KR100960768B1 - Linear vacuum deposition system - Google Patents

Abstract

Embodiments of a vacuum conveyor system are provided herein. In one embodiment, the vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support the substrates and move through the first vacuum sleeve. A port is provided for sealingly coupling the first vacuum sleeve to the processing chambers. A first substrate manipulator is disposed proximate to the port. Multiple ports may be provided for sealingly coupling the first vacuum sleeve to the plurality of processing chambers. A second vacuum sleeve can be hermetically coupled to opposite sides of the processing chambers. The vacuum conveyor system can be modularized into independent modules linked via load lock chambers. Multiple rollers can compensate for any gap in the leading edge of the substrate being carried thereon.

Description

Linear Vacuum Deposition System {LINEAR VACUUM DEPOSITION SYSTEM}

Embodiments of the present invention generally relate to a vacuum deposition system. More particularly, the present invention relates to a vacuum conveyor system for transporting substrates in a vacuum environment.

Glass substrates are particularly used for manufacturing active television and computer displays, or for solar panel applications. In television or computer display applications, each glass substrate may form multiple display monitors, each containing more than one million thin film resistors.

Processing on large glass substrates is often accompanied by performing multiple sequential steps, including, for example, performing chemical vapor deposition (CVD) processes, physical vapor deposition (PVD) processes, or etching processes. Glass substrate processing systems may include one or more processing chambers to perform the processes.

Glass substrates may have a size ranging from about 370 mm × 470 mm to about 1870 mm × 2200 mm. In addition, substrate sizes are becoming larger in order to allow more displays to be formed or to allow large displays to be produced. Large size requires much higher performance in developing processing systems as well as to manipulate large substrates.

However, current production equipment becomes more expensive. For example, cluster equipment suitable for vacuuming large glass substrates, for example large glass substrates of 1 m ² or more, is very expensive, requiring a relatively large floor space. As such, the incremental cost of adding additional equipment to the production line to increase throughput is very expensive.

Therefore, there is a need for an improved substrate processing system.

Embodiments of a vacuum conveyor system are provided in the present invention. In one embodiment, the vacuum conveyor system includes a first vacuum sleeve and a plurality of rollers that support and move the substrates through the first vacuum sleeve. The first vacuum sleeve has a port for sealingly coupling the first vacuum sleeve to the processing chamber. The first substrate manipulator is disposed near the connector port. Multiple ports may be provided for sealingly coupling the first vacuum sleeve to the plurality of processing chambers. A dedicated substrate manipulator is provided for each processing chamber. The second vacuum sleeve can be hermetically coupled to opposite sides of the processing chambers. The vacuum conveyor system can be modular with independent modules linked through load lock chambers. Multiple rollers can compensate for any sag of the leading edge of the substrate carried thereon.

In another embodiment, the vacuum conveyor system includes a first vacuum sleeve that surrounds a plurality of rollers that support and move the substrate through the first vacuum sleeve. The first vacuum sleeve has a plurality of ports for sealingly coupling the first vacuum sleeve to the first side of the plurality of processing chambers and a substrate manipulator disposed proximate each port. The second vacuum sleeve is disposed parallel to the first vacuum sleeve and surrounds a plurality of rollers that support and move the substrates through the second vacuum sleeve. The second vacuum sleeve has a plurality of ports for sealingly coupling the second vacuum sleeve to a second side opposite the plurality of processing chambers and a substrate manipulator disposed proximate each port.

In yet another embodiment, the vacuum processing system includes a first vacuum conveyor module and a second vacuum conveyor module. The first vacuum conveyor module includes first and second vacuum sleeves, the first and second vacuum sleeves surrounding a plurality of rollers that support and move the substrates through the first and second vacuum sleeves. The first and second vacuum sleeves have a plurality of ports for sealingly coupling the first and second vacuum sleeves to a first side and an opposite second side corresponding to each of the plurality of processing chambers. The first and second vacuum sleeves have a substrate manipulator disposed proximate each port. The connector sleeve has a plurality of rollers that couple the first end of the first vacuum sleeve to the first end of the second vacuum sleeve and support and move the substrates through the connector sleeve. A load lock couples the first vacuum conveyor module to the second vacuum conveyor module.

In another aspect of the invention, a substrate processing method is provided. In one embodiment, a substrate processing method comprises: a first vacuum sleeve having a port for sealingly coupling a first vacuum sleeve to a processing chamber, a plurality of rollers for supporting and moving substrates through a first vacuum sleeve; Providing a vacuum conveyor system having a first substrate manipulator disposed in a first vacuum sleeve adjacent to the first vacuum sleeve; Conveying the first substrate through a first vacuum sleeve to a location on the first substrate manipulator; And operating the first substrate manipulator vertically to lift the first substrate from the plurality of rollers.

The above-mentioned features of the present invention can be understood in detail, and a more detailed description of the invention briefly summarized above can be made with reference to the embodiments, some of which are shown in the accompanying drawings. However, the accompanying drawings show only typical embodiments of the invention and therefore should not be considered as limiting the scope of the invention, other equally effective embodiments may be accommodated in the invention.

1A is a top view of one embodiment of a vacuum conveyor system,

1B is a partial side view of a vacuum conveyor system,

2 is a top view of another embodiment of a vacuum conveyor system,

3A-B are partial top and side views, respectively, illustrating a vacuum conveyor system detailing one embodiment of a substrate manipulator;

4A-B are partial top and side views, respectively, illustrating a vacuum conveyor system detailing another embodiment of a substrate manipulator;

5A-B are schematic top and side views, respectively, illustrating one embodiment of a magnetic rack and pinion drive mechanism suitable for use with embodiments of the substrate manipulator;

5C is a bottom view of the magnetic pinion of the magnetic rack and pinion drive mechanism of FIGS. 5A-B;

6A is a top view of one embodiment of a roller drive system of a vacuum conveyor system;

6B is a detailed view of one embodiment of a roller of a vacuum conveyor system,

7A-C are illustrations of various embodiments of roller configurations,

8 is a top view of another embodiment of a substrate manipulator,

9 is a schematic top view of another embodiment of a vacuum conveyor system,

10 is a schematic top view of another embodiment of a vacuum conveyor system, and

11 is a schematic partial side view of an embodiment of the plurality of rollers.

For ease of understanding, like reference numerals have been used wherever possible to indicate common elements which are common in the figures. It is apparent that elements and features of one embodiment may be beneficially incorporated in other embodiments without further description.

However, the accompanying drawings merely illustrate exemplary embodiments of the invention and therefore should not be considered as limiting the scope of the invention, other equally effective embodiments may be accommodated in the invention.

Embodiments for a vacuum conveyor system are provided herein. A vacuum conveyor system, ie a sealed substrate transport system having a lower pressure than atmospheric, can be coupled to multiple processing chambers to facilitate the transport of substrates between the processing chambers while maintaining the processing pressure, ie vacuum. have. The vacuum conveyor system can be connected to any load locks or processing chambers including conventional load locks and processing chambers. The processing chambers may be chemical vapor deposition (CVD) processing chambers, physical vapor deposition (PVD) processing chambers, any processing chambers operating in a vacuum such as atomic layer deposition (ALD) processing chambers, or lower pressure than atmospheric. May be any other deposition or other processing chamber operating in the field.

1A shows a simplified top view of a vacuum conveyor system 100. Vacuum conveyor system 100 includes a vacuum sleeve 102 having one or more ports 108 and surrounding a plurality of rollers 104, and one or more substrate manipulators 106. The size of the vacuum sleeve 102 is minimized to provide the minimum capacity needed to allow passage of the substrate. The small capacity facilitates vacuum setting and maintenance within the vacuum sleeve 102 and reduces the time required to lower the pressure to the desired vacuum level. The smaller size vacuum sleeve 102 also increases the robustness of the vacuum conveyor system 100 by maintaining a smaller volume of vacuum in the vacuum sleeve 102, thereby reducing atmospheric pressure and low internal pressure outside the vacuum sleeve 102. The force arising from the pressure difference between them can be reduced.

Alternatively, and as shown in FIG. 1B, one or more dose reducers 118 may be provided to reduce the internal capacity of the vacuum sleeve 102. The dose reducer may be a solid or hollow member, for example a hollow box that occupies an internal space, ie reduces the internal capacity of the vacuum sleeve 102. In one embodiment, the capacity reducers 118 may be disposed above the plurality of rollers 104 and between adjacent ports 108. The capacity reducers 118 are sized so as not to interfere with the transport and manipulation of the substrate 190 or the substrate manipulators 106 supported on the plurality of rollers 104. Capacity reducers of any shape or size may be unobtrusive in any position within the vacuum sleeve 102 to further reduce the internal capacity of the vacuum sleeve 102 to be vented and maintained at the desired vacuum pressure. Can be located.

Although the sleeve 102 is shown to be substantially horizontally oriented, the sleeve 102 can be tilted such that the ports 108 (and associated processing chambers coupled to the sleeve 102) can be stacked vertically on each other. . In other embodiments, the sleeve 102 is substantially vertical such that the ports 108 (and associated processing chambers coupled to the sleeve 102) are vertically stacked to minimize the foot print of the system. It is contemplated that the direction may be oriented.

Referring again to FIG. 1A, the determining factors for the capacity of the vacuum sleeve 102 include factors that affect the height, length, and width of the vacuum sleeve 102. For example, the height of the vacuum sleeve 102 is constrained by the height of the plurality of rollers and the height at which the substrate must be lifted by the substrate manipulators 106. In one embodiment, the height of the vacuum sleeve is less than about 30 inches. In another embodiment, the height of the vacuum sleeve 102 is less than about 20 inches. The length of the vacuum sleeve is limited by the number of processing chambers 102 attached to the vacuum sleeve and the spacing between the processing chambers. The width of the vacuum sleeve 102 is constrained by the width of the substrate and the extra width required for lateral movement of the substrate by the substrate manipulators 106.

Vacuum sleeve 102 has one or more ports 108 for hermetically coupling vacuum sleeve 102 to one or more processing chambers. The processing chambers may be hermetically coupled to the vacuum sleeve 102 in any suitable manner, and the processing chambers may be mounted coplanar with the vacuum sleeve 102. In the embodiment shown in FIG. 1A, four processing chambers 120 ₁ , 120 ₂ , 120 ₃ , and 120 _n connected to the vacuum sleeve 102 of the vacuum conveyor system 100 through respective ports 108. ) Is shown. The port 108 is a vacuum sleeve 102 and the process chambers (120 ₁ -120 _n) corresponds to the opening (aperture), for example, a vacuum sleeve around the process chamber slit valve in order to easily carry the substrate between ( 102 is coupled to the processing chambers. Coupling the processing chambers close to the vacuum sleeve 102 minimizes the horizontal distance that the substrate must be transported and moved by the substrate manipulators 106 from the plurality of rollers 104 to the substrate support of each processing chamber. Thereby helping to minimize the capacity of the vacuum sleeve 102.

Optionally, the connector 116 may be disposed between one or more processing chambers and the vacuum sleeve 102. The connector 116 may be an adapter that facilitates coupling of the vacuum sleeve 102 with processing chambers that may not be directly coupled to the vacuum sleeve 102. Alternatively or in combination, connector 116 may be a spacer for placing the processing chamber in a desired position. For example, the connector 116 more accurately positions the substrate support disposed within the processing chamber at a desired distance from the vacuum sleeve 102 to facilitate alignment with the extended position of each substrate manipulator 106. Can be utilized to

One or more substrate manipulators 106 are dedicated to a particular processing chamber, such that one substrate manipulator 106 is coupled to each processing chamber coupled to a vacuum sleeve, eg, vacuum sleeve 102 in FIG. 1A. Are provided in close proximity to the processing chambers 120 _1-n . Substrate manipulators 106 are generally suitable for carrying substrates from the processing chamber to the processing chamber with an idle position that does not interfere with the substrates moving on the plurality of rollers 104 through the vacuum sleeve 102. Have at least one carrying position. As such, the substrate manipulators 106 are only required to have a vertical movement range and a horizontal movement range in the direction toward and away from the processing chamber, ie, in a direction perpendicular to the longitudinal direction of the vacuum sleeve 102. It becomes substantially cheaper than a vacuum transport robot with additional lateral and / or rotational degrees of freedom. It is contemplated that the position of the substrate manipulator 106 can be controllably adjusted at multiple positions within the vertical and horizontal movement ranges.

Suitable sensors and control systems (not shown) for substrate manipulators 106 may be provided and integrated with a controller 150 that controls the operation of the vacuum conveyor system 100. Sensors and control systems may detect the position of the substrate on the plurality of rollers 104 and / or on the substrate manipulators 106. When substrate manipulators 106 are used to transport the substrate between each processing chamber, sensors and control systems also determine the position of the substrate manipulators 106 and / or the position of the substrate supported thereon. Can be detected.

3A and 3B show top and side views, respectively, of one embodiment of the substrate manipulator 106. The substrate manipulator 106 generally includes a substantially flat surface for supporting a substrate overlying it and is configured to move between the plurality of rollers 104. In one embodiment, the substrate manipulator 106 includes a bracket 302 having a plurality of support fingers 304 extending horizontally therefrom. The support fingers 304 are positioned between the respective rollers in the plurality of rollers 104 and, in the retracted position, below the height of the plurality of rollers 104 such that movement of the substrate thereon is not hindered. Is placed on.

The support fingers 304 of the substrate manipulator 106 are positioned vertically by one or more vertical movement assemblies 306 coupled to the bracket 302. Vertical movement assemblies 306 may provide a range of movements that are controllable or infinitely controllable with respect to discrete positions. In one embodiment, each of the pair of vertical movement assemblies 306 includes a pair of vertically stacked actuators 340 and 342 having extended and withdrawn positions. Control of the actuators 340, 342 is withdrawn in the retracted position 334 (both the actuators are withdrawn), the transport position 332 (one actuator is extended, the other actuator is withdrawn), and the raised position ( 330 (both actuators extended). Degree extension required is formed on the wall 320 of the board floor height of 300, and a processing chamber (120 _n) that extend on the lift pins 326 of a set at the withdrawn position, the process chamber (120 _n), the slit Relates to the distance between the upper heights of the valves 322

Vertical movement assemblies 306 may include pneumatic or hydraulic actuators, screws, solenoids, any suitable actuator such as a motor, or any suitable actuator for providing the desired vertical movement of the substrate manipulator 106. . In one embodiment, the actuators 340, 342 of the vertical movement assemblies 306 are sealed pneumatic actuators. A flexible tube (not shown) may be placed into an air source (not shown) disposed outside of the vacuum sleeve 102.

A controller 308 is provided to control the vertical operation of the substrate manipulator 106. AC power from AC power source 350 is provided to controller 308 via power line 352. Control signals may be provided over an AC power line by modulating the control signals at variable frequencies. Thus, the multiple substrate manipulators 106 can be controlled independently while connected to the same power line 352 and AC power source 350. Control signals may be provided by the controller 150 (shown at the bottom of FIG. 1A).

Horizontal movement assembly 318 is provided for horizontal movement of the substrate manipulator 106, eg, movement into and out of the processing chambers. Horizontal movement assembly 318 may include any suitable mechanism, such as pneumatic actuators or hydraulic actuators, lead screws, motors, and the like. In one embodiment, the horizontal movement assembly 318 includes a stage 312 movably coupled to the plurality of horizontal rails 310. The stage 312 is coupled to the bottom of the vertical movement assemblies 306 such that movement of the stage 312 moves the bracket 302 and the supporting fingers 304. Horizontal rails 310 are disposed on the bottom of the vacuum sleeve 102 which is substantially parallel to the plurality of rollers 104 in order to facilitate horizontal movement towards and away from the processing chambers.

Extension 316 is coupled to stage 312 and protrudes through an opening formed in vacuum sleeve 102. A tube 316 is coupled to the vacuum sleeve 102 around the opening to maintain vacuum integrity. An o-ring or other sealing mechanism (not shown) may optionally be disposed between the tube 316 and the vacuum sleeve 102 to easily form a hermetic seal. The tube 316 provides a sealing area long enough for the extension 314 to move as required to control the horizontal position of the substrate manipulator 106.

The drive mechanism 370 is coupled to the extension 314 through the tube 316 to control the horizontal movement of the substrate manipulator 106. The drive mechanism 370 can also be controlled by the controller 150. In one embodiment, the drive mechanism 370 may be a magnetic drive system. An example of a magnetic drive system suitable for use in the present invention is described in US Pat. No. 6,471,459, issued October 29, 2002, entitled "Substrate Transfer Shuttle Having a Magnetic Drive" by Blonigan et al., Incorporated herein by reference. It is.

5A-B show schematic top and side views, respectively, of one embodiment of a magnetic rack and pinion drive mechanism suitable for use in embodiments for a substrate manipulator. 5C is a bottom view of the magnetic pinion of the magnetic rack and pinion drive mechanism of FIGS. 5A-B. Referring simultaneously to FIGS. 5A-C (some elements of the substrate processing system are not shown in FIGS. 5A-5C for simplicity), each magnetic drive mechanism, for example drive mechanism 590, may be configured as a substrate manipulator 106. And a wheeled magnetic pinion 592 positioned below the tube 316 including the extension 314. At least part of the extension 314 includes a magnetic rack 548 that corresponds to the magnetic pinion 592. The flange 542 can be formed on one or both sides of the rack 548 and one or more rotatable supports 582, 584 support the rack 548 and have a magnetic or coupled to the pinion 592. It may be positioned to prevent sagging due to gravity.

Magnetic pinion 592 is located below the associated tube 316 to be outside the processing environment but directly below one of the magnetic racks 548. Thus, magnetic pinion 592 is separated from magnetic rack 548 by a gap having a width w (see FIG. 5B). A portion of the tube 316 disposed between the magnetic rack 548 and the magnetic pinion 592 is formed of a material having low magnetic permeability, such as aluminum.

Each magnetic pinion 592 may be coupled to the motor 594 by a drive shaft 596. The axis of rotation of the drive shaft 596 and the magnetic pinion 592 (shown by dashed line 98) is generally perpendicular to the longitudinal size of the magnetic rack 548, ie perpendicular to the travel direction of the substrate manipulator 106.

Each magnetic pinion 592 includes a plurality of alternating polarized interleaved pinion magnets 500a and 500b. Each pinion magnet is aligned in a straight line such that each magnetic axis passes substantially through the rotation axis 598 of the magnetic pinion 592. Similarly, each rack 548 includes a plurality of alternately interleaved rack magnets 510a, 510b. The magnetic axis of each rack magnet is aligned substantially perpendicular to the axis of rotation of the pinion, for example along the vertical axis 524 if the axis of rotation is substantially horizontal. The rack magnets 510a, 510b may be recessed so that they are coplanar with the bottom surface of the rack 548, and the pinion magnets are recessed so that they are coplanar with the outer edge of the pinion 592. Can be.

Each magnet of rack 548 and pinion 592 is a substantially rectangular plate that is magnetized so that one side of the plate is an "N" pole and the opposite side of the plate is an "S" pole. For example, the pinion magnets 500a face the N poles at the outer faces 502 of the plates and the S poles at the inner faces 504 of the plates. On the other hand, the pinion magnets 500b face the north pole at the inner faces 504 of the plate and the south poles at the outer faces 502 of the plates. Similarly, each rack magnet 510a faces the north pole at the top surface 514 of the plate and toward the south pole at the bottom surface 512 of the plate. In contrast, each rack magnet 510a faces the north pole at the bottom surface 512 of the plate and toward the south pole at the top surface 514 of the plate.

As shown in FIG. 5A, the major axis (shown by dashed line 508) of each rack magnet plate may be arranged such that the rotational axis 598 and the major axis 508 are the so-called “helical” angle α. have. As shown in FIG. 5C, the pinion magnet plates may be arranged such that between the major axis 508 ′ of the pinion magnets and the rotation axis 598 of the pinion 592 are the same helical angle α ′. The spiral angle can be up to about 45 degrees. Alternatively, the major axis of each magnet may be directed generally parallel to the axis of rotation 98 of the pinion (α = 0 degrees). Thus, the helical angle may be between about 0 degrees and 45 degrees. By positioning the magnets at a helical angle, the fluctuations in the magnetic suction force between the rack and pinion magnets are reduced as their magnetic fields are engaged and released, providing a smoother linear movement of the substrate manipulator 106. In either case, at the closest point of approach, the pinion magnet will be substantially coplanar with its associated rack magnet.

The pinion magnets 500a and 500b are separated by a pitch P, which is equal to the pitch P 'of the rack magnets 510a and 510b. Pitches P and P 'may be about 1/4 inch. The specific pitch is such that the strength of the magnets, the weight of the substrate manipulator and any substrate to be supported thereon, the gap width W between the rack and pinion, and the substrate manipulator will be moved between the sleeve 102 and each processing chamber. It can be selected based on the desired speed.

As best shown in Fig. 5B, the rack and pinion magnets are coupled as their opposite poles are fixed to each other (shown by magnetic force lines 518). If the pinion 592 is rotating, each pinion magnet, such as the pinion magnet 500a, will move toward the rack 548, so that the closest magnet of opposite polarity, for example, the rack magnet ( 510a) magnetically. Additionally, adjacent pinion magnets 500b (of opposite polarity to pinion magnet 500a) will magnetically engage with adjacent rack magnets 510b. Thus, as the pinion 592 rotates, for example, in the direction shown by arrow 506, the substrate manipulator 106 will be driven horizontally, ie in the direction indicated by arrow 516. Conversely, if the pinion 592 rotates in the opposite direction of the arrow 506, the substrate manipulator 106 will be driven in the opposite direction of the arrow 516.

The alternating polarity of the magnets prevents the magnetic coupling from deteriorating between the adjacent magnets of the rack and pinion. In addition, since the engagement between the rack and the pinion is magnetic, some give in the engagement is provided, so that the movement of the rack is made substantially without jittering or mechanical impact. In addition, since there is no direct physical connection or rotary feedthrough between the rack and the pinion, the risk of contamination from the drive mechanism is reduced. Specifically, the process chambers and load lock chambers are not contaminated because the motor and pinion are located outside the processing environment of the processing chambers (ie, the sealed environment of the processing chambers and load lock chambers attached to the vacuum conveyor system). Do not.

As shown in FIG. 5C, each drive mechanism may include an encoder 520 that provides input to a control system 522, eg, a general-purpose programmable digital computer, to direct rotation of an associated drive shaft. The control system 522 may be controlled by the controller 150 shown in FIG. 1A, or alternatively may be part of the controller 150.

Referring to FIGS. 3A-B, during operation, the substrate manipulator 106 is initially in an idle position 354, with fingers 304 disposed between and below the rollers 104. To remove any substrate that may be located in the processing chamber 120 _n , the controller raises the vertical movement assemblies 306 to raise the fingers 304 to the transport position 332. The horizontal drive system 370 uses the extension 314 of the horizontal movement assembly 318 to move the stage 312 therein towards the processing chamber 120 _n . The substrate 300 is lifted by the lift pins 326 onto the substrate support 324 disposed inside the processing chamber 120 _n . The fingers 304 of the substrate manipulator 106 in the transport position 332 are at a height such that the fingers 304 pass between the bottom surface of the substrate 300 and the top surface of the substrate support 324. do. After moving under the substrate 300, the substrate manipulator 106 is further operated up to the raised position 330, which lifts the substrate 300 away from the lift pins 326. The substrate manipulator 106 can now withdraw the substrate 300 and an idle position 334 that will place the substrate 300 on the surface of the rollers 104 once the processing chamber 120 _n is empty. Can be lowered again. The substrate may be placed on the substrate support 324 of the processing chamber 120 _n by reversing the above steps.

It is contemplated that other ranges of movement may be used to transport substrates into and out of the processing chambers. For example, where the substrate lift pins 326 can be controlled for multiple extension positions, the substrate can be moved by raising or lowering the lift pins 326 rather than changing the height of the substrate manipulator 106. 106) may be raised onto or away from it. As such, certain embodiments of the substrate manipulator 106 include two vertical positions, and an idle position below the plurality of rollers 104 and a transport position suitable for entry into and discharge from the processing chamber 120 _n . It can have

4A and 4B show top and side views, respectively, of another embodiment of a substrate manipulator 106 having a pair of nested fingers that operate independently to move the substrates in and out of the processing chamber to increase throughput. The substrate manipulator 106 described with respect to FIGS. 4A-B is similar to the substrate manipulator 106 described with respect to FIGS. 3A-B except that it is required to allow independent control and movement for the nested fingers. . Specifically, the substrate manipulator described with respect to FIGS. 3A-B and 4A-B may have the same range of movement, control mechanisms, and general configuration.

In the embodiment shown in FIGS. 4A-B, the substrate manipulator 106 includes an outer substrate manipulator 490 and an inner substrate manipulator 492. The outer and inner substrate manipulators 490 and 492 can be controlled independently and are configured to allow the desired range of movement of the substrate manipulators 490 and 492 without collision. External and internal substrate manipulators 490 and 492 are similar except as noted below.

The outer substrate manipulator 490 includes an outer bracket 402 having a plurality of outer fingers 404 extending horizontally therefrom. The outer bracket 402 is held in a vertical position by a pair of vertical movement assemblies 406. The vertical movement assemblies 406 may optionally be configured to facilitate horizontal movement when the substrate is disposed on the plurality of rollers 104 between the outer substrate manipulators 490 and the processing chamber 120 _n . It can be spaced wider than its length. Vertical movement assemblies 406 may include a pair of stacked vertical actuators 440, 442. Vertical movement assemblies 406 (or vertical actuators 440, 442) may be controlled by controller 408. Controller 408 is coupled to AC power source 450 by power line 452 and controls external substrate manipulator 490 as described above with respect to FIGS. 3A-B.

Vertical movement assemblies 406 are coupled to horizontal movement assembly 418. Horizontal movement assembly 418 includes a stage 412 movably coupled to a plurality of horizontal rails 410, wherein the plurality of horizontal rails 410 are walls 420 of the processing chamber 120 _n . In order to facilitate the movement of the external substrate manipulator 490 into and out of the slit valve 422 formed in the). An extension 414 is coupled to the stage 412 and extends horizontally through the opening of the vacuum sleeve 102 down there towards the processing chamber 120 _n . Tube 416 is provided to maintain the vacuum integrity of vacuum sleeve 102. Horizontal drive system 470 is coupled to extension 414 to provide horizontal movement of external substrate manipulator 490. Horizontal drive system 470 may be the same as described with respect to FIGS. 3A-B and FIG. AC.

The inner substrate manipulator 492 includes an inner bracket 482 with inner fingers 484 extending horizontally therefrom. Bracket 482 may be held in place designated by a pair of vertical movement assemblies 486. Vertical movement assemblies 486 may include a pair of stacked vertical actuators (obviously not shown). Vertical movement assemblies 486 (or stacked vertical actuators) are controlled by controller 488. Controller 488 is coupled to AC power source 450 via power line 452. Alternatively, controller 408 can independently control both internal and external substrate manipulators 490 and 492. Thus, independent control of the outer substrate manipulator 490 and the inner substrate manipulator 492 can be provided by using the same power line and power source. The brackets 482 and the fingers 484 of the inner substrate manipulator 492 are provided with brackets 402 to minimize the width of the vacuum sleeve 102 required to house the substrate manipulators 490 and 492 and to save space. ) And under the fingers 404 of the external substrate manipulator 490.

Although not explicitly shown, the horizontal movement of the inner substrate manipulator 492 on the horizontal movement assembly 498 with multiple horizontal rails 480 is controlled in the same manner as the outer substrate manipulator 490. A plurality of horizontal rails 480 for supporting the inner substrate manipulator 492 is provided located inside the plurality of horizontal rails 410, and the plurality of horizontal rails 410 are provided for the outer substrate manipulator 490. Support to facilitate independent movement and control of the inner and outer substrate manipulators 490 and 492.

In operation, the substrates are transported to the processing chamber (120 _n), the substrate (400A) outside of the substrate manipulator (490) to the processing chamber (120 _n), a more efficient substrate by increasing the in the carrying position to lift up a from the inside the processing May exit from the chamber 120 _n . When the external substrate manipulator 490 is picking up the substrate 400A, the substrate 400B reaches the front of the processing chamber 120 _n on the plurality of rollers 104. The internal substrate manipulator 492 then raises the substrate 400B and moves it into the processing chamber 120 _n . This can be done simultaneously with the external substrate manipulator 490 pulling the substrate 400A out of the processing chamber 120 _n . Next the substrate manipulator 492 may then be withdrawn from the process chamber (120 _n) which lower the substrate (400B) over the lift pins 426 of the processing chamber (120 _n). The inner substrate manipulator 492 may then be lowered into the idle position below the plurality of rollers 104, which causes the outer substrate manipulator 490 to lower the substrate 400A over the plurality of rollers 104 to complete the transport. To help.

Although described with respect to a vacuum conveyor system, it should be considered that the substrate manipulator described in FIGS. 3A-B and the nested substrate manipulator described in FIGS. 4A-B can be used in other systems that require substrate transfer and transport.

Referring to FIG. 1A, a number of rollers 104 facilitate the movement of substrates through the vacuum sleeve 102. In one embodiment, the plurality of rollers 104 are driven to control the position of the substrate disposed thereon. The multiple rollers 104 can be driven and controlled by any suitable means and can be "gang" driven (ie all driven together), driven in independently controllable groups or independently Can be driven.

For example, a of FIG. 6 shows one embodiment of a plurality of rollers 104 and a drive system therefor. In one embodiment, the plurality of rollers 104 includes a plurality of rollers 624 coupled between bearings 604, 606 disposed at either end of the roller 624. The bearing 606 is coupled to a stanchion 608 located on the bottom of the vacuum sleeve 102. The bearing 604 is coupled to a drive rail 602 disposed inside the vacuum sleeve 102. A pulley 612 is coupled to each of the rollers 624 and interfaces with a belt 610 that controls the movement of the rollers 624. Pulleys 612 may also be provided between the rollers 624 to maintain a suitable interface between the pulleys 612 and the belt 610. One or more of the pulleys 612 may have features (eg, on the belt) formed on the belt to enhance traction between the pulley 612 and the belt 610 and to prevent slipping therebetween. And may have a portion, such as grooves or notches 614, to interface with square teeth or V-notches formed therein. The rollers 624 are also controlled by providing a motor 630 to control the movement of the belt 610. Motor 630 may be coupled to controller 150 (shown in FIG. 1A). Each of the rollers 624 may be grouped to provide independent control over substrates moving within designated areas of the conveyor system.

The rollers 624 may generally comprise a solid or hollow member. In addition, the width of the rollers 624 may be wide enough to support the substrate thereon by the individual rollers 624. Alternatively, the substrate may be supported at multiple points along the width of the substrate. For example, individual rollers 624 may be “scalloped” or shaped (not shown) or smaller disposed on axis 620, as shown in detail in FIG. 6B. Individual rollers 622 may be used to support the substrate at multiple spaced apart locations, thereby reducing the area of surface contact between the multiple rollers 104 and the substrate. The reduced surface contact area reduces things such as damage to the substrate or particle generation caused by the contact between the substrate and the multiple rollers 104.

The rollers 104 are generally spaced close enough to each other to provide a suitable support for the substrates in operation to prevent damage or deformation of the substrate. One problem that may arise from deformation of the substrate is that the leading edge of the substrate may be deflected down due to gravity and potentially damage the substrate and / or rollers by contacting subsequent rollers of the vacuum conveyor system 100. I can give it. For example, the leading edge of the substrate can be cut or broken in strong contact with subsequent rollers. In addition, particles that occur due to damage to the substrate or by breaking the substrate may further damage the substrate. The effect can be exacerbated by the high processing temperature required in certain treatments, which can cause the substrate-in particular the glass substrate-to soften and further deflect down.

7A-7C illustrate embodiments showing various alignments of multiple rollers 104. In FIG. 7A, the plurality of rollers 104 are all aligned along a horizontal plane and rotate about an axis 704A, such that the substrate 700 is positioned flat on the surface of the plurality of rollers 104. do. As indicated by the arrow, as the substrate 700 moves from left to right, the leading edge 702 of the substrate 700 extends from the previous roller 710A and as the substrate 700 continues to move forward. The leading edge 702 is not supported until it reaches the roller 712A. For applications where the substrate is not deflectably detectable, the arrangement of multiple rollers 104 shown in FIG. 7A may be sufficient. However, if the leading edge 702 of the substrate 700 is deflected down while not supported between the rollers 710A, 712A, the leading edge 702 may contact the roller 712A and potentially the substrate May cause damage to (700).

Alternatively, the multiple rollers may support any potential sag at the leading edge of the substrate by supporting the substrate in such a way as to position the leading edge of the substrate over any subsequent rollers as the substrate advances along the multiple rollers. It can be configured to support the substrate in a manner that compensates for it. For example, in one embodiment, the plurality of rollers 104 may be arranged as shown in FIG. 7B, where the plurality of rollers 104 include eccentric or cam-shaped rollers. Eccentric rollers support the substrate 700 at multiple heights due to the non-circular profile of the rollers. The eccentric rollers rotate about the axis 706B and can be aligned in a straight line with respect to each other. Alternatively, the eccentric rollers may be rotated and arranged in different phases with respect to each other such that a plurality of support heights are provided under a given substrate being supported by a subset of the plurality of rollers disposed below the substrate.

For example, as shown in FIG. 7B, the eccentric rollers may be arranged alternately 180 degrees out of phase, such that all other rollers (eg, rollers 706B, 710B) are relative to each other. They are aligned in a straight line and in phase 180 degrees different from adjacent rollers (eg, 708B, 712B). The eccentric shape of the rollers is defined by the substrate 700 between a maximum height when the first support height, for example eccentricity, points upwards, and a minimum height when a second support height, eg, eccentricity points downwards. Provide multiple support heights for the. As the substrate 700 moves from left to right, the leading edge 702 will be raised by the roller 710B, thereby with respect to the leading edge 702 in the unsupported area between the rollers 710B and 712B. It can compensate for any downward deflections that may occur. As such, when the substrate 700 comes into contact with the roller 712B, the leading edge 702 will not be in strong contact with the roller 712B. The shape and amount of eccentricity of the roller 704B can be controlled to provide smooth conveyance of the substrate 700.

Additionally, the position of the substrate 700 when initially placed on the rollers 704B can be controlled with the relative rotational position of the rollers 704B, thus leading edge 702 of the substrate 700. Will always extend out of the high portion of the roller as it exits and moves toward the adjacent roller as shown in FIG. 7B. Alternatively, and as shown in FIG. 7C, multiple rollers 104 may be mounted on offset axis 704C to provide the same up and down relative to substrate 700 as described above with respect to FIG. 7B. It may include cylindrical rollers mounted to and disposed eccentrically in an alternating manner.

It should be considered that other orientations of the eccentric rollers may also be suitably used to prevent the leading edge of the substrate from contacting subsequent rollers as the substrate moves through multiple rollers. For example, FIG. 7D shows a number of rollers 104 similar to that described with respect to FIG. 7B above. However, in this embodiment, the eccentric rollers are in different phases sequentially with respect to each other by an exemplary 90 degree increment in the counterclockwise direction. Roller 706D is shown eccentrically facing down. Each subsequent roller (each of the rollers 708D, 710D, 712D) has an eccentric extending 90 degrees counterclockwise from the previous roller.

The amount of offset of the eccentricity of the rollers, ie the degree of rotation in different phases, can be set at a desired angle depending on the distance of the rollers, the amount of eccentricity of the rollers, and the amount of downward deflection of the substrate. Rather than being limited to 180 and 90 degrees, the amount of other phases of the rollers should be considered to be any angle suitable for preventing the leading edge of the substrate from being in strong contact with the roller.

Further, it should be considered that the shape of the eccentric roller is not limited to the individual protrusions as shown in Figs. 7B and 7D. For example, a roller with any desired profile with individual protrusions or multiple protrusions can be used to control the support heights of the substrate supported thereon as the roller rotates. In one exemplary embodiment, the plurality of rollers 104 may include elliptical rollers 706E, 708E, 710E, 712E. The elliptical shape of the rollers can be used to control the support height of the substrate 700 and in particular the support height of the leading edge 702 of the substrate as the substrate moves from the previous roller 710E to the subsequent roller 712E, for example. have.

Further, other configurations of the multiple rollers 104 may compensate for any warp against the leading edge of the substrate, such as configurations that provide a separate mechanism to support the leading edge of the substrate or control the height of the rollers. It should be considered that it can be used for For example, FIG. 11 shows a schematic partial side view of one embodiment of a plurality of rollers 114. In one embodiment, each of the plurality of rollers 114 may be coupled to an actuator 1102. The actuators 1102 may be any suitable actuator or mechanism for controlling the support height of the multiple rollers 104, such as pneumatic actuators or hydraulic actuators, motors, screws, and the like. . Each actuator 1102 may be individually controlled to selectively and dynamically adjust the position of any of the plurality of rollers 104 relative to one another as the substrate moves the plurality of rollers 104. Can be. For example, in the embodiment shown in FIG. 11, the leading edge 702 of the substrate 704 is supported by a roller 1110 raised at least relative to the subsequent roller 1112. Alternatively or in combination, subsequent rollers in the travel direction, for example roller 1112, may be lowered as shown virtually to further facilitate smooth conveyance of leading edge 702 to roller 1112. have. Although shown integrally in a vacuum conveyor system in FIGS. 7B-E and 11, the described roller configurations can be used in other transport and processing systems where compensation for any deflection to the leading edge of the substrate is required. This should be considered.

Referring again to FIG. 1A, the load lock 110 is coupled with the vacuum sleeve 102 at each of the first end 112 and the second end 114 of the vacuum sleeve 102. A pressure control system (not shown), including pumps, ports, valves, meters, and the like, can be coupled to the vacuum sleeve 102 to control the pressure in the vacuum sleeve 102 to a desired level. have. For example, the pressure of the vacuum sleeve 102 is maintained at or close to the pressure maintained inside the processing chambers to minimize pressure variations as the substrates are transported between the vacuum sleeve 102 and the processing chambers. Treatment by any particles that can be made into the processing chamber, thereby saving the time required to readjust the processing chamber pressure to an appropriate pressure level and due to an increase in the processing chamber pressure. Contamination of the chamber can be minimized.

A controller 150 is provided to facilitate control and integration of the vacuum conveyor system 100. The controller 150 typically includes a central control unit (CPU), memory and support circuits (not shown). Controller 150 may be coupled to various components of vacuum conveyor system 100 to control the movement and / or processing of the substrate. For example, controller 150 may control multiple rollers 104, substrate manipulators 106, pressure control systems, and the like. The controller 150 may be coupled to or the same as a controller provided for controlling other components such as processing chambers and / or any load locks coupled to the vacuum conveyor system 100.

2 illustrates another embodiment of a vacuum conveyor system 200. The vacuum conveyor system 200 includes the vacuum conveyor system 100 described above with respect to FIG. 1A except that the vacuum conveyor system 200 has two vacuum sleeves 102 extending in parallel with respect to each other. similar. Two vacuum sleeves 102 have one or more processing chambers 220 disposed therebetween and sealedly coupled to the vacuum sleeves 102 by respective connectors 116.

The vacuum conveyor system 200 with two vacuum sleeves 102 allows for increased throughput easily. The two vacuum sleeves 102 also allow for easy maintenance in the event of a failure of one of the vacuum sleeves. Optionally, the vacuum sleeves 102 can be selectively separated from one another, for example by a valve or other suitable mechanism, to allow processing to continue through the operable vacuum sleeve without maintaining the vacuum of the inoperative vacuum sleeve. . In addition, maintenance or inspection of the inoperative vacuum sleeve may be performed while continuing processing of the substrates through the operable vacuum sleeve.

The processing chambers 220 used by the vacuum conveyor system 200 have a pass-through design, ie the processing chambers have slit valves located opposite the processing chamber 220. Any substrate enters through one side of the processing chamber 220 and is discharged through the opposite side of the processing chamber 220. As such, substrate manipulators 106 are provided on both sides of the processing chamber 220 to facilitate movement of the substrate into and out of the processing chamber 200 through either end. In one embodiment, the substrate manipulators 106 may be the substrate manipulators described herein with respect to FIGS. 3A-B. Alternatively, substrate manipulators 106 may include nested substrate manipulators as described with respect to FIGS. 4A-B. As mentioned above, the conveyor system 200 can supply substrates to the processing chambers 220 in a substantially horizontal, inclined or substantially vertical direction.

Connector sleeve 202 is coupled between at least one end of vacuum sleeves 102 to easily move substrates from one vacuum sleeve 102 to another without passing through processing chambers 220. Connector sleeve 202 includes a number of rollers 204 to easily move the substrate through connector sleeve 202. Multiple rollers 204 may be configured similarly to multiple rollers 104. In one embodiment, the plurality of rollers 204 are configured similarly to the plurality of rollers described in Figures 6A-B.

In the embodiment shown in FIG. 2, two connector sleeves 202 are coupled between the vacuum sleeves 102 via one end of the connector sleeve 202. Although any angle is contemplated, the connector sleeves 202 are substantially vertically coupled to the vacuum sleeves 102 for ease of manufacture and operation. In order to easily move the substrate between the rollers 104 of the vacuum sleeves 102 and the rollers 204 of the connector sleeve 202, the substrate manipulator 206 is provided with the vacuum sleeves 102 and the connector sleeves. At least one of the interfaces between 202 is provided. In the embodiment shown in FIG. 2, one substrate manipulator 206 is provided at each interface between the vacuum sleeves 102 and the connector sleeves 202, for example each of the vacuum conveyor system 200. Is provided in the corner of the.

FIG. 8 illustrates a number of rollers 104 included in the vacuum sleeve 102 and a plurality of connector sleeves 202 included in the vacuum sleeve system 102 as seen in the corners of the vacuum conveyor system 200 shown in FIG. 2. One embodiment of a substrate manipulator 206 for transporting substrates between rollers 204 is shown. In one embodiment, the substrate manipulator 806 is constructed and positioned in the vacuum sleeve 102 similar to the substrate manipulator 106 described with respect to FIGS. 3A and 3B. However, instead of extending and withdrawing the substrate into the processing chamber, the substrate manipulator 806 moves the substrate over a plurality of lift pins 810 provided between the plurality of rollers 204 and the connector sleeve 202. Is extended and withdrawn.

During operation, as the substrate passes over the substrate manipulator 806 during the retracted position 820, the substrate manipulator 806 may rise to lift the substrate from the plurality of rollers 104 and the plurality of rollers. And move to an extended position 822 disposed beyond the lifters 204 and lift pins 810. From the extended position 822, the substrate manipulator 806 can then lower the substrate over the lift pins 810 and return to the withdrawn position 820. Alternatively, the lift pins can be configured to extend to a height that allows the substrate to be easily lifted from the substrate manipulator 806 and then advances to the withdrawn position 820. Lift pins 810 can lower the substrate onto multiple rollers 204 and then move the substrate to the next desired destination.

1 and 2, the vacuum conveyor system described herein is scalable and can be coupled to as few or as many processing chambers as required for specific processing requirements. For example, the length of the vacuum sleeves 102 and the number of ports 108 provided can be tailored for a particular application. In addition, the vacuum conveyor system can be segmented to be easily extended. For example, one segment may be the width of an individual processing chamber. Multiple segments can be hermetically coupled together as desired to form a vacuum conveyor system of desired length to provide a desired number of processing chambers.

Alternatively, when a known number of processing chambers are used in combination to perform standard processes on the substrates, the segments may provide the amount of work required to seal the number of components, the processing chambers and the leaks, etc. to one another. It can be larger to reduce, thereby making the vacuum conveyor system simpler and more robust. For example, in applications where a cluster of five CVD processing chambers is typically provided to perform substrate processing, one segment width of the vacuum conveyor system of the vacuum sleeve 102 is the sum of five single chamber width segments. There may be five process chambers than one individual.

In addition, the vacuum conveyor system may be modularized into separate sections that use different treatments or operate at different pressures. For example, the first module may include a first group of processing chambers and the second module may include a second group of processing chambers. The first and second group of processing chambers may be running processes with different operating pressures. For example, the first group of processing chambers may include CVD processing chambers, and the second group of processing chambers may include PVD processing chambers. The two modules can be configured independently, as in any of the embodiments of the vacuum conveyor systems described herein, and have a load lock to enable transport between the modules without exposing the substrate or vacuum conveyor system modules to atmospheric pressure. Can be combined through.

For example, FIG. 9 shows a vacuum conveyor system 900 having a first vacuum conveyor module 950 ₁ coupled to a second vacuum conveyor module 950 _n by a load lock chamber 110. Additional load lock chambers 110 are provided at any end of the first and second vacuum conveyor modules 950 ₁ , 950 _n to provide an entry into and exit from the vacuum conveyor system 900. . The first vacuum conveyor module 950 ₁ includes a vacuum sleeve 902 having rollers 904 and substrate manipulators 906 contained therein. The connector 908 is provided to interface with the one or more processing chambers (920 ₁ to 920 _n). A dedicated substrate manipulator 906 is provided for each processing chamber. The second vacuum conveyor module 950 _n similarly includes a vacuum sleeve 912 with rollers 914 and substrate manipulators 916 disposed therein, and including one or more processing chambers 930 ₁ through ₁ . 930 _n ). A dedicated substrate manipulator 916 is provided for each processing chamber 930 _n . Vacuum sleeves, multiple rollers, and substrate manipulators may include any of the embodiments described herein, and may also include all required to operate a vacuum conveyor system, such as vacuum pumps, controllers, and the like. It may further include other components.

The first and second vacuum conveyor modules 950 ₁ , 950 _n may be sealed from each other through the load lock 110 and maintained at different vacuum levels. For example, the process chambers (920 ₁ to 920 _n) when performing a process using a vacuum of different levels than are the process chambers (930 _1, 930 _n), the first and second vacuum conveyor module (950 ₁ , 950 _n ) may be maintained at each vacuum level correlated to the vacuum level of specific processing chambers connected to the vacuum conveyor module. For example, CVD processes generally operate at higher pressures than PVD processing chambers. As such, processing chambers 920 ₁ through 920 _n may be clusters of CVD processing chambers separated by load lock 100 from processing chambers 930 ₁ through 930 _n , which may be clusters of PVD processing chambers. . In the above example, held in a vacuum conveyor module (950 _1), the pressure is the CVD process chamber (920 ₁ to 920 _n) and to a pressure substantially equal to and, while the vacuum conveyor module (950 _n) to be held in held in the pressure may be substantially equal to a lower pressure to be maintained and in PVD processing chambers (930 ₁ to 930 _n).

10 illustrates one particular embodiment of a system of a heterogeneous CVD / PVD processing system 1000. System 1000 generally includes a first vacuum conveyor module 1010 coupled to a second vacuum conveyor module 1020 via a load lock 110. Further load locks 110 are provided at opposite ends of the vacuum conveyor modules 1010, 1020 to provide an inlet to and exit from the vacuum conveyor modules 1010, 1020. In the embodiment shown in FIG. 10, the atmospheric pressure conveyor 1002 is coupled to the first module 1010 through a load lock 110. Atmospheric conveyor 1002 allows coupling to processing chambers that do not operate in a vacuum. For example, in one embodiment, multiple processing chambers 1008 are coupled to atmospheric conveyor 1002 to process substrates prior to entering vacuum conveyor system 1000. Process chambers 1008 may be, for example, pre-deposition cleaning chambers. In one embodiment, each of the pre-deposit cleaning chambers is subjected to a 6-second process that has an 8-second delivery time and yields a 6-8 second total actual cycle (TACT). The 6-8 second TACT corresponds to 52 substrates per hour operated by each processing chamber 1008. In the embodiment shown in FIG. 10, three pre-deposition cleaning chambers 1008 may be provided and run in parallel to provide a total substrate throughput of 156 substrates per hour.

As the processing for each of the substrates is completed, it is conveyed through the load lock 110 to the first vacuum conveyor module 1010 maintained at the first vacuum pressure. The first vacuum conveyor module 1010 includes a vacuum conveyor 1012 and a plurality of processing chambers 1014. The vacuum conveyor 1012 is similar to the vacuum conveyor systems described in the various embodiments described in detail above. In the embodiment shown in FIG. 10, 20 processing chambers 1014 are disposed inside the first vacuum conveyor module 1010. In one embodiment, the processing chambers 1014 are CVD processing chambers. CVD processing chambers may be configured to perform various processes, such as deposition of a gate silicon nitride layer, an amorphous silicon layer, and a doped silicon layer. Each of the above processes may be performed in the same or different processing chamber 1014 at six substrate throughputs per hour and per processing chamber. By multiplying by 20 processing chambers, the total throughput of the first vacuum conveyor module 1010 is equivalent to 120 substrates per hour.

Once processing for the substrates in the first vacuum conveyor module 1010 is completed, the substrates proceed through the vacuum conveyor 1012 to the load lock 110 and into the second vacuum conveyor module 1020. The second vacuum conveyor module 1020 includes a vacuum conveyor 1022 and a plurality of processing chambers 1024 as described above. In one embodiment, six processing chambers 1024 are provided. The processing chambers 1024 of the second module may be PVD processing chambers operating at a higher vacuum level than the CVD processing chambers of the first module. As such, the vacuum conveyor 1022 of the second vacuum conveyor module 1020 is maintained at a higher level of vacuum than the vacuum conveyor 1012 of the first conveyor module 1010.

PVD processing chambers 1024 may be arranged to perform various vacuum processes on the substrate. In one embodiment, two of the processing chambers 1024 are configured to deposit a molybdenum layer on the substrate. For example, a 1000-angstrom thick layer of molybdenum may be deposited on the substrate at a rate of about 2,500 angstroms per minute. This treatment typically has a 24 second processing time, 10 seconds of overhead, and 8 seconds of transport time, yielding a 42 second TACT. The 42 second TACT corresponds to 85 substrates per hour in each processing chamber, yielding a total substrate throughput of 170 substrates per hour for the two processing chambers.

Three of the processing chambers 1024 may be configured to deposit an aluminum layer or another metal layer on the substrate. For example, an aluminum layer of 3,000 angstroms may be deposited on the substrate at a rate of about 3,000 angstroms per minute. This treatment typically has a processing time of 60 seconds, an overhead of 10 seconds, and a transport time of 8 seconds, yielding a total of 78 seconds of TACT. The TACT of 78 seconds corresponds to 48 substrates per hour and per processing chamber, which yields a total throughput of 138 substrates per hour for the three processing chambers.

Finally, the processing chamber 1024 may be configured to deposit a molybdenum layer on the substrate. For example, a layer of 500 angstroms of molybdenum can be deposited on the substrate at a rate of about 2,500 angstroms per minute. This process generally has a processing time of 12 seconds, an overhead of 10 seconds, and a transport time of 8 seconds, yielding a TACT of 30 seconds. TACT of 30 seconds corresponds to a throughput of about 120 substrates per hour.

As the process of the PVD processes in the second vacuum conveyor module 1020 is completed, the substrate during processing exits the module 1020 and proceeds through the load lock 110 to the atmospheric conveyor 1004, the atmospheric conveyor 1004. In), the substrate is moved for continuous processing. Since the total throughput is related to the slowest processing time, the heterogeneous CVD / PVD processing system 1000 described above has a total throughput of about 120 substrates per hour.

Thus, embodiments of a vacuum conveyor system have been provided. The vacuum conveyor system may use conventional vacuum processing chambers, be scalable, segmentable, and / or modular. The vacuum conveyor system has a smaller capacity to facilitate vacuum pressure maintenance and includes dedicated substrate manipulators for the respective processing chambers. Modular vacuum conveyor systems can be coupled by load locks and are maintained independently at vacuum pressures corresponding to the processing chambers attached to each module. The vacuum conveyor system includes a roller drive system that controls the movement of substrates through the system. The roller drive system may be configured to compensate for the bending of the leading edge of the substrate in areas not supported between the rollers.

Although the above embodiments primarily refer to linear conveyor systems, it should be considered that the vacuum conveyor systems may be parallel to axes that are nonlinearly linked to or offset from each other. For example, the vacuum conveyor system or modules may be connected vertically or connected to each other by a vacuum sleeve that provides different angle alignments, including "U" shaped configurations. Also, the conveyor system can supply substrates to the processing chambers in a substantially horizontal orientation, inclined or substantially vertical orientation. In addition, although the above embodiments have been described primarily with respect to glass substrates, the vacuum conveyor system described herein may be useful for transporting and processing other substrates, for example polymer substrates or semiconductor substrates that undergo sequential vacuum treatments. Presence should be considered.

While the foregoing has been directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope of the invention is set forth in the claims that follow. Is determined by.

Claims (114)

delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete As a substrate processing method, (a) providing a conveyor system having a plurality of substrate supports for supporting and moving substrates, a first substrate manipulator and a second substrate manipulator; (b) conveying a first substrate to a position above the first substrate manipulator; And (c) operating the first substrate manipulator vertically to lift the first substrate from the plurality of substrate supports. (d) retrieving a second substrate disposed on the substrate support of the first chamber to the second substrate manipulator; (e) retracting the second substrate manipulator to position the second substrate on the plurality of substrate supports; And (f) positioning the first substrate on the substrate support of the first chamber and withdrawing the first substrate manipulator Substrate processing method comprising a. delete delete The method of claim 29, wherein step (d) (e1) vertically operating the second substrate manipulator to a position above the plurality of substrate supports; And (e2) operating the second substrate manipulator horizontally to move the plurality of fingers of the second substrate manipulator into the processing chamber Substrate processing method further comprising. delete delete As a substrate operating device, A conveyor, the conveyor arranged to carry a substrate overlying the conveyor in at least a first direction; A substrate manipulator that is capable of moving between an idle position disposed below an elevation of a substrate support of the conveyor, a first conveyance position disposed above the conveyor, and a second conveyance position located beside the first conveyance position; A first vertical movement assembly manipulated to move the substrate manipulator vertically between the idle position and the first conveyance position; And A first horizontal moving assembly manipulated to move the substrate manipulator horizontally between the first and second transport positions Substrate operation apparatus comprising a. The method of claim 35, wherein the substrate manipulator, First bracket; And A plurality of first fingers having a substrate support surface and extending laterally from the first bracket Further comprising at least two of the plurality of fingers separated by substrate supports of the conveyor defining a height of the substrate supports of the conveyor. delete delete delete delete delete delete 36. The method of claim 35, The substrate manipulator includes an inner substrate manipulator and an external substrate manipulator that can be independently controlled. delete delete delete delete delete delete delete delete delete As a substrate operating device, A plurality of rollers for supporting and moving the substrates; And Board Manipulator Including, the substrate manipulator, First bracket; A plurality of first fingers extending horizontally from the first bracket and having a substrate support surface, the plurality of first fingers disposed between adjacent rollers of the plurality of rollers; And Horizontal moving assembly Wherein the substrate manipulator includes an idle position in which the plurality of first fingers are disposed below the support height of the plurality of rollers, and a transport position in which the plurality of first fingers are disposed above the plurality of rollers. Moveable, wherein the horizontal moving assembly is configured to move the substrate manipulator horizontally in the transport position. delete delete delete delete delete 54. The method of claim 53, The substrate manipulator further includes an inner substrate manipulator and an external substrate manipulator that can be independently controlled. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete As a substrate transport apparatus, Including a plurality of rollers, The plurality of rollers support and transport the substrate on top of the plurality of rollers, the plurality of rollers being manipulated to simultaneously support the substrate on top of the rollers at multiple heights, And a leading edge of the substrate is supported at a height above an adjacent roller among the plurality of rollers in a direction of movement. delete 76. The method of claim 75 wherein And the plurality of rollers are rotated in different phases with respect to each other. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete 76. The method of claim 75 wherein Wherein some of the plurality of rollers are driven independently of the remaining portions of the plurality of rollers. As a substrate transport apparatus, A plurality of eccentrically-shaped rollers, The eccentrically shaped plurality of rollers supports and transports a substrate on the plurality of rollers, wherein a first roller of the plurality of rollers is positioned at the height above the adjacent roller of the plurality of rollers in a moving direction. A substrate carrying apparatus for supporting the leading edge of the. delete 97. The method of claim 95, Wherein some of the plurality of rollers are driven independently of the remaining portions of the plurality of rollers. delete delete As a substrate transport apparatus, A plurality of rollers driven eccentrically-shaped, The eccentrically shaped and driven rollers support and transport the substrate on the plural rollers, and the eccentrically shaped and driven rollers rotate in different phases with respect to each other and the plural rollers A first roller supporting the leading edge of the substrate at a height above an adjacent roller of the plurality of rollers in a moving direction. delete 101. The method of claim 100, And wherein some of the plurality of rollers are driven independently of the remaining portions of the plurality of rollers. delete As a substrate carrying method, Moving the substrate on the plurality of rollers in a desired direction; Raising the leading edge of the substrate relative to the roller adjacent in the direction of movement; And Lowering a second one of the plurality of rollers adjacent to a first one of the plurality of rollers supporting the leading edge of the substrate Substrate transport method comprising a. delete delete delete delete delete delete delete delete delete delete

Images