KR100838000B1 - 리소그래피용 반사 방지막 형성 조성물 - Google Patents
리소그래피용 반사 방지막 형성 조성물 Download PDFInfo
- Publication number
- KR100838000B1 KR100838000B1 KR1020020009326A KR20020009326A KR100838000B1 KR 100838000 B1 KR100838000 B1 KR 100838000B1 KR 1020020009326 A KR1020020009326 A KR 1020020009326A KR 20020009326 A KR20020009326 A KR 20020009326A KR 100838000 B1 KR100838000 B1 KR 100838000B1
- Authority
- KR
- South Korea
- Prior art keywords
- antireflection film
- structural unit
- forming composition
- maleimide
- polymer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
Abstract
Description
굴절률 (n값) 광학흡수 계수 (k값) 드라이 엣칭 선택성 |
실시예 1 1.71 0.19 1.55 실시예 2 1.69 0.23 1.58 실시예 3 1.70 0.20 1.57 실시예 4 1.74 0.33 1.22 실시예 5 1.74 0.31 1.62 비교예 1 1.60 0.47 0.88 |
Claims (10)
- 삭제
- 삭제
- 삭제
- 말레이미드 또는 그 유도체로 된 구조단위를 가진 수지를 함유하는, 반도체 장치제조의 리소그래피 프로세스에 사용하는 반사 방지막 형성 조성물에 있어서, 상기 수지는 아래의 식 (2)로 나타내어지는 구조단위를 함유하고, 또한 중합체 중에 함유되는 말레이미드 구조단위 (A) 및 (메타)아크릴레이트 구조단위 (B)의 합계에 대하여 말레이미드 구조단위 (A)가 51 ∼ 95 몰%, 그리고 (메타)아크릴레이트 구조단위 (B)가 49 ∼ 5 몰%인 중합체인 반사 방지막 형성 조성물.위의 식 중에서 각 R1, R2 및 R3은 각각 독립하여 있고, R1은 수소원자, 할로겐 원자, 치환 혹은 비치환의 탄소수 1 ∼ 10의 알킬기 또는 벤젠 유도체이며, R2는 수소원자, 할로겐 원자 또는 메틸기이고, R3은 수소원자 또는 치환 혹은 비치환의 탄소수 1 ∼ 10의 알킬기이며, x는 1 ∼ 10300의 수이고, y는 0 ∼ 12100의 수이다.
- 삭제
- 제4항에 있어서, 식 (2)로 나타내어지는 구조단위로서 R1이 수소원자, 할로겐 원자 또는 치환 혹은 비치환의 탄소수 1 ∼ 10의 알킬기인 반사 방지막 형성 조성물.
- 제4항 또는 제6항에 있어서, 적어도 2개의 가교형성 관능기를 가진 가교제를 추가로 함유하는 반사 방지막 형성 조성물.
- 제4항 또는 제6항에 기재한 반사 방지막 형성 조성물을 기판 위에 도포하고, 소성하는 것으로 된, 반도체 장치제조의 리소그래피 프로세스에 사용하는 반사 방지막의 형성방법.
- 제4항 또는 제6항에 기재한 반사 방지막 형성 조성물을 기판 위에 도포하고 소성하여 반사 방지막을 형성하고, 이 반사 방지막 위에 포토레지스트를 피복하여 이 기판을 노광한 후 현상하며, 엣칭에 의하여 기판 위에 화상을 전사하여 집적회로 소자를 형성하는 것으로 된, 반도체 장치의 제조방법.
- 제9항에 있어서, 노광은 193 nm의 파장의 광에 의하여 실시되는 반도체 장치의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00046779 | 2001-02-22 | ||
JP2001046779 | 2001-02-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020070804A KR20020070804A (ko) | 2002-09-11 |
KR100838000B1 true KR100838000B1 (ko) | 2008-06-13 |
Family
ID=18908337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020009326A KR100838000B1 (ko) | 2001-02-22 | 2002-02-21 | 리소그래피용 반사 방지막 형성 조성물 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6927266B2 (ko) |
EP (1) | EP1237042B1 (ko) |
KR (1) | KR100838000B1 (ko) |
DE (1) | DE60207124T2 (ko) |
TW (1) | TW563001B (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7365408B2 (en) * | 2002-04-30 | 2008-04-29 | International Business Machines Corporation | Structure for photolithographic applications using a multi-layer anti-reflection coating |
KR100480235B1 (ko) | 2002-07-18 | 2005-04-06 | 주식회사 하이닉스반도체 | 유기 반사방지막 조성물 및 이를 이용한 포토레지스트의패턴 형성 방법 |
US7323289B2 (en) * | 2002-10-08 | 2008-01-29 | Brewer Science Inc. | Bottom anti-reflective coatings derived from small core molecules with multiple epoxy moieties |
CN1802603A (zh) | 2003-07-17 | 2006-07-12 | 霍尼韦尔国际公司 | 用于高级微电子应用的平面化薄膜及其生产装置和方法 |
KR100570207B1 (ko) * | 2003-10-15 | 2006-04-12 | 주식회사 하이닉스반도체 | 유기 반사방지막용 광 흡수제 중합체 및 이의 제조 방법과상기 중합체를 포함하는 유기 반사 방지막 조성물 |
US7030201B2 (en) | 2003-11-26 | 2006-04-18 | Az Electronic Materials Usa Corp. | Bottom antireflective coatings |
WO2006049045A1 (ja) * | 2004-11-01 | 2006-05-11 | Nissan Chemical Industries, Ltd. | スルホン酸エステルを含有するリソグラフィー用反射防止膜形成組成物 |
US20060154186A1 (en) * | 2005-01-07 | 2006-07-13 | Advanced Technology Materials, Inc. | Composition useful for removal of post-etch photoresist and bottom anti-reflection coatings |
JP5112733B2 (ja) * | 2006-04-11 | 2013-01-09 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | フォトリソグラフィ用コーティング組成物 |
EP1906249A3 (en) * | 2006-09-26 | 2008-12-24 | Rohm and Haas Electronic Materials, L.L.C. | Antireflective coating compositions for photolithography |
US20090035704A1 (en) * | 2007-08-03 | 2009-02-05 | Hong Zhuang | Underlayer Coating Composition Based on a Crosslinkable Polymer |
KR100871772B1 (ko) * | 2007-09-17 | 2008-12-05 | 주식회사 효성 | 이소시아네이트계 유도체를 포함하는 공중합체, 상기공중합체의 제조방법, 상기 공중합체를 포함하는유기반사방지막 조성물 및 상기 조성물을 포함하는유기반사방지막 |
US8039201B2 (en) * | 2007-11-21 | 2011-10-18 | Az Electronic Materials Usa Corp. | Antireflective coating composition and process thereof |
US20090253081A1 (en) * | 2008-04-02 | 2009-10-08 | David Abdallah | Process for Shrinking Dimensions Between Photoresist Pattern Comprising a Pattern Hardening Step |
US20090253080A1 (en) * | 2008-04-02 | 2009-10-08 | Dammel Ralph R | Photoresist Image-Forming Process Using Double Patterning |
US20100040838A1 (en) * | 2008-08-15 | 2010-02-18 | Abdallah David J | Hardmask Process for Forming a Reverse Tone Image |
US8084186B2 (en) * | 2009-02-10 | 2011-12-27 | Az Electronic Materials Usa Corp. | Hardmask process for forming a reverse tone image using polysilazane |
JP5552365B2 (ja) * | 2009-06-30 | 2014-07-16 | 東京応化工業株式会社 | 接着剤組成物および接着フィルム |
EP2479612B1 (en) * | 2009-09-14 | 2016-12-07 | Nissan Chemical Industries, Ltd. | Photosensitive resin composition containing copolymer |
US8697336B2 (en) | 2011-12-15 | 2014-04-15 | Az Electronic Materials Usa Corp. | Composition for forming a developable bottom antireflective coating |
CN116102939B (zh) * | 2021-11-09 | 2023-10-03 | 上海新阳半导体材料股份有限公司 | 一种深紫外光刻用底部抗反射涂层及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0823661A1 (en) * | 1996-08-07 | 1998-02-11 | Fuji Photo Film Co., Ltd. | Composition for anti-reflective coating material |
EP0917002A1 (en) * | 1997-05-27 | 1999-05-19 | Clariant International Ltd. | Composition for antireflection or light absorption film and compounds for use in the same |
EP0942331A1 (en) * | 1997-10-08 | 1999-09-15 | Clariant International Ltd. | Antireflection or light-absorbing coating composition and polymer therefor |
JPH11263806A (ja) * | 1998-03-17 | 1999-09-28 | Clariant Japan Kk | 光吸収性ポリマーおよびその反射防止膜への応用 |
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DE4039334A1 (de) | 1989-12-28 | 1991-07-04 | Hoechst Celanese Corp | Lichtempfindlicher gegenstand und verfahren zur erzeugung eines bildes |
US5294680A (en) | 1992-07-24 | 1994-03-15 | International Business Machines Corporation | Polymeric dyes for antireflective coatings |
US6503689B2 (en) | 2000-09-19 | 2003-01-07 | Shipley Company, L.L.C. | Antireflective composition |
US6503421B1 (en) * | 2000-11-01 | 2003-01-07 | Corning Incorporated | All polymer process compatible optical polymer material |
-
2002
- 2002-02-20 US US10/078,108 patent/US6927266B2/en not_active Expired - Lifetime
- 2002-02-21 KR KR1020020009326A patent/KR100838000B1/ko active IP Right Grant
- 2002-02-22 EP EP02003280A patent/EP1237042B1/en not_active Expired - Fee Related
- 2002-02-22 TW TW091103186A patent/TW563001B/zh not_active IP Right Cessation
- 2002-02-22 DE DE60207124T patent/DE60207124T2/de not_active Expired - Lifetime
Patent Citations (5)
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EP0823661A1 (en) * | 1996-08-07 | 1998-02-11 | Fuji Photo Film Co., Ltd. | Composition for anti-reflective coating material |
EP0917002A1 (en) * | 1997-05-27 | 1999-05-19 | Clariant International Ltd. | Composition for antireflection or light absorption film and compounds for use in the same |
EP0942331A1 (en) * | 1997-10-08 | 1999-09-15 | Clariant International Ltd. | Antireflection or light-absorbing coating composition and polymer therefor |
JPH11263806A (ja) * | 1998-03-17 | 1999-09-28 | Clariant Japan Kk | 光吸収性ポリマーおよびその反射防止膜への応用 |
EP0982320A1 (en) * | 1998-03-17 | 2000-03-01 | Clariant Finance (BVI) Limited | Light-absorbing polymers and application thereof to antireflection film |
Also Published As
Publication number | Publication date |
---|---|
KR20020070804A (ko) | 2002-09-11 |
TW563001B (en) | 2003-11-21 |
EP1237042A2 (en) | 2002-09-04 |
US6927266B2 (en) | 2005-08-09 |
US20020156148A1 (en) | 2002-10-24 |
EP1237042A3 (en) | 2003-09-03 |
DE60207124D1 (de) | 2005-12-15 |
DE60207124T2 (de) | 2006-07-20 |
EP1237042B1 (en) | 2005-11-09 |
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