CN112930251A

CN112930251A - Substrate conveying device

Info

Publication number: CN112930251A
Application number: CN201980071082.XA
Authority: CN
Inventors: 开田准一
Original assignee: Hirata Corp
Current assignee: Hirata Corp
Priority date: 2018-12-11
Filing date: 2019-12-11
Publication date: 2021-06-08
Also published as: TW202032708A; TWI732377B; WO2020122133A1; JP2020096032A; JP7175735B2

Abstract

The invention provides a substrate conveying device which is compact in structure and high in throughput of substrate processing. The substrate transfer device includes a substrate transfer module and an atmospheric transfer robot provided inside the substrate transfer module, the atmospheric transfer robot having a robot base portion that can freely travel relative to the substrate transfer module. The substrate transfer apparatus further includes a substrate aligner provided above the robot base and having at least two substrate placement stages for aligning the substrate.

Description

Substrate conveying device

Technical Field

The present invention relates to a substrate transport apparatus, and more particularly, to a substrate transport apparatus that takes out a substrate from a container storing the substrate and delivers the substrate to a processing apparatus that performs various processes on the substrate.

The present application claims priority to Japanese patent application No. 2018-231643, filed 12/11/2018, the contents of which are incorporated herein by reference.

Background

The substrate transfer apparatus includes an atmospheric transfer robot that takes out a wafer (hereinafter, referred to as a wafer) from a container that stores the substrate therein, and transfers the wafer. The atmospheric transfer robot can travel along a travel guide and is provided with an end effector at the tip thereof. The atmospheric transfer robot takes out or reloads the wafer with the end effector by extending/bending its arm unit. In the substrate transfer apparatus, a wafer taken out by an end effector is transferred to a substrate aligner, and the orientation of the wafer is adjusted to a predetermined orientation by the substrate aligner to perform centering of the wafer.

In this way, the wafer is transferred by the air transfer robot and the orientation and center position of the wafer are adjusted by the substrate aligner (see patent document 1).

Further, as a substrate transfer apparatus, there is known a structure in which a holding shaft (hereinafter, referred to as a substrate aligner) is provided integrally with an air transfer robot. In this substrate transport apparatus, the arm unit of the atmospheric transport robot is extended and raised, and the end effector advances to the wafer pickup position of the cassette and lifts the wafer upward. Then, the end effector moves to a position directly above the substrate aligner by bending and lowering the arm unit, and the wafer is transferred to the substrate aligner.

In this way, by providing the substrate aligner integrally with the atmospheric transfer robot, it is not necessary to make the atmospheric transfer robot travel to the position of the substrate aligner in order to align the wafer. Therefore, the moving distance of the air transfer robot, that is, the cycle time of substrate processing in the substrate transfer device can be shortened as compared with the conventional one (see patent document 2).

Prior art documents

Patent document

Patent document 1: japanese laid-open patent publication No. 2009-21504

Patent document 2: japanese laid-open patent publication No. 8-255821

Disclosure of Invention

Summary of the invention

Problems to be solved by the invention

The substrate transfer apparatuses of patent documents 1 and 2 include only one substrate aligner. In particular, in the case of patent document 2, even if the substrate is taken out by each robot arm, the alignment of the wafer by the substrate aligner can be performed only one by one. Therefore, while the wafer alignment by one robot arm is performed, the wafer by the other robot arm is on standby, and the substrate aligner becomes a bottleneck in shortening the cycle time of the substrate processing. Therefore, it is conceivable to provide a plurality of substrate aligners in the substrate transport apparatus, but the apparatus structure becomes large-scale according to the number of the substrates to be provided. Further, due to the progress of IoT in recent years, the demand for shortening the cycle time in substrate processing has further increased.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate transport apparatus having a compact apparatus configuration and high throughput of substrate processing.

Means for solving the problems

The substrate transfer apparatus of the present invention includes a substrate transfer module, and an atmospheric transfer robot provided inside the substrate transfer module, wherein the atmospheric transfer robot has a robot base portion that can freely travel relative to the substrate transfer module, and the substrate transfer apparatus further includes a substrate aligner provided above the robot base portion and having at least two substrate placement stages that align the orientation of a substrate.

In the substrate transport apparatus according to the present invention, the atmospheric transport robot may include: a pair of arm units rotatably supported by the robot base and capable of extending and bending; and end effectors which are provided at the front ends of the pair of arm units, respectively, and which have placement portions on which the substrates can be placed in upper and lower stages.

In the substrate transport apparatus according to the present invention, the substrate aligner may include a substrate temporary placement unit above each of the substrate placement tables.

In the substrate transport apparatus according to the present invention, the substrate aligner may include: at least two substrate mounting tables for aligning the orientation of the substrate; and a base part for setting the substrate carrying platforms.

In the substrate transport apparatus according to the present invention, the substrate aligner may include at least two substrate aligners, each substrate aligner including: a substrate mounting table for aligning the orientation of the substrate; and a base part for setting the substrate placing table.

In the substrate transport apparatus according to the present invention, the substrate transport apparatus may further include a load lock chamber connected to the substrate transport module and having a polygonal shape in a plan view, and the load lock chamber may have an opening for carrying in or carrying out the substrate on a surface connected to the substrate transport module and a surface adjacent to the surface connected to the substrate transport module.

In the substrate transport apparatus according to the present invention, the substrate transport module may be connected to two load lock chambers, the two load lock chambers may be provided such that the adjacent surfaces thereof face each other, and the openings may be provided in the facing adjacent surfaces.

Effects of the invention

According to the present invention, a substrate transport apparatus having a compact apparatus structure and high throughput of substrate processing can be obtained.

Drawings

Fig. 1 is a plan view showing a substrate transport apparatus according to the present invention.

Fig. 2 is an enlarged view of a portion II of fig. 1.

Fig. 3 is an enlarged view of a portion III of fig. 2.

Fig. 4 is a perspective view showing a substrate aligner of the substrate transport apparatus.

Fig. 5 is a front view showing a substrate aligner of the substrate transport apparatus.

Fig. 6A is a perspective view illustrating an example in which a wafer is placed on the first substrate placement stage and the first buffer of the substrate transfer apparatus.

Fig. 6B is a perspective view of an example of positioning the wafer placed on the first and second substrate placement tables of the substrate transport apparatus in the direction of the wafer, and reading the ID.

Fig. 7A is a perspective view illustrating an example in which the wafers in the first and second buffers of the substrate transport apparatus are placed on the first and second substrate placement tables, and the orientation of the wafers is aligned and the ID is read.

Fig. 7B is a perspective view illustrating an example in which the atmospheric transfer robot takes out the wafer on the first substrate placement stage of the substrate transfer device.

Fig. 8 is a plan view showing the first load lock chamber of the substrate transport apparatus.

Fig. 9 is a schematic sectional view showing a first load lock chamber of the substrate transport apparatus.

Detailed Description

Hereinafter, embodiments of the substrate transport apparatus according to the present invention will be described.

As shown in fig. 1, the substrate transport apparatus 10 includes a substrate transport module (EFEM)12, an atmospheric transport robot 14, and a substrate aligner 15. A plurality of load ports 13 are connected to a front surface (a lower surface in fig. 1) of a housing outer wall 22 in the substrate transport module 12. Further, a plurality of

load lock chambers

16, 17 are provided on the rear surface (upper surface in fig. 1) of the housing outer wall 22 in the substrate transport module 12, and a vacuum transport module 18 is provided between the

load lock chambers

16, 17.

In the substrate transport module 12, a guide mechanism 24 and a drive mechanism 220 are provided on the housing inner wall 21 of the substrate transport module 12. The guide mechanism 24 is provided on the bottom surface of the housing inner wall 21 of the substrate transport module 12, and includes a pair of

guide rails

24a and 24b and a rack 24c provided along one of the guide rails 24a (or 24 b). The drive mechanism 220 provided in the robot base 25 of the air transfer robot 14 includes: a pair of engaged portions (sliders) 124a and 124b that engage with the

guide rails

24a and 24b, respectively; a pinion 225 meshed with the rack 24 c; and a drive source 224 that drives a pinion 225. In the present embodiment, the description has been given of the rack and pinion using the rack 24c and the pinion 225 as the linear motion mechanism for moving the transfer robot 14, but the present invention is not limited thereto. For example, all the linear motion mechanisms conventionally used for the traveling of a robot may be replaced.

The load port 13 is a device for opening and closing the door 32a of the FOUP 32. The FOUP32 is a container having a shelf for placing 25 layers, for example, and is placed on the load port 13. The semiconductor wafers (substrates) 35 are respectively accommodated in the 25-stage placement shelves. In this embodiment, an example in which 25 semiconductor wafers 35 are accommodated in FOUP32 is described, but the number of semiconductor wafers 35 accommodated in FOUP32 may be appropriately selected.

By opening the door 32a of the FOUP32 through the load port 13, the semiconductor wafer 35 accommodated in the FOUP32 faces the housing inner wall 21, and the semiconductor wafer 35 can be transferred between the FOUP32 and the atmospheric transfer robot 14.

As shown in fig. 2, an atmospheric transfer robot 14 is provided inside the substrate transfer module 12. The air transfer robot 14 includes a robot base 25, a pair of

arm units

26 and 27,

end effectors

28 and 29 provided at the distal ends of the

arm units

26 and 27, and a substrate aligner 15 described later.

The robot base 25 is supported by the guide mechanism 24 so as to be movable in the substrate transport module 12. Thus, the air transfer robot 14 can freely access both the plurality of load ports 13 and the

load lock chambers

16 and 17. The pair of

arm units

26 and 27 are supported by the robot base 25 so as to be rotatable and liftable. The robot base 25 includes therein a lifting mechanism and a turning mechanism, not shown. Thereby, the pair of

arm units

26 and 27 can be freely raised and lowered and rotated with respect to the robot base 25.

As shown in fig. 3, the first arm unit 26 of the pair of

arm units

26 and 27 includes a first arm 41 and a second arm 42 that are connected to each other in an extendable and bendable manner. Specifically, the base of the first arm 41 is rotatably connected to the robot base 25, and the base of the second arm 42 is rotatably connected to the tip of the first arm 41. The first end effector 28 is connected to the tip of the second arm 42.

The second arm unit 27 includes a third arm 45 and a fourth arm 46 that are connected to each other in an extendable and bendable manner, as in the first arm unit 26. Specifically, the base of the third arm 45 is coupled to the robot base 25. The base of the fourth arm 46 is rotatably connected to the tip of the third arm 45. Further, the second end effector 29 is connected to the tip of the fourth arm 46.

The first end effector 28 includes an upper hand member (placement portion) 51 and a lower hand member (placement portion) 52. The upper hand member 51 and the lower hand member 52 are arranged in two upper and lower stages with their relative positions in the vertical direction and the horizontal direction fixed. The wafer 35 is placed on the upper hand member 51 and the lower hand member 52.

Like the first end effector 28, the second end effector 29 includes an upper hand member (placement portion) 53 and a lower hand member (placement portion) 54. The upper hand member 53 and the lower hand member 54 are arranged in two upper and lower layers, similarly to the upper hand member 51 and the lower hand member 52 of the first end effector 28. The wafer 35 is similarly placed on the upper hand member 53 and the lower hand member 54.

In a state where the first arm unit 26 and the second arm unit 27 are bent (the state of fig. 3), the second end effector 29 is disposed below the first end effector 28 so as to overlap.

As shown in fig. 2, 4, and 5, the substrate aligner 15 is provided on an upper portion 25a of the robot base 25. In other words, the substrate aligner 15 is provided integrally with the robot base 25. The substrate aligner 15 includes one base portion 56, two substrate placement tables 57 and 58, two notch

portion detection mechanisms

61 and 62, and one ID reading mechanism 63. The substrate aligner 15 is a dual aligner including two substrate mounting tables 57 and 58, and can align two wafers 35 substantially simultaneously as described later. Hereinafter, one of the two substrate mounting tables 57 and 58 will be described as the first substrate mounting table 57, and the other will be described as the second substrate mounting table 58, and one of the two

notch detection mechanisms

61 and 62 will be described as the first notch detection mechanism 61, and the other will be described as the notch detection mechanism 62.

The first substrate mounting table 57 and the second substrate mounting table 58 are rotatably supported at an interval on the upper portion 56a of the base portion 56. The wafer 35 of the first end effector 28 is placed on the second substrate placing table 58. The wafer 35 of the second end effector 29 is placed on the first substrate placing table 57. In other words, the first arm unit 26 mounts the wafer 35 on the second substrate mounting table 58, and the second arm unit 27 mounts the wafer 35 on the first substrate mounting table 57. The first substrate mounting table 57 and the second substrate mounting table 58 are formed so that the wafers 35 mounted on the substrate mounting tables 57 and 58 can be arranged in a horizontal plane.

Further, in the upper portion 56a of the base portion 56, a first notch detection mechanism 61 is provided at one end portion (right lower end portion in fig. 4) 56b on the first substrate mounting table 57 side, and a second notch detection mechanism 62 is provided at the other end portion (left upper end portion in fig. 4) 56c on the second substrate mounting table 58 side. The first notch detecting mechanism 61 and the second notch detecting mechanism 62 are provided to face the edges of the wafers 35 mounted on the first substrate mounting table 57 and the second substrate mounting table 58, respectively, and detect the positions of the notches in the circumferential direction of the wafers 35, respectively.

Further, one ID reading mechanism 63 is provided between the first substrate mounting table 57 and the second substrate mounting table 58 in the upper portion 56a of the base portion 56. The upper surface of the ID reading mechanism 63 is disposed facing the upper portion 56a of the base portion 56. The ID reading mechanism 63 reads the ID of the edge back surface of the wafer 35 placed on the first substrate placing table 57 and the second substrate placing table 58, and detects, for example, processing information, history, and the like of the wafer 35.

According to the substrate aligner 15, in a state where the wafers 35 are placed on the first substrate placing table 57 and the second substrate placing table 58, each wafer 35 is rotated by rotating the first substrate placing table 57 and the second substrate placing table 58. Then, the positions of the notches (notches) provided at the edges of the wafers 35 are detected by the first notch detection mechanism 61 and the second notch detection mechanism 62. Then, based on the detection information, the rotation of the first substrate mounting table 57 and the second substrate mounting table 58 is controlled, and the orientation of the wafer 35 is adjusted so that the notch reaches a predetermined position. Thereby, the wafers 35 are aligned so that the crystal orientations of the wafers 35 face in arbitrary directions. The ID reading mechanism 63 reads the ID of each wafer 35 and detects the processing information, history, and the like of the wafer 35.

Thus, two substrate mounting tables 57 and 58 are provided on one base portion 56 of the substrate aligner 15. Further, one ID reading mechanism 63 is provided between the two substrate mounting tables 57, 58, and the ID of each wafer 35 mounted on the two substrate mounting tables 57, 58 is read alternately. That is, the ID reading mechanism 63, which is an expensive detection device, is shared and used in one, thereby reducing the apparatus cost.

Next, an example of reading the ID of the wafer 35 by aligning the wafer 35 by the substrate aligner 15 will be described based on fig. 2, 3, 6A, 6B, 7A, and 7B.

The air transfer robot 14 is advanced so that the robot base 25 is positioned in front of the desired load port 13 and the

arm units

26 and 27 are opposed to the load port 13. Thereafter, the air transfer robot 14 shown in fig. 2 is driven to extend the

arm units

26 and 27 toward the FOUP 32. Then, the wafer 35 stored in the FOUP32 is picked up by the upper hand 51 and the lower hand 52 of the first end effector 28 and the upper hand 53 and the lower hand 54 of the second end effector 29, and the wafer 35 is transferred from the FOUP32 to each hand. Thereafter, the

arm units

26 and 27 are retracted toward the robot base 25, and the wafer 35 is taken out.

Thereafter, the

arm units

26 and 27 are rotated with respect to the robot base 25, and the

arm units

26 and 27 are aligned with the substrate aligner 15.

Hereinafter, the wafer 35 placed on the lower hand member 52 of the first end effector 28 is referred to as "wafer 35A", and the wafer 35 placed on the upper hand member 51 of the first end effector 28 is referred to as "wafer 35C". The wafer 35 placed on the lower hand 54 of the second end effector 29 is referred to as "wafer 35B", and the wafer 35 placed on the upper hand 53 of the second end effector 29 is referred to as "wafer 35D".

The atmospheric transfer robot 14 is driven to extend the

arm units

26 and 27 toward the substrate aligner 15. As shown in fig. 3 and 6A, the wafer 35A placed on the lower hand member 52 of the first end effector 28 in the arm unit 26 is transferred to the first substrate placement stage 57. Thereafter, the robot base 25 is rotated to transfer the wafer 35C of the upper hand 51 of the first end effector 28 to the second substrate mounting table 58. Thereafter, the alignment of the wafers 35A and 35C is performed on the two substrate mounting tables 57 and 58.

After the first alignment is completed, the wafer 35C on the second substrate mounting table 58 is picked up by the upper hand member 51 of the first end effector 28 in the arm unit 26, and the wafer 35B placed on the lower hand member 54 of the second end effector 29 in the arm unit 27 is transferred to the second substrate mounting table 58. Thereafter, the robot base 25 is rotated in the opposite direction, the wafer 35A on the first substrate mounting table 57 is picked up by the lower hand member 52 of the first end effector 28 in the arm unit 26, and the wafer 35D placed on the upper hand member 53 of the second end effector 29 in the arm unit 27 is transferred to the first substrate mounting table 57. Thereafter, the alignment of the

wafers

35B and 35D is performed on the two substrate mounting tables 57 and 58.

After the second alignment is completed, the wafer 35D of the first substrate placing table 57 is scooped up by the upper hand member 53 of the second end effector 29 in the arm unit 27. Then, the robot base 25 is rotated, and the wafer 35B of the second substrate placing table 58 is scooped up by the lower hand member 54 of the second end effector 29 in the arm unit 27.

Here, by driving the substrate aligner 15 and rotating the first substrate mounting table 57 and the second substrate mounting table 58, the wafer 35A mounted on the first substrate mounting table 57 and the wafer 35C mounted on the second substrate mounting table 58 are rotated. By the rotation of the wafer 35A and the wafer 35C, the first notch detection mechanism 61 and the second notch detection mechanism 62 detect the notches of the wafers 35A and 35C. Then, based on the detection information, the rotation of the first substrate mounting table 57 and the second substrate mounting table 58 is controlled, and the wafers 35A and 35C are aligned so that the cutouts reach predetermined positions. When the wafers 35A and 35C rotate, the ID reading mechanism 63 reads the IDs of the wafers 35A and 35C, and detects the process information, history, and the like of the wafers 35A and 35C.

Thereafter, the atmospheric transfer robot 14 is driven again to extend the

arm units

26 and 27 toward the substrate aligner 15. The wafer 35C, which has been aligned and ID read, is picked up from the second substrate mounting table 58 by the upper hand member 51 of the first end effector 28 and transferred. Then, the robot base 25 is rotated again, and the

arm units

26 and 27 are extended toward the substrate aligner 15. The wafer 35A, which has been aligned and ID read, is picked up from the first substrate mounting table 57 by the lower hand member 52 of the first end effector 28 and transferred.

The substrate aligner 15 is driven again to rotate the first substrate mounting table 57 and the second substrate mounting table 58, whereby the wafer 35B mounted on the first substrate mounting table 57 and the wafer 35D mounted on the second substrate mounting table 58 are rotated. By the rotation of the wafer 35B and the wafer 35D, the first notch detection mechanism 61 and the second notch detection mechanism 62 detect the notches of the

wafers

35B and 35D. Then, based on the detection information, the rotation of the first substrate mounting table 57 and the second substrate mounting table 58 is controlled, and the

wafers

35B and 35D are aligned so that the cutouts reach predetermined positions. When the

wafers

35B and 35D rotate, the ID reading mechanism 63 reads the IDs of the wafers 35A and 35C, and detects the process information, history, and the like of the wafers 35A and 35C.

After that, the arm unit 27 is elongated again toward the substrate aligner 15. As shown in fig. 3 and 7B, the wafer 35B, which has been aligned and ID read, is picked up from the first substrate mounting table 57 by the upper hand member 53 of the second end effector 29 and transferred. Then, the robot base 25 is rotated again, and the arm unit 27 is extended toward the substrate aligner 15. The wafer 35D, which has been aligned and ID read, is picked up from the second substrate mounting table 58 by the lower hand 54 of the first end effector 28 and transferred.

Thus, the wafers 35C and 35A, the IDs of which have been read, are placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28, respectively. Further, the

wafers

35B and 35D, the IDs of which have been read, are placed on the upper hand member 53 and the lower hand member 54 of the second end effector 29, respectively. That is, the alignment of all the wafers 35A to 35D placed on the hand members is completed.

Thereafter, the atmospheric transfer robot 14 is advanced so that the robot base 25 is positioned in front of the desired load lock chamber 16 (or 17). Thereafter, the atmospheric transfer robot 14 is driven so that the

arm units

26 and 27 face the load lock chamber 16. Thereafter, each

arm unit

26, 27 is extended toward the load lock chamber 16. The

wafers

35C, 35A, 35B, and 35D placed on the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 and 54 of the second end effector 29 are all carried into the first load-lock chamber 16 (or the second load-lock chamber 17). The second load lock chamber 17 is shown in fig. 1. Here, the travel and alignment of the atmospheric transfer robot 14 are preferably performed during the alignment of the wafer 35. This makes it possible to perform alignment of the wafer 35 and travel of the air transfer robot 14 in parallel, thereby shortening the cycle time and improving the throughput.

In the substrate transport apparatus 10 according to the present embodiment, since the atmospheric transport robot 14 is provided to be able to advance freely, all the load ports 13 and the two

load lock chambers

16 and 17 can be covered by one robot, unlike the fixed-rotation type transport robot in the conventional substrate transport apparatus. Therefore, the operation rate of each atmospheric transfer robot is increased, and the apparatus cost can be suppressed. The substrate aligner 15 capable of aligning the two wafers 35 is integrally provided in the robot base 25 of the air transfer robot 14, and the substrate aligner 15 always follows the travel of the air transfer robot 14. Therefore, during the travel of the atmospheric transfer robot 14, the alignment of the wafer 35 can be performed. Therefore, the cycle time of the substrate transport apparatus 10 is shortened, and the throughput is improved.

While the wafer 35 is aligned by the substrate aligner 15, the operation of the atmospheric transfer robot 14 (see fig. 2) is temporarily stopped (idle time is generated). However, as shown in fig. 4 and 5, the substrate aligner 15 includes two substrate mounting tables 57 and 58, and can simultaneously align two wafers 35 in parallel. Therefore, the idle time of the air transfer robot 14 is reduced by half in the substrate transfer apparatus 10 according to the present embodiment, as compared with a conventional substrate transfer apparatus in which the substrate placing stage includes one substrate aligner. This can shorten the cycle time of the substrate transport apparatus in the continuous processing of the wafer 35, and can improve the throughput. Further, the substrate aligner 15 includes a first buffer 64a and a second buffer 64b above the first substrate mounting table 57 and the second substrate mounting table 58, and can align four wafers 35 in a total of the upper and lower layers at a time. Therefore, the throughput of the substrate transport apparatus can be further improved.

Returning to fig. 1 and 2, two

load lock chambers

16 and 17 are connected to the other long wall 22b of the housing outer wall 22 of the substrate transport module 12. Hereinafter, of the two

load lock chambers

16 and 17, the load lock chamber connected to one side of the vacuum transfer module 18 is referred to as a first load lock chamber 16, and the load lock chamber connected to the other side of the vacuum transfer module 18 is referred to as a second load lock chamber 17.

The first and second

load lock chambers

16 and 17 are symmetrical with respect to the vacuum transfer module 18. Hereinafter, the second load lock chamber 17 is denoted by the same reference numerals as those of the first load lock chamber 16, and detailed description of the second load lock chamber 17 will be omitted.

As shown in fig. 8 and 9, the first load-lock chamber 16 includes a frame 71, a first gate valve mechanism (gate valve mechanism) 72, a second gate valve mechanism (gate valve mechanism) 73, a plurality of stages of substrate mounting portions 74, and an elevation/rotation unit 75.

The frame 71 has a polygonal shape in plan view, and has a first surface 71a, a second surface 71b, a third surface 71c, and a fourth surface 71 d. In the present embodiment, a quadrangular shape in plan view is exemplified as the frame 71, but the frame 71 may be formed in another polygonal shape.

The first surface 71a is a surface of the housing outer wall 22 of the substrate transport module 12 connected to the other long wall 22 b. The first surface 71a is formed with a first opening (opening) 77. The second surface 71b is a surface adjacent to the first surface 71 a. The second surface 71b is provided with a second opening (opening) 78. In this way, the first opening 77 and the second opening 78 are provided in the adjacent first surface 71a and second surface 71b, respectively. The first opening 77 and the second opening 78 have a sufficient height to transfer the four wafers 35 to the upper and lower hand members 51, 52 of the first end effector 28 and the upper and lower hand members 53, 54 of the second end effector 29 as soon as possible.

The wafer 35 is transferred from the substrate transfer module 12 side to the interior of the first load lock chamber 16 (the multi-stage substrate placement unit 74) through the first opening 77 by the atmospheric transfer robot 14 (in the direction of arrow a). Then, the wafer 35 inside the first load lock chamber 16 is taken out (in the direction of arrow B) through the second opening 78 by a vacuum transfer robot (not shown) in the vacuum transfer module 18. The vacuum transfer robot is supported in the vacuum transfer module 18 so as to be rotatable about a rotation shaft 81. When the wafer 35 is transferred from the vacuum transfer module 18 to the substrate transfer module 12 through the first load lock chamber 16, the wafer 35 is transferred in the direction of arrow C and the direction of arrow D in this order.

Here, the intersection angle θ 1 between the carrying-in direction (arrow a direction) of the wafer 35 and the carrying-out direction (arrow B direction) of the wafer 35 is 90 ° (right angle). That is, the path for carrying in and carrying out the wafer 35 is L-shaped. Thus, when the vacuum transport module 18 is connected to the first load lock chamber 16, the installation position of the vacuum transport module 18 approaches the substrate transport module 12 side indefinitely. As a result, the gap between the substrate transport module 12 and the vacuum transport module 18 is reduced, and the dead space is reduced. Therefore, the substrate transport module 12 and the vacuum transport module 18 can have a smaller overall length and depth, i.e., a smaller footprint, and the volume of a housing (not shown) constituting the cleaning space can be reduced accordingly. The wafer 35 taken out by the vacuum transfer robot in the vacuum transfer module 18 is transferred to a transfer module chamber (vacuum chamber). The transfer module chamber is connected to the surface of the vacuum transfer module 18 opposite the substrate transfer module 12. At this time, the vacuum transfer robot can be aligned with the transfer module chamber only by rotating the vacuum transfer robot at a rotation angle θ 2 of 90 °. Here, in the conventional vacuum transfer robot, the intersection angle θ 1 is larger than 90 °, for example, 120 ° to 150 °. The rotation angle theta 2 of the vacuum transfer robot at this time is 120-150 deg. That is, in the substrate transport apparatus 10 of the present embodiment, the rotation angle θ 2 of the vacuum transport robot can be reduced compared to the conventional one. Therefore, the turning angle is reduced, and the cycle time from the start of turning to the end of turning of the vacuum transfer robot can be shortened accordingly. Thus, the cycle time can be shortened in the step of taking out the wafer 35 from the second opening 78 and carrying it into the transfer module by the vacuum transfer robot.

Between the first load lock chamber 16 and the substrate transport module 12, the four wafers 35 are carried in and out together through the first opening 77 by the first end effector 28 and the second end effector 29 of the atmospheric transport robot 14. That is, the four wafers 35 placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28 and the upper hand member 53 and the lower hand member 54 of the second end effector 29 shown in fig. 3 are all carried into the first load-lock chamber 16 through the first opening 77.

Further, between the first load lock chamber 16 and the vacuum transfer module 18, the wafer 35 is carried in and out through the second opening 78 by the vacuum transfer robot.

As shown in fig. 1, the second openings 78 of the first load lock chamber 16 and the second load lock chamber 17 are provided at opposing positions. The two second opening portions 78 are openings connected to the vacuum transfer module 18. Thereby, the vacuum transfer module 18 can be disposed in the space between the first load lock chamber 16 and the second load lock chamber 17. Thus, the vacuum transfer module 18 can be disposed adjacent to the other long wall 22b of the housing outer wall 22 of the substrate transfer module 12.

The first opening 77 is openable and closable by the first gate valve mechanism 72, and can be hermetically sealed. The first gate valve mechanism 72 includes a first gate valve 84 and a first opening/closing mechanism (not shown). The first gate valve 84 is supported to be movable up and down between a closed position for closing the first opening 77 and an open position for opening the first opening 77. The first gate valve 84 is connected to a first opening/closing mechanism. By operating the first opening/closing mechanism, the first gate valve 84 is lifted and lowered to open and close the first opening 77. In a state where the first opening 77 is closed by the first gate valve 84, the first opening 77 is sealed in an airtight state by the first gate valve 84.

The second opening 78 is openable and closable by the second gate valve mechanism 73, and can be hermetically sealed. The second gate valve mechanism 73 includes a second gate valve 85 and a second opening/closing mechanism 86, as in the first gate valve mechanism 72. The second gate valve 85 is supported to be movable between a closed position for closing the second opening 78 and an open position for opening the second opening 78. The second gate valve 85 is connected to a second opening/closing mechanism 86. By operating the second opening/closing mechanism 86, the second gate valve 85 is lifted and lowered to open and close the second opening 78. In a state where the second opening 78 is closed by the second gate valve 85, the second opening 78 is sealed in an airtight state by the second gate valve 85.

A plurality of substrate mounting portions 74 are provided inside the housing 71. The multi-layer substrate mounting section 74 includes, for example, shelves in which at least 25 layers are arranged in the vertical direction, and can accommodate 25 wafers 35 at a time.

Here, in the

FOUP box

32, 25 wafers 35 can be normally housed. Therefore, the substrate placement units 74 in multiple stages can accommodate the wafers 35 of the FOUP box 32 at once.

In the present embodiment, an example in which 25 semiconductor wafers 35 are accommodated in the multi-layered substrate mounting unit 74 has been described, but the number of semiconductor wafers 35 accommodated in the multi-layered substrate mounting unit 74 can be appropriately selected.

The lifting/lowering/rotating unit 75 is connected to the multi-layered substrate mounting portion 74. The lifting/lowering/rotating unit 75 includes a lifting mechanism 75a and a rotating mechanism 75 b. The elevating mechanism 75a is a mechanism for elevating the substrate mounting unit 74 in multiple stages. For example, four wafers 35 are transferred to any four layers of the substrate mounting unit 74 by the air transfer robot 14 through the first opening 77, and then the substrate mounting unit 74 is raised four layers as a whole by the elevating mechanism 75 a. Thereafter, the four new wafers 35 are sequentially transferred to and accommodated in the substrate mounting portion 74 by repeating this process, thereby transferring and accommodating the wafers 35 to all desired layers of the substrate mounting portion 74.

The rotation mechanism 75b rotates the substrate mounting portion 74 of the plurality of layers about a vertical axis (i.e., a rotation center axis) 88. The multilayer substrate mounting portion 74 is provided at a position shifted by L2 from the rotation center axis 88 toward the substrate transport module 12 side at the center position 89 of the multilayer substrate mounting portion 74. For example, after the wafers 35 are transferred and stored in all desired layers of the substrate placement unit 74, the entire substrate placement unit 74 is rotated by 90 ° toward the vacuum transfer module 18 by the rotation mechanism 75 b. Thereafter, the wafer 35 is taken out from the substrate placement unit 74 by the vacuum transfer robot in the vacuum transfer module 18.

Here, the center of the wafer 35 placed on the multi-layered substrate placement unit 74 through the first opening 77 is located at the center position 89 of the multi-layered substrate placement unit 74. That is, the wafer 35 is positioned at a position shifted toward the first opening 77 side from the rotation center axis 88 of the rotation mechanism 75b in a state of being placed on the substrate placement unit 74 having a plurality of stages.

Thus, when the atmospheric transfer robot 14 carries the wafer 35 from the substrate transfer module 12 to the substrate placement units 74 in a plurality of stages, the carrying-in/carrying-out stroke (extension/retraction stroke) of the atmospheric transfer robot 14 can be shortened. As a result, the carrying-in/out stroke is shortened, and the cycle time when the wafer 35 is carried into the substrate placement units 74 of the plurality of stages from the substrate transport module 12 can be shortened accordingly.

Next, first to third modifications of the present embodiment will be described.

(first modification)

In the substrate transport apparatus 10 of the present embodiment, the two substrate placement tables 57 and 58 are provided at the same time in the base portion 56 of the substrate aligner 15, and one ID reading mechanism 63 is used for reading the ID of each wafer 35.

For example, as in the present modification, two existing individual aligners may be arranged side by side as the substrate aligner. The substrate aligner of the present modification is also a dual aligner including two substrate placement tables, and can align two wafers 35 substantially simultaneously. The conventional aligner has a structure in which one substrate mounting table, one notch detection mechanism, and an ID reading mechanism are provided on one base portion.

According to the substrate transport apparatus 10 of the present modification, since a conventional or existing aligner can be directly applied to the substrate aligner, the setup is easy, and since ID reading of the two wafers 35 can be independently performed, the throughput is further improved compared to the present embodiment.

(second modification)

In the substrate transport apparatus 10 according to the present modification, the example in which the center position 89 of the multi-layered substrate placement section 74 is disposed at the position shifted by L2 from the rotation center axis 88 of the rotation mechanism 75b toward the substrate transport module 12 side has been described, but the present invention is not limited to this.

For example, as in the second modification, the rotation center axis 88 of the rotation mechanism 75b may be provided coaxially with the center position 89 of the substrate mounting portion 74 of the plurality of stages. Accordingly, the rotation mechanism 75b is aligned with the axis of the multi-layered substrate placement unit 74, and therefore the multi-layered substrate placement unit 74 is rotated in a stable state by the rotation mechanism 75 b.

(third modification)

In the substrate transport apparatus 10 of the present modification example, as shown in fig. 4 to 6B, the substrate aligner 15 includes two substrate temporary placement sections 64.

The substrate aligner 15 of the present modification includes a substrate temporary placement portion 64 on the base portion 56. The substrate temporary placement unit 64 is disposed above the first substrate mounting table 57 and the second substrate mounting table 58. Specifically, the substrate temporary placement unit 64 includes a first buffer 64a disposed above the first substrate placement table 57 and a second buffer 64b disposed above the second substrate placement table 58.

The first buffer 64a is an annular frame member, and allows the wafer 35 of the upper hand member 51 (see fig. 3) of the first end effector 28 to be dropped and scooped up. The annular frame member may be a continuous frame member having a cutout only in a part thereof or an aggregate of a plurality of discontinuous frame members. The second buffer 64b is configured similarly to the first buffer 64 a.

Hereinafter, the wafer 35 placed on the lower hand member 52 of the first end effector 28 is referred to as "wafer 35A", and the wafer 35 placed on the upper hand member 51 of the first end effector 28 is referred to as "wafer 35C". Note that the wafer 35 placed on the lower hand 54 of the second end effector 29 is referred to as "wafer 35B", and the wafer 35 placed on the upper hand 53 of the second end effector 29 is referred to as "wafer 35D".

The

arm units

26 and 27 are rotated with respect to the robot base 25, and the

arm units

26 and 27 are aligned with the substrate aligner 15. Thereafter, the atmospheric transfer robot 14 is driven to extend the

arm units

26 and 27 toward the substrate aligner 15. As shown in fig. 3 and 6A, the wafer 35A placed on the lower hand member 52 of the first end effector 28 in the arm unit 26 is transferred to the first substrate placement stage 57, and the wafer 35C on the upper hand member 51 of the first end effector 28 is transferred to the first buffer 64a (see fig. 5). At the same timing as the transfer by the arm unit 26 (or substantially the same timing with a slight time difference), as shown in fig. 3 and 6B, the wafer 35B placed on the lower hand 54 of the second end effector 29 in the arm unit 27 is transferred to the second substrate placement stage 58, and the wafer 35D on the upper hand 53 of the second end effector 29 is transferred to the second buffer 64B (see fig. 5).

By driving the substrate aligner 15 and rotating the first substrate mounting table 57 and the second substrate mounting table 58, the wafer 35A mounted on the first substrate mounting table 57 and the wafer 35B mounted on the second substrate mounting table 58 are rotated. By the rotation of the wafer 35A and the wafer 3B, the first notch detection mechanism 61 and the second notch detection mechanism 62 detect the notches of the

wafers

35A and 35B. Then, based on the detection information, the rotation of the first substrate mounting table 57 and the second substrate mounting table 58 is controlled, and the alignment of the

wafers

35A and 35B is adjusted so that the cutouts reach predetermined positions. When the

wafers

35A and 35B rotate, the ID reading mechanism 63 reads the IDs of the

wafers

35A and 35B, and detects the process information, history, and the like of the

wafers

35A and 35B.

Thereafter, the atmospheric transfer robot 14 is driven again to extend the

arm units

26 and 27 toward the substrate aligner 15. The wafer 35A, which has been aligned and ID read, is transferred from the first substrate mounting table 57 to the lower hand member 52 of the first end effector 28, and the wafer 35C is transferred from the first buffer 64a to the upper hand member 51 of the first end effector 28. At the same timing as the transfer of the wafers 35A and 35C, the wafer 35B, which has been aligned and ID-read, is transferred from the second substrate mounting table 58 to the lower hand member 54 of the second end effector 29, and the wafer 35D is transferred from the second buffer 64B to the upper hand member 53 of the second end effector 29.

Thereafter, the lift mechanism (not shown) of the air transfer robot 14 is driven to lower the pair of

arm units

26 and 27, and the

arm units

26 and 27 are extended again toward the substrate aligner 15. As shown in fig. 3 and 7A, the wafer 35C is transferred from the upper hand member 51 of the first end effector 28 to the first substrate mounting table 57. At the same timing as the transfer of the wafer 35C, the wafer 35D is transferred from the upper hand member 53 of the second end effector 29 to the second substrate placement stage 58.

The substrate aligner 15 is driven again to rotate the first substrate mounting table 57 and the second substrate mounting table 58, whereby the wafer 35C mounted on the first substrate mounting table 57 and the wafer 35D mounted on the second substrate mounting table 58 are rotated. By the rotation of the wafer 35C and the wafer 35D, the first notch detection mechanism 61 and the second notch detection mechanism 62 detect the notches of the wafers 35C and 35D. Then, based on the detection information, the rotation of the first substrate mounting table 57 and the second substrate mounting table 58 is controlled, and the alignment of the wafers 35C and 35D is adjusted so that the cutouts reach predetermined positions. When the wafers 35C and 35D rotate, the ID reading mechanism 63 reads the IDs of the wafers 35C and 35D, and detects the processing information, history, and the like of the wafers 35C and 35D.

After that, each

arm unit

26, 27 is elongated again toward the substrate aligner 15. As shown in fig. 3 and 7B, the wafer 35C, which has been aligned and ID read, is transferred from the first substrate mounting table 57 to the upper hand member 51 of the first end effector 28. At the same timing as the transfer of the wafer 35C, the wafer 35D, which has been aligned and ID read, is transferred from the second substrate mounting table 58 to the upper hand 53 of the second end effector 29.

Thus, the wafers 35C and 35A, from which the IDs have been read, are placed on the upper hand member 51 and the lower hand member 52 of the first end effector 28, respectively. Further, the

wafers

35D and 35B whose respective orientations are aligned and whose IDs have been read are placed on the upper hand member 53 and the lower hand member 54 of the second end effector 29, respectively. That is, the alignment of all the wafers 35A to 35D placed on the hand members is completed.

Thereafter, as in the present embodiment, four

wafers

35B, 35A, 35D, and 35C placed on the upper and lower hand members 51 and 52 of the first end effector 28 and the upper and lower hand members 53 and 54 of the second end effector 29 are collectively carried into the first load-lock chamber 16 (or the second load-lock chamber 17).

Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to the embodiments, and design changes to the extent of not departing from the gist of the present invention are included in the present invention.

For example, in the substrate transport apparatus 10 of the present embodiment, the example in which two substrate mounting tables 57 and 58 are provided in the substrate aligner 15 has been described, but as another example, three or more substrate mounting tables may be provided.

In the first modification, an example in which two existing aligners are arranged as the substrate aligner 15 has been described, but three or more existing aligners may be provided.

Claims

1. A substrate transfer device comprising a substrate transfer module and an atmospheric transfer robot provided inside the substrate transfer module,

the atmospheric transfer robot has a robot base portion capable of freely moving relative to the substrate transfer module,

the substrate transfer apparatus further includes a substrate aligner provided above the robot base and having at least two substrate placement stages for aligning the substrate.

2. The substrate transport apparatus according to claim 1,

the atmosphere transfer robot includes:

a pair of arm units rotatably supported by the robot base and capable of being extended and bent; and

and end effectors which are provided at the front ends of the pair of arm units, respectively, and which have placement portions on which the substrates can be placed in upper and lower stages.

3. The substrate transport apparatus according to claim 2,

the substrate aligner includes a substrate temporary placement unit above each of the substrate placement tables.

4. The substrate transport apparatus according to claim 3,

the substrate aligner has:

at least two substrate mounting tables for aligning the orientation of the substrate; and

a base part for setting the substrate carrying platforms.

5. The substrate transport apparatus according to claim 3,

the substrate aligner includes at least two stages,

each of the substrate aligners has:

a substrate mounting table for aligning the orientation of the substrate; and

a base part for setting the substrate carrying platform.

6. The substrate transport apparatus according to any one of claims 1 to 5,

the substrate transfer device further includes a load lock chamber connected to the substrate transfer module and having a polygonal shape in a plan view,

the load lock chamber has openings for carrying in and out the substrate on a surface connected to the substrate transfer module and a surface adjacent to the surface connected to the substrate transfer module.

7. The substrate transport apparatus according to claim 6,

connecting two load lock chambers at the substrate transfer module,

the two load lock chambers are provided such that the adjacent surfaces thereof face each other, and the openings are provided in the facing adjacent surfaces.