KR100796688B1 - Plasma display panel and manufacturing method of the same - Google Patents

Abstract

Plasma display panel of the present invention is to eliminate all the problems caused by the exhaust pipe, and is provided along the overlapping edge of the rear substrate and the front substrate overlapping and shifted opposite to each other to seal both substrates mutually. And the entire region of the rear substrate is formed in the same plane as the front surface of the front substrate.

Exhaust, Sealed, Frit, Chamber

Description

Plasma display panel and manufacturing method thereof {PLASMA DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME}

1 is a flowchart illustrating a method of manufacturing a plasma display panel according to an embodiment of the present invention.

2 is a perspective view schematically illustrating a vacuum sealing process of a plasma display panel according to an exemplary embodiment of the present invention.

Figure 3 is a perspective view of the separated state before the vacuum sealing of the back substrate and the front substrate.

4 is a perspective view of a plasma display panel according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view taken along the line VV of FIG. 3.

The present invention relates to a plasma display panel and a method of manufacturing the same, and more particularly, to a plasma display panel manufactured by a vacuum sealing method and a method of manufacturing the same.

In general, a plasma display panel is a visible light of red (R), green (G) and blue (B) generated by exciting the phosphor using a vacuum ultra-violet (VUV) emitted from the plasma obtained through gas discharge It is a display device for implementing an image.

As an example, an AC plasma display panel forms address electrodes on a back substrate and covers the address electrodes with a dielectric layer. The partition walls are disposed between the address electrodes on the dielectric layer to form a stripe shape, and phosphor layers of red (R), green (G), and blue (B) layers are formed on the partition walls. On the front substrate facing the rear substrate, display electrodes composed of a pair of sustain electrodes and scan electrodes are formed along the direction crossing the address electrodes, and a dielectric layer and an MgO protective film cover the display electrodes. The discharge cell is formed at the point where the pair of address electrodes on the rear substrate and the pair of display electrodes on the front substrate cross each other. In the plasma display panel, millions of unit discharge cells are arranged in a matrix form.

The memory characteristic is used to drive the discharge cells of the plasma display panel. In more detail, in order to generate a discharge between the sustain electrode and the scan electrode constituting the pair of display electrodes, a potential difference of more than a specific voltage is required, and the voltage at this boundary is called a firing voltage (Vf). When the scan voltage and the address voltage are respectively applied to the scan electrode and the address electrode, the discharge is started to form a plasma in the discharge cell, and the electrons and ions of the plasma move toward the electrodes having opposite polarities.

On the other hand, a dielectric layer is applied to each electrode of the plasma display panel so that most of the moved space charges are stacked on the dielectric layer having opposite polarity, so that the net space potential between the scan electrode and the address electrode is originally applied to the address. It becomes lower than voltage Va, discharge becomes weak, and address discharge disappears. At this time, a relatively small amount of electrons are accumulated in the sustain electrode, and a relatively large amount of ions are accumulated in the scan electrode. The charges accumulated on the sustain electrode and the dielectric layer covering the scan electrode are wall charged (Qw). The space voltage formed between the sustain electrode and the scan electrode by these wall charges is referred to as wall voltage (Vw).

Subsequently, when the discharge sustain voltage Vs is applied to the sustain electrode and the scan electrode, the sum of the magnitudes of the discharge sustain voltage Vs and the wall voltage Vw (Vs + Vw) is the discharge start voltage Vf. If higher, sustain discharge occurs in the discharge cell. The vacuum ultraviolet (VUV) generated at this time excites the phosphor and emits visible light through the transparent front substrate.

However, when there is no address discharge between the scan electrode and the address electrode (that is, when no address voltage Va is applied), wall charges do not accumulate between the sustain electrode and the scan electrode, and consequently, the sustain electrode and the scan electrode. There is no wall voltage in between. At this time, only the discharge sustain voltage Vs applied to the sustain electrode and the scan electrode is formed in the discharge cell. Since the discharge sustain voltage is lower than the discharge start voltage Vf, the gas space between the sustain electrode and the scan electrode cannot be discharged. .

Sealing / exhaust technology is applied to manufacture such a plasma display panel. This sealing / exhaust process is one of the processes for determining the characteristics of the plasma display panel.

The encapsulation / exhaust process heats the back substrate and the front substrate at normal pressure, melts the sealing frit while maintaining the assembly accuracy between the two substrates, and seals the two substrates together. Impurity gas is heated and exhausted for a long time to make a clean space. Thereafter, the discharge gas is filled in the plasma display panel, and the end of the exhaust pipe is sealed / removed to complete the plasma display panel.

This sealing / exhaust method requires an exhaust port and an exhaust pipe in the plasma display panel since the internal space is exhausted through the exhaust pipe and the discharge gas is charged through the exhaust pipe after sealing both substrates at normal pressure.

Since the exhaust pipe is provided to protrude behind the rear substrate from the plasma display panel, there is a high risk of breakage, making it difficult to implement a thinner plasma display panel.

Disclosure of Invention An object of the present invention is to provide a plasma display panel and a method of manufacturing the same, which eliminate all the problems associated with the exhaust pipe, that is, the trouble of the exhaust pipe and the difficulty of implementing the thinner.

Plasma display panel according to an embodiment of the present invention, the back substrate and the front substrate overlapping and overlapping with each other, and includes a frit is provided along the overlapping edge of the back substrate and the front substrate to seal the two substrates mutually; The entire area of the rear substrate may be formed in the same plane as the front surface of the front substrate.

In addition, the method of manufacturing a plasma display panel according to an embodiment of the present invention includes the steps of putting a back substrate and a front substrate in a chamber facing each other, forming a vacuum atmosphere in the chamber, discharge gas in the chamber The method may include filling, sealing the back substrate and the front substrate in the chamber, and extracting the sealed back substrate and the front substrate from the chamber.

In the filling of the discharge gas, the discharge gas may be charged at the same pressure as the internal pressure of the final product plasma display panel.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.

1 is a flowchart illustrating a method of manufacturing a plasma display panel according to an embodiment of the present invention, and FIG. 2 is a perspective view schematically illustrating a vacuum sealing process of a plasma display panel according to an embodiment of the present invention.

Referring to these drawings, the method of manufacturing a plasma display panel performs a vacuum sealing process in the chamber 100 as shown in FIG. 2.

The manufacturing method includes the step of injecting the back substrate 10 and the front substrate 20 into the chamber 100 in an opposite state (ST100), forming a vacuum atmosphere in the chamber 100 (ST200), and the chamber ( Injecting a discharge gas into the chamber 100 (ST300), sealing the back substrate 10 and the front substrate 20 in the chamber 100 (ST400), and extracting the sealed plasma display panel ( ST500).

Figure 3 is a perspective view of the separated state before the vacuum sealing of the back substrate and the front substrate.

Referring to this figure, a process of sealing the back substrate 10 and the front substrate 20 is performed like the discharge gas injection process after exhausting, among a plurality of processes for manufacturing the plasma display panel.

That is, the inside of the chamber 100 is evacuated to form a vacuum atmosphere, and discharge gas is injected into the chamber 100 in the vacuum atmosphere to seal the back substrate 10 and the front substrate 20 together. The sealing process of both substrates 10 and 20 is performed simultaneously, including a discharge gas injection process.

For this process, the chamber 100 is provided with an outlet 101 on one side, and is formed by connecting a vacuum discharge system (not shown) to the outlet 101. Due to the driving of the vacuum discharge system, the chamber 100 forms a vacuum atmosphere therein.

In addition, the chamber 100 may have a separate passage for injecting the discharge gas. However, for convenience, the outlet 101 in this embodiment is also used as a passage for injecting the discharge gas.

The back substrate 10 and the front substrate 20 introduced into the chamber 100 for vacuum sealing are provided in a state configured as shown in FIG. 4 through the previous processes among the plasma display panel manufacturing processes.

Before explaining this vacuum sealing process, the structure of the plasma display panel is schematically described with reference to FIG.

4 is a perspective view of a plasma display panel according to an embodiment of the present invention.

Referring to this drawing, the plasma display panel is called a first substrate (hereinafter referred to as a "back substrate") 10 and a second substrate (hereinafter referred to as a "front substrate") which are disposed to face each other at predetermined intervals. 20 and a partition wall 16 provided between the substrates 10 and 20. The partition wall 16 is formed at a predetermined height between the rear substrate 10 and the front substrate 20 to partition the plurality of discharge cells 17. The discharge cells 17 are filled with a discharge gas (for example, a mixed gas including neon (Ne), xenon (Xe), etc.) so as to generate a vacuum ultraviolet ray by gas discharge, and absorbs the vacuum ultraviolet ray A phosphor layer 19 for emitting visible light is provided.

The plasma display panel includes an address electrode 11 and a first electrode (hereinafter referred to as a “holding electrode”) corresponding to each discharge cell 17 between the rear substrate 10 and the front substrate 20 in order to realize an image by gas discharge. 31 and a second electrode 32 (hereinafter referred to as "scan electrode").

The address electrodes 11 are covered with a dielectric layer 13 covering the inner surface of the back substrate 10 as described above. The dielectric layer 13 prevents cations or electrons from directly colliding with the address electrode 11 during discharge, thereby preventing damage to the address electrode 11, and also forms and accumulates wall charges. Since the address electrode 11 is disposed on the rear substrate 10 and does not prevent the visible light from being irradiated forward, the address electrode 11 may be formed of an opaque electrode, that is, a metal electrode having excellent electrical conductivity.

The partition 16 is actually provided on the dielectric layer 13 to partition the discharge cells 17. The partitions 16 extend in the y-axis direction, and the plurality of partitions 16 are arranged side by side in the x-axis direction to form a stripe structure of the discharge cells 17.

In addition, the partition wall may further include a partition wall extending in the x-axis direction between the partitions 16 extending in the y-axis direction to form discharge cells in a matrix structure (not shown).

The phosphor layer 19 formed in each of the discharge cells 17 is, for example, a phosphor on the surface of the dielectric layer 13 positioned between the sidewall of the partition 16 and neighboring partitions 16 in the x-axis direction. It is formed by applying a face and drying, exposing, developing and firing it.

The phosphor layer 19 is formed of a phosphor that generates visible light of the same color in the discharge cells 17 formed along the y-axis direction. In addition, the phosphor layer 19 is repeatedly formed by red, green, and blue phosphors in the discharge cells 17 repeatedly disposed along the x-axis direction.

In addition, the sustain electrode 31 and the scan electrode 32 are provided on the inner surface of the front substrate 20 so that the surface discharge structure corresponds to each discharge cell 17 so as to cause gas discharge in the discharge cells 17. To form. The sustain electrode 31 and the scan electrode 32 extend in the x-axis direction crossing the address electrode 11.

Each of the sustain electrode 31 and the scan electrode 32 includes transparent electrodes 31a and 32a for generating a discharge and bus electrodes 31b and 32b for applying a voltage signal to the transparent electrodes 31a and 32a, respectively. Is formed. The transparent electrodes 31 a and 32 a are portions which cause surface discharge inside the discharge cell 17 and are formed of a transparent material (for example, indium tin oxide (ITO)) to secure the aperture ratio of the discharge cell 17. The bus electrodes 31b and 32b are formed of a metal material having excellent conductivity to compensate for the high electrical resistance of the transparent electrodes 31a and 32a.

The transparent electrodes 31a and 32a form surface discharge structures with each of the widths W31 and W32 from the outer edge of the discharge cell 17 along the y-axis direction, and form a center portion of each discharge cell 17. To form a discharge gap (G). The bus electrodes 31b and 32b are disposed on the transparent electrodes 31a and 32a, respectively, and extend in the x-axis direction at the outside of the discharge cell 17. Therefore, when the voltage signal is applied to the bus electrodes 31b and 32b, the voltage signal is applied to each of the transparent electrodes 31a and 32a connected to the bus electrodes 31b and 32b.

Again, the sustain electrode 31 and the scan electrode 32 are covered with the dielectric layer 21 while crossing the address electrodes 11 and facing each other corresponding to the discharge cells 17. The dielectric layer 21 forms and accumulates wall charges during discharge while protecting the sustain electrode 31 and the scan electrode 32 from gas discharge.

This dielectric layer 21 is covered with a protective film 23. For example, the protective film 23 is formed of transparent MgO to protect the dielectric layer 21, thereby increasing the secondary electron emission coefficient during discharge.

On the other hand, in order to seal the back substrate 10 and the front substrate 20 configured as described above, in the manufacturing method of the plasma display panel, the back substrate 10 and the front substrate 20 are introduced into the chamber 100 in an opposite state. (ST100)

At this time, the back substrate 10 is supplied with the address electrodes 11, the dielectric layer 13, the partition 16, and the phosphor layer 19 formed as described above, and the back substrate 10 is a sustain electrode. (31), the scanning electrode 32, the dielectric layer 21, and the protective film 23 are supplied in the state formed (refer FIG. 4).

The rear substrate 10 and the front substrate 20 configured as described above are in the state of FIG. 3 (the state in which the frit 50 is applied to the rear substrate) from the state of FIG. 5 (the molten state in which the frit 50 is not cured). It is put into the chamber 100.

Following this input step ST100, a vacuum atmosphere is formed in the chamber 100 (ST200).

When the vacuum pressure by the vacuum discharge system is applied to the discharge port 101 while both the substrates 10 and 20 are put in, a vacuum atmosphere is formed inside the chamber 100 while the discharge cells between the substrates 10 and 20 are discharged. The gas existing in the field 17 is discharged.

Referring to FIG. 2, at this time, both substrates 10 and 20 facing each other are sufficiently exhausted through four sides thereof.

As described above, since the evacuation by the vacuum atmosphere is formed through the four sides of both substrates 10 and 20, the evacuation time can be further shortened, and the possibility of residual impurities can be greatly improved.

Following the vacuum atmosphere forming step ST200, a discharge gas is injected into the chamber 100 (ST300).

When both the substrates 10 and 20 are introduced and a discharge gas is injected into the discharge port 101 by the vacuum discharge system while the vacuum is formed, the discharge gas atmosphere is formed inside the chamber 100, and both substrates 10 are formed. , Discharge gas is injected and charged into the discharge cells 17 between.

At this time, the atmospheric pressure of the discharge gas formed in the chamber 100 is formed at the same pressure as that of the discharge gas formed in the discharge cells 17 of the plasma display panel. That is, the chamber 100 is filled with discharge gas in a pressure state such as a pressure to be formed in the discharge cells 17 of the product to maintain the pressure range.

Referring to FIG. 2, at this time, both substrates 10 and 20 facing each other are sufficiently injected and filled with discharge gas through four sides thereof.

As such, since the exhaust and discharge gas is filled through the four sides of both substrates 10 and 20, the exhaust port and the exhaust pipe provided in the rear substrate of the conventional plasma display panel may be removed. That is, in the frit 50, the entire area of the back substrate 10 is formed in the plane of the same area as the front substrate 20.

As the exhaust port and the exhaust pipe are removed from the rear substrate, durability problems such as damage of the exhaust pipe and difficulty of implementing the thin film of the plasma display panel can be largely solved.

Following the discharge gas injection step ST300, the rear substrate 10 and the front substrate 20 are sealed to each other in the chamber 100 (ST400).

The rear substrate 10 and the front substrate 20 are sealed to each other in a state where the discharge gas is filled in the discharge cells 17. Separate devices for sealing may be provided with the known sealing devices inside the chamber 100, and thus, illustration and detailed description thereof will be omitted.

At this time, as shown in FIG. 5, the frit 50 in the molten state seals both substrates 10 and 20 with each other while curing. Through this sealing step ST400, the basic plasma display panel structure is completed.

Following the sealing step ST400 of both substrates 10 and 20, the sealed plasma display panel is taken out from the chamber 100. At this time, the discharge gas remaining in the chamber 100 can be recovered through the discharge port 101.

During the plasma display panel driving, a reset discharge is generated by a reset pulse applied to the scan electrode 31 in the reset period, and the scan pulse and the address electrode 11 applied to the scan electrode 32 in the addressing period following the reset period. The address discharge is generated by the address pulse applied to the C1, and then the sustain discharge is generated by the sustain pulse applied to the sustain electrode 31 and the scan electrode 32 in the sustain period.

The sustain electrode 31 and the scan electrode 32 serve as electrodes for applying sustain pulses required for sustain discharge, and the scan electrodes 32 serve as electrodes for applying reset pulses and scan pulses, and the address electrodes. Reference numeral 11 serves as an electrode for applying an address pulse. The sustain electrode 32, the scan electrode 32, and the address electrode 11 may differ in their roles according to voltage waveforms applied to the sustain electrodes 32, the scan electrodes 32, and the address electrodes 11, and are not necessarily limited to these roles.

The plasma display panel selects the discharge cells 17 to be turned on by the address discharge due to the interaction between the address electrode 11 and the scan electrode 32, and the sustain electrode 31 and the scan electrode 32 are mutually selected. The selected discharge cells 17 are driven by sustain discharge due to the action, thereby realizing an image.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

As described above, according to the plasma display panel of the present invention, after forming a vacuum atmosphere in the chamber into which the rear substrate and the front substrate are introduced and injecting the discharge gas, the rear substrate and the front substrate are sealed to each other, so that the plasma display is not provided. There is an effect that makes it possible to manufacture panels.

Claims (3)

It is manufactured by sealing the rear substrate and the front substrate in the chamber filled with the discharge gas, The rear substrate and the front substrate that overlap each other while being offset from each other; A frit provided along the overlapping edges of the rear substrate and the front substrate to seal both substrates; In the frit, the entire area of the back substrate is formed in the plane of the same area as the front substrate. Inserting the back substrate and the front substrate into the chamber in opposition to each other; Forming a vacuum atmosphere in the chamber; Filling the chamber with a discharge gas; Sealing the back substrate and the front substrate in the chamber; And And extracting the sealed back substrate and the front substrate from the chamber. The method of claim 2, Filling the discharge gas, A method of manufacturing a plasma display panel in which discharge gas is filled at a pressure equal to an internal pressure of a final product plasma display panel.

Images