KR100881902B1 - Lamp - Google Patents

Abstract

An LED (Light Emitting Diode) lamp reduces the electrical energy consumption by replacing the existing fluorescent lamp, the PL lamp, the circle line lamp and the discharge tube. The first terminal (2a) and the second terminal (2b) are formed in the upper part and the lateral part of the socket(1) respectively. The resin insulation unit is formed in the bottom side of the socket with the insert injection. The wedding ring(7) is combined to the bottom side of the resin insulation unit. The radiating unit(4) is assembled by screw in the bottom side of the wedding ring. The intermediate connecting unit(8) is combined to the bottom side of the radiating unit. The light transmitting case(6) of the bulb shape is assembled by screw in the bottom side of the intermediate connecting unit. A plurality of chip light-emitting diodes(10) is mounted on each substrate(9). The substrate connected to the first and the second terminal electrically is combined to the bonding protrusion part (8a) of the intermediate connecting unit. A plurality of first heat radiation fins (fin) (4a) is formed on the top of the cooling plate. The radiation member (5a) is extended to the bottom side from the cooling plate. A plurality of second heat radiation fins (5b) is formed in the inner side of the radiation member. A plurality of first heat hole (4d) and the second heat hole (8b) are formed in the lateral part of the radiating unit and lateral part of the intermediate connecting unit.

Description

Lamp using LED {Lamp}

The present invention relates to a lamp using an LED, and in particular, by using an LED to provide a lamp that can replace a conventional fluorescent lamp, PL lamp, circle line lamp, discharge tube (metal lamp, sodium lamp, CDM lamp), power consumption Is a lamp that uses LEDs that can provide high quality brightness while prolonging the product's lifespan, and providing eco-friendly lamps because fluorescent materials or heavy metals are not built in the lamps. It is about.

Commonly used lamps are provided with incandescent lamps, fluorescent lamps, PL lamps, and circle lines.

However, conventional lamps not only have the disadvantage of consuming much power, but also have a problem that their use is gradually limited because heavy metals such as fluorescent material and mercury are embedded in the lamp and classified as a main culprit of environmental pollution. there was.

Therefore, the present invention for solving the above problems is to use a low power consumption LED as a light source, and having a heat dissipation means for effectively radiating heat generated from the LED, by diffusely reflecting the light of the LED so that the LED light is spread widely It is aimed to provide a lamp using LED that can replace the fluorescent lamp, PL lamp, circle line lamp, and discharge tube (metal lamp, sodium lamp, CDM lamp) that are used in the past by combining and using diffusion lens. .

The present invention for achieving the above object,

A socket for screwing into the socket, a first terminal and a second terminal are formed on the side and the top of the socket, respectively, and a resin insulator is formed by insert injection into the lower part of the socket, and the bottom of the resin insulator. The coupling ring, and assembling a heat dissipation part made of a thermally conductive metal material having a coupling portion at the bottom of the coupling ring as a screw, the coupling protrusion coupled to the coupling portion as a screw is formed to protrude inwardly on the upper side and the inside of the bottom. An intermediate connection part made of a resin material formed with a screw coupling part is coupled to the lower end of the heat dissipation unit, and screw assembly of a light-transmitting case of a bulb shape at the lower end of the intermediate connection part,

A plurality of substrates coated with a polymer waterproof coating on the surface of the metal PCB substrate are attached to form a flat cross-sectional shape in a hexagonal shape, and a plurality of chip LEDs are mounted on the respective substrates, and are electrically connected to the first and second terminals. The substrate is coupled to the coupling protrusion protruding inwardly inside the intermediate connecting portion, and the heat dissipation portion extends downward from the heat sink to form a heat dissipation plate having a plurality of heat dissipation fins at the top of the heat dissipation portion. The heat dissipation fins are formed to protrude to the inside of the heat dissipation port, and a plurality of heat dissipation holes are formed on the side parts of the heat dissipation part and the side parts of the intermediate connection part.

According to the present invention, by providing a lamp that can replace the existing fluorescent lamp, PL lamp, circle line lamp, discharge tube (metal lamp, sodium lamp, CDM lamp) by using the LED, the power consumption is significantly compared to the conventional lamp It is possible to expect the effect of providing a lamp using LED that can provide high quality brightness while reducing the quality of the product, prolonging the life of the product, and providing eco-friendly lamps because there is no fluorescent material or heavy metal in the lamp. have.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, FIGS. 1 to 13.

◈ First Embodiment ◈

1 to 3 illustrate a first embodiment of the present invention, and provide a lamp that can replace an existing incandescent lamp using an LED.

The lamp of the first embodiment has a socket part 1 for screwing into a socket on which an incandescent lamp is mounted, and has a first terminal 2a and a second terminal 2b on the side and top of the socket part 1, respectively. ) So that the power supplied from the socket can be supplied to the substrate 9 to be laid down.

The resin insulator 3 is formed by insert injection below the socket 1, and the coupling ring 7 is coupled to the lower side of the resin insulator 3, wherein the coupling ring 7 is formed. The coupling pin 7a protruding upward from the upper surface of the upper portion of the coupling pin 7a is embedded in the bottom portion of the resin insulating portion 3 so that the coupling force between the coupling ring 7 and the resin insulating portion 3 is improved.

A heat dissipation part 4 made of a thermally conductive metal material (for example, an aluminum material) formed at the lower end of the coupling ring 7 with the coupling part 4c protruding inwardly is assembled as a screw.

The upper end of the heat dissipation unit 4 is assembled as a screw against the lower side of the coupling ring (7), the coupling ring (7) is in contact with the metal case surrounding the socket to which the lamp is coupled as shown in Figure 1a It has a function of dissipating heat through the metal case.

In this case, a heat sink 5 is formed inside the heat sink 4, and a heat sink 5a is extended to a lower side of the heat sink 5, and the top surface of the heat sink 5 and the heat sink 5a are formed. A plurality of first and second heat dissipation fins 4a and 5b are formed on the inner circumferential surface to improve heat dissipation efficiency.

On the other hand, the intermediate connection portion 8 made of a resin material is coupled to the coupling portion 4c provided at the lower end of the heat dissipation portion 4, and the intermediate connection portion 8 is a screw to the coupling portion 4c. A coupling protrusion 8a to be coupled is formed to protrude inwardly at an upper portion thereof, and a screw coupling portion for screw assembly of the light transmitting case 6 is formed at an inner side of the lower portion thereof.

Screw assembly of the light transmitting case 6 of the bulb-shaped at the lower end of the intermediate connecting portion 8, the light transmitting case 6 is made of a PC resin or opaque tempered glass material, a plurality of lower parts of the light transmitting case (6) The lens plate 11 provided with the third heat dissipation hole 11a is detachably coupled.

In addition, a substrate 9 on which a plurality of chip LEDs 10 are mounted is installed in the coupling protrusion 8a so as to be positioned inside the light transmission case 6, and the substrate 9 is formed of ceramic, silicon on the surface of the metal PCB substrate. And attaching a plurality of substrates 9 having polymer waterproof coating of one of the particles of epoxy resin to form a hexagonal shape in a flat cross-section as shown in FIG. 2, and a plurality of chips on each of the substrates 9. The LED 10 is mounted and electrically connected to the first and second terminals 2a and 2b.

The substrate 9 couples an upper portion thereof to a coupling protrusion 8a protruding inwardly at an inner upper end of the intermediate connector 8, and the heat dissipation hole 5a is in close contact with the inside of the substrate 9 so that the chip LED ( The heat generated during the lighting of 10) is efficiently radiated through the heat dissipation hole 5a and the heat dissipation plate 5 inside.

The heat dissipation port 5a and the substrate 9 are insulated with an insulating material not shown.

A plurality of first heat dissipation holes 4d and second heat dissipation holes 8b are formed in the side portions of the heat dissipating portion 4 and the side portions of the intermediate connecting portion 8 to improve heat dissipation efficiency.

The chip LED 10 is coupled to the diffusion lens 13 for diffusing the light of the chip LED 10 as shown in Figure 2, the surface of the diffusion lens 13 is a number of diffuse reflection like a diamond surface The surface 14 is formed to allow the light of the chip LED 10 to be widely spread and irradiated.

The first embodiment of the present invention configured as described above uses a LED to provide a lamp such as an incandescent lamp, and when the lamp of the first embodiment is mounted in a socket, it is supplied to the first and second terminals 2a and 2b. The chip LED 10 mounted on the substrate 9 is turned on by the power supply, and the heat generated from the chip LED 10 is conducted to the heat sink 5 by the heat dissipation hole 5a, and then the first heat dissipation fin 4a. Since the heat dissipation is performed through the heat dissipation, the heat generated from the chip LED 10 can be efficiently removed, and the plurality of second heat dissipation holes 8b and the heat dissipation part 4 formed at the upper end of the intermediate connection part 8 are provided. Since the heat dissipation efficiency is further improved by the first heat dissipation hole 4d, the life of the chip LED 10 can be further extended.

Figure 3 shows an embodiment in which the first embodiment of the present invention is formed in the shape of low pressure sodium, and the detailed structure thereof is the same as that of the first embodiment, and thus detailed description thereof will be omitted.

◈ Second Embodiment ◈

4 to 6 show a second embodiment of the present invention, in which the second embodiment is a linear form of the lamp of the present invention.

In a second embodiment of the present invention,

A heat dissipation case 20 is provided to be fitted into the socket of the luminaire, and one end of the heat dissipation case 20 is coupled to a terminal 21 for receiving power from the socket. A plurality of first heat dissipation holes 22 are formed.

Although not shown between the terminal 21 and the heat dissipation case 20, the terminal 21 and the heat dissipation case 20 are electrically insulated through a resin insulating material.

The heat dissipation member 24 having the plurality of heat dissipation fins 25 is built into the heat dissipation case 20, and the third end of the heat dissipation case 20 has a plurality of third heat dissipation holes 27 at a side surface thereof. One resin connecting portion 26 is combined.

The heat dissipation case 20 and the resin connecting portion 26 are fastened by screws or by adhesive.

In addition, the resin connection part 26 is formed of an opaque tempered glass or PC material and is fitted with a light transmitting cover 23 having a plurality of second heat dissipation holes 23a formed at an end thereof, and coupled to the inside of the light transmitting cover 23. The light emitting means 30 is installed in this.

The light emitting means 30 has a plurality of heat dissipation fins 33a inside the heat absorbing body 33 while forming a heat absorbing body 33 having a predetermined length from the heat dissipating body 24 in the form of a triangular rod as shown in FIG. 6. Is formed, and a plurality of chip LEDs 32 are mounted on the surface of each substrate 31 while the substrate 31 is provided outside the heat absorbing body 33.

Preferably, the substrate 31 and the terminal 21 are electrically connected to each other.

The chip LED 32 is coupled to the diffusion lens 13 for diffusing the light of the chip LED 32 as shown in Figure 6, the surface of the diffusion lens 13 is a number of diffuse reflection like a diamond surface The surface 14 is formed so that the light of the chip LED 32 can be widely spread and irradiated.

The second embodiment of the present invention configured as described above is a lamp using a LED formed in a straight shape, can be easily mounted and used by fitting to the socket, the heat generated from the LED heat absorber 33 and the radiator 24 And by using the heat dissipation fin 25 can be efficiently radiated heat can extend the life of the weak LED.

◈ Third Embodiment ◈

7 to 9 show a third embodiment of the present invention. The third embodiment is a lamp which can be used as a substitute for PL lamp.

The third embodiment of the present invention,

Three terminals 41 and one ground terminal (G) is provided with a heat dissipation case 40 made of a metal material on one side, the heat dissipation case 40 is formed with a plurality of first heat dissipation holes (40a), The heat dissipation plate 43 having a plurality of first heat dissipation fins 44 is installed in the heat dissipation case 40.

The terminal 41 and the heat dissipation case 40 are electrically insulated, and the ground terminal G is connected to the heat sink 43.

In addition, the resin connection part 45 having a plurality of second heat dissipation holes 46 on the side part at the other side of the heat dissipation case 40 is coupled using a screw or an adhesive, and the 'U' is connected to the resin connection part 45. 'Shape and combines the floodlight cover 42 made of PC or opaque tempered glass material.

At this time, if necessary, the cap 42a having a plurality of air holes 42b at the end of the floodlight cover 42 may be detachably coupled.

On the other hand, the light emitting means 50 is installed inside the floodlight cover 42,

The light emitting means 50 extends two heat absorbing plates 52 from the heat dissipation plate 43 so as to be positioned inside the floodlight cover 42, and the two substrates are formed to be in close contact with both surfaces of the heat absorbing plate 52. 51 is combined and a plurality of chip LEDs 53 are mounted on each substrate 51.

A plurality of second heat dissipation fins 52a protrude from the side surfaces of the heat absorbing plate 52.

In addition, as shown in FIG. 9, the chip LED 53 is coupled to a diffusion lens 13 that diffuses the light of the chip LED 53, and the surface of the diffusion lens 13 is as large as a diamond surface. By forming the diffuse reflection surface 14 of the chip LED 53 so that the light can be spread widely.

The third embodiment of the present invention configured as described above can be used as a substitute for the conventional PL and the like, and heat generated from the plurality of chip LEDs 53 installed inside the floodlight cover 42 is absorbed by the heat absorbing plate 52. A plurality of agents formed in the heat dissipation plate 43, the first heat dissipation hole 40a formed in the case 40, and the heat dissipation fin 44 protruding from the heat dissipation plate 43, and the resin connecting portion 45. The heat dissipation efficiency is further improved by the two heat dissipation holes 46, thereby solving the problem that the chip LED 53 is easily damaged by high temperature heat.

4th Embodiment

10 and 11 show a fourth embodiment of the present invention, which provides a lamp that can be used as a fluorescent lamp replacement.

A first heat dissipation case 61 and a second heat dissipation having a floodlight tube 60 made of a PC or an opaque tempered glass material, each of which has a first resin connection portion 75 and a second resin connection portion 76 coupled to one side thereof. The case 62 is fitted to both sides of the floodlight tube 60 to be coupled.

The coupling of the floodlight tube 60 and the heat dissipation cases 61 and 62 is connected to the first and second resin connectors 75 and 76 coupled to one side of the heat dissipation cases 61 and 62. Screw), and the first and second resin connection portions 75 and 76 are coupled to the first and second heat dissipation cases 61 and 62 using screws or to each other using an adhesive.

A plurality of third and fourth heat dissipation holes 75a and 76a are formed in the first and second resin connection parts 75 and 76.

Meanwhile, two power terminals 63 are installed in the first heat dissipation case 61, a ground terminal G is installed in the second heat dissipation case 62, and each case 61 and 62 is provided in the first heat dissipation case 61. A plurality of first heat dissipation holes 64 and second heat dissipation holes 69 are formed to improve heat dissipation efficiency.

In addition, a first heat dissipation member 65 is installed inside the first heat dissipation case 61, and a plurality of first heat dissipation fins 67 protrude from one side of the first heat dissipation member 65, and the first The second heat dissipation member 70 is formed inside the heat dissipation case 62, and a plurality of second heat dissipation fins 72 protrudes from one side of the second heat dissipation member 70, and the ground terminal G is formed. And the second heat sink 70 are electrically connected to each other.

In addition, the light emitting means 30 is installed inside the floodlight tube 60, wherein the light emitting means 30 has a triangular bar shape to reach the second heat sink 70 from the first heat sink 65. The heat absorbing rod 66 is formed, and the three substrates 31 are attached to the outside of the heat absorbing rod 66 in a triangular shape, and a plurality of chip LEDs 32 are mounted on each of the substrates 31. Configure.

Part of the heat absorbed by the heat absorbing rod 66 is radiated to the outside through the plurality of third heat dissipation holes 75a and the fourth heat dissipation holes 76a formed in the first and second resin connection parts 75 and 76. Thus, efficient heat dissipation is achieved, and a part of heat is conducted to the first and second heat sinks 65 and 70 to dissipate heat.

A plurality of third heat dissipation fins 66a are formed on the inner circumferential surface of the heat absorbing rod 66.

Preferably, the substrate 31 and the power supply terminal 63 are electrically connected to each other.

The chip LED 32 is coupled to a diffusion lens 13 for diffusing the light of the chip LED 32 as shown in FIG. 11, and a plurality of diffuse reflections are formed on the surface of the diffusion lens 13 like a diamond surface. The surface 14 is formed so that the light of the chip LED 32 can be widely spread and irradiated.

The fourth embodiment of the present invention configured as described above can be conveniently used as a substitute for fluorescent lamps, and since the heat generated from the chip LED 32 can be efficiently radiated using the first and second heat sinks, the chip LED 32 is used. Can extend the life of the product.

◈ Fifth Embodiment ◈

12 and 13 show a fifth embodiment of the present invention. The fifth embodiment is a lamp that can be used as a substitute for a circle line or the like formed in a ring shape.

The fifth embodiment of the present invention,

Case comprising a floodlight tube 80 made of PC or opaque tempered glass material having a ring shape, and a plurality of power terminals 83 and one ground terminal 84 on the outside of the floodlight tube 80 A plurality of heat dissipation holes 82 are formed in the case 81.

The heat sink 85 made of a high thermal conductivity metal is installed inside the floodlight tube 80 at the position where the case 81 is coupled, and the fitting protrusions 86 protrude to both sides of the heat sink 85. And a plurality of heat dissipation fins 87 protruding from the outside of the heat dissipator 85 to efficiently dissipate heat generated from the chip LEDs 32 while exchanging heat with air introduced into the heat dissipation holes 82. .

On the other hand, the light emitting means 30 is fitted to the fitting projections 86 formed on the heat sink 85, the light emitting means 30 is three substrate 31 as shown in Figure 13 in a triangular shape And a plurality of chip LEDs 32 mounted on each of the substrates 31, and a hollow rod having a triangular rod shape and integrally formed with a heat sink 85 in an inner space of the substrate 31 forming the triangular rod shape. The heat absorbing rod 88 quickly absorbs heat generated from the chip LED 32 via the heat absorbing rod 88 to be transferred to the heat sink 85.

On the inner circumferential surface of the heat absorbing rod 88, a plurality of heat dissipation fins 88a are formed to protrude inward.

Preferably, the substrate 31 and the power supply terminal 83 are electrically connected to each other. The substrate 31 and the heat sink 85 are electrically insulated, and the ground terminal 84 and the heat sink 85 are electrically connected. Connect with

The chip LED 32 is coupled to the diffusion lens 13 to diffuse the light of the chip LED 32 as shown in Figure 13, the surface of the diffusion lens 13 is a number of diffuse reflection like a diamond surface The surface 14 is formed so that the light of the chip LED 32 can be widely spread and irradiated.

The fifth embodiment of the present invention configured as described above can be conveniently used as a substitute for a circle line, and can effectively dissipate heat generated from the chip LED 32 to extend the life of the chip LED 32.

12 (b) shows another embodiment in which the fifth embodiment of the present invention is formed by socket coupling.

All the substrates applied to the first to fifth embodiments described in the present invention are implemented using a metal PCB, and the surface of the substrate is formed of any one of ceramic, silicon and epoxy resin particles as described above. Waterproof coating and insulation are made by polymer waterproof coating.

Existing luminaires have a separate ballast (ballast), wired and assembled, so the assembly work is very cumbersome and time consuming, and the appearance of the luminaire has been increased.

The LED lamp of the present invention can be expected to have an effect that the additional economic benefits that are generated because the ballast is not required, and the standby power loss due to the ballast is significantly reduced.

1 to 3 show a first embodiment of the present invention.

4 to 6 show a second embodiment of the present invention.

7 to 9 show a third embodiment of the present invention.

10 and 11 show a fourth embodiment of the present invention.

12 and 13 show a fifth embodiment of the present invention.

Explanation of symbols for main parts of the drawings

1: socket, 2a, 2b: terminal,

3: resin insulation, 4: heat dissipation,

5: heat sink, 5a: heat sink,

6: floodlight case, 7: coupling ring,

8: intermediate connection, 9: board,

10: chip LED, 11: lens plate,

13: diffuse lens, 14: diffuse reflection,

Claims (7)

It is provided with a socket portion (1) for screwing in the socket, the first terminal 2a and the second terminal (2b) is formed on the side and top of the socket portion 1, respectively, A resin insulator 3 is formed by insert injection below the socket 1, a coupling ring 7 is coupled to the lower side of the resin insulator 3, and a lower side of the coupling ring 7 is formed. A heat dissipation part 4 made of a thermally conductive metal material having a coupling part 4c at its lower end as a screw, and a coupling protrusion 8a coupled as a screw to the coupling part 4c is formed to protrude inwardly at an upper end thereof and The intermediate connection portion 8 made of a resin material formed with a screw coupling portion inside the coupling to the lower end of the heat dissipation portion 4, screw assembly of the bulb-shaped light transmitting case 6 to the lower end of the intermediate connection portion 8, A plurality of substrates 9 coated with a polymer waterproof coating on the surface of the metal PCB are attached to form a hexagonal shape in a planar cross-section, and a plurality of chip LEDs 10 are mounted on the respective substrates 9 while the first and The substrate 9 electrically connected to the second terminals 2a and 2b is coupled to the coupling protrusion 8a protruding inwardly into the intermediate connector 8. The heat sink 5a extends downward from the heat sink 5 while forming a heat sink 5 having a plurality of first heat sink fins 4a on the heat sink 4. To be in close contact with the inside of the (9), protruding to form a plurality of second heat radiation fins (5b) on the inside of the heat dissipation holes (5a), A lamp using LEDs, characterized in that a plurality of first heat dissipation holes (4d) and second heat dissipation holes (8b) are formed in the side parts of the heat dissipation part (4) and in the side parts of the intermediate connection part (8). The method of claim 1, The light transmission case 6 is made of PC resin or opaque tempered glass material, and detachably coupling the lens plate 11 having a plurality of third heat dissipation holes 11a at the lower end of the light transmission case 6. Lamp using LED characterized in that. A heat dissipation case 20 is provided to be fitted into the socket of the luminaire, and one end of the heat dissipation case 20 is coupled to a terminal 21 for receiving power from the socket. A plurality of first heat dissipation holes 22 are formed, a heat dissipation member 24 having a plurality of heat dissipation fins 25 is provided inside the heat dissipation case 20, and another end of the heat dissipation case 20 is formed. The resin connection portion 26 having a plurality of third heat dissipation holes 27 in the side portion is coupled to the resin connection portion 26, and the second heat dissipation hole (at the end of the resin connection portion 26 is made of opaque tempered glass or PC material). Insert the light-emitting cover 23 is formed 23a, and the light emitting means 30 is installed in the light-emitting cover 23, The light emitting means 30 extends a heat absorbing body 33 having a predetermined length from the heat sink 24 in the form of a triangular rod, and installs the substrate 31 on the outer side of the heat absorbing body 33. 31) A lamp using an LED, characterized in that a plurality of chip LED 32 is mounted on the surface. Four terminals 41 and G are provided with a heat dissipation case 40 installed at one side, and the heat dissipation case 40 has a plurality of first heat dissipation holes 40a formed therein, and is provided inside the heat dissipation case 40. Installing a heat dissipation plate 43 having a plurality of first heat dissipation fins 44, and coupling the resin connection part 45 having a plurality of second heat dissipation holes 46 to a side portion at another side of the heat dissipation case 40. And to combine the floodlight cover 42 made of a PC or opaque tempered glass material of the 'U' shape to the resin connection portion 45, the light emitting means 50 is installed in the interior of the floodlight cover 42, The light emitting means 50 extends two heat absorbing plates 52 from the heat dissipation plate 43 so as to be positioned inside the floodlight cover 42, and the two substrates are formed to be in close contact with both surfaces of the heat absorbing plate 52. 51, a plurality of chip LEDs 53 are mounted on each of the substrates 51, and a plurality of second heat dissipation fins 52a are formed to protrude from the side surfaces of the heat absorbing plate 52. Lamp using LED. A first heat dissipation case 61 and a second heat dissipation having a floodlight tube 60 made of a PC or an opaque tempered glass material, each of which has a first resin connection portion 75 and a second resin connection portion 76 coupled to one side thereof. The case 62 is fitted to both sides of the floodlight tube 60, Two power terminals 63 are installed in the first heat dissipation case 61, a ground terminal G is installed in the second heat dissipation case 62, and a plurality of power terminals 63 are provided in each case 61 and 62. The first heat dissipation hole 64 and the second heat dissipation hole 69 are formed, A first heat dissipation member 65 is installed inside the first heat dissipation case 61, and a plurality of first heat dissipation fins 67 protrude from one side of the first heat dissipation 65, and the second heat dissipation case is formed. A second radiator 70 is formed inside the 62, and a plurality of second radiator fins 72 protrude from one side of the second radiator 70, and the ground terminal G and the second are radiated. The heat sink 70 is electrically connected, The light emitting means 30 is installed inside the floodlight tube 60, and the light emitting means 30 is a heat absorbing rod having a triangular rod shape from the first heat sink 65 to the second heat sink 70. And forming a plurality of substrates 31 on the outer side of the heat absorbing rod 66 in a triangle shape, and mounting a plurality of chip LEDs 32 on each of the substrates 31. , And a plurality of third heat dissipation holes (75a) and fourth heat dissipation holes (76a) are formed on side surfaces of the first and second resin connection parts (75) (76), respectively. Case comprising a floodlight tube 80 made of PC or opaque tempered glass material having a ring shape, and a plurality of power terminals 83 and one ground terminal 84 on the outside of the floodlight tube 80 And a plurality of heat dissipation holes 82 formed in the case 81, and a heat dissipator 85 made of a thermally conductive metal in the floodlight tube 80 at the position where the case 81 is coupled. ) And internally, protruding fitting protrusions 86 on both sides of the heat sink 85, and protruding a plurality of heat sink fins 87 on the outside of the heat sink 85, The light emitting means 30 is fitted to the fitting protrusions 86 formed on the heat sink 85, and the light emitting means 30 combines three substrates 31 in a triangular shape, and each of the substrates 31. A plurality of chip LEDs 32 are mounted on the chip LEDs, and the chip LEDs are formed in the internal space of the substrate 31 coupled in the triangular shape via a heat absorbing rod 88 integrally formed with a heat sink 85. 32) The lamp using the LED, characterized in that the heat absorbing rod 88 absorbs heat generated by the heat absorbing rod (85) quickly. According to any one of claims 1 to 6, wherein the chip LED is coupled to the diffusion lens for diffusing the light of the chip LED, the surface of the diffuse lens is a number of diffuse reflection surface, such as a diamond surface Lamp using the LED, characterized in that formed.

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