KR100785744B1 - Image sensor packaging method of optical pointing apparatus - Google Patents

Image sensor packaging method of optical pointing apparatus Download PDF

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KR100785744B1
KR100785744B1 KR1020060102825A KR20060102825A KR100785744B1 KR 100785744 B1 KR100785744 B1 KR 100785744B1 KR 1020060102825 A KR1020060102825 A KR 1020060102825A KR 20060102825 A KR20060102825 A KR 20060102825A KR 100785744 B1 KR100785744 B1 KR 100785744B1
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South Korea
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image sensor
printed circuit
circuit board
lead terminal
heat
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KR1020060102825A
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Korean (ko)
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안건준
배재훈
김재동
고희곤
홍성덕
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크루셜텍 (주)
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Abstract

An image sensor packaging method of an optical pointing apparatus is provided to improve productivity by shortening a working time, and prevent a performance from lowering due to heat by cooling efficiently heat generated from an image sensor. A printed circuit board(10) including a plurality of lead terminal groups is prepared. The lead terminal groups are printed in a constant interval on the printed circuit board. Each of the lead terminal group includes a center loading part(12) and lead terminals(14) formed around the loading part. A through-hole(15) is formed at the center loading part of the printed circuit board on which an image sensor(20) is loaded. A heat-absorbing pad(52) is installed on an upper surface of the center loading part. The image sensor is installed on the heat-absorbing pad which is installed at the center loading part. A bonding pad(24) of the image sensor connected with the lead terminals by using a bonding wire(30). A transparent sealant(40) is formed to seal the printed circuit board in order to package the image sensor, the bonding wire, and the lead terminal groups. The packaged image sensors are divided into each of image sensors.

Description

광 포인팅 장치의 이미지 센서 패키징 방법{IMAGE SENSOR PACKAGING METHOD OF OPTICAL POINTING APPARATUS}Image sensor packaging method of optical pointing device {IMAGE SENSOR PACKAGING METHOD OF OPTICAL POINTING APPARATUS}

도 1은 종래의 이미지 센서 패키지를 나타내는 측단면도,1 is a side cross-sectional view showing a conventional image sensor package,

도 2는 본 발명에 따른 광 포인팅 장치의 이미지 센서 패키지가 설치된 휴대 단말기를 나타내는 사시도, 2 is a perspective view of a portable terminal in which an image sensor package of an optical pointing device according to the present invention is installed;

도 3은 본 발명에 따른 이미지 센서 패키지의 구성을 상세하게 나타내는 측단면도, 3 is a side cross-sectional view showing in detail the configuration of an image sensor package according to the present invention;

도 4는 본 발명에 따른 이미지 센서 패키지의 다른 실시예를 나타내는 측단면도, 4 is a side cross-sectional view showing another embodiment of an image sensor package according to the present invention;

도 5는 본 발명에 따른 이미지 센서 패키징 방법의 각 단계를 나타내는 블록도,5 is a block diagram showing each step of the image sensor packaging method according to the present invention;

도 6a는 본 발명의 이미지 센서를 패키징하기 위한 인쇄회로기판의 평면도,6A is a plan view of a printed circuit board for packaging an image sensor of the present invention;

도 6b 내지 도 6l은 본 발명의 이미지 센서 패키징 방법의 각 단계 모습을 도 6a의 Ⅴ-Ⅴ선을 따라 절단하여 나타낸 단면도들이다. 6B to 6L are cross-sectional views illustrating the steps of the image sensor packaging method of the present invention taken along the line VV of FIG. 6A.

♣도면의 주요 부분에 대한 부호의 설명♣ ♣ Explanation of symbols for the main parts of the drawing

10: 인쇄회로기판 12: 안착부10: printed circuit board 12: seating portion

14: 리드단자 14a: 리드단자 군(群)14: lead terminal 14a: lead terminal group

15: 관통홀 20: 이미지 센서15: through hole 20: image sensor

24: 본딩 패드(Bonding Pad)       24: Bonding Pad

30: 본딩 와이어 40: 투명봉지재30: bonding wire 40: transparent sealing material

50: 방열수단 52: 흡열패드50: heat dissipation means 52: endothermic pad

54: 열전달부재 56: 방열패드54: heat transfer member 56: heat dissipation pad

62: 캐필러리(Capillary) 70: 반도체 봉합금형62: capillary 70: semiconductor sealing mold

71: 캐비티면 72: 캐비티(Cavity)71: Cavity side 72: Cavity

80: 쏘잉기(Sawing Machine) 90: 이미지 센서 패키지80: Sawing Machine 90: Image Sensor Package

100: 이미지 센서 패키지100: image sensor package

본 발명은 광 포인팅 장치의 이미지 센서 패키징 방법에 관한 것으로, 더욱 상세하게는, 본 발명의 광 포인팅 장치는 휴대단말기에 장착되어, 광포인팅 장치의 커버플레이트 위에 손가락을 움직임으로써 휴대단말기의 엘씨디(LCD)상의 커서를 움직이게 하는 장치이다. 또한 본 발명의 광포인팅 장치에 있어서 이미지 센서 패키지는 손가락의 움직임을 감지하는 센서패키지로 광포인팅 장치의 생산효율 뿐만 아니라 성능에 중요한 역할을 한다. 그러기 위해선 패키징이 쉽고 간편하여 제조시간을 단축시키고 생산효율을 향상시킬 수 있으며, 내부에서 발생된 열을 보다 효율적으로 냉각시켜 열로 인한 성능저하와 수명 단축현상을 미연에 방지할 수 있는 광 포인팅 장치의 이미지 센서 패키징 방법에 관한 것이다. The present invention relates to a method of packaging an image sensor of an optical pointing device, and more particularly, the optical pointing device of the present invention is mounted on a portable terminal, and moves the finger on the cover plate of the optical pointing device to move the LCD of the portable terminal (LCD). It is a device to move the cursor on). In addition, in the optical pointing device of the present invention, the image sensor package is a sensor package that detects the movement of a finger and plays an important role in performance as well as production efficiency of the optical pointing device. To do this, packaging is easy and simple, which shortens manufacturing time and improves production efficiency, and more efficiently cools internally generated heat, thereby preventing performance degradation and shortening of life due to heat. An image sensor packaging method.

개인 휴대 단말기 등에 설치되는 입력장치의 일례로서, 광 포인팅 장치가 제안되고 있으며, 광 포인팅 장치는 이미지 센서 패키지(Image Sensor Package)를 구비하고 있다. As an example of an input device installed in a personal portable terminal or the like, an optical pointing device has been proposed, and the optical pointing device includes an image sensor package.

이미지 센서 패키지는, 빛의 변화를 감지하여 전기적인 영상 신호로 변환시켜주는 장치로서, 디지털 카메라, 디지털 캠코더 및 각종 휴대용 단말기 등에 많이 사용되고 있다. The image sensor package is a device that detects a change in light and converts it into an electric video signal, and is widely used in digital cameras, digital camcorders, and various portable terminals.

이러한 이미지 센서 패키지는 도 1에 도시된 바와 같이, 이미지 센서(1)를 인쇄회로기판(3)에 실장한 다음, 실장된 이미지 센서(1)를 커버(5)로 패키징(Packaging)하는 구성을 갖는다.As shown in FIG. 1, the image sensor package is configured to mount the image sensor 1 on the printed circuit board 3 and then package the mounted image sensor 1 into the cover 5. Have

특히, 커버(5)는, 외부의 오염물질과 기계적인 충격으로부터 이미지 센서(1) 및 이미지 센서(1)와 전기적으로 연결되는 리드단자(6)와 본딩 와이어(7)를 보호하는 것으로, 이미지 센서(1)의 둘레에 배열되는 세라믹 재질의 측벽부(5a)와, 측벽부(5a)의 트인 상부를 덮는 투명재질의 커버판부(5b)로 구성된다.In particular, the cover 5 protects the lead terminal 6 and the bonding wire 7 electrically connected to the image sensor 1 and the image sensor 1 from external contaminants and mechanical shocks. It comprises a side wall portion 5a of ceramic material arranged around the sensor 1 and a cover plate portion 5b made of a transparent material covering the open top of the side wall portion 5a.

그런데, 이러한 종래의 이미지 센서 패키지는, 커버(5)를 구성하기 위한 패키징 작업이 매우 까다롭고 힘들다는 문제점이 있으며, 이에 따라 작업시간이 지연되고, 작업시간이 지연됨에 따라 생산효율도 떨어진다는 단점이 있다.However, such a conventional image sensor package has a problem that the packaging operation for configuring the cover 5 is very difficult and difficult, and thus the work time is delayed and the production efficiency is also reduced as the work time is delayed. There is this.

즉, 종래의 커버(5)는, 세라믹 재질의 측벽부(5a)와, 측벽부(5a)를 덮는 투명재질의 커버판부(5b)로 구성되므로, 패키징 작업시에 이미지 센서(1)을 둘러싸도록 측벽부(5a)를 일일이 형성한 다음, 측벽부(5a)의 트인 상부를 투명 커버판 부(5b)로 다시 일일이 덮어야 한다는 단점이 있다.That is, since the conventional cover 5 is composed of a ceramic side wall portion 5a and a transparent cover plate portion 5b covering the side wall portion 5a, the image cover 1 surrounds the image sensor 1 during packaging operation. After the side wall portion 5a is formed one by one, the open top of the side wall portion 5a must be covered with the transparent cover plate portion 5b again.

따라서, 패키징 작업이 매우 번거롭고 까다로우며, 많은 수작업이 요구된다는 문제점이 있다. 특히, 이같은 문제점 때문에 작업시간이 지연되고, 작업시간이 지연됨에 따라 생산효율도 현저하게 저하된다는 문제점이 있다.Therefore, there is a problem that the packaging operation is very cumbersome and difficult, and requires a lot of manual work. In particular, the work time is delayed due to such a problem, there is a problem that the production efficiency is significantly reduced as the work time is delayed.

그리고 종래의 이미지 센서 패키지는, 이미지 센서(1)에서 발생되는 열로 인해 성능이 저하되고 수명이 짧아지는 등의 문제점이 있다.In addition, the conventional image sensor package has a problem that the performance is reduced due to the heat generated from the image sensor 1, the life is shortened.

즉, 이미지 센서(1)는 작동시에 전기에너지의 일부를 열손실로 방출하는데, 이렇게 방출된 열은 외부로 방출되지 않은 채, 이미지 센서(1)를 과열시킨다는 문제점이 있으며, 이러한 문제점 때문에 이미지 센서(1)의 성능이 급격히 저하되고, 수명이 현저하게 단축된다는 문제점이 있다. 또한 기존의 이미지 센서 패키지(1)는, 외부의 충격, 먼지, 전기적 충격에 취약하다는 문제점을 안고 있다.That is, the image sensor 1 emits a part of the electrical energy as a heat loss during operation, there is a problem that the heat is released overheat the image sensor 1 without being released to the outside, because of this problem There is a problem that the performance of the sensor 1 is drastically lowered and the life is significantly shortened. In addition, the existing image sensor package 1 has a problem that it is vulnerable to external shock, dust, and electrical shock.

따라서, 본 발명은 상기한 바와 같은 종래의 문제점을 해결하기 위해 이루어진 것으로서, 그 목적은 패키징 작업이 매우 쉽고 간편하며, 패키지의 롤(Roll)작업을 간편하게 할 수 있는 광 포인팅 장치의 이미지 센서 패키징 방법을 제공하는 데 있다. Accordingly, the present invention has been made to solve the conventional problems as described above, the purpose of the packaging process is an image sensor packaging method of the optical pointing device that is very easy and simple, and can easily roll the package (Roll) To provide.

본 발명의 다른 목적은, 패키징 작업을 매우 용이하게 수행할 수 있도록 하여 제조시간을 단축시키고, 패키징 봉합에 있어서 기계적/전기적/화학적인 안정성및 생산효율을 향상시킬 수 있는 광 포인팅 장치의 이미지 센서 패키징 방법을 제공하는 데 있다.Another object of the present invention is to package an image sensor of an optical pointing device that can make the packaging operation very easy to shorten the manufacturing time and improve the mechanical / electrical / chemical stability and production efficiency in the packaging sealing. To provide a way.

본 발명의 다른 목적은, 이미지 센서에서 발생된 열을 보다 효율적으로 냉각시킴으로써, 열로 인한 성능저하 및 수명단축현상을 미연에 방지할 수 있는 광 포인팅 장치의 이미지 센서 패키징 방법을 제공하는 데 있다.Another object of the present invention is to provide an image sensor packaging method of an optical pointing device that can more efficiently cool down heat generated in an image sensor, thereby preventing performance degradation and lifespan shortening due to heat.

이와 같은 목적을 달성하기 위하여 본 발명의 광 포인팅 장치의 이미지 센서 패키징 방법은, 중앙의 안착부와, 둘레의 리드단자들로 이루어진 리드단자 군(群)이 간격을 두고 다수개 인쇄된 인쇄회로기판을 준비하는 단계와; 상기 각 리드단자 군의 중앙 안착부 각각에 이미지 센서를 설치하는 단계와; 상기 이미지 센서의 본딩 패드와 상기 리드단자 군의 리드단자들을 본딩 와이어로 연결하는 단계와; 상기 이미지 센서와 본딩 와이어와 리드단자 군을 덮어서 패키징할 수 있도록 상기 인쇄회로기판에 투명봉지재를 일체로 사출 봉합 성형하는 단계와; 상기 패키징된 각 이미지 센서 패키지를 낱개로 분리하는 단계를 포함하는 것을 특징으로 한다. In order to achieve the above object, the image sensor packaging method of the optical pointing device of the present invention includes a printed circuit board in which a plurality of lead terminals composed of a center seat portion and a lead terminal circumference are spaced apart. Preparing a; Installing an image sensor on each of the center seating portions of the lead terminal groups; Connecting the bonding pads of the image sensor and the lead terminals of the lead terminal group with bonding wires; Injection sealing molding the transparent sealing material integrally on the printed circuit board so as to cover and package the image sensor, the bonding wire, and the lead terminal group; And separating each of the packaged image sensor packages individually.

바람직하게는, 상기 각 리드단자 군의 중앙 안착부에 이미지 센서를 설치하기 전에, 상기 중앙 안착부와 상기 이미지 센서 사이에 흡열패드를 설치하는 단계와, 상기 흡열패드와 연결 접촉될 수 있도록 상기 인쇄회로기판에 열전달부재를 설치하는 단계와, 상기 열전달부재와 연결 접촉될 수 있도록 인쇄회로기판의 밑면에 방열패드를 설치하는 단계를 더 포함하는 것을 특징으로 한다.Preferably, prior to installing the image sensor in the central seating portion of each of the lead terminal group, the step of installing a heat absorbing pad between the center seating portion and the image sensor, the printing so as to be in contact with the heat absorbing pad The method may further include installing a heat transfer member on the circuit board, and installing a heat dissipation pad on a bottom surface of the printed circuit board so as to be in contact with the heat transfer member.

이하, 본 발명에 따른 광 포인팅 장치의 이미지 센서 패키징 방법의 바람직한 실시예를 첨부 도면에 의거하여 상세히 설명한다.Hereinafter, a preferred embodiment of the image sensor packaging method of the optical pointing device according to the present invention will be described in detail with reference to the accompanying drawings.

먼저, 본 발명의 특징부인 이미지 센서 패키지를 살펴보기에 앞서 광 포인팅 장치에 대해 간략하게 살펴본다. First, the optical pointing device is briefly described before looking at the image sensor package which is a feature of the present invention.

광 포인팅 장치는 도 2에 도시된 바와 같이, 휴대단말기에 장착되어 장치의 커버플레이트 상의 피사체(손가락 표면)의 움직임을 통해 휴대단말기 엘씨디(LCD)의 커서를 움직이게 하는 장치로써 피사체의 움직임을 감지하는 이미지 센서 패키지를 구비한다. As shown in FIG. 2, the optical pointing device is a device that is mounted on a portable terminal and moves a cursor of an LCD (LCD) through a movement of a subject (a finger surface) on a cover plate of the apparatus. An image sensor package is provided.

다음으로, 본 발명의 특징부인 이미지센서 패키지(150)에 대해 상세하게 살펴본다. 먼저, 본 발명의 이미지 센서 패키지는, 도 3에 도시된 바와 같이, 인쇄회로기판(10)을 구비한다. 인쇄회로기판(10)은 상면의 안착부(12)와, 안착부(12) 둘레의 리드단자(14)들을 갖추고 있다.Next, the image sensor package 150 which is a feature of the present invention will be described in detail. First, the image sensor package of the present invention, as shown in Figure 3, includes a printed circuit board 10. The printed circuit board 10 has a seating portion 12 on the upper surface and lead terminals 14 around the seating portion 12.

그리고 본 발명의 이미지 센서 패키지는, 인쇄회로기판(10)의 안착부(12)에 접착되는 이미지 센서(20)를 구비한다. 이미지 센서(20)는, 빛의 변화를 전기적인 영상 신호로 변환시켜주는 광검출 반도체 칩으로서, 상면 중앙에는 외부의 빛을 수용하기 위한 광수용부(22)가 형성되고, 광수용부(22)의 둘레에는 다수의 본딩 패드(24)가 형성되어 있다. In addition, the image sensor package of the present invention includes an image sensor 20 bonded to the mounting portion 12 of the printed circuit board 10. The image sensor 20 is a photodetector semiconductor chip that converts a change of light into an electrical image signal. A photoreceptor 22 is formed at the center of the upper surface to receive external light. A plurality of bonding pads 24 are formed in the circumference.

한편, 이미지 센서(20)의 본딩 패드(24)와 인쇄회로기판(10)의 리드단자(14)는 본딩 와이어(30)에 의해 연결된다. 본딩 와이어(30)는 금(Gold) 재질의 세선(細線)으로 구성되며, 이미지 센서(20)의 본딩 패드(24)와 인쇄회로기판(10)의 리드단자(14)를 전기적으로 연결한다. Meanwhile, the bonding pad 24 of the image sensor 20 and the lead terminal 14 of the printed circuit board 10 are connected by the bonding wire 30. The bonding wire 30 is composed of a thin wire made of gold, and electrically connects the bonding pad 24 of the image sensor 20 and the lead terminal 14 of the printed circuit board 10.

다시, 도 3을 참조하면, 본 발명의 이미지 센서 패키지는, 이미지 센서(20)와 본딩 와이어(30) 및 리드단자(14)를 덮어서 봉합하는 투명봉지재(40)를 구비한 다. Referring back to FIG. 3, the image sensor package of the present invention includes a transparent encapsulant 40 covering and sealing the image sensor 20, the bonding wire 30, and the lead terminal 14.

투명봉지재(40)는, 절연체이면서 빛의 투과성이 매우 좋은 재질, 예를 들면, 투명 에폭시몰딩컴파운드(Epoxy Molding Compound)로 구성되며, 인쇄회로기판(10)의 상면을 완전히 덮어서 봉합하도록 구성된다. 특히, 이미지 센서(20)와, 상기 이미지 센서(20)와 리드단자(14)를 연결하는 본딩 와이어(30)를 완전히 봉합하도록 구성된다. 이러한 투명봉지재(40)는 사출 및 반도체 몰딩 성형에 의한 방법을 통해 상기 인쇄회로기판(10)상에 일체로 성형된다. The transparent encapsulant 40 is made of an insulator and a material having excellent light permeability, for example, a transparent epoxy molding compound, and is configured to completely cover and seal the upper surface of the printed circuit board 10. . In particular, the image sensor 20 and the bonding wire 30 connecting the image sensor 20 and the lead terminal 14 are configured to be completely sealed. The transparent encapsulant 40 is integrally molded on the printed circuit board 10 through a method of injection molding and semiconductor molding molding.

이러한 투명봉지재(40)는, 이미지 센서(20)와 본딩 와이어(30)와 리드단자(14)를 완전히 봉합하는 구조이므로, 상기 이미지 센서(20)와 본딩 와이어(30)와 리드단자(14)를 외부의 오염물질과 충격으로부터 보호할 수 있다.Since the transparent encapsulant 40 has a structure in which the image sensor 20, the bonding wire 30, and the lead terminal 14 are completely sealed, the image sensor 20, the bonding wire 30, and the lead terminal 14 are sealed. ) Can be protected from external contaminants and impacts.

또한, 투명봉지재(40)는, 사출 및 반도체 몰딩 성형에 의한 방법으로 형성되므로, 매우 용이하고 간편하게 제조될 수 있다. 따라서 패키징 공정이 단순화될 수 있다. 특히, 패키징 공정이 단순화되므로, 제조시간을 단축시킬 수 있고 생산효율을 향상시킬 수 있다. In addition, the transparent encapsulant 40 is formed by a method by injection molding and semiconductor molding, and thus can be manufactured very easily and simply. Thus, the packaging process can be simplified. In particular, since the packaging process is simplified, manufacturing time can be shortened and production efficiency can be improved.

또한, 투명봉지재(40)는, 몸체가 전체적으로 투명하므로, 많은 량의 빛이 간섭받지 않고 이미지 센서(20)의 광수용부(22)로 수용될 수 있게 한다. In addition, since the transparent encapsulant 40 is entirely transparent, the transparent encapsulant 40 may be accommodated in the light receiving portion 22 of the image sensor 20 without a large amount of light being interfered with.

다음으로, 도 4에는 본 발명에 따른 광 포인팅 장치의 이미지 센서 패키지의 다른 실시예를 나타내는 도면이 도시되어 있다. 다른 실시예의 광 포인팅 장치의 이미지 센서 패키지는, 이미지 센서(20)를 냉각시키는 방열수단(50)을 구비한다. Next, FIG. 4 is a view showing another embodiment of an image sensor package of the optical pointing device according to the present invention. The image sensor package of the optical pointing device of another embodiment includes heat dissipation means 50 for cooling the image sensor 20.

방열수단(50)은, 이미지 센서(20)와 인쇄회로기판(10)의 사이에 설치되는 흡 열패드(52)와, 흡열패드(52)와 연결되도록 인쇄회로기판(10)에 설치되는 열전달부재(54)와, 열전달부재(54)와 연결되도록 인쇄회로기판(10)의 밑면에 설치되는 방열패드(56)을 구비한다. The heat dissipation means 50 may include a heat absorbing pad 52 disposed between the image sensor 20 and the printed circuit board 10, and a heat transfer unit installed on the printed circuit board 10 so as to be connected to the heat absorbing pad 52. The member 54 and the heat dissipation pad 56 are installed on the bottom surface of the printed circuit board 10 so as to be connected to the heat transfer member 54.

흡열패드(52)는 열전도율이 우수한 재질로 구성되며, 인쇄회로기판(10)의 상면에 형성된 안착부(12)에 안착되도록 구성된다. 이러한 흡열패드(52)는, 이미지 센서(20)의 밑면과 접촉한 상태에서, 상기 이미지 센서(20)에서 발생되는 열을 흡수하는 역할을 한다. The heat absorbing pad 52 is made of a material having excellent thermal conductivity, and is configured to be seated on the seating portion 12 formed on the upper surface of the printed circuit board 10. The heat absorbing pad 52 absorbs heat generated from the image sensor 20 while in contact with the bottom surface of the image sensor 20.

열전달부재(54)는, 인쇄회로기판(10)을 관통하는 관통홀(15)에 설치되며, 열전도율이 우수한 재질, 예를 들면, 금속재로 구성된다. 이러한 열전달부재(54)는 흡열패드(52)의 열을 인쇄회로기판(10)의 밑면으로 전달하는 역할을 한다.The heat transfer member 54 is provided in the through hole 15 penetrating the printed circuit board 10 and is made of a material having excellent thermal conductivity, for example, a metal material. The heat transfer member 54 serves to transfer the heat of the heat absorbing pad 52 to the bottom surface of the printed circuit board 10.

방열패드(56)는, 열전도율이 우수한 재질, 예를 들면, 금속재로 구성되며, 인쇄회로기판(10)의 밑면에 안착된다. 이러한 방열패드(56)는 열전달부재(54)로부터 전달된 열을 외기로 방출하도록 구성된다. The heat dissipation pad 56 is made of a material having excellent thermal conductivity, for example, a metal, and is mounted on the bottom surface of the printed circuit board 10. The heat dissipation pad 56 is configured to discharge heat transferred from the heat transfer member 54 to the outside air.

이러한 다른 실시예의 이미지 센서 패키지에 의하면, 이미지 센서(20)에서 발생된 열을 흡열패드(52)로 흡수한 다음, 흡수된 열을 열전달부재(54)로써 인쇄회로기판(10)의 밑면으로 전달하고, 전달된 열을 방열패드(56)를 통해 외부로 방출하는 구성을 갖는다. 따라서, 이미지 센서(20)에서 발생된 열을 외부로 신속히 방출할 수 있으며, 이에 따라 이미지 센서(20)를 신속하게 냉각시킬 수 있게 된다. According to the image sensor package of another embodiment, the heat generated from the image sensor 20 is absorbed by the heat absorbing pad 52, and then the absorbed heat is transferred to the underside of the printed circuit board 10 by the heat transfer member 54. And, it has a configuration that releases the transferred heat to the outside through the heat radiation pad (56). Therefore, the heat generated by the image sensor 20 can be quickly released to the outside, thereby allowing the image sensor 20 to be cooled quickly.

특히, 이미지 센서(20)를 신속하게 냉각시킴으로써, 이미지 센서(20)가 과열되는 것을 방지할 수 있으며, 이미지 센서(20)의 과열을 방지할 수 있으므로, 이미 지 센서(20)의 과열로 인한 이미지 센서(20)의 성능저하와 수명단축을 미연에 방지할 수 있다. In particular, by rapidly cooling the image sensor 20, it is possible to prevent the image sensor 20 from overheating, and to prevent overheating of the image sensor 20, the overheating of the image sensor 20 It is possible to prevent the performance degradation and the shortening of the life of the image sensor 20 in advance.

이하에서는, 이와 같은 구성을 갖는 이미지 센서 패키지의 패키징 방법을 도 5와 도 6a 내지 도 6l을 참조하여 상세하게 살펴본다.Hereinafter, a packaging method of an image sensor package having such a configuration will be described in detail with reference to FIGS. 5 and 6A to 6L.

먼저, 본 발명의 패키징 방법은, 도 5와 도 6a와 도 6b에 도시된 바와 같이, 다수개의 리드단자 군(群)(14a)이 간격을 두고 인쇄된 인쇄회로기판(10)을 준비한다(S101). 여기서, 리드단자 군(14a)은 복수개의 리드단자(14)들로 구성되며, 이들 리드단자(14)들은 중앙 안착부(12)의 둘레에 대략 4각형 배열을 이루며 인쇄되어 있다. First, in the packaging method of the present invention, as shown in FIGS. 5, 6A, and 6B, a plurality of lead terminal groups 14a are prepared with a printed circuit board 10 printed at intervals ( S101). Here, the lead terminal group 14a is composed of a plurality of lead terminals 14, and these lead terminals 14 are printed in a substantially quadrangular arrangement around the central seating portion 12.

한편, 인쇄회로기판(10)의 준비가 완료되면, 도 5와 도 6c와 도 6d와 도 6e에 도시된 바와 같이, 각 리드단자 군(14a)의 중앙 안착부(12)에 흡열패드(52)를 부착한 다음(S103), 흡열패드(52)의 밑면과 연결 접촉될 수 있도록 인쇄회로기판(10)의 관통홀(15)에 열전달부재(54)를 설치하고(S105), 설치된 열전달부재(54)의 밑면과 연결 접촉되도록 인쇄회로기판(10)의 밑면에 방열패드(56)를 부착한다(S107). On the other hand, when the preparation of the printed circuit board 10 is completed, as shown in FIGS. 5, 6C, 6D, and 6E, the heat absorbing pad 52 is disposed at the center seating portion 12 of each lead terminal group 14a. ) Is attached (S103), the heat transfer member 54 is installed in the through hole 15 of the printed circuit board 10 so as to be in contact with the bottom surface of the heat absorbing pad 52 (S105), the heat transfer member is installed The heat dissipation pad 56 is attached to the bottom of the printed circuit board 10 so as to be in contact with the bottom of the 54 (S107).

이때, 흡열패드(52)와 방열패드(56)는 접착제, 예를 들면, 에폭시수지 접착제 또는 폴리아미드 접착제 등을 통해 인쇄회로기판(10)에 부착된다. 그리고 방열패드(56)은 인쇄회로기판(10)의 밑면에 부착된다. At this time, the heat absorbing pad 52 and the heat radiating pad 56 are attached to the printed circuit board 10 through an adhesive, for example, an epoxy resin adhesive or a polyamide adhesive. The heat dissipation pad 56 is attached to the bottom surface of the printed circuit board 10.

그리고 흡열패드(52)와 방열패드(56)의 부착이 완료되면, 도 5와 도 6f에 도시된 바와 같이, 인쇄회로기판(10)의 각 흡열패드(52) 상면에 이미지 센서(20)를 접착한다(S109). 이때, 이미지 센서(20)의 접착은 에폭시수지 접착제 또는 폴리아미드 접착제 등을 통해 접착한다.When the heat absorbing pad 52 and the heat radiating pad 56 are attached, the image sensor 20 is placed on the top of each heat absorbing pad 52 of the printed circuit board 10, as shown in FIGS. 5 and 6F. Adhesion (S109). In this case, the image sensor 20 is attached through an epoxy resin adhesive or a polyamide adhesive.

그리고 이미지 센서(20)의 접착이 완료되면, 도 5와 도 6g에 도시된 바와 같이, 이미지 센서(20)의 본딩 패드(24)와 리드단자 군(14a)의 리드단자(14)를 본딩 와이어(30)로 연결한다(S111). 이때, 본딩 와이어(30)의 연결은, 와이어 본더(Wire Bonder)(도시하지 않음)에 의해 이루어진다. 상기 와이어 본더는, 와이어 캐필러리(Capillary)(62)를 갖춘 장치로서, 상기 캐필러리(62)를 본딩 패드(24)와 리드단자(14) 사이에서 이동시켜가면서 상기 본딩 패드(24)와 리드단자(14)를 본딩 와이어(30)로 연결 접속시키는 장치이다. When the adhesion of the image sensor 20 is completed, as shown in FIGS. 5 and 6G, the bonding pad 24 of the image sensor 20 and the lead terminal 14 of the lead terminal group 14a are bonded to the wire. Connect to (30) (S111). At this time, the bonding wire 30 is connected by a wire bonder (not shown). The wire bonder is a device having a wire capillary 62, which moves the capillary 62 between the bonding pad 24 and the lead terminal 14 while the bonding pad 24 is moved. And the lead terminal 14 are connected to each other by a bonding wire 30.

다음으로, 와이어 본딩 공정이 완료되면, 도 5와 도 6h와 도 6i와 도 6j에 도시된 바와 같이, 이미지 센서(20)와 본딩 와이어(30)와 리드단자 군(14a)을 덮어서 패키징하도록 상기 인쇄회로기판(10)에 투명봉지재(40)를 일체로 사출 및 반도체 몰딩 성형한다(S113). Next, when the wire bonding process is completed, as shown in FIGS. 5, 6H, 6I, and 6J, the package to cover and package the image sensor 20, the bonding wire 30, and the lead terminal group 14a. The transparent encapsulant 40 is integrally injected and molded on the printed circuit board 10 (S113).

사출 및 반도체 몰딩 성형은, 도 6h에서와 같이, 각 이미지 센서(20)와 본딩 와이어(30)와 리드단자 군(14a)에 대응되는 캐버티(Cavity)(72)와 투명도 및 굴절율 개선을 위해 거칠기(Ra) 0.02까지의 매끄러운 반도체 봉합금형(70)의 캐비티면(71)을 폴리싱가공하여 준비한 다음, 준비된 반도체 봉합금형(70)을 인쇄회로기판(10)의 상면에 배치시켜 각 이미지 센서(20)와 본딩 와이어(30)와 리드단자 군(14a)을 덮어서 폐쇄한다. 그리고 도 6i에서와 같이, 반도체 봉합금형(70)의 캐버티(72)에 투명 재질의 유동성 성형재료, 예를 들면, 투명 에폭시몰딩컴파운 드(Epoxy Molding Compound)(74)를 봉합 금형에 충진시킨후 열을 가하면 점성이 떨어짐으로써 물처럼 묽어진다. 그리고 소정시간이 지난 후에는 경화가 되어 성형이 이루어지고, 도 6j에서와 같이, 반도체 봉합금형(70)을 인쇄회로기판(10)으로부터 분리시킴으로써, 이미지 센서(20)와 본딩 와이어(30)와 리드단자 군(14a)을 덮어서 봉합하도록 투명봉지재(40)를 일체로 사출 및 반도체 몰딩 성형하는 것이다. Injection and semiconductor molding molding, as shown in Figure 6h, to improve the cavities (72) corresponding to each image sensor 20, the bonding wire 30 and the lead terminal group 14a, and to improve transparency and refractive index After polishing and preparing the cavity surface 71 of the smooth semiconductor sealing mold 70 up to the roughness Ra 0.02, the prepared semiconductor sealing mold 70 is disposed on the upper surface of the printed circuit board 10 so that each image sensor ( 20), the bonding wire 30, and the lead terminal group 14a are covered and closed. As shown in FIG. 6I, a fluid molding material of a transparent material, for example, a transparent epoxy molding compound 74, is filled in the sealing mold in the cavity 72 of the semiconductor encapsulation mold 70. When heated, it becomes less viscous and dilutes like water. After a predetermined time has elapsed, curing is performed, and molding is performed. As shown in FIG. 6J, the semiconductor encapsulation mold 70 is separated from the printed circuit board 10 to thereby form an image sensor 20 and a bonding wire 30. The transparent encapsulant 40 is integrally injection molded and semiconductor molded to cover and seal the lead terminal group 14a.

그리고 사출 및 반도체 몰딩 성형이 완료되면, 도 5와 도 6k에서와 같이, 패키징된 이미지 센서(20)를 낱개로 분리한다(S115). When injection and semiconductor molding molding are completed, as illustrated in FIGS. 5 and 6K, the packaged image sensor 20 is separately separated (S115).

분리 공정은, 패키징된 이미지 센서(20)가 분리될 수 있도록 인쇄회로기판(10)을 절단하는 공정으로서, 쏘잉기(Sawing Machine)(80)를 통해 이루어지며, 커터(80)를 통해 절단된 각 이미지 센서(20)는, 도 6l에 도시된 바와 같이, 하나의 이미지 센서 패키지(100)로 제조된다. The separation process is a process of cutting the printed circuit board 10 so that the packaged image sensor 20 can be separated. The separation process is performed through a sawing machine 80 and is cut through the cutter 80. Each image sensor 20 is made of one image sensor package 100, as shown in FIG. 6L.

이상에서와 같이 여러 단계를 통하여 제조된 이미지 센서 패키지(100)는, 투명봉지재(40)를 사출에 의한 방법으로 형성하므로, 패키징하기가 매우 간편하고, 전기적/기계적/화학적으로 안정성을 유지할 수 있다. 따라서, 작업시간을 단축시킬 수 있으며, 이에 따라 생산성을 향상시킬 수 있다.Since the image sensor package 100 manufactured through various steps as described above is formed by the method of the transparent encapsulant 40 by injection, it is very easy to package and can maintain the electrical / mechanical / chemical stability have. Therefore, working time can be shortened and productivity can be improved accordingly.

또한, 이미지 센서(20)를 냉각시키기 위한 흡열패드(52)와 열전달부재(54)와 방열패드(56)도 갖추고 있으므로, 이미지 센서(20)의 과열을 방지하며, 따라서, 이미지 센서(20)의 과열로 인한 성능저하 및 수명단축을 미연에 방지할 수 있다. In addition, since the heat absorbing pad 52, the heat transfer member 54, and the heat radiating pad 56 for cooling the image sensor 20 are also provided, the overheating of the image sensor 20 is prevented, and thus the image sensor 20 is provided. It can prevent the deterioration of performance and shorten the life due to overheating.

한편, 본 발명에 따른 이미지 센서 패키징 방법의 다른 예로서, 상기 각 리드단자 군(14a)의 중앙 안착부(12)에 이미지 센서(20)를 직접 설치할 수도 있다. 이때, 흡열패드(52)와 열전달부재(54)와 방열패드(56)는 인쇄회로기판(10)에 설치하지 않음은 물론이다. On the other hand, as another example of the image sensor packaging method according to the present invention, the image sensor 20 may be directly installed in the central seating portion 12 of each lead terminal group 14a. In this case, the heat absorbing pad 52, the heat transfer member 54, and the heat radiating pad 56 are not installed on the printed circuit board 10.

이상에서는 본 발명의 바람직한 실시예를 예시적으로 설명하였으나, 본 발명의 범위는 이와 같은 특정 실시예에만 한정되는 것은 아니며, 특허청구범위에 기재된 범주내에서 적절하게 변경 가능한 것이다. Although the preferred embodiments of the present invention have been described above by way of example, the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope of the claims.

이상에서 설명한 바와 같이, 본 발명의 이미지 센서 패키지 방법에 의하면, 투명봉지재를 사출에 의한 방법으로 형성하므로, 패키징하기가 매우 간편하며, 따라서, 작업시간을 단축시킬 수 있으며, 생산성을 향상시킬 수 있다.As described above, according to the image sensor package method of the present invention, since the transparent encapsulant is formed by the injection method, it is very easy to package, thereby reducing the work time and improve productivity. have.

또한 광포인팅 장치의 이미지 센서패키지가 돔스위치를 포함한 기계적 스위치에 의해 클릭기능을 부가할 경우, 클릭에 따른 상하 하중에 따라 이미지 센서 패키지에 심각한 충격을 주게되고 이는 센서 본딩 와이어의 단선불량이 발생될수 있다. 따라서 본발명은 이에 대한 불량들을 원천적으로 방지할수 있는 효과가 있다.In addition, when the image sensor package of the optical pointing device adds a click function by a mechanical switch including a dome switch, the image sensor package may be severely affected by the vertical load due to the click, which may cause disconnection of the sensor bonding wire. have. Therefore, the present invention has an effect that can prevent the defects on the basis of.

또한, 이미지 센서를 효율적으로 냉각시키는 구조를 가짐으로써 이미지 센서의 과열을 방지하며, 따라서, 이미지 센서의 과열로 인한 성능저하 및 수명단축을 미연에 방지할 수 있는 효과가 있다. In addition, having a structure for efficiently cooling the image sensor prevents overheating of the image sensor, and therefore, there is an effect of preventing performance degradation and lifespan reduction due to overheating of the image sensor.

Claims (4)

광 포인팅 장치의 이미지 센서 패키징 방법에 있어서,In the image sensor packaging method of the optical pointing device, 중앙의 안착부(12)와, 둘레의 리드단자(14)들로 이루어진 리드단자 군(群)(14a)이 간격을 두고 다수개 인쇄된 인쇄회로기판(10)을 준비하는 단계와;Preparing a plurality of printed printed circuit boards 10 at intervals between a center seating portion 12 and lead terminal groups 14a formed of peripheral lead terminals 14; 이미지 센서(20)가 안착될 인쇄회로기판(10) 중앙의 안착부(12) 각각에 관통홀(15)을 형성하는 단계와;Forming through-holes 15 in each of the mounting portions 12 in the center of the printed circuit board 10 on which the image sensor 20 is to be mounted; 상기 인쇄회로기판(10) 중앙의 안착부(12) 상면에 흡열패드(52)를 설치하는 단계와;Installing a heat absorbing pad (52) on an upper surface of the seating portion (12) in the center of the printed circuit board (10); 상기 각 리드단자 군(14a)의 중앙 안착부(12)에 설치된 흡열패드(52)위에 이미지 센서(20)를 설치하는 단계와;Installing an image sensor (20) on the heat absorbing pad (52) installed at the center seating portion (12) of each of the lead terminal groups (14a); 상기 이미지 센서(20)의 본딩 패드(24)와 상기 리드단자 군(14a)의 리드단자(14)들을 본딩 와이어(30)로 연결하는 단계와;Connecting bonding pads (24) of the image sensor (20) and lead terminals (14) of the lead terminal group (14a) with bonding wires (30); 상기 이미지 센서(20)와 본딩 와이어(30)와 리드단자 군(14a)을 덮어서 패키징할 수 있도록 상기 인쇄회로기판(10)에 투명봉지재(40)를 일체로 사출 봉합 성형하는 단계와;Injection sealing molding the transparent sealing material 40 integrally with the printed circuit board 10 so as to cover and package the image sensor 20, the bonding wire 30, and the lead terminal group 14a; 상기 패키징된 각 이미지 센서(20)를 낱개로 분리하는 단계를 포함하는 것을 특징으로 하는 광 포인팅 장치의 이미지 센서 패키징 방법.And separately separating each of the packaged image sensors (20). 제1항에 있어서,The method of claim 1, 상기 각 리드단자 군(14a)의 중앙 안착부(12)에 이미지 센서(20)를 설치하기 전에,Before installing the image sensor 20 to the central seating portion 12 of each lead terminal group 14a, 상기 흡열패드(52)와 연결 접촉 될 수 있도록 상기 인쇄회로기판(10)에 열전달부재(54)를 설치하는 단계와, Installing a heat transfer member 54 on the printed circuit board 10 so as to be in contact with the heat absorbing pad 52; 상기 열전달부재(54)와 연결 접촉될 수 있도록 인쇄회로기판(10)의 밑면에 방열패드(56)를 설치하는 단계를 더 포함하는 것을 특징으로 하는 광 포인팅 장치의 이미지 센서 패키징 방법.And installing a heat dissipation pad (56) on a bottom surface of the printed circuit board (10) so as to be in contact with the heat transfer member (54). 삭제delete 삭제delete
KR1020060102825A 2006-10-23 2006-10-23 Image sensor packaging method of optical pointing apparatus KR100785744B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200447764Y1 (en) * 2008-02-14 2010-02-18 (주) 아이.에스.브이. Photo sensor module for opticla mouse
KR101018253B1 (en) * 2009-03-12 2011-03-03 삼성전기주식회사 Camera Module

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KR20000000325U (en) * 1998-06-08 2000-01-15 김영환 Surface Mount Semiconductor Package
KR20000070837A (en) * 1997-02-10 2000-11-25 모리 가즈히로 Resin sealed semiconductor device and method for manufacturing the same
KR20040077472A (en) * 2003-02-28 2004-09-04 산요덴키가부시키가이샤 Semiconductor device and manufacturing method thereof

Patent Citations (3)

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KR20000070837A (en) * 1997-02-10 2000-11-25 모리 가즈히로 Resin sealed semiconductor device and method for manufacturing the same
KR20000000325U (en) * 1998-06-08 2000-01-15 김영환 Surface Mount Semiconductor Package
KR20040077472A (en) * 2003-02-28 2004-09-04 산요덴키가부시키가이샤 Semiconductor device and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200447764Y1 (en) * 2008-02-14 2010-02-18 (주) 아이.에스.브이. Photo sensor module for opticla mouse
KR101018253B1 (en) * 2009-03-12 2011-03-03 삼성전기주식회사 Camera Module

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