광 엘이디칩(3)이 반복배치되어 형성된 엘이디 어레이(1)가 안착되고, 상부에 탑뷰(TOP VIEW)방식의 카메라인식기(12)가 구비된다. 검사테이블(10)은 엘이디 어레이(1)를 자동공급/배출하는 로딩/언로딩장치(도시생략)와 연계작동되도록 설치되고, 검사 중에 엘이디 어레이(1)의 유동이 방지되도록 엘이디 어레이(1)의 가장자리부분과 대응하는 위치에 클램프, 위치고정키를 포함하는 고정수단(도시생략)이 구비된다. In the inspection table 10 according to the present invention, an LED array 1 formed by repeatedly arranging side light emitting LED chips 3 on a substrate 2 is seated thereon, and a top view camera recognizer 12 is mounted thereon. ) Is provided. The inspection table 10 is installed to operate in conjunction with a loading / unloading device (not shown) for automatically supplying / discharging the LED array 1, and the LED array 1 to prevent the flow of the LED array 1 during inspection. A fixing means (not shown) including a clamp and a position fixing key is provided at a position corresponding to the edge portion of the.

그리고, 검사테이블(10)은 로딩된 엘이디 어레이(1)상에 배치된 측면 발광 엘이디칩(3)를 ON시키기 위해 일단에 전원단자가 구비되고, 전원단자는 검사공정이 수행되는 중에 전원을 일시적으로 공급하며, 카메라인식기(12)을 통하여 스캔이 완료되면 전원공급이 차단된다.Then, the test table 10 is provided with a power supply terminal at one end to turn on the side light emitting LED chip 3 disposed on the loaded LED array 1, and the power supply terminal temporarily supplies power during the inspection process. When the scan is completed through the camera recognizer 12, the power supply is cut off.

또, 탑뷰(TOP VIEW)방식의 카메라인식기(12)는 검사테이블(10) 상부에서 측면 발광 엘이디칩(3)의 광원을 스캔하는바, 여기서 카메라인식기(12)는 엘이디 어레이(1)의 사이즈에 대응하여 2~6회 분할촬영하게 된다.In addition, the top view camera recognizer 12 scans the light source of the side-emitting LED chip 3 from the upper part of the inspection table 10, where the camera recognizer 12 is the size of the LED array 1; In response to this, two to six divided shots are taken.

또한, 본 발명에 따른 상부지그(20)는 엘이디 어레이(1)상에 안착되고, 측면으로 조사되는 측면 발광 엘이디칩(3)의 광원이 굴절되어 상측의 카메라인식기(12)상으로 전달되도록 반사부재(22)가 구비된다. 상부지그(20)는 검사테이블(10)을 기준으로 설정된 위치에서 승하강되도록 설치되고, 반복 배치되는 측면 발광 엘이디칩(3)의 배열사이에 반사부재(22)가 위치된다. In addition, the upper jig 20 according to the present invention is seated on the LED array 1, the light source of the side light emitting LED chip 3 irradiated to the side is refracted to be reflected on the camera recognizer 12 of the upper side is reflected The member 22 is provided. The upper jig 20 is installed to move up and down at a position set based on the inspection table 10, and the reflective member 22 is positioned between the arrangement of the side-emitting LED chips 3 that are repeatedly arranged.

여기서, 반사부재(22)는 측면 발광 엘이디칩(3)의 광원이 상측의 카메라인식기(12)상으로 굴절되도록 경사각(예컨대, 45도)으로 설치되고, 길이방향으로 배치된 각각의 측면 발광 엘이디칩(3)에서 반사된 광원의 도달위치가 일정하도록 측면 발광 엘이디칩(3)과의 거리가 일정하게 유지된다.Here, the reflective member 22 is installed at an inclination angle (for example, 45 degrees) so that the light source of the side light emitting LED chip 3 is refracted onto the upper camera recognizer 12, and each side light emitting LED is arranged in the longitudinal direction. The distance from the side light emitting LED chip 3 is kept constant so that the arrival position of the light source reflected from the chip 3 is constant.

이에 측면 발광 엘이디칩(3)의 광원이 반사부재(22)에 의해 굴절되어 상측으로 조사되면, 탑뷰(TOP VIEW)방식의 카메라인식기(12)가 이를 스캔하여 불량여부를 판별하게 된다.Accordingly, when the light source of the side light emitting LED chip 3 is refracted by the reflecting member 22 and irradiated upward, the top view camera recognizer 12 scans it and determines whether there is a defect.

이때 본 발명에 따른 변형예로서, 상기 상부지그(20)상에 설치되고, 측면 발광 엘이디칩(3)의 광원조사방향을 제외한 영역이 차폐되도록 차폐홈(32)이 형성되는 커버지그(30)가 구비된다. 커버지그(30)는 상부지그(20)와 함께 승하강되도록 설치되고, 도 3에 도시된 바와 같이 저면에 다수의 차폐홈(32)이 형성된다. 이에 상부지그(20)를 엘이디 어레이(1)상에 안착시 도 2와 같이 차폐홈(32)상에 측면 발광 엘이디칩(3)이 수용된 상태로 잡광의 주변분산이 방지된다.At this time, as a modification according to the present invention, the cover jig 30 is provided on the upper jig 20, the shielding groove 32 is formed so that the area except the light source irradiation direction of the side light emitting LED chip 3 is shielded Is provided. The cover jig 30 is installed to move up and down together with the upper jig 20, and a plurality of shielding grooves 32 are formed at a bottom thereof as shown in FIG. 3. Accordingly, when the upper jig 20 is seated on the LED array 1, peripheral dispersion of light is prevented in a state in which the side light emitting LED chip 3 is accommodated on the shielding groove 32 as shown in FIG. 2.

이에 측면 발광 엘이디칩(3)을 검사하는 중에 사방으로 분산되는 잡광이 커버지그(30)에 의해 차단되므로, 주변에 배치된 각각의 측면 발광 엘이디칩(3)에 대한 광원검사정밀도가 향상되는 이점이 있다.Accordingly, since the light scattering in all directions is blocked by the cover jig 30 while the side light emitting LED chip 3 is inspected, the light source inspection precision of each side light emitting LED chip 3 disposed in the vicinity is improved. There is this.

또한 본 고에 따른 다른 변형예로서, 상기 반사부재(22)는 힌지(22a)를 축으로 선회되어 광원의 굴절각도조절이 가능하도록 구비된다. 힌지(22a)는 반사부재(22)의 길이방향 양 끝단에 구비되고, 도 4처럼 선회각도에 따라 측면 발광 엘이디칩(3)에서 조사된 광원의 굴절각도가 조절된다.In addition, as another modification according to the present, the reflective member 22 is provided to enable to adjust the angle of refraction of the light source is pivoted around the hinge (22a). Hinge 22a is provided at both ends of the reflecting member 22 in the longitudinal direction, and as shown in FIG. 4, the angle of refraction of the light source irradiated from the side light emitting LED chip 3 is adjusted.

이에 검사체인 엘이디 어레이(1)의 사이즈가 광폭으로 형성되어 카메라인식기(12)를 통한 폭방향 1회 스캔범위를 벗어날 경우, 각각의 반사부재(22) 각도를 조절하여 굴절된 광원간의 간격을 축소시킴으로 카메라인식기(12)의 1회 스캔범위내에서 폭방향 전체촬영이 이루어지는 이점이 있다.Therefore, when the size of the LED array (1) of the test body is formed to be wide and out of the range of one scan in the width direction through the camera recognizer (12), the distance between the refracted light sources is reduced by adjusting the angle of each reflecting member (22). By doing so, there is an advantage that the entire widthwise photographing is performed within one scan range of the camera recognizer 12.

10: 검사테이블 20: 상부지그 30: 커버지그10: inspection table 20: upper jig 30: cover jig

Claims (3)

기판(2)상에 측면 발광 엘이디칩(3)이 반복배치되어 형성된 엘이디 어레이(1)가 안착되고, 상부에 탑뷰(TOP VIEW)방식의 카메라인식기(12)가 구비되는 검사테이블(10);
상기 검사테이블(10)을 기준으로 설정된 위치에서 승하강되도록 설치되고, 반복 배치되는 측면 발광 엘이디칩(3)의 배열사이사이에 안착되어 측면으로 조사되는 측면 발광 엘이디칩(3)의 광원을 상측의 카메라인식기(12)상으로 굴절 전달하는 반사부재(22)가 구비되는 상부지그(20);
상기 상부지그(20)상에 설치되고, 측면 발광 엘이디칩(3)의 광원조사방향을 제외한 영역을 차폐하여 잡광의 주변분산을 차단하도록 다수의 차폐홈(32)이 형성되는 커버지그(30);를 포함하여 구성되는 것을 특징으로 하는 측면 발광 엘이디 어레이용 검사 지그.An inspection table 10 having an LED array 1 formed by repeatedly arranging side light emitting LED chips 3 on a substrate 2 and having a top view (TOP VIEW) type camera recognizer 12 disposed thereon;
The light source of the side light emitting LED chip 3, which is installed to move up and down at a position set based on the inspection table 10, is disposed between the arrangements of the side light emitting LED chips 3 which are repeatedly arranged, and is irradiated to the side. An upper jig 20 having a reflecting member 22 for refractively transmitting onto the camera recognizer 12;
Cover jig 30 is provided on the upper jig 20, a plurality of shielding grooves 32 are formed to shield the area except the light source irradiation direction of the side-emitting LED chip 3 to block the peripheral dispersion of light Inspection jig for a side-emitting LED array, characterized in that comprising a. 삭제delete 제 1항에 있어서,
상기 반사부재(22)는 힌지(22a)를 축으로 선회되어 광원의 굴절각도조절이 가능하도록 구비되는 것을 특징으로 하는 측면 발광 엘이디 어레이용 검사 지그.The method of claim 1,
The reflecting member 22 is pivoting around the hinge (22a) to the jig for side-emitting LED array, characterized in that it is provided to be able to adjust the refractive angle of the light source.
KR1020100073034A 2010-07-28 2010-07-28 Test jig for side luminescence type led array KR101015792B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237140B1 (en) 2012-02-08 2013-02-25 (주)씨에스이엔지 A faulty-tester of the led chip
CN113552426A (en) * 2021-09-22 2021-10-26 广东电网有限责任公司东莞供电局 Automatic light sensing monitoring device for transformer substation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125226A (en) * 1994-10-27 1996-05-17 Oki Electric Ind Co Ltd Mounting method of light emitting diode array chip, inspection method for mounting, and inspection device used for it
KR100783563B1 (en) * 2006-10-23 2007-12-10 주식회사 로옴코리아 An extra thin type 7 segment structure used indirect lighting method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125226A (en) * 1994-10-27 1996-05-17 Oki Electric Ind Co Ltd Mounting method of light emitting diode array chip, inspection method for mounting, and inspection device used for it
KR100783563B1 (en) * 2006-10-23 2007-12-10 주식회사 로옴코리아 An extra thin type 7 segment structure used indirect lighting method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237140B1 (en) 2012-02-08 2013-02-25 (주)씨에스이엔지 A faulty-tester of the led chip
CN113552426A (en) * 2021-09-22 2021-10-26 广东电网有限责任公司东莞供电局 Automatic light sensing monitoring device for transformer substation
CN113552426B (en) * 2021-09-22 2022-01-21 广东电网有限责任公司东莞供电局 Automatic light sensing monitoring device for transformer substation

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