JP5068738B2 - Substrate processing apparatus and method - Google Patents

Description

The present invention relates to a substrate processing apparatus and method for processing a substrate.

  Conventionally, in order to perform various processes on substrates such as semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, etc. A substrate processing apparatus is used.

  The substrate processing apparatus of patent document 1 is demonstrated as an example of a substrate processing apparatus. FIG. 32 is a plan view showing the substrate processing apparatus of Patent Document 1. In FIG. As shown in FIG. 32, the substrate processing apparatus 900 includes an indexer 910 and a processing module 920.

  The indexer 910 includes an indexer robot 912 that reciprocates on an indexer transport path 911 that extends linearly, and a cassette mounting section 913 on which a plurality of carriers C can be mounted along the indexer transport path 911. A plurality of substrates W are accommodated in the carrier C.

  The processing module 920 includes a main transfer robot 922 that reciprocates on a main transfer path 921 orthogonal to the indexer transfer path 911, and a pair of unit portions 930A and 930B provided so as to sandwich the main transfer path 921. In the unit portions 930A and 930B, processing chambers 933 and 934 for performing processing on the substrate W are provided. In the substrate processing apparatus 900, the substrate W is transported as follows.

  First, the carrier C is carried into the cassette mounting unit 913 from the outside of the substrate processing apparatus 900. The unprocessed substrate W stored in the carrier C is taken out by the indexer robot 912 and transferred to the main transfer robot 922.

The substrate W transferred to the main transfer robot 922 is carried into the processing chambers 933 and 934 and subjected to a cleaning process. Thereafter, the processed substrate W is stored again in the carrier C by the main transfer robot 922 and the indexer robot 912.
Japanese Patent Laid-Open No. 10-150090

  In the substrate processing apparatus 900, the indexer robot 912 includes a substrate take-out arm for taking out an unprocessed substrate W from the carrier C, and a substrate storage arm for storing the processed substrate W in the carrier C.

  For example, the indexer robot 912 takes out and transfers one unprocessed substrate W from the carrier C, and transfers the substrate W to the main transfer robot 922. Further, the indexer robot 912 receives and transports one processed substrate W from the main transport robot 922 and stores the substrate W in the carrier C.

  During the operation of the indexer robot 912, the carrier C in which the unprocessed substrate W to be taken out by the indexer robot 912 may be different from the carrier C in which the indexer robot 912 stores the processed substrate W. .

  In this case, the indexer robot 912 must move the indexer transport path 911 toward another carrier C in which the unprocessed substrate W is stored after storing the processed substrate W in one carrier C, for example. . Thereby, the improvement of the throughput in the substrate processing apparatus 900 is prevented.

  Therefore, in order to improve the throughput in the substrate processing apparatus 900, it is conceivable to increase the operation speed of the indexer robot 912. However, the operation speed of the indexer robot 912 cannot be significantly increased. This is due to the following reason.

  In the carrier C, the accommodation interval of the substrates W is very small in order to accommodate more substrates W. As a result, the substrate take-out arm and the substrate storage arm of the indexer robot 912 are fabricated so that the thickness decreases according to the storage interval of the substrates W in the carrier C. Therefore, the rigidity of the substrate take-out arm and the substrate storage arm is not so high.

  Therefore, when the operation speed of the indexer robot 912 is remarkably increased, vibration or deformation occurs in each arm. As a result, a conveyance failure of the substrate W occurs.

An object of the present invention is to provide a substrate processing apparatus and method that can sufficiently shorten the time for transporting a substrate.

(1) A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus for processing a substrate, wherein a container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted; A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the same number of substrates that can be stored in the storage container are mounted in a substantially horizontal posture; There is a processing unit that performs processing on the substrates transported via the mounting shelf, and a plurality of substrate holding units that can hold a plurality of substrates at the same time and can be stored in a storage container. And a first substrate transport device that transports a plurality of substrates at once between the container platform and the substrate platform shelf, and a plurality of substrate holders that can hold the substrates one by one. , and a second substrate transport device that transports the substrate between the processing unit substrate platform shelf, the storage container is Has a receiving groove of a plurality of stages provided in the spacing, a plurality of storage shelves of the substrate platform shelf is provided at regular intervals, the distance between the storage shelves is greater than the distance between the receiving groove.

  In this substrate processing apparatus, a storage container is placed on the container placement portion. A plurality of substrates are stored in a substantially horizontal posture in the storage container. The substrate mounting shelf includes a plurality of storage shelves on which at least the same number of substrates that can be stored in the storage container are mounted in a substantially horizontal posture.

  The first substrate transfer device can hold a plurality of substrates at once and has a plurality of substrate holding units equal to the maximum number of substrates that can be stored in a storage container. The first substrate transport apparatus transports a plurality of substrates at a time between a storage container on a container platform and a substrate platform shelf. A plurality of substrates are placed in a substantially horizontal posture on a plurality of storage shelves of the substrate placement shelf. The second substrate transport device transports the substrate between the substrate mounting shelf and the processing unit.

  Thereby, the board | substrate accommodated in the storage container is conveyed by the process part by the 1st and 2nd board | substrate conveyance apparatus, and is processed. In addition, the substrate processed by the processing unit is transferred to and stored in the storage container by the second and first substrate transfer devices.

In this way, the same number of substrates as the maximum number that can be stored in the storage container can be collectively transferred between the container mounting portion and the substrate mounting shelf by the first substrate transfer device. Therefore, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container platform and the substrate platform shelf without increasing the operating speed of the first substrate transport apparatus .
Further, since the distance between the storage shelves of the substrate mounting shelf is larger than the distance between the storage grooves of the storage container, the distance between the substrate holding parts of the second substrate transfer apparatus is set to the substrate holding part of the first substrate transfer apparatus. It can be larger than the distance between. Thereby, the rigidity of each substrate holding part of the second substrate transport apparatus can be increased, and the operation speed of the second substrate transport apparatus can be increased. As a result, the throughput in the substrate processing apparatus is improved.

  (2) The first substrate transport device controls the distance between the substrate holders and the adjustment mechanism, and transfers the substrates between the substrate mounting shelf and the plurality of substrate holders. And a control unit that adjusts the distance between the substrate holding units to the distance between the storage shelves.

  In this case, when the distance between the substrate holders of the first substrate transport device and the distance between the storage shelves of the substrate mounting shelf are different, the substrate between the first substrate transport device and the substrate mounting shelf. In the delivery, the distance between the substrate holders of the first substrate transport apparatus can be adjusted to the distance between the storage shelves of the substrate mounting shelf by the adjusting mechanism. Accordingly, a plurality of substrates equal to the maximum number of substrates that can be stored in the storage container can be transferred to and from the substrate mounting shelf by a single transfer operation of the first substrate transfer device. Accordingly, it is possible to shorten the time for transferring a plurality of substrates between the first substrate transport apparatus and the substrate mounting shelf. As a result, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container placement unit and the substrate placement shelf.

( 3 ) A substrate processing apparatus according to a second invention is a substrate processing apparatus for processing a substrate, wherein a container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted; A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the same number of substrates that can be stored in the storage container are mounted in a substantially horizontal posture; There is a processing unit that performs processing on the substrates transported via the mounting shelf, and a plurality of substrate holding units that can hold a plurality of substrates at the same time and can be stored in a storage container. And a first substrate transport device that transports a plurality of substrates at once between the container platform and the substrate platform shelf, and a plurality of substrate holders that can hold the substrates one by one. , and a second substrate transport device that transports the substrate between the processing unit substrate mounting shelf, substrate mounting The plurality of storage shelves provided at equal intervals, a plurality of substrate holders are provided at equal intervals, the distance between the storage rack are those that are integer multiples of the distance between the substrate holder.

  In this case, a plurality of substrates as many as the maximum number of substrates that can be stored in the storage container can be transferred to and from the plurality of storage shelves of the substrate mounting shelf by a plurality of transfer operations of the first substrate transfer device. it can. As a result, a plurality of substrates as many as the maximum number of substrates that can be stored in the storage container by the first substrate transfer device can be transferred together.

( 4 ) The distance between the storage shelves may be twice the distance between the substrate holders.

  In this case, a plurality of substrates of the same number as the maximum number of substrates that can be stored in the storage container can be transferred between the plurality of storage shelves of the substrate mounting shelf by the two transfer operations of the first substrate transfer device. it can. As a result, the first substrate transport device can transport a plurality of substrates as many as the maximum number of substrates that can be stored in the storage container, and the first substrate transport device and the substrate mounting shelf It is possible to shorten the delivery time of a plurality of substrates between them. As a result, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container placement unit and the substrate placement shelf.

( 5 ) A substrate processing apparatus according to a third aspect of the present invention is a substrate processing apparatus for processing a substrate, wherein a container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted; A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the same number of substrates that can be stored in the storage container are mounted in a substantially horizontal posture; There is a processing unit that performs processing on the substrates transported via the mounting shelf, and a plurality of substrate holding units that can hold a plurality of substrates at the same time and can be stored in a storage container. And a first substrate transport device that transports a plurality of substrates at once between the container platform and the substrate platform shelf, and a plurality of substrate holders that can hold the substrates one by one. , and a second substrate transport device that transports the substrate between the processing unit substrate mounting shelf, a plurality of groups The holding unit alternately includes a plurality of first and second substrate holding units, and the plurality of storage shelves of the substrate storage shelf includes a plurality of first storage shelves and a plurality of second storage shelves, The substrate processing apparatus controls the first substrate transport apparatus, and when the substrates are transferred between the substrate mounting shelf and the plurality of substrate holding units, the plurality of first substrate holding units causes the plurality of first substrate holding units to be transferred. The plurality of substrate holders are moved so that the substrates are transferred to and from the plurality of second storage shelves by the plurality of second substrate holders after the substrates are transferred to and from the storage shelves. is further provided shall control unit for.

  In this case, after the substrates are transferred to and from the plurality of first storage shelves by the plurality of first substrate holders, the plurality of second substrate holders are connected to the plurality of second storage shelves. The board is delivered. Accordingly, the same number of substrates as the maximum number of substrates that can be stored in the storage container can be transferred to and from the substrate mounting shelf by the two transfer operations of the first substrate transfer device. As a result, the same number of substrates as the maximum number of substrates that can be stored in the storage container can be collectively transferred by the first substrate transfer device, and the first substrate transfer device and the substrate mounting shelf It is possible to shorten the delivery time of a plurality of substrates between them. As a result, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container placement unit and the substrate placement shelf.

( 6 ) A substrate processing apparatus according to a fourth aspect of the present invention is a substrate processing apparatus for processing a substrate, wherein a container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted; A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the same number of substrates that can be stored in the storage container are mounted in a substantially horizontal posture; There is a processing unit that performs processing on the substrates transported via the mounting shelf, and a plurality of substrate holding units that can hold a plurality of substrates at the same time and can be stored in a storage container. And a first substrate transport device that transports a plurality of substrates at once between the container platform and the substrate platform shelf, and a plurality of substrate holders that can hold the substrates one by one. , and a second substrate transport device that transports the substrate between the processing unit substrate mounting shelf, substrate mounting Is shall an adjustment mechanism for adjusting the distance between the storage shelves.

  In this case, when the substrate is transferred between the first substrate transport device and the substrate mounting shelf, the distance between the storage shelves of the substrate mounting shelf is set by the adjusting mechanism to the substrate holding portion of the first substrate transport device. Can be adjusted to the distance between. Accordingly, a plurality of substrates equal to the maximum number of substrates that can be stored in the storage container can be transferred to and from the substrate mounting shelf by a single transfer operation of the first substrate transfer device. Accordingly, it is possible to shorten the time for transferring a plurality of substrates between the first substrate transport apparatus and the substrate mounting shelf.

  Further, when the substrate is transferred between the second substrate transfer device and the substrate mounting shelf, the distance between the storage shelves of the substrate mounting shelf is set between the substrate holding portions of the second substrate transfer device by the adjusting mechanism. The distance can be adjusted. Thereby, since the distance between the substrate holding parts of the second substrate transfer apparatus can be increased, the rigidity of each substrate holding part of the second substrate transfer apparatus is increased and the operating speed of the second substrate transfer apparatus is increased. Can be increased.

  As a result, it is possible to sufficiently shorten the time for transporting the plurality of substrates by the first substrate transport apparatus and the time for transporting the plurality of substrates by the second substrate transport apparatus, thereby improving the throughput in the substrate processing apparatus.

(7) The plurality of substrate holders of the first substrate transport apparatus may be provided so as to be arranged in the vertical direction, and the plurality of substrates may be simultaneously held together.

  Thereby, it is possible to simultaneously take out and transport a plurality of substrates stored in the storage container on the container placement unit, and to transport a plurality of substrates to be transported in a batch to the storage container on the container placement unit. Can be stored at the same time.

( 8 ) A substrate processing apparatus according to a fifth aspect of the present invention is a substrate processing apparatus for processing a substrate, a processing region for processing the substrate, a loading / unloading region for loading and unloading the substrate with respect to the processing region, A transfer unit that transfers a substrate between the processing region and the carry-in / carry-out region, and the carry-in / carry-out region is a container on which a storage container having a plurality of storage grooves in which a plurality of substrates are stored in a substantially horizontal posture is placed. Including a placement unit, a first substrate transport device that transports the substrate between the storage container placed on the container placement unit and the transfer unit, and the processing region includes a processing unit that performs processing on the substrate, A second substrate transfer device that transfers the substrate between the transfer unit and the processing unit, and the transfer unit includes a substrate mounting shelf having a plurality of storage shelves on which the substrate is mounted in a substantially horizontal posture. The first substrate transfer device is provided so as to be arranged in the vertical direction, A plurality of substrate holders that are held in a flat position, a drive mechanism that moves the plurality of substrate holders between the storage container and the substrate mounting shelf and moves them back and forth in a substantially horizontal direction, and a substrate; An adjustment mechanism that adjusts the distance between the holding units, and the adjustment mechanism controls the distance between the substrate holding units when the substrate is transferred between the storage container and the plurality of substrate holding units. And a controller that adjusts the distance between the substrate holders to the distance between the storage shelves when the substrates are transferred between the substrate mounting shelf and the plurality of substrate holders . The plurality of storage grooves are provided at equal intervals, the plurality of storage shelves of the substrate mounting shelf are provided at equal intervals, and the distance between the storage shelves is larger than the distance between the storage grooves .

  In this substrate processing apparatus, a storage container is placed on the container placement portion in the carry-in / out area. The substrate is stored in the storage container in a substantially horizontal posture. The first substrate transport device in the carry-in / out region transports the substrate between the storage container on the container placement unit and the substrate placement shelf of the delivery unit. Substrates are placed in a substantially horizontal posture on a plurality of storage shelves of the substrate placement shelf.

  The second substrate transport device in the processing region transports the substrate between the substrate mounting shelf of the transfer unit and the processing unit. Thereby, the board | substrate accommodated in the storage container in the carrying in / out area | region is conveyed by the process part by the 1st and 2nd board | substrate conveyance apparatus, and is processed. In addition, the substrate processed by the processing unit is transferred and stored in the storage container in the loading / unloading area by the second and first substrate transfer apparatuses.

  The first substrate transport device transports a substrate between the storage container and the substrate mounting shelf using a plurality of substrate holding units. When the substrate is transferred between the storage container and the plurality of substrate holders, the distance between the substrate holders is adjusted to the distance between the storage grooves of the storage container by the adjusting mechanism. Thereby, each board | substrate holding | maintenance part can be easily inserted between the storage grooves of a storage container. Therefore, it is possible to smoothly transfer the substrate between the storage container and the plurality of substrate holding units.

  Further, when the substrate is transferred between the substrate mounting shelf and the plurality of substrate holding units, the distance between the substrate holding units is adjusted to the distance between the storage shelves of the substrate mounting shelf by the adjusting mechanism. . Thereby, each board | substrate holding | maintenance part can be easily inserted between the storage shelves of a board | substrate mounting shelf. Therefore, the substrate can be smoothly transferred between the substrate mounting shelf and the plurality of substrate holding units.

Thus, since the distance between the substrate holding portions of the first substrate transport apparatus can be adjusted by the adjustment mechanism, the distance between the storage grooves of the storage container and the distance between the storage shelves of the substrate mounting shelf are different. Even if it is a case, a some board | substrate can be smoothly conveyed between a storage container and a board | substrate mounting shelf. As a result, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container placement unit and the substrate placement shelf.
Further, since the distance between the storage shelves of the substrate mounting shelf is larger than the distance between the storage grooves of the storage container, the distance between the substrate holding portions of the second substrate transport apparatus is larger than the distance between the storage grooves of the storage container. Can be bigger. Thereby, the rigidity of each substrate holding part of the second substrate transport apparatus can be increased, and the operation speed of the second substrate transport apparatus can be increased. As a result, the throughput in the substrate processing apparatus is improved.

( 9 ) The drive mechanism may move the plurality of substrate holding units simultaneously. Accordingly, a plurality of substrates can be simultaneously transferred to and transferred from the storage container on the container placement unit, and a plurality of substrates can be simultaneously transferred to and from the substrate placement shelf. Can be transported.

( 10 ) The distance between the storage shelves of the substrate mounting shelf may be an integral multiple of the distance between the storage grooves of the storage container.

  In this case, the distance between the substrate holding portions of the second substrate transfer apparatus can be an integral multiple of the distance between the storage grooves of the storage container. Thereby, it is possible to sufficiently increase the rigidity of each substrate holding portion of the second substrate transport apparatus and increase the operation speed of the second substrate transport apparatus. As a result, the throughput in the substrate processing apparatus is improved.

( 11 ) The distance between the storage shelves of the substrate mounting shelf may be twice the distance between the storage grooves of the storage containers.

  In this case, the distance between the substrate holding portions of the second substrate transfer device can be doubled from the distance between the storage grooves of the storage container. Accordingly, it is possible to sufficiently increase the rigidity of each substrate holding unit of the second substrate transport apparatus and increase the operation speed of the second substrate transport apparatus without increasing the size of the second substrate transport apparatus. As a result, the throughput in the substrate processing apparatus is improved.

( 12 ) The processing unit may include a cleaning processing unit that cleans the substrate. In this case, the substrate is cleaned by the cleaning processing unit.

( 13 ) The first substrate transport apparatus may include a reversing mechanism that reverses the substrate. In this case, since the substrate can be inverted by the first substrate transfer apparatus, even when the substrate processing apparatus needs to be inverted, an apparatus for inverting the substrate is separate from the first substrate transfer apparatus. It is not necessary to provide it. Thereby, the footprint of the substrate processing apparatus can be reduced. In addition, according to the first substrate transport apparatus, since the substrate can be transported and the substrate can be reversed, the throughput of the substrate processing apparatus can be improved.

The substrate transfer device is a substrate transfer device that transfers a substrate from a storage unit in which the substrate is stored in a substantially horizontal posture, and is provided so as to be arranged in a vertical direction and holds a plurality of substrate holding portions that hold the substrate in a substantially horizontal posture. A drive mechanism that moves a plurality of substrate holders and advances and retracts in a substantially horizontal direction to transport the substrate corresponding to the storage unit; an adjustment mechanism that adjusts a distance between the substrate holders; and an adjustment mechanism. And a control unit that adjusts the distance between the substrate holding units to the distance between the substrates in the storage unit.

  The substrate transport apparatus transports a plurality of substrates between a storage container and a substrate mounting shelf using a plurality of substrate holding units. When the substrate is transferred between the storage container and the plurality of substrate holders, the distance between the substrate holders is adjusted to the distance between the storage grooves of the storage container by the adjusting mechanism. Thereby, each board | substrate holding | maintenance part can be easily inserted between the storage grooves of a storage container. Therefore, it is possible to smoothly transfer the substrate between the storage container and the plurality of substrate holding units.

  Further, when the substrate is transferred between the substrate mounting shelf and the plurality of substrate holding units, the distance between the substrate holding units is adjusted to the distance between the storage shelves of the substrate mounting shelf by the adjusting mechanism. . Thereby, each board | substrate holding | maintenance part can be easily inserted between the storage shelves of a board | substrate mounting shelf. Therefore, the substrate can be smoothly transferred between the substrate mounting shelf and the plurality of substrate holding units.

  As described above, since the distance between the substrate holding portions can be adjusted by the adjustment mechanism, even if the distance between the storage grooves of the storage container and the distance between the storage shelves of the substrate mounting shelf are different, the storage is possible. A plurality of substrates can be smoothly transferred between the container and the substrate mounting shelf. As a result, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container placement unit and the substrate placement shelf.

The substrate transport apparatus may further include a reversing mechanism that reverses the substrates held by the plurality of substrate holding units.

  In this case, since the substrate can be reversed by the substrate transport apparatus, even if it is necessary to reverse the substrate in the substrate processing apparatus, it is not necessary to provide a device for reversing the substrate separately from the substrate transport apparatus. Thereby, the footprint of the substrate processing apparatus can be reduced. Further, according to this substrate transport apparatus, since the substrate can be transported and the substrate can be reversed, the throughput of the substrate processing apparatus can be improved.

( 14 ) A substrate processing method according to a sixth aspect of the present invention is a container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted, and at least the maximum number of substrates that can be stored in the storage container A substrate processing method for processing a substrate by a substrate processing apparatus including a substrate mounting shelf having a plurality of storage shelves on which the same number of substrates are mounted in a substantially horizontal posture, and the substrate can be stored in a storage container A plurality of substrates transferred from the storage container placed on the container placement unit to the substrate placement shelf by the first substrate transport device having the same number of the plurality of substrate holding units; A step of sequentially transporting the substrate from the substrate mounting shelf to the processing unit by the second substrate transporting device having a plurality of substrate holding units capable of holding the substrates one by one; A stage where the processing unit processes the processed substrate. And a step of sequentially transporting substrates processed by the processing unit to the substrate mounting shelf by the second substrate transport device, and mounting a plurality of processed substrates transferred to the substrate mounting shelf on the container mounting unit. A plurality of substrate holders alternately including a plurality of first and second substrate holders, wherein the plurality of substrate holders alternately include a plurality of first and second substrate holders. The plurality of storage shelves include a plurality of first storage shelves and a plurality of second storage shelves, and a plurality of storage shelves when a substrate is transferred between the substrate mounting shelf and the plurality of substrate holding units. After the substrate is transferred to and from the plurality of first storage shelves by the first substrate holding unit, the substrate is transferred to and from the plurality of second storage shelves by the plurality of second substrate holding units. a shall move the plurality of substrate holders to be performed.

  In this substrate processing method, a plurality of substrates are collectively transferred by the first substrate transfer device from the storage container mounted on the container mounting portion to the substrate mounting shelf. In this case, the first substrate transport apparatus can collectively hold a plurality of substrate holding units equal to the maximum number of substrates that can be stored in the storage container. In addition, at least the same number of substrates as the maximum number of substrates that can be stored in the storage container can be mounted in a substantially horizontal posture on the plurality of storage shelves of the substrate mounting shelf.

  Next, the substrate is sequentially transferred from the substrate mounting shelf to the processing unit by the second substrate transfer device. In this case, the second substrate transfer apparatus can hold the substrates one by one. The substrate transported by the second substrate transport device is processed by the processing unit.

  Substrates after processing by the processing unit are sequentially transferred to the substrate mounting shelf by the second substrate transfer device. Further, the plurality of processed substrates transferred to the substrate mounting shelf are collectively transferred by the first substrate transfer device to the storage container mounted on the container mounting portion.

As described above, the first substrate transport device can transport the same number of substrates as the maximum number that can be stored in the storage container between the container mounting portion and the substrate mounting shelf. Therefore, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container platform and the substrate platform shelf without increasing the operating speed of the first substrate transport apparatus. Thereby, the throughput in the substrate processing apparatus is improved.
In addition, after the substrates are transferred to and from the plurality of first storage shelves by the plurality of first substrate holders, the plurality of second substrate holders and the plurality of second storage shelves. The board is delivered. Accordingly, the same number of substrates as the maximum number of substrates that can be stored in the storage container can be transferred to and from the substrate mounting shelf by the two transfer operations of the first substrate transfer device. As a result, the same number of substrates as the maximum number of substrates that can be stored in the storage container can be collectively transferred by the first substrate transfer device, and the first substrate transfer device and the substrate mounting shelf It is possible to shorten the delivery time of a plurality of substrates between them. As a result, it is possible to sufficiently shorten the time for transporting a plurality of substrates between the storage container on the container placement unit and the substrate placement shelf.

  According to the present invention, it is possible to transfer a plurality of substrates at once, and the substrate transfer time is sufficiently shortened.

  A substrate transfer apparatus and a substrate processing apparatus according to an embodiment of the present invention will be described. In the following description, the substrate refers to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and the like.

[1] First Embodiment (1) Configuration of Substrate Processing Apparatus FIG. 1A is a plan view of a substrate processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic side view of the substrate processing apparatus 1 (a) as viewed from the direction of an arrow X. FIG. Moreover, FIG. 2 is a figure which shows typically the AA line cross section of Fig.1 (a).

  As shown in FIG. 1A, the substrate processing apparatus 100 includes an indexer block 10 and a processing block 11. The indexer block 10 and the processing block 11 are provided in parallel with each other.

  The indexer block 10 is provided with a plurality of carrier mounting tables 40, an indexer robot IR, and a control unit 4. On each carrier mounting table 40, a carrier C that stores a plurality of substrates W in multiple stages is mounted. Details of the carrier C will be described later.

  The indexer robot IR is configured to be movable in the direction of the arrow MV1 (FIG. 1A), to be rotatable about a vertical axis, and to be vertically movable. The indexer robot IR is provided with a batch type hand IRH in which a plurality of hands for delivering the substrate W are arranged in the vertical direction. The hand IRH holds the peripheral edge and the outer peripheral edge of the lower surface of the substrate W. Details of the indexer robot IR will be described later.

  The control unit 4 includes a computer including a CPU (Central Processing Unit) and controls each unit in the substrate processing apparatus 100.

  As shown in FIG. 1B, the processing block 11 is provided with a plurality of surface cleaning units SS and a main robot MR. In this example, four surface cleaning units SS are vertically stacked on one side surface of the processing block 11, and the other four surface cleaning units SS are vertically stacked on the other side surface of the processing block 11. Has been. In the surface cleaning unit SS, the surface of the substrate W is subjected to scrub cleaning or chemical cleaning.

  The main robot MR is provided between the plurality of surface cleaning units SS located on one side surface of the processing block 11 and the plurality of surface cleaning units SS located on the other side surface side of the processing block 11. The main robot MR is configured to be rotatable about a vertical axis and to be vertically movable.

  The main robot MR is provided with hands MRH1 and MRH2 for delivering the substrate W up and down. The hands MRH1 and MRH2 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W. Details of the main robot MR will be described later.

  As shown in FIG. 2, between the indexer block 10 and the processing block 11, substrate platforms PASS1, PASS2 for transferring the substrate W between the indexer robot IR and the main robot MR are provided above and below. It has been.

  A plurality of substrates W can be placed in multiple stages on the substrate platforms PASS1, PASS2. The upper substrate platform PASS1 is used when transporting the substrate W from the processing block 11 to the indexer block 10, and the lower substrate platform PASS2 transports the substrate W from the indexer block 10 to the processing block 11. Used when. Details of the substrate platforms PASS1, PASS2 will be described later.

(2) Outline of Operation of Substrate Processing Apparatus Next, an outline of the operation of the substrate processing apparatus 100 will be described with reference to FIGS. 1 and 2. The operation of each component of the substrate processing apparatus 100 described below is controlled by the control unit 4 in FIG.

  First, the indexer robot IR takes out all unprocessed substrates W from the carrier C mounted on the carrier mounting table 40 using the batch type hand IRH. The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow MV1, and places a plurality of substrates W on the IRH on the substrate platform PASS2. In the present embodiment, the indexer robot IR places all the substrates W held by the batch type hand IRH on the substrate platform PASS <b> 2 by two placement operations. Details will be described later.

  The main robot MR moves up and down while rotating around the vertical axis, and takes out the substrate W from the substrate platform PASS2 using the lower hand MRH2. Next, the main robot MR unloads the substrate W after the surface cleaning process from one of the surface cleaning units SS by the upper hand MRH1, and loads the substrate W held by the hand MRH2 into the surface cleaning unit SS. Then, the main robot MR moves up and down again while rotating around the vertical axis, and places the substrate W held by the upper hand MRH1 on the substrate platform PASS1.

  The indexer robot IR takes out the processed substrate W from the substrate platform PASS1 using the hand IRH. In the present embodiment, the indexer robot IR takes out all the substrates W placed on the substrate platform PASS2 by two take-out operations. The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow MV1, and stores all the substrates W held by the hand IRH in one of the carriers C mounted on the carrier mounting table 40. .

  In the substrate processing apparatus 100 according to the present embodiment, the transfer operation of the substrate W by the indexer robot IR and the main robot MR is continuously repeated.

(3) Configuration of Carrier and Substrate Placement Section FIG. 3 is a longitudinal sectional view for explaining the structure of the carrier C and the substrate placement sections PASS1, PASS2 in FIG. FIG. 3 is a longitudinal sectional view seen from the direction of arrow X in FIG.

  FIG. 3A shows a longitudinal sectional view of the carrier C in FIG. As shown in FIG. 3A, the carrier C has a box shape. One side of the carrier C is open so that the hand IRH can enter.

  A plurality of substrate storage grooves C2 extending along the horizontal direction are formed at equal intervals on the inner surface of the carrier C extending in the vertical direction.

  One substrate W is stored in each substrate storage groove C2. In the present embodiment, the interval H1 between the substrate storage grooves C2 adjacent in the vertical direction is set to 10 mm. In this case, the substrates W are accommodated in the carrier C at intervals of 10 mm.

  A maximum of m substrates W can be stored in the carrier C. Here, m is an integer of 2 or more. In the present embodiment, a maximum of 12 substrates W can be stored in the carrier C.

  FIG. 3B shows a longitudinal sectional view of the substrate platform PASS1 in FIG. In the present embodiment, the substrate platform PASS1 and the substrate platform PASS2 have the same shape. As shown in FIG. 3B, the substrate platform PASS1 includes support walls 51 and 52 provided to face each other.

  The support wall 51 is provided with a plurality of support plates 51a at equal intervals, and the support wall 52 is provided with a plurality of support plates 52a at equal intervals. The substrates W are respectively placed on a plurality of sets of support plates 51a and 52a provided at the same height. In the substrate platform PASS1, a plurality of substrates W equal to the maximum number m of substrates W that can be stored in the carrier C are placed. In the present embodiment, 12 sets of support plates 51a and 52a are provided. Accordingly, a maximum of 12 substrates W are placed in the substrate platform PASS1.

  An interval H2 between one set of support plates 51a and 52a and another set of support plates 51a and 52a adjacent in the vertical direction is larger than an interval H1 between the substrate storage grooves C2 of the carrier C. Specifically, the interval H2 between the pair of support plates 51a, 52a and another set of support plates 51a, 52a adjacent in the vertical direction is set to an integral multiple of the interval H1 between the substrate storage grooves C2 of the carrier C. Is done. For example, the distance H2 between the set of support plates 51a and 52a and the other set of support plates 51a and 52a adjacent in the vertical direction is set to twice the distance H1 between the substrate storage grooves C2 of the carrier C. In the present embodiment, the distance H2 between the set of support plates 51a and 52a and the other set of support plates 51a and 52a adjacent in the vertical direction is set to 20 mm.

  The substrate platforms PASS1 and PASS2 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W for each of the support plate 51a or the support plate 52a. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 and PASS2.

(4) Configuration of Indexer Robot Subsequently, a detailed configuration of the indexer robot IR will be described. FIG. 4 is a side view of the indexer robot IR, and FIG. 5 is a plan view of the indexer robot IR.

  As shown in FIGS. 4 and 5, the indexer robot IR includes a transport rail part 210, a moving support column 220, a lifting support part 230, and a base part 240.

  The transport rail unit 210 is attached to the floor surface of the indexer block 10. A moving support column 220 extending in the vertical direction is mounted on the transport rail unit 210. One end of an elevating support portion 230 extending in the horizontal direction is attached to the moving support column 220. A base portion 240 is attached to the other end of the lifting support portion 230.

  A horizontal movement mechanism 211 made up of, for example, a ball screw and a motor is provided in the conveyance rail portion 210 extending in the horizontal direction. Due to the horizontal movement mechanism 211, the movement support column 220 moves in the horizontal direction along the transport rail portion 210 (arrow MV1).

  The moving support column 220 is provided with a vertical moving mechanism 221 composed of, for example, a ball screw and a motor. By the vertical movement mechanism 221, the elevating support unit 230 moves in the vertical direction along the moving support column 220 (arrow MV2). Thereby, the base part 240 can move in the horizontal direction and the vertical direction.

  A rotation stage 250 is provided on the base portion 240 so as to be rotatable with respect to the base portion 240. The rotating stage 250 is rotated by a rotating mechanism 241 provided inside the base portion 240 (arrow MV3). The rotation mechanism 241 is configured by a motor, for example.

  The rotary stage 250 is provided with a hand IRH that can advance and retreat in the horizontal direction. The hand IRH includes a plurality of hand elements 260, a hand support part 270 and a sliding part 280. Lower ends of the sliding portions 280 are slidably attached to both side surfaces of the rotary stage 250. The hand support portion 270 is fixed to the sliding portion 280 above the rotary stage 250. The plurality of hand elements 260 are fixed to the hand support portion 270 so as to be arranged at equal intervals in the vertical direction.

  The sliding portion 280 moves back and forth in the horizontal direction by a horizontal movement mechanism 251 provided inside the rotary stage 250. As a result, the hand IRH moves back and forth in the horizontal direction (arrow MV4). The horizontal movement mechanism 251 is configured by, for example, a motor and a belt.

  The hand IRH includes a plurality of hand elements 260 equal to the maximum number m of substrates W that can be stored in the carrier C. In the present embodiment, twelve hands RH are provided. The plurality of hand elements 260 are provided at equal intervals. An interval between the upper and lower adjacent hand elements 260 (a distance between an upper surface and an upper surface of the upper and lower adjacent hand elements 260) is equal to an interval H1 between the substrate storage grooves C2 of the carrier C in FIG. Is set as follows.

  As shown in FIG. 5, each hand element 260 has two claw portions 261 extending substantially in parallel. A plurality of support pins 262 are attached to the claw portion 261 of the hand element 260. In the present embodiment, four support pins 262 are attached substantially evenly along the outer periphery of the substrate W placed on the claw portion 261. The four support pins 262 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W.

  The claw portion 261 of the hand element 260 has a thickness of about 4 mm, for example. Thereby, the hand element 260 can be inserted between the plurality of substrates W stored in the carrier C of FIG.

  The operations of the horizontal movement mechanism 211, the vertical movement mechanism 221, the rotation mechanism 241 and the horizontal movement mechanism 251 are controlled by the control unit 4 shown in FIG.

(5) Configuration of Main Robot Next, a detailed configuration of the main robot MR will be described. FIG. 6A is a side view of the main robot MR, and FIG. 6B is a plan view of the main robot MR.

  As shown in FIGS. 6A and 6B, the main robot MR includes a base portion 21, and an up-and-down rotation portion 22 is provided so as to be movable up and down with respect to the base portion 21. A hand MRH1 is connected to the ascending / descending rotation part 22 via an articulated arm AM1, and a hand MRH2 is connected via an articulated arm AM2.

  The up-and-down rotation unit 22 is moved up and down by an up-and-down drive mechanism 25 provided in the base unit 21 and rotated around a vertical axis by a rotation drive mechanism 26 provided in the base unit 21.

  The articulated arms AM1 and AM2 are independently driven by a driving mechanism (not shown), and advance and retreat in the horizontal direction while maintaining the hands MRH1 and MRH2 in a fixed posture.

  The hands MRH1 and MRH2 are provided at a certain height with respect to the lifting / lowering rotating unit 22, and the hand MRH1 is located above the hand MRH2. The height difference M1 (FIG. 6A) between the hand MRH1 and the hand MRH2 is kept constant.

  The height difference M1 between the hand MRH1 and the hand MRH2 is, for example, the distance between the support plates 51a adjacent to the top and bottom of the substrate platforms PASS1 and PASS2 shown in FIG. 3B (and between the support plates 52a). It may be set to be substantially equal to H2.

  The hands MRH1 and MRH2 have the same shape, and are each formed in a substantially U shape. The hand MRH1 has two claw portions H11 extending substantially in parallel, and the hand MRH2 has two claw portions H12 extending substantially in parallel. A plurality of support pins 23 are attached to the hands MRH1 and MRH2.

  In the present embodiment, four support pins 23 are attached almost evenly along the outer periphery of the substrate W placed on the upper surfaces of the hands MRH1 and MRH2. The four support pins 23 hold the peripheral edge and the outer peripheral edge of the lower surface of the substrate W.

  The hands MRH1 and MRH2 are formed thicker than the claw portion 261 of the indexer robot IR (FIG. 5), and have a thickness of about 15 mm, for example. Accordingly, the hands MRH1 and MRH2 have higher rigidity than the hand element 260 of the indexer robot IR.

(6) Details of Operation of Indexer Robot Next, details of the operation of the indexer robot IR will be described.

  7 to 14 are diagrams for explaining the operation of the indexer robot IR. 7 to 14, (a) is a schematic view of the hand IRH and the substrate platform PASS2 as viewed from the direction of the arrow Y in FIG. 1, and (b) is a cross-sectional view taken along line BB in (a). is there. 7A to 14A, the support wall 52 and the support plate 52a of the substrate platform PASS2 are shown. 7 to 14, the hand IRH of the indexer robot IR is provided with 12 hand elements 260, and the substrate platform PASS2 is provided with 12 sets of support plates 51a and 52a. .

  When placing the substrate W before the cleaning process on the substrate platform PASS2, first, the indexer robot IR moves to the front of the substrate platform PASS2 in the indexer block 10 (FIG. 1).

  Then, as shown in FIG. 7, the position in the vertical direction of the substrate W placed on the second, fourth, sixth, eighth, tenth and twelfth claw portions 261 from the top is 1, 2, 3 from the top. In the vertical direction of the substrate W placed on the claw portions 261 on the third, fifth, seventh, ninth, and eleventh stages from above, above the fourth, fifth, and sixth stage support plates 51a and 52a. The vertical position of the hand IRH is set so that the position is lower than the first, second, third, fourth, and fifth-stage support plates 51a and 52a.

  Next, as shown in FIG. 8, the hand IRH moves to the substrate platform PASS2 side on the rotary stage 250 (FIG. 4). Accordingly, the claw part 261 and all the substrates W placed on the claw part 261 enter the substrate platform PASS2. In addition, each board | substrate W and each support plate 51a, 52a are not contacting.

  Next, as shown in FIG. 9, the hand IRH moves downward. As a result, the substrates W placed on the claw portions 261 at the second, fourth, sixth, eighth, tenth and twelfth stages from above are the first, second, third, fourth, fifth and sixth stage support plates from above. 51a and 52a. That is, half of the six substrates W held by the hand IRH are placed on the substrate platform PASS2.

  Next, as shown in FIG. 10, the hand IRH moves in a direction away from the substrate platform PASS <b> 2 on the rotary stage 250 (FIG. 4). Accordingly, the claw portion 261 and the remaining six substrates W placed on the claw portion 261 are moved out of the substrate platform PASS2.

  Next, as shown in FIG. 11, the hand IRH moves downward. At this time, the vertical positions of the substrates W placed on the first, third, fifth, seventh, ninth, and eleventh claw portions 261 from the top are 6, 7, 8, 9, 10, and 11 from the top. The position of the hand IRH in the vertical direction is lower than the support plates 51a and 52a at the stage and above the support plates 51a and 52a at the seventh, eighth, ninth, tenth, and eleventh stages from above. Is set.

  Next, as shown in FIG. 12, the hand IRH moves to the substrate platform PASS2 side on the rotary stage 250 (FIG. 4). Accordingly, the claw part 261 and the substrate W placed on the claw part 261 enter the substrate platform PASS2. In addition, each board | substrate W and each support plate 51a, 52a are not contacting.

  Next, as shown in FIG. 13, the hand IRH moves downward. As a result, the substrate W placed on the first, third, fifth, seventh, ninth and eleventh-stage claw portions 261 from the upper side is supported by the seventh, eighth, ninth, tenth, eleventh and twelfth stage support plates 51a and 52a. Thereby, the transfer of the substrate W from the carrier C (FIG. 1) to the substrate platform PASS2 is completed.

  Thereafter, as shown in FIG. 14, the hand IRH moves in a direction away from the substrate platform PASS2 on the rotary stage 250 (FIG. 4). Thereby, the claw portion 261 moves backward out of the substrate platform PASS2.

  As described above, in the present embodiment, all the substrates W held by the hand IRH are placed on the substrate platform PASS2 in two portions for every plurality of substrates W arranged every other substrate. Placed.

  Note that when the substrate W after the cleaning process is taken out from the substrate platform PASS1 (FIG. 1), the indexer robot IR performs an operation opposite to the operation of the indexer robot IR shown in FIGS. Thereby, all the substrates W placed in the substrate platform PASS1 can be taken out by two taking-out operations.

(7) Control Operation of Substrate Processing Apparatus 100 by Control Unit 4 Here, a control operation of the substrate processing apparatus 100 by the control unit 4 will be described. FIG. 15 is a flowchart showing the control operation of the substrate processing apparatus 100 by the control unit 4.

  As shown in FIG. 15, the control unit 4 controls the indexer robot IR so as to collectively transport a plurality of substrates W from the carrier C on the carrier platform 40 to the substrate platform PASS2 (step S1). In this case, the indexer robot IR takes out a plurality of unprocessed substrates W from the carrier C on the carrier mounting table 40 using the batch type hand IRH and transports them to the substrate platform PASS2, and the batch type hand IRH. All the substrates W held in (1) are placed on the substrate platform PASS2 by two placement operations.

  Next, the control unit 4 controls the main robot MR so as to sequentially transfer the substrates W one by one from the substrate platform PASS2 to the surface cleaning unit SS (step S2). In this case, the main robot MR takes out the substrate W from the substrate platform PASS2 using the lower hand MRH2 and transports it to the surface cleaning unit SS. Then, the main robot MR unloads the substrate W after the surface cleaning process from the surface cleaning unit SS by the upper hand MRH1, and loads the substrate W held by the hand MRH2 into the surface cleaning unit SS.

  Further, the control unit 4 controls the surface cleaning unit SS so as to perform the surface cleaning process on the substrate W (step S3).

  Next, the control unit 4 controls the main robot MR so as to sequentially transfer the substrates W one by one from the surface cleaning unit SS to the substrate platform PASS1 (step S4). In this case, the main robot MR transports and places the substrate W held on the upper hand MRH1 to the substrate platform PASS1.

  By repeatedly performing the control operations in steps S2 to S4, the surface treatment is performed on the plurality of substrates W placed on the substrate platform PASS2, and the plurality of processed substrates W are transferred to the substrate platform PASS1. Placed.

  Thereafter, the control unit 4 controls the indexer robot IR so as to collectively transport a plurality of substrates W from the substrate platform PASS1 to the carrier C on the carrier platform 40 (step S5). In this case, the indexer robot IR takes out and transports all the substrates W placed on the substrate platform PASS1 by two take-out operations using the batch-type hand IRH, and performs carrier C on the carrier platform 40. Store in.

(8) Effect In this embodiment, since the indexer robot IR is provided with the batch-type hand IRH, a large number of substrates W can be transferred by the indexer robot IR. Thereby, the transfer time of the substrate W between the carrier C and the substrate platforms PASS1, PASS2 is shortened. As a result, the throughput of the substrate processing apparatus 100 can be improved.

  Further, in the substrate platforms PASS1 and PASS2, the interval H2 between the support plates 51a vertically adjacent (and between the support plates 52a) is set to be twice the interval H1 between the substrate storage grooves C2 vertically adjacent to the carrier C. Has been. Thereby, the thickness of the hand MRH1 and the hand MRH2 of the main robot MR can be sufficiently increased. In this case, since the highly rigid hands MRH1 and MRH2 can be used for the main robot MR, the operation speed of the main robot MR can be increased. Thereby, the throughput of the substrate processing apparatus 100 can be improved.

  Further, in the substrate platforms PASS1 and PASS2, the interval H2 between the support plates 51a adjacent in the vertical direction (and between the support plates 52a) is the interval between the hand elements 260 (claw portions 261) adjacent in the vertical direction of the indexer robot IR. It is set to 2 times. In this case, as described with reference to FIGS. 7 to 14, the two hand elements 260 can be inserted between the support plates 51 a (support plates 52 a).

  Therefore, when placing the unprocessed substrate W on the substrate platform PASS2, half of the hand elements 260 of the plurality of hand elements 260 are placed above the support plates 51a and 52a in the substrate platform PASS2. Can be arranged. Thereby, half of the plurality of substrates W placed on the hand IRH is placed on the support plates 51a and 52a by the placement operation of the indexer robot IR once. Can do. Therefore, all the substrates W held by the hand IRH can be placed on the substrate platform PASS2 by two placement operations. Thereby, the transfer time of the substrate W between the carrier C and the substrate platform PASS2 can be sufficiently shortened.

  Further, when the processed substrate W is taken out from the substrate platform PASS1, half of the hand elements 260 among the plurality of hand elements 260 are arranged below the support plates 51a and 52a in the substrate platform PASS1. be able to. Thereby, half of the substrates W arranged at every other substrate out of the plurality of substrates W placed on the support plates 51a and 52a can be taken out by the hand element 260 by one carry-out operation of the indexer robot IR. . Therefore, all the substrates W placed on the support plates 51a and 52a can be taken out from the substrate platform PASS1 by two take-out operations. Thereby, the transfer time of the substrate W between the substrate platform PASS1 and the carrier C can be sufficiently shortened.

(9) Modified Example In the above, as shown in FIGS. 7 to 14, the substrate placed on the claw portion 261 in the second stage from the top is placed on the uppermost support plates 51 a and 52 a. However, the substrate placed on the uppermost claw portion 261 may be placed on the uppermost support plates 51a and 52a. In this case, the substrate W placed on the first, third, fifth, seventh, ninth and eleventh-stage claw portions 261 from above is the first, second, third, fourth, fifth and sixth-stage support plates from above. The substrates W placed on the 51a, 52a and placed on the second, fourth, sixth, eighth, tenth and twelfth claw portions 261 from the upper side are the seventh, eighth, ninth, tenth, eleventh, and It is placed on the 12th stage support plates 51a, 52a.

  In the above embodiment, the case where the twelve hand elements 260 are provided in the hand IRH has been described. However, the number of hand elements 260 provided in the hand IRH is not limited to the above example. For example, 25 hand elements 260 may be provided in the hand IRH.

  In this case, by providing 25 sets of support plates 51a and 52a on the substrate platforms PASS1 and PASS2, respectively, the same effect can be obtained by the same operation as the above embodiment. In this case, a carrier C that can accommodate 25 substrates W can be used. When 25 substrates W are stored in the carrier C, the indexer robot IR can take out all 25 substrates W from the carrier C. Thus, the number of hand elements 260 of the hand IRH and the number of support plates 51a and 52a of the substrate platforms PASS1 and PASS2 depend on the processing speed of the surface cleaning unit SS, the moving speed of the indexer robot IR, and the main robot MR. It can be appropriately changed according to various factors such as the moving speed.

  The main robot MR uses the hand MRH2 when holding the unprocessed substrate W, and uses the hand MRH1 when holding the substrate W that has been subjected to the cleaning process. The hand MRH1 may be used when holding the substrate W to be processed, and the hand MRH2 may be used when holding the substrate W that has been subjected to the cleaning process.

  Further, as the main robot MR, an articulated transfer robot that moves the hand linearly by moving the joint is used, but the present invention is not limited to this, and the hand is slid linearly with respect to the substrate W. A direct-acting transfer robot that performs the forward / backward movement operation may be used.

  In the above description, the indexer robot IR having the batch type hand IRH is used. However, the batch type hand IRH including the plurality of hand elements 260 and one hand element for holding one substrate W are used. Alternatively, an indexer robot IR having a configuration in which a single-wafer type hand provided can be replaced may be used.

  In the present embodiment, the height difference M1 (FIG. 6A) between the hand MRH1 and the hand MRH2 is adjacent to the upper and lower sides of the substrate platform PASS1 (or PASS2) shown in FIG. 3B. When set so as to be substantially equal to between the plates 51a (and between the support plates 52a), the main robot MR may deliver the two substrates W to the substrate platform PASS1 (or PASS2).

  In this case, the main robot MR inserts the hand MRH1 and the hand MRH2 at the same time below the two sets of support plates 51a and 52a adjacent to the upper and lower sides of the substrate platform PASS1 (or PASS2), and mounts them adjacent to each other. The two placed substrates W can be easily taken out. Further, the two substrates W held by the hand MRH1 and the hand MRH2 can be placed on two sets of support plates 51a and 52a adjacent to each other in the vertical direction of the substrate platform PASS1 (or PASS2).

  Thereby, the conveyance time of the board | substrate W between board | substrate mounting part PASS1, PASS2 and surface cleaning unit SS can be shortened.

[2] Second Embodiment The substrate processing apparatus according to the second embodiment is different in configuration from the substrate processing apparatus 100 according to the first embodiment in the following points.

  The substrate platform used in the substrate processing apparatus according to the present embodiment has the following configuration. FIG. 16 is a view for explaining the structure of the substrate platform used in the substrate processing apparatus according to the second embodiment.

  As shown in FIG. 16, the substrate platforms PASS1, PASS2 of the present embodiment include a plurality of sets of support plates 51P arranged to face each other in a horizontal plane. Each set of support plates 51 </ b> P is stacked in multiple stages by a plurality of cylinders 510. A plurality of support pins PN that support the lower surface of the substrate W are provided on each set of support plates 51P.

  Between the two support plates 51P in each group, the hand IRH of the indexer robot IR and the hands MRH1 and MRH2 of the main robot MR can be inserted. Accordingly, the substrate W transported by the indexer robot IR and the main robot MR is temporarily placed on the plurality of support pins PN provided on each pair of support plates 51P.

  As the cylinder 510, for example, an air cylinder or an oil cylinder is used. Each cylinder 510 is connected to the cylinder synchronization mechanism 500. The cylinder synchronization mechanism 500 is controlled by the control unit 4 and supplies fluid (for example, air or oil) to the plurality of cylinders 510 while synchronizing the plurality of cylinders 510.

  Accordingly, each cylinder 510 expands and contracts in the vertical direction according to the amount of fluid (for example, air or oil) supplied from the cylinder synchronization mechanism 500. Thereby, in the substrate platforms PASS1 and PASS2 of the present embodiment, the interval GC between the support plates 51P adjacent in the vertical direction changes within a predetermined range.

  FIG. 17 is a diagram illustrating an example of a case where the interval GC between the support plates 51P vertically adjacent to each other changes in the substrate platforms PASS1 and PASS2 in FIG.

  As shown in FIG. 17, the interval GC between the support plates 51P adjacent in the vertical direction changes, for example, from the maximum interval HG1 indicated by the dotted line to the minimum interval HG2 indicated by the solid line.

  For example, the maximum distance HG1 between the support plates 51P is set to be substantially equal to the height difference M1 between the hand MRH1 and the hand MRH2 of the main robot MR shown in FIG. The minimum distance HG2 between the support plates 51P is set to, for example, 10 mm so as to be equal to the distance H1 in FIG.

  The maximum distance HG1 between the support plates 51P may be set to 20 mm so as to be equal to the distance H2 in FIG. 3B, for example.

  The substrate platforms PASS1 and PASS2 are provided with optical sensors (not shown) for detecting the presence or absence of the substrate W, corresponding to each set of support plates 51P.

  In the present embodiment, when the substrate W is placed on the substrate platform PASS2 by the indexer robot IR and when the substrate W is taken out from the substrate platform PASS1, the distance between the support plates 51P is set to the minimum distance HG2. The

  In this case, a set of claw portions 261 (FIG. 5) can be inserted between each set of support plates 51P. Thereby, all the substrates W held by the hand IRH of the indexer robot IR can be placed on the substrate platform PASS2 by a single placement operation, and are placed on the substrate platform PASS1. All the substrates W can be taken out by one take-out operation. As a result, the transfer time of the substrate W between the carrier C and the substrate platform PASS1, PASS2 is sufficiently shortened.

  Further, when the substrate W is placed on the substrate platform PASS1 by the main robot MR and when the substrate is taken out from the substrate platform PASS2, the distance between the support plates 51P is set to the maximum distance HG1. In this case, the hands MRH1 and MRH2 of the main robot MR having a thickness larger than the claw portion 261 of the indexer robot IR can be easily placed between the plurality of substrates W placed on the support plates 51P of the substrate platforms PASS1 and PASS2. Can enter. Thereby, the delivery of the substrate W between the main robot MR and the substrate platforms PASS1, PASS2 is reliably performed.

[3] Third Embodiment A substrate processing apparatus according to a third embodiment is different from the substrate processing apparatus 100 according to the first embodiment in the following points.

  The hand IRH of the indexer robot IR used in the substrate processing apparatus according to the present embodiment has the following configuration. 18 and 19 are views for explaining the structure of the hand IRH used in the substrate processing apparatus according to the third embodiment.

  As shown in FIGS. 18 and 19, each pair of claw portions 261 of the hand IRH according to the present embodiment includes a plurality of stages (a cylinder similar to the cylinder 510 in FIG. 16) in a multi-stage in the hand support portion 270. Are stacked. Each cylinder is connected to a cylinder synchronization mechanism 500 similar to that shown in FIG. Therefore, each cylinder expands and contracts in the vertical direction in accordance with the amount of fluid (for example, air or oil) supplied from the cylinder synchronization mechanism 500. Thereby, in the hand IRH of the present embodiment, the interval between the claw portions 261 adjacent in the vertical direction changes between the maximum interval HG3 and the minimum interval HG4.

  The maximum interval HG3 is set to be equal to the interval H2 in FIG. The minimum interval HG4 is set to be equal to the interval H1 in FIG.

  In the present embodiment, when the substrate W is taken out from the carrier C by the indexer robot IR and when the substrate W is placed on the carrier C, the gap 261 is set to the minimum interval HG4. In this case, a set of claw portions 261 can be inserted between the substrate storage grooves C2. Thereby, all the substrates W placed on the carrier C can be taken out by one take-out operation, and all the substrates W held by the hand IRH are taken into the carrier C by one placement operation. Can be placed.

  Further, when the substrate W is placed on the substrate platform PASS2 by the indexer robot IR and when the substrate W is taken out from the substrate platform PASS1, the distance between the claw portions 261 is set to the maximum interval HG3. In this case, a pair of claw portions 261 can be respectively entered between the support plates 51a (between the support plates 52a). Accordingly, all the substrates W held by the hand IRH can be placed on the substrate platform PASS2 by a single placement operation, and all the substrates placed on the substrate platform PASS1. W can be taken out by one take-out operation.

  As a result, the transfer time of the substrate W between the carrier C and the substrate platforms PASS1, PASS2 is sufficiently shortened.

[4] Fourth Embodiment A substrate processing apparatus according to a fourth embodiment is different from the substrate processing apparatus 100 according to the first embodiment in the following points.

  FIG. 20A is a plan view of the substrate processing apparatus according to the fourth embodiment of the present invention, and FIG. 20B is a schematic view of the substrate processing apparatus of FIG. FIG.

  As shown in FIG. 20, in the substrate processing apparatus 100 according to the fourth embodiment, a back surface cleaning unit RSS is provided instead of the front surface cleaning unit SS. The main robot MR transports the substrate W between the substrate platforms PASS1, PASS2 and the back surface cleaning unit RSS. In the back surface cleaning unit RSS, the back surface of the substrate W is cleaned.

  In the present embodiment, when the substrate W is transported from the carrier C to the substrate platform PASS2, and when the substrate W is transported from the substrate platform PASS1 to the carrier C, the substrate W is indexed by the indexer robot IR. Is inverted.

  FIGS. 21, 22 and 23 are perspective views showing hand IRH used for indexer robot IR of substrate processing apparatus 100 according to the present embodiment. The indexer robot IR shown in FIGS. 21 to 23 is different from the indexer robot IR shown in FIG. 4 in the configuration of the hand IRH.

  In the following description, the state of the hand IRH in FIG. 21 is a reference state. FIG. 22 shows a hand IRH in a state where a later-described rotating unit 320 is rotated 90 ° from the reference state, and FIG. 23 shows a hand IRH in which the rotating unit 320 is rotated 180 degrees from the reference state. Has been. In FIG. 22, a plurality of substrates W are held by the hand IRH.

  As shown in FIG. 21, the hand IRH according to the present embodiment includes a plurality of hand elements 300, a hand support part 310, a rotating part 320, and a main body part 330. A belt 410, a drive pulley 411, a driven pulley 412 and two guide rails 413 are provided below the hand IRH. In the present embodiment, the belt 410, the driving pulley 411, the driven pulley 412, the guide rail 413, and a motor (not shown) constitute the horizontal movement mechanism 251 shown in FIG.

  The guide rail 413 is attached to the upper surface of the rotary stage 250 in FIG. The main body 330 is attached on the guide rail 413. The belt 410 is stretched over the drive pulley 411 and the driven pulley 412. The belt 410 is held by a belt holding portion 331 formed at the lower end portion of one end surface of the main body portion 330.

  In the present embodiment, drive pulley 411 is rotated by a motor (not shown). The rotational force of the drive pulley 411 is transmitted to the main body 330 via the belt 410 and the belt holding part 331. Accordingly, the main body 330 moves along the guide rail 413.

  As shown in FIGS. 21 to 23, arm portions 332 and 333 are formed at both ends of the main body portion 330 so as to extend upward. A support shaft 334 is rotatably provided on the arm portion 332. The rotation unit 320 is fixed to the support shaft 334, and the hand support unit 310 is fixed to one surface of the rotation unit 320. A plurality of hand elements 300 are provided on one surface 311 (hereinafter referred to as hand surface 311) of the hand support unit 310.

  The arm portion 333 is provided with a motor 335. A gear box 336 is provided on the motor 335. One end of the support shaft 334 is inserted into the gear box 336. An output shaft (not shown) of the motor 335 is connected to the support shaft 334 in the gear box 336 by, for example, a bevel gear or the like.

  In the present embodiment, the support shaft 334 rotates when the motor 335 is driven. Thereby, the rotation unit 320, the hand support unit 310, and the hand element 300 rotate about the support shaft 334 as the rotation axis.

  As shown in FIG. 21, substrate guide portions 401, 402, and 403 are provided on the hand support portion 310 so as to protrude on the hand surface 311. A plurality of groove portions 404 are formed in the substrate guide portions 401, 402, and 403. The substrate guide portion 401 is provided so as to protrude in a direction perpendicular to the hand surface 311 at an intermediate position between each pair of hand elements 300. The substrate guide portions 402 and 403 are provided so as to protrude in a direction perpendicular to the hand surface 311 on both sides of the plurality of hand elements 300.

  FIG. 24 is a diagram showing the hand element 300. In FIG. 24, three hand elements 300 are shown. As shown in FIG. 24, a support pin 301 is provided on the upper surface of the end of each hand element 300 on the hand support portion 310 side, and a support pin 302 is provided on the lower surface. A guide pin 340 is provided on the upper surface of the tip of each hand element 300, and a guide pin 341 is provided on the lower surface.

  FIG. 25 is a perspective view showing the internal configuration of the hand support unit 310, and FIG. 26 is a side view showing the internal configuration of the hand support unit 310.

  As shown in FIG. 25, a fixed plate 800 is provided inside the hand support portion 310. A cylinder 801 and a motor 802 are fixed to the fixed plate 800. In the present embodiment, the cylinder 801 is provided with a piston 803 that moves by hydraulic pressure, for example.

  The tip of the piston 803 is fixed to the moving plate 804. The moving plate 804 is provided on the fixed plate 800 so as to be movable in a direction parallel to the alignment direction of the plurality of hand elements 300.

  As shown in FIG. 26, the moving plate 804 is provided with a projecting portion 805 so as to project to the hand element 300 side. The protrusion 805 has an inclined surface 806. A rotating member 807 having a circular cross section is provided so as to come into contact with the inclined surface 806 of the protruding portion 805. The rotating member 807 is rotatably supported at one end of the support shaft 808. The other end of the support shaft 808 is fixed to the moving plate 809. The moving plate 809 is provided so as to be movable in a direction perpendicular to the hand surface 311 (FIG. 21). Substrate guide portions 401, 402, and 403 in FIG. 21 are provided on the moving plate 809.

  A fixed pin 810 is provided on the moving plate 809. A spring 811 is provided between the fixing pin 810 and the fixing plate 800. The moving plate 809 is biased toward the fixed plate 800 by a spring 811.

  The motor 802 is provided with a rotating shaft 812. A moving member 813 is provided at the tip of the rotation shaft 812 so as to be movable in a direction parallel to the alignment direction of the plurality of hand elements 300. The moving member 813 moves as the rotating shaft 812 rotates. The moving member 813 is connected to the plurality of hand elements 300.

  In the present embodiment, the cylinder 801 is controlled by the control unit 4 shown in FIG. Thereby, the moving plate 804 moves, and the rotating member 807 moves in a direction perpendicular to the hand surface 311 while rotating on the inclined surface 806. As a result, the substrate guide portions 401, 402, and 403 move in a direction perpendicular to the hand surface 311.

  Hereinafter, the operation of the indexer robot IR will be described with reference to the drawings.

  27 and 28 are diagrams showing the relationship between the substrate W and the hand element 300. FIG.

  When taking out the substrate W from the carrier C (FIG. 20), the hand IRH is set to the reference state shown in FIG. In this state, the main body 330 moves in the horizontal direction, and the hand element 300 is inserted into the carrier C. Then, as shown in FIG. 27, the hand element 300 is raised by driving the motor 802 (FIG. 25) so that the lower surface of the substrate W is supported by the support pins 301 and the guide pins 340. Thereby, the substrate W is held by the plurality of hand elements 300.

  Next, the main body 330 moves in the horizontal direction, and the hand element 300 moves backward out of the carrier C. Then, by driving the cylinder 801 (FIG. 25) with the substrate W supported on the support pins 301 and the guide pins 340, the substrate guide portions 401, 402, and 403 are moved to the substrate W side. As a result, the outer peripheral end portion of the substrate W is inserted into the groove portion 404, and the substrate W is sandwiched between the groove portion 404, the support pins 301, and the guide pins 340. In this state, as shown in FIG. 22, the rotating unit 320 and the hand support unit 310 are rotated by 90 ° about the support shaft 334 as the rotation axis. Thereby, the substrate W is supported in the vertical direction. At this time, since the outer peripheral end portion of the substrate W is inserted into the groove portion 404 as described above, the substrate W can be reliably held by the hand IRH.

  Next, as shown in FIG. 28, the hand element 300 is moved in the horizontal direction by driving the motor 802 (FIG. 25) so that the support pins 302 and the guide pins 341 come into contact with the substrate W. Accordingly, the substrate W is sandwiched between the groove 404, the support pin 302, and the guide pin 341. In this state, the main body 330 (FIG. 22) is moved horizontally to the carrier C (FIG. 20) side. Then, as shown in FIG. 23, the rotation unit 320 and the hand support unit 310 are further rotated by 90 ° about the support shaft 334 as the rotation axis. Thereby, the inversion operation of the substrate W is completed.

  Even when the rotating unit 320 and the hand support unit 310 rotate, the substrate W is sandwiched between the groove 404, the support pin 301 (or the support pin 302), and the guide pin 340 (or the guide pin 341). The element 300 can securely hold the substrate W.

  Thereafter, the cylinder guide 801 (402) (FIG. 24) is moved away from the substrate W by driving the cylinder 801 (FIG. 25). Thereby, the substrate W is stably supported on the support pins 302 and the guide pins 341.

  Thereafter, the indexer robot IR moves to a position facing the substrate platform PASS2, the main body 330 moves in the horizontal direction, and the hand element 300 is inserted into the substrate platform PASS2. Then, the hand element 300 is lowered by driving the motor 802 (FIG. 25) so that the support pins 302 and the guide pins 341 are separated from the substrate W. Thereby, the substrate W is placed on the substrate platform PASS2.

  As described above, in the present embodiment, since the indexer robot IR can invert the substrate W, it is not necessary to provide a separate apparatus for inverting the substrate W. Thereby, the footprint of the substrate processing apparatus 100 can be reduced.

  In addition, since the substrate W can be reversed by the indexer robot IR, the time required to reverse the substrate W can be shortened. Thereby, the throughput of the substrate processing apparatus 100 can be improved.

(Modification)
In the above description, the substrate W is reversed by rotating the hand support portion 310 (FIG. 21) by 180 ° with the support shaft 334 (FIG. 21) as the rotation axis. However, the method for reversing the substrate W is limited to the above example. Not.

  For example, a rotation mechanism (for example, a motor or the like provided in the rotation unit 320) that can rotate the hand support unit 310 about the axis L1 (FIGS. 21 and 22) extending vertically from the center point of the hand mounting surface 311. You may provide in hand IRH.

  In this case, the indexer robot IR performs the same operation as described above until the state shown in FIG. 28, that is, the substrate W is supported in the vertical direction and is sandwiched between the groove 404, the support pin 302, and the guide pin 341.

  And in the state shown in FIG. 28, the hand support part 310 is rotated 180 degree | times on the rotating part 320 around the axis line L1. Thereby, the back surface side of the substrate W is directed to the substrate platform PASS1, PASS2 (FIG. 20) side. Further, the rotation stage 250 (FIG. 4) is rotated 180 ° by the rotation mechanism 241 (FIG. 4). Thereby, the surface side of the substrate W is directed to the substrate platform PASS1, PASS2 side. In this state, the hand IRH is returned to the reference state shown in FIG. 21 by rotating the rotating unit 320 (FIG. 21) and the hand support unit 310 (FIG. 21) by 90 ° with the support shaft 334 as the rotation axis. Thereby, the reversing operation of the substrate W is completed.

  After the reversing operation of the substrate W is completed, the indexer robot IR places the substrate W on the substrate platform PASS2 by the same operation as described above.

  As described above, in this example, it is not necessary to rotate the rotating unit 320 by 180 °, so that the burden on the motor 335 (FIG. 22) can be reduced. Thereby, the reliability of the hand IRH is improved.

  Note that the order of the rotation operation of the hand support portion 310 around the axis L1 and the rotation operation of the rotation stage 250 may be reversed.

  Further, the rotation operation around the axis L1 of the hand support portion 310 and the rotation operation of the rotation stage 250 may be performed simultaneously. In this case, the time required to invert the substrate W can be shortened. Thereby, the throughput of the substrate processing apparatus 100 can be improved.

[5] Fifth Embodiment The hand IRH of the indexer robot IR used in the substrate processing apparatus according to the fifth embodiment has the following configuration. FIG. 29 is a view for explaining the structure of the hand IRH used in the substrate processing apparatus according to the fifth embodiment. The hand IRH shown in FIG. 29 is different from the hand IRH shown in FIG. 5 in the following points.

  As shown in FIG. 29, each pair of claw portions 261 of the indexer robot IR of the present embodiment has a position similar to that in FIG. 5 (hereinafter referred to as a normal position) and a position separated from each other (hereinafter referred to as a separated position). It is provided so that it can move between. Further, the claw portion 261 is provided with a plurality of support pins 262a at the same positions as the support pins 262 in FIG. A support pin 262b is provided in the vicinity of each support pin 262a.

  The positions of the support pins 262a and 262b are such that the substrate W is supported by the support pin 262a when the claw portion 261 is set to the normal position, and the support pin 262b when the claw portion 261 is set to the separated position. Is set to support the substrate W.

  Note that the height of the support pin 262a is set higher than that of the support pin 262b. Thereby, when the substrate W is supported by the support pins 262a, the substrate W can be prevented from coming into contact with the support pins 262b.

  In the present embodiment, when the substrate W is transported from the carrier C to the substrate platform PASS2, the claw portion 261 is set to the normal position, and when the substrate W is transported from the substrate platform PASS1 to the carrier C. The claw portion 261 is set at the separated position. Therefore, the substrate W before the cleaning process is supported by the support pins 262a, and the substrate W after the cleaning process is supported by the support pins 262b.

  In this case, even if the deposit on the substrate W before the cleaning process adheres to the support pins 262a, the deposit does not adhere to the support pins 262b. Thereby, the deposit on the substrate W before the cleaning process does not adhere to the substrate W after the cleaning process. As a result, it is possible to reliably prevent the substrate W after the cleaning process from being contaminated when the substrate W after the cleaning process is transported.

[6] Sixth Embodiment A substrate processing apparatus according to a sixth embodiment is different in configuration from the substrate processing apparatus 100 according to the first to fifth embodiments in the following points.

  FIG. 30A is a plan view of a substrate processing apparatus according to the sixth embodiment of the present invention, and FIG. 30B is a schematic view of the substrate processing apparatus of FIG. FIG. Moreover, FIG. 31 is a figure which shows typically the AA line cross section of Fig.31 (a).

  As shown in FIGS. 30 and 31, in the substrate processing apparatus 100 according to the sixth embodiment, instead of the control unit 4 of FIG. 1, a main control unit 4a, an indexer robot control unit 4b, and a main robot use A control unit 4c is provided.

  The main controller 4a includes a processing unit controller. The main control unit 4a receives a command signal from an operation unit provided on the side surface of the substrate transport apparatus 100, and gives an instruction to the indexer robot control unit 4b, the main robot control unit 4c, and the processing unit control unit.

  The indexer robot control unit 4b controls the operation of the indexer robot IR according to an instruction from the main control unit 4a. The main robot control unit 4c controls the operation of the main robot MR in accordance with an instruction from the main control unit 4a. The processing unit controller controls the operation of the front surface cleaning unit SS or the operation of the back surface cleaning unit RSS of FIG.

  In the present embodiment, the indexer robot control unit 4b performs the control operations in steps S1 and S5 in FIG. 15, the main robot control unit 4c performs the control operations in steps S2 and S4 in FIG. 15, and the main control unit 4a. The processing unit controller performs the control operation of step S3 in FIG.

  In the present embodiment, the indexer robot control unit 4b is provided separately from the indexer robot IR, but the indexer robot control unit 4b may be provided in the indexer robot IR. Further, although the main robot control unit 4c is provided separately from the main robot MR, the main robot control unit 4c may be provided in the main robot MR.

  When the main controller 4a, the indexer robot controller 4b, and the main robot controller 4c of the present embodiment are applied to the second embodiment, the operation of the substrate platforms PASS1 and PASS2 is controlled. The substrate placement unit controller is further provided.

[7] Correspondence between each constituent element of claims and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claims and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the carrier mounting table 40 is an example of a container mounting portion, the carrier C is an example of a storage container, the substrate storage groove C2 is an example of a storage groove, and the substrate mounting portions PASS1, PASS2 are It is an example of a substrate mounting shelf or a delivery unit, and support plates 51a, 52a, 51P are examples of storage shelves.

  The indexer robot IR is an example of the substrate transfer device or the first substrate transfer device, and the hand elements 260 and 300 are examples of the substrate holding unit or the first and second substrate holding units. The main robot MR is an example of the second substrate transfer device, and the hands MRH1 and MRH2 are examples of the substrate holding unit. The front surface cleaning unit SS or the back surface cleaning unit RSS is an example of a processing unit or a cleaning processing unit. The processing block 11 is an example of a processing area, and the indexer block 10 is an example of a loading / unloading area.

  Further, the transport rail part 210, the horizontal movement mechanism 211, the movement support column 220, the vertical movement mechanism 221, the elevating support part 230, the base part 240, the rotation mechanism 241, the rotation stage 250, the horizontal movement mechanism 251, the belt 410, and the driving pulley 411. The driven pulley 412 is an example of a drive mechanism.

  Further, the hand support unit 310, the rotation unit 320, the support shaft 334, the motor 335, and the gear box 336 are examples of the reversing mechanism, the cylinder synchronization mechanism 500 and the cylinder 510 are examples of the adjusting mechanism, and the control unit 4 or the indexer robot. The control unit 4b is an example of the control unit.

  In addition, as each component of a claim, the other various element which has the structure or function described in the claim can also be used.

  INDUSTRIAL APPLICABILITY The present invention can be effectively used for manufacturing substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, glass substrates for plasma displays, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. .

(A) is a top view of the substrate processing apparatus which concerns on the 1st Embodiment of this invention, (b) is the typical side view which looked at the substrate processing apparatus of Fig.1 (a) from the direction of arrow X. is there. It is a figure which shows typically the AA line cross section of Fig.1 (a). It is a longitudinal cross-sectional view for demonstrating the structure of the carrier and board | substrate mounting part of FIG. It is a side view of an indexer robot. It is a top view of an indexer robot. (A) is a side view of the main robot, and (b) is a plan view of the main robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a figure for demonstrating operation | movement of an indexer robot. It is a flowchart which shows control of the substrate processing apparatus by a control part. It is a figure for demonstrating the structure of the substrate mounting part used for the substrate processing apparatus which concerns on 2nd Embodiment. FIG. 17 is a diagram illustrating an example of a case where a distance between support plates adjacent in the vertical direction changes in the substrate platform of FIG. 16. It is a figure for demonstrating the structure of the hand used for the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure for demonstrating the structure of the hand used for the substrate processing apparatus which concerns on 3rd Embodiment. (A) is a top view of the substrate processing apparatus which concerns on the 4th Embodiment of this invention, (b) is the typical side view which looked at the substrate processing apparatus of Fig.20 (a) from the direction of arrow X. is there. It is a perspective view which shows the hand used for the indexer robot of the substrate processing apparatus which concerns on 4th Embodiment. It is a perspective view which shows the hand used for the indexer robot of the substrate processing apparatus which concerns on 4th Embodiment. It is a perspective view which shows the hand used for the indexer robot of the substrate processing apparatus which concerns on 4th Embodiment. It is a figure which shows a hand element. It is a perspective view which shows the internal structure of a hand support part. It is a side view which shows the internal structure of a hand support part. It is a figure which shows the relationship between a board | substrate and a hand element. It is a figure which shows the relationship between a board | substrate and a hand element. It is a figure for demonstrating the structure of the hand used for the substrate processing apparatus which concerns on 5th Embodiment. (A) is the top view 6 of the substrate processing apparatus which concerns on the 6th Embodiment of this invention, (b) is the typical side view which looked at the substrate processing apparatus of Fig.30 (a) from the direction of arrow X It is. It is a figure which shows typically the AA line cross section of Fig.30 (a). 10 is a plan view showing a substrate processing apparatus of Patent Document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 4 Control part 4a Main control part 4b Indexer robot control part 4c Main robot control part 10 Indexer block 11 Processing block 40 Carrier mounting stand 51a, 52a, 51P Support plate 100 Substrate processing apparatus 210 Conveying rail part 211 Horizontal movement mechanism 220 Movement Support column 221 Vertical movement mechanism 230 Elevation support section 240 Base section 241 Rotation mechanism 250 Rotation stage 251 Horizontal movement mechanism 260,300 Hand element 261 Claw section 500 Cylinder synchronization mechanism 510 Cylinder C carrier C2 Substrate storage groove IR indexer robot IAM1, IAM2 Articulated arm IRH, MRH1, MRH2 Hand MR Main robot PASS1, PASS2 Substrate placement part PN Support pin SS Surface cleaning unit RSS Back surface cleaning unit W Substrate

Claims (14)

A substrate processing apparatus for processing a substrate,
A container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted;
A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the maximum number of substrates that can be stored in the storage container is mounted in a substantially horizontal posture; ,
A processing unit that performs processing on the substrate conveyed through the substrate mounting shelf;
A plurality of substrate holders that can hold a plurality of substrates at the same time and have the same number as the maximum number of substrates that can be stored in the storage container, between the container mounting portion and the substrate mounting shelf; A first substrate transfer device for transferring a plurality of substrates at once;
A plurality of substrate holding units that can hold the substrates one by one, and a second substrate transfer device that transfers the substrate between the substrate mounting shelf and the processing unit ,
The storage container has a plurality of storage grooves provided at equal intervals, the plurality of storage shelves of the substrate mounting shelf are provided at equal intervals, and the distance between the storage shelves is the distance between the storage grooves A substrate processing apparatus characterized by being larger than the above . The first substrate transfer device includes:
An adjustment mechanism for adjusting a distance between the substrate holding parts;
A control unit that controls the adjustment mechanism and adjusts the distance between the substrate holding units to the distance between the storage shelves when the substrate is transferred between the substrate mounting shelf and the plurality of substrate holding units. the substrate processing apparatus according to claim 1, wherein the containing and. A substrate processing apparatus for processing a substrate,
A container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted;
A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the maximum number of substrates that can be stored in the storage container is mounted in a substantially horizontal posture; ,
A processing unit that performs processing on the substrate conveyed through the substrate mounting shelf;
A plurality of substrate holders that can hold a plurality of substrates at the same time and have the same number as the maximum number of substrates that can be stored in the storage container, between the container mounting portion and the substrate mounting shelf; A first substrate transfer device for transferring a plurality of substrates at once;
A plurality of substrate holding units that can hold the substrates one by one, and a second substrate transfer device that transfers the substrate between the substrate mounting shelf and the processing unit,
The plurality of storage shelves of the substrate mounting shelf are provided at equal intervals, the plurality of substrate holding units are provided at equal intervals, and the distance between the storage shelves is an integral multiple of the distance between the substrate holding units. A substrate processing apparatus. 4. The substrate processing apparatus according to claim 3, wherein the distance between the storage shelves is twice the distance between the substrate holders. A substrate processing apparatus for processing a substrate,
A container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted;
A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the maximum number of substrates that can be stored in the storage container is mounted in a substantially horizontal posture; ,
A processing unit that performs processing on the substrate conveyed through the substrate mounting shelf;
A plurality of substrate holders that can hold a plurality of substrates at the same time and have the same number as the maximum number of substrates that can be stored in the storage container, between the container mounting portion and the substrate mounting shelf; A first substrate transfer device for transferring a plurality of substrates at once;
A plurality of substrate holding units that can hold the substrates one by one, and a second substrate transfer device that transfers the substrate between the substrate mounting shelf and the processing unit,
The plurality of substrate holders include a plurality of first and second substrate holders alternately,
The plurality of storage shelves of the substrate storage shelf include a plurality of first storage shelves and a plurality of second storage shelves,
The plurality of first substrate holders controls the first substrate transport device, and the plurality of first substrate holders transfer the substrates between the substrate mounting shelf and the plurality of substrate holders. Holding the plurality of substrates so that the substrates are transferred to and from the plurality of second storage shelves by the plurality of second substrate holders after the substrates are transferred to and from the storage shelves. A substrate processing apparatus, further comprising a control unit that moves the unit. A substrate processing apparatus for processing a substrate,
A container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted;
A substrate mounting shelf having a plurality of storage shelves arranged so as to face the container mounting portion and on which at least the maximum number of substrates that can be stored in the storage container is mounted in a substantially horizontal posture; ,
A processing unit that performs processing on the substrate conveyed through the substrate mounting shelf;
A plurality of substrate holders that can hold a plurality of substrates at the same time and have the same number as the maximum number of substrates that can be stored in the storage container, between the container mounting portion and the substrate mounting shelf; A first substrate transfer device for transferring a plurality of substrates at once;
A plurality of substrate holding units that can hold the substrates one by one, and a second substrate transfer device that transfers the substrate between the substrate mounting shelf and the processing unit,
The substrate mounting shelf is a substrate processing apparatus, characterized in that it comprises an adjusting mechanism for adjusting the distance between the storage rack. Wherein the plurality of substrate holding portion of the first substrate transport device is disposed so as to be aligned in the vertical direction, according to any one of claims 1 to 6, characterized in that collectively holding a plurality of substrates simultaneously Substrate processing equipment. A substrate processing apparatus for processing a substrate,
A processing area for processing the substrate;
A loading / unloading area for loading and unloading the substrate with respect to the processing area;
A delivery section for delivering a substrate between the processing area and the carry-in / out area;
The carry-in / out area is
A container mounting portion on which a storage container having a plurality of storage grooves in which a plurality of substrates are stored in a substantially horizontal posture is mounted;
A first substrate transport device that transports a substrate between the storage container placed on the container placement unit and the delivery unit;
The processing area is
A processing unit for processing the substrate;
A second substrate transfer device for transferring a substrate between the delivery unit and the processing unit;
The delivery unit is
Including a substrate mounting shelf having a plurality of storage shelves on which the substrate is mounted in a substantially horizontal posture;
The first substrate transfer device includes:
A plurality of substrate holders that are arranged in a vertical direction and hold the substrates in a substantially horizontal posture;
A drive mechanism for moving the plurality of substrate holders to move the substrate between the storage container and the substrate mounting shelf and moving the substrate holder in a substantially horizontal direction;
An adjustment mechanism for adjusting a distance between the substrate holding parts;
The adjustment mechanism is controlled to adjust the distance between the substrate holders to the distance between the storage grooves when transferring the substrate between the storage container and the plurality of substrate holders. A controller that adjusts the distance between the substrate holders to the distance between the storage shelves when the substrate is transferred between the placement shelf and the plurality of substrate holders ;
The plurality of storage grooves of the storage container are provided at equal intervals, the plurality of storage shelves of the substrate mounting shelf are provided at equal intervals, and the distance between the storage shelves is greater than the distance between the storage grooves. Is a large substrate processing apparatus. The substrate processing apparatus according to claim 8 , wherein the drive mechanism moves the plurality of substrate holding units simultaneously. The substrate processing apparatus according to claim 9 , wherein a distance between the storage shelves of the substrate mounting shelf is an integral multiple of a distance between the storage grooves of the storage container. The distance between the storage shelves of the substrate platform shelf, the substrate processing apparatus according to claim 9 or 10, wherein the twice the distance between the receiving groove of the receiving container. Wherein the processing unit, the substrate processing apparatus according to any one of claims 1 to 11, characterized in that it comprises a cleaning unit for cleaning the substrate. Said first substrate transport apparatus, the substrate processing apparatus according to any one of claims 1 to 12, further comprising a reversing mechanism for reversing the substrate. A container mounting portion on which a storage container in which a plurality of substrates are stored in a substantially horizontal posture is mounted, and a plurality of substrates on which at least the same number of substrates that can be stored in the storage container are mounted in a substantially horizontal posture. A substrate processing method for processing a substrate by a substrate processing apparatus including a substrate mounting shelf having a stage storage shelf,
A plurality of substrate holding units having the same number of substrates as the maximum number of substrates that can be stored in the storage container, a plurality of the storage containers placed on the container placement unit are placed on the substrate placement shelf. A step of transferring a plurality of substrates in a batch,
Sequentially transferring the substrates from the substrate mounting shelf to the processing unit by a second substrate transfer device having a plurality of substrate holding units capable of holding the substrates one by one;
Processing the substrate transferred by the second substrate transfer apparatus by the processing unit;
Sequentially transporting the substrate after processing by the processing unit to the substrate mounting shelf by the second substrate transport device;
A plurality of processed substrates transferred to the substrate mounting shelf are collectively transferred to the storage container mounted on the container mounting unit by the first substrate transfer device ;
The plurality of substrate holders include a plurality of first and second substrate holders alternately,
The plurality of storage shelves of the substrate storage shelf include a plurality of first storage shelves and a plurality of second storage shelves,
When the substrates are transferred between the substrate mounting shelf and the plurality of substrate holding units, the plurality of first substrate holding units can transfer the substrates between the plurality of first storage shelves. substrate moving the plurality of substrate holders as transferring the substrate is performed between said plurality of second storage rack by the plurality of second substrate supporting unit after being made, characterized in Rukoto Processing method.

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